Intel D95738-001US User Manual
Intel® Desktop Board
DG33TL
Technical Product Specification
May 2007
Order Number: D95738-001US
The Intel® Desktop Board DG33TL may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DG33TL Specification Update.
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DG33TL Technical Product
Specification.
This product specification applies to only the standard Intel® Desktop Board DG33TL with BIOS
identifier DPP3510J.86A.
Changes to this specification will be published in the Intel Desktop Board DG33TL Specification
Update before being incorporated into a revision of this document.
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to any such patents, trademarks, copyrights, or other intellectual property rights.
May 2007
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
®
desktop boards may contain design defects or errors known as errata, which may cause the product
Intel
to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel
literature, may be obtained from:
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Copyright © 2007, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel
Desktop Board DG33TL. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board
DG33TL and its components to the vendors, system integrators, and other engineers
and technicians who need this level of information. It is specifically not intended for
general audiences.
What This Document Contains
®
Chapter Description
1 A description of the hardware used on the board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
INTEGRATOR’S NOTES
#
Integrator’s notes are used to call attention to information that may be useful to
system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iii
Intel Desktop Board DG33TL Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbit Gigabit (1,073,741,824 bits)
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview........................................................................................ 10
1.1.1 Feature Summary ................................................................ 10
1.1.2 Board Layout ....................................................................... 12
1.1.3 Block Diagram ..................................................................... 14
1.2 Legacy Considerations...................................................................... 15
1.3 Online Support................................................................................ 15
1.4 Processor ....................................................................................... 15
1.5 System Memory .............................................................................. 16
1.5.1 Memory Configurations ......................................................... 17
1.6 Intel® G33 Express Chipset............................................................... 19
1.6.1 Intel G33 Graphics Subsystem ............................................... 19
1.6.2 Intel® Viiv™ Processor Technology.......................................... 21
1.6.3 USB ................................................................................... 21
1.6.4 Serial ATA Interfaces ............................................................ 22
1.7 Parallel IDE Controller ...................................................................... 23
1.8 Real-Time Clock Subsystem .............................................................. 23
1.9 Legacy I/O Controller ....................................................................... 24
1.9.1 Consumer Infrared (CIR)....................................................... 24
1.9.2 Serial Port........................................................................... 24
1.10 Audio Subsystem............................................................................. 25
1.10.1 Audio Subsystem Software .................................................... 26
1.10.2 Audio Connectors and Headers ............................................... 26
1.11 LAN Subsystem............................................................................... 27
1.11.1 Intel® 82566DC Gigabit Ethernet Controller.............................. 27
1.11.2 LAN Subsystem Software....................................................... 28
1.11.3 RJ-45 LAN Connector with Integrated LEDs .............................. 28
1.12 Hardware Management Subsystem .................................................... 29
1.12.1 Hardware Monitoring and Fan Control...................................... 29
1.12.2 Fan Monitoring..................................................................... 29
1.12.3 Chassis Intrusion and Detection.............................................. 29
1.12.4 Thermal Monitoring .............................................................. 30
1.13 Power Management ......................................................................... 31
1.13.1 ACPI .................................................................................. 31
1.13.2 Hardware Support ................................................................ 34
2 Technical Reference
2.1 Memory Map................................................................................... 39
2.1.1 Addressable Memory............................................................. 39
2.2 Connectors and Headers................................................................... 42
2.2.1 Back Panel Connectors .......................................................... 43
2.2.2 Component-side Connectors and Headers ................................ 44
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Intel Desktop Board DG33TL Technical Product Specification
2.3 Jumper Block .................................................................................. 53
2.4 Mechanical Considerations ................................................................ 54
2.4.1 Form Factor......................................................................... 54
2.5 Electrical Considerations ................................................................... 55
2.5.1 Power Supply Considerations ................................................. 55
2.5.2 Fan Header Current Capability................................................ 55
2.5.3 Add-in Board Considerations .................................................. 56
2.6 Thermal Considerations .................................................................... 56
2.7 Reliability ....................................................................................... 58
2.8 Environmental ................................................................................ 58
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 59
3.2 BIOS Flash Memory Organization ....................................................... 60
3.3 Resource Configuration .................................................................... 60
3.3.1 PCI* Autoconfiguration.......................................................... 60
3.3.2 PCI IDE Support................................................................... 61
3.4 System Management BIOS (SMBIOS)................................................. 61
3.5 Legacy USB Support ........................................................................ 62
3.6 BIOS Updates ................................................................................. 63
3.6.1 Language Support ................................................................ 63
3.6.2 Custom Splash Screen .......................................................... 63
3.7 BIOS Recovery................................................................................ 64
3.8 Boot Options................................................................................... 65
3.8.1 CD-ROM Boot ...................................................................... 65
3.8.2 Network Boot....................................................................... 65
3.8.3 Booting Without Attached Devices........................................... 65
3.8.4 Changing the Default Boot Device During POST ........................ 65
3.9 Adjusting Boot Speed....................................................................... 66
3.9.1 Peripheral Selection and Configuration..................................... 66
3.9.2 BIOS Boot Optimizations ....................................................... 66
3.10 BIOS Security Features .................................................................... 67
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 69
4.2 BIOS Beep Codes ............................................................................ 69
4.3 BIOS Error Messages ....................................................................... 69
4.4 Port 80h POST Codes ....................................................................... 70
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 75
5.1.1 Safety Standards.................................................................. 75
5.1.2 European Union Declaration of Conformity Statement................ 76
5.1.3 Product Ecology Statements................................................... 78
5.1.4 EMC Regulations .................................................................. 82
5.1.5 Product Certification Markings (Board Level)............................. 84
5.2 Battery Disposal Information............................................................. 85
vi
Contents
Figures
1. Major Board Components.................................................................. 12
2. Block Diagram ................................................................................ 14
3. Memory Channel and DIMM Configuration........................................... 18
4. Back Panel Audio Connector Options .................................................. 26
5. LAN Connector LED Locations............................................................ 28
6. Thermal Sensors and Fan Headers ..................................................... 30
7. Location of the Standby Power Indicator LED....................................... 37
8. Detailed System Memory Address Map ............................................... 40
9. Back Panel Connectors ..................................................................... 43
10. Component-side Connectors and Headers ........................................... 44
11. Connection Diagram for Front Panel Header ........................................ 50
12. Connection Diagram for Front Panel USB Headers ................................ 52
13. Connection Diagram for IEEE 1394a Header ........................................ 52
14. Location of the Jumper Block............................................................. 53
15. Board Dimensions ........................................................................... 54
16. Localized High Temperature Zones..................................................... 57
Tables
1. Feature Summary............................................................................ 10
2. Board Components Shown in Figure 1 ................................................ 13
3. Supported Memory Configurations ..................................................... 16
4. DVI Port Status Conditions................................................................ 20
5. Audio Jack Retasking Support ........................................................... 25
6. LAN Connector LED States ................................................................ 28
7. Effects of Pressing the Power Switch .................................................. 31
8. Power States and Targeted System Power........................................... 32
9. Wake-up Devices and Events ............................................................ 33
10. System Memory Map ....................................................................... 41
11. Component-side Connectors and Headers Shown in Figure 10................ 45
12. HD Audio Link Header ...................................................................... 46
13. Front Panel Audio Header ................................................................. 46
14. Serial ATA Connectors ...................................................................... 46
15. Serial Port Header ........................................................................... 46
16. Chassis Intrusion Header .................................................................. 47
17. Front and Rear Chassis (3-Pin) Fan Headers ........................................ 47
18. Processor (4-Pin) Fan Header ............................................................ 47
19. Auxiliary Front Panel Power/Sleep LED Header ..................................... 48
20. Processor Core Power Connector........................................................ 49
21. Main Power Connector...................................................................... 49
22. Front Panel Header .......................................................................... 50
23. States for a One-Color Power LED ...................................................... 51
24. States for a Two-Color Power LED ...................................................... 51
25. BIOS Setup Configuration Jumper Settings.......................................... 53
26. Recommended Power Supply Current Values ....................................... 55
27. Fan Header Current Capability........................................................... 55
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Intel Desktop Board DG33TL Technical Product Specification
28. Thermal Considerations for Components ............................................. 57
29. Desktop Board DG33TL Environmental Specifications............................ 58
30. BIOS Setup Program Menu Bar .......................................................... 60
31. BIOS Setup Program Function Keys.................................................... 60
32. Acceptable Drives/Media Types for BIOS Recovery ............................... 64
33. Boot Device Menu Options ................................................................ 65
34. Supervisor and User Password Functions............................................. 67
35. Beep Codes .................................................................................... 69
36. BIOS Error Messages ....................................................................... 69
37. Port 80h POST Code Ranges.............................................................. 70
38. Port 80h POST Codes ....................................................................... 71
39. Typical Port 80h POST Sequence........................................................ 74
40. Safety Standards............................................................................. 75
41. Lead-Free Board Markings ................................................................ 81
42. EMC Regulations ............................................................................. 82
43. Product Certification Markings ........................................................... 84
viii
1 Product Description
What This Chapter Contains
1.1 Overview........................................................................................ 10
1.2 Legacy Considerations...................................................................... 15
1.3 Online Support................................................................................ 15
1.4 Processor ....................................................................................... 15
1.5 System Memory .............................................................................. 16
1.6 Intel® G33 Express Chipset............................................................... 19
1.7 Parallel IDE Controller ...................................................................... 23
1.8 Real-Time Clock Subsystem .............................................................. 23
1.9 Legacy I/O Controller ....................................................................... 24
1.10 Audio Subsystem............................................................................. 25
1.11 LAN Subsystem............................................................................... 27
1.12 Hardware Management Subsystem .................................................... 29
1.13 Power Management ......................................................................... 31
9
Intel Desktop Board DG33TL Technical Product Specification
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the Desktop Board DG33TL.
Table 1. Feature Summary
Form Factor ATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters])
Processor Support for the following:
Memory
Chipset
Audio 8-channel (7.1) audio subsystem using the IDT* STAC9271D audio codec and
Video Intel® Graphics Media Accelerator (Intel® GMA) 3100 onboard graphics
Legacy I/O Control Legacy I/O controller for serial port header and Consumer Infrared (CIR)
Peripheral
Interfaces
LAN Support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel
BIOS
®
• Intel
• Intel
• Intel
• Intel
• Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR2 800 or DDR2 667 MHz DIMMs
• Support for up to 8 GB of system memory using DDR2 800 or DDR2
Intel
• Intel
• Intel
Dolby* Home Theater certification
subsystem.
• 12 USB 2.0 ports
• Two IEEE-1394a interfaces: one back panel connector and one front-panel
• Six Serial ATA (3 Gbps) interfaces, including one red-colored external Serial
• One Parallel ATA IDE interface with UDMA 33, ATA-66/100 support
• One serial port header (may require specialized chassis or cable for use)
Gigabit Ethernet Controller
• Intel
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
Core™2 Quad processor in an LGA775 socket with a 1066 MHz
system bus
®
Core™2 Duo processor in an LGA775 socket with a 1333 or 1066 or 800
MHz system bus
®
Pentium® Dual-Core processor in an LGA775 socket with an 800 MHz
system bus
®
Celeron® processor in an LGA775 socket with an 800 MHz system bus
667 DIMMs
®
G33 Express Chipset, consisting of:
®
82G33 Graphics and Memory Controller Hub (GMCH)
®
82801IR I/O Controller Hub (ICH9R)
header
ATA (eSATA) interface
®
BIOS (resident in the SPI Flash device)
and SMBIOS
®
82566DC
continued
10
Table 1. Feature Summary (continued)
Instantly Available
PC Technology
Expansion
Capabilities
Hardware Monitor
Subsystem
• Support for PCI* Local Bus Specification Revision 2.3
• Support for PCI Express* Revision 1.0a
• Suspend to RAM support
• Wake on PCI, RS-232, front panel, PS/2 devices, USB ports, LAN, and CIR
• One PCI Express x16 bus add-in card connector
• Two PCI Express x1 bus add-in card connectors
• One PCI Conventional bus connector
®
• Intel
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan headers
• Three fan sense inputs used to monitor fan activity
Quiet System Technology implemented through the Intel® Management
Engine in ICH9R
Product Description
11
Intel Desktop Board DG33TL Technical Product Specification
1.1.2 Board Layout
Figure 1 shows the location of the major components.
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.
12
Table 2. Board Components Shown in Figure 1
Item/callout
from
Figure 1 Description
A Front panel audio header
B Speaker
C PCI Conventional bus add-in card connector
D Battery
E PCI Express x1 connector
F PCI Express x1 connector
G Chassis intrusion header
H PCI Express x16 connector
I Back panel connectors
J Processor core power connector (2 X 2)
K Rear chassis fan connector
L LGA775 processor socket
M Intel 82G33 GMCH
N Processor fan header
O DIMM Channel A sockets
P DIMM Channel B sockets
Q Serial port header
R Main Power connector (2 X 12)
S Front panel header
T Auxiliary front panel power LED header
U Intel 82801IR I/O Controller Hub (ICH9R)
V BIOS Setup configuration jumper block
W Front chassis fan header
X Serial ATA connectors [5]
Y External Serial ATA (eSATA) connector
Z Front panel USB header
AA Front panel USB header
BB Front panel CIR receiver (input) header
CC Back panel CIR emitter (output) header
DD Front panel USB header
EE Parallel ATA connector
FF IEEE-1394a header
GG High Definition Audio Link header
Product Description
13
Intel Desktop Board DG33TL Technical Product Specification
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas.
Figure 2. Block Diagram
14
Product Description
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
• No parallel port
• No floppy drive connector
• No serial port on the back panel
• The serial port header is located near the memory sockets and may require a
specialized chassis or cabling solution to use
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel® Desktop Board DG33TL http://www.intel.com/products/motherboard/DG33TL/index.htm
Desktop Board Support http://support.intel.com/support/motherboards/desktop
Available configurations for the
Desktop Board DG33TL
Supported processors http://www.intel.com/go/findcpu
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
http://www.intel.com/products/motherboard/DG33TL/index.htm
1.4 Processor
The board is designed to support the following processors:
• Intel Core 2 Quad processor in an LGA775 socket with a 1066 MHz system bus
• Intel Core 2 Duo processor in an LGA775 socket with a 1333 or 1066 or 800 MHz
system bus
• Intel Pentium Dual-Core processor in an LGA775 socket with an 800 MHz
system bus
• Intel Celeron processor in an LGA775 socket with an 800 MHz system bus
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 105 W. The processors listed above are only
supported when falling within the wattage requirements of the DG33TL board. See
the Intel web site listed below for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://www.intel.com/go/findcpu
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
INTEGRATOR’S NOTE
#
Use only ATX12V-compliant power supplies.
For information about Refer to
Power supply connectors Section 2.2.2.4, page 49
15
Intel Desktop Board DG33TL Technical Product Specification
1.5 System Memory
The board has four DIMM sockets and support the following memory features:
• 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMS with x16 organization are not supported.
• 8 GB maximum total system memory using DDR2 800 or DDR2 667 DIMMs; refer
to Section
2.1.1 on page 39 for information on the total amount of addressable
memory.
• Minimum total system memory: 512 MB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR2 800 or DDR2 667 MHz SDRAM DIMMs
• DDR2 667 DIMMs with SPD timings of only 5-5-5 (tCL-tRCD-tRP)
• DDR2 800 DIMMs with SPD timings of only 5-5-5 or 6-6-6 (tCL-tRCD-tRP)
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 3. Supported Memory Configurations
DIMM
Type
DDR2 667 512 Mbit 256 MB 1 GB 4 GB
DDR2 667 1 Gbit 512 MB 2 GB 8 GB
DDR2 800 512 Mbit 256 MB 1 GB 4 GB
DDR2 800 1 Gbit 512 MB 2 GB 8 GB
SDRAM
Technology
Smallest usable
DIMM (one x16
Single-sided
DIMM)
Largest usable
DIMM (one x8
Double-sided
DIMM)
Maximum capacity
with four identical
x8 Double-sided
DIMMs
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb/
CS-025414.htm
16
Product Description
1.5.1 Memory Configurations
The Intel 82G33 GMCH supports the following types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
• Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system
memory map) is mapped to dual channel operation; the topmost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/
cs-011965.htm
17
Intel Desktop Board DG33TL Technical Product Specification
Figure 3 illustrates the memory channel and DIMM configuration.
NOTE
The DIMM 0 sockets of both channels are blue. The DIMM 1 sockets of both channels
are black.
Figure 3. Memory Channel and DIMM Configuration
INTEGRATOR’S NOTE
#
Regardless of the memory configuration used (dual channel, single channel, or flex
mode), DIMM 0 of Channel A must always be populated. This is a requirement of the
®
Intel
Management Engine.
18
Product Description
1.6 Intel® G33 Express Chipset
The Intel G33 Express chipset consists of the following devices:
• Intel 82G33 Graphics and Memory Controller Hub (GMCH) with Direct Media
Interface (DMI) interconnect
• Intel 82801IR I/O Controller Hub (ICH9R)
The GMCH component provides interfaces to the CPU, memory, PCI Express, and the
DMI interconnect. The component also provides integrated graphics capabilities
supporting 3D, 2D, and display capabilities. The ICH9R is a centralized controller for
the board’s I/O paths.
The chipset supports the following features:
• Onboard Graphics
• Dynamic Video Memory Technology
• USB
• Serial ATA
For information about Refer to
The Intel G33 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.6.1 Intel G33 Graphics Subsystem
The Intel G33 Express chipset contains two separate, mutually exclusive graphics
options. Either the Intel Graphics Media Accelerator 3100 (Intel GMA 3100) graphics
controller (contained within the 82G33 GMCH) is used, or a PCI Express x16 add-in
card can be used. When a PCI Express x16 add-in card is installed, the Intel GMA
3100 graphics controller is disabled.
1.6.1.1 Intel® Graphics Media Accelerator 3100 Graphics
Controller
The Intel GMA 3100 graphics controller features the following:
• 400 MHz core frequency
• High quality texture engine
⎯ DX9.0c* and OpenGL* 1.4 compliant
⎯ Hardware Pixel Shader 2.0
⎯ Vertex Shader Model 2.0
• 3D Graphics Rendering enhancements
⎯ 1.6 dual texture GigaPixel/sec max fill rate
⎯ 16-bit and 32-bit color
⎯ Vertex cache
• Video
⎯ Software DVD at 30 fps full screen
⎯ DVMT support up to 256 MB
19
Intel Desktop Board DG33TL Technical Product Specification
• Display
⎯ Supports analog displays up to 2048 x 1536 at 75 Hz refresh (QXGA)
⎯ Dual independent display support
⎯ DDC2B compliant interface with Advanced Digital Display 2 card or Media
Expansion Card (ADD2/MEC), support for TV-out/TV-in and DVI digital display
connections
1.6.1.2 Dynamic Video Memory Technology (DVMT)
DVMT enables enhanced graphics and memory performance through highly efficient
memory utilization. DVMT ensures the most efficient use of available system memory
for maximum 2-D/3-D graphics performance. Up to 256 MB of system memory can be
allocated to DVMT on systems that have 512 MB or more of total system memory
installed. DVMT returns system memory back to the operating system when the
additional system memory is no longer required by the graphics subsystem.
DVMT will always use a minimal fixed portion of system physical memory (as set in the
BIOS Setup program) for compatibility with legacy applications. An example of this
would be when using VGA graphics under DOS. Once loaded, the operating system
and graphics drivers allocate additional system memory to the graphics buffer as
needed for performing graphics functions.
NOTE
The use of DVMT requires operating system driver support.
1.6.1.3 Configuration Modes
The video modes supported by this board are based on the Extended Display
Identification Data (EDID) modes of the monitor to which the system is connected.
Standard monitors are assumed.
1.6.1.4 Digital Video Interface (DVI)
The DVI port supports only DVI-D displays. If a DVI-I display is connected, only the
digital signal will be displayed. The maximum supported resolution is 1600 x 1200 at
60 Hz. The DVI port is compliant with the DVI 1.0 specification.
Depending on the type of add-in card installed in the PCI Express x16 connector, the
DVI port will behave as described in
Table 4. DVI Port Status Conditions
PCI Express x16 connector status DVI port status
No add-in card installed Enabled
Non-video PCI Express x1 add-in card installed Enabled
PCI Express x4, x8, or 16 add-in card installed Disabled
ADD2 or MEC card installed Disabled
Table 4.
20
Product Description
1.6.1.5 Advanced Digital Display (ADD2/MEC) Card Support
The GMCH routes two multiplexed SDVO ports that are each capable of driving up to a
225 MHz pixel clock to the PCI Express x16 connector. When an ADD2/MEC card is
detected, the Intel GMA 3100 graphics controller is enabled and the PCI Express x16
connector is configured for SDVO mode. SDVO mode enables the SDVO ports to be
accessed by the ADD2/MEC card. An ADD2/MEC card can either be configured to
support simultaneous display or can be configured to support dual independent display
as an extended desktop configuration with different color depths and resolutions.
ADD2/MEC cards can be designed to support the following configurations:
• Low Voltage Differential Signaling (LVDS)
• Single device operating in dual channel mode
• HDTV output
• HDMI support (when used with the HD Audio Link)
1.6.2 Intel® Viiv™ Processor Technology
This Intel desktop board supports Intel® Viiv™ processor technology. To be eligible for
the Intel Viiv processor technology brand, a system must meet certain hardware and
software requirements. To get the list of requirements for Intel Viiv processor
technology branding as well as all the features supported by Intel Viiv processor
technology, refer to:
http://www.intel.com/products/viiv/index.htm
1.6.3 USB
The board supports up to 12 USB 2.0 ports, supports UHCI and EHCI, and uses UHCIand EHCI-compatible drivers.
The ICH9R provides the USB controller for all ports. The port arrangement is as
follows:
• Six ports are implemented with stacked back panel connectors
• Six ports are routed to three separate front panel USB headers
For information about Refer to
The location of the USB connectors on the back panel Figure 9, page 43
The location of the front panel USB headers Figure 10, page 44
21
Intel Desktop Board DG33TL Technical Product Specification
1.6.4 Serial ATA Interfaces
The board provides five Serial ATA (SATA) connectors, which support one device per
connector. The board also provides one red-colored external Serial ATA (eSATA)
connector.
1.6.4.1 Serial ATA Support
The DG33TL Desktop Board’s Serial ATA controller offers six independent Serial ATA
ports with a theoretical maximum transfer rate of 3 Gbits/sec per port. One device
can be installed on each port for a maximum of six Serial ATA devices. A point-topoint interface is used for host to device connections, unlike Parallel ATA IDE which
supports a master/slave configuration and two devices per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the
operating system. The Serial ATA controller can operate in both legacy and native
modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14
and 15). In Native mode, standard PCI Conventional bus resource steering is used.
Native mode is the preferred mode for configurations using the Windows* XP and
Windows Vista operating systems.
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see:
For information about Refer to
The location of the Serial ATA connectors Figure 10, page 44
http://www.serialata.org/.
1.6.4.2 Serial ATA RAID
The DG33TL Desktop Board supports the following RAID (Redundant Array of
Independent Drives) levels:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity
22
Product Description
1.7 Parallel IDE Controller
The Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The
Parallel ATA IDE interface supports the following modes:
• Programmed I/O (PIO): processor controls data transfer.
• 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to
16 MB/sec.
• Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 33 MB/sec.
• ATA-66: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is
device driver compatible.
• ATA-100: DMA protocol on IDE bus allows host and target throttling. The ATA-100
logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up
to 88 MB/sec.
NOTE
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce
reflections, noise, and inductive coupling.
The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives)
and ATA devices. The BIOS supports Logical Block Addressing (LBA) and Extended
Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate
and translation mode to the BIOS.
For information about Refer to
The location of the Parallel ATA IDE connector Figure 10, page 44
1.8 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded
into CMOS RAM at power-on.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one.
Figure 1 on page 12 shows the location of the battery.
23
Intel Desktop Board DG33TL Technical Product Specification
1.9 Legacy I/O Controller
The I/O controller provides the following features:
• Consumer Infrared (CIR) headers
• One serial port header
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• PS/2-style mouse and keyboard interfaces
• Intelligent power management, including a programmable wake-up event interface
• PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.9.1 Consumer Infrared (CIR)
The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer
Infrared usage models. Microsoft Windows Vista* is the supported operating system
The CIR feature is made up of two separate pieces: the receiving header, and the
emitter header. The receiving header consists of a filtered translated infrared input
compliant with Microsoft CIR specifications, and also a “learning” infrared input. This
learning input is simply a high pass input which the computer can use to “learn” to
speak the infrared communication language of other user remotes. The emitter
header consists of two output ports which the PC can use to emulate “learned”
infrared commands in order to control external electronic hardware.
Customers are required to buy or create their own interface modules to plug into Intel
Desktop Boards for this feature to work.
1.9.2 Serial Port
The board has one serial port header located on the component side of the board. The
serial port supports data transfers at speeds up to 115.2 kbits/sec with BIOS support.
For information about Refer to
The location of the serial port header Figure 10, page 44
The signal names of the serial port header Table 15, page 46
24
Product Description
1.10 Audio Subsystem
The onboard audio subsystem consists of the following:
• Intel 82801IR (ICH9R)
• IDT STAC9271D audio codec
• Back panel audio connectors
• Component-side audio headers:
⎯ Intel
⎯ HD audio link header
The audio subsystem supports the following features:
• Dolby Home Theater support
• A signal-to-noise (S/N) ratio of 95 dB
• Independent multi-streaming 7.1 audio (using the back panel audio connectors)
and stereo (using the Intel High Definition Audio front panel header).
• ADAT support from the back panel optical S/PDIF port
NOTE
The use of AC 97 front panel headers is not recommended for use with Microsoft
Windows Vista.
®
High Definition Audio front panel header
Table 5 lists the supported functions of the front panel and back panel audio jacks.
Table 5. Audio Jack Retasking Support
Audio Jack
Front panel – Green No Yes No Yes
Front panel – Pink No No Yes No
Back panel – Blue Yes Yes No No
Back panel – Green No Yes No Yes
Back panel – Pink No No Yes No
Back panel – Black No Yes No No
Back panel - Orange No Yes No No
Supports
Line in?
Supports
Line out?
Supports
Microphone?
Supports
Headphones?
25
Intel Desktop Board DG33TL Technical Product Specification
1.10.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section
1.10.2 Audio Connectors and Headers
The board contains audio connectors on the back panel and audio headers on the
component side of the board. The front panel audio header provides mic in and line
out signals for the front panel. Microphone bias is supported for both the front and
back panel microphone connectors.
The front/back panel audio connectors are configurable through the audio device
drivers. The available configurable audio ports are shown in
Figure 4.
1.2, page 15
Item Description
A Surround left/right channel audio out/Retasking Jack
B Center channel and LFE (subwoofer) audio out
C Line in
D Line out
E Mic in
F S/PDIF Digital Audio Out (Optical)
Figure 4. Back Panel Audio Connector Options
For information about Refer to
The location of the front panel audio header Figure 10, page 44
The signal names of the front panel audio header Table 13, page 46
The location of the HD Audio Link header Figure 10, page 44
The signal names of the HD Audio Link header Table 12, page 46
The back panel audio connectors Section 2.2.1, page 43
26
1.11 LAN Subsystem
The LAN subsystem consists of the following:
• Intel 82566DC Gigabit Ethernet Controller (10/100/1000 Mbits/sec)
• Intel 82801IR (ICH9R)
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between ICH9R and the LAN controller
• PCI Conventional bus power management
⎯ ACPI technology support
⎯ LAN wake capabilities
⎯ LAN subsystem software
For information about Refer to
LAN software and drivers http://downloadcenter.intel.com
Product Description
1.11.1 Intel® 82566DC Gigabit Ethernet Controller
The Intel 82566DC Gigabit Ethernet Controller supports the following features:
• PCI Express link
• 10/100/1000 IEEE 802.3 compliant
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Transmit TCP segmentation
• Full device driver compatibility
• PCI Express power management support
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