ST72260Gx, ST72262Gx,
ST72264Gx
8-BIT MCU WITH FLASH OR ROM MEMORY, ADC, TWO 16-BIT TIMERS, I2C, SPI, SCI INTERFACES
■Memories
–4 K or 8 Kbytes Program memory: ROM or Single voltage extended Flash (XFlash) with read-out protection write protection and InCircuit Programming and In-Application Programming (ICP and IAP). 10K write/erase cycles guaranteed, data retention: 20 years at 55°C.
–256 bytes RAM
■Clock, Reset and Supply Management
–Enhanced reset system
–Enhanced low voltage supply supervisor (LVD) with 3 programmable levels and auxiliary voltage detector (AVD) with interrupt capability for implementing safe power-down procedures
–Clock sources: crystal/ceramic resonator oscillators, internal RC oscillator and bypass for external clock
–PLL for 2x frequency multiplication
–Clock-out capability
–4 Power Saving Modes: Halt, Active Halt,Wait and Slow
■Interrupt Management
–Nested interrupt controller
–10 interrupt vectors plus TRAP and RESET
–22 external interrupt lines (on 2 vectors)
■22 I/O Ports
–22 multifunctional bidirectional I/O lines
–20 alternate function lines
–8 high sink outputs
■4 Timers
–Main Clock Controller with Real time base and Clock-out capabilities
–Configurable watchdog timer
Device Summary
SDIP32
LFBGA 6x6mm |
SO28 |
–Two 16-bit timers with: 2 input captures, 2 output compares, external clock input on one timer, PWM and Pulse generator modes
■3 Communication Interfaces
–SPI synchronous serial interface
–I2C multimaster interface (SMBus V1.1 Compliant)
–SCI asynchronous serial interface
■1 Analog peripheral
–10-bit ADC with 6 input channels
■Instruction Set
–8-bit data manipulation
–63 basic instructions with illegal opcode detection
–17 main addressing modes
–8 x 8 unsigned multiply instruction
■Development Tools
–Full hardware/software development package
Features |
ST72260G1 |
ST72262G1 |
ST72262G2 |
ST72264G1 |
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ST72264G2 |
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Program memory - bytes |
4K |
4K |
8K |
4K |
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8K |
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RAM (stack) - bytes |
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256 (128) |
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Peripherals |
Watchdog timer, RTC, |
Watchdog timer, RTC, |
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Watchdog timer, RTC, |
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Two16-bit timers, SPI |
Two 16-bit timers, SPI, ADC |
Two 16-bit timers, SPI, SCI, I2C, ADC |
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Operating Supply |
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2.7 V to |
5.5 V |
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CPU Frequency |
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Up to 8 MHz (with oscillator up to 16 MHz) PLL 4/8 MHz |
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Operating Temperature |
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-40° C to +85° C |
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-40° C to +85° C |
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0° C to +70° C / |
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-40° C to +85° C |
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Packages |
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SO28 / SDIP32 |
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SO28 / SDIP32 |
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LFBGA |
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Rev. 3 |
June 2005 |
1/172 |
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1
Table of Contents
1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 PIN DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 REGISTER & MEMORY MAP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4 FLASH PROGRAM MEMORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.2 MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.3 PROGRAMMING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.4 ICC INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.5 MEMORY PROTECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.6 RELATED DOCUMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.7 REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5 CENTRAL PROCESSING UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.1 |
INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
17 |
5.2 |
MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
17 |
5.3 |
CPU REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
17 |
6 SUPPLY, RESET AND CLOCK MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.1 PHASE LOCKED LOOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 6.2 MULTI-OSCILLATOR (MO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 6.3 RESET SEQUENCE MANAGER (RSM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 6.4 SYSTEM INTEGRITY MANAGEMENT (SI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
7 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 7.2 MASKING AND PROCESSING FLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 7.3 INTERRUPTS AND LOW POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 7.4 CONCURRENT & NESTED MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 7.5 INTERRUPT REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
8 POWER SAVING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
33 |
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8.1 |
INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
33 |
8.2 |
SLOW MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
33 |
8.3 |
WAIT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
34 |
8.4 |
ACTIVE-HALT AND HALT MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
35 |
8.5 |
HALT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
36 |
9 I/O PORTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
9.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 9.2 FUNCTIONAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 9.3 I/O PORT IMPLEMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 9.4 UNUSED I/O PINS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 9.5 LOW POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 9.6 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 9.7 DEVICE-SPECIFIC I/O PORT CONFIGURATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 9.8 I/O PORT REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
10 MISCELLANEOUS REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
2/172
2
|
Table of Contents |
|
10.1 |
I/O PORT INTERRUPT SENSITIVITY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. 45 |
10.2 |
I/O PORT ALTERNATE FUNCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
45 |
10.3 |
MISCELLANEOUS REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
46 |
11 ON-CHIP PERIPHERALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
48 |
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11.1 |
WATCHDOG TIMER (WDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
48 |
11.2 |
MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK (MCC/RTC) . . . . . . . . . . . . . |
53 |
11.3 |
16-BIT TIMER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
55 |
11.4 |
SERIAL PERIPHERAL INTERFACE (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
75 |
11.5 |
SERIAL COMMUNICATIONS INTERFACE (SCI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
87 |
11.6 |
I2C BUS INTERFACE (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
103 |
11.7 |
10-BIT A/D CONVERTER (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
116 |
12 INSTRUCTION SET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
120 |
12.1 CPU ADDRESSING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 12.2 INSTRUCTION GROUPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
13 ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
13.1 PARAMETER CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 13.2 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 13.3 OPERATING CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 13.4 SUPPLY CURRENT CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 13.5 CLOCK AND TIMING CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135 13.6 MEMORY CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140 13.7 EMC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141 13.8 I/O PORT PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144 13.9 CONTROL PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 13.10 TIMER PERIPHERAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 13.11 COMMUNICATION INTERFACE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . 153 13.12 10-BIT ADC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
14 PACKAGE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159
14.1 PACKAGE MECHANICAL DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 14.2 THERMAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 14.3 LEAD-FREE PACKAGE INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
15 DEVICE CONFIGURATION AND ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . 162
15.1 OPTION BYTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162 15.2 DEVICE ORDERING INFORMATION AND TRANSFER OF CUSTOMER CODE . . . . 164 15.3 DEVELOPMENT TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
16 KNOWN LIMITATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
16.1 ALL FLASH AND ROM DEVICES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168 16.2 FLASH DEVICES ONLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
17 REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171
3/172
3
ST72260Gx, ST72262Gx, ST72264Gx
To obtain the most recent version of this datasheet,
please check at www.st.com>products>technical literature>datasheet
Please note that the list of known limitations can be found at the end of this document on page 168.
4/172
ST72260Gx, ST72262Gx, ST72264Gx
The ST72260Gx, ST72262Gx and ST72264Gx devices are members of the ST7 microcontroller family. They can be grouped as follows :
–ST72264Gx devices are designed for mid-range applications with ADC, I2C and SCI interface capabilities.
–ST72262Gx devices target the same range of applications but without I2C interface or SCI.
–ST72260Gx devices are for applications that do not need ADC, I2C peripherals or SCI.
All devices are based on a common industrystandard 8-bit core, featuring an enhanced instruction set.
The ST72F260G, ST72F262G, and ST72F264G versions feature single-voltage FLASH memory with byte-by-byte In-Circuit Programming (ICP) capabilities.
Under software control, all devices can be placed in WAIT, SLOW, Active-HALT or HALT mode, reducing power consumption when the application is in idle or stand-by state.
The enhanced instruction set and addressing modes of the ST7 offer both power and flexibility to software developers, enabling the design of highly efficient and compact application code. In addition to standard 8-bit data management, all ST7 microcontrollers feature true bit manipulation, 8x8 unsigned multiplication and indirect addressing modes.
For easy reference, all parametric data is located in Section 13 on page 126.
