Note: In printed manuals all A3 drawings are located at the back of the binder
Page 4 – 2
Issue 2 06/98
Page 3
PAMS
NHA–3
Technical Documentation
Introduction
Technical Summary
H700 User interface module consists of the following parts:–
Display with driving IC;
Backlighting circuits;
Earpiece driver circuit;
Buzzer driver circuit;
Keypad contacts and circuitry;
Accessory interface circuits;
Protection components on charger input.
List of Submodules
Table 4. List of Submodules
Name of submoduleType codeMaterial
code
CUI1+ display module4850025
Uif Module
Notes
Issue 2 06/98
Page 4 – 3
Page 4
NHA–3
Uif Module
Technical Specifications
PAMS
Technical Documentation
LCDCLK
LCDRstX
LCDENX
LCDDC_Col0
LCDSDA_Col1
LCDSDCLK_Col3
Col2
Row(0:4)
PwrkeyX
Light0
Light1
VCH
ChrgCtrl
ReqA
MBUS
HEAR
Board to Board Connector
XMic
EARP
IntEarEn
BuzzPWM
MIC
LCDCLK
Reset
LCDENX
LCDDC
LCDSDA
LCDSDCLK
System Connector
& Charger Socket
VCH
ChrgCtrl
ReqA
MBUS
HEAR
XMic
UI Display
Col3
Col2
Col1
Col0
Audio Circuits
EARP
IntEarEn
BuzzPWM
MIC
Row1
Row2
Row0
Row3
Backlights
Internal
Keypad
PwrkeyX
Row4
BSI
BTEMP
VBATT
GND
Page 4 – 4
Battery
Connections
BSI
BTEMP
VBATT
GND
Figure 1. UI Module Block Diagram
Issue 2 06/98
Page 5
PAMS
NHA–3
Technical Documentation
External Signals and Connections
Table 5. List of Connectors
Connector NameCodeNotesSpecifications / Ratings
System Connector5469041Includes recess with spring
contacts for Mic & dc jack
socket for charger
Inter–board connector546904944–way connection to sys-
tem module
Table 6. System Connector X502
Pin
No.
1AGNDAnalogue Ground
NameFunctionInput/
Output
Minimum
Typical /
Nominal
Maxi-
mum
Uif Module
Unit
2BTEMP_Vi-
bEn
3MICInternal Micro-
4VBATTBattery Voltage3.23.65.1V
5GNDSystem Ground
6GNDSystem Ground
7MBUSSerial data inter-
8ReqARequest for Ac-
9SGND
10XMICAccessory Micro-
11HEARHeadset earpiece
12VINCharger VoltageI/P16.9
13(JackDet)
Battery Temperature detection
Vibra enable
phone signal
face
cessory
phone signal
signal
I/P0.04
10
I/P22.4mV p–p
I/ODigital signal levels + interrupt
capability
I/PDigital Interrupt + A–D I/P to
engine to determine accessory
ID
I/P89 (HF)
6.0
(Headset
)
O/PLevel depends on the accessory
connected
2.8V
6800mV p–p
900
kHz
V
mA
14ChrgCtrlCharger control
signal
15GNDSystem Ground
16ChrgCtrlSee 14 above
17BSIBattery size
9Row1Keypad Row 1I/PDigital signal levels
10Row0Keypad Row 0I/PDigital signal levels
11Col2Keypad Column 2I/ODigital signal levels
12LCDSDA_Col1Mux’d LCD serial
13ChrgCtrlCharger control
NameFunctionInput/
signal
Mux’d display
ol3
data clock & keypad Column 3
or command &
Keypad Column 0
data & Keypad
Column 1
signal
Mini-
Output
I/P20.448.0115mV p–p
I/ODigital signal levels
I/ODigital signal levels
I/ODigital signal levels
O/P3037Hz
mum
Typical /
Nominal
Maxi-
mum
Unit
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Issue 2 06/98
Page 7
PAMS
NHA–3
Technical Documentation
Table 7. Inter–board Connector X501 (continued)
FunctionNamePin
No.
14MBUSSerial data inter-
face
15–18 GNDSystem Ground
19–22 VCHCharger VoltageO/P16.9
23MICInternal Micro-
phone signal
24AGNDAnalogue Ground
25XMICAccessory Micro-
phone signal
26HEARHeadset earpiece
signal
27EARNfor NED usage
Input/
Output
I/PDigital signal levels + interrupt
O/P22.4mV p–p
O/P89 (HF)
I/PLevel depends on the accessory
Minimum
capability
connected
Typical /
Nominal
900
6800mV p–p
6.0
(Headset
)
Uif Module
UnitMaxi-
mum
V
mA
28BTEMP_Vi-
bEn
29BSIBattery size
30Row2Keypad Row 2O/PDigital signal levels
31Row3Keypad Row 3O/PDigital signal levels
32Row4Keypad Row 4O/PDigital signal levels
33VBBRegulated base-
34LCDRstXReset for display
35Spare
36LCDENXDisplay driver en-
37ReqARequest for Ac-
38Spare
39Spare
Battery Tempera-
ture detection
Vibra enable
detection
band supply volt-
age
driver
able
cessory
O/P0.04
10
O/P0.042.8V
I/P2.82.96
I/PDigital signal levels – low pulse
I/PDigital signal levels – active low
O/PDigital Interrupt + A–D I/P to
engine to determine accessory
ID
2.8V
5
kHz
V
mA
40Light0Keypad backlight
control
41Light1Display LED con-
trol
Issue 2 06/98
I/PDigital signal levels – Active high
I/PDigital signal levels – Active high
Page 4 – 7
Page 8
NHA–3
Uif Module
PAMS
Technical Documentation
Table 7. Inter–board Connector X501 (continued)
FunctionNamePin
No.
42LCDCLKDisplay driver
clock
43BuzzPWMPWM signal to
Buzzer
44IntEarEnInternal Earpiece
Enable
Pinout for vertically aligned
connector (LHS of phone
viewed from front.)
LCDSDCLK_Col3
VBATT
VBATT
VBATT
VBATT
EarP
PwrKeyX
LCDDC_COL0
Row1
Row0
Col2
LCDSDA_Col1
ChrgCtrl
MBUS
GND
GND
GND
GND
VCH
VCH
VCH
VCH
Input/
Output
Minimum
Typical /
Nominal
mum
UnitMaxi-
I/P160kHz
I/PFrequency & mark/space ratio
are adjusted to give required
ring–tones
I/ODigital signal levels – Active high
1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
IntEarEn
BuzzPWM
LCDCLK
Light1
Light0
Spare
Spare
ReqA
LCDENX
Spare – for possible NED usage
LCDRstX
VBB
Row4
Row3
Row2
BSI
BTEMP
EARN
HEAR
XMIC
AGND
MIC
Internal Signals and Connections
Pin 1 is on the Left side of the PCB with the board viewed from the
Keypad side and the display at the top.
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Issue 2 06/98
Page 9
PAMS
VDD=V0V1V2V3V4V5
NHA–3
Technical Documentation
Table 8. Display Module Connections
Connec-
tion No.
1NCNo Connect
2RESLCDRstXReset
3IFGNDData length select pin for parallel interface
4P/SGNDHI for parallel I/F, LO for serial
5CKLCDCLKExternal clock input for LCD
6VDDVBBSystem supply voltage
7VSSGNDSystem Ground
8CAP1+Boosting Capacitor (C109) positive pin
12VOUTOutput pin for boosting – connection for smoothing
capacitor (C107) to VDD
13VRVoltage regulating pin – gives voltage between VDD
& V5 by resistance division
14V0
15V1
16V2
17V3
18V4
19V5
20VSSGNDSystem Ground
21VDDVBBSystem supply voltage
22SCLLCDSDCLK_Col3Serial Data Clock
23SILCDSDA_Col1Serial Data
24/CSLCDENXChip select – active LO
25/WRGNDWrite enable – active LO
26A0LCDDC_Col0Selects Command or Data transfer, LO for Com-
27NCNo Connect
Multi–level power supply for liquid crystal drive.
Where:–
VDD=V
VDDVSSV5VOUT
mand, HI for Data
V1V2V
V4V
Issue 2 06/98
Page 4 – 9
Page 10
NHA–3
Uif Module
Functional Description
Buzzer Driving Circuit
This comprises R506,C502,V500,R504,R507,V502,V501 & buzzer H500
The input is a PWM signal whose frequency and mark–space ratio
determine the pitch and loudness of the buzzer. The signal is generated
by a PWM output on the system board’s MCU.
Earpiece Driving Circuit
This comprises R501,V500,R502,C503,R512,R513,R514,V507,C505
driver IC N500,R518 & the earpiece B500
The driver enable signal IntEarEn is active HI at the system board
interface. The transistor circuit with V500 inverts it to the correct logic for
the driver IC N500.
PAMS
Technical Documentation
The EARP analogue signal is single–ended and the driver IC N1 provides
the amplification necessary to achieve the required output levels at the
speaker. Volume control is achieved by varying the input levels by means
of the ASIC on the system module.
Display Interface
The display driving IC is present on the display module. This part requires
some external components (R & C) to operate correctly. These are C600
C601,C602,C603,C604,C605,C606,C607,R612, R613 & C608
The interface is described earlier in Table 5.
Keypad Interface Circuitry
The keypad allows for the power key to be located in 2 different places –
one is at the top right of the phone, the other is the top left of the main key
area. V600, R600 & R601 are required for this to function.
The power key operates by pulling PwrKeyX LO, this is a dedicated input
to the System module.
Three of the keypad Column connections are multiplexed with display
driving signals. The following 3 resistors are required to enable the keypad
& display to work correctly together: R602, R603, R604.
Accessory Interface
The UI module provides the route for the Accessory audio and control
signals from the system module to the system connector.
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Issue 2 06/98
Page 11
PAMS
NHA–3
Technical Documentation
LED Driving Circuits
Keypad Backlight LED driving is via R608, R609, V602, V603, R610 &
R611.
Display Backlight LED driving is via R605, R606, V601 & R607.
In both cases a HI signal on the Contol line (Light0 or Light1) will turn the
relevant transitor on and cause conduction of current from VBATT via the
LEDs and the transistor emittor resistor. The function of the emittor
resistor is to set the total current available to the LEDs in the
corresponding circuit.
ESD Protection
ESD protection is provided by spark gaps placed on certain signals plus
clamping diodes – V508, V509, V503, V505 – on 4 of the system
connector signals: HEAR; ReqA; MBUS; and XMIC respectively.
Uif Module
Issue 2 06/98
Page 4 – 11
Page 12
NHA–3
Uif Module
Technical Documentation
Parts List
Amps UI Module
p.n 0200785 EDMS issue 10.4 PCB version 10
ItemCodeDescriptionValueType
R5011430065Chip resistor10 k5 % 0.063 W 0603
R5021430087Chip resistor100 k5 % 0.063 W 0603
R5041430023Chip resistor820 5 % 0.063 W 0603
R5061430043Chip resistor2.2 k5 % 0.063 W 0603
R5081430167Chip resistor47 5 % 0.063 W 0603
R5121430071Chip resistor22 k5 % 0.063 W 0603
R5131430083Chip resistor68 k5 % 0.063 W 0603
R5141430035Chip resistor1.0 k5 % 0.063 W 0603
R5151430017Chip resistor390 5 % 0.063 W 0603
R5161430087Chip resistor100 k5 % 0.063 W 0603
R5171430144Chip jumper0603
R5181430007Chip resistor180 5 % 0.063 W 0603
R6001430043Chip resistor2.2 k5 % 0.063 W 0603
R6011430043Chip resistor2.2 k5 % 0.063 W 0603
R6021430043Chip resistor2.2 k5 % 0.063 W 0603
R6031430043Chip resistor2.2 k5 % 0.063 W 0603
R6041430043Chip resistor2.2 k5 % 0.063 W 0603
R6051430023Chip resistor820 5 % 0.063 W 0603
R6061430035Chip resistor1.0 k5 % 0.063 W 0603
R6071430157Chip resistor18 5 % 0.063 W 0603
R6081430023Chip resistor820 5 % 0.063 W 0603
R6091430035Chip resistor1.0 k5 % 0.063 W 0603
R6101430163Chip resistor33 5 % 0.063 W 0603
R6111430159Chip resistor22 5 % 0.063 W 0603
R6121414357Chip resistor590 k1 % 0.1 W 0805
R6131430217Chip resistor634 k1 % 0.063 W 0603
C5002320107Ceramic cap.10 n5 % 50 V 0603
C5022320107Ceramic cap.10 n5 % 50 V 0603
C5032320781Ceramic cap.47 n20 % 16 V 0603
C5052312410Ceramic cap.1.0 u10 % 16 V 1206
C5062320075Ceramic cap.470 p5 % 50 V 0603
C5082320107Ceramic cap.10 n5 % 50 V 0603
C5132312410Ceramic cap.1.0 u10 % 16 V 1206
C6002320779Ceramic cap.100 n10 % 16 V 0603
C6012320779Ceramic cap.100 n10 % 16 V 0603
C6022320779Ceramic cap.100 n10 % 16 V 0603
C6032320779Ceramic cap.100 n10 % 16 V 0603
C6042320779Ceramic cap.100 n10 % 16 V 0603
C6052312410Ceramic cap.1.0 u10 % 16 V 1206