Triguard SC300E
MDO16GNS
16-Channel Digital Output Module
48Vdc
(MDO16GNS)
INTRODUCTION
PURPOSE
Issue 2
October 2005
The 48Vdc Digital Output Module MDO16GNS provides the output control interface between
SC300E processing environment and up to 16 field items. All field outputs from the module
the
are
galvanically isolated from the system.
Circuit triplication and voting procedures make the module single-fault tolerant and latent
testing ensures that the failure of a normally ‘ON’ (energised) or ‘OFF’ channel will be
recognised and
the circuit ‘on-line’ status and the health of the module.
The module, which is compatible with ‘dual slot hot repair’, can be fitted in any of the ten I/O
slots in the SC300E chassis. ‘Wrong slotting’ is prevented by physical coding
main processor software identifies the module via a built-in hardware identifier.
Channel outputs leave the module via the DIN 41612 ‘rear plug-up’ system on the chassis
backplane.
This document is intended to provide a general understanding of the function of the module
sufficient to enable basic maintenance operations to be effected in the field.
reported to the system. Front panel indicators show the state of all channels,
ASSOCIATED DOCUMENTATION
. The SC300E
008-5097
008-5143
Reference No
Chassis User Manual
T
DO16AIE 16-Channel Digital Output Termination Card
Introduced Power, 48Vdc User Manual
008-5141
Title
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Mechanical coding
block (Upper)
ConfigurationLinks
Link3
ICC
B
HL
V
321
HW
GTZ
320
Link 1
Connector
J1
Common Interface (CI)
Module
Connector J2
Figure 1-1 General view and front panel detail
Connector J3
Mechanical coding
block (Lower)
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SPECIFICATION
Model
MDO16GNS
Channels
Architecture
Indicators:
Output driver FET
Voltage range
Voltage drop
Maximum drive
Surge limiting
Isolation
Minimum load per output
Module power consumption excluding field
power dissipation in module
Module power consumption including field
power dissipation in module
Overall size (mm)
Overall
Input
Modules
size (inches)
16
TMR
One per point
Health, 3 xOn
48Vdc ±10%
Less than 3V
Resistive load: 1A per channel
Tungsten load: 0.125A per channel
3A peak
1kVdc field to system, commoned supply
12mA (24mA if dual slot hot repair)
4W
6W @ minimum load
36W @ maximum load
400(9U)H x 397L x 28W
15.75H x 15.63L x 1.1W
Line
Weight
ENVIRONMENTAL SPECIF
The maximum ambient temperature measured at the hottest point within the Triguard system
shall
Temperature operating:
Temperature
Humidity
EMC/RFI
Vibration/Shock
Certification:
Gene
2.1kg
ICATIONS
not be greater than 60 degrees centigrade.
storage:
Immunity
ral Certification: Ref. SC300E TMR Product Guide (ref 008-5209).
+5°C to +60°C
-
25°C to +70°C
5% to 95% non-condensing at ambient <40°C
Tested and certified to IEC 1131-Part 2 1994
Tested and certified to IEC 1131-Part 2 1994
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TRANSPORT AND HANDLING
The MDO16GNS must be transported and stored in its original packing material which should
be
retained for this purpose.
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TECHNICAL DESCRIPTIO
N
PHYSICAL
The MDO16GNS is a 9U high module with integral front panel and rear connectors. A
daughterboard carries the common interface circuits. Figure 1-1 shows the general layout,
including the location of the connectors and front panel details.
Mechanical coding blocks
All Input/Output modules carry two coder blocks equipped with pins which mate with holes in
corresponding
The
pins in the module blocks are factory installed in a pattern determined by the module and
corresponding
holes
are plugged with set screws. The chassis slot coder block configuration for this module
is shown in Figure 2-1
blocks in the chassis and prevent the module being inserted into the wrong slot.
set screws are removed from the chassis coder blocks to enable fitting. Unused
.
Figure 2-1 Chassis slot coder blocks configuration
EXTERNAL CONNECTIONS
Field Circuits
The field load circuit shown in Figure 2-2 is the typical required for the safe connection of field
loads
to
the MDO16GNS. For any unused channel a dummy field load (value 10k ohm) should
be used. We however, recommend the use of their 16-Channel Digital Output Termination
Card TDO16AIE which offers full connection facilities with dummy loads, indicating fuses and
alarm
outputs (See Section 1.2, Associated documentation).
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Figure 2-2 Basic field load circuit
Module connectors
The system bus connector is J1 and the common interface is connected via J4 and J5 (not
shown).
diagram (Figure 2-3 ) the following symbols are used:
All other pins on J3 are connected to field supply return but this field supply return may not be
All the digital outputs are routed through connector J2. In the external connection
0
x = Connector pin
Earth =
+ve
-
ve
O/P = Channel output
= First mate (long pin)
Connected to chassis
=
= Field supply return
J3 pin 1c is connected to earth.
Field supply in
WARNING
at earth potential
.
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Figure 2-3 Field output connector J2 pinouts
Connector J3 pin 1c is connected to earth.
All other pins on J3 are connected to field supply return.
THEORY OF OPERATION
The channel output command information from the main processor follows three identical paths
through
the common interface. In order to minimise the number of data connections across
system-to-field barrier, the channel data are converted to serial form before entering the module
from the common interface. In this manner 16 output channels can be served by just three
paths instead of 48.
The three data streams are each applied to opto-isolators which mark the interface between
the system and field sides of the circuit and provide a system-to-field channel isolation of 1kV.
the MDO16GNS (see Figure 2-4 ), each path is controlled by its own microcontroller in
the 1kV
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The data streams are then applied to the 16-bit output shift registers. The serial bits are
clocked s
then latch the data and present it on the 16-bit busses (CHANA, CHANB and CHANC) to the
output
of the SC300E system.
The output switch for each channel comprises six FETs connected in the series/parallel
network shown and providing 2 out of 3 majority voting between the three paths A, B and C. A
front panel LED at the switch output is lit when the switch is closed. Voltage and current
monitoring circuits are also connected to the switches to provide outputs for the Latent Fault
Detection
registers and o
the
Testing of the output switches by the LFD circuits is co-ordinated by the microcontrollers on
the
confirm no faults present, the SC300E processors (main processors) will instruct each
microcontroller in turn to switch its output alone to the opposite state and confirm the correct
operation of its individual output switch.
The module power requirements are served from two different sources. The power for the
output-side circuits is derived from the chassis 12V supply via dc/dc converters. All of the
supplies are monitored. Electronic fuse circuits sense the current in each output path and cut
off the upper FET if the current exceeds a predetermined limit.
uccessively into the shift registers until the 16th bit has been received. The registers
switches. The data is continuously refreshed in this manner and updated at each scan
(LFD) system. These outputs are fed back to the microcontrollers via dedicated shift
pto-isolators. The feedback information confirms that the output has switched to
commanded state and that the line is not open or short circuit.
common i
nterface. When all outputs are in the healthy condition and the microcontrollers
An On/Off Line Request switch on the front panel enables a request to be sent to the SC300E
system that the module be ta
module contains a hardware identity circuit that enables system identification of the module,
and
three manual links 1, 2 and 3. Link 1 allows the module to be set up for 321 or 320 mode
operat
ion which sets the threshold that determines how much of the circuit can be degraded
while
still preserving overall operation. 320 mode means that the system will continue to
function with two out of three serviceable circuits. If the number falls to one out of
read data is maintained. In 321 mode the system will continue to function with one out of three
serviceable
line.
Link 2 (HLV/GTZ) determines whether,in the event of a failure due to 321/320 action, the last
read values are held (HLV) or are set to zero (GTZ). Link 2 is only active however, if Link 3
(ICCB/HW) is set to HW. If Link 3 is set to ICCB Link 2 is ignored and its function determined
by soft
circuits. If that fails the last read data is maintained and the module is taken off
ware.
ken off-line for maintenance purposes or returned on-line. The
three the last
-
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DC
Figure 2-4. MDO16GNS –
Block Diagram
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Common Interface
The three discrete control circuits in the common interface (A, B, and C) are each responsible
for the control of the corresponding one third of the I/O module circuits. Each control circui
comprises a microcontroller with a dedicated watchdog, data buffers and shared RAM. The
circuit is powered via the module and permits live insertion of replacement modules.
The microcontrollers co-ordinate I/O signal processing diagnostics, on-line/off-line status and
signal status read/write cycles to and from the SC300E processors via an I/O communications
bus.
All I/O modules have an identification code which is read by the common interface and
passed
main processors. If, for maintenance purposes, the On/Off Line Request switch on the front of
the
to the main processors which may then grant the request. The watchdog on each
microcontroller extinguishes the Health LED on the I/O module front panel in the event of a
microcontroller failure, LFD failure or a voting discrepancy.
to
the main processors for verification. The on-li
module is operated, the action is read by all three microcontrollers and the request passed
ne/off-line status is determined by the
t
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Figure 2-5 Common interface -
Block diagram
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SERVICING
SCOPE
Repair is by module replacement. Faulty modules are not repairable in the field. They should be
replaced by new modules and returned for repair.
CAUTION 1
Before fitting a new module ensure that the setting of the configuration links
that on the old module.
This module contains components that may be electrostatically sensitive. It should be
transported and stored in its original packaging material.
CAUTION 2
are the same as
DIAGNOSIS
The TriBuild workstation is used for fault diagnosis. In the case of an Input/Output fault the
Health LED on the faulty module will be extinguished.
PREPARATION
To ascertain whether the chassis I/O slot containing the faulty module has been allocated a
hot repair partner, use one of the following methods:
•
• Check the chassis wiring configuration
• Use the I/O chassis Configuration Report on the TriBuild workstation.
Where there is a hot repair partner allocation, use the ‘D
otherwise use the ‘Single-slot hot repair’ procedure.
Check the system drawings
ual-slot hot repair’ procedure,
CONFIGURATION
Before fitting a new module ensure that 321/320 link setting is the same as that on the old
module.
REMOVAL AND REPLACEMENT
CAUTION 3
Failure to take the faulty module off-line before removing it from the chassis could trigger a fault
alarm.
CAUTION 4
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When inserting a module ensure that it is aligned with the markings on the chassis rails and
that
it
module
engages with the top and bottom guides. Improper insertion may cause damage to the
and/or chassis conne
ctors.
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SINGLE-SLOT HOT REPAIR
1.
Operate the On/Off Line Request switch on the faulty module. The three On Line LEDs
should
all extinguish to indicate that the main processors have recognised the request
and taken the module off-line. The last read data input from the module will be
maintained until the new module is on-line.
2.
Slacken the two module securing screws and use the black ejection levers (top and
bottom) to draw the module from its slot.
3.
Insert the new module ensuring that it engages properly in the upper and lower guides
in the chassis. The top and bottom chassis rails carry alignment marks to assist. Pull
out the ejection levers and as the module is pushed back engage the levers on the
chassis rails. The levers should then be used to draw the module into position, some
resistance will be felt as the rear connector pins engage. The module should be fixed
in position with the securing screws.
4.
Operate the On/Off Line Request switch and check that the three On Line LEDs
illuminate for one s
to indicate that the module has been put on-line. If the LEDs do not illuminate either
the first or second time or fail to remain illuminated, then the module must be
considered faulty.
econd, extinguish for one second and then illuminate permanently
DUAL-SLOT HOT REPAIR
1.
Insert the new module into the vacant hot repair slot ensuring that it engages properly
in the upper and lower guides in the chassis. The top and bottom chassis rails carry
alignment marks to assist. Pull out the ejection levers and as the module is pushed
back engage the levers on the chassis rails. The levers should then be used to draw
the module into position, some resistance will be felt as the rear connector pins
engage. The module should be fixed in position with the securing screws.
2.
Operate the On/Off Line Request switch on the new module. Ascertain that the three
Line LEDs on the new module illuminate for one second, extinguish for one second
On
and then illuminate permanently as the LEDs on the old module extinguish. This
se
quence indicates that the new module has been put on line and the old module
taken off-line. If the LEDs on the new module do not illuminate either the first or second
time
or
fail to remain illuminated, the new module must be regarded as faulty. The old
3.
module’s
If the new module is serviceable slacken the screws on the old module and use its
ejection levers to remove it from the chassis.
LEDs should remain illuminated indicating that it is still on-line.
PREVENTIVE MAINTENAN
CE
No preventive maintenanc
e is necessary.
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SERVICE SUPPORT
SPARES
Spare parts and technical advice can be obtained from your local area offices
.
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