Figure 69.Typical I
Figure 70.Typical V
Figure 71.Typ. V
Figure 72.Typical V
Figure 73.Typical V
Figure 74.Typical V
Figure 75.Typical V
Figure 76.RESET
Figure 77.Two typical applications with ICCSEL/V
The ST7232AK1-Auto, ST7232AK2-Auto, ST7232AJ1-Auto, and ST7232AJ2-Autodevices
are members of the ST7 microcontroller family designed for the 5V operating range.
The 32 and 44-pin devices are designed for mid-range applications
All devices are based on a common industry-standard 8-bit core, featuring an enhanced
instruction set and are available with Flash or ROM program memory.
Under software control, all devices can be placed in wait, slow, active halt or halt mode,
reducing power consumption when the application is in idle or stand-by state.
The enhanced instruction set and addressing modes of the ST7 offer both power and
flexibility to software developers, enabling the design of highly efficient and compact
application code. In addition to standard 8-bit data management, all ST7 microcontrollers
feature true bit manipulation, 8 x 8 unsigned multiplication and indirect addressing modes.
Figure 1.Device block diagram
8-bit core
ALU
RESET
V
PP
V
SS
V
DD
OSC1
OSC2
V
V
AREF
SSA
Control
OSC
ADDRESS AND DATA BUS
MCC/RTC/beep
PORT F
Timer A
Beep
Por t E
SCI
Por t D
10-bit ADC
Program
memory
(8K bytes)
RAM
(384 bytes)
Watchdog
Por t A
Por t B
Por t C
Timer B
SPI
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ST7232Axx-AutoIntroduction
1.2 Differences between ST7232A-Auto and ST7232A datasheets
The differences between the ST7232A-Auto datasheet, version 1, released in January 2008
and the ST7232A datasheet, version 2, released in December 2005 are listed below.
Differences are categorised as follows:
●Principal differences
●Minor content differences
●Editing and formatting differences
1.2.1 Principal differences
1.Changed root part number from ST7232A to ST7232AK1-Auto, ST7232AK2-Auto,
ST7232AJ1-Auto, and ST7232AJ2-Auto throughout document
2. Changed document title on page 1
3. Removed 1 and 5 suffix version temperatures ranges throughout the document
4. Features on page 1: Changed minimum value of data retention time (t
and changed the condition to T
6. Section 6.3: Phase locked loop (PLL) on page 36: Added caution regarding use of PLL
with an external clock
7. Reset vector fetch on page 38: Added a ‘caution’ about the reset vector when it is not
programmed
8. Section 9.2.1: Input modes on page 62: Amended note3 of this section
9. Section 9.3: I/O port implementation on page 66: Deleted I/O port implementation
tables
10. Output compare on page 85: Amended text in note 3
11. Figure 41: Output compare timing diagram, fTIMER = fCPU/4 on page 88: Removed
compare register i Latch from diagram
12. Section 10.6: 10-bit A/D converter (ADC) on page 139: Amended text concerning the
EOC bit in Starting the conversion
13. Table 70: Current characteristics on page 155:
–Added data for the LQFP44 package to I
–Updated max I
values for standard I/O and high sink I/O
IO
VDD
and I
VSS
14. Table 72: General operating conditions on page 156: Updated temperature ranges in
the ‘conditions’ column
15. Table 82: Characteristics of dual VOLTAGE HDFlash MEMORY on page 164:
–Changed typical value of supply current (I
–Changed minimum value of data retention time (t
condition to T
= 55°C
A
–Changed the condition of write erase cycle (N
) to < 10µA
DD
RET
RW
) to 20 years and changed the
) to TA = 85°C
16. Section 12.7.3: Absolute maximum ratings (electrical sensitivity) on page 167:
Removed text concerning dynamic latch-up
17. Electro-static discharge (ESD) on page 167: Replaced JESD22-A114A/A115A
standard with AEC-Q100-002/003/011 standard
) to 20 years
RET
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IntroductionST7232Axx-Auto
18. Table 85: ESD absolute maximum ratings on page 167:
–Added test standards to conditions column
–Changed max value of CDM from 250 V to: > 500 V to ≤ 750 V with corner pins >
750 V
–Added ‘class’ information
19. Static latch-up on page 167: Added ‘AEC-Q100/004’ standard
20. Table 86: Latch up results on page 167:
–Removed T
= +25°C, +85°C and +105°C from latch-up conditions
A
–Added AEC-Q100/004 test standard
–Removed dynamic latch-up results
–Changed ‘class’ information
–Removed footnote 1 pertaining to class descriptions and JEDEC standards
