Intel LGA1155, CORE PROCESSOR FAMILY DESKTOP Manual

2nd Generation Intel® Core™ Processor Family Desktop and LGA1155 Socket

Thermal Mechanical Specifications and Design Guidelines (TMSDG)

Supporting the Intel® Core™ i7, i5 and i3 Desktop Processor January 2011

Document Number #: 324644-002

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The processor and Intel Series 6 Chipset and LGA1155 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

“Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology.For more information, see http://www.intel.com/technology/turboboost.”

Enhanced Intel® SpeedStep® Technology See the Processor Spec Finder or contact your Intel representative for more information.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See www.intel.com/products/processor_number for details.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, Intel Core, Pentium, and the Intel logo are trademarks of Intel Corporation in the U.S and other countries.

* Other brands and names may be claimed as the property of others. Copyright © 2011 Intel Corporation.

2	Thermal/Mechanical Specifications and Design Guidelines

Contents

1	Introduction		..............................................................................................................	9
	1.1	References .......................................................................................................		10
	1.2	Definition ............................................................................................of Terms		10
2	Package Mechanical ..........................................................& Storage Specifications			13
	2.1	Package .......................................................................Mechanical Specifications		13
		2.1.1 ....................................................................	Package Mechanical Drawing	14
		2.1.2 ......................................................Processor Component Keep-Out Zones		14
		2.1.3 ................................................................	Package Loading Specifications	15
		2.1.4 ....................................................................	Package Handling Guidelines	15
		2.1.5 ...............................................................	Package Insertion Specifications	15
		2.1.6 ....................................................................	Processor Mass Specification	15
		2.1.7 .................................................................................	Processor Materials	16
		2.1.8 .................................................................................	Processor Markings	16
		2.1.9 .....................................................................	Processor Land Coordinates	17
	2.2	Processor .........................................................................Storage Specifications		18
3	LGA1155 Socket ......................................................................................................			19
	3.1	Board Layout ....................................................................................................		20
		3.1.1 ................................Suggested Silkscreen Marking for Socket Identification		22
	3.2	Attachment ................................................................................to Motherboard		22
	3.3	Socket ...........................................................................................Components		23
		3.3.1 ..............................................................................	Socket Body Housing	23
		3.3.2 ...........................................................................................	Solder Balls	23
		3.3.3 ...............................................................................................	Contacts	23
		3.3.4 ...............................................................................Pick and Place Cover		23
	3.4	Package ...........................................................................Installation / Removal		24
		3.4.1 ..............................................Socket Standoffs and Package Seating Plane		25
	3.5	Durability .........................................................................................................		25
	3.6	Markings ..........................................................................................................		25
	3.7	Component ...............................................................................Insertion Forces		26
	3.8	Socket ......................................................................................................Size		26
4	Independent ...................................................................Loading Mechanism (ILM)			27
	4.1	Design .................................................................................................Concept		27
		4.1.1 ................................................................ILM Assembly Design Overview		27
		4.1.2 ...............................................................ILM Back Plate Design Overview		28
		4.1.3 .........................................Shoulder Screw and Fasteners Design Overview		29
	4.2	Assembly .......................................................................of ILM to a Motherboard		30
	4.3	ILM Interchangeability .......................................................................................		32
	4.4	Markings ..........................................................................................................		32
	4.5	ILM Cover ........................................................................................................		33
5	LGA1155 Socket ..and ILM Electrical, Mechanical and Environmental Specifications			37
	5.1	Component ...............................................................................................Mass		37
	5.2	Package/Socket ..........................................................................Stackup Height		37
	5.3	Loading ........................................................................................Specifications		38
	5.4	Electrical ......................................................................................Requirements		39
	5.5	Environmental ..............................................................................Requirements		40
6	Thermal Specifications ............................................................................................			41
	6.1	Thermal .......................................................................................Specifications		41
		6.1.1 Intel® Core™ i7-2000 and i5-2000 Desktop Processor Series
		.............................................................	(Quad Core 95W) Thermal Profile	43

Thermal/Mechanical Specifications and Design Guidelines

3

6.1.2	Intel® Core™ i7-2000 and i5-2000 Desktop Processor Series
	(Quad Core 65W) and Intel® Core™ i3-2000 Desktop Processor Series
	(Dual Core 65W) Thermal Profile..............................................................	44
6.1.3	Intel® Core™ i5-2000 desktop processor series (Quad Core 45W)
	Thermal Profile.......................................................................................	46

