Sony ICD-SX68,ICD-SX78DR9,ICD-SX88,ICD-SX68DR9,ICD-SX78 Service Manual

SERVICE MANUAL

Published by Sony Techno Create Corporation

Sony Corporation

Audio Business Group

ICD-SX68/SX68DR9/SX78/

SX78DR9/SX88

SPECIFICATIONS

IC RECORDER

9-887-998-01

2008B04-1

©

2008.02

US Model

Canadian Model

ICD-SX68/SX68DR9

AEP Model

E Model

ICD-SX68/SX78/SX78DR9

Korea Model

ICD-SX68/SX78/SX88

Ver. 1.0 2008.02

Photo : ICD-SX68

Capacity (User available capacity)

ICD-SX68/SX68DR9: 512MB
(approx. 483MB=507,346,944Byte)
ICD-SX78/SX78DR9: 1GB
(approx. 975MB=1,022,590,976Byte)
ICD-SX88: 2GB
(approx. 1.93GB=2,081,521,664Byte)
A part of the memory capacity is used as a
management area.

Recording time

Frequency range

STHQ : 80 Hz - 20,000 Hz
ST : 80 Hz - 16,500 Hz
STLP : 80 Hz - 7,000 Hz
SP : 80 Hz - 6,000 Hz
LP : 80 Hz - 3,500 Hz

•

•

•

•

•

Bit rates and sampling frequencies for

Bit rate: 32 - 320 kbps, VBR
Sampling frequencies: 16/22.05/24/32/44.1/
48 kHz
Not all encoders are supported.

Speaker

Approx. 16 mm (21/32 in.) dia.

Power output

150 mW

Input/Output

Microphone jack (minijack, stereo)

input for plug in power, minimum input
level 0.6 mV, 3 kilohms or lower impedance
microphone

Headphone jack (minijack, stereo)

output for 8 - 300 ohms headphones

USB connector

Playback speed control

+200% to –75% (DPC)

Power requirements

Two NH-AAA rechargeable batteries: 2.4 V DC
Two LR03 (size AAA) alkaline batteries: 3.0 V DC

Operating temperature

5˚C - 35˚C (41˚F - 95˚F)

•

–

•

–

•

Maximum recording time

The maximum recording time of all the
folders is as follows.

ICD-SX68/SX68DR9

STHQ mode ST mode STLP mode

8 hr. 35 min. 22 hr. 50 min. 44 hr. 00 min.

SP mode LP mode

69 hr. 40 min. 185 hr. 55 min.

ICD-SX78/SX78DR9

STHQ mode ST mode STLP mode

17 hr. 25 min. 46 hr. 5 min. 88 hr. 45 min.

SP mode LP mode

140 hr. 35 min. 374 hr. 55 min.

ICD-SX88

STHQ mode ST mode STLP mode

35 hr. 30 min. 93 hr. 55 min. 180 hr. 45 min.

SP mode LP mode

286 hr. 10 min. 763 hr. 15 min.

(hr : hours/min. : minutes)

Dimensions (w/h/d) (not incl.
projecting parts and controls)(JEITA)*

30.8 × 119.3 × 14.9 mm (1 1/4 × 4 3/4 × 19/32
in.)

Mass (JEITA)*

74 g (2.7 oz) including two NH-AAA
rechargeable batteries

* Measured value by the standard of JEITA

(Japan Electronics and Information
Technology Industries Association)

Supplied accessories

change without notice.

Rechargeable batteries (2)
Stereo headphones (1) (Except AEP)
USB connecting cable (1)
Application Software, Digital Voice
Editor (CD-ROM) (1)
Application Software, Dragon Naturally
Speaking (CD-ROM)
(2) (SX68DR9: US/SX78DR9: E)
(3) (SX68DR9: Canadian)
(4) (SX78DR9: AEP)
Cradle (1) (SX68DE9/SX78DR9)
Stand (1) (AEP, E, Korea)
Carrying pouch (1)

