NEXCOM NDiS B532 User Manual

NEXCOM International Co., Ltd.

Multi-Media Solutions

Digital Signage Platform NDiS B532

User Manual

NEXCOM International Co., Ltd.

Published March 2014

www.nexcom.com

Content

Contents

Preface

Copyright ............................................................................................. iv

Disclaimer .............................................................................................. iv

Acknowledgements ............................................................................... iv

Regulatory Compliance Statements ........................................................ iv

Declaration of Conformity ...................................................................... iv

RoHS Compliance ................................................................................... v

Warranty and RMA ................................................................................ vi

Safety Information ................................................................................viii

Installation Recommendations ...............................................................viii

Safety Precautions .................................................................................. ix

Technical Support and Assistance ............................................................ x

Conventions Used in this Manual ............................................................ x

Global Service Contact Information ........................................................ xi

Package Contents ................................................................................. xiii

Ordering Information ............................................................................xiv

Chapter 1: Product Introduction

Overview ................................................................................................1

Key Features ...........................................................................................1

Physical Features .....................................................................................2

Front Panel ..........................................................................................2

Rear Panel ...........................................................................................2

Hardware Specifications ..........................................................................3

Mechanical Dimensions ...........................................................................4

Chapter 2: Jumpers and Connectors

Before You Begin ....................................................................................5

Precautions ............................................................................................5

Locations of the Jumpers and Connectors for NDiB B532 ........................ 6

NDiB B532 ...........................................................................................6

Jumper Settings ......................................................................................7

Jumpers .................................................................................................. 8

RTC Clear Jump ................................................................................... 8

Connector Pin Definitions .......................................................................9

External I/O Interfaces - Front Panel .....................................................9

Power Button ................................................................................... 9

LED Connector ................................................................................. 9

Reset Button ..................................................................................10

COM1 and COM2 Connectors ....................................................... 10

USB 3.0 Ports ................................................................................. 11

External I/O Interfaces - Rear Panel.....................................................12

DC Jack Connector ........................................................................12

HDMI ............................................................................................. 12

USB 3.0 Ports ................................................................................. 13

LAN Connectors ............................................................................. 13

S/PDIF Connector ...........................................................................14

Audio Connectors .......................................................................... 14

Internal Connectors ........................................................................... 15

USB Connector ..............................................................................15

SIM Card Slot .................................................................................15

Debug 80 Port Connector ..............................................................16

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Content

SATA Connector .............................................................................16

SATA Connector (7-pin and 15-pin) ................................................17

SATA DOM Power Connector .........................................................17

Battery Connector .......................................................................... 18

MCU Debug Jump .........................................................................18

GPIO .............................................................................................. 19

MCU Download Connector ............................................................ 19

FAN Connector ..............................................................................20

DC-in Power Connector .................................................................20

Mini-PCIe Connector ...................................................................... 21

Mini-PCIe Connector ...................................................................... 22

Chapter 3: System Setup 23

Removing the Chassis Cover ................................................................23

Installing a SO-DIMM ............................................................................ 24

Installing the CPU .................................................................................26

Installing a SATA Hard Drive ..................................................................31

Installing a Wireless LAN Module ..........................................................34

Installing a TV Tuner Module ................................................................. 36

Chapter 4: BIOS Setup 38

About BIOS Setup ................................................................................. 38

When to Configure the BIOS .................................................................38

Default Configuration ........................................................................... 39

Entering Setup ...................................................................................... 39

Legends ................................................................................................ 39

BIOS Setup Utility .................................................................................. 41

Main .................................................................................................41

Advanced .......................................................................................... 42

Boot .................................................................................................. 52

Security .............................................................................................53

Save & Exit ........................................................................................53

Appendix A: Watchdog Timer......................................54

Appendix B: GPI/O Programming Guide.....................56

GPIO Configuration ........................................................................... 56

Appendix C: Triple Display Settings............................57

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NDiS B532 User Manual

Preface

Copyright

This publication, including all photographs, illustrations and software, is protected under international copyright laws, with all rights reserved. No part of this manual may be reproduced, copied, translated or transmitted in any form or by any means without the prior written consent from NEXCOM International Co., Ltd.

Disclaimer

The information in this document is subject to change without prior notice and does not represent commitment from NEXCOM International Co., Ltd. However, users may update their knowledge of any product in use by constantly checking its manual posted on our website: http://www.nexcom.com. NEXCOM shall not be liable for direct, indirect, special, incidental, or consequential damages arising out of the use of any product, nor for any infringements upon the rights of third parties, which may result from such use. Any implied warranties of merchantability or fitness for any particular purpose is also disclaimed.

Acknowledgements

NDiS B532 is a trademark of NEXCOM International Co., Ltd. All other product names mentioned herein are registered trademarks of their respective owners.

Regulatory Compliance Statements

This section provides the FCC compliance statement for Class B devices and describes how to keep the system CE compliant.

Declaration of Conformity

FCC

This equipment has been tested and verified to comply with the limits for a Class B digital device, pursuant to Part 15 of FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. Operation of this equipment in a residential area (domestic environment) is likely to cause harmful interference, in which case the user will be required to correct the interference (take adequate measures) at their own expense.

CE

The product(s) described in this manual complies with all applicable European Union (CE) directives if it has a CE marking. For computer systems to remain CE compliant, only CE-compliant parts may be used. Maintaining CE compliance also requires proper cable and cabling techniques.

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Preface

RoHS Compliance

NEXCOM RoHS Environmental Policy and Status Update

NEXCOM is a global citizen for building the digital infrastructure. We are committed to providing green

products and services, which are compliant with European Union RoHS (Restriction on Use of Hazardous Substance in Electronic Equipment) directive 2011/65/EU, to be your trusted green partner and to protect our environment.

RoHS restricts the use of Lead (Pb) < 0.1% or 1,000ppm, Mercury (Hg) < 0.1% or 1,000ppm, Cadmium (Cd) < 0.01% or 100ppm, Hexavalent Chromium (Cr6+) < 0.1% or 1,000ppm, Polybrominated biphenyls (PBB) < 0.1% or 1,000ppm, and Polybrominated diphenyl Ethers (PBDE) < 0.1% or 1,000ppm.

In order to meet the RoHS compliant directives, NEXCOM has established an engineering and manufacturing task force to implement the introduction of green products. The task force will ensure that we follow the standard NEXCOM development procedure and that all the new RoHS components and new manufacturing processes maintain the highest industry quality levels for which NEXCOM are renowned.

The model selection criteria will be based on market demand. Vendors and suppliers will ensure that all designed components will be RoHS compliant.

How to recognize NEXCOM RoHS Products?

For existing products where there are non-RoHS and RoHS versions, the suffix “(LF)” will be added to the compliant product name.

All new product models launched after January 2013 will be RoHS compliant. They will use the usual NEXCOM naming convention.

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Preface

Warranty and RMA

NEXCOM Warranty Period

NEXCOM manufactures products that are new or equivalent to new in accordance with industry standard. NEXCOM warrants that products will be free from defect in material and workmanship for 2 years, beginning on the date of invoice by NEXCOM. HCP series products (Blade Server) which are manufactured by NEXCOM are covered by a three year warranty period.

NEXCOM Return Merchandise Authorization (RMA)

▪ Customers shall enclose the “NEXCOM RMA Service Form” with the

returned packages.