6.1.4Intel® Core™ i5-2000 and i3-2000 Desktop Processor Series

			(Dual Core 35W) Thermal Profile...............................................................		47
		6.1.5 Processor Specification for Operation Where Digital Thermal Sensor
			Exceeds TCONTROL ...................................................................................		48
		6.1.6	Thermal Metrology..................................................................................		52
	6.2	Processor Thermal Features ................................................................................			53
		6.2.1	Processor Temperature............................................................................		53
		6.2.2	Adaptive Thermal Monitor ........................................................................		53
			6.2.2.1	Frequency/VID Control...............................................................	54
			6.2.2.2	Clock Modulation.......................................................................	55
			6.2.2.3 Immediate Transition to combined TM1 and TM2 ...........................		55
			6.2.2.4	Critical Temperature Flag ...........................................................	56
			6.2.2.5	PROCHOT# Signal .....................................................................	56
		6.2.3	THERMTRIP# Signal ................................................................................		56
	6.3	Intel® Turbo Boost Technology ............................................................................			57
		6.3.1	Intel® Turbo Boost Technology Frequency..................................................		57
		6.3.2 Intel® Turbo Boost Technology Graphics Frequency ....................................			57
	6.4	Thermal Considerations ......................................................................................			58
		6.4.1 Intel® Turbo Boost Technology Power Control and Reporting ........................			58
		6.4.2	Package Power Control ............................................................................		59
		6.4.3	Power Plane Control ................................................................................		60
		6.4.4	Turbo Time Parameter.............................................................................		60
7	PECI Interface .........................................................................................................				61
	7.1	Platform Environment Control Interface (PECI) ......................................................			61
		7.1.1	Introduction...........................................................................................		61
			7.1.1.1 Fan Speed Control with Digital Thermal Sensor .............................		61
8	Sensor Based Thermal Specification Design Guidance ..............................................				63
	8.1	Sensor Based Specification Overview (DTS 1.0) .....................................................			63
	8.2	Sensor Based Thermal Specification .....................................................................			65
		8.2.1	TTV Thermal Profile.................................................................................		65
		8.2.2 Specification When DTS value is Greater than TCONTROL.............................			66
	8.3	Thermal Solution Design Process .........................................................................			66
		8.3.1	Boundary Condition Definition ..................................................................		67
		8.3.2 Thermal Design and Modelling ..................................................................			68
		8.3.3	Thermal Solution Validation......................................................................		68
			8.3.3.1 Test for Compliance to the TTV Thermal Profile..............................		68
			8.3.3.2 Thermal Solution Characterization for Fan Speed Control ................		68
	8.4	Fan Speed Control (FSC) Design Process...............................................................			69
		8.4.1 Fan Speed Control Algorithm without TAMBIENT Data..................................			70
		8.4.2 Fan Speed Control Algorithm with TAMBIENT Data ......................................			71
		8.4.3 DTS 1.1 A New Fan Speed Control Algorithm without TAMBIENT Data............			73
		8.4.4 Fan Speed Control Implementation Details .................................................			75
	8.5	System Validation..............................................................................................			76
	8.6	Thermal Solution Characterization........................................................................			77
9	ATX Reference Thermal Solution ..............................................................................				79
	9.1	Heatsink Thermal Solution ..................................................................................			79
	9.2	Geometric Envelope for the Intel Reference ATX Thermal Mechanical Design..............			81
	9.3	Reference Design Components ............................................................................			82
		9.3.1	Extrusion...............................................................................................		82

4	Thermal/Mechanical Specifications and Design Guidelines

	9.3.2	Clip ......................................................................................................			82
	9.3.3	Core .....................................................................................................			83
9.4	Mechanical Interface to the Reference Attach Mechanism........................................				84
9.5	Heatsink Mass & Center of Gravity.......................................................................				86
9.6	Thermal Interface Material..................................................................................				86
9.7	Heat Pipe Thermal Considerations........................................................................				87
10 Thermal Solution Quality and Reliability Requirements............................................					89
10.1	Reference Heatsink Thermal Verification...............................................................				89
10.2	Mechanical Environmental Testing .......................................................................				89
	10.2.1	Recommended Test Sequence..................................................................			90
	10.2.2	Post-Test Pass Criteria ............................................................................			90
	10.2.3	Recommended BIOS/Processor/Memory Test Procedures .............................			90
10.3	Material and Recycling Requirements ...................................................................				91
11 Boxed Processor Specifications ...............................................................................					93
11.1	Introduction .....................................................................................................				93
11.2	Mechanical Specifications ...................................................................................				94
	11.2.1	Boxed Processor Cooling Solution Dimensions ............................................			94
	11.2.2	Boxed Processor Fan Heatsink Weight .......................................................			96
	11.2.3	Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly			..... 96
11.3	Electrical Requirements......................................................................................				96
	11.3.1	Fan Heatsink Power Supply......................................................................			96
11.4	Thermal Specifications .......................................................................................				98
	11.4.1	Boxed Processor Cooling Requirements .....................................................			98
	11.4.2	Variable Speed Fan...............................................................................			100

Figures

2-1 Processor Package Assembly Sketch ........................................................................		13
2-2	Package View .......................................................................................................	14
2-3	Processor Top-Side Markings ..................................................................................	16
2-4 Processor Package Lands Coordinates ......................................................................		17
3-1 LGA1155 Socket with Pick and Place Cover ...............................................................		19
3-2 LGA1155 Socket Contact Numbering (Top View of Socket)..........................................		20
3-3 LGA1155 Socket Land Pattern (Top View of Board) ....................................................		21
3-4	Suggested Board Marking.......................................................................................	22
3-5	Attachment to Motherboard ....................................................................................	22
3-6 Pick and Place Cover..............................................................................................		24
3-7 Package Installation / Removal Features...................................................................		25
4-1 ILM Assembly with Installed Processor .....................................................................		28
4-2	Back Plate ............................................................................................................	29
4-3	Shoulder Screw.....................................................................................................	30
4-4	ILM Assembly .......................................................................................................	31
4-5 Pin1 and ILM Lever................................................................................................		32
4-6	ILM Cover ............................................................................................................	34
4-7 ILM Cover and PnP Cover Interference .....................................................................		35
5-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology ..............................		40
6-1 Thermal Test Vehicle Thermal Profile for Intel® Core™ i7-2000 and i5-2000 Desktop
	Processor Series (Quad Core 95W) ..........................................................................	43
6-2 Thermal Test Vehicle Thermal Profile for Intel® Core™ i7-2000 and i5-2000 Desktop
	Processor Series (Quad Core 65W) and Intel® Core™ i3-2000 Desktop Processor
	Series (Dual Core 65W) ........................................................................................	44
6-3 Thermal Test Vehicle Thermal Profile for Intel® Core™ i5-2000 Desktop Processor
	Series (Quad Core 45W) ........................................................................................	46

