EG91 Hardware Design
LTE Standard Module Series
Rev. EG91_Hardware_Design_V1.7
Date: 2019-08-09
Status: Released
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LTE Standard Module Series
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About the Document
History
Revision
Date
Author
Description
1.0
2017-03-22
Felix YIN/
Yeoman CHEN/
Jackie WANG
Initial
1.1
2018-01-23
Felix YIN/
Rex WANG
1. Added band B28A.
2. Updated the description of UMTS and GSM
features in Table 2.
3. Updated the functional diagram in Figure 1.
4. Updated module operating frequencies in
Table 21.
5. Updated current consumption in Table 26.
6. Updated RF output power in Table 27.
7. Updated the conducted RF receiving
sensitivity in Table 28.
8. Updated the GPRS multi-slot classes in
Table 33.
9. Added thermal consideration in Chapter 5.8
10. Added a GND pad in each of the four corners
of the module’s footprint in Chapter 6.2.
11. Updated storage information in Chapter 7.1.
12. Added packaging information in Chapter 7.3.
1.2
2018-03-14
Felix YIN/
Rex WANG
1. Added the description of EG91-NA.
2. Updated the functional diagram in Figure 1.
3. Updated pin assignment in Figure 2.
4. Updated GNSS function in Table 1.
5. Updated GNSS Features in Table 2.
6. Updated reference circuit of USB interface
in Figure 21.
7. Added description of GNSS receiver in
Chapter 4.
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8. Updated pin definition of RF antenna in
Table 21.
9. Updated module operating frequencies in
Table 22.
10. Added description of GNSS antenna
interface in Chapter 5.2.
11. Updated antenna requirements in Table 25.
12. Updated RF output power in Table 32.
1.3
2019-02-03
Ward WANG/
Nathan LIU/
Rex WANG
1. Added new variants EG91-NS, EG91-V,
EG91-EC and related contents.
2. Opened pin 24 as ADC0 and added related
contents.
3. Updated functional diagram (Figure 1)
4. Updated pin assignment (Figure 2)
5. Updated GNSS features (Table 2)
6. Added USB_BOOT interface information
(Chapter 3.18)
7. Updated storage information (Chapter 8.1)
8. Updated module operating frequencies
(Table 23)
9. Updated antenna requirements (Table 26)
10. Added current consumption of EG91-NS,
EG91-V and EG91-EC (Table 32, 33 and 34)
11. Added conducted RF receiving sensitivity of
EG91-NS, EG91-V and EG91-EC (Table 39,
40 and 41)
1.4
2019-03-29
Ward WANG
1. Modified module name EG91-EC to
EG91-EX, and EG91-V to EG91-VX
2. Added newly supported 9.x of Android USB
serial driver (Table 2)
3. Modified the reflow temperature range as .
238ºC~245ºC (Chapter 8.2)
1.5
2019-05-24
Ward WANG/
Nathan LIU
1. Updated comment of RF antenna (Table 4)
2. Updated EG91-EX current consumption
(Table 36)
3. Updated EG91-EX conducted RF receiving
sensitivity (T able 43)
1.6
2019-07-05
Ward WANG
1. Updated supported protocols (Table 2).
2. Updated timing of turning on module (Figure
12).
3. DFOTA is developed.
4. Updated description of USB_BOOT
interface and timing sequence for entering
emergency download mode (Chapter 3.18
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and Figure 29).
1.7
2019-08-09
Fanny CHEN/
Rex WANG
1. Added ThreadX variant EG91-NAX and
updated related contents (Table 1 and 4,
Chapter 2.2, 2.3, 3.2 and 5).
2. Added related notes of SPI interface not
supported on ThreadX modules (Chapter
3.1, 3.3 and 3.13).
3. Added current consumption of EG91-NAX
(Table 37).
4. Updated EG91-NA conducted RF receiving
sensitivity (Table 41).
5. Updated EG91-NS conducted RF receiving
sensitivity (Table 42).
6. Added EG91-NAX conducted RF receiving
sensitivity (Table 45).
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Contents
About the Document ..................................................................................................................................... 2
Contents.......................................................................................................................................................... 5
Table Index ..................................................................................................................................................... 7
Figure Index.................................................................................................................................................... 9
1 Introduction........................................................................................................................................... 11
1.1. Safety Information...................................................................................................................... 12
2 Product Concept .................................................................................................................................. 13
2.1. General Description ................................................................................................................... 13
2.2. Key Features.............................................................................................................................. 14
2.3. Functional Diagram ................................................................................................................... 17
2.4. Evaluation Board ....................................................................................................................... 18
3 Application Interfaces.......................................................................................................................... 19
3.1. General Description ................................................................................................................... 19
3.2. Pin Assignment .......................................................................................................................... 20
3.3. Pin Description ........................................................................................................................... 21
3.4. Operating Modes ....................................................................................................................... 28
3.5. Power Saving ............................................................................................................................. 29
3.5.1. Sleep Mode ...................................................................................................................... 29
3.5.1.1. UART Application ................................................................................................... 29
3.5.1.2. USB Application with USB Remote Wakeup Function ......................................... 30
3.5.1.3. USB Application with USB Suspend/Resume and RI Function ........................... 30
3.5.1.4. USB Application without USB Suspend Function ................................................. 31
3.5.2. Airplane Mode .................................................................................................................. 32
3.6. Power Supply ............................................................................................................................. 32
3.6.1. Power Supply Pins ........................................................................................................... 32
3.6.2. Decrease Voltage Drop .................................................................................................... 33
3.6.3. Reference Design for Power Supply ............................................................................... 34
3.6.4. Monitor the Power Supply................................................................................................ 34
3.7. Power-on/off Scenarios ............................................................................................................. 35
3.7.1. Turn on Module Using the PWRKEY .............................................................................. 35
3.7.2. Turn off Module ................................................................................................................ 37
3.7.2.1. Turn off Module Using the PWRKEY Pin .............................................................. 37
3.7.2.2. Turn off Module Using AT Command .................................................................... 37
3.8. Reset the Module....................................................................................................................... 38
3.9. (U)SIM Interfaces....................................................................................................................... 39
3.10. USB Interface............................................................................................................................. 42
3.11. UART Interfaces ........................................................................................................................ 43
3.12. PCM and I2C Interfaces ............................................................................................................ 46
3.13. SPI Interface .............................................................................................................................. 49
3.14. Network Status Indication.......................................................................................................... 50
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3.15. STATUS ..................................................................................................................................... 51
3.16. ADC Interface ............................................................................................................................ 51
3.17. Behaviors of RI .......................................................................................................................... 52
3.18. USB_BOOT Interface ................................................................................................................ 53
4 GNSS Receiver ..................................................................................................................................... 55
4.1. General Description ................................................................................................................... 55
4.2. GNSS Performance ................................................................................................................... 55
4.3. Layout Guidelines ...................................................................................................................... 56
5 Antenna Interfaces ............................................................................................................................... 57
5.1. Main/Rx-diversity Antenna Interfaces ....................................................................................... 57
5.1.1. Pin Definition .................................................................................................................... 57
5.1.2. Operating Frequency ....................................................................................................... 57
5.1.3. Reference Design of RF Antenna Interface .................................................................... 58
5.1.4. Reference Design of RF Layout ...................................................................................... 59
5.2. GNSS Antenna Interface ........................................................................................................... 61
5.3. Antenna Installation ................................................................................................................... 62
5.3.1. Antenna Requirement ...................................................................................................... 62
5.3.2. Recommended RF Connector for Antenna Installation .................................................. 63
6 Electrical, Reliability and Radio Characteristics ............................................................................. 65
6.1. Absolute Maximum Ratings....................................................................................................... 65
6.2. Power Supply Ratings ............................................................................................................... 65
6.3. Operation and Storage Temperatures ...................................................................................... 66
6.4. Current Consumption ................................................................................................................ 67
6.5. RF Output Power ....................................................................................................................... 75
6.6. RF Receiving Sensitivity ............................................................................................................ 76
6.7. Electrostatic Discharge .............................................................................................................. 79
6.8. Thermal Consideration .............................................................................................................. 79
7 Mechanical Dimensions ...................................................................................................................... 81
7.1. Mechanical Dimensions of the Module ..................................................................................... 81
7.2. Recommended Footprint ........................................................................................................... 83
7.3. Top and Bottom Views of the Module ....................................................................................... 84
8 Storage, Manufacturing and Packaging ............................................................................................ 85
8.1. Storage....................................................................................................................................... 85
8.2. Manufacturing and Soldering .................................................................................................... 86
8.3. Packaging .................................................................................................................................. 87
9 Appendix A References ....................................................................................................................... 89
10 Appendix B GPRS Coding Schemes ................................................................................................. 93
11 Appendix C GPRS Multi-slot Classes................................................................................................ 94
12 Appendix D EDGE Modulation and Coding Schemes ..................................................................... 96
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Table Index
TABLE 1: FREQUENCY BANDS OF EG91 SERIES MODULE ................................ ................................ ...... 13
TABLE 2: KEY FEATURES OF EG91 MODULE ............................................................................................ 14
TABLE 3: IO PARAMETERS DEFINITION ..................................................................................................... 21
TABLE 4: PIN DESCRIPTION ........................................................................................................................ 21
TABLE 5: OVERVIEW OF OPERATING MODES................................ ................................ ........................... 28
TABLE 6: PIN DEFINITION OF VBAT AND GND ........................................................................................... 33
TABLE 7: PIN DEFINITION OF PWRKEY ...................................................................................................... 35
TABLE 8: PIN DEFINITION OF RESET_N ..................................................................................................... 38
TABLE 9: PIN DEFINITION OF (U)SIM INTERFACES ................................................................................... 40
TABLE 10: PIN DEFINITION OF USB INTERFACE ....................................................................................... 42
TABLE 11: PIN DEFINITION OF MAIN UART INTERFACES ................................................................ ......... 44
TABLE 12: PIN DEFINITION OF DEBUG UART INTERFACE ....................................................................... 44
TABLE 13: LOGIC LEVELS OF DIGITAL I/O ................................ ................................................................ .. 44
TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES ..................................................................... 48
TABLE 15: PIN DEFINITION OF SPI INTERFACE ......................................................................................... 49
TABLE 16: PIN DEFINITION OF NETWORK STATUS INDICATOR ............................................................... 50
TABLE 17: WORKING STATE OF NETWORK STATUS INDICATOR ............................................................ 50
TABLE 18: PIN DEFINITION OF STATUS ...................................................................................................... 51
TABLE 19: PIN DEFINITION OF ADC INTERFACE ....................................................................................... 52
TABLE 20: CHARACTERISTICS OF ADC INTERFACE ................................................................................. 52
TABLE 21: DEFAULT BEHAVIORS OF RI................................................................ ...................................... 53
TABLE 22: PIN DEFINITION OF USB_BOOT INTERFACE ........................................................................... 53
TABLE 23: GNSS PERFORMANCE .............................................................................................................. 55
TABLE 24: PIN DEFINITION OF RF ANTENNA ................................ ............................................................. 57
TABLE 25: MODULE OPERATING FREQUENCIES ...................................................................................... 57
TABLE 26: PIN DEFINITION OF GNSS ANTENNA INTERFACE ................................................................... 61
TABLE 27: GNSS FREQUENCY .................................................................................................................... 61
TABLE 28: ANTENNA REQUIREMENTS ....................................................................................................... 62
TABLE 29: ABSOLUTE MAXIMUM RATINGS ................................................................................................ 65
TABLE 30: POWER SUPPLY RATINGS................................................................................................ ......... 65
TABLE 31: OPERATION AND STORAGE TEMPERATURES ........................................................................ 66
TABLE 32: EG91-E CURRENT CONSUMPTION ........................................................................................... 67
TABLE 33: EG91-NA CURRENT CONSUMPTION ........................................................................................ 69
TABLE 34: EG91-NS CURRENT CONSUMPTION ........................................................................................ 70
TABLE 35: EG91-VX CURRENT CONSUMPTION ........................................................................................ 71
TABLE 36: EG91-EX CURRENT CONSUMPTION ........................................................................................ 72
TABLE 37: EG91-NAX CURRENT CONSUMPTION ...................................................................................... 74
TABLE 38: GNSS CURRENT CONSUMPTION OF EG91 ............................................................................. 75
TABLE 39: RF OUTPUT POWER .................................................................................................................. 75
TABLE 40: EG91-E CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 76
TABLE 41: EG91-NA CONDUCTED RF RECEIVING SENSITIVITY .............................................................. 76
TABLE 42: EG91-NS CONDUCTED RF RECEIVING SENSITIVITY .............................................................. 77
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TABLE 43: EG91-VX CONDUCTED RF RECEIVING SENSITIVITY ................................ .............................. 77
TABLE 44: EG91-EX CONDUCTED RF RECEIVING SENSITIVITY ................................ .............................. 78
TABLE 45: EG91-NAX CONDUCTED RF RECEIVING SENSITIVITY ........................................................... 78
TABLE 46: ELECTROSTATIC DISCHARGE CHARACTERISTICS (25ºC, 45% RELATIVE HUMIDITY) ........ 79
TABLE 47: RECOMMENDED THERMAL PROFILE PARAMETERS .............................................................. 86
TABLE 48: RELATED DOCUMENTS ............................................................................................................. 89
TABLE 49: TERMS AND ABBREVIATIONS ................................................................................................... 89
TABLE 50: DESCRIPTION OF DIFFERENT CODING SCHEMES ................................................................. 93
TABLE 51: GPRS MULTI-SLOT CLASSES .................................................................................................... 94
TABLE 52: EDGE MODULATION AND CODING SCHEMES ......................................................................... 96
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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM............................................................................................................. 17
FIGURE 2: PIN ASSIGNMENT (TOP VIEW) ................................ ................................ .................................. 20
FIGURE 3: SLEEP MODE APPLICATION VIA UART ..................................................................................... 29
FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP ................................................... 30
FIGURE 5: SLEEP MODE APPLICATION WITH RI ....................................................................................... 31
FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ............................................... 31
FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION..................................................... 33
FIGURE 8: STAR STRUCTURE OF POWER SUPPLY .................................................................................. 34
FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY............................................................................. 34
FIGURE 10: TURN ON THE MODULE USING DRIVING CIRCUIT ............................................................... 35
FIGURE 11: TURN ON THE MODULE USING BUTTON ............................................................................... 36
FIGURE 12: TIMING OF TURNING ON MODULE ......................................................................................... 36
FIGURE 13: TIMING OF TURNING OFF MODULE ....................................................................................... 37
FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 38
FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ..................................................... 39
FIGURE 16: TIMING OF RESETTING MODULE ........................................................................................... 39
FIGURE 17: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR
............................................................................................................................................................... 41
FIGURE 18: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR . 41
FIGURE 19: REFERENCE CIRCUIT OF USB INTERFACE........................................................................... 43
FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP .................................................................. 45
FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT............................................................. 46
FIGURE 22: PRIMARY MODE TIMING .......................................................................................................... 47
FIGURE 23: AUXILIARY MODE TIMING ....................................................................................................... 47
FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC ................................... 48
FIGURE 25: REFERENCE CIRCUIT OF SPI INTERFACE WITH PERIPHERALS ........................................ 49
FIGURE 26: REFERENCE CIRCUIT OF NETWORK STATUS INDICATOR .................................................. 50
FIGURE 27: REFERENCE CIRCUIT OF STATUS ......................................................................................... 51
FIGURE 28: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ............................................................... 53
FIGURE 29: TIMING SEQUENCE FOR ENTERING EMERGENCY DOWNLOAD MODE ............................. 54
FIGURE 30: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................ 59
FIGURE 31: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB .................................................................... 59
FIGURE 32: COPLANAR WAVEGUIDE DESIGN ON A 2-LAYER PCB.......................................................... 60
FIGURE 33: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND)
............................................................................................................................................................... 60
FIGURE 34: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND)
............................................................................................................................................................... 60
FIGURE 35: REFERENCE CIRCUIT OF GNSS ANTENNA ........................................................................... 62
FIGURE 36: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ............................................... 63
FIGURE 37: MECHANICALS OF U.FL-LP CONNECTORS ........................................................................... 64
FIGURE 38: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ................................ .......................... 64
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FIGURE 39: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) .................. 80
FIGURE 40: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB)
............................................................................................................................................................... 80
FIGURE 41: MODULE TOP AND SIDE DIMENSIONS................................ ................................ ................... 81
FIGURE 42: MODULE BOTTOM DIMENSIONS (TOP VIEW)........................................................................ 82
FIGURE 43: RECOMMENDED FOOTPRINT (TOP VIEW) ............................................................................ 83
FIGURE 44: TOP VIEW OF THE MODULE ................................................................................................... 84
FIGURE 45: BOTTOM VIEW OF THE MODULE ........................................................................................... 84
FIGURE 46: REFLOW SOLDERING THERMAL PROFILE ............................................................................ 86
FIGURE 47: TAPE DIMENSIONS .................................................................................................................. 87
FIGURE 48: REEL DIMENSIONS .................................................................................................................. 88
FIGURE 49: TAPE AND REEL DIRECTIONS ................................................................................................ 88
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1 Introduction
This document defines the EG91 module and describes its air interface and hardware interface which are
connected with customers’ applications.
