Intel DB75EN Specification

Intel® Desktop Board DB75EN

Technical Product Specification

June 2012

Part Number: G54940-002

The Intel Desktop Board DB75EN may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DB75EN Specification Update.

Revision History

Revision Revision History Date

-001 First release of the Intel® Desktop Board DB75EN Technical Product Specification

-002 Specification clarificati o n June 2012

This product spec ification applies to only the standar d Intel® Desktop Board with BIOS identifier ENB7510H.86A.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNE CT I ON WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PROD UCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A P ARTICULAR PURPOSE, MERCHANTABILITY, O R INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FO R ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

All Intel computers (PC) for installation in home s , offices , schoo ls , com p uter room s , and sim ilar locati o ns . The suitability of this product for other PC or embedded no n-PC app lic a tio ns or o ther e nviro nme nts , s uc h as medical, industrial, alarm systems, te s t equipment, etc. may not be supported without further evaluation by Intel.

Intel Corporation may have patents or pending pa te nt app lic ations, trademarks, copyrights, or other intellectual property rights that r e la te to the pres e nted subjec t matte r. The furnishing of documents and other materials and inform ation doe s not provide any license, express or implied, by estoppel or otherwis e , to any such patents, trademarks, copyrights, or othe r intelle c tua l p ro perty rights.

Intel may make changes to specifications and produc t descriptions at any time, without notice. Designers must not rely on the absence or characteristic s of any feature s or instructions marked “reserved”

or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

Intel desktop boards may contain design defe c ts or error s know n as err ata , which may c ause the prod uc t to deviate from published specifications . C urrent characterized errata are available on request.

Contact your local Intel sales offic e or your distr ibutor to obtain the latest specifications before plac ing your product order.

Intel, 3 trademarks of Intel Corporation in the U.S. and/or other countries.

desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal

generation Intel Core processor family, and 2nd generation Intel Core processor family are

April 2012

Board Identification Information

Basic Desktop Board DB75EN Identification Information

AA Revision BIOS Revision Notes

G39650-300 ENB7510H.86A.0017 1,2 Notes:

1. The AA number is found on a small label on the component side of the board.

2. The B75 processor used on this AA revisio n cons is ts of the following component:

Device Stepping S-Spec Numbers

Intel B75 Express Chipset A1 SLJ85

Specification Changes or Clarifications

Table 1 indicates the Specification Changes or Specification Clarifications that apply to the Intel

Desktop Board DB75EN.

Table 1. Specification Changes or Clarifications

Date Type of Change Description of Changes or Clarifications

June 2012 Spec Clarification Removed references to RAID support and replaced with

SATA ACHI support.

Errata

Current characterized errata, if any, are documented in a separate Specification Update. See http://developer.intel.com/products/desktop/motherboard/index.htm for the latest documentation.

iii

Intel Desktop Board DB75EN Technical Product Specification

A map of the resou r ces of the Intel Desk top Board

The features supported by the BIOS Setup program

Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel Board DB75EN.

Intended Audience

The TPS is intended to provide detailed, technical information about Intel Desktop Board DB75EN and its components to the vendors, system integrators, and other engineers and technician s who need this level of information. It is specifical ly not intended for general audiences.

What This Document Contains

Chapter Description

1 A description of the hardwar e used on Intel Desktop Board DB75EN

4 A description of the BIOS error mes s a ges , beep codes, and POST codes 5 Regulatory comp lia nce and battery dis posal informati on

Typographical Conventions

Desktop

This section cont ains information abo u t t he conventions used in this sp ecification. No t all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DB75EN Technical Product Specification

Other Common Notation

# Used after a signal name to identify an active-low sig nal (s uch as USB P0# ) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kb Kilob it (1024 bits) kb/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mb Megabit (1,048,576 bits) Mb/s Megabit s pe r second TDP Thermal Design Power xxh An address or data value ending with a lowercase h indicates a hexadec ima l value. x.x V Volts. Voltages are DC unless otherwise specified. * This symbol is used to indicate third-party brands and names that are the property of their

respective owners.

Contents

Revision History

Board Identification Information .................................................................. iii

Specification Changes or Clarifications ......................................................... iii

Errata ...................................................................................................... iii

Preface

Intended Audience ..................................................................................... v

What This Document Contains ..................................................................... v

Typographical Conventions ......................................................................... v

1 Product Description

1.1 Overview ......................................................................................... 11

1.1.1 Feature Summary ................................................................. 11

1.1.2 Board Layout ........................................................................ 13

1.1.3 Block Diagram ...................................................................... 15

1.2 Online Support ................................................................................. 16

1.3 Processor ........................................................................................ 16

1.3.1 Graphics Subsystem .............................................................. 17

1.4 System Memory ............................................................................... 19

1.4.1 Memory Configurations .......................................................... 20

1.5 Intel

1.5.1 Direct Media Interface (DMI) .................................................. 22

1.5.2 Display Interfaces ................................................................. 22

1.5.3 USB ..................................................................................... 23

1.5.4 SATA Interfaces .................................................................... 23

1.6 Real-Time Clock Subsystem ............................................................... 24

1.7 Legacy I/O Controller ........................................................................ 24

1.8 Audio Subsystem .............................................................................. 25

1.8.1 Audio Subsystem Software ..................................................... 25

1.8.2 Audio Connectors and Headers ................................................ 26

1.9 LAN Subsystem ................................................................................ 27

1.9.1 Intel

1.9.2 LAN Subsystem Software ....................................................... 28

1.9.3 RJ-45 LAN Connector with Integrated LEDs .............................. 28

1.10 Hardware Management Subsystem ..................................................... 29

1.10.1 Hardware Monitoring ............................................................. 29

1.10.2 Fan Monitoring ...................................................................... 29

1.10.3 Chassis Intrusion and Detection .............................................. 29

1.10.4 Thermal Monitoring ............................................................... 30

1.11 Intel

1.11.1 Intel

1.11.2 Intel

1.11.3 Intel

B75 Express Chipset ................................................................ 22

82579V Gigabit Ethernet Controller ................................ 27

Security and Manageability Technologies .................................... 31

Small Business Technology ............................................ 31

Virtualization Technology .............................................. 31

Virtualization Technology for Directed I/O ....................... 32

vii

Intel Desktop Board DB75EN Technical Product Specification

1.11.4 Intel® Anti-Theft Technology ................................................... 32

1.11.5 Intel

Management Engine (Intel® ME) Software and Drivers ...... 33

1.12 Power Management .......................................................................... 34

1.12.1 ACPI .................................................................................... 34

1.12.2 Hardware Support ................................................................. 36

2 Technical Reference

2.1 Memory Resources ........................................................................... 41

2.1.1 Addressable Memory.............................................................. 41

2.1.2 Memory Map ......................................................................... 43

2.2 Connectors and Headers .................................................................... 43

2.2.1 Back Panel Connectors ........................................................... 44

2.2.2 Component-side Connectors and Headers ................................. 45

2.3 Jumper Block ................................................................................... 55

2.4 Intel

2.5 Mechanical Considerations ................................................................. 57

2.6 Electrical Considerations .................................................................... 58

2.7 Thermal Considerations ..................................................................... 59

2.8 Reliability ........................................................................................ 62

2.9 Environmental .................................................................................. 62

Management Engine BIOS Extension (Intel® MEBX) Reset Header . 56

2.5.1 Form Factor .......................................................................... 57

2.6.1 Power Supply Considerations .................................................. 58

2.6.2 Power Supervisor .................................................................. 59

2.6.3 Fan Header Current Capability ................................................ 59

2.6.4 Add-in Board Considerations ................................................... 59

3 Overview of BIOS Features

3.1 Introduction ..................................................................................... 63

3.2 BIOS Flash Memory Organization ........................................................ 64

3.3 Resource Configuration ..................................................................... 64

3.3.1 PCI Express Autoconfiguration ................................................ 64

3.4 System Management BIOS (SMBIOS) ................................................. 65

3.5 Legacy USB Support ......................................................................... 65

3.6 BIOS Updates .................................................................................. 66

3.6.1 Language Support ................................................................. 66

3.6.2 Custom Splash Screen ........................................................... 67

3.7 BIOS Recovery ................................................................................. 67

3.8 Boot Options .................................................................................... 68

3.8.1 Optical Drive Boot ................................................................. 68

3.8.2 Network Boot ........................................................................ 68

3.8.3 Booting Without Attached Devices ........................................... 68

3.8.4 Changing the Default Boot Device During POST ......................... 68

3.9 Adjusting Boot Speed

................................

3.9.1 Peripheral Selection and Configuration ..................................... 69

3.9.2 BIOS Boot Optimizations ........................................................ 69

3.10 BIOS Security Features ..................................................................... 70

3.11 BIOS Performance Features ............................................................... 71

........................................ 69

viii

Contents

4 Error Messages and Beep Codes

4.1 Speaker .......................................................................................... 73

4.2 BIOS Beep Codes ............................................................................. 73

4.3 Front-panel Power LED Blink Codes ..................................................... 74

4.4 BIOS Error Messages ........................................................................ 74

4.5 Port 80h Power O n Self Test (POST) Codes .......................................... 75

5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance ...................................................................... 81

5.1.1 Safety Standards................................................................... 81

5.1.2 European Union Declaration of Conformity Statement ................ 82

5.1.3 Product Ecology Statements ................................................... 83

5.1.4 China RoHS .......................................................................... 86

5.1.5 EMC Regulations ................................................................... 87

5.1.6 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 89

5.1.7 Regulatory Compliance Marks (Board Level) ............................. 90

5.2 Battery Disposal Information .............................................................. 91

Figures

1. Major Board Components .................................................................. 13

2. Block Diagram .................................................................................. 15

3. Memory Channel and DIMM Configuration ............................................ 21

4. Back Panel Audio Connectors ............................................................. 26

5. LAN Connector LED Locations ............................................................. 28

6. Thermal Sensors and Fan Headers ...................................................... 30

7. Location of the Intel ME “M” State LED ................................................ 33

8. Location of the Standby Power LED ..................................................... 40

9. Detailed System Memory Address Map ................................................ 42

10. Back Panel Connectors ...................................................................... 44

11. Component-side Connectors and Headers ............................................ 45

12. Connection Diagram for Front Panel Header ......................................... 52

13. Connection Diagram for Front Panel USB 2.0 Headers ........................... 54

14. Location of the Jumper Block ............................................................. 55

15. Intel MEBX Reset Header ................................................................... 56

16. Board Dimensions ............................................................................. 57

17. Localized High Temperature Zones ..................................................... 60

18. Intel Desktop Board DB75EN China RoHS Material Self

Declaration Table .............................................................................. 86

Tables

1. Specification Changes or Clarifications ................................................... iii

2. Feature Summary ............................................................................. 11

3. Components Shown in Figure 1 .......................................................... 14

4. Supported Memory Configurations ...................................................... 19

5. Audio Jack Support ........................................................................... 25

Intel Desktop Board DB75EN Technical Product Specification

6. LAN Connector LED States ................................................................. 28

7. Intel ME “M” State LED Behavior ........................................................ 33

8. Effects of Pressing the Power Switch ................................................... 34

9. Power States and Targeted System Power ........................................... 35

10. Wake-up Devices and Events ............................................................. 36

11. System Memory Map......................................................................... 43

12. Component-side Connectors and Headers Shown in Figure 11 ................ 46

13. Serial Port Header ............................................................................ 47

14. Front Panel Audio Header for Intel HD Audio ........................................ 47

15. Front Panel Audio Header for AC ’97 Audio ........................................... 47

16. Front Panel USB 2.0 Headers ............................................................. 47

17. Front Panel USB 3.0 Connector ........................................................... 48

18. SATA Connectors .............................................................................. 48

19. S/PDIF Header ................................................................................. 48

20. Chassis Intrusion Header ................................................................... 49

21. Processor, Front, and Rear Chassis (4-Pin) Fan Headers ....................... 49

22. LPC Debug Header ............................................................................ 49

23. TPM Header ..................................................................................... 49

24. Processor Core Power Connect or ........................................................ 51

25. Main Power Connector ....................................................................... 51

26. Front Panel Header ........................................................................... 52

27. States for a One-Color Power LED ....................................................... 53

28. States for a Two-Color Power LED....................................................... 53

29. Alternate Front Panel Power/Sleep LED Header..................................... 53

30. BIOS Setup Configuration Jumper Settings .......................................... 55

31. Intel MEBX Reset Header Signals ........................................................ 56

32. Recommended Power Supply Current Values (High Power) .................... 58

33. Recommended Power Supply Current Values (Low Power) ..................... 58

34. Fan Header Current Capability ............................................................ 59

35. Thermal Considerations for Components .............................................. 61

36. Tcontrol Values for Components ......................................................... 61

37. Environmental Specifications .............................................................. 62

38. BIOS Setup Program Menu Bar ........................................................... 64

39. BIOS Setup Program Function Keys .................................................... 64

40. Acceptable Drives/Media Types for B IO S Recovery ................................ 67

41. Boot Device Menu Option s ................................................................. 68

42. Supervisor and User Password Functions ............................................. 70

43. BIOS Beep Codes .............................................................................

44. Front-panel Power LED Blink Codes ..................................................... 74

45. BIOS Error Messages ........................................................................ 74

46. Port 80h POST Code Ranges .............................................................. 75

47. Port 80h POST Codes ........................................................................ 76

48. Typical Port 80h POST Sequence ........................................................ 80

49. Safety Standards .............................................................................. 81

50. EMC Regulations ............................................................................... 87

51. Regulatory Compliance Marks ............................................................ 90

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 2 summarizes the major features of the board.