▪ Customers must collect all the information about the problems

encountered and note anything abnormal or, print out any on-screen messages, and describe the problems on the “NEXCOM RMA Service Form” for the RMA number apply process.

▪ Customers can send back the faulty products with or without accessories

(manuals, cable, etc.) and any components from the card, such as CPU and RAM. If the components were suspected as part of the problems, please note clearly which components are included. Otherwise, NEXCOM is not responsible for the devices/parts.

▪ Customers are responsible for the safe packaging of defective products,

making sure it is durable enough to be resistant against further damage and deterioration during transportation. In case of damages occurred during transportation, the repair is treated as “Out of Warranty.”

▪ Any products returned by NEXCOM to other locations besides the

customers’ site will bear an extra charge and will be billed to the customer.

Repair Service Charges for Out-of-Warranty Products

NEXCOM will charge for out-of-warranty products in two categories, one is basic diagnostic fee and another is component (product) fee.

Repair Service Charges for Out-of-Warranty Products

NEXCOM will charge for out-of-warranty products in two categories, one is basic diagnostic fee and another is component (product) fee.

System Level

▪ Component fee: NEXCOM will only charge for main components such as

SMD chip, BGA chip, etc. Passive components will be repaired for free, ex: resistor, capacitor.

▪ Items will be replaced with NEXCOM products if the original one cannot

be repaired. Ex: motherboard, power supply, etc.

▪ Replace with 3rd party products if needed.

▪ If RMA goods can not be repaired, NEXCOM will return it to the customer

without any charge.

Board Level

▪ Component fee: NEXCOM will only charge for main components, such

as SMD chip, BGA chip, etc. Passive components will be repaired for free, ex: resistors, capacitors.

▪ If RMA goods can not be repaired, NEXCOM will return it to the customer

without any charge.

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Preface

Warnings

Read and adhere to all warnings, cautions, and notices in this guide and the documentation supplied with the chassis, power supply, and accessory modules. If the instructions for the chassis and power supply are inconsistent with these instructions or the instructions for accessory modules, contact the supplier to find out how you can ensure that your computer meets safety and regulatory requirements.

Cautions

Electrostatic discharge (ESD) can damage system components. Do the described procedures only at an ESD workstation. If no such station is available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the computer chassis.

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Preface

Safety Information

Before installing and using the device, note the following precautions:

▪ Read all instructions carefully.

▪ Do not place the unit on an unstable surface, cart, or stand.

▪ Follow all warnings and cautions in this manual.

▪ When replacing parts, ensure that your service technician uses parts

specified by the manufacturer.

▪ Avoid using the system near water, in direct sunlight, or near a heating

device.

▪ The load of the system unit does not solely rely for support from the

rackmounts located on the sides. Firm support from the bottom is highly necessary in order to provide balance stability.

▪ The computer is provided with a battery-powered real-time clock circuit.

There is a danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the manufacturer. Discard used batteries according to the manufacturer’s instructions.

Installation Recommendations

Ensure you have a stable, clean working environment. Dust and dirt can get into components and cause a malfunction. Use containers to keep small components separated.

Adequate lighting and proper tools can prevent you from accidentally damaging the internal components. Most of the procedures that follow require only a few simple tools, including the following:

▪ A Philips screwdriver

▪ A flat-tipped screwdriver

▪ A grounding strap

▪ An anti-static pad

Using your fingers can disconnect most of the connections. It is recommended that you do not use needle-nose pliers to disconnect connections as these can damage the soft metal or plastic parts of the connectors.

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Preface

Safety Precautions

1. Read these safety instructions carefully.

2. Keep this User Manual for later reference.

3. Disconnect this equipment from any AC outlet before cleaning. Use a

damp cloth. Do not use liquid or spray detergents for cleaning.

4. For plug-in equipment, the power outlet socket must be located near the

equipment and must be easily accessible.

5. Keep this equipment away from humidity.

6. Put this equipment on a stable surface during installation. Dropping it or

letting it fall may cause damage.

7. The openings on the enclosure are for air convection to protect the

equipment from overheating. DO NOT COVER THE OPENINGS.

8. Make sure the voltage of the power source is correct before connecting

the equipment to the power outlet.

9. Place the power cord in a way so that people will not step on it. Do not

place anything on top of the power cord. Use a power cord that has been approved for use with the product and that it matches the voltage and current marked on the product’s electrical range label. The voltage and current rating of the cord must be greater than the voltage and current rating marked on the product.

10. All cautions and warnings on the equipment should be noted.

11. If the equipment is not used for a long time, disconnect it from the power source to avoid damage by transient overvoltage.

12. Never pour any liquid into an opening. This may cause fire or electrical shock.

13. Never open the equipment. For safety reasons, the equipment should be opened only by qualified service personnel.

14. If one of the following situations arises, get the equipment checked by service personnel:

a. The power cord or plug is damaged. b. Liquid has penetrated into the equipment. c. The equipment has been exposed to moisture. d. The equipment does not work well, or you cannot get it to work

according to the user’s manual. e. The equipment has been dropped and damaged. f. The equipment has obvious signs of breakage.

15. Do not place heavy objects on the equipment.

16. The unit uses a three-wire ground cable which is equipped with a third pin to ground the unit and prevent electric shock. Do not defeat the purpose of this pin. If your outlet does not support this kind of plug, contact your electrician to replace your obsolete outlet.

17. CAUTION: DANGER OF EXPLOSION IF BATTERY IS INCORRECTLY REPLACED. REPLACE ONLY WITH THE SAME OR EQUIVALENT TYPE RECOMMENDED BY THE MANUFACTURER. DISCARD USED BATTERIES ACCORDING TO THE MANUFACTURER’S INSTRUCTIONS.

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Preface

CAUTION!

Technical Support and Assistance

1. For the most updated information of NEXCOM products, visit NEXCOM’s website at www.nexcom.com.

2. For technical issues that require contacting our technical support team or sales representative, please have the following information ready before calling: – Product name and serial number – Detailed information of the peripheral devices – Detailed information of the installed software (operating system,

version, application software, etc.) – A complete description of the problem – The exact wordings of the error messages

Warning!

1. Handling the unit: carry the unit with both hands and handle it with care.

2. Maintenance: to keep the unit clean, use only approved cleaning products or clean with a dry cloth.

3. CompactFlash: Turn off the unit’s power before inserting or removing a CompactFlash storage card.

Conventions Used in this Manual

Warning: Information about certain situations, which if not observed, can cause personal injury. This will prevent injury to yourself when performing a task.

CAUTION!CAUTION!

Caution: Information to avoid damaging components or losing data.

Note: Provides additional information to complete a task easily.

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Preface

Global Service Contact Information

Headquarters

NEXCOM International Co., Ltd.

