Kodak DryView 6800 User manual

{TheoryGuide}{Production}{Health Group}{ExternalAndInternal}

Important

Publication No. 8F2924

30JUL07

Confidential

Restricted

Information

THEORY GUIDE

for the

Kodak DryView 6800 LASER IMAGER

Service Code: 1649

Qualified service personnel must repair this equipment.

THEORY GUIDE

This equipment includes parts and assemblies sensitive to damage from electrostatic discharge. Use caution to prevent damage during all service procedures.

Description Page

30JUL07

8F2924

Page

2 of 72

PLEASE NOTE The information contained herein is based on the experience and knowledge relating to the

subject matter gained by Carestream Health, Inc., prior to publication.

No patent license is granted by this information.

Carestream Health, Inc., reserves the right to change this information without notice, and makes no warranty, express or implied, with respect to this information. Carestream Health, Inc., shall not be liable for any loss or damage, including consequential or special damages, resulting from any use of this information, even if loss or damage is caused by Carestream Health, Inc., negligence or other fault.

Table of Contents

Equipment Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Main Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Film Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Main Steps in the Film Path. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

System Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

DICOM RASTER ENGINE (DRE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

MCS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Power Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

DICOM RASTER ENGINE (DRE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Local Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Machine Control System (MCS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

MCS Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

MCS Hardware. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

C BUS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Communication Between MICRO BOARDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Optics Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Components Controlled or Sensed by the MICROBOARDS . . . . . . . . . . . . . . . 19

POWER DISTRIBUTION BOARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

I2C Bus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

MICROPROCESSOR FUNCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

THEORY GUIDE

30JUL07

8F2924

Page

3 of 72

Application Software. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Door Latch Motor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Unlock Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Turnaround Motor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

INTERLOCK SYSTEM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

ROLLBACK/PICKUP ASSEMBLIES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Film Registration Assembly. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

PURPOSE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

FILM PATH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

REGISTRATION ASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Registration Component Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Electrical Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

HOW THE REGISTRATION SUBSYSTEM FUNCTIONS . . . . . . . . . . . . . . . . 38

OPTICS/EXPOSURE TRANSPORT ASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

OPTICS ASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Internal Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

OPTICAL COMPONENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

OPTICS AY ELECTRONICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

“Imaging” Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

EXPOSURE TRANSPORT AY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

How It Works . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

EXPOSURE TRANSPORT CONTROL SYSTEM . . . . . . . . . . . . . . . . . . . . . . . . . . 55

ISOLATION PLATE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

THERMAL PROCESSOR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

Purpose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

Main Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

Transport Within the PROCESSOR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

SLACKLOOP AY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

DRUM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

FLATBED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

COOLING SECTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

PROCESSOR CONTROL BOARD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

AIRFLOW in the PROCESSOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

APPLICATION SOFTWARE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

“Initialization” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

Temperature Offsets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

POWER MODULE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

Physical Layout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

THEORY GUIDE

30JUL07

8F2924

Page

4 of 72

Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

Fault Protection in the POWER MODULE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

Publication History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

30JUL07

FILM SUPPLY DRAWERS

POWER MODULE

TURNAROUND

PROCESSOR

PROCESSOR FLATBED

EXPOSURE TRANSPORT

OPTICS

DRUM

ASSEMBLY

REGISTRATION ASSEMBLY

DRE

PROCESSOR COOLING SECTION

ACCUMULATOR

LOCAL PANEL

SORTER

Laser Beam

8F2924

Page

5 of 72

THEORY GUIDE Equipment Description

Section 1: Equipment Description

System Overview

Main Assemblies

Figure 1 shows the main parts of the IMAGER:

Figure 1

30JUL07

8F2924

Page

6 of 72

THEORY GUIDE Equipment Description

FILM SUPPLY DRAWERS

Each DRAWER holds a film cartridge. The PICKUP ASSEMBLY in the DRAWER feeds film to the REGISTRATION ASSEMBLY. There can be 1,2 or 3 DRAWERS.

