Sony MGSX-1 Service manual
MGS-X1
SERVICE MANUAL
Ver 1.0 2001.09
SPECIFICATIONS
System “Memory Stick” digital audio system
Sampling frequency response
44.1 kHz
Recording format Adaptive Transform Acorstick Cording3
(ATRAC3)
Frequency response 20 to 20,000 Hz
Signal-to-noise ratio (S/N)
More than 80 dB (excluding 66 kbps)
Power consumption Less than 300 mA (during playback)
Operating temperature –10 °C to +55 °C
Dimensions Approx. 48.1 × 30.5 × 113.5 mm (w/h/d)
(1 15/16 × 1 1/4 × 4 1/2 in.)
Mass Approx. 210 g (7.4 oz.)
Supplied accessories Parts for installation and connections (1 set)
Carrying pouch (1)
Optional accessories Source selector
XA-C30
Bus/Pin extension cord (2 m)
RC-87
“MG Memory Stick”
MSG-32A (32 MB) MSG-64A (64 MB)
MSG 128A (128 MB)
US Model
Canadian Model
AEP Model
UK Model
9-873-325-01
2001I0400-1
© 2001.9
Design and specifications are subject to change without notice.
MG MEMORY STICK
SYSTEM-UP PLAYER
Sony Corporation
e Vehicle Company
Shinagawa Tec Service Manual Production Group
1
MGS-X1
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TABLE OF CONTENTS
1. SERVICE NOTE ................................................................ 3
2. GENERAL
On “MagicGate Memory Stick” ..............................................4
Features ................................................................................... 4
Operation ................................................................................. 5
Connection...............................................................................5
3. DISASSEMBLY
3-1. Case (Bottom) ..................................................................... 7
3-2. IF Board ..............................................................................7
3-3. Main Board ......................................................................... 8
3-4. LED Board .......................................................................... 8
4. DIAGRAMS
4-1. IC Pin Descriptions ............................................................. 9
4-2. Block Diagram – Main Section –...................................... 17
4-3. Block Diagram – IF Section –........................................... 18
4-4. Printed Wiring Board – Main Section –............................ 21
4-5. Schematic Diagram – Main Section (1/4) – ...................... 22
4-6. Schematic Diagram – Main Section (2/4) – ...................... 23
4-7. Schematic Diagram – Main Section (3/4) – ...................... 24
4-8. Schematic Diagram – Main Section (4/4) – ...................... 25
4-9. Printed Wiring Board – IF Section –.................................26
4-10. Printed Wiring Board – LED Section –............................. 27
4-11. Schematic Diagram – IF, LED Section – .......................... 28
5. EXPLODED VIEW
5-1. Main Section ..................................................................... 32
UNLEADED SOLDER
•
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
SAFETY-RELATED COMPONENT WARNING!!
6. ELECTRICAL PARTS LIST ........................................ 33
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY P ARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
2
LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SECTION 1
SERVICE NOTE
• Replacement of MBM29LV400BC-90PBT (IC5000),
HY62UF16201ALLF (IC5600), CXD9534CGG (IC7001) and
CXD1859GA (IC8000) on main board used in this set requires a
special tool. Therefore, they cannot be replaced.
• When performing operational checks with the main and IF boards
removed, install the service jig (relay board for main and IF board
connection) between main board (CN100) and IF board (CN501)
as shown in the figure below.
MGS-X1
( Relay board for main and IF board connection)
Service jig
IF board
MAIN board
LED board
3
MGS-X1
SECTION 2
GENERAL
This section extracted from
instruction manual.
4
MGS-X1
Connection
5
MGS-X1
6
SECTION 3
)
)
DISASSEMBLY
Note : This set can be disassemble according to the following sequence.
Set Case (Bottom) IF Board Main Board LED Board
Note : Follow the disassembly procedure in the numerical order given.
3-1. CASE (BOTTOM)
1
screws (1.7x5), tapping
2
5
4
screws (1.7x5), tapping
3
screw (1.7x5), tapping
6
case (bottom
MGS-X1
3-2. IF BOARD
4
IF board
wire
3
CN501
claws
2
screws (M1.4x3.5)
5
CN502
1
Removal the solders.