Thermal/Mechanical Specifications and Design Guidelines

5

	6-4	Thermal Test Vehicle Thermal Profile for Intel® Core™ i5-2000 and i3-2000 Desktop
		Processor Series (Dual Core 35W) ...........................................................................	47
6-5		TTV Case Temperature (TCASE) Measurement Location ..............................................	52
6-6		Frequency and Voltage Ordering ..............................................................................	55
6-7		Package Power Control ...........................................................................................	59
8-1		Comparison of Case Temperature versus Sensor Based Specification ............................	64
8-2		Intel® Core™ i7-2000 and i5-2000 desktop processor series (Quad Core 95W)
		Thermal Profile......................................................................................................	65
8-3		Thermal solution Performance .................................................................................	66
8-4		Example: Required YCA for Various TAMBIENT Conditions ...........................................	67
8-5		Thermal Solution Performance versus Fan Speed .......................................................	69
8-6		Fan Response Without TAMBIENT Data .....................................................................	71
8-7		Fan Response with TAMBIENT Aware FSC..................................................................	72
8-8		DTS 1.1 Definition Points ........................................................................................	74
8-9		Fan Response Comparison with Various Fan Speed Control Options ..............................	76
9-1		ATX Heatsink Reference Design Assembly .................................................................	80
9-2		ATX KOZ 3-D Model Primary (Top) Side ....................................................................	81
9-3		RCBFH Extrusion ...................................................................................................	82
9-4		Clip for Existing Solutions to straddle LGA1155 Socket................................................	83
9-5		Core ....................................................................................................................	84
9-6		Clip Core and Extrusion Assembly ............................................................................	85
9-7		Critical Parameters for Interface to the Reference Clip ................................................	85
9-8		Critical Core Dimensions .........................................................................................	86
9-9		TTV Die Size and Orientation...................................................................................	87
11-1		Mechanical Representation of the Boxed Processor .....................................................	94
11-2		Space Requirements for the Boxed Processor (side view) ............................................	95
11-3		Space Requirements for the Boxed Processor (top view) .............................................	95
11-4		Space Requirements for the Boxed Processor (overall view) ........................................	96
11-5		Boxed Processor Fan Heatsink Power Cable Connector Description................................	97
11-6		Baseboard Power Header Placement Relative to Processor Socket.................................	98
11-7		Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view).....................	99
11-8		Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view)....................	99
11-9		Boxed Processor Fan Heatsink Set Points ................................................................	100

6	Thermal/Mechanical Specifications and Design Guidelines

Tables

1-1		Reference Documents .............................................................................................	10
1-2		Terms and Descriptions...........................................................................................	10
2-1		Processor Loading Specifications ..............................................................................	15
2-2		Package Handling Guidelines....................................................................................	15
2-3		Processor Materials.................................................................................................	16
2-4		Storage Conditions .................................................................................................	18
5-1		Socket Component Mass .........................................................................................	37
5-2 1155-land Package and LGA1155 Socket Stackup Height.............................................			37
5-3 Socket & ILM Mechanical Specifications .....................................................................			38
5-4 Electrical Requirements for LGA1155 Socket ..............................................................			39
6-1		Processor Thermal Specifications..............................................................................	42
6-2	Thermal Test Vehicle Thermal Profile for Intel® Core™ i7-2000 and i5-2000 Desktop
		Processor Series (Quad Core 95W) ...........................................................................	43
6-3	Thermal Test Vehicle Thermal Profile for Intel® Core™ i7-2000 and i5-2000 Desktop
		Processor Series (Quad Core 65W) and Intel® Core™ i3-2000 Desktop Processor Series
		(Dual Core 65W) ..................................................................................................	45
6-4	Thermal Test Vehicle Thermal Profile for Intel® Core™ i5-2000 Desktop Processor
		Series (Quad Core 45W) .........................................................................................	46
6-5	Thermal Test Vehicle Thermal Profile for Intel® Core™ i5-2000 and i3-2000 Desktop
		Processor Series (Dual Core 35W) ...........................................................................	47
6-6 Thermal Solution Performance above TCONTROL for the Intel® Core™ i7-2000 and
		i5-2000 Desktop Processor Series (Quad Core 95W) ...................................................	48
6-7 Thermal Solution Performance above TCONTROL for the Intel® Core™ i7-2000 and
		i5-2000 Desktop Processor Series (Quad Core 65W) and Intel® Core™ i3-2000
		Desktop Processor Series (Dual Core 65W) ...............................................................	49
6-8 Thermal Solution Performance above TCONTROL for the Intel® Core™ i5-2000
		Desktop Processor Series (Quad Core 45W)...............................................................	50
6-9 Thermal Solution Performance above TCONTROL for the Intel® Core™ i5-2000 and
		i3-2000 Desktop Processor Series (Dual Core 35W) ....................................................	51
8-1 DTS 1.1 Thermal Solution Performance above TCONTROL............................................			74
8-2 Fan Speed control example for 95W TDP processor1 ...................................................			75
8-3 Thermal Solution Performance above TCONTROL ........................................................			77
9-1		Reference Thermal Solutions ...................................................................................	79
10-1		Use Conditions (Board Level) ...................................................................................	89
11-1		Fan Heatsink Power and Signal Specifications.............................................................	97
11-2		Fan Heatsink Power and Signal Specifications...........................................................	101

Thermal/Mechanical Specifications and Design Guidelines

7

Revision History

Revision		Description	Revision Date
Number
001	•	Initial release	January 2011
002	•	Minor edits for clarity	January 2011

§

8	Thermal/Mechanical Specifications and Design Guidelines

Introduction

1 Introduction

The goal of this document is to provide thermal and mechanical specifications for the processor and the associated socket. The usual design guidance is also included.