Related Documentation
AN1365: Guidelines for migrating ST72C254 applications to ST72F264
Figure 1. General Block Diagram
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OSC1 |
CLOCK |
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I2C* |
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MULTI OSC |
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OSC2 |
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SCI* |
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MCC/RTC |
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PA7:0 |
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PORT A |
(8 bits) |
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LVD |
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VDD |
POWER |
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ICD |
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VSS |
SUPPLY |
ADDRESS |
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RESET |
CONTROL |
PORT B |
PB7:0 |
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AND |
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8-BIT CORE |
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BUS DATA |
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ALU |
16-BIT TIMER A |
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PROGRAM |
PORT C |
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PC5:0 |
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MEMORY |
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10-BIT ADC* |
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RAM |
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WATCHDOG |
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*Not available on some devices, see device summary on page 1.
5/172
ST72260Gx, ST72262Gx, ST72264Gx
Figure 2. 28-Pin SO Package Pinout
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VDD |
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ei1 |
ei0 |
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AIN5/EXTCLK_A/PC5 |
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12 |
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17 |
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PC0/ICAP1_B/AIN02 |
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AIN42/OCMP2_B/PC4 |
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13 |
ei0 or ei11 |
16 |
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PC1/OCMP1_B/AIN12 |
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AIN32/ICAP2_B/PC3 |
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14 |
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15 |
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PC2/MCO/AIN22 |
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1 Configurable by option byte |
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(HS) |
20mA high sink capability |
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2 Alternate function not available on ST72260 |
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eiX |
associated external interrupt vector |
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3 Alternate function not available on ST72260 and ST72262 |
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Figure 3. 32-Pin SDIP Package Pinout |
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VDD |
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RESET |
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1 |
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32 |
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OSC1 |
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2 |
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31 |
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VSS |
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OSC2 |
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3 |
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30 |
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ICCSEL |
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PA0 (HS)/ICCCLK |
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SS/PB7 |
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4 |
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29 |
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SCK/PB6 |
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5 |
ei1 |
ei0 |
28 |
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PA1 (HS)/ICCDATA |
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MISO/PB5 |
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6 |
27 |
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PA2 (HS) |
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MOSI/PB4 |
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7 |
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26 |
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PA3 (HS) |
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NC |
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8 |
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25 |
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NC |
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NC |
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9 |
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24 |
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NC |
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OCMP2_A/PB3 |
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10 |
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23 |
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PA4 (HS)/SCLI3 |
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ICAP2_A/PB2 |
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11 |
ei1 |
ei0 |
22 |
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PA5 (HS)/RDI3 |
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OCMP1_A/PB1 |
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12 |
21 |
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PA6 (HSI/SDAI3 |
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ICAP1_A/PB0 |
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13 |
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20 |
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PA7 (HS)/TDO3 |
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AIN52/EXTCLK_A/PC5 |
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14 |
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19 |
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PC0/ICAP1_B/AIN02 |
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AIN42/OCMP2_B/PC4 |
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15 |
ei0 or ei11 |
18 |
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PC1/OCMP1_B/AIN12 |
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AIN32/ICAP2_B/PC3 |
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16 |
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17 |
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PC2/MCO/AIN22 |
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1 Configurable by option byte |
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(HS) |
20mA high sink capability |
|||||||||
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||||||||||||
2 Alternate function not available on ST72260 |
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3 Alternate function not available on ST72260 and ST72262 |
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eiX |
associated external interrupt vector |
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6/172
ST72260Gx, ST72262Gx, ST72264Gx
PIN DESCRIPTION (Cont’d)
Figure 4. TFBGA Package Pinout (view through package)
1 |
2 |
3 |
4 |
5 |
6 |
A
B
C
D
E
F
7/172
ST72260Gx, ST72262Gx, ST72264Gx
PIN DESCRIPTION (Cont’d)
For external pin connection guidelines, refer to Section 13 "ELECTRICAL CHARACTERISTICS" on page 126.
Legend / Abbreviations for Table 1:
Type: |
I = input, O = output, S = supply |
|
Input level: |
A = Dedicated analog input |
|
In/Output level: |
CT= CMOS 0.3 VDD/0.7 VDD with input trigger |
|
Output level: |
HS = 20 mA high sink (on N-buffer only) |
|
Port and control configuration: |
||
– |
Input: |
float = floating, wpu = weak pull-up, int = interrupt 1), ana = analog |
– |
Output: |
OD = open drain 2), PP = push-pull |
Refer to Section 9 "I/O PORTS" on page 38 for more details on the software configuration of the I/O ports.
The RESET configuration of each pin is shown in bold. This configuration is valid as long as the device is in reset state.
Table 1. Device Pin Description
Pin n° |
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Level |
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Port / Control |
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Main |
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Type |
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SDIP32 |
SO28 |
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BGA |
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Input |
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Output |
float |
wpu |
int |
ana |
OD |
PP |
Function |
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Pin Name |
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Input |
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Output |
Alternate Function |
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(after |
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reset) |
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Top priority non maskable interrupt (ac- |
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1 |
1 |
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A3 |
RESET |
I/O |
CT |
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X |
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X |
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tive low) |
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OSC1 3) |
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External clock input or Resonator oscilla- |
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2 |
2 |
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C4 |
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I |
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tor inverter input or resistor input for RC |
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oscillator |
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3 |
3 |
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B3 |
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OSC2 3) |
O |
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Resonator oscillator inverter output or ca- |
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pacitor input for RC oscillator |
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4 |
4 |
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A2 |
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I/O |
|
CT |
X |
ei1 |
|
X |
X |
Port B7 |
SPI Slave Select (active low) |
||
PB7/SS |
|
|
||||||||||||||||||
5 |
5 |
|
A1 |
PB6/SCK |
I/O |
|
CT |
X |
ei1 |
|
X |
X |
Port B6 |
SPI Serial Clock |
||||||
6 |
6 |
|
B1 |
PB5/MISO |
I/O |
|
CT |
X |
ei1 |
|
X |
X |
Port B5 |
SPI Master In/ Slave Out Data |
||||||
7 |
7 |
|
B2 |
PB4/MOSI |
I/O |
|
CT |
X |
ei1 |
|
X |
X |
Port B4 |
SPI Master Out / Slave In Data |
||||||
8 |
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C1 |
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NC |
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9 |
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C2 |
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NC |
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Not Connected |
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D1 |
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NC |
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10 |
8 |
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C3 |
PB3/OCMP2_A |
I/O |
|
CT |
X |
ei1 |
|
X |
X |
Port B3 |
Timer A Output Compare 2 |
||||||
11 |
9 |
|
D2 |
PB2/ICAP2_A |
I/O |
|
CT |
X |
ei1 |
|
X |
X |