REGISTRATION

Orients film for the EXPOSURE TRANSPORT.

ASSEMBLY EXPOSURE

TRANSPORT

Moves the film line by line past the scanning laser beam.

OPTICS MODULE Generates a scanning laser beam that exposes the

film.

PROCESSOR

Rapidly heats the film to processing temperature.

DRUM PROCESSOR

FLATBED

Keeps the temperature of the film until image is fully developed.

PROCESSOR

Stops emulsion development and hardens the “base”.

COOLING SECTION TURNAROUND Routes developed film to the SORTER or OUTPUT

TRAY.

SORTER Places film in 1 of 5 SORTER BINS. You can

configure the IMAGER to route films from each connected MODALITY to a different BIN. The SORTER is optional. If the IMAGER does not have a SORTER, all completed films are sent to 1 OUTPUT TRAY.

- DICOM RASTER ENGINE

A computer that runs the MIM software and the MACHINE CONTROL SYSTEM (MCS) software that controls the IMAGER.

THEORY GUIDE Equipment Description

30JUL07

8F2924

Page

7 of 72

Film Path

Figure 2 shows the film path within the IMAGER.

Figure 2

30JUL07

8F2924

Page

8 of 72

THEORY GUIDE Equipment Description

Main Steps in the Film Path

1. The MCS places an image into the IMAGE MEMORY on the DATAPATH

BOARD.

2. One of the PICKUP ASSEMBLIES feeds a sheet of film to the REGISTRATION

AY.

3. ROLLERS in the REGISTRATION AY move the film down until the trailing edge

of the film clears the PICKUP AY and is vertical. Depending on the size of the film and the film DRAWER it comes from, the film might or might not extend all the way into the ACCUMULATOR.

4. ROLLERS in the REGISTRATION AY reverse direction and feed film from the

ACCUMULATOR.

5. The film is “centered” and “deskewed” in the REGISTRATION AY.

6. ROLLERS in the REGISTRATION AY feed film up to the EXPOSURE

TRANSPORT.

7. The DATAPATH BOARD starts to read the image from IMAGE MEMORY “line-

by-line” and sends each line to the OPTICS MODULE. The OPTICS MODULE generates a scanning laser beam for each image line.

8. ROLLERS in the EXPOSURE TRANSPORT move the film past the horizontal

scanning laser beam that exposes the film.

9. The leading edge of the film reaches the heated PROCESSOR DRUM and

starts to develop when the “lower” part of the film is moving through the EXPOSURE TRANSPORT.

10. The film is moved through the THERMAL PROCESSOR by the rotating DRUM

and a series of ROLLERS. In the PROCESSOR:

- The DRUM rapidly heats the film to about 129 ° C.

- The film then moves through the heated FLATBED SECTION which maintains a slightly lower temperature and completes processing the film.

- The film moves through the COOLING SECTION to remove heat from the film to prevent density variations.

11. The developed film enters the TURN-AROUND which changes the film

direction and discharges it to the SORTER or EXIT TRAY.

THEORY GUIDE Equipment Description

DRE

Modalities

DICOM

DRE

LOCAL PANEL

Touchscreen Input

Image Data DC Power

Customer Network

DC PowerAC Power

AC Power

Speaker Power Switch

POWER MODULE

AC Power In

DRE

COMPUTER

Image

Control/ Status

USB Channel

MCS

(Print Engine)

30JUL07

8F2924

Page

9 of 72

System Organization

Overview

The IMAGER has 3 main parts:

• The DICOM RASTER ENGINE (DRE)

• The MACHINE CONTROL SYSTEM (MCS)

• The POWER MODULE

30JUL07

8F2924

Page

10 of 72

THEORY GUIDE Equipment Description

DICOM RASTER ENGINE (DRE)

The DRE system consists of the DRE COMPUTER and the LOCAL PANEL.