15F, No. 920, Chung-Cheng Rd., Zhonghe District, New Taipei City, 23586, Taiwan, R.O.C. Tel: +886-2-8226-7786 Fax: +886-2-8226-7782 www.nexcom.com

America

USA NEXCOM USA

2883 Bayview Drive, Fremont CA 94538, USA Tel: +1-510-656-2248 Fax: +1-510-656-2158 Email: sales@nexcom.com www.nexcom.com

Asia

Taiwan Central Taiwan Office

16F, No.250, Sec. 2, Chongde Rd., Beitun Dist., Taichung City 406, R.O.C. Tel: +886-4-2249-1179 Fax: +886-4-2249-1172 Email: sales@nexcom.com.tw www.nexcom.com.tw

Japan NEXCOM Japan

9F, Tamachi Hara Bldg., 4-11-5, Shiba Minato-ku, Tokyo, 108-0014, Japan Tel: +81-3-5419-7830 Fax: +81-3-5419-7832 Email: sales@nexcom-jp.com www.nexcom-jp.com

China NEXCOM China

2F, Block 4, Venus Plaza, Bldg. 21, ZhongGuanCun Software Park, No. 8, Dongbeiwang West Rd., Haidian District, Beijing, 100193, China Tel: +86-10-8282-6599 Fax: +86-10-8282-5955 Email: sales@nexcom.cn www.nexcom.cn

Shanghai Office

Room 603/604, Huiyinmingzun Plaza Bldg., 1, No.609, Yunlin East Rd., Shanghai, 200062, China Tel: +86-21-5278-5868 Fax: +86-21-3251-6358 Email: sales@nexcom.cn www.nexcom.cn

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Shenzhen Office

Room1707, North Block, Pines Bldg., No.7 Tairan Rd., Futian Area, Shenzhen, 518040, China Tel: +86-755-8332-7203 Fax: +86-755-8332-7213 Email: sales@nexcom.cn www.nexcom.cn

Wuhan Office

1-C1804/1805, Mingze Liwan, No. 519 South Luoshi Rd., Hongshan District, Wuhan, 430070, China Tel: +86-27-8722-7400 Fax: +86-27-8722-7400 Email: sales@nexcom.cn www.nexcom.cn

Chengdu Office

9F, Shuxiangxie, Xuefu Garden, No.12 Section 1, South Yihuan Rd., Chengdu, 610061, China Tel: +86-28-8523-0186 Fax: +86-28-8523-0186 Email: sales@nexcom.cn www.nexcom.cn

Europe

Italy NEXCOM ITALIA S.r.l

Via Gaudenzio Ferrari 29, 21047 Saronno (VA), Italia Tel: +39 02 9628 0333 Fax: +39 02 9286 9215 Email: nexcomitalia@nexcom.eu www.nexcomitalia.it

United Kingdom NEXCOM EUROPE

10 Vincent Avenue, Crownhill Business Centre, Milton Keynes, Buckinghamshire, MK8 0AB, United Kingdom Tel: +44-1908-267121 Fax: +44-1908-262042 Email: sales.uk@nexcom.eu www.nexcom.eu

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Preface

Package Contents

Before continuing, verify that the NDiS B532 package that you received is complete. Your package should have all the items listed in the following table.

Item Part Number Name Description Qty

1 50222A0438X00 NDiS 166 HDD-Bracket VER:A CHYUAN-JYH 95x9.8x8.0mm 0.8T SPCC+NI 1 2 5044440031X00 Rubber Foot Kang Yang:RF20-5-4P 19.8x18x5.0mm 4 3 5044440090X00 Thermal Pad APUS:3A2015001001500 15x10x1.5mm XR-PE 1 4 5044440192X00 Thermal Pad EAPUS:XR-Pe 10x10x1.5mm K=11 w/mk 1 5 5044440470X00 Thermal Pad For NDiS B532 E-LIN:S3S 70x50x0.5mm K=2.0w/mk 1 6 7400080005X00 Power Adapter w/C6 Socket L.T.E.:LTE90E-S2-210 80W 12V/6.67A MINI DIN 4PIN Male Plug 1 7 50222A0591X00 NDiS B532 Wall-Mount-Bracket VER:A JAN YU 190x53.7x1.5T(mm) SPCC+NI 2 8 50311F0100X00 Round Head Screw w/Spring+Flat Washer Long FEI:P3x6L P3x6 iso/SW6x0.5 NI 4 9 602DCD0680X00 (N)NDiS B532 Manual Driver DVD VER:1.0 1

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Preface

Ordering Information

The following information below provides ordering information for NDiS B532.

NDiS B532 (P/N: 10W00B53200X0)

- 3rd generation Intel® Core™ processor (up to 35W) fanless system

®

- Intel

QM77 chipset

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NDiS B532 User Manual

Chapter 1: Product Introduction

Overview

NDiS B532 is a powerful digital signage player which is built around the superb technology of 3rd generation Intel and QM77 integrated graphics controller. The digital signage player can offer impressive system performance and full HD videos. With support for smooth 1080P video playback on three independent displays, the 1080P signage player can fully satisfy customer’s expectation and therefore be used in applications such as advertising, hospitality, brand promotion and digital menu board.

®

Core™ processor family series

Key Features

▪ 3rd Generation Intel® Core™ processor

®

integrated HD 4000 graphic engine

▪ Intel

▪ Compact and slim design

▪ 3 independent displays

▪ USB 3.0, dual GbE LAN support

▪ WLAN/ TV tuner support

▪ DirectX 11 support

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NDiS B532 User Manual

Chapter 1: Product Introduction

Physical Features

Front Panel Rear Panel

Power

HDD

Button

LED

Line-in

COM2

USB 3.0

COM1 Power

LED

Reset

HDMI2

12V

DC in

HDMI1 HDMI3

2

LAN LAN

USB 3.0 S/PDIF

Line-out

NDiS B532 User Manual

Chapter 1: Product Introduction

Hardware Specifications

CPU Support

▪ 3rd generation Intel® Core™ rPGA socket type processor

Chipset

▪ Intel® QM77

®

integrated HD4000 graphic engine

▪ Intel

Main Memory

▪ 2x 204-pin SO-DIMM sockets, supports DDR3 1600/1333MHz non-ECC,

un-buffered memory up to 16GB (Single socket max. 8GB)

I/O Interface-Front

▪ 1x power status LED ▪ 1x HDD status LED ▪ 1x power switch ▪ 1x reset switch ▪ 2x USB3.0 ▪ 2x DB9 for RS-232

I/O Interface-Rear

▪ +12V DC-in ▪ 3x HDMI ▪ 2x USB3.0 ▪ 2x RJ45 with LED for 10/100/1000Mbs Ethernet ▪ 1x SPDIF ▪ 1x Line-in/ 1x Line-out ▪ 3x antenna hole for Wi-Fi and TV tuner

Storage

▪ 1x SATA 2.5” HDD ▪ 1x SATA DOM

Expansion

▪ 1x Mini-PCIe for optional WLAN module ▪ 1x Mini-PCIe for optional TV tuner module

Data Protection

▪ 1x Wafer onboard for TPM module (ver. 1.2), support Intel Trusted

Execution Technology

Construction

▪ Top cover made by aluminum for main heat exchange ▪ Chassis made by steel in black

Dimensions

▪ 294 mm (W) x 198 mm (D) x 52 mm(H) (11.6” x 7.8” x 2.0”)

w/o mounting bracket

Power Supply

▪ 1x External 80W AC/ DC adapter Input: 100~240VAC Output: +12VDC

Environment

▪ Operating temperature: 0°C to 40°C

▪ Storage temperature: -20°C to 80°C

▪ Humidity: 10 to 90% (non-condensing)

Certification

▪ CE approval

▪ FCC Class A

Operating System

▪ Windows7 / Windows 8 / XP / WES7 / WES2009 / Linux

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Chapter 1: Product Introduction

Mechanical Dimensions

198.00

294.00

4

52.00

NDiS B532 User Manual

Chapter 2: Jumpers and Connectors

This chapter describes how to set the jumpers and connectors on the NDiS B532 motherboard.

Before You Begin

▪ Ensure you have a stable, clean working environment. Dust and dirt can

get into components and cause a malfunction. Use containers to keep small components separated.

