V 1.10 Page 1of 45 ICM MP CCQ GRM
A52/A55/C55 IFX
Company Confidential © Copyright Siemens AG
08/03
A52, A55 & C55 IFX
Level 2.5e
Repair Documentation
V 1.10
Version Date Department Notes to change
V 1.00 09.052003 ICM MP CCQ GRM New document
V 1.10 11.08.2003 ICM MP CCQ GRM Document modified (A52)
V 1.10 Page 2of 45 ICM MP CCQ GRM
A52/A55/C55 IFX
Company Confidential © Copyright Siemens AG
08/03
Table of Contents:
1 LIST OF AVAILABLE LEVEL 2,5E PARTS C55 IFX .........................................4
2 REQUIRED EQUIPMENT FOR LEVEL 2,5E ...................................................... 5
3 REQUIRED SOFTWARE FOR LEVEL 2,5E C55 IFX.........................................5
4 RADIO PART DESCRIPTION............................................................................. 6
4.1 Introduction..................................................................................................... 6
4.2 Power Supply RF-Part .................................................................................... 7
4.3 Frequency generation .................................................................................... 7
4.3.1 Synthesizer: The discrete VCXO (26MHz)...........................................................................7
4.3.2 Synthesizer: LO1..................................................................................................................8
4.4 Antenna Switch / External Antenna Connector (electrical/mechanical only
C55) 10
4.5 Frontendmodul (Electrical Antenna Switch) .............................................. 10
4.6 Receiver......................................................................................................... 11
4.6.1 Receiver: EGSM900/GSM1800 – Filter to Demodulator ...................................................11
4.6.2 IC Overview ........................................................................................................................13
4.7 Transmitter.................................................................................................... 15
4.7.1 Transmitter: Modulator and Limited Amplifier ....................................................................15
4.7.2 Transmitter: and Power Amplifier.......................................................................................16
5 LOGIC / CONTROL........................................................................................... 17
5.1 Overview of Hardware Structure ................................................................. 17
5.1.1 Logic Block Diagram ..........................................................................................................17
5.1.2 Block Diagram C55 IFX Control Part .................................................................................17
5.1.3 EGOLD+.............................................................................................................................18
5.1.4 SRAM .................................................................................................................................22
5.1.5 FLASH ................................................................................................................................22
5.1.6 SIM .....................................................................................................................................22
5.1.7 Vibration Motor ...................................................................................................................23
6 POWER SUPPLY..............................................................................................23
6.1 Power Supply ASIC ......................................................................................23
6.1.1 Power Supply Operating modes: .......................................................................................25
6.1.2 Power Supply Functions:....................................................................................................26
6.2 Battery ........................................................................................................... 33
6.3 Charging Concept......................................................................................... 34
V 1.10 Page 3of 45 ICM MP CCQ GRM
A52/A55/C55 IFX
Company Confidential © Copyright Siemens AG
08/03
7 INTERFACES.................................................................................................... 37
7.1 Vibra............................................................................................................... 37
7.2 Earpiece......................................................................................................... 37
7.3 Microphone ................................................................................................... 38
7.4 Battery ........................................................................................................... 38
7.5 IO Connector with ESD protection.............................................................. 39
7.5.1 IO Connector – New Slim Lumberg ...................................................................................39
7.5.2 ESD Protection with EMI filter ............................................................................................40
7.6 SIM ................................................................................................................. 41
7.7 Display........................................................................................................... 41
8 ACOUSTIC........................................................................................................ 42
8.1 Microphone ................................................................................................... 42
8.1.1 Mechanical .........................................................................................................................42
8.1.2 Electrical .............................................................................................................................42
8.2 Earpiece/Loudspeaker ................................................................................. 43
8.2.1 Mechanical .........................................................................................................................43
8.2.2 Electrical .............................................................................................................................43
9 DISPLAY AND ILLUMINATION........................................................................ 44
9.1 Display........................................................................................................... 44
9.2 Illumination ...................................................................................................44
10 KEYBOARD ................................................................................................... 45
V 1.10 Page 4of 45 ICM MP CCQ GRM
A52/A55/C55 IFX
Company Confidential © Copyright Siemens AG
08/03
1 List of available level 2,5e parts C55 IFX
ID-No Type Board Name, Location Part-No.
D150 VCO HIT Transmitter_VCO L36820-L6097-D670
D1600 VCO IFX Transmitter_VCO L36820-L6109-D670
D171 IC HIT/IFX Egold+ L36810-G6149-D670
D1740 Filter IFX Ant_Switch_Diplexer L36197-F5006-F936
D1785 IC IFX Transceiver IC L36197-F5011-F334
D361 IC HIT/IFX ASIC L36145-J4682-Y43
D800 IC HIT Transceiver IC L36820-L6105-D670
D920 IC HIT PA_Comperator L36820-L6133-D670
R1507 Resistor IFX Temp_Resistor L36120-F4223-H
R959 Resistor HIT Temp_Resistor L36120-F4223-H
V1500 Diode IFX Capa_Diode L36840-D61-D670
V151 Diode HIT/IFX Diode_KB7 L36840-D5062-D670
V181 Diode HIT/IFX Diode_Battery_Interface L36702-A1051
V211 Transistor HIT/IFX Tran._Vibra L36830-C1097-D670
V220 Diode HIT/IFX Diode_Vibra L36851-Z9105-Z981
V222 Transistor HIT/IFX Trans_Light_ L36830-C1112-D670
V223 Transistor HIT Trans_Light_ L36840-C4004-D670
V361 Transistor HIT/IFX Tran._Charge L36830-C1110-D670
V850 Transistor HIT Tran._VCO_Switch L36820-C6047-D670
V920 Diode HIT Feedback_Diode L36840-D5049-D670
V921 Transistor HIT Tran._PA_Switch L36820-C6047-D670
V950 Transistor HIT Tran._26MHz_Ampl. L36840-C4049-D670
V951 Diode HIT Capa_Diode L36840-D61-D670
Z1500 Quartz IFX Oszillator_26MHz L36145-F260-Y17
Z1600 Filter IFX Transmitter_Filter L36145-K280-Y242
Z1700 IC IFX Power_Amplifier L36197-F5005-F487
Z171 Quartz HIT/IFX Quarz/Egold L36145-F102-Y8
Z211 Filter HIT/IFX Logic/IO_Interface L36197-F5000-F116
Z850 VCO HIT 1LO_VCO L36145-G100-Y96
Z851 Filter HIT Filter_BALUN L36145-K260-Y41
Z880 IC HIT Ant_Switch_Diplexer L36145-K280-Y257
Z900 IC HIT Power_Amplifier L36851-Z2002-A59
Z950 Quartz HIT Oszillator_26MHz L36145-F260-Y17
V 1.10 Page 5of 45 ICM MP CCQ GRM
A52/A55/C55 IFX
Company Confidential © Copyright Siemens AG
08/03
2 Required Equipment for Level 2,5e
- GSM-Tester (CMU200 or 4400S incl. Options)
- PC-incl. Monitor, Keyboard and Mouse
- Bootadapter 2000/2002 (L36880-N9241-A200)
- Adapter cable for Bootadapter due to new Lumberg connector
- Troubleshooting Frame C55 (F30032-P209-A1)
- Power Supply
- Spectrum Analyser
- Active RF-Probe incl. Power Supply
- Oscilloscope incl. Probe
- RF-Connector (N<>SMA(f))
- Power Supply Cables
- Dongle (F30032-P28-A1) if USB-Dongle is used a special driver for NT is required
- BGA Soldering equipment
Reference: Equipment recommendation V1.2
(downloadable from the technical support page)
3 Required Software for Level 2,5e C55 IFX
- Windows NT Version4
- Winsui version1.43 or higher
- Software for GSM-Tester ( Cats(Acterna/Wiltek) or CMU-GO(Rohde&Schwarz) )
- Software for reference oscillator adjustment
- Internet unblocking solution
- Dongle driver for USB-Dongle if used with WIN NT4
V 1.10 Page 6of 45 ICM MP CCQ GRM
A52/A55/C55 IFX
Company Confidential © Copyright Siemens AG
08/03
4 Radio Part Description
4.1 Introduction
The radio part is necessary to convert the GMSK-RF-signals from the antenna to the
baseband and vice versa.
In the receiving direction, the signals are split in the I- and Q-component and fed to the
A/D-converter of the logic part. In the transmission direction, the GMSK-signal is
generated with the Direct Modulator by modulation of the I- and Q-signals, which are
generated in the baseband section. After the modulation the RF-signals are amplified by
a buffer-limiter and, for the GSM900 path, filtered with a SAW-Filter. Finally, the power
amplifier (PA) is attached to reach the output power.
Transmitter and Receiver are never active at the same time. Simultaneous
reception in the EGSM 900 and GSM 1800 band is impossible as well as
simultaneous transmission in both bands. However the monitoring band
(monitoring timeslot) in the TDMA-frame can be chosen independently of the
receiving or transmitting band (RX- and TX timeslot of the band).
The RF-part is designed for dualband operation (EGSM 900, GSM 1800) and consists of
the following main components:
1. 26MHz reference crystal Z1500
2. TX-Filter in GSM section Z1600
3. Transmitter power amplifier RF9340 with integrated regulator Z1700
4. Front-End-Module including RX-/TX-switch and EGSM 900/GSM1800 receiver SAW-
filters D1740
5. Infineon Limiter/Buffer PMB2256 to amplify the RF signals from the modulator to
drive the PA D1600
6. Infineon Smarti DC2 PMB6256 with the following functionality D1785:
• Integrated active part of the 26MHz crystal oscillator
• PLL for local oscillator LO1
• LO1-VCO
• Direct conversion receiver with channel filtering
• Direct Modulator
• Active part of the reference oscillator including buffer
• Control circuit for band switch
V 1.10 Page 7of 45 ICM MP CCQ GRM
A52/A55/C55 IFX
Company Confidential © Copyright Siemens AG
08/03
4.2 Power Supply RF-Part
The voltage regulator for the RF-part is located inside the ASIC D361.(see chapter 5.2).It
generates the required 2,85V “RF-Voltages” named VCC2_8 and VCC_SYN. (VCC_SYN
is also named VCC2 and behind R1451 VCC_OSC)
The following components are supplied by:
VCC2_8
• Limiter amplifier
VCC_SYN
• Modulators
• RX mixers
• VCO
• PLL
• 26 MHz reference oscillator
The voltage regulator RFREG 1 is controlled by the signal SLEEPQ (RF_EN
(RF REG G2)),
RFREG2 is controlled by he signal VCXOEN_UC connected to SLEEP1_N
(on/off Control
H1)
. Both signals are provided by the EGOLD+ (SLEEPQ (GSM TDMA-Timer H16) /
VCXOEN_UC (Miscellaneous R6)).
Circuit diagram
4.3 Frequency generation
4.3.1 Synthesizer: The discrete VCXO (26MHz)
The reference oscillator is a 26 MHz voltage controlled crystal oscillator. It has two main
tasks:
• It is used as reference for the synthesizer phase/frequency detector (Smarti
internal circuit)
• It gives the clock for the processor (E-Gold)
The main block is realized as an internal transistor cell with a Colpitts structure. The 26
MHz quartz crystal is connected to a tuning circuit that allows a fine-tuning of the
frequency. A current mirror, acting as buffer and amplifier followed by a LC resonant
circuit makes the signal to fit the E-Gold clock signal requirements. ON/OFF signal
(VCC_OSC) comes from the ASIC via the resistor R1451. For temperature
measurements of the VCXO a temperature resistance (R700) is used. The resistor is
placed near the VCXO. The measurement result TVCXO is reported to the EGOLD+
(Analog Interface P3) via R138 as the signal TENV. The frequency of the reference oscillator
can be adjusted by the EGOLD+ via a PNM- modulated AFC-signal.
The signal leaves the SMARTI as BB_SIN26M at pin 4 to be further used from the
EGOLD+ (D171
(functional T3)).
The required voltage VCC_SYN is provided by the ASCI D361
V
CC2_8
VCC_
SYN
V 1.10 Page 8of 45 ICM MP CCQ GRM
A52/A55/C55 IFX
Company Confidential © Copyright Siemens AG
08/03
Circuit diagram
4.3.2 Synthesizer: LO1
The local oscillator (LO1) consists of a PLL inside the Smarti DC (D720), an external loop
filter. The VCO is build in.
The first local oscillator is needed to generate frequencies which enables the transceiver IC
to demodulate the receiver signal and to perform the channel selection in the TX part. The
LO1/PLL part is switched on with PLLON (
pin 5) from the EGOLD+ (D171 (GSM TDMA Timer
F16)
). The PLL settings are programmed by the 3 wire bus RFCLK (pin 1), RFDATA (pin2)
and RFSTR (
pin3). The LO frequency is 4 times the RX/TX frequency for EGSM 900 and 2
times for GSM1800.
This LO1 frequency range
The required voltage VCC_SYN is provided by the ASIC D361
from EGOLD
to EGOLD+
V 1.10 Page 9of 45 ICM MP CCQ GRM
A52/A55/C55 IFX
Company Confidential © Copyright Siemens AG
08/03
Block diagram
Circuit diagram
~
~
External
loopfilter
External
loopfilter
V 1.10 Page 10of 45 ICM MP CCQ GRM
A52/A55/C55 IFX
Company Confidential © Copyright Siemens AG
08/03
4.4 Antenna Switch / External Antenna Connector
(electrical/mechanical only C55)
The mechanical antenna switch for the differentiation between the internal and external
antenna.
4.5 Frontendmodul (Electrical Antenna Switch)
EGSM900/GSM1800 <> Receiver/Transmitter
The frontend has two functions.
- to select the different GSM bands
- to switch between RX and TX mode
Inside the frontendmodul SAW filters are integrated in the RX paths.
For dual band mode the FEM needs two supply voltages (VC1, VC2) that are directly
provided by the Smarti DC (FEM1 and FEM2). The following logical table shows the
different modes of the FEM.
Mode Selection Vc. 1 Vc.2 Vc.3
EGSM900 RX LOW LOW LOW
EGSM900 TX HIGH LOW LOW
GSM1800 RX LOW LOW LOW
GSM1800 TX LOW HIGH LOW
GSM1900 RX LOW LOW HIGH
GSM1900 TX LOW HIGH LOW
Two balanced SAW filters are integrated to have good stop-band attenuation in the GSM
and the PCN RX paths.
Top View
Block diagram
to / from
di
p
lexer
External
Internal
V 1.10 Page 11of 45 ICM MP CCQ GRM
A52/A55/C55 IFX
Company Confidential © Copyright Siemens AG
08/03
4.6 Receiver
4.6.1 Receiver: EGSM900/GSM1800 – Filter to Demodulator
From the antenna switch, up to the demodulator the received signal passes the following
blocks to get the demodulated baseband signals for the EGOLD+:
Inside Z650 Smarti Smarti Smarti
Filter: The EGSM900, GSM1800 filters are located inside the frontend module. The Filter
are centred to a frequency of 942,5MHz for EGSM900, 1847,5MHz for GSM1800.
LNA:
The LNA´s (EGSM900/GSM1800) are located inside the Smarti. The LNA can be
switched in HIGH (On) and LOW (Off) mode and is controlled by the Smarti depending on
EGOLD+ information.
Demodulator:
The Smarti DC consists of a direct conversion receiver for GSM 900/1800.
The amplified RF signal is converted by a quadrature demodulator to the final
outputsignals at baseband frequency. The LO signals are generated by a divider by 4 for
the GSM900 band and by a divider by 2 for GSM1800 band.
The resulting in-phase and quadratursignals are fed into two baseband low pass filters and
the PGC amplifier chain. The baseband filter provide a suppression of inband-blocking and
adjacent channel interferers.
PGC:
After baseband filtering the signal is fed into a PGC amplifier chain. The baseband
amplifier offers 78 dB programmable gain with 2 dB steps. Due to the high baseband gain
(58 dB), DC offsets can corrupt the signal at the baseband outputs. Differential offset
voltages are reduced by an internal offset compensation circuit. The control is realised
through the EGOLD+ signals (RFDATA; RFCLK; RFSTR.
(RF Control J15, J16, J17).
Filter LNA
PGC
Demodulator
to Antenna
from
P
A
Control Signals
from Smarti
V 1.10 Page 12of 45 ICM MP CCQ GRM
A52/A55/C55 IFX
Company Confidential © Copyright Siemens AG
08/03
The required voltage VCCSYN is provided by the ASIC D361
Circuit diagram
Top view
to EGOLD+
progr. signals
from
antenna
PMB6256
V 1.10 Page 13of 45 ICM MP CCQ GRM
A52/A55/C55 IFX
Company Confidential © Copyright Siemens AG
08/03
4.6.2 IC Overview
IC Overview
Smarti
RX Path
TX Path
RX/TX Path
V 1.10 Page 14of 45 ICM MP CCQ GRM
A52/A55/C55 IFX
Company Confidential © Copyright Siemens AG
08/03
Block diagram
The functional block diagram shows the IFX RF solution of the A55/C55
State
machi ne
Serial
Interface
R
1
D
1
PFD+CP
Transceiver IC
Smarti DC2
PMB6256
Logic
Outputs
BB: RF_I
BB: RF_IX
BB: RF_Q
BB: RF_QX
RFCLK
RFSTR
RFDATA
PA_RAMP
TXON1
TVCXO
(Tenv)
TXONPA
AFC
SIN 26MHz
DC autocalibr ation
PGC (2dB steps)
GSM
PCN
RF PLL
LOOP-Fil ter
BATT+
Band
(Low=GSM
High=DCS)
PA_Ramp
(200mV for
lowest output
level)
SAW
1805 - 1880 MHz
925-960 MHz
942.5 MHz
1842.5 MHz
FEM incl.
SAW
Pin-diode
switch incl.
TX harmonic
filtering
SAW
TX_GSM
(FEM1)
external
antenna
antenna
matching
mechanical
antenna
switch
internal
antenna
Antenna
low pass
filter
Buffer-Limiter
PMB2256
(Lumpi)
H3-Fil ter
(for mod
spectrum)
SAW
RC-Lowpass
RC-Lowpass
internal
RF VCO
3420 - 3540 MHz
3540.4 - 3700 MHz
3700.4 - 3820 MHz
3820.8-3839.2 MHz
LFS
for fast lock
BB-Out BB-Out
DCS LNA
(-20dB at low
gain)
GSM LNA
(-20dB at low
gain)
+/- 45°
IQ demodulator
IQ demodulator
+/- 45°
+/- 45°
IQ modulator
Salzburg
D0950
VCC2_8
VCC_SYN
(for Smarti
supply)
BATT+
VCXOEN
SLEEPQ
2.85V
enable
enable
V REF1
V RF2
BB filter
Tune voltage within 0.5..2.3V
VCXO
integrated act ive
part
26 MHz
AFC voltage
(from E-Gold)
TX_DCS
(FEM2)
Tenv
(Temp
sensor)
TXONPA
(enable)
DCS
GSM
OSW1
(Low=GSM
High=DCS)
Band
(Low=GSM
High=DCS)
TXON1
(enable)
VCC
2_8
VCC
2_8
VCC_SYN
is supply for all
Chip VCC's
OSW1
FEM1
FEM2
Buffer
26MHz
PLL_ON
BB filter
BB filterBB filter
PGC
(2dB steps)
PGC (2dB steps)PGC (2dB steps)
Divider
%2
Divider
%2
Divider
%2
Int. Voltage
Regulator
VREG
RF-Part of L55 Tuna / Infi neon
IQ modulator
+/- 45°
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