Port B2 |
Timer A Input Capture 2 |
||||||
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Timer A Output Compare 1 |
12 |
10 |
|
E1 |
PB1 /OCMP1_A |
I/O |
|
CT |
X |
ei1 |
|
X |
X |
Port B1 |
Caution: Negative current |
||||||
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injection not allowed on |
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this pin4). |
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Timer A Input Capture 1 |
13 |
11 |
|
F1 |
PB0 /ICAP1_A |
I/O |
|
CT |
X |
ei1 |
|
X |
X |
Port B0 |
Caution: Negative current |
||||||
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|
injection not allowed on |
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this pin4). |
14 |
12 |
|
F2 |
PC5/EXTCLK_A/AIN5 |
I/O |
|
CT |
X |
ei0/ei1 |
X |
X |
X |
Port C5 |
Timer A Input Clock or ADC |
||||||
|
|
Analog Input 5 |
||||||||||||||||||
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8/172
ST72260Gx, ST72262Gx, ST72264Gx
Pin n° |
|
|
|
Level |
|
Port / Control |
|
Main |
|
||||||
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Type |
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SDIP32 |
SO28 |
|
BGA |
|
Input |
Output |
float |
wpu |
int |
ana |
OD |
PP |
Function |
|
|
|
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|
Pin Name |
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|
Input |
|
Output |
Alternate Function |
|||
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(after |
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reset) |
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15 |
13 |
|
E2 |
PC4/OCMP2_B/AIN4 |
I/O |
CT |
X |
ei0/ei1 |
X |
X |
X |
Port C4 |
Timer B Output Compare 2 or |
||
|
ADC Analog Input 4 |
||||||||||||||
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16 |
14 |
|
F3 |
PC3/ ICAP2_B/AIN3 |
I/O |
CT |
X |
ei0/ei1 |
X |
X |
X |
Port C3 |
Timer B Input Capture 2 or |
||
|
ADC Analog Input 3 |
||||||||||||||
17 |
15 |
|
E3 |
PC2/MCO/AIN2 |
I/O |
CT |
X |
ei0/ei1 |
X |
X |
X |
Port C2 |
Main clock output (fCPU) or |
||
|
ADC Analog Input 2 |
||||||||||||||
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18 |
16 |
|
F4 |
PC1/OCMP1_B/AIN1 |
I/O |
CT |
X |
ei0/ei1 |
X |
X |
X |
Port C1 |
Timer B Output Compare 1 or |
||
|
ADC Analog Input 1 |
||||||||||||||
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19 |
17 |
|
D3 |
PC0/ICAP1_B/AIN0 |
I/O |
CT |
X |
ei0/ei1 |
X |
X |
X |
Port C0 |
Timer B Input Capture 1 or |
||
|
ADC Analog Input 0 |
||||||||||||||
|
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|
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|
|
20 |
18 |
|
E4 |
PA7/TDO |
I/O |
CT |
HS |
X |
ei0 |
|
X |
X |
Port A7 |
SCI output |
|
21 |
19 |
|
F5 |
PA6/SDAI |
I/O |
CT |
HS |
X |
|
ei0 |
|
T |
|
Port A6 |
I2C DATA |
22 |
20 |
|
F6 |
PA5 /RDI |
I/O |
CT |
HS |
X |
ei0 |
|
X |
X |
Port A5 |
SCI input |
|
23 |
21 |
|
E6 |
PA4/SCLI |
I/O |
CT |
HS |
X |
|
ei0 |
|
T |
|
Port A4 |
I2C CLOCK |
24 |
|
|
E5 |
NC |
|
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||
25 |
|
|
D6 |
NC |
|
|
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|
|
|
|
Not Connected |
|
||
|
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|
D5 |
NC |
|
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|
26 |
22 |
|
C6 |
PA3 |
I/O |
CT |
HS |
X |
ei0 |
|
X |
X |
Port A3 |
|
|
27 |
23 |
|
D4 |
PA2 |
I/O |
CT |
HS |
X |
ei0 |
|
X |
X |
Port A2 |
|
|
|
|
|
C5 |
NC |
|
|
|
|
|
|
|
Not Connected |
|
||
|
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|||
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|
B6 |
NC |
|
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|||
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||
|
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|
28 |
24 |
|
A6 |
PA1/ICCDATA |
I/O |
CT |
HS |
X |
ei0 |
|
X |
X |
Port A1 |
In Circuit Communication Data |
|
29 |
25 |
|
A5 |
PA0/ICCCLK |
I/O |
CT |
HS |
X |
ei0 |
|
X |
X |
Port A0 |
In Circuit Communication |
|
|
|
Clock |
|||||||||||||
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|
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|
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|
|
|
30 |
26 |
|
B5 |
ICCSEL |
I |
CT |
|
X |
|
|
|
|
|
ICC mode pin, must be tied low |
|
31 |
27 |
|
A4 |
VSS |
S |
|
|
|
|
|
|
|
|
Ground |
|
32 |
28 |
|
B4 |
VDD |
S |
|
|
|
|
|
|
|
|
Main power supply |
Notes:
1.In the interrupt input column, “eiX” defines the associated external interrupt vector. If the weak pull-up column (wpu) is merged with the interrupt column (int), then the I/O configuration is a pull-up interrupt input, otherwise the configuration is a floating interrupt input. Port C is mapped to ei0 or ei1 by option byte.
2.In the open drain output column, “T” defines a true open drain I/O (P-Buffer and protection diode to VDD are not implemented). See Section 9 "I/O PORTS" on page 38 for more details.
3.OSC1 and OSC2 pins connect a crystal or ceramic resonator, or an external source to the on-chip oscillator see Section 2 "PIN DESCRIPTION" on page 6 and Section 6.2 "MULTI-OSCILLATOR (MO)" on page 21 for more details.
4: For details refer to Section 13.8 on page 144
9/172
ST72260Gx, ST72262Gx, ST72264Gx
As shown in Figure 5, the MCU is capable of addressing 64K bytes of memories and I/O registers.
The available memory locations consist of 128 bytes of register location, 256 bytes of RAM and up to 8 Kbytes of user program memory. The RAM space includes up to 128 bytes for the stack from 0100h to 017Fh.
The highest address bytes contain the user reset and interrupt vectors.
The Flash memory contains two sectors (see Figure 5) mapped in the upper part of the ST7 ad-
Figure 5. Memory Map
dressing space so the reset and interrupt vectors are located in Sector 0 (F000h-FFFFh).
The size of Flash Sector 0 and other device options are configurable by Option byte (refer to Section 15.1 on page 162).
IMPORTANT: Memory locations marked as “Reserved” must never be accessed. Accessing a reseved area can have unpredictable effects on the device.
Related Documentation
AN 985: Executing Code in ST7 RAM
0000h |
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HW Registers |
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(see Table 2) |
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0080h |
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007Fh |
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Short Addressing RAM |
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0080h |
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Zero page |
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RAM |
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00FFh |
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(256 Bytes) |
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0100h |
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Stack or |
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017Fh |
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16-bit Addressing RAM |
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(128 Bytes) |
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0180h |
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017Fh |
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Reserved |
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8K FLASH |
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PROGRAM MEMORY |
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DFFFh |
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E000h |
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4 Kbytes |
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E000h |
Program Memory |
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EFFFh |
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SECTOR 1 |
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F000h |
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4 Kbytes |
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FFDFh |
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FFFFh |
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FFE0h |
Interrupt & Reset Vectors |
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FFFFh |
(see Table 5 on page 32) |
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10/172
ST72260Gx, ST72262Gx, ST72264Gx
Table 2. Hardware Register Map
Address |
Block |
Register |
Register Name |
Reset |
Remarks |
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Label |
Status |
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0000h |
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PCDR |
Port C Data Register |
xx000000h1) |
R/W 2) |
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0001h |
Port C |
PCDDR |
Port C Data Direction Register |
00h |
R/W 2) |
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0002h |
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PCOR |
Port C Option Register |
00h |
R/W 2) |
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0003h |
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Reserved (1 Byte) |
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0004h |
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PBDR |
Port B Data Register |
00h 1) |
R/W |
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0005h |
Port B |
PBDDR |
Port B Data Direction Register |
00h |
R/W |
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0006h |
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PBOR |
Port B Option Register |
00h |
R/W. |
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0007h |
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Reserved (1 Byte) |
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0008h |
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PADR |
Port A Data Register |
00h 1) |
R/W |
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0009h |
Port A |
PADDR |
Port A Data Direction Register |
00h |
R/W |
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000Ah |
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PAOR |
Port A Option Register |
00h |
R/W |
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000Bh |
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to |
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Reserved (17 Bytes) |
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001Bh |
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001Ch |
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ISPR0 |
Interrupt software priority register0 |
FFh |
R/W |
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001Dh |
ITC |
ISPR1 |
Interrupt software priority register1 |
FFh |
R/W |
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001Eh |
ISPR2 |
Interrupt software priority register2 |
FFh |
R/W |
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001Fh |
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ISPR3 |
Interrupt software priority register3 |
FFh |
R/W |
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0020h |
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MISCR1 |
Miscellanous register 1 |
00h |
R/W |
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0021h |
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SPIDR |
SPI Data I/O Register |
xxh |
R/W |
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0022h |
SPI |
SPICR |
SPI Control Register |
0xh |
R/W |
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0023h |
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SPICSR |
SPI Status Register |
00h |
R/W |
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0024h |
WATCHDOG |
WDGCR |
Watchdog Control Register |
7Fh |
R/W |
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0025h |
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SICSR |
System Integrity Control / Status Register |
000x 000x |
R/W |
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0026h |
MCC |
MCCSR |
Main Clock Control / Status Register |
00h |
R/W |
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0027h |
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Reserved (1 Byte) |
