Panasonic SC-EN25P, SC-EN26P, SC-EN27PC Schematic

CD Stereo System

SC-EN25P SC-EN26P SC-EN27PC

Colour

(S)............Silver Type

System

SC-EN25P

Main Unit: SA-EN25P

Speakers: SB-EN25P

SC-EN26P

Main Unit: SA-EN26P

Speakers: SB-EN26P

SC-EN27PC

Main Unit: SA-EN27PC

Speakers: SB-EN25P

ORDER NO.AD0603021CE

Specifications

MAIN UNIT

RADIO

Frequency range:

FM; 87.9 - 107.9 MHz (200kHz steps)

87.5 - 108.0 MHz (100kHz steps)

M; 520 to 1710 kHz (10kHz steps)

Intermediate Frequency:

FM; 10.7MHz

M; 450kHz

CD PLAYER

Sampling frequency: 44.1kHz

Decoding: 16 bit linear

Beam source: Semiconductor laser (wavelength

795nm)

Number of channels: 2 channel, stereo

Wow and flutter: Less than possible measurement

data

D/A converter: MASH(1 bit DAC)

Terminals

Input: MUSIC PORT; 3.5mm stereo

(33kΩ)

Output: PHONES: 3.5mm stereo (32Ω)

GENERAL

Power supply: AC120V, 60Hz

Power consumption: 16W

Dimensions (W×H×D): 241×206×206mm

(9-1/2”×8-1/8”×8-1/8”)

Mass: 3.1kg (6lb. 13oz.) with speakers

1.8kg (3lb. 15oz.) without speakers

SPEAKERS

Full range: 8cm (3-1/8”), 6Ω×2

Dimensions (W×H×D): 91mm×206mm×176mm

(3-19/32”×8-1/8”×6-15/16”)

Power consumption in standby mode: 2.0W

Note:

SC-EN25P / SC-EN26P / SC-EN27PC

Specifications are subject to change without notice. Mass and dimensions are approximate.

MPEG Layer-3 audio decording technology

licenced from Fraunhofer IIS and Thomson multimedia.

CONTENTS

Page Page

1 Accessories 3

2 Location of Control

3 Safety Precaution

4 Protection Circuitry

5 Handling Precautions For Traverse Deck (Optical Pickup)

6 Precaution of Laser Diode

7 Prevention of Electro Static Discharge (ESD) To

Electrostatically (ES) Devices

8 Handling the Lead-free Solder

8.1. About lead free solder (PbF)

9 Operation Checks and Component Replacement

9.1. Main Unit

9.2. Speaker

10 Self Diagnostic Function

10.1. Setting of self diagnostic Function

11 Description of Error Code

11.1. Error detection for CD Mechanism block

12 Schematic Diagram

12.1. Schematic Diagram Notes

12.2. Schematic Diagram 21

12.3. Voltage Value

13 Printed Circuit Board

14 Block Diagram

15 Wiring Connection Diagram

16 Measurements and Adjustments

16.1. Tuner Adjustment

16.2. Adjustment Point

17 Terminal Functions of ICs

18 Replacement Parts List

18.1. SA-EN25P,SA-EN26P and SA-EN27PC

18.2. SB-EN25P

18.3. SB-EN26P

19 Cabinet Parts Location

19.1. Main Unit

19.2. Speaker(SB-EN25)

19.3. Speaker(SB-EN26)

20 Packaging

1 Accessories

· Remote control........................................................1pc.

(N2QAGB000037): SC-EN25/26 (N2QAGB000038): SC-EN27

· AC power supply cord (RJA0065-1D).......................1pc.

2 Location of Control

SC-EN25P / SC-EN26P / SC-EN27PC

Batteries.........................................................................2pc

· FM/AM loop antenna (N1DADYY00003)...................1pc.

Note:

· The included AC power supply cord is for use with this unit

only. Do not use it with other equipment.

SC-EN25P / SC-EN26P / SC- EN27PC

3 Safety Precaution

(This “Safety Precaution” is applied only in U.S.A.)

1. Before servicing, unplug the power cord to prevent an electric shock.

2. When replacing parts, use only manufacturer’s recommended components for safety.

3. Check the condition of the power cord. Replace if wear or damage is evident.

4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.

5. Before returning the serviced equipment to the customer, be sure to make the following insulation resistance test to prevent the customer from being exposed to a shock hazard.

Insulation Resistance Test

1. Unplug the power cord and short the two prongs of the plug with a jumper wire.

2. Turn on the power switch.

3. Measure the resistance value with ohmmeter between the jumper AC plug and each exposed metal cabinet part, such as screw heads, control shafts, handle brackets, etc. Equipment with antenna terminals should read between 3MΩ and 5.2MΩ to allexposedparts. (Fig.A) Equipment without antenn a terminals should read approximately infinity to all exposed parts. (Fig.B) *Note: Some exposed partsmay beisolated from the chassis by design. These will read infinity.

(Fig.A)

(Fig.B)

4. If the measurement is outside the specified limits, there is a possibility of a shock hazard. The equipment should be repaired and rechecked before it is returned to the customer.

SC-EN25P / SC-EN26P / SC- EN27PC

4 Protection Circuitry

The protection circuitry may have operated if either of the following conditions are noticed:

· No sound is heard when the power is turned on.

· Stop during a performance.

The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are “shorted”, or if speaker with an impedance less than the indicated rated impedance of the amplifier are used.

If this occurs, follow the procedure outline below:

1. Turn off the power.

2. Determine the cause of the problem and correct it.

3. Turn on the power once again after one minute.

Note:

When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again.

5 Handling Precautions For Traverse Deck (Optical

Pickup)

The laser diode in the traverse deck (optical pickup) may break down due to potential caused by static electricity of clothes or human body. So, be careful of electrostatic breakdown during repair of the traverse deck (optical pickup).

· Handling of traverse deck (optical pickup)

1. Do not subject the traverse deck (optical pickup) to static electricity as it is extremely sensitive to electrical shock.

2. To prevent the breakdown of the laser diode, an antistatic shorting pin is inserted into flexible board (FFC board).(Fig.1)

3. Take care not to apply excessive stress to the flexible board (FFC board). When removing or connecting the short pin, finish the job in as short time as possible.

4. Do not turn the variable resistor (laser power adjustment). It has already been adjusted.

· Grounding for electrostatic breakdown prevention

1. Human body grounding (Fig.2)

Use the anti-static wrist strap to discharge the static electricity from your body.

2. Work table grounding (Fig.2)

Put a conduc tive material (sheet) or steel sheet on the area where the traverse deck (optical pickup) is place, and ground the sheet.

Caution:

The static electricity of your clothes will not be grounded through the wrist strap. So, take care not to let your clothes touch the traverse deck (optical pickup).

Caution when replacing the Traverse Deck

The traverse deck has a short point shorted with solder to protect the laser diode against electrostatics breakdown. Be sure to remove the solder from the short point before making connections.

SC-EN25P / SC-EN26P / SC- EN27PC

(Fig.1)

(Fig.2)

6 Precaution of Laser Diode

Caution:

This unit utilizes a class 1 laser. Invisible laser radiation is emitted from the optical pickup lens. When the unit is turned on:

1. Do not look directly into the pickup lens.

2. Do not use optical instruments to look at the pickup lens.

3. Do not adjust the preset variable resister on the pickup lens.

4. Do not disassemble the optical pickup unit.

5. If the optical pickup is replaced, use the manufacturer’s specified replacement pickup only.

6. Use of control or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

CAUTION!

THIS PRODUCT UTILIZES A LASER. USE OF CONTROLS OR ADJUSTMENTS OR PERFORMANCE OF PROCEDURES OTHER THAN THOSE SPECIFIED HEREIN MAY RESULT IN HAZARDOUS RADIATION EXPOSURE.

SC-EN25P / SC-EN26P / SC- EN27PC

7 Prevention of Electro Static Discharge (ESD) To

Electrostatically (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES Devices are integrated circuits and some field-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).

1. Immediately before handlin g any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, Which should be removed for potential shock resons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal devices. Some solder removal devices not classified as “anti-static (ESD protected)” can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficie nt to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices.(Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

8 Handling the Lead-free Solder

8.1. About lead free solder (PbF)

Distinction of PbF P.C.B.:

P.C.B.s (manufactured) using lead free solder will have a PbF stamp on the P.C.B.

Caution

· Pb free solder has a higher melting point than standard solder; Typically the melting point is 50-70°F (30 - 40°C)

higher.Please use a high temperature soldering iron. In case of the soldering iron with temperature control, please set it to 700± 20 °F (370 ± 10°C).

· Pb free solder will tent to splash when heated too high (about 1100°F/600°C).

· W hen soldering or unsoldering, please completely remove all of the solder on the pins and solder area, and be sure to heat

the soldering points with the Pb free solder until it melts enough.