Pace LS3000en Service Manual

LS 3000
Optical Inspection System
Operation Manual
P/N 5050-0517
Rev A-CB
System Operations Manual, Rev A
EXTREME CARE WHILE HANDLING AND USING
1. Packing Contents, Standard Items
a. Packing contents (Standard Items)
Description Part Number
Rigid Probe 1106-0046-P1 Fiber Probe End piece 1106-0049-P1 Large PCB Holder (2) 1400-0001-01-P1 Med PCB Holder (2) 1400-0001-02-P1 Small PCB Holder (4) 1400-0001-03-P1 Small PCB Tray 1400-0050-P1 Single Gooseneck 6007-0020-P1
2. Specifications:
120 VAC Unit 8007-0401 230 VAC Unit 8007-0402 Dimensions H: 510mm (20”) W: 635mm (25”)
D: 660mm (26”) Weight 32kg (70lbs) Magnification 100x – 375x with object 3.3mm
(13”) away from probe using a
381mm (15”) diagonal monitor Field of View 1.5mm (.06”) – 6.35mm (.25”) with
object at 6.35mm (.25mm) away
from probe using 381mm (15”)
diagonal monitor Focus Distance 0 – 228mm (9”) with 381mm (15”)
diagonal monitor Minimum Standoff
.05mm (.002”) Height (distance between
top of PCB and underside of
component)
Minimum Distance
2.54mm (.1”) Between Components Optics Probe Fiber Optic rigid probe with
stainless steel protective cap
Lighting Type Adjustable Metal Halide Light
Source Maximum PCB Size 510mm (20”) x 610mm (24”) Camera Hi-Resolution CCD Camera Agency Approvals CE
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System Operations Manual, Rev A
Optional Accessories
- Flexible Optics Probe 0.38mm (.015”)
diameter. P/N 1106-0047-P1
- Dual Fiber Light Gooseneck. P/N 6007-
0021-P1
- 15” LCD Flat Panel Monitor P/N 7015-
0010
Right Angle Light Bar:
- 12.7mm (.5”) Wide: P/N 1106 -
0048-03-P1
- 25.4mm (1”) Wide: P/N 1106-
0048-02-P1
- 38.1mm (1.5”) Wide: P/N 1106-
0048-01-P1
Figure 1: LS 3000
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System Operations Manual, Rev A
3. Safety Information
a. Follow all manufacturer safety precautions listed in this manual. b. Ensure system is used only in accordance with the following
procedures. c. Immediately replace any worn or damaged items d. Do not open the back panel while system is in use.
EXTREME CARE WHILE HANDLING AND USING
4. Features
a. The LS 3000 is the newest, cost effective, optical inspection system
specifically designed for today’s electronics. It’s primary use is for
inspection of area array devices including PBGA’s, CSP’s, Flip
Chips, LBGA’s, CBGA’s etc. However, the LS 3000 has a wide
range of other inspection used on any SMT or through-hole base
PCB. The LS 3000 is ideal for periodically monitoring the
performance of production or rework reflow equipment. It is also a
critical inspection/monitoring instrument for R&D labs and process
development departments when developing new processes of
troubleshooting problems. b. The LS 3000 features a high resolution CCD chip camera and
incorporates industrial quality endoscopic components to acquire
images. The video signal can be sent to a stand-alone monitor or
can be routed to a PC via a video acquisition card. The system
comes standard with front lighting through the endoscope and with
back lighting from one fiber light gooseneck and one end piece.
Both back and front lighting can be adjusted independently. An
optional dual gooseneck for back lighting is also available. The
camera head on the LS 3000 can be moved in the Y direction using
a fine adjustment knob on the side of the system, which allows the
user to scan an entire side of a device with ease. c. The LS 3000 verifies your process integrity so you can have
absolute confidence in your production or rework process.
5. Un-packing
Your LS 3000 system comes completely contained in one cardboard box, which has been secured to a shipping palette. If you have purchased the optional monitor, it will come packaged in it’s own box and will be attached to the top of the system box.
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System Operations Manual, Rev A
Starting with the LS 3000 container, please use the following steps to safely unpack;
a. If your system came with the monitor, cut or loosen any straps,
which hold the monitor box to the main assembly box. Set monitor
box aside. b. The cardboard box holding your LS 3000 will come strapped to a
palette. This can be left intact or the straps holding it to the palette
can be removed and the box removed from the palette. c. Carefully cut any tape holding the main assembly box top together
and open the box top. d. The interior of the box contains several, custom cut, foam packing
trays. The top packing tray will have a set of Velcro straps running
though it. e. Un-do the Velcro straps as shown in figure 2 and carefully remove
the top foam-packing tray. This will reveal the camera head
assembly, which has been removed from the main system for
shipping.
Figure 2 Und oing the Velcro Straps
f. The camera head assembly is still connected to the main unit via
it’s wiring which will be clearly seen. Carefully lift the camera head
assembly without placing any strain on the wiring and remove the
second foam-packing tray as shown in figure 3. This is the packing
tray that previously cradled the camera head assembly.
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System Operations Manual, Rev A
Figure 3. Removing the Camera Head Assembly from Packaging
g. Prior to proceeding with the unpacking process it is advisable to
first attach the camera head assembly to the main unit. This can
be done as follows;
i. Loosen the coarse height adjustment knob as show in figure
4. Do not remove the knob.
Figure 4. Loosening the Coarse Adjustment Knob
ii. Carefully slide the camera head assembly onto the camera
head assembly post on the main frame of the system as show in figure 5. It does not need to be at any specific height at this point.
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