Table 2. Feature Summary

Form Factor

Processor

Memory

Chipset

Graphics

Audio 8-channel (6+2) Intel High Definition Audio via the Realtek* ALC662 audio codec

Micro-ATX (9.60 inches by 9.60 inches [243.84 millimeters by

243.84 millimeters]) generation Intel® Core processor family and 2nd generation Intel® Core

• 3

processor family processors with up to 95 W TDP in an LGA1155 socket

― One PCI Express* 3.0 x16 graphics interface ― Integrated memory controller with dual channe l DDR 3 m emory support ― Integrated graphics process ing (proce s so rs with Intel ― External graphics interface controlle r

• Four 24 0-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets

• Support for DDR3 1600 MHz, DDR3 1333 MHz , a nd DDR3 1066 MHz DIMMs

• Support for 1 Gb, 2 Gb, and 4 Gb memory technology

• Support for up to 32 GB of system memory with four DIMMs using 4 Gb

memory technology

• Support for non-ECC memory

• Support for 1.5 V (standard voltage) and 1.35 V (low voltage) JEDEC memory

• Support for XMP memory

Note: DDR3 1600 MHz DIMMs are only supported by 3 processor family processors

B75 Express Chipset consisting of the Intel® B75 Express Platform

Intel Controller Hub (PCH)

• Integrated graphics support for processors with Intel

― VGA ― DVI-D

• Support for a PCI Express 3.0 x16 add-in graphics card

Note: PCI Express 3.0 is only supporte d by 3

processor family processors

HD Graphics)

generation Intel Core

Graphics Technology:

generation Intel Core

continued

Intel Desktop Board DB75EN Technical Product Specification

One PCI Express 3.0 x16 add-in card connector

Table 2. Feature Summary (continued)

Peripheral Interfaces

Expansion Capabilities

BIOS

Instantly Available PC Technology

LAN Support

Legacy I/O Control Nuvoton NCT6776D I/O controller for PS/2 po r t, serial port, parallel port, and

Hardware Monitor Subsystem

Intel® Security and Manageability Technologies

• Four USB 3.0 ports:

― Two USB 3.0 ports are implemented with stacked back panel connectors

(blue)

― Two front panel USB 3.0 ports are imple mented thro ugh one internal

connector (blue)

• Eight USB 2.0 ports:

― Four ports implemented with stacked back panel connectors (black) ― Four f ro nt p ane l por ts imp le mented through two internal headers

• Five Serial ATA (SATA) ports:

― One SATA 6.0 Gb/s interface through the Intel B75 Express Chipset with

SATA ACHI support (blue)

― Three internal SATA 3.0 Gb/s interfaces through Intel B75 Express Chipset

with SATA ACHI support (black)

― One internal eSATA 3.0 Gb/s inter face (red)

• PS/2*-style keyboard/mouse port

• One serial port header

• One parallel port connector on the back panel

•

• One PCI Express 2.0 x1 bus add-in card connector from the PCH

• Two Conventional PCI bus add-in card connectors from the PCH

Note: PCI Express 3.0 is only supported by 3

family processors

• Intel

BIOS resident in the SPI Flash device

• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play ,

and SMBIOS

• Support for PCI Express Revision 3.0

• Suspend to RAM support

• Wake on PCI, PCI Express, LAN, front panel, PS/2, serial, and USB ports

Gigabit (10/100/1000 Mb/s ) LAN subsystem using the I nte l Ethernet Controller

hardware management support

• Hardware monitoring through the Nuvoton I/O controller

• Voltage sense to detect out of range power supply voltages

• Thermal sense to detect out of range thermal values

• Three fan headers

• Two fan sense inputs used to monitor fan activity

• Fan speed control

• Intel

Small Business Technology (Intel® SBT)

Anti-Theft (Intel® AT)

Virtualization Technology (Intel® VT)

Virtualization for Directed I/O (Intel® VT-d)

generation Intel Core processor

82579V Gigabit

Product Description

1.1.2 Board Layout

Figure 1 shows the location of the major components on Intel Desktop Board DB75EN.

Figure 1. Major Board Components

Intel Desktop Board DB75EN Technical Product Specification

Table 3 lists the components identified in Figure 1.

Table 3. Components Shown in Figure 1

Item/callout from Figure 1 Description

A Conventional PCI add-in card connector B Conventional PCI add-in card connector C PCI Express x1 add-in card conne c to r D PCI Express x16 add-in card connector E Back panel connectors F 12 V processor core voltage connector (2 x 2 pin) G LGA1155 processor socket H Rear chassis fan header I Processor fan header J DIMM 3 (Channel A DIMM 0) K DIMM 1 (Channel A DIMM 1) L DIMM 4 (Channel B DIMM 0) M DIMM 2 (Channel B DIMM 1) N Front chassis fan header O Chassis intrusion header P Low Pin Count (LPC) Debug header Q Trusted Platform Module (TPM) header R Main p ower connector (2 x 12) S Intel® Management Engine BIOS Extension (Intel® MEBX) Reset header T Battery U Piezoelectric speaker V SATA 6.0 Gb/s connector (blue) W eSATA 3.0 Gb/s connector (red) X Alternate front panel power/slee p LED head er Y Fro nt panel header Z Standby power LED AA BIOS Setup configuration jumper block BB SATA 3.0 Gb/s connectors (black) CC Front panel USB 3.0 connector (blue) DD Intel® Management Engine “M” state LED EE Intel B75 Express Chipset FF Front panel USB 2.0 connector GG Front panel USB 2.0 connector HH Serial port connector II S/PDIF out header JJ Front panel audio header KK Internal mono speaker header

1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas of the board.

Product Description

Figure 2. Block Diagram

Intel Desktop Board DB75EN Technical Product Specification

1.2 Online Support

To find information about… Visit this World Wide Web site:

Intel Desktop Board DB75EN http://www.intel.com/products/motherboard/index.htm Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support Available configurations for Intel

Desktop Board DB75EN Supported processors http://processormatch.intel.com

Chipset information http://www.intel.com/products/desktop/chipsets/index.htm BIOS and driver updates http://downloadcenter.intel.com Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-

Integration informatio n http://www.intel.com/support/go/buildit

http://ark.intel.com

025414.htm

1.3 Processor

The board supports 3rd generation Intel Core processor family and 2nd generation Intel Core processo r family processors.

Other processors may be supported in the future. This board supports processors with a maximum wattage of 95 W Thermal Design Power (TDP). The processors listed above are only supported when falling within the wattage requirements of Intel Desktop Board DB75EN. See the Intel web site listed below for the most up-to-date list of supported processors.

For information about… Refer to:

Supported processors http://processormatch.intel.com

CAUTION

Use only the processors listed on the web site above. Use of unsupported processors can damage the board, the processor, and the power supply .

NOTE

This board has specific requirements for providing power to the processor. Refer to Section 2.6.1 on page 58 for information on power supply requirements for this board.

Product Description

1.3.1 Graphics Subsystem

The board supports graphics through either the processor Intel HD Graphics or a PCI Express x16 add-in graphics card.

1.3.1.1 Processor Graphics

The board supports integrated graphics through the Intel® Flexible Display Interface

(Intel

1.3.1.1.1 Intel® High Definition (Intel® HD) Graphics

The Intel HD graphics controller features the following:

• 3D Features

• Video

FDI) for processors with Intel HD Graphics.

 DirectX* 11 (2

generation Intel Core processor family processors support

CS4.0 only) support

 OpenGL* 3.0 support  Shader Model 4.0

 High-Definition content at up to 1080p resolution  Hardware accelerated MPEG-2, VC-1/WMV, and H.264/AVC Hi-Definition video

formats

 Intel

HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick

Sync Video) Note: Intel Quick Sync is enabled with the appropriate software application

 Dynamic Video Memory Technology (DVMT) 5.0 support  Support of up to 1.7 GB Video Memory with 4 GB and above system memory

configuration

Intel Desktop Board DB75EN Technical Product Specification

1.3.1.2 PCI Express x16 Graphics

3rd generation Intel Core processor family processors support PCI Express 3.0, 2.x, and 1.x and 2

generation Intel Core processor family processors support PCI

Express 2.x and 1.x:

• PCI Express 3.0 with a raw bit rate of 8.0 GT/s results in an effective bandwidth of 1 GB/s each direction per lane. The maximum theoretical bandwidth of the x16 interface is 16 GB/s in each direction, simultaneously, for a total bandwidth of 32 GB/s.

• PCI Express 2.x with a raw bit rate of 5.0 GT/s results in an effective bandwidth of 500 MB/s each direction per lane. The maximum theoretical bandwidth of the x16 interface is 8 GB/s in each direction, simultane ously, for a total bandwidth of 16 GB/s.

• PCI Express 1.x with a raw bit rate of 2.5 GT/s results in an effective bandwidth of 250 MB/s each direction per lane. The maximum theoretical bandwidth of the x16 interface is 4 GB/s in each direction, simultane ously, for a total bandwidth of 8 GB/s.

For information about Refer to

PCI Express technology http://www.pcisig.com

Product Description

Capacity

Configuration

Density

Front-side/Back-side

Devices

1024 MB

1 Gbit

128 M x8/empty

2048 MB

1 Gbit

128 M x8/128 M x8

2048 MB

2 Gbit

256 M x8/empty

4096 MB

2 Gbit

256 M x8/256 M x8

8192 MB

4 Gbit

512 M x8/512 M x8

1.4 System Memory

The board has four DIMM sockets and supports the following memory features:

• 1.5 V DDR3 SDRAM DIMMs with gold plated contacts, with the option to raise the voltage to support higher performance DDR3 SDRAM DIMMs.

• 1.35 V Low Voltage DDR3 DIMMs (JEDEC specification)

• Two independent memory channels with interleaved mode support

• Unbuffered, sin gl e-sided or double-sided DIMMs with the following restriction:

DIMMs with x16 organization are not supported.

• 32 GB maximum total system memory (with 4 Gb memory technology). Refer to Section 2.1.1 on page 41 for information on the total amount of addressable memory.

• Minimum recommended total system memory: 1 GB

• Non-ECC DIMMs

• Serial Presence Detect

• DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz SDRAM DIMMs

Note: DDR3 1600 MHz DIMMs ar e only supported by 3

processor family processors

• XMP version 1.3 performance profile support for memory speeds of 1600 MHz or lower

generation Intel Core

NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and pr ogram the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined fr eq u en cy.

Table 4 lists the supported DIMM configurations.

Table 4. Supported Memory Configurations

DIMM

4096 MB SS 4 Gbit 512 M x8/empty 8

Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to

single-sided memory modules (containing one row of SDRAM).

(Note)

SDRAM

SDRAM Organization

Number of SDRAM

Intel Desktop Board DB75EN Technical Product Specification

For information about… Refer to:

Tested Memory http://support.intel.com/support/motherboards/desktop/sb

/CS-025414.htm

1.4.1 Memory Configurations

The 3rd generation Intel Core processor family and 2nd generation Intel Core processor family processors support the following types of memory organization:

• Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used.

• Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the othe r. If different speed DIMMs are used between channels, the slowest memory timing will be used.

• Flex mode. This mode provides the most flexible performance characteristics. The bottommost DRAM memory (the memory that is lowes t within the system memory map) is mapped to dual channel operation; the topm ost DRAM memory (the memory that is nearest to the 8 GB address space limit), if any, is mapped to single channel operation. Flex mode results in multiple zones of dual and single channel operation across the whole of DRAM memory. To use flex mode, it is necessary to populate both channels.

For information about… Refer to:

Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-

011965.htm

Figure 3 illustrates the memory channel and DIMM configuration.

Product Description

Figure 3. Memory Channel and DIMM Configuration

NOTE

For best memory performance always install memory in the blue DIMM sockets if installing only two DIMMs on your board.

Intel Desktop Board DB75EN Technical Product Specification

1.5 Intel® B75 Express Chipset

Intel B75 Express Chipset with Intel Flexible Display Interconnect (Intel FDI) and Direct Media Interface (DMI) interconnect provides interfaces to the processor and the display, USB, SATA, LPC, LAN, and PCI Express interfaces. The Intel B75 Express Chipset is a centralized controller for the board’s I/O paths.

