Nokia 3300 Service Manual 09 nem2 sysmod

CCS Technical Documentation
NEM-2 Series Transceivers
System Module and User
Interface
Issue 1 07/03 Copyright Nokia. All rights reserved.
NEM-2
System Module and User Interface CCS Technical Documentation
Page No
Glossary of Terms.......................................................................................................... 5
Introduction.................................................................................................................... 8
Electrical Modules .......................................................................................................8
Interconnection Diagram .............................................................................................9
Temperature Conditions ............................................................................................10
Humidity ....................................................................................................................10
Absolute Maximum Ratings ......................................................................................10
DC Characteristics .....................................................................................................11
Main Supply ............................................................................................................ 11
Phone....................................................................................................................... 11
BB Regulators ......................................................................................................... 11
Audio Player regulators .......................................................................................... 12
User Interface Modules................................................................................................ 13
Keyboard ....................................................................................................................13
Display .................................................................................................................... 13
LCD & Keyboard Illumination ..................................................................................14
UI B2B-Connector .....................................................................................................14
System Module : Baseband.......................................................................................... 16
Baseband Technical Specifications ...........................................................................16
DC Characteristics................................................................................................... 16
Power Distribution diagram .................................................................................... 17
Baseband External and Internal Signals and Connections ........................................18
FM Radio Interface ................................................................................................. 24
Internal Speaker....................................................................................................... 25
Integrated HF Speaker............................................................................................. 25
External Signals and Connections .............................................................................25
Battery connector .................................................................................................... 25
Bottom Connector ................................................................................................... 26
DC Plug ................................................................................................................... 28
Audio Line In Connector......................................................................................... 28
SIM connector ......................................................................................................... 29
MMC Connector ..................................................................................................... 29
Internal Signals and Connections ..............................................................................30
Internal microphone ................................................................................................ 30
Internal speaker ....................................................................................................... 30
Vibra ....................................................................................................................... 30
Audio player............................................................................................................ 30
Phone- Audio Player Interface (MADI).................................................................. 32
Baseband Functional Description ................................................................................ 33
Modes of Operation ...................................................................................................33
No Supply................................................................................................................ 33
Back-up ................................................................................................................... 33
Acting Dead............................................................................................................. 33
Active ...................................................................................................................... 33
Sleep Mode.............................................................................................................. 34
Charging .................................................................................................................. 34
Battery ..................................................................................................................... 34
Page 2 Copyright Nokia. All rights reserved. Issue 1 07/03
NEM-2
CCS Technical Documentation System Module and User Interface
Supply Voltage Distribution ......................................................................................36
Phone....................................................................................................................... 37
Audio Player............................................................................................................ 38
Power Up, Power Down and Reset ............................................................................40
Phone....................................................................................................................... 40
Audio Player............................................................................................................ 40
Clocking .....................................................................................................................40
This clock is distributed to audio codec as well. .......................................................41
Phone- Audio Player Interface (MADI) ....................................................................42
Power and Reset ...................................................................................................... 42
Wake- Up ................................................................................................................ 42
Communication ....................................................................................................... 43
Audio....................................................................................................................... 43
Audio Player ..............................................................................................................43
Audio Features ........................................................................................................ 43
Audio routing and conditioning .............................................................................. 43
FM Radio ...................................................................................................................46
SIM Interface........................................................................................................... 46
MultiMediaCard MMC ........................................................................................... 47
Flash Memory ......................................................................................................... 47
Ringing Tone Speaker and Amplifier ..................................................................... 47
Audio Digital Signal Processor (ADSP) ................................................................. 47
External Accessory Regulator................................................................................. 48
Acoustics ....................................................................................................................48
Earpiece................................................................................................................... 48
Microphone ............................................................................................................. 49
Ringing tone speaker............................................................................................... 49
Vibra........................................................................................................................ 49
Headset .................................................................................................................... 49
Batteries .....................................................................................................................50
Main Battery............................................................................................................ 50
Backup Battery........................................................................................................ 50
Flash Programming ....................................................................................................50
RF Module Introduction............................................................................................... 51
RF Frequency Plan ....................................................................................................52
DC characteristics ......................................................................................................53
Regulators................................................................................................................ 53
Typical current consumption................................................................................... 54
RF characteristics......................................................................................................... 55
Power Distribution .................................................................................................. 55
Channel Numbers and Frequencies......................................................................... 56
Main RF characteristics........................................................................................... 56
Transmitter characteristics ...................................................................................... 56
Receiver characteristics........................................................................................... 57
RF Block Diagram .................................................................................................. 57
RF Block Diagram NEM-2 ..................................................................................... 58
Frequency Synthesizers .............................................................................................59
Receiver .....................................................................................................................59
Issue 1 07/03 Copyright Nokia. All rights reserved.. Page 3
NEM-2
System Module and User Interface CCS Technical Documentation
Transmitter .................................................................................................................59
Front End................................................................................................................. 60
Power Amplifier...................................................................................................... 61
RF ASIC Helgo ....................................................................................................... 61
AFC function........................................................................................................... 61
Antenna .................................................................................................................. 61
Page 4 Copyright Nokia. All rights reserved. Issue 1 07/03
NEM-2
CCS Technical Documentation System Module and User Interface

Glossary of Terms

ACI Accessory Control Interface
ADC Analog-Digital Converter
AEC Acoustic Echo Canceller
AFC Automatic Frequency Control
AGC Automatic Gain Control
ALWE Background noise suppressor
AMS After Market Service
API Application Programming Interface
ARM Processor architecture
ASIC Application Specific Integrated Circuit
BB Baseband
CBus Control Bus connecting UPP_WD2 with AEM and UEMK
CMT Cellular Mobile Telephone (MCU and DSP)
CPU Central Processing Unit
CTSI Clocking Timing Sleep Interrupt
COG Chip On Glass
CSP Chip Scale Package
CSTN Color Super Twisted Nematic
DAC Digital-Analog Converter
DAI Digital Audio Interface
DB Dual band
DCS1800 Digital Cellular system at 1800 MHz
DCT3 Digital Core Technology, 3rd generation
DCN Offset Cancellation control signal
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NEM-2
System Module and User Interface CCS Technical Documentation
DLL Dynamic Link Library
DRC Dynamic Range Controller
DSP Digital Signal Processor
EGSM Extended – GSM
EFR Enhanced Full Rate
EGPRS Enhanced General Packet Radio Service
EMC Electromagnetic compatibility
EMI Electromagnetic Interference
ESD Electro Static Discharge
EXT RF External RF
FBUS Asynchronous Full Duplex Serial Bus
GPRS General Packet Radio Service
GSM Global System for Mobile communications
HS Half Rate Speech
HSCSD High Speed Circuit Switched Data
IC Integrated Circuit
I/O Input/Output
LCD Liquid Crystal Display
LDO Low Drop-Out
LNA Low Noise Amplifier
MBUS 1-wire half duplex serial bus
MCU Micro Controller Unit
MFI Modulator and Filter Interface
PA Transmit Power Amplifier
Page 6 Copyright Nokia. All rights reserved. Issue 1 07/03
NEM-2
CCS Technical Documentation System Module and User Interface
PC Personal Computer
PCM Pulse Code Modulation
PCM SIO Synchronous serial bus for PCM audio transferring
PWB Printed Wiring Board
RF Radio Frequency
SIM Subscriber Identity Module
UEMK Universal Energy Management
UI User Interface
UPP Universal Phone Processor
VCXO Voltage Controlled Crystal Oscillator
VCTCXO Voltage Controlled Temperature Compensated Crystal Oscillator.
Issue 1 07/03 Copyright Nokia. All rights reserved.. Page 7
NEM-2
System Module and User Interface CCS Technical Documentation

Introduction

Electrical Modules

The NEM-2 phone comprises two modules: the main PWB (EM21) and UI PWB (EM20)
The system module EM11 consists of Radio Frequency (RF) and baseband (BB). User Inter­face (UI) contains only LCD connector, backlight LEDs, keypad layout and Earpiece cir­cuit.
FM radio is located on the main PWB EM21.
The modules are connected with each other by B2B connectors.
In general NEM-2 baseband hardware consists of two parts:
GSM Phone
Audio Player
Phone part is based on DCT4 common baseband architecture. Qwerty-keyboard is con­nected to UPP ASIC.
Audio Player part contains functionality needed for stereo audio features. MMC interface and USB interface are included as well.
Phone controls power up and reset of Audio Player part via dedicated hardware signals. In operational modes both parts are running asynchronous, communication takes place via UART based asynchronous serial interface.
Special audio routing provides for the connection between audio sources and audio out­puts. Audio lines are part of the Phone- Audio Player interface as well.
The purpose of the RF block is to receive and demodulate the radio frequency signal from the base station and to transmit a modulated RF signal to the base station.
Page 8 Copyright Nokia. All rights reserved. Issue 1 07/03
NEM-2
CCS Technical Documentation System Module and User Interface

Interconnection Diagram

Figure 1: Interconnection diagram
Issue 1 07/03 Copyright Nokia. All rights reserved.. Page 9
NEM-2
System Module and User Interface CCS Technical Documentation

Temperature Conditions

Env. Condition Ambient temperature Note
Normal operation -20°C … +55°C/
-4°F … +131°F
Reduced performance -40°C … -20°C/
-40°F… -4°F and +55°C … +85°C/ +131°F...+185°F
No operation or storage <-40°C or > +85°C/
<-40°F or > +185°F

Humidity

The modules are not protected against water. Condensated or splashed water might cause malfunction momentarily. Long term wetness will cause permanent damage.

Absolute Maximum Ratings

Absolute maximum ratings are specified below.
Parameter Min. typ. Max. Unit Note
Battery Voltage
Charger Input Voltage
Specifications fulfilled except FMR is only up to +14°F
For LCD only up to +176°F
No operation or storage. An attempt to operate may dam­age the phone permanently
0.3
0.3
5.5 V
20 V
Page 10 Copyright Nokia. All rights reserved. Issue 1 07/03
NEM-2
CCS Technical Documentation System Module and User Interface

DC Characteristics

Main Supply
Signal min. typ. max. Unit Note
VBAT 3.1 3.6 5.1 V
Phone
Signal min. typ. max. Unit Note
BB Regulators
VANA 2.70 2.78 2.86 V I
VFLASH1 2.70 2.78 2.86 V I
VFLASH2 2.70 2.78 2.86 V I
VSIM 1.745
2.91
1.8
3.0
1.855
3.09VV
VIO 1.72 1.8 1.88 V I
VCORE 1.0
1.235
1.425
1.710
1.053
1.3
1.5
1.8
1.106
1.365
1.575
1.890
V V V V
= 80mA
max
= 70mA, I
max
= 40mA
max
I
= 25mA, I
max
= 150mA, I
max
I
= 200mA, I
max
Default value = 1.5V
Signal min. typ. max. Unit Note
VR1A 4.6 4.75 4.9 V
VR1B 4.6 4.75 4.9 V Not used
VR2 2.70
3.20
2.78
3.30
2.86
3.40VV
I
max
= 100mA
sleep
sleep
sleep
sleep
= 2.0mA
= 0.5mA
= 0.5mA
= 0.2mA
VR3 2.70 2.78 2.86 V I
max
= 20mA
VR4 2.70 2.78 2.86 V
VR5 2.70 2.78 2.86 V I
VR6 2.70 2.78 2.86 V I
VR7 2.70 2.78 2.86 V I
= 50mA, I
max
= 50mA, I
max
= 45mA
max
sleep
sleep
= 0.1mA
= 0.1mA
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System Module and User Interface CCS Technical Documentation
Audio Player regulators
Signal min. typ. max. Unit Note
AudioPlayerVcore 1.23
1.42
AudioPlayerVDD 3.23
3.0
AudioPlayerVMMC 3.23
3.0
1.3
1.5
3.3 3.37 V regulated mode;
3.3 3.37 V regulated mode;
1.37
1.58
V default value 1.3V
I
= 300mA
max
unregulated mode; I
= 300mA
max
unregulated mode; I
= 60mA
max
Page 12 Copyright Nokia. All rights reserved. Issue 1 07/03
NEM-2
CCS Technical Documentation System Module and User Interface

User Interface Modules

Keyboard

NEM-2 features a Qwerty keyboard, two soft keys and send/end keys with additional 4­way rocker for gaming and music features. The keys are connected in a 6x7-matrix with the UPP. Key pressing is detected by scanning procedure.
The applied “Bulls Eye” keypads are located on the UI board.
A “hotkey” for activating the music features and the volume up and down keys are located on the engine board and connected to GENIO ports.
Display
130*130 pixel passive matrix colour STN display is used.
LCD connector
LCD interface signals are specified below.
No. Symbol Parameter min. typ. max. Unit Note
1 V
2 XRES Reset
3 SDA Serial data Hi: 0.7*V
4 V
5 XCS Chip select
6 SCLK Serial data clock Hi:0.7*V
7 VSS Ground 0 V
8 LED- LED ground 0.505 0.525 0.545 V Connected to
DD
DDI
Voltage supply 2.6 2.75 3.6 V Connected to
VFLASH1 (2.78V)
(active low)
Logic voltage sup­ply
(active low)
Hi:0.7*V Lo:0
Lo: 0
1.7 1.8 VDD V Connected to
Hi:0.7*V Lo:0
Lo:0
DDI
DDI
DDI
DDI
Hi: V
DDI
Lo:0.3*V
Hi: V
DDI
Lo: 0.3*V
Hi: V
DDI
Lo:0.3*V
Hi: V
DDI
Lo:0.3*V
V
DDI
V
DDI
VIO (1.8V)
V
DDI
V
DDI
DC-DC con­verter ‘feedback’ pin
9 NC --- -- -- -- -- Not connected
10 LED+ LED voltage supply 9 10.8 12 V LCD illumination
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NEM-2
System Module and User Interface CCS Technical Documentation

LCD & Keyboard Illumination

For LCD illumination there are 3 white LEDs, which are integrated inside the LCD module. For driving the LEDs a DC-DC converter is used .
The keypad is illuminated by 4 white LEDs driven also by the DC-DC converter.

UI B2B-Connector

Two UI B2B-connectors are used for connection between engine board and UI board.
No. Symbol Parameter Min. typ. max. Unit Note
1 VIO Supply for LCD 1.72 1.8 1.88 V LCDIF: VDDI (logic supply)
2 VFLASH1 Supply for LCD 2.70 2.78 2.86 V LCDIF: VDD (power supply)
3 GND 0 V
4 GND 0 V
5 LCDUI_0 LCD interface 0 1.8 V LCDIF: SCLK (CLOCK)
6 LCDUI_1 LCD interface 0 1.8 V LCDIF: SDA (SDATA)
7 LCDUI_2 LCD interface 0 1.8 V LCDIF: XCS (Chip select)
8 GENIO_4 LCD interface 0 1.8 V LCDIF: XRES (RESET)
9 GND 0 V
10 GND 0 V
11 LED+ DC-DC con-
verter out
12 LED- DC-DC con-
verter return
13 LED1- Return 1 Return path 1 Keypad illumina-
14 LED2- Return 2 Return path 2 Keypad illumina-
15 Not used
16 Not used
17 GND 0 V
9 10.8 12 V LCD illumination
Open circuit voltage: 20V max
0.525 0.525 0.545 V LCD illumination, Voltage over feedback resistor
tion
tion
18 GND 0 V
19 GENIO_21 KB i/f 0 1.8 V KEY_BUS12, Column
20 GND V
21 GND V
22 GND V
UI B2B-Connector 1
Page 14 Copyright Nokia. All rights reserved. Issue 1 07/03
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CCS Technical Documentation System Module and User Interface
No. Symbol Parameter Min. typ. max. Unit Note
1 GND 0 V
2 GND 0 V
3 KEYB_0 Keyboard
Interface
4 KEYB_1 Keyboard
Interface
5 KEYB_2 Keyboard
Interface
6 KEYB_3 Keyboard
Interface
7 KEYB_4 Keyboard
Interface
8 GENIO_2 Keyboard
Interface
9 KEYB_5 Keyboard
Interface
10 KEYB_6 Keyboard
Interface
11 KEYB_7 Keyboard
Interface
12 KEYB_8 Keyboard
Interface
0 1.8 V Column 0= P00 at UPP
0 1.8 V Column 1= P01
0 1.8 V Column 2 = P02
0 1.8 V Column 3 = P03
0 1.8 V Column 4 = P04
0 1.8 V Column 5 = “P05”
0 1.8 V Row 0 = P10
0 1.8 V Row 1 = P11
0 1.8 V Row 2 = P12
0 1.8 V Row 3 = P13
13 KEYB_9 Keyboard
0 1.8 V Row 4 = P14
Interface
14 KEYB_10 Keyboard
0 1.8 V Row 5 = P15
Interface
15 GND 0 V
16 GND 0 V
17 EAR_0 Earpiece
0 2 V
out
18 EAR_0 Earpiece
0 2 V
out
19 EAR_1 Earpiece
0 2 V
out
20 EAR_1 Earpiece
0 2 V
out
21 GND
22 GND
0 V
0 V
PP
PP
PP
PP
Earpiece line 0
Earpiece line 0
Earpiece line 1
Earpiece line 1
Issue 1 07/03 Copyright Nokia. All rights reserved.. Page 15
NEM-2
System Module and User Interface CCS Technical Documentation

System Module : Baseband

Baseband Technical Specifications

DC Characteristics
Regulators and Supply Voltage Ranges
Battery Voltage Range
Signal Min. Nom Max Note
VBAT 3.1V 3.6V 4.2V (charging
high limit voltage)
BB Regulators
Signal Min. Nom Max Note
VANA 2.70V 2.78V 2.86V I
VFLASH1 2.70V 2.78V 2.86V I
VFLASH2 2.70V 2.78V 2.86V I
VSIM 1.745V
2.91V
VIO 1.72V 1.8V 1.88V I
VCORE 1.0V
1.235V
1.425V
1.710V
1.8V
3.0V
1.053V
1.3V
1.5V
1.8V
1.855V
3.09V
1.106V
1.365V
1.575V
1.890V
3.1V SW cut off
= 80mA
max
= 70mA
max
= 1.5mA
I
sleep
= 40mA
max
I
= 25mA
max
I
= 0.5mA
sleep
= 150mA
max
= 0.5mA
I
sleep
I
= 200mA
max
I
= 0.2mA
sleep
Default value 1.5V
Accessory Regulator
Signal Min Nom Max Note
Vout 2.72V 2.80 2.88V I
= 70mA
max
RF Regulators
Signal Min Nom Max Note
VR1A 4.6V 4.75V 4.9V I
VR2 2.70V
3.20V
2.78V
3.3V
2.86V
3.40V
max
I
max
= 10mA
= 100mA
Page 16 Copyright Nokia. All rights reserved. Issue 1 07/03
NEM-2
A
y
UEMK
CCS Technical Documentation System Module and User Interface
VR3 2.70V 2.78V 2.86V I
VR4 2.70V 2.78V 2.86V I
VR5 2.70V 2.78V 2.86V I
VR6 2.70V 2.78V 2.86V I
VR7 2.70V 2.78V 2.86V I
max
max
I
sleep
max
I
sleep
max
I
sleep
max
= 20mA
= 50mA
= 0.1mA
= 50mA
= 0.1mA
= 50mA
= 0.1mA
= 45mA
Current Sources
Signal Min Nom Max Note
IPA1 and IPA2 0mA - 5mA Programmable, +/-6%
IPA3 and IPA4 50µA 100µA 105µA V
V
IPA1,VIPA1
IPA1
= 0V - 2.7V
= 0V - 2.7V
Power Distribution diagram
Battery
Baseband
VLED+
White LED Driver
VBAT
VBAT
Audio Amplifier
UEM
RTC
ccessor
Regulator
RF Regulators
Baseband Regulators
CHACON
VR1A VR1B
VR2-7
VSIM
VCORE
VANA
VIO
VFLASH1
VFLASH2
6
SIM
UPP
FLASH
LCD
Backup
battery
FM Radio
PA Supply
Vout
System Connector
VBAT
IRDA
Issue 1 07/03 Copyright Nokia. All rights reserved.. Page 17
NEM-2
System Module and User Interface CCS Technical Documentation

Baseband External and Internal Signals and Connections

This section describes the external and internal electrical connection and interface levels on the baseband. The electrical interface specifications are collected into tables that cover a connector or a defined interface.
Figure 2: RF/BB connections block diagram
VR3
VBAT
IPA1 IPA2
VR1A
VR2 VR3 VR4 VR5 VR6 VR7
BB
UEM
UPP
AFCOUT
AUXOUT
RXIINP
RXQINP
TXIOUTP
TXIOUTN
TXQOUTP
TXQOUTN
VrefRF01
PATEMP
GENIO5
GENIO6
GENIO7
RFCLK
RFBUSCLK
RFBUSDA
RFBUSEN1X
GENIO9
VCTCXO VCO
VC
TXC
OUT_BB1_I
OUT_BB1_Q
TXI_0
TXI_180
TXQ_180
TXQ_0
VB_EXT
RFTEMP
TXP
RESET
TXA
REFOUT
SCLK
SDATA
SLE
MODE
MODOUTP_G_TX
MODOUTM_G_TX
MODOUTP_P_TX
MODOUTM_P_TX
Helgo
PA
VCP
VRF_TX
VRF_RX
VF_RX
VLNA
VPAB
VLO
VPRE
VBB
Iref_850
Iref_1800_1900
RF
VR7
VR1A VR2
VR4
VR5
VR6
VBAT IPA1 IPA2
Table 1: AC and DC Characteristics of DCT4 RF-Baseband Voltage Supplies
Signal name
VBAT Battery PA & UEM Voltage 2.95 3.6 4.2 V Battery supply. Cut-
From To Parameter Min Typ Max Unit Function
off level of DCT4 reg­ulators is 3.04V. Losses in PWB tracks and ferrites are taken account to minimum battery voltage level.
Current 2000 mA
Current drawn by
0.8 2 uA
PA when ”off”
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CCS Technical Documentation System Module and User Interface
VR1A UEM HELGO Voltage 4.6 4.75 4.9 V Charge pump output
for SHF VCO tuning.
Current 2 10 mA
Noise density 240 nVr
ms/ sqrt( Hz)
VR2 UEM HELGO Voltage 2.70 2.78 2.86 V Supply for
I/Q-modulators, buff­ers, ALS
Current 65 100 mA
Noise density f=100Hz f>300Hz
VR3 UEM VCTCXO,
HELGO
VR4 UEM HELGO Voltage 2.70 2.78 2.86 V Supply for Helgo RX;
Voltage 2.70 2.78 2.86 V Supply for VCTCXO,
Current 1 20 mA
Noise density 240 nVr
Current 50 mA
120 nVr
ms/ sqrt( Hz)
PLL digital parts
ms/ sqrt( Hz)
PA bias blocks Noise density dec­ades 20dB/deg from 6Hz to 600 Hz. From f>600Hz max. noise density nVrms/ sqrt(Hz)
Noise density f=6Hz f=60Hz f>600Hz
VR5 UEM HELGO Voltage 2.70 2.78 2.86 V Supply for Helgo PLL;
Current 50 mA
Noise density BW=100Hz... 100kHZ
5500 550 55
240 nVr
nVr ms/ sqrt( Hz)
ms/ sqrt( Hz)
dividers, LO­buffers, prescaler,
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System Module and User Interface CCS Technical Documentation
VR6 UEM HELGO Voltage 2.70 2.78 2.86 V Supply for Helgo BB
and LNAs
Current 50 mA
Noise density BW=100Hz... 100kHz
VR7 UEM SHF VCO Voltage 2.70 2.78 2.86 V Supply for SHF VCO
Current 30 mA
Noise density 100Hz<f<2kHz 2kHz<f<10kHz 10kHz<f<30kHz 30kHz<f<90kHz 90kHz<f<3MHz
VrefRF01 UEM HELGO Voltage 1.334 1.35 1.366 V Voltage Reference for
240 nVr
ms/ sqrt( Hz)
70 55 35 30 30
nVr ms/ sqrt( Hz)
HELGO DCN2 op.amps.
Note: Below 600Hz
noise density is allowed to increase 20 dB/oct
Current 100 uA
Temp Coef -65 +65 uV/C
Noise density BW=600Hz...
100kHz
Table 2: AC and DC Characteristics of DCT4 RF-Baseband Digital Signals
Signal name From To Parameter Input Characteristics Function
TXP UPP
(GenIO5)
TXA UPP
(GenIO7)
HELGO ”1” 1.38 1.88 V Power
HELGO ”1” 1.38 1.88 V Power con-
Note
”0” 0 0.4 V
Load Resistance 10 220 k
Load Capacitance 20 pF
Timing Accuracy 1/4 symbol
60 nVr
ms/ sqrt( Hz)
Min Typ Max Unit
amplifier enable
trol loop enable
”0” 0 0.4 V
Page 20 Copyright Nokia. All rights reserved. Issue 1 07/03
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CCS Technical Documentation System Module and User Interface
Load Resistance 10 220 k
Load Capacitance 20 pF
Timing Accuracy 1/4 symbol
MODE UPP
(GenIO9)
RFBusEn1X UPP HELGO
RFBusDa UPP HELGO
PA ”1” 1.38 1.88 V Power
(SLE)
(SDATA)
amplifier mode input
”0” 0 0.4 V
Load Resistance 10 220 k
Load Capacitance 20 pF
Timing Accuracy 1/4 symbol
”1” 1.38 1.88 V RFbus ena-
ble
”0” 0 0.4 V
Current 50 uA
Load resistance 10 220 k
Load capacitance 20 pF
”1” 1.38 1.88 V RFbus
data; read/ write
RFBusClk UPP HELGO
(SCLK)
RESET UPP
(GENIO06)
HELGO ”1” 1.38 1.85 V Reset to
”0” 0 0.4 V
Load resistance 10 220 k
Load capacitance 20 pF
Data frequency 10 MHz
”1” 1.38 1.88 V RFBus
clock
”0” 0 0.4 V
Load resistance 10 220 k
Load capacitance 20 pF
Data frequency 10 MHz
Helgo
”0” 0 0.4 V
Load capacitance 20 pF
Load resistance 10 220 k
Timing accuracy 1/4 symbol
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System Module and User Interface CCS Technical Documentation
Table 3: AC and DC Characteristics of DCT4 RF-Baseband Analogue Signals
Signal name From To Parameter Min Typ Max Unit Function
VCTCXO VCTCXO UPP Frequency 13 26 MHz High stability clock
signal for the logic circuits, AC cou­pled. Distorted sine­wave e.g. sawtooth.
Signal amplitude 0.2 0.8 2.0 Vpp
Input Impedance 10 k
Input Capacitance 10 pF
Harmonic Content -8 dBc
Clear signal window (no glitch)
Duty Cycle 40 60 %
VCTCXOGnd VCTCXO UPP DC Level 0 V Ground for refer-
RXI/RXQ HELGO UEM Voltage swing
(static)
DC level 1.3 1.35 1.4 V
I/Q amplitude mis­match
I/Q phase mismatch -5 5 deg
TXIP / TXIN UEM HELGO Differential voltage
swing (static)
DC level 1.17 1.20 1.23 V
Source Impedance 200 W
200 mVpp
ence clock
1.35 1.4 1.45 Vpp Received demodu­lated IQ signals
0.2 dB
2.15 2.2 2.25 Vpp Programmable volt­age swing. Programmable com­mon mode voltage. Between TXIP-TXIN
TXQP / TXQN UEM HELGO Same spec as for TXIP / TXIN
AFC UEM
(AFCOUT)
TxC UEM
(AUX­OUT)
VCTCXO Voltage Min
Max
Resolution 11 bits
Load resistance and capacitance
Source Impedance 200 W
HELGO Voltage Min
Max
Source Impedance 200 W
0.0
2.4
1
2.4
0.1
2.6
100
0.1 V Transmitter power
V Automatic fre-
quency control sig­nal for VCTCXO
k nF
level and ramping control
Page 22 Copyright Nokia. All rights reserved. Issue 1 07/03
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CCS Technical Documentation System Module and User Interface
Resolution 10 bits
RFTemp HELGO UEM
(PATEMP)
IPA1 / IPA2 UEM PA Output Voltage 0 2.7 V PA final stage quies-
Voltage at -20oC 1,57 V Temperature sensor
of RF.
Voltage at +25oC 1,7
Voltage at +60oC 1,79
cent current adjust­ment
Current range 0 5 mA
Resolution 4 bits
Current tolerance -6 +6 %
Noise density f=100 Hz- 800kHz f=800kHz-100MHz
88 110
nVrms/ sqrt(Hz)
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NEM-2
System Module and User Interface CCS Technical Documentation
FM Radio Interface
BB Signal FM Radio Signal Min Nom Max Condition Note
VFLASH2 Vcca 2.7V 2.78V 2.86V I
Vcc(vco) 2.7V 2.78V 2.86V I
Vccd 2.7V 2.78V 2.86V I
GenIO(3) FMClk 1.4V
0
30ppm Stability
GenIO(8) FMWrEn 1.4V
0V
GenIO(12) FMCtrlDa 1.4V
0
GenIO(11) FMCtrlClk 1.4V
0
FM Antenna RFI1, RFI2 76 MHz 108 MHz FM Input frequency
1.8V 1.88V
0.4V
32kHz Frequency Also 6.5 MHz can be
1.8V 1.88V
0.4V
1.8V 1.88V
0.6V
1.8V 1.88V
0.6V
1 MHz Frequency
High Low
High Low
High Low
High Low
=10.5 mA
max
=940 µA
max
= 3.9 mA
max
Reference clock for FM radio module
used
Write/Read enable
Bi-directional data
FM Radio L FM Radio R
VAFL VAFR
100mV Audio level
24 dB 30 dB Channel sep-
aration
54dB 60 dB (S+N)/N
2% Harmonic
distortion
Page 24 Copyright Nokia. All rights reserved. Issue 1 07/03
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CCS Technical Documentation System Module and User Interface
Internal Speaker
Signal Min Nom Max Condition Note
EARP
0.75V 0.8V
EARN
0.75V 0.8V
2.0 V
0.85V
2.0 V
0.85V
pp
AC DC
pp
AC DC
Integrated HF Speaker
Signal Min Nom Max Condition Note
IHFP
0.75V 0.8V
IHFN
0.75V 0.8V
2.0 V
0.85V
2.0 V
0.85V
pp
AC DC
pp
AC DC
Differential output (V
= 4.0 Vpp)
diff
Differential output (V
= 4.0 Vpp)
diff
Issue 1 07/03 Copyright Nokia. All rights reserved.. Page 25
NEM-2
System Module and User Interface CCS Technical Documentation

External Signals and Connections

Battery connector
The design is based on “Demi” battery connector.Bottom Connector
No. Symbol Parameter Min. typ. Max. Unit Note
1 VBAT 3.1 3.6 5.1 V Positive battery terminal
2 BSI 68 KOhmBattery capacity measurement
(fixed resistor, connected to GND inside the battery pack)
3 BTEMP 47 kOhmBattery temperature measure-
ment (measured by NTC resistor connected to GND inside pack)
4 GND 0 V Negative/common battery termi-
nal
Bottom connector, or the system connector is of type Pop-Port (TM)
Figure 3: Bottom connector pinout
Contacts, 14 pcs
14
Locking holes for accessories, 2 pcs
Bottom connector pins and signals:
Page 26 Copyright Nokia. All rights reserved. Issue 1 07/03
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CCS Technical Documentation System Module and User Interface
No. Symbol
1 Charge V charge 7.0 8.4 9.2 VRMS Fast charger
2 GND Charge GND 0 V Max. serial impedance 100mOhm
3 ACI ACI 1 Kbit/s
4 Vout DC out 2.78 V
5 USB Vbus DC in 4.375 5.25 V USB spec.
6 USB D+ Pos. diff. data 12 Mbit USB spec.
Sig. Description
min. tip. Max. Unit Note
850 MA
(PWB and connector
850 MA
0 2.78 V Voltage level valid for DCT4
47 Ohm Max. serial impedance for inser-
tion and removal detection
70 MA Max. output current for acc.
0 3.3 V USB spec.
33 Ohm Max. serial impedance
7 USB D- Neg. diff.
data
0 3.3 V USB spec.
8 USB data
GND
9 XMIC N Audio In 300 8k Hz Frequency range 3 dB points
10 XMIC P Audio In 300 8k Hz Frequency range -3 dB points
11 HSEAR N Audio Out 0 V Unbalanced HSEAR design
Data GND 0 V USB spec.
12 Mbit USB spec.
33 Ohm Max. serial impedance
1 Vpp
2.25 V DC voltage
1 Vpp
2.25 V DC voltage
Audio GND Left, decoupling FM antenna signal
10 Ohm Max. serial impedance
12 HSEAR P Audio Out 30 20k Hz Frequency range -3dB points
with load 32 ohm (headset)
1 V
10 Ohm Max. serial impedance
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System Module and User Interface CCS Technical Documentation
13 HSEAR R NAudio Out 0 V Unbalanced HSEAR design
Audio GND Right, decoupling FM antenna signal
10 Ohm Max. serial impedance
14 HSEAR R P Audio Out 30 20k Hz Frequency range -3dB points
With load 32 ohm (headset)
1 V
DC Plug
NMP standard 2- or 3-wire chargers are compatible with the Pop-Port connector. The IF does not support 3-wire charging control.
No. Symbol
B Charge V charge 7.0 8.4 9.2 VRMSFast charger
A GND Charge GND 0 V Max. serial impedance 100mOhm
Signal Description
min. typ. Max. Unit Note
850 mA
(PWB and connector
850 mA
Audio Line In Connector
Audio line in connector is a 2.5mm stereo jack with internal plug- detection switch .
No. Symbol Parameter min. typ. max. Unit Note
1 GND 0 V
2 Right Level 2 Vrms
3 Impedance 11 13 14.5 kOhm
4 Left Level 2 Vrms
5 Impedance 11 13 14.5 kOhm
6 Detection 0 1.8 V Line in detection
Page 28 Copyright Nokia. All rights reserved. Issue 1 07/03
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CCS Technical Documentation System Module and User Interface
SIM connector
No. Symbol Parameter min. typ. max. Unit No.
1 SIMCLK Frequency 1.05 3.25 3.36 MHz 1
Trise/Tfall 50 ns
duty cycle 40 60 %
2 SIMRST Voh 0.9 * VSIM VSIM V 2
Vol 0 0.15*VSIM V
3 VSIM 3V SIM Card 2.8 3.0 3.2 V 3
6 mA
1.8V SIM Card 1.6 1.8 2.0
4 GND ground 0 V 4
5 n. c. 5
6 DATA Voh 0.9*VSIM VSIM V 6
Vol 0 0.15*VSIM V
Vih 0.7*VSIM VSIM V
Vil 0 0.15*VSIM V
MMC Connector
NEM-2 supports full size MultiMediaCards with 3.3V power supply
No. Symbol Parameter min. typ. max. Unit Note
1 RSV n. c.
2 CMD Command line -0.5 3.6 V Peak voltage
0.625*VDD VDD+0.3 V Input high voltage
GND-0.3V 0.25*VDD Input low voltage
3 GND -0.5 0 0.5 V
4 VDD 2.0 3.3 3.6 V Supply voltage
5 CLK Clock line -0.5 3.6 V Peak voltage
0 20 MHz Clock frequency
10 ns Clock low/high time
10 ns Clock rise/fall time
6 GND ground -0.5 0 0.5 V
7 DATA 0 Data line 0 -0.5 3.6 V Peak voltage
0.75*VDD V Output high voltage
0.125*VDD V Output low voltage
Issue 1 07/03 Copyright Nokia. All rights reserved.. Page 29
NEM-2
System Module and User Interface CCS Technical Documentation

Internal Signals and Connections

Internal microphone
Symbol Parameter Min. typ. max. Unit Note
MICP Differential Input
P
MICN Differential Input
N
MICB Microphone Bias 2.0 2.1 2.25 V DC
200 mVpp 1kOhm to MICB
200 mVpp 1kOhm to GND
Internal speaker
Symbol Parameter Min. typ. max. Unit Note
EARP differential out 2.0 Vpp AC, (Vdiff = 4.0 Vpp)
EARN differential out 2.0 Vpp AC
Vibra
Signal Min. Nom Max Condition Note
VIBRA DC voltage 1.0 1.5 2.3 V Motor average dc
Output frequency
4 64 512 Hz
Audio player
DA250- SMPS Interface
SMPS (Switch Mode Power Supply) for application DSP core voltage supply needs exter­nal clock. ADSP timer 0 provides it. Core voltage level can be changed by VoutSelection signal, which is connected to ADSP GPIO pin.
Symbol Parameter Min. typ. Max. Unit Note
SMPSClk SMPS synchro-
nization clock
VOutSelection SMPS output
voltage selec­tion
0 3.3 V
460 kHz
0
0.85
0.65
3.3
V low: VCore = 1.5V (default)
high: VCore = 1.3V
Page 30 Copyright Nokia. All rights reserved. Issue 1 07/03
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CCS Technical Documentation System Module and User Interface
Stereo Codec
Two different interfaces are used between DSP and codec, which runs in master mode:
I2C control interface
audio data interface (I2S)
I2C control interface is used for transferring low speed control information between application DSP and codec. Signal specification of the control interface is given below.
Symbol Parameter Min. typ. Max. Unit Note
SDA serial data 0 3.3 V IIC data line, external 10k pull-
up used
SDL serial clock 0 3.3 V IIC clock line, external 10k pull-
up used
Audio data is transferred via I2S serial digital audio interface. Signal specification of the audio data interface is listed below.
Symbol Parameter Min. typ. Max. Unit Note
SDATA_IN serial data 0 3.3 V serial data DSP -> codec
SDATA_OUT serial data 0 3.3 V serial data codec -> DSP
LRCIN frame sync. 0 3.3 V frame sync. DSP -> codec
LRCOUT frame sync. 0 3.3 V frame sync. codec -> DSP
BCLK Clock 0 3.3 V clock codec -> DSP
Ringing Tone Speaker Amplifier
Ringing Tone Speaker amplifier shut down pin is connected to ADSP GPIO. Signal specifi­cation is given below.
Symbol Parameter Min. typ. Max. Unit Note
APAShutDown shut down 0 3.3 V external pull- down
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System Module and User Interface CCS Technical Documentation
Phone- Audio Player Interface (MADI)
DCT4 Phone- Audio Player interface signals are specified below. Also the nick name MADI (MCU- ADSP Interface) is frequently used. Refer to section Functional Description for further details of the DCT4 Phone- Audio Player interface concept.
Symbol Parameter Min. typ. Max. Unit Note
AudioPlayerP­wrOn
AudioPlayerRe­setX
AudioPlayer­FlashRPX
AudioPlayerRxD audio player
AudioPlayerTxD audio player
SleepClk RTC clock 0 1.8 V DCT4 Phone -> Audio Player; it is
USBPwrDetec­tion
LineInDetection Line- In detec-
Audio Player power enable
main Audio Player reset
Audio Player flash reset
receive data
transmit data
USB power detection
tion
0 1.8 V active high; connected to audio
player power supply regulators
0 3.3 V active low; UEMK open drain
output, pull- up resistor inside Audio Player part
0 3.3 V active low; UEMK open drain
output, pull- up resistor inside Audio Player part
0 1.8 V DCT4 Phone -> Audio Player; IR
level shifter inside UEMK used
0 3.3 V Audio Player -> DCT4 Phone; IR
level shifter inside UEMK used
under investigation if RTC inside ADSP is needed
32 kHz
0 1.8 V active high; wake up from sleep
mode
0 1.8 V active high; wake up from sleep
mode
GSM_HF phone audio
out
FM-Radio_R FM radio, right
channel
FM-Radio_L FM radio, left
channel
80 200 mV
80 200 MV
1 Vpp DCT4 Phone -> Audio Player,
mono GSM down link
FMR to Audio Player, stereo
rms
rms
Vrf=1mV, L=R, Delta f=22.5KHz, fmod=1KHz
FMR to Audio Player, stereo Vrf=1mV, L=R, Delta f=22.5KHz, fmod=1KHz
Page 32 Copyright Nokia. All rights reserved. Issue 1 07/03
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CCS Technical Documentation System Module and User Interface

Baseband Functional Description

Modes of Operation

EM21 baseband has six different functional modes:
No supply
• Back-up
Acting Dead
• Active
• Sleep
Charging
No Supply
In NO_SUPPLY mode, the phone has no supply voltage. This mode is due to disconnection of main battery and backup battery or low battery voltage level in both of the batteries.
Phone is exiting from NO_SUPPLY mode when sufficient battery voltage level is detected. Battery voltage can rise either by connecting a new battery with VBAT > V
connecting charger and charging the battery above V
Back-up
In BACK_UP mode the backup battery has sufficient charge but the main battery can be disconnected or empty (VBAT < V
VRTC regulator is disabled in BACK_UP mode. VRTC output is supplied without regulation from backup battery (VBACK). All the other regulators are disabled in BACK_UP mode.
Acting Dead
If the phone is off when the charger is connected, the phone is powered on but enters a state called ”Acting Dead”. To the user, the phone acts as if it was switched off. A battery charging alert is given and/or a battery charging indication on the display is shown to acknowledge the user that the battery is being charged.
and VBACK > VBU
MSTR
MSTR+
COFF
or by
MSTR+
.
).
Active
In the Active mode the phone is in normal operation, scanning for channels, listening to a base station, transmitting and processing information. There are several sub-states in the active mode depending on if the phone is in burst reception, burst transmission, if DSP is working etc.
One of the sub-states of the active mode is FM radio on state. In that case, Audio Ampli­fier and FM radio are powered on. FM radio circuitry is controlled by the MCU and 13MHz-reference clock is generated in the UPP. VFLASH2 regulator is operating.
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In Active mode the RF regulators are controlled by SW writing into EM’s registers wanted settings: VR1A can be enabled or disabled. VR2 can be enabled or disabled and its output voltage can be programmed to be 2.78V or 3.3V. VR4 -VR7 can be enabled, disabled, or forced into low quiescent current mode. VR3 is always enabled in Active mode.
Sleep Mode
Sleep mode is entered when both MCU and DSP are in stand–by mode. Sleep is con­trolled by both processors. When SLEEPX low signal is detected UEMK enters SLEEP mode. VCORE, VIO and VFLASH1 regulators are put into low quiescent current mode. All the RF regulators are disabled in SLEEP. When SLEEPX=1 detected UEMK enters ACTIVE mode and all functions are activated.
The sleep mode is exited either by the expiration of a sleep clock counter in the UEMK or by some external interrupt, generated by a charger connection, key press, headset con­nection etc.
In sleep mode VCTCXO is shut down and 32 kHz sleep clock oscillator is used as reference clock for the baseband.
Charging
Charging can be performed in any operating mode.
NEM-2 supports the standard NMP charger interface.
Charging is controlled by the UEMK ASIC and external components are needed for EMC, reverse polarity and transient protection of the input to the baseband module. The charger connection is through the system connector interface. The NEM-2 baseband is designed to support DCT3 chargers from an electrical point of view. Both 2- and 3-wire type chargers are supported.
The operation of the charging circuit has been specified in such a way as to limit the power dissipation across the charge switch and to ensure safe operation in all modes.
Battery
780 mAh Li-ion battery pack BLD-3 is used in NEM-2.
Description Value
Nominal discharge cut-off voltage 3.1V
Nominal battery voltage 3.6V
Nominal charging voltage 4.2V
Maximum charger output current 850 mA
Minimum charger output current 200 mA
Page 34 Copyright Nokia. All rights reserved. Issue 1 07/03
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Pin numbering of battery pack
Signal name Pin number Function
VBAT 1 Positive battery terminal
BSI 2 Battery capacity measurement (fixed resistor inside the battery
pack)
BTEMP 3 Battery temperature measurement (measured by NTC resistor
inside pack)
GND 4 Negative/common battery terminal
BLD-3 battery pack pin order
Figure 4:
4(GND)
3(BTEMP)
2(BSI)
1 (+)
Issue 1 07/03 Copyright Nokia. All rights reserved.. Page 35
NEM-2
System Module and User Interface CCS Technical Documentation

Supply Voltage Distribution

The energy management of NEM-2 is based on DCT4 architecture and additional compo­nents for Audio Player power supply. A semi fixed battery supplies the DCT4 Phone part and the Audio Player part.
UEMK includes several regulators to supply DCT4 Phone RF and baseband. It provides the energy management including power up and down procedure.
Additional regulators are included for Audio Player supply. These regulators are con­trolled by UPP GenIO pin.
If the main battery is not present, a backup battery supplies the Real Time Clock (RTC) part of UEMK. RTC inside ADSP is not supported and powered down permanently.
Figure below shows NEM-2 supply voltage distribution diagram.
Figure 5: NEM-2 Supply Voltage Distribution Diagram
power key
backup
battery
charger
DCT4 Phone Baseband
(UPP, Flash, RF)
GenIO22
Supply (UEM)
RTC
main battery
Audio Player Baseband
(DA250, Flash, codec,
amp., MMC, USB)
Audio Player Power SupplyDCT4 Phone Power
enable
control
power
Page 36 Copyright Nokia. All rights reserved. Issue 1 07/03
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CCS Technical Documentation System Module and User Interface
Phone
The Phone part supply voltage distribution is controlled by UEMK asic. There are six sep­arate regulators used by baseband. Detailed DCT4 Phone supply voltage distribution dia­gram is shown in figure below.
Figure 6: Phone Supply Voltage Distribution Diagram
VBAT
passive
LC-
filter
VBACK
UEM
VBATBB1
VBATBB2
VBATBB3
VBATBB4
VBATBB5
VBATVR1
VBATVR2
VBATVR3
VBATVR4
VBATVR5
VBATVR6
VBATVR7
VBATTDriv
VBACK
VDD18
VDD28
VDAAud1
VDAAud2
VDAConvRx
VDAConvTx VRTC
VCORE
VIO
VFLASH1
VFLASH2
VSIM
VR1A
VR1B
VR2
VR3
VR4
VR5
VR6
VR7
VANA
RF
UPP8M
VDDPDRAM
VCORE
VDDMCU
VDDDSP
VDDIO
VDDA
VPP
Flash
VPP
VCC
LCD
VDDI
VDD
FM Radio
VCC
VDIG
SIM
VSIM
Booster
CALLED1
LDO 2.8V
GenIO0
BUZZ0
LEDs
LED+
Tomahawk
Vout
Smart Covers
DC_Out
control
power
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System Module and User Interface CCS Technical Documentation
Audio Player
Audio Player power supply module consist of three different regulators, SMPS type for DSP core supply with different output voltages, 3.3V LDO type for peripherals and analog audio supply and 3.3V LDO type for MMC.
Audio Player power supply is controlled by DCT4 Phone part via dedicated hardware sig­nal AudioPlayerPwrEnable. Two supply voltages AudioPlayerVCore and AudioPlayerVDD are generated inside this block. Refer to chapter Phone- Audio Player Interface (MADI) for further hardware implementation details.
Audio Player DSP core voltage regulator is dual mode (LDO/ SMPS) type. For SMPS mode external synchronization frequency is needed. ADSP TOUT0 is used for that purpose. The ADSP controls AudioPlayerVCore regulator output voltage via GPIO. Therefore ADSP is able to set his core voltage according to the DSP frequency.
ADSP GPIO controls MMC supply voltage regulator.
AudioPlayerVDD will drop below typical value (3.3V) if battery is discharged. This causes some audio performance loss. Digital part is not affected by this supply voltage drop.
Detailed Audio Player supply voltage distribution diagram is shown in figure below.
Page 38 Copyright Nokia. All rights reserved. Issue 1 07/03
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A
A
A
A
A
CCS Technical Documentation System Module and User Interface
Figure 7: Audio Player Supply Voltage Distribution Diagram
VBAT
SMPS
(1.3/ 1.5V)
clock
Vout
AudioPlayerPwrEn
LDO
(3.3V)
AudioPlayerVCore
AudioPlayerVDD
LC- filter
460kHz
Vout selection
udioPlayerVAudio
passive
RC- filter
passive
RC- filter
n. c.
n. c.
DSP DA250
CVDD
RVDD
RCVDD
RDVDD
TOUT0
GPIO2
USBVDD
DVDD
DVDD
VDD
Flash
VPP
VCCQ
VCC
Codec AIC23passive
BVDD
DVDD
VDD
HPVDD
MMCPwrEn
LDO
(3.3V)
APAShutDown
udioPlayerVMMC
AudioPlayerVAPA
passive
LC- filter
Audio Amp
VCC
ShutDown
MMC
VCC
control
power
Issue 1 07/03 Copyright Nokia. All rights reserved.. Page 39
NEM-2
A
System Module and User Interface CCS Technical Documentation

Power Up, Power Down and Reset

Phone
Power up, power down and reset of DCT4 Phone part is controlled by the UEMK ASIC.
Audio Player
Audio Player power up, power down and reset is controlled by software via dedicated hardware signals AudioPlayerPwrEnable, AudioPlayerResetX and AudioPlayerFlashRPX. Figure below shows the block diagram including Phone reset, Audio Player power con­trol and Audio Player reset signals.
Figure 8: Phone and Audio Player Reset
Audio Player power- up is initialized by activating power enable signal. After power sup­ply settling time Audio Player reset signals can be released.

Clocking

Phone part and Audio Player part uses different oscillators. DCT4 Phone clocking concept is reused without changes. Two oscillators are implemented:
power key
backup
battery
charger
DCT4 Phone Baseband
(UPP, Flash, RF)
PURX
DCT4 Phone
Power Supply
(UEM)
(UEMK)
main battery
GenIO22
DLight
KLight
Audio Player Baseband
(DA250, Flash, codec,
amp., MMC, USB)
Flash reset
DSP reset
Audio Player Power Supply
enable
control
power
32kHz sleep clock
26MHz system clock
FMR is connected to UPP FMclk (GENIO3) output pin. FMclk output frequency is set to 32kHz via FM Radio Clock Selection bit in CTSI MCU Clock Control Register 2.
Page 40 Copyright Nokia. All rights reserved. Issue 1 07/03
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CCS Technical Documentation System Module and User Interface

This clock is distributed to audio codec as well.

Figure 9: Clock Distribution Diagram
32 kHz
UEMK
UEM
VR3
VCTCXO
26MHz
32 kHz
SLEEPX
UPP
MCU
DSP
26 MHz
PLL
CTSI
SLICER
HELGO
HELGO
HELGA
h
26 MHz
RFBUSCLK 13MHz
CBUSCLK 1MHz
DBUSCLK 13MHz
LCDCLK max. 6.5MHz
SIMCLK max. 3.25MHz
Issue 1 07/03 Copyright Nokia. All rights reserved.. Page 41
NEM-2
System Module and User Interface CCS Technical Documentation

Phone- Audio Player Interface (MADI)

Phone- Audio Player interface consists of different signals groups:
power and reset
wake- up
communication
•audio
Power and Reset
Three signals are used for Audio Player power supply control and reset:
AudioPlayerPwrEnable
AudioPlayerResetX
AudioPlayerPwrEnable controls power supply of Audio Player. It is active high, default state after reset is low. Phone software can switch Audio Player power supply on by pull­ing AudioPlayerPwrEnable high.
AudioPlayerResetX controls ADSP reset. It is connected to open drain output Klight of UEMK asic and ResetX signal of ADSP. External pull-up resistor is used the signal is active low.
AudioPlayerFlashRPX controls flash reset/ sleep mode input. It is used either for disabling flash during USB booting or for flash sleep mode control during run time. Therefore it is connected to open drain output Dlight of UEMK asic, GPIO2 of ADSP and RPX signal of flash memory. External pull- up resistor is used the signal is active low.
Wake- Up
Transitions from sleep mode into operation mode are triggered by so called wake- up sig­nals. All wake- up signals are connected to UPP. Wake- up signals distributed from Audio Player part are:
AudioPlayerFlashRPX
LineInDetection
USBWakeUp
LineInDetection is connected to switch inside line- in connector and UPP GenIO13. Switch is open when line- in plug is inserted. Therefore LineInDetection signal is active high.
USBWakeUp is connected to Vbus signal of USB connector and UPP GenIO14. LineInDe­tection signal goes high if USB host is connected and power is supplied on USB Vbus pin. Therefore USBWakeUp signal is active high.
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Communication interface specified below provides wake- up capability as well. Either DCT4 Phone or Audio Player will wake- up on activity at the receive lines.
Communication
DCT4 Phone- Audio Player communication interface is serial, UART based asynchronous interface. Two lines (RxD and TxD) are used. At DCT4 Phone side LPRF UART of UPP is used. At Audio Player side McBSP0 of DA250 is used.
ADSP internal timer 0 is used for McBSP0 transmit clock. Therefore timer output pin "TOUT0" is connected to McBSP0 pin "CLKX".
Audio
Two different audio sources are distributed form DCT4 Phone to Audio Player part:
•GSM_HF
FMRadioOutL, FMRadioOutR

Audio Player

Audio concept is basing on application DSP TMS320DA250. As audio hardware codec (AD/DA converter) a TLV320AIC23B is used. As FM-radio TEA5767 is used.
The stereo audio hardware codec includes AD- and DA-converter, input amplifier, output amplifier and headphone amplifier. The headphone amplifier is designed for loads with resistance greater 16 ohms. The used headset resistance is 32 ohm. The minimal specified load resistance is 0 ohm in the hardware codec specification. That means that the output circuit is shortcut protected
Audio Features
Following audio features are supported:
Telephony in private mode
Telephony via headset
Playback from MP3/AAC files via headset
FM radio via headset
Recording from analog source via line in or from FM radio in AAC format
Loading from MP3/AAC files via USB
Monitoring the recording source via headset
MP3/AAC ringing tones
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Audio routing and conditioning
The analog audio sources FM radio and line in are mixed and level conditioned in a pas­sive stereo mixer and then fed through the Audio Codec RLINEIN and LLINEIN. The GSM downlink from the UEMK HFOUT for headset is added by the codec mono analog input (MICIN).
Source selection is controlled by software using the mute function for GSM downlink and power on/off for FM radio. FM radio is powered off when not in use for power sav­ing. The TMUTE pin of the TEA5767 is not used. Disabling the output stage of the UEMK mutes the GSM downlink signal. Line in signal is the master signal and can’t be muted. Line in connection is detected via software and switches the FM radio off.
Line in detection is done via sense line from the 2.5mm jack connector to UPP GENIO13.
The amplification and routing of the analog audio sources and outputs of the audio codec is done via the control interface (SDIN, SCLK, CS, MODE) and the digital audio interface (LRCIN, DIN, LROUT, DOUT, BCLK) from the DA250.
Audio signal routing is done by software. The hardware concept is fixed wired. The soft­ware manages the sources/ inputs and the outputs that will be connected for the used path. Level and volume control, the equalizing for the selected path and the user wishes of tone settings or adjustment are also controlled by software. The different use cases are described in the document Hitchhiker use cases.
When recording from FM radio or line in the signal can be monitored via headset. A phone call during recording is possible with headset. The recorded signal is mixed into the GSM downlink by the audio codec with lower level for background monitoring. The GSM downlink has no influence to the recorded audio signal.
The block diagram of the audio part and the AIC23B audio codec can be found in the fol­lowing picture.
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Figure 10: Audio block diagram
Tomahawk
ACI
XMICP
XMICN
HSEARRP
HSERARN
HSEARLP
HSEARLN
FM-Antenna
UEM HeadInt
UEM Mic2P
UEM Mic2N
Line In
LineIn Detection
UEM HFOUT
DA250
FM­radio
LM48 90
DA250
CodecCl
APAShutDown
I2C interface
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FM Radio

The FM radio in the transceiver NEM-2 is a single chip electronically tuned FM stereo radio with fully integrated IF selectivity and demodulation. The FM radio is completely adjustment free.
It can be tuned the European, US and Japanese FM bands.
The channel tuning and bus data are controlled by UPP.
The FM-antenna signal is generated out of the HSEARRN and HSEARN signals from the bottom connector. FM-radio is only working when headset is connected because the cable is used as FM-antenna.
SIM Interface
UEMK contains the SIM interface logic level shifting. SIM interface can be programmed to support 3V and 1.8V SIMs. SIM supply voltage is selected by a register in the UEMK. It is only allowed to change the SIM supply voltage when the SIM IF is powered down.
The SIM power up/down sequence is generated in the UEMK. This means that the UEMK generates the RST signal to the SIM. Also the SIMCardDet signal is connected to UEMK. The card detection is taken from the BSI signal, which detects the removal of the battery.
The SIM interface is powered up when the SIMCardDet signal indicates "card in". This signal is derived from the BSI signal.
Parameter Variable Min. Typ Max Unit
SIMCARDet, BSI comparator Threshold Vkey 1.94 2.1 2.26 V
SIMCARDet, BSI comparator Hysteresis (1) Vsimhyst 50 75 100 mV
The entire SIM interface locates in two chips: UPP and UEMK.
The SIM interface in the UEMK contains power up/down, port gating, card detect, data receiving, ATR-counter, registers and level shifting buffers logic. The SIM interface is the electrical interface between the Subscriber Identity Module Card (SIM Card) and mobile phone (via UEMK device).
The data communication between the card and the phone is asynchronous half duplex. The clock supplied to the card is in GSM system 1.083 MHz or 3.25 MHz.
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Figure 11: SIM interface NEM-2
SIM
C5 C6 C7
C1
C2
C3
C8
C4
From
MultiMediaCard MMC
NEM-2 uses a MMC as memory for the MP3/AAC files. Records from line in or FM radio can be saved on this card. Also music files via USB can be stored on the MMC. The MMC can be easy exchanged by the end user and is located under the battery pack. NEM-2 is supporting MM1 and MM2 standard cards.
SIM
ASIP
SIMIO
SIMCl
SIMRst
VSIM
BSI
UEMK
UEM
SIMIF
register
SIMIO
SIMCl
SIMRst
UEM digital logic
UPP
SIMIO
SIMClk
UEMInt
CBusDa
CBusEnX
CBusClk
SIMR
UIF Block
MMC power is supplied by additional discrete 3.3V regulator, which is controlled via ADSP GPIO.
Flash Memory
ADSP code and data is stored in 16MBit, 16 Mbit wide asynchronous flash memory.
Flash power supply and flash programming supply are connected to AudioPlayerVDD supply.
Ringing Tone Speaker and Amplifier
A bridge power amplifier (LM4890) drives the ringing tone speaker which can be shut­down via ADSP GPIO6 line. The audio signal is routed from the audio codec (AIC23B) ROUT and LOUT and is mixed via summation amplifier input to a mono signal.
Audio Digital Signal Processor (ADSP)
SMPS supplies ADSP core hardware modules (AudioPlayerVCore). ADSP peripherals power supply is connected to AudioPlayerVDD regulator.
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External Accessory Regulator
An external LDO Regulator exists for accessory power supply purposes. All ACI-accesso­ries require this power supply. Regulator input is connected to battery voltage VBAT and output is connected to Vout pin in the system connector. Regulator is controlled via UPP (On/Off-function).
Accessory Regulator Signals
Signal Min. Nom Max Note
Vout 2.70V 2.78 2.86V I
GenIO(0) 1.4 1.8 1.88
0.6

Acoustics

The following chapters give a description of acoustical parts.
Earpiece
Used earpiece is a standard part, NMP code 5140067. Its’ features include impedance 32 ohm, sensitivity 103dB+-3dB dB, SPL/1Vrms input 1kHz.
.
= 150mA
max
High (ON) Low (OFF)
Figure 12: Earpiece view from top
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Microphone
The microphone is embedded into the B-cover. IT features a sensitivity of 42+/-2dB (0dB=1V/Pa at 1Khz). Its impedance is 1.4kohm.
Polarity as shown:
Figure 13: Microphone Polarity
Ringing tone speaker
Alerting tones, as MP3, AAC, MIDI or conventional sinusoidal files are made audible by an integrated loudspeaker. The acoustic pressure level requirement for these ringing tones is 105dB(A) at a distance of 5cm.
The ringing tone speaker NMP code 5140253, impedance 8 ohm, sensitivity 69B+/-2dB SPL @ 0.1W, 1m, averaged over rated frequency range.
Polarity as shown:
Pin 1 (+)
Figure 14: Ringing tone speaker Polarity (the view on the spring contacts)
The ringing tone speaker is integrated into the B-cover. An adhesive ring acoustically seals the lid, which closes the box. The lid is supported with mechanical reinforcements to stop resonance of the housing. Two cylindrical contact pins, which are moveable inside the lid, contact the electrical signal through from PWB to the Speaker.
side view
Pin 2 (-)
Vibra
The Vibra code is 6800053.
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Headset
The headset HDS-3H used is a passive type with stereo headphone and integrated microphone. It is possible to use a 3rd party stereo headphone with 3.5mm jack plug via
adapter from 3.5mm jack to the Pop-Port plug at the connector. With the same adapter the output can be used as line out for an external device.

Batteries

Main Battery
780mAh Li-Ion battery pack BLD-3 is used. No other battery packs can be used.
Backup Battery
To preserve the RTC when the main battery is removed, a backup battery is provided.
Polyacene SMD battery type is used. The nominal capacity of the battery is 0.01mAh.

Flash Programming

Flash programming for DCT4 phone part is done in the same way as for all other DCT4 phones. The Audio Player part can be flashed via USB.
For flashing the phone part the same equipment as for all DCT4 phones can be used. Only for connection of the testpads a special adapter is needed. For USB flashing in field ser­vice a special USB cable DKU-2 is needed.
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RF Module Introduction

The RF module performs the necessary high frequency operations of the GSM850/ GSM1900 dualband engine. Both the transmitter and receiver have been implemented by using direct conversion architecture which means that the modulator and demodulator operate at the channel frequency.
The core of the RF is an application-specific integrated circuit, Helgo. Another core com­ponent is a power amplifier module which includes two amplifier chains, one for GSM850 and the other for GSM1900.
Other key components include
26 MHz VCTCXO for frequency reference
3290-3980 MHz SHF VCO (super high frequency voltage controlled oscillator)
front end module comprising a RX/TX switch and two RF bandpass SAW filters
TX850 SAW filter and TX1900 Balun
RX1900 SAW Filter, LNA and RX1900 Balun
The control information for the RF is coming from the baseband section of the engine through a serial bus, referred later on as RFBus. This serial bus is used to pass the infor­mation about the frequency band, mode of operation, and synthesizer channel for the RF. In addition, exact timing information and receiver gain settings are transferred through the RFBus. Physically, the bus is located between the baseband ASIC called UPP and Helgo. Using the information obtained from UPP Helgo controls itself to the required mode of operation and further sends control signals to the front end and power amplifier modules. In addition to the RFBus there are still other interface signals for the power control loop and VCTCXO control and for the modulated waveforms.
RF circuitry is located on one side of the 8 layer PWB.
EMC leakage is prevented by using a metal shield. The RF circuits are separated to three blocks.
PA, Antenna Switch module, LNA, 1900 MHz band SAW Filter and 1900 MHz Balun
Helgo RF IC and VCTCXO
VCO and Balun
The RF transmission lines consists of striplines and microstriplines after PA.
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RF Frequency Plan

RF frequency plan is shown below. The VCO operates at the channel frequency multiplied by two or four depending on the frequency band of operation. This means that the base­band modulated signals are directly converted up to the transmission frequency and the received RF signals directly down to the baseband frequency.
Figure 15: RF Frequency plan
.
H e l g o
R X 8 5 0 : 8 6 9 - 8 9 4 M H z
R X 1 9 0 0 : 1 9 3 0 - 1 9 9 0 M H z
I - S i g n a l Q - S i g n a l
R
T X 1 9 0 0 : 1 8 5 0 - 1 9 1 0 M H z
T X 8 5 0 : 8 2 4 - 8 4 9 M H z
f / 4 f / 2
f f
f f
f / 4 f / 2
.
P L L
1 / 1 1 / 2
3 2 9 6 ­3 9 8 0 M H z
L P F
V C O
2 6 M H z T C X O
B B C L K
I - S i g n a l Q - S i g n a l
T X
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DC characteristics

Regulators
The transceiver baseband section has a multi function analog ASIC, UEMK, which con­tains among other functions six pieces of 2.78 V linear regulators and a 4.8 V switching regulator. All the regulators can be controlled individually by the 2.78 V logic directly or through a control register. Normally, direct control is needed because of switching speed requirement: the regulators are used to enable the RF-functions which means that the controls must be fast enough.
The use of the regulators can be seen in the power distribution diagram which is pre­sented in Power Distribution Diagram (page 50).
The seven regulators are named VR1 to VR7. VrefRF01(1.35V) is used as Helgo bias refer­ence voltage.
The regulators (except for VR7) are connected to the Helgo. Different modes of operation can be selected inside the Helgo according to the control information coming through the RFBus.
List of the needed supply voltages
Volt. source Load
VR1 PLL charge pump (4.8 V)
VR2 TX modulators, ALCs, driver
VR3 VCTCXO, synthesizer digital parts
VR4 Helgo pre-amps, mixers, DtoS
VR5 dividers, LO-buffers, prescaler
VR6 LNAs, Helgo baseband (Vdd_bb)
VR7 VCO
VrefRF01 Helgo Ref. Voltage (DC_Ref)
Vbatt PA
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Typical current consumption
The table shows the typical current consumption in different operation modes.
Operation mode Current consumption Notes
Power OFF < 10 uA Leakage current (triple band PA)
RX, GSM850 75 mA, peak
RX, GSM1900 70 mA, peak
TX, power level 5, GSM850 1800 mA, peak Efficiency: ca. 45%
TX, power level 0, GSM1900 1100 mA, peak Efficiency: ca. 40%
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RF characteristics

Power Distribution

Figure 16: Power distribution diagram
LNA GSM1900
Helgo
RX / TX parts
PLL
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Channel Numbers and Frequencies

System Channel number TX frequency RX frequency Unit
GSM850 128 <= n <=251 F = 824.2 + 0.2 * (n-128) F = 869.2 + 0.2 * (n-128) MHz
GSM1900 512 <= n <= 810 F=1850.2 +0.2*(n-512) F=1930.2+0.2*(n-512) MHz

Main RF characteristics

Parameter Unit and value
Cellular System GSM850, GSM1900
RX Frequency Band GSM850: 869...894 MHz
GSM1900: 1930...1990 MHz
TX Frequency Band GSM850: 824...869 MHz
GSM1900: 1850...1910 MHz
Output Power GSM850: +5...+33 dBm / 3.2 mW... 2 W
Duplex Spacing GSM850: 45MHz

Transmitter characteristics

Item Values (GSM850/GSM1900)
Type Direct conversion, nonlinear, FDMA/TDMA
LO frequency range 3296...3396 MHz / 3700...3820 MHz
Output power 2 W / 1 W peak
Gain control range min. 30 dB
Maximum phase error (RMS/peak) max 5 deg./20 deg. peak
GSM1900: +0...+30 dBm / 1.0 mW... 1 W
GSM1900: 80 MHz
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Receiver characteristics

Item Values, GSM850/GSM1900
Type Direct conversion, Linear, FDMA/TDMA
LO frequencies 3476...3576 MHz / 3860...3980 MHz
Typical 3 dB bandwidth +/- 91 kHz
Sensitivity min. - 102 dBm
Total typical receiver voltage gain (from antenna to RX ADC)
Receiver output level (RF level -95 dBm) 230 mVpp, single-ended I/Q signals to RX ADCs
Typical AGC dynamic range 83 dB
Accurate AGC control range 60 dB
Typical AGC step in LNA 30 dB GSM1900 / 25 dB GSM850
Usable input dynamic range -102... -10 dBm
RSSI dynamic range -110... -48 dBm
Compensated gain variation in receiving band +/- 1.0 dB
86 dB

RF Block Diagram

The block diagram of the RF module can be seen in Chapter on “RF Block Diagram”. The detailed functional description is given in the following sections
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RF Block Diagram NEM-2

Figure 17: RF Block Diagram
GSM 850
3290 - 3980 MHz
GSM 1800/1900
M
GSM 1900
HELGO
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Frequency Synthesizers

The VCO frequency is locked by a PLL (phase locked loop) into a stable frequency source given by a VCTCXO which is running at 26 MHz. The frequency of the VCTCXO is in turn locked into the frequency of the base station with the help of an AFC voltage which is generated in UEMK by an 11 bit D/A converter. The PLL is located in Helgo and it is con­trolled through the RFBus.
The required frequency dividers for modulator and demodulator mixers are integrated in Helgo.
Loop filter filters out the comparison pulses of the phase detector and generates a DC control voltage to the VCO. The loop filter determines the step response of the PLL (set­tling time) and contributes to the stability of the loop.
The frequency synthesizer is integrated in Helgo except for the VCTCXO, VCO, and the loop filter.

Receiver

Each receiver path is a direct conversion linear receiver. From the antenna the received RF-signal is fed to a front end module where a diplexer first divides the signal to two separate paths according to the band of operation: either lower, GSM850 or upper, GSM1900 path.
Most of the receiver circuitry is included in Helgo.

Transmitter

The transmitter consists of two final frequency IQ-modulators and power amplifiers, for the lower and upper bands separately, and a power control loop. The IQ-modulators are integrated in Helgo, as well as the operational amplifiers of the power control loop. The two power amplifiers are located in a single module and the power detector, directional coupler, and loop filter parts of the power control loop are implemented as discrete com­ponents on the PWB. In the GMSK mode the power is controlled by adjusting the DC bias levels of the power amplifiers.
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Front End
The front end features include:
- Antenna 50 ohm input
- RX GSM1900 single output, RX GSM850 balanced output
- TXs single 50 ohm input
-3 control lines from the Helgo
Figure 18: Front End
V _ a n t 1 , 2 , 3
R X G S M 8 5 0
A n t e n n a
R X G S M 1 9 0 0
T X G S M 8 5 0
T X G S M 1 9 0 0
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Power Amplifier
The power amplifier features include:
- 50 ohm input and output for GSM850/GSM1900
- internal power detector
- Mode: GSM/EDGE
Figure 19: Power amplifier
RF ASIC Helgo
The RF ASIC features include
- Package uBGA108
G S M 8 5 0 o u t
G S M 1 9 0 0 o u t
G S M 8 5 0 P o w e r C o n t r o l
G S M 1 9 0 0 P o w e r C o n t r o l
G S M 8 5 0 i n
G S M 1 9 0 0 i n
P o w e r D e t e c t o r
M o d e G S M / E D G E
- Balanced I/Q demodulator and balanced I/Q modulator
- Power control operational amplifier, acts as an error amplifier
- The signal from VCO is balanced, frequencies 3290 to 3980 MHz
- GSM850 low noise amplifier (LNA) are integrated.
The Helgo can be tested by test points only.
AFC function
AFC is used to lock the transceiver’s clock to the frequency of the base station.
Antenna
The NEM-2 GSM850/GSM1900 transceiver features an internal antenna.
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