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88

2

1. GENERAL .................................................................. 3

2. DISASSEMBLY

2-1. Knob (HOLD), Speaker Assy (SP001) ........................... 6

2-2. Chassis Assy, Case Assy ................................................. 6

2-3. Battery Case Lid ............................................................. 7

2-4. Cover (Chassis), MAIN Board ....................................... 7

2-5. Chassis ............................................................................ 8

2-6. SW Board, HPJACK Board ............................................ 8

2-7. MIC-A Assy , MIC-B Assy .............................................. 9

2-8. Liquid Crystal Display Panel, AUDIO Board ................ 9

3. TEST MODE ............................................................ 10

4. DIAGRAMS

4-1. Block Diagram - MAIN1 Section - ................................ 13

4-2. Block Diagram - MAIN2 Section - ................................ 14

4-3. Printed Wiring Board - AUDIO Board (Side A) - ......... 15

4-4. Printed Wiring Board - AUDIO Board (Side B) - ......... 16

4-5. Schematic Diagram - AUDIO Board (1/2) - .................. 17

4-6. Schematic Diagram - AUDIO Board (2/2) - .................. 18

4-7. Printed Wiring Board - MAIN Board (Side A) - ........... 19

4-8. Printed Wiring Board - MAIN Board (Side B) - ........... 20

4-9. Schematic Diagram - MAIN Board (1/5) - .................... 21

4-10. Schematic Diagram - MAIN Board (2/5) - .................... 22

4-11. Schematic Diagram - MAIN Board (3/5) - .................... 23

4-12. Schematic Diagram - MAIN Board (4/5) - .................... 24

4-13. Schematic Diagram - MAIN Board (5/5) - .................... 25

4-14. Printed Wiring Boards - HPJACK Board, SW Board - . 26

4-15. Schematic Diagram - HPJACK Board, SW Board - ...... 27

5. EXPLODED VIEWS

5-1. Overall Assy .................................................................... 38

5-2. Chassis Section ............................................................... 39

6. ELECTRICAL PARTS LIST .............................. 40

TABLE OF CONTENTS

UNLEADED SOLDER

Boards requiring use of unleaded solder are printed with the lead­free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be

applied to the solder joint for a slightly longer time.

Soldering irons using a temperature regulator should be set to

about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the

heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscou-s (sticky, less prone to fl ow)

than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may

also be added to ordinary solder.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam­aged by heat.

Flexible Circuit Board Repairing

• Keep the temperature of soldering iron around 270 °C during
repairing.

• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering
or unsoldering.

CAUTION

Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88

3

SECTION 1

GENERAL

9

GB

* Connect stereo ear receiver or stereo

headphones supplied or not supplied to the

i (headphone) jack. If unwanted noise is

heard, wipe the headphones plug clean.

Rear

P Speaker
Q HOLD switch

**

R V-UP (Digital Voice Up) switch (37, 57)
S DPC switch (38, 51)
T DIRECTNL (directional) switch (24)
U

m (microphone) jack (31, 32)

V (USB) connector (13, 64)
W Battery compartment (13)

** Slide the HOLD switch in the direction of

the arrow to lock all the functions of all the
buttons. During stop, “POWER SAVING…”
will be displayed and the display will be
turned o to prevent battery power from
exhausting.

Index to Parts and
Controls

Refer to the pages indicated in
parentheses for details.

Front

1 i (headphone) jack* (21, 23, 34, 35,

84)

2 Built-in microphones (stereo/

directional) (21, 25, 26)

3 Operation indicator (21, 25, 27, 29, 53)

4 Display window (10, 11)
5 DIVIDE/

(bookmark) button (31, 34,

39)

6

(folder)/MENU button

7 z (record/pause) button (21, 25, 26,

27, 30)

8

x (stop) button (18, 22, 26, 28, 30, 34,

41, 43, 46, 47)

9

> (cue/fast forward) button (35)

J Nx (play/stop/enter) button
K . (review/fast backward) button

(35)

L VOL (volume) +/– button (23, 34)
M (repeat) A-B/

(priority) button

(34, 38, 46)

N ERASE button (43)
O Opning for a handstrap (A handstrap

is not supplied.)

This section is extracted
from instruction manual.