6
cord (with connector
7
MGS-X1
)
f
3-3. MAIN BOARD
2
MAIN board
1
screw (M1.4
3-4. LED BOARD
Note:
When mounting the sheet (LED-PWB),
take not of the direction of mounting
(different in thickness).
sheet (LED-PWB)
LED board
4
LED board
Thicker Side
case (upper) assy
3
screws (M1.4)
1
screw (M1.4)
2
spring, lea
8
SECTION 4
DIAGRAMS
4-1. IC PIN DESCRIPTIONS
• IC7001 CXD9534CGG (SYSTEM CONTROLLER)
Pin No. Pin Name I/O Pin Description
1 – 7 D6 – D0 I/O
8 VDDIO1 — Power supply pin (+2.8 V)
9 VSSIO1 — Ground pin
10 – 18 A18 – A10 O
19 VDDIO1 — Power supply pin (+2.8 V)
20 – 28 A9 – A1 O
29 A0 O Address signal output pin Not used (open)
30 VSSIO1 — Ground pin
31 VDDIO1 — Power supply pin (+2.8 V)
32 MCLK O Not used (open)
33 XRW O Not used (open)
34, 35 MAS1, MAS0 O Not used (open)
36 XOPC O Not used (open)
37 XMREQ O Not used (open)
38 VSSCORE — Ground pin
39 VDDCORE — Power supply pin (+1.8 V)
40 XWAIT O Not used (open)
41 XRSTOUT O Reset signal output pin “L” : reset Not used (open)
42, 43 BS1, BS0 O Not used (open)
44 XOE O
45 XWE O
46 XUB O Write enable signal output to the S-RAM (IC5600) (upper byte) “L” active
47 XLB O Write enable signal output to the S-RAM (IC5600) (lower byte) “L” active
48 XCS1 O Chip select signal output to the demultiplexer (IC5800)
49 XCS0 O Chip select signal output to the flash memory (IC5000)
50 PWM3 O Not used (connect to ground.)
51 PWM2 O Beep sound control signal output
52, 53 PWM1, PWM0 O Not used (connect to ground.)
54 VSSIO1 — Ground pin
55 – 59 GIOE7 – GIOE3 I Key input from the SONY bus interface (IC501)
60 RTC CS O Chip select signal output Not used (open)
61 SAM RST O Reset signal output to the CXD1859GA (IC8000)
62 HPBB1, 2 O Bass boost level control signal output
63 VDDIO1 — Power supply pin (+2.8 V)
64 ATCRO O System wake up signal output
65 VSSIO1 — Ground pin
66 WAKE4 I
67 WAKE3 I
68 WAKE2 I Interrupt request signal input from the CXD1859GA (IC8000)
69 WAKE1 I System hold off signal input from the SONY bus interface (IC501)
70 WAKE0 I System wake up signal input
71 RXD I Not used (open)
72 SDI1 I Serial data input
73 BIO I Not used (open)
Two-way data bus with the flash memory (IC5000), S-RAM (IC5600) and
CXD1859GA (IC8000)
Address signal output to the flash memory (IC5000), S-RAM (IC5600) and
CXD1859GA (IC8000)
Address signal output to the flash memory (IC5000), S-RAM (IC5600) and
CXD1859GA (IC8000)
Output enable signal output to the flash memory (IC5000), S-RAM (IC5600) and
CXD1859GA (IC8000) “L” active
Write enable signal output to the flash memory (IC5000), S-RAM (IC5600) and
CXD1859GA (IC8000) “L” active
System wake up signal from the reset signal generator (IC9007)
Input the signal, when inserts the rechargeable battery
System wake up signal from the CXD1859GA (IC8000) or voltage detector (IC9002)
Input the signal, when input the rechargeable power
MGS-X1
9
MGS-X1
Pin No. Pin Name I/O Pin Description
74 VDDIO1 — Power supply pin (+2.8 V)
75 VSSIO1 — Ground pin
76 XF O Not used (open)
77 TXD O Not used (open)
78 SDO1 O Serial data output Not used (open)
79 SCK1 O Serial data transfer clock signal output Not used (open)
80 VSSCORE — Ground pin
81 USB CHGON O Not used (open)
82 FR XRST O Not used (open)
83 DAC XPD O Power on/off control signal output to the D/A converter (IC505)