The components described in this document include:

•The thermal and mechanical specifications for the following Intel® desktop processors:

—Intel® Core™ i7-2000 desktop processor series

—Intel® Core™ i5-2000 desktop processor series

—Intel® Core™ i3-2000 desktop processor series

•The LGA1155 socket and the Independent Loading Mechanism (ILM) and back plate.

•The reference design thermal solution (heatsink) for the processors and associated retention hardware.

The Intel® Core™ i7-2000, i5-2000 and i3-2000 desktop processor series has the different thermal specifications. When required for clarity, this document will use:

—Intel® Core™ i7-2000 and i5-2000 desktop processor series (Quad Core 95W)

—Intel® Core™ i7-2000 and i5-2000 desktop processor series (Quad Core 65W)

—Intel® Core™ i3-2000 desktop processor series (Dual Core 65W)

—Intel® Core™ i5-2000 desktop processor series (Quad Core 45W)

—Intel® Core™ i5-2000 and i3-2000 desktop processor series (Dual Core 35W)

Note: When the information is applicable to all products the this document will use “processor” or “processors” to simplify the document.

Thermal/Mechanical Specifications and Design Guidelines

9

Introduction

1.1References

Material and concepts available in the following documents may be beneficial when reading this document.

Table 1-1.	Reference Documents
	Document	Location	Notes
	2nd Generation Intel® Core™ Processor Family Desktop Datasheet,	http://
	Volume 1	download.intel.com/
		design/processor/
		datashts/324641.pdf
	2nd Generation Intel® Core™ Processor Family Desktop Datasheet,	http://
	Volume 2	download.intel.com/
		design/processor/
		datashts/324642.pdf
	2nd Generation Intel® Core™ Processor Family Desktop Specification	http://
	Update	download.intel.com/
		design/processor/
		specupdt/324643.pdf
	4-Wire Pulse Width Modulation (PWM) Controlled Fans	Available at http://
		www.formfactors.org/

1.2Definition of Terms

Table 1-2.	Terms and Descriptions
Term		Description
Bypass		Bypass is the area between a passive heatsink and any object that can act to form a duct. For this
		example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest
		surface.
CTE		Coefficient of Thermal Expansion. The relative rate a material expands during a thermal event.
DTS		Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature.
FSC		Fan Speed Control
IHS		Integrated Heat Spreader: a component of the processor package used to enhance the thermal
		performance of the package. Component thermal solutions interface with the processor at the IHS surface.
ILM		Independent Loading Mechanism provides the force needed to seat the 1155-LGA land package onto the
		socket contacts.
PCH		Platform Controller Hub. The PCH is connected to the processor via the Direct Media Interface (DMI) and
		Intel® Flexible Display Interface (Intel® FDI).
LGA1155 socket		The processor mates with the system board through this surface mount, 1155-land socket.
PECI		The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication
		channel between Intel processor and chipset components to external monitoring devices.
CA		Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance
		using total package power. Defined as (TCASE – TLA) / Total Package Power. The heat source should always
		be specified for measurements.
CS		Case-to-sink thermal characterization parameter. A measure of thermal interface material performance
		using total package power. Defined as (TCASE – TS) / Total Package Power.
SA		Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using
		total package power. Defined as (TS – TLA) / Total Package Power.
TCASE or TC		The case temperature of the processor, measured at the geometric center of the topside of the TTV IHS.
TCASE_MAX		The maximum case temperature as specified in a component specification.
TCC		Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock
		modulation and/or operating frequency and input voltage adjustment when the die temperature is very
		near its operating limits.
10		Thermal/Mechanical Specifications and Design Guidelines

Introduction

Table 1-2.	Terms and Descriptions (Continued)
Term		Description
TCONTROL		Tcontrol is a static value that is below the TCC activation temperature and used as a trigger point for fan
		speed control. When DTS > Tcontrol, the processor must comply to the TTV thermal profile.
TDP		Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP is not
		the maximum power that the processor can dissipate.
Thermal Monitor		A power reduction feature designed to decrease temperature after the processor has reached its maximum
		operating temperature.
Thermal Profile		Line that defines case temperature specification of the TTV at a given power level.
TIM		Thermal Interface Material: The thermally conductive compound between the heatsink and the processor
		case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor
		case to the heatsink.
TTV		Thermal Test Vehicle. A mechanically equivalent package that contains a resistive heater in the die to
		evaluate thermal solutions.
TLA		The measured ambient temperature locally surrounding the processor. The ambient temperature should be
		measured just upstream of a passive heatsink or at the fan inlet for an active heatsink.
TSA		The system ambient air temperature external to a system chassis. This temperature is usually measured
		at the chassis air inlets.
	§

Thermal/Mechanical Specifications and Design Guidelines

11

Introduction

12	Thermal/Mechanical Specifications and Design Guidelines

Package Mechanical & Storage Specifications

2Package Mechanical & Storage Specifications

2.1Package Mechanical Specifications

The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with the motherboard via the LGA1155 socket. The package consists of a processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor thermal solutions, such as a heatsink. Figure 2-1 shows a sketch of the processor package components and how they are assembled together. Refer to Chapter 3 and Chapter 4 for complete details on the LGA1155 socket.

