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RM-8/RM-47 Series Transceivers
7 - System Module
Draft 1 10/2004 |
♥Nokia Corporation |
RM-8/RM-47 |
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System Module |
CCS Technical Documentation |
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Draft 1 10/2004 |
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RM - 8/RM-47 |
CCS Technical Documentation |
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System Module |
Table of Contents |
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Page No |
Glossary of Terms..................................................................................................................................... |
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4 |
Baseband Module Introduction ........................................................................................................... |
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7 |
Features ...................................................................................................................................................... |
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8 |
Environmental Specifications............................................................................................................... |
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9 |
Normal and extreme voltages ........................................................................................................... |
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Temperature conditions ...................................................................................................................... |
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Humidity ............................................................................................................................................... |
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10 |
Vibration ............................................................................................................................................... |
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10 |
ESD strength ........................................................................................................................................ |
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Technical Specifications ....................................................................................................... |
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UEME ...................................................................................................................................................... |
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DC Characteristics ............................................................................................................. |
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............. 13 |
Power Distribution............................................................................................................. |
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............. 14 |
Tiku ......................................................................................................................................................... |
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Main Features .................................................................................................................. |
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Memory Block................................................................................................................... |
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Memory ................................................................................................................................................. |
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NOR Flash...................................................................................................................... |
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.................... 16 |
SDRAM.......................................................................................................................... |
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16 |
Charging ................................................................................................................................................ |
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17 |
Battery ................................................................................................................................................... |
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19 |
Interfaces .............................................................................................................................................. |
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19 |
FM-Radio....................................................................................................................... |
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19 |
IrDA.............................................................................................................................................. |
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20 |
Camera......................................................................................................................... |
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22 |
SIM............................................................................................................................................... |
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24 |
FBUS ........................................................................................................................... |
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26 |
USB ............................................................................................................................ |
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27 |
UI Interface................................................................................................................... |
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28 |
RF Interface ................................................................................................................... |
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33 |
Test Pattern ................................................................................................................... |
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33 |
Test Points........................................................................................................................................ |
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35 |
Main board A side of PWB ............................................................................................................... |
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Main board B side of PWB ............................................................................................................... |
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36 |
RF Module Introduction......................................................................................................... |
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37 |
RF Frequency Plan .............................................................................................................................. |
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38 |
DC Characteristics .............................................................................................................................. |
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38 |
Regulators..................................................................................................................... |
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38 |
Typical Current Consumption.................................................................................................... |
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39 |
Power Distribution............................................................................................................. |
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40 |
RF Characteristics ............................................................................................................................... |
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40 |
RF Block Diagram ............................................................................................................................... |
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43 |
Frequency Synthesizers......................................................................................................... |
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44 |
Receiver ....................................................................................................................... |