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0028h |
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I2CCR |
I2C Control Register |
00h |
R/W |
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0029h |
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I2CSR1 |
I2C Status Register 1 |
00h |
Read Only |
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002Ah |
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I2CSR2 |
I2C Status Register 2 |
00h |
Read Only |
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002Bh |
I2C |
I2CCCR |
I2C Clock Control Register |
00h |
R/W |
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002Ch |
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I2COAR1 |
I2C Own Address Register 1 |
00h |
R/W |
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002Dh |
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I2COAR2 |
I2C Own Address Register2 |
40h |
R/W |
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002Eh |
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I2CDR |
I2C Data Register |
00h |
R/W |
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002Fh |
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Reserved (2 Bytes) |
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0030h |
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11/172
ST72260Gx, ST72262Gx, ST72264Gx
Address |
Block |
Register |
Register Name |
Reset |
Remarks |
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Label |
Status |
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0031h |
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TACR2 |
Timer A Control Register 2 |
00h |
R/W |
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0032h |
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TACR1 |
Timer A Control Register 1 |
00h |
R/W |
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0033h |
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TASCSR |
Timer A Control/Status Register |
xxh |
R/W |
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0034h |
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TAIC1HR |
Timer A Input Capture 1 High Register |
xxh |
Read Only |
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0035h |
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TAIC1LR |
Timer A Input Capture 1 Low Register |
xxh |
Read Only |
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0036h |
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TAOC1HR |
Timer A Output Compare 1 High Register |
80h |
R/W |
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0037h |
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TAOC1LR |
Timer A Output Compare 1 Low Register |
00h |
R/W |
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0038h |
TIMER A |
TACHR |
Timer A Counter High Register |
FFh |
Read Only |
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0039h |
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TACLR |
Timer A Counter Low Register |
FCh |
Read Only |
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003Ah |
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TAACHR |
Timer A Alternate Counter High Register |
FFh |
Read Only |
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003Bh |
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TAACLR |
Timer A Alternate Counter Low Register |
FCh |
Read Only |
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003Ch |
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TAIC2HR |
Timer A Input Capture 2 High Register |
xxh |
Read Only |
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003Dh |
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TAIC2LR |
Timer A Input Capture 2 Low Register |
xxh |
Read Only |
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003Eh |
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TAOC2HR |
Timer A Output Compare 2 High Register |
80h |
R/W |
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003Fh |
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TAOC2LR |
Timer A Output Compare 2 Low Register |
00h |
R/W |
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0040h |
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MISCR2 |
Miscellanous register 2 |
00h |
R/W |
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0041h |
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TBCR2 |
Timer B Control Register 2 |
00h |
R/W |
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0042h |
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TBCR1 |
Timer B Control Register 1 |
00h |
R/W |
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0043h |
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TBSCSR |
Timer B Control/Status Register |
xxh |
R/W |
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0044h |
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TBIC1HR |
Timer B Input Capture 1 High Register |
xxh |
Read Only |
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0045h |
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TBIC1LR |
Timer B Input Capture 1 Low Register |
xxh |
Read Only |
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0046h |
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TBOC1HR |
Timer B Output Compare 1 High Register |
80h |
R/W |
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0047h |
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TBOC1LR |
Timer B Output Compare 1 Low Register |
00h |
R/W |
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0048h |
TIMER B |
TBCHR |
Timer B Counter High Register |
FFh |
Read Only |
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0049h |
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TBCLR |
Timer B Counter Low Register |
FCh |
Read Only |
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004Ah |
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TBACHR |
Timer B Alternate Counter High Register |
FFh |
Read Only |
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004Bh |
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TBACLR |
Timer B Alternate Counter Low Register |
FCh |
Read Only |
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004Ch |
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TBIC2HR |
Timer B Input Capture 2 High Register |
xxh |
Read Only |
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004Dh |
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TBIC2LR |
Timer B Input Capture 2 Low Register |
xxh |
Read Only |
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004Eh |
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TBOC2HR |
Timer B Output Compare 2 High Register |
80h |
R/W |
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004Fh |
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TBOC2LR |
Timer B Output Compare 2 Low Register |
00h |
R/W |
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0050h |
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SCISR |
SCI Status Register |
C0h |
Read Only |
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0051h |
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SCIDR |
SCI Data Register |
xxh |
R/W |
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0052h |
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SCIBRR |
SCI Baud Rate Register |
00h |
R/W |
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0053h |
SCI |
SCICR1 |
SCI Control Register1 |
x000 0000h |
R/W |
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0054h |
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SCICR2 |
SCI Control Register2 |
00h |
R/W |
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0055h |
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SCIERPR |
SCI Extended Receive Prescaler Register |
00h |
R/W |
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0056h |
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SCIETPR |
SCI Extended Transmit Prescaler Register |
00h |
R/W |
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0057h |
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Reserved (24 Bytes) |
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006Eh |
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006Fh |
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ADCDRL |
Data Register Low3) |
00h |
Read Only |
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0070h |
ADC |
ADCDRH |
Data Register High3) |
00h |
Read Only |
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0071h |
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ADCCSR |
Control/Status Register |
00h |
R/W |
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0072h |
FLASH |
FCSR |
Flash Control Register |
00h |
R/W |
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0073h |
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007Fh |
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12/172
ST72260Gx, ST72262Gx, ST72264Gx
Legend: x=Undefined, R/W=Read/Write
Notes:
1.The contents of the I/O port DR registers are readable only in output configuration. In input configuration, the values of the I/O pins are returned instead of the DR register contents.
2.The bits associated with unavailable pins must always keep their reset value.
3.For compatibility with the ST72C254, the ADCDRL and ADCDRH data registers are located with the LSB on the lower address (6Fh) and the MSB on the higher address (70h). As this scheme is not little Endian, the ADC data registers cannot be treated by C programs as an integer, but have to be treated as two char registers.
13/172
ST72260Gx, ST72262Gx, ST72264Gx
The ST7 single voltage extended Flash (XFlash) is a non-volatile memory that can be electrically erased and programmed either on a byte-by-byte basis or up to 32 bytes in parallel.
The XFlash devices can be programmed off-board (plugged in a programming tool) or on-board using In-Circuit Programming or In-Application Programming.
The array matrix organisation allows each sector to be erased and reprogrammed without affecting other sectors.
■ICP (In-Circuit Programming)
■IAP (In-Application Programming)
■ICT (In-Circuit Testing) for downloading and executing user application test patterns in RAM
■Sector 0 size configurable by option byte
■Read-out and write protection against piracy
The ST7 can be programmed in three different ways:
–Insertion in a programming tool. In this mode, FLASH sectors 0 and 1 and option byte row can be programmed or erased.
–In-Circuit Programming. In this mode, FLASH sectors 0 and 1 and option byte row can be programmed or erased without removing the device from the application board.
–In-Application Programming. In this mode, sector 1 can be programmed or erased without removing the device from the application
14/172
board and while the application is running.
ICP uses a protocol called ICC (In-Circuit Communication) which allows an ST7 plugged on a printed circuit board (PCB) to communicate with an external programming device connected via cable. ICP is performed in three steps:
Switch the ST7 to ICC mode (In-Circuit Communications). This is done by driving a specific signal sequence on the ICCCLK/DATA pins while the RESET pin is pulled low. When the ST7 enters ICC mode, it fetches a specific RESET vector which points to the ST7 System Memory containing the ICC protocol routine. This routine enables the ST7 to receive bytes from the ICC interface.
–Download ICP Driver code in RAM from the ICCDATA pin
–Execute ICP Driver code in RAM to program the FLASH memory
Depending on the ICP Driver code downloaded in RAM, FLASH memory programming can be fully customized (number of bytes to program, program locations, or selection of the serial communication interface for downloading).
This mode uses an IAP Driver program previously programmed in Sector 0 by the user (in ICP mode).
This mode is fully controlled by user software. This allows it to be adapted to the user application, (us- er-defined strategy for entering programming mode, choice of communications protocol used to fetch the data to be stored etc.)
