Intel® Desktop Board
DG33TL
Technical Product Specification
May 2007
Order Number: D95738-001US
The Intel® Desktop Board DG33TL may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DG33TL Specification Update.
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DG33TL Technical Product
Specification.
This product specification applies to only the standard Intel® Desktop Board DG33TL with BIOS
identifier DPP3510J.86A.
Changes to this specification will be published in the Intel Desktop Board DG33TL Specification
Update before being incorporated into a revision of this document.
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May 2007
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
®
desktop boards may contain design defects or errors known as errata, which may cause the product
Intel
to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel
literature, may be obtained from:
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Copyright © 2007, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel
Desktop Board DG33TL. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board
DG33TL and its components to the vendors, system integrators, and other engineers
and technicians who need this level of information. It is specifically not intended for
general audiences.
What This Document Contains
®
Chapter Description
1 A description of the hardware used on the board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
INTEGRATOR’S NOTES
#
Integrator’s notes are used to call attention to information that may be useful to
system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iii
Intel Desktop Board DG33TL Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbit Gigabit (1,073,741,824 bits)
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview........................................................................................ 10
1.1.1 Feature Summary ................................................................ 10
1.1.2 Board Layout ....................................................................... 12
1.1.3 Block Diagram ..................................................................... 14
1.2 Legacy Considerations...................................................................... 15
1.3 Online Support................................................................................ 15
1.4 Processor ....................................................................................... 15
1.5 System Memory .............................................................................. 16
1.5.1 Memory Configurations ......................................................... 17
1.6 Intel® G33 Express Chipset............................................................... 19
1.6.1 Intel G33 Graphics Subsystem ............................................... 19
1.6.2 Intel® Viiv™ Processor Technology.......................................... 21
1.6.3 USB ................................................................................... 21
1.6.4 Serial ATA Interfaces ............................................................ 22
1.7 Parallel IDE Controller ...................................................................... 23
1.8 Real-Time Clock Subsystem .............................................................. 23
1.9 Legacy I/O Controller ....................................................................... 24
1.9.1 Consumer Infrared (CIR)....................................................... 24
1.9.2 Serial Port........................................................................... 24
1.10 Audio Subsystem............................................................................. 25
1.10.1 Audio Subsystem Software .................................................... 26
1.10.2 Audio Connectors and Headers ............................................... 26
1.11 LAN Subsystem............................................................................... 27
1.11.1 Intel® 82566DC Gigabit Ethernet Controller.............................. 27
1.11.2 LAN Subsystem Software....................................................... 28
1.11.3 RJ-45 LAN Connector with Integrated LEDs .............................. 28
1.12 Hardware Management Subsystem .................................................... 29
1.12.1 Hardware Monitoring and Fan Control...................................... 29
1.12.2 Fan Monitoring..................................................................... 29
1.12.3 Chassis Intrusion and Detection.............................................. 29
1.12.4 Thermal Monitoring .............................................................. 30
1.13 Power Management ......................................................................... 31
1.13.1 ACPI .................................................................................. 31
1.13.2 Hardware Support ................................................................ 34
2 Technical Reference
2.1 Memory Map................................................................................... 39
2.1.1 Addressable Memory............................................................. 39
2.2 Connectors and Headers................................................................... 42
2.2.1 Back Panel Connectors .......................................................... 43
2.2.2 Component-side Connectors and Headers ................................ 44
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Intel Desktop Board DG33TL Technical Product Specification
2.3 Jumper Block .................................................................................. 53
2.4 Mechanical Considerations ................................................................ 54
2.4.1 Form Factor......................................................................... 54
2.5 Electrical Considerations ................................................................... 55
2.5.1 Power Supply Considerations ................................................. 55
2.5.2 Fan Header Current Capability................................................ 55
2.5.3 Add-in Board Considerations .................................................. 56
2.6 Thermal Considerations .................................................................... 56
2.7 Reliability ....................................................................................... 58
2.8 Environmental ................................................................................ 58
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 59
3.2 BIOS Flash Memory Organization ....................................................... 60
3.3 Resource Configuration .................................................................... 60
3.3.1 PCI* Autoconfiguration.......................................................... 60
3.3.2 PCI IDE Support................................................................... 61
3.4 System Management BIOS (SMBIOS)................................................. 61
3.5 Legacy USB Support ........................................................................ 62
3.6 BIOS Updates ................................................................................. 63
3.6.1 Language Support ................................................................ 63
3.6.2 Custom Splash Screen .......................................................... 63
3.7 BIOS Recovery................................................................................ 64
3.8 Boot Options................................................................................... 65
3.8.1 CD-ROM Boot ...................................................................... 65
3.8.2 Network Boot....................................................................... 65
3.8.3 Booting Without Attached Devices........................................... 65
3.8.4 Changing the Default Boot Device During POST ........................ 65
3.9 Adjusting Boot Speed....................................................................... 66
3.9.1 Peripheral Selection and Configuration..................................... 66
3.9.2 BIOS Boot Optimizations ....................................................... 66
3.10 BIOS Security Features .................................................................... 67
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 69
4.2 BIOS Beep Codes ............................................................................ 69
4.3 BIOS Error Messages ....................................................................... 69
4.4 Port 80h POST Codes ....................................................................... 70
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 75
5.1.1 Safety Standards.................................................................. 75
5.1.2 European Union Declaration of Conformity Statement................ 76
5.1.3 Product Ecology Statements................................................... 78
5.1.4 EMC Regulations .................................................................. 82
5.1.5 Product Certification Markings (Board Level)............................. 84
5.2 Battery Disposal Information............................................................. 85
vi
Contents
Figures
1. Major Board Components.................................................................. 12
2. Block Diagram ................................................................................ 14
3. Memory Channel and DIMM Configuration........................................... 18
4. Back Panel Audio Connector Options .................................................. 26
5. LAN Connector LED Locations............................................................ 28
6. Thermal Sensors and Fan Headers ..................................................... 30
7. Location of the Standby Power Indicator LED....................................... 37
8. Detailed System Memory Address Map ............................................... 40
9. Back Panel Connectors ..................................................................... 43
10. Component-side Connectors and Headers ........................................... 44
11. Connection Diagram for Front Panel Header ........................................ 50
12. Connection Diagram for Front Panel USB Headers ................................ 52
13. Connection Diagram for IEEE 1394a Header ........................................ 52
14. Location of the Jumper Block............................................................. 53
15. Board Dimensions ........................................................................... 54
16. Localized High Temperature Zones..................................................... 57
Tables
1. Feature Summary............................................................................ 10
2. Board Components Shown in Figure 1 ................................................ 13
3. Supported Memory Configurations ..................................................... 16
4. DVI Port Status Conditions................................................................ 20
5. Audio Jack Retasking Support ........................................................... 25
6. LAN Connector LED States ................................................................ 28
7. Effects of Pressing the Power Switch .................................................. 31
8. Power States and Targeted System Power........................................... 32
9. Wake-up Devices and Events ............................................................ 33
10. System Memory Map ....................................................................... 41
11. Component-side Connectors and Headers Shown in Figure 10................ 45
12. HD Audio Link Header ...................................................................... 46
13. Front Panel Audio Header ................................................................. 46
14. Serial ATA Connectors ...................................................................... 46
15. Serial Port Header ........................................................................... 46
16. Chassis Intrusion Header .................................................................. 47
17. Front and Rear Chassis (3-Pin) Fan Headers ........................................ 47
18. Processor (4-Pin) Fan Header ............................................................ 47
19. Auxiliary Front Panel Power/Sleep LED Header ..................................... 48
20. Processor Core Power Connector........................................................ 49
21. Main Power Connector...................................................................... 49
22. Front Panel Header .......................................................................... 50
23. States for a One-Color Power LED ...................................................... 51
24. States for a Two-Color Power LED ...................................................... 51
25. BIOS Setup Configuration Jumper Settings.......................................... 53
26. Recommended Power Supply Current Values ....................................... 55
27. Fan Header Current Capability........................................................... 55
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Intel Desktop Board DG33TL Technical Product Specification
28. Thermal Considerations for Components ............................................. 57
29. Desktop Board DG33TL Environmental Specifications............................ 58
30. BIOS Setup Program Menu Bar .......................................................... 60
31. BIOS Setup Program Function Keys.................................................... 60
32. Acceptable Drives/Media Types for BIOS Recovery ............................... 64
33. Boot Device Menu Options ................................................................ 65
34. Supervisor and User Password Functions............................................. 67
35. Beep Codes .................................................................................... 69
36. BIOS Error Messages ....................................................................... 69
37. Port 80h POST Code Ranges.............................................................. 70
38. Port 80h POST Codes ....................................................................... 71
39. Typical Port 80h POST Sequence........................................................ 74
40. Safety Standards............................................................................. 75
41. Lead-Free Board Markings ................................................................ 81
42. EMC Regulations ............................................................................. 82
43. Product Certification Markings ........................................................... 84
viii
1 Product Description
What This Chapter Contains
1.1 Overview........................................................................................ 10
1.2 Legacy Considerations...................................................................... 15
1.3 Online Support................................................................................ 15
1.4 Processor ....................................................................................... 15
1.5 System Memory .............................................................................. 16
1.6 Intel® G33 Express Chipset............................................................... 19
1.7 Parallel IDE Controller ...................................................................... 23
1.8 Real-Time Clock Subsystem .............................................................. 23
1.9 Legacy I/O Controller ....................................................................... 24
1.10 Audio Subsystem............................................................................. 25
1.11 LAN Subsystem............................................................................... 27
1.12 Hardware Management Subsystem .................................................... 29
1.13 Power Management ......................................................................... 31
9
Intel Desktop Board DG33TL Technical Product Specification
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the Desktop Board DG33TL.
Table 1. Feature Summary
Form Factor ATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters])
Processor Support for the following:
Memory
Chipset
Audio 8-channel (7.1) audio subsystem using the IDT* STAC9271D audio codec and
Video Intel® Graphics Media Accelerator (Intel® GMA) 3100 onboard graphics
Legacy I/O Control Legacy I/O controller for serial port header and Consumer Infrared (CIR)
Peripheral
Interfaces
LAN Support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel
BIOS
®
• Intel
• Intel
• Intel
• Intel
• Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR2 800 or DDR2 667 MHz DIMMs
• Support for up to 8 GB of system memory using DDR2 800 or DDR2
Intel
• Intel
• Intel
Dolby* Home Theater certification
subsystem.
• 12 USB 2.0 ports
• Two IEEE-1394a interfaces: one back panel connector and one front-panel
• Six Serial ATA (3 Gbps) interfaces, including one red-colored external Serial
• One Parallel ATA IDE interface with UDMA 33, ATA-66/100 support
• One serial port header (may require specialized chassis or cable for use)
Gigabit Ethernet Controller
• Intel
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
Core™2 Quad processor in an LGA775 socket with a 1066 MHz
system bus
®
Core™2 Duo processor in an LGA775 socket with a 1333 or 1066 or 800
MHz system bus
®
Pentium® Dual-Core processor in an LGA775 socket with an 800 MHz
system bus
®
Celeron® processor in an LGA775 socket with an 800 MHz system bus
667 DIMMs
®
G33 Express Chipset, consisting of:
®
82G33 Graphics and Memory Controller Hub (GMCH)
®
82801IR I/O Controller Hub (ICH9R)
header
ATA (eSATA) interface
®
BIOS (resident in the SPI Flash device)
and SMBIOS
®
82566DC
continued
10
Table 1. Feature Summary (continued)
Instantly Available
PC Technology
Expansion
Capabilities
Hardware Monitor
Subsystem
• Support for PCI* Local Bus Specification Revision 2.3
• Support for PCI Express* Revision 1.0a
• Suspend to RAM support
• Wake on PCI, RS-232, front panel, PS/2 devices, USB ports, LAN, and CIR
• One PCI Express x16 bus add-in card connector
• Two PCI Express x1 bus add-in card connectors
• One PCI Conventional bus connector
®
• Intel
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan headers
• Three fan sense inputs used to monitor fan activity
Quiet System Technology implemented through the Intel® Management
Engine in ICH9R
Product Description
11
Intel Desktop Board DG33TL Technical Product Specification
1.1.2 Board Layout
Figure 1 shows the location of the major components.
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.
12
Table 2. Board Components Shown in Figure 1
Item/callout
from
Figure 1 Description
A Front panel audio header
B Speaker
C PCI Conventional bus add-in card connector
D Battery
E PCI Express x1 connector
F PCI Express x1 connector
G Chassis intrusion header
H PCI Express x16 connector
I Back panel connectors
J Processor core power connector (2 X 2)
K Rear chassis fan connector
L LGA775 processor socket
M Intel 82G33 GMCH
N Processor fan header
O DIMM Channel A sockets
P DIMM Channel B sockets
Q Serial port header
R Main Power connector (2 X 12)
S Front panel header
T Auxiliary front panel power LED header
U Intel 82801IR I/O Controller Hub (ICH9R)
V BIOS Setup configuration jumper block
W Front chassis fan header
X Serial ATA connectors [5]
Y External Serial ATA (eSATA) connector
Z Front panel USB header
AA Front panel USB header
BB Front panel CIR receiver (input) header
CC Back panel CIR emitter (output) header
DD Front panel USB header
EE Parallel ATA connector
FF IEEE-1394a header
GG High Definition Audio Link header
Product Description
13
Intel Desktop Board DG33TL Technical Product Specification
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas.
Figure 2. Block Diagram
14
Product Description
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
• No parallel port
• No floppy drive connector
• No serial port on the back panel
• The serial port header is located near the memory sockets and may require a
specialized chassis or cabling solution to use
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel® Desktop Board DG33TL http://www.intel.com/products/motherboard/DG33TL/index.htm
Desktop Board Support http://support.intel.com/support/motherboards/desktop
Available configurations for the
Desktop Board DG33TL
Supported processors http://www.intel.com/go/findcpu
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
http://www.intel.com/products/motherboard/DG33TL/index.htm
1.4 Processor
The board is designed to support the following processors:
• Intel Core 2 Quad processor in an LGA775 socket with a 1066 MHz system bus
• Intel Core 2 Duo processor in an LGA775 socket with a 1333 or 1066 or 800 MHz
system bus
• Intel Pentium Dual-Core processor in an LGA775 socket with an 800 MHz
system bus
• Intel Celeron processor in an LGA775 socket with an 800 MHz system bus
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 105 W. The processors listed above are only
supported when falling within the wattage requirements of the DG33TL board. See
the Intel web site listed below for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://www.intel.com/go/findcpu
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
INTEGRATOR’S NOTE
#
Use only ATX12V-compliant power supplies.
For information about Refer to
Power supply connectors Section 2.2.2.4, page 49
15
Intel Desktop Board DG33TL Technical Product Specification
1.5 System Memory
The board has four DIMM sockets and support the following memory features:
• 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMS with x16 organization are not supported.
• 8 GB maximum total system memory using DDR2 800 or DDR2 667 DIMMs; refer
to Section
2.1.1 on page 39 for information on the total amount of addressable
memory.
• Minimum total system memory: 512 MB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR2 800 or DDR2 667 MHz SDRAM DIMMs
• DDR2 667 DIMMs with SPD timings of only 5-5-5 (tCL-tRCD-tRP)
• DDR2 800 DIMMs with SPD timings of only 5-5-5 or 6-6-6 (tCL-tRCD-tRP)
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 3. Supported Memory Configurations
DIMM
Type
DDR2 667 512 Mbit 256 MB 1 GB 4 GB
DDR2 667 1 Gbit 512 MB 2 GB 8 GB
DDR2 800 512 Mbit 256 MB 1 GB 4 GB
DDR2 800 1 Gbit 512 MB 2 GB 8 GB
SDRAM
Technology
Smallest usable
DIMM (one x16
Single-sided
DIMM)
Largest usable
DIMM (one x8
Double-sided
DIMM)
Maximum capacity
with four identical
x8 Double-sided
DIMMs
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb/
CS-025414.htm
16
Product Description
1.5.1 Memory Configurations
The Intel 82G33 GMCH supports the following types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
• Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system
memory map) is mapped to dual channel operation; the topmost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/
cs-011965.htm
17
Intel Desktop Board DG33TL Technical Product Specification
Figure 3 illustrates the memory channel and DIMM configuration.
NOTE
The DIMM 0 sockets of both channels are blue. The DIMM 1 sockets of both channels
are black.
Figure 3. Memory Channel and DIMM Configuration
INTEGRATOR’S NOTE
#
Regardless of the memory configuration used (dual channel, single channel, or flex
mode), DIMM 0 of Channel A must always be populated. This is a requirement of the
®
Intel
Management Engine.
18
Product Description
1.6 Intel® G33 Express Chipset
The Intel G33 Express chipset consists of the following devices:
• Intel 82G33 Graphics and Memory Controller Hub (GMCH) with Direct Media
Interface (DMI) interconnect
• Intel 82801IR I/O Controller Hub (ICH9R)
The GMCH component provides interfaces to the CPU, memory, PCI Express, and the
DMI interconnect. The component also provides integrated graphics capabilities
supporting 3D, 2D, and display capabilities. The ICH9R is a centralized controller for
the board’s I/O paths.
The chipset supports the following features:
• Onboard Graphics
• Dynamic Video Memory Technology
• USB
• Serial ATA
For information about Refer to
The Intel G33 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.6.1 Intel G33 Graphics Subsystem
The Intel G33 Express chipset contains two separate, mutually exclusive graphics
options. Either the Intel Graphics Media Accelerator 3100 (Intel GMA 3100) graphics
controller (contained within the 82G33 GMCH) is used, or a PCI Express x16 add-in
card can be used. When a PCI Express x16 add-in card is installed, the Intel GMA
3100 graphics controller is disabled.
1.6.1.1 Intel® Graphics Media Accelerator 3100 Graphics
Controller
The Intel GMA 3100 graphics controller features the following:
• 400 MHz core frequency
• High quality texture engine
⎯ DX9.0c* and OpenGL* 1.4 compliant
⎯ Hardware Pixel Shader 2.0
⎯ Vertex Shader Model 2.0
• 3D Graphics Rendering enhancements
⎯ 1.6 dual texture GigaPixel/sec max fill rate
⎯ 16-bit and 32-bit color
⎯ Vertex cache
• Video
⎯ Software DVD at 30 fps full screen
⎯ DVMT support up to 256 MB
19
Intel Desktop Board DG33TL Technical Product Specification
• Display
⎯ Supports analog displays up to 2048 x 1536 at 75 Hz refresh (QXGA)
⎯ Dual independent display support
⎯ DDC2B compliant interface with Advanced Digital Display 2 card or Media
Expansion Card (ADD2/MEC), support for TV-out/TV-in and DVI digital display
connections
1.6.1.2 Dynamic Video Memory Technology (DVMT)
DVMT enables enhanced graphics and memory performance through highly efficient
memory utilization. DVMT ensures the most efficient use of available system memory
for maximum 2-D/3-D graphics performance. Up to 256 MB of system memory can be
allocated to DVMT on systems that have 512 MB or more of total system memory
installed. DVMT returns system memory back to the operating system when the
additional system memory is no longer required by the graphics subsystem.
DVMT will always use a minimal fixed portion of system physical memory (as set in the
BIOS Setup program) for compatibility with legacy applications. An example of this
would be when using VGA graphics under DOS. Once loaded, the operating system
and graphics drivers allocate additional system memory to the graphics buffer as
needed for performing graphics functions.
NOTE
The use of DVMT requires operating system driver support.
1.6.1.3 Configuration Modes
The video modes supported by this board are based on the Extended Display
Identification Data (EDID) modes of the monitor to which the system is connected.
Standard monitors are assumed.
1.6.1.4 Digital Video Interface (DVI)
The DVI port supports only DVI-D displays. If a DVI-I display is connected, only the
digital signal will be displayed. The maximum supported resolution is 1600 x 1200 at
60 Hz. The DVI port is compliant with the DVI 1.0 specification.
Depending on the type of add-in card installed in the PCI Express x16 connector, the
DVI port will behave as described in
Table 4. DVI Port Status Conditions
PCI Express x16 connector status DVI port status
No add-in card installed Enabled
Non-video PCI Express x1 add-in card installed Enabled
PCI Express x4, x8, or 16 add-in card installed Disabled
ADD2 or MEC card installed Disabled
Table 4.
20
Product Description
1.6.1.5 Advanced Digital Display (ADD2/MEC) Card Support
The GMCH routes two multiplexed SDVO ports that are each capable of driving up to a
225 MHz pixel clock to the PCI Express x16 connector. When an ADD2/MEC card is
detected, the Intel GMA 3100 graphics controller is enabled and the PCI Express x16
connector is configured for SDVO mode. SDVO mode enables the SDVO ports to be
accessed by the ADD2/MEC card. An ADD2/MEC card can either be configured to
support simultaneous display or can be configured to support dual independent display
as an extended desktop configuration with different color depths and resolutions.
ADD2/MEC cards can be designed to support the following configurations:
• Low Voltage Differential Signaling (LVDS)
• Single device operating in dual channel mode
• HDTV output
• HDMI support (when used with the HD Audio Link)
1.6.2 Intel® Viiv™ Processor Technology
This Intel desktop board supports Intel® Viiv™ processor technology. To be eligible for
the Intel Viiv processor technology brand, a system must meet certain hardware and
software requirements. To get the list of requirements for Intel Viiv processor
technology branding as well as all the features supported by Intel Viiv processor
technology, refer to:
http://www.intel.com/products/viiv/index.htm
1.6.3 USB
The board supports up to 12 USB 2.0 ports, supports UHCI and EHCI, and uses UHCIand EHCI-compatible drivers.
The ICH9R provides the USB controller for all ports. The port arrangement is as
follows:
• Six ports are implemented with stacked back panel connectors
• Six ports are routed to three separate front panel USB headers
For information about Refer to
The location of the USB connectors on the back panel Figure 9, page 43
The location of the front panel USB headers Figure 10, page 44
21
Intel Desktop Board DG33TL Technical Product Specification
1.6.4 Serial ATA Interfaces
The board provides five Serial ATA (SATA) connectors, which support one device per
connector. The board also provides one red-colored external Serial ATA (eSATA)
connector.
1.6.4.1 Serial ATA Support
The DG33TL Desktop Board’s Serial ATA controller offers six independent Serial ATA
ports with a theoretical maximum transfer rate of 3 Gbits/sec per port. One device
can be installed on each port for a maximum of six Serial ATA devices. A point-topoint interface is used for host to device connections, unlike Parallel ATA IDE which
supports a master/slave configuration and two devices per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the
operating system. The Serial ATA controller can operate in both legacy and native
modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14
and 15). In Native mode, standard PCI Conventional bus resource steering is used.
Native mode is the preferred mode for configurations using the Windows* XP and
Windows Vista operating systems.
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see:
For information about Refer to
The location of the Serial ATA connectors Figure 10, page 44
http://www.serialata.org/.
1.6.4.2 Serial ATA RAID
The DG33TL Desktop Board supports the following RAID (Redundant Array of
Independent Drives) levels:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity
22
Product Description
1.7 Parallel IDE Controller
The Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The
Parallel ATA IDE interface supports the following modes:
• Programmed I/O (PIO): processor controls data transfer.
• 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to
16 MB/sec.
• Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 33 MB/sec.
• ATA-66: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is
device driver compatible.
• ATA-100: DMA protocol on IDE bus allows host and target throttling. The ATA-100
logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up
to 88 MB/sec.
NOTE
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce
reflections, noise, and inductive coupling.
The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives)
and ATA devices. The BIOS supports Logical Block Addressing (LBA) and Extended
Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate
and translation mode to the BIOS.
For information about Refer to
The location of the Parallel ATA IDE connector Figure 10, page 44
1.8 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded
into CMOS RAM at power-on.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one.
Figure 1 on page 12 shows the location of the battery.
23
Intel Desktop Board DG33TL Technical Product Specification
1.9 Legacy I/O Controller
The I/O controller provides the following features:
• Consumer Infrared (CIR) headers
• One serial port header
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• PS/2-style mouse and keyboard interfaces
• Intelligent power management, including a programmable wake-up event interface
• PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.9.1 Consumer Infrared (CIR)
The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer
Infrared usage models. Microsoft Windows Vista* is the supported operating system
The CIR feature is made up of two separate pieces: the receiving header, and the
emitter header. The receiving header consists of a filtered translated infrared input
compliant with Microsoft CIR specifications, and also a “learning” infrared input. This
learning input is simply a high pass input which the computer can use to “learn” to
speak the infrared communication language of other user remotes. The emitter
header consists of two output ports which the PC can use to emulate “learned”
infrared commands in order to control external electronic hardware.
Customers are required to buy or create their own interface modules to plug into Intel
Desktop Boards for this feature to work.
1.9.2 Serial Port
The board has one serial port header located on the component side of the board. The
serial port supports data transfers at speeds up to 115.2 kbits/sec with BIOS support.
For information about Refer to
The location of the serial port header Figure 10, page 44
The signal names of the serial port header Table 15, page 46
24
Product Description
1.10 Audio Subsystem
The onboard audio subsystem consists of the following:
• Intel 82801IR (ICH9R)
• IDT STAC9271D audio codec
• Back panel audio connectors
• Component-side audio headers:
⎯ Intel
⎯ HD audio link header
The audio subsystem supports the following features:
• Dolby Home Theater support
• A signal-to-noise (S/N) ratio of 95 dB
• Independent multi-streaming 7.1 audio (using the back panel audio connectors)
and stereo (using the Intel High Definition Audio front panel header).
• ADAT support from the back panel optical S/PDIF port
NOTE
The use of AC 97 front panel headers is not recommended for use with Microsoft
Windows Vista.
®
High Definition Audio front panel header
Table 5 lists the supported functions of the front panel and back panel audio jacks.
Table 5. Audio Jack Retasking Support
Audio Jack
Front panel – Green No Yes No Yes
Front panel – Pink No No Yes No
Back panel – Blue Yes Yes No No
Back panel – Green No Yes No Yes
Back panel – Pink No No Yes No
Back panel – Black No Yes No No
Back panel - Orange No Yes No No
Supports
Line in?
Supports
Line out?
Supports
Microphone?
Supports
Headphones?
25
Intel Desktop Board DG33TL Technical Product Specification
1.10.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section
1.10.2 Audio Connectors and Headers
The board contains audio connectors on the back panel and audio headers on the
component side of the board. The front panel audio header provides mic in and line
out signals for the front panel. Microphone bias is supported for both the front and
back panel microphone connectors.
The front/back panel audio connectors are configurable through the audio device
drivers. The available configurable audio ports are shown in
Figure 4.
1.2, page 15
Item Description
A Surround left/right channel audio out/Retasking Jack
B Center channel and LFE (subwoofer) audio out
C Line in
D Line out
E Mic in
F S/PDIF Digital Audio Out (Optical)
Figure 4. Back Panel Audio Connector Options
For information about Refer to
The location of the front panel audio header Figure 10, page 44
The signal names of the front panel audio header Table 13, page 46
The location of the HD Audio Link header Figure 10, page 44
The signal names of the HD Audio Link header Table 12, page 46
The back panel audio connectors Section 2.2.1, page 43
26
1.11 LAN Subsystem
The LAN subsystem consists of the following:
• Intel 82566DC Gigabit Ethernet Controller (10/100/1000 Mbits/sec)
• Intel 82801IR (ICH9R)
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between ICH9R and the LAN controller
• PCI Conventional bus power management
⎯ ACPI technology support
⎯ LAN wake capabilities
⎯ LAN subsystem software
For information about Refer to
LAN software and drivers http://downloadcenter.intel.com
Product Description
1.11.1 Intel® 82566DC Gigabit Ethernet Controller
The Intel 82566DC Gigabit Ethernet Controller supports the following features:
• PCI Express link
• 10/100/1000 IEEE 802.3 compliant
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Transmit TCP segmentation
• Full device driver compatibility
• PCI Express power management support
27
Intel Desktop Board DG33TL Technical Product Specification
1.11.2 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers Section
1.2, page 15
1.11.3 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5 below).
Item Description
A Link LED (Green)
B Data Rate LED (Green/Yellow)
Figure 5. LAN Connector LED Locations
Table 6 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 6. LAN Connector LED States
LED LED Color LED State Condition
Off LAN link is not established.
Link Green
Data Rate Green/Yellow
On LAN link is established.
Blinking LAN activity is occurring.
Off 10 Mbits/sec data rate is selected.
Green 100 Mbits/sec data rate is selected.
Yellow 1000 Mbits/sec data rate is selected.
28
Product Description
1.12 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Fan monitoring and control
• Thermal and voltage monitoring
• Chassis intrusion detection
1.12.1 Hardware Monitoring and Fan Control
The features of the hardware monitoring and fan control include:
• Intel Quiet System Technology, delivering acoustically-optimized thermal
management
• Fan speed control controllers and sensors integrated into the ICH9R
• Remote thermal diode sensor for ambient temperature sensing
• Thermal sensors in the processor, 82G33 GMCH, and 82801IR ICH9R
• Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.25 V, and
+VCCP) to detect levels above or below acceptable values
• Thermally monitored closed-loop fan control, for all three fans, that can adjust the
fan speed or switch the fans on or off as needed
1.12.2 Fan Monitoring
Fan monitoring can be implemented using Intel® Desktop Utilities or third-party
software.
For information about Refer to
The functions of the fan headers Section 1.13.2.2, page 35
1.12.3 Chassis Intrusion and Detection
The board supports a chassis security feature that detects if the chassis cover is
removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.
For information about Refer to
The location of the chassis intrusion header Figure 10, page 44
29
Intel Desktop Board DG33TL Technical Product Specification
1.12.4 Thermal Monitoring
Figure 6 shows the locations of the thermal sensors and fan headers.
Item Description
A Rear chassis fan
B Thermal diode, located on processor die
C Thermal diode, located on the GMCH die
D Remote thermal sensor
E Processor fan
F Thermal diode, located on the ICH9R die
G Front chassis fan
Figure 6. Thermal Sensors and Fan Headers
NOTE
The minimum thermal reporting threshold for the GMCH is 66°C. The GMCH thermal
sensor will display 66°C until the temperature rises above this point.
30
Product Description
1.13 Power Management
Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:
⎯ Power connector
⎯ Fan headers
⎯ LAN wake capabilities
⎯ Instantly Available PC technology
⎯ Wake from USB
⎯ Power Management Event signal (PME#) wake-up support
⎯ Wake from Consumer IR
1.13.1 ACPI
ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with the board requires an
operating system that provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake-up events (see
• Support for a front panel power and sleep mode switch
Table 9 on page 33)
Table 7 lists the system states based on how long the power switch is pressed,
depending on how ACPI is configured with an ACPI-aware operating system.
Table 7. Effects of Pressing the Power Switch
If the system is in this
state…
Off
(ACPI G2/G5 – Soft off)
On
(ACPI G0 – working state)
On
(ACPI G0 – working state)
Sleep
(ACPI G1 – sleeping state)
Sleep
(ACPI G1 – sleeping state)
…and the power switch
is pressed for
Less than four seconds Power-on
Less than four seconds Soft-off/Standby
More than four seconds Fail safe power-off
Less than four seconds Wake-up
More than four seconds Power-off
…the system enters this state
(ACPI G0 – working state)
(ACPI G1 – sleeping state)
(ACPI G2/G5 – Soft off)
(ACPI G0 – working state)
(ACPI G2/G5 – Soft off)
31
Intel Desktop Board DG33TL Technical Product Specification
1.13.1.1 System States and Power States
Under ACPI, the operating system directs all system and device power state
transitions. The operating system puts devices in and out of low-power states based
on user preferences and knowledge of how devices are being used by applications.
Devices that are not being used can be turned off. The operating system uses
information from applications and user settings to put the system as a whole into a
low-power state.
Table 8 lists the power states supported by the board along with the associated
system power targets. See the ACPI specification for a complete description of the
various system and power states.
Table 8. Power States and Targeted System Power
Global
States
G0 – working
state
G1 – sleeping
state
G1 – sleeping
state
G1 – sleeping
state
G2/S5 S5 – Soft off.
G3 –
mechanical off.
AC power is
disconnected
from the
computer.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis’ power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.
Sleeping States
S0 – working C0 – working D0 – working
S1 – Processor
stopped
S3 – Suspend to
RAM. Context
saved to RAM.
S4 – Suspend to
disk. Context
saved to disk.
Context not saved.
Cold boot is
required.
No power to the
system.
Processor
States
C1 – stop
grant
No power D3 – no power
No power D3 – no power
No power D3 – no power
No power D3 – no power for
Device States
state.
D1, D2, D3 –
device
specification
specific.
except for
wake-up logic.
except for
wake-up logic.
except for
wake-up logic.
wake-up logic,
except when
provided by
battery or
external source.
Targeted System
Power
Full power > 30 W
5 W < power < 52.5 W
Power < 5 W
Power < 5 W
Power < 5 W
No power to the system.
Service can be performed
safely.
(Note 1)
(Note 2)
(Note 2)
(Note 2)
32
Product Description
1.13.1.2 ENERGY STAR*
In 2007, the US Department of Energy and the US Environmental Protection Agency
revised the ENERGY STAR* requirements. Intel has worked directly with these two
governmental agencies to define the new requirements. Currently Intel Desktop
Boards meet the new requirements.
For information about Refer to
ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar
1.13.1.3 Wake-up Devices and Events
Table 9 lists the devices or specific events that can wake the computer from specific
states.
Table 9. Wake-up Devices and Events
These devices/events can wake up the computer… …from this state
LAN S1, S3, S4, S5
PME# signal S1, S3, S4, S5
Power switch S1, S3, S4, S5
RTC alarm S3, S4, S5
Serial port S3
USB S3
WAKE# signal S1, S3, S4, S5
Consumer IR S1, S3 (S4 and S5)
Notes:
1. For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option to
Power On will enable a wake-up event from LAN in the S5 state.
2. Wake from S4 and S5 is optional by the specification.
(Note 1)
(Note 1)
(Note 2)
NOTE
The use of these wake-up events from an ACPI state requires an operating system
that provides full ACPI support. In addition, software, drivers, and peripherals must
fully support ACPI wake events.
33
Intel Desktop Board DG33TL Technical Product Specification
1.13.2 Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake
capabilities and Instantly Available PC technology features are used. Failure to do so
can damage the power supply. The total amount of standby current required depends
on the wake devices supported and manufacturing options.
The board provides several power management hardware features, including:
• Power connector
• Fan headers
• LAN wake capabilities
• Instantly Available PC technology
• Wake from USB
• PME# signal wake-up support
• WAKE# signal wake-up support
• Wake from Consumer IR
LAN wake capabilities and Instantly Available PC technology require power from the
+5 V standby line.
NOTE
The use of Wake from USB technologies from an ACPI state requires an operating
system that provides full ACPI support.
1.13.2.1 Power Connector
ATX12V-compliant power supplies can turn off the system power through system
control. When an ACPI-enabled system receives the correct command, the power
supply removes all non-standby voltages.
When resuming from an AC power failure, the computer returns to the power state it
was in before power was interrupted (on or off). The computer’s response can be set
using the Last Power State feature in the BIOS Setup program’s Boot menu.
For information about Refer to
The location of the main power connector Figure 10, page 44
The signal names of the main power connector Table 21, page 49
34
Product Description
1.13.2.2 Fan Headers
The function/operation of the fan headers is as follows:
• The fans are on when the board is in the S0 state.
• The fans are off when the board is off or in the S3, S4, or S5 state.
• The CPU fan header is wired to a fan tachometer input and the Front and Rear fan
headers share the tachometer input of the hardware monitoring and fan control
device. All fan headers support closed-loop fan control that can adjust the fan
speed or switch the fan on or off as needed.
• All fan headers have a +12 V DC connection.
For information about Refer to
The locations of the fan headers and thermal sensors Figure 6, page 30
The signal names of the processor fan header Table 18, page 47
The signal names of the chassis fan headers Table 17, page 47
1.13.2.3 LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line from the power supply must be
capable of providing adequate +5 V standby current. Failure to provide adequate
standby current when implementing LAN wake capabilities can damage the power
supply.
LAN wake capabilities enable remote wake-up of the computer through a network.
The LAN subsystem PCI bus network adapter monitors network traffic at the Media
Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem
asserts a wake-up signal that powers up the computer. Depending on the LAN
implementation, the board supports LAN wake capabilities with ACPI in the following
ways:
• The PCI Express WAKE# signal
• The PCI bus PME# signal for PCI 2.3 compliant LAN designs
⎯ By Ping
⎯ Magic Packet
• The onboard LAN subsystem
• Wake from CIR
35
Intel Desktop Board DG33TL Technical Product Specification
1.13.2.4 Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line from the power supply
must be capable of providing adequate +5 V standby current. Failure to provide
adequate standby current when implementing Instantly Available PC technology can
damage the power supply.
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the
power supply is off, and the front panel LED is amber if dual colored, or off if single
colored.) When signaled by a wake-up device or event, the system quickly returns to
its last known wake state.
wake the computer from the S3 state.
The board supports the PCI Bus Power Management Interface Specification. Add-in
boards that also support this specification can participate in power management and
can be used to wake the computer.
The use of Instantly Available PC technology requires operating system support and
PCI 2.3 compliant add-in cards and drivers.
Table 9 on page 33 lists the devices and events that can
36
Product Description
1.13.2.5 Wake from USB
USB bus activity wakes the computer from ACPI S1 and S3 state.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB
and support in the OS.
1.13.2.6 PME# Signal Wake-up Support
When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI
S1, S3, S4, or S5 state (with Wake on PME enabled in BIOS).
1.13.2.7 WAKE# Signal Wake-up Support
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from
an ACPI S1, S3, S4, or S5 state.
1.13.2.8 +5 V Standby Power Indicator LED
The +5 V standby power indicator LED shows that power is still present even when the
computer appears to be off.
indicator LED.
Figure 7 shows the location of the standby power
CAUTION
If AC power has been switched off and the standby power indicator is still lit,
disconnect the power cord before installing or removing any devices connected to the
board. Failure to do so could damage the board and any attached devices.
Figure 7. Location of the Standby Power Indicator LED
37
Intel Desktop Board DG33TL Technical Product Specification
38
2 Technical Reference
What This Chapter Contains
2.1 Memory Map................................................................................... 39
2.2 Connectors and Headers................................................................... 42
2.3 Jumper Block .................................................................................. 53
2.4 Mechanical Considerations ................................................................ 54
2.5 Electrical Considerations ................................................................... 55
2.6 Thermal Considerations .................................................................... 56
2.7 Reliability ....................................................................................... 58
2.8 Environmental ................................................................................ 58
2.1 Memory Map
2.1.1 Addressable Memory
The board utilizes 8 GB of addressable system memory. Typically the address space
that is allocated for PCI Conventional bus add-in cards, PCI Express configuration
space, BIOS (SPI Flash), and chipset overhead resides above the top of DRAM (total
system memory). On a system that has 8 GB of system memory installed, it is not
possible to use all of the installed memory due to system address space being
allocated for other system critical functions. These functions include the following:
• BIOS/ SPI Flash (8 Mbits)
• Local APIC (19 MB)
• Digital Media Interface (40 MB)
• Front side bus interrupts (17 MB)
• PCI Express configuration space (256 MB)
• MCH base address registers, internal graphics ranges, PCI Express ports (up to
512 MB)
• Memory-mapped I/O that is dynamically allocated for PCI Conventional and PCI
Express add-in cards
• Base graphics memory support (1 MB or 8 MB)
• Intel Management Engine Interface single channel (8 MB) or dual channel (16 MB)
39
Intel Desktop Board DG33TL Technical Product Specification
The amount of installed memory that can be used will vary based on add-in cards and
BIOS settings.
Figure 8 shows a schematic of the system memory map. All installed
system memory can be used when there is no overlap of system addresses.
PCI Memory Range -
contains PCI, chipsets,
Direct Media Interface
(DMI), and ICH ranges
(approximately 750 MB)
DRAM
Range
DOS
Compatibility
Memory
Top of System Address Space
8 GB
FLASH
APIC
Reserved
Top of usable
DRAM (memory
visible to the
operating system)
1 MB
640 KB
0 MB
Upper
4 GB of
address
space
~20 MB
0FFFFFH
0F0000H
0EFFFFH
0E0000H
0DFFFFH
0C0000H
0BFFFFH
0A0000H
09FFFFH
00000H
Upper BIOS
area (64 KB)
Lower BIOS
area
(64 KB;
16 KB x 4)
Add-in Card
BIOS and
Buffer area
(128 KB;
16 KB x 8)
Standard PCI/
ISA Video
Memory (SMM
Memory)
128 KB
DOS area
(640 KB)
1 MB
960 KB
896 KB
768 KB
640 KB
0 KB
OM18311
Figure 8. Detailed System Memory Address Map
40
Table 10 lists the system memory map.
Table 10. System Memory Map
Technical Reference
Address Range
(decimal)
1024 K - 8388608 K 100000 - 1FFFFFFFF 8191 MB Extended memory
960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS
896 K - 960 K E0000 - EFFFF 64 KB Reserved
800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS
640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS
639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by
512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory
0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory
Address Range
(hex)
Size
Description
memory (open to the PCI bus).
Dependent on video adapter used.
memory manager software)
41
Intel Desktop Board DG33TL Technical Product Specification
2.2 Connectors and Headers
CAUTION
Only the following connectors have overcurrent protection: Back panel and front panel
USB, with support for 1394.
The other internal connectors/headers are not overcurrent protected and should
connect only to devices inside the computer’s chassis, such as fans and internal
peripherals. Do not use these connectors/headers to power devices external to the
computer’s chassis. A fault in the load presented by the external devices could cause
damage to the computer, the power cable, and the external devices themselves.
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use
shielded cable that meets the requirements for full-speed devices.
This section describes the board’s connectors and headers. The connectors and
headers can be divided into these groups:
• Back panel I/O connectors (see page
• Component-side connectors and headers (see page
43)
44)
42
2.2.1 Back Panel Connectors
Figure 9 shows the location of the back panel connectors.
Item Description
A VGA output
B DVI-D output
C IEEE-1394a
D USB ports [2]
E USB ports [2]
F LAN
G USB ports [2]
H Surround left/right channel audio out
I Center channel and LFE (subwoofer) audio out
J Audio line in
K S/PDIF Digital audio out (optical)
L Mic in
M Audio line out
Technical Reference
Figure 9. Back Panel Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
43
Intel Desktop Board DG33TL Technical Product Specification
2.2.2 Component-side Connectors and Headers
Figure 10 shows the locations of the component-side connectors and headers.
Figure 10. Component-side Connectors and Headers
44
Technical Reference
Table 11 lists the component-side connectors and headers identified in Figure 10.
Table 11. Component-side Connectors and Headers Shown in
Item/callout
from
Figure 10 Description
A Front panel audio header
B PCI Conventional bus add-in card connector
C PCI Express x1 add-in card connector
D PCI Express x1 add-in card connector
E Chassis intrusion header
F PCI Express x16 add-in card connector
G Processor core power connector (2 X 2)
H Rear chassis fan header
I Processor fan header
J Serial port header
K Main power connector (2 X 12)
L Front panel header
M Auxiliary front panel power LED header
N Front chassis fan header
O Serial ATA connectors [5]
P External Serial ATA (eSATA) connector
Q Front panel USB header
R Front panel USB header
S Front panel CIR receiver (input) header
T Back panel CIR emitter (output) header
U Front panel USB header
V Parallel ATA connector
W Front panel IEEE-1394a header
X High Definition Audio Link header
Figure 10
45
Intel Desktop Board DG33TL Technical Product Specification
2.2.2.1 Signal Tables for the Connectors and Headers
Table 12. HD Audio Link Header
Pin Signal Name Pin Signal Name
1 BCLK 2 Ground
3 RST# 4 3.3 VCC
5 SYNC 6 Ground
7 SDO 8 3.3 VCC
9 SDI0 10 +12 V
11 SDI1 12 Key (no pin)
13 Aud RSVD 14 3.3 V STBY
15 Aud RSVD 16 Ground
Table 13. Front Panel Audio Header
Pin Signal Name Pin Signal Name
1 [Port 2] Left channel 2 Ground
3 [Port 2] Right channel 4 PRESENCE# (Dongle present)
5 [Port 1] Right channel 6 [Port 1] SENSE_RETURN
7 SENSE_SEND (Jack detection) 8 Key (no pin)
9 [Port 2] Left channel 10 [Port 2] SENSE_RETURN
Table 14. Serial ATA Connectors
Pin Signal Name
1 Ground
2 TXP
3 TXN
4 Ground
5 RXN
6 RXP
7 Ground
Table 15. Serial Port Header
Pin Signal Name Pin Signal Name
1 DCD 2 RXD#
3 TXD# 4 DTR
5 Ground 6 DSR
7 RTS 8 CTS
9 RI 10 Key (no pin)
46
Table 16. Chassis Intrusion Header
Pin Signal Name
1 Intruder
2 Ground
Table 17. Front and Rear Chassis (3-Pin) Fan Headers
Pin Signal Name
1 Control
2 +12 V
3 Tach
Table 18. Processor (4-Pin) Fan Header
Pin Signal Name
1 Ground
2 +12 V
3 FAN_TACH
4 FAN_CONTROL
Technical Reference
Table 20. Back Panel CIR Emitter (Output) Header
Pin Signal Name
1 Emitter out 1
2 Emitter out 2
3 Ground
4 Key (no pin)
5 Jack detect 1
6 Jack detect 2
Table 21. Front Panel CIR Receiver (Input) Header
Pin Signal Name
1 Ground
2 LED
3 NC
4 Learn-in
5 5 V standby
6 VCC
7 Key (no pin)
8 CIR Input
47
Intel Desktop Board DG33TL Technical Product Specification
2.2.2.2 Add-in Card Connectors
The board has the following add-in card connectors:
• PCI Express x16: one connector supporting simultaneous transfer speeds up to
4 GBytes/sec of peak bandwidth per direction and up to 8 GBytes/sec concurrent
bandwidth
• PCI Express x1: two PCI Express x1 connectors. The x1 interface supports
simultaneous transfer speeds up to 250 Mbytes/sec of peak bandwidth per
direction and up to 500 MBytes/sec concurrent bandwidth
• PCI Conventional (rev 2.3 compliant) bus: one PCI Conventional bus add-in card
connector. PCI Conventional bus add-in cards with SMBus support can access
sensor data and other information residing on the board.
Note the following considerations for the PCI Conventional bus connectors:
• The PCI Conventional bus connector is bus master capable.
• SMBus signals are routed to the PCI Conventional bus connector. This enables PCI
Conventional bus add-in boards with SMBus support to access sensor data on the
board. The specific SMBus signals are as follows:
⎯ The SMBus clock line is connected to pin A40.
⎯ The SMBus data line is connected to pin A41.
2.2.2.3 Auxiliary Front Panel Power/Sleep LED Header
Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel
header.
Table 19. Auxiliary Front Panel Power/Sleep LED Header
Pin Signal Name In/Out Description
1 HDR_BLNK_GRN Out Front panel green LED
2 Not connected
3 HDR_BLNK_YEL Out Front panel yellow LED
48
Technical Reference
2.2.2.4 Power Supply Connectors
The board has the following power supply connectors:
• Main power – a 2 x 12 connector. This connector is compatible with 2 x 10
connectors previously used on Intel Desktop boards. The board supports the use
of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When
using a power supply with a 2 x 10 main power cable, attach that cable on the
rightmost pins of the main power connector, leaving pins 11, 12, 23, and 24
unconnected.
• Processor core power – a 2 x 2 connector. This connector provides power
directly to the processor voltage regulator and must always be used. Failure to do
so will prevent the board from booting.
Table 20. Processor Core Power Connector
Pin Signal Name Pin Signal Name
1 Ground 2 Ground
3 +12 V 4 +12 V
Table 21. Main Power Connector
Pin Signal Name Pin Signal Name
1 +3.3 V 13 +3.3 V
2 +3.3 V 14 -12 V
3 Ground 15 Ground
4 +5 V 16 PS-ON# (power supply remote on/off)
5 Ground 17 Ground
6 +5 V 18 Ground
7 Ground 19 Ground
8 PWRGD (Power Good) 20 No connect
9 +5 V (Standby) 21 +5 V
10 +12 V 22 +5 V
11 +12 V
12 2 x 12 connector detect
Note: When using a 2 x 10 power supply cable, this pin will be unconnected.
(Note)
23 +5 V
(Note)
24 Ground
(Note)
(Note)
For information about Refer to
Power supply considerations Section 2.5.1, page 55
49
Intel Desktop Board DG33TL Technical Product Specification
2.2.2.5 Front Panel Header
This section describes the functions of the front panel header. Table 22 lists the signal
names of the front panel header.
header.
Table 22. Front Panel Header
Figure 11 is a connection diagram for the front panel
Pin Signal
Hard Drive Activity LED Power LED
1 HD_PWR Out Hard disk LED
3 HDA# Out Hard disk active
Reset Switch On/Off Switch
5 Ground Ground 6 FPBUT_IN In Power switch
7 FP_RESET# In Reset switch 8 Ground Ground
Power Not Connected
9 +5 V Power 10 N/C Not connected
In/
Out Description
pull-up to +5 V
LED
Pin Signal
2 HDR_BLNK_GRN Out Front panel green
4 HDR_BLNK_YEL Out Front panel yellow
In/
Out Description
LED
LED
Figure 11. Connection Diagram for Front Panel Header
50
Technical Reference
2.2.2.5.1 Hard Drive Activity LED Header
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is
being read from or written to a hard drive. Proper LED function requires one of the
following:
• A Serial ATA hard drive connected to an onboard Serial ATA connector
• A Parallel ATA IDE hard drive connected to an onboard Parallel ATA IDE connector
2.2.2.5.2 Reset Switch Header
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type
switch that is normally open. When the switch is closed, the board resets and runs the
POST.
2.2.2.5.3 Power/Sleep LED Header
Pins 2 and 4 can be connected to a one- or two-color LED.
possible states for a one-color LED.
Table 24 shows the possible states for a two-color
Table 23 shows the
LED.
Table 23. States for a One-Color Power LED
LED State Description
Off Power off/sleeping
Steady Green Running
Table 24. States for a Two-Color Power LED
LED State Description
Off Power off
Steady Green Running
Steady Yellow Sleeping
NOTE
The colors listed in Table 23 and Table 24 are suggested colors only. Actual LED
colors are chassis-specific.
2.2.2.5.4 Power Switch Header
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The
switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power
supply to switch on or off. (The time requirement is due to internal debounce circuitry
on the board.) At least two seconds must pass before the power supply will recognize
another on/off signal.
51
Intel Desktop Board DG33TL Technical Product Specification
2.2.2.6 Front Panel USB Headers
Figure 12 is a connection diagram for the front panel USB headers.
INTEGRATOR’S NOTES
#
• The +5 V DC power on the USB headers is fused.
• Use only a front panel USB connector that conforms to the USB 2.0 specification
for high-speed USB devices.
Figure 12. Connection Diagram for Front Panel USB Headers
2.2.2.7 Front Panel IEEE 1394a Header
Figure 13 is a connection diagram for the IEEE 1394a header.
INTEGRATOR’S NOTES
#
• The +12 V DC power on the IEEE 1394a header is fused.
• The IEEE 1394a header provides one IEEE 1394a port.
Figure 13. Connection Diagram for IEEE 1394a Header
52
Technical Reference
2.3 Jumper Block
CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the
power cord from the computer before changing a jumper setting. Otherwise, the
board could be damaged.
Figure 14 shows the location of the jumper block. The jumper determines the BIOS
Setup program’s mode.
normal, configure, and recovery. When the jumper is set to configure mode and the
computer is powered-up, the BIOS compares the processor version and the microcode
version in the BIOS and reports if the two match.
Table 25 lists the jumper settings for the three modes:
Figure 14. Location of the Jumper Block
Table 25. BIOS Setup Configuration Jumper Settings
Function/Mode Jumper Setting Configuration
Normal 1-2
321
Configure 2-3
321
Recovery None
321
The BIOS uses current configuration information and
passwords for booting.
After the POST runs, Setup runs automatically. The
maintenance menu is displayed.
The BIOS attempts to recover the BIOS configuration. See
Section
3.7 for more information on BIOS recovery.
53
Intel Desktop Board DG33TL Technical Product Specification
2.4 Mechanical Considerations
2.4.1 Form Factor
The board is designed to fit into an ATX-form-factor chassis. Figure 15 illustrates the
mechanical form factor for the board. Dimensions are given in inches [millimeters].
The outer dimensions are 9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters]. Location of the I/O connectors and mounting holes are in
compliance with the ATX specification.
Figure 15. Board Dimensions
54
Technical Reference
2.5 Electrical Considerations
2.5.1 Power Supply Considerations
CAUTION
The +5 V standby line from the power supply must be capable of providing adequate
+5 V standby current. Failure to do so can damage the power supply. The total
amount of standby current required depends on the wake devices supported and
manufacturing options.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the indicated parameters of the ATX form factor
specification.
• The potential relation between 3.3 VDC and +5 VDC power rails
• The current capability of the +5 VSB line
• All timing parameters
• All voltage tolerances
For example, for a system consisting of a supported 65 W processor (see Section
on page
15 for a list of supported processors), 1 GB DDR2 RAM, one hard disk drive,
one optical drive, and all board peripherals enabled, the minimum recommended
power supply is 300 W.
Table 25 lists the recommended power supply current values
Table 26. Recommended Power Supply Current Values
Output Voltage
Current
For information about Refer to
Selecting an appropriate power supply http://support.intel.com/support/motherboards/desktop/sb/
3.3 V 5 V 12 V1 12 V2 -12 V 5 VSB
15 A 15 A 10 A 10 A 0.3 A 3.0 A
CS-026472.htm
2.5.2 Fan Header Current Capability
CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan
header. Connecting the processor fan to a chassis fan header may result in onboard
component damage that will halt fan operation.
Table 27 lists the current capability of the fan headers.
1.4
Table 27. Fan Header Current Capability
Fan Header Maximum Available Current
Processor fan 2.0 A
Front chassis fan 1.5 A
Rear chassis fan 1.5 A
55
Intel Desktop Board DG33TL Technical Product Specification
2.5.3 Add-in Board Considerations
The board is designed to provide 2 A (average) of +5 V current for each add-in board.
The total +5 V current draw for add-in boards for a fully loaded board (all three
expansion slots and the PCI Express x16 connector filled) must not exceed 8 A.
2.6 Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38 oC at the processor fan
inlet is a requirement. Use a processor heat sink that provides omni-directional
airflow to maintain required airflow across the processor voltage regulator area.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
http://developer.intel.com/design/motherbd/cooling.htm
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section
2.8.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit. The processor
voltage regulator area (shown in
an open chassis.
Figure 16) can reach a temperature of up to 85 oC in
56
Technical Reference
Figure 16 shows the locations of the localized high temperature zones.
Item Description
A Processor voltage regulator area
B Processor
C Intel 82G33 GMCH
D Intel 82801IR (ICH9R)
Figure 16. Localized High Temperature Zones
Table 28 provides maximum case temperatures for the board components that are
sensitive to thermal changes. The operating temperature, current load, or operating
frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the board.
Table 28. Thermal Considerations for Components
Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel 82G33 GMCH 97 oC (under bias)
Intel 82801IR (ICH9R) 92 oC (under bias)
For information about Refer to
Processor datasheets and specification updates Section 1.2, page 15
57
Intel Desktop Board DG33TL Technical Product Specification
2.7 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF
prediction is used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The Desktop Board DG33TL
MTBF is 218,279 hours.
2.8 Environmental
Table 29 lists the environmental specifications for the board.
Table 29. Desktop Board DG33TL Environmental Specifications
Parameter Specification
Temperature
Non-Operating
Operating
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/second²
Packaged Half sine 2 millisecond
Product weight (pounds) Free fall (inches) Velocity change
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 10 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
-40 °C to +70 °C
0 °C to +55 °C
(inches/sec²)
58
3 Overview of BIOS Features
What This Chapter Contains
3.1 Introduction ................................................................................... 59
3.2 BIOS Flash Memory Organization ....................................................... 60
3.3 Resource Configuration .................................................................... 60
3.4 System Management BIOS (SMBIOS)................................................. 61
3.5 Legacy USB Support ........................................................................ 62
3.6 BIOS Updates ................................................................................. 63
3.7 BIOS Recovery................................................................................ 64
3.8 Boot Options................................................................................... 65
3.9 Adjusting Boot Speed....................................................................... 66
3.10 BIOS Security Features .................................................................... 67
3.1 Introduction
The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash
Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash
contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN
EEPROM information, and Plug and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision
code. The initial production BIOSs are identified as
When the BIOS Setup configuration jumper is set to configure mode and the computer
is powered-up, the BIOS compares the CPU version and the microcode version in the
BIOS and reports if the two match.
The BIOS Setup program can be used to view and change the BIOS settings for the
computer. The BIOS Setup program is accessed by pressing the <F2> key after the
Power-On Self-Test (POST) memory test begins and before the operating system boot
begins. The menu bar is shown below.
Maintenance Main Advanced Security Power Boot Exit
NOTE
The maintenance menu is displayed only when the board is in configure mode.
Section
2.3 on page 53 shows how to put the board in configure mode.
DPP3510J.86A.
59
Intel Desktop Board DG33TL Technical Product Specification
Table 30 lists the BIOS Setup program menu features.
Table 30. BIOS Setup Program Menu Bar
Maintenance Main Advanced Security Power Boot Exit
Clears
passwords and
displays
processor
information
Displays
processor
and memory
configuretion
Configures
advanced
features
available
through the
chipset
Sets
passwords
and security
features
Configures
power
management
features and
power supply
controls
Table 31 lists the function keys available for menu screens.
Table 31. BIOS Setup Program Function Keys
Selects boot
options
Saves or
discards
changes to
Setup
program
options
BIOS Setup Program
Function Key
<←> or <→>
<↑> or <↓>
<Tab> Selects a field (Not implemented)
<Enter> Executes command or selects the submenu
<F9> Load the default configuration values for the current menu
<F10> Save the current values and exits the BIOS Setup program
<Esc> Exits the menu
Description
Selects a different menu screen (Moves the cursor left or right)
Selects an item (Moves the cursor up or down)
3.2 BIOS Flash Memory Organization
The Serial Peripheral Interface Flash Memory (SPI Flash) includes an 8 Mbit (1024 KB)
flash memory device.
3.3 Resource Configuration
3.3.1 PCI* Autoconfiguration
The BIOS can automatically configure PCI devices. PCI devices may be onboard or
add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having
to configure the system. When a user turns on the system after adding a PCI card,
the BIOS automatically configures interrupts, the I/O space, and other system
resources. Any interrupts set to Available in Setup are considered to be available for
use by the add-in card.
60
Overview of BIOS Features
3.3.2 PCI IDE Support
If you select Auto in the BIOS Setup program, the BIOS automatically sets up the
PCI IDE connector with independent I/O channel support. The IDE interface supports
hard drives up to ATA-66/100 and recognizes any ATAPI compliant devices, including
CD-ROM drives, tape drives, and Ultra DMA drives. The BIOS determines the
capabilities of each drive and configures them to optimize capacity and performance.
To take advantage of the high capacities typically available today, hard drives are
automatically configured for Logical Block Addressing (LBA) and to PIO Mode 3 or 4,
depending on the capability of the drive. You can override the auto-configuration
options by specifying manual configuration in the BIOS Setup program.
To use ATA-66/100/133 features the following items are required:
• An ATA-66/100/133 peripheral device
• An ATA-66/100/133 compatible cable
• ATA-66/100/133 operating system device drivers
NOTE
Do not connect an ATA device as a slave on the same IDE cable as an ATAPI master
device. For example, do not connect an ATA hard drive as a slave to an ATAPI
CD-ROM drive.
3.4 System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing
computers in a managed network.
The main component of SMBIOS is the Management Information Format (MIF)
database, which contains information about the computing system and its
components. Using SMBIOS, a system administrator can obtain the system types,
capabilities, operational status, and installation dates for system components. The
MIF database defines the data and provides the method for accessing this information.
The BIOS enables applications such as third-party management software to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the
SMBIOS information. The BIOS supports an SMBIOS table interface for such operating
systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information. Additional
board information can be found in the BIOS under the Additional Information header
under the Main BIOS page.
61
Intel Desktop Board DG33TL Technical Product Specification
3.5 Legacy USB Support
Legacy USB support enables USB devices to be used even when the operating
system’s USB drivers are not yet available. Legacy USB support is used to access the
BIOS Setup program, and to install an operating system that supports USB. By
default, Legacy USB support is set to Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to
enter and configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB
keyboards and mice are recognized and may be used to configure the operating
system. (Keyboards and mice are not recognized during this period if Legacy USB
support was set to Disabled in the BIOS Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB
devices are recognized by the operating system, and Legacy USB support from the
BIOS is no longer used.
7. Additional USB legacy feature options can be access by using Intel Integrator
Toolkit.
To install an operating system that supports USB, verify that Legacy USB support in
the BIOS Setup program is set to Enabled and follow the operating system’s
installation instructions.
62
Overview of BIOS Features
3.6 BIOS Updates
The BIOS can be updated using either of the following utilities, which are available on
the Intel World Wide Web site:
• Intel
• Intel
Both utilities verify that the updated BIOS matches the target system to prevent
accidentally installing an incompatible BIOS.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS
update.
For information about Refer to
BIOS update utilities http://support.intel.com/support/motherboards/desktop/sb/
®
Express BIOS Update utility, which enables automated updating while in the
Windows environment. Using this utility, the BIOS can be updated from a file on a
hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from
the file location on the Web.
®
Flash Memory Update Utility, which requires booting from DOS. Using this
utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash
drive or a USB hard drive), or a CD-ROM.
CS-022312.htm.
3.6.1 Language Support
The BIOS Setup program and help messages are supported in US English. Additional
languages are available in the Integrator’s Toolkit utility. Check the Intel website for
details.
3.6.2 Custom Splash Screen
During POST, an Intel® splash screen is displayed by default. This splash screen can
be augmented with a custom splash screen. The Intel
available from Intel can be used to create a custom splash screen.
NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.
For information about
Intel Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/
Additional Intel® software tools http://developer.intel.com/products/motherboard/dg965wh/tools.htm
Refer to
and
http://developer.intel.com/design/motherbd/software.htm
®
Integrator’s Toolkit that is
63
Intel Desktop Board DG33TL Technical Product Specification
3.7 BIOS Recovery
It is unlikely that anything will interrupt a BIOS update; however, if an interruption
occurs, the BIOS could be damaged.
can and cannot be used for BIOS recovery. The BIOS recovery media does not need
to be made bootable.
Table 32. Acceptable Drives/Media Types for BIOS Recovery
Media Type Can be used for BIOS recovery?
CD-ROM drive connected to the Parallel ATA interface Yes
CD-ROM drive connected to the Serial ATA interface Yes
USB removable drive (a USB Flash Drive, for example) Yes
USB diskette drive (with a 1.44 MB diskette) No
USB hard disk drive No
Legacy diskette drive (with a 1.44 MB diskette) connected to the
legacy diskette drive interface
For information about Refer to
BIOS recovery http://support.intel.com/support/motherboards/desktop
Table 32 lists the drives and media types that
No
64
Overview of BIOS Features
3.8 Boot Options
In the BIOS Setup program, the user can choose to boot from a diskette drive, hard
drive, USB drive, USB flash drive, CD-ROM, or the network. The default setting is for
the diskette drive to be the first boot device, the hard drive second, and the ATAPI
CD-ROM third. If enabled, the last default boot device is the network.
3.8.1 CD-ROM Boot
Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM
format specification. Under the Boot menu in the BIOS Setup program, ATAPI CDROM is listed as a boot device. Boot devices are defined in priority order. Accordingly,
if there is not a bootable CD in the CD-ROM drive, the system will attempt to boot
from the next defined drive.
3.8.2 Network Boot
The network can be selected as a boot device. This selection allows booting from the
onboard LAN or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To
use this key during POST, the User Access Level in the BIOS Setup program's Security
menu must be set to Full.
3.8.3 Booting Without Attached Devices
For use in embedded applications, the BIOS has been designed so that after passing
the POST, the operating system loader is invoked even if the following devices are not
present:
• Video adapter
• Keyboard
• Mouse
3.8.4 Changing the Default Boot Device During POST
Pressing the <F10> key during POST causes a boot device menu to be displayed. This
menu displays the list of available boot devices (as set in the BIOS setup program’s
Boot Device Priority Submenu).
Table 33. Boot Device Menu Options
Boot Device Menu Function Keys Description
<↑> or <↓>
<Enter> Exits the menu, saves changes, and boots from the selected
<Esc> Exits the menu without saving changes
Table 33 lists the boot device menu options.
Selects a default boot device
device
65
Intel Desktop Board DG33TL Technical Product Specification
3.9 Adjusting Boot Speed
These factors affect system boot speed:
• Selecting and configuring peripherals properly
• Optimized BIOS boot parameters
3.9.1 Peripheral Selection and Configuration
The following techniques help improve system boot speed:
• Choose a hard drive with parameters such as “power-up to data ready” less than
eight seconds, that minimize hard drive startup delays.
• Select a CD-ROM drive with a fast initialization rate. This rate can influence POST
execution time.
• Eliminate unnecessary add-in adapter features, such as logo displays, screen
repaints, or mode changes in POST. These features may add time to the boot
process.
• Try different monitors. Some monitors initialize and communicate with the BIOS
more quickly, which enables the system to boot more quickly.
3.9.2 BIOS Boot Optimizations
Use of the following BIOS Setup program settings reduces the POST execution time.
• In the Boot Menu, set the hard disk drive as the first boot device. As a result, the
POST does not first seek a diskette drive, which saves about one second from the
POST execution time.
• In the Peripheral Configuration submenu, disable the LAN device if it will not be
used. This can reduce up to four seconds of option ROM boot time.
NOTE
It is possible to optimize the boot process to the point where the system boots so
quickly that the Intel logo screen (or a custom logo splash screen) will not be seen.
Monitors and hard disk drives with minimum initialization times can also contribute to
a boot time that might be so fast that necessary logo screens and POST messages
cannot be seen.
This boot time may be so fast that some drives might be not be initialized at all. If
this condition should occur, it is possible to introduce a programmable delay ranging
from three to 30 seconds (using the Hard Disk Pre-Delay feature of the Advanced
Menu in the Drive Configuration Submenu of the BIOS Setup program).
66
Overview of BIOS Features
3.10 BIOS Security Features
The BIOS includes security features that restrict access to the BIOS Setup program
and who can boot the computer. A supervisor password and a user password can be
set for the BIOS Setup program and for booting the computer, with the following
restrictions:
• The supervisor password gives unrestricted access to view and change all the
Setup options in the BIOS Setup program. This is the supervisor mode.
• The user password gives restricted access to view and change Setup options in the
BIOS Setup program. This is the user mode.
• If only the supervisor password is set, pressing the <Enter> key at the password
prompt of the BIOS Setup program allows the user restricted access to Setup.
• If both the supervisor and user passwords are set, users can enter either the
supervisor password or the user password to access Setup. Users have access to
Setup respective to which password is entered.
• Setting the user password restricts who can boot the computer. The password
prompt will be displayed before the computer is booted. If only the supervisor
password is set, the computer boots without asking for a password. If both
passwords are set, the user can enter either password to boot the computer.
• For enhanced security, use different passwords for the supervisor and user
passwords.
• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to
16 characters in length.
Table 34 shows the effects of setting the supervisor password and user password.
This table is for reference only and is not displayed on the screen.
Table 34. Supervisor and User Password Functions
Password
Set
Neither Can change all
Supervisor
only
User only N/A Can change all
Supervisor
and user set
Note: If no password is set, any user can change all Setup options.
Supervisor
Mode
options
Can change all
options
Can change all
options
(Note)
User Mode
Can change all
options
Can change a
limited number
of options
options
Can change a
limited number
of options
(Note)
Setup Options
None None None
Supervisor Password Supervisor None
Enter Password
Clear User Password
Supervisor Password
Enter Password
Password
to Enter
Setup
User User
Supervisor or
user
Password
During
Boot
Supervisor or
user
67
Intel Desktop Board DG33TL Technical Product Specification
68
4 Error Messages and Beep Codes
What This Chapter Contains
4.1 Speaker ......................................................................................... 69
4.2 BIOS Beep Codes ............................................................................ 69
4.3 BIOS Error Messages ....................................................................... 69
4.4 Port 80h POST Codes ....................................................................... 70
4.1 Speaker
The board-mounted speaker provides audible error code (beep code) information
during POST.
For information about Refer to
The location of the onboard speaker Figure 1, page 12
4.2 BIOS Beep Codes
Whenever a recoverable error occurs during POST, the BIOS displays an error
message describing the problem (see
Table 35. Beep Codes
Type Pattern Frequency
Memory error Three long beeps 1280 Hz
Thermal warning Four alternating beeps:
High tone, low tone, high tone, low tone
Table 35).
High tone: 2000 Hz
Low tone: 1600 Hz
4.3 BIOS Error Messages
Table 36 lists the error messages and provides a brief description of each.
Table 36. BIOS Error Messages
Error Message Explanation
CMOS Battery Low The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been
corrupted. Run Setup to reset values.
Memory Size Decreased Memory size has decreased since the last boot. If no memory
was removed, then memory may be bad.
No Boot Device Available System did not find a device to boot.
69
Intel Desktop Board DG33TL Technical Product Specification
4.4 Port 80h POST Codes
During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O
port 80h. If the POST fails, execution stops and the last POST code generated is left
at port 80h. This code is useful for determining the point where an error occurred.
Displaying the POST codes requires a PCI bus add-in card, often called a POST card.
The POST card can decode the port and display the contents on a medium such as a
seven-segment display.
NOTE
The POST card must be installed in PCI bus connector 1.
The following tables provide information about the POST codes generated by the
BIOS:
•
Table 37 lists the Port 80h POST code ranges
•
Table 38 lists the Port 80h POST codes themselves
•
Table 39 lists the Port 80h POST sequence
NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal.
Table 37. Port 80h POST Code Ranges
Range Category/Subsystem
00 – 0F Debug codes: Can be used by any PEIM/driver for debug.
10 – 1F Host Processors: 1F is an unrecoverable CPU error.
20 – 2F Memory/Chipset: 2F is no memory detected or no useful memory detected.
30 – 3F Recovery: 3F indicated recovery failure.
40 – 4F Reserved for future use.
50 – 5F I/O Busses: PCI, USB, ISA, ATA, etc. 5F is an unrecoverable error. Start with PCI.
60 – 6F Reserved for future use (for new busses).
70 – 7F Output Devices: All output consoles. 7F is an unrecoverable error.
80 – 8F Reserved for future use (new output console codes).
90 – 9F Input devices: Keyboard/Mouse. 9F is an unrecoverable error.
A0 – AF Reserved for future use (new input console codes).
B0 – BF Boot Devices: Includes fixed media and removable media. BF is an unrecoverable error.
C0 – CF Reserved for future use.
D0 – DF Boot device selection.
E0 – FF E0 – EE: Miscellaneous codes. See Table 38.
EF: boot/S3 resume failure.
F0 – FF: FF processor exception.
70
Error Messages and Beep Codes
Table 38. Port 80h POST Codes
POST Code Description of POST Operation
10 Power-on initialization of the host processor (Boot Strap Processor)
11 Host processor cache initialization (including APs)
12 Starting Application processor initialization
13 SMM initialization
21 Initializing a chipset component
22 Reading SPD from memory DIMMs
23 Detecting presence of memory DIMMs
24 Programming timing parameters in the memory controller and the DIMMs
25 Configuring memory
26 Optimizing memory settings
27 Initializing memory, such as ECC init
28 Testing memory
50 Enumerating PCI busses
51 Allocating resources to PCI bus
52 Hot Plug PCI controller initialization
53 – 57 Reserved for PCI Bus
58 Resetting USB bus
59 Reserved for USB
5A Resetting PATA/SATA bus and all devices
5B Reserved for ATA
5C Resetting SMBus
5D Reserved for SMBus
70 Resetting the VGA controller
71 Disabling the VGA controller
72 Enabling the VGA controller
78 Resetting the console controller
79 Disabling the console controller
7A Enabling the console controller
Host Processor
Chipset
Memory
PCI Bus
USB
ATA/ATAPI/SATA
SMBus
Local Console
Remote Console
continued
71
Intel Desktop Board DG33TL Technical Product Specification
Table 38. Port 80h POST Codes (continued)
POST Code Description of POST Operation
90 Resetting keyboard
91 Disabling keyboard
92 Detecting presence of keyboard
93 Enabling the keyboard
94 Clearing keyboard input buffer
95 Instructing keyboard controller to run Self Test (PS/2 only)
98 Resetting mouse
99 Disabling mouse
9A Detecting presence of mouse
9B Enabling mouse
B0 Resetting fixed media
B1 Disabling fixed media
B2 Detecting presence of a fixed media (IDE hard drive detection etc.)
B3 Enabling/configuring a fixed media
B8 Resetting removable media
B9 Disabling removable media
BA Detecting presence of a removable media (IDE, CD-ROM detection, etc.)
BC Enabling/configuring a removable media
Dy Trying boot selection y (y=0 to 15)
E0 Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN
EFI_SW_PEI_PC_HANDOFF_TO_NEXT)
E2 Permanent memory found
E1, E3 Reserved for PEI/PEIMs
E4 Entered DXE phase
E5 Started dispatching drivers
E6 Started connecting drivers
Keyboard (PS/2 or USB)
Mouse (PS/2 or USB)
Fixed Media
Removable Media
BDS
PEI Core
DXE Core
continued
72
Error Messages and Beep Codes
Table 38. Port 80h POST Codes (continued)
POST Code Description of POST Operation
DXE Drivers
E7 Waiting for user input
E8 Checking password
E9 Entering BIOS setup
EB Calling Legacy Option ROMs
Runtime Phase/EFI OS Boot
F4 Entering Sleep state
F5 Exiting Sleep state
F8 EFI boot service ExitBootServices ( ) has been called
F9 EFI runtime service SetVirtualAddressMap ( ) has been called
FA EFI runtime service ResetSystem ( ) has been called
PEIMs/Recovery
30 Crisis Recovery has initiated per user request
31 Crisis Recovery has initiated by software (corrupt flash)
34 Loading recovery capsule
35 Handing off control to the recovery capsule
3F Unable to recover
73
Intel Desktop Board DG33TL Technical Product Specification
Table 39. Typical Port 80h POST Sequence
POST Code Description
21 Initializing a chipset component
22 Reading SPD from memory DIMMs
23 Detecting presence of memory DIMMs
25 Configuring memory
28 Testing memory
34 Loading recovery capsule
E4 Entered DXE phase
12 Starting application processor initialization
13 SMM initialization
50 Enumerating PCI busses
51 Allocating resourced to PCI bus
92 Detecting the presence of the keyboard
90 Resetting keyboard
94 Clearing keyboard input buffer
95 Keyboard Self Test
EB Calling Video BIOS
58 Resetting USB bus
5A Resetting PATA/SATA bus and all devices
92 Detecting the presence of the keyboard
90 Resetting keyboard
94 Clearing keyboard input buffer
5A Resetting PATA/SATA bus and all devices
28 Testing memory
90 Resetting keyboard
94 Clearing keyboard input buffer
E7 Waiting for user input
01 INT 19
00 Ready to boot
74
5 Regulatory Compliance and Battery
Disposal Information
What This Chapter Contains
5.1 Regulatory Compliance..................................................................... 75
5.2 Battery Disposal Information............................................................. 85
5.1 Regulatory Compliance
This section contains the following regulatory compliance information for Desktop
Board DG33TL:
• Safety standards
• European Union Declaration of Conformity statement
• Product Ecology statements
• Electromagnetic Compatibility (EMC) standards
• Product certification markings
5.1.1 Safety Standards
Desktop Board DG33TL complies with the safety standards stated in Table 40 when
correctly installed in a compatible host system.
Table 40. Safety Standards
Standard Title
UL 60950-1, First Edition Information Technology Equipment – Safety - Part 1: General
Requirements (USA and Canada)
EN 60950-1:2006, Second
Edition
IEC 60950-1:2005, Second
Edition
Information Technology Equipment – Safety - Part 1: General
Requirements (European Union)
Information Technology Equipment – Safety - Part 1: General
Requirements (International)
75
Intel Desktop Board DG33TL Technical Product Specification
5.1.2 European Union Declaration of Conformity
Statement
We, Intel Corporation, declare under our sole responsibility that the product Intel®
Desktop Board DG33TL is in conformity with all applicable essential requirements
necessary for CE marking, following the provisions of the European Council Directive
2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive).
The product is properly CE marked demonstrating this conformity and is for
distribution within all member states of the EU with no restrictions.
This product follows the provisions of the European Directives 2004/108/EC and
2006/95/EC.
Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC a
2006/95/EC.
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv
2004/108/EC & 2006/95/EC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief
2004/108/EC & 2006/95/EC.
Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC ja 2006/95/EC
kehtestatud nõuetele.
Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC & 2006/95/EC määräyksiä.
Français Ce produit est conforme aux exigences de la Directive Européenne
2004/108/EC & 2006/95/EC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie
2004/108/EC & 2006/95/EC.
Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών
2004/108/EC και 2006/95/EC.
Magyar E termék megfelel a 2004/108/EC és 2006/95/EC Európai Irányelv
előírásainak.
Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer
2004/108/EC & 2006/95/EC.
Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC &
2006/95/EC.
Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC un 2006/95/EC
noteikumiem.
Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC ir 2006/95/EC
nuostatas.
76
Regulatory Compliance and Battery Disposal Information
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej
2004/108/EC u 2006/95/EC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet
2004/108/EC & 2006/95/EC.
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej
2004/108/EC i 73/23/EWG.
Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC
& 2006/95/EC.
Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC &
2006/95/EC.
Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív
2004/108/EC a 2006/95/EC.
Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC in
2006/95/EC.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC &
2006/95/EC.
Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC ve 2006/95/EC yönergelerine uyar.
77
Intel Desktop Board DG33TL Technical Product Specification
5.1.3 Product Ecology Statements
The following information is provided to address worldwide product ecology concerns
and regulations.
5.1.3.1 Disposal Considerations
This product contains the following materials that may be regulated upon disposal:
lead solder on the printed wiring board assembly.
5.1.3.2 Recycling Considerations
As part of its commitment to environmental responsibility, Intel has implemented the
Intel Product Recycling Program to allow retail consumers of Intel’s branded products
to return used products to selected locations for proper recycling.
Please consult the
details of this program, including the scope of covered products, available locations,
shipping instructions, terms and conditions, etc.
中文
http://www.intel.com/intel/other/ehs/product_ecology for the
作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program
（英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作
恰当的重复使用处理。
请参考
了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。
Deutsch
Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel
Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel
Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für
ordnungsgemäßes Recycling zurückzugeben.
Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte,
verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der
http://www.intel.com/intel/other/ehs/product_ecology
Español
Como parte de su compromiso de responsabilidad medioambiental, Intel ha
implantado el programa de reciclaje de productos Intel, que permite que los
consumidores al detalle de los productos Intel devuelvan los productos usados en los
lugares seleccionados para su correspondiente reciclado.
Consulte la
del programa, que incluye los productos que abarca, los lugares disponibles,
instrucciones de envío, términos y condiciones, etc.
http://www.intel.com/intel/other/ehs/product_ecology
http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles
78
Regulatory Compliance and Battery Disposal Information
Français
Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis
en œuvre le programme Intel Product Recycling Program (Programme de recyclage
des produits Intel) pour permettre aux consommateurs de produits Intel de recycler
les produits usés en les retournant à des adresses spécifiées.
Visitez la page Web
http://www.intel.com/intel/other/ehs/product_ecology pour en
savoir plus sur ce programme, à savoir les produits concernés, les adresses
disponibles, les instructions d'expédition, les conditions générales, etc.
日本語
インテルでは、環境保護活動の一環として、使い終えたインテル
ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクル
プログラムを発足させました。
対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、
http://www.intel.com/in
tel/other/ehs/product_ecology （英語）をご覧ください。
Malay
Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran,
Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan
pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke
lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.
Sila rujuk
http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan
butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi
tersedia, arahan penghantaran, terma & syarat, dsb.
Portuguese
Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o
Programa de Reciclagem de Produtos para que os consumidores finais possam enviar
produtos Intel usados para locais selecionados, onde esses produtos são reciclados de
maneira adequada.
Consulte o site
http://www.intel.com/intel/other/ehs/product_ecology (em Inglês)
para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos,
os locais disponíveis, as instruções de envio, os termos e condições, etc.
Russian
В качестве части своих обязательств к окружающей среде, в Intel создана
программа утилизации продукции Intel (Product Recycling Program) для
предоставления конечным пользователям марок продукции Intel возможности
возврата используемой продукции в специализированные пункты для должной
утилизации.
Пожалуйста, обратитесь на веб-сайт
http://www.intel.com/intel/other/ehs/product_ecology за информацией об этой
программе, принимаемых продуктах, местах приема, инструкциях об отправке,
положениях и условиях и т.д.
79
Intel Desktop Board DG33TL Technical Product Specification
Türkçe
Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin
Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri
dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya
koymuştur.
Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve
şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen
http://www.intel.com/intel/other/ehs/product_ecology Web sayfasına gidin.
5.1.3.3 Lead Free Desktop Board
This Desktop Board is a European Union Restriction of Hazardous Substances (EU
RoHS Directive 2002/95/EC) compliant product. EU RoHS restricts the use of six
materials. One of the six restricted materials is lead.
This Desktop Board is lead free although certain discrete components used on the
board contain a small amount of lead which is necessary for component performance
and/or reliability. This Desktop Board is referred to as “Lead-free second level
interconnect.” The board substrate and the solder connections from the board to the
components (second-level connections) are all lead free.
China bans the same substances and has the same limits as EU RoHS; however it
requires different product marking and controlled substance information. The required
mark shows the Environmental Friendly Usage Period (EFUP). The EFUP is defined as
the number of years for which controlled listed substances will not leak or chemically
deteriorate while in the product.
80
Regulatory Compliance and Battery Disposal Information
Table 41 shows the various forms of the “Lead-Free 2nd Level Interconnect” mark as it
appears on the board and accompanying collateral.
Table 41. Lead-Free Board Markings
Description Mark
Lead-Free 2
This symbol is used to identify
electrical and electronic
assemblies and components in
which the lead (Pb) concentration
level in the desktop board
substrate and the solder
connections from the board to the
components (second-level
interconnect) is not greater than
0.1% by weight (1000 ppm).
nd
Level Interconnect:
or
or
81
Intel Desktop Board DG33TL Technical Product Specification
5.1.4 EMC Regulations
Desktop Board DG33TL complies with the EMC regulations stated in Table 42 when
correctly installed in a compatible host system.
Table 42. EMC Regulations
Regulation Title
FCC 47 CFR Part 15,
Subpart B
ICES-003 Issue 4
(Class B)
EN55022: 2006
(Class B)
EN55024:1998 Information Technology Equipment – Immunity Characteristics Limits and
EN55022:2006
(Class B)
CISPR 222005
+A1:2005 +A2:2006
(Class B)
CISPR 24: 1997
+A1:2001 +A2:2002
VCCI V-3/2007.04,
V-4/2007.04, Class B
Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio
Frequency Devices. (USA)
Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
Limits and methods of measurement of Radio Interference Characteristics
of Information Technology Equipment. (European Union)
methods of measurement. (European Union)
Australian Communications Authority, Standard for Electromagnetic
Compatibility. (Australia and New Zealand)
Limits and methods of measurement of Radio Disturbance Characteristics of
Information Technology Equipment. (International)
Information Technology Equipment – Immunity Characteristics – Limits and
Methods of Measurement. (International)
Voluntary Control for Interference by Information Technology Equipment.
(Japan)
82
Regulatory Compliance and Battery Disposal Information
Japanese Kanji statement translation: this is a Class B product based on the standard
of the Voluntary Control Council for Interference from Information Technology
Equipment (VCCI). If this is used near a radio or television receiver in a domestic
environment, it may cause radio interference. Install and use the equipment
according to the instruction manual.
Korean Class B statement translation: this is household equipment that is certified to
comply with EMC requirements. You may use this equipment in residential
environments and other non-residential environments.
83
Intel Desktop Board DG33TL Technical Product Specification
5.1.5 Product Certification Markings (Board Level)
Desktop Board DG33TL has the product certification markings shown in Table 43.
Table 43. Product Certification Markings
Description Mark
UL joint US/Canada Recognized Component mark. Includes adjacent UL file
number for Intel desktop boards: E210882.
FCC Declaration of Conformity logo mark for Class B equipment. Includes
Intel name and DG33TL model designation.
CE mark. Declaring compliance to European Union (EU) EMC directive and
Low Voltage directive.
Australian Communications Authority (ACA) C-tick mark. Includes adjacent
Intel supplier code number, N-232.
Japan VCCI (Voluntary Control Council for Interference) mark.
S. Korea MIC (Ministry of Information and Communication) mark. Includes
adjacent MIC certification number: CPU-DG33TL (B)
Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.
Includes adjacent Intel company number, D33025.
Printed wiring board manufacturer’s recognition mark. Consists of a unique
UL recognized manufacturer’s logo, along with a flammability rating (solder
side).
China RoHS/Environmentally Friendly Use Period Logo: This is an
example of the symbol used on Intel Desktop Boards and associated
collateral. The color of the mark may vary depending upon the application.
The Environmental Friendly Usage Period (EFUP) for Intel Desktop Boards has
been determined to be 10 years.
V-0
84
Regulatory Compliance and Battery Disposal Information
5.2 Battery Disposal Information
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.
PRECAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les
piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des
piles usagées doit respecter les réglementations locales en vigueur en matière de
protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier
bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i
overensstemmelse med gældende miljølovgivning.
OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
bør kastes i henhold til gjeldende miljølovgivning.
VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljövårdsbestämmelserna.
VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on
mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten
mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen
des Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.
85
Intel Desktop Board DG33TL Technical Product Specification
PRECAUCIÓN
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENÇÃO
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias
usadas deve ser feita de acordo com as regulamentações ambientais da região.
AŚCIAROŽZNAŚĆ
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.
Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых
акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.
UPOZORNÌNÍ
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné,
baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními
předpisy o životním prostředí.
Προσοχή
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία
λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι
δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με
τους κατά τόπο περιβαλλοντικούς κανονισμούς.
VIGYAZAT
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket
lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi
előírásoknak megfelelően kell kiselejtezni.
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Regulatory Compliance and Battery Disposal Information
AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi
peraturan alam sekitar tempatan.
OSTRZEŻENIE
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu
baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi
przepisami ochrony środowiska.
PRECAUŢIE
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.
Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să
respecte reglementările locale privind protecţia mediului.
ВНИМАНИЕ
При использовании батареи несоответствующего типа существует риск ее взрыва.
Батареи должны быть утилизированы по возможности. Утилизация батарей
должна проводится по правилам, соответствующим местным требованиям.
UPOZORNENIE
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.
Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí
vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.
POZOR
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.
Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.
.
UYARI
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri
dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.
OСТОРОГА
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.
Якщо можливо, використані батареї слід утилізувати. Утилізація використаних
батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.
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Intel Desktop Board DG33TL Technical Product Specification
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