For information about Refer to

The Intel B75 chipset http://www.intel.com/products/desktop/chipsets/index.htm Resources used by the chipset Chapte r 2

1.5.1 Direct Media Interface (DMI)

Direct Media Interface (DMI) is the chip-to-chip connection between the processor and PCH. This high-speed interface integrates advanced priority-based servicing allowing for concurrent traffic and true isochronous transfer capabilities.

1.5.2 Display Interfaces

Display is divided between the processor and the PCH. The processor houses the memory interface, display planes, and pipes while the PCH has transcoder and display interface or ports.

The PCH receives the display data over Intel FDI and transcodes the data as per the display technology protocol and sends the data through the display interface.

1.5.2.1 Intel

Intel FDI connects t he display engine in the processor with the display interfaces on the PCH. The display data from the frame buffer is processed in the display engine of the processor and sent to the PCH over the Intel FDI where it is transcode d a s per the display protocol and driven to the display monitor.

Flexible Display Interconnect (Intel

FDI)

1.5.2.2 Analog Display (VGA)

The VGA port supports analog displays. The maximum suppo rted resolution is 2048 x 1536 (QXGA) at a 75 Hz refresh rate. The VGA port is enabled for POST whenever a monitor is attached, regardless of the DVI-D connector status.

1.5.2.3 Digital Visual Interface (DVI-D)

The DVI-D port supports only digital DVI displays. The maximum supported resolution is 2048 x 1536 at 75 Hz refresh (QXGA). The DVI-D port is compliant with the DVI 1.0 specification.

Product Description

1.5.3 USB

The PCH contains up to two Enhanced Host Controller Interface (EHCI) host controllers that support USB high-speed signaling. High-speed USB 2.0 allows data transfe rs up to 480 Mb/s. All ports are high-speed, fu l l-speed, and low-speed capable.

The PCH also contains an integrated eXtensible Host Controller Interface (xHCI) host controller which supports USB 3.0 ports . T his controller allows data transfers up to 5 Gb/s. The controller supports SuperSpeed (SS), high-speed (HS), full-speed (FS), and low-speed (LS) traffic on the bus.

The board supports up to four USB 3.0 ports and eight USB 2.0 ports. The Intel B75 Express Chipset provides the USB controller for the 2.0/3.0 ports. The

port arrangement is as follows:

• Two USB 3.0 ports are implemented with stacked back panel connectors (b lue)

• Two front panel USB 3.0 ports are implemented through one internal connector

(blue)

• Four USB 2.0 ports are implemented with stacked back panel connectors (black)

• Four USB 2.0 front panel ports are implemented through two internal headers

(black)

NOTE

Computer systems that have an unshielded ca b le a ttached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use a shielded cable that meets the requirements for full-speed devices.

For information about Refer to

The location of the USB connectors on the back panel Figure 10, page 44 The location of the front panel USB headers Figure 11, page 45

1.5.4 SATA Interfaces

The board provides five SATA connectors, through the PCH, which support one device each:

• One SATA 6.0 Gb/s interface through the Intel B75 Express Chipset with SATA ACHI support (blue)

• Three internal Serial ATA (SATA) 3.0 Gb/s interfaces through the Intel B75 Express Chipset with SATA ACHI support (black)

• One internal eSATA 3.0 Gb/s interface (red)

The PCH provides independent SATA ports with a theoretical maximum transfer rate of

6.0 Gb/s for one port and 3.0 Gb/s for four ports. A point-to-point interface is used for

host-to-device connections. The PC H supports the Serial ATA Specification, Revision 3.0. The PCH also supports

several optional sections of th e Serial ATA II: Extensions to Serial ATA 1.0 Specification, Revision 1.0 (AHCI support is required for some elements).

Intel Desktop Board DB75EN Technical Product Specification

The underlying SATA functional ity is transparent to the operating system. The SATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP and Windows 7 operating systems.

NOTE

Many SATA drives use new low-voltage power connectors and require adapters or power supplies equipped with low-voltage power connectors.

For more information, see: http://www.serialata.org/.

For information about Refer to

The location of the SATA connectors Figure 11, page 45

1.6 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket , the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The c lock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied via the power supply 5V STBY rail.

NOTE

If the battery and AC power fail, date and time values will be reset and the user will be notified during the POST.

When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.

1.7 Legacy I/O Controller

The I/O controller provides the following features:

• One serial port

• One back panel parallel port (with Extended Capabilities Port (ECP) and Enhanced

Parallel Port (EPP) support)

• PS/2-style keyboard/mouse interface on the back panel

• Serial IRQ interface compatible with serialized IRQ support for PCI systems

• Intelligent power management, including a program mable wake-up event interface

• Conventional PCI bus power management support

The BIOS Setup program provides configuration options for the I/O controller.

Product Description

1.8 Audio Subsystem

The board supports the Intel® High Definition Audio (Intel® HD Audio) subsystem. The audio subsystem consists of the following:

• Intel B75 Express Chipset

• Realtek ALC662 audio codec

The audio subsystem has the following feat ures:

• Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio por t. The back panel audio jacks are capable of retasking according to the user’s definition, or can be automatically switched depending on the recognized device type.

• Front panel Intel HD Audio and AC ’97 audio support.

• 3-port analog audio out stack.

• A signal-to-noise (S/N) ratio of 95 dB.

• Windows 7 Ultimate certification.

Table 5 lists the supported functions of the front panel and back panel audio jacks.

Table 5. Audio Jack Support

Audio Jack

Front panel – Green Default Front panel – Pink Default Back panel – Blue Default

Back panel – Green (ctrl pane l ) Default

Back panel – Pink Default

Microphone Headphones

Line Out

(Front Spks)

(ctrl panel)

Line In

(Surround)

(ctrl panel)

1.8.1 Audio Subsystem Software

The latest audio software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining audio software and driver s Section 1.2, pa ge 16

Mic-In

(Center/Sub)

(ctrl panel)

Intel Desktop Board DB75EN Technical Product Specification

1.8.2 Audio Connectors and Headers

The board contains audio connectors and headers on both the back panel and the component side of the board. The component-side audio headers include front panel audio (a 2 x 5-pin header that provides mic in and line out signals for front pa nel audio connectors). The available configurable back panel audio connectors are shown in Figure 4.

Item Description

A Line in/surround B Line out/front speakers C Mic in/center/sub

Figure 4. Back Panel Audio Connectors

NOTE

The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.

For information about Refer to

The locations of the front panel audio header and S/PDIF audio he ader Figure 11, page 45 The signal names of the front panel audio header and S/PDIF audio header Section 2.2.2.1, page 47 The back panel audio connectors Section 2.2.1, page 44

1.8.2.1 S/PDIF Header

The S/PDIF header allows connections to coaxial or optical dongles for digital audio output.

1.8.2.2 Internal Mono Speaker Header

The internal mono speaker header allows co nnection to an internal, low-power speaker for basic system sound capability. The subsystem is capable of driving a speaker load of 8 Ohms at 1 W (rms) or 4 Ohms at 1.5 W (rms).

1.9 LAN Subsystem

The LAN subsystem consists of the following:

• Intel 82579V Gigabit Ethernet Controller (10/100/1000 Mb/s)

• Intel B75 Express Chipset

• RJ-45 LAN connector with integrated status LEDs

Additional features of the LAN subsystem include:

• CSMA/CD protocol engine

• LAN connect interface betw een the PCH and the LAN controller

• Conventional PCI bus power m anagement  ACPI technology support  LAN wake capabilities

• ACPI technology support

• LAN wake capabilities

• LAN subsystem software

For information about Refer to

LAN software and drivers http://downloadcenter.intel.com

Product Description

1.9.1 Intel® 82579V Gigabit Ethernet Controller

The Intel 82579V Gigabit Ethernet Controller supports the following features:

• 10/100/1000 BASE-T IEEE 802.3 compliant

• Energy Efficient Ethernet (EEE) IEEE802.3az support (Low Power Idle [LPI] mode)

• Dual interconnect between the Integrated LAN Controller and the Physical Layer

(PHY):

 PCI Express-based interface for active state operation (S0) state  SMBUS for host and management traffic (Sx low power state)

• Compliant to IEEE 802.3x flow control support

• 802.1p and 802.1q

• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)

• Full device driver compatibility

Intel Desktop Board DB75EN Technical Product Specification

1.9.2 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining LAN software and drivers http://downloadcenter.intel.com

1.9.3 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).

Item Description

A Link LED (Green) B Data Rate LED (Green/Yellow)

Figure 5. LAN Connector LED Locations

Table 6 describes the LED states when the board is powered up and the LAN subsystem is operating.

Table 6. LAN Connector LED States

LED LED Color LED State Condition

Off LAN link is not established.

Link Green

Data Rate Green/Yellow

On LAN link is established. Blinking LAN activity is occurring. Off 10 Mb/s data rate is selected. Green 100 Mb/s data rate is selected. Yellow 1000 Mb/s data rate is selected.

Product Description

1.10 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following:

• Thermal and voltage monitoring

• Chassis intrusion detection

1.10.1 Hardware Monitoring

The hardware monitoring and fan control subsystem is based on the Nuvoton NCT6776D device, which supports the following:

• Processor and system ambient temperature monitoring

• Chassis fan speed monitoring

• Power monitoring of +12 V, +5 V, +3.3 V, 3.3 Vstandby, V_SM, +VCCP,

PCH VCC

• SMBus interface

and

1.10.2 Fan Monitoring

Fan monitoring can be implemented using Intel® Desktop Utilities or third-party software.

For information about Refer to

The functions of the fan headers Section 1.12.2.2, page 37

1.10.3 Chassis Intrusion and Detection

The board supports a chassis security featur e that detects if the chassis cover is removed. The security feature uses a mechan ical switch on the chass is that attaches to the chassis intrusion header. When the chassis cover is removed, the mechanical switch is in the closed position.

For information about Refer to

The location of the chassis intrusion header Figure 11, page 45

Intel Desktop Board DB75EN Technical Product Specification

1.10.4 Thermal Monitoring

Figure 6 shows the locations of the thermal sensors and fan headers.

Item Description

A Thermal diode, located on the processor die B Rear chassis fan header C Processor fan header D Front chassis fan header E Thermal d iod e , loc ated on the I nte l B75 PCH

Figure 6. Thermal Sensors and Fan Headers

Product Description

1.11 Intel® Security and Manageability

Technologies

Intel® Security and Manageability Technologies provide tools and resources to help small business owners and IT organizations pr otect and manage their a ssets in a business or institut io n al environment .

NOTE

Software with security and/or manageability capability is required to take advantage of Intel platform security and/or management technologies.

1.11.1 Intel® Small Business Technology

Intel® Small Business Technology (Intel® SBT) provides small businesses with security and productivity capabilities to help keep their PCs up-to-date, protected and running well. Intel SBT is the firmware component of Intel SBA) and includes this hardware functionality:

• Local Maintenance Timer – Enables applications to “wake-up” the host platform when it is powered down or in a sleep state.

• Local Software Monitor – Provides a common reporting mechanism to monitor applications running on the host operating s ystem.

For information about Refer to

Intel Small Business Advantage http://www.intel.com/go/SBA

Small Business Advantage (Intel®

1.11.2 Intel® Virtualization Technology

Intel® Virtualization Technology (Intel® VT) is a hardware-assisted technology that, when combined with software-based virtualization solutions, provides maximum system utilization by consolidating multiple environments into a single server or PC.

NOTE

A processor with Intel VT does not guarantee that virtualization will work on your system. Intel VT requires a computer system with a chipset, BIOS, enabling software and/or operating system, device drivers , and applic ations designed for this feature.

For information about Refer to

Intel Virtualization Technology http://www.intel.com/technology/virtualization/technology.

htm

Intel Desktop Board DB75EN Technical Product Specification

1.11.3 Intel® Virtualization Technology for Directed I/O

Intel® Virtualization Technology for Directed I/O (Intel® VT-d) allows addresses in incoming I/O device memory transactions to be remapped to different host addresses. This provides Virtual Machine Monitor (VMM) software with:

• Improved reliability and security through device isolation using hardware assisted remapping

• Improved I/O performance and availability by direct assignment of devices.

For information about Refer to

Intel Virtualization Technolo gy for Directed I/O

http://www.intel.com/technology/itj/2006/v10i3/2-io/4virtualization-techniques.htm

1.11.4 Intel® Anti-Theft Technology

Intel® Anti-Theft (Intel® AT) provides local, tamper-resistant defense that works like a poison pill that disables the compute r and access to its data even if the operating system (OS) is reimaged, a new hard drive is installed, or the computer is disconnected from the network.