21. Table 87: I/O general port pin characteristics on page 168:
–Added footnote
(3)
–Amended footnote
and
(4)
(5)
22. Figure 76: RESET pin protection on page 173: Removed EMC protective circuitry
(device works correctly without these components)
23. Table 92: SPI characteristics on page 175:
–Added footnote
(1)
and
(2)
–Updated max and unit information of tv(MO)
–Updated min values of t
(MO)
h
–Updated min and max values for ‘data output valid’ and ‘data output hold’ times
24. Figure 80: SPI master timing diagram on page 177: Modified figure to reflect changes
made in Table 92: SPI characteristics concerning t
(MO) and th(MO)
v
25. Table 93: 10-bit ADC characteristics on page 178:
–Removed word ‘positive’ from explanation of I
–Updated footnote
(2)
26. Figure 83: Typical A/D converter application on page 179: Changed IL ± 1µA to I
parameter
lkg
lkg
27. Table 94: ADC accuracy with VDD = 5.0V on page 181:
–Made the ‘conditions’ applicable for all parameters
–Updated footnote
(2)
28. Table 97: Thermal characteristics on page 184:
–Amended footnotes
(1)
and
(2)
–Added a value for LQFP44
29. Table 99: Flash option bytes on page 185:
–Changed bits 4 and 3 of option byte 0 to a default value of ‘1’
–Changed the OSCRANGE bits [2:0] of option byte 1 from 111 to 011
–Added footnote 1 concerning package selection
32. Added Table 102: Package selection (OPT7) on page 187
33. Section 15.1.2: External interrupt missed on page 194: Added section on ‘external
interrupt missed’ bug
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34. Section 15.1.6: TIMD set simultaneously with OC interrupt on page 197:
–Added section concerning limitation of the 16-bit timer
–Added ‘TBCR1’, ‘TBCSR I’ and ‘TBCSR &’ to the workaround subsection
1.2.2 Minor content differences
1.Removed all references to the SDIP32 and SDIP42 packages (which are unavailable in
automotive) thoughout document
2. Replaced TQFP by LQFP throughout document
3. Table 3: Hardware register map on page 25: Replaced ‘h’ with ‘b’ in the reset status
column for the SCICR1 register
4. System integrity control/status register (SICSR) on page 41: Replaced ‘h’ with ‘b’ in the
reset value cell of the SICSR register
5. Table 43: SPI register map and reset values on page 117: Changed the name of bit 5 in
the SPICSR register from OR to OVR
6. Break character on page 123: SPI replaced by SCI
7. Control register 1 (SCICR1) on page 133: Replaced ‘h’ with ‘b’ in the reset value cell of
the SCICR1 register
8. Changed I
application with an external clock source on page 161 and Table 90: ICCSEL/VPP pin
characteristics on page 174
9. Table 95: 32-pin LQFP mechanical data on page 182 and Table 96: 44-pin LQFP
mechanical data on page 183: Altered ‘inches’ data to four decimal places
10. Section 13.3: Soldering information on page 184:
–Updated environmental information regarding ‘ECOPACK®’ packages
–Replaced ECOPACK
–Updated section on ECOPACK® soldering compatability
11. Table 98: Soldering compatibility (wave and reflow soldering process) on page 184:
Removed footnote on Pb package maximum temperature
12. Updated Table 103: Flash user programmable device types on page 187
17. Added Table 105: ROM factory coded device types on page 190
18. Updated Figure 90: ROM commercial product code structure on page 190
19. Updated ST72P32A/ST7232A (3.8 to 5.5V) microcontroller option list on page 191
20. Updated Table 106: STMicroelectronics development tools on page 193
21. Section 14.4: Development tools on page 192:
–Updated Introduction and Programming tools
–Deleted Emulators and In-circuit debugging kit
–Added Evaluation tools and starter kits and Development and debugging tools
22. Section 14.5: ST7 application notes on page 193: Removed list of ST7 application
notes
L
to I
in Table 77: External clock source on page 161, Figure 65: Typical
lkg
TM
with ECOPACK® throughout the document
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IntroductionST7232Axx-Auto
1.2.3 Editing and formatting differences
1.Reformatted document
2. Converted register and bit decriptions to table format
3. Edited English throughout document
4. Correctly aligned footnotes of tables throughout document
For external pin connection guidelines, refer to Section 12: Electrical characteristics on
page 153.