The package components shown in Figure 2-1 include the following:

1.Integrated Heat Spreader (IHS)

2.Thermal Interface Material (TIM)

3.Processor core (die)

4.Package substrate

5.Capacitors

Figure 2-1. Processor Package Assembly Sketch

Core (die)	TIM
IHS

Substrate

Capacitors

LGA1155 Socket

System Board

Note:

1.Socket and motherboard are included for reference and are not part of processor package.

2.For clarity the ILM not shown.

Thermal/Mechanical Specifications and Design Guidelines

13

Package Mechanical & Storage Specifications

2.1.1Package Mechanical Drawing

Figure 2-2 shows the basic package layout and dimensions. The detailed package mechanical drawings are in Appendix D. The drawings include dimensions necessary to design a thermal solution for the processor. These dimensions include:

1.Package reference with tolerances (total height, length, width, and so on)

2.IHS parallelism and tilt

3.Land dimensions

4.Top-side and back-side component keep-out dimensions

5.Reference datums

6.All drawing dimensions are in mm.

Figure 2-2. Package View

37.5

37.5

2.1.2Processor Component Keep-Out Zones

The processor may contain components on the substrate that define component keepout zone requirements. A thermal and mechanical solution design must not intrude into the required keep-out zones. Decoupling capacitors are typically mounted to either the topside or land-side of the package substrate. See Figure B-3 and Figure B-4 for keepout zones. The location and quantity of package capacitors may change due to manufacturing efficiencies but will remain within the component keep-in. This keep-in zone includes solder paste and is a post reflow maximum height for the components.

14	Thermal/Mechanical Specifications and Design Guidelines

Package Mechanical & Storage Specifications

2.1.3Package Loading Specifications

Table 2-1 provides dynamic and static load specifications for the processor package. These mechanical maximum load limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Also, any mechanical system or component testing should not exceed the maximum limits. The processor package substrate should not be used as a mechanical reference or load-bearing surface for thermal and mechanical solution.

.

Table 2-1. Processor Loading Specifications

Parameter	Minimum	Maximum	Notes
Static Compressive Load	-	600 N [135 lbf]	1, 2, 3
Dynamic Compressive Load	-	712 N [160 lbf]	1, 3, 4

Notes:

1.These specifications apply to uniform compressive loading in a direction normal to the processor IHS.

2.This is the maximum static force that can be applied by the heatsink and retention solution to maintain the heatsink and processor interface.

3.These specifications are based on limited testing for design characterization. Loading limits are for the package only and do not include the limits of the processor socket.

4.Dynamic loading is defined as an 50g shock load, 2X Dynamic Acceleration Factor with a 500g maximum thermal solution.

2.1.4Package Handling Guidelines

Table 2-2 includes a list of guidelines on package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal.

Table 2-2. Package Handling Guidelines

Parameter	Maximum Recommended	Notes
Shear	311 N [70 lbf]	1, 4
Tensile	111 N [25 lbf]	2, 4
Torque	3.95 N-m [35 lbf-in]	3, 4

Notes:

1.A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.

2.A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.

3.A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top surface.

4.These guidelines are based on limited testing for design characterization.

2.1.5Package Insertion Specifications

The processor can be inserted into and removed from an LGA1155 socket 15 times. The socket should meet the LGA1155 socket requirements detailed in Chapter 5.

2.1.6Processor Mass Specification

The typical mass of the processor is 21.5g (0.76 oz). This mass [weight] includes all the components that are included in the package.

Thermal/Mechanical Specifications and Design Guidelines

15

Package Mechanical & Storage Specifications

2.1.7Processor Materials

Table 2-3 lists some of the package components and associated materials.

Table 2-3. Processor Materials

Component	Material
Integrated Heat Spreader (IHS)	Nickel Plated Copper
Substrate	Fiber Reinforced Resin
Substrate Lands	Gold Plated Copper

2.1.8Processor Markings

Figure 2-3 shows the topside markings on the processor. This diagram is to aid in the identification of the processor.

Figure 2-3. Processor Top-Side Markings

GRP1LINE1

GRP1LINE2

GRP1LINE3

GRP1LINE4

GRP1LINE5

S/N

Sample (QDF):

GRP1LINE1: i{M}{C}YY GRP1LINE2: INTEL CONFIDENTIAL GRP1LINE3: QDF ES SPEED GRP1LINE4: COUNTRY OF ORIGIN GRP1LINE5: {FPO} {e4}

Production (SSPEC):

GRP1LINE1: i{M}{C}YY GRP1LINE2: BRAND PROC# GRP1LINE3: SSPEC SPEED GRP1LINE4: COUNTRY OF ORIGIN GRP1LINE5: {FPO} {e4}

16	Thermal/Mechanical Specifications and Design Guidelines

Package Mechanical & Storage Specifications

2.1.9Processor Land Coordinates

Figure 2-4 shows the bottom view of the processor package.

.