NOTE

No computer system can provide absolute security under all conditions. Intel AT requires the computer system to have an Intel AT-enabled chipset, BIOS, firmware release, software, and an Intel AT-capable Service Provider/ISV application and service subscription. The detection (triggers) , resp onse (actions), and reco ve ry mech an i sm s only work after the Intel AT functionality has been activated and configured. Certain functionality may not be offered by some ISVs or service providers and may not be available in all countries. Intel assumes no liability for lost or stolen data and/or systems or any other damages resulting thereof.

For information about Refer to

Intel Anti-Theft http://antitheft.intel.com/welcome.aspx

Product Description

1.11.5 Intel® Management Engine (Intel® ME) Software

and Drivers

Intel ME software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining Intel ME software and drivers Section 1.2 on page 16

1.11.5.1 Intel Management Engine “M” State LED

The board has a blue-colored Intel ME “M” state LED (see Figure 7). The “M” state is based on Intel ME status, as follows:

• M0 = Intel ME is in full control in S0

• M3 = Intel ME is in full control in S3-S5 for “out of bound” Intel manageability

• Moff = Intel ME is in sleep state after Intel ME timeout has occurred

Table 7 shows expected behavior of the “M” state LED.

Table 7. Intel ME “M” State LED Behavior

Sx/M3 Sx/Moff S0/M0

LED blinks Off On

Figure 7. Location of the Intel ME “M” State LED

Intel Desktop Board DB75EN Technical Product Specification

state…

pressed for

…the system enters this state

(ACPI G0 – working state)

(ACPI G1 – sleeping state)

(ACPI G0 – working state)

(ACPI G2/G5 – Soft off)

(ACPI G1 – sleeping state)

(ACPI G0 – working state)

1.12 Power Management

Power management is implemented at several levels, including:

• Software support through Advanced Configuration and Pow er Interface (ACPI)

• Hardware support:  Power connector  Fan headers  LAN wake capabilities  Instantly Available PC technology  Wake from USB

 Power Management Event signal (PME#) wake-up support  PCI Express WAKE# signal support  Wake from PS/2 devices  Wake from serial port  Wake from S5  +5 V Standby Power Indicator LED

1.12.1 ACPI

ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with this board require s an operating system that provides full ACPI support. ACPI features include:

• Plug and Play (including bus and device enumeration)

• Power management control of individual devices, add-in boards (some add-in

boards may require an ACPI-aware driver), video displays, and hard disk drives

• Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state

• A Soft-off feature that enables the operating system to power-off the compute r

• Support for multiple wake-up events (see Table 10 on page 36)

• Support for a front panel power and sleep mode switch

Table 8 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system.

Table 8. Effects of Pressing the Power Switch

If the system is in this

Off (ACPI G2/G5 – Soft off) On

…and the power switch is

Less than four seconds Power-on

Less than four seconds Soft-off/Standby

More than six seconds Fail safe power-off

(ACPI G0 – working state)

Sleep

Sleep (ACPI G1 – sleeping state)

Less than four seconds Wake-up

More than six seconds Power-off

(ACPI G2/G5 – Soft off)

Product Description

1.12.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state transitions. The operating system p uts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.

Table 9 lists the power states supported by the board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states.

Table 9. Power States and Targeted System Power

Global States Sleeping States

G0 – working state

G1 – sleeping state

G2/S5 S5 – Soft off.

G3 – mechanical off

AC power is disconnected from the computer.

Notes:

1. To tal system power is dependent on the system configuration, including add -in board s and per ipherals powered by the system chassis’ power supply.

2. Dependent on the standby power consumption of wake-up devices used in the sys te m .

S0 – working C0 – working D0 – working

S3 – Suspend to RAM. Context saved to RAM.

S4 – Suspend to disk. Context saved to disk.

Context not saved. Cold boot is required.

No power to the system.

Processor States

No power D3 – no power

No power D3 – no power for

Device States

state.

except for wake-up logic.

wake-up logic, except when provided by battery or external source.

Targeted System Power

Full power > 30 W

Power < 5 W

No power to the system. Service can be performed safely.

(Note 1)

(Note 2)

Intel Desktop Board DB75EN Technical Product Specification

Note 1)

(Note 1)

(Notes 1 and 3)

1.12.1.2 Wake-up Devices and Events

Table 10 lists the devices or specific events that can wake the computer from specific states.

Table 10. Wake-up Devices and Events

These devices/events can wake up the computer… …from this state

Power switch RTC alarm LAN USB S3 PME# signal

WAKE# Serial port S3 PS/2 devices

Notes:

1. S4 implies operating system support only.

2. Wake from S4 and S5 is recommended by Microsoft.

3. PS/2 wake from S5 has a selection in the BIOS to enable wake from a combination key (Alt + Print Screen) or the keyboard power button.

NOTE

S3, S4, S5 S3, S4, S5 S3, S4, S5

S3, S4, S5 S3, S4, S5

S3, S4, S5

(

(Note 1)

The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events.

1.12.2 Hardware Support

CAUTION

Ensure that the power supply provides adeq uate + 5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing o pti ons.

The board provides several power management hardware features, including:

• Power connector

• Fan headers

• LAN wake capabilities

• Instantly Available PC technology

• Wake from USB

• Power Management Event signal (PME#) wake-up support

• PCI Express WAKE# signal support

• Wake from PS/2 devices

• Wake from serial port

• Wake from S5

• +5 V Standby Power Indicator LED

Product Description

LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line.

NOTE

The use of Wake from USB from an ACPI state requires an operating system that provides full ACPI support.

1.12.2.1 Power Connector

ATX12V-compliant power supplies can turn off the system power through system control. When an ACPI -enabled system receives the correct command, the power supply removes all non-standby voltages.

When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu.

For information about Refer to

The location of the main power connector Figure 11, page 45 The signal names of the main power connector Table 25, page 51

1.12.2.2 Fan Headers

The function/operation of the fan headers is as follows:

• The fans are on when the board is in the S0 state

• The fans are off when the board is off or in the S3, S4, or S5 state

• Each fan header is wired to a fan tachometer input of t he hardware monitoring and

fan control ASIC

• All fan headers support closed-loop fan control that can adjust the fan speed or switch the fan on or of f as needed

• All fan headers have a +12 V DC connection

• The fan headers are controlled by Pulse Width Modulation

For information about Refer to

The location of the fan headers Figure 11, page 45 The location of the fan headers and sensors for thermal monitoring Figure 6, page 30

Intel Desktop Board DB75EN Technical Product Specification

1.12.2.3 LAN Wake Capabilities

CAUTION

For LAN wake capabilities, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabi li ti es can damage the power supply.

LAN wake capabilities enable remote wake-up of the computer through a network. The LAN subsystem PCI bus network adapter monitors network traffic at the Media Independent Interface. Upon detecting a Mag ic P a cket* frame, the LAN subsystem asserts a wake-up signal that powers up the computer. Depending on the LAN implementation, the board suppor ts L A N wake capabilities with ACPI in the following ways:

• The PCI Express WAKE# signal

• By Ping

• Magic Packet

• The onboard LAN subsystem

1.12.2.4 Instantly Available PC Technology

CAUTION

For Instantly Available PC technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Availabl e PC technology can damage the power supply.

Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, and the front panel LED is amber if dual colored, or off if single colored.) When signaled by a wake-up device or event, the system quickly returns to its last known wake state. Table 10 on page 36 lists the devices and events that can wake the computer from the S3 state.

The board supports the PCI Bus Power Management Interface Specification. Add-in boards that also support this specification ca n participate in power management and can be used to wake the computer.

The use of Instantly Available PC technology requires operating system support and PCI Express add-in cards and drivers.

Product Description

1.12.2.5 Wake from USB

USB bus activity wakes the computer from an ACPI S3 state.

NOTE

Wake from USB requires the use of a USB peripheral that supports Wake from USB.

1.12.2.6 PME# Signal Wake-up Support

When the PME# signal on the Conventional PCI bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state (with Wake on PME enabled in the BIOS).

1.12.2.7 WAKE# Signal Wake-up Support

When the WAKE# signal on t he PCI Express bus is assert ed, the computer wakes from an ACPI S3, S4, or S5 state.

1.12.2.8 Wake from PS/2 Devices

PS/2 keyboard activity wakes the computer from an AC PI S3, S4, or S5 state. However, when the computer is in an ACPI S4 or S5 state, the only PS/2 activity that will wake the computer is the Alt + Print Screen or the Power Key available only on some keyboards.

1.12.2.9 Wake from Serial Port

Serial port activity wakes the computer from an ACPI S3 state.

1.12.2.10 Wake from S5

When the RTC Date and Time is set in the BIOS, the computer will automatically wake from an ACPI S5 state.

Intel Desktop Board DB75EN Technical Product Specification

1.12.2.11 +5 V Standby Power Indicator LED

The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 8 shows the location of the standby power LED.

CAUTION

If AC power has been switched off and the sta ndby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any a ttached devices.

Figure 8. Location of the Standby Power LED

2 Technical Reference

2.1 Memory Resources

2.1.1 Addressable Memory

The board utilizes 32 GB of addressable system memory. Typically the address space that is allocated for Conventional PCI bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory). On a system that has 32 GB of system memory installed, it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions. The se functions include the following:

• BIOS/SPI Flash device (96 Mbit)

• Local APIC (19 MB)

• Direct Media Interface (40 MB)

• PCI Express configuration space (256 MB)

• PCH base address registers PCI Express ports (up to 256 MB)

• Memory-mapped I/O that is dynamically allocated for Conventional PCI and PCI

Express add-in cards (256 MB)

The board provides the capability to reclaim the physical memory overlapped by the memory mapped I/O logical address space. The board remaps physical memory from the top of usable DRAM boundary to the 4 GB boundary to an equiva lent sized logical address range located just above the 4 GB boundary. Figure 9 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.

Intel Desktop Board DB75EN Technical Product Specification

Figure 9. Detailed System Memory Address Map

2.1.2 Memory Map

Table 11 lists the system memory map.

Table 11. System Memory Map

Technical Reference

Address Range (decimal)

1024 K - 33550336 K 100000 – 7FFC00000 32764 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K E0000 - EFFFF 64 KB Reserved 800 K - 896 K C8000 - DFFFF 96 KB Pote ntia l av a ilable high DOS

640 K - 800 K A0000 - C7FFF 160 KB Video memory a nd BIOS 639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by

512 K - 639 K 80000 - 9FBFF 127 KB Exte nded conventional memory 0 K - 512 K 00000 - 7FFFF 512 KB Conventio na l me mory

Address Range (hex)

Size Description

memory (open to the PCI Conventional bus). Dependent on video adapter used.

memory manager software)

2.2 Connectors and Headers

CAUTION

Only the following connectors and headers have overcurrent protection: back panel and front panel USB, and PS/2.

The other internal connectors and headers are not overcurrent protected and should connect only to dev i ces inside the computer’s chassis, such as fans and int ernal peripherals. Do not use these connectors or headers to power devices external to the computer’s chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves.

Furthermore, improper connection of USB header single wire connectors may eventually overload the overcurrent protection and cause damage to the board.

This section describes the board’s connectors. The connectors can be divided into these groups:

• Back panel I/O connectors

• Component-side connectors and headers (see page 45)

Intel Desktop Board DB75EN Technical Product Specification

2.2.1 Back Panel Connectors

Figure 10 shows the location of the back panel connectors for the board.

Item Description

A PS/2 port B USB 2.0 ports C USB 2.0 ports D VGA connector E Parallel port F DVI-D connector G LAN port H USB 3.0 ports I Line in/surround J Line ou t/ front speakers K Mic-in/center/subwoofer

Figure 10. Back Panel Connectors

NOTE

The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.

Technical Reference

2.2.2 Component-side Connectors and Headers

Figure 11 shows the locations of the component-side connectors and headers.

Figure 11. Component-side Connectors and Headers

Intel Desktop Board DB75EN Technical Product Specification

Table 12 lists the component-side connectors and headers identified in Figure 11.