IAP mode can be used to program any memory areas except Sector 0, which is write/erase protected to allow recovery in case errors occur during the programming operation.
ST72260Gx, ST72262Gx, ST72264Gx
FLASH PROGRAM MEMORY (Cont’d)
ICP needs a minimum of 4 and up to 7 pins to be connected to the programming tool. These pins are:
–RESET: device reset
–VSS: device power supply ground
–ICCCLK: ICC output serial clock pin
–ICCDATA: ICC input serial data pin
–ICCSEL: ICC selection (not required on devices without ICCSEL pin)
–OSC1: main clock input for external source (not required on devices without OSC1/OSC2 pins)
–VDD: application board power supply (optional, see Note 3)
Notes:
1. If the ICCCLK or ICCDATA pins are only used as outputs in the application, no signal isolation is necessary. As soon as the Programming Tool is plugged to the board, even if an ICC session is not in progress, the ICCCLK and ICCDATA pins are not available for the application. If they are used as inputs by the application, isolation such as a serial resistor has to be implemented in case another device forces the signal. Refer to the Programming
Figure 6. Typical ICC Interface
Tool documentation for recommended resistor values.
2.During the ICP session, the programming tool must control the RESET pin. This can lead to conflicts between the programming tool and the application reset circuit if it drives more than 5mA at high level (push pull output or pull-up resistor<1K). A schottky diode can be used to isolate the application RESET circuit in this case. When using a classical RC network with R>1K or a reset management IC with open drain output and pull-up resistor>1K, no additional components are needed. In all cases the user must ensure that no external reset is generated by the application during the ICC session.
3.The use of Pin 7 of the ICC connector depends on the Programming Tool architecture. This pin must be connected when using most ST Programming Tools (it is used to monitor the application power supply). Please refer to the Programming Tool manual.
4.Pin 9 has to be connected to the OSC1 pin of the ST7 when the clock is not available in the application or if the selected clock option is not programmed in the option byte. ST7 devices with mul- ti-oscillator capability need to have OSC2 grounded in this case.
PROGRAMMING TOOL
ICC CONNECTOR
ICC Cable
(See Note 3)
APPLICATION CL2
POWER SUPPLY
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VDD |
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OSC2 |
ICC CONNECTOR
HE10 CONNECTOR TYPE
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OPTIONAL |
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APPLICATION BOARD |
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(See Note 4) |
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9 |
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7 |
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5 |
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1 |
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OSC1 |
VSS |
ICCSEL |
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15/172
ST72260Gx, ST72262Gx, ST72264Gx
FLASH PROGRAM MEMORY (Cont’d)
There are two different types of memory protection: Read Out Protection and Write/Erase Protection which can be applied individually.
Read-out protection, when selected, provides a protection against Program Memory content extraction and against write access to Flash memory. Even if no protection can be considered as totally unbreakable, the feature provides a very high level of protection for a general purpose microcontroller.
In flash devices, this protection is removed by reprogramming the option. In this case the program memory is automatically erased and the device can be reprogrammed.
Read-out protection selection depends on the device type:
–In Flash devices it is enabled and removed through the FMP_R bit in the option byte.
–In ROM devices it is enabled by mask option specified in the Option List.
Write/erase protection, when set, makes it impossible to both overwrite and erase program memory. Its purpose is to provide advanced security to applications and prevent any change being made to the memory content.
Warning: Once set, Write/erase protection can never be removed. A write-protected flash device is no longer reprogrammable.
Write/erase protection is enabled through the FMP_W bit in the option byte.
16/172
For details on Flash programming and ICC protocol, refer to the ST7 Flash Programming Reference Manual and to the ST7 ICC Protocol Reference Manual.
AN1477: Emulated data EEPROM with XFlash memory
AN1576: IAP drivers for ST7 HDFlash or XFlash MCUs
AN1575: On Board Programming methods for ST7 HDFlash or XFlash MCUs
AN1070: Checksum self checking capability
FLASH CONTROL/STATUS REGISTER (FCSR)
Read/Write
Reset Value: 000 0000 (00h) 1st RASS Key: 0101 0110 (56h)
2nd RASS Key: 1010 1110 (AEh)
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OPT |
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Note: This register is reserved for programming using ICP, IAP or other programming methods. It controls the XFlash programming and erasing operations.
When an EPB or another programming tool is used (in socket or ICP mode), the RASS keys are sent automatically.
ST72260Gx, ST72262Gx, ST72264Gx
This CPU has a full 8-bit architecture and contains six internal registers allowing efficient 8-bit data manipulation.
■Enable executing 63 basic instructions
■Fast 8-bit by 8-bit multiply
■17 main addressing modes (with indirect addressing mode)
■Two 8-bit index registers
■16-bit stack pointer
■Low power HALT and WAIT modes
■Priority maskable hardware interrupts
■Non-maskable software/hardware interrupts
The 6 CPU registers shown in Figure 7 are not present in the memory mapping and are accessed by specific instructions.
Accumulator (A)
The Accumulator is an 8-bit general purpose register used to hold operands and the results of the arithmetic and logic calculations and to manipulate data.
Index Registers (X and Y)
These 8-bit registers are used to create effective addresses or as temporary storage areas for data manipulation. (The Cross-Assembler generates a precede instruction (PRE) to indicate that the following instruction refers to the Y register.)
The Y register is not affected by the interrupt automatic procedures.
Program Counter (PC)
The program counter is a 16-bit register containing the address of the next instruction to be executed by the CPU. It is made of two 8-bit registers PCL (Program Counter Low which is the LSB) and PCH (Program Counter High which is the MSB).
Figure 7. CPU Registers
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ACCUMULATOR |
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RESET VALUE = XXh |
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X INDEX REGISTER |
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Y INDEX REGISTER |
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RESET VALUE = RESET VECTOR @ FFFEh-FFFFh |
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RESET VALUE = 1 |
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RESET VALUE = STACK HIGHER ADDRESS |
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X = Undefined Value
17/172
ST72260Gx, ST72262Gx, ST72264Gx
CENTRAL PROCESSING UNIT (Cont’d)
Condition Code Register (CC)
Read/Write
Reset Value: 111x1xxx
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The 8-bit Condition Code register contains the interrupt masks and four flags representative of the result of the instruction just executed. This register can also be handled by the PUSH and POP instructions.
These bits can be individually tested and/or controlled by specific instructions.
Arithmetic Management Bits
Bit 4 = H Half carry.
This bit is set by hardware when a carry occurs between bits 3 and 4 of the ALU during an ADD or ADC instructions. It is reset by hardware during the same instructions.
0:No half carry has occurred.
1:A half carry has occurred.
This bit is tested using the JRH or JRNH instruction. The H bit is useful in BCD arithmetic subroutines.
Bit 2 = N Negative.
This bit is set and cleared by hardware. It is representative of the result sign of the last arithmetic, logical or data manipulation. It’s a copy of the result 7th bit.
0:The result of the last operation is positive or null.
1:The result of the last operation is negative
(i.e. the most significant bit is a logic 1).
This bit is accessed by the JRMI and JRPL instructions.
18/172
Bit 1 = Z Zero.
This bit is set and cleared by hardware. This bit indicates that the result of the last arithmetic, logical or data manipulation is zero.
0:The result of the last operation is different from zero.
1:The result of the last operation is zero.
This bit is accessed by the JREQ and JRNE test instructions.
Bit 0 = C Carry/borrow.
This bit is set and cleared by hardware and software. It indicates an overflow or an underflow has occurred during the last arithmetic operation.
0:No overflow or underflow has occurred.
1:An overflow or underflow has occurred.
This bit is driven by the SCF and RCF instructions and tested by the JRC and JRNC instructions. It is also affected by the “bit test and branch”, shift and rotate instructions.
Interrupt Management Bits
Bit 5,3 = I1, I0 Interrupt
The combination of the I1 and I0 bits gives the current interrupt software priority.
