Sony XRC-6090 Service manual
SERVICE MANUAL
For RM-X4S (Remote Commander),
please refer to RM-X4S Service Manual
(9-925-698-∏) previously issued.
Photo: XR-5800R
XR-C6090
E Model
Dolby noise reduction manufactured under license
from Dolby Laboratories Licensing Corporation.
“DOLBY” and the double-D symbol a are trademarks of Dolby Laboratories Licensing Corporation.
SPECIFICATIONS
Model Name Using Similar Mechanism XR-C450
Tape Transport Mechanism Type
MG-25J-136
MICROFILM
FM/AM CASSETTE CAR STEREO
TABLE OF CONTENTS
1. GENERAL
Location of Controls ....................................................... 3
Setting the Clock ............................................................. 3
Installation....................................................................... 4
Connection ...................................................................... 6
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
2. DISASSEMBLY ......................................................... 8
3. ASSEMBLY OF MECHANISM DECK........... 10
4. MECHANICAL ADJUSTMENTS....................... 13
5. ELECTRICAL ADJUSTMENTS
Tape Deck Section .......................................................... 13
Tuner Section .................................................................. 13
6. DIAGRAMS
6-1. Printed Wiring Board – Main Section –........................ 15
6-2. Schematic Diagram – Main Section – ............................ 17
6-3. Printed Wiring Board – Panel Section –........................ 21
6-4. Schematic Diagram – Panel Section – .......................... 23
6-5. IC Pin Function Description ........................................... 27
7. EXPLODED VIEWS ................................................ 30
8. ELECTRICAL PARTS LIST ............................... 33
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
– 2 –
SECTION 1
GENERAL
This section is extracted from
instruction manual.
– 3 –
– 4 –
– 5 –
– 6 –
– 7 –
SECTION 2
DISASSEMBLY
Note: Follow the disassembly procedure in the numerical order given.
FRONT PANEL ASS’Y, COLLAR
4
collar
3
claw
1
Push the button
(release).
2
COVER ASS’Y
1
A
Remove the front panel ass’y
to the direction of the arrow
2
A
3
claw
.
cover ass’y
3
– 8 –
2
1
SUB PANEL, MECHANISM DECK (MG-25J-136)
k
3
connector
(CN351)
2
sub panel
1
three screws
(PTT2.6
×
8)
5
screw
(PTT2.6
4
flexible flat cable
(CN301)
×
6)
6
mechanism dec
(MG-25F-136)
1
three screws
(PTT2.6
×
8)
MAIN BOARD, HEAT SINK
3
two ground point
screws
4
main board
5
three screws
(PTT 2.6
2
×
10)
rubber cap (25)
1
two screws
(PTT2.6
5
two screws
(PTT 2.6
5
6
heat sink
two screws
(PTT 2.6
×
8)
×
1
10)
screw
(PTT2.6
×
10)
×
8)
– 9 –
Loading...