Table 12. Component-side Connectors and Headers Shown in Figure 11

Item/callout f rom Figure 11 Description

A Conventional PCI add-in card connector B Conventional PCI add-in card connector C PC I Express x1 add-in card connector D PCI Express x16 add-in card connector E 12 V pr oce s so r core vo lta g e connec tor (2 x 2 pin) F Rear chassis fan header G Processor fan header H Front chassis fan header I Chassis intrusion header J LPC Debug header K TPM header L Main power connector (2 x 12) M Intel MEBX reset header N SATA 6.0 Gb/s connector (blue) O eSATA 3.0 Gb/s connector (red) P A l te r na te front p a ne l power/s le e p LED header Q Front panel header R SA T A 3.0 conne c tor s (b lack) S Front panel USB 3.0 connector (blue) T Fro nt panel USB 2.0 header U Front panel USB 2.0 header V Serial port header W S/PDIF out header X Front panel audio header Y I nte rnal mono speaker header

Technical Reference

2.2.2.1 Signal Tables for the Connectors and Headers

Table 13. Serial Port Header

Pin Signal Name Pin Signal Name

1 DCD (Data Carrier Detect) 2 RXD# (Receive Data ) 3 TXD# (Transmit Data) 4 DTR (Data Terminal Ready) 5 Ground 6 DSR (Data Set Ready) 7 RTS (Reques t To Send ) 8 CTS (Clear To Send) 9 RI (Ring Indicator) 10 Ke y (no pin)

Table 14. Front Panel Audio Header for Intel HD Audio

Pin Signal Name Pin Signal Name

1 [Port 1] Left channe l 2 Ground 3 [Port 1] Right c hanne l 4 PRESENCE# (Dongle present) 5 [Port 2] R ight c hanne l 6 [Port 1] SENSE_RETURN 7 SENSE_SEN D (Jack d e tection) 8 Key (no p in) 9 [Port 2] Left channe l 10 [Port 2] SENSE_RETURN

Table 15. Front Panel Audio Header for AC ’97 Audio

Pin Signal Name Pin Signal Name

1 MIC 2 AUD_GND 3 MIC_BIAS 4 AUD_GND 5 FP_OUT_R 6 FP_RETURN_R 7 AUD_5V 8 KEY (no pin) 9 FP_OUT_L 10 FP_RETURN_L

Table 16. Front Panel USB 2.0 Headers

Pin Signal Name Pin Signal Name

1 +5 V DC 2 +5 V DC 3 D- 4 D5 D+ 6 D+ 7 Ground 8 Ground 9 KEY (no pin) 10 No Connect

Intel Desktop Board DB75EN Technical Product Specification

Table 17. Front Panel USB 3.0 Connector

Pin Signal Name Description

1 Vbus Power 2 IntA_P1_SSRX− USB3 ICC Port1 SuperSpeed Rx− 3 IntA_P1_SSRX+ USB3 ICC Port1 S u perSpeed Rx+ 4 GND Ground 5 IntA_P1_SSTX− USB3 ICC Port1 SuperSpeed Tx− 6 IntA_P1_SSTX+ USB3 ICC Port 1 Su p erSpeed Tx+ 7 GND Ground 8 IntA_P1_D− USB3 ICC Port1 D− (USB2 Signal D−) 9 IntA_P1_D+ USB3 ICC Port1 D+ (USB2 Signal D+) 10 ID Over Current Protection 11 IntA_P2_D+ USB3 ICC Port2 D+ (USB2 Signal D+) 12 IntA_P2_D− USB3 ICC Port2 D− (USB2 Signal D−) 13 GND Ground 14 IntA_P2_SSTX+ USB3 ICC Port2 SuperS p eed Tx+ 15 IntA_P2_SSTX− USB3 ICC Port2 SuperSpeed Tx− 16 GND Ground 17 IntA_P2_SSRX+ USB3 ICC Port2 SuperSpee d Rx+ 18 IntA_P2_SSRX− USB3 ICC Port2 SuperSpe ed Rx+ 19 Vbus Power 20 Key No pin

Table 18. SATA Connectors

Pin Signal Name

1 Ground 2 TXP 3 TXN 4 Ground 5 RXN 6 RXP 7 Ground

Table 19. S/PDIF Header

Pin Signal Name

1 Ground 2 S/PDIF out 3 Key (no pin) 4 +5 V DC

Table 20. Chassis Intrusion Header

Pin Signal Name

1 Intruder# 2 Ground

Table 21. Processor, Front, and Rear Chassis

(4-Pin) Fan Headers

Pin Signal Name

1 Ground 2 +12 V 3 FAN_TACH 4 FAN_CONTROL

Note: These fan headers use Pulse Width Modulation control for fan speed.

(Note)

Technical Reference

Table 22. LPC Debug Header

Pin Signal Name Pin Signal Name

1 CK_33M_DEBUG 2 GND 3 PLTRST# 4 LFRAME# 5 LAD0 6 LAD1 7 LAD2 8 LAD3 9 GND 10 GND 11 +3.3 V 12 +3.3 V 13 Key (no pin) 14 +3.3 V

Table 23. TPM Header

Pin Signal Name Pin Signal Name

1 PCICLK 2 GND 3 FRAME 4 Key (no pin) 5 PCIRST 6 N/C 7 LAD3 8 LAD2 9 VCC3 10 LAD1 11 LAD0 12 GND 13 N/C 14 N/C 15 3VSB 16 SERIRQ 17 GND 18 CLKRUN 19 PWRDWN 20 N/C

Intel Desktop Board DB75EN Technical Product Specification

2.2.2.2 Add-in Card Connectors

The board has the following add-in card connectors:

• One PCI Express x16 (3.0/ 2.x/ 1.x)

• One PCI Express x1 (2.x/1.x)

• Two Conventional PCI (rev 2.3)

Note the following considerations for th e Conventional PCI bus connectors:

• The Conventional PCI bus connectors are bus master capable.

• SMBus signals are routed to the Conventional PCI bus connectors. This enables

Conventional PCI bus add-in boards with SMBus support to access sensor data on the desktop board. The specific SMBus signals are as follows:

 The SMBus clock line is connected to pin A40.  The SMBus data line is connected to pin A41.

NOTE

PCI Express 3.0 is only supported by 3rd generation Intel Core processor family processors.

Technical Reference

2.2.2.3 Power Supply Connectors

The board has the following power supply connectors:

• Main power – a 2 x 12 connector. This connector is compatible with 2 x 1 0 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, attach that cable to the main power connector, leaving pins 11, 12, 23, and 24 unconnected.

• Processor core power – a 2 x 2 connector. This connector provides power directly to the processor voltage re gulator and must always be used. Failure to do so will prevent the board from booting.

Table 24. Processor Core Power Connector

Pin Signal Name Pin Signal Name

1 Ground 2 Ground 3 +12 V 4 +12 V

Table 25. Main Power Connector

Pin Signal Name Pin Signal Name

1 +3.3 V 13 +3.3 V 2 +3.3 V 14 -12 V 3 Ground 15 Ground 4 +5 V 16 PS-ON# (power supply remote on/off) 5 Ground 17 Ground 6 +5 V 18 Ground 7 Ground 19 Ground 8 PWRGD (Power Good) 20 No connect 9 +5 V (Standby) 21 +5 V 10 +12 V 22 +5 V 11 12

Note: When using a 2 x 10 power supply cable, this pin will be unconnected.

+12 V 2 x 12 connector detect

(Note)

23 24

(Note)

+5 V Ground

(Note)

For information about Refer to

Power supply considerations Section 2.6.1 on page 58

Intel Desktop Board DB75EN Technical Product Specification

2.2.2.4 Front Panel Header

This section describes the functions of t he front panel header. Table 26 lists the signal names of the front panel header. Figure 12 is a connection diagram for the front panel header.

Table 26. Front Panel Header

Pin Signal Name Description Pin Signal Name Description

1 HDD_POWER_LED Pull-up resistor

(750 Ω) to +5V

3 HDD_LED# [Out] Hard disk

activity LED 5 GROUND Ground 6 POWER_SWITCH# [In] Power switch 7 RESET_SWITCH# [In] Reset switch 8 GROUND Ground 9 +5V_DC Power 10 Key No pin

2 POWER_LED_MAIN [Out] Front panel LED

(main color)

4 POWER_LED_ALT [Out] Front panel LED

(alt color)

Figure 12. Connection Diagram for Front Panel Header

2.2.2.4.1 Hard Drive Activity LED Header

Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires a SATA hard drive or optical drive connected to an onboard SATA connector.

2.2.2.4.2 Reset Switch Header

Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST.

Technical Reference

2.2.2.4.3 Power/Sleep LED Header

Pins 2 and 4 can be conne cted to a one- or two-color LED. Table 27 shows the possible states for a one-color LED. Table 28 shows the possible states for a two-color LED.

Table 27. States for a One-Color Power LED

LED State Description

Off Power off/sleeping Steady Green Running

Table 28. States for a Two-Color Power LED

LED State Description

Off Power of f Steady Green Running Steady Yellow Sleeping

NOTE

The colors listed in Table 27 and Table 28 are suggested colors only. Actual LED colors are chassis-specific.

2.2.2.4.4 Power Switch Header

Pins 6 and 8 can be conne cted to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off. (The time requirement is due to internal debounce circuit ry on the board.) At least two seconds must pass before the power supply will recognize another on/off signal.

2.2.2.5 Alternate Front Panel Power/Sleep LED Header

Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel header.

Table 29. Alternate Front Panel Power/Sleep LED Header

Pin Signal Name Description

1 POWER_LED_MAIN [Out] Front panel LED (main color) 2 Key (no pin) 3 POWER_LED_ALT [Out] Front panel LED (alt color)

Intel Desktop Board DB75EN Technical Product Specification

2.2.2.6 Front Panel USB 2.0 Headers

Figure 13 is a connection diagram for the front panel USB 2.0 headers.

NOTE

• The +5 V DC power on the USB headers is fused.

• Use only a front panel USB connector that conforms to the USB 2.0 specification for

high-speed USB devices.

Figure 13. Connection Diagram for Front Panel USB 2.0 Headers

Technical Reference

2.3 Jumper Block

CAUTION

Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged.

Figure 14 shows the location of the jumper b lo ck. The 3-pin jumper block determines the BIOS Setup program’s mode. Table 30 describes the jumper settings for the three modes: normal, configure, and recovery. When the jumper is set to configure mode and the computer is powered-up, the BIOS compares the processor version and the microcode version in the BIOS and reports if the two match.

Figure 14. Location of the Jumper Block

Table 30. BIOS Setup Configuration Jumper Settings

Function/Mode Jumper Setting Configuration

Normal

Configure

Recovery

1-2

2-3

None

The BIOS uses current configuration information and passwords for booting.

After the POST runs, Setup runs automatically. The maintenance menu is displayed.

Note that this Configure mode is the only way to clear the BIOS/CMOS settings. Press F9 (restore defaults ) w hile in Configure mode to restore the BIOS/CMOS settings to their default values.

The BIOS attempts to recover the BIOS configuration. A recovery CD or flash drive is required.

Intel Desktop Board DB75EN Technical Product Specification

2.4 Intel® Management Engine BIOS Extension

(Intel

The Intel® MEBX reset header (see Figure 15) allows you to reset the Intel ME configuration to the factory defaults. Momentarily shorting pins 1 and 2 with a jumper (not supplied) will accomplish the following:

• Return all Intel ME parameters to their default values.

• Reset the Intel MEBX password to the default value (admin).

CAUTION

Always turn off the power and unplug the power cord from the computer before installing an MEBX reset jumper. The jumper must be removed before reapplying power. The system must be allowed to reach end of POST before reset is complete. Otherwise, the board could be damaged.

NOTE

After using the MEBX Reset, a “CMOS battery failure” warning will occur during the next POST. This is expected and does not indicate a component failure.

MEBX) Reset Header

Table 31. Intel MEBX Reset Header Signals

Pin Function

1 PCH_RTCRST_PULLUP 2 Ground 3 No connection

Figure 15. Intel MEBX Reset Header

Technical Reference

2.5 Mechanical Considerations

2.5.1 Form Factor

The board is designed to fit into an ATX-form-factor chassis. Figure 16 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 9.60 inches by 9.60 inches [243.84 millimeters by

243.84 millimeters]. Location of the I/O co nnectors and mounting holes are in compliance w ith the ATX specification.

Figure 16. Board Dimensions

Intel Desktop Board DB75EN Technical Product Specification

2.6 Electrical Considerations

2.6.1 Power Supply Considerations

CAUTION

The +5 V standby line from the power supply must be capa b le of providing adequate +5 V standby current. Failure to do so can damage the power s upp ly. The total amount of standby current require d depends on the wake devices supported and manufacturing options.

Additional power required will depend on configurations chosen by the integrator. The power supply must comply with the indicated parameters of the ATX form factor

specification.

• The potential relation between 3.3 V DC and +5 V DC pow er rails

• The current capability of the +5 VSB line

• All timing parameters

• All voltage tolerances

For example, for a high power system consisting of a supported 95 W processor (see Section 1.3 on page 16 for a list of supported processors), 4 GB DDR3 RAM, one high end video card, one hard disk drive, one optical d rive, and all board peripherals enabled, the minimum recommended power supply is 460 W. Table 32 lists possible recommended power supply current rail values.

Table 32. Recommended Power Supply Current Values (High Power)

Output Voltage 3.3 V 5 V 12 V1 12 V2 -1 2 V 5 VSB Current 22 A 20 A 20 A 20 A 0. 3 A 2.5 A

For example, for a l ow p owe r system consisting of a supported 45 W processor (see Section 1.3 on page 16 for a list of supported processor s), 2 GB DDR3 RAM, integrated graphics, one SSD, one optical drive, and no extra onboard peripherals enabled, the minimum recommended power supply is a 320 W. Table 33 lists possible recommended power supply current rail values. Note: If the correct power supply and system configuration is used, a smaller power supply will work.

Table 33. Recommended Power Supply Current Values (Low Power)

Output Voltage 3.3 V 5 V 12 V1 12 V2 -1 2 V 5 VSB Current 20 A 20 A 15 A 15 A 0.3 A 1.5 A

For information about Refer to

Selecting an appropriate power s upply http://support.intel.com/support/motherboards/desktop/sb

/CS-026472.htm

Technical Reference

2.6.2 Power Supervisor

This board supports a version of the Power Superv isor feature which adds protection to the 5 VSB power rail by limiting potential electrical overstress events to a nondestructive level.

2.6.3 Fan Header Current Capability

CAUTION

The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the p rocessor fan to a chassis fan header may result in onboard component damage that will halt fan operation.

Table 34 lists the current capability of the fan headers.

Table 34. Fan Header Current Capability

Fan Header Maximum Available Current

Processor fan 2.0 A Front chassis fan 1.5 A Rear chassis fan 1.5 A

2.6.4 Add-in Board Considerations

The board is designed to provide 2 A (average) of current for each add-in board from the +5 V rail. The total +5 V current draw for add-in boards for a fully loaded board (all three expansion slots filled) must not exceed the system’s power supply +5 V maximum current or 14 A in total.

2.7 Thermal Considerations

CAUTION

A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is a requirement. Use a processor heat sink that provides omni-directional airflow to maintain required airflow across the processor voltage reg u lator area.

CAUTION

Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website:

http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm

All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance.

Intel Desktop Board DB75EN Technical Product Specification

CAUTION

Ensure that the ambient temperature does not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.9.

CAUTION

Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area (shown in Figure 17) can reach a temperature of up to 120 an open chassis.

Figure 17 shows the locations of the localized high temperature zones.

C in

Figure 17. Localized High Temperature Zones

Item Description

A Pro c ess or voltag e regulator area B Processor C Intel B75 Express Chipset

Technical Reference

For information about

Refer to

Table 35 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board.

Table 35. Thermal Considerations for Components

Component Maximum Case Temperature

Processor For processor case temperature, see processor datasheets and

processor specification updates

Intel B75 Express Chipset 104 oC

To ensure functionality and reliability, the component is specified for proper operation when Case Temperature is maintained at or below the maximum temperature listed in Table 35. This is a requirement for sustained power dissipation equal to Thermal Design Power (TDP is specified as the maximum sustainable power to be dissipated by the components). When the component is dissipating less than TDP, the case temperature should be below the Maximum Case Temperature. The surface temperature at the geometric center of the compone nt corresponds to Case Temperature.

It is important to note that the temperature measurement in the system BIOS is a value reported by embedded thermal sensors in the components and does not directly correspond to the Maximum Case Temperature. The upper operating limit when monitoring this thermal sensor is Tcontrol.

Table 36. Tcontrol Values for Components

Component Tcontrol

Processor For processor case temperature, see processor datasheets and

processor specification updates

Intel B75 Express Chipset 104 oC

Processor datasheets and specification updates Section 1.2, page 16 Intel B75 Express Chipset http://www.intel.com/products/desktop/

chipsets/

Intel Desktop Board DB75EN Technical Product Specification

2.8 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Issue 2; Method I Cas e 3 50% electrical stress, 50 ºC ambient. The MTBF prediction is used to estimate repair rates and spare pa rts requirements. The MTBF data is calculated from predicted data at 50 ºC. The MTBF for the Intel Desktop Board DB75EN is 281,462 hours.

2.9 Environmental

Table 37 lists the environmental specifications for the board.

Table 37. Environmental Specifications

Parameter Specification Temperature

Non-Operating Operating Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches/s² Packaged Half sine 2 millisecond Product Weight (pounds) Free Fall (inches) Veloc ity Cha nge (inc he s /s ²) <20 36 167 21-40 30 152 41-80 24 136 81-100 18 118 Vibration Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz 20 Hz to 500 Hz: 0.02 g² Hz (flat) Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat) 40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz

-20 °C to +70 °C 0 °C to +55 °C

3 Overview of BIOS Features

3.1 Introduction

The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug and Play support.

The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as ENB7510H.86A.

When the BIOS Setup configuration jumper is set to configure mode and the computer is powered-up, the BIOS compares the CPU version and the microcode version in the BIOS and reports if the two match.

The BIOS Setup program can be used to view and change the BIOS settings for the computer. The BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST) memory test begins and before the operating system boot begins. The menu bar is shown below.

Maintenance Main Configuration Performance Security Power Boot Exit

NOTE

The maintenance menu is d isplayed only when the board is in configure mode. Section 2.3 on page 55 shows how to put the board in configure mode.

Intel Desktop Board DB75EN Technical Product Specification

Table 38 lists the BIOS Setup program menu features.

Table 38. BIOS Setup Program Menu Bar

Maintenance Main

Clears passwords and displays processor information

Displays processor and memory configuration

Configuration

Configures advanced features available through the chipset

Performance Security Power

Configures Memory, Bus and Processor overrides

Sets passwords and security features

Table 39 lists the function keys available for menu screens.

Table 39. BIOS Setup Program Function Keys

BIOS Setup Program Function Key

<←> or <→> <↑> or <↓> <Tab> Se le c ts a field (Not im p le mente d ) <Enter> Executes command or selects the submenu <F9> Load the default configuration values for the current menu <F10> Save the current values and exits the BIOS Setup program <Esc> Exits the menu

Description

Selects a different menu screen (Moves the cursor left or right) Selects an item (Moves the cursor up or down)

Configures power management features and power supply controls

Boot

Selects boot options

Exit

Saves or discards changes to Setup program options

3.2 BIOS Flash Memory Organization

The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 96 Mbit (12288 KB) flash memory device.

3.3 Resource Configuration

3.3.1 PCI Express Autoconfiguration

The BIOS can automatically configure PCI Express devices. PCI Express devices may be onboard or add-in cards. Autoconfiguration lets a user insert or remove PCI Express cards without having to configure the system. When a user turns on the system after adding a PCI Express card, the BIOS automatically configures interrupts, the I/O space, and other system resources. Any interrupts set to Available in Setup are considered to be available for use by the add-in card.

Overview of BIOS Features

3.4 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI ) compliant method for managing computers in a managed network.

The main component of SMBIOS is the Management Inf ormation Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administra tor can obtain the system types, capabilities, operational status, and installation dates for system components. The MIF database defines the data and provides the method for accessing this information. The BIOS enables applications such as third-party management software to use SMBIOS. The BIOS stores and reports the following SMBIOS information:

• BIOS data, such as the BIOS revision level

• Fixed-system data, such as peripherals, serial numbers, and asset tags

• Resource data, such as memory size, cache size, and processor speed

• Dynamic data, such as event detection and error logging

Non-Plug and Play operating systems require an additional interface for obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such operating systems. Using this support, an SMBIOS service-level application running on a non-Plug and Play operating system can obtain the SMBIOS information. Additional board information c an be found in the BIOS under the Additional Information header under the Main BIOS page.

3.5 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled.

Legacy USB supp o rt op erates as follows:

1. When you apply power to the computer, legacy support is disabled.

2. POST begins.

3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to

enter and configure the BIOS Setup progr a m and the m ainte nance menu.

4. POST complet es.

5. The operating system loads. While the o perating system is loading, USB

keyboards and mice are recognized and may be use d to co nfigure the operating system. (Keyboards and mice are not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup program.)

6. After the operating system loads the USB drivers , all legacy and non-legacy USB

devices are recognized by the operating system, and Legacy USB support from the BIOS is no longer used.

7. Additional USB legacy feature options can be access by using Intel

Toolkit.

Integrator

Intel Desktop Board DB75EN Technical Product Specification

To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system’s instal la tion ins t r u ctions.

3.6 BIOS Updates

The BIOS can be updated us ing either of the following utilities, which are available on the Intel World Wide Web site:

• Intel

Both utilities verify that the updated BIOS matches the target system to prevent accidentally installing an incompatible BIOS.

Express BIOS Update utility, which enables a utomated updating while in the Windows environment . Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from the file location on the Web.

Flash Memory Update Utility, which requires booting from DOS. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM.

NOTE

Review the instructions distributed with the upgrade util ity before attempting a BIOS update.

For information about Refer to

BIOS update utilities http://support.intel.com/support/motherboards/desktop/sb

/CS-022312.htm.

3.6.1 Language Support

The BIOS Setup program and help messages are supported in US English. Check the Intel web site for support.

Overview of BIOS Features

3.6.2 Custom Splash Screen

During POST, an Intel® splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen.

NOTE

If you add a custom splash screen, it will share space with the Intel branded logo.

For information about

Intel Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/ Additional Intel® software tools http://developer.intel.com/design/motherbd/software.htm

Refer to

3.7 BIOS Recovery

It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS could be damaged. Table 40 lists the drives and media types that can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootable.

Table 40. Acceptable Drives/Media Types for BIOS Recovery

Media Type Can be used for BIOS recovery?

CD-ROM drive connected to the SATA interface Yes USB removable drive (a USB Flash Drive, for example) Yes USB diskette drive (with a 1.44 MB diskette) No USB hard disk drive No

For information about Refer to

BIOS recovery http://www.intel.com/support/motherboards/desktop/sb/

cs-023360.htm

Intel Desktop Board DB75EN Technical Product Specification

3.8 Boot Options

In the BIOS Setup program, the user can choose to boot from a hard drive, optical drive, removable drive, or the network. The default setting is for the optical drive to be the first boot device, the hard drive second, removable drive third, and the network fourth.

3.8.1 Optical Drive Boot

Booting from the optical drive is supported in compliance to the El Torito bootable CD-ROM format specification. Under the Boot menu in the BIO S Setup p rogram, the optical drive is listed as a boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD in the optical drive, the system will attempt to boot from the next defined drive.

3.8.2 Network Boot

The network can be selected as a boot device. This selection allows booting from the onboard LAN or a network add-in card with a remote boot ROM installed.

Pressing the <F12> key during POST automatically fo rces booting from the LAN. To use this key during POST, the User Access Level in the BIOS Setup program's Security menu must be set to Full.

3.8.3 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present:

• Video adapter

• Keyboard

• Mouse

3.8.4 Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a boot dev ice menu to be displayed. This menu display s the list of a vailable boot devices. Table 41 lists the boot device menu options.

Table 41. Boot Device Menu Options

Boot Device Menu Function Keys Description

<↑> or <↓> <Enter> Exits the menu, and boots from the selected device <Esc> Exits the menu and boots according to the boot priority

Selects a default boot device

defined through BIOS setup

Overview of BIOS Features

3.9 Adjusting Boot Speed

These factors affect system boot speed:

• Selecting and configuring peripherals properly

• Optimized BIOS boot parameters

• Enabling the Fast Boot feature

3.9.1 Peripheral Selection and Configuration

The following techniques help improve system boot speed:

• Choose a hard drive with parameters such as “power-up to data ready” in less than eight seconds that minimizes hard drive startup delays.

• Select a CD-ROM drive with a fast initialization rat e. This rate can influence POST execution time.

• Eliminate unnecessary add-in adapter features, such as logo displays, screen repaints, or mode changes in POST. These features may add time to the boot process.

• Try different monitors. Some monitors in itiali ze and communicate with the BIOS more quickly, which enables the system to boot more quickly.

3.9.2 BIOS Boot Optimizations

Use of the following BIOS Setup program settings reduces the POST execution time.

• In the Boot menu, enable the settings for Fast Boot. This option will all ow BIOS to skip through various stages of POST and boot quickly to the last detected boot device.

• In the Boot Menu, set the hard disk drive as the first boot device. As a result, the POST does not first seek a diskette drive, which saves about one second from the POST execution time.

• In the Peripheral Configuration submenu, disable the LAN device if it will not be used. This can reduce up to four seconds of option ROM boot time.

NOTE

It is possible to optimize the boot process to the point where the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo scre ens and POST messages cannot be seen.

This boot time may be so fast that some drives might be not be initialized at all. If this condition should occur, it is possible to introduce a programmable delay ranging from zero to 30 seconds by 5 second increments (using the Hard Disk Pre-Delay feature of the Advanced Menu in the Drive Confi g uration Submenu of the BIOS Setup program).

Intel Desktop Board DB75EN Technical Product Specification

Password

3.10 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions:

• The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode.

• The user password gives restricted access to view and change Setup options i n the BIOS Setup program. This is the user mode.

• If only the supervisor password is set, pressing the <Enter> key at the password prompt of the BIOS Setup program allows the user restricted access to Setup.

• If both the supervisor and user passwords are set, users can enter either the supervisor password or the user password to access Setup. Users have access to Setup respective to which password is entered.