The DRE COMPUTER is a compact Pentium PC that runs the Microsoft Windows XP operating system and several modules of the 6800 application software. With the application software, the DRE functions as a MIM print server, within the IMAGER, where the MCS is the print destination.

The DRE COMPUTER is responsible for acquiring print jobs from modalities on the customer’s network and for queueing and rendering the incoming print jobs. Formatted print jobs are forwarded, over a USB connection, to the MCS for printing. The DRE COMPUTER also communicates with the LOCAL PANEL and runs service tool software that can be accessed with a SERVICE PC.

The LOCAL PANEL is an 8 by 10-in. color FLAT PANEL DISPLAY that serves as the operator interface for the IMAGER. In addition to the DISPLAY, it includes a TOUCHSCREEN, a SPEAKER and a POWER SWITCH. Images displayed on the LOCAL PANEL are sent from the DRE COMPUTER and TOUCHSCREEN commands are sent to the DRE COMPUTER for interpretation and action.

MCS

The MCS is the “print engine” within the IMAGER. It receives formatted images from the DRE and performs all of the electrical and mechanical functions necessary to transport, expose and develop DryView film.

Power Module

The POWER MODULE supplies +5 V and +24 V DC power to the MCS electronics and 120 V AC power to the DRE and to the HEATERS in the THERMAL PROCESSOR. Input power can range from 90 to 250 V AC. For energy saving purposes, the POWER MODULE includes a control input that allows the DRE COMPUTER to shut off DC power to the MCS electronics and AC power to the THERMAL PROCESSOR HEATERS.

For more information see POWER MODULE.

30JUL07

8F2924

Page

11 of 72

THEORY GUIDE DICOM RASTER ENGINE (DRE)

Section 2: DICOM RASTER ENGINE (DRE)

The DRE is a PERSONAL COMPUTER (PC) with the Microsoft Windows XP Embedded operating system. It runs application software that functions as a MIM PRINT SERVER and software that prepares images for printing.

The DRE connects to the customer’s LOCAL AREA NETWORK and is responsible for acquiring, queueing and rendering images from DICOM modalities on the LAN. Rendered images are sent to the MCS for printing.

A single USB cable connects the DRE to the MCS. The USB interface can transfer several channels of data simultaneously. It concurrently transfers commands, image data and configuration from the DRE to the MCS. At the same time it transfers and status information and diagnostic information returned from the MCS.

The DRE is mounted on a tray that slides out of the IMAGER for service. The main components are

• PC MOTHERBOARD with a 1.6 GHz (or better) Intel Pentium M PROCESSOR

• A NETWORK BOARD in a PCI slot on the MOTHERBOARD

• HARD DRIVE

• DVD/CD DRIVE

• DC POWER SUPPLY for the MOTHERBOARD and accessories

• Cooling FAN

• INPUT CF BOARD - This BOARD performs 2 functions

– It provides an adaptor for a COMPACT FLASH (CF) CARD that connects to the IDE

controller on the MOTHERBOARD.

– It provides a service interface to the DRE. There are 3 CONNECTORS for service

tools: > An RJ45 NETWORK CONNECTOR to connect a LAPTOP COMPUTER > A USB CONNECTOR for connecting a USB MOUSE > A PS2 CONNECTOR for connecting a KEYBOARD

THEORY GUIDE DICOM RASTER ENGINE (DRE)

COMPACT

CARD

FLASH

DVD/CD DRIVE

NETWORK

USB

KEYBOARD

CONNECTORS

INPUT CF BOARD

FRONT

DC POWER SUPPLY

120 V AC From POWER MODULE

HARD DRIVE

FAN

MOTHER BOARD

LOCAL PANEL

USB

CONNECTOR

NETWORK CONNECTOR

LVDS BOARD

CABLE to

DATAPATH

USB CABLE to

BOARD

(for customer

network)

(for Service)

