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BTB08-800C
Datasheet
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SGS Thomson Microelectronics BTB08-800TWRG, BTB08-800SWRG, BTB08-800SW, BTB08-800CWRG, BTB08-800CW Datasheet

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BTA/BTB08 and T8 Series
SNUBBERLESS™, LOGIC LEVEL & STANDARD 8A TRIACS
MAIN FEATURES:
Symbol Value Unit
I
T(RMS)
V
DRM/VRRM
I
GT (Q1)
8A
600 and 800 V
5 to 50 mA
Available either in through-hole or surface-mount packages, the BTA/BT B08 and T8 triac series is suitable for general purpose AC sw itching. They can be used as an ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits... or for phase control operation in light dimmers, motor speed controllers,... The snubberless versions (BTA/BTB...W and T8 series) are specially recommended for use on inductive loads, than ks to their high com mutation performances. By usin g an internal ceramic pa d, the BTA series provides voltage insulated tab (rated at 2500V RMS) complying with UL standards (File ref.: E81734)
A2
A1
A2
G
DPAK
(T8-B)
A1
A2
G
A1
A2
G
TO-220AB Insulated
(BTA08)
G
IPAK
(T8-H)
A2
A1
A1
A2
A2
A1
A2
D2PAK (T8-G)
G
TO-220AB
(BTB08)
A2
G
A2
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
I
T(RMS)
I
TSM
²
I
dI/dt
I
GM
P
G(AV)
T
stg
T
RMS on-state current (full sine wave)
Non repetitive surge peak on-state current (full cycle, Tj initial = 25°C)
tI
²
t Value for fusing
Critical rate of rise of on-state current I
G
Peak gate current tp = 20 µs Tj = 125°C 4 A Average gate power dissipation Tj = 125°C 1 W
Storage junction temperature range Operating junction temp erature range
j
April 2002 - Ed: 5A
= 2 x IGT , tr ≤ 100 ns
DPAK / D
IPAK / TO-220AB
TO-220AB Ins. Tc = 100°C
F = 120 Hz Tj = 125°C 50 A/µs
²
PAK
Tc = 110°C
8A
F = 50 Hz t = 20 ms 80 A F = 60 Hz t = 16.7 ms 84
tp = 10 ms 36
- 40 to + 150
- 40 to + 125
A
°C
²
s
1/10
BTA/BTB08 and T8 Series
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)
■ SNUBBERLESS™ and LOGIC LEVEL (3 Quadrants)
Symbol Test Conditions Quadrant T8 BTA/BTB08 Un it
T810 T835 TW SW CW BW
I
GT
V
V
(1)
GT GD
= 12 V RL = 30 Ω
V
D
VD = V
RL = 3.3 kΩ
DRM
I - II - III MAX. 10 35 5 10 35 50 I - II - III MAX. 1.3 V
I - II - III MIN. 0.2
Tj = 125°C
I
(2)
H
I
L
= 100 mA
I
T
I
= 1.2 I
G
GT
MAX.153510153550mA
I - III MAX. 25 50 10 25 50 70 mA
II 30 60 15 30 60 80
dV/dt (2) V
= 67 %V
D
Tj = 125°C
(dI/dt)c (2) (dV/dt)c = 0.1 V/µs
gate open
DRM
Tj = 125°C MIN. 5.4 - 3.5 5.4 - - A/ms
MIN. 40 400 20 40 400 1000 V/µs
(dV/dt)c = 10 V/µs Tj = 125°C 2.8 - 1.5 2.8 - ­Without snubber
■ ST ANDARD (4 Quadrants)
Tj = 125°C - 4.5 - - 4.5 7
Symbol Test Conditions Quadra nt BTA/BTB08
CB
(1)
I
GT
V
GT
V
GD
I
(2)
H
I
L
= 12 V RL = 30 Ω
V
D
VD = V
= 500 mA
I
T
IG = 1.2 I
RL = 3.3 kΩ Tj = 125°C
DRM
GT
I - II - III
IV
MAX.
25 50
50
100 ALL MAX. 1.3 V ALL MIN.
0.2 V
MAX. 25 50 mA
I - III - IV MAX. 40 50 mA
II 80 100
dV/dt (2) V
= 67 %V
D
gate open Tj = 125°C
DRM
MIN. 200 400 V/µs
(dV/dt)c (2) (dI/dt)c = 3.5 A/ms Tj = 125°C MIN. 5 10 V/µs
mA
Unit
mA
V
STATIC CHARACTERISTICS
Symbol Test Conditions Value Unit
V
(2) ITM = 11 A tp = 380 µs
TM
(2)
V
to
(2)
R
d
I
DRM
I
RRM
Note 1: minimum IGT is guaranted at 5% of IGT max. Note 2: for both polarities of A2 referenced to A1
Threshold voltage Tj = 125°C MAX. 0.85 V Dynamic resistance Tj = 125°C MAX. 50 mΩ V
= V
DRM
RRM
2/10
Tj = 25°C MAX. 1.55 V
Tj = 25°C
Tj = 125°C 1 mA
MAX.
5µA
BTA/BTB08 and T8 Series
THERMAL RESISTANCES
Symbol Parameter Value Unit
R
th(j-c)
R
th(j-a)
S = Copper surface under tab
Junction to case (AC)
Junction to ambient
PRODUCT SELECTOR
S = 1 cm S = 0.5 cm
DPAK / D
IPAK / TO-220AB
TO-220AB Insulated 2.5
²
²
TO-220AB Insulated
²
PAK
D²PAK
DPAK 70
TO-220AB
IPAK 100
1.6
45
60
°C/W
°C/W
Voltage (xxx)
Part Number
Sensitivity Type
Package
600 V 800 V
BTA/BTB08-xxxB X X 50 mA Standard TO-220AB BTA/BTB108-xxxBW X X 50 mA Snubberless TO-220AB BTA/BTB08-xxxC X X 25 mA Standard TO-220AB BTA/BTB08-xxxCW X X 35 mA Snubberless TO-220AB BTA/BTB08-xxxSW X X 10 mA Logic level TO-220AB BTA/BTB08-xxxTW X X 5 mA Logic level TO-220AB T810-xxxB X X 10 mA Logic level DPAK T810-xxxH X X 10 mA Logic level IPAK T835-xxxB X X 35mA Snubberless DPAK T835-xxxG X X 35 mA Snubberless
²
D
PAK
T835-xxxH X X 35 mA Snubberless IPAK
BTB: non insulated TO-220AB package
3/10
BTA/BTB08 and T8 Series
ORDERING INFORMATION
BT A 08 - 600 BW (RG)
TRIAC SERIES
INSULATION: A: insulated B: non insulated
CURRENT:8A
TRIAC SERIES
CURRENT:8A
OTHER INFORMATION
Part Number Marking Weight
PACKING MODE Bulk: Blank RG:Tube
VOLTAGE: 600: 600V 800: 800V
SENSITIVITY &TYPE B: 50mA STANDARD BW: 50mA SNUBBERLESS C: 25mA STANDARD CW: 35mA SNUBBERLESS SW: 10mA LOGIC LEVEL TW: 5mA LOGIC LEVEL
T 8 10 - 600 B (-TR)
PACKAGE: B: DPAK
2
VOLTAGE: 600: 600V 800: 800V
SENSITIVITY: 10: 10mA 35: 35mA
G: D PAK H: IPAK
PACKING MODE: Blank:Tube
-TR: DPAK / D PAK Tape & Reel
Base
quantity
2
Packing
mode
BTA/BTB08-xxxyz BTA/BTB08xxxyz 2.3 g 250 Bulk BTA/BTB08-xxxyzRG BTA/BTB08-xxxyz 2.3 g 50 Tube T8yy-xxxB T8yyxxx 0.3 g 75 Tube T8yy-xxxB-TR T8yyxxx 0.3 g 2500 Tape & reel T8yy-xxxH T8yyxxx 0.4 g 75 Tube T8yy-xxxG T8yyxxx 1.5 g 50 Tube T8yy-xxxG-TR T8yyxxx 1.5 g 1000 Tape & reel
Note: xxx = voltage, yy = sensitivity, z = type
4/10
BTA/BTB08 and T8 Series
Fig. 1: Maximum power dissipation versus RMS
on-state current (full cycle).
P (W)
10
9 8 7 6 5 4 3 2 1 0
012345678
IT(RMS)(A)
Fig. 2-2: RMS on-state current versus ambient temperature (printed circuit board FR4, copper
thickness: 35µm),full cycle.
IT(RMS) (A)
3.5
2
3.0
2.5
2.0
1.5
1.0
0.5
0.0 0 25 50 75 100 125
DPAK
(S=1cm )
DPAK
(S=0.5cm )
2
2
Tamb(°C)
Fig. 2-1: RMS on-state current versus case temperature (full cycle).
IT(RMS) (A)
10
9
BTB/T8
8 7 6
BTA
5 4 3 2 1 0
0 25 50 75 100 125
Tc(°C)
Fig. 3: Relative variation of thermal impedance versus pulse duration.
K=[Zth/Rth]
1E+0
1E-1
1E-2
1E-3
Zth(j-c)
DPAK/IPAK
Zth(j-a)
TO-220AB/D²PAK
Zth(j-a)
tp(s)
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
Fig. 4: On-state characteristics (maximum values).
ITM (A)
100
Tj max. Vto = 0.85V Rd = 50 m
Ω
10
1
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Tj=Tj max
Tj=25°C
VTM(V)
Fig. 5: Surge peak on-state current versus number of cycles.
ITSM (A)
90 80 70 60 50 40 30
Repetitive Tc=100°C
Non repetitive Tj initial=25°C
20 10
0
1 10 100 1000
Number of cycles
t=20ms
One cycle
5/10
BTA/BTB08 and T8 Series
Fig. 6: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width
tp < 10ms, and corresponding value of I²t.
ITSM (A), I²t (A²s)
1000
dI/dt limitation:
50A/µs
100
tp (ms)
10
0.01 0.10 1.00 10.00
Tj initial=25°C
ITSM
I²t
Fig. 8-1: Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values). Snubberless & Logic Lev el Types
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.2
2.0
TW
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.1 1.0 10.0 100.0
(dV/dt)c (V/µs)
T835/CW/BW
T810/SW
Fig. 7: Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values).
IGT,IH,IL[Tj] / IGT,IH,IL [Tj=25°C]
2.5
2.0
IGT
1.5
1.0
IH & IL
0.5
Tj(°C)
0.0
-40 -20 0 20 40 60 80 100 120 140
Fig. 8-2: Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values). Standard Types
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
C
B
(dV/dt)c (V/µs)
0.1 1.0 10.0 100.0
Fig. 9: Relative variation of critical rate of decrease of main current versus junction temperature.
(dI/dt)c [Tj] / (dI/dt)c [Tj specified]
6 5 4 3 2 1 0
0 25 50 75 100 125
6/10
Tj(°C)
Fig. 10: DPAK and D
2
PAK Thermal resistance junction to ambien t versus copper surface under tab (printed circuit board FR4, copper thickness: 35 µm).
Rth(j-a) (°C/W)
100
90 80 70 60 50 40 30 20 10
0
0 4 8 1216202428323640
DPAK
D²PAK
S(cm²)
PACKAGE MECHANICAL DAT A
DPAK (Plastic)
BTA/BTB08 and T8 Series
DIMENSIONS
FOOTPRINT DIMENSIONS (in millimete r s )
DPAK (Plastic)
REF.
A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212
C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.018 0.023
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.251 0.259
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.397 L2 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039
R 0.2 typ. 0.007 typ.
V2 0° 8° 0° 8°
Millimeters Inches
Min. Max Min. Max.
6.7
6.7
3
3
1.61.6
2.32.3
7/10
BTA/BTB08 and T8 Series
PACKAGE MECHANICAL DAT A
D²PAK (Plastic)
E
L2
L
L3
A1
B2 B
G
2.0 MIN. FLAT ZONE
C2
DIMENSIONS
A
REF.
Millimeters Inches
Min. T yp. Max. Min. Typ. Max.
A 4.30 4.60 0.169 0.181
A1 2.49 2.69 0.098 0.106
D
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
B2 1.25 1.40 0.048 0.055
C 0.45 0.60 0.017 0.024
C
R
C2 1.21 1.36 0.047 0.054
D 8.95 9.35 0.352 0.368 E 10.00 10.28 0.393 0.405
G 4.88 5.28 0.192 0.208
A2
L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069
V2
R 0.40 0.016
V2 0° 8° 0° 8°
FOOTPRINT DIMENSIONS (in millimete r s )
D²PAK (Plastic)
16.90
10.30
1.30
3.70
8.90
5.08
8/10
PACKAGE MECHANICAL DAT A
IPAK (Plastic)
BTA/BTB08 and T8 Series
DIMENSIONS
REF.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A
E
B2
L2
C2
A 2.2 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A3 0.7 1.3 0.027 0.051
B 0.64 0.9 0.025 0.035 B2 5.2 5.4 0.204 0.212 B3 0.85 0.033
D
B5 0.3 0.035 B6 0.95 0.037
C 0.45 0.6 0.017 0.023
H
L1
L
B6
B3 B
V1
A1
C2 0.48 0.6 0.019 0.023
D 6 6.2 0.236 0.244
E 6.4 6.6 0.252 0.260
G 4.4 4.6 0.173 0.181
B5
G
C A3
H 15.9 16.3 0.626 0.641
L 9 9.4 0.354 0.370 L1 0.8 1.2 0.031 0.047 L2 0.8 1 0.031 0.039 V1 10° 10°
9/10
BTA/BTB08 and T8 Series
PACKAGE MECHANICAL DAT A
TO-220AB Ins.
B
C
b2
REF.
Millimeters Inches
DIMENSION S
Min. Typ. Max. Min. Typ. Max.
L
I
A
F
A 15.20 15.90 0.598 0.625 a1 3.75 0.147 a2 13.00 14.00 0.511 0.55 1
B 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.02 4 0.034
l4
b2 1.23 1.32 0.04 8 0.051
C 4.40 4 .60 0.173 0.181
a1
l3
l2
a2
c2
c1 0.49 0 .70 0.019 0.027 c2 2.40 2 .72 0.094 0.107
e 2.40 2.70 0.09 4 0.106
F 6.20 6.60 0.244 0.259
I 3.75 3.85 0.147 0.151
I4 1 5.80 16.40 16.80 0.622 0.646 0.661
L 2.65 2.95 0.10 4 0.116
b1
e
M
c1
l2 1.14 1 .70 0.044 0.066 l3 1.14 1 .70 0.044 0.066 M 2.60 0.102
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