• Setting the user password restricts who can boot the computer. The password prompt will be displayed before the computer is booted. If only the supervisor password is set, the computer boots without ask ing for a password. If both passwords are set, the user can enter either password to boot the computer.

• For enhanced security, use different passwords for the supervisor and user passwords.

• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 16 characters in length.

Table 42 shows the effects of setting the supervisor password and user password. This table is for reference only and is not displayed on the screen.

Table 42. Supervisor and User Password Functions

Password Set

Neither Can c hang e all

Supervisor only

User only N/A C an c hange all

Supervisor and user set

Note: If no password is set, any user can change all Setup options.

Supervisor Mode

options Can change all

options

Can change all options

(Note)

User Mode

Can change all options

Can change a limited number of options

options Can change a

limited number of options

(Note)

Setup Options

None None None

Supervisor Password Supervisor None

Enter Password Clear User Password

Supervisor Password Enter Password

to Enter Setup

User User

Supervisor or user

During Boot

Supervisor or user

Overview of BIOS Features

NOTE

The BIOS complies with NIST Special Publication 800-147 BIOS Protection Guidelines / Recommendations of the National Institute of Standards and Te chnology. Refer to

http://csrc.nist.gov/publications/nistpubs/800-147/NIST-SP800-147-April2011.pdf for

more information.

3.11 BIOS Performance Features

The BIOS includes the following options to p rovide custom performance enhancements when using 3 processor family processors in an LGA1155 socket.

• Processor Maximum Non-Turbo Ratio (processor multiplier can only be adjusted down)

• Memory multiplier adjustment

• Memory voltage adjustment

• Graphics multiplier adjustment

generation Intel Core processor family and 2nd generation Intel Core

Intel Desktop Board DB75EN Technical Product Specification

4 Error Messages and Beep Codes

4.1 Speaker

The board-mounted speaker provides audible error code (beep code) information during POST.

For information about Refer to

The location of the onboard speaker Figure 1, page 13

4.2 BIOS Beep Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s speaker to beep an error message describing the problem (see Table 43).

Table 43. BIOS Beep Codes

Type Pattern Frequency

F2 Setup/F10 Boot Menu Prompt

BIOS update in progress None Video err or On-off (1.0 second each) two times, then

Memory error On-off (1.0 second each) three times, the n

Thermal trip warning Alternate high and low beeps (1.0 second each)

One 0.5 second beep when BIOS is ready to accept keyboard input

2.5-second pause (off), entire pattern repeats (beeps and pause) once and the BIOS will continue to boot.

2.5-second pause (off), entire pattern repeats (beeps and pause) until the system is powered off.

for eight beeps, followed by system shut down.

932 Hz

932 Hz When no VGA option ROM is found.

932 Hz

High beep 2000 Hz Low beep 1500 Hz

Intel Desktop Board DB75EN Technical Product Specification

4.3 Front-panel Power LED Blink Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 44).

Table 44. Front-panel Power LED Blink Codes

Type Pattern Note

F2 Setup/F10 Boot Menu Prompt

BIOS update in progress Off when the update begins, then on for

Video err or On-off (1.0 second each) two times, then

Memory error On-off (1.0 second each) three times, the n

Thermal trip warning Each beep will be accompanied by the follo wing

None

0.5 seconds, then off for 0.5 seconds. The pattern repeats until the BIOS update is complete.

2.5-second pause (off), entire pattern repeats (blink and pause) until the system is powered off.

2.5-second pause (off), entire pattern repeats (blinks and pause) until the system is powered off.

blink pattern: .25 seconds on, .25 seconds off, .25 seconds on, .25 seconds off. This will result in a total of 16 blinks.

When no VGA option ROM is found.

4.4 BIOS Error Messages

Table 45 lists the error messages and provides a brief description of each.

Table 45. BIOS Error Messages

Error Message Explanation

CMOS Battery Low The battery may be losing power. Replace the battery soon. CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been

corrupted. Run Setup to reset values.

Memory Size Decreased Memory size has decreased since the last boot. If no memory

was removed, then memory may be bad.

No Boot Device Available System did not find a device to boot.

Error Messages and Beep Codes

4.5 Port 80h Power On Self Test (POST) Codes

During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred.

Displaying the POST codes on a medium such as a seven-segment display, requires a POST card that can interface with the Low Pin Count (LPC) Debug header or a POST card that can be insta l led in one of the Conventional PCI connectors. Refer to the location of the LPC Debug header in Figure 1.

The following tables provide information about the POST codes generated by the BIOS:

• Table 46 lists the Port 80h POST code ranges

• Table 47 lists the Port 80h POST codes themselves

• Table 48 lists the Port 80h POST sequence

NOTE

In the tables listed above, all POST codes and range values are listed in hexadecimal.

Table 46. Port 80h POST Code Ranges

Range Subsystem

0x00 – 0x05 Entering SX states S0 to S5. 0x10, 0x20, 0 x30,

0x40, 0x50 0x08 – 0x0F Secur ity (S EC ) phase 0x11 – 0x1F PEI phase pre MRC execution 0x21 – 0x29 MRC Memory detection 0x2A – 0x2F PEI phase post MRC execution 0x31 – 0x35 Recovery 0x36 – 0x3F Platfor m DX E driv er 0x41 – 0x4F CPU Initialization (PEI, DXE, SMM) 0x50 – 0x5F I/O Buses: PCI, USB, ISA, ATA etc. 0x5F is an unrecover ab le erro r. Start with PCI. 0x60 – 0x6F BDS 0x70 – 0x7F Output Dev ic es: All output consoles. 0x80 – 0x8F For future use 0x90 – 0x9F Input devices: Keyboard/Mouse. 0xA0 – 0xAF For future use 0xB0 – 0xBF Boot Devices: Inc lude s fixe d media and remov a b le media. Not that cri tic al s inc e

0xC0 – 0xCF For future use 0xD0 – 0xDF For future use 0xF0 – 0xFF

Resuming from SX states. 0x10 – S1, 0x20 – S2, 0x30 – S3, etc.

consoles should be up at this point.

Intel Desktop Board DB75EN Technical Product Specification

Table 47. Port 80h POST Codes

Port 80 Code Progress Code Enumeration

ACPI S States 0x00,0x01,0x02,0x03,0x04,0x05 Enter ing S0 , S2 , S3, S4, or S5 state 0x10,0x20,0x30,0x40,0x50 Resuming from S2, S3, S4, S5 Security Phase (SEC) 0x08 Starting BIOS execution after CPU BIST 0x09 SPI prefetching and caching 0x0A Load BSP microcode 0x0B Load APs microcodes 0x0C Platfor m program baseaddresses 0x0D Wake Up All APs 0x0E Initialize NEM 0x0F Pass entry point of the PEI core PEI before MRC PEI Platform driver 0x11 Set bootmode, GPIO init 0x12 Early chipset register programming including gr ap hic s init 0x13 Basic PCH init, discrete device init (1394, SATA) 0x14 LAN init 0x15 Exit early platform init driver PEI SMBUS 0x16 SMBUSriver init 0x17 Entry to SMBUS execute read/write 0x18 Exit SMBUS execute read/write PEI CK505 Clock Programming 0x19 Entry to CK505 programming 0x1A Ex it C K50 5 progr a mmi ng PEI Over-Clock Programming 0x1B Entr y to e ntry to PEI over -clock programming 0x1C Exit PEI ove r-clock programming Memory 0x21 MRC entry point 0x23 Reading SPD from memory DIMMs 0x24 Detecting presenc e of memory DIMMs 0x27 Configuring memory 0x28 Testing memory 0x29 Exit MRC driver

continued

Error Messages and Beep Codes

Table 47. Port 80h POST Codes (continued)

Port 80 Code Progress Code Enumeration

PEI after MRC 0x2A S tart to Program MTRR Settings 0x2B Done Programming MTRR Settings PEIMs/Recovery 0x31 Crisis Recovery has initiated 0x33 Loading recovery capsule 0x34 Start recovery capsule/ valid capsule is found CPU Initialization CPU PEI Phase 0x41 Begin CPU PEI Init 0x42 XMM instruction enabling 0x43 End CPU PEI Init CPU PEI SMM Phase 0x44 Begin CPU SMM Init smm relocate bases 0x45 Smm relocate bases for APs 0x46 End CPU SMM Init CPU DXE Phase 0x47 CPU DXE Phase begin 0x48 Refresh memory space attributes according to MTRRs 0x49 Load the microcode if needed 0x4A Initialize strings to HII database 0x4B Initialize MP Support 0x4C CPU DXE Phas e End CPU DXE SMM Phase 0x4D CPU DXE SMM Phase begin 0x4E Relocate SM bases for all APs 0x4F CPU DXE SMM Phase end IO BUSES 0x50 Enumerating PCI buses 0x51 Allocating resources to PCI bus 0x52 Hot Plug PCI controller initialization USB 0x58 Resetting USB bus 0x59 Reserved for USB ATA/ATAPI/SATA 0x5A R e s e tting PATA/SATA bus and all devices 0x5B Reserved for ATA

continued

Intel Desktop Board DB75EN Technical Product Specification

Table 47. Port 80h POST Codes (continued)

Port 80 Code Progress Code Enumeration

BDS 0x60 BDS driver entry point initialize 0x61 BDS service routine entry point (can be called multiple time s ) 0x62 BDS Step2 0x63 BDS Step3 0x64 BDS Step4 0x65 BDS Step5 0x66 BDS Step6 0x67 BDS Step7 0x68 BDS Step8 0x69 BDS Step9 0x6A B DS Step10 0x6B B DS Step11 0x6C BDS Step12 0x6D BDS Step13 0x6E BDS Step14 0x6F BDS return to DXE core (should not get here) Keyboard (PS2 or USB) 0x90 Resetting keyboard 0x91 Disabling the keyboard 0x92 Detecting the presence of the keyboard 0x93 Enabling the keyboard 0x94 Clearing keyboard input buffer 0x95 Instructing keyboard controller to run Self Test (PS2 only) Mouse (PS2 or USB) 0x98 Resetting mouse 0x99 Detecting mouse 0x9A Detecting presence of mouse 0x9B Enab ling mouse Fixed Media 0xB0 Resetting fixed media 0xB1 Disabling fixed media

0xB2 Detecting presence of a fixed media (IDE hard drive detection etc.) 0xB3 Enabling/configuring a fixed media

continued

Error Messages and Beep Codes

Table 47. Port 80h POST Codes (continued)

Port 80 Code Progress Code Enumeration

Removable Media 0xB8 Resetting removable media 0xB9 Disabling removable media 0xBA Detecting presence of a removable media (IDE, CDROM detection

etc.) 0xBB Enabling/configuring a removable media DXE Core 0xE4 Ente r e d D X E phase BDS 0xE7 Waiting for user input 0xE8 Checking password 0xE9 Entering BIOS setup 0xEB Calling Legacy Option ROMs Runtime Phase/EFI OS Boot 0xF8 EFI boot service ExitBootServices ( ) has been called 0xF9 EFI runtime service SetVirtualAddressMap ( ) has been called

Intel Desktop Board DB75EN Technical Product Specification

Table 48. Typical Port 80h POST Sequence

POST Code Description

21 I nitia lizing a chipset component 22 Reading SPD from memory DIMMs 23 Detecting presence of memory DIMMs 25 Configuring memory 28 Tes ting m e mory 34 Loading recovery capsule E4 Entered DXE phase 12 Starting application processor initialization 13 SMM initializ ation 50 Enumerating PCI buses 51 Allocating resourced to PCI bus 92 De te c ting the presence of the keyboard 90 Resetting keyboard 94 Clearing keyboard input buffer 95 Keyboard Self Test EB Calling Video BIOS 58 Resetting USB bus 5A Resetting PATA/SATA bus and all devic e s 92 De te c ting the presence of the keyboard 90 Resetting keyboard 94 Clearing keyboard input buffer 5A Resetting PATA/SATA bus and all devic e s 28 Tes ting m e mory 90 Resetting keyboard 94 Clearing keyboard input buffer E7 Waiting for user input 01 INT 19 00 Ready to boot

5 Regulatory Compliance and Battery

Disposal Information

5.1 Regulatory Compliance

This section cont ains the following regulatory compliance information for Intel Desk t op Board DB75EN:

• Safety standards

• European Union Declaration of Conformity statement

• Product Ecology statements

• Electromagnetic Compatibility (EMC) standar ds

• Product certification markings

5.1.1 Safety Standards

Intel Desktop Board DB75EN complies with the safety standards stated in Table 49 when correctly installed in a compatible host system.

Table 49. Safety Standards

Standard Title

CSA/UL 60950-1 Information Technology Equipment – Safety - Part 1: General

Requirements (USA and Canada)

EN 60950-1 Information Technology Equipment – Safety - Part 1: General

Requirements (European Union)

IEC 60950-1 Information Technology Equipment – Safety - Par t 1: General

Requirements (International)

Intel Desktop Board DB75EN Technical Product Specification

5.1.2 European Union Declaration of Conformity

Statement

We, Intel Corporation, declare under our sole responsibility that the product Intel® Desktop Board DB75EN is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC (ROHS Directive).

