Murata MBN52832 Datasheet

Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.5, 12/02/2020 www.murata.com

Revision History

Date
Author
Change Description
0.1
06/03/2016
RF PD
Preliminary version
0.2
06/16/2016
RF PD
Modified the module block diagram.
0.3
8/25/2016
RF PD
Update test data points
0.4
8/27/2016
RF PD
Update module dimension and reference schematic
0.5
12/15/2016
RF PD
Applied model/type name MBN52832 to the datasheet
0.6
02/01/2017
RF PD
Update Table 2.1 and Figure 2.2
0.7
03/15/2017
RF PD
Add sleep current
0.8
05/26/2017
RF PD
Table 2.2 change pin 36, 37 pin 36 description to NC. Add section 6.1 and 6.2, recommendation for host PCB landing and
placement. Updated reference schematic. Add section 9 and section 10, assembly and packaging information. Add section 12 Notice. Add section 13 Preconditions to use the module.
0.9
07/27/2017
RF PD
Add regulatory section
0.92
8/23/2017
RF PD
Update layout guidance for antenna connection; updated regulatory information
1.0
10/06/2017
Murata
Update the max height to 0.9mm, remove the sample part number.
1.1
06/14/2018
Murata
Remove Section 17, support contact.
1.2
10/10/2018
Murata
Added FCC and IC certification update for portable application in section
11.6
1.3
11/13/18
Murata
Corrected typos in section 7.
1.4
02/06/2020
Murata
Corrected module height in figure 2.1 Reformatted the content of section 2.3 Add KC certificate information. Fig 10.7; table 11.1; add section 11.7
1.5
12/02/2020
Murata
Corrected the TELEC ID in table 11.1
MBN52832 Data
BLE Module
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Table of Contents

REVISION HISTORY .............................................................................................................................................................. 1
TABLE OF CONTENTS ......................................................................................................................................................... 2
1 INTRODUCTION ............................................................................................................................................................ 5
1.1 Features ..................................................................................................................................................................... 5
1.2 Applications ................................................................................................................................................................ 5
1.3 Block Diagram ............................................................................................................................................................ 6
1.4 Acronyms ................................................................................................................................................................... 6
1.5 References ................................................................................................................................................................. 6
2 MECHANICAL SPECIFICATION .................................................................................................................................. 7
2.1 Module Dimensions .................................................................................................................................................... 7
2.2 Top and Side View ..................................................................................................................................................... 7
2.3 PCB Footprint Top View ............................................................................................................................................. 8
2.4 Pin Configuration ........................................................................................................................................................ 9
3 DC ELECTRICAL SPECIFICATION ............................................................................................................................ 12
3.1 Typical Power Consumption .................................................................................................................................... 12
4 RF SPECIFICATION .................................................................................................................................................... 12
5 ENVIRONMENTAL SPECIFICATION ......................................................................................................................... 13
5.1 Absolute Maximum Rating ....................................................................................................................................... 13
5.2 Recommended Operating Condition ........................................................................................................................ 13
6 POWER SEQUENCE ................................................................................................................................................... 13
7 APPLICATION INFORMATION ................................................................................................................................... 14
7.1 Recommended PCB Landing Pattern ...................................................................................................................... 14
7.2 Host PCB Layout Recommendations ...................................................................................................................... 15
7.3 Layout Guidance for Using Internal PCB Antenna .................................................................................................. 16
7.4 Layout Guidance for Microstrip Design And External Antenna ................................................................................ 17
8 APPLICATION REFERENCE ...................................................................................................................................... 20
9 ASSEMBLY INFORMATION ....................................................................................................................................... 21
10 PACKAGING AND MARKING INFORMATION .......................................................................................................... 22
10.1 Dimensions of Tape (Plastic tape) ........................................................................................................................... 22
10.2 Dimensions of Reel .................................................................................................................................................. 23
10.3 Taping Diagrams ...................................................................................................................................................... 24
10.4 Leader and Tail tape ................................................................................................................................................ 25
10.5 Peeling Force ........................................................................................................................................................... 26
10.6 PACKAGE (Humidity proof Packaging) ................................................................................................................... 26
10.7 Module Marking Information..................................................................................................................................... 27
10.8 Moisture Sensitivity Level ......................................................................................................................................... 27
11 REGULATORY INFORMATION .................................................................................................................................. 28
11.1 FCC Notice (USA) .................................................................................................................................................... 28
11.2 FCC Labeling Requirements .................................................................................................................................... 29
11.3 IC Notice (Canada) .................................................................................................................................................. 29
11.4 IC Labeling Requirements........................................................................................................................................ 30
11.5 ESTI compliance (Europe) ....................................................................................................................................... 30
11.6 RF Exposure ............................................................................................................................................................ 30
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11.6.1 Using on-board PCB antenna ..................................................................................................................... 30
11.6.2 Using external antenna ............................................................................................................................... 30
11.7 KC Certificate Notice ................................................................................................................................................ 30
12 ROHS INFORMATION ................................................................................................................................................. 31
13 ORDERING INFORMATION ........................................................................................................................................ 31
14 NOTICE ........................................................................................................................................................................ 32
14.1 Storage Conditions ................................................................................................................................................... 32
14.2 Handling Conditions ................................................................................................................................................. 32
14.3 Standard PCB Design (Land Pattern and Dimensions) ........................................................................................... 32
14.4 Notice for Chip Placer .............................................................................................................................................. 32
14.5 Operational Environment Conditions ....................................................................................................................... 32
14.6 Input Power Capacity ............................................................................................................................................... 33
15 PRECONDITIONS TO USE MURATA PRODUCTS ................................................................................................... 34
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LIST OF FIGURES
Figure 1.1 Block Diagram ........................................................................................................................................................ 6
Figure 2.1 Module Top and Side View (Unit: mm) .................................................................................................................. 7
Figure 2.2 Module Footprint Top View (Unit: mm) .................................................................................................................. 8
Figure 2.3 Pinout Diagram Top View ...................................................................................................................................... 9
Figure 7.1 Recommended PCB Landing Pattern.................................................................................................................. 14
Figure 7.2 Host PCB Layout Recommendation, top view ..................................................................................................... 15
Figure 7.3 Layout Guide for Antenna Performance (1) ......................................................................................................... 16
Figure 7.4 Layout Guide for Antenna Performance (2) ......................................................................................................... 17
Figure 7.5 Layout Guide for External Antenna (1) ................................................................................................................ 18
Figure 7.6 Layout Guide for External Antenna (2) ................................................................................................................ 18
Figure 8.1 Reference Design ................................................................................................................................................ 20
Figure 9.1 Reflow Profile ....................................................................................................................................................... 21
Figure 10.1 Tape Dimensions (Unit in mm) .......................................................................................................................... 22
Figure 10.2 Reel Dimensions (Unit: mm) .............................................................................................................................. 23
Figure 10.3 Tape Diagram .................................................................................................................................................... 24
Figure 10.4 Tape Leader and Tail ......................................................................................................................................... 25
Figure 10.5 Peeling Force Diagram ...................................................................................................................................... 26
Figure 10.6 Packaging Diagram............................................................................................................................................ 26
Figure 10.7 Module Marking Diagram ................................................................................................................................... 27
LIST OF TABLES
Table 2.1: Module Dimensions ................................................................................................................................................ 7
Table 2.2 Pinouts .................................................................................................................................................................. 10
Table 3.1 Typical Power Consumption ................................................................................................................................. 12
Table 4.1 RF Characteristics ................................................................................................................................................. 12
Table 5.1 Absolute Maximum Rating .................................................................................................................................... 13
Table 5.2 Recommended Operating Condition ..................................................................................................................... 13
Table 11.1 Regulatory Standards Conformance................................................................................................................... 28
Table 11.2 External Antenna to comply with FCC and IC .................................................................................................... 28
Table 11.3 External Antenna to comply with IC .................................................................................................................... 29
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1 Introduction