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44 |
Transmitter .................................................................................................................... |
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44 |
Front End...................................................................................................................... |
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44 |
Power Amplifier................................................................................................................ |
............... |
45 |
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Page 3 |
RM-8/RM-47 |
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System Module |
CCS Technical Documentation |
RF ASIC Helgo |
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AFC function ................................................................................................................... |
................. 46 |
Antenna ............................................................................................................................................. |
46 |
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Glossary of Terms
ACI |
Accessory Control Interface |
ADC |
Analog Digital Converter |
AMSL |
After Market Service Leader |
ASIC |
Application Specific Integrated Circuit |
ASIP |
Application Specific Integrated Passive |
ADSP |
Application DSP (expected to run high level tasks) |
ARM |
Advanced RISC Machines |
BB |
Baseband |
CCP |
Compact Camera Port |
CDSP |
Cellular DSP (expected to run low level tasks) |
COF |
Chip on foil |
COG |
Chip On Glass |
CSTN |
Color Super Twisted Nematic |
CTSI |
Clock Timing Sleep and Interrupt block of Tiku |
DCT4.5 |
Digital Core Technology, generation 4.5 |
DSP |
Digital Signal Processor |
EMC |
Electro Magnetic Compatibility |
ESD |
Electro Static Discharge |
FR |
Full Rate |
FSTN |
Film compensated Super Twisted Nematic |
GSM |
Global System Mobile |
HW |
Hardware |
IF |
Interface |
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IHF |
Integrated Hands Free |
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IMEI |
International Mobile Equipment Identity |
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IR |
Infrared |
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IrDa |
Infrared Data Association |
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LCD |
Liquid Crystal Display |
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LDO |
Low Drop Out |
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LED |
Light Emitting Diode |
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MCU |
Microprocessor Control Unit |
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NTC |
Negative temperature Coefficient, temperature sensitive resistor |
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used as a temperature sensor. |
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PA |
Power Amplifier (RF) |
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PDA |
Personal Digital Assistant |
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PDRAM |
Program/Data RAM (on chip in Tiku) |
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Phoenix |
SW tool of DCT4.x |
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PUP |
General Purpose IO (PIO), USARTS and Pulse Width Modulators |
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PWB |
Printed Wired Board |
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PopPortTM |
BB4.x system connector. It includes: USB, Stereo headset, Fbus. |
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RTC |
Real Time Clock, small circuitry that keeps track of updating the |
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clock counter and the calendar. To keep it update without (or |
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empty) battery, an alternative power source can be used: small |
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battery or large capacitor. |
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SARAM |
Single Access RAM |
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SIM |
Subscriber Identification Module |
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SW |
Software |
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SWIM |
Subscriber / Wallet Identification Module |
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SPR |
Standard Product Requirements |
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STI |
Serial Trace Interface |
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TCXO |
Temperature controlled Oscillator |
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Tiku |
Successor of the UPP, officially Tiku Edge |
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UEME |
Universal Energy Management Enhanced |
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UEMEK |
Successor of UEME |
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UI |
User Interface |
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USB |
Universal Serial Bus |
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UPP |
Universal Phone Processor |
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♥Nokia Corporation |
Page 7 |
RM-8/RM-47 |
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System Module |
CCS Technical Documentation |
Baseband Module Introduction
This chapter describes the baseband module for the RM-8/RM-47 program. The baseband module includes the baseband engine chipset, the UI components and acoustical parts of the transceiver.
The RM-8/RM-47 is a hand-portable GSM900/GSM1800/GSM1900 phone for the fashion segment, having the DCT4.5 generation baseband and RF circuitry. The key driver for this product is the implementation of EDGE, introducing true multimedia capability from WCDMA in GSM single mode.
RM-8/RM-47 is equipped with the DCT4 connector, supporting most of the DCT4 accessories. The battery interface is relative new consisting of only 3 connections. Standard battery is BL-4C battery with 760mAh capacity.
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Features
The HW specific features of the RM-8/RM-47 phone:
•Fold phone with easily exchangeable fabrics.
•Tripleband Engine (900, 1800, 1900)
•EDGE (EGPRS): MSC 10 (4+2)
•FR, EFR, AMR codecs
•Integrated Camera and Colour Displays
•MMS (Multi Media Messaging), Java MIDP, SyncML & xHTML
•USB Interface to PC
•IrDA
•FM Radio
•IHF
•PopPortTM Accessory support
Accessories:
•Chargers: ACP-12, LCH-9, LCH-12 and AC-1.
•Car accessories: HF-3 and BHF-3.
•Audio accessories: HDB-4, HS-5, LPS-4, HS-3, AD-5B and MD-1
•Connectivity accessories: DKU-2 and HDA-10.
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Page 9 |
RM-8/RM-47 |
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CCS Technical Documentation |
Environmental Specifications
Normal and extreme voltages
Following voltages are assumed as normal and extreme voltages for used battery:
Table 1: Normal and extreme voltages
Voltage |
Voltage [V] |
Condition |
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General Conditions |
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Nominal voltage |
3,700 |
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Lower extreme voltage |
3,145 |
1 |
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Higher extreme voltage |
4,230 |
2 |
(fast charging) |
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HW Shutdown Voltages |
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Vmstr+ |
2,1 ± 0,1 |
Off to on |
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Vmstr- |
1,9 ± 0,1 |
On to off |
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SW Shutdown Voltages |
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Sw shutdown |
3,1 |
In call |
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Sw shutdown |
3,2 |
In idle |
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Min Operating Voltage |
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Vcoff+ |
3,1 ± 0,1 |
Off to on |
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Vcoff- |
2,8 ± 0,1 |
On to off |
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1ADC settings in the SW might shutdown the phone above this value.
2During fast charging of an empty battery, the voltage might exceed this value. Voltages between
4.20and 4.60 might appear for a short while.
Temperature conditions
•Operational temperature range (all specifications met within this range): –5°C.. +55°C (stationary use)
•Functional temperature range (reduced performance): –30°C.. +70°C
•Storage temperature range: –30°C.. +85°C
Temperatures at –10°C, +25°C and +55°C are used for the cpk analysis.
The baseband module complies with the SPR4 Operating Conditions.
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Humidity
Relative humidity range is 5...95%.
The BB module is not protected against water. Condensed or splashed water might cause malfunction. Any submerge of the phone will cause permanent damage. Long-term high humidity, with condensation, will cause permanent damage because of corrosion.
The baseband module complies with the SPR4 Operating Conditions.
Vibration
The baseband module complies with the SPR4 Operating Conditions.
ESD strength
Standard for electrostatic discharge is IEC 61000-4-2 and level 4 requirements are fulfilled.
The baseband module complies with the SPR4 Operating Conditions.
Draft 1 10/2004 |
♥Nokia Corporation |
Page 11 |
RM-8/RM-47 |
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System Module |
CCS Technical Documentation |
Technical Specifications
UEME
UEME is the Universal Energy Management Enhanced IC for digital hand portable phones. In addition to energy management, the UEME functionality performs all baseband mixed–signal functions.
The different states of the UEME are explained below.
No supply
In the NO_SUPPLY mode the UEME has no supply voltage (VBAT < VMSTR and VBACK<V_BUCOFF-). This mode is due to the fact, that both the main battery and the backup battery are either disconnected or both discharged to a low voltage level.
The UEME will recover from NO_SUPPLY into the RESET mode, if the VBAT voltage level rises above the VMSTR+ level, by either reconnecting the main battery or charging it to such level.
Backup
In the BACK_UP mode the main battery is either disconnected or has a low voltage level (VBAT < VMSTRand VBACK > V_BUCOFF+).
The regulator VRTC that supplies the real time clock is disabled in the BACK_UP mode. Instead the unregulated backup battery voltage VBACK supplies the output of the VRTC. All other regulators are disabled and the phone has no functionality.
The UEME will recover from the BACK_UP mode into the RESET mode if VBAT rises above VMSTR+.
Power off
In order for the UEME to be in the PWR_OFF mode, it must have supply voltage (VBAT > VMSTR+).
The VRTC regulator is enabled and supplying the RTC within the UEME. The UEME will enter the RESET mode after a 20 ms delay whenever one of the below listed conditions is logically true:
•The power button is activated.
•Charger connection is detected.
•RTC alarm is detected.
The UEME will enter PWR_OFF from all other modes except NO_SUPPLY and BACK_UP if the internal watchdog elapses.
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Reset
When the UEME enters the RESET mode from the PWR_OFF mode the watchdog is enabled. If the VBAT fails to rise above the power-up voltage level VCOFF+ (3.1 V), before the watchdog elapses, the UEME will enter the PWR_OFF mode. Otherwise, after a 200 ms delay the regulator VFLASH1 will be enabled and after an additional delay of 500 _s, the regulators VANA, VIO, VCORE and VR3 will be enabled. All other regulators i.e. VFLASH2, VSIM, VR1, VR2 and VR4 – VR7 are software controlled and disabled by default. After an additional delay of 20 ms, the UEME enters the PWR_ON mode.
Power on
In PWR_ON the UEME is fully functional in the sense that all internal circuits are powered up or can be by means of software. The UEME will enter the PWR_OFF mode if VBAT drops below VCOOFfor a period of time longer than 5 _s. The UEME will furthermore enter the PWR_OFF mode if either of the watchdogs Operational State Machine (approx. 100 _s), Security (32 sec.) or Power Key (4 sec.) elapses or if any of the regulators triggers the thermal protection circuitry.
Sleep
The UEME can be forced into the SLEEP mode by the Tiku by setting the input SLEEPX low for more than 60 _s. This state is entered when the external Tiku activity is low (phone in sleep) and thereby lowering the internal current consumption of the UEME. The regulator VANA is disabled and VR1 – VR7 are either disabled or in low quiescent mode. From SLEEP the UEME enters PWR_ON if SLEEPX goes high, the PWR_OFF mode if watchdog elapses or the BACK_UP mode if VBAT drops below VMSTR-.
Protection mode
The UEME has two separate protection limits for over temperature conditions, one for the charging switch and one for the regulators. The temperature circuitry measures the onchip temperature. In case of charging over temperature, the circuit turns the charging switch off. In case of over temperature in any of the regulators, the UEME powers off.
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Page 13 |
RM-8/RM-47 |
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CCS Technical Documentation |
DC Characteristics
The figures in the following table reflect the specification of the voltage and current regulators within the UEME.
Table 2: UEME Regulator Output and State in Sleep
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Voltage (V) |
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Current (mA) |
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Name |
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Filter |
Comment |
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Min |
Nom |
Max |
Max |
Sleep |
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Max |
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VANA |
2.70 |
2.78 |
2.86 |
80 |
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2 |
5uA minimum for stability. |
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Controlled by the UEME. Disabled |
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in Sleep mode. |
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VFLASH1 |
2.61 |
2.78 |
2.95 |
70 |
1.5 |
1 |
5uA minimum for stability. Con- |
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trolled by the UEME. |
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VIO |
1.72 |
1.80 |
1.88 |
150 |
0.5 |
3 |
5uA minimum for stability. Con- |
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trolled by the UEME. |
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VCORE |
1.41 |
1.50 |
1.59 |
200 |
0.2 |
1 |
5uA minimum for stability. |
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MCUSW is setting the voltage. |
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VAUX1 |
1.745 |
1.80 |
1.855 |
50 |
0.5 |
1 |
Voltage level is set by MCUSW. |
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2.91 |
3.0 |
3.09 |
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VAUX2 |
2.70 |
2.78 |
2.86 |
70 |
0.5 |
1 |
5uA minimum for stability. |
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VAUX3 |
2.70 |
2.78 |
2.86 |
10 |
0.5 |
1 |
5uA minimum for stability. |
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VSIM |
1.745 |
1.80 |
1.855 |
25 |
0.5 |
- |
5uA minimum for stability. |
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2.91 |
3.00 |
3.09 |
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VR1A/B |
4.60 |
4.75 |
4.90 |
10 |
- |
4 |
Disabled in Sleep mode. The max- |
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imum current is for 1 regulator |
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active. If both are used, maxi- |
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mum 5mA each. |
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VR2 |
2.70 |
2.78 |
2.86 |
100 |
- |
5 |
100uA minimum for stability. |
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(2.61) |
(2.78) |
(2.95) |
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Active during (Sleepmode). |
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VR3 |
2.70 |
2.78 |
2.86 |
20 |
- |
4 |
100uA minimum for stability. |
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Controlled by the UEME. |
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VR4 |
2.70 |
2.78 |
2.86 |
50 |
0.1 |
6 |
100uA minimum for stability. |
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VR5 |
2.70 |
2.78 |
2.86 |
50 |
0.1 |
7 |
100uA minimum for stability. |
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VR6 |
2.70 |
2.78 |
2.86 |
50 |
0.1 |
7 |
100uA minimum for stability. |
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VR7 |
2.70 |
2.78 |
2.86 |
45 |
- |
7 |
100uA minimum for stability. |
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Draft 1 10/2004 |
RM-8/RM-47
CCS Technical Documentation |
System Module |
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Power Distribution
The connection of the miscellaneous power connection can be seen in the following overview.
Figure 1: Power distribution
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Vbus |
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CHARGER |
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TOMAHAWK |
NUT |
Vcc |
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HF- |
Amplifier |
VBAT |
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VOUT |
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SPEAKER |
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IR |
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VBAT |
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Module |
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ESD |
PAOUTN |
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VCharOut |
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VCharIN |
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PAOUTP |
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UEMEK |
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LED |
VBAT |
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VIBRA |
ESD |
Vibra |
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driver |
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ESD |
PwrOnX |
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BTEMP |
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BB Regulators |
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Display |
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illumination |
MALTA |
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LS |
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2.78V |
VAUX2 |
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LCD |
Display |
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“PWR Key” |
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RF CODECS |
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2.78V |
VAUX3 |
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RF Regulators |
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DRIVER |
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AUDIO CODEC |
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2.78V |
VANA |
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VR1A |
4.75V |
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LED |
VBAT |
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VR1B |
4.75V |
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DIGITAL |
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2.78V |
VFLASH1 |
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driver |
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VR2 |
2.78V |
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BLOCKS |
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1.8/3.0V |
VSIM |
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ESD |
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VR3 |
2.78V/3.6V |
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BSI |
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1.8/3.0V |
VAUX1 |
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VR4 |
2.78V/3.6V |
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1.0-1.8V |
VCORE |
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illumination |
IZU |
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VR5 |
2.78V/3.6V |
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DIGITAL |
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1.8V |
1.8V VIO |
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LCD |
Display |
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VR6 |
2.78V/3.6V |
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BLOCKS |
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DRIVER |
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VR7 |
2.78V/3.6V |
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Dlight |
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KLight |
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LED |
VBAT |
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driver |
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VRefRF02 VRefRF01 |
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SleepClk |
SleepX |
UEMRstX |
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Keyb Light |
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VBack |
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PURX |
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KEYBOARD |
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VBack |
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VCORE_LIN |
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CCP |
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Camera |
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FM Radio |
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VBAT |
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VIO |
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LM2708 |
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VBAT |
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VXO |
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1.5V |
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HELGA |
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TIKU |
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VBAT_RF |
RF |
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EDGE |
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VCORE |
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RFClock |
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BATT |
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FLASH 128Mb |
VIO |
VIO |
SDRAM 64Mb |
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BSI |
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ZOCUS - C |
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Lynx |
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Battery |
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VBAT |
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Draft 1 10/2004 |
♥Nokia Corporation |
Page 15 |
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