Sony MDXC-800-REC Service manual
MDX-C800REC
SERVICE MANUAL
SPECIFICATIONS
US Model
Canadian Model
Model Name Using Similar Mechanism NEW
Mini Disc Mechanism Type MG-715B-160
Optical Pick-up Name KMS-263A
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC DISTORTION
19 watts per channel minimum continuous average power into
4 ohms, 4 channels driven from 20 Hz to 20 kHz with no more
than 1% total harmonic distortion.
Other Specifications
MD recoder section
Signal-to-noise ratio 92 dB
Frequency response 10 – 20,000 Hz
Wow and flutter Below measurable limit
Laser Diode Properties
Material GaAlAs
Wavelength 790 nm
Emission Duration Continuous
Laser output power Less than 5 mW*
* This output is the value measured at a distance
of 200 mm from the objective lens surface on the
Optical Pick-up Block.
Tuner section
FM
Tuning range 87.5 – 107.9 MHz
Antenna terminal External antenna connector
Intermediate frequency 10.7 MHz/450 kHz
Usable sensitivity 8 dBf
Selectivity 75 dB at 400 kHz
Signal-to-noise ratio 66 dB (stereo),
Harmonic distortion at 1 kHz
Separation 35 dB at 1 kHz
Frequency response 30 – 15,000 Hz
AM
Tuning range 530 – 1,710 kHz
Antenna terminal External antenna connector
Intermediate frequency 10.7 MHz/450 kHz
Sensitivity 30 µV
Power amplifier section
Outputs Speaker outputs
Speaker impedance 4 – 8 ohms
Maximum power output 45 W × 4 (at 4 ohms)
72 dB (mono)
0.6% (stereo),
0.3% (mono)
(sure seal connectors)
General
Outputs Audio outputs
Power antenna relay
control lead
Power amplifier control
lead
Inputs Telephone ATT control
lead
Digital input connector
BUS audio input connector
BUS control input connector
Tone controls Bass ±9 dB at 100 Hz
Treble ±9 dB at 10 kHz
Power requirements 12 V DC car battery
(negative ground)
Dimensions Approx. 178 × 50 × 184 mm
(7 1/8 × 2 × 7 1/4 in.)
(w/h/d)
Mounting dimensions Approx. 182 × 53 × 163 mm
(7 1/4 × 2 1/8 × 6 1/2 in.)
(w/h/d)
Mass Approx. 1.5 kg (3 lb. 1 oz.)
Supplied accessories Parts for installation and
connections (1 set)
Front panel case (1)
U.S. and foreign patents licensed from Dolby
laboratories Licensing Corporation.
Design and specifications are subject to change without
notice.
FM/AM MINI DISC RECORDER
1
d
SERVICE NOTE
CAUTION
Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens.
HANDLING PRECAUTION FOR THE OVER WRITE HEAD
The over write head is susceptible to damage. When adjusting and
checking the over write head, it requires careful handling.
over write hea
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
(KMS-263A)
The laser diode in the optical pick-up block may suffer electrostatic
break-down easily. When handling it, perform soldering bridge to
the laser-tap on the flexible board. Also perform measures against
electrostatic break-down sufficiently bef ore the operation. The flexible board is easily damaged and should be handled with care.
pick-up
laser-tap
flexible board
variable resistor
Never turn this
variable resistor.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
P ART NUMBERS APPEAR AS SHOWN IN THIS MANU AL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
2
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT .
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
TABLE OF CONTENTS
1. GENERAL
Location of controls................................................................. 4
Getting Started......................................................................... 4
Setting the clock ...................................................................... 4
MD player CD/MD unit .......................................................... 5
Recording on an MD ............................................................... 6
Editing an MD ......................................................................... 8
Radio ....................................................................................... 9
Other Functions ..................................................................... 10
TV/Video ............................................................................... 11
Connections ........................................................................... 13
2. DISASSEMBLY
2-1. Sub Panel Assy .................................................................. 16
2-2. MD Mechanism Block ...................................................... 16
2-3. Main Board, Digital Board................................................ 17
2-4. Heat Sink (REC) ............................................................... 17
2-5. MD Mechanism................................................................. 18
2-6. Computer Board ................................................................ 18
2-7. Servo Board....................................................................... 19
2-8. Tension Spring (B) ............................................................ 19
2-9. Chassis (L), (R) Assy ........................................................ 20
2-10. Loading Motor Assy.......................................................... 20
2-11. Sled Motor Assy................................................................ 21
2-12. Sensor Board ..................................................................... 21
2-13. Spindle Motor Assy........................................................... 22
2-14. Over Write Head ............................................................... 22
2-15. Optical Pick-up ................................................................. 23
4. EXPLODED VIEWS
4-1. Sub Panel Section.............................................................. 57
4-2. Front Panel Section ........................................................... 58
4-3. Chassis Section ................................................................. 59
4-4. MD Mechanism Section (1) .............................................. 60
4-5. MD Mechanism Section (2) .............................................. 61
4-6. MD Mechanism Section (3) .............................................. 62
5. ELECTRICAL PARTS LIST ........................................ 63
3. DIAGRAMS
3-1. IC Pin Descriptions ........................................................... 24
3-2. Block Diagram –MD Section–.......................................... 30
3-3. Block Diagram –Tuner Section–....................................... 31
3-4. Block Diagram –Display Section–.................................... 32
3-5. Circuit Boards Location .................................................... 33
3-6. Printed Wiring Board –Servo Section– ............................. 34
3-7. Schematic Diagram –Servo Section (1/3)– ....................... 36
3-8. Schematic Diagram –Servo Section (2/3)– ....................... 37
3-9. Schematic Diagram –Servo Section (3/3)– ....................... 38
3-10. Printed Wiring Board –Sensor Section– ........................... 39
3-11. Schematic Diagram –Sensor Section– .............................. 39
3-12. Printed Wiring Board –Computer Section– ...................... 40
3-13. Schematic Diagram –Computer Section– ......................... 41
3-14. Printed Wiring Boards –Main Section– ............................ 42
3-15. Schematic Diagram –Main Section (1/4)– ........................ 44
3-16. Schematic Diagram –Main Section (2/4)– ........................ 45
3-17. Schematic Diagram –Main Section (3/4)– ........................ 46
3-18. Schematic Diagram –Main Section (4/4)– ........................ 47
3-19. Printed Wiring Board –Relay Section– ............................. 48
3-20. Schematic Diagram –Relay Section–................................ 49
3-21. Printed Wiring Board –Key Section–................................ 50
3-22. Schematic Diagram –Key Section–................................... 51
3
SECTION 1
GENERAL
This section is extracted
from instruction manual.
4
56789101112131415
SECTION 2
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
2-1. SUB PANEL ASSY
4 two claws
5 CN700
2 PTT 2.6x6
2-2. MD MECHANISM BLOCK
0 MD mechanism block
7 PTT 2.6x6
6 sub panel assy
5 ground point screw
(PTT 2.6x6)
3 claw
1 PTT 2.6x6
6 CONNECTION board
8 P 2x5
16
2 PTT 2.6x6
4 CN823
9 bracket (R) (MD)
1 PTT 2.6x6
3 CN100
2-3. MAIN BOARD, DIGITAL BOARD
0
0
5 MAIN board
4 ground point screws
(PTT 2.6x6)
3 ground point screw
(PTT 2.6x6)
8 DIGITAL board
6 CN821
2 PTT 2.6x10
7 PTT 2.6x1
1 PTT 2.6x10
2-4. HEAT SINK (REC)
6 heat sink (REC)
5 PTT 2.6x1
4 PTT 2.6x10
3 PTT 2.6x10
2 PTT 2.6x10
1 PTT 2.6x10
17
2-5. MD MECHANISM
4
2 P 2x3
1 P 2x3
7 bracket (F) (MD)
2-6. COMPUTER BOARD
9 CN561
8 CN400
6 P 2x3
4 P 2x3
3 shield case (U)
0 MD mechanism
5 shield case (77)
18
3 CN401
4 COMPUTER board
2 PS 2x
1 PS 2x4
)
2-7. SERVO BOARD
d
1 PS 2x4
2 PS 2x4
6 SERVO boar
5 CN440
2-8. TENSION SPRING (B)
3 CN510
4 CN520
2 tension spring (B)
1 tension spring (B
19
y
2-9. CHASSIS (L), (R) ASSY
y
0 damper (T)
9 tension spring (F)
qa chassis (L) assy
8 chassis (R) ass
7 damper (T)
6 tension spring (F)
1 P 2x3
2-10. LOADING MOTOR ASSY
5 lever (OPS)
3 P 2x3
5 P 2x3
4 P 2x3
2 P 2x3
1 OWH flexible board
3 P 2x3
4 loading motor ass
20
2 CN552
f
2-11. SLED MOTOR ASSY
d
5 PS 2x4
6 CN551
2 wire
1 OWH flexible board
7 sled motor assy
3 P 1.7x2
4 spring (SL), lea
2-12. SENSOR BOARD
5 PS 2x4
claw
1 Removal the solders
6
4 PS 2x4
3 CN551
2 CN552
7 SENSOR boar
21
y
2-13. SPINDLE MOTOR ASSY
2-14. OVER WRITE HEAD
2 P 1.7x2
1 P 1.7x2
3 spindle motor ass
1 P 1.7x6
2 over write head (RF325-74A)
22
d
2-15. OPTICAL PICK-UP
6 main shaft
5 optical pick-up
4 K 2x3
2 OWH flexible board
3 K 2x3
1 OWH flexible boar
23
Loading...