▪ Adequate lighting and proper tools can prevent you from accidentally

damaging the internal components. Most of the procedures that follow require only a few simple tools, including the following: – A Philips screwdriver – A flat-tipped screwdriver – A set of jewelers screwdrivers – A grounding strap – An anti-static pad

▪ Using your fingers can disconnect most of the connections. It is

recommended that you do not use needle-nosed pliers to disconnect connections as these can damage the soft metal or plastic parts of the connectors.

▪ Before working on internal components, make sure that the power is off.

Ground yourself before touching any internal components, by touching a metal object. Static electricity can damage many of the electronic components. Humid environments tend to have less static electricity than

dry environments. A grounding strap is warranted whenever danger of static electricity exists.

Precautions

Computer components and electronic circuit boards can be damaged by discharges of static electricity. Working on computers that are still connected to a power supply can be extremely dangerous.

Follow the guidelines below to avoid damage to your computer or yourself:

▪ Always disconnect the unit from the power outlet whenever you are

working inside the case.

▪ If possible, wear a grounded wrist strap when you are working inside the

computer case. Alternatively, discharge any static electricity by touching the bare metal chassis of the unit case, or the bare metal body of any other grounded appliance.

▪ Hold electronic circuit boards by the edges only. Do not touch the

components on the board unless it is necessary to do so. Don’t flex or stress the circuit board.

▪ Leave all components inside the static-proof packaging that they shipped

with until they are ready for installation.

▪ Use correct screws and do not over tighten screws.

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Chapter 2: Jumpers and Connectors

Locations of the Jumpers and Connectors for NDiB B532

NDiB B532

The figure below is the top view of the NDiB B532, which is the mainboard used in the NDiS B532. It shows the locations of the jumpers and connectors.

JP1

SW2

J4

LED1

SW1

J1 J2

DIMM1

J3

USB1

JP2

FAN1

FAN2

CON1

CN11

JP5

JP7

DIMM2

CN8CN7

CN9

J6

CN1

JP3

J8

CN2

USB2

JP6

JP8

6

SATA1

CN10

CN5

CN3

CN6

NDiS B532 User Manual

CN4

CON3CON2

Chapter 2: Jumpers and Connectors

Jumper Settings

A jumper is the simplest kind of electric switch. It consists of two metal pins and a cap. When setting the jumpers, ensure that the jumper caps are placed on the correct pins. When the jumper cap is placed on both pins, the jumper is short. If you remove the jumper cap, or place the jumper cap on just one pin, the jumper is open.

Refer to the illustrations below for examples of what the 2-pin and 3-pin jumpers look like when they are short (on) and open (off).

Two-Pin Jumpers: Open (Left) and Short (Right)

Three-Pin Jumpers: Pins 1 and 2 are Short

3

2

1

3

2

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NDiS B532 User Manual

Chapter 2: Jumpers and Connectors

Jumpers

RTC Clear Jump

Connector type: 1x3 3-pin header, 2.54mm pitch Connector location: JP3

1 3

Pin Settings

1-3 On Normal 2-3 On Clear CMOS

1-2 On: default

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Chapter 2: Jumpers and Connectors

Connector Pin Definitions

External I/O Interfaces - Front Panel

Power Button

Connector location: SW2

Power LED Definition

ON Blue

OFF Red

LED Connector

Connector location: LED1

HDD

Power

LEDs LED Definition

HDD Red

Power Green

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Chapter 2: Jumpers and Connectors

Reset Button

Connector location: SW1

Pin Definition

1-2 System Reset

COM1 and COM2 Connectors

Connector type: DB-9 port Connector location: J1 and J2

1 5 6

Pin Definition Pin Definition

1 DCD 2 RXD 3 TXD 4 DTR 5 GND 6 DSR 7 RTS 8 CTS 9 RI

9

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Chapter 2: Jumpers and Connectors

USB 3.0 Ports

Connector type: Dual USB 3.0 ports Connector location: USB1

9

1

10 13

5

4

1418

Pin Definition Pin Definition

1 VCC 2 USB0_N 3 USB0_P 4 GND 5 USB3_RX0_N 6 USB3_RX0_P 7 GND 8 USB3_TX0_N

9 USB3_TX0_P 10 VCC 11 USB1_N 12 USB1_P 13 GND 14 USB3_RX1_N 15 USB3_RX1_P 16 GND 17 USB3_TX1_N 18 USB3_TX1_P

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Chapter 2: Jumpers and Connectors

External I/O Interfaces - Rear Panel

DC Jack Connector

Connector location: CN11

HDMI

Connector type: HDMI port Connector location: CN7, CN8 and CN9

1 2 3 4

Pin Definition Pin Definition

1 12V DC_IN 2 12V DC_IN

3 GND 4 GND

5 GND

1

2 18

19

Pin Definition Pin Definition

1 HDMI_D2+ 2 GND 3 HDMI_D2- 4 HDMI_D1+ 5 GND 6 HDMI_D17 HDMI_D0+ 8 GND

9 HDMI_D0- 10 HDMI_CLK+ 11 GND 12 HDMI_CLK13 NC 14 NC 15 HDMI_DDC_SCL 16 HDMI_DDC_SDA 17 GND 18 VCC5 19 HDMI_HPD

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Chapter 2: Jumpers and Connectors

USB 3.0 Ports

Connector type: Dual USB 3.0 ports Connector location: USB2

9

1

10 13

Pin Definition Pin Definition

1 VCC 2 USB0_N 3 USB0_P 4 GND 5 USB3_RX0_N 6 USB3_RX0_P 7 GND 8 USB3_TX0_N

9 USB3_TX0_P 10 VCC 11 USB1_N 12 USB1_P 13 GND 14 USB3_RX1_N 15 USB3_RX1_P 16 GND 17 USB3_TX1_N 18 USB3_TX1_P

5

4

1418

LAN Connectors

Connector type: RJ45 port with LEDs Connector location: CON2 and CON3

1

ACT Link

Pin Definition Pin Definition

1 TCT 2 TD43 TD4+ 4 TD35 TD3+ 6 TD27 TD2+ 8 TD1-

9 TD1+ 10 TCTG 11 Left_LED+ 12 Left_LED13 Right_LED+ 14 Right_LED-

8

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Chapter 2: Jumpers and Connectors

S/PDIF Connector

Connector type: S/PDIF Connector Connector location: CN10

Pin Definition Pin Definition

1 GND 2 VCC 3 SPDIF OUT

Audio Connectors

Connector type: 2x 3.5mm TRS Connector location: CN6

Line-in

Line-out

Pin Definition Pin Definition

1 GND 2 FRONT-L

3 GND 4 FRONT-JD

5 FRONT-R N/A N/A 22 LINE-L 23 GND 24 LINE-JD 25 LINE-R

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Chapter 2: Jumpers and Connectors

16

Internal Connectors

USB Connectors

Connector type: 1x6 6-pin header JST, 2.0mm pitch Connector location: J3 and J8

Pin Definition Pin Definition

1 VCC 2 USB0_N 3 USB0_P 4 USB1_N 5 USB1_P 6 GND

SIM Card Slot

Connector location: CN4

C3 C2 C1

Pin Definition Pin Definition

C1 UIM_PWR C5 GND C2 UIM_RST C6 NC C3 UIM_CLK C7 UIM_DAT

C7 C6 C5

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Chapter 2: Jumpers and Connectors