The product is properly CE marked demonstrating this conformity and is for distribution within all member state s of the EU with no restrictions.

This product follows the provisions of the European Directives 2004/108/EC, 2006/95/EC, and 2002/95/EC.

Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC, 2006/95/EC a 2002/95/EC.

Dansk Dette produkt er i overensstemmelse med det europæiske direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC.

Dutch Dit product is in navolging van de bepalingen van Europees Directief 2004/108/EC, 2006/95/EC & 2002/95/EC.

Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC, ja 2006/95/EC ja 2002/95/EC kehtestatud nõuetele. Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC määräyksiä. Français Ce produit est conforme aux exigences de la Directive Européenne 2004/108/EC, 2006/95/EC & 2002/95/EC. Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie 2004/108/EC, 2006/95/EC & 2002/95/EC.

Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών

2004/108/EC, 2006/95/EC και 2002/95/EC. Magyar E termék megfelel a 2004/108/EC, 2006/95/EC és 2002/95/EC Európai

Irányelv előírásainak. Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer

2004/108/EC, 2006/95/EC, & 2002/95/EC. Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC,

2006/95/EC & 2002/95/EC. Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC, 2006/95/EC un

2002/95/EC noteikumiem. Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC, 2006/95/EC, ir

2002/95/EC nuostatas. Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 2004/108/EC, 2006/95/EC u 2002/95/EC. Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 2004/108/EC, 2006/95/EC & 2002/95/EC. Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 2004/108/EC, 206/95/EC i 2002/95/EC.

Regulatory Compliance and Battery Disposal Information

中文

Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC, 2006/95/EC & 2002/95/EC.

Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC, 2006/95/EC & 2002/95/EC.

Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 2004/108/EC, 2006/95/EC a 2002/95/EC.

Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC, 2006/95/EC in 2002/95/EC.

Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC. Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC, 2006/95/EC ve 2002/95/EC yönergelerine uyar.

5.1.3 Product Ecology Statements

The following information is provided to address worldwide product ecology concerns and regulations.

5.1.3.1 Disposal Considerations

This product contains the following materials th at may be regulated upon disposal: lead solder on the printed wiring board assembly.

5.1.3.2 Recycling Considerations

As part of its commitment to environmental responsibility, Intel has implemented the Intel Product Recycling Program to allow retail consumers of Intel’s branded products to return used products to selected locations for proper recycling.

Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the details of this program, including the scope of covered products, available locations, shipping instructions, terms and conditions, etc.

作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program

（英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作恰当的重复使用处理。

请参考http://www.intel.com/intel/other/ehs/product_ecology

了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。

Deutsch

Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm impleme nt iert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben.

Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der

http://www.intel.com/intel/other/ehs/product_ecology

Intel Desktop Board DB75EN Technical Product Specification

Español Como parte de su compromiso de responsabilidad medioambiental, Intel ha

implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado.

Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles del programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de envío, términos y condiciones, etc.

Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis

en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à des adresses spécifiées.

Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en savoir plus sur ce programme, à savoir les produits concernés, les adresses disponibles, les instructions d'expédition, les conditions générales, etc.

日本語インテルでは、環境保護活動の一環として、使い終えたインテル

ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクルプログラムを発足させました。

対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、http://www.intel.com/in

tel/other/ehs/product_ecology （英語）をご覧ください。

Malay

Sebagai sebahagian daripada komitmennya te rhada p ta nggungjawab persekitaran, Intel telah melaksa nakan Program Kitar Se m u la Produk untuk membenarkan pengguna-pengguna runcit produk jenama Intel memula n g kan produk terguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.

Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syarat, dsb.

Portuguese Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o

Programa de Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel usados para locais selecionados, onde esses produtos são reciclados de maneira adequada.

Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Inglês) para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os locais disponíveis, as instruções de envio, os termos e condições, etc.

Regulatory Compliance and Battery Disposal Information

Russian

В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной утилизации.

Пожалуйста, обратитесь на веб-сайт

http://www.intel.com/intel/other/ehs/product_ecology за информацией об этой

программе, принимаемых продуктах, местах приема, инструкциях об отправке, положениях и условиях и т.д.

Türkçe

Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya koymuştur.

Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen

http://www.intel.com/intel/other/ehs/product_ecology Web sayfasına gidin.

Intel Desktop Board DB75EN Technical Product Specification

5.1.4 China RoHS

Intel Desktop Board DB75EN is a China RoHS-compliant product. The China Ministry of Information Industry (MII) stipulates that a material Self

Declaration Table (SDT) must be included in a product’s user documentation. The SDT for Intel Desktop Board DB75EN is shown in Figure 18.

Figure 18. Intel Desktop Board DB75EN China RoHS Material

Self Declaration Table

Regulatory Compliance and Battery Disposal Information

5.1.5 EMC Regulations

Intel Desktop Board DB75EN complies with the EMC regulations stated in Table 50 when correctly installed in a compatible host system.

Table 50. EMC Regulations

Regulation Title

FCC 47 CFR Part 15, Subpart B

ICES-003 Interference-Causing Equipment Standard, Digital Apparatus. (Canad a ) EN55022

EN55024

EN55022

CISPR 22

CISPR 24

VCCI V-3, V-4

KN-22, KN-24

CNS 13438 Bureau of Standards, Metrology, and Inspection (Taiwan)

Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Rad i o Frequency Devices. (USA)

Limits and methods of measurement of Radio Interf ere nce Characte ristics of Information Technology Equipment. (Eur op e an Unio n)

Information Technology Equipment – Immunity Char ac ter is tic s Lim its and methods of measurement. (European Union)

Australian Communications Author i ty , S ta nd ard for Ele c tromag ne tic Compatibility. (Australia and New Zealand)

Limits and methods of measurement of Radio Disturbance Characteristics of Information Technology Equipment. (International)

Information Technology Equipment – Immunity Characteristics – Limits and Methods of Measurement. (International)

Voluntary Control for Interference by Information Technology Equipment. (Japan)

Korean Communications Commission – Framework Act on Telecommunications and Radio Waves Ac t (South Korea)

FCC Declaration of Conformity

This device complies with Part 15 of the FCC Rules . Oper a t ion is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

For questions related to the EMC performance of this product, contact: Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124

1-800-628-8686 This equipment has been tested and found to comply with the limits for a Class B

digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interfere nce to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and the receiver.

Intel Desktop Board DB75EN Technical Product Specification

• Connect the equipment to an o ut let on a circuit other than the one to which the

receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications to the equipment not expressly approved by Intel

Corporation could void the user’s authority to operate the equipment. Tested to comply with FCC standards for home or office use.

Canadian Department of Communications Compliance Statement

This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the Radio Interference Regulations of the Canadian Department of Commu nications.

Le présent appareil numerique német pas de bruits radioélectriques dépassant les limites applicables aux appareils numériques de la classe B prescrites dans le Réglement sur le broullage radioélectrique édicté par le ministére des Communications du Canada.

Japan VCCI Statement

Japan VCCI Statement translation: This is a Class B product based on the sta nda rd of the Voluntary Control Council for Inter ference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manua l.

Korea Class B Statement

Korea Class B Statement translation: This e quipment is for home use , and has acquired electromagnetic conformity registration, so it can be used not only in residential areas, but also other areas.

Regulatory Compliance and Battery Disposal Information

5.1.6 ENERGY STAR* 5.0, e-Standby, and ErP

Compliance

The US Department of Energy and the US Environmental Protection Agency have continually revised the ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements.

Intel Desktop Board DB75EN meets the following program requirements in an adequate system configuration, including appropriate selection of an efficient pow er supply:

• Energy Star v5.0, category D

• EPEAT*

• Korea e-Standby

• European Union Energy-related Products Directive 2009 (ErP) Lot 6

NOTE

Energy Star compliance is based at the sys tem level not the board level. Use of an Intel Desktop Board alone does not guarantee Energy Star compliance.

For information about Refer to

ENERGY STAR requirements and recommended config urations http://www.intel.com/go/energystar Electronic Product Environmental As s e ssm e nt Too l (EPEAT) http://www.epeat.net/ Korea e-Standby Program http://www.kemco.or.kr/new_eng/pg02/

pg02100300.asp

European Union Energy-related Products Directive 2009 (ErP) http://ec.europa.eu/enterprise/policies/s

ustainable-business/sustainableproduct-policy/ecodesign/index_en.htm

Intel Desktop Board DB75EN Technical Product Specification

5.1.7 Regulatory Compliance Marks (Board Level)

Intel Desktop Board DB75EN has the regulatory compliance marks shown in Table 51.

Table 51. Regulatory Compliance Marks

Description Mark

UL joint US/Canada Recognized Compone nt mark. Inc lude s adjace nt U L file number for Intel Desktop Boards: E210882.

FCC Declaration of Conformity logo mark for Class B equipment.

CE mark. Declaring compliance to the European U nion (EU) EMC directive, Low Voltage directive, and RoHS directive.

Australian Communications Author i ty (ACA) and New Zealand Radio Spectrum Management (NZ RSM) C-tick mark. Includes adjacent Intel supplier code number, N-232.

Japan VCCI (Voluntary Control Counci l for I nterference) mark.

Korea Certification mark. Includes an adja cent KC C (Kore an Communic ations Commission) certificatio n number: KCC-REM-CPU-DB75EN.

Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark. Includes adjacent Intel company number, D33025.

Printed wiring board manufacturer ’s reco g nition mark. Consists of a unique UL recognized manufacturer’s logo , along with a flamm ability rating (solder side).

China RoHS/Environmentally Friendly Use Period Logo: This is an example of the symbol used on Intel Desktop Boards and associated collateral. The color of the mark may vary depending upon the application. The Environme ntal Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined to be 10 years.

V-0

Regulatory Compliance and Battery Disposal Information

5.2 Battery Disposal Information

CAUTION

Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations.

PRÉCAUTION

Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des piles usagées doit respecter les réglementations locales en vigueur en matière de protection de l'environnement.

FORHOLDSREGEL

Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse med gældende miljølovgivning.

OBS!

Det kan oppstå eksplosjonsfare hvis b a tteriet skiftes ut med feil type. Brukte batterier bør kastes i henhold til gjeldende miljølovgivning.

VIKTIGT!

Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljövårdsbestämmelserna.

VARO

Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten mukaisesti.

VORSICHT

Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entspreche n d en , vom He rsteller empfoh l enen Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend.

AVVERTIMENTO

Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto. Utilizzare solo pile uguali o di tipo equiv alente a quelle consigliate dal produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore.

Intel Desktop Board DB75EN Technical Product Specification

PRECAUCIÓN

Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.

WAARSCHUWING

Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.

ATENÇÃO

Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto. As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias usadas deve ser feita de acordo com as regulamentações ambientais da região.

AŚCIAROŽZNAŚĆ

Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу. Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.

UPOZORNÌNÍ

V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné, baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními předpisy o životním prostředí.

Προσοχή

Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με τους κατά τόπο περιβαλλοντικούς κανονισμούς.

VIGYÁZAT

Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi előírásoknak megfelelően kell kiselejtezni.

Regulatory Compliance and Battery Disposal Information

AWAS

Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan.

OSTRZEŻENIE

Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska.

PRECAUŢIE

Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător. Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să respecte reglementările locale privind protecţia mediului.

ВНИМАНИЕ

При использовании батареи несоответствующего типа существует риск ее взрыва. Батареи должны быть утилизированы по возможности. Утилизация батарей должна проводится по правилам, соответствующим местным требованиям.

UPOZORNENIE

Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu. Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.

POZOR

Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo. Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi

okoljevarstvenimi predpisi.

UYARI

Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.

OСТОРОГА

Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху. Якщо можливо, використані батареї слід утилізувати. Утилізація використаних батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.

Intel Desktop Board DB75EN Technical Product Specification

小心

주의

如果更換的電池類型不正確，可能會有爆炸的危險。請盡可能將電池送至回收處。請依照當地的環保規範來處理使用過的電池。

배터리를 잘못된 종류로 교체할 경우 폭발 위험이 있습니다. 가능한 경우 배터리는 재활용해야 하며, 수명이 다한 배터리를 폐기할 때는 각 지역의 환경법을 따라야 합니다.

THẬN TRỌNG

Có nguy cơ xảy ra nổ nếu thay pin không đúng loại. Pin cần được tái chế nếu có thể thực hiện được. Việc thải bỏ pin đã sử dụng phải tuân theo các quy định của địa phương về môi trường.

Regulatory Compliance and Battery Disposal Information

Intel Desktop Board DB75EN Technical Product Specification

Intel DB75EN Specification

Specifications and Main Features

Frequently Asked Questions

User Manual