Intel® Desktop Board
D925XCV/D925XBC
Technical Product Specification
June 2004
Order Number: C68597-001
The Intel® Desktop Board D925XCV/D925XBC may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board D925XCV/D925XBC Specification Update.
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board D925XCV/D925XBC Technical
Product Specification
June 2004
This product specification applies to only standard Intel
®
Desktop Boards D925XCV and
D925XBC with BIOS identifier CV92510A.86A.
Changes to this specification will be published in the Intel Desktop Board D925XCV/D925XBC
Specification Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED
BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH
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provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other
intellectual property rights.
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Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.”
Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising
from future changes to them.
®
Intel
desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from:
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Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors,
®
power and environmental requirements, and the BIOS for these Intel
and D925XBC. It describes the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Boards
D925XCV and D925XBC and their components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not intended for
general audiences.
What This Document Contains
Desktop Boards: D925XCV
Chapter Description
1 A description of the hardware used on the Desktop Boards D925XCV and D925XBC
2 A map of the resources of the Desktop Boards
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these
symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
✏
Notes call attention to important information.
INTEGRATOR’S NOTES
#
Integrator’s notes are used to call attention to information that may be useful to system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iii
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
WARNING
Warnings indicate conditions, which if not observed, can cause personal injury.
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
(NxnX) When used in the description of a component, N indicates component type, xn are the relative
coordinates of its location on the Desktop Boards D925XCV and D925XBC, and X is the
instance of the particular part at that general location. For example, J5J1 is a connector,
located at 5J. It is the first connector in the 5J area.
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 PCI Bus Terminology Change...................................................................................... 11
1.2 Board Differences ........................................................................................................11
1.3 Overview ...................................................................................................................... 12
1.3.1 Feature Summary.......................................................................................... 12
1.3.2 Manufacturing Options ..................................................................................13
1.3.3 Board Layouts ...............................................................................................14
1.3.4 Block Diagram ............................................................................................... 18
1.4 Online Support ............................................................................................................. 19
1.5 Processor .....................................................................................................................19
1.6 System Memory ........................................................................................................... 20
1.6.1 Memory Configurations .................................................................................21
1.7 Intel® 925X Chipset...................................................................................................... 25
1.7.1 USB ............................................................................................................... 25
1.7.2 IDE Support ...................................................................................................25
1.7.3 Real-Time Clock, CMOS SRAM, and Battery................................................ 28
1.8 PCI Express Connectors.............................................................................................. 28
1.9 Auxiliary Power (AUX PWR) Output Connector........................................................... 28
1.10 I/O Controller................................................................................................................ 29
1.10.1 Serial Port...................................................................................................... 29
1.10.2 Parallel Port ...................................................................................................29
1.10.3 Diskette Drive Controller................................................................................ 30
1.10.4 Keyboard and Mouse Interface .....................................................................30
1.11 Audio Subsystem ......................................................................................................... 31
1.11.1 Audio Subsystem Software ...........................................................................31
1.11.2 Audio Connectors ..........................................................................................31
1.11.3 8-Channel (7.1) Audio Subsystem................................................................. 32
1.11.4 6-Channel (5.1) Audio Subsystem................................................................. 34
1.12 LAN Subsystem ...........................................................................................................35
1.12.1 Marvell Yukon 88E8050 PCI Express 1.0a Integrated MAC/PHY
Gigabit Ethernet Controller ............................................................................35
1.12.2 RJ-45 LAN Connector with Integrated LEDs ................................................. 35
1.12.3 Alert Standard Format (ASF) Support ........................................................... 36
1.12.4 LAN Subsystem Software.............................................................................. 36
1.13 Hardware Management Subsystem............................................................................. 37
1.13.1 Hardware Monitoring and Fan Control ASIC ................................................. 37
1.13.2 Thermal Monitoring........................................................................................ 38
1.13.3 Fan Monitoring............................................................................................... 40
1.13.4 Chassis Intrusion and Detection.................................................................... 40
1.14 Power Management .....................................................................................................40