Interrupt Software Priority |
I1 |
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These two bits are set/cleared by hardware when entering in interrupt. The loaded value is given by the corresponding bits in the interrupt software priority registers (IxSPR). They can be also set/ cleared by software with the RIM, SIM, IRET, HALT, WFI and PUSH/POP instructions.
See the interrupt management chapter for more details.
ST72260Gx, ST72262Gx, ST72264Gx
CENTRAL PROCESSING UNIT (Cont’d)
Stack Pointer (SP)
Read/Write
Reset Value: 01 7Fh
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SP7 |
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SP4 |
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SP2 |
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SP0 |
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The Stack Pointer is a 16-bit register which is always pointing to the next free location in the stack. It is then decremented after data has been pushed onto the stack and incremented before data is popped from the stack (see Figure 8).
Since the stack is 128 bytes deep, the 8 most significant bits are forced by hardware. Following an MCU Reset, or after a Reset Stack Pointer instruction (RSP), the Stack Pointer contains its reset value (the SP7 to SP0 bits are set) which is the stack higher address.
The least significant byte of the Stack Pointer (called S) can be directly accessed by a LD instruction.
Note: When the lower limit is exceeded, the Stack Pointer wraps around to the stack upper limit, without indicating the stack overflow. The previously stored information is then overwritten and therefore lost. The stack also wraps in case of an underflow.
The stack is used to save the return address during a subroutine call and the CPU context during an interrupt. The user may also directly manipulate the stack by means of the PUSH and POP instructions. In the case of an interrupt, the PCL is stored at the first location pointed to by the SP. Then the other registers are stored in the next locations as shown in Figure 8
–When an interrupt is received, the SP is decremented and the context is pushed on the stack.
–On return from interrupt, the SP is incremented and the context is popped from the stack.
A subroutine call occupies two locations and an interrupt five locations in the stack area.
Figure 8. Stack Manipulation Example
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CALL |
Interrupt |
PUSH Y |
POP Y |
IRET |
RET |
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Event |
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PCL |
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19/172 |
ST72260Gx, ST72262Gx, ST72264Gx
The device includes a range of utility features for securing the application in critical situations (for example in case of a power brown-out), and reducing the number of external components. An overview is shown in Figure 10.
For more details, refer to dedicated parametric section.
Main Features
■Optional PLL for multiplying the frequency by 2 (not to be used with internal RC oscillator)
■Reset Sequence Manager (RSM)
■Multi-Oscillator Clock Management (MO)
–4 Crystal/Ceramic resonator oscillators
–1 Internal RC oscillator
■System Integrity Management (SI)
–Main supply Low Voltage Detector (LVD)
–Auxiliary Voltage Detector (AVD) with interrupt capability for monitoring the main supply
If the clock frequency input to the PLL is in the 2 to 4 MHz range, the PLL can be used to multiply the frequency by two to obtain an fOSC2 of 4 to 8 MHz. The PLL is enabled by option byte. If the PLL is disabled, then fOSC2 = fOSC/2.
Caution: The PLL is not recommended for applications where timing accuracy is required. See “PLL Characteristics” on page 139.
Figure 9. PLL Block Diagram
fOSC |
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PLL OPTION BIT
Figure 10. Clock, Reset and Supply Block Diagram
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fCPU |
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OSC2 |
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MULTI- |
fOSC |
PLL |
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OSCILLATOR |
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CONTROLLER |
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OSC1 |
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RESET SEQUENCE |
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WATCHDOG |
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AVD Interrupt Request |
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TIMER (WDG) |
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RESET |
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MANAGER |
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SICSR |
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IE |
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VSS |
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LOW VOLTAGE |
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DETECTOR |
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VDD |
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(LVD) |
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AUXILIARY VOLTAGE |
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DETECTOR |
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(AVD) |
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20/172
ST72260Gx, ST72262Gx, ST72264Gx
The main clock of the ST7 can be generated by four different source types coming from the multioscillator block:
■an external source
■5 crystal or ceramic resonator oscillators
■an internal high frequency RC oscillator
Each oscillator is optimized for a given frequency range in terms of consumption and is selectable through the option byte. The associated hardware configurations are shown in Table 3. Refer to the electrical characteristics section for more details.
Caution: The OSC1 and/or OSC2 pins must not be left unconnected. For the purposes of Failure Mode and Effects Analysis, it should be noted that if the OSC1 and/or OSC2 pins are left unconnected, the ST7 main oscillator may start and, in this configuration, could generate an fOSC clock frequency in excess of the allowed maximum (>16MHz.), putting the ST7 in an unsafe/undefined state. The product behaviour must therefore be considered undefined when the OSC pins are left unconnected.
External Clock Source
In this external clock mode, a clock signal (square, sinus or triangle) with ~50% duty cycle has to drive the OSC1 pin while the OSC2 pin is tied to ground.
Crystal/Ceramic Oscillators
This family of oscillators has the advantage of producing a very accurate rate on the main clock of the ST7. The selection within a list of 5 oscillators with different frequency ranges has to be done by option byte in order to reduce consumption (refer to Section 15.1 on page 162 for more details on the frequency ranges). In this mode of the multioscillator, the resonator and the load capacitors have to be placed as close as possible to the oscillator pins in order to minimize output distortion and start-up stabilization time. The loading capacitance values must be adjusted according to the selected oscillator.
These oscillators are not stopped during the RESET phase to avoid losing time in the oscillator start-up phase.
Internal RC Oscillator
This oscillator allows a low cost solution for the main clock of the ST7 using only an internal resistor and capacitor. Internal RC oscillator mode has the drawback of a lower frequency accuracy and should not be used in applications that require accurate timing.
In this mode, the two oscillator pins have to be tied to ground.
Related documentation
AN1530: Accurate timebase for low cost ST7 applications with internal RC.
Table 3. ST7 Clock Sources
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Hardware Configuration |
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External Clock |
ST7 |
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OSC1 |
OSC2 |
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EXTERNAL |
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SOURCE |
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Resonators |
ST7 |
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OSC1 |
OSC2 |
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Crystal/Ceramic |
CL1 |
CL2 |
LOAD |
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Internal RC Oscillator |
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OSC1 |
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21/172 |
ST72260Gx, ST72262Gx, ST72264Gx
The reset sequence manager includes three RESET sources as shown in Figure 12:
■External RESET source pulse
■Internal LVD RESET (Low Voltage Detection)
■Internal WATCHDOG RESET
These sources act on the RESET pin and it is always kept low during the delay phase.
The RESET service routine vector is fixed at addresses FFFEh-FFFFh in the ST7 memory map.
The basic RESET sequence consists of 3 phases as shown in Figure 11:
■Active Phase depending on the RESET source
■4096 CPU clock cycle delay (selected by option byte)
■RESET vector fetch
The 4096 CPU clock cycle delay allows the oscillator to stabilise and ensures that recovery has taken place from the Reset state. The shorter or longer clock cycle delay should be selected by option byte to correspond to the stabilization time of the external oscillator used in the application.
Figure 12. Reset Block Diagram
The RESET vector fetch phase duration is 2 clock cycles.
Figure 11. RESET Sequence Phases
RESET
Active Phase |
INTERNAL RESET |
FETCH |
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4096 CLOCK CYCLES |
VECTOR |
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The RESET pin is both an input and an open-drain output with integrated RON weak pull-up resistor. This pull-up has no fixed value but varies in accordance with the input voltage. It can be pulled low by external circuitry to reset the device. See Electrical Characteristic section for more details.
A RESET signal originating from an external
source must have a duration of at least th(RSTL)in in order to be recognized (see Figure 13). This de-
tection is asynchronous and therefore the MCU can enter reset state even in HALT mode.
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RON |
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Filter |
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INTERNAL |
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RESET |
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PULSE |
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22/172
ST72260Gx, ST72262Gx, ST72264Gx
RESET SEQUENCE MANAGER (Cont’d)
The RESET pin is an asynchronous signal which plays a major role in EMS performance. In a noisy environment, it is recommended to follow the guidelines mentioned in the electrical characteristics section.
If the LVD is disabled by option byte, to start up the microcontroller correctly, the user must ensure by means of an external reset circuit that the reset signal is held low until VDD is over the minimum level specified for the selected fOSC frequency.