Debug 80 Port Connector

Connector type: 1x10 10-pin header JST, 1.0mm pitch Connector location: J4

110

Pin Definition Pin Definition

1 GND 2 PCIRST# 3 33M_CLK 4 LPC_FRAME# 5 LPC_AD3 6 LPC_AD2 7 LPC_AD1 8 LPC_AD0 9 3.3V 10 3.3V

SATA Connector

Connector type: Standard Serial ATAII 7P (1.27mm, SATA-M-180) Connector location: CN3

1 7

Pin Definition Pin Definition

1 GND 2 SATA_TXP

3 SATA_TXN 4 GND

5 SATA_RXN 6 SATA_RXP

7 GND

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Chapter 2: Jumpers and Connectors

SATA Connector (7-pin and 15-pin)

Connector type: Standard Serial ATAII 7P and 15P Connector location: SATA1

S1P15

Pin Definition Pin Definition

S1 GND S2 SATA_TXP S3 SATA_TXN S4 GND S5 SATA_RXN S6 SATA_RXP

S7 GND P1-3 NC P4-6 GND P7-9 VCC5 P10,12 GND

P11 NC P13-15 VCC12

SATA DOM Power Connector

Connector type: 1x4 4-pin header, 2.54mm pitch Connector location: CN2

14

Pin Definition Pin Definition

1 +12V 2 GND 3 GND 4 +5V

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Chapter 2: Jumpers and Connectors

Battery Connector

Connector type: 1x2 2-pin header JST, 1.25mm pitch Connector location: J6

1 2

Pin Definition

1 GND 2 3V

MCU Debug Jumpers

Connector type: 1x3 3-pin header, 2.54mm pitch Connector location: JP5 and JP6

1 3

Pin Settings

1 TX 2 RX 3 GND

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Chapter 2: Jumpers and Connectors

19

21

15

GPIO

Connector type: 2x5 10-pin header Connector location: JP1

0

Pin Definition Pin Definition

1 GPI1 2 GPO1 3 GPI2 4 GPO2 5 GPI3 6 GPO3 7 GPI4 8 GPO4 9 GND 10 VCC5

MCU Download Connectors

Connector type: 1x5 5-pin header, 2.54mm pitch Connector location: JP7 and JP8

Pin Definition Pin Definition

1 VCC3 2 C2D 3 MRST 4 C2CK 5 GND

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Chapter 2: Jumpers and Connectors

12

34

FAN Connectors

Connector type: 1x4 4-pin header, 2.54mm pitch Connector location: FAN1 and FAN2

14

Pin Definition Pin Definition

1 GND 2 VCC 3 SPEED 4 CONTROL

DC-in Power Connector

Connector type: 2x2 4-pin header Connector location: CON1

Pin Definition Pin Definition

1 GND 2 GND 3 12V DC_IN 4 12V DC_IN

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Chapter 2: Jumpers and Connectors

Mini-PCIe Connector

Connector location: CN1

12

51 52

Pin Definition Pin Definition

1 WAKE# 2 3.3VSB 3 NC 4 GND 5 NC 6 1.5V 7 CLK_REQ# 8 NC

9 GND 10 NC 11 PCIE_CLK# 12 NC 13 PCIE_CLK 14 NC 15 GND 16 NC 17 NC 18 GND 19 NC 20 WLAN_DIS# 21 GND 22 RESET# 23 PCIE_RX_N 24 3.3VSB 25 PCIE_RX_P 26 GND

21

Pin Definition Pin Definition

27 GND 28 1.5V 29 GND 30 SMBCLK 31 PCIE_TX_N 32 SMBDAT 33 PCIE_TX_P 34 GND 35 GND 36 USB_N 37 GND 38 USB_P 39 3.3VSB 40 GND 41 3.3VSB 42 NC 43 GND 44 NC 45 NC 46 NC 47 NC 48 1.5V 49 NC 50 GND 51 NC 52 3.3VSB

NDiS B532 User Manual

Chapter 2: Jumpers and Connectors

Mini-PCIe Connector

Connector location: CN5

12

51 52

Pin Definition Pin Definition

1 WAKE# 2 3.3VSB

3 NC 4 GND

5 NC 6 1.5V

7 CLK_REQ# 8 UIM_PWR

9 GND 10 UIM_DAT 11 PCIE_CLK# 12 UIM_CLK 13 PCIE_CLK 14 UIM_RST 15 GND 16 NC 17 NC 18 GND 19 NC 20 WLAN_DIS# 21 GND 22 RESET# 23 PCIE_RX_N 24 3.3VSB 25 PCIE_RX_P 26 GND

22

Pin Definition Pin Definition

27 GND 28 1.5V 29 GND 30 SMBCLK 31 PCIE_TX_N 32 SMBDAT 33 PCIE_TX_P 34 GND 35 GND 36 USB_N 37 GND 38 USB_P 39 3.3VSB 40 GND 41 3.3VSB 42 NC 43 GND 44 NC 45 NC 46 NC 47 NC 48 1.5V 49 NC 50 GND 51 NC 52 3.3VSB

NDiS B532 User Manual

Chapter 3: System Setup

CAUTION!

Chapter 3: System Setup

Removing the Chassis Cover

Prior to removing the chassis cover, make sure the unit’s power

CAUTION!CAUTION!

1. The screws on the back and bottom are used to secure the cover to the chassis. Remove these screws and put them in a safe place for later use.

is off and disconnected from the power sources to prevent electric shock or system damage.

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Chapter 3: System Setup

Installing a SO-DIMM

1. Locate the DIMM socket on the board.

2. Push the ejector tabs which are at the ends of the socket outward. This indicates that the socket is unlocked.

DIMM sockets

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NDiS B532 User Manual

Chapter 3: System Setup

3. Note how the module is keyed to the socket. Grasping the module by its edges, align the module with the socket so that the “notch” on the module is aligned with the “key” on the socket. The key ensures the module can be plugged into the socket in only one direction.

4. Insert the module into the socket at an approximately 30 degrees angle. Apply firm even pressure to each end of the module until it slips down into the socket. The contact fingers on the edge of the module will almost completely disappear inside the socket.

The ejector tabs at the ends of the socket will automatically snap into the locked position to hold the module in place.

Key

Notch

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Chapter 3: System Setup

CAUTION!

Installing the CPU

1. Loosen the mounting screws that secure the heat sink to the chassis.

Mounting Screw

▪ Make sure all power cables are unplugged before you install

CAUTION!CAUTION!

the CPU.

▪ The CPU socket must not come in contact with anything

other than the CPU. Avoid unnecessary exposure.

2. Now remove the heat sink to access the CPU socket.

Bottom Side of the Heat Sink

3. The CPU socket is readily accessible after you have removed the heatsink.

26

CPU socket

NDiS B532 User Manual

Chapter 3: System Setup

4. Use a screwdriver to turn the screw to its unlocked position.

Locked Unocked

5. Position the CPU above the socket. The gold triangular mark on the

CPU must align with pin 1 of the CPU socket.

Pin1

27

Gold Triangular Mark

Handle the CPU by its edges and avoid touching the pins.

NDiS B532 User Manual

Chapter 3: System Setup

CAUTION!

6. Insert the CPU into the socket until it is seated in place. The CPU will fit in only one orientation and can easily be inserted without exerting any force. Use a screwdriver to turn the screw to its locked position.

CAUTION!CAUTION!