Figure 2-4. Processor Package Lands Coordinates

AY
AW
AV
AU
AT
AR
AP
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
P
R
T
N
M
K
K
J
H
G
F
E
D
C
B
A
1	3	5	7	9	11		13		15		17		19		21		23		25	27		29		31		33		35		37	39
2	4		6	8	10	12		14		16		18		20		22		24	26		28		30		32		34		36	38		40

Thermal/Mechanical Specifications and Design Guidelines

17

Package Mechanical & Storage Specifications

2.2Processor Storage Specifications

Table 2-4 includes a list of the specifications for device storage in terms of maximum and minimum temperatures and relative humidity. These conditions should not be exceeded in storage or transportation.

.

Table 2-4. Storage Conditions

Parameter	Description	Min	Max	Notes
TABSOLUTE STORAGE	The non-operating device storage temperature.	-55 °C	125 °C	1, 2, 3
	Damage (latent or otherwise) may occur when
	subjected to for any length of time.
TSUSTAINED STORAGE	The ambient storage temperature limit (in	-5 °C	40 °C	4, 5
	shipping media) for a sustained period of time.
RHSUSTAINED STORAGE	The maximum device storage relative humidity	60% @ 24 °C		5, 6
	for a sustained period of time.
TIMESUSTAINED STORAGE	A prolonged or extended period of time; typically	0	6	6
	associated with customer shelf life.	Months	Months

Notes:

1.Refers to a component device that is not assembled in a board or socket that is not to be electrically connected to a voltage reference or I/O signals.

2.Specified temperatures are based on data collected. Exceptions for surface mount reflow are specified in by applicable JEDEC standard Non-adherence may affect processor reliability.

3.TABSOLUTE STORAGE applies to the unassembled component only and does not apply to the shipping media, moisture barrier bags or desiccant.

4.Intel branded board products are certified to meet the following temperature and humidity limits that are given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C, Humidity: 50% to 90%, non-condensing with a maximum wet bulb of 28 °C). Post board attach storage temperature limits are not specified for non-Intel branded boards.

5.The JEDEC, J-JSTD-020 moisture level rating and associated handling practices apply to all moisture sensitive devices removed from the moisture barrier bag.

6.Nominal temperature and humidity conditions and durations are given and tested within the constraints imposed by TSUSTAINED STORAGE and customer shelf life in applicable intel box and bags.

§

18	Thermal/Mechanical Specifications and Design Guidelines

LGA1155 Socket

3 LGA1155 Socket

This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the processors. The socket provides I/O, power and ground contacts. The socket contains 1155 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard.

The contacts are arranged in two opposing L-shaped patterns within the grid array. The grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the array and selective depopulation elsewhere.

The socket must be compatible with the package (processor) and the Independent Loading Mechanism (ILM). The ILM design includes a back plate which is integral to having a uniform load on the socket solder joints. Socket loading specifications are listed in Chapter 5.

Figure 3-1. LGA1155 Socket with Pick and Place Cover

Thermal/Mechanical Specifications and Design Guidelines

19

LGA1155 Socket

Figure 3-2. LGA1155 Socket Contact Numbering (Top View of Socket)

30

28

29

26 2725

24

22 23

20 21

18 19

16

17

14 15

12 13

10 11

8

9

7

6

4

5

2 3

1

A	C	E G	J	L	N	R	U	W AA AC AE AG AJ AL AN AR AU AW
B	D	F	H K	M	P	T	V	Y AB AD AF AH AK AM AP AT AV AY

39 4038

37 36

3533 34

31 3230

29

27 28

25 26

24

23 22

21 20

19 18

17 16

15 14

13 12

11

3.1Board Layout

The land pattern for the LGA1155 socket is 36 mils X 36 mils (X by Y) within each of the two L-shaped sections. Note that there is no round-off (conversion) error between socket pitch (0.9144 mm) and board pitch (36 mil) as these values are equivalent. The two L-sections are offset by 0.9144 mm (36 mil) in the x direction and 3.114 mm (122.6 mil) in the y direction, see Figure 3-3. This was to achieve a common package land to PCB land offset which ensures a single PCB layout for socket designs from the multiple vendors.

20	Thermal/Mechanical Specifications and Design Guidelines

LGA1155 Socket

Figure 3-3. LGA1155 Socket Land Pattern (Top View of Board)

30

28 29

27

26

24 25

23

22

21

20

18 19

17

16

14 15

12 13

10 11

9

8

6 7

5

4

23

1

A C E G J L N R U B D F H K M P T V

36mil (0.9144 mm)

W	AA AC AE AG AJ	AL AN AR AU AW
Y	AB AD AF AH AK	AM AP AT AV AY
		39	40
			38
		37	36
		35
			34
		33	32
		31	30
		29	28
		27	26
		25	24
		23
			22
		21	20
		19	18
		17	16
		15
			14
		13	12
		11

122.6 mil (3.1144mm)

A	C E	G	J	L	N R	U	W	AA AC AE AG AJ AL AN AR AU AW
B	D	F	H	K M	P	T	V	Y AB AD AF AH AK AM AP AT AV AY

Thermal/Mechanical Specifications and Design Guidelines

21

LGA1155 Socket

3.1.1Suggested Silkscreen Marking for Socket Identification

Intel is recommending that customers mark the socket name approximately where shown in Figure 3-4.

Figure 3-4. Suggested Board Marking

3.2Attachment to Motherboard

The socket is attached to the motherboard by 1155 solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, and so on) to attach the socket.

As indicated in Figure 3-1, the Independent Loading Mechanism (ILM) is not present during the attach (reflow) process.

Figure 3-5. Attachment to Motherboard

Load plate

Frame	Load Lever

Shoulder

Screw

Back Plate

22	Thermal/Mechanical Specifications and Design Guidelines

LGA1155 Socket

3.3Socket Components

The socket has two main components, the socket body and Pick and Place (PnP) cover, and is delivered as a single integral assembly. Refer to Appendix C for detailed drawings.

3.3.1Socket Body Housing

The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable of withstanding 260 °C for 40 seconds which is compatible with typical reflow/rework profiles. The socket coefficient of thermal expansion (in the XY plane), and creep properties, must be such that the integrity of the socket is maintained for the conditions listed in Chapter 5.

The color of the housing will be dark as compared to the solder balls to provide the contrast needed for pick and place vision systems.

3.3.2Solder Balls

A total of 1155 solder balls corresponding to the contacts are on the bottom of the socket for surface mounting with the motherboard. The socket solder ball has the following characteristics:

•Lead free SAC (SnAgCu) 305 solder alloy with a silver (Ag) content between 3% and 4% and a melting temperature of approximately 217 °C. The alloy is compatible with immersion silver (ImAg) and Organic Solderability Protectant (OSP) motherboard surface finishes and a SAC alloy solder paste.

•Solder ball diameter 0.6 mm ± 0.02 mm, before attaching to the socket lead.

The co-planarity (profile) and true position requirements are defined in Appendix C.

3.3.3Contacts

Base material for the contacts is high strength copper alloy.

For the area on socket contacts where processor lands will mate, there is a 0.381 m [15 inches] minimum gold plating over 1.27 m [50 inches] minimum nickel underplate.

No contamination by solder in the contact area is allowed during solder reflow.

3.3.4Pick and Place Cover

The cover provides a planar surface for vacuum pick up used to place components in the Surface Mount Technology (SMT) manufacturing line. The cover remains on the socket during reflow to help prevent contamination during reflow. The cover can withstand 260 °C for 40 seconds (typical reflow/rework profile) and the conditions listed in Chapter 5 without degrading.

As indicated in Figure 3-6, the cover remains on the socket during ILM installation, and should remain on whenever possible to help prevent damage to the socket contacts.

Thermal/Mechanical Specifications and Design Guidelines

23

LGA1155 Socket

Cover retention must be sufficient to support the socket weight during lifting, translation, and placement (board manufacturing), and during board and system shipping and handling. PnP Cover should only be removed with tools, to prevent the cover from falling into the contacts.

The socket vendors have a common interface on the socket body where the PnP cover attaches to the socket body. This should allow the PnP covers to be compatible between socket suppliers.

As indicated in Figure 3-6, a Pin1 indicator on the cover provides a visual reference for proper orientation with the socket.

Figure 3-6. Pick and Place Cover

Pin 1

Pick & Place

ILM Installation

3.4Package Installation / Removal

As indicated in Figure 3-7, access is provided to facilitate manual installation and removal of the package.

To assist in package orientation and alignment with the socket:

•The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for proper orientation.

•The package substrate has orientation notches along two opposing edges of the package, offset from the centerline. The socket has two corresponding orientation posts to physically prevent mis-orientation of the package. These orientation features also provide initial rough alignment of package to socket.

•The socket has alignment walls at the four corners to provide final alignment of the package.

24	Thermal/Mechanical Specifications and Design Guidelines

LGA1155 Socket

.

Figure 3-7. Package Installation / Removal Features

Package	Orientation
Pin 1	Notch
Indicator	(2 Places)

	Finger/Tool
	Access
Alignment	(2 Places)
Post	Pin 1
(2 Places)	Chamfer

3.4.1Socket Standoffs and Package Seating Plane

Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in Appendix C.

Similarly, a seating plane on the topside of the socket establishes the minimum package height. See Section 5.2 for the calculated IHS height above the motherboard.

3.5Durability

The socket must withstand 20 cycles of processor insertion and removal. The max chain contact resistance from Table 5-4 must be met when mated in the 1st and 20th cycles.

The socket Pick and Place cover must withstand 15 cycles of insertion and removal.

3.6Markings

There are three markings on the socket:

•LGA1155: Font type is Helvetica Bold - minimum 6 point (2.125 mm). This mark will also appear on the pick and place cap.

•Manufacturer's insignia (font size at supplier's discretion).

•Lot identification code (allows traceability of manufacturing date and location).

Thermal/Mechanical Specifications and Design Guidelines

25

LGA1155 Socket

All markings must withstand 260 °C for 40 seconds (typical reflow/rework profile) without degrading, and must be visible after the socket is mounted on the motherboard.

LGA1155 and the manufacturer's insignia are molded or laser marked on the side wall.

3.7Component Insertion Forces

Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/ Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force to insert the package into the socket.

3.8Socket Size

Socket information needed for motherboard design is given in Appendix C.

This information should be used in conjunction with the reference motherboard keepout drawings provided in Appendix B to ensure compatibility with the reference thermal mechanical components.

§

26	Thermal/Mechanical Specifications and Design Guidelines

Independent Loading Mechanism (ILM)

4Independent Loading Mechanism (ILM)

The ILM has two critical functions: deliver the force to seat the processor onto the socket contacts and distribute the resulting compressive load evenly through the socket solder joints.

The mechanical design of the ILM is integral to the overall functionality of the LGA1155 socket. Intel performs detailed studies on integration of processor package, socket and ILM as a system. These studies directly impact the design of the ILM. The Intel reference ILM will be “build to print” from Intel controlled drawings. Intel recommends using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from Intel's detailed studies and may not incorporate critical design parameters.

Note: There is a single ILM design for the LGA1155 socket and LGA1156 socket.

4.1Design Concept

The ILM consists of two assemblies that will be procured as a set from the enabled vendors. These two components are ILM assembly and back plate. To secure the two assemblies, two types of fasteners are required a pair (2) of standard 6-32 thread screws and a custom 6-32 thread shoulder screw. The reference design incorporates a T-20 Torx* head fastener. The Torx* head fastener was chosen to ensure end users do not inadvertently remove the ILM assembly and for consistency with the LGA1366 socket ILM. The Torx* head fastener is also less susceptible to driver slippage. Once assembled the ILM is not required to be removed to install / remove the motherboard from a chassis.

4.1.1ILM Assembly Design Overview

The ILM assembly consists of 4 major pieces: ILM cover, load lever, load plate and the hinge frame assembly.

All of the pieces in the ILM assembly except the hinge frame and the screws used to attach the back plate are fabricated from stainless steel. The hinge frame is plated. The frame provides the hinge locations for the load lever and load plate. An insulator is preapplied to the bottom surface of the hinge frame.

The ILM assembly design ensures that once assembled to the back plate the only features touching the board are the shoulder screw and the insulated hinge frame assembly. The nominal gap of the load plate to the board is ~1 mm.

When closed the load plate applies two point loads onto the IHS at the “dimpled” features shown in Figure 4-1. The reaction force from closing the load plate is transmitted to the hinge frame assembly and through the fasteners to the back plate. Some of the load is passed through the socket body to the board inducing a slight compression on the solder joints.

A pin 1 indicator will be marked on the ILM assembly.

Thermal/Mechanical Specifications and Design Guidelines

27

Independent Loading Mechanism (ILM)

Figure 4-1. ILM Assembly with Installed Processor

Hinge /
Frame
Assy	Fasteners

Load

Load Lever

Plate

Pin 1 Indicator

Shoulder Screw

4.1.2ILM Back Plate Design Overview

The back plate is a flat steel back plate with pierced and extruded features for ILM attach. A clearance hole is located at the center of the plate to allow access to test points and backside capacitors if required. An insulator is pre-applied. A notch is placed in one corner to assist in orienting the back plate during assembly.

Caution: Intel does NOT recommend using the server back plate for high-volume desktop applications at this time as the server back plate test conditions cover a limited envelope. Back plates and screws are similar in appearance. To prevent mixing, different levels of differentiation between server and desktop back plate and screws have been implemented.

For ILM back plate, three levels of differentiation have been implemented:

•Unique part numbers, please refer to part numbers listed in Appendix A.

•Desktop ILM back plate to use black lettering for marking versus server ILM back plate to use yellow lettering for marking.

•Desktop ILM back plate using marking “115XDBP” versus server ILM back plate using marking “115XSBP”.

Note: When reworking a BGA component or the socket that the heatsink, battery, ILM and ILM Back Plate are removed prior to rework. The ILM back plate should also be removed when reworking through hole mounted components in a mini-wave or solder pot). The maximum temperature for the pre-applied insulator on the ILM is approximately 106 °C.

28	Thermal/Mechanical Specifications and Design Guidelines

Independent Loading Mechanism (ILM)

Figure 4-2. Back Plate

Assembly	Die Cut
Orientation	Insulator
Feature

Pierced & Extruded

Thread Features

4.1.3Shoulder Screw and Fasteners Design Overview

The shoulder screw is fabricated from carbonized steel rod. The shoulder height and diameter are integral to the mechanical performance of the ILM. The diameter provides alignment of the load plate. The height of the shoulder ensures the proper loading of the IHS to seat the processor on the socket contacts. The design assumes the shoulder screw has a minimum yield strength of 235 MPa.

A dimensioned drawing of the shoulder screw is available for local sourcing of this component. Please refer to Figure B-13 for the custom 6-32 thread shoulder screw drawing.

The standard fasteners can be sourced locally. The design assumes this fastener has a minimum yield strength of 235 MPa. Please refer to Figure B-14 for the standard 6-32 thread fasteners drawing.

Note: The screws for Server ILM are different from Desktop design. The length of Server ILM screws are shorter than the Desktop screw length to satisfy Server secondary-side clearance limitation.

Note: Unique part numbers, please refer to Appendix A.

Note: The reference design incorporates a T-20 Torx* head fastener. The Torx* head fastener was chosen to ensure end users do not inadvertently remove the ILM assembly and for consistency with the LGA1366 socket ILM.

Thermal/Mechanical Specifications and Design Guidelines

29

Independent Loading Mechanism (ILM)

Figure 4-3. Shoulder Screw

Cap

6-32 thread

Shoulder

4.2Assembly of ILM to a Motherboard

The ILM design allows a bottoms up assembly of the components to the board. See Figure 4-4 for step by step assembly sequence.

1.Place the back plate in a fixture. The motherboard is aligned with the fixture.

2.Install the shoulder screw in the single hole near Pin 1 of the socket. Torque to a minimum and recommended 8 inch-pounds, but not to exceed 10 inch-pounds.

3.Align and place the ILM assembly over the socket.

4.Install two (2) 6-32 fasteners. Torque to a minimum and recommended 8 inchpounds, but not to exceed 10 inch-pounds.

The thread length of the shoulder screw accommodates a nominal board thicknesses of 0.062”.

30	Thermal/Mechanical Specifications and Design Guidelines