Sony HCD-VP1 Service manual

HCD-VP1
SERVICE MANUAL
HCD-VP1 is the Amplifier, Video CD player , Tape Deck and Tuner section in CMT-VP1.
Dolby noise reduction manufactured under license from Dolby Laboratories Licensing Corporation. “DOLBY” and the double-D symbol a are trade­marks of Dolby Laboratories Licensing Corporation.
CD Section
Tape Section
E Model
Chinese Model
Model Name Using Similar Mechanism HCD-CP1 CD Mechanism Type KSL-2130CCP/K1N Optical Pick-up Name KSS-213C/K1N Model Name Using Similar Mechanism HCD-ED1 Tape Transport Mechanism Type CMAL1Z023A
SPECIFICATIONS
MICROFILM
MICRO HiFi COMPONENT SYSTEM
TABLE OF CONTENTS
1. GENERAL
Location of Controls ....................................................... 3
Setting the Time .............................................................. 4
2. DISASSEMBLY ......................................................... 5
3. SERVICE MODE...................................................... 10
4. ELECTRICAL CONFIRMATIONS AND ADJUSTMENTS
DECK Section ................................................................. 11
CD Section ...................................................................... 13
5. DIAGRAMS
5-1. Block Diagram – SERVO Section – ............................... 15
5-2. Block Diagram – TAPE Section – .................................. 16
5-3. Block Diagram – MAIN Section – ................................. 17
5-4. Block Diagram
– DISPLAY/POWER SUPPLY Section – ...................... 18
5-5. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 19
5-6. Printed Wiring Board – CD Board – .............................. 20
5-7. Schematic Diagram – CD Board – ................................. 21
5-8. Schematic Diagram – MAIN Board (1/4) – ................... 22
5-9. Schematic Diagram
– MAIN Board (2/4), HP/MIC Board,
VIDEO SW Board, LOADING Board – ........................ 23
5-10. Schematic Diagram – MAIN Board (3/4) – ................... 24
5-11. Schematic Diagram
– MAIN Board (4/4), LCD Board – .............................. 25
5-12. Printed Wiring Board – MAIN Board – ......................... 26
5-13. Printed Wiring Boards
– LCD Board, HP/MIC Board,
VIDEO SW Board, LOADING Board – ........................ 27
5-14. Printed Wiring Board – CONTROL Board – ................. 28
5-15. Schematic Diagram – CONTROL Board –.................... 29
5-16. Printed Wiring Board – POWER Board – ...................... 30
5-17. Schematic Diagram – POWER Board –......................... 30
5-18. IC Pin Function Description ........................................... 35
6. EXPLODED VIEWS ................................................ 37
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro­static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emis­sion, observe from more than 30 cm away from the objecti ve lens.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam­aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur­ing repairing.
• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra­diation exposure.
This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior.
7. ELECTRICAL PARTS LIST ............................... 42
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANU AL OR IN SUPPLEMENTS PUB­LISHED BY SONY.
2
Laser component in this product is capable of emitting radiation exceeding the limit for Class 1.
The following caution label is located inside the unit.
LOCATION OF CONTROLS
• Front View
2 3
1
!¶ !• !ª @º
@™
@∞
• Rear View
2
1
6 7 8
9
4 5
@• @ª
3
4
6
SECTION 1

GENERAL

7 8
9
!¡ !™
!£ !¢
!∞ !§
#™
1 Tape deck 2 Liquid crystal display 3 DSG button and indicator 4 VOLUME knob 5 TAPE P button 6 TAPE 6 button 7 TAPE œ, p, 0, ) buttons 8 TAPE REC r button 9 CD SYNC button and indicator 0 TUNER/BAND button !¡ TUNING +/– buttons !™ TUNING MODE button !£ CD EJECT 6 button !¢ CD ^, p, =/0, +/) buttons !∞ CD PLAY MODE button !§ CD REPEAT button !¶ TUNER button and indicator !• CD button and indicator !ª TAPE button and indicator @º MD/VIDEO button and indicator @¡ 1/u button and indicator @™ Remote sensor @£ CD disc tray @¢ PHONES jack @∞ MIC IN jack @§ MIC VOL knob @¶ VCD ON indicator @• PBC indicator @ª SELECT button #º PREV button #¡ RETURN button #™ NEXT button
1 AM ANTENNA terminals 2 FM ANTENNA terminals 3 SYSTEM SELECT switch 4 VIDEO OUT jack 5 POWER SELECT switch 6 LINE OUT jacks 7 MD IN jacks 8 VIDEO IN jacks 9 OPTICAL DIGITAL OUT (CD) 0 SPEAKER terminals
0
5
3
This section is extracted from instruction manual.
4
SECTION 2
s