84 LCDON O
85 HP PWR O Power on/off control signal output to the headphone amplifier Not used (open)
86 HPBBON O Bass boost on/off control signal output to the headphone amplifier Not used
87 HPMUTE O Muting on/off control signal output to the SONY bus interface (IC501)
88 DAC DEMP O Emphasis control signal output to the D/A converter (IC505)
89 ORANGE O LED drive signal output for access indicator “H” : LED on Not used (open)
90 LED ON O LED drive signal output pin Not used (open)
91 EXTON O Not used (open)
92 EL ON O
93 CHGON O Not used (open)
94 USB XDACK O Not used (open)
95 USB XINT O Not used (open)
96 USB REG CE O Not used (open)
97 TSB I/O Not used (open)
98 VSSCORE — Ground pin
99 SPCK O Not used (open)
100 XIRQ O Not used (open)
101 SCK0 O
102 SDO0 O Serial data output for liquid crystal display drive to the SONY bus interface (IC501)
103 FS4 O Clock signal output to the power controller (IC9005)
104 WAKE O Power wake up request signal output to the power controller (IC9005)
105 VDDCORE — Power supply pin (+1.8 V)
106 SDI0 O Serial data output for liquid crystal display drive to the SONY bus interface (IC501)
107 SLEEPEN I Not used (open)
108 WAKEEN I Wake up enable signal input from the reset signal generator (IC9003)
109 XCRST I
110 OSCEN I OSC enable signal input from the reset signal generator (IC9003)
111 VDDCORE — Power supply pin (+1.8 V)
112 ROM RY/XBY O Ready/busy signal output to the flash memory (IC5000) “L” : busy, “H” : ready
113 USB XDET I Not used (fixed at “L”)
114 VBUS XON I Not used (fixed at “L”)
115 VBUS INT I USB connect detection signal input from the voltage detector (IC9002)
116 USB XDREQ I Not used (fixed at “L”)
117 USB XINT I Not used (fixed at “L”)
118 XHOLD I System hold signal input from the SONY bus interface (IC501)
119 XTEST I Input terminal for the test mode setting “L” : test mode, normally fixed at “H”
120 DSP CCLK I Not used (fixed at “H”)
121 USB TRON I Not used (fixed at “L”)
122 MS PWR O Power on/off control signal output to a memory stick
Power on/off control signal output for the liquid crystal display unit “H” : LCD on
Not used (open)
Power on/off control signal output for the back light of liquid crystal display unit
“H” : back light on Not used
Serial data transfer clock signal output for liquid crystal display drive to the SONY
bus interface (IC501)
System reset signal input from the reset signal generator (IC9007) “L” : reset
For several hundreds msec. after the power supply rises, “L” is input, then it changes to “H”
10
Pin No. Pin Name I/O Pin Description
123 HP BEEP O Beep sound control signal output to the headphone amplifier Not used
124 LCD XCS O Chip select signal output for liquid crystal display drive Not used
125 SAM INT I Interrupt request signal input from the CXD1859GA (IC8000)
126 SSAM2 USB XINT I Not used (fixed at “L”)
127 MS EJ I Not used (fixed at “L”)
128 VSSCORE — Ground pin
129 AVSS — Ground pin (for analog system)
130 AVCC — Power supply pin (+2.8 V) (for analog system)
131 – 133 AD12 – AD10 I Not used (fixed at “L”)
134 AD9 I USB power voltage monitor input pin (A/D input) Not used (fixed at “L”)
135 AD8 I Battery voltage monitor input pin (A/D input) Not used (fixed at “L”)
136 – 140 AD7 – AD3 I Not used (fixed at “L”)