This document can help customers quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of EG91 module. Associated with application note
and user guide, customers can use EG91 module to design and set up mobile applications easily.
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1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating EG91 module. Manufacturers of the cellular
terminal should send the following safety information to users and operating personnel, and incorporate
these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for
customers’ failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If the device offers an Airplane Mode, then it should be
enabled prior to boarding an aircraft. Please consult the airline staff for more
restrictions on the use of wireless devices on boarding the aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with
unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such
conditions, please remember using emergency call. In order to make or receive a
call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.
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2 Product Concept
2.1. General Description
EG91 module is an embedded 4G wireless communication module with receive diversity. It supports
LTE-FDD/WCDMA/GSM wireless communication, and provides data connectivity on LTE-FDD,
DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It can also provide voice
functionality 1) to meet customers’ specific application demands. EG91 contains 6 variants: EG91-E,
EG91-NA, EG91-NS, EG91-VX 2), EG91-EX 2) and EG91-NAX 2). The following table shows the
frequency bands of EG91 series module.
Table 1: Frequency Bands of EG91 Series Module
Module
LTE Bands
(with Rx-diversity)
WCDMA
(with Rx-diversity)
GSM
GNSS 3)
EG91-E
FDD:
B1/B3/B7/B8/B20/B28A
B1/B8
900/1800MHz
Not supported
EG91-NA
FDD:
B2/B4/B5/B12/B13
B2/B4/B5
Not supported
GPS, GLONASS,
BeiDou/Compass,
Galileo, QZSS
EG91-NS
FDD:
B2/B4/B5/B12/B13/B25/
B26
B2/B4/B5
Not supported
GPS, GLONASS,
BeiDou/Compass,
Galileo, QZSS
EG91-VX 2)
FDD: B4/B13
Not supported
Not supported
GPS, GLONASS,
BeiDou/Compass,
Galileo, QZSS
EG91-EX 2)
FDD:
B1/B3/B7/B8/B20/B28
B1/B8
900/1800MHz
GPS, GLONASS,
BeiDou/Compass,
Galileo, QZSS
EG91-NAX 2)
FDD:
B2/B4/B5/B12/B13/B25/
B26
B2/B4/B5
Not supported
GPS, GLONASS,
BeiDou/Compass,
Galileo, QZSS
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1.
1)
EG91 contains Telematics version and Data-only version. Telematics version supports voice and
data functions, while Data-only version only supports data function.
2.
2)
EG91-VX/-EX/-NAX are based on ThreadX OS.
3.
3)
GNSS function is optional.
With a compact profile of 29.0mm × 25.0mm × 2.3mm, EG91 can meet almost all requirements for M2M
applications such as automotive, smart metering, tracking system, security, router, wireless POS, mobile
computing device, PDA phone, tablet PC, etc.
EG91 is an SMD type module which can be embedded into applications through its 106 LGA pads.
EG91 is integrated with internet service protocols like TCP, UDP and PPP. Extended AT commands have
been developed for customers to use these internet service protocols easily.
2.2. Key Features
The following table describes the detailed features of EG91 module.
Table 2: Key Features of EG91 Module
Feature
Details
Power Supply
Supply voltage: 3.3V~4.3V
Typical supply voltage: 3.8V
Transmitting Power
Class 4 (33dBm±2dB) for EGSM900
Class 1 (30dBm±2dB) for DCS1800
Class E2 (27dBm±3dB) for EGSM900 8-PSK
Class E2 (26dBm±3dB) for DCS1800 8-PSK
Class 3 (24dBm+1/-3dB) for WCDMA bands
Class 3 (23dBm±2dB) for LTE-FDD bands
LTE Features
Support up to non-CA Cat 1 FDD
Support 1.4/3/5/10/15/20MHz RF bandwidth
Support MIMO in DL direction
LTE-FDD: Max 10Mbps (DL), Max 5Mbps (UL)
UMTS Features
Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA
Support QPSK, 16-QAM and 64-QAM modulation
DC-HSDPA: Max 42Mbps (DL)
HSUPA: Max 5.76Mbps (UL)
WCDMA: Max 384Kbps (DL), Max 384Kbps (UL)
NOTES
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GSM Features
R99:
CSD: 9.6kbps
GPRS:
Support GPRS multi-slot class 33 (33 by default)
Coding scheme: CS-1, CS-2, CS-3 and CS-4
Max 107Kbps (DL), Max 85.6Kbps (UL)
EDGE:
Support EDGE multi-slot class 33 (33 by default)
Support GMSK and 8-PSK for different MCS (Modulation and Coding
Scheme)
Downlink coding schemes: CS 1-4 and MCS 1-9
Uplink coding schemes: CS 1-4 and MCS 1-9
Max 296Kbps (DL)/Max 236.8Kbps (UL)
Internet Protocol Features
Support TCP/UDP/PPP/FTP/FTPS/HTTP/HTTPS/NTP/PING/QMI/NITZ/
MMS/SMTP/SSL/MQTT/FILE/CMUX*/SMTPS* protocols
Support PAP (Password Authentication Protocol) and CHAP (Challenge
Handshake Authentication Protocol) protocols which are usually used for
PPP connections
SMS
Text and PDU modes
Point-to-point MO and MT
SMS cell broadcast
SMS storage: ME by default
(U)SIM Interfaces
Support 1.8V and 3.0V (U)SIM cards
Audio Features
Support one digital audio interface: PCM interface
GSM: HR/FR/EFR/AMR/AMR-WB
WCDMA: AMR/AMR-WB
LTE: AMR/AMR-WB
Support echo cancellation and noise suppression
PCM Interface
Used for audio function with external codec
Support 16-bit linear data format
Support long frame synchronization and short frame synchronization
Support master and slave mode, but must be the master in long frame
synchronization
USB Interface
Compliant with USB 2.0 specification (slave only); the data transfer rate
can reach up to 480Mbps
Used for AT command communication, data transmission, GNSS NMEA
sentences output, software debugging, firmware upgrade and voice over
USB
Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.6/3.x/4.1~4.15,
Android 4.x/5.x/6.x/7.x/8.x/9.x, etc.
UART Interface
Main UART:
Used for AT command communication and data transmission
Baud rates reach up to 921600bps, 115200bps by default
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EG91_Hardware_Design 16 / 96
Support RTS and CTS hardware flow control
Debug UART:
Used for Linux console and log output
115200bps baud rate
SPI Interface 2)
Provides a duplex, synchronous and serial communication link with the
peripheral devices.
Dedicated to one-to-one connection, without chip selection.
1.8V operation voltage with clock rates up to 50MHz.
Rx-diversity
Support LTE/WCDMA Rx-diversity
GNSS Features
Gen8C Lite of Qualcomm
Protocol: NMEA 0183
AT Commands
Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT
commands
Network Indication
NETLIGHT pin for network activity status indication
Antenna Interfaces
Including main antenna interface (ANT_MAIN), Rx-diversity antenna
(ANT_DIV) interface and GNSS antenna interface (ANT_GNSS) 1)
Physical Characteristics
Size: (29.0±0.15)mm × (25.0±0.15)mm × (2.3±0.2)mm
Package: LGA
Weight: approx. 3.8g
Temperature Range
Operation temperature range: -35°C ~ +75°C 3)
Extended temperature range: -40°C ~ +85°C
4)
Storage temperature range: -40°C ~ +90°C
Firmware Upgrade
USB interface or DFOTA
RoHS
All hardware components are fully compliant with EU RoHS directive
1.
1)
GNSS antenna interface is only supported on EG91-NA/-NS/-VX/-EX/-NAX.
2.
2)
SPI interface is not supported on ThreadX modules.
3. 3) Within operation temperature range, the module is 3GPP compliant.
4. 4) Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call* (emergency call is not supported on ThreadX
modules), etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum
and no harm to radio network. Only one or more parameters like P
out
might reduce in their value and
exceed the specified tolerances. When the temperature returns to normal operation temperature
levels, the module will meet 3GPP specifications again.
5. “*” means under development.
NOTES
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2.3. Functional Diagram
The following figure shows a block diagram of EG91 and illustrates the major functional parts.
⚫ Power management
⚫ Baseband
⚫ DDR+NAND flash
⚫ Radio frequency
⚫ Peripheral interfaces
Baseband
PMIC
Transceiver
NAND
DDR2
SDRAM
PA
PAM
Switch
ANT_MAIN ANT_DIV
VBAT_BB
VBAT_RF
PWRKEY
VDD_EXT
USB PCM UARTI2C
RESET_N
19.2M
XO
STATUS
GPIOs
Control
IQ Control
Duplexer
SAW
Tx
PRx DRx
(U)SIM2
SPI
(U)SIM1
SAW
LNA
ANT_GNSS
1)
SAW
GPS
Figure 1: Functional Diagram
1)
GNSS antenna interface is only supported on EG91-NA/-NS/-VX/-EX/-NAX.
NOTE
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2.4. Evaluation Board
Quectel provides a complete set of evaluation tools to facilitate the use and testing of EG91 module. The
evaluation tool kit includes the evaluation board (UMTS<E EVB), USB data cable, earphone, antenna
and other peripherals. For more details, please refer to document [7].
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3 Application Interfaces
3.1. General Description
EG91 is equipped with 62-pin 1.1mm pitch SMT pads and 44-pin ground/reserved pads that can be
connected to customers’ cellular application platforms. Sub-interfaces included in these pads are
described in detail in the following chapters:
⚫ Power supply
⚫ (U)SIM interfaces
⚫ USB interface
⚫ UART interfaces
⚫ PCM and I2C interfaces
⚫ SPI interface 1)
⚫ Status indication
⚫ USB_BOOT interface
⚫
1)
SPI interface is not supported on ThreadX modules.
NOTE
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3.2. Pin Assignment
The following figure shows the pin assignment of EG91 module.
NC
PCM_SYNC
PCM_CLK
PCM_DIN
PCM_DOUT
NC
NC
PWRKEY
1)
NC
RESET_N
RESERVED
1
2
3
4
5
6
7
11
12
13
14
15
16
17
18
50
51
52
53
54
55
58
59
60
61
62
USB_DM
AP_READY
STATUS
NETLIGHT
DBG_RXD
DBG_TXD
ADC0
RESERVED
SPI_CLK
SPI_MOSI
SPI_MISO
VDD_EXT
DTR
GND
USIM1_CLK
USIM1_DATA
USIM1_RST
USIM1_VDD
RI
DCD
CTS
TXD
RXD
VBAT_BB
VBAT_BB
USIM_GND
GND
31
30
29
28
27
26
23
22
21
20
19
10
9
USB_DP
USB_VBUS
NC
GND
NC
NC
RTS
I2C_SCL
I2C_SDA
8
49
48
47
46
45
44
43
40
41
42
39
38
37
36
35
34
33
32
24
57
56
GND
GND
ANT_MAIN
GND
GND
NC
VBAT_RF
VBAT_RF
GND
GND
NC
GND
USIM1_PRESENCE
63
64
65
66
67
68
83
84
85
86
87
88
98
97
96
95
94
93
78
77
76
75
74
73
91 92
89 90
71
72
69
70
80 79
82 81
100
99
102 101
POWER USB UART
(U)SIM
OTHERS
GND
NC
PCM
ANT
25
USIM2_PRESENCE
USIM2_CLK
USIM2_RST
USIM2_DATA
USIM2_VDD
SPI
USB_BOOT
103
104
105
106
ANT_DIV (EG91-NA/-NS/-VX/-EX/-NAX)
ANT_GNSS (EG91-NA/-NS/-VX/-EX/-NAX)
RESERVED
RESERVED
(Pin 56 on EG91-E)
ANT_DIV (EG91-E)
Figure 2: Pin Assignment (Top View)
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1. 1) PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset.
2. Keep all RESERVED pins and unused pins unconnected.
3. GND pads should be connected to ground in the design.
4. Please note that the definition of pin 49 and 56 are different among EG91-NA/-NS/-VX/-EX/-NAX and
EG91-E. For more details, please refer to Table 4.
3.3. Pin Description
The following tables show the pin definition and description of EG91.
Table 3: IO Parameters Definition
Table 4: Pin Description
Type
Description
AI
Analog Input
AO
Analog Output
DI
Digital Input
DO
Digital Output
IO
Bidirectional
OD
Open Drain
PI
Power Input
PO
Power Output
Power Supply
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment
VBAT_BB
32, 33
PI
Power supply for
module’s baseband
part
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
It must be provided with
sufficient current up to
0.8A.
NOTES
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VBAT_RF
52, 53
PI
Power supply for
module’s RF part
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
It must be provided with
sufficient current up to
1.8A in a burst
transmission.
VDD_EXT
29
PO
Provide 1.8V for
external circuit
Vnorm=1.8V
IOmax=50mA
Power supply for
external GPIO’s pull up
circuits.
If unused, keep it open.
GND
3, 31, 48,
50, 54, 55,
58, 59, 61,
62, 67~74,
79~82,
89~91,
100~106
Ground
Power-on/off
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
PWRKEY
15
DI
Turn on/off the
module
VH=0.8V
The output voltage is
0.8V because of the
diode drop in the
Qualcomm chipset.
RESET_N
17
DI
Reset signal of the
module
VIHmax=2.1V
VIHmin=1.3V
VILmax=0.5V
Require pull-up
resistor to 1.8V
internally.
Active low.
If unused, keep it
open.
Status Indication
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
STATUS
20
DO
Indicate the
module’s operation
status
VOHmin=1.35V
VOLmax=0.45V
1.8V power domain.
If unused, keep it
open.
NETLIGHT
21
DO
Indicate the
module’s network
activity status
VOHmin=1.35V
VOLmax=0.45V
1.8V power domain.
If unused, keep it
open.
USB Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
USB_VBUS
8
PI
USB connection
detection
Vmax=5.25V
Vmin=3.0V
Typical: 5.0V
If unused, keep it
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Vnorm=5.0V
open.
USB_DP
9
IO
USB differential
data bus (+)
Compliant with USB
2.0 standard
specification.
Require differential
impedance of 90Ω.
USB_DM
10
IO
USB differential
data bus (-)
Compliant with USB
2.0 standard
specification.
Require differential
impedance of 90Ω.
(U)SIM Interfaces
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
USIM_GND
47
Specified ground
for (U)SIM card
Connect to ground of
(U)SIM card
connector.
USIM1_VDD
43
PO
Power supply for
(U)SIM card
For 1.8V (U)SIM:
Vmax=1.9V
Vmin=1.7V
For 3.0V (U)SIM:
Vmax=3.05V
Vmin=2.7V
IOmax=50mA
Either 1.8V or 3.0V is
supported by the
module automatically.
USIM1_DATA
45
IO
Data signal of
(U)SIM card
For 1.8V (U)SIM:
VILmax=0.6V
VIHmin=1.2V
VOLmax=0.45V
VOHmin=1.35V
For 3.0V (U)SIM:
VILmax=1.0V
VIHmin=1.95V
VOLmax=0.45V
VOHmin=2.55V
USIM1_CLK
46
DO
Clock signal of
(U)SIM card
For 1.8V (U)SIM:
VOLmax=0.45V
VOHmin=1.35V
For 3.0V (U)SIM:
VOLmax=0.45V
VOHmin=2.55V
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USIM1_RST
44
DO
Reset signal of
(U)SIM card
For 1.8V (U)SIM:
VOLmax=0.45V
VOHmin=1.35V
For 3.0V (U)SIM:
VOLmax=0.45V
VOHmin=2.55V
USIM1_
PRESENCE
42
DI
(U)SIM card
insertion detection
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
If unused, keep it
open.
USIM2_VDD
87
PO
Power supply for
(U)SIM card
For 1.8V (U)SIM:
Vmax=1.9V
Vmin=1.7V
For 3.0V (U)SIM:
Vmax=3.05V
Vmin=2.7V
IOmax=50mA
Either 1.8V or 3.0V is
supported by the
module automatically.
USIM2_DATA
86
IO
Data signal of
(U)SIM card
For 1.8V (U)SIM:
VILmax=0.6V
VIHmin=1.2V
VOLmax=0.45V
VOHmin=1.35V
For 3.0V (U)SIM:
VILmax=1.0V
VIHmin=1.95V
VOLmax=0.45V
VOHmin=2.55V
USIM2_CLK
84
DO
Clock signal of
(U)SIM card
For 1.8V (U)SIM:
VOLmax=0.45V
VOHmin=1.35V
For 3.0V (U)SIM:
VOLmax=0.45V
VOHmin=2.55V
USIM2_RST
85
DO
Reset signal of
(U)SIM card
For 1.8V (U)SIM:
VOLmax=0.45V
VOHmin=1.35V
For 3.0V (U)SIM:
VOLmax=0.45V
VOHmin=2.55V
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USIM2_
PRESENCE
83
DI
(U)SIM card
insertion detection
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
If unused, keep it
open.
Main UART Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
RI
39
DO
Ring indicator
VOLmax=0.45V
VOHmin=1.35V
1.8V power domain.
If unused, keep it
open.
DCD
38
DO
Data carrier
detection
VOLmax=0.45V
VOHmin=1.35V
1.8V power domain.
If unused, keep it
open.
CTS
36
DO
Clear to send
VOLmax=0.45V
VOHmin=1.35V
1.8V power domain.
If unused, keep it
open.
RTS
37
DI
Request to send
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
If unused, keep it
open.
DTR
30
DI
Data terminal
ready.
Sleep mode
control.
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
Require pull-up
resistor by default.
Low level wakes up
the module.
If unused, keep it
open.
TXD
35
DO
Transmit data
VOLmax=0.45V
VOHmin=1.35V
1.8V power domain.
If unused, keep it
open.
RXD
34
DI
Receive data
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
If unused, keep it
open.
Debug UART Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
DBG_TXD
23
DO
Transmit data
VOLmax=0.45V
VOHmin=1.35V
1.8V power domain.
If unused, keep it
open.
DBG_RXD
22
DI
Receive data
VILmin=-0.3V
VILmax=0.6V
1.8V power domain.
If unused, keep it
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EG91_Hardware_Design 26 / 96
VIHmin=1.2V
VIHmax=2.0V
open.
PCM Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
PCM_DIN
6
DI
PCM data input
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
If unused, keep it
open.
PCM_
DOUT
7
DO
PCM data output
VOLmax=0.45V
VOHmin=1.35V
1.8V power domain.
If unused, keep it
open.
PCM_SYNC
5
IO
PCM data frame
synchronization
signal
VOLmax=0.45V
VOHmin=1.35V
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
In master mode, it is
an output signal. In
slave mode, it is an
input signal.
If unused, keep it
open.
PCM_CLK
4
IO
PCM clock
VOLmax=0.45V
VOHmin=1.35V
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
In master mode, it is
an output signal. In
slave mode, it is an
input signal.
If unused, keep it
open.
I2C Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
I2C_SCL
40
OD
I2C serial clock.
Used for external
codec
An external pull-up
resistor is required.
1.8V only.
If unused, keep it
open.
I2C_SDA
41
OD
I2C serial data.
Used for external
codec
An external pull-up
resistor is required.
1.8V only.
If unused, keep it
open.
ADC Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
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EG91_Hardware_Design 27 / 96
ADC0
24
AI
General purpose
analog to digital
converter
Voltage range:
0.3V to VBAT_BB
If unused, keep it
open.
SPI Interface 1)
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
SPI_CLK
26
DO
Clock signal of SPI
interface
VOLmax=0.45V
VOHmin=1.35V
1.8V power domain.
If unused, keep it
open.
SPI_MOSI
27
DO
Master output slave
input of SPI
interface
VOLmax=0.45V
VOHmin=1.35V
1.8V power domain.
If unused, keep it
open.
SPI_MISO
28
DI
Master input slave
output of SPI
interface
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
If unused, keep it
open.
RF Interfaces
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
ANT_GNSS
49
(EG91NA/-NS/
-VX/-EX/
-NAX)
AI
GNSS antenna pad
50Ω impedance.
If unused, keep it
open.
The pin is defined as
ANT_DIV on
EG91-E.
ANT_DIV
49
(EG91-E)
AI
Receive diversity
antenna pad
50Ω impedance.
If unused, keep it
open.
Pin 56 is reserved on
EG91-E.
56
(EG91NA/-NS/
-VX/-EX/
-NAX)
ANT_MAIN
60
IO
Main antenna pad
50Ω impedance.
Other Pins
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
AP_READY
19
DI
Application
processor sleep
state detection
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
1.8V power domain.
If unused, keep it
open.
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1. 1) SPI interface is not supported on ThreadX modules.
2. Keep all RESERVED pins and unused pins unconnected.
3.4. Operating Modes
The table below briefly summarizes the various operating modes referred in the following chapters.
Table 5: Overview of Operating Modes
Mode
Details
Normal
Operation
Idle
Software is active. The module has registered on network, and it is
ready to send and receive data.
Talk/Data
Network connection is ongoing. In this mode, the power consumption is
decided by network setting and data transfer rate.
Minimum
Functionality
Mode
AT+CFUN command can set the module to a minimum functionality mode without
removing the power supply. In this case, both RF function and (U)SIM card will be invalid.
Airplane
AT+CFUN command or W_DISABLE# pin can set the module to enter airplane mode. In
VIHmax=2.0V
USB_BOOT
75
DI
Force the module to
enter emergency
download mode
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
It is recommended to
reserve the test
points.
RESERVED Pins
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
NC
1,2, 11~14,
16, 51,
57, 63~66,
76~78,
88, 92~99
NC
Keep these pins
unconnected.
RESERVED
18, 25, 56
Reserved
Keep these pins
unconnected.
Pin 56 is only
reserved on EG91-E.
NOTES
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EG91_Hardware_Design 29 / 96
Mode
this case, RF function will be invalid.
Sleep Mode
In this mode, the current consumption of the module will be reduced to the minimal level.
During this mode, the module can still receive paging message, SMS, voice call and
TCP/UDP data from the network normally.
Power Down
Mode
In this mode, the power management unit shuts down the power supply. Software is not
active. The serial interface is not accessible. Operating voltage (connected to VBAT_RF
and VBAT_BB) remains applied.
3.5. Power Saving
3.5.1. Sleep Mode
EG91 is able to reduce its current consumption to a minimum value during the sleep mode. The following
sub-chapters describe the power saving procedures of EG91 module.
3.5.1.1. UART Application
If the host communicates with the module via UART interface, the following preconditions can let the
module enter sleep mode.
⚫ Execute AT+QSCLK=1 command to enable sleep mode.
⚫ Drive DTR to high level.
The following figure shows the connection between the module and the host.
RXD
TXD
RI
DTR
AP_READY
TXD
RXD
EINT
GPIO
GPIO
Module
Host
GND
GND
Figure 3: Sleep Mode Application via UART
Driving the host DTR to low level will wake up the module.
⚫ When EG91 has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.17 for
details about RI behavior.
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⚫ AP_READY will detect the sleep state of host (can be configured to high level or low level detection).
Please refer to AT+QCFG="apready" for details.
3.5.1.2. USB Application with USB Remote Wakeup Function
If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions
must be met to let the module enter sleep mode.
⚫ Execute AT+QSCLK=1 command to enable sleep mode.
⚫ Ensure the DTR is held at high level or keep it open.
⚫ The host’s USB bus, which is connected with the module’s USB interface, enters suspend state.
The following figure shows the connection between the module and the host.
USB_VBUS
USB_DP
USB_DM
AP_READY
VDD
USB_DP
USB_DM
GPIO
Module
Host
GND
GND
Figure 4: Sleep Mode Application with USB Remote Wakeup
⚫ Sending data to EG91 through USB will wake up the module.
⚫ When EG91 has a URC to report, the module will send remote wakeup signals via USB bus so as to
wake up the host.
3.5.1.3. USB Application with USB Suspend/Resume and RI Function
If the host supports USB suspend/resume, but does not support remote wakeup function, the RI signal is
needed to wake up the host.
There are three preconditions to let the module enter sleep mode.
⚫ Execute AT+QSCLK=1 command to enable sleep mode.
⚫ Ensure the DTR is held at high level or keep it open.
⚫ The host’s USB bus, which is connected with the module’s USB interface, enters suspended state.
The following figure shows the connection between the module and the host.
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USB_VBUS
USB_DP
USB_DM
AP_READY
VDD
USB_DP
USB_DM
GPIO
Module Host
GND
GND
RI
EINT
Figure 5: Sleep Mode Application with RI
⚫ Sending data to EG91 through USB will wake up the module.
⚫ When module has a URC to report, RI signal will wake up the host.
3.5.1.4. USB Application without USB Suspend Function
If the host does not support USB suspend function, USB_VBUS should be disconnected with an external
control circuit to let the module enter sleep mode.
⚫ Execute AT+QSCLK=1 command to enable sleep mode.
⚫ Ensure the DTR is held at high level or keep it open.
⚫ Disconnect USB_VBUS.
The following figure shows the connection between the module and the host.
USB_VBUS
USB_DP
USB_DM
AP_READY
VDD
USB_DP
USB_DM
GPIO
Module Host
RI
EINT
Power
Switch
GPIO
GND
GND
Figure 6: Sleep Mode Application without Suspend Function
Switching on the power switch to supply power to USB_VBUS will wake up the module.
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Please pay attention to the level match shown in dotted line between the module and the host. Please
refer to document [1] for more details about EG91 power management application.
3.5.2. Airplane Mode
When the module enters airplane mode, the RF function does not work, and all AT commands correlative
with RF function will be inaccessible. This mode can be set via the following ways.
Hardware:
The W_DISABLE# pin is pulled up by default. Driving it to low level will let the module enter airplane
mode.
Software:
AT+CFUN command provides the choice of the functionality level through setting <fun> as 0, 1 or 4.
⚫ AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled.
⚫ AT+CFUN=1: Full functionality mode (by default).
⚫ AT+CFUN=4: Airplane mode. RF function is disabled.
1. Airplane mode control via W_DISABLE# is disabled in firmware by default. It can be enabled by
AT+QCFG="airplanecontrol" command and this command is under development.
2. The execution of AT+CFUN command will not affect GNSS function.
3.6. Power Supply
3.6.1. Power Supply Pins
EG91 provides four VBAT pins for connection with an external power supply. There are two separate
voltage domains for VBAT.
⚫ Two VBAT_RF pins for module’s RF part.
⚫ Two VBAT_BB pins for module’s baseband part.
The following table shows the details of VBAT pins and ground pins.
NOTE
NOTES
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 33 / 96
Table 6: Pin Definition of VBAT and GND
Pin Name
Pin No.
Description
Min.
Typ.
Max.
Unit
VBAT_RF
52, 53
Power supply for module’s
RF part.
3.3
3.8
4.3
V
VBAT_BB
32, 33
Power supply for module’s
baseband part.
3.3
3.8
4.3
V
GND
3, 31, 48, 50,
54, 55, 58, 59,
61, 62, 67~74,
79~82, 89~91,
100~106
Ground
- 0 -
V
3.6.2. Decrease Voltage Drop
The power supply range of the module is from 3.3V to 4.3V. Please make sure that the input voltage will
never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G
network. The voltage drop will be less in 3G and 4G networks.
VBAT
Min.3.3V
Ripple
Drop
Burst
Transmission
Burst
Transmission
Figure 7: Power Supply Limits during Burst Transmission
To decrease voltage drop, a bypass capacitor of about 100µF with low ESR (ESR=0.7Ω) should be used,
and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It
is recommended to use three ceramic capacitors (100nF, 33pF, 10pF) for composing the MLCC array, and
place these capacitors close to VBAT_BB/VBAT_RF pins. The main power supply from an external
application has to be a single voltage source and can be expanded to two sub paths with star structure.
The width of VBAT_BB trace should be no less than 1mm, and the width of VBAT_RF trace should be no
less than 2mm. In principle, the longer the VBAT trace is, the wider it will be.
In addition, in order to avoid the damage caused by electric surge and ESD, it is suggested that a TVS
diode with low reverse stand-off voltage V
RWM
, low clamping voltage VC and high reverse peak pulse
current I
PP
should be used. The following figure shows the star structure of the power supply.
LTE Standard Module Series
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EG91_Hardware_Design 34 / 96
Module
VBAT_RF
VBAT_BB
VBAT
C1
100uF
C6
100nFC733pFC810pF
+
+
C2
100nF
C5
100uF
C3
33pF
C4
10pF
D1
WS4.5D3HV
Figure 8: Star Structure of Power Supply
3.6.3. Reference Design for Power Supply
Power design for the module is very important, as the performance of the module largely depends on the
power source. The power supply should be able to provide sufficient current up to 2A at least. If the
voltage drop between the input and output is not too high, it is suggested that an LDO should be used to
supply power for the module. If there is a big voltage difference between the input source and the desired
output (VBAT), a buck converter is preferred to be used as the power supply.
The following figure shows a reference design for +5V input power source. The typical output of the power
supply is about 3.8V and the maximum load current is 3A.
DC_IN
MIC29302WU
IN OUT
EN
GND
ADJ
2 4
1
3
5
VBAT
100nF
470uF
100nF
100K
47K
470uF
470R
51K
1%
1%
4.7K
47K
VBAT_EN
Figure 9: Reference Circuit of Power Supply
3.6.4. Monitor the Power Supply
AT+CBC command can be used to monitor the VBAT_BB voltage value. For more details, please refer to
document [2].
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EG91_Hardware_Design 35 / 96
3.7. Power-on/off Scenarios
3.7.1. Turn on Module Using the PWRKEY
The following table shows the pin definition of PWRKEY.
Table 7: Pin Definition of PWRKEY
Pin Name
Pin No.
Description
DC Characteristics
Comment
PWRKEY
15
Turn on/off the module
VH=0.8V
The output voltage is 0.8V
because of the diode drop in
the Qualcomm chipset.
When EG91 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a
low level for at least 500ms. It is recommended to use an open drain/collector driver to control the
PWRKEY. After STATUS pin outputting a high level, PWRKEY pin can be released. A simple reference
circuit is illustrated in the following figure.
Turn on pulse
PWRKEY
4.7K
47K
≥ 500ms
10nF
Figure 10: Turn on the Module Using Driving Circuit
Another way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike
may generate from the finger. Therefore, a TVS component is indispensable to be placed nearby the
button for ESD protection. A reference circuit is shown in the following figure.
LTE Standard Module Series
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EG91_Hardware_Design 36 / 96
PWRKEY
S1
Close to S1
TVS
Figure 11: Turn on the Module Using Button
The power-on scenario is illustrated in the following figure.
VIL≤0.5V
VH=0.8V
VBAT
PWRKEY
≥500ms
RESET_N
STATUS
(DO)
Inactive
ActiveUART
Inactive ActiveUSB
≥
≥12s
≥13s
VDD_EXT
BOOT_CONFIG &
USB_BOOT Pins
About 100ms
10s
NOTE 1
≥100ms. After this time, the BOOT_CONFIG
pins can be set to high level by external circuit.
Figure 12: Timing of Turning on Module
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EG91_Hardware_Design 37 / 96
1. Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is
no less than 30ms.
2. PWRKEY can be pulled down directly to GND with a recommended 10KΩ resistor if module
needs to be powered on automatically and shutdown is not needed.
3.7.2. Turn off Module
Either of the following methods can be used to turn off the module:
⚫ Normal power-off procedure: Turn off the module using the PWRKEY pin.
⚫ Normal power-off procedure: Turn off the module using AT+QPOWD command.
3.7.2.1. Turn off Module Using the PWRKEY Pin
Driving the PWRKEY pin to a low level voltage for at least 650ms, the module will execute power-off
procedure after the PWRKEY is released. The power-off scenario is illustrated in the following figure.
VBAT
PWRKEY
≥ 30s
≥ 650ms
RUNNING
Power-down procedure
OFF
Module
Status
STATUS
Figure 13: Timing of Turning off Module
3.7.2.2. Turn off Module Using AT Command
It is also a safe way to use AT+QPOWD command to turn off the module, which is similar to turning off the
module via PWRKEY pin.
Please refer to document [2] for details about the AT+QPOWD command.
NOTES
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EG91 Hardware Design
EG91_Hardware_Design 38 / 96
1. In order to avoid damaging internal flash, please do not switch off the power supply when the module
works normally. Only after the module is shut down by PWRKEY or AT command, the power supply
can be cut off.
2. When turning off module with AT command, please keep PWRKEY at high level after the execution of
power-off command. Otherwise the module will be turned on again after successful turn-off.
3.8. Reset the Module
The RESET_N pin can be used to reset the module. The module can be reset by driving RESET_N to a
low level voltage for 150ms~460ms.
Table 8: Pin Definition of RESET_N
Pin Name
Pin No.
Description
DC Characteristics
Comment
RESET_N
17
Reset the module
VIHmax=2.1V
VIHmin=1.3V
VILmax=0.5V
The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button
can be used to control the RESET_N.
Reset pulse
RESET_N
4.7K
47K
150ms~460ms
Figure 14: Reference Circuit of RESET_N by Using Driving Circuit
NOTES
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 39 / 96
RESET_N
S2
Close to S2
TVS
Figure 15: Reference Circuit of RESET_N by Using Button
The reset scenario is illustrated in the following figure.
VIL ≤ 0.5V
VIH ≥ 1.3V
VBAT
≥ 150ms
Resetting
Module
Status
Running
RESET_N
Restart
≤ 460ms
Figure 16: Timing of Resetting Module
1. Use RESET_N only when turning off the module by AT+QPOWD command and PWRKEY pin failed.
2. Ensure that there is no large capacitance on PWRKEY and RESET_N pins.
3.9. (U)SIM Interfaces
EG91 provides two (U)SIM interfaces, and only one (U)SIM card can work at a time. The (U)SIM1 and
(U)SIM2 cards can be switched by AT+QDSIM command. For more details, please refer to document
[2].
The (U)SIM interfaces circuitry meet ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards
are supported.
NOTES
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EG91_Hardware_Design 40 / 96
Table 9: Pin Definition of (U)SIM Interfaces
Pin Name
Pin No.
I/O
Description
Comment
USIM1_VDD
43
PO
Power supply for (U)SIM1 card
Either 1.8V or 3.0V is
supported by the module
automatically.
USIM1_DATA
45
IO
Data signal of (U)SIM1 card
USIM1_CLK
46
DO
Clock signal of (U)SIM1 card
USIM1_RST
44
DO
Reset signal of (U)SIM1 card
USIM1_
PRESENCE
42
DI
(U)SIM1 card insertion detection
USIM_GND
47 Specified ground for (U)SIM card
USIM2_VDD
87
PO
Power supply for (U)SIM2 card
Either 1.8V or 3.0V is
supported by the module
automatically.
USIM2_DATA
86
IO
Data signal of (U)SIM2 card
USIM2_CLK
84
DO
Clock signal of (U)SIM2 card
USIM2_RST
85
DO
Reset signal of (U)SIM2 card
USIM2_
PRESENCE
83
DI
(U)SIM2 card insertion detection
EG91 supports (U)SIM card hot-plug via USIM_PRESENCE (USIM1_PRESENCE/USIM2_PRESENCE)
pin. The function supports low level and high level detection, and is disabled by default. Please refer to
document [2] about AT+QSIMDET command for details.
The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector.
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 41 / 96
Module
USIM_VDD
USIM_GND
USIM_RST
USIM_CLK
USIM_DATA
USIM_PRESENCE
0R
0R
0R
VDD_EXT
51K
100nF (U)SIM Card Connector
GND
GND
33pF
33pF 33pF
VCC
RST
CLK
IO
VPP
GND
GND
USIM_VDD
15K
Figure 17: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector
If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A
reference circuit of (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following
figure.
Module
USIM_VDD
USIM_GND
USIM_RST
USIM_CLK
USIM_DATA
0R
0R
0R
100nF
(U)SIM Card Connector
GND
33pF 33pF 33pF
VCC
RST
CLK IO
VPP
GND
GND
15K
USIM_VDD
Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector
In order to enhance the reliability and availability of the (U)SIM cards in customers’ applications, please
follow the criteria below in the (U)SIM circuit design:
⚫ Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length
as less than 200mm as possible.
⚫ Keep (U)SIM card signals away from RF and VBAT traces.
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EG91_Hardware_Design 42 / 96
⚫ Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1uF, and place it as
close to (U)SIM card connector as possible. If the ground is complete on customers’ PCB,
USIM_GND can be connected to PCB ground directly.
⚫ To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and
shield them with surrounded ground.
⚫ In order to offer good ESD protection, it is recommended to add a TVS diode array whose parasitic
capacitance should not be more than 15pF. The 0Ω resistors should be added in series between the
module and the (U)SIM card to facilitate debugging. The 33pF capacitors are used for filtering
interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the
(U)SIM card connector.
⚫ The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace
and sensitive occasion are applied, and should be placed close to the (U)SIM card connector.
3.10. USB Interface
EG91 contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0
specification and supports high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface
acts as slave only, and is used for AT command communication, data transmission, GNSS NMEA
sentences output, software debugging, firmware upgrade and voice over USB. The following table shows
the pin definition of USB interface.
Table 10: Pin Definition of USB Interface
Pin Name
Pin No.
I/O
Description
Comment
USB_DP
9
IO
USB differential data bus (+)
Require differential
impedance of 90Ω.
USB_DM
10
IO
USB differential data bus (-)
Require differential
impedance of 90Ω.
USB_VBUS
8
PI
USB connection detection
Typical: 5.0V
GND
3 Ground
For more details about USB 2.0 specifications, please visit http://www.usb.org/home.
The USB interface is recommended to be reserved for firmware upgrade in customers’ design. The
following figure shows a reference circuit of USB interface.
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 43 / 96
USB_DP
USB_DM
GND
USB_DP
USB_DM
GND
L1
Close to Module
R3
R4
Test Points
ESD Array
NM_0R
NM_0R
Minimize these stubs
Module
MCU
USB_VBUS
VDD
Figure 19: Reference Circuit of USB Interface
A common mode choke L1 is recommended to be added in series between the module and customer’s
MCU in order to suppress EMI spurious transmission. Meanwhile, the 0Ω resistors (R3 and R4) should be
added in series between the module and the test points so as to facilitate debugging, and the resistors are
not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 components
must be placed close to the module, and also these resistors should be placed close to each other. The
extra stubs of trace must be as short as possible.
The following principles should be complied with when design the USB interface, so as to meet USB 2.0
specification.
⚫ It is important to route the USB signal traces as differential pairs with total grounding. The impedance
of USB differential trace is 90Ω.
⚫ Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is
important to route the USB differential traces in inner-layer with ground shielding on not only upper
and lower layers but also right and left sides.
⚫ Pay attention to the influence of junction capacitance of ESD protection components on USB data
lines. Typically, the capacitance value should be less than 2pF.
⚫ Keep the ESD protection components to the USB connector as close as possible.
3.11. UART Interfaces
The module provides two UART interfaces: the main UART interface and the debug UART interface. The
following shows their features.
⚫ The main UART interface supports 9600bps, 19200bps, 38400bps, 57600bps, 115200bps,
230400bps, 460800bps, 921600bps and 3000000bps baud rates, and the default is 115200bps. It
supports RTS and CTS hardware flow control, and is used for AT command communication only.
LTE Standard Module Series
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EG91_Hardware_Design 44 / 96
⚫ The debug UART interface supports 115200bps baud rate. It is used for Linux console and log
output.
The following tables show the pin definition of the two UART interfaces.
Table 11: Pin Definition of Main UART Interfaces
Pin Name
Pin No.
I/O
Description
Comment
RI
39
DO
Ring indicator
1.8V power domain
DCD
38
DO
Data carrier detection
CTS
36
DO
Clear to send
RTS
37
DI
Request to send
DTR
30
DI
Sleep mode control
TXD
35
DO
Transmit data
RXD
34
DI
Receive data
Table 12: Pin Definition of Debug UART Interface
Pin Name
Pin No.
I/O
Description
Comment
DBG_TXD
23
DO
Transmit data
1.8V power domain
DBG_RXD
22
DI
Receive data
1.8V power domain
The logic levels are described in the following table.
Table 13: Logic Levels of Digital I/O
Parameter
Min.
Max.
Unit
VIL
-0.3
0.6
V
VIH
1.2
2.0
V
VOL 0 0.45
V
VOH
1.35
1.8
V
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The module provides 1.8V UART interfaces. A level translator should be used if customers’ application is
equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is
recommended. The following figure shows a reference design.
VCCA VCCB
OE
A1
A2
A3
A4
A5
A6
A7
A8
GND
B1
B2
B3
B4
B5
B6
B7
B8
VDD_EXT
RI
DCD
RTS
RXD
DTR
CTS
TXD
51K
51K
0.1uF
0.1uF
RI_MCU
DCD_MCU
RTS_MCU
RXD_MCU
DTR_MCU
CTS_MCU
TXD_MCU
VDD_MCU
Translator
120K
10K
Figure 20: Reference Circuit with Translator Chip
Please visit http://www.ti.com for more information.
Another example with transistor translation circuit is shown as below. The circuit design of dotted line
section can refer to the circuit design of solid line section, in terms of both module input and output circuit
design. Please pay attention to the direction of connection.
LTE Standard Module Series
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EG91_Hardware_Design 46 / 96
MCU/ARM
TXD
RXD
VDD_EXT
10K
VCC_MCU
4.7K
10K
VDD_EXT
TXD
RXD
RTS
CTS
DTR
RI
RTS
CTS
GND
GPIO DCD
Module
GPIO
EINT
VDD_EXT
4.7K
GND
1nF
1nF
Figure 21: Reference Circuit with Transistor Circuit
Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps.
3.12. PCM and I2C Interfaces
EG91 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the
following modes and one I2C interface:
⚫ Primary mode (short frame synchronization, works as both master and slave)
⚫ Auxiliary mode (long frame synchronization, works as master only)
In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising
edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports
256KHz, 512KHz, 1024KHz or 2048KHz PCM_CLK at 8KHz PCM_SYNC, and also supports 4096KHz
PCM_CLK at 16KHz PCM_SYNC.
In auxiliary mode, the data is also sampled on the falling edge of the PCM_CLK and transmitted on the
rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates
with a 256KHz, 512KHz, 1024KHz or 2048KHz PCM_CLK and an 8KHz, 50% duty cycle PCM_SYNC.
EG91 supports 16-bit linear data format. The following figures show the primary mode’s timing
relationship with 8KHz PCM_SYNC and 2048KHz PCM_CLK, as well as the auxiliary mode’s timing
relationship with 8KHz PCM_SYNC and 256KHz PCM_CLK.
NOTE
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 47 / 96
PCM_CLK
PCM_SYNC
PCM_DOUT
MSB
LSB
MSB
125us
1 2 256255
PCM_DIN
MSB
LSBMSB
Figure 22: Primary Mode Timing
PCM_CLK
PCM_SYNC
PCM_DOUT
MSB
LSB
PCM_DIN
125us
MSB
1 2 3231
LSB
Figure 23: Auxiliary Mode Timing
The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio
codec design.
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EG91_Hardware_Design 48 / 96
Table 14: Pin Definition of PCM and I2C Interfaces
Pin Name
Pin No.
I/O
Description
Comment
PCM_DIN
6
DI
PCM data input
1.8V power domain
PCM_DOUT
7
DO
PCM data output
1.8V power domain
PCM_SYNC
5
IO
PCM data frame
synchronization signal
1.8V power domain
PCM_CLK
4
IO
PCM data bit clock
1.8V power domain
I2C_SCL
40
OD
I2C serial clock
Require an external pull-up to 1.8V
I2C_SDA
41
OD
I2C serial data
Require an external pull-up to 1.8V
Clock and mode can be configured by AT command, and the default configuration is master mode using
short frame synchronization format with 2048KHz PCM_CLK and 8KHz PCM_SYNC. Please refer to
document [2] about AT+QDAI command for details.
The following figure shows a reference design of PCM interface with external codec IC.
PCM_DIN
PCM_DOUT
PCM_SYNC
PCM_CLK
I2C_SCL
I2C_SDA
Module
1.8V
4.7K
4.7K
BCLK
LRCK
DAC
ADC
SCL
SDA
BIAS
MICBIAS
INP
INN
LOUTP
LOUTN
Codec
Figure 24: Reference Circuit of PCM Application with Audio Codec
1. It is recommended to reserve an RC (R=22Ω, C=22pF) circuit on the PCM lines, especially for
PCM_CLK.
2. EG91 works as a master device pertaining to I2C interface.
NOTES
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EG91 Hardware Design
EG91_Hardware_Design 49 / 96
3.13. SPI Interface
SPI interface of EG91 acts as the master only. It provides a duplex, synchronous and serial
communication link with the peripheral devices. It is dedicated to one-to-one connection, without chip
selection. Its operation voltage is 1.8V with clock rates up to 50MHz.
The following table shows the pin definition of SPI interface.
Table 15: Pin Definition of SPI Interface
Pin Name
Pin No.
I/O
Description
Comment
SPI_CLK
26
DO
Clock signal of SPI interface
1.8V power domain
SPI_MOSI
27
DO
Master output slave input of SPI
interface
1.8V power domain
SPI_MISO
28
DI
Master input slave output of SPI
interface
1.8V power domain
The following figure shows a reference design of SPI interface with peripherals.
SPI_MISO
SPI_MOSI
SPI_CLK
Module
SPI_CLK
SPI_MOSI
SPI_MISO
Peripherals
Figure 25: Reference Circuit of SPI Interface with Peripherals
1. SPI interface is not supported on ThreadX modules.
2. The module provides 1.8V SPI interface. A level translator should be used between the module and
the host if customer’s application is equipped with a 3.3V processor or device interface.
NOTES
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EG91_Hardware_Design 50 / 96
3.14. Network Status Indication
The module provides one network indication pin: NETLIGHT. The pin is used to drive a network status
indication LED.
The following tables describe the pin definition and logic level changes of NETLIGHT in different network
status.
Table 16: Pin Definition of Network Status Indicator
Pin Name
Pin No.
I/O
Description
Comment
NETLIGHT
21
DO
Indicate the module’s network activity status
1.8V power domain
Table 17: Working State of Network Status Indicator
Pin Name
Logic Level Changes
Network Status
NETLIGHT
Flicker slowly (200ms High/1800ms Low)
Network searching
Flicker slowly (1800ms High/200ms Low)
Idle
Flicker quickly (125ms High/125ms Low)
Data transfer is ongoing
Always High
Voice calling
A reference circuit is shown in the following figure.
4.7K
47K
VBAT
2.2K
Module
NETLIGHT
Figure 26: Reference Circuit of Network Status Indicator
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EG91_Hardware_Design 51 / 96
3.15. STATUS
The STATUS pin is set as the module’s operation status indicator. It will output high level when the module
is powered on. The following table describes the pin definition of STATUS.
Table 18: Pin Definition of STATUS
Pin Name
Pin No.
I/O
Description
Comment
STATUS
20
DO
Indicate the module’s operation status
1.8V power domain.
If unused, keep it open.
The following figure shows the reference circuit of STATUS.
4.7K
47K
VBAT
2.2K
Module
STATUS
Figure 27: Reference Circuit of STATUS
3.16. ADC Interface
The module provides one analog-to-digital converter (ADC) interface. AT+QADC=0 command can be
used to read the voltage value on ADC0 pin. For more details about the command, please refer to
document [2].
In order to improve the accuracy of ADC voltage values, the traces of ADC should be surrounded by
ground.
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EG91_Hardware_Design 52 / 96
Table 19: Pin Definition of ADC Interface
Pin Name
Pin No.
I/O
Description
Comment
ADC0
24
AI
Force the module to enter
emergency download mode
If unused, keep this pin
open.
The following table describes the characteristics of ADC interface.
Table 20: Characteristics of ADC Interface
Parameter
Min.
Typ.
Max.
Unit
ADC0 Voltage Range
0.3 VBAT_BB
V
ADC Resolution
15
bits
1. It is prohibited to supply any voltage to ADC pins when ADC pins are not powered by VBAT.
2. It is recommended to use resistor divider circuit for ADC application.
3.17. Behaviors of RI
AT+QCFG="risignaltype","physical" command can be used to configure RI behavior. The default RI
behaviors can be changed by AT+QCFG="urc/ri/ring" command. Please refer to document [2] for
details.
No matter on which port URC is presented, URC will trigger the behavior of RI pin.
URC can be outputted from UART port, USB AT port and USB modem port through configuration via
AT+QURCCFG command. The default port is USB AT port.
The default behaviors of the RI are shown as below.
NOTE
NOTES
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 53 / 96
Table 21: Default Behaviors of RI
State
Response
Idle
RI keeps at high level
URC
RI outputs 120ms low pulse when a new URC returns
3.18. USB_BOOT Interface
EG91 provides a USB_BOOT pin. Customers can pull up USB_BOOT to 1.8V before VDD_EXT is
powered up, and the module will enter emergency download mode when it is powered on. In this mode,
the module supports firmware upgrade over USB interface.
Table 22: Pin Definition of USB_BOOT Interface
Pin Name
Pin No.
I/O
Description
Comment
USB_BOOT
75
DI
Force the module to enter
emergency download mode
1.8V power domain.
Active high.
It is recommended to
reserve test point.
The following figures show the reference circuit of USB_BOOT interface and timing sequence of entering
emergency download mode.
Module
USB_BOOT
VDD_EXT
4.7K
Test point
TVS
Close to test point
Figure 28: Reference Circuit of USB_BOOT Interface
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 54 / 96
V
IL
≤
0.5V
VH=0.8V
VBAT
PWRKEY
≥
500ms
RESET_N
VDD_EXT
About 100ms
USB_BOOT
USB_BOOT can be pulled up to 1.8V before
VDD_EXT Is powered up, and the module will
enter emergency download mode when it is
powered on.
NOTE 1
Figure 29: Timing Sequence for Entering Emergency Download Mode
1. Please make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the
time between powering up VBAT and pulling down PWRKEY pin is no less than 30ms.
2. When using MCU to control module to enter the emergency download mode, please follow the above
timing sequence. It is not recommended to pull up USB_BOOT to 1.8V before powering up VBAT.
Short the test points as shown in Figure 28 can manually force the module to enter download mode.
NOTES
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 55 / 96
4 GNSS Receiver
4.1. General Description
EG91 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of
Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS).
EG91 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via
USB interface by default.
By default, EG91 GNSS engine is switched off. It has to be switched on via AT command. For more
details about GNSS engine technology and configurations, please refer to document [3].
4.2. GNSS Performance
The following table shows GNSS performance of EG91.
Table 23: GNSS Performance
Parameter
Description
Conditions
Typ.
Unit
Sensitivity
(GNSS)
Cold start
Autonomous
-146
dBm
Reacquisition
Autonomous
-157
dBm
Tracking
Autonomous
-157
dBm
TTFF
(GNSS)
Cold start
@open sky
Autonomous
34.6
s
XTRA enabled
11.57
s
Warm start
@open sky
Autonomous
26.09
s
XTRA enabled
3.7
s
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 56 / 96
Hot start
@open sky
Autonomous
1.8
s
XTRA enabled
3.4
s
Accuracy
(GNSS)
CEP-50
Autonomous
@open sky
<2.5
m
1. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep
on positioning for 3 minutes.
2. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can
fix position again within 3 minutes after loss of lock.
3. Cold start sensitivity: the lowest GNSS signal value at the antenna port on which the module fixes
position within 3 minutes after executing cold start command.
4.3. Layout Guidelines
The following layout guidelines should be taken into account in customers’ design.
⚫ Maximize the distance among GNSS antenna, main antenna and Rx-diversity antenna.
⚫ Digital circuits such as (U)SIM card, USB interface, camera module and display connector should be
kept away from the antennas.
⚫ Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar
isolation and protection.
⚫ Keep the characteristic impedance for ANT_GNSS trace as 50Ω.
Please refer to Chapter 5 for GNSS antenna reference design and antenna installation information.
NOTES
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 57 / 96
5 Antenna Interfaces
EG91 antenna interfaces include a main antenna interface and an Rx-diversity antenna interface which is
used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS
antenna interface which is only supported on EG91-NA/-NS/-VX/-EX/-NAX. The impedance of the
antenna port is 50Ω.
5.1. Main/Rx-diversity Antenna Interfaces
5.1.1. Pin Definition
The pin definition of main antenna and Rx-diversity antenna interfaces is shown below.
Table 24: Pin Definition of RF Antenna
Pin Name
Pin No.
I/O
Description
Comment
ANT_MAIN
60
IO
Main antenna pad
50Ω impedance
ANT_DIV
(EG91-E)
49
AI
Receive diversity antenna pad
50Ω impedance
ANT_DIV
(EG91-NA/-NS/-VX/
-EX/-NAX)
56
AI
Receive diversity antenna pad
50Ω impedance
5.1.2. Operating Frequency
Table 25: Module Operating Frequencies
3GPP Band
Transmit
Receive
Unit
EGSM900
880~915
925~960
MHz
DCS1800
1710~1785
1805~1880
MHz
WCDMA B1
1920~1980
2110~2170
MHz
LTE Standard Module Series
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EG91_Hardware_Design 58 / 96
WCDMA B2
1850~1910
1930~1990
MHz
WCDMA B4
1710~1755
2110~2155
MHz
WCDMA B5
824~849
869~894
MHz
WCDMA B8
880~915
925~960
MHz
LTE-FDD B1
1920~1980
2110~2170
MHz
LTE FDD B2
1850~1910
1930~1990
MHz
LTE-FDD B3
1710~1785
1805~1880
MHz
LTE FDD B4
1710~1755
2110~2155
MHz
LTE FDD B5
824~849
869~894
MHz
LTE-FDD B7
2500~2570
2620~2690
MHz
LTE-FDD B8
880~915
925~960
MHz
LTE FDD B12
699~716
729~746
MHz
LTE FDD B13
777~787
746~756
MHz
LTE-FDD B20
832~862
791~821
MHz
LTE-FDD B25
1850~1915
1930~1995
MHz
LTE-FDD B26
814~849
859~894
MHz
LTE-FDD B28
703~748
758~803
MHz
5.1.3. Reference Design of RF Antenna Interface
A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A π-type matching
circuit should be reserved for better RF performance. The capacitors are not mounted by default.
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 59 / 96
ANT_MAIN
R1 0R
C1
Module
Main
antenna
NM
C2
NM
R2 0R
C3
Diversity
antenna
NM
C4
NM
ANT_DIV
Figure 30: Reference Circuit of RF Antenna Interface
1. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the
receiving sensitivity.
2. ANT_DIV function is enabled by default. AT+QCFG="diversity",0 command can be used to disable
receive diversity.
3. Place the π-type matching components (R1/C1/C2, R2/C3/C4) as close to the antenna as possible.
5.1.4. Reference Design of RF Layout
For user’s PCB, the characteristic impedance of all RF traces should be controlled as 50Ω. The
impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant,
height from the reference ground to the signal layer (H), and the space between the RF trace and the
ground (S). Microstrip and coplanar waveguide are typically used in RF layout to control characteristic
impedance. The following figures are reference designs of microstrip or coplanar waveguide with different
PCB structures.
.
Figure 31: Microstrip Line Design on a 2-layer PCB
NOTES
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 60 / 96
Figure 32: Coplanar Waveguide Design on a 2-layer PCB
Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)
Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)
In order to ensure RF performance and reliability, the following principles should be complied with in RF
layout design:
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 61 / 96
⚫ Use impedance simulation tool to control the characteristic impedance of RF traces as 50Ω.
⚫ The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully
connected to ground.
⚫ The distance between the RF pins and the RF connector should be as short as possible, and all the
right angle traces should be changed to curved ones.
⚫ There should be clearance area under the signal pin of the antenna connector or solder joint.
⚫ The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around
RF traces and the reference ground could help to improve RF performance. The distance between
the ground vias and RF traces should be no less than two times the width of RF signal traces (2*W).
For more details about RF layout, please refer to document [5].
5.2. GNSS Antenna Interface
The GNSS antenna interface is only supported on EG91-NA/-NS/-VX/-EX/-NAX. The following tables
show pin definition and frequency specification of GNSS antenna interface.
Table 26: Pin Definition of GNSS Antenna Interface
Pin Name
Pin No.
I/O
Description
Comment
ANT_GNSS
(EG91-NA/-NS/-VX/-EX/-NAX)
49
AI
GNSS antenna
50Ω impedance
Table 27: GNSS Frequency
Type
Frequency
Unit
GPS
1575.42±1.023
MHz
GLONASS
1597.5~1605.8
MHz
Galileo
1575.42±2.046
MHz
BeiDou
1561.098±2.046
MHz
QZSS
1575.42
MHz
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 62 / 96
A reference design of GNSS antenna is shown as below.
GNSS
Antenna
VDD
Module
ANT_GNSS
47nH
10R
0.1uF
0R
NM NM
100pF
Figure 35: Reference Circuit of GNSS Antenna
1. An external LDO can be selected to supply power according to the active antenna requirement.
2. If the module is designed with a passive antenna, then the VDD circuit is not needed.
5.3. Antenna Installation
5.3.1. Antenna Requirement
The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna.
Table 28: Antenna Requirements
Type
Requirements
GNSS 1)
Frequency range: 1559MHz~1609MHz
Polarization: RHCP or linear
VSWR: < 2 (Typ.)
Passive antenna gain: > 0dBi
Active antenna noise figure: < 1.5dB
Active antenna gain: > 0dBi
Active antenna embedded LNA gain: < 17dB
GSM/WCDMA/LTE
VSWR: ≤ 2
Efficiency : > 30%
Max input power: 50W
NOTES
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 63 / 96
Input impedance: 50Ω
Cable insertion loss: < 1dB
(EGSM900, WCDMA B5/B8,
LTE-FDD B5/B8/B12/B13/B20/B26/B28)
Cable insertion loss: < 1.5dB
(DCS1800, WCDMA B1/B2/B4, LTE-FDD B1/B2/B3/B4/B25)
Cable insertion loss: < 2dB
(LTE-FDD B7)
1)
It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of
active antenna may generate harmonics which will affect the GNSS performance.
5.3.2. Recommended RF Connector for Antenna Installation
If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector
provided by Hirose.
Figure 36: Dimensions of the U.FL-R-SMT Connector (Unit: mm)
NOTE
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 64 / 96
U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT.
Figure 37: Mechanicals of U.FL-LP Connectors
The following figure describes the space factor of mated connector.
Figure 38: Space Factor of Mated Connector (Unit: mm)
For more details, please visit http://www.hirose.com.
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 65 / 96
6 Electrical, Reliability and Radio
Characteristics
6.1. Absolute Maximum Ratings
Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are
listed in the following table.
Table 29: Absolute Maximum Ratings
Parameter
Min.
Max.
Unit
VBAT_RF/VBAT_BB
-0.3
4.7 V USB_VBUS
-0.3
5.5
V
Peak Current of VBAT_BB
0
0.8
A
Peak Current of VBAT_RF
0
1.8
A
Voltage at Digital Pins
-0.3
2.3
V
6.2. Power Supply Ratings
Table 30: Power Supply Ratings
Parameter
Description
Conditions
Min.
Typ.
Max.
Unit
VBAT
VBAT_BB and
VBAT_RF
The actual input voltages
must be kept between the
minimum and maximum
values.
3.3
3.8
4.3
V
LTE Standard Module Series
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EG91_Hardware_Design 66 / 96
Voltage drop during
burst transmission
Maximum power control
level on EGSM900
400
mV
I
VBAT
Peak supply current
(during transmission
slot)
Maximum power control
level on EGSM900
1.8
2.0
A
USB_VBUS
USB connection
detection
3.0
5.0
5.25
V
6.3. Operation and Storage Temperatures
The operation and storage temperatures are listed in the following table.
Table 31: Operation and Storage Temperatures
Parameter
Min.
Typ.
Max.
Unit
Operation Temperature Range 1)
-35
+25
+75
ºC
Extended Temperature Range 2)
-40 +85
ºC
Storage Temperature Range
-40 +90
ºC
1.
1)
Within operation temperature range, the module is 3GPP compliant.
2.
2)
Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call* (emergency call is not supported on ThreadX
modules), etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum
and no harm to radio network. Only one or more parameters like Pout might reduce in their value and
exceed the specified tolerances. When the temperature returns to the normal operating temperature
levels, the module will meet 3GPP specifications again.
3. “*” means under development.
NOTES
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 67 / 96
6.4. Current Consumption
The values of current consumption are shown below.
Table 32: EG91-E Current Consumption
Parameter
Description
Conditions
Typ.
Unit
I
VBAT
OFF state
Power down
13
uA
Sleep state
AT+CFUN=0 (USB disconnected)
1.1
mA
GSM DRX=2 (USB disconnected)
2.0
mA
GSM DRX=5 (USB suspended)
1.9
mA
GSM DRX=9 (USB disconnected)
1.3
mA
WCDMA PF=64 (USB disconnected)
1.7
mA
WCDMA PF=64 (USB suspended)
2.1
mA
WCDMA PF=512 (USB disconnected)
1.1
mA
LTE-FDD PF=64 (USB disconnected)
2.1
mA
LTE-FDD PF=64 (USB suspended)
2.6
mA
LTE-FDD PF=256 (USB disconnected)
1.4
mA
Idle state
GSM DRX=5 (USB disconnected)
19.0
mA
GSM DRX=5 (USB connected)
29.0
mA
WCDMA PF=64 (USB disconnected)
19.0
mA
WCDMA PF=64 (USB connected)
29.0
mA
LTE-FDD PF=64 (USB disconnected)
19.0
mA
LTE-FDD PF=64 (USB connected)
29.0
mA
GPRS data
transfer
EGSM900 4DL/1UL @32.67dBm
260
mA
EGSM900 3DL/2UL @32.59dBm
463
mA
EGSM900 2DL/3UL @30.74dBm
552
mA
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 68 / 96
EGSM900 1DL/4UL @29.26dBm
619
mA
DCS1800 4DL/1UL @29.2dBm
165
mA
DCS1800 3DL/2UL @29.13dBm
267
mA
DCS1800 2DL/3UL @29.01dBm
406
mA
DCS1800 1DL/4UL @28.86dBm
467
mA
EDGE data
transfer
EGSM900 4DL/1UL PCL=8 @27.1dBm
163
mA
EGSM900 3DL/2UL PCL=8 @27.16dBm
274
mA
EGSM900 2DL/3UL PCL=8 @26.91dBm
383
mA
EGSM900 1DL/4UL PCL=8 @26.12dBm
463
mA
DCS1800 4DL/1UL PCL=2 @25.54dBm
136
mA
DCS1800 3DL/2UL PCL=2 @25.68dBm
220
mA
DCS1800 2DL/3UL PCL=2 @25.61dBm
306
mA
DCS1800 1DL/4UL PCL=2 @25.41dBm
396
mA
WCDMA data
transfer
WCDMA B1 HSDPA CH10700 @22.29dBm
507
mA
WCDMA B1 HSUPA CH10700 @21.79dBm
516
mA
WCDMA B8 HSDPA CH3012 @22.47dBm
489
mA
WCDMA B8 HSUPA CH3012 @21.98dBm
482
mA
LTE data transfer
LTE-FDD B1 CH18300 @22.98dBm
685
mA
LTE-FDD B3 CH19575 @23.23dBm
698
mA
LTE-FDD B7 CH21100 @23.46dBm
723
mA
LTE-FDD B8 CH21625 @23.35dBm
655
mA
LTE-FDD B20 CH24300 @23.41dBm
723
mA
LTE-FDD B28A CH27360 @23.16dBm
660
mA
GSM
voice call
EGSM900 PCL=5 @32.5dBm
258
mA
DCS1800 PCL=0 @29.23dBm
159
mA
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 69 / 96
WCDMA
voice call
WCDMA B1 CH10700 @23.06dBm
555
mA
WCDMA B8 CH3012 @23.45dBm
535
mA
Table 33: EG91-NA Current Consumption
Parameter
Description
Conditions
Typ.
Unit
I
VBAT
OFF state
Power down
13
uA
Sleep state
AT+CFUN=0 (USB disconnected)
1.0
mA
WCDMA PF=64 (USB disconnected)
2.2
mA
WCDMA PF=64 (USB suspended)
2.5
mA
WCDMA PF=512 (USB disconnected)
1.4
mA
LTE-FDD PF=64 (USB disconnected)
2.6
mA
LTE-FDD PF=64 (USB suspended)
2.9
mA
LTE-FDD PF=256 (USB disconnected)
1.7
mA
Idle state
WCDMA PF=64 (USB disconnected)
14.0
mA
WCDMA PF=64 (USB connected)
26.0
mA
LTE-FDD PF=64 (USB disconnected)
15.0
mA
LTE-FDD PF=64 (USB connected)
26.0
mA
WCDMA data
transfer
WCDMA B2 HSDPA CH9938 @22.45 dBm
569
mA
WCDMA B2 HSUPA CH9938 @21.73 dBm
559
mA
WCDMA B4 HSDPA CH1537 @23.05 dBm
572
mA
WCDMA B4 HSUPA CH1537 @22.86 dBm
586
mA
WCDMA B5 HSDPA CH4407 @23 dBm
518
mA
WCDMA B5 HSUPA CH4407 @ 22.88 dBm
514
mA
LTE data
transfer
LTE-FDD B2 CH1100 @23.29 dBm
705
mA
LTE-FDD B4 CH2175 @23.19 dBm
693
mA
LTE Standard Module Series
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EG91_Hardware_Design 70 / 96
LTE-FDD B5 CH2525 @23.39 dBm
601
mA
LTE-FDD B12 CH5060 @23.16 dBm
650
mA
LTE-FDD B13 CH5230 @23.36 dBm
602
mA
WCDMA
voice call
WCDMA B2 CH9938 @23.34 dBm
627
mA
WCDMA B4 CH1537 @23.47 dBm
591
mA
WCDMA B5 CH4357 @ 23.37 dBm
536
mA
Table 34: EG91-NS Current Consumption
Parameter
Description
Conditions
Typ.
Unit
I
VBAT
OFF state
Power down
8
uA
Sleep state
AT+CFUN=0 (USB disconnected)
1.2
mA
WCDMA PF=64 (USB disconnected)
2
mA
WCDMA PF=64 (USB suspended)
2.3
mA
WCDMA PF=512 (USB disconnected)
1.3
mA
LTE-FDD PF=64 (USB disconnected)
2.5
mA
LTE-FDD PF=64 (USB suspended)
2.8
mA
LTE-FDD PF=256 (USB disconnected)
1.6
mA
Idle state
WCDMA PF=64 (USB disconnected)
19.9
mA
WCDMA PF=64 (USB connected)
30.1
mA
LTE-FDD PF=64 (USB disconnected)
21.2
mA
LTE-FDD PF=64 (USB connected)
30.9
mA
WCDMA data
transfer
WCDMA B2 HSDPA CH9938 @22.4 dBm
527
mA
WCDMA B2 HSUPA CH9938 @22.31 dBm
547
mA
WCDMA B4 HSDPA CH1537 @23.01 dBm
575
mA
WCDMA B4 HSUPA CH1537 @22.69 dBm
589
mA
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 71 / 96
WCDMA B5 HSDPA CH4407 @23.05 dBm
553
mA
WCDMA B5 HSUPA CH4407 @ 22.91 dBm
556
mA
LTE data
transfer
LTE-FDD B2 CH1100 @23.26 dBm
724
mA
LTE-FDD B4 CH2175 @23.52 dBm
693
mA
LTE-FDD B5 CH2525 @23.51 dBm
613
mA
LTE-FDD B12 CH5060 @23.39 dBm
634
mA
LTE-FDD B13 CH5230 @23.54 dBm
576
mA
LTE-FDD B25 CH8590@ 23.64 dBm
739
mA
LTE-FDD B26 CH8765@ 23.34 dBm
647
mA
WCDMA
voice call
WCDMA B2 CH9938 @23.39 dBm
571
mA
WCDMA B4 CH1738 @23.27 dBm
593
mA
WCDMA B5 CH4357 @ 23.35 dBm
554
mA
Table 35: EG91-VX Current Consumption
Parameter
Description
Conditions
Typ.
Unit
I
VBAT
OFF state
Power down
9
uA
Sleep state
AT+CFUN=0 (USB disconnected)
TBD
mA
LTE-FDD PF=64 (USB disconnected)
TBD
mA
LTE-FDD PF=64 (USB suspended)
TBD
mA
LTE-FDD PF=256 (USB disconnected)
TBD
mA
Idle state
LTE-FDD PF=64 (USB disconnected)
16.5
mA
LTE-FDD PF=64 (USB connected)
30.8
mA
LTE data
transfer
LTE-FDD B4 CH2175 @23.36dBm
715
mA
LTE-FDD B13 CH5230 @23.38dBm
642
mA
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 72 / 96
Table 36: EG91-EX Current Consumption
Parameter
Description
Conditions
Typ.
Unit
I
VBAT
OFF state
Power down
15
uA
Sleep state
AT+CFUN=0 (USB disconnected)
1.3
mA
GSM DRX=2 (USB disconnected)
2.3
mA
GSM DRX=5 (USB suspend)
2.0
mA
GSM DRX=9 (USB disconnected)
1.6
mA
WCDMA PF=64 (USB disconnected)
1.8
mA
WCDMA PF=64 (USB suspend)
2.1
mA
WCDMA PF=512 (USB disconnected)
1.3
mA
LTE-FDD PF=64 (USB disconnected)
2.3
mA
LTE-FDD PF=64 (USB suspend)
2.6
mA
LTE-FDD PF=256 (USB disconnected)
1.5
mA
Idle state
GSM DRX=5 (USB disconnected)
21.0
mA
GSM DRX=5 (USB connected)
31.0
mA
WCDMA PF=64 (USB disconnected)
21.0
mA
WCDMA PF=64 (USB connected)
31.0
mA
LTE-FDD PF=64 (USB disconnected)
21.0
mA
LTE-FDD PF=64 (USB connected)
31.0
mA
GPRS data
transfer
EGSM900 4DL/1UL @33.06dBm
247.9
mA
EGSM900 3DL/2UL @32.93dBm
450.8
mA
EGSM900 2DL/3UL @31.1dBm
536.4
mA
EGSM900 1DL/4UL @29.78dBm
618
mA
DCS1800 4DL/1UL @29.3dBm
144
mA
DCS1800 3DL/2UL @29.3dBm
253.4
mA
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 73 / 96
DCS1800 2DL/3UL @29.21dBm
355.4
mA
DCS1800 1DL/4UL @29.07dBm
455.7
mA
EDGE data
transfer
EGSM900 4DL/1UL PCL=8 @27.29dBm
169.5
mA
EGSM900 3DL/2UL PCL=8 @27.01dBm
305.06
mA
EGSM900 2DL/3UL PCL=8 @26.86dBm
434
mA
EGSM900 1DL/4UL PCL=8 @25.95dBm
548
mA
DCS1800 4DL/1UL PCL=2 @26.11dBm
135
mA
DCS1800 3DL/2UL PCL=2 @25.8dBm
244
mA
DCS1800 2DL/3UL PCL=2 @25.7dBm
349
mA
DCS1800 1DL/4UL PCL=2 @25.6dBm
455
mA
WCDMA data
transfer
WCDMA B1 HSDPA @22.48dBm
485
mA
WCDMA B1 HSUPA @21.9dBm
458
mA
WCDMA B8 HSDPA @22.6dBm
556
mA
WCDMA B8 HSUPA @22.02dBm
520
mA
LTE data
transfer
LTE-FDD B1 @23.37dBm
605
mA
LTE-FDD B3 @23.3dBm
667
mA
LTE-FDD B7 @23.2dBm
783
mA
LTE-FDD B8 @23.09dBm
637
mA
LTE-FDD B20 @23.21dBm
646
mA
LTE-FDD B28 @22.76dBm
661
mA
GSM
voice call
EGSM900 PCL=5 @32.36dBm
259
mA
DCS1800 PCL=0 @29.5dBm
149
mA
WCDMA
voice call
WCDMA B1 @23.4dBm
494
mA
WCDMA B8 @23.6dBm
608
mA
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 74 / 96
Table 37: EG91-NAX Current Consumption
Parameter
Description
Conditions
Typ.
Unit
I
VBAT
OFF state
Power down
9
uA
Sleep state
AT+CFUN=0 (USB disconnected)
1.1
mA
WCDMA PF=64 (USB disconnected)
2.1
mA
WCDMA PF=64 (USB suspend)
2.2
mA
WCDMA PF=512 (USB disconnected)
1.6
mA
LTE-FDD PF=64 (USB disconnected)
2.6
mA
LTE-FDD PF=64 (USB suspend)
2.7
mA
LTE-FDD PF=256 (USB disconnected)
1.8
mA
Idle state
WCDMA PF=64 (USB disconnected)
16.7
mA
WCDMA PF=64 (USB connected)
32.2
mA
LTE-FDD PF=64 (USB disconnected)
14.0
mA
LTE-FDD PF=64 (USB connected)
32.6
mA
WCDMA data
transfer
WCDMA B2 HSDPA @21.74dBm
528
mA
WCDMA B2 HSUPA @21.47dBm
536
mA
WCDMA B4 HSDPA @22.67dBm
542
mA
WCDMA B4 HSUPA @22.30dBm
550
mA
WCDMA B5 HSDPA @22.63dBm
523
mA
WCDMA B5 HSUPA @22.31dBm
523
mA
LTE data
transfer
LTE-FDD B2 @23.08dBm
694
mA
LTE-FDD B4 @23.31dBm
691
mA
LTE-FDD B5 @23.23dBm
586
mA
LTE-FDD B12 @23.03dBm
613
mA
LTE-FDD B13 @23.13dBm
626
mA
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 75 / 96
LTE-FDD B25 @22.96dBm
689
mA
LTE-FDD B26 @23.11dBm
636
mA
WCDMA
voice call
WCDMA B2 @23.08dBm
581
mA
WCDMA B4 @23.21dBm
557
mA
WCDMA B5 @23.29dBm
534
mA
Table 38: GNSS Current Consumption of EG91
6.5. RF Output Power
The following table shows the RF output power of EG91 module.
Table 39: RF Output Power
Frequency
Max.
Min.
EGSM900
33dBm±2dB
5dBm±5dB
DCS1800
30dBm±2dB
0dBm±5dB
EGSM900 (8-PSK)
27dBm±3dB
5dBm±5dB
DCS1800 (8-PSK)
26dBm±3dB
0dBm±5dB
WCDMA B1/B2/B4/B5/B8
24dBm+1/-3dB
< -49dBm
LTE-FDD B1/B2/B3/B4/B5/B7/
B8/B12/B13/B20/B25/B26/B28
23dBm±2dB
< -39dBm
Parameter
Description
Conditions
Typ.
Unit
I
VBAT
(GNSS)
Searching
(AT+CFUN=0)
Cold start @Passive Antenna
54
mA
Hot Start @Passive Antenna
54
mA
Lost state @Passive Antenna
53
mA
Tracking
(AT+CFUN=0)
Open Sky @Passive Antenna
32
mA
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 76 / 96
In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. The design conforms to the
GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1.
6.6. RF Receiving Sensitivity
The following tables show the conducted RF receiving sensitivity of EG91 module.
Table 40: EG91-E Conducted RF Receiving Sensitivity
Frequency
Primary
Diversity
SIMO
3GPP
EGSM900
-108.6dBm
NA
NA
-102dBm
DCS1800
-109.4 dBm
NA
NA
-102dbm
WCDMA B1
-109.5dBm
-110dBm
-112.5dBm
-106.7dBm
WCDMA B8
-109.5dBm
-110dBm
-112.5dBm
-103.7dBm
LTE-FDD B1 (10MHz)
-97.5dBm
-98.3dBm
-101.4dBm
-96.3dBm
LTE-FDD B3 (10MHz)
-98.3dBm
-98.5dBm
-101.5dBm
-93.3dBm
LTE-FDD B7 (10MHz)
-96.3dBm
-98.4dBm
-101.3dBm
-94.3dBm
LTE-FDD B8 (10MHz)
-97.1dBm
-99.1dBm
-101.2dBm
-93.3dBm
LTE-FDD B20 (10MHz)
-97dBm
-99dBm
-101.3dBm
-93.3dBm
LTE-FDD B28A (10MHz)
-98.3dBm
-99dBm
-101.4dBm
-94.8dBm
Table 41: EG91-NA Conducted RF Receiving Sensitivity
Frequency
Primary
Diversity
SIMO
3GPP
WCDMA B2
-110dBm
-110dBm
-112.5dBm
-104.7dBm
WCDMA B4
-110dBm
-110dBm
-112.5dBm
-106.7dBm
WCDMA B5
-111dBm
-111dBm
-113dBm
-104.7dBm
NOTE
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 77 / 96
LTE-FDD B2 (10MHz)
-98dBm
-99dBm
-102.2dBm
-94.3dBm
LTE-FDD B4 (10MHz)
-97.8dBm
-99.5dBm
-102.2dBm
-96.3dBm
LTE-FDD B5 (10MHz)
-99.6dBm
-100.3dBm
-103dBm
-94.3dBm
LTE-FDD B12 (10MHz)
-99.5dBm
-100dBm
-102.5dBm
-93.3dBm
LTE-FDD B13 (10MHz)
-99.2dBm
-100dBm
-102.5dBm
-93.3dBm
Table 42: EG91-NS Conducted RF Receiving Sensitivity
Frequency
Primary
Diversity
SIMO
3GPP
WCDMA B2
-110dBm
-110dBm
-112.5dBm
-104.7dBm
WCDMA B4
-110dBm
-110dBm
-112.5dBm
-106.7dBm
WCDMA B5
-111dBm
-111dBm
-113dBm
-104.7dBm
LTE-FDD B2 (10MHz)
-98dBm
-99dBm
-102.2dBm
-94.3dBm
LTE-FDD B4 (10MHz)
-97.8dBm
-99.5dBm
-102.2dBm
-96.3dBm
LTE-FDD B5 (10MHz)
-99.4dBm
-100dBm
-102.7dBm
-94.3dBm
LTE-FDD B12 (10MHz)
-99.5dBm
-100dBm
-102.5dBm
-93.3dBm
LTE-FDD B13 (10MHz)
-99.2dBm
-100dBm
-102.5dBm
-93.3dBm
LTE-FDD B25 (10MHz)
-97.6dBm
-99dBm
-102.2dBm
-92.8dBm
LTE-FDD B26 (10MHz)
-99.1dBm
-99.9dBm
-102.7dBm
-93.8dBm
Table 43: EG91-VX Conducted RF Receiving Sensitivity
Frequency
Primary
Diversity
SIMO
3GPP
LTE-FDD B4 (10MHz)
-98.2dBm
-99.2dBm
-102.2dBm
-96.3dBm
LTE-FDD B13 (10MHz)
-99.2dBm
-100dBm
-102.5dBm
-93.3dBm
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 78 / 96
Table 44: EG91-EX Conducted RF Receiving Sensitivity
Frequency
Primary
Diversity
SIMO
3GPP
EGSM900
-109.8dBm
NA
NA
-102dBm
DCS1800
-109.8 dBm
NA
NA
-102dbm
WCDMA B1
-110dBm
-111dBm
-112.5dBm
-106.7dBm
WCDMA B8
-110dBm
-111dBm
-112.5dBm
-103.7dBm
LTE-FDD B1 (10MHz)
-98.7dBm
-98.8dBm
-102.4dBm
-96.3dBm
LTE-FDD B3 (10MHz)
-98.3dBm
-99.5dBm
-102.5dBm
-93.3dBm
LTE-FDD B7 (10MHz)
-97.5dBm
-98.4dBm
-100.3dBm
-94.3dBm
LTE-FDD B8 (10MHz)
-98.7dBm
-99.6dBm
-102.2dBm
-93.3dBm
LTE-FDD B20 (10MHz)
-97dBm
-97.5dBm
-102.2dBm
-93.3dBm
LTE-FDD B28 (10MHz)
-98.2dBm
-99.5dBm
-102dBm
-94.8dBm
Table 45: EG91-NAX Conducted RF Receiving Sensitivity
Frequency
Primary
Diversity
SIMO
3GPP
WCDMA B2
-110dBm
-110dBm
-112.5dBm
-104.7dBm
WCDMA B4
-110dBm
-110dBm
-112.5dBm
-106.7dBm
WCDMA B5
-111dBm
-111dBm
-113dBm
-104.7dBm
LTE-FDD B2 (10MHz)
-98dBm
-99dBm
-102.2dBm
-94.3dBm
LTE-FDD B4 (10MHz)
-97.8dBm
-99.5dBm
-102.2dBm
-96.3dBm
LTE-FDD B5 (10MHz)
-99.4dBm
-100dBm
-102.7dBm
-94.3dBm
LTE-FDD B12 (10MHz)
-99.5dBm
-100dBm
-102.5dBm
-93.3dBm
LTE-FDD B13 (10MHz)
-99.2dBm
-100dBm
-102.5dBm
-93.3dBm
LTE-FDD B25 (10MHz)
-97.6dBm
-99dBm
-102.2dBm
-92.8dBm
LTE-FDD B26 (10MHz)
-99.1dBm
-99.9dBm
-102.7dBm
-93.8dBm
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 79 / 96
6.7. Electrostatic Discharge
The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject
to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and
packaging procedures must be applied throughout the processing, handling and operation of any
application that incorporates the module.
The following table shows the module’s electrostatic discharge characteristics.
Table 46: Electrostatic Discharge Characteristics (25ºC, 45% Relative Humidity)
Tested Interfaces
Contact Discharge
Air Discharge
Unit
VBAT, GND
±5
±10
KV
All Antenna Interfaces
±4
±8
KV
Other Interfaces
±0.5
±1
KV
6.8. Thermal Consideration
In order to achieve better performance of the module, it is recommended to comply with the following
principles for thermal consideration:
⚫ On customers’ PCB design, please keep placement of the module away from heating sources,
especially high power components such as ARM processor, audio power amplifier, power supply, etc.
⚫ Do not place components on the opposite side of the PCB area where the module is mounted, in
order to facilitate adding of heatsink when necessary.
⚫ Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as
to ensure better heat dissipation performance.
⚫ The reference ground of the area where the module is mounted should be complete, and add ground
vias as many as possible for better heat dissipation.
⚫ Make sure the ground pads of the module and PCB are fully connected.
⚫ According to customers’ application demands, the heatsink can be mounted on the top of the module,
or the opposite side of the PCB area where the module is mounted, or both of them.
⚫ The heatsink should be designed with as many fins as possible to increase heat dissipation area.
Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and
module/PCB.
The following shows two kinds of heatsink designs for reference and customers can choose one or both
of them according to their application structure.
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 80 / 96
Heatsink
EG91 Module
Application Board
Application Board
Heatsink
Thermal Pad
Shielding Cover
Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module)
Thermal Pad
Heatsink
Application Board
Application Board
Heatsink
Thermal Pad
EG91 Module
Shielding Cover
Figure 40: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)
1. The module offers the best performance when the internal BB chip stays below 105°C. When the
maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but
provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB
chip temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will
recover to network connected state after the maximum temperature falls below 115°C. Therefore, the
thermal design should be maximally optimized to make sure the maximum BB chip temperature
always maintains below 105°C. Customers can execute AT+QTEMP command and get the
maximum BB chip temperature from the first returned value.
2. For more detailed guidelines on thermal design, please refer to document [6].
NOTES
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 81 / 96
7 Mechanical Dimensions
This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm,
and the dimensional tolerances are ±0.05mm unless otherwise specified.
7.1. Mechanical Dimensions of the Module
25±0.15
29±0.15
2.30±0.2
Pin 1
Figure 41: Module Top and Side Dimensions
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 82 / 96
Figure 42: Module Bottom Dimensions (Top View)
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 83 / 96
7.2. Recommended Footprint
Figure 43: Recommended Footprint (Top View)
For easy maintenance of the module, please keep about 3mm between the module and other
components in the host PCB.
NOTE
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 84 / 96
7.3. Top and Bottom Views of the Module
Figure 44: Top View of the Module
Figure 45: Bottom View of the Module
These are renderings of EG91. For authentic appearance, please refer to the module that you receive
from Quectel.
NOTE
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 85 / 96
8 Storage, Manufacturing and
Packaging
8.1. Storage
EG91 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below.
1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH.
2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other
high temperature processes must be:
⚫ Mounted within 168 hours at the factory environment of ≤30ºC/60%RH.
⚫ Stored at <10%RH.
3. Devices require baking before mounting, if any circumstances below occurs:
⚫ When the ambient temperature is 23ºC±5ºC and the humidity indicator card shows the humidity
is >10% before opening the vacuum-sealed bag.
⚫ Device mounting cannot be finished within 168 hours at factory conditions of ≤30ºC/60%RH.
If baking is required, devices may be baked for 8 hours at 120ºC±5ºC.
As the plastic package cannot be subjected to high temperature, it should be removed from devices
before high temperature (120ºC) baking. If shorter baking time is desired, please refer to
IPC/JEDECJ-STD-033 for baking procedure.
NOTE
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 86 / 96
8.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the
thickness of stencil for the module is recommended to be 0.15mm~0.18mm. For more details, please
refer to document [4].
It is suggested that the peak reflow temperature is 238ºC~245ºC, and the absolute maximum reflow
temperature is 245ºC. To avoid damage to the module caused by repeated heating, it is strongly
recommended that the module should be mounted after reflow soldering for the other side of PCB has
been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and
related parameters are shown below.
Temp. (°C )
Reflow Zone
Soak Zone
245
200
220
238
C
D
B
A
150
100
Max slope: 1~3°C /sec
Cooling down
slope: 1~4°C /sec
Max slope:
2~3°C /sec
Figure 46: Reflow Soldering Thermal Profile
Table 47: Recommended Thermal Profile Parameters
Factor
Recommendation
Soak Zone
Max slope
1 ~ 3°C/sec
Soak time (between A and B: 150°C and 200°C)
60 ~ 120 sec
Reflow Zone
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 87 / 96
8.3. Packaging
EG91 is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until
the devices are ready to be soldered onto the application.
The reel is 330mm in diameter and each reel contains 250pcs modules. The following figures show the
packaging details, measured in mm.
Figure 47: Tape Dimensions
Max slope
2 ~ 3°C/sec
Reflow time (D: over 220°C)
40 ~ 60 sec
Max temperature
238 ~ 245°C
Cooling down slope
1 ~ 4°C/sec
Reflow Cycle
Max reflow cycle
1
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 88 / 96
Direction of feed
Cover tape
13
100
44.5
+0.20
-0.00
48.5
Figure 48: Reel Dimensions
Carrier tape
packing module
Carrier tape
unfolding
1083
Figure 49: Tape and Reel Directions
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 89 / 96
9 Appendix A References
Table 48: Related Documents
SN
Document Name
Remark
[1]
Quectel_EC2x&EG9x_Power_Management_
Application_Note
Power Management Application Note
for EC25, EC21, EC20 R2.0, EC20
R2.1, EG95 and EG91
[2]
Quectel_EG9x_AT_Commands_Manual
AT Commands Manual for EG95 and
EG91
[3]
Quectel_EC25&EC21_GNSS_AT_Commands_
Manual
GNSS AT Commands Manual for EC25
and EC21 modules
[4]
Quectel_Module_Secondary_SMT_User_Guide
Module Secondary SMT User Guide
[5]
Quectel_RF_Layout_Application_Note
RF Layout Application Note
[6]
Quectel_LTE_Module_Thermal_Design_Guide
Thermal design guide for LTE standard,
LTE-A and Automotive modules
[7]
Quectel_UMTS<E_EVB_User_Guide
UMTS<E EVB user guide for
UMTS<E modules
Table 49: Terms and Abbreviations
Abbreviation
Description
AMR
Adaptive Multi-rate
bps
Bits Per Second
CHAP
Challenge Handshake Authentication Protocol
CS
Coding Scheme
CSD
Circuit Switched Data
CTS
Clear To Send
DC-HSPA+
Dual-carrier High Speed Packet Access
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 90 / 96
DFOTA
Delta Firmware Upgrade Over-The-Air
DL
Downlink
DTR
Data Terminal Ready
DTX
Discontinuous Transmission
EFR
Enhanced Full Rate
ESD
Electrostatic Discharge
FDD
Frequency Division Duplex
FR
Full Rate
GMSK
Gaussian Minimum Shift Keying
GSM
Global System for Mobile Communications
HR
Half Rate
HSPA
High Speed Packet Access
HSDPA
High Speed Downlink Packet Access
HSUPA
High Speed Uplink Packet Access
I/O
Input/Output
Inorm
Normal Current
LED
Light Emitting Diode
LNA
Low Noise Amplifier
LTE
Long Term Evolution
MIMO
Multiple Input Multiple Output
MO
Mobile Originated
MS
Mobile Station (GSM engine)
MSL
Moisture Sensitivity Level
MT
Mobile Terminated
PAP
Password Authentication Protocol
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 91 / 96
PCB
Printed Circuit Board
PDU
Protocol Data Unit
PPP
Point-to-Point Protocol
QAM
Quadrature Amplitude Modulation
QPSK
Quadrature Phase Shift Keying
RF
Radio Frequency
RHCP
Right Hand Circularly Polarized
Rx
Receive
SMS
Short Message Service
TDD
Time Division Duplexing
TX
Transmitting Direction
UL
Uplink
UMTS
Universal Mobile Telecommunications System
URC
Unsolicited Result Code
(U)SIM
(Universal) Subscriber Identity Module
Vmax
Maximum Voltage Value
Vnorm
Normal Voltage Value
Vmin
Minimum Voltage Value
VIHmax
Maximum Input High Level Voltage Value
VIHmin
Minimum Input High Level Voltage Value
VILmax
Maximum Input Low Level Voltage Value
VILmin
Minimum Input Low Level Voltage Value
VImax
Absolute Maximum Input Voltage Value
VImin
Absolute Minimum Input Voltage Value
VOHin
Minimum Output High Level Voltage Value
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 92 / 96
VOLmax
Maximum Output Low Level Voltage Value
VOLmin
Minimum Output Low Level Voltage Value
VSWR
Voltage Standing Wave Ratio
WCDMA
Wideband Code Division Multiple Access
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 93 / 96
10 Appendix B GPRS Coding Schemes
Table 50: Description of Different Coding Schemes
Scheme
CS-1
CS-2
CS-3
CS-4
Code Rate
1/2
2/3
3/4
1
USF
3 3 3 3 Pre-coded USF
3 6 6
12
Radio Block excl.USF and BCS
181
268
312
428
BCS
40
16
16
16
Tail
4 4 4 - Coded Bits
456
588
676
456
Punctured Bits
0
132
220
-
Data Rate Kb/s
9.05
13.4
15.6
21.4
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 94 / 96
11 Appendix C GPRS Multi-slot Classes
Thirty-three classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot
classes are product dependent, and determine the maximum achievable data rates in both the uplink and
downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots,
while the second number indicates the amount of uplink timeslots. The active slots determine the total
number of slots the GPRS device can use simultaneously for both uplink and downlink communications.
The description of different multi-slot classes is shown in the following table.
Table 51: GPRS Multi-slot Classes
Multislot Class
Downlink Slots
Uplink Slots
Active Slots
1 1 1 2 2 2 1 3 3 2 2 3 4 3 1 4 5 2 2
4
6 3 2
4
7 3 3
4
8 4 1
5
9 3 2
5
10 4 2 5 11 4 3 5 12 4 4
5
13 3 3
NA
14 4 4
NA
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 95 / 96
15 5 5
NA
16 6 6
NA
17 7 7
NA
18 8 8
NA
19 6 2
NA
20 6 3
NA
21 6 4
NA
22 6 4
NA
23 6 6
NA
24 8 2
NA
25 8 3
NA
26 8 4
NA
27 8 4
NA
28 8 6
NA
29 8 8
NA
30 5 1
6
31 5 2
6
32 5 3
6
33 5 4
6
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 96 / 96
12 Appendix D EDGE Modulation and
Coding Schemes
Table 52: EDGE Modulation and Coding Schemes
Coding Scheme
Modulation
Coding Family
1 Timeslot
2 Timeslot
4 Timeslot
CS-1:
GMSK
/
9.05kbps
18.1kbps
36.2kbps
CS-2:
GMSK
/
13.4kbps
26.8kbps
53.6kbps
CS-3:
GMSK
/
15.6kbps
31.2kbps
62.4kbps
CS-4:
GMSK
/
21.4kbps
42.8kbps
85.6kbps
MCS-1
GMSK
C
8.80kbps
17.60kbps
35.20kbps
MCS-2
GMSK
B
11.2kbps
22.4kbps
44.8kbps
MCS-3
GMSK
A
14.8kbps
29.6kbps
59.2kbps
MCS-4
GMSK
C
17.6kbps
35.2kbps
70.4kbps
MCS-5
8-PSK
B
22.4kbps
44.8kbps
89.6kbps
MCS-6
8-PSK
A
29.6kbps
59.2kbps
118.4kbps
MCS-7
8-PSK
B
44.8kbps
89.6kbps
179.2kbps
MCS-8
8-PSK
A
54.4kbps
108.8kbps
217.6kbps
MCS-9
8-PSK
A
59.2kbps
118.4kbps
236.8kbps
1.1. FCC Certification Requirements.
According to the definition of mobile and fixed device is described in Part 2.1091(b), this
device is a mobile device.
And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications
only. The antenna installation and operating configurations of this transmitter, including
any applicable source-based time- averaging duty factor, antenna gain and cable loss
must satisfy MPE categorical Exclusion Requirements of 2.1091.
2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and
the user’s body and must not transmit simultaneously with any other antenna or
transmitter.
3.A label with the following statements must be attached to the host end product: This
device contains FCC ID: XMR201909EG91NAX.
4.To comply with FCC regulations limiting both maximum RF output power and human
exposure to RF radiation, maximum antenna gain (including cable loss) must not
exceed:
❒ WCDMA II:≤9.00 dBi
❒ WCDMAIV:≤6.000 dBi
❒ WCDMA V:≤10.416 dBi
❒ LTE Band 2:≤8.500dBi
❒ LTE Band 4:≤5.500dBi
❒ LTE Band 5:≤9.916dBi
❒ LTE Band 12:≤9.234dBi
❒ LTE Band 13:≤9.673 dBi
❒ LTE Band 25:≤8.000dBi
❒ LTE Band 26:≤9.416dBi
5. This module must not transmit simultaneously with any other antenna or
transmitter
6. The host end product must include a user manual that clearly defines operating
requirements and conditions that must be observed to ensure compliance with current
FCC RF exposure guidelines.
For portable devices, in addition to the conditions 3 through 6 described above, a
separate approval is required to satisfy the SAR requirements of FCC Part 2.1093
If the device is used for other equipment that separate approval is required for all other
operating configurations, including portable configurations with respect to 2.1093 and
different antenna configurations.
For this device, OEM integrators must be provided with labeling instructions of finished
products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two
paragraphs:
A certified modular has the option to use a permanently affixed label, or an electronic
label. For a permanently affixed label, the module must be labeled with an FCC ID Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual
must provide clear instructions explaining to the OEM the labeling requirements,
options and OEM user manual instructions that are required (see next paragraph).
For a host using a certified modular with a standard fixed label, if (1) the module’s FCC
ID is not visible when installed in the host, or (2) if the host is marketed so that end
users do not have straightforward commonly used methods for access to remove the
module so that the FCC ID of the module is visible; then an additional permanent label
referring to the enclosed module:“Contains Transmitter Module FCC ID:
XMR201909EG91NAX” or “Contains FCC ID: XMR201909EG91NAX” must be used.
The host OEM user manual must also contain clear instructions on how end users can
find and/or access the module and the FCC ID.
The final host / module combination may also need to be evaluated against the FCC
Part 15B criteria for unintentional radiators in order to be properly authorized for
operation as a Part 15 digital device.
The user’s manual or instruction manual for an intentional or unintentional radiator shall
caution the user that changes or modifications not expressly approved by the party
responsible for compliance could void the user's authority to operate the equipment. In
cases where the manual is provided only in a form other than paper, such as on a
computer disk or over the Internet, the information required by this section may be
included in the manual in that alternative form, provided the user can reasonably be
expected to have the capability to access information in that form.
This device complies with part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and (2)
this device must accept any interference received, including interference that may
cause undesired operation.
Changes or modifications not expressly approved by the manufacturer could void the
user’s authority to operate the equipment.
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