12 Volt Wake Up Signal to the Power

Module

NETWORK BOARD

30JUL07

8F2924

Page

12 of 72

• LVDS BOARD -This BOARD provides an interface between the MOTHERBOARD and the

LOCAL PANEL. It also provides 2 external connectors:

– An RJ45 NETWORK CONNECTOR for connecting the IMAGER to the customer’s

Ethernet/DICOM network

– A USB CONNECTOR for future use

A 26-pin cable connects the LVDS BOARD to the LOCAL PANEL. This cable carries the image data for the LCD PANEL, input data from the TOUCH SCREEN, backlight brightness signal, audio for the SPEAKER, +3.3, +5 and +12 V DC power, and a signal from the POWER BUTTON on the LOCAL PANEL. LVDS is an abbreviation for “Low Voltage Differential Signaling”, the transmission method used to send image data from the LVDS BOARD to the LOCAL PANEL.

The following diagram shows the main components in the DRE and the external connection points on the DRE.

THEORY GUIDE DICOM RASTER ENGINE (DRE)

Note

30JUL07

8F2924

Page

13 of 72

The COMPACT FLASH (CF) CARD is used to backup and restore the IMAGER configuration parameters. It also holds data required for startup and should not be removed or replaced unless directed by a MODIFICATION INSTRUCTION or other approved procedure. The IMAGER will not start up if the CF CARD is not present.

The DC POWER SUPPLY in the DRE supplies power to the MOTHER BOARD, HARD DRIVE and DVD/CD DRIVE. A 12 V DC output from the DRE POWER SUPPLY serves as a wake up signal to the IMAGER POWER MODULE.

The DRE POWER SUPPLY is controlled by the MOTHERBOARD. A logic signal from the MOTHERBOARD turns the DRE POWER SUPPLY ON and OFF.

• When the IMAGER is “Ready” or in the “Energy Save” or “Sleep” modes, the

MOTHERBOARD turns the DRE POWER SUPPLY ON. The POWER SUPPLY provides +3.3, +5, +12, and -12 V DC and the DRE is fully functional.

• When the IMAGER is in the “Power Off” state, the MOTHERBOARD turns off the DRE

POWER SUPPLY. In this condition, the POWER SUPPLY provides only +5 V DC standby power to the MOTHERBOARD. Most functions on the MOTHERBOARD are suspended but the 5V standby power enables the MOTHERBOARD to wakeup with a signal from the POWER BUTTON on the LOCAL PANEL or from the Power Schedule set up on the LOCAL PANEL.

The DRE POWER SUPPLY receives 120 V AC input power from the POWER MODULE. The POWER SWITCH on the POWER MODULE must be ON for the DRE POWER SUPPLY to supply either full power or +5 V standby power.

30JUL07

8F2924

Page

14 of 72

THEORY GUIDE Local Panel

Section 3: Local Panel

The LOCAL PANEL, which connects by a CABLE to the LVDS BOARD in the DRE, contains:

• An LCD DISPLAY with miniature fluorescent BACKLIGHTS

• A TOUCH PANEL

• An DC-to-AC INVERTER POWER SUPPLY for the BACKLIGHTS

• A SPEAKER

• A momentary POWER SWITCH

• A LOCAL PANEL INTERFACE BOARD that connects to the to the LVDS BOARD in the

DRE

The LOCAL PANEL is not repaired in the field: it is replaced as a unit.

The following graphic is a block diagram of the LOCAL PANEL.

30JUL07

+12 V DC

To BACKLIGHTS

100 V AC

TOUCH PANEL

LCD PANEL

To DRE

INVERTER

DC-to-AC

SPEAKER

MOMENTARY SWITCH

(POWER BUTTON)

LOCAL PANEL

INTERFACE BOARD

LOCAL PANEL

8F2924

Page

15 of 72

THEORY GUIDE Local Panel

The cable that connects the LOCAL PANEL to the DRE carries:

• Image data for the LCD DISPLAY PANEL

• Input data from the TOUCH PANEL

• Closure signal (ground) from the MOMENTARY SWITCH

• Audio signal to the SPEAKER

• A backlight dimming signal

• +3.3, +5, and +12 V DC power

30JUL07

8F2924

Page

16 of 72

THEORY GUIDE Machine Control System (MCS)

Section 4: Machine Control System (MCS)

The MCS is the print engine within the IMAGER. It is made up of both hardware and software components.

MCS Functions

The MCS receives image data and commands from the DRE over the USB interface and is responsible for controlling the mechanical and optics assemblies to transport, expose and develop films. Once the DRE sends an image and print command, the MCS performs the actions necessary to expose and print a film largely independent of the DRE.

MCS Hardware

The MCS hardware consists of several electro-mechanical subsystems, each controlled by a “MICRO BOARD” - a circuit board containing a MICROPROCESSOR. Software in each MICRO BOARD provides the control “intelligence” for the subsystems. An I2C BUS connects a master MICROPROCESSOR on the DATAPATH BOARD to all of the other MICRO BOARDS. The BUS is used to exchange commands and status information between the master MICROPROCESSOR and the MICROROCESSORS on the other MICRO BOARDS. The master MICROPROCESSOR controls the subordinate MICROBOARDS by sending commands and receiving status information on the I2C BUS. Each MICROBOARD controls the functions of its mechanical subsystem by controlling motors and reading sensors.

The following diagram shows how the MICROBOARDS are connected on the I2C BUS. The DATAPATH MICROPROCESSOR is the primary control device with all other MICROPROCESSORS subordinate.

30JUL07

FILM SUPPLY

LASER DRIVER BOARD

POWER DISTRIBUTION BOARD

USB

LOCAL PA NE L

I2C

Modulated Laser Beam - To Optics

DATAPATH BOARD

CONTROL

BOARDS

BOARD

Laser Diode

Capacity: 1 Image

Digital - to - analog conversion

To : MOTORS, HEATERS, SENSORS controlled or sensed by the MICROBOARDS

TRANSLATION

USB/I2C

DRE

PRIMARY MICROPROCESSOR

8F2924

Page

17 of 72

THEORY GUIDE Machine Control System (MCS)

I2C BUS

The I2C is a low-speed, serial BUS with only 2 lines (plus ground). The BUS interconnects all of the MICROBOARDS.The MICROCONTROLLERS and FLASH MEMORIES on the MICROBOARDS connect to the BUS. Each device connected to the BUS has a unique address.

THEORY GUIDE Machine Control System (MCS)

30JUL07

8F2924

Page

18 of 72

The BUS is bidirectional. Any of the MICROPROCESSORS can initiate a data transfer on the BUS. Several types of information are transferred on the BUS:

• Commands - These are sent from the MASTER MICROPROCESSOR, on the DATAPATH

BOARD, to cause a slave MICROPROCESSOR to perform an action, for example, to “Execute Diagnostics” stored in the slave CPU. A command causes the slave to reply, acknowledging that the command can be processed or that there is a problem which prevents processing the command.

• MICROBOARDS return responses to commands to the DATAPATH BOARD.

• MICROBOARDS send status information to the DATAPATH BOARD.

• Software updates are downloaded to the MICROBOARDS.

Communication Between MICRO BOARDS

Communication between the DRE and the 11 MICRO-BOARDS is conducted over a USB channel and an I2C bus. The 11 MICRO-BOARDS are all connected on a common I2C bus. This bus is used to send commands from the DRE to the MICRO-BOARDS and return responses from the MICRO-BOARDS. It is also used to load software or other data into MICROPROCESSOR MEMORIES or NVRAM on the MICRO-BOARDS.