In Table 2: Device pin description below, refer to Section 9: I/O ports on page 62 for more
details on the software configuration of the I/O ports. The RESET
configuration of each pin
is shown in bold. This configuration is valid as long as the device is in reset state. For
external pin connection guidelines refer to Section 12: Electrical characteristics on
page 153.
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ST7232Axx-AutoPin description
Table 2.Device pin description
Pin
no.
LQFP44
Pin name
LQFP32
Typ e
(1)
LevelPort
InputOutput
Input
Output
float
(2)
wpu
int
ana
(3)
OD
Main
function
(after
reset)
PP
630PB4 (HS)I/OCTHSXei3XXPort B4
731 PD0/AIN0I/O C
832 PD1/AIN1I/O C
(4)
9 -
10 -
11 -
12 -
131 V
142 V
PD2/AIN2I/O C
(4)
PD3/AIN3I/O C
(4)
PD4/AIN4I/O C
(4)
PD5/AIN5I/O C
(5)
AREF
(5)
SSA
SAnalog reference voltage for ADC
SAnalog ground voltage
153 PF0/MCO/AIN8I/O C
164 PF1 (HS)/BeepI/O C
(4)
17 -
185
PF2 (HS)I/O CTHSXei1XXPort F2
PF4/OCMP1_A/
AIN10
I/O C
T
T
T
T
T
T
T
T
T
XXXXXPort D0ADC analog input 0
XXXXXPort D1ADC analog input 1
XXXXXPort D2ADC analog Input 2
XXXXXPort D3ADC analog Input 3
XXXXXPort D4ADC analog Input 4
XXXXXPort D5ADC analog Input 5
Xei1XXXPort F0
HSXei1XXPort F1Beep signal output
XXXX XPort F4
Alternate function
Main clock
out (f
CPU
)
Timer A output
compare 1
ADC analog
input 8
ADC analog
input 10
196 PF6 (HS)/ICAP1_A I/O CTHSXXXXPort F6Timer A input capture 1
207
21-V
22-V
238
249
25 10
26 11
27 12
28 13 PC5/MOSI/AIN14I/O C
29 14 PC6/SCK/ICCCLK I/O C
PF7
(HS)/EXTCLK_A
(5)
DD_0
(5)
SS_0
PC0/OCMP2_B/
AIN12
PC1/OCMP1_B/
AIN13
PC2
(HS)/ICAP2_B
PC3
(HS)/ICAP1_B
PC4/MISO/
ICCDATA
I/O CTHSXXXXPort F7Timer A external clock source
SDigital main supply voltage
SDigital ground voltage
I/O C
I/O C
I/O C
I/O C
I/O C
T
T
T
T
T
T
T
XXXX XPort C0
XXXX XPort C1
HSXXXXPort C2Timer B input capture 2
HSXXXXPort C3Timer B input capture 1
XXXXPort C4
XXXX XPort C5
XXXXPort C6
Timer B output
compare 2
Timer B output
compare 1
SPI master in/
slave out data
SPI master out
/slave in data
SPI serial
clock
ADC analog
input 12
ADC analog
input 13
ICC data
input
ADC analog
input 14
ICC clock
output
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Pin descriptionST7232Axx-Auto
Table 2.Device pin description
Pin
no.