MBN52832 is a Bluetooth Low Energy module. It enables ultra-low power connectivity for data communication. The product integrates Nordic Bluetooth Low Energy IC, RF front end, and crystal. This is an ideal solution for Internet of Things (IOT) application.

1.1 Features

Bluetooth® v5
o Higher throughput o Increased broadcast capacity o Improved channel co-existence algorithm (SCA)
ANT, NFC Tag
Nordic nRF52832 Bluetooth Smart®
Built-in ARM Cortex M4 core with 64KB RAM and 512KB flash
Dimension 7.4 x 7.0 x 0.9 mm
Packaging: LGA
Bluetooth/ANT Antenna Configuration:
o On-board PCB antenna o Supports external antenna from pin pad
Maximum transmit power: +4dBm @ antenna port (LDO Mode)
Receive sensitivity: -93dBm @ 1Mbps (LDO Mode)
Power consumption
o TX 7mA @ 3.5dBm (DCDC Mode) o RX 6mA (DCDC Mode)
Host interface: UART, SPI
Other interfaces: 20 GPIO, 5 ADC, UART, SPI (master and slave), I2C, PWM and Debug SWD
Operating temperature range: -40 ºC to 85 ºC
RoHS compliant
MSL Level 3 in accordance with JEDEC J-STD-020
Regulatory certificates: FCC, IC, ETSI (plan)

1.2 Applications

Home Automation
Proximity Services
Building automation
Medical/Healthcare
Beacon
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1.3 Block Diagram

Figure 1.1 Block Diagram

1.4 Acronyms

- AIO Analog Input / Output
- GPIO General Purpose Input / Output
- I2C Inter-Integrated Circuit
- LPCOMP Low Power Comparator
- SPI Serial Peripheral Interface
- UART Universal Asynchronous Receiver Transmitter

1.5 References

[1] Nordic Semiconductor, nRF52832 - Product Specification v1.3, 2017 [2] Nordic Semiconductor, nRF52832-CIAA Pin assignment and mechanical dimensions, 2016
VCC
UART
SWD
GPIO/AIO
SPI
Nordic
nRF52832
32MHz Xtal
Matching
circuit
32KHz Xtal
(for ANT only
NFC Antenna
(Optional)
BLE/ANT
Antenna
To external or
on-board
antenna
Inductor for DC/DC
(optional)
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2 Mechanical Specification

2.1 Module Dimensions

Table 2.1: Module Dimensions
Parameter
Typical
Unit
Dimension (L x W x H)
7.4 ±0.2mm x 7.0 ±0.2mm x 0.9 (max)
mm

2.2 Top and Side View

Figure 2.1 Module Top and Side View (Unit: mm)
Pin 1
7.0mm typ.
0.9mm
max.
7.4mm typ.
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2.3 PCB Footprint Top View

Figure 2.2 Module Footprint Top View (Unit: mm)
Mark
Dimensions
Mark
Dimensions
Mark
Dimensions
Mark
Dimensions
L
7.4±0.2
W
7.0±0.2
T
0.9 MAX
a1
0.3±0.1
a2
0.3±0.1
b1
0.3±0.2
b2
0.425±0.2
b3
0.3±0.2
c1
0.6±0.1
c2
0.6±0.1
e1
0.65±0.1
e2
0.65±0.1
g1
0.35±0.1
g2
0.5±0.1
g3
0.35±0.1
g4
2.6±0.1
m1
0.3±0.1
m2
0.6±0.1
m3
0.3±0.1
m4
0.3±0.1
m5
0.3±0.1
m6
0.6±0.1
s1
0.425±0.2
s2
0.3±0.2
s3
0.475±0.1
s4
0.35±0.1
s5
0.825±0.1
s6
0.35±0.1
s7
0.5±0.1
s8
0.5±0.1
s9
0.4±0.1
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2.4 Pin Configuration

Figure 2.3 Pinout Diagram Top View
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Table 2.2 Pinouts
Pin #
Pin Name
Nordic IC Pin
I/O
Description
1
P0_09/NFC ANT
P0.09/NFC
I/O
GPIO; NFC antenna connection.
2
P0_06
P0.06
I/O
GPIO
3
P0_00/XL1
P0.00/XL1
I/O
Connection for 32.768kHz crystal (LFXO); GPIO
4
P0_01/XL2
P0.01/XL2
I/O
Connection for 32.768kHz crystal (LFXO); GPIO
5
GND
GND
6
VCC
VDD
Module power supply
7
DCC
DCC
DC/DC converter output pin. *Refer to reference schematic.
8
DEC
DEC4
1V3 regulator supply decoupling. Input from DC/DC converter. Output from 1.3V LDO. *Refer to reference schematic.
9
P0_02/AIN0
P0.02/AIN0
I/O
GPIO; SAADC/COMP/LPCOMP input
10
P0_05/AIN3
P0.05/AIN3
I/O
GPIO; SAADC/COMP/LPCOMP input
11
P0_03/AIN1
P0.03/AIN1
I/O
GPIO; SAADC/COMP/LPCOMP input
12
P0_04/AIN2
P0.04/AIN2
I/O
GPIO; SAADC/COMP/LPCOMP input
13
P0_29/AIN5
P0.29/AIN5
I/O
GPIO; SAADC/COMP/LPCOMP input
14
P0_07
P0.07
I/O
GPIO
15
P0_08
P0.08
I/O
GPIO
16
SWDIO
SWDIO
I/O
Serial Wire Debug I/O for debug and programming.
17
P0_21/RESET
P0.21/RESET
I/O
GPIO; Configurable as system RESET pin
18
SWDCLK
SWDCLK
I/O
Serial Wire Debug clock input for debug and programming.
19
GND
GND
GND
20
ANTIN
*Refer to reference schematic.
21
ANTOUT
RF signal output. Connect to ANTIN for on­board antenna or to external antenna. *Refer to reference schematic.
22
P0_18/TRACE0
P0.18/TRACE DATA[0]
I/O
GPIO; Trace port output;
23
P0_16/TRACE1
P0.16/TRACE DATA[1]
I/O
GPIO; Trace port output.
24
P0_15/TRACE2
P0.15/TRACE DATA[2]
I/O
GPIO; Trace port output.
25
P0_14/TRACE3
P0.14/TRACE DATA[3]
I/O
GPIO; Trace port output.
26
P0_10/NFC ANT
P0.10/NFC
I/O
GPIO; NFC antenna connection.
27
P0_20
P0.20
I/O
GPIO
28
P0_17
P0.17
I/O
GPIO
29
P0_13
P0.13
I/O
GPIO
30
GND
Ground.
31
GND
Ground.
32
GND
Ground.
33
GND
Ground.
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Pin #
Pin Name
Nordic IC Pin
I/O
Description
34
GND
Ground.
35
GND
Ground.
36
NC
NC
37
NC
NC
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