141 AD2 I Key input pin (A/D input)
142 AD1 I Not used (fixed at “L”)
143 AOUT O Not used (open)
144 VDDAD — Power supply pin (+2.8 V) (for A/D converter)
145 VSSAD — Ground pin (for A/D converter)
146 VDDA — Power supply pin (+1.8 V)
147 LF — Low-pass filter connecting pin
148 VSSA — Ground pin
149 VDDCORE — Power supply pin (+1.8 V)
150 XTO O System clock output pin (22.5792 MHz)
151 XTI I System clock input pin (22.5792 MHz)
152 VSSCORE — Ground pin
153 VSSIO2 — Ground pin
154 CUDATAI I Not used (fixed at “L”)
155 CUCLKI I Not used (fixed at “L”)
156 S RA I Not used (fixed at “L”)
157 VDDIO2 — Power supply pin (+2.8 V)
158 CUDATAO O Not used (open)
159 CUCLKO O Not used (open)
160 S RB O Not used (open)
161 VSSIO2 — Ground pin
162 VDDIO2 — Power supply pin (+2.8 V)
163 – 170 FRIO0 – FRIO7 I/O Not used (open)
171 VDDIO2 — Power supply pin (+2.8 V)
172 VSSIO2 — Ground pin
173 – 180 FRIO8 – FRIO15 I/O Not used (open)
181 VDDIO2 — Power supply pin (+2.8 V)
182 VSSIO2 — Ground pin
183 – 187 FRCE0 – FRCE4 O Not used (pull up)
188 FRWE O Not used (pull up)
189 FRRE O Not used (pull up)
190 FRCLE O Not used (open)
191 FRALE O Not used (open)
192 FRWP O Not used (pull up)
193 VDDIO2 — Power supply pin (+2.8 V)
194 FRREADY I Not used (fixed at “L”)
195 VSSIO2 — Ground pin
196 VSSIO3 — Ground pin
197 FS256 O Clock signal (11.2896 MHz) output to the D/A converter (IC505)
198 PCMO O Digital audio signal output to the D/A converter (IC505)
199 XCSADA — Not used (open)
MGS-X1
11
MGS-X1
Pin No. Pin Name I/O Pin Description
200 CDTO O Not used (open)
201 CCLK — Not used (open)
202 DGSDO O Not used (open)
203 VDDIO3 — Power supply pin (+1.8 V)
204 BCK O Bit clock signal output to the D/A converter (IC505)
205 LRCK O L/R sampling clock signal output to the D/A converter (IC505)
206 VSSIO3 — Ground pin
207 DGSDI I Not used (fixed at “L”)
208 CDTI I Not used (fixed at “L”)
209 PCMI I Not used (fixed at “L”)
210 VDDIO3 — Power supply pin (+1.8 V)
211 BUSPLU I Not used (fixed at “L”)
212 – 217 TEST0 – TEST5 I For test pin Normally open
218 VSSCORE — Ground pin
219, 220 MD6, MD5 I Mode setting input pin Fixed at “H” in this set
221 MD4 I Mode setting input pin Fixed at “L” in this set
222 MD3 I Mode setting input pin Fixed at “H” in this set
223, 224 MD2, MD1 I Mode setting input pin Fixed at “L” in this set
225 MD0 I Mode setting input pin Fixed at “H” in this set
226 NMI I Not used (fixed at “L”)
227 VDDCORE — Power supply pin (+1.8 V)
228 TCLK I Not used (open)
229 TDI I Not used (open)
230 TMS I Not used (open)
231 XTRST I Not used (open)
232 TCLKD I Not used (open)
233 TDID I Not used (open)
234 TMSD I Not used (open)
235 XTRSTD I Not used (open)
236 VSSCORE — Ground pin
237 TDOD O Not used (open)
238 TDO O Not used (open)
239 VDDCORE — Power supply pin (+1.8 V)
240, 241 MSEL0D, MSEL1D I/O Not used (open)
242, 243 MSEL1, MSEL0 I/O Not used (open)
244 VSSIO1 — Ground pin
245 VDDIO1 — Power supply pin (+2.8 V)
246 – 253 D15 – D8 I/O
254 VSSIO1 — Ground pin
255 VDDIO1 — Power supply pin (+2.8 V)
256 D7 I/O
T wo-way data bus with the flash memory (IC5000), S-RAM (IC5600) and
CXD1859GA (IC8000)
T wo-way data bus with the flash memory (IC5000), S-RAM (IC5600) and
CXD1859GA (IC8000)
12
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