Do not force the CPU into the socket. Forcing the CPU into the socket may bend the pins and damage the CPU.

7. Attach the thermal pads onto the CPU and chipset.

Thermal Pad

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Chapter 3: System Setup

8. Align the mounting screws of the heat sink with the mounting holes on the board then tighten the screws to secure the heat sink in place.

Mounting hole

29

Mounting Screw

NDiS B532 User Manual

Chapter 3: System Setup

9. Attach the thermal pad onto the heatsink.

Thermal Pad

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NDiS B532 User Manual

Chapter 3: System Setup

CAUTION!

Installing a SATA Hard Drive

CAUTION!CAUTION!

Please correctly follow the below instructions and noted items to avoid making unnecessary damages.

1. The drive bracket included in the package is used to hold a SATA hard

drive.

2. Place the SATA hard drive onto the drive bracket. Align the mounting

holes that are on the sides of the SATA drive with the mounting holes on the drive bracket.

SATA Hard Drive

Drive Bracket

3. Use the provided screws to secure the SATA drive in place.

Mounting Screw

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NDiS B532 User Manual

Chapter 3: System Setup

4. Secure the SATA Drive with the provided mounting screw.

Mounting Studs

5. The mounting holes on the drive bracket and chassis are used to secure hard drive to the chassis.

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Chapter 3: System Setup

6. Locate for the SATA connector and the SATA power connector on the SATA drive.

SATA Data Connector

SATA Power Connector

SATA Data Connector

7. Align the mounting holes of the drive bracket with the mounting studs on the board then use the provided mounting screws to secure the hard drive in place.

Mounting Screw

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Chapter 3: System Setup

Installing a Wireless LAN Module

1. Locate the Mini PCI Express slot on the board.

Mini PCI Express Slot

2. Insert the wireless LAN module into the Mini PCI Express slot at a 45 degrees angle until the gold-plated connector on the edge of the module completely disappears inside the slot.

3. Push the module down then secure it with mounting screws.

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Chapter 3: System Setup

3. Attach the RF cables onto the Wi-Fi module, then mount the antenna jacks to the antenna holes located at the rear panel of the chassis. Then connect the external antennas to the antenna jacks.

Antenna

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Chapter 3: System Setup

Installing a TV Tuner Module

1. Locate the Mini PCI Express slot on the board.

Mini PCI Express Slot

2. Insert the TV module into the Mini PCI Express slot at a 45 degrees angle until the gold-plated connector on the edge of the module completely disappears inside the slot.

3. Push the module down then secure it with mounting screws.

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NDiS B532 User Manual

Chapter 3: System Setup

3. Attach the RF cables onto the TV tuner module, then mount the antenna jacks to the antenna holes located at the rear panel of the chassis. Then connect the external antennas to the antenna jacks.

Antenna

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NDiS B532 User Manual

Chapter 4: BIOS Setup

This chapter describes how to use the BIOS setup program for the NDiS B532. The BIOS screens provided in this chapter are for reference only and may change if the BIOS is updated in the future.

To check for the latest updates and revisions, visit the NEXCOM Web site at www.nexcom.com.tw.

About BIOS Setup

The BIOS (Basic Input and Output System) Setup program is a menu driven utility that enables you to make changes to the system configuration and tailor your system to suit your individual work needs. It is a ROM-based configuration utility that displays the system’s configuration status and provides you with a tool to set system parameters.

These parameters are stored in non-volatile battery-backed-up CMOS RAM that saves this information even when the power is turned off. When the system is turned back on, the system is configured with the values found in CMOS.

With easy-to-use pull down menus, you can configure such items as:

▪ Hard drives, diskette drives, and peripherals

▪ Video display type and display options

▪ Password protection from unauthorized use

▪ Power management features

The settings made in the setup program affect how the computer performs. It is important, therefore, first to try to understand all the setup options, and second, to make settings appropriate for the way you use the computer.

When to Configure the BIOS

▪ This program should be executed under the following conditions:

▪ When changing the system configuration

▪ When a configuration error is detected by the system and you are

prompted to make changes to the setup program

▪ When resetting the system clock

▪ When redefining the communication ports to prevent any conflicts

▪ When making changes to the Power Management configuration

▪ When changing the password or making other changes to the security

setup

Normally, CMOS setup is needed when the system hardware is not consistent with the information contained in the CMOS RAM, whenever the CMOS RAM has lost power, or the system features need to be changed.

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Chapter 4: BIOS Setup

Default Configuration

Most of the configuration settings are either predefined according to the Load Optimal Defaults settings which are stored in the BIOS or are automatically detected and configured without requiring any actions. There are a few settings that you may need to change depending on your system configuration.

Entering Setup

When the system is powered on, the BIOS will enter the Power-On Self Test (POST) routines. These routines perform various diagnostic checks; if an error is encountered, the error will be reported in one of two different ways:

▪ If the error occurs before the display device is initialized, a series of beeps

will be transmitted.

▪ If the error occurs after the display device is initialized, the screen will

display the error message.

Powering on the computer and immediately pressing <Del> allows you to enter Setup.

Legends

Key Function

Moves the highlight left or right to select a menu.

Moves the highlight up or down between sub¬menus or fields.

Exits the BIOS Setup Utility.

Scrolls forward through the values or options of the highlighted field.

Scrolls backward through the values or options of the highlighted field.

Selects a field.

Displays General Help.

Load previous values.

Load optimized default values.

Press the

key to enter Setup:

39

Saves and exits the Setup program.

Press <Enter> to enter the highlighted sub¬menu

NDiS B532 User Manual

Chapter 4: BIOS Setup

Scroll Bar

When a scroll bar appears to the right of the setup screen, it indicates that there are more available fields not shown on the screen. Use the up and down arrow keys to scroll through all the available fields.

Submenu

When “” appears on the left of a particular field, it indicates that a submenu which contains additional options are available for that field. To display the submenu, move the highlight to that field and press .

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NDiS B532 User Manual

Chapter 4: BIOS Setup

BIOS Setup Utility

Once you enter the AMI BIOS Setup Utility, the Main Menu will appear on the screen. The main menu allows you to select from several setup functions and one exit. Use arrow keys to select among the items and press to accept or enter the submenu.

Main

The Main menu is the first screen that you will see when you enter the BIOS Setup Utility.

Advanced Boot Security Save & ExitMain

BIOS Information BIOS Vendor Production Name BIOS Version Build Date and Time

Memory Information Memory Frequency Total Memory DIMM#0 DIMM#2

ME Firmware Information ME FW Version ME Firmware Mode ME Firmware SKU

System Date

System Time

American Megatrends NDiS B532 D532A006 03/18/2013 15:40:58

1333 Mhz 4096 MB (DDR3) Not Present 4096 MB (DDR3)

8.0.3.1502 Normal Mode 5MB

[Thu 07/18/2013] [10:42:31]

Set the Date. Use Tab to switch between Date elements.

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

System Date

The date format is <day>, <month>, <date>, <year>. Day displays a day, from Monday to Sunday. Month displays the month, from January to December. Date displays the date, from 1 to 31. Year displays the year, from 1999 to 2099.

System Time

The time format is <hour>, <minute>, <second>. The time is based on the 24-hour military-time clock. For example, 1 p.m. is 13:00:00. Hour displays hours from 00 to 23. Minute displays minutes from 00 to 59. Second displays seconds from 00 to 59.

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Chapter 4: BIOS Setup

Advanced

The Advanced menu allows you to configure your system for basic operation. Some entries are defaults required by the system board, while others, if enabled, will improve the performance of your system or let you set some features according to your preference.

Setting incorrect field values may cause the system to malfunction.

Advanced Boot Security Save & ExitMain

RTC Wake Settings

ACPI Settings Trusted Computing

CPU Conguration SATA Conguration

Lock Down Setting

PCH-IO Conguration Graphics Conguration Intel TXT(LT) Conguration AMT Conguration USB Conguration Super IO Conguration

H/W Monitor

CPU PPM Conguration

Enable system to wake using RTC alarm

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

RTC Wake Settings

This section is used to configure RTC Wake settings.

Main

Wake system with Fixed Time [Disabled]

Advanced Chipset PCIPnP Security

Exit

Enable or disable System wake on alarm event. When enabled, System will wake on the

hr::min::sec specied

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Wake System with Fixed Time

Enables or disables system wake on alarm event. When enabled, system will wake on the hr::min::sec specified.

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Chapter 4: BIOS Setup

ACPI Settings

This section is used to configure ACPI Settings.

Main

ACPI Settings

Enable Hibernation [Enabled]

ACPI Sleep State [S3 only(Suspend to...)]

Advanced Chipset PCIPnP Security

Exit

Enables or Disables System ability to Hibernate (OS/S4 Sleep State). This option may be not effective with some OS.

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Enable Hibernation

Enables or disables system ability to hibernate (OS/S4 Sleep State). This option may not be effective with some OS.

ACPI Sleep State

Select the highest ACPI sleep state the system will enter when the suspend button is pressed. The options are Suspend Disabled and S3 (Suspend to RAM).

Trusted Computing

This section is used to configure the security device settings.

Main

Conguration

Security Device Support [Disable]

Current Status Information NO Security Device Found

Advanced Chipset PCIPnP Security

Exit

Enables or Disables BIOS support for security device. Operating system will not show Security Device. TCG EFI protocol and INT1A interface will not be available.

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Security Device Support

Enables or disables BIOS support for security device. Operating system will not show Security Device. TCG EFI protocol and INT1A interface will not be available.

Current Status Information

Use this item to see TPM current status information, such as TPM enabled status, TPM active status and TPM owner status.

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Chapter 4: BIOS Setup

CPU Configuration

This section is used to configure the CPU.

Main

CPU Conguration

Intel(R) Core(TM) i5-3610ME CPU @ 2.70GHz CPU Signature 306a9 Microcode Patch 15 CPU Speed 2700 MHz Processor Cores 2 Intel HT Technology Supported Intel VT-x Technology Supported Intel SMX Technology Supported 64-bit Supported

Hyper-threading [Enabled]

Intel Virtualization Technology [Disabled]

Advanced Chipset PCIPnP Security

Exit

Enabled for Windows XP and Linux (OS optimized for HyperThreading Technology) and Disabled for other OS (OS not optimized for Hyper-Threading Technology). When Disabled only one thread per enabled core is enabled.

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Hyper-Threading

This field is used to enable or disable hyper-threading.

Intel® Virtualization Technology

When this field is set to Enabled, the VMM can utilize the additional hardware capabilities provided by Vanderpool Technology.

SATA Configuration

This section is used to configure the SATA drives.

Advanced Boot Security Save & ExitMain

SATA Controller(s)

SATA Mode Selection

Serial ATA Port 0 Software Preserve Serial ATA Port 1 Software Preserve

[Enabled]

[IDE]

ST320LT012-9WS (320.0GB) SUPPORTED Empty Unknown

Enable or disable SATA Device.

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

SATA Controller(s)

Enables or disables the SATA controller.

SATA Mode Selection

Configures the SATA as IDE or AHCI mode.

IDE This option configures the Serial ATA drives as Parallel ATA physical storage device.

AHCI This option configures the Serial ATA drives to use AHCI (Advanced Host Controller Interface). AHCI allows the storage driver to enable the advanced Serial ATA features which will increase storage performance.

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Chapter 4: BIOS Setup

Lock Down Setting

This section is used to configure the RTC lock settings.

Advanced Boot Security Save & ExitMain

RTC RAM Lock

[Enabled]

Enable or disable bytes 38h-3Fh in the upper and lower 128-byte bank of RTC RAM lockdown.

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

RTC RAM Lock

Enables or disables bytes 38h-3Fh in the upper and lower 128-byte bank of RTC RAM lockdown.

PCH-IO Configuration

This section is used to configure PCH parameters.

Advanced Boot Security Save & ExitMain

Restore AC Power Loss

[Power Off]

Select AC power state when power is re-applied after a power failure.

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Restore on AC Power Loss

Power Off When power returns after an AC power failure, the system’s power is off. You must press the Power button to power-on the system.

Power On When power returns after an AC power failure, the system will automatically power-on.

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Chapter 4: BIOS Setup

Graphics Configuration

This section is used to configure the graphics parameters.

Advanced Boot Security Save & ExitMain

Graphics Conguration

LCD Control

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

LCD Control

Configurations for LCD.

LCD Control

This section is used to configure the LCD settings.

Advanced Boot Security Save & ExitMain

LCD Control

Primary IGFX Boot Display

Secondary IGFX Boot Display

[HDMI1]

[HDMI3]

Select the Video Device which will be activated during POST. This has no effect if external graphics present. Secondary boot display selection will appear based on your selection. VGA modes will be supported only on primary display

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Primary IGFX Boot Display

Select the Video Device which will be activated during POST. This has no effect if external graphics present. Secondary boot display selection will appear based on your selection. VGA modes will be supported only on primary display. The options are HDM1, HDMI2 and HDMI3.

Secondary IGFX Boot Display

Select the secondary display device, the options are Disabled, HDMI1, HDMI2 and HDMI3.

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Chapter 4: BIOS Setup

Intel® TXT(LT) Configuration

This section is used to configure the Intel® Trusted Execution Technology.

Advanced

Intel Trusted Execution Technology Conguration

Intel TXT support only can be enabled/disabled if SMX is enabled. VT and VT-d support must also be enabled prior to TXT.

Secure Mode Extensions (SMX)

Intel TXT(LT) Support

Enabled

[Disabled]

Enables or Disables Intel(R) TXT(LT) support.

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

USB 3.0 Support

Enables or disables Intel® TXT(LT) support.

AMT Configuration

This section is used to configure Active Management Technology (AMT) options.

Advanced Boot Security Save & ExitMain

Intel AMT

BIOS Hotkey Pressed MEBx Selection Screen

[Enabled]

[Disabled] [Disabled]

Enable/Disable Intel (R) Active Management Technology BIOS Extension. Note : iAMT H/W is always enabled. This option just controls the BIOS extension execution. If enabled, this requires

additional rmware in the SPI

device

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Intel® AMT

Enables or disables Intel® Active Management Technology.

BIOS Hotkey Pressed

Enables or disables BIOS hotkey press.

MEBx Selection Screen

Enables or disables MEBx selection screen.

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Chapter 4: BIOS Setup

USB Configuration

This section is used to configure the USB.

Advanced

USB Conguration

USB Devices: 1 Keyboard, 1 Mouse, 2 Hubs

Legacy USB Support

USB3.0 Support

[Enabled]

Enables Legacy USB support. AUTO option disables legacy support if no USB devices are connected. DISABLE option will keep USB devices available only for EFI applications.

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Legacy USB Support

Enabled Enables Legacy USB. Auto Disables support for Legacy when no USB devices are connected. Disabled Keeps USB devices available only for EFI applications.

Super IO Configuration

This section is used to configure serial ports 0 and 1.

Advanced

Super IO Conguration

Super IO Chip



Serial Port 0 Conguration



Serial Port 1 Conguration

IT8728

Set Parameters of Serial Port 0 (COMA)

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Super IO Chip

Displays the Super I/O chip used on the board.

USB 3.0 Support

Enables or disables the USB 3.0 controller.

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NDiS B532 User Manual

Chapter 4: BIOS Setup

Serial Port 0 Configuration

This section is used to configure serial port 0.

Advanced

Serial Port 0 Conguration

Serial Port

Device Settings

[Enabled]

IO=3F8h; IRQ=4;

Serial Port

Enables or disables the serial port.

Enable or Disable Serial Port (COM)

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Serial Port 1 Configuration

This section is used to configure serial port 1.

Advanced

Serial Port 1 Conguration

Serial Port

Device Settings

[Enabled]

IO=2F8h; IRQ=3;

Serial Port

Enables or disables the serial port.

Enable or Disable Serial Port (COM)

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

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Chapter 4: BIOS Setup

H/W Monitor

This section is used to monitor hardware status such as temperature, fan speed and voltages.

Advanced

PC Health Status

FAN Setting

CPU Core Temperature(DTS) CPU FAN Speed System FAN Speed CPU:VCORE +12V +5V +3.3V

[Enable Smart Fan]

: +58 C : N/A : N/A : +0.948 V : +12.101 V : +4.830 V : +3.192 V

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

FAN Setting

Selects the speed of the fan, the options are Always Full Speed, Enable Smart Fan or Disable.

System FAN Speed

Detects and displays the current system fan speed.

CPU:VCORE

Detects and displays the Vcore CPU voltage.

+12V

Detects and displays 12V voltage.

+5V

Detects and displays 5V voltage.

+3.3V

Detects and displays 3.3V voltage.

Core CPU Temperature(DTS)

Detects and displays the current CPU temperature.

CPU FAN Speed

Detects and displays the current CPU fan speed.

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Chapter 4: BIOS Setup

CPU PPM Configuration

This section is used to configure the Processor Power Management (PPM) configuration.

Advanced

CPU PPM Conguration

EIST

Turbo Mode CPU C3 Report CPU C6 report CPU C7 report

[Enabled]

[Disabled] [Enabled] [Enabled] [Enabled]

Enable/Disable Intel SpeedStep

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

EIST

Enables or disables Intel® SpeedStep.

CPU C6 Report

Enables or disables C6 report to the operating system.

CPU C7 Report

Enables or disables C7 report to the operating system.

Turbo Mode

Enables or disables turbo mode.

CPU C3 Report

Enables or disables C3 report to the operating system.

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Chapter 4: BIOS Setup

Boot

This section is used to configure the boot features.

Advanced

Launch PXE OpROM policy

Boot Option Priorities

Boot Option #1

Hard Drive BBS Priorities

Launch PXE OpROM Policy

Controls the execution of UEFI and legacy PXE OpROM.

Boot

Security

[Do not launch]

[SATA PM: ST320LT01 . . .]

Save & ExitMain

Controls the execution of UEFI and Legacy PXE OpROM

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Hard Drive BBS Priorities

Sets the order of the legacy devices in this group.

Main

Boot Option #1

Advanced

Boot

Security

[SATA PM: ST320LT01 . . .]

SATA PM: ST320LT012-9WS14C Disabled

Boot Option #1

Sets the system boot order

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Boot Option Priorities

Adjust the boot sequence of the system. Boot Option #1 is the first boot device that the system will boot from, next will be #2 and so forth.

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Chapter 4: BIOS Setup

Security

Advanced Boot Security Save & ExitMain

Password Description

If ONLY the Administrator’s password is set, then this only limits access to Setup and is only asked for when entering Setup. If ONLY the User’s password is set, then this is a power on password and must be entered to boot or enter Setup. In Setup the User Will have Administrator rights. The password length must be in the following range: Minimum length 3 Maximum length 20

Administrator Password

User Password

HDD Security Conguration:

HDD0:ST320LT012-9

Administrator Password

Select this to reconfigure the administrator’s password.

User Password

Select this to reconfigure the user’s password.

HDD Security Configuration

Select this to configure the HDD security password.

Set Administrator Password

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Save & Exit

Advanced Boot

Save Changes and Exit

Discard Changes and Exit

Restore Defaults

Save Changes and Exit

To save the changes and exit the Setup utility, select this field then press <Enter>. A dialog box will appear. Confirm by selecting Yes. You can also press <F4> to save and exit Setup.

Discard Changes and Exit

To exit the Setup utility without saving the changes, select this field then press <Enter>. You may be prompted to confirm again before exiting. You can also press <ESC> to exit without saving the changes.

Security

Save & ExitMain

Save & Exit

Reset the system after saving the changes.

→←: Select Screen ↑↓: Select Item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: Exit

Restore Defaults

To restore the BIOS to default settings, select this field then press <Enter>. A dialog box will appear. Confirm by selecting Yes.

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Appendix A: Watchdog Timer

NDiS B532 features a watchdog timer that resets the CPU or generates an interrupt if the processor stops operating for any reason. This feature ensures system reliability in industrial standalone or unmanned environments.

Watchdog Timer Control Register (Index=71h, Default=00h)

Bit Description

7 WDT is reset upon a CIR interrupt.

6 WDT is reset upon a KBC (mouse) interrupt.

5 WDT is reset upon a KBC (keyboard) interrupt.

4 WDT is reset upon a read or a write to the Game Port base address.

3-2 Reserved

1 Force Time-out. This bit is self-clearing.

WDT Status

0 1: WDT value reaches 0.

0: WDT value is not 0.

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Appendix A: Watchdog Timer

Watchdog Timer Configuration Register (Index=72h, Default=001s0000b)

Bit Description

7 WDT Time-out value select 1

1: Second 0: Minute

6 WDT output through KRST (pulse) Enable

1: Enable 0: Disable

5 WDT Time-Out Value Extra Select

1: 64ms x WDT Timer-out value (default=4s) 0: Determined by WDT Time-out value select 1 (bit 7 of this register)

4 WDT Output through PWEGD Enable

1: Enable 0: Disable

During LRESET# this bit is selected by JP2 power-on strapping option.

3-0 Interrupt level Select for WDT.

Watch Dog Timer Time-out value (LSB) Register (Index=73h, default=38h)

Bit Description

7-0 WDT Time-out value select 7-0

Watch Dog Timer Time-out value (MSB) Register (Index=74h, default=00h)

Bit Description

7-0 WDT Time-out value select 15-8

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Appendix B: GPI/O Programming Guide

GPIO Configuration

Address: A02

DATA Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0

GPIO mapping GPI4 GPI3 GPI2 GPI1 X X X GPO4

Address: A00

DATA Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 10

GPIO

mapping

X X X GPO3 X GPO2 GPO1 X GPI3

Example:

Output data (1010) through GPO

Step1: At Debug mode Step2: Set Data at address A02 and A00

C:\debug

-o A02 F1

-o A00 ED

Read data from GPI

Step1: At Debug mode Step2: Read Data at A02 (Input data is 1010)

C:\debug

-i A02

-AF

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Appendix C: Triple Display Settings

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NEXCOM NDiS B532 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual