Intel DB75EN Specification
Intel® Desktop Board
DB75EN
Technical Product Specification
June 2012
Part Number: G54940-002
The Intel Desktop Board DB75EN may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata are documented in the Intel Desktop Board DB75EN Specification Update.
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DB75EN Technical Product
Specification
-002 Specification clarificati o n June 2012
This product spec ification applies to only the standar d Intel® Desktop Board with BIOS identifier
ENB7510H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNE CT I ON WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PROD UCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A P ARTICULAR PURPOSE, MERCHANTABILITY, O R INFRINGEMENT
OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN
WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FO R ANY APPLICATION IN
WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
®
All Intel
computers (PC) for installation in home s , offices , schoo ls , com p uter room s , and sim ilar locati o ns . The
suitability of this product for other PC or embedded no n-PC app lic a tio ns or o ther e nviro nme nts , s uc h as
medical, industrial, alarm systems, te s t equipment, etc. may not be supported without further evaluation by
Intel.
Intel Corporation may have patents or pending pa te nt app lic ations, trademarks, copyrights, or other
intellectual property rights that r e la te to the pres e nted subjec t matte r. The furnishing of documents and
other materials and inform ation doe s not provide any license, express or implied, by estoppel or otherwis e ,
to any such patents, trademarks, copyrights, or othe r intelle c tua l p ro perty rights.
Intel may make changes to specifications and produc t descriptions at any time, without notice.
Designers must not rely on the absence or characteristic s of any feature s or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defe c ts or error s know n as err ata , which may c ause the prod uc t to
deviate from published specifications . C urrent characterized errata are available on request.
Contact your local Intel sales offic e or your distr ibutor to obtain the latest specifications before plac ing your
product order.
Intel, 3
trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the propert y of others.
Copyright 2012, Intel Corporation. All rights reserved.
desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
rd
generation Intel Core processor family, and 2nd generation Intel Core processor family are
April 2012
Board Identification Information
Basic Desktop Board DB75EN Identification Information
AA Revision BIOS Revision Notes
G39650-300 ENB7510H.86A.0017 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The B75 processor used on this AA revisio n cons is ts of the following component:
Device Stepping S-Spec Numbers
Intel B75 Express Chipset A1 SLJ85
Specification Changes or Clarifications
Table 1 indicates the Specification Changes or Specification Clarifications that apply to
the Intel
®
Desktop Board DB75EN.
Table 1. Specification Changes or Clarifications
Date Type of Change Description of Changes or Clarifications
June 2012 Spec Clarification Removed references to RAID support and replaced with
SATA ACHI support.
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.
iii
Intel Desktop Board DB75EN Technical Product Specification
iv
2
A map of the resou r ces of the Intel Desk top Board
3
The features supported by the BIOS Setup program
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for Intel
Board DB75EN.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel Desktop
Board DB75EN and its components to the vendors, system integrators, and other
engineers and technician s who need this level of information. It is specifical ly not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardwar e used on Intel Desktop Board DB75EN
4 A description of the BIOS error mes s a ges , beep codes, and POST codes
5 Regulatory comp lia nce and battery dis posal informati on
Typographical Conventions
®
Desktop
This section cont ains information abo u t t he conventions used in this sp ecification. No t
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
v
Intel Desktop Board DB75EN Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low sig nal (s uch as USB P0# )
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kb Kilob it (1024 bits)
kb/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048,576 bits)
Mb/s Megabit s pe r second
TDP Thermal Design Power
xxh An address or data value ending with a lowercase h indicates a hexadec ima l value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
vi
Contents
Revision History
Board Identification Information .................................................................. iii
Specification Changes or Clarifications ......................................................... iii
Errata ...................................................................................................... iii
Preface
Intended Audience ..................................................................................... v
What This Document Contains ..................................................................... v
Typographical Conventions ......................................................................... v
1 Product Description
1.1 Overview ......................................................................................... 11
1.1.1 Feature Summary ................................................................. 11
1.1.2 Board Layout ........................................................................ 13
1.1.3 Block Diagram ...................................................................... 15
1.2 Online Support ................................................................................. 16
1.3 Processor ........................................................................................ 16
1.3.1 Graphics Subsystem .............................................................. 17
1.4 System Memory ............................................................................... 19
1.4.1 Memory Configurations .......................................................... 20
®
1.5 Intel
1.5.1 Direct Media Interface (DMI) .................................................. 22
1.5.2 Display Interfaces ................................................................. 22
1.5.3 USB ..................................................................................... 23
1.5.4 SATA Interfaces .................................................................... 23
1.6 Real-Time Clock Subsystem ............................................................... 24
1.7 Legacy I/O Controller ........................................................................ 24
1.8 Audio Subsystem .............................................................................. 25
1.8.1 Audio Subsystem Software ..................................................... 25
1.8.2 Audio Connectors and Headers ................................................ 26
1.9 LAN Subsystem ................................................................................ 27
1.9.1 Intel
1.9.2 LAN Subsystem Software ....................................................... 28
1.9.3 RJ-45 LAN Connector with Integrated LEDs .............................. 28
1.10 Hardware Management Subsystem ..................................................... 29
1.10.1 Hardware Monitoring ............................................................. 29
1.10.2 Fan Monitoring ...................................................................... 29
1.10.3 Chassis Intrusion and Detection .............................................. 29
1.10.4 Thermal Monitoring ............................................................... 30
1.11 Intel
1.11.1 Intel
1.11.2 Intel
1.11.3 Intel
B75 Express Chipset ................................................................ 22
®
82579V Gigabit Ethernet Controller ................................ 27
®
Security and Manageability Technologies .................................... 31
®
Small Business Technology ............................................ 31
®
Virtualization Technology .............................................. 31
®
Virtualization Technology for Directed I/O ....................... 32
vii
Intel Desktop Board DB75EN Technical Product Specification
1.11.4 Intel® Anti-Theft Technology ................................................... 32
®
1.11.5 Intel
Management Engine (Intel® ME) Software and Drivers ...... 33
1.12 Power Management .......................................................................... 34
1.12.1 ACPI .................................................................................... 34
1.12.2 Hardware Support ................................................................. 36
2 Technical Reference
2.1 Memory Resources ........................................................................... 41
2.1.1 Addressable Memory.............................................................. 41
2.1.2 Memory Map ......................................................................... 43
2.2 Connectors and Headers .................................................................... 43
2.2.1 Back Panel Connectors ........................................................... 44
2.2.2 Component-side Connectors and Headers ................................. 45
2.3 Jumper Block ................................................................................... 55
2.4 Intel
2.5 Mechanical Considerations ................................................................. 57
2.6 Electrical Considerations .................................................................... 58
2.7 Thermal Considerations ..................................................................... 59
2.8 Reliability ........................................................................................ 62
2.9 Environmental .................................................................................. 62
®
Management Engine BIOS Extension (Intel® MEBX) Reset Header . 56
2.5.1 Form Factor .......................................................................... 57
2.6.1 Power Supply Considerations .................................................. 58
2.6.2 Power Supervisor .................................................................. 59
2.6.3 Fan Header Current Capability ................................................ 59
2.6.4 Add-in Board Considerations ................................................... 59
3 Overview of BIOS Features
3.1 Introduction ..................................................................................... 63
3.2 BIOS Flash Memory Organization ........................................................ 64
3.3 Resource Configuration ..................................................................... 64
3.3.1 PCI Express Autoconfiguration ................................................ 64
3.4 System Management BIOS (SMBIOS) ................................................. 65
3.5 Legacy USB Support ......................................................................... 65
3.6 BIOS Updates .................................................................................. 66
3.6.1 Language Support ................................................................. 66
3.6.2 Custom Splash Screen ........................................................... 67
3.7 BIOS Recovery ................................................................................. 67
3.8 Boot Options .................................................................................... 68
3.8.1 Optical Drive Boot ................................................................. 68
3.8.2 Network Boot ........................................................................ 68
3.8.3 Booting Without Attached Devices ........................................... 68
3.8.4 Changing the Default Boot Device During POST ......................... 68
3.9 Adjusting Boot Speed
................................
3.9.1 Peripheral Selection and Configuration ..................................... 69
3.9.2 BIOS Boot Optimizations ........................................................ 69
3.10 BIOS Security Features ..................................................................... 70
3.11 BIOS Performance Features ............................................................... 71
........................................ 69
viii
Contents
4 Error Messages and Beep Codes
4.1 Speaker .......................................................................................... 73
4.2 BIOS Beep Codes ............................................................................. 73
4.3 Front-panel Power LED Blink Codes ..................................................... 74
4.4 BIOS Error Messages ........................................................................ 74
4.5 Port 80h Power O n Self Test (POST) Codes .......................................... 75
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ...................................................................... 81
5.1.1 Safety Standards................................................................... 81
5.1.2 European Union Declaration of Conformity Statement ................ 82
5.1.3 Product Ecology Statements ................................................... 83
5.1.4 China RoHS .......................................................................... 86
5.1.5 EMC Regulations ................................................................... 87
5.1.6 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 89
5.1.7 Regulatory Compliance Marks (Board Level) ............................. 90
5.2 Battery Disposal Information .............................................................. 91
Figures
1. Major Board Components .................................................................. 13
2. Block Diagram .................................................................................. 15
3. Memory Channel and DIMM Configuration ............................................ 21
4. Back Panel Audio Connectors ............................................................. 26
5. LAN Connector LED Locations ............................................................. 28
6. Thermal Sensors and Fan Headers ...................................................... 30
7. Location of the Intel ME “M” State LED ................................................ 33
8. Location of the Standby Power LED ..................................................... 40
9. Detailed System Memory Address Map ................................................ 42
10. Back Panel Connectors ...................................................................... 44
11. Component-side Connectors and Headers ............................................ 45
12. Connection Diagram for Front Panel Header ......................................... 52
13. Connection Diagram for Front Panel USB 2.0 Headers ........................... 54
14. Location of the Jumper Block ............................................................. 55
15. Intel MEBX Reset Header ................................................................... 56
16. Board Dimensions ............................................................................. 57
17. Localized High Temperature Zones ..................................................... 60
18. Intel Desktop Board DB75EN China RoHS Material Self
Declaration Table .............................................................................. 86
Tables
1. Specification Changes or Clarifications ................................................... iii
2. Feature Summary ............................................................................. 11
3. Components Shown in Figure 1 .......................................................... 14
4. Supported Memory Configurations ...................................................... 19
5. Audio Jack Support ........................................................................... 25
ix
Intel Desktop Board DB75EN Technical Product Specification
6. LAN Connector LED States ................................................................. 28
7. Intel ME “M” State LED Behavior ........................................................ 33
8. Effects of Pressing the Power Switch ................................................... 34
9. Power States and Targeted System Power ........................................... 35
10. Wake-up Devices and Events ............................................................. 36
11. System Memory Map......................................................................... 43
12. Component-side Connectors and Headers Shown in Figure 11 ................ 46
13. Serial Port Header ............................................................................ 47
14. Front Panel Audio Header for Intel HD Audio ........................................ 47
15. Front Panel Audio Header for AC ’97 Audio ........................................... 47
16. Front Panel USB 2.0 Headers ............................................................. 47
17. Front Panel USB 3.0 Connector ........................................................... 48
18. SATA Connectors .............................................................................. 48
19. S/PDIF Header ................................................................................. 48
20. Chassis Intrusion Header ................................................................... 49
21. Processor, Front, and Rear Chassis (4-Pin) Fan Headers ....................... 49
22. LPC Debug Header ............................................................................ 49
23. TPM Header ..................................................................................... 49
24. Processor Core Power Connect or ........................................................ 51
25. Main Power Connector ....................................................................... 51
26. Front Panel Header ........................................................................... 52
27. States for a One-Color Power LED ....................................................... 53
28. States for a Two-Color Power LED....................................................... 53
29. Alternate Front Panel Power/Sleep LED Header..................................... 53
30. BIOS Setup Configuration Jumper Settings .......................................... 55
31. Intel MEBX Reset Header Signals ........................................................ 56
32. Recommended Power Supply Current Values (High Power) .................... 58
33. Recommended Power Supply Current Values (Low Power) ..................... 58
34. Fan Header Current Capability ............................................................ 59
35. Thermal Considerations for Components .............................................. 61
36. Tcontrol Values for Components ......................................................... 61
37. Environmental Specifications .............................................................. 62
38. BIOS Setup Program Menu Bar ........................................................... 64
39. BIOS Setup Program Function Keys .................................................... 64
40. Acceptable Drives/Media Types for B IO S Recovery ................................ 67
41. Boot Device Menu Option s ................................................................. 68
42. Supervisor and User Password Functions ............................................. 70
43. BIOS Beep Codes .............................................................................
44. Front-panel Power LED Blink Codes ..................................................... 74
45. BIOS Error Messages ........................................................................ 74
46. Port 80h POST Code Ranges .............................................................. 75
47. Port 80h POST Codes ........................................................................ 76
48. Typical Port 80h POST Sequence ........................................................ 80
49. Safety Standards .............................................................................. 81
50. EMC Regulations ............................................................................... 87
51. Regulatory Compliance Marks ............................................................ 90
7
3
x
rd
®
®
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 2 summarizes the major features of the board.
Table 2. Feature Summary
Form Factor
Processor
Memory
Chipset
Graphics
Audio 8-channel (6+2) Intel High Definition Audio via the Realtek* ALC662 audio codec
Micro-ATX (9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters])
generation Intel® Core processor family and 2nd generation Intel® Core
• 3
processor family processors with up to 95 W TDP in an LGA1155 socket
― One PCI Express* 3.0 x16 graphics interface
― Integrated memory controller with dual channe l DDR 3 m emory support
― Integrated graphics process ing (proce s so rs with Intel
― External graphics interface controlle r
• Four 24 0-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1600 MHz, DDR3 1333 MHz , a nd DDR3 1066 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 32 GB of system memory with four DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.5 V (standard voltage) and 1.35 V (low voltage) JEDEC memory
• Support for XMP memory
Note: DDR3 1600 MHz DIMMs are only supported by 3
processor family processors
B75 Express Chipset consisting of the Intel® B75 Express Platform
Intel
Controller Hub (PCH)
• Integrated graphics support for processors with Intel
― VGA
― DVI-D
• Support for a PCI Express 3.0 x16 add-in graphics card
Note: PCI Express 3.0 is only supporte d by 3
processor family processors
®
HD Graphics)
rd
generation Intel Core
Graphics Technology:
rd
generation Intel Core
continued
11
Intel Desktop Board DB75EN Technical Product Specification
One PCI Express 3.0 x16 add-in card connector
Table 2. Feature Summary (continued)
Peripheral
Interfaces
Expansion
Capabilities
BIOS
Instantly Available
PC Technology
LAN Support
Legacy I/O Control Nuvoton NCT6776D I/O controller for PS/2 po r t, serial port, parallel port, and
Hardware Monitor
Subsystem
Intel® Security and
Manageability
Technologies
• Four USB 3.0 ports:
― Two USB 3.0 ports are implemented with stacked back panel connectors
(blue)
― Two front panel USB 3.0 ports are imple mented thro ugh one internal
connector (blue)
• Eight USB 2.0 ports:
― Four ports implemented with stacked back panel connectors (black)
― Four f ro nt p ane l por ts imp le mented through two internal headers
• Five Serial ATA (SATA) ports:
― One SATA 6.0 Gb/s interface through the Intel B75 Express Chipset with
SATA ACHI support (blue)
― Three internal SATA 3.0 Gb/s interfaces through Intel B75 Express Chipset
with SATA ACHI support (black)
― One internal eSATA 3.0 Gb/s inter face (red)
• PS/2*-style keyboard/mouse port
• One serial port header
• One parallel port connector on the back panel
•
• One PCI Express 2.0 x1 bus add-in card connector from the PCH
• Two Conventional PCI bus add-in card connectors from the PCH
Note: PCI Express 3.0 is only supported by 3
family processors
®
• Intel
BIOS resident in the SPI Flash device
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play ,
and SMBIOS
• Support for PCI Express Revision 3.0
• Suspend to RAM support
• Wake on PCI, PCI Express, LAN, front panel, PS/2, serial, and USB ports
Gigabit (10/100/1000 Mb/s ) LAN subsystem using the I nte l
Ethernet Controller
hardware management support
• Hardware monitoring through the Nuvoton I/O controller
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan headers
• Two fan sense inputs used to monitor fan activity
• Fan speed control
®
• Intel
• Intel
• Intel
• Intel
Small Business Technology (Intel® SBT)
®
Anti-Theft (Intel® AT)
®
Virtualization Technology (Intel® VT)
®
Virtualization for Directed I/O (Intel® VT-d)
rd
generation Intel Core processor
®
82579V Gigabit
12
Product Description
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board DB75EN.
Figure 1. Major Board Components
13
Intel Desktop Board DB75EN Technical Product Specification
Table 3 lists the components identified in Figure 1.
Table 3. Components Shown in Figure 1
Item/callout
from Figure 1 Description
A Conventional PCI add-in card connector
B Conventional PCI add-in card connector
C PCI Express x1 add-in card conne c to r
D PCI Express x16 add-in card connector
E Back panel connectors
F 12 V processor core voltage connector (2 x 2 pin)
G LGA1155 processor socket
H Rear chassis fan header
I Processor fan header
J DIMM 3 (Channel A DIMM 0)
K DIMM 1 (Channel A DIMM 1)
L DIMM 4 (Channel B DIMM 0)
M DIMM 2 (Channel B DIMM 1)
N Front chassis fan header
O Chassis intrusion header
P Low Pin Count (LPC) Debug header
Q Trusted Platform Module (TPM) header
R Main p ower connector (2 x 12)
S Intel® Management Engine BIOS Extension (Intel® MEBX) Reset header
T Battery
U Piezoelectric speaker
V SATA 6.0 Gb/s connector (blue)
W eSATA 3.0 Gb/s connector (red)
X Alternate front panel power/slee p LED head er
Y Fro nt panel header
Z Standby power LED
AA BIOS Setup configuration jumper block
BB SATA 3.0 Gb/s connectors (black)
CC Front panel USB 3.0 connector (blue)
DD Intel® Management Engine “M” state LED
EE Intel B75 Express Chipset
FF Front panel USB 2.0 connector
GG Front panel USB 2.0 connector
HH Serial port connector
II S/PDIF out header
JJ Front panel audio header
KK Internal mono speaker header
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Product Description
15
Figure 2. Block Diagram
Intel Desktop Board DB75EN Technical Product Specification
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DB75EN http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for Intel
Desktop Board DB75EN
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration informatio n http://www.intel.com/support/go/buildit
http://ark.intel.com
025414.htm
1.3 Processor
The board supports 3rd generation Intel Core processor family and 2nd generation Intel
Core processo r family processors.
Other processors may be supported in the future. This board supports processors with
a maximum wattage of 95 W Thermal Design Power (TDP). The processors listed
above are only supported when falling within the wattage requirements of Intel
Desktop Board DB75EN. See the Intel web site listed below for the most up-to-date
list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply .
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.6.1 on page 58 for information on power supply requirements for this board.
16
Product Description
1.3.1 Graphics Subsystem
The board supports graphics through either the processor Intel HD Graphics or a PCI
Express x16 add-in graphics card.
1.3.1.1 Processor Graphics
The board supports integrated graphics through the Intel® Flexible Display Interface
®
(Intel
1.3.1.1.1 Intel® High Definition (Intel® HD) Graphics
The Intel HD graphics controller features the following:
• 3D Features
• Video
FDI) for processors with Intel HD Graphics.
DirectX* 11 (2
nd
generation Intel Core processor family processors support
CS4.0 only) support
OpenGL* 3.0 support
Shader Model 4.0
High-Definition content at up to 1080p resolution
Hardware accelerated MPEG-2, VC-1/WMV, and H.264/AVC Hi-Definition video
formats
Intel
®
HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick
Sync Video)
Note: Intel Quick Sync is enabled with the appropriate software application
Dynamic Video Memory Technology (DVMT) 5.0 support
Support of up to 1.7 GB Video Memory with 4 GB and above system memory
configuration
17
Intel Desktop Board DB75EN Technical Product Specification
1.3.1.2 PCI Express x16 Graphics
3rd generation Intel Core processor family processors support PCI Express 3.0, 2.x,
and 1.x and 2
nd
generation Intel Core processor family processors support PCI
Express 2.x and 1.x:
• PCI Express 3.0 with a raw bit rate of 8.0 GT/s results in an effective bandwidth of
1 GB/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 16 GB/s in each direction, simultaneously, for a total bandwidth of
32 GB/s.
• PCI Express 2.x with a raw bit rate of 5.0 GT/s results in an effective bandwidth of
500 MB/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 8 GB/s in each direction, simultane ously, for a total bandwidth of
16 GB/s.
• PCI Express 1.x with a raw bit rate of 2.5 GT/s results in an effective bandwidth of
250 MB/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 4 GB/s in each direction, simultane ously, for a total bandwidth of
8 GB/s.
For information about Refer to
PCI Express technology http://www.pcisig.com
18
Product Description
Capacity
Configuration
Density
Front-side/Back-side
Devices
1024 MB
SS
1 Gbit
128 M x8/empty
8
2048 MB
DS
1 Gbit
128 M x8/128 M x8
16
2048 MB
SS
2 Gbit
256 M x8/empty
8
4096 MB
DS
2 Gbit
256 M x8/256 M x8
16
8192 MB
DS
4 Gbit
512 M x8/512 M x8
16
1.4 System Memory
The board has four DIMM sockets and supports the following memory features:
• 1.5 V DDR3 SDRAM DIMMs with gold plated contacts, with the option to raise the
voltage to support higher performance DDR3 SDRAM DIMMs.
• 1.35 V Low Voltage DDR3 DIMMs (JEDEC specification)
• Two independent memory channels with interleaved mode support
• Unbuffered, sin gl e-sided or double-sided DIMMs with the following restriction:
DIMMs with x16 organization are not supported.
• 32 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 41 for information on the total amount of addressable
memory.
• Minimum recommended total system memory: 1 GB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz SDRAM DIMMs
Note: DDR3 1600 MHz DIMMs ar e only supported by 3
processor family processors
• XMP version 1.3 performance profile support for memory speeds of 1600 MHz or
lower
rd
generation Intel Core
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and pr ogram the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined fr eq u en cy.
Table 4 lists the supported DIMM configurations.
Table 4. Supported Memory Configurations
DIMM
4096 MB SS 4 Gbit 512 M x8/empty 8
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
(Note)
SDRAM
SDRAM Organization
Number of SDRAM
19
Intel Desktop Board DB75EN Technical Product Specification
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb
/CS-025414.htm
1.4.1 Memory Configurations
The 3rd generation Intel Core processor family and 2nd generation Intel Core processor
family processors support the following types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the othe r. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
• Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowes t within the system
memory map) is mapped to dual channel operation; the topm ost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
20
Figure 3 illustrates the memory channel and DIMM configuration.
Product Description
Figure 3. Memory Channel and DIMM Configuration
NOTE
For best memory performance always install memory in the blue DIMM sockets if
installing only two DIMMs on your board.
21
Intel Desktop Board DB75EN Technical Product Specification
1.5 Intel® B75 Express Chipset
Intel B75 Express Chipset with Intel Flexible Display Interconnect (Intel FDI) and
Direct Media Interface (DMI) interconnect provides interfaces to the processor and the
display, USB, SATA, LPC, LAN, and PCI Express interfaces. The Intel B75 Express
Chipset is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel B75 chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapte r 2
1.5.1 Direct Media Interface (DMI)
Direct Media Interface (DMI) is the chip-to-chip connection between the processor and
PCH. This high-speed interface integrates advanced priority-based servicing allowing
for concurrent traffic and true isochronous transfer capabilities.
1.5.2 Display Interfaces
Display is divided between the processor and the PCH. The processor houses the
memory interface, display planes, and pipes while the PCH has transcoder and display
interface or ports.
The PCH receives the display data over Intel FDI and transcodes the data as per the
display technology protocol and sends the data through the display interface.
1.5.2.1 Intel
Intel FDI connects t he display engine in the processor with the display interfaces on
the PCH. The display data from the frame buffer is processed in the display engine of
the processor and sent to the PCH over the Intel FDI where it is transcode d a s per the
display protocol and driven to the display monitor.
®
Flexible Display Interconnect (Intel
®
FDI)
1.5.2.2 Analog Display (VGA)
The VGA port supports analog displays. The maximum suppo rted resolution is 2048 x
1536 (QXGA) at a 75 Hz refresh rate. The VGA port is enabled for POST whenever a
monitor is attached, regardless of the DVI-D connector status.
1.5.2.3 Digital Visual Interface (DVI-D)
The DVI-D port supports only digital DVI displays. The maximum supported resolution
is 2048 x 1536 at 75 Hz refresh (QXGA). The DVI-D port is compliant with the DVI 1.0
specification.
22
Product Description
1.5.3 USB
The PCH contains up to two Enhanced Host Controller Interface (EHCI) host controllers
that support USB high-speed signaling. High-speed USB 2.0 allows data transfe rs up to
480 Mb/s. All ports are high-speed, fu l l-speed, and low-speed capable.
The PCH also contains an integrated eXtensible Host Controller Interface (xHCI) host
controller which supports USB 3.0 ports . T his controller allows data transfers up to
5 Gb/s. The controller supports SuperSpeed (SS), high-speed (HS), full-speed (FS),
and low-speed (LS) traffic on the bus.
The board supports up to four USB 3.0 ports and eight USB 2.0 ports.
The Intel B75 Express Chipset provides the USB controller for the 2.0/3.0 ports. The
port arrangement is as follows:
• Two USB 3.0 ports are implemented with stacked back panel connectors (b lue)
• Two front panel USB 3.0 ports are implemented through one internal connector
(blue)
• Four USB 2.0 ports are implemented with stacked back panel connectors (black)
• Four USB 2.0 front panel ports are implemented through two internal headers
(black)
NOTE
Computer systems that have an unshielded ca b le a ttached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use a
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 10, page 44
The location of the front panel USB headers Figure 11, page 45
1.5.4 SATA Interfaces
The board provides five SATA connectors, through the PCH, which support one device
each:
• One SATA 6.0 Gb/s interface through the Intel B75 Express Chipset with SATA
ACHI support (blue)
• Three internal Serial ATA (SATA) 3.0 Gb/s interfaces through the Intel B75 Express
Chipset with SATA ACHI support (black)
• One internal eSATA 3.0 Gb/s interface (red)
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
6.0 Gb/s for one port and 3.0 Gb/s for four ports. A point-to-point interface is used for
host-to-device connections.
The PC H supports the Serial ATA Specification, Revision 3.0. The PCH also supports
several optional sections of th e Serial ATA II: Extensions to Serial ATA 1.0
Specification, Revision 1.0 (AHCI support is required for some elements).
23
Intel Desktop Board DB75EN Technical Product Specification
The underlying SATA functional ity is transparent to the operating system. The SATA
controller can operate in both legacy and native modes. In legacy mode, standard IDE
I/O and IRQ resources are assigned (IRQ 14 and 15). In native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for
configurations using the Windows* XP and Windows 7 operating systems.
NOTE
Many SATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/.
For information about Refer to
The location of the SATA connectors Figure 11, page 45
1.6 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket , the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The c lock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied via the power supply 5V STBY rail.
NOTE
If the battery and AC power fail, date and time values will be reset and the user will be
notified during the POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.
1.7 Legacy I/O Controller
The I/O controller provides the following features:
• One serial port
• One back panel parallel port (with Extended Capabilities Port (ECP) and Enhanced
Parallel Port (EPP) support)
• PS/2-style keyboard/mouse interface on the back panel
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• Intelligent power management, including a program mable wake-up event interface
• Conventional PCI bus power management support
The BIOS Setup program provides configuration options for the I/O controller.
24
Product Description
1.8 Audio Subsystem
The board supports the Intel® High Definition Audio (Intel® HD Audio) subsystem. The
audio subsystem consists of the following:
• Intel B75 Express Chipset
• Realtek ALC662 audio codec
The audio subsystem has the following feat ures:
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio por t. The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.
• Front panel Intel HD Audio and AC ’97 audio support.
• 3-port analog audio out stack.
• A signal-to-noise (S/N) ratio of 95 dB.
• Windows 7 Ultimate certification.
Table 5 lists the supported functions of the front panel and back panel audio jacks.
Table 5. Audio Jack Support
Audio Jack
Front panel – Green Default
Front panel – Pink Default
Back panel – Blue Default
Back panel – Green (ctrl pane l ) Default
Back panel – Pink Default
Microphone Headphones
Line Out
(Front Spks)
(ctrl panel)
Line In
(Surround)
(ctrl panel)
1.8.1 Audio Subsystem Software
The latest audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and driver s Section 1.2, pa ge 16
Mic-In
(Center/Sub)
(ctrl panel)
25
Intel Desktop Board DB75EN Technical Product Specification
1.8.2 Audio Connectors and Headers
The board contains audio connectors and headers on both the back panel and the
component side of the board. The component-side audio headers include front panel
audio (a 2 x 5-pin header that provides mic in and line out signals for front pa nel audio
connectors). The available configurable back panel audio connectors are shown in
Figure 4.
Item Description
A Line in/surround
B Line out/front speakers
C Mic in/center/sub
Figure 4. Back Panel Audio Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
For information about Refer to
The locations of the front panel audio header and S/PDIF audio he ader Figure 11, page 45
The signal names of the front panel audio header and S/PDIF audio header Section 2.2.2.1, page 47
The back panel audio connectors Section 2.2.1, page 44
1.8.2.1 S/PDIF Header
The S/PDIF header allows connections to coaxial or optical dongles for digital audio
output.
1.8.2.2 Internal Mono Speaker Header
The internal mono speaker header allows co nnection to an internal, low-power speaker
for basic system sound capability. The subsystem is capable of driving a speaker load
of 8 Ohms at 1 W (rms) or 4 Ohms at 1.5 W (rms).
26
1.9 LAN Subsystem
The LAN subsystem consists of the following:
• Intel 82579V Gigabit Ethernet Controller (10/100/1000 Mb/s)
• Intel B75 Express Chipset
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface betw een the PCH and the LAN controller
• Conventional PCI bus power m anagement
ACPI technology support
LAN wake capabilities
• ACPI technology support
• LAN wake capabilities
• LAN subsystem software
For information about Refer to
LAN software and drivers http://downloadcenter.intel.com
Product Description
1.9.1 Intel® 82579V Gigabit Ethernet Controller
The Intel 82579V Gigabit Ethernet Controller supports the following features:
• 10/100/1000 BASE-T IEEE 802.3 compliant
• Energy Efficient Ethernet (EEE) IEEE802.3az support (Low Power Idle [LPI] mode)
• Dual interconnect between the Integrated LAN Controller and the Physical Layer
(PHY):
PCI Express-based interface for active state operation (S0) state
SMBUS for host and management traffic (Sx low power state)
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Full device driver compatibility
27
Intel Desktop Board DB75EN Technical Product Specification
1.9.2 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers http://downloadcenter.intel.com
1.9.3 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).
Item Description
A Link LED (Green)
B Data Rate LED (Green/Yellow)
Figure 5. LAN Connector LED Locations
Table 6 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 6. LAN Connector LED States
LED LED Color LED State Condition
Off LAN link is not established.
Link Green
Data Rate Green/Yellow
On LAN link is established.
Blinking LAN activity is occurring.
Off 10 Mb/s data rate is selected.
Green 100 Mb/s data rate is selected.
Yellow 1000 Mb/s data rate is selected.
28
Product Description
1.10 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Thermal and voltage monitoring
• Chassis intrusion detection
1.10.1 Hardware Monitoring
The hardware monitoring and fan control subsystem is based on the Nuvoton
NCT6776D device, which supports the following:
• Processor and system ambient temperature monitoring
• Chassis fan speed monitoring
• Power monitoring of +12 V, +5 V, +3.3 V, 3.3 Vstandby, V_SM, +VCCP,
PCH VCC
• SMBus interface
and
1.10.2 Fan Monitoring
Fan monitoring can be implemented using Intel® Desktop Utilities or third-party
software.
For information about Refer to
The functions of the fan headers Section 1.12.2.2, page 37
1.10.3 Chassis Intrusion and Detection
The board supports a chassis security featur e that detects if the chassis cover is
removed. The security feature uses a mechan ical switch on the chass is that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.
For information about Refer to
The location of the chassis intrusion header Figure 11, page 45
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