1.14.1 ACPI .............................................................................................................. 40
1.14.2 Hardware Support .........................................................................................43
v
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
1.15 Trusted Platform Module (Optional) .............................................................................47
1.15.1 System Requirements ................................................................................... 47
1.15.2 Warning of Potential Data Loss .....................................................................47
1.15.3 Security Precautions...................................................................................... 48
1.15.4 Trusted Platform Module Ownership ............................................................. 49
1.15.5 Enabling the Trusted Platform Module .......................................................... 50
1.15.6 Assuming Trusted Platform Module Ownership ............................................ 50
1.15.7 Recovery Procedures ....................................................................................51
1.15.8 Clearing Trusted Platform Module Ownership............................................... 52
1.15.9 Software Support........................................................................................... 53
2 Technical Reference
2.1 Introduction ..................................................................................................................55
2.2 Memory Resources ......................................................................................................55
2.2.1 Addressable Memory..................................................................................... 55
2.2.2 Memory Map.................................................................................................. 57
2.3 DMA Channels .............................................................................................................57
2.4 Fixed I/O Map............................................................................................................... 58
2.5 PCI Configuration Space Map...................................................................................... 59
2.6 Interrupts ......................................................................................................................60
2.7 PCI Conventional Interrupt Routing Map .....................................................................61
2.8 Connectors................................................................................................................... 63
2.8.1 Back Panel Connectors .................................................................................63
2.8.2 Component-side Connectors......................................................................... 68
2.9 Jumper Block ...............................................................................................................80
2.10 Mechanical Considerations ..........................................................................................81
2.10.1 D925XCV Form Factor .................................................................................. 81
2.10.2 D925XBC Form Factor .................................................................................. 82
2.10.3 I/O Shield....................................................................................................... 83
2.11 Electrical Considerations.............................................................................................. 85
2.11.1 DC Loading.................................................................................................... 85
2.11.2 Add-in Board Considerations......................................................................... 85
2.11.3 Fan Connector Current Capability .................................................................86
2.11.4 Power Supply Considerations .......................................................................86
2.12 Thermal Considerations ...............................................................................................87
2.13 Reliability...................................................................................................................... 89
2.14 Environmental .............................................................................................................. 90
2.15 Regulatory Compliance................................................................................................ 91
2.15.1 Safety Regulations ........................................................................................91
2.15.2 EMC Regulations........................................................................................... 91
2.15.3 European Union Declaration of Conformity Statement.................................. 92
2.15.4 Product Ecology Statements ......................................................................... 93
2.15.5 Product Certification Markings (Board Level) ................................................94
vi
3 Overview of BIOS Features
3.1 Introduction ..................................................................................................................95
3.2 BIOS Flash Memory Organization ...............................................................................96
3.3 Resource Configuration ...............................................................................................96
3.3.1 PCI Autoconfiguration.................................................................................... 96
3.3.2 PCI IDE Support ............................................................................................96
3.4 System Management BIOS (SMBIOS) ........................................................................97
3.5 Legacy USB Support.................................................................................................... 97
3.6 BIOS Updates .............................................................................................................. 98
3.6.1 Language Support .........................................................................................98
3.6.2 Custom Splash Screen.................................................................................. 98
3.7 Boot Options ................................................................................................................99
3.7.1 CD-ROM Boot ...............................................................................................99
3.7.2 Network Boot .................................................................................................99
3.7.3 Booting Without Attached Devices ................................................................ 99
3.7.4 Changing the Default Boot Device During POST .......................................... 99
3.8 Fast Booting Systems with Intel® Rapid BIOS Boot................................................... 100