Pin name
LQFP44
LQFP32
30 15 PC7/SS/AIN15I/O C
31 16 PA3 (HS)I/O C
32-V
33-V
DD_1
SS_1
(5)
(5)
34 17 PA4 (HS)I/O C
(4)
35 -
PA5 ( H S )I/ O CTHSXXXXPort A5
36 18 PA6 (HS)I/O C
37 19 PA7 (HS)I/O C
38 20 V
/ICCSELI
PP
LevelPort
Type
Input
T
T
SDigital main supply voltage
SDigital ground voltage
T
T
T
(1)
(continued)
Main
InputOutput
ana
(3)
OD
Output
float
(2)
wpu
int
function
(after
reset)
PP
XXXX XPort C7
HSXei0XXPort A3
HSXXXXPort A4
HSXTPort A6
HSXTPort A7
Must be tied low. In the Flash
programming mode, this pin acts as the
programming voltage input V
Section 12.9.2 for more details. High
voltage must not be applied to ROM
devices.
Alternate function
SPI slave
select (active
low)
ADC analog
input 15
. See
PP
39 21 RESETI/O C
40 22 V
SS_2
41 23 OSC2
42 24 OSC1
43 25 V
DD_2
(5)
(6)
(6)
(5)
SDigital ground voltage
OResonator oscillator inverter output
I
SDigital main supply voltage
44 26 PE0/TDOI/O C
127PE1/RDII/OC
T
T
T
XXXXPort E0SCI transmit data out
XXXXPort E1SCI receive data in
Top priority non maskable interrupt.
External clock input or resonator
oscillator inverter input
Caution: Negative current
228PB0I/OC
(4)
3-
4-
PB1I/O C
(4)
PB2I/O C
529PB3I/OC
1. Legend/abbreviations for Table 2:
Type: I = input, O = output, S = supply
Input level: C
Output level: HS = 20mA high sink (on N-buffer only)
Port and control configuration inputs: float = floating, wpu = weak pull-up, int = interrupt, ana = analog ports
Port and control configuration outputs: OD = open drain, PP = push-pull
2. ‘eiX’ defines the associated external interrupt vector. If the weak pull-up column (wpu) is merged with the interrupt column
(int), then the I/O configuration is pull-up interrupt input; otherwise the configuration is floating interrupt input
= CMOS 0.3VDD/0.7VDD with input trigger
T
T
T
T
T
Xei2XXPort B0
injection not allowed on this
pin
Xei2XXPort B1
Xei2XXPort B2
Xei2XXPort B3
(7)
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ST7232Axx-AutoPin description
3. ‘T’ defines a true open drain I/O (P-buffer and protection diode to VDD are not implemented). See Section 9: I/O ports on
page 62 and Section 12.8: I/O port pin characteristics for more details
4. Each I/O port has 8 pads. Pads that are not bonded to external pins are in input pull-up configuration after reset. The
configuration of these pads must be kept at reset state to avoid added current consumption.
5. It is mandatory to connect all available V
6. OSC1 and OSC2 pins connect a crystal/ceramic resonator, or an external source to the on-chip oscillator; see Section 1:
Introduction and Section 12.5: Clock and timing characteristics for more details
7. For details refer to Section 12.8.1: General characteristics on page 168
DD
and V
pins to the supply voltage and all VSS and V
AREF
pins to ground
SSA
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Register and memory mapST7232Axx-Auto
3 Register and memory map
As shown in <Blue HT>Figure 4, the MCU is capable of addressing 64K bytes of memories
and I/O registers.
The available memory locations consist of 128 bytes of register locations, up to 384 bytes of
RAM and up to 8 Kbytes of user program memory. The RAM space includes up to 256 bytes
for the stack from 0100h to 01FFh.
The highest address bytes contain the user reset and interrupt vectors.
Caution:Memory locations marked as ‘reserved’ must never be accessed. Accessing a reserved
area can have unpredictable effects on the device.
Figure 4.Memory map
0000h
007Fh
0080h
047Fh
0480h
E000h
FFDFh
FFE0h
FFFFh
HW registers
Program memory
Interrupt and reset vectors
(see Ta bl e 3)
RAM
(384 bytes)
Reserved
(4K or 8K)
(see Ta bl e 15 )
0080h
00FFh
0100h
01FFh
0200h
027Fh
or 047Fh
Short addressing
RAM (zero page)
256 bytes stack
Reserved
E000h
8 Kbytes
F000h
4 Kbytes
FFFFh
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ST7232Axx-AutoRegister and memory map
Table 3.Hardware register map
AddressBlockRegister labelRegister nameReset status
0000h
0001h
0002h
0003h
0004h
0005h
0006h
0007h
0008h
0009h
000Ah
000Bh
000Ch
000Dh
000Eh
000Fh
0010h
0011h
0012h to
0020h
0021h
0022h
0023h
0024h
0025h
0026h
0027h
Por t A
Por t B
Por t C
Por t D
Por t E
Por t F
SPI
ITC
(3)
(3)
(3)
(3)
(3)
PA DR
PADDR
PA OR
PBDR
PBDDR
PBOR
PCDR
PCDDR
PCOR
PDADR
PDDDR
PDOR
PEDR
PEDDR
PEOR
PFDR
PFDDR
PFOR
SPIDR
SPICR
SPICSR
ISPR0
ISPR1
ISPR2
ISPR3
Port A data register
Port A data direction register
Port A option register
Port B data register
Port B data direction register
Port B option register
Port C data register
Port C data direction register
Port C option register
Port D data register
Port D data direction register
Port D option register
Port E data register
Port E data direction register
Port E option register
Port F data register
Port F data direction register
Port F option register
Reserved area (15 bytes)
SPI data I/O register
SPI control register
SPI control/status register
0028hEICRExternal interrupt control register00hR/W
0029hFlashFCSRFlash control/status register00hR/W
002AhWatchdog WDGCRWatchdog control register7FhR/W
002BhReserved area (1 byte)
002Ch
002Dh
002Eh to
0030h
MCC
MCCSR
MCCBCR
Main clock control/status register
Main clock controller: beep control register
Reserved area (3 bytes)
00h
00h
Remarks
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
(3)
R/W
(3)
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
(2)
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Register and memory mapST7232Axx-Auto
Table 3.Hardware register map (continued)
00h
00h
xxh
xxh
80h
00h
FFh
xxh
xxh
80h
00h
00h
00h
xxh
xxh
80h
00h
xxh
xxh
80h
00h
xxh
00h
00h
00h
00h
00h
00h
00h
(1)
Remarks
R/W
R/W
R/W
Read only
Read only
R/W
R/W
Read only
Read only
Read only
Read only
Read only
Read only
R/W
R/W
R/W
R/W
R/W
Read only
Read only
R/W
R/W
Read only
Read only
Read only
Read only
Read only
Read only
R/W
R/W
Read only
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Read only
Read only
AddressBlockRegister labelRegister nameReset status
0031h
0032h
0033h
0034h
0035h
0036h
0037h
0038h
0039h
003Ah
003Bh
003Ch
003Dh
003Eh
003Fh
0040hReserved area (1 byte)
0041h
0042h
0043h
0044h
0045h
0046h
0047h
0048h
0049h
004Ah
004Bh
004Ch
004Dh
004Eh
004Fh
0050h
0051h
0052h
0053h
0054h
0055h
0056h
0057h
0058h to
006Fh
0070h
0071h
0072h
0073h
007Fh
1. x = undefined
2. R/W = read/write
3. The bits associated with unavailable pins must always keep their reset value
4. The contents of the I/O port DR registers are readable only in output configuration. In input configuration, the values of the
I/O pins are returned instead of the DR register contents
Timer A
Timer B
SCI
ADC
TAC R2
TAC R1
TAC SR
TA IC 1 H R
TAIC1LR
TAO C1 HR
TAO C1 LR
TAC HR
TAC LR
TAACHR
TA AC L R
TA IC 2 H R
TAIC2LR
TAO C2 HR
TAO C2 LR
Timer A control register 2
Timer A control register 1
Timer A control/status register
Timer A input capture 1 high register
Timer A input capture 1 low register
Timer A output compare 1 high register
Timer A output compare 1 low register
Timer A counter high register
Timer A counter low register
Timer A alternate counter high register
Timer A alternate counter low register
Timer A input capture 2 high register
Timer A input capture 2 low register
Timer A output compare 2 high register
Timer A output compare 2 low register
Timer B control register 2
Timer B control register 1
Timer B control/status register
Timer B input capture 1 high register
Timer B input capture 1 low register
Timer B output compare 1 high register
Timer B output compare 1 low register
Timer B counter high register
Timer B counter low register
Timer B alternate counter high register
Timer B alternate counter low register
Timer B input capture 2 high register
Timer B input capture 2 low register
Timer B output compare 2 high register
Timer B output compare 2 low register
SCI status register
SCI data register
SCI baud rate register
SCI control register 1
SCI control register 2
SCI extended receive prescaler register
Reserved area
SCI extended transmit prescaler register
Reserved area (24 bytes)
Control/status register
Data high register
Data low register
Reserved area (13 bytes)
xxxx x0xxb
FCh
FFh
FCh
xxxx x0xxb
FFh
FCh
FFh
FCh
C0h
x000 0000b
(2)
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ST7232Axx-AutoFlash program memory
4 Flash program memory
4.1 Introduction
The ST7 dual voltage high density Flash (HDFlash) is a non-volatile memory that can be
electrically erased as a single block or by individual sectors and programmed on a byte-bybyte basis using an external V
The HDFlash devices can be programmed and erased off-board (plugged in a programming
tool) or on-board using ICP (in-circuit programming) or IAP (in-application programming).
The array matrix organisation allows each sector to be erased and reprogrammed without
affecting other sectors.
4.2 Main features
●Three Flash programming modes:
–Insertion in a programming tool. In this mode, all sectors including option bytes
can be programmed or erased
–ICP (in-circuit programming). In this mode, all sectors including option bytes can
be programmed or erased without removing the device from the application board
–IAP (in-application programming) In this mode, all sectors except sector 0, can be
programmed or erased without removing the device from the application board
and while the application is running
●ICT (in-circuit testing) for downloading and executing user application test patterns in
RAM
●Read-out protection
●Register access security system (RASS) to prevent accidental programming or erasing
supply.
PP
4.3 Structure
The Flash memory is organised in sectors and can be used for both code and data storage.
Depending on the overall Flash memory size in the microcontroller device, there are up to
three user sectors (see Ta b l e 4 ). Each of these sectors can be erased independently to
avoid unnecessary erasing of the whole Flash memory when only a partial erasing is
required.
The first two sectors have a fixed size of 4 Kbytes (see Figure 5). They are mapped in the
upper part of the ST7 addressing space so the reset and interrupt vectors are located in
sector 0 (F000h-FFFFh).
Table 4.Sectors available in Flash devices
Flash size (bytes)Available sectors
4KSector 0
8KSectors 0,1
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Flash program memoryST7232Axx-Auto
4.3.1 Read-out protection
Read-out protection, when selected, provides a protection against program memory content
extraction and against write access to Flash memory. Even if no protection can be
considered as totally unbreakable, the feature provides a very high level of protection for a
general purpose microcontroller.
In Flash devices, this protection is removed by reprogramming the option. In this case, the
entire program memory is first automatically erased and the device can be reprogrammed.
Read-out protection selection depends on the device type:
●In Flash devices it is enabled and removed through the FMP_R bit in the option byte
●In ROM devices it is enabled by mask option specified in the option list
Figure 5.Memory map and sector addresses of the ST7232X family
4K10K24K48K
1000h
3FFFh
7FFFh
9FFFh
BFFFh
D7FFh
DFFFh
EFFFh
FFFFh
8K16K32K60K
2Kbytes
4.4 ICC interface
ICC needs a minimum of 4 and up to 6 pins to be connected to the programming tool (see
Figure 6). These pins are:
●RESET: device reset
●V
●ICCCLK: ICC output serial clock pin
●ICCDATA: ICC input/output serial data pin
●ICCSEL/V
●OSC1(or OSCIN): main clock input for external source (optional)
●V
: device power supply ground
SS
: programming voltage
PP
: application board power supply (optional, see Figure 6, footnote 3)
DD
8Kbytes40 Kbytes
16 Kbytes
4 Kbytes
4 Kbytes
24 Kbytes
Flash memory size
Sector 2
52 Kbytes
Sector 1
Sector 0
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ST7232Axx-AutoFlash program memory
Figure 6.Typical ICC interface
Programming tool
ICC connector
ICC cable
(3)
Application
power supply
1. If the ICCCLK or ICCDATA pins are only used as outputs in the application, no signal isolation is
necessary. As soon as the programming tool is plugged to the board, even if an ICC session is not in
progress, the ICCCLK and ICCDATA pins are not available for the application. If they are used as inputs by
the application, isolation such as a serial resistor has to implemented in case another device forces the
signal. Refer to the programming tool documentation for recommended resistor values.
2. During the ICC session, the programming tool must control the RESET
between the programming tool and the application reset circuit if it drives more than 5mA at high level
(push pull output or pull-up resistor < 1K). A schottky diode can be used to isolate the application reset
circuit in this case. When using a classical RC network with R > 1K or a reset management IC with open
drain output and pull-up resistor > 1K, no additional components are needed. In all cases the user must
ensure that no external reset is generated by the application during the ICC session.
3. The use of Pin 7 of the ICC connector depends on the programming tool architecture. This pin must be
connected when using most ST programming tools (it is used to monitor the application power supply).
Please refer to the programming tool manual.
C
L2
DD
V
OSC2
(See ‘caution’)
C
L1
OSC1
ST7
975 3
10kΩ
SS
V
ICC connector
1
HE10 connector type
246810
Application reset source
RESET
ICCCLK
ICCSEL/VPP
ICCDATA
pin. This can lead to conflicts
Application board
Application I/O
(2)
(1)
Caution:External clock ICC entry mode is mandatory. Pin 9 must be connected to the OSC1 or
OSCIN pin of the ST7 and OSC2 must be grounded.
4.5 In-circuit programming (ICP)
To perform ICP the microcontroller must be switched to ICC (in-circuit communication) mode
by an external controller or programming tool.
Depending on the ICP code downloaded in RAM, Flash memory programming can be fully
customized (number of bytes to program, program locations, or selection serial
communication interface for downloading).
When using an STMicroelectronics or third-party programming tool that supports ICP and
the specific microcontroller device, the user needs only to implement the ICP hardware
interface on the application board (see Figure 6). For more details on the pin locations, refer
to the device pinout description.
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Obsolete Product(s) - Obsolete Product(s)
Flash program memoryST7232Axx-Auto
4.6 In-application programming (IAP)
This mode uses a Bootloader program previously stored in sector 0 by the user (in ICP
mode or by plugging the device in a programming tool).
This mode is fully controlled by user software. This allows it to be adapted to the user
application, (user-defined strategy for entering programming mode, choice of
communications protocol used to fetch the data to be stored, ...). For example, it is possible
to download code from the SPI, SCI, USB or CAN interface and program it in the Flash. IAP
mode can be used to program any of the Flash sectors except sector 0, which is write/erase
protected to allow recovery in case errors occur during the programming operation.
4.7 Related documentation
For details on Flash programming and ICC protocol, refer to the ST7 Flash programming
reference manual and to the ST7 ICC protocol reference manual
Flash control/status register (FCSR)
FCSRReset value: 0000 0000 (00h)
76543210
.
0
R/W
This register is reserved for use by programming tool software. It controls the Flash
programming and erasing operations.
Table 5.Flash control/status register address and reset value
Address (Hex.)Register label76543210
0029h
FCSR
Reset value00000000
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