A proper reset signal for a slow rising VDD supply can generally be provided by an external RC network connected to the RESET pin.
6.3.4 Internal Low Voltage Detector (LVD)
RESET
Two different RESET sequences caused by the internal LVD circuitry can be distinguished:
■Power-On RESET
■Voltage Drop RESET
The device RESET pin acts as an output that is pulled low when VDD<VIT+ (rising edge) or VDD<VIT- (falling edge) as shown in Figure 13.
The LVD filters spikes on VDD larger than tg(VDD) to avoid parasitic resets.
The RESET sequence generated by a internal Watchdog counter overflow is shown in Figure 13.
Starting from the Watchdog counter underflow, the device RESET pin acts as an output that is pulled low during at least tw(RSTL)out.
Figure 13. RESET Sequences
VDD
VIT+(LVD)
VIT-(LVD)
LVD |
EXTERNAL |
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WATCHDOG |
RESET |
RESET |
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RESET |
RUN |
RUN |
RUN |
RUN |
ACTIVE PHASE |
ACTIVE |
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ACTIVE |
PHASE |
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PHASE |
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th(RSTL)in |
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tw(RSTL)out |
EXTERNAL
RESET
SOURCE
RESET PIN
WATCHDOG
RESET
WATCHDOG UNDERFLOW
INTERNAL RESET (4096 TCPU)
VECTOR FETCH
23/172
ST72260Gx, ST72262Gx, ST72264Gx
The System Integrity Management block contains group the Low voltage Detector (LVD) and Auxiliary Voltage Detector (AVD) functions. It is managed by the SICSR register.
Provided the minimum VDD value (guaranteed for the oscillator frequency) is above VIT-, the MCU can only be in two modes:
– under full software control
Note: A reset can also be triggered following the detection of an illegal opcode or prebyte code. Refer to Section 12.2.1 on page 123 for further details.
The Low Voltage Detector function (LVD) generates a static reset when the VDD supply voltage is below a VIT- reference value. This means that it secures the power-up as well as the power-down keeping the ST7 in reset.
The VIT- reference value for a voltage drop is lower than the VIT+ reference value for power-on in order to avoid a parasitic reset when the MCU starts running and sinks current on the supply (hysteresis).
The LVD Reset circuitry generates a reset when VDD is below:
–VIT+ when VDD is rising
–VIT- when VDD is falling
The LVD function is illustrated in Figure 14.
The voltage threshold can be configured by option byte to be low, medium or high.
Figure 14. Low Voltage Detector vs Reset
– in static safe reset
In these conditions, secure operation is always ensured for the application without the need for external reset hardware.
During a Low Voltage Detector Reset, the RESET pin is held low, thus permitting the MCU to reset other devices.
Notes:
The LVD allows the device to be used without any external RESET circuitry.
The LVD is an optional function which can be selected by option byte.
Use of LVD with capacitive power supply: with this type of power supply, if power cuts occur in the application, it is recommended to pull VDD down to 0V to ensure optimum restart conditions. Refer to circuit example in Figure 91 on page 151 and note 6.
It is recommended to make sure that the VDD supply voltage rises monotonously when the device is exiting from Reset, to ensure the application functions properly.
VDD
Vhys
VIT+
VIT-
RESET
24/172
ST72260Gx, ST72262Gx, ST72264Gx
SYSTEM INTEGRITY MANAGEMENT (Cont’d)
The Voltage Detector function (AVD) is based on
an analog comparison between a VIT- and VIT+ reference value and the VDD main supply. The VIT-
reference value for falling voltage is lower than the VIT+ reference value for rising voltage in order to avoid parasitic detection (hysteresis).
The output of the AVD comparator is directly readable by the application software through a real time status bit (VDF) in the SICSR register. This bit is read only.
Caution: The AVD functions only if the LVD is enabled through the option byte.
6.4.2.1 Monitoring the VDD Main Supply
The AVD voltage threshold value is relative to the selected LVD threshold configured by option byte (see Section 15.1 on page 162).
If the AVD interrupt is enabled, an interrupt is gen-
erated when the voltage crosses the VIT+(AVD) or VIT-(AVD) threshold (AVDF bit toggles).
Figure 15. Using the AVD to Monitor VDD
In the case of a drop in voltage, the AVD interrupt acts as an early warning, allowing software to shut down safely before the LVD resets the microcontroller. See Figure 15.
The interrupt on the rising edge is used to inform the application that the VDD warning state is over.
If the voltage rise time trv is less than 256 or 4096 CPU cycles (depending on the reset delay selected by option byte), no AVD interrupt will be generated when VIT+(AVD) is reached.
If trv is greater than 256 or 4096 cycles then:
– If the AVD interrupt is enabled before the
VIT+(AVD) threshold is reached, then 2 AVD interrupts will be received: the first when the AVDIE
bit is set, and the second when the threshold is reached.
–If the AVD interrupt is enabled after the VIT+(AVD) threshold is reached then only one AVD interrupt will occur.
VDD |
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Early Warning Interrupt |
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(Power has dropped, MCU not |
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VIT+(AVD) |
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Vhyst |
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VIT-(AVD) |
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VIT+(LVD) |
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VIT-(LVD) |
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trv VOLTAGE RISE TIME |
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AVDF bit |
0 |
1 |
RESET VALUE |
1 |
0 |
AVD INTERRUPT |
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REQUEST |
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IF AVDIE bit = 1 |
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INTERRUPT PROCESS |
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INTERRUPT PROCESS |
LVD RESET |
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ST72260Gx, ST72262Gx, ST72264Gx
SYSTEM INTEGRITY MANAGEMENT (Cont’d)
Mode |
Description |
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WAIT |
No effect on SI. AVD interrupts cause the |
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HALT |
The SICSR register is frozen. |
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6.4.3.1 Interrupts
The AVD interrupt event generates an interrupt if the corresponding Enable Control Bit (AVDIE) is
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set and the interrupt mask in the CC register is reset (RIM instruction).
Interrupt Event |
Event |
Enable |
Exit |
Exit |
Flag |
Control |
from |
from |
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Wait |
Halt |
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AVD event |
AVDF |
AVDIE |
Yes |
No |
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ST72260Gx, ST72262Gx, ST72264Gx
SYSTEM INTEGRITY MANAGEMENT (Cont’d)
SYSTEM INTEGRITY (SI) CONTROL/STATUS REGISTER (SICSR)
Read/Write
Reset Value: 000x 000x (00h)
7 |
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0 |
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0 |
AVD |
AVD |
LVD |
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0 |
WDG |
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IE |
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RF |
RF |
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Bit 7 = Reserved, always read as 0.
Bit 6 = AVDIE Voltage Detector interrupt enable
This bit is set and cleared by software. It enables an interrupt to be generated when the AVDF flag changes (toggles). The pending interrupt information is automatically cleared when software enters the AVD interrupt routine.
0:AVD interrupt disabled
1:AVD interrupt enabled
Bit 5 = AVDF Voltage Detector flag
This read-only bit is set and cleared by hardware. If the AVDIE bit is set, an interrupt request is generated when the AVDF bit changes value.
0:VDD over VIT+(AVD) threshold
1:VDD under VIT-(AVD) threshold
Bit 4 = LVDRF LVD reset flag
This bit indicates that the last Reset was generated by the LVD block. It is set by hardware (LVD reset) and cleared by software (writing zero). See
WDGRF flag description for more details. When the LVD is disabled by OPTION BYTE, the LVDRF bit value is undefined.
Bit 3:1 = Reserved, must be kept cleared.
Bit 0 = WDGRF Watchdog reset flag
This bit indicates that the last Reset was generated by the Watchdog peripheral. It is set by hardware (watchdog reset) and cleared by software (writing zero) or an LVD Reset (to ensure a stable cleared state of the WDGRF flag when CPU starts).
Combined with the LVDRF flag information, the flag description is given by the following table.
RESET Sources |
LVDRF |
WDGRF |
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External |
RESET |
pin |
0 |
0 |
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Watchdog |
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1 |
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1 |
X |
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Application Notes
The LVDRF flag is not cleared when another RESET type occurs (external or watchdog), the LVDRF flag remains set to keep trace of the original failure. In this case, a watchdog reset can be detected by software while an external reset can not.
Address |
Register |
7 |
6 |
5 |
4 |
3 |
2 |
1 |
0 |
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(Hex.) |
Label |
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0025h |
SICSR |
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AVDIE |
AVDF |
LVDRF |
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WDGRF |
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Reset Value |
0 |
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0 |
x |
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27/172
ST72260Gx, ST72262Gx, ST72264Gx
The ST7 enhanced interrupt management provides the following features:
■Hardware interrupts
■Software interrupt (TRAP)
■Nested or concurrent interrupt management with flexible interrupt priority and level management:
–Up to 4 software programmable nesting levels
–Up to 16 interrupt vectors fixed by hardware
–2 non-maskable events: RESET and TRAP This interrupt management is based on:
–Bit 5 and bit 3 of the CPU CC register (I1:0),
–Interrupt software priority registers (ISPRx),
–Fixed interrupt vector addresses located at the high addresses of the memory map (FFE0h to FFFFh) sorted by hardware priority order.
This enhanced interrupt controller guarantees full upward compatibility with the standard (not nested) ST7 interrupt controller.
The interrupt masking is managed by the I1 and I0 bits of the CC register and the ISPRx registers which give the interrupt software priority level of each interrupt vector (see Table 4). The processing flow is shown in Figure 16
When an interrupt request has to be serviced:
–Normal processing is suspended at the end of the current instruction execution.
–The PC, X, A and CC registers are saved onto the stack.
–I1 and I0 bits of CC register are set according to the corresponding values in the ISPRx registers of the serviced interrupt vector.
–The PC is then loaded with the interrupt vector of the interrupt to service and the first instruction of the interrupt service routine is fetched (refer to “Interrupt Mapping” table for vector addresses).
The interrupt service routine should end with the IRET instruction which causes the contents of the saved registers to be recovered from the stack.
Note: As a consequence of the IRET instruction, the I1 and I0 bits will be restored from the stack and the program in the previous level will resume.
Table 4. Interrupt Software Priority Levels
Interrupt software priority |
Level |
I1 |
I0 |
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Level 0 |
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1 |
0 |
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Level 1 |
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1 |
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Level 2 |
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High |
0 |
0 |
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Level 3 |
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1 |
1 |
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Figure 16. Interrupt Processing Flowchart
RESET |
PENDING |
Y |
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INTERRUPT |
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N |
Interrupt has the same or a |
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lower software priority |
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than current one |
I1:0 |
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FETCH NEXT |
THE INTERRUPT |
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INSTRUCTION |
STAYS PENDING |
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Interrupt hashighera |
softwarepriority than currentone |
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“IRET” |
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RESTORE PC, X, A, CC |
EXECUTE |
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FROM STACK |
INSTRUCTION |
STACK PC, X, A, CC |
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LOAD I1:0 FROM INTERRUPT SW REG. |
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LOAD PC FROM INTERRUPT VECTOR |
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ST72260Gx, ST72262Gx, ST72264Gx
INTERRUPTS (Cont’d)
Servicing Pending Interrupts
As several interrupts can be pending at the same time, the interrupt to be taken into account is determined by the following two-step process:
–the highest software priority interrupt is serviced,
–if several interrupts have the same software priority then the interrupt with the highest hardware priority is serviced first.
Figure 17 describes this decision process.
Figure 17. Priority Decision Process
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PENDING |
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INTERRUPTS |
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Same |
SOFTWARE |
Different |
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PRIORITY |
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HIGHEST SOFTWARE |
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PRIORITY SERVICED |
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HIGHEST HARDWARE |
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PRIORITY SERVICED |
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When an interrupt request is not serviced immediately, it is latched and then processed when its software priority combined with the hardware priority becomes the highest one.
Note 1: The hardware priority is exclusive while the software one is not. This allows the previous process to succeed with only one interrupt.
Note 2: RESET and TRAP are non-maskable and they can be considered as having the highest software priority in the decision process.
Different Interrupt Vector Sources
Two interrupt source types are managed by the ST7 interrupt controller: the non-maskable type (RESET and TRAP) and the maskable type (external or from internal peripherals).
Non-Maskable Sources
These sources are processed regardless of the state of the I1 and I0 bits of the CC register (see Figure 16). After stacking the PC, X, A and CC registers (except for RESET), the corresponding vector is loaded in the PC register and the I1 and I0 bits of the CC are set to disable interrupts (level
3). These sources allow the processor to exit HALT mode.
■ TRAP (Non Maskable Software Interrupt)
This software interrupt is serviced when the TRAP instruction is executed. It will be serviced according to the flowchart on Figure 16 as a TLI.
■ RESET
The RESET source has the highest priority in the ST7. This means that the first current routine has the highest software priority (level 3) and the highest hardware priority.
See the RESET chapter for more details.
Maskable Sources
Maskable interrupt vector sources can be serviced if the corresponding interrupt is enabled and if its own interrupt software priority (in ISPRx registers) is higher than the one currently being serviced (I1 and I0 in CC register). If any of these two conditions is false, the interrupt is latched and thus remains pending.
■ External Interrupts
External interrupts allow the processor to exit from HALT low power mode.
External interrupt sensitivity is software selectable through the Miscellaneous registers (MISCRx). External interrupt triggered on edge will be latched and the interrupt request automatically cleared upon entering the interrupt service routine.
If several input pins of a group connected to the same interrupt vector request an interrupt simultaneously, the interrupt vector will be serviced. Software can read the pin levels to identify which pin(s) are the source of the interrupt.
If several input pins are selected simultaneously as interrupt source, these are logically NANDed. For this reason if one of the interrupt pins is tied low, it masks the other ones.
■ Peripheral Interrupts
Usually the peripheral interrupts cause the MCU to exit from HALT mode except those mentioned in the “Interrupt Mapping” table.
A peripheral interrupt occurs when a specific flag is set in the peripheral status registers and if the corresponding enable bit is set in the peripheral control register.
The general sequence for clearing an interrupt is based on an access to the status register followed by a read or write to an associated register.
Note: The clearing sequence resets the internal latch. A pending interrupt (i.e. waiting for being serviced) will therefore be lost if the clear sequence is executed.
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ST72260Gx, ST72262Gx, ST72264Gx
INTERRUPTS (Cont’d)
All interrupts allow the processor to exit the WAIT low power mode. On the contrary, only external and other specified interrupts allow the processor to exit the HALT modes (see column “Exit from HALT” in “Interrupt Mapping” table). When several pending interrupts are present while exiting HALT mode, the first one serviced can only be an interrupt with exit from HALT mode capability and it is selected through the same decision process shown in Figure 17.
Note: If an interrupt, that is not able to Exit from HALT mode, is pending with the highest priority when exiting HALT mode, this interrupt is serviced after the first one serviced.
Figure 18. Concurrent Interrupt Management
The following Figure 18 and Figure 19 show two different interrupt management modes. The first is called concurrent mode and does not allow an interrupt to be interrupted, unlike the nested mode in Figure 19. The interrupt hardware priority is given in this order from the lowest to the highest: MAIN, IT4, IT3, IT2, IT1, IT0. The software priority is given for each interrupt.
Warning: A stack overflow may occur without notifying the software of the failure.
Note: TLI (Top Level Interrupt) is not available in this product.
Related Documentation
AN1044: Multiple interrupt source management for ST7 MCUs
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IT2 |
IT1 |
IT4 |
IT3 |
TLI |
IT0 |
SOFTWARE |
I1 |
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I0 |
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TLI |
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IT0 |
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IT2 |
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IT3 |
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USED STACK = 10 BYTES
Figure 19. Nested Interrupt Management
HARDWARE PRIORITY
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IT2 |
IT1 |
IT4 |
IT3 |
TLI |
IT0 |
SOFTWARE |
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I1 |
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LEVEL |
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TLI |
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IT0 |
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IT1 |
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IT1 |
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IT2 |
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IT2 |
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IT3 |
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IT4 |
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