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88

4

5 Remaining battery/Charging

indicator
When dry batteries are used, the

indicator shows the remaining
battery power.
While charging the rechargeable
batteries an animation appears.

6 Selected message number/Total

number of messages in the folder

7 Priority marks

Appear(s) when a message is set with
priority mark(s).

8 Bookmark indicator

Appears when a bookmark is set for
a message.

9 Alarm indicator

Appears when the alarm is set for a
message.

J

Displays the EFFECT setting in the
menu.
BA1 : The bass sound is reinforced.
BA2 : The bass sound is further
reinforced.

Display window

Display during playback and stop

1Operation mode indicator

Displays the following, depending on
the current operation mode

: playback
: stop

: review/fast backward,

cue/fast forward

: going backward/forward

continuously

2 Folder indicator
3 Elasped time/Remaining time

indication/Recording date and time
indication

4 Folder name/Message name/Artist

name indication

K Recording mode indicator

Displays the recording mode set
using the menu when the IC recorder
is in the stop mode, and displays the
current recording mode when the IC
recorder is in the playback mode.

STHQ : Standard play stereo
recording mode with high quality
sound
ST : Standard play stereo recording
mode
STLP : Long play stereo recording
mode
SP : Standard play monaural
recording mode
LP : Long play monaural recording
mode
MP3 : MP3 mode (during playback
only)

L Microphone sensitivity indicator

Displays the current microphone
sensitivity.

(high) : To record at a meeting or

in a quiet/spacious place.

(low) : To record for dictation or in
a noisy place.
MAN (manual) : To record with
microphone sensitivity set manually.

M Remaining recording time indication

Display during recording

N Operation mode indicator

Displays the following, depending
on the current operation of the IC
recorder.

: recording
: recording standby/recording

pause

: recording with the VOR

function

: recording pause with the

VOR function

O Recording level meter

P Microphone sensitivity indicator

Displays the current microphone
sensitivity when recording with AGC
(Automatic Gain Control).

(high) : To record at a meeting or

in a quiet/spacious place.

(low) : To record for dictation or in
a noisy place.
Displays the recording level during
manual recording.

Q Elapsed recording time indication
R Alarm indicator
S Recording mode indicator

Displays the recording mode (STHQ,
ST, STLP, SP, and LP) set in the menu.

T LIM (limiter) indicator

Displays the LIMITER setting in the
menu.
When “REC LEVEL” is set to “AUTO­AGC,” “---” is displayed.

U Remaining recording time indication
V Remaining battery/Charging

indicator

W LCF (Low Cut Filter) indicator

Displays the LCF setting in the menu.

1 Select “DATE & TIME” in the menu.

1

Press and hold /MENU.
The menu mode will be displayed in
the display window.

2

Press . or > to select “DETAIL
MENU” and press

Nx.

3

Press . or > to select “DATE &
TIME” and press

Nx.

2 Press . or > to select “AUTO”

or “MANUAL” and press

Nx.

When you selected “AUTO,” the clock is
automatically adjusted using the clock
in the computer connected to the IC
recorder and on which the supplied
Digital Voice Editor software is started.

When you select “MANUAL,” proceed
to the next steps.

Step 2: Setting the
Clock

x

.

/>

Nx

/MENU

You need to set the clock to use the
alarm function or record the date and
time.
Clock setting display appears when you

you insert batteries after the IC recorder
has been without batteries for a certain
period of time. In this case, proceed from
step 4.

3 Press . or > to select

“08y1m1d” and press

Nx.

4 Press . or >to set the year,

month, day, hour, and minute in
sequence, and then press

Nx.

“EXECUTING….” appears and the clock
is set.

5 Press x to return to the normal

display.

Note

If you do not press Nx within one minute
of entering the clock setting data, the clock
setting mode is cancelled and the window
will return to the normal display.

P

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88

5

SECTION 2

DISASSEMBLY

• This set can be disassembled in the order shown below.

2-2.CHASSIS ASSY ,

CASE ASSY

(Page 6)

2-3.BATTERY CASE LID

(Page 7)

2-4.COVER (CHASSIS),

MAIN BOARD

(Page 7)

2-5.CHASSIS

(Page 8)

2-6.SW BOARD,

HPJACK BOARD

(Page 8)

2-7.MIC-A ASSY,

MIC-B ASSY

(Page 9)

2-8.LIQUID CRYSTAL

DISPLAY PANEL,

AUDIO BOARD (Page 9)

2-1.KNOB (HOLD),

SPEAKER ASSY (SP001)

(Page 6)

SET

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88

6

Note: Follow the disassembly procedure in the numerical order shown below.

2-1. KNOB (HOLD), SPEAKER ASSY (SP001)

2-2. CHASSIS ASSY, CASE ASSY

RE two screws (1.7 × 4.5)

RH speaker assy (SP001)

RB two claws

 two

claws

 claw

 claw

RG claw

 claw

 claw

 knob (hold)

 knob (hold)

RT base

R cover (jack)

 knob (hold)

 knob (hold)

 screw (1.4 × 2.5)

L side
faces

case assy

chassis assy

left side

 bracket (chassis)

 spacer (ornamental belt)

 chassis assy

 battery case lid assy

 screw (1.7 × 3.5)

When assembling the chassis assy,
adjust the switches in the direction
of the arrow.

When assembling the chassis assy to the case assy,
orient the case assy so that its L side
faces down, and insert the chassis
assy with its left side up.

switches

switch

 case assy

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88

7

2-3. BATTERY CASE LID

2-4. COVER (CHASSIS), MAIN BOARD

 battery case lid,

base (battery), e.t.c.

 chassis (battery case lid)

 screw (1.7 × 3)

 battery terminal

(+–) assy

 base (battery)

 hinge

(battery case lid)

 battery case lid

 four claws

 five claws

 Remove the SW board

in the direction of the arrow.

 cover (chassis)

 Remove the

solderings.

 battery terminal (+)

 battery terminal (–)

 MAIN board

Assembling the chassis assy

After the chassis assy has been assembled,
check that the wires of the microphone are properly
routed (without being pressed down).

 board to board
connector

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88

8

2-5. CHASSIS

2-6. SW BOARD, HPJACK BOARD

sheet (microphone jack)

screws

screw holes

harnesses

 chassis

 two claws

 two claws

 two claws and dowel.

Sheet (microphone jack) attachment
position is shown.

 sheet
(microphone jack)

 two cushions

 two screws (B1.4 × 4)

Route the harness as shown below.

When installing the HPJACK board,
push the board to the very end,
and then fix it with screws.

HPJACK board

 Remove
the solderings.

 wire (frat type)
(CN7002)

 HPJACK board

 SW board

 sheet (LED)

orange

black

blue
gray

Solder each lead according to the color
(black, orange, blue, gray) as shown in
the figure.

Sheet (LED) attachment position is shown.

sheet (LED)

sheet (LED)

LED

LED

SW board

SW board

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88

9

2-7. MIC-A ASSY, MIC-B ASSY

2-8. LIQUID CRYSTAL DISPLAY PANEL, AUDIO BOARD

 Remove the soldering.

 wire (frat type)

(CN5002)

R AUDIO board

 battery terminal

(detection)

 light guide plate

 sheet (light guide plate S)

 sheet

(light guide plate L)

 liquid crystal
display panel
(LCD101)

 holder (LCD)

 two claws

claw

Sheet (light guide plate L) attachment
position is shown.

When installing the liquid crystal display
panel to the holder (LCD), insert the liquid
crystal display panel to the holder (LCD)
from the side with claws.

Sheet
(light guide plate L)

AUDIO board

1mm

claw

liquid crystal
display panel

holder (LCD)

 Remove the
solderings.

 mic-A assy
(M101)

 mic-A assy
(M102)

 mic-B assy
(M103)

red

red

black

black yellow

black

Solder each lead according to the color
(black, red, yellow) as shown in the figure.

mic-A assy
(M101)

mic-A assy
(M102)

mic-B assy
(M103)

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88

10

[Test Mode]

The following checks can be implemented using the Test Mode.

How to Enter the Test Mode

• Turn the power on. (by inserting batteries)

• Turn ON the [V-UP] switch while pressing the [DIVIDE/ ]
button and [VOL –] button at the same time.

How to Exit the Test Mode

Exit the test mode by turning OFF the power. (by removing the
batteries)

Initial Status of the Test Mode

When the machine enters the test mode, the LCD display appears
as shown below.

Select the desired item by using the [>]/[.] button, and
press the [Nx] button to set the selection.

1. Version test

• Version of the respective modules are verifi ed.

• Press the [x] button to return to the test mode screen.

2. Key Chk + Format test

• Perform the key check by pressing the keys. The NAND for­matting (deleting all events) and the default settings of the
menus (default language and LCD contrast remain unchanged)
are executed at the same time.

* [

Nx

]/[>]/[.]/[ /MENU]/[z]/[x]/[VOL +]/

[VOL –] /[ERASE]/[DIVIDE/

]/[ A-B/ ]/
[DPC (ON/OFF)]/[V-UP (ON/OFF)]/
[DIRECTNT (ON/OFF)]/[. HOLD]

• Press the [x] button to return to the test mode screen.

SECTION 3

TEST MODE

+

Loop





































































Version

KeyChk+Fmt

Loop

ExtMic Cal

SetMic Cal

Beep

Lcd Cont

RTC Int









Battery

BattAC2

BattAB4

BattCnt

Menu Init

Key Check

Log Output

App LogOut

Convert

VBUS

Sleep

START

Initial status of test mode

F/W version display

TEST MODE

END

TEST MODE

Turn off the power
(Remove the batteries)

ARM X.XX .XX / DSP X.X.XX

ICX-XXX

F/W version of
CPU(DSP block)

Boot:X

Oct XX 200X XX:XX:XX

F/W version of
CPU(ARM block)

F/W version of
Boot loader

liant

The checked key is display.
When all checks are

completed, the back-Light
turns on for 0.5 seconds

The NAND formatting
(deleting all events)
and the befault settings
of the menus are completed.

Total of 15 keys* are counted.

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88

11

3. Loop test

Execute the DSP LOOP BACK.

• Press the [ /MENU] button to return to the test mode

screen.

4. ExtMic Cal

• The external microphone R and L channels level difference is

calibrated.

• Press the [Nx] button to start calibration.
• Press the [x] button to return to the test mode screen.

5. SetMic Cal

• The internal microphone R and L channels level difference is

calibrated.

• Press the [Nx] button to start calibration.
• Press the [x] button to return to the test mode screen.

6. Beep test

• Beep sound of 1.3 kHz is output.
• Press the [Nx] button to start outputting and press the [x]

button to stop.

• Press the [

/MENU] button to return to the test mode

screen.

7. LCD Cont test

• Adjust the LCD contrast.
Default value is 10.

• Adjust the LCD contrast using the [>]/[.] button.
• Press the [

/MENU] button to return to the test mode

screen.

8. RTC Interrupt test

• Perform the self test of the RTC.
• Press the [x] button to return to the test mode screen.

9. Battery test

• The detected A/D value of the battery remaining power is
checked.

• Press the [x] or [ /MENU] button to return to the test mode
screen.

10. Batt Cnt test

• The present A/D value of the center of the battery remaining is

checked.

• When the battery is not connected, NG is display.
• Press the [x] or [ /MENU] button to return to the test mode

screen.

11. Batt AC2 test

• The present A/D value of the side of VBatAC x2 on the error

amplifi ed circuit (IC1603 output) is checked.

• Press the [x] or [ /MENU] button to return to the test mode

screen.

12. Batt AB4 test

• The present A/D value of the side of VBatAB x4 on the error

amplifi ed circuit (IC1603 output) is checked.

• Press the [

x

] or [ /MENU] button to return to the test mode

screen.

* : 11, 12 items, refer to following fi g.

13. VBUS test

• The present value of the VBUS is checked.
If it is connected, OK is display.
• Press the [

x

] or [ /MENU] button to return to the test mode

screen.

14. Sleep test

• Sleep is tested.

Note: When <Sleep> is selected, the machine enter the sleep mode. To

exit the sleep mode, turn off the power, by removing the batteries
and reenter the test mode.

15. Menu lnit

• Press the [Nx] button to enter the menu initialization.
• Press the [

x

] button to return the test mode screen.

16. Key Chk test

• Key check only is executed when the key is pressed.
• Press the [

x

] button to return to the test mode screen.

17. Log Output test

• This is the log output to be used for engineering design.

Note: Not used.

• Press the [x] button to return to the test mode screen.

18. App Log Out test

• This is the app log out to be used for engineering design.
• Press the [x] button to return the test mode screen.

19. Convert test

• This is the conversion out to be used for engineering design.
• Press the [ /MENU] button to exit the test mode.

Test

Key SWITCH

Description

1

Sound vol­ume test

[VOL +],
[VOL –]

The sound volume can be adjusted
(Default value is 20.)

2

Recording
level test

[.], [>]

Press the [.HOLD] switch to ON
for MANUAL mode.
The recording level can be adjusted
(Default value is 30.)

Muting test

[DIVIDE /

]

Muting test can be set to “ON” or
“OFF”.

6

Directivity [DIRECTNL]

“ON” or “OFF” of the switch can be
set the directivity of the microphone.

3

Setting of
recording
AUTO/
MANUAL

[.HOLD]

OFF: AUTO
ON: MANUAL

4

Sensitivity
/ Limitter

[V-UP]

AUTO ([.HOLD] SW:ON):

(OFF: Sensitivity H, ON: Sensitiv­ity L)

MANUAL ([.HOLD] SW:ON):

(OFF: Limitter OFF, ON: Limitter
ON)

5

Selection
of the
external
micro­phone

[DPC]

Press the [.HOLD] switch to ON
for MANUAL mode.
OFF: MIC IN, ON: AUDIO IN







70k

110k

ADIN1

(VCCVBAT)

ErrorAmp

ADIN7

(VBAT_ERR)

ADIN8

(VBAT_CNT)

B

C

A

VBatAB

VBatBC

VBatAC

IC1001

IC1603

Q1664

Q1663

x2SIDE

x4SIDE

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88

12

For Schematic Diagrams.

Note:

• All capacitors are in μF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics

and tantalums.

• All resistors are in Ω and

1

/4 W or less unless otherwise

specifi ed.

• f : internal component.

• C : panel designation.

• A : B+ Line.

• Power voltage is dc 1.5V and fed with regulated dc power
supply from battery terminal.

• Voltages are dc with respect to ground under no-signal
(detuned) conditions.
no mark : REC

( ) : PLAY
* : Impossible to measure

• Voltages are taken with a VOM (Input impedance 10
MΩ).

Voltage variations may be noted due to normal production

tolerances.

• Signal path.

F : PB
L : REC

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)

For Printed Wiring Boards.

Note:

• X : Parts extracted from the component side.

• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)

Caution:

Parts face side:
(SIDE A)
Pattern face side:
(SIDE B)

Parts on the parts face side seen from
the pattern face are indicated.
Parts on the pattern face side seen from
the parts face are indicated.

• Lead layouts

SECTION 4

DIAGRAMS

surface

CSP (Chip Size Package) Lead layout of conventional IC

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88

1313

4-1. BLOCK DIAGRAM - MAIN1 SECTION -

Signal path

: REC

: PB

27

9

CS

SDA

IC3404

REG

IC1001(1/2)

SYSTEM CONTROLLER

OUTP

OUTN

Q3304
MUTE

Q5001

LED DRIVE

D5005,5004,5002

Q3402

SWITCH

J3301

(SPEAKER)

13

14

11

2
3

IC3654

VOLUME CONTROL

WA

WB

SCLK
DIN

4

CS

LA

10

LB

3

7

10

5

8

IC3203

SELECTOR

IN2

COM1

COM2

2

NO1

D3607

D3606

IN1

9

4

NC1

NO2

NC2

3

7

8

5

10

IC3655

SELECTOR

IN2

VDD_HP

COM1

COM2

4

NO1

IN1

9

2

NC1

NO2

NC2

SCK

IC3901

ADC, DAC, HEADPHONEAMP

AIN1L

30

31

MD/ADA

AS/ADR

MC/SCR

LRCK

PCM0_LRCK

BCK

PCM0_BCK

DIN

DOUT

SCKI

HPCOM/MONO

HPOL/LOR

HPOR/LOR

17

16

V10

KS-1IPS

W8

OS-1IPS

W10

OZSC-1IPS

OMWP

AC22

AD22

AB22

AC21

KLC-OMP

NES-OMP

IS-OMP

OS-OMP

U18

OKLCFER

2ZSC-OIPS

SPI1_CLK
SPI1_MOSI
AGC_XCS

KLC_1IPS

ISOM_1IPS

SCX_CGA

IDT-D

KCT-D

V17

SMT_D

NWDP

NETUM

U19

AC6

AB2

W22

AA2

0ZSC-0IPS

KS-OIPS

OS-OIPS

Y3

80IPG

AA1

AC7

AC8

AC23

AD7

110IPG

010IPG

210IPG

SP001

+

-

FUNCTION

SWITCH

R

(MIC CENTER)

IC3403

POWERAMP

IC3904

MICAMP

IN+

OUT

V+

1

5
4

J3201

PLUG IN

POWER

S6014

S6015

HOLD

23

AIN3R
AIN3L

22

29
32

22W-0A-DLCB

91U-TSRX-DLCB

6CA-SC-DLCB

2BA-TEDX-JPH

1AA-ETUM-PS

2AA-RWP-PS

3Y-ETUM-PH

7CA-KLC-OIPS

8CA-ISOM-OIPS

PWM
ADA_XCS

1
2

PCM0_DADT

3

PCM0_ADDT

7

CPU_RFFCLK0

KCRL_0MCP

KCB_0MCP

MWP

SCX_ADA

TDAD_0MCP

TDDA_0MCP

0KLCFFR_UPC

4

5

15
2

IN

VDD2

UNREG35-DET

MAIN2
SECTION
(Page 14)

VDD1

VOUT

VIN

+3.3V

CE

L

1

5

6

IC3202

AMP

A OUTPU T

B OUTPUT

3

A+INPUT

A-INPUT

B+INPUT

B-INPUT

7

2

3

7

10

5

8

IC3024

SELECTOR

COM1

COM2

2

NO1

IN1

IN2

9

4

NC1

NO2

NC2

VDD_GP2

VDD_GP2

Q3660

SWITCH

Q3657

SWITCH

Q3659

SWITCH

TEDX_CIMTXE

1LES_CIM

2LES_CIM

RWPX_CIM

LES_ENILX_CIM

1DA_YEK

0DA_YEK

EKAW-YEK

B6

4NIDA

AD4

10IPG

AD3

20IPG

C6

3NIDA

IS_1MP

OS_1MP

Q6001

SWITCH

AD5

AA3

AD20

AC20

NES_1MP

AB20

KLC_1MP

AB21

0OIPG

9OIPG

CD

RES

LIQUID

CRYSTAL

DISPLAY

26

AIN1R

12

10

14

16

1

3

OFF

ON

V-UP

OFF

ON

S6016

AD2

30IPG

DPC

OFF

ON

S6013

AC5

40IPG

T26

OKC

U26

IKC

DIRECTNL

OFF

ON

X1401

11.2896MHz

AC26

NICSO

AB26

TUOCSO

X1601

32.768KHz

W3

510IPG

GRNK

D5004

REDK

W2

410IPG

A

S6001,S6002,S6004

S6005-6008
S6010,S6012,
S6509,S6511

(MIC)

(MIC)

M101

M102

M103

LCD101

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88

1414

4-2. BLOCK DIAGRAM - MAIN2 SECTION -

Signal path

: REC

: PB

H4-8

G5-8

E5-7
F5-8

H22-25,F25
C25,G23-25
E25,J22-24
F24,D24,25

H2,3
G3,4

F4,E4

H18,19
D18,20

C20,E18

AB0_A25/DPQ

AB0_F24/DAK

A2,A8,B1
B2,B8,B9
C1,C2,C8
C9,D1,D2
D8,D9,E1

E9

H9-7,
H3-1,

G3,G2,

J8,7,
J3,2

U2-5,
V8,4,5
W4,5,

Y4,5,
AA4

R1,R8,N1,
N2,N3,N4,
N5N8,M4,
M5,M8,P1,
P2,P3P4,

P8,

GPI07

Q8501

SWITCH

J5

SDR_DATA30

G4

EXTRST

DQ0-7
DQ8-12
DQ13-15

F1R4

DQM1

E8

LDQM

SDR_DQM1

SDR_DQM0

SDR_DATA0-15

SDR_A0-11

P5

IC2602

SRAM

IC1001(2/2)

SYSTEM CONTOLLER

A4

NAND_WEZ

IC2701
FLASH

MEMORY

I/01-I/08

NAND_DA0-DA7

E1

E2

XIN

C2

VBUS

B1

DM

C1

1

1

4

4

DP

XOUT

X8501
24MHz

C4

A6

A0-A11

DREQO_N

D4

DACK0-N

A5

CS_N

C5

WR0_N

RST_N

SDR_DATA31

C6

4

3

1

4

2

1

4

4

INT_N

B5

WR1_N

RD_N

AB0_A1 -A6

AB0_D00 - D15

AB0_A1-A6

AB0_D0 - D15

1
2

5

VBUS

D-

GND

ID

3D+
4

IC8503

USB CONTROLLER

CN8002

(USB)

VBUS

F8

SDR_WEZ
SDR_RASZ
SDR_CASZ
SDR_CKE0

SDR_CLK

SDR_BA0

T5

F7

U8

F3

CKE

T1

F2

CLK

AA5

EXM_RDZ

J19

AB0_WRZ

H16

E3

NAND_REZ

H13

NAND_DA15

E9

NAND_CLE

NAND_XWE
NAND_XRE
NAND_XWP
NAND_CLE
NAND_ALE
NAND_XCS0
NAND_XCS1
NAND_RXBO

NAND_RBZO

D3

NAND_ALE

M9

NAND_CSZ0
NAND_CSZ1

C2
D2

NAND_RXB1

NAND_RBZ1

H8

19

XWP

18

XWE

17

ALE

16

CLE

10

XCE2

9

XCE1

8

XRE

7

R/B1

H26

PDAGHC

H17

E24

F23

AB3

A2

AB0_CSZ0

E11

TABWS_WSP

CS

G9

SDR_CSZ0

T3

BA1

G8

SDR_BA1

T4

G7

BA0

AB5

F9

R5

NAND_XWE

NAND_XRE

NAND_XWP

NAND_CLE

NAND_ALE

NAND_XCS0

NAND_XCS1

NAND_RXBO

6

R/B2

NAND_RXB1

29-32
41-44

B4,C4,D4
E4,L9,E6,

K9,E8

WE
RAS
CAS

H5

Q1665

SWITCH

Q1667

SWITCH

Q8004

SWITCH

IC8504
DETECT

Q8502

SWITCH

D1601

IC1802

DC/DC CONV.

VDD_DCCOUT33

VDD_UNREG

+3.1V

IC8501

+3.1V REG

UNREG35-DET

MAIN1
SECTION
(Page 13)

VOUT

SHDN

4

1

DRY BATTERY
SIZE "AAA"
(IEC DESIGNATION LR03)
2PCS. 3V

SWITCH

Q1608

Q1664

SW

SW

Q1663

IC8003

DETECT

Q1609

SWITCH

+1.5V

IC1603

AMP

INT+

OUT

IC8001

DETECT

VOUT

VIN

IC8502

+1.5VREG

IC8002

RESET

SWITCH

Q1668

A17

SUBV

E15

SUBVWS_WSP

K26

GHC

D15

2SUB-WS_WSP

G22

3ZSC-0BA

2ZSC-0BA

F22

C8

7NIDA

SWITCH

Q1603

A

SWITCH

Q1601