SONY CDP35 Service Manual

CDP-XE400/XE500
SERVICE MANUAL
Photo: CDP-XE500
SPECIFICATIONS
US Model
CDP-XE400/XE500
AEP Model
UK Model
E Model
Australian Model
CDP-XE500
Model Name Using Similar Mechanism CDP-261/361 CD Mechanism Type CDM14-5BD20 Base Unit Name BU-5BD20
MICROFILM
COMPACT DISC PLAYER
– 1 –
The laser component in this product
is capable of emitting radiation exceeding the limit for Class 1.
The following caution label is located inside of the unit.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following safety check before releasing the set to the customer: Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a re­turn to chassis, must not exceed 0.5 mA (500 microampers). Leakage current can be measured by any one of three methods.
This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior.
CAUTION
Use of controls or adjustments or performance of proce­dures other than those specified herein may result in haz­ardous radiation exposure.
Notes on Chip Component Replacement
Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
MODEL IDENTIFICATION
– Back Panel –
1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers’ instructions to use these instruments.
2. A battery-operated A C milliammeter. The Data Precision 245 digi­tal multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The “limit” indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passi ve VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suitable. (See Fig. A)
To Exposed Metal Parts on Set
0.15µF
1.5k
AC voltmeter (0.75V)
CDP-XE400
US Model : 4-977-587-5π
CDP-XE500
US Model : 4-977-587-1π E Model : 4-977-587-3π Australian Model : 4-977-587-4π Chinese Model : 4-977-587-9π AEP, German, East European Model : 4-978-388-0π UK Model : 4-978-388-1π
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
– 2 –
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objectiv e lens in the optical pick-up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERA TION CHECK
1. Make POWER switch on with no disc inserted and disc table closed.
2. Confirm that the following operation is performed while observing the objective lens.
TABLE OF CONTENTS
1. GENERAL
Identifying the Parts .................................................................. 4
Playing a CD.............................................................................. 5
2. DISASSEMBLY
2-1. Front Panel .............................................................................. 6
2-2. Base Unit Block ...................................................................... 6
3. ELECTRICAL BLOCK CHECKING ............................. 7
4. DIAGRAMS
4-1. IC Pin Functions...................................................................... 9
4-2. Printed Wiring Board – BD Section –................................... 13
4-3. Schematic Diagram – BD Section –...................................... 15
4-4. Printed Wiring Boards – Main Section – .............................. 17
4-5. Schematic Diagram – Main Section –................................... 21
5. EXPLODED VIEWS
5-1. Case Section .......................................................................... 28
5-2. Back Panel Section................................................................ 29
5-3. CD Mechanism Section......................................................... 30
5-4. Base Unit Section .................................................................. 31
6. ELECTRICAL PARTS LIST .......................................... 32
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE P AR TS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
– 3 –
Front Panel/Remote
Commander
1 POWER switch
2 PLAY MODE button
3 REPEAT button
4 TIME button
SECTION 1

GENERAL

CONTINUE button
SHUFFLE button
PROGRAM button
5 Disc tray
6 § OPEN/CLOSE button
7 0/) (manual search) button
8 CHECK (program check) button
9 CLEAR (program clear) button
0 ENTER button
AMS ± (AMS*) control
!™ PHONES Jack
p (Stop) button
P (Pause) button
!∞ · (Play) button
Display
MUSIC SCAN button
!• PEAK SEARCH button
EDIT/TIME button
Play Mode buttons
Numeric buttons
@™ >10 (over 10) button
TIME button
=/+ (AMS*) button
@∞ FADER button
*AMS is the abbreviation of Automatic
Music Sensor.
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IDENTIFYING THE P ARTS
RM-D420 (CDP-XE500 only)
– 4 –
– 5 –
SECTION 2

DISASSEMBLY

Note : Follo w the disassembly procedure in the numerical order giv en.
2-1. FRONT PANEL
• When removing the front panel assembly on electric power failure, first open the loading block by turning cam with a screwdriver as shown in the figure, next pull out the loading block with hand, and remove the loading panel as shown in the figure, then remove the front panel assembly.
3
Remove loading panel in the arrow direction.
1
Turn in the direction
of the arrow.
bottom of chassis
2-2. BASE UNIT BLOCK
1
Turn the cam to direction of arrow (Counter clockwise) by
minus screw driver.
2
Take off the disc table.
3
Remove the yoke bracket.
4
Remove the MD (BU-5BD20) to the direction of arrow.
1
cam
2
4
BU-5BD20
Pull out disc table.
3
yoke bracket
2
disc table
– 6 –
SECTION 3