DISASSEMBLY

Note: Follow the disassembly procedure in the numerical order given.
COVER (UPPER)
1
two case screws
3
cover (upper)
2
four screws (BTP3
1
two case crew
×
8)
TAPE MECHANISM DECK
6
two screws
2
connector
5
tape mechanism deck
1
flat wire (12 core)
3
two screws (BTP3 × 8)
4
lag
3
two screws (BTP3 × 8)
0
claw
9
F/R belt
7
motor
8
main belt
pinch roller
5
FRONT PANEL SECTION
)
)
2
flat wire (12 core)
3
screw (KTP3
×
6)
5
two bosses
1
connector (CN809)
2
flat wire (20 core) (CN804)
1
connector
2
flat wire (18 core) (CN802)
1
connector (CN812)
1
connector (CN303)
6
connector (CN603
4
two screws (BTP3
×
8)
• FRONT PANEL SECTION INSTALLATION
Note: Follow the assembly procedure in the numerical order given.
5
flat wire (12 core)
3
screw (KTP3
×
6)
6
connector
3
screw (KTP3
×
6)
5
flat wire (20 core) (CN804)
7
front panel section
5
flat wire (18 core) (CN802)
6
three connectors (CN303, 809, 812
1
two bosses
2
connector (CNP806) Note: As CNP806 pin is bent easily,
4
two screws (BTP3
3
×
8)
screw (KTP3
×
6)
treat is carefully.
6
CD MECHANISM DECK SECTION
)
1
two connectors
3
two screws (BTP3 × 8)
2
flat wire (19 core) (CN805)
1
connector (CN306)
4
CD mechanism deck section
VCD BLOCK
2
three screws
3
VCD block
3
two screws (BTP3 × 8)
5
holder (VCD)
4
screw (P2
×
8)
1
flat wire (24 core (CN701)
4
two screws (P2
×
8)
7
MECHANISM DECK ASS’Y
Note: As 3 coil springs are missed easily, terat them carefully.
3
coil spring
1
2
3
4
mechanism deck ass’y
two screws
×
10)
(P2.6 washer
(2130)
coil spring (front)
(rear)
2
washer (2130)
1
two screws (P2.6
2
washer (2130)
3
coil spring (rear)
2
washer (2130)
3
coil spring (front)
×
10)
TRAY (2130)
4
Pull the tray (2130).
8
Remove the tray (2130).
1
7
lock lever
two screws (PTPWH2.6
×
7)
2
chucking yoke (K)
6
damper (S)
A
5
claw
7
lock lever
3
Rotate the control cam in the direction of arrow
A
.
8
• SUB CHASSIS INSTALLATION
Note: Follow the assembly procedure in the numerical order given.
2
Install the drive gear with gear position as shown in figure.
gear
3
screw (PTPWH2.6 × 16)
front side
5
two screws (PTPWH2.6 × 7)
4
sub chassis
1
Install the control cam with gear position as shown in figure.
gear
front side
9
SECTION 3

SERVICE MODE

[Liquid Crystal Display All Lit Check Mode]
Procedure:
1. Set to standby state.
2. Press three buttons of p (TAPE), p (CD), and [MD/VIDEO] simultaneously.
3. Liquid crystal display are all turned on.
4. To release from this mode, press the 1/u button to turn the power OFF.
[Tape Deck Aging Mode]
This mode can be used for operation check of tape deck section.
Procedure:
1. Set a tape in the tape deck.
2. Set to standby state.
3. Press three buttons of p (TAPE), p (CD), and [TAPE] si­multaneously.
4. The aging is executed in bellow sequence.
5. To release from the aging mode, press the 1/u button to turn the power OFF.
Aging mode sequence:
Start
[CD Aging Mode]
This mode can be used for operation check of CD section.
Procedure:
1. Load a CD disc.
2. Set to standby state.
3. Press three buttons of p (TAPE), p (CD), and [TUNER] simultaneously.
4. The aging is executed in bellow sequence.
5. To release from the aging mode, press the 1/u button to turn the power OFF.
Aging mode sequence:
Start
Open the disc tray
Close the disc tray
Play the last track
FWD Play
1 minute
REC pause for 3 seconds
FWD REC
3 minutes
Fast forward
REV Play
1 minute
REC pause for 3 seconds
REV REC
3 minutes
Shut off
Shut off
Shut off
Shut off
10
Rewind
SECTION 4
r

ELECTRICAL CONFIRMATIONS AND ADJUSTMENTS

DECK SECTION
Note: Confirm each contents of this section first of all. If the results are
not satisfied, do the adjustment.
0 dB=0.775 V
1. Demagnetize the record/playback head with a head demagne­tizer.
2. Do not use a magnetized screwdriver for the adjustments.
3. After the adjustments, apply suitable locking compound to the parts adjust.
4. The adjustments should be performed with the rated power supply voltage unless otherwise noted.
5. The adjustments should be performed in the order given in this service manual. (As a general rule, playback circuit ad­justment should be completed before performing recording circuit adjustment)
6. The adjustments should be performed for both L-CH and R­CH.
7. Switches and controls should be set as follows unless other­wise specified.
• Test Tape
Tape Signal Used for
P-4-A100 10 kHz, –10 dB Azimuth Adjustment P-4-L300 315 Hz, 0 dB Level Adjustment
Record/Playback Head Azimuth Adjustment
Procedure:
1. Mode: Playback
test tape P-4-A100 (10 kHz, –10 dB)
MAIN board LINE OUT jack (PJ301) L-CH, R-CH
set
level mete
+ –
2. T urn the adjustment screw and check output peaks. If the peaks do not match for L-CH and R-CH, turn the adjustment screw so that outputs match within 1dB of peak.
Output level
within 1dB
L-CH peak
R-CH peak
within 1dB
Screw position
L-CH peak
Screw position
R-CH peak
3. Mode: Playback
MAIN board test tape P-4-A100 (10 kHz, –10 dB)
L-CH
set
R-CH
in phase 45°90°135°180
LINE OUT jack (PJ301)
L-CH
R-CH
waveform of oscilloscope
good
oscilloscope
wrong
H
V
°
4. Repeat step 1 to 3 in playback (REV) mode.
5. After the adjustments, apply suitable locking compound to the pats adjusted.
Adjustment Location:
reverse
forward
11
Playback level Confirmation and Adjustment
Procedure:
Mode: Playback
test tape P-4-L300 (315 Hz, 0 dB)
set
MAIN board LINE OUT jack (PJ301) L-CH, R-CH
level meter
+ –
Confirm playback level is within specification values as follows. If these levels are out of specification values, adjust the RV151 (L-CH) and RV251 (R-CH) on the MAIN board so that the level meter reading become within specified value.
Specified value:
PJ301 PB level: 301.5 to 338.3 mV (–8.2 to –7.2 dB) le vel dif fer­ence between the channels: within ±0.5 dB
REC Level Confirmation and Adjustment
Procedure:
1. Mode: Record
MAIN board MD IN jack (PJ301) L-CH, R-CH
AF OSC
315 Hz, 50 mV (–23.8 dB)
attenuator
600
set
2. Mode: Playback
recorded portion
set
MAIN board LINE OUT jack (PJ301) L-CH, R-CH
level meter
+ –
blank tape CS-123
Adjustment Location: MAIN board
REC Bias Confirmation and Adjustment
Procedure:
1. Mode: Record
MAIN board MD IN jack (PJ301) L-CH, R-CH
50 mV (–23.8 dB)
 
600
blank tape CN-123
set
AF OSC
1) 315 Hz
2) 10 kHz
attenuator
2. Mode: Playback
recorded portion
set
MAIN board LINE OUT jack (PJ301) L-CH, R-CH
level meter
+ –
3. Confirm playback the signal recorded in step 1 become speci­fied value as follows. If these values are out of specification values, adjust the R V153 (L-CH) and R V253 (R-CH) on the MAIN board to repeat steps 1and 2.
3. Confirm playback the signal recorded in step 1 become speci­fied value as follows. If these values are out of specification v alues, adjust the R V252 (R-CH) and R V152 (L-CH) on the MAIN board to repeat steps 1 and 2.
Specified value:
PJ301 PB level: 47.2 to 53.0 mV (– 24.3 to – 23.3 dB)
Adjustment Location: MAIN board
– MAIN Board (Conductor Side) –
LINE OUT (L/R) MD IN (L/R) VIDEO IN (L/R)
REC Level
IC352
RV251 (R) RV151 (L)
RV253 (R) RV153 (L)
PJ301
RV252 (R)
RV152 (L)
Playback Level
REC Bias
Specified value: Playback output of 315 Hz to playback output
of 10 kHz: ± 0.5 dB
Adjustment Location: MAIN board
12
CD SECTION
TP (GND)
TP (VC)
TP (FOK)
20 11
1
10
CN701
IC701
IC703
Notes:
1. CD block basically constructed to operate without adjustment. There­fore, check each item in order given.
2. Use YEDS-18 disc (Part No.: 3-702-101-01) unless otherwise indicated.
3. Use the oscilloscope with more than 10 M impedance.
4. Clean an object lens by an applicator with neutral detergent when the signal level is low than specified value with the following checks.
S-Curve Confirmation
Connection:
CD board
IC703 pin
!∞
TP (VC)
Procedure:
1. Connect an oscilloscope to IC703 pin !∞ and TP (VC) on the
CD board.
2. Connect between TP (FOK) and TP (GND) on the CD board
by lead wire.
3. Turn the power ON.
4. Press the
[EJECT] (CD) button to open the disc tray, and
6
put the disc (YEDS-18).
5. Press the
[EJECT] (CD) button to close the disc tray (Actu-
6
ate the focus search).
6. Conf irm that the wavef orm on the oscilloscope is symmetrical
between A and B and that peak to peak level is within 3.0 ±
1.0 Vp-p.
oscilloscope
+ –
RF signal waveform
VOLT/DIV: 200 mV TIME/DIV: 500 ns (with the 10: 1 probe in use)
level: 1.3 Vp-p
+0.25 –0.20
When observing the eye pattern, set the oscilloscope for AC range and raise vertical sensitivity.
Connecting Location:
– CD Board (Conductor Side) –
S-curve waveform
symmetry
A
within 3.0 ± 1.0 Vp-p
B
7. After confirmation, disconnect the lead wire in step 2.
Note: • Try to measure several times to make sure that the ratio of A : B
or B : A is more than 10 : 7.
• Take sweep time as long as possible and light up the brightness to obtain best waveform.
RF Level Confirmation
Connection:
CD board
IC703 pin
TP (VC)
!§
oscilloscope
(AC range)
+ –
Procedure:
1. Connect an oscilloscope to IC703 pin and TP (VC) on the CD board.
2. Turn the power ON.
3. Load the disc (YEDS-18), and press the back the disc.
4. Confirm that the waveform on the oscilloscope is clear and
[] button to play-
^
that the RF signal level is correct.
Note: Clear RF signal w av eform means that the shape “≈” can be clearly
distinguished at the center of the waveform.
13
14
5-1. BLOCK DIAGRAM – SERVO Section –
HCD-VP1
SECTION 5

DIAGRAMS

DETECTOR
A
B
C
D
F
E
OPTICAL PICK-UP
(KSS-213C/K1N)
LASER DIODE
PD
I-V AMP
10
LD
S-CLK
S-ACK
CTRL2
XTAL 16.9344MHz
AD BCK LRCK GFS
C2PO
DO
RST
S-SO
S-SI
L-OUT
R-OUT
VIDEO OUT
CD L-CH
R-CH
VIDEO OUT
OPTICAL
DO
TRANSCEIVER
IC308
J401
(Page 17)
F
OPTICAL
DIGITAL OUT (CD)
IC704
6320
VCKI
XTAO
CLOCK
GENERATOR
INTERNAL BUS
DIGITAL
OUT
SBSO
75
62
XTAI
SCLK
ERROR
CORRECTOR
PEAK
DETECTOR
83
D/A DIGITAL
PROCESSOR
MUTE
79
MUTE
DATA BCLK LRCK
GFS
RFCK
PROCESSOR
C2PO
SERIAL/PARALLEL
DOUT
46 47 45 54 55 56
71
S-REQ
FILTER
RF AMP,
A+5V
7
4
2
1
5
6
AUTOMATIC
POWER
CONTROL
Q701
3
4
5
6
9
FOCUS/TRACKING ERROR AMP
A
B
C
D
F
8
F I-V AMP
E
E I-V AMP
1
FOCUS/TRACKING COIL DRIVE,
SPINDLE/SLED MOTOR DRIVE
LD
IC702
IC703
RF
SUMMING
AMP
APC LD
AMP
RF EQ
AMP
FOCUS
ERROR AMP
TRACKING
ERROR AMP
APC PD
AMP
RFO
RFE
FE BIAS
LDON
DIGITAL SIGNAL PROCESSOR
IC701 (1/2)
16
RF EQ
SWITCH
17
Q702
FE
15
14
TE
13
19
PD
2
RFAC
36
ASYMMETRY
CORRECTOR
ASYI
38
ASYO
39
NOISE
SHAPER
MIX
18-TIMES
OVERSAMPLING
FILTER
CLV
PROCESSOR
MDP
MON
FSW
94
97
95
96
MDS
33
31
PCO
FILO
DIGITAL PLL VARI-PITCH
DOUBLE SPEED
SYNC
PROTECTOR
TIMING
GENERATOR 1
SCOR
XRST
74
81
WFCK
73
34
CLTV
32
FILI
TIMING
GENERATOR 2
SCOR
LDON
EFM
DEMODULATOR
ADDRESS
GENERATOR
SUBCODE Q
PROCESSOR
SUBQ
SQCK
77
78
SQCK/SCLK
REGISTER
32K
RAM
SUBQ
PRIORITY ENCODER
SUBCODE P – W
PROCESSOR
EXCK
76
D+5V
VCD BLOCK
(1/2)
(TRACKING)
(FOCUS)
05
2-AXIS DEVICE
M101
(SPINDLE)
M102
(SLED)
OUT+
27
M
26
16
M
17
12
13
1
2
OUT–
OUT+
OUT–
OUT–
OUT+
OUT+
OUT–
MOTOR
DRIVE
MOTOR
DRIVE
COIL
DRIVE
COIL
DRIVE
IN–
IN–
IN+
IN–
IN+
MUTE
IN+
IN+, IN–
23, 24
20
19
10
9
4
5
15
15 11
100
SW401
26
29
28
27
FE
TE
SE
RFDC
A/D
CONVERTER
SFDR
100
SRDR
2
TFDR
4
TRDR
6
FFDR
8
FRDR
10
PWM GENERATOR
FOCUS/TRACKING/SLED
SERVO DSP
FOCUS/TRACKING/SLED
SERVO
INTERFACE
COUT
89
DIGITAL SERVO
PROCESSOR
IC701 (2/2)
MIRR/DFCT/
FOK
DETECTOR
SERVO AUTO SEQUENCER
CPU
INTERFACE
FOK
MIRR
DFCT
SENS
DATA CLOK
XLAT
VIDEO SYSTEM
LIMIT
A +5V
93 91 92
80
86 88 87
FOK
SENS
DATA CLK XTL
SW-CLOSE
SW-OPEN
XRST
SYSTEM SELECT
PAL
AUTO
NTSC
S701
(LIMIT)
DISC TRAY OPEN/CLOSE
MOTOR DRIVE
IC309
IN1TR-OPEN
5 2
6 10
OUT1
IN2TR-CLOSE
OUT2
(DISC TRAY CLOSE DET)
(DISC TRAY OPEN DET)
M
M901
DISC TRAY
OPEN/CLOSE
S901
S902
17 13 12
RST
S-SO
S-CLK
S-ACK
S-REQ
SYSTEM CONTROLLER
IC801 (1/4)
S-SI
SIGNAL PATH
: CD PLAY (AUDIO)
: CD PLAY (VIDEO)
: DIGITAL OUT
1515
HCD-VP1
5-2. BLOCK DIAGRAM – TAPE Section –
L-CH
(RECORD/PLAYBACK)
R-CH
(ERASE)
RV253
RECORD BIAS (R)
R-CH
R-CH
RECORD BIAS (L)
BIAS OSC
T351
RV153
7 9
8
PLAYBACK
R-CH
REC BIAS
Q359, 360
BIAS OSC Q357, 358
EQ AMP
IC351
REC/PB SWITCHING
IC350
SWITCH
RV151
PLAYBACK
LEVEL (L)
4
T150
BIAS
TRAP
+8V
Q351
41
39
(CrO2 DET)
DECK A/B
SELECT
N/C/M
15
BIAS SWITCH
CIRCUIT
N
C
M
25 24 23
37
REC/PB
RV152
RECORD
LEVEL (L)
DOLBY NR
AMP
CIRCUIT
33, 34
DECK PROCESS,
DOLBY NR AMP
IC352
R/MUTE
NR-ON
32
(CAPSTAN/REEL)
(TRIGGER PLUNGER)
BIAS
L/M R/P
REC-L
35
16 17 18 20 19
M
Q352
Q353
Q354
Q356
Q355
CAPSTAN/REEL
MOTOR DRIVE
Q657, 659
TRIGGER
PLUNGER DRIVE
Q656, 658
REC-BIAS
86
REC-MUTE
87
DOLBY
88
L-MUTE
96
REC/PB
95
SYSTEM CONTROLLER
MOT-CON
10
SOL-CON
30
PB-L
REC/PB
IC801 (2/4)
A
B
C
(Page 17)
(Page 17)
(Page 18)
05
SIGNAL PATH
: TAPE PLAY : TAPE RECORD
16
16
(HEAD POSITION DET)
(HALF DET (SIDE-A))
(HALF DET (SIDE-B))
(CASSETTE IN DET)
TAPE END DETECT
SENSOR
1
6
32
TAPE-END
T-MODE
TC-SW
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