Panasonic DMRE-100 Service manual

Table Of Contents

COVER

1 SAFETY PRECAUTIONS

1.1 GENERAL GUIDELINES

1.1.1 LEAKAGE CURRENT COLD CHECK

1.1.2 LEAKAGE CURRENT HOT CHECK (See Figure 1 .)

2 PREVENTION OF ELECTRO STATIC DISCHARGE (ESD) TO ELECTROSTATICALLY SENSITIVE (ES) DEVICES

3 Precaution of Laser Diode

4 Handling the Lead-free Solder

4.1 About lead free solder (PbF)

5 Service Explorer

5.1 Service Explorer Express

5.2 Service Explorer in Detail

5.2.1 Does not operate

5.2.2 Poor Pictures

5.2.3 Other

5.2.4 Some defective functions

5.2.5 Caution when replacing the parts

6 Standard Inspection Specifications after Making Repairs

6.1 Standard Inspection Specification

6.2 Adjustment Procedures

6.2.1 Power Supply Adjustment

6.2.2 Audio Level Meter Adjustment (Automatically)

7 Assembling and Disassembling

7.1 Disassembly flow chart

7.2 P.C.B. Positions

7.3 The Top Cover

7.4 The Front panel

7.5 The Front (R) P.C.B.

7.6 The Front (L) and DV Jack P.C.B.

7.7 The SD & PC card P.C.B.

7.8 The ATAPI and DRIVE-ATAPI P.C.B.

7.9 The Digital P.C.B.

7.10 The DVD-RAM Drive

7.11 HDD

7.12 The Rear panel

7.12.1 In case of removing Fan motor from Rear panel

7.13 The Power Supply P.C.B. and Main P.C.B.

7.14 The Scart P.C.B. and SHIELD P.C.B.

7.15 The VIF Decoder P.C.B. and Nicam / Decoder P.C.B.

8 Service Positions

8.1 Checking procedure

8.2 Checking the Digital P.C.B.

8.3 Checking the Main P.C.B. and FRONT (L), (R) P.C.B.

8.4 Checking the Power Supply P.C.B.

8.5 Specifications for HDD Spin-up / Spin-down

9 List of Various Mode

9.1 List of Various Buttons

9.2 Special modes at a glance

9.2.1 Service modes

9.2.2 Other special modes

9.2.3 List of the U / H / F Error Displays

9.3 The information table of an error generating disk

9.3.1 Error generating disk type

9.3.2 Error generating disk state

9.3.3 Disk production maker ID

10 Abbreviations

11 Voltage and Waveform Chart

11.1 Power Supply P.C.B.

11.2 Main P.C.B.

11.3 Scart P.C.B.

11.4 Nicam / Decorder P.C.B.

11.5 Front (L) P.C.B.

11.6 Front (R) P.C.B.

11.7 PS9001, PS9002, PS9003 Connectors

11.8 PP9701, PP9702 Waveform

12 Block Diagram

12.1 Power Supply Block Diagram

12.1.1 Integrated Circuit Power Supply Chart ( PSC 1 - PSC 24 )

12.2 Analog Video Block Diagram

12.3 Analog Audio Block Diagram

12.4 Timer Block Diagram

12.5 Digital Section Block Diagram

12.5.1 Digital Video Section Block Diagram

12.5.2 Digital Audio Section Block Diagram

12.5.3 Digital Block IC Pin Terminal Chart (TC1-TC37)

13 Schematic Diagram

13.1 Interconnection Schematic Diagram

13.2 Main Power Supply Schematic Diagram

13.3 Sub Power Supply Schematic Diagram (P) ( Main P.C.B. 1 / 5 )

13.4 Main Net Schematic Diagram (M) ( Main P.C.B. 2 / 5 )

13.5 Video I / O Schematic Diagram (V) ( Main P.C.B. 3 / 5 )

13.6 Audio Schematic Diagram (A) ( Main P.C.B. 4 / 5 )

13.7 Timer Schematic Diagram (T) ( Main P.C.B. 5 / 5 )

13.8 Digital Net Schematic Diagram (DN) ( Digital P.C.B. 1 / 9 )

13.9 AV Input Schematic Diagram (AI) ( Digital P.C.B. 2 / 9 )

13.10 AV Encoder Schematic Diagram (EN) ( Digital P.C.B. 3 / 9 )

13.11 AV Decoder Schematic Diagram (AD) ( Digital P.C.B. 4 / 9 )

13.12 System Control Schematic Diagram (S) ( Digital P.C.B. 5 / 9 )

13.13 Glue Schematic Diagram (G) ( Digital P.C.B. 6 / 9 )

13.14 1394 DV Schematic Diagram (DV) (Digital P.C.B. 7 / 9)

13.15 Real Time Stream (RTSC) Schematic Diagram (DS) (Digital P.C.B. 8 / 9)

13.16 MPEG4 Schematic Diagram (MP) (Digital P.C.B. 9 / 9)

13.17 ATAPI Schematic Diagram

13.18 Drive ATAPI Schematic Diagram

13.19 Scart Schematic Diagram

13.20 VIF Decorder Schematic Diagram

13.21 Nicam / Decorder Schematic Diagram

13.22 SD & PC Card Schematic Diagram

13.23 Front (L) Schematic Diagram

13.24 Front (R) Schematic Diagram

14 Print Circuit Board

14.1 Power Supply P.C.B.

14.2 Main P.C.B.

14.2.1 Main P.C.B. ( Section 1 / 4 )

14.2.2 Main P.C.B. ( Section 2 / 4 )

14.2.3 Main P.C.B. ( Section 3 / 4 )

14.2.4 Main P.C.B. ( Section 4 / 4 )

14.2.5 Main P.C.B. Address Information

14.3 Digital P.C.B.

14.3.1 Digital P.C.B. ( Section 1 / 2 )

14.3.2 Digital P.C.B. & DV Jack P.C.B. ( Section 2 / 2 )

14.3.3 Digital P.C.B. Address Information

14.4 Drive ATAPI & ATAPI P.C.B.

14.5 Scart P.C.B.

14.5.1 Scart P.C.B. (Section 1 / 2)

14.5.2 Scart P.C.B. (Section 2 / 2)

14.6 VIF Decorder P.C.B.

14.7 Nicam / Decorder P.C.B.

14.8 SD & PC Card P.C.B.

14.9 Front ( L ) & ( R ) P.C.B.

15 Exploded Views

15.1 Casing Parts & Mechanism Section 1

15.2 Casing Parts & Mechanism Section 2

15.3 Packing & Accessories Section

16 Replacement Parts List

17 Schematic Diagram for printing with A4 size

Service Manual

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ORDER NO.DSD0309017C2

DVD Video Recorder

● DMR-E100HEE

Colour

(S).......................Silver Type

Specifications

Power supply: AC220-240 V, 50 Hz Power consumption: 48 W

Recording system: DVD video recording standards (DVD-RAM),

Optical pick-up: System with 1 lens, 2 integration units (657 nm wavelength for DVDs, 785 nm wavelength for CDs) Recordable discs: 12 cm 4.7 GB DVD-RAM discs

Recording time: (with 4.7GB disc): Max. 6 hours

(with built-in 80GB HDD): Max. 106 hours

Region number: Region No.5

(Approx. 3W (Stand by mode))

DVD video standards (DVD-R)

12 cm 9.4 GB DVD-RAM discs 8 cm 2.8 GB DVD-RAM discs 12 cm 4.7 GB DVD-R discs (for General Ver. 2.0/4X-SPEED DVD-R Revision 1.0) 8 cm 1.4 GB DVD-Rdiscs (for General Ver. 2.0)

XP: 60 minutes SP: 120 minutes LP: 240 minutes EP: 360 minutes

XP: 17 hours SP: 34 hours LP: 68 hours EP: 106 hours

Playable discs: 12 cm 4.7 GB DVD-RAM discs

12 cm 9.4 GB DVD-RAM discs 8 cm 2.8 GB DVD-RAM discs 12 cm 4.7 GB DVD-R discs (for General Ver. 2.0) 8 cm 1.4 GB DVD-R discs (for General Ver. 2.0) DVD-VIDEOdiscs CD-Audio discs (CD-DA) Video CD discs DVD-Audio discs CD-R/ CD-RW discs

(CD-DA, Video CD, MP3 formatted discs)

Built-in HDD Capacity: 80GB Drive Unit: High Speed Drive (correspond to 4 times speed with DVD-R disc) Television System

Tuner System: PAL-BGH, I, DK/ SECAM-BG, DK Channel Coverage:

OIRT (DK) VHF: Ch R1-R12,

CCIR (BGH) VHF: Ch E2-E12,

UHF: Ch 21-69

CATV: Ch 44MHz-470MHz

UHF: Ch 21-69

CATV: Ch S01-S05, M1-M10, U1-U10, S21-S41

(PAL-I) UHF: Ch 21-69

RF Converter Output: Not provided

Video

Video System: SECAM (Only Input)/ PAL colour signal, 625 lines, 50 fields NTSC colour signal, 525 lines, 60 fields Recording System: MEPG2 (Hybrid VBR), MPEG4 (VBR) Video in: AV1/AV2 (21 pin), AV3/AV4 (pin jack)

S-Video in: AV2 (21 pin), AV3/AV4 (S terminal)

1Vp-p 75 ohm, terminated

RGB In: AV2 (21 pin), 0.7Vp-p (PAL) 75 ohm, terminated Video Out: AV1/AV2 (21 pin), Video Out (pin jack)

S-Video Out: AV1 (21 pin), S-Video Out(S terminal)

1Vp-p 75 ohm, terminated

RGB Out: AV1 (21 pin) 0.7Vp-p (PAL) 75 ohm, terminated DV Input: 4 pin Audio

Recording system: Dolby Digital 2ch, Linear PCM

2ch (XP mode), G.726 (MPEG4)

Audio In: AV1/AV2 (21pin) AV3/AV4 (pin jack)

Input Level: Standard: 0.5 Vrms

Full scale: 2 Vrms at 1k Hz

Input Impedance: More than 10k ohm

Audio Out: AV1/AV2 (21 pin) Audio Out (pin jack)

Output Level: Standard: 0.5 Vrms

Full scale: 2 Vrms at 1k Hz

Output impedance: less than 1k ohm

Digital Audio Out: Optical terminal (PCM, Dolby Digital, DTS, MPEG) SD/PC Card Slot

SD Memory Card Slot: 1 pc.

PC Card Slot (Type II): 1 pc. Still Picture (JPEG, TIFF)

Compatible Media

(SD Card Slot):

SD Memory Card, MultiMediaCard

Compatible Media

(PC Card Slot):

Format: FAT12, FAT16

Image File Format: JPEG conforming to DCF (Design rule for Camera File system), (Sub sampling 4:2:2 or 4:2:0) TIFF (Uncompressed RGB chunky), DPOF Compatible

Number of pixels: 320×240 to 6144×4096

Thawing Time: Approx. 7 sec. (2 Mpixels) SD Video (MPEG4,

MPEG2)

Compatible Media

(SD Card Slot):

Compatible Media

(PC Card Slot):

MPEG4

Codec: Video: MPEG4 conforming,

Number of pixels: super fine/fine: 320×240 (QVGA),

Recording rate (max): superfine: 1050 kbps,

File format: SD-Video format conforming (ASF)

MPEG2 *Recording coversion and transfer is possible from card to HDD or DVD-RAM disc.

Codec: MPEG2

File format: SD-Video format conforming

Dimensions: Approx.

Mass: Approx. 5.5 kg (12.13 lbs) Operating temperature: 5°C-40°C (41°F-104°F) Operating humidity range: 10%-80% RH (no condensation) Clock unit: Quartz-controlled 12-hour digital display

A PC Card adaptor conforming to PC Card Standards, ATA Flash PC Card, PC Card Adaptor (SD Memory Card, xD-Picture Card, Microdrive, Multi MediaCard, CompactFlash, SmartMedia, Memory Stick), Mobile hard disc

SD Memory Card, MultiMediaCard (restricted to fine, normal, economy of MPEG4)

Mobile hard disk (Only read)

Audio: G.726 conforming

normal/economy: 176×144 (QCIF)

fine: 430 kbps, normal: 300 kbps, economy: 100 kbps (include Audio transfer rate as 32 kbps)

*After Video Recording coversion and transfer to HDD or DVD-RAM disc, the playback is possible.

(SD-Video Entertainment Video Profile) (VR conversion and transfer is possible from card to HDD or DVD-RAM disc)

430 (W)×79 (H)×296 (D) mm [Approx. 1615/ 16“(W)×31/ 8” (H)×1111/ 16” (D)] (excludingprotrusions)

LASER Specification

Class 1 LASER Product

Wave length: 779-791 nm 653-662 nm Laser power: No hazardous radiation is emitted with the safety protection. Solder:

This model uses lead free solder (PbF).

Notes:

Mass and dimensions are approximate.

Specifications are subject to change without notice.

Notes:

The part of DVD RAM Drive (VXY1789) is listed separately.

Please refer to ORDER NO. RAM0307003C0.

1 SAFETY PRECAUTIONS

TOP

1.1 GENERAL GUIDELINES

1.1.1 LEAKAGE CURRENT COLD CHECK

1.1.2 LEAKAGE CURRENT HOT CHECK (See Figure 1 .)

1.1 GENERAL GUIDELINES

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1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.1.1 LEAKAGE CURRENT COLD CHECK

1.1.2 LEAKAGE CURRENT HOT CHECK (See Figure 1 .)

1.1.1 LEAKAGE CURRENT COLD CHECK

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1. Unplug the AC cord and connect a jumper between the two prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to thechassis, the reading should be

between 1MΩ and 5.2MΩ. When the exposed metal does not have a return path to the chassis, the reading must be

Figure 1

1.1.2 LEAKAGE CURRENT HOT CHECK (See

Figure 1 .)

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1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15μF capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in

Figure 1 .

3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outsideof the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.

2 PREVENTION OF ELECTRO STATIC DISCHARGE (ESD) TO ELECTROSTATICALLY SENSITIVE (ES) DEVICES

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Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistorsand semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, whichshould be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparableconductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)sufficient to damage an ES device).

3 Precaution of Laser Diode

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4 Handling the Lead-free Solder

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4.1 About lead free solder (PbF)

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Caution:

● Pb free solder has a higher melting point than standard solder; Typically the melting point is

50 - 70°F (30 - 40°C) higher. Please use a high temperature soldering iron. In case of the soldering iron with temperature control,please set it to 700 ± 20°F (370 ± 10°C).

● Pb free solder will tend to splash when heated too high (about 1100°F/600°C).

● When soldering or unsoldering, please completely remove all of the solder on the pins or

solder area, and be sure to heat the soldering points with the Pb free solder until it melts enough.

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5 Service Explorer

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The Service Explorer provides information about all possible causes based on the symptoms and gives step by step instructions making parts. It consists of two parts, based on applications: the first is the “Service Explorer Express” andthe second is “Service Explorer in Detail”.

1. For details about the service / test modesetting mentioned in the description, refer to the “List of various modes”.

❍ Service mode setting: While the power is off, press TIME SLIP, STOP, and OPEN /

CLOSE simultaneously for five seconds.

❍ Process mode 1 setting: While the power is off, press SKIP(R), TIME SLIP, and

OPEN / CLOSE simultaneously for five seconds.

2. For disassembly and replacement procedures, refer to the “Assembling and Disassemling”.

5.1 Service Explorer Express

5.2 Service Explorer in Detail

5.2.1 Does not operate

5.2.2 Poor Pictures

5.2.3 Other