3.8.1 Peripheral Selection and Configuration .......................................................100
3.8.2 Intel Rapid BIOS Boot .................................................................................100
3.9 BIOS Security Features .............................................................................................101
Contents
4 Error Messages and Beep Codes
4.1 BIOS Error Messages ................................................................................................ 103
4.2 Port 80h POST Codes ...............................................................................................105
4.3 Bus Initialization Checkpoints ....................................................................................109
4.4 Speaker ..................................................................................................................... 110
4.5 BIOS Beep Codes...................................................................................................... 110
vii
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
Figures
1. Desktop Board D925XCV Components ....................................................................... 14
2. Desktop Board D925XBC Components ....................................................................... 16
3. Block Diagram.............................................................................................................. 18
4. Memory Channel and DIMM Configuration.................................................................. 21
5. Dual Channel (Interleaved) Mode Configuration with Two DIMMs .............................. 22
6. Dual Channel (Interleaved) Mode Configuration with Three DIMMs............................ 22
7. Dual Channel (Interleaved) Mode Configuration with Four DIMMs.............................. 23
8. Single Channel (Asymmetric) Mode Configuration with One DIMM............................. 24
9. Single Channel (Asymmetric) Mode Configuration with Three DIMMs ........................ 24
10. Front/Back Panel Audio Connector Options for 8-Channel (7.1) Audio Subsystem .... 32
11. 8-channel (7.1) Audio Subsystem Block Diagram........................................................ 33
12. Front/Back Panel Audio Connector Options for 6-Channel (5.1) Audio Subsystem .... 34
13. 6-Channel (5.1) Audio Subsystem Block Diagram....................................................... 34
14. LAN Connector LED Locations .................................................................................... 35
15. Thermal Monitoring for D925XCV Board .....................................................................38
16. Thermal Monitoring for D925XBC Board .....................................................................39
17. Location of the Standby Power Indicator LED on the D925XCV Board....................... 46
18. Detailed System Memory Address Map....................................................................... 56
19. Back Panel Connectors for 8-Channel (7.1) Audio Subsystem ...................................64
20. Back Panel Connectors for 6-Channel (5.1) Audio Subsystem ...................................66
21. D925XCV Component-side Connectors ......................................................................68
22. D925XBC Component-side Connectors ......................................................................70
23. Connection Diagram for Front Panel Connector ..........................................................77
24. Connection Diagram for Front Panel USB Connectors................................................ 78
25. Connection Diagram for IEEE 1394a Connectors........................................................ 79
26. Location of the Jumper Block....................................................................................... 80
27. Desktop Board D925XCV Dimensions......................................................................... 81
28. Desktop Board D925XBC Dimensions......................................................................... 82
29. I/O Shield Dimensions for Boards with the 8-Channel (7.1) Audio Subsystem............ 83
30. I/O Shield Dimensions for Boards with the 6-Channel (5.1) Audio Subsystem............ 84
31. Processor Heatsink for Omni-directional Airflow.......................................................... 87
32. Localized High Temperature Zones .............................................................................88
Tables
1. Summary of Board Differences .................................................................................... 11
2. Feature Summary ........................................................................................................12
3. Manufacturing Options .................................................................................................13
4. D925XCV Components Shown in Figure 1.................................................................. 15
5. D925XBC Components Shown in Figure 2.................................................................. 17
6. Supported Memory Configurations ..............................................................................20
7. LAN Connector LED States .........................................................................................35
8. Effects of Pressing the Power Switch ..........................................................................41
9. Power States and Targeted System Power ................................................................. 42
10. Wake-up Devices and Events ......................................................................................43
11. System Memory Map ................................................................................................... 57
12. DMA Channels .............................................................................................................57
13. I/O Map ........................................................................................................................58
viii
Contents
14. PCI Configuration Space Map...................................................................................... 59
15. Interrupts ......................................................................................................................60
16. PCI Interrupt Routing Map ...........................................................................................62
17. Back Panel Connectors Shown in Figure 19................................................................ 65
18. Back Panel Connectors Shown in Figure 20................................................................ 67
19. D925XCV Component-side Connectors Shown in Figure 21. .....................................69
20. D925XBC Component-side Connectors Shown in Figure 22. .....................................71
21. ATAPI CD-ROM Connector .........................................................................................72
22. Front Panel Audio Connector....................................................................................... 72
23. Front Chassis Fan and Rear Chassis Fan Connectors............................................... 72
24. Processor Fan Connector and Auxiliary Rear Fan Connector ....................................72
25. Chassis Intrusion Connector ........................................................................................73
26. SCSI Hard Drive Activity LED Connector (Optional).................................................... 73
27. Serial ATA Connectors................................................................................................. 73
28. Auxiliary Power Output Connector ...............................................................................73
29. Main Power Connector................................................................................................. 75
30. ATX12V Power Connector ...........................................................................................75
31. Alternate Power Connector ..........................................................................................75
32. Auxiliary Front Panel Power/Sleep LED Connector .....................................................76
33. Front Panel Connector .................................................................................................76
34. States for a One-Color Power LED ..............................................................................77
35. States for a Two-Color Power LED ..............................................................................77
36. BIOS Setup Configuration Jumper Settings................................................................. 80
37. DC Loading Characteristics .........................................................................................85
38. Fan Connector Current Capability................................................................................ 86
39. Thermal Considerations for Components ....................................................................89
40. Desktop Board D925XCV/D925XBC Environmental Specifications ............................ 90
41. Safety Regulations .......................................................................................................91
42. EMC Regulations ......................................................................................................... 91
43. Product Certification Markings ..................................................................................... 94
44. BIOS Setup Program Menu Bar................................................................................... 96
45. BIOS Setup Program Function Keys............................................................................ 96
46. Boot Device Menu Options ..........................................................................................99
47. Supervisor and User Password Functions .................................................................101
48. BIOS Error Messages ................................................................................................ 103
49. Uncompressed INIT Code Checkpoints..................................................................... 105
50. Boot Block Recovery Code Checkpoints ...................................................................105
51. Runtime Code Uncompressed in F000 Shadow RAM ............................................... 106
52. Bus Initialization Checkpoints ....................................................................................109
53. Upper Nibble High Byte Functions .............................................................................109
54. Lower Nibble High Byte Functions .............................................................................110
55. Beep Codes ...............................................................................................................111
ix
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
x
1 Product Description
What This Chapter Contains
1.1 PCI Bus Terminology Change...................................................................................... 11
1.2 Board Differences ........................................................................................................11
1.3 Overview ...................................................................................................................... 12
1.4 Online Support ............................................................................................................. 19
1.5 Processor .....................................................................................................................19
1.6 System Memory ........................................................................................................... 20
1.7 Intel® 925X Chipset...................................................................................................... 25
1.8 PCI Express Connectors.............................................................................................. 28
1.9 Auxiliary Power (AUX PWR) Output Connector........................................................... 28
1.10 I/O Controller................................................................................................................ 29
1.11 Audio Subsystem ......................................................................................................... 31
1.12 LAN Subsystem ...........................................................................................................35
1.13 Hardware Management Subsystem............................................................................. 37
1.14 Power Management .....................................................................................................40
1.1 PCI Bus Terminology Change
Previous generations of Intel® Desktop Boards used an add-in card connector referred to as PCI.
This generation of Intel Desktop Boards adds a new technology for add-in cards: PCI Express*.
The 32-bit parallel bus previously referred to as PCI is now called PCI Conventional.
1.2 Board Differences
This TPS describes these Intel Desktop Boards: D925XCV and D925XBC. The Desktop Boards
are identical with the exception of the items listed in Table 1.
Table 1. Summary of Board Differences
D925XCV
D925XBC
• ATX Form Factor (10.20 inches by 9.60 inches [259.08 millimeters by
243.84 millimeters])
• Four PCI Conventional bus add-in card connectors
• Two PCI Express x1 bus add-in card connectors
• Auxiliary rear fan connector
• Option for auxiliary power output connector
• Option for SCSI hard drive indicator LED
• Option for Trusted Platform Module (TPM)
• microATX Form Factor (9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters])
• Two PCI Conventional bus add-in card connectors
• One PCI Express x1 bus add-in card connector
11
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
NOTE
✏
Most of the illustrations in this document show only the Desktop Board D925XCV. When there are
significant differences between the two Desktop Boards, illustrations of both boards are provided.
1.3 Overview
1.3.1 Feature Summary
Table 2 summarizes the major features of the Desktop Boards D925XCV and D925XBC.
Table 2. Feature Summary
Form Factor
Processor Support for an Intel® Pentium® 4 processor in an LGA775 socket with an 800 or
Memory
Chipset
Video One PCI Express x16 connector supporting PCI Express x16 graphics cards
Audio Intel® High Definition Audio subsystem
I/O Control LPC Bus I/O controller
USB Support for USB 2.0 devices
Peripheral
Interfaces
BIOS
Instantly Available
PC Technology
• D925XCV: ATX (10.20 inches by 9.60 inches [259.08 millimeters by
243.84 millimeters])
• D925XBC: microATX (9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters])
533 MHz system bus
• Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR2 400 MHz and DDR2 533 MHz DIMMs
• Support for up to 4 GB of system memory
®
Intel
925X Chipset, consisting of:
®
• Intel
• Intel
• 8 Mbit Firmware Hub (FWH)
• Eight USB ports
• One serial port
• One parallel port
• Four Serial ATA interfaces
• One Parallel ATA IDE interface with UDMA 33, ATA-66/100 support
• One diskette drive interface
• PS/2* keyboard and mouse ports
• Intel/AMI BIOS (resident in the 8 Mbit FWH)
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
• Support for PCI Local Bus Specification Revision 2.2
• Support for PCI Express Revision 1.0a
• Suspend to RAM support
• Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
82925X Memory Controller Hub (MCH)
®
82801FR I/O Controller Hub (ICH6-R)
and SMBIOS
continued
12
Product Description
Table 2. Feature Summary (continued)
LAN Support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Marvell* Yukon*
88E8050 PCI Express Gigabit Ethernet Controller
Expansion
Capabilities
Hardware Monitor
Subsystem
• D925XCV: Four PCI Conventional bus add-in card connectors (SMBus routed
to PCI Conventional bus connector 2), two PCI Express x1 bus add-in card
connectors, and one PCI Express x16 bus add-in card connector
• D925XBC: Two PCI Conventional bus add-in card connectors (SMBus routed to
PCI Conventional bus connector 2), one PCI Express x1 bus add-in card
connector, and one PCI Express x16 bus add-in card connector
• Hardware monitoring and fan control ASIC
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan connectors
• Three fan sense inputs used to monitor fan activity
• Fan speed control
1.3.2 Manufacturing Options
Table 3 describes the manufacturing options on the Desktop Boards D925XCV and D925XBC.
Not every manufacturing option is available in all marketing channels. Please contact your Intel
representative to determine which manufacturing options are available to you.
Table 3. Manufacturing Options
Audio Subsystem Intel High Definition Audio subsystem in one of the following configurations:
• 8-channel (7.1) audio subsystem with five analog audio outputs and two S/PDIF
• 6-channel (5.1) audio subsystem with three analog audio outputs using the
Alternate (ALT)
Power Input
Connector
Auxiliary (AUX)
Power Output
Connector
IEEE-1394a
Interface
SCSI Hard Drive
Activity LED
Connector
Trusted Platform
Module (TPM)
For information about Refer to
Available configurations for the Desktop Boards D925XCV and D925XBC Section 1.4, page 19
Provides required additional power when using a power supply with a 20-pin (2x10)
main power connector. Not required when using a power supply with a 24-pin (2x12)
main power connector.
Provides power for internal chassis lighting (D925XCV board only)
IEEE-1394a controller and three IEEE-1394a connectors (one back panel connector,
two front-panel connectors)
Allows add-in hard drive controllers (SCSI or other) to use the same LED as the
onboard IDE controller. (D925XCV board only)
A component that enhances platform security (D925XCV board only)
digital audio outputs (coaxial and optical) using the Realtek* ALC880 audio codec
Realtek ALC860 audio codec
13
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
1.3.3 Board Layouts
Figure 1 shows the location of the major components on the Desktop Board D925XCV.
LL
KK
JJ
HH
GG
FF
MM
II
B
D
E
F
A
C
G
I
H
J
K
L
M
M
O
P
Q
EE
DD
CC
BB
AA
X
Z
V
W
Y
U
Figure 1. Desktop Board D925XCV Components
Table 4 lists the D925XCV components identified in Figure 1.
R
T
S
OM16676
14
Table 4. D925XCV Components Shown in Figure 1.
Item/callout from Figure 1 Description
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
AA
BB
CC
DD
EE
FF
GG
HH
II
JJ
KK
LL
MM
Auxiliary rear fan connector
ATAPI CD-ROM connector
PCI Express x1 bus add-in card connectors
Audio codec
Front panel audio connector
PCI Conventional bus add-in card connectors
Marvell Yukon 88E8050 PCI Express Gigabit Ethernet Controller
PCI Express x16 bus add-in card connector
Rear chassis fan connector
Back panel connectors
Alternate power connector
+12V power connector (ATX12V)
LGA775 processor socket
Processor fan connector
Intel 82925X MCH
DIMM Channel A sockets
DIMM Channel B sockets
I/O controller
Power connector
Diskette drive connector
Parallel ATE IDE connector
Battery
Chassis intrusion connector
BIOS Setup configuration jumper block
8 Mbit Firmware Hub (FWH)
Front chassis fan connector
Serial ATA connectors
Auxiliary front panel power LED connector
Front panel connector
SCSI hard drive indicator LED (optional)
Auxiliary power output connector (optional)
Front panel USB connector
TPM component (optional)
Front panel USB connector
Intel 82801FR I/O Controller Hub (ICH6-R)
Front panel IEEE-1394a connectors (optional)
IEEE-1394a controller (optional)
Speaker
PCI Conventional bus add-in card connectors
Product Description
15
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
Figure 2 shows the location of the major components on the Desktop Board D925XBC.
HH
GG
FF
EE
DD
CC
BB
AA
A
B
C
D
F
E
G
H
I
J
K
L
M
N
Z
U
W
Y
S
X
T
V
R
Figure 2. Desktop Board D925XBC Components
Table 5 lists the D925XCV components identified in Figure 2.
O
Q
P
OM16686
16
Table 5. D925XBC Components Shown in Figure 2.
Item/callout from Figure 2 Description
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
AA
BB
CC
DD
EE
FF
GG
HH
Audio codec
Front panel audio connector
PCI Conventional bus add-in card connectors
Marvell Yukon 88E8050 PCI Express Gigabit Ethernet Controller
PCI Express x16 bus add-in card connector
Rear chassis fan connector
Back panel connectors
Alternate power connector
+12V power connector (ATX12V)
LGA775 processor socket
Processor fan connector
Intel 82925X MCH
DIMM Channel A sockets
DIMM Channel B sockets
I/O controller
Power connector
Diskette drive connector
Parallel ATE IDE connector
Battery
Chassis intrusion connector
BIOS Setup configuration jumper block
8 Mbit Firmware Hub (FWH)
Front chassis fan connector
Serial ATA connectors
Auxiliary front panel power LED connector
Front panel connector
Front panel USB connector
Front panel USB connector
Intel 82801FR I/O Controller Hub (ICH6-R)
Front panel IEEE-1394a connectors (optional)
IEEE-1394a controller (optional)
Speaker
ATAPI CD-ROM connector
PCI Express x1 bus add-in card connector
Product Description
17
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
1.3.4 Block Diagram
Figure 3 is a block diagram of the major functional areas of the boards.
PCI Express x1 Slot 1
PCI Express x1 Slot 2
Parallel ATA
IDE Connector
LGA775
Processor Socket
PCI Express
x16 Interface
PCI Express
x16
Connector
Channel A
DIMMs (2)
PCI Express x1 Interface
D925XCV
only
Parallel ATA
IDE Interface
System Bus
(800/533 MHz)
Intel 82925X
Memory Controller
Hub (MCH)
Dual-Channel
Memory Bus
SMBus
Gigabit Ethernet
Controller
USB
LPC Bus
I/O
Controller
LPC Bus
Intel 82801FR
I/O Controller Hub
(ICH6-R)
DMI Interconnect
Back Panel/Front Panel
USB Ports
Serial Ports
Parallel Port
PS/2 Mouse
PS/2 Keyboard
Diskette Drive
Firmware Hub
LAN
Connector
Connector
8 Mbit
(FWH)
Intel 925X Chipset
LPC Bus
TPM Component
(Optional)
Channel B
DIMMs (2)
IEEE-1394a Connectors
(Optional)
PCI Slot 1
PCI Slot 2
PCI Slot 3
PCI Slot 4
= connector or socket
PCI Bus
D925XCV
only
PCI Bus
SMBus
Hardware Monitoring
and Fan Control ASIC
Figure 3. Block Diagram
Serial ATA
IDE Interface
Front Panel Retasking Jack A/E
Front Panel Retasking Jack F
High Definition Audio Link
Mic In/Retasking Jack B
Line In/Retasking Jack C
Audio
Codec
Surround Left-Right/Retasking Jack H
Line Out/Retasking Jack D
Center and LFE/Retasking Jack G
Serial ATA IDE
Connectors (4)
CD-ROM
S/PDIF
OM16999
18
1.4 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Boards D925XCV and
D925XBC under “Desktop Board
Products” or “Desktop Board Support”
Available configurations for the Desktop
Board D925XCV
Available configurations for the Desktop
Board D925XBC
Processor data sheets http://www.intel.com/design/litcentr
ICH6-R addressing http://developer.intel.com/design/chipsets/datashts
Custom splash screens http://intel.com/design/motherbd/gen_indx.htm
Audio software and utilities http://www.intel.com/design/motherbd
LAN software and drivers http://www.intel.com/design/motherbd
1.5 Processor
Product Description
http://www.intel.com/design/motherbd
http://support.intel.com/support/motherboards/desktop
http://developer.intel.com/design/motherbd/cv/cv_available.htm
http://developer.intel.com/design/motherbd/bc/bc_available.htm
The boards are designed to support Intel Pentium 4 processors in an LGA775 processor socket with
an 800 or 533 MHz system bus. See the Intel web site listed below for the most up-to-date list of
supported processors.
For information about… Refer to:
Supported processors for the D925XCV board http://www.intel.com/design/motherbd/cv/cv_proc.htm
Supported processors for the D925XBC board http://www.intel.com/design/motherbd/bc/bc_proc.htm
CAUTION
Use only the processors listed on web site above. Use of unsupported processors can damage the
board, the processor, and the power supply.
INTEGRATOR’S NOTES
#
Use only ATX12V-compliant power supplies.
For information about Refer to
Power supply connectors Section 2.8.1.1, page 64
19
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
1.6 System Memory
The boards have four DIMM sockets and support the following memory features:
• 1.8 V (only) DDR2 SDRAM DIMMs
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMS with x16 organization are not supported.
• 4 GB maximum total system memory. Refer to Section 2.2.1 on page 55 for information on the
total amount of addressable memory.
• Minimum total system memory: 128 MB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR2 533 MHz or DDR2 400 MHz SDRAM DIMMs
✏ NOTES
• Remove the PCI Express x16 video card before installing or upgrading memory to avoid
interference with the memory retention mechanism.
• To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure.
This allows the BIOS to read the SPD data and program the chipset to accurately configure
memory settings for optimum performance. If non-SPD memory is installed, the BIOS will
attempt to correctly configure the memory settings, but performance and reliability may be
impacted or the DIMMs may not function under the determined frequency.
Table 6 lists the supported DIMM configurations.
Table 6. Supported Memory Configurations
DIMM
Capacity
128 MB SS 256 Mbit 16 M x 16/empty 4
256 MB SS 256 Mbit 32 M x 8/empty 8
256 MB SS 512 Mbit 32 M x 16/empty 4
512 MB DS 256 Mbit 32 M x 8/32 M x 8 16
512 MB SS 512 Mbit 64 M x 8/empty 8
512 MB SS 1 Gbit 64 M x 16/empty 4
1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16
1024 MB SS 1 Gbit 128 M x 8/empty 8
2048 MB DS 1 Gbit 128 M x 8/128 M x 8 16
Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers
to single-sided memory modules (containing one row of SDRAM).
INTEGRATOR’S NOTE
#
Configuration
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
Refer to Section 2.2.1, on page 55 for additional information on available memory.
20
Product Description
0
0
1.6.1 Memory Configurations
The Intel 82925X MCH supports two types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for real world
applications. Dual channel mode is enabled when the installed memory capacities of both
DIMM channels are equal. Technology and device width can vary from one channel to the
other but the installed memory capacity for each channel must be equal. If different speed
DIMMs are used between channels, the slowest memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth
operation for real world applications. This mode is used when only a single DIMM is installed
or the memory capacities are unequal. Technology and device width can vary from one
channel to the other. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
Figure 4 illustrates the memory channel and DIMM configuration.
NOTE
✏
The DIMM0 sockets of both channels are blue. The DIMM1 sockets of both channels are black.
Channel A, DIMM
Channel A, DIMM 1
Channel B, DIMM
Channel B, DIMM 1
OM16677
Figure 4. Memory Channel and DIMM Configuration
21
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
1.6.1.1 Dual Channel (Interleaved) Mode Configurations
Figure 5 shows a dual channel configuration using two DIMMs. In this example, the DIMM0
(blue) sockets of both channels are populated with identical DIMMs.
1 GB
Channel A, DIMM 0
Channel A, DIMM 1
1 GB
Channel B, DIMM 0
Channel B, DIMM 1
OM17123
Figure 5. Dual Channel (Interleaved) Mode Configuration with Two DIMMs
Figure 6 shows a dual channel configuration using three DIMMs. In this example, the combined
capacity of the two DIMMs in Channel A equal the capacity of the single DIMM in the DIMM0
(blue) socket of Channel B.
256 MB
256 MB
512 MB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
22
OM17122
Figure 6. Dual Channel (Interleaved) