NEXCOM NDiS M533 User Manual

NEXCOM International Co., Ltd.

Multi-Media Solutions

Digital Signage Platform NDiS M533

User Manual

NEXCOM International Co., Ltd.

Published March 2014

www.nexcom.com

Content

Contents

Preface

Copyright ............................................................................................. iv

Disclaimer .............................................................................................. iv

Acknowledgements ............................................................................... iv

Regulatory Compliance Statements ........................................................ iv

Declaration of Conformity ...................................................................... iv

RoHS Compliance ................................................................................... v

Warranty and RMA ................................................................................ vi

Safety Information ................................................................................viii

Installation Recommendations ...............................................................viii

Safety Precautions .................................................................................. ix

Technical Support and Assistance ............................................................ x

Conventions Used in this Manual ............................................................ x

Global Service Contact Information ........................................................ xi

Package Contents ................................................................................. xiii

Ordering Information ............................................................................xiv

Chapter 1: Product Introduction

Overview ................................................................................................1

Key Features ...........................................................................................1

Physical Features .....................................................................................2

Front Panel ..........................................................................................2

Rear Panel ...........................................................................................2

Hardware Specifications ..........................................................................3

Mechanical Dimensions ...........................................................................4

Chapter 2: Jumpers and Connectors

Before You Begin ....................................................................................5

Precautions ............................................................................................5

Locations of the Jumpers and Connectors for NDiB M533 ....................... 6

NDiB M533 .........................................................................................6

Jumper Settings ......................................................................................7

Jumpers .................................................................................................. 8

RTC Control Connector .......................................................................8

Connector Pin Definitions .......................................................................9

External I/O Interfaces .......................................................................... 9

USB Connector ................................................................................9

LAN Port ..........................................................................................9

RJ45 RS232 Connector ...................................................................10

USB 3.0 Ports ................................................................................. 10

HDMI ............................................................................................. 11

JAE-TX25 .......................................................................................12

Internal Connectors ........................................................................... 13

RTC Battery Connector ...................................................................13

Debug Port ....................................................................................13

SATA Connector (7-pin and 15-pin) ................................................14

SIM Card Slot .................................................................................14

Mini-PCIe Connector ...................................................................... 15

Chapter 3: System Setup

Removing the Chassis Cover ................................................................16

Installing a SO-DIMM (DIMM1) .............................................................17

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Content

Installing a SO-DIMM (DIMM2) .............................................................19

Installing a 2.5” HDD Storage ...............................................................24

Installing a Wireless LAN Module ..........................................................26

Installing a 3G Module .......................................................................... 31

Chapter 4: BIOS Setup

About BIOS Setup ................................................................................. 35

When to Configure the BIOS .................................................................35

Default Configuration ........................................................................... 36

Entering Setup ...................................................................................... 36

Legends ................................................................................................ 36

BIOS Setup Utility .................................................................................. 38

Main .................................................................................................38

Advanced .......................................................................................... 39

Boot .................................................................................................. 49

Security .............................................................................................49

Save & Exit ........................................................................................50

Appendix A: Watchdog Timer................................51

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Preface

Copyright

This publication, including all photographs, illustrations and software, is protected under international copyright laws, with all rights reserved. No part of this manual may be reproduced, copied, translated or transmitted in any form or by any means without the prior written consent from NEXCOM International Co., Ltd.

Disclaimer

The information in this document is subject to change without prior notice and does not represent commitment from NEXCOM International Co., Ltd. However, users may update their knowledge of any product in use by constantly checking its manual posted on our website: http://www.nexcom.com. NEXCOM shall not be liable for direct, indirect, special, incidental, or consequential damages arising out of the use of any product, nor for any infringements upon the rights of third parties, which may result from such use. Any implied warranties of merchantability or fitness for any particular purpose is also disclaimed.

Acknowledgements

NDiS M533 is a trademark of NEXCOM International Co., Ltd. All other product names mentioned herein are registered trademarks of their respective owners.

Regulatory Compliance Statements

This section provides the FCC compliance statement for Class B devices and describes how to keep the system CE compliant.

Declaration of Conformity

FCC

This equipment has been tested and verified to comply with the limits for a Class B digital device, pursuant to Part 15 of FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. Operation of this equipment in a residential area (domestic environment) is likely to cause harmful interference, in which case the user will be required to correct the interference (take adequate measures) at their own expense.

CE

The product(s) described in this manual complies with all applicable European Union (CE) directives if it has a CE marking. For computer systems to remain CE compliant, only CE-compliant parts may be used. Maintaining CE compliance also requires proper cable and cabling techniques.

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Preface

RoHS Compliance

NEXCOM RoHS Environmental Policy and Status Update

NEXCOM is a global citizen for building the digital infrastructure. We are committed to providing green

products and services, which are compliant with European Union RoHS (Restriction on Use of Hazardous Substance in Electronic Equipment) directive 2011/65/EU, to be your trusted green partner and to protect our environment.

RoHS restricts the use of Lead (Pb) < 0.1% or 1,000ppm, Mercury (Hg) < 0.1% or 1,000ppm, Cadmium (Cd) < 0.01% or 100ppm, Hexavalent Chromium (Cr6+) < 0.1% or 1,000ppm, Polybrominated biphenyls (PBB) < 0.1% or 1,000ppm, and Polybrominated diphenyl Ethers (PBDE) < 0.1% or 1,000ppm.

In order to meet the RoHS compliant directives, NEXCOM has established an engineering and manufacturing task force to implement the introduction of green products. The task force will ensure that we follow the standard NEXCOM development procedure and that all the new RoHS components and new manufacturing processes maintain the highest industry quality levels for which NEXCOM are renowned.

The model selection criteria will be based on market demand. Vendors and suppliers will ensure that all designed components will be RoHS compliant.

How to recognize NEXCOM RoHS Products?

For existing products where there are non-RoHS and RoHS versions, the suffix “(LF)” will be added to the compliant product name.

All new product models launched after January 2013 will be RoHS compliant. They will use the usual NEXCOM naming convention.

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Preface

Warranty and RMA

NEXCOM Warranty Period

NEXCOM manufactures products that are new or equivalent to new in accordance with industry standard. NEXCOM warrants that products will be free from defect in material and workmanship for 2 years, beginning on the date of invoice by NEXCOM. HCP series products (Blade Server) which are manufactured by NEXCOM are covered by a three year warranty period.

NEXCOM Return Merchandise Authorization (RMA)

▪ Customers shall enclose the “NEXCOM RMA Service Form” with the

returned packages.

▪ Customers must collect all the information about the problems

encountered and note anything abnormal or, print out any on-screen messages, and describe the problems on the “NEXCOM RMA Service Form” for the RMA number apply process.

▪ Customers can send back the faulty products with or without accessories

(manuals, cable, etc.) and any components from the card, such as CPU and RAM. If the components were suspected as part of the problems, please note clearly which components are included. Otherwise, NEXCOM is not responsible for the devices/parts.

▪ Customers are responsible for the safe packaging of defective products,

making sure it is durable enough to be resistant against further damage and deterioration during transportation. In case of damages occurred during transportation, the repair is treated as “Out of Warranty.”

▪ Any products returned by NEXCOM to other locations besides the

customers’ site will bear an extra charge and will be billed to the customer.

Repair Service Charges for Out-of-Warranty Products

NEXCOM will charge for out-of-warranty products in two categories, one is basic diagnostic fee and another is component (product) fee.

Repair Service Charges for Out-of-Warranty Products

NEXCOM will charge for out-of-warranty products in two categories, one is basic diagnostic fee and another is component (product) fee.

System Level

▪ Component fee: NEXCOM will only charge for main components such as

SMD chip, BGA chip, etc. Passive components will be repaired for free, ex: resistor, capacitor.

▪ Items will be replaced with NEXCOM products if the original one cannot

be repaired. Ex: motherboard, power supply, etc.

▪ Replace with 3rd party products if needed.

▪ If RMA goods can not be repaired, NEXCOM will return it to the customer

without any charge.

Board Level

▪ Component fee: NEXCOM will only charge for main components, such

as SMD chip, BGA chip, etc. Passive components will be repaired for free, ex: resistors, capacitors.

▪ If RMA goods can not be repaired, NEXCOM will return it to the customer

without any charge.

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Preface

Warnings

Read and adhere to all warnings, cautions, and notices in this guide and the documentation supplied with the chassis, power supply, and accessory modules. If the instructions for the chassis and power supply are inconsistent with these instructions or the instructions for accessory modules, contact the supplier to find out how you can ensure that your computer meets safety and regulatory requirements.

Cautions

Electrostatic discharge (ESD) can damage system components. Do the described procedures only at an ESD workstation. If no such station is available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the computer chassis.

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Preface

Safety Information

Before installing and using the device, note the following precautions:

▪ Read all instructions carefully.

▪ Do not place the unit on an unstable surface, cart, or stand.

▪ Follow all warnings and cautions in this manual.

▪ When replacing parts, ensure that your service technician uses parts

specified by the manufacturer.

▪ Avoid using the system near water, in direct sunlight, or near a heating

device.

▪ The load of the system unit does not solely rely for support from the

rackmounts located on the sides. Firm support from the bottom is highly necessary in order to provide balance stability.

▪ The computer is provided with a battery-powered real-time clock circuit.

There is a danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the manufacturer. Discard used batteries according to the manufacturer’s instructions.

Installation Recommendations

Ensure you have a stable, clean working environment. Dust and dirt can get into components and cause a malfunction. Use containers to keep small components separated.

Adequate lighting and proper tools can prevent you from accidentally damaging the internal components. Most of the procedures that follow require only a few simple tools, including the following:

▪ A Philips screwdriver

▪ A flat-tipped screwdriver

▪ A grounding strap

▪ An anti-static pad

Using your fingers can disconnect most of the connections. It is recommended that you do not use needle-nose pliers to disconnect connections as these can damage the soft metal or plastic parts of the connectors.

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Preface

Safety Precautions

1. Read these safety instructions carefully.

2. Keep this User Manual for later reference.

3. Disconnect this equipment from any AC outlet before cleaning. Use a

damp cloth. Do not use liquid or spray detergents for cleaning.

4. For plug-in equipment, the power outlet socket must be located near the

equipment and must be easily accessible.

5. Keep this equipment away from humidity.

6. Put this equipment on a stable surface during installation. Dropping it or

letting it fall may cause damage.

7. The openings on the enclosure are for air convection to protect the

equipment from overheating. DO NOT COVER THE OPENINGS.

8. Make sure the voltage of the power source is correct before connecting

the equipment to the power outlet.

9. Place the power cord in a way so that people will not step on it. Do not

place anything on top of the power cord. Use a power cord that has been approved for use with the product and that it matches the voltage and current marked on the product’s electrical range label. The voltage and current rating of the cord must be greater than the voltage and current rating marked on the product.

10. All cautions and warnings on the equipment should be noted.

11. If the equipment is not used for a long time, disconnect it from the power source to avoid damage by transient overvoltage.

12. Never pour any liquid into an opening. This may cause fire or electrical shock.

13. Never open the equipment. For safety reasons, the equipment should be opened only by qualified service personnel.

14. If one of the following situations arises, get the equipment checked by service personnel:

a. The power cord or plug is damaged. b. Liquid has penetrated into the equipment. c. The equipment has been exposed to moisture. d. The equipment does not work well, or you cannot get it to work

according to the user’s manual. e. The equipment has been dropped and damaged. f. The equipment has obvious signs of breakage.

15. Do not place heavy objects on the equipment.

16. The unit uses a three-wire ground cable which is equipped with a third pin to ground the unit and prevent electric shock. Do not defeat the purpose of this pin. If your outlet does not support this kind of plug, contact your electrician to replace your obsolete outlet.

17. CAUTION: DANGER OF EXPLOSION IF BATTERY IS INCORRECTLY REPLACED. REPLACE ONLY WITH THE SAME OR EQUIVALENT TYPE RECOMMENDED BY THE MANUFACTURER. DISCARD USED BATTERIES ACCORDING TO THE MANUFACTURER’S INSTRUCTIONS.

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Preface

CAUTION!

Technical Support and Assistance

1. For the most updated information of NEXCOM products, visit NEXCOM’s website at www.nexcom.com.

2. For technical issues that require contacting our technical support team or sales representative, please have the following information ready before calling: – Product name and serial number – Detailed information of the peripheral devices – Detailed information of the installed software (operating system,

version, application software, etc.) – A complete description of the problem – The exact wordings of the error messages

Warning!

1. Handling the unit: carry the unit with both hands and handle it with care.

2. Maintenance: to keep the unit clean, use only approved cleaning products or clean with a dry cloth.

3. CompactFlash: Turn off the unit’s power before inserting or removing a CompactFlash storage card.

Conventions Used in this Manual

Warning: Information about certain situations, which if not observed, can cause personal injury. This will prevent injury to yourself when performing a task.

CAUTION!CAUTION!

Caution: Information to avoid damaging components or losing data.

Note: Provides additional information to complete a task easily.

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Preface

Global Service Contact Information

Headquarters

NEXCOM International Co., Ltd.

15F, No. 920, Chung-Cheng Rd., Zhonghe District, New Taipei City, 23586, Taiwan, R.O.C. Tel: +886-2-8226-7786 Fax: +886-2-8226-7782 www.nexcom.com

America

USA NEXCOM USA

2883 Bayview Drive, Fremont CA 94538, USA Tel: +1-510-656-2248 Fax: +1-510-656-2158 Email: sales@nexcom.com www.nexcom.com

Asia

Taiwan Central Taiwan Office

16F, No.250, Sec. 2, Chongde Rd., Beitun Dist., Taichung City 406, R.O.C. Tel: +886-4-2249-1179 Fax: +886-4-2249-1172 Email: sales@nexcom.com.tw www.nexcom.com.tw

Japan NEXCOM Japan

9F, Tamachi Hara Bldg., 4-11-5, Shiba Minato-ku, Tokyo, 108-0014, Japan Tel: +81-3-5419-7830 Fax: +81-3-5419-7832 Email: sales@nexcom-jp.com www.nexcom-jp.com

China NEXCOM China

2F, Block 4, Venus Plaza, Bldg. 21, ZhongGuanCun Software Park, No. 8, Dongbeiwang West Rd., Haidian District, Beijing, 100193, China Tel: +86-10-8282-6599 Fax: +86-10-8282-5955 Email: sales@nexcom.cn www.nexcom.cn

Shanghai Office

Room 603/604, Huiyinmingzun Plaza Bldg., 1, No.609, Yunlin East Rd., Shanghai, 200062, China Tel: +86-21-5278-5868 Fax: +86-21-3251-6358 Email: sales@nexcom.cn www.nexcom.cn

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Shenzhen Office

Room1707, North Block, Pines Bldg., No.7 Tairan Rd., Futian Area, Shenzhen, 518040, China Tel: +86-755-8332-7203 Fax: +86-755-8332-7213 Email: sales@nexcom.cn www.nexcom.cn

Wuhan Office

1-C1804/1805, Mingze Liwan, No. 519 South Luoshi Rd., Hongshan District, Wuhan, 430070, China Tel: +86-27-8722-7400 Fax: +86-27-8722-7400 Email: sales@nexcom.cn www.nexcom.cn

Chengdu Office

9F, Shuxiangxie, Xuefu Garden, No.12 Section 1, South Yihuan Rd., Chengdu, 610061, China Tel: +86-28-8523-0186 Fax: +86-28-8523-0186 Email: sales@nexcom.cn www.nexcom.cn

Europe

Italy NEXCOM ITALIA S.r.l

Via Gaudenzio Ferrari 29, 21047 Saronno (VA), Italia Tel: +39 02 9628 0333 Fax: +39 02 9286 9215 Email: nexcomitalia@nexcom.eu www.nexcomitalia.it

United Kingdom NEXCOM EUROPE

10 Vincent Avenue, Crownhill Business Centre, Milton Keynes, Buckinghamshire, MK8 0AB, United Kingdom Tel: +44-1908-267121 Fax: +44-1908-262042 Email: sales.uk@nexcom.eu www.nexcom.eu

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Preface

Package Contents

Before continuing, verify that the NDiS M533 package that you received is complete. Your package should have all the items listed in the following table.

Item Part Number Name Description Qty

1 50311F0112X00 Flat Head Screw Long FEI:F3x4iso For SPC-150 M3x4mm (NYLOK) Black 2 2 50311F0295X00 Flat Head Screw Long FEI:F2x4 NYLOK NIGP F2x4 NIGP NYLOK 2 3 5044440090X00 Thermal Pad APUS:3A2015001001500 15x10x1.5mm XR-PE 1 4 5060200081X00 Thermal Pad APUS:PSX PXF-098-060-08 25x15x0.2mm 1 5 5060900226X00 Mini PCIe Bracket CHYUAN-JYH 29x30x2.1mm SPCC t=1.0mm NI 1 6 6012200049X00 ASG110 PE BAG 24x38cm 240x380x0.08mm 1 7 6012200052X00 PE Zipper Bag #8 170x240mm, w/China RoHS Symbol 1 8 6012200053X00 PE Zipper Bag #3 100x70mm, w/China RoHS Symbol 1 9 6023309081X00 Cable EDI:232091081804-RS COM Port. DB9 Female to RJ45 8P8C L:1800mm 1

10 602DCD0777X00 NDiS M533 DVD Driver Manual VER:1.0 JCL 1

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Preface

Ordering Information

The following provides ordering information for NDiS M533.

NDiS M533 (P/N: 10W00M53300X0)

4th generation Intel® Core™ i5-4400E BGA type processor OPS, Intel QM87 chipset

®

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Chapter 1: Product Introduction

Overview

NDiS M533 is an OPS-compliant media player powered by 4th generation

®

Intel

Core™ processors. Following open pluggable standard, NDiS M533 can perfectly fit into a myriad of OPS-panels and is compact in size. Yet, NDiS M533 has high scalability, allowing for easy storage capacity expansion through pluggable 2.5” storage unit and effortless functional extension through Mini Card expansion modules. Changing system memory is also made simple. In addition, NDiS M533 leverages the 4th generation Intel Core™ processors to deliver outstanding graphics whilst limiting the power usage. The superb but power-efficient NDiS M533 can therefore maximize visual impacts for digital signage applications.

®

Key Features

▪ 4th generation Intel® Core™ i5-4400E processor family

®

▪ Intel

▪ Dual DDR3L SO-DIMM support

▪ WWAN/ WLAN/ TV Tuner support

▪ Support for Intel

HD Graphics with DirectX 11.1 support

®

AMT9.0

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Chapter 1: Product Introduction

Physical Features

Front Panel Rear Panel

AntennaAntenna

HDD SlotHDD LED

Power

Button

USB 3.0 USB 3.0 USB 3.0

Line-out Mic-in

LAN HDMI

COM

Reset

JAE TX25 80Pin

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Chapter 1: Product Introduction

Hardware Specifications

CPU Support

▪ 4th generation Intel® Core™ i5-4400E BGA type processor

Chipset

▪ Intel® QM87

Graphics

▪ Intel® integrated HD 4600

Main Memory

▪ 2x 204 pin SO-DIMM socket, support DDR3L 1600 MHz with un-buffered

and non-ECC SDRAM up to 16GB

I/O Interface-Front

▪ 1x Power button ▪ 1x Reset button ▪ 1x HDD LED ▪ 4x USB3.0 ▪ 1x HDMI ▪ 1x Mic-in / Line-out ▪ 1x 2.5” HDD slot ▪ 1x RJ45 with LEDs for Gigabit LAN ▪ 1x RJ45 for RS-232 ▪ 2x Antenna hole

▪ 1x Audio out L/R ▪ 2x USB 2.0 ▪ 1x USB 3.0 ▪ DC input +12V~+19V ▪ Control signals (PWR_STATUS, PS_ON#, PB_DET, CEC, SYS_FAN)

Storage Device

▪ 1x 2.5” SATA storage bay for HDD/ SSD

Expansion

▪ 1x mini-PCIe for optional WLAN/ TV tuner module ▪ 1x SIM slot

Dimensions

▪ 200mm (W) x 119mm (D) x 30mm (H) (7.8” x 4.7” x 1.1”)

Power Supply

▪ DC power input +12V~19V

Environment

▪ Operating temperature: ambient with air flow from 0°C to 45°C ▪ Storage temperature: -20°C to 80°C ▪ Humidity: 10 to 90% (non-condensing)

Certification

▪ CE approval ▪ FCC Class A

I/O Interface-Rear

▪ 1x TMDS ▪ 1x DisplayPort ▪ 1x UART

Operating System

▪ Windows 7 / Windows 8 / WES7 / WES8 / Linux

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Chapter 1: Product Introduction

Mechanical Dimensions

180.00

119.00

200.00

30.00

26.00 68.00

8.60

13.00

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Chapter 2: Jumpers and Connectors

This chapter describes how to set the jumpers and connectors on the NDiS M533 motherboard.

Before You Begin

▪ Ensure you have a stable, clean working environment. Dust and dirt can

get into components and cause a malfunction. Use containers to keep small components separated.

▪ Adequate lighting and proper tools can prevent you from accidentally

damaging the internal components. Most of the procedures that follow require only a few simple tools, including the following: – A Philips screwdriver – A flat-tipped screwdriver – A set of jewelers screwdrivers – A grounding strap – An anti-static pad

▪ Using your fingers can disconnect most of the connections. It is

recommended that you do not use needle-nosed pliers to disconnect connections as these can damage the soft metal or plastic parts of the connectors.

▪ Before working on internal components, make sure that the power is off.

Ground yourself before touching any internal components, by touching a metal object. Static electricity can damage many of the electronic components. Humid environments tend to have less static electricity than

dry environments. A grounding strap is warranted whenever danger of static electricity exists.

Precautions

Computer components and electronic circuit boards can be damaged by discharges of static electricity. Working on computers that are still connected to a power supply can be extremely dangerous.

Follow the guidelines below to avoid damage to your computer or yourself:

▪ Always disconnect the unit from the power outlet whenever you are

working inside the case.

▪ If possible, wear a grounded wrist strap when you are working inside the

computer case. Alternatively, discharge any static electricity by touching the bare metal chassis of the unit case, or the bare metal body of any other grounded appliance.

▪ Hold electronic circuit boards by the edges only. Do not touch the

components on the board unless it is necessary to do so. Don’t flex or stress the circuit board.

▪ Leave all components inside the static-proof packaging that they shipped

with until they are ready for installation.

▪ Use correct screws and do not over tighten screws.

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Chapter 2: Jumpers and Connectors

Locations of the Jumpers and Connectors for NDiB M533

NDiB M533

The figure below is the top and bottom view of the NDiB M533, which is the mainboard used in the NDiS M533. It shows the locations of the jumpers and connectors.

CON1

SATA1

CN5

J1J2

J3

CN3 CN4

CON2

COM1

CN2

CN1

CN6

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Chapter 2: Jumpers and Connectors

Jumper Settings

A jumper is the simplest kind of electric switch. It consists of two metal pins and a cap. When setting the jumpers, ensure that the jumper caps are placed on the correct pins. When the jumper cap is placed on both pins, the jumper is short. If you remove the jumper cap, or place the jumper cap on just one pin, the jumper is open.

Refer to the illustrations below for examples of what the 2-pin and 3-pin jumpers look like when they are short (on) and open (off).

Two-Pin Jumpers: Open (Left) and Short (Right)

Three-Pin Jumpers: Pins 1 and 2 are Short

3

2

1

3

2

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Chapter 2: Jumpers and Connectors

Jumpers

RTC Control Connector

Connector type: 1x3 3-pin header, 2.54mm pitch Connector location: J1

1 3

Pin Settings

1-2 On Normal 2-3 On Clear BIOS

1-2 On: default

Pin Definition

1 RTC_RST#_PU 2 RTC_RST# 3 CLR_CMOS

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Chapter 2: Jumpers and Connectors

Connector Pin Definitions

External I/O Interfaces

USB Connector

Connector type: USB 3.0 port Connector location: CN3 and CN4

9

1

Pin Definition Pin Definition

1 VBUS 2 D3 D+ 4 GND 5 SSRX- 6 SSRX+ 7 GND 8 SSTX9 SSTX+

5

4

LAN Port

Connector type: RJ45 port with LEDs Connector location: CON2

1 8

Pin Definition Pin Definition

1 TCT 2 MID33 MID3+ 4 MID25 MID2+ 6 MID17 MID1+ 8 MID0-

9 MID0+ 10 GND 11 LED+ 12 LAN_ACTLED#_C 13 LAN1_LED2P 14 LAN1_LED3P

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Chapter 2: Jumpers and Connectors

RJ45 RS232 Connector

Connector type: RJ45 port (RS232 only) Connector location: COM1

1 8

LAN1A LAN1B

Pin Definition Pin Definition

A1 RTS B1 RTS A3 TXD B3 TXD A4 GND B4 GND A6 RXD B6 RXD A8 CTS B8 CTS

USB 3.0 Ports

Connector type: Dual USB 3.0 ports Connector location: CN2

18

10

9

1

Pin Definition Pin Definition

1 VBUS1 2 D1-

3 D1+ 4 GND

5 STDA_SSRX1- 6 STDA_SSRX1+

7 GND 8 STDA_SST1-

9 STDA_SST1+ 10 VBUS2 11 D2- 12 D2+ 13 GND 14 STDA_SSRX215 STDA_SSRX2+ 16 GND 17 STDA_SSTX2- 18 STDA_SSTX2+

14

5

13

4

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Chapter 2: Jumpers and Connectors

HDMI

Connector type: HDMI port Connector location: CN1

19

18

1

2

Pin Definition Pin Definition

1 TMDS DATA2+ 2 GND 3 TMDS DATA2- 4 TMDS DATA1+ 5 GND 6 TMDS DATA17 TMDS DATA0+ 8 GND

9 TMDS DATA0- 10 TMDS CLOCK+ 11 GND 12 TMDS CLOCK13 CEC 14 NC 15 SCL 16 SDA 17 DDC 18 +5V 19 HOT PLUG DETECT

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Chapter 2: Jumpers and Connectors

JAE-TX25

Connector location: CON1

Pin Definition Pin Definition

1 DDP_3N 18 TMDS_CLK+ 2 DDP_3P 19 GND 3 GND 20 TMDS04 DDP_2N 21 TMDS0+ 5 DDP_2P 22 GND 6 GND 23 TMDS17 DDP_1N 24 TMDS1+ 8 DDP_1P 25 GND

9 GND 26 TMDS210 DDP_0N 27 TMDS2+ 11 DDP_0P 28 GND 12 GND 29 DVI_DDC_DATA 13 DDP_AUXN 30 DVI_DDC_CLK 14 DDP_AUXP 31 DVI_HPD 15 DDP_HPD 32 GND 16 GND 33 +12V~+19V 17 TMDS_CLK- 34 +12V~+19V

Pin Definition Pin Definition

35 +12V~+19V 58 StdA_SSTX+ 36 +12V~+19V 59 GND 37 +12V~+19V 60 USB_PN2 38 +12V~+19V 61 USB_PP2 39 +12V~+19V 62 GND 40 +12V~+19V 63 USB_PN1 41 RSVD 64 USB_PP1 42 RSVD 65 GND 43 RSVD 66 USB_PN0 44 RSVD 67 USB_PP0 45 RSVD 68 GND 46 RSVD 69 AZ_LINEOUT_L 47 RSVD 70 AZ_LINEOUT_R 48 RSVD 71 CEC 49 RSVD 72 PB_DET 50 SYS_FAN 73 PS_ON# 51 UART_RXD 74 PWR_STATUS 52 UART_TXD 75 GND 53 GND 76 GND 54 StdA_SSRX- 77 GND 55 StdA_SSRX+ 78 GND 56 GND 79 GND 57 StdA_SSTX- 80 GND

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Chapter 2: Jumpers and Connectors

Internal Connectors

RTC Battery Connector

Connector type: 1x2 2-pin header JST, 1.25mm pitch Connector location: J2

1

Pin Definition

1 GND

2 VBAT

2

Debug Port

Connector type: 1x10 10-pin header JST, 1.0mm pitch Connector location: J3

10

Pin Definition Pin Definition

1 VCC3 2 VCC3 3 LPC_AD0 4 LPC_AD1 5 LPC_AD2 6 LPC_AD3 7 LPC_FRAME# 8 LPC_CLK0 9 SIO_RST# 10 GND

1

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SATA Connector (7-pin and 15-pin)

Connector type: Standard Serial ATAII 7P and 15P Connector location: SATA1

S1P15

Pin Definition Pin Definition

S1 GND S2 SATA_TXPO_C S3 SATA_TXNO_C S4 GND S5 SATA_RXNO_C S6 SATA_RXNO_C S7 GND P1 NC P2 NC P3 NC P4 GND P5 GND P6 GND P7 VCC5 P8 VCC5 P9 VCC5

P10 GND P11 NC P12 GND P13 SATA_V12 P14 SATA_V12 P15 SATA_V12

MH1 GND MH2 GND

SIM Card Slot

Connector location: CN5

C3 C2 C1

Pin Definition Pin Definition

C1 UIM_PWR2 C2 UIM_RST2 C3 UIM_CLK2 C5 GND C6 NC C7 UIM_DAT2

C7 C6 C5

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Mini-PCIe Connector

Connector location: CN6

12

51 52

Pin Definition Pin Definition

1 PCIE_WAKE# 2 +3.3B_MINI 3 NC 4 GND 5 NC 6 D15VS 7 CLKREQ# 8 UIM_PWR

9 GND 10 UIM_DATA 11 MC_PCIE_CLK_N 12 UIM_CLK 13 MC_PCIE_CLK_P 14 UIM_RESET 15 GND 16 UIM_VPP 17 NC 18 GND 19 NC 20 MINICARD1_DIS# 21 GND 22 WLAN_RESET# 23 mPCIE_RX_N 24 +3.3B_MINI 25 mPCIE_RX_P 26 GND

15

Pin Definition Pin Definition

27 GND 28 D15VS 29 GND 30 SMB_CLK 31 mPCIE_TX_N 32 SMB_DATA 33 mPCIE_TX_P 34 GND 35 GND 36 USB_IN 37 GND 38 USB_IP 39 +3.3B_MINI 40 GND 41 +3.3B_MINI 42 NC 43 GND 44 LED_WLAN# 45 NC 46 NC 47 NC 48 D15VS 49 NC 50 GND 51 PRE-DEC 52 +3.3B_MINI

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Chapter 3: System Setup

CAUTION!

Chapter 3: System Setup

Removing the Chassis Cover

Prior to removing the chassis cover, make sure the unit’s power

CAUTION!CAUTION!

1. The screws on the front, top and back are used to secure the cover to the chassis. Remove these screws and put them in a safe place for later use.

is off and disconnected from the power sources to prevent electric shock or system damage.

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Installing a SO-DIMM (DIMM1)

1. Loosen the screws on the bottom cover of the chassis, then lift up the

cover and remove it from the chassis.

2. Push the ejector tabs which are at the ends of the socket outward. This indicates that the socket is unlocked.

Ejector tab

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3. Note how the module is keyed to the socket. Grasping the module by its edges, align the module with the socket so that the “notch” on the module is aligned with the “key” on the socket. The key ensures the module can be plugged into the socket in only one direction.

4. Insert the module into the socket at an approximately 30 degrees angle. Apply firm even pressure to each end of the module until it slips down into the socket. The contact fingers on the edge of the module will almost completely disappear inside the socket.

The ejector tabs at the ends of the socket will automatically snap into the locked position to hold the module in place.

Key

Notch

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Installing a SO-DIMM (DIMM2)

1. Remove the chassis cover. 2. Loosen the four screws on the heat sink and remove it to access the DIMM socket beneath.

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3. Push the ejector tabs which are at the ends of the socket outward. This

indicates that the socket is unlocked.

Ejector tab

4. Note how the module is keyed to the socket. Grasping the module by its edges, align the module with the socket so that the “notch” on the module is aligned with the “key” on the socket. The key ensures the module can be plugged into the socket in only one direction.

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Key

Notch

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Chapter 3: System Setup

5. Insert the module into the socket at an approximately 30 degrees angle. Apply firm even pressure to each end of the module until it slips down into the socket. The contact fingers on the edge of the module will almost completely disappear inside the socket.

The ejector tabs at the ends of the socket will automatically snap into the locked position to hold the module in place.

6. Please make sure a thermal pad is placed on the PCH.

Thermal pad

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Chapter 3: System Setup

CAUTION!

7. Before reinstalling the heat sink, place the included thermal pad on the bottom of the heat sink.

Adhesive lm (on both sides)

Thermal pad

Please install the thermal pad and make sure the adhesive

CAUTION!CAUTION!

films on both sides of the thermal pad are removed before placing it on the heat sink.

8. Place the thermal pad onto the heat sink as depicted in the image below.

Place thermal pad here

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Chapter 3: System Setup

9. After the adhesive films are removed and the thermal pad is placed onto the heat sink, reinstall the heat sink and fasten four screws to secure the heat sink.

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Chapter 3: System Setup

CAUTION!

Installing a 2.5” HDD Storage

The system is equipped with a removable 2.5” HDD drive bay. To install a HDD, please follow the instructions below.

CAUTION!CAUTION!

1. Remove the HDD cover located at the front panel by loosening the

screw.

Please correctly follow the below instructions and noted items to avoid making unnecessary damages.

Screw

2. Gently take the cover out.

3. Align the mounting holes on the front of the HDD to the mounting holes on the cover, then tighten screws on both sides to secure it. Make sure the connector side of the HDD is facing outwards.

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Screw

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Chapter 3: System Setup

4. Put the HDD back into the slot gently, then tighten the screw to secure it.

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Chapter 3: System Setup

Installing a Wireless LAN Module

1. Remove the chassis cover and the antenna hole covers.

2. On the bottom and side of the chassis, loosen the screws on the mini-PCIe cover, then lift up the cover and remove it from the chassis.

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Chapter 3: System Setup

mounting holes on the Wi-Fi module bracket. Then tighten screws onto the mounting holes to secure the bracket.

Wi-Fi module bracketMounting holes

4. Locate the mini-PCIe slot and insert the Wi-Fi module into the slot.3. Align the mounting holes on the Wi-Fi mini card module to the

27

Mini-PCIe slot

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Chapter 3: System Setup

5. Align the mounting holes on the module to the mounting holes on the board, and tighten screws to secure it.

Screw

6. Locate the RF connector on the Wi-Fi module and attach one end of the RF cables onto the Wi-Fi module.

RF connector

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Chapter 3: System Setup

7. Wire the RF cables behind the mainboard.

8. Insert the 2 rings (ring 1 then ring 2) into the Wi-Fi antenna jacks.

9. Mount the Wi-Fi antenna jacks to the Wi-Fi antenna holes located at the front panel of the chassis, then tighten the rings.

Ring1

Ring2

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Chapter 3: System Setup

10. Connect the external antennas to the Wi-Fi antenna jacks.

Antenna

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Installing a 3G Module

1. On the bottom and side of the chassis, loosen the screws on the mini-PCIe cover, then lift up the cover and remove it from the chassis.

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2. Locate the mini-PCIe slot and insert the 3G module into the slot.

Mini-PCIe slot

3. Align the mounting holes on the module to the mounting holes on the board, and tighten screws to secure it.

Screw

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4. Locate the RF connector on the 3G module and attach the RF cable onto the 3G module.

RF connector

5. Wire the RF cable behind the mainboard.

6. Insert the 2 rings (ring 1 then ring 2) into the 3G antenna jack.

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Ring1

Ring2

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7. Mount the 3G antenna jack to the antenna hole located at the front panel of the chassis, then tighten the rings.

8. Connect the external antenna to the antenna jack.

Antenna

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NDiS M533 User Manual

Chapter 4: BIOS Setup

This chapter describes how to use the BIOS setup program for the NDiS M533. The BIOS screens provided in this chapter are for reference only and may change if the BIOS is updated in the future.

To check for the latest updates and revisions, visit the NEXCOM Web site at www.nexcom.com.tw.

About BIOS Setup

The BIOS (Basic Input and Output System) Setup program is a menu driven utility that enables you to make changes to the system configuration and tailor your system to suit your individual work needs. It is a ROM-based configuration utility that displays the system’s configuration status and provides you with a tool to set system parameters.

These parameters are stored in non-volatile battery-backed-up CMOS RAM that saves this information even when the power is turned off. When the system is turned back on, the system is configured with the values found in CMOS.

With easy-to-use pull down menus, you can configure such items as:

▪ Hard drives, diskette drives, and peripherals

▪ Video display type and display options

▪ Password protection from unauthorized use

▪ Power management features

The settings made in the setup program affect how the computer performs. It is important, therefore, first to try to understand all the setup options, and second, to make settings appropriate for the way you use the computer.

When to Configure the BIOS

▪ This program should be executed under the following conditions:

▪ When changing the system configuration

▪ When a configuration error is detected by the system and you are

prompted to make changes to the setup program

▪ When resetting the system clock

▪ When redefining the communication ports to prevent any conflicts

▪ When making changes to the Power Management configuration

▪ When changing the password or making other changes to the security

setup

Normally, CMOS setup is needed when the system hardware is not consistent with the information contained in the CMOS RAM, whenever the CMOS RAM has lost power, or the system features need to be changed.

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Chapter 4: BIOS Setup

Default Configuration

Most of the configuration settings are either predefined according to the Load Optimal Defaults settings which are stored in the BIOS or are automatically detected and configured without requiring any actions. There are a few settings that you may need to change depending on your system configuration.

Entering Setup

When the system is powered on, the BIOS will enter the Power-On Self Test (POST) routines. These routines perform various diagnostic checks; if an error is encountered, the error will be reported in one of two different ways:

▪ If the error occurs before the display device is initialized, a series of beeps

will be transmitted.

▪ If the error occurs after the display device is initialized, the screen will

display the error message.

Powering on the computer and immediately pressing <Del> allows you to enter Setup.

Legends

Key Function

Moves the highlight left or right to select a menu.

Moves the highlight up or down between sub¬menus or fields.

Exits the BIOS Setup Utility.

Scrolls forward through the values or options of the highlighted field.

Scrolls backward through the values or options of the highlighted field.

Selects a field.

Displays General Help.

Load previous values.

Load optimized default values.

Press the

key to enter Setup:

36

Saves and exits the Setup program.

Press <Enter> to enter the highlighted sub¬menu

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Chapter 4: BIOS Setup

Scroll Bar

When a scroll bar appears to the right of the setup screen, it indicates that there are more available fields not shown on the screen. Use the up and down arrow keys to scroll through all the available fields.

Submenu

When “” appears on the left of a particular field, it indicates that a submenu which contains additional options are available for that field. To display the submenu, move the highlight to that field and press .

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Chapter 4: BIOS Setup

BIOS Setup Utility

Once you enter the AMI BIOS Setup Utility, the Main Menu will appear on the screen. The main menu allows you to select from several setup functions and one exit. Use arrow keys to select among the items and press to accept or enter the submenu.

Main

The Main menu is the first screen that you will see when you enter the BIOS Setup Utility.

Advanced Boot Security Save & ExitMain

BIOS Information BIOS Vendor BIOS Version Build Date and Time

Memory Information Memory Frequency Total Memory DIMM#0 DIMM#1

ME FW Version ME Firmware SKU

System Board Information Production Name

System Language

System Date System Time

American Megatrends D533M008 10/14/2013 14:25:43

1600 Mhz 4096 MB (DDR3) Not Present 4096 MB (DDR3)

9.0.13.1402 5MB

NDISM533

[English]

[Mon 01/12/2009] [06:43:33]

Choose the system default language

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

System Language

Selects the system default language.

System Date

The date format is <day>, <month>, <date>, <year>. Day displays a day, from Monday to Sunday. Month displays the month, from January to December. Date displays the date, from 1 to 31. Year displays the year, from 1999 to 2099.

System Time

The time format is <hour>, <minute>, <second>. The time is based on the 24-hour military-time clock. For example, 1 p.m. is 13:00:00. Hour displays hours from 00 to 23. Minute displays minutes from 00 to 59. Second displays seconds from 00 to 59.

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Chapter 4: BIOS Setup

Advanced

The Advanced menu allows you to configure your system for basic operation. Some entries are defaults required by the system board, while others, if enabled, will improve the performance of your system or let you set some features according to your preference.

Setting incorrect field values may cause the system to malfunction.

Advanced Boot Security Save & ExitMain

RTC Wake Settings

ACPI Settings

CPU Conguration SATA Conguration

Power Control

BIOS Security Conguration Graphics Conguration AMT Conguration USB Conguration NCT6106D Super IO Conguration

NCT6106D H/W Monitor

Enable system to wake using RTC alarm

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

RTC Wake Settings

This section is used to configure RTC Wake settings.

Main

Wake system with Fixed Time [Disabled]

Advanced Chipset PCIPnP Security

Exit

Enable or disable System wake on alarm event. When enabled, System will wake on the

hr::min::sec specied

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Wake System with Fixed Time

Enables or disables system wake on alarm event. When enabled, system will wake on the hr::min::sec specified.

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Chapter 4: BIOS Setup

ACPI Settings

This section is used to configure ACPI Settings.

Main

ACPI Settings

Enable Hibernation [Enabled]

ACPI Sleep State [S3 only(Suspend to...)]

Advanced Chipset PCIPnP Security

Exit

Enables or Disables System ability to Hibernate (OS/S4 Sleep State). This option may be not effective with some OS.

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Enable Hibernation

Enables or disables system ability to hibernate (OS/S4 Sleep State). This option may not be effective with some OS.

ACPI Sleep State

Select the highest ACPI sleep state the system will enter when the suspend button is pressed. The options are Suspend Disabled and S3 (Suspend to RAM).

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Chapter 4: BIOS Setup

CPU Configuration

This section is used to configure the CPU.

Main

CPU Conguration

Intel(R) Core(TM) i5-4400E CPU @ 2.70GHz CPU Signature 306c3 Processor Family 6 Microcode Patch 12 FSB Speed 100 MHz CPU Speed 3200 MHz Processor Cores 2 Intel HT Technology Supported Intel VT-x Technology Supported Intel SMX Technology Supported EIST Technology Supported

Hyper-threading [Enabled]

Intel Virtualization Technology [Enabled] EIST [Enabled] Turbo Mode [Enabled] CPU C states [Enabled] Enhanced C1 state [Enabled] CPU C3 Report [Enabled] CPU C6 report [Enabled] C6 Latency [Short] CPU C7 report [CPU C7s] C7 Latency [Long]

Advanced Chipset PCIPnP Security

Exit

Enabled for Windows XP and Linux (OS optimized for HyperThreading Technology) and Disabled for other OS (OS not optimized for Hyper-Threading Technology). When Disabled only one thread per enabled core is enabled.

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Hyper-Threading

This field is used to enable or disable hyper-threading.

Turbo Mode

Enables or disables turbo mode.

CPU C States

Enables or disables CPU C states.

Enhanced C1 State

Enables or disables enhanced C1 state.

CPU C3 Report

Enables or disables C3 report to the operating system.

CPU C6 Report

Enables or disables C6 report to the operating system.

C6 Latency

Configures short/long latency for C6.

CPU C7 Report

Enables or disables C7 report to the operating system.

C7 Latency

Configures short/long latency for C7.

Intel® Virtualization Technology

When this field is set to Enabled, the VMM can utilize the additional hardware capabilities provided by Vanderpool Technology.

EIST

Enables or disables Intel® SpeedStep.

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Chapter 4: BIOS Setup

SATA Configuration

This section is used to configure the SATA drives.

Advanced Boot Security Save & ExitMain

SATA Controller(s)

SATA Mode Selection

Serial ATA Port 0 Software Preserve

Port 0 Spin Up Device

[Enabled]

[AHCI]

Empty Unknown

[Enabled] [Disabled]

SATA Controller(s)

Enables or disables the SATA controller.

Determines how SATA controller(s) operate.

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

SATA Mode Selection

Configures the SATA as IDE or AHCI mode.

IDE This option configures the Serial ATA drives as Parallel ATA physical storage device.

AHCI This option configures the Serial ATA drives to use AHCI (Advanced Host Controller Interface). AHCI allows the storage driver to enable the advanced Serial ATA features which will increase storage performance.

Port 0

Enables or disables Serial ATA port 0.

Spin Up Device

Enables or disables staggered spin up on device connected to Serial ATA port 0.

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Chapter 4: BIOS Setup

Power Control

This section is used to configure power state settings.

Advanced Boot Security Save & ExitMain

Restore AC Power Loss

[Power Off]

Select AC power state when power is re-applied after a power failure.

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Restore on AC Power Loss

Power Off When power returns after an AC power failure, the system’s power is off. You must press the Power button to power-on the system.

Power On When power returns after an AC power failure, the system will automatically power-on.

BIOS Security Configuration

This section is used to configure the BIOS security settings.

Advanced Boot Security Save & ExitMain

BIOS Security Conguration

BIOS Lock

RTC RAM Lock

[Disabled]

Enable or disable BIOS lock enable (BLE) bit.

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

BIOS Lock

Enables or disables BIOS lock enable (BLE) bit.

RTC RAM Lock

Enables or disables bytes 38h-3Fh in the upper and lower 128-byte bank of RTC RAM lockdown.

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Chapter 4: BIOS Setup

Graphics Configuration

This section is used to configure the graphics parameters.

Advanced Boot Security Save & ExitMain

Select the Video Device which

Primary IGFX Boot Display

Secondary IGFX Boot Display

[Internal HDMI]

[External HDMI]

will be activated during POST. This has no effect if external graphics present. Secondary boot display selection will appear based on your selection. VGA modes will be supported only on primary display

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Primary IGFX Boot Display

Select the video device which will be activated during POST. Has no effect if external graphics is present. Secondary boot display selection will appear based on your selection. VGA modes will be supported only on primary display.

Secondary IGFX Boot Display

Select the secondary display device.

AMT Configuration

This section is used to configure Active Management Technology (AMT) options.

Advanced Boot Security Save & ExitMain

Intel AMT

BIOS Hotkey Pressed MEBx Selection Screen Disable ME

[Enabled]

[Disabled] [Disabled] [Disabled]

Enable/Disable Intel (R) Active Management Technology BIOS Extension. Note : iAMT H/W is always enabled. This option just controls the BIOS extension execution. If enabled, this requires

additional rmware in the SPI

device

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Intel® AMT

Enables or disables Intel® Active Management Technology.

BIOS Hotkey Pressed

Enables or disables BIOS hotkey press.

MEBx Selection Screen

Enables or disables MEBx selection screen.

Disable ME

Sets ME to Soft Temporary disabled.

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Chapter 4: BIOS Setup

USB Configuration

This section is used to configure the USB.

Advanced

USB Conguration

USB Module Version

Legacy USB Support

USB3.0 Support XHCI Hand-off EHCI Hand-off USB Mass Storage Driver Support

8.10.27

[Enabled]

[Enabled] [Enabled] [Disabled] [Enabled]

Enables Legacy USB support. AUTO option disables legacy support if no USB devices are connected. DISABLE option will keep USB devices available only for EFI applications.

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Legacy USB Support

Enabled Enables Legacy USB. Auto Disables support for Legacy when no USB devices are connected. Disabled Keeps USB devices available only for EFI applications.

XHCI Hand-off

This is a workaround for OSs that does not support XHCI hand-off. The XHCI ownership change should be claimed by the XHCI driver.

EHCI Hand-off

This is a workaround for OSs that does not support EHCI hand-off. The EHCI ownership change should be claimed by the EHCI driver.

USB Mass Storage Driver Support

Enables or disables USB mass storage driver support.

USB 3.0 Support

Enables or disables the USB 3.0 controller.

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Chapter 4: BIOS Setup

NCT6106D Super IO Configuration

This section is used to configure serial ports 0 and 1.

Advanced

NCT6106D Super IO Conguration

NCT6106D Super IO Chip



Serial Port 0 Conguration



Serial Port 1 Conguration

NCT6106D

NCT6106D Super IO Chip

Displays the Super I/O chip used on the board.

Set Parameters of Serial Port 0 (COMA)

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Serial Port 0 Configuration

This section is used to configure serial port 0.

Advanced

Serial Port 0 Conguration

Serial Port

Device Settings

Change Settings

[Enabled]

IO=2F8h; IRQ=5;

[Auto]

Serial Port

Enables or disables the serial port.

Enable or Disable Serial Port (COM)

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Change Settings

Selects an optimal setting for the Super IO device.

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Serial Port 1 Configuration

This section is used to configure serial port 1.

Advanced

Serial Port 1 Conguration

Serial Port

Device Settings

Change Settings

[Enabled]

IO=3E8h; IRQ=3;

[Auto]

Enable or Disable Serial Port (COM)

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Serial Port

Enables or disables the serial port.

Change Settings

Selects an optimal setting for the Super IO device.

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Chapter 4: BIOS Setup

H/W Monitor

This section is used to monitor hardware status such as temperature, fan speed and voltages.

Advanced

PC Health Status

Smart Fan Function

SYS Thermistor Temp CPU Diode Temp CpuFan Speed VCORE VIN0 VIN1

[Enabled]

: +48.5 C : +66.0 C : 2132 RPM : +1.744 V : +12.192 V : +5.160 V

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Smart Fan Function

Enables or disables smart fan function.

CpuFan Speed

Detects and displays the current CPU fan speed.

VCORE

Detects and displays the Vcore CPU voltage.

VIN0

Detects and displays 12V voltage.

VIN1

Detects and displays 5V voltage.

SYS Thermistor Temp

Detects and displays the current system temperature.

CPU Diode Temp

Detects and displays the current CPU diode temperature.

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Chapter 4: BIOS Setup

Boot

This section is used to configure the boot features.

Advanced

Launch PXE OpROM policy

Boot Option Priorities

Launch PXE OpROM Policy

Controls the execution of UEFI and legacy PXE OpROM.

Boot Option Priorities

Adjust the boot sequence of the system. Boot Option #1 is the first boot device that the system will boot from, next will be #2 and so forth.

Boot

Security

[Do not launch]

Save & ExitMain

Controls the execution of UEFI and Legacy PXE OpROM

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Security

Advanced Boot Security Save & ExitMain

Password Description

If ONLY the Administrator’s password is set, then this only limits access to Setup and is only asked for when entering Setup. If ONLY the User’s password is set, then this is a power on password and must be entered to boot or enter Setup. In Setup the User Will have Administrator rights. The password length must be in the following range: Minimum length 3 Maximum length 20

Administrator Password

User Password

Administrator Password

Select this to reconfigure the administrator’s password.

User Password

Select this to reconfigure the user’s password.

Set Administrator Password

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

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Save & Exit

Advanced Boot

Save Changes and Reset

Discard Changes and Reset

Restore Defaults Save as User Defaults

Save Changes and Reset

To save the changes and reset, select this field then press <Enter>. A dialog box will appear. Confirm by selecting Yes.

Security

Save & ExitMain

Save & Exit

Reset the system after saving the changes.

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Save as User Defaults

To use the current configurations as user default settings for the BIOS, select this field then press <Enter>. A dialog box will appear. Confirm by selecting Yes.

Discard Changes and Reset

To exit the Setup utility without saving the changes, select this field then press <Enter>. You may be prompted to confirm again before exiting.You can also press <ESC> to exit without saving the changes.

Restore Defaults

To restore the BIOS to default settings, select this field then press <Enter>. A dialog box will appear. Confirm by selecting Yes.

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NDiS M533 User Manual

Appendix A: Watchdog Timer

CR F0h. Watchdog Timer I(WDT1) and KBC P20 Control Mode Register

Location: Address F0h Attribute: Read/Write Power Well: VCC Reset by: LRESET# or PWROK Default: 00h Size: 8 bits

Bit Read/Write Description

7-5 Reserved.

Watchdog Timer I count mode is 1000 times faster. 0: Disable.

4 R / W

3 R / W

2 R / W

1 R / W

0 Reversed

1: Enable. (If bit-3 is 0, the count mode is 1/1000 seconds mode.) (If bit-3 is 1, the count mode is 1/1000 minutes mode.)

Select Watchdog Timer I count mode. 0: Second Mode. 1: Minute Mode.

Enable the rising edge of a KBC reset (P20) to issue a timeout event. 0: Disable. 1: Enable.

Disable / Enable the Watchdog Timer I output low pulse to the KBRST# pin (PIN59) 0: Disable. 1: Enable.

CR F1h. Watchdog Timer I(WDT1) Counter Register

Location: Address F1h Attribute: Read/Write Power Well: VCC Reset by: LRESET# or PWROK Default: 04h Size: 8 bits

Bit Read/Write Description

Watch Dog Timer I Time-out value. Writing a non-zero value to this register causes the counter to load the value into the Watch Dog Counter and start counting down. If CR F2h, bits 7 and 6 are set, any Mouse Interrupt or Keyboard Interrupt event causes the previously-loaded, non-zero value to be reloaded to the Watch Dog Counter and the count down

7-0 R / W

resumes. Reading this register returns the current value in the Watch Dog Counter, not the Watch Dog Timer Timeout value. 00h: Time-out Disable 01h: Time-out occurs after 5.03x107 CLKIN cycle time, by analogy. (5.03x107 x (1/48MHz) = 1.046s)

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NDiS M533 User Manual

Appendix A: Watchdog Timer

CR F2h. Watchdog Timer I(WDT1) Control & Status Register

Location: Address F2h Attribute: Read/Write Power Well: VCC Reset by: LRESET# or PWROK Default: 00h Size: 8 bits

Bit Read/Write Description

Mouse interrupt reset enables watch-dog timer reload

7 R / W

6 R / W

5 Write “1” Only Trigger Watchdog Timer I event. This bit is self-clearing.

4

3-0 R / W These bits select the IRQ resource for the Watchdog Timer I

R / W

Write “0” Clear

0: Watchdog Timer I is not affected by mouse interrupt. 1: Watchdog Timer I is reset by mouse interrupt.

Keyboard interrupt reset enables watch-dog timer reload 0: Watchdog Timer I is not affected by keyboard interrupt. 1: Watchdog Timer I is reset by keyboard interrupt.

Watchdog Timer I status bit 0: Watchdog Timer I is running. 1: Watchdog Timer I issues time-out event.

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NDiS M533 User Manual

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