The I2C INTERFACE is a 2-wire BUS having a Serial Data, SDA, and a Serial Clock (SCL) line. These wires connect information between the devices and the CPUs connected to the BUS. Each CPU on the BUS is recognized by a unique address and can either receive or transmit data. The CPU that starts a data transfer is a “master” and the receiving CPU is a “slave.” Any of the CPUs on the BUS can be either a master or a slave. In practice, the MASTER CPU will start all commands, and will normally be the master, and the CPUs for modules on the BUS will be slaves. Three types of messages are used:

• Commands - These are sent from the MASTER CPU to cause a slave CPU to perform an

action, for example, to “Execute Diagnostics” stored in the slave CPU. A command causes the slave to reply, acknowledging that the command can be processed or that there is a problem which prevents processing the command.

• Replies - The slave must respond with a reply after each byte of a received command. If

the MASTER does not receive a reply within 100 ms after sending the command, it will stop the process.

THEORY GUIDE Machine Control System (MCS)

30JUL07

8F2924

Page

19 of 72

• Notification - These are sent from a slave CPU to the MASTER CPU indicating a changed

condition in the slave module.

Each type of message must be preceded by the address of the CPU for which it is intended.

Optics Module

Components Controlled or Sensed by the MICROBOARDS

The IMAGER has a number of rotary and linear MOTORS that power the functions of the IMAGER and SENSORS. The SENSORS provide input to MICROPROCESSORS that control the MOTORS.

Figure 3 shows the approximate location of MOTORS and SENSORS in the IMAGER. Table

1 and Table 2 provide descriptions each MOTOR and SENSOR.

THEORY GUIDE Machine Control System (MCS)

F5 F6

S12

S1 S2S3S4 S5

S6 S7S8

S10

S11

S13

S14

S15

M4 M5

M10

M11

M12

M13 M14

M15

M16M17

M18M19

S4 - PU Roller Position

M14 - Temp Cooling Drive

S19

M20

M22

M21

S24

S23 S22

S21

S20

S25

30JUL07

8F2924

Page

20 of 72

Figure 3 MOTORS and SENSORS

30JUL07

Note

8F2924

Page

21 of 72

THEORY GUIDE Machine Control System (MCS)

In the following tables: For components in the PICKUP or ROLLBACK ASSEMBLIES, x will be U, M or L, for the UPPER, MIDDLE or LOWER FILM DRAWER.

Table 1 MOTORS

Designator/

Location

M1x Pickup

M2x

Pickup

M3x

Pickup

M4x

Pickup

M5x

Pickup

Rollback

Registration

Name Location

PICKUP FEED ROLLER OPEN/ CLOSE MOTOR

Descriptio

Function

PICKUP ROLLER

Open/ Close

PICKUP ROLLER

drive

PICKUP PICKUP

drive

PICKUP PICKUP

PUMP

PICKUP PICKUP

RELIEF VALVE

ROLLBACK ROLLBAC

K DRIVE MOTOR

Registration Centering

MOTOR

Motion Typ e

Rotational DC GEAR

MOTOR

Home/

Default

Home = Open

Limit = Close

Rotational STEPPER Off On

Rotational DC GEAR

MOTOR

Home = Up (film at feed)

Limit = Cartridge bottom

Rotational

Linear

Rotational, Reversing

STEPPER Home =

ARMS retracted

actuated = ARMS extended to film size

Limit

THEORY GUIDE Machine Control System (MCS)

30JUL07

8F2924

Page

22 of 72

Table 2 SENSORS

Designator Location

S1x PICKUP Home

SENSOR

Description/

Function

Type Default

Interrupt SENSOR

Blocked = PICKUP home

Sensed

Position

Unblocked = PICKUP not home

+ 50 hidden pages

Kodak DryView 6800 User manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Section 1: Equipment Description

System Overview

Main Assemblies

Film Path

Main Steps in the Film Path

System Organization

Overview

DICOM RASTER ENGINE (DRE)

Power Module

Section 2: DICOM RASTER ENGINE (DRE)

Section 3: Local Panel

Section 4: Machine Control System (MCS)

MCS Functions

MCS Hardware

I2C BUS

Communication Between MICRO BOARDS

Optics Module

Components Controlled or Sensed by the MICROBOARDS