ELECTRICAL BLOCK CHECKING

Note :
1. CD Block is basically designed to operate without adjustment. Therefore, check each item in order given.
2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated.
3. Use an oscilloscope with more than 10M impedance.
4. Clean the objective lens using an applicator with neutral detergent when the signal level is low than specified value with the follo wing checks.
S Curve Check
oscilloscope
BD board
TP (FE) TP (VC)
Procedure :
1. Connect oscilloscope to test point TP (FE) on BD board.
2. Connect between test point TP (FEI) and TP (VC) by lead wire.
3. Turn Power switch on.
4. Put disc (YEDS-18) in and turn Power switch on again and actuate the focus search. (Actuate the focus search when disc table is moving in and out.)
5. Check if the oscilloscope waveform (S-curve) is symmetrical between A and B. And confirm peak to peak le v el within 3±1 Vp-p.
S-curve waveform
symmetry
A
within 3±1 Vp-p
B
3. Put disc (YEDS-18) in and playback.
4. Confirm that oscilloscope waveform is clear and check if RF signal level is correct or not.
Note :
A clear RF signal waveform means that the shape “ ” can be clearly distinguished at the center of the waveform.
RF signal waveform
VOLT/DIV : 200mV TIME/DIV : 500nS
level : 1.2
+0.25 –0.20
Vp-p
E-F Balance (1 Track Jump) Check
oscilloscope (DC range)
BD board
TP (TE) TP (VC)
Procedure :
1. Connect oscilloscope to test point TP (TE) on BD board .
2. Turn Power switch on.
3. Put disc (YEDS-18) in to play the number five track.
4. Press the “P (pause)” button. (Becomes the 1 track jump mode.)
5. Check the level B of the oscilloscope’s waveform and the A (DC voltage) of the following : A/B×100 = less than ± 20%.
1 track jump waveform
6. After check, remove the lead wire connected in step 2. Note : • Try to measure several times to make sure than the ratio of
A : B or B : A is more than 10 : 7.
•Set sweep time as long as possible and set the brightness to obtain best waveform.
RF Level Check
oscilloscope
BD board
TP (RF) TP (VC)
Procedure :
1. Connect oscilloscope to test point TP (RF) on BD board.
2. Turn Power switch on.
Center of the waveform
B
level : 1.5±0.7Vp-p
symmetry
RF PLL Free-run Frequency Check
Procedure :
1. Connect frequency counter to test point (PLCK) with lead wire.
frequency counter
MAIN board
TP (PLCK)
2. Turn Power switch on.
3. Confirm that reading on frequency counter is 4.3218MHz.
– 7 –
A (DC voltage)
Adjustment Location : BD board
–BD board (conductor side) –
(PLCK)
120
IC103
10 11
IC101
(RF)
(VC)
(FE)
(FEI)
(TE)
– 8 –
SECTION 4

DIAGRAMS

4-1. IC PIN FUNCTIONS
• IC101 CXD2545Q (DIGITAL SERVO & DIGITAL SIGNAL PROCESSOR)
Pin No. Pin Name I/O Function
1 SRON O Sled drive output (Not used.) 2 SRDR O Sled drive output 3 SFON O Sled drive output (Not used.) 4 TFDR O Tracking drive output 5 TRON O Tracking drive output (Not used.) 6 TRDR O Tracking drive output 7 TFON O Tracking drive output (Not used.) 8 FFDR O Focus drive output
9 FRON O Focus drive output (Not used.) 10 FRDR O Focus drive output 11 FFON O Focus drive output (Not used.) 12 VCOO O VCO output for analog EFM PLL. (Not used.) 13 VCOI I VCO input for analog EFM PLL. (Ground) 14 TEST I TEST pin connected normally to Ground. 15 DVSS Digital Ground 16 TES2 I TEST pin connected normally to Ground. 17 TES3 I TEST pin connected normally to Ground. 18 PDO O Charge-pump output for analog EFM PLL. (Not used.) 19 VPCO O Charge-pump output for variable pitch PLL. (Not used.) 20 VCKI I Clock input from variable pitch external VCO. (Ground) 21 AVD2 Analog power supply 22 IGEN I Power supply pin for operational amplifiers. 23 AVS2 Analog Ground 24 ADIO I (Not used.) 25 RFC O (Not used.) 26 RFDC I RF signal input 27 TE I Tracking error signal input 28 SE I Sled error signal input 29 FE I Focus error signal input 30 VC I Center voltage input pin 31 FILO O Filter output for master PLL. 32 FILI I Filter input for master PLL. 33 PCO O Charge-pump output for master PLL. 34 CLTV I Control voltage input for master VCO. 35 AVS1 Analog Ground 36 RFAC I EFM signal input 37 BIAS I Asymmetry circuit constant current input 38 ASYI I Asymmetry comparate voltage input 39 ASYO O EFM full swing output 40 AVD1 Analog power supply 41 DVDD Digital power supply 42 ASYE I Asymmetry circuit ON/OFF 43 PSSL I Audio data output mode selection input 44 WDCK O 48-bit slot D/A interface. Word clock 45 LRCK O 48-bit slot D/A interface. LR clock 46 DATA O DA 16 output when PSSL=1. 48-bit slot serial data when PSSL=0. 47 BCLK O DA 15 output when PSSL=1. 48-bit slot data when PSSL=0.
– 9 –
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