Quectel Wireless Solutions 2019SC600NA User Manual

SC600Y&SC600T
Hardware Design
Smart LTE Module Series
Rev: SC600Y&SC600T_Hardware_Design_V1.0
Date: 2019-07-01
www.quectel.com
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GENERAL NOTES
QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION
PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT
TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE.
COPYRIGHT
THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN.
Copyright © Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved.
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About the Document
History
Revision
Date
Author
Description
1.0
2019-07-01
Light WANG/ Rock CHEN
Initial
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Contents
About the Document ................................................................................................................................... 2
Contents ....................................................................................................................................................... 3
Table Index ................................................................................................................................................... 6
Figure Index ................................................................................................................................................. 8
1 Introduction ........................................................................................................................................ 14
1.1. Safety Information ..................................................................................................................... 15
2 Product Concept ................................................................................................................................ 16
2.1. General Description .................................................................................................................. 16
2.2. Key Features ............................................................................................................................. 19
2.3. Functional Diagram ................................................................................................................... 23
2.4. Evaluation Board ....................................................................................................................... 24
3 Application Interfaces ....................................................................................................................... 25
3.1. General Description .................................................................................................................. 25
3.2. Pin Assignment ......................................................................................................................... 26
3.3. Pin Description .......................................................................................................................... 27
3.4. Power Supply ............................................................................................................................ 43
3.4.1. Power Supply Pins ......................................................................................................... 43
3.4.2. Decrease Voltage Drop .................................................................................................. 43
3.4.3. Reference Design for Power Supply .............................................................................. 44
3.5. Turn on and off Scenarios ......................................................................................................... 45
3.5.1. Turn on Module Using the PWRKEY ............................................................................. 45
3.5.2. Turn off Module .............................................................................................................. 47
3.6. VRTC Interface ......................................................................................................................... 48
3.7. Power Output ............................................................................................................................ 49
3.8. Battery Charge and Management ............................................................................................. 49
3.9. USB Interface ............................................................................................................................ 51
3.10. UART Interfaces ........................................................................................................................ 54
3.11. (U)SIM Interfaces ...................................................................................................................... 56
3.12. SD Card Interface ..................................................................................................................... 58
3.13. GPIO Interfaces ........................................................................................................................ 60
3.14. I2C Interfaces ............................................................................................................................ 63
3.15. I2S Interface .............................................................................................................................. 64
3.16. SPI Interfaces ............................................................................................................................ 64
3.17. ADC Interfaces .......................................................................................................................... 65
3.18. Vibrator Drive Interface ............................................................................................................. 65
3.19. LCM Interfaces .......................................................................................................................... 66
3.20. Touch Panel Interfaces ............................................................................................................. 70
3.21. Camera Interfaces..................................................................................................................... 71
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3.21.1. Design Considerations ................................................................................................... 77
3.21.2. Flashlight Interfaces ....................................................................................................... 79
3.22. Sensor Interfaces ...................................................................................................................... 80
3.23. Audio Interfaces ........................................................................................................................ 80
3.23.1. Reference Circuit Design for Microphone Interfaces ..................................................... 82
3.23.2. Reference Circuit Design for Earpiece Interface ........................................................... 83
3.23.3. Reference Circuit Design for Headphone Interface ....................................................... 83
3.23.4. Reference Circuit Design for Loudspeaker Interface..................................................... 84
3.23.5. Audio Interfaces Design Considerations........................................................................ 84
3.24. Emergency Download Interface ................................................................................................ 85
4 Wi-Fi and BT ....................................................................................................................................... 86
4.1. Wi-Fi Overview .......................................................................................................................... 86
4.1.1. Wi-Fi Performance ......................................................................................................... 86
4.2. BT Overview .............................................................................................................................. 88
4.2.1. BT Performance ............................................................................................................. 89
5 GNSS ................................................................................................................................................... 90
5.1. GNSS Performance .................................................................................................................. 90
5.2. GNSS RF Design Guidelines .................................................................................................... 91
6 Antenna Interfaces ............................................................................................................................. 92
6.1. Main/Rx-diversity Antenna Interfaces ....................................................................................... 92
6.1.1. Main and Rx-diversity Antenna Interfaces Reference Design ....................................... 95
6.1.2. Reference Design of RF Layout..................................................................................... 96
6.2. Wi-Fi/BT Antenna Interface ....................................................................................................... 98
6.3. GNSS Antenna Interface ........................................................................................................... 99
6.3.1. Recommended Circuit for Passive Antenna .................................................................. 99
6.3.2. Recommended Circuit for Active Antenna ................................................................... 100
6.4. Antenna Installation ................................................................................................................. 100
6.4.1. Antenna Requirements ................................................................................................ 100
6.4.2. Recommended RF Connector for Antenna Installation ............................................... 101
7 Electrical, Reliability and Radio Characteristics .......................................................................... 103
7.1. Absolute Maximum Ratings .................................................................................................... 103
7.2. Power Supply Ratings ............................................................................................................. 103
7.3. Operation and Storage Temperatures ..................................................................................... 104
7.4. Current Consumption .............................................................................................................. 105
7.5. RF Output Power .....................................................................................................................111
7.6. RF Receiving Sensitivity ......................................................................................................... 114
7.7. Electrostatic Discharge ........................................................................................................... 116
8 Mechanical Dimensions .................................................................................................................. 118
8.1. Mechanical Dimensions of the Module ................................................................................... 118
8.2. Recommended Footprint ........................................................................................................ 120
8.3. Top and Bottom View of the Module ....................................................................................... 121
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9 Storage, Manufacturing and Packaging ........................................................................................ 122
9.1. Storage .................................................................................................................................... 122
9.2. Manufacturing and Soldering .................................................................................................. 123
9.3. Packaging ............................................................................................................................... 124
10 Appendix A References ................................................................................................................... 126
11 Appendix B GPRS Coding Schemes ............................................................................................. 129
12 Appendix C GPRS Multi-slot Classes ............................................................................................ 130
13 Appendix D EDGE Modulation and Coding Schemes ................................................................. 132
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Table Index
TABLE 1: SC600Y-EM*/SC600T-EM* FREQUENCY BANDS .......................................................................... 16
TABLE 2: SC600Y-NA*/SC600T-NA* FREQUENCY BANDS ........................................................................... 17
TABLE 3: SC600Y-JP*/SC600T-JP* FREQUENCY BANDS ............................................................................. 17
TABLE 4: SC600Y-WF*/SC600T-WF* FREQUENCY BANDS .......................................................................... 18
TABLE 5: SC600Y&SC600T KEY FEATURES ................................................................................................. 19
TABLE 6: I/O PARAMETERS DEFINITION ....................................................................................................... 27
TABLE 7: PIN DESCRIPTION ........................................................................................................................... 27
TABLE 8: POWER DESCRIPTION ................................................................................................................... 49
TABLE 9: PIN DEFINITION OF CHARGING INTERFACE ............................................................................... 50
TABLE 10: PIN DEFINITION OF USB INTERFACE ......................................................................................... 52
TABLE 11: USB TRACE LENGTH INSIDE THE MODULE ............................................................................... 54
TABLE 12: PIN DEFINITION OF UART INTERFACES ..................................................................................... 54
TABLE 13: PIN DEFINITION OF (U)SIM INTERFACES ................................................................................... 56
TABLE 14: PIN DEFINITION OF SD CARD INTERFACE ................................................................................ 59
TABLE 15: SD CARD SIGNAL TRACE LENGTH INSIDE THE MODULE ....................................................... 60
TABLE 16: PIN DEFINITION OF GPIO INTERFACES ..................................................................................... 60
TABLE 17: PIN DEFINITION OF I2C INTERFACES ......................................................................................... 63
TABLE 18: PIN DEFINITION OF I2S INTERFACE ........................................................................................... 64
TABLE 19: PIN DEFINITION OF SPI INTERFACES ........................................................................................ 65
TABLE 20: PIN DEFINITION OF ADC INTERFACES ....................................................................................... 65
TABLE 21: PIN DEFINITION OF VIBRATOR DRIVE INTERFACE .................................................................. 66
TABLE 22: PIN DEFINITION OF LCM INTERFACES ....................................................................................... 66
TABLE 23: PIN DEFINITION OF TOUCH PANEL INTERFACES ..................................................................... 70
TABLE 24: PIN DEFINITION OF CAMERA INTERFACES ............................................................................... 72
TABLE 25: MIPI TRACE LENGTH INSIDE THE MODULE............................................................................... 77
TABLE 26: PIN DEFINITION OF FLASHLIGHT INTERFACES ........................................................................ 79
TABLE 27: PIN DEFINITION OF SENSOR INTERFACES ............................................................................... 80
TABLE 28: PIN DEFINITION OF AUDIO INTERFACES ................................................................................... 81
TABLE 29: WI-FI TRANSMITTING PERFORMANCE ....................................................................................... 86
TABLE 30: WI-FI RECEIVING PERFORMANCE .............................................................................................. 87
TABLE 31: BT DATA RATE AND VERSIONS .................................................................................................... 89
TABLE 32: BT TRANSMITTING AND RECEIVING PERFORMANCE ............................................................. 89
TABLE 33: GNSS PERFORMANCE ................................................................................................................. 90
TABLE 34: PIN DEFINITION OF MAIN/RX-DIVERSITY ANTENNA INTERFACES ......................................... 92
TABLE 35: SC600Y-JP*/SC600T-JP* MODULE OPERATING FREQUENCIES .............................................. 92
TABLE 36: SC600Y-EM*/SC600T-EM* MODULE OPERATING FREQUENCIES............................................ 93
TABLE 37: SC600Y-NA*/SC600T-NA* MODULE OPERATING FREQUENCIES ............................................ 94
TABLE 38: PIN DEFINITION OF WI-FI/BT ANTENNA INTERFACE ................................................................ 98
TABLE 39: WI-FI/BT FREQUENCY................................................................................................................... 98
TABLE 40: PIN DEFINITION OF GNSS ANTENNA .......................................................................................... 99
TABLE 41: GNSS FREQUENCY ....................................................................................................................... 99
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TABLE 42: ANTENNA REQUIREMENTS ........................................................................................................ 100
TABLE 43: ABSOLUTE MAXIMUM RATINGS ................................................................................................ 103
TABLE 44: SC600Y&SC600T MODULES POWER SUPPLY RATINGS ........................................................ 103
TABLE 45: OPERATION AND STORAGE TEMPERATURES ........................................................................ 104
TABLE 46: SC600Y-JP*/SC600T-JP* CURRENT CONSUMPTION ............................................................... 105
TABLE 47: SC600Y-EM*/SC600T-EM* CURRENT CONSUMPTION ............................................................ 106
TABLE 48: SC600Y-NA*/SC600T-NA* CURRENT CONSUMPTION .............................................................. 110
TABLE 49: SC600Y-JP*/SC600T-JP* RF OUTPUT POWER .......................................................................... 111
TABLE 50: SC600Y-EM*/SC600T-EM* RF OUTPUT POWER ........................................................................ 112
TABLE 51: SC600Y-NA*/SC600T-NA* RF OUTPUT POWER ......................................................................... 113
TABLE 52: SC600Y-JP*/SC600T-JP* RF RECEIVING SENSITIVITY ............................................................. 114
TABLE 53: SC600Y-EM*/SC600T-EM* RF RECEIVING SENSITIVITY .......................................................... 115
TABLE 54: SC600Y-NA*/SC600T-NA* RF RECEIVING SENSITIVITY ........................................................... 116
TABLE 55: ESD CHARACTERISTICS (TEMPERATURE: 25°C , HUMIDITY: 45%) ........................................ 117
TABLE 56: RECOMMENDED THERMAL PROFILE PARAMETERS ............................................................. 123
TABLE 57: REEL PACKAGING ....................................................................................................................... 125
TABLE 58: RELATED DOCUMENTS .............................................................................................................. 126
TABLE 59: TERMS AND ABBREVIATIONS .................................................................................................... 126
TABLE 60: DESCRIPTION OF DIFFERENT CODING SCHEMES ................................................................ 129
TABLE 61: GPRS MULTI-SLOT CLASSES .................................................................................................... 130
TABLE 62: EDGE MODULATION AND CODING SCHEMES ......................................................................... 132
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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 23
FIGURE 2: PIN ASSIGNMENT (TOP VIEW)..................................................................................................... 26
FIGURE 3: VOLTAGE DROP SAMPLE ............................................................................................................. 43
FIGURE 4: STAR STRUCTURE OF POWER SUPPLY .................................................................................... 44
FIGURE 5: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 45
FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................... 46
FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ........................................................................... 46
FIGURE 8: TIMING OF TURNING ON MODULE ............................................................................................. 47
FIGURE 9: TIMING OF TURNING OFF MODULE ........................................................................................... 48
FIGURE 10: RTC POWERED BY COIN CELL ................................................................................................. 48
FIGURE 11: REFERENCE DESIGN FOR BATTERY CHARGING CIRCUIT ................................................... 51
FIGURE 12: USB 2.0 INTERFACE REFERENCE DESIGN ............................................................................. 53
FIGURE 13: USB TYPE-C INTERFACE REFERENCE DESIGN ..................................................................... 53
FIGURE 14: REFERENCE CIRCUIT WITH LEVEL TRANSLATOR CHIP (FOR UART5) .............................. 55
FIGURE 15: RS232 LEVEL MATCH CIRCUIT (FOR UART5) .......................................................................... 56
FIGURE 16: REFERENCE CIRCUIT FOR (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR
................................................................................................................................................................... 57
FIGURE 17: REFERENCE CIRCUIT FOR (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR
................................................................................................................................................................... 58
FIGURE 18: REFERENCE CIRCUIT FOR SD CARD INTERFACE ................................................................. 59
FIGURE 19: REFERENCE CIRCUIT FOR VIBRATOR CONNECTION ........................................................... 66
FIGURE 20: REFERENCE CIRCUIT DESIGN FOR LCM0 INTERFACE ......................................................... 68
FIGURE 21: REFERENCE CIRCUIT DESIGN FOR LCM1 INTERFACE ......................................................... 69
FIGURE 22: REFERENCE DESIGN OF LCM1 EXTERNAL BACKLIGHT DRIVING CIRCUIT ....................... 70
FIGURE 23: REFERENCE CIRCUIT DESIGN FOR TOUCH PANEL INTERFACES ....................................... 71
FIGURE 24: REFERENCE CIRCUIT DESIGN FOR TWO-CAMERA APPLICATIONS .................................... 75
FIGURE 25: REFERENCE CIRCUIT DESIGN FOR THREE-CAMERA APPLICATIONS ................................ 76
FIGURE 26: REFERENCE CIRCUIT DESIGN FOR FLASHLIGHT INTERFACES .......................................... 80
FIGURE 27: REFERENCE CIRCUIT DESIGN FOR ANALOG ECM-TYPE MICROPHONE ........................... 82
FIGURE 28: REFERENCE CIRCUIT DESIGN FOR MEMS-TYPE MICROPHONE ........................................ 82
FIGURE 29: REFERENCE CIRCUIT DESIGN FOR EARPIECE INTERFACE ................................................ 83
FIGURE 30: REFERENCE CIRCUIT DESIGN FOR HEADPHONE INTERFACE ........................................... 83
FIGURE 31: REFERENCE CIRCUIT DESIGN FOR LOUDSPEAKER INTERFACE ....................................... 84
FIGURE 32: REFERENCE CIRCUIT DESIGN FOR EMERGENCY DOWNLOAD INTERFACE ..................... 85
FIGURE 33: REFERENCE CIRCUIT DESIGN FOR MAIN AND RX-DIVERSITY ANTENNA INTERFACES .. 95
FIGURE 34: MICROSTRIP DESIGN ON A 2-LAYER PCB ............................................................................... 96
FIGURE 35: COPLANAR WAVEGUIDE DESIGN ON A 2-LAYER PCB ........................................................... 96
FIGURE 36: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND)
................................................................................................................................................................... 97
FIGURE 37: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND)
................................................................................................................................................................... 97
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FIGURE 38: REFERENCE CIRCUIT DESIGN FOR WI-FI/BT ANTENNA INTERFACE .................................. 98
FIGURE 39: REFERENCE CIRCUIT DESIGN FOR GNSS PASSIVE ANTENNA ........................................... 99
FIGURE 40: REFERENCE CIRCUIT DESIGN FOR GNSS ACTIVE ANTENNA ........................................... 100
FIGURE 41: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) .............................................. 101
FIGURE 42: MECHANICALS OF U.FL-LP CONNECTORS ........................................................................... 102
FIGURE 43: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ......................................................... 102
FIGURE 44: MODULE TOP AND SIDE DIMENSIONS .................................................................................... 118
FIGURE 45: MODULE BOTTOM DIMENSIONS (TOP VIEW) ........................................................................ 119
FIGURE 46: RECOMMENDED FOOTPRINT (TOP VIEW) ............................................................................ 120
FIGURE 47: TOP VIEW OF SC600Y/SC600T MODULES ............................................................................. 121
FIGURE 48: BOTTOM VIEW OF SC600Y/SC600T MODULES ..................................................................... 121
FIGURE 49: RECOMMENDED REFLOW SOLDERING THERMAL PROFILE .............................................. 123
FIGURE 50: TAPE DIMENSIONS ................................................................................................................... 124
FIGURE 51: REEL DIMENSIONS ................................................................................................................... 125
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OEM/Integrators Installation Manual
Important Notice to OEM integrators
1. This module is limited to OEM installation ONLY.
2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).
3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations
4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.
End Product Labeling
When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: XMR2019SC600NA “Contains IC: 10224A-2019SC600NA The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met.
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In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the party responsible for compliance could void
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the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Industry Canada Statement
This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement."
The device could automatically discontinue transmission in case of absence of information to transmit, or operational failure. Note that this is not intended to prohibit transmission of control or signaling information or the use of repetitive codes where required by the technology.
The device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems; The maximum antenna gain permitted for devices in the bands 5250–5350 MHz and 5470–5725 MHz shall comply with the e.i.r.p. limit; and The maximum antenna gain permitted for devices in the band 5725–5825 MHz shall comply with the e.i.r.p. limits specified for point-to-point and non point-to-point operation as appropriate.
L'appareil peut interrompre automatiquement la transmission en cas d'absence d'informations à transmettre ou de panne opérationnelle. Notez que ceci n'est pas destiné à interdire la transmission d'informations de contrôle ou de signalisation ou l'utilisation de codes répétitifs lorsque cela est requis par la technologie.
Le dispositif utilisé dans la bande 5150-5250 MHz est réservé à une utilisation en intérieur afin de réduire le risque de brouillage préjudiciable aux systèmes mobiles par satellite dans le même canal; Le gain d'antenne maximal autorisé pour les dispositifs dans les bandes 5250-5350 MHz et 5470-5725 MHz doit être conforme à la norme e.r.p. limite; et Le gain d'antenne maximal autorisé pour les appareils de la bande 5725-5825 MHz doit être conforme à la norme e.i.r.p. les limites spécifiées pour un fonctionnement point à point et non point à point, selon le cas.
CAN ICES-3(B)/ NMB-3(B)
Radiation Exposure Statement
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This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.
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1 Introduction
This document defines the SC600Y&SC600T modules and describes their air interfaces and hardware interfaces which are connected with customers’ applications.
This document can help customers quickly understand module interface specifications, electrical and mechanical details as well as other related information of SC600Y&SC600T modules. Associated with application note and user guide, customers can use SC600Y&SC600T modules to design and set up mobile applications easily.
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1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating SC600Y&SC600T modules. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’ failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft.
Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc.
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2 Product Concept
2.1. General Description
SC600Y&SC600T are a series of Smart LTE modules based on Qualcomm platform and Android operating system, and provide industrial grade performance. Their general features are listed below:
Support worldwide LTE-FDD, LTE-TDD, DC-HSDPA, DC-HSUPA, HSPA+, HSDPA, HSUPA,
WCDMA, EDGE and GPRS coverage
Support short-range wireless communication via Wi-Fi 802.11a/b/g/n/ac and BT4.2 LE standards ⚫ Integrate GPS/GLONASS/BeiDou satellite positioning systems ⚫ Support multiple audio and video codecs ⚫ Built-in high performance AdrenoTM 506 graphics processing unit ⚫ Provide multiple audio and video input/output interfaces as well as abundant GPIO interfaces
SC600Y&SC600T modules are composed of standard version (SC600Y-XX) and high-performance version (SC600T-XX). They are available in SC600Y-EM*/ SC600T-EM*, SC600Y-NA*/ SC600T-NA*, SC600Y-JP*/ SC600T-JP*, SC600Y-WF*/ SC600T-WF*.
The following table shows the supported frequency bands of SC600Y&SC600T.
Table 1: SC600Y-EM*/SC600T-EM* Frequency Bands
Type
Frequency Bands
LTE-FDD
B1/B2/B3/B4/B5/B7/B8/B20/B28A/B28B
LTE-TDD
B38/B39/B40/B41
WCDMA
B1/B2/B4/B5/B8
TD-SCDMA
/
EVDO/CDMA
/
GSM
850/900/1800/1900MHz
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Wi-Fi 802.11a/b/g/n/ac
2402MHz~2482MHz; 5180MHz~5825MHz
BT4.2 LE
2402MHz~2480MHz
GNSS
GPS: 1575.42MHz±1.023MHz GLONASS: 1597.5MHz~1605.8MHz BeiDou: 1561.098MHz±2.046MHz
Table 2: SC600Y-NA*/SC600T-NA* Frequency Bands
Type
Frequency Bands
LTE-FDD
B2/B4/B5/B7/B12/B13/B14/B17/B25/B26/B66/B71
LTE-TDD
B41
WCDMA
B2/B4/B5
TD-SCDMA
/
EVDO/CDMA
/
GSM
/
Wi-Fi 802.11a/b/g/n/ac
2402MHz~2482MHz; 5180MHz~5825MHz
BT4.2 LE
2402MHz~2480MHz
GNSS
GPS: 1575.42MHz±1.023MHz GLONASS: 1597.5MHz~1605.8MHz BeiDou: 1561.098MHz±2.046MHz
Table 3: SC600Y-JP*/SC600T-JP* Frequency Bands
Type
Frequency Bands
LTE-FDD
B1/B3/B5/B8/B11/B18/B19/B21/B26/B28A/B28B
LTE-TDD
B41
WCDMA
B1/B6/B8/B19
TD-SCDMA
/
EVDO/CDMA
/
GSM
/
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Wi-Fi 802.11a/b/g/n/ac
2402MHz~2482MHz; 5180MHz~5825MHz
BT4.2 LE
2402MHz~2480MHz
GNSS
GPS: 1575.42MHz±1.023MHz GLONASS: 1597.5MHz~1605.8MHz BeiDou: 1561.098MHz±2.046MHz
Table 4: SC600Y-WF*/SC600T-WF* Frequency Bands
Type
Frequency Bands
LTE-FDD
/
LTE-TDD
/
WCDMA
/
TD-SCDMA
/
EVDO/CDMA
/
GSM
/
Wi-Fi 802.11a/b/g/n/ac
2402MHz~2482MHz; 5180MHz~5825MHz
BT4.2 LE
2402MHz~2480MHz
GNSS
/
“*” means under development.
SC600Y&SC600T are SMD-type modules which can be embedded into applications through its 323 pins (including 152 LCC pads and 171 LGA pads). With a compact profile of 43.0mm × 44.0mm × 2.85mm, SC600Y&SC600T can meet almost all requirements for M2M applications such as smart metering, smart home, security, routers, wireless POS, mobile computing devices, PDA phone, tablet PC, etc.
NOTE
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2.2. Key Features
The following table describes the detailed features of SC600Y&SC600T modules.
Table 5: SC600Y&SC600T Key Features
Features
Details
Application Processor
SC600Y-XX
Octa-core ARM Cortex-A53 64-bit CPU @1.8GHz Two quad-core processors with 512KB L2 cache
SC600T-XX
Octa-core ARM Cortex-A53 64-bit CPU @2.0GHz (high performance)
One quad-core with 1MB L2 cache ⚫ One quad-core with 512KB L2 cache
Modem system
Hexagon DSP v56 core up to 850MHz 768KB L2 cache
GPU
SC600Y-XX
AdrenoTM 506 with 64-bit addressing, designed for 600MHz
SC600T-XX
AdrenoTM 506 with 64-bit addressing, designed for 650MHz
Memory
16GB eMMC + 2GB LPDDR3 (default) 32GB eMMC + 4GB LPDDR3 (optional)
Operating System
Android OS 9.0
Power Supply
VBAT Supply Voltage: 3.55V~4.4V Typical: 3.8V
Transmitting Power
Class 4 (33dBm±2dB) for GSM850 Class 4 (33dBm±2dB) for EGSM900 Class 1 (30dBm±2dB) for DCS1800 Class 1 (30dBm±2dB) for PCS1900 Class E2 (27dBm±3dB) for GSM850 8-PSK Class E2 (27dBm±3dB) for EGSM900 8-PSK Class E2 (26dBm±3dB) for DCS1800 8-PSK Class E2 (26dBm±3dB) for PCS1900 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (24dBm+3/-1dB) for EVDO/CDMA BC0 Class 2 (24dBm+1/-3dB) for TD-SCDMA bands Class 3 (23dBm±2dB) for LTE-FDD bands Class 3 (23dBm±2dB) for LTE-TDD bands
LTE Features
Support 3GPP R8 Cat 6* and Cat 4 Support 1.4 to 20MHz RF bandwidth
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Support Multiuser MIMO in DL direction
Cat 6* FDD: Max 300Mbps (DL)/Max 50Mbps (UL) ⚫ Cat 6* TDD: Max 265Mbps (DL)/Max 30Mbps (UL) ⚫ Cat 4 FDD: Max 150Mbps (DL)/Max 50Mbps (UL) ⚫ Cat 4 TDD: Max 130Mbps (DL)/Max 30Mbps (UL)
UMTS Features
Support 3GPP R9 DC-HSDPA/DC-HSUPA/HSPA+/HSDPA/HSUPA/WCDMA Support QPSK, 16-QAM and 64-QAM modulation
DC-HSDPA: Max 42Mbps (DL) ⚫ DC-HSUPA: Max 11.2Mbps (UL) ⚫ WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL)
GSM Features
R99
CSD: 9.6kbps, 14.4kbps
GPRS
Support GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max 107Kbps (DL), 85.6Kbps (UL)
EDGE
Support EDGE multi-slot class 33 (33 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 Max 296Kbps (DL), 236.8Kbps (UL)
WLAN Features
2.4GHz/5GHz, support 802.11a/b/g/n/ac, maximally up to 433Mbps Support AP and STA mode
Bluetooth Features
BT4.2 LE
GNSS Features
GPS/GLONASS/BeiDou
SMS
Text and PDU mode Point-to-point MO and MT SMS cell broadcast
LCM Interfaces
Support two groups of 4-lane MIPI_DSI Support dual LCDs Support WUXGA up to (1920×1200) at 60fps Provide one high voltage output for powering a string of WLEDs Provide four drivers for sinking the current from WLED strings, and each sink current can reach up to 25mA
Camera Interfaces
Support three groups of 4-lane MIPI_CSI, up to 2.1Gbps per lane Support 3 cameras (4-lane + 4-lane + 4-lane) or 4 cameras (4-lane + 4-lane + 2-lane + 1-lane)
SC600Y-XX
up to 21MP with dual ISP
SC600T-XX
up to 24MP with dual ISP
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Video Codec
SC600Y-XX
Video encoding and decoding: up to 1080P @60fps Wi-Fi Video: encoding up to 1080P @30fps; decoding up to 1080P @60fps
SC600T-XX
Video encoding and decoding: up to 4K @30fps, up to 1080P @60fps Wi-Fi Video: encoding up to 1080P @30fps; decoding up to 1080P @60fps
Audio Interfaces
Audio Input
Three analog microphone inputs, integrating internal bias voltage
Audio Output
Class AB stereo headphone output Class AB earpiece differential output Class D speaker differential amplifier output
Audio Codec
G711, QCELP, EVRC, EVRC-B, EVRC-WB, AMR-NB, AMR-WB, GSM-EFR, GSM-FR, GSM-HR
USB Interface
Support with USB 3.0 or 2.0 specifications, with transmission rates up to 5Gbps on USB 3.0 and 480Mbps on USB 2.0. Support USB OTG Used for AT command communication, data transmission, software debugging and firmware upgrade
UART Interfaces
4 UART Interfaces: UART5, UART6, UART4 and UART2 UART5 & UART6: 4-wire UART interface with RTS/CTS hardware flow
control, baud rate up to 4Mbps
UART4: 2-wire UART interface ⚫ UART2: 2-wire UART interface used for debugging
Vibrator drive interface
Drive ERM vibrator
SD Card Interface
Support SD 3.0 Support SD card hot-plug
(U)SIM Interfaces
2 (U)SIM interfaces Support USIM/SIM card: 1.8V/2.95V Support Dual SIM Dual Standby (supported by default)
I2C Interfaces
Five I2C interfaces, used for peripherals such as TP, camera, sensor, etc.
I2S Interface
Support for I2S peripherals
Flashlight Interface
2 high current Flash and torch LED driver
1A each for Flash mode and 300mA each for torch mode by default ⚫ 1.5A each for Flash mode and 300mA each for torch mode maximally
ADC Interfaces
2 general purpose ADC interfaces Support up to 15-bit sampling accuracy
SPI Interfaces
Two SPI interfaces, only support master mode
One SPI interface used for peripheral device ⚫ One SPI interface used for sensor application, such as fingerprint sensors
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Charging Interface
Used for battery voltage detection, fuel gauge, battery temperature detection
Real Time Clock
Supported
Antenna Interfaces
Main antenna, Rx-diversity antenna, GNSS antenna and Wi-Fi/BT antenna interfaces
Physical Characteristics
Size: (43.0±0.15)mm × (44.0±0.15)mm × (2.85±0.2)mm Package: LCC + LGA Weight: approx. 13.0g
Temperature Range
Operating temperature range: -35°C ~ +65°C
1)
Extended temperature range: -40°C ~ +75°C
2)
Storage temperature range: -40°C ~ +90°C
Firmware Upgrade
Over USB interface
RoHS
All hardware components are fully compliant with EU RoHS directive
1. 1) Within operation temperature range, the module is 3GPP compliant.
2. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like P
out
might reduce in their value and exceed the specified tolerances. When the temperature returns to
the normal operating temperature levels, the module will meet 3GPP specifications again.
3. “*” means under development.
NOTES
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2.3. Functional Diagram
The following figure shows a block diagram of SC600Y&SC600T and illustrates the major functional parts.
Power management ⚫ Radio frequency ⚫ Baseband ⚫ LPDDR3+eMMC flash ⚫ Peripheral interfaces
-- USB interface
-- (U)SIM interfaces
-- UART interfaces
-- SD card interface
-- I2C interfaces
-- ADC interfaces
-- LCM (MIPI) interfaces
-- TP (touch panel) interfaces
-- Camera (MIPI) interfaces
-- Audio interfaces
Baseband
Tranceiver
WCN
LPDDR
eMMC
USB_VBUS
Battery
Flash
WLED
Motor
Charge
OTG
Boost
DIP
XO
ANT_ GNSS
ANT_WiFi/BT
GPIOs
I2C
SD 3.0
UART
2×(U)SIM
USB
2.0/3.0
3×CAM
2×TP2×LCM2×SPI
EAR
SPK
MICs ADCs
HK ADC
Flash
Haptics
RFCLK
BBCLK
MEM
Multimedia
Connectivity
Air Interface
Porcessors
Codec
Power
Signal
Power
Function
SAW
48MHz
5G FEM
Duplexs
PA
PAM
SAW
LNA
SAW
SAW
Switch
SAW
ANT_DRX
ANT_ MAIN
19. 2M XO
PMU
HK ADC
& MPPs
PWM
Headset
VRTC
VBAT
APT
VDD_RF
LED
PWRKEY
PMI
C1
SD_LDO11
USIM1_VDD
USIM2_VDD
LDO6_1P8 LDO5_1P8
SD_LDO12 LDO22_2P8 LDO10_2P8
LDO17_2P85
LDO23_1P2
LDO2_1P1
I2S
WLED IC
VPH_PWR
Figure 1: Functional Diagram
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2.4. Evaluation Board
In order to help customers develop applications with SC600Y&SC600T conveniently, Quectel supplies the evaluation board, USB to RS232 converter cable, USB Type-C data cable, power adapter, earphone, antenna and other peripherals to control or test the module. For more details, please refer to document
[1].
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3 Application Interfaces
3.1. General Description
SC600Y&SC600T are equipped with 323-pin 1.0mm pitch SMT pads that can be embedded into cellular application platform. The following chapters provide the detailed description of pins/interfaces listed below.
Power supply ⚫ VRTC interface ⚫ Charging interface ⚫ USB interface ⚫ UART interfaces ⚫ (U)SIM interfaces ⚫ SD card interface ⚫ GPIO interfaces ⚫ I2C interfaces ⚫ I2S interfaces ⚫ SPI interfaces ⚫ ADC interfaces ⚫ Vibrator drive interface ⚫ LCM interfaces ⚫ TP (touch panel) interfaces ⚫ Camera interfaces ⚫ Flashlight interfaces ⚫ Sensor interfaces ⚫ Audio interfaces ⚫ Emergency download interface
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3.2. Pin Assignment
The following figure shows the pin assignment of SC600Y&SC600T modules.
313
314
315
316
317
318
319
306
307
308
309
310
311
312
299
300
301
302
303
304
305
292
293
294
295
296
297
298
285
286
287
288
289
290
291
278
279
280
281
282
283
284
271
272
273
274
275
276
277
264
265
266
268
269
270
267
257
258
259
261
262
263
260
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
39
41
42
43
44
45
46
47
48
49
51
52
53
54
40
50
555657585960616263
64
323
321
322
2
4
25
26
27
29
28
30
31
32
33
34
35
36
37
38
656667
68
697071
72
737475
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
109
111
112
113
114
115
116
117
118
120
121
122
123
124
125
126
128
129
130
131
132
133
134
135
136
137
138
139
141
142
143
144
145
146
147
148
149
150
151
152
127
140
153
154
155
156
157
158
159
160
161
162
163
164
165
166
119
GND POWER AUDIO USB
(U)SIM SD TP LCM
CAMERA ANT UART GPIO
RESERVED
OTHERS
108
110
182
183
184
185
186
187
188
189
190
191
192
193
194
195
211
212
213
214
215
216
217
218
219
220
221
244
243
242
241
240
239
238
237
236
235
234
2 0 0
2 0 1
2 0 2
2 0 3
2 0 4
2 0 5
2 0 6
2 0 7
2 0 8
2 0 9
2 1 0
196
197
1 9 8
1 9 9
2 4 6
2 4 7
2 4 8
2 4 9
2 5 0
2 5 1
2 5 2
2 5 3
2 5 4
2 5 5
2 5 6
2 4 5
1 7 7
1 7 6
175
1 7 4
1 7 3
1 7 2
1 7 1
1 7 0
1 6 9
1 6 8
1 6 7
1 8 1
1 8 0
1 7 9
1 7 8
2 3 2
2 3 1
230
2 2 9
2 2 8
2 2 7
2 2 6
2 2 5
224
2 2 3
2 2 2
2 3 3
320
Figure 2: Pin Assignment (Top View)
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3.3. Pin Description
Table 6: I/O Parameters Definition
Type
Description
IO
Bidirectional
DI
Digital input
DO
Digital output
PI
Power input
PO
Power output
AI
Analog input
AO
Analog output
OD
Open drain
The following tables show the SC600Y&SC600T’s pin definitions and electrical characteristics.
Table 7: Pin Description
Power Supply
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
VBAT
36, 37, 38
PI/PO
Power supply for the module
Vmax=4.4V Vmin=3.55V Vnorm=3.8V
It must be able to provide sufficient current up to 3.0A. It is suggested to use a TVS to increase voltage surge withstand capability.
VDD_RF
1, 2
PO
Connect to external bypass capacitors to eliminate voltage fluctuation of RF part.
VOmax=4.4V VOmin=3.55V VOnorm=3.8V
Do not load externally.
VPH_PWR
220, 221
PO
Power supply for peripheral
Vmax=4.4V Vmin=3.55V
It can provide a maximum continuous
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Vnorm=3.8V
current of 1A approximately.
VRTC
16
PI/PO
Power supply for internal RTC circuit
VOmax=3.2V VI=2.0V~3.25V
LDO5_1P8
9
PO
1.8V output power supply
Vnorm=1.8V IOmax=20mA
Power supply for
external GPIO’s pull
up circuits and level shift circuit.
LDO10_2P8
11
PO
2.8V output power supply
Vnorm=2.8V IOmax=150mA
Power supply for VDD of sensors and TPs. Add a
1.0uF~4.7uF bypass capacitor if used. If unused, keep this pin open.
LDO6_1P8
10
PO
1.8V output power supply
Vnorm=1.8V IOmax=300mA
Power supply for I/O VDD of cameras, LCDs and sensors. Add a 1.0uF~2.2uF bypass capacitor if used. If unused, keep this pin open.
LDO17_2P85
12
PO
2.85V output power supply
Vnorm=2.85V IOmax=300mA
Power supply for cameras and LCDs. Add a 1.0uF~4.7uF bypass capacitor if used. If unused, keep this pin open.
LDO23_1P2
15
PO
1.2V output power supply
Vnorm=1.2V IOmax=600mA
Power supply for DVDD of front cameras. Add a 1.0uF~2.2uF bypass capacitor if used. If unused, keep this pin open.
LDO2_1P1
13
PO
1.1V output power supply
Vnorm=1.1V IOmax=1200mA
Power supply for DVDD of rear cameras. Add a 1.0uF~2.2uF bypass capacitor if
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used. If unused, keep this pin open.
LDO22_2P8
14
PO
2.8V output power supply
Vnorm=2.8V IOmax=150mA
Power supply for AVDD of cameras. Add a 1.0uF~4.7uF bypass capacitor if used. If unused, keep this pin open.
GND
3, 4, 18, 20, 31, 34, 35, 40, 43, 47, 56, 62, 87, 98, 101, 112, 125, 128, 130, 133, 135, 148, 150, 159, 163, 170, 173, 176, 182, 193, 195, 219, 225, 243, 257~323
Ground
Audio Interfaces
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
MIC_BIAS
167
AO
Microphone bias voltage
VO=1.6V~2.85V
MIC1_P
44
AI
Microphone positive input for channel 1
MIC1_N
45
AI
Microphone negative input for channel 1
MIC_GND
168
Microphone reference ground
If unused, connect this pin to the ground.
MIC2_P
46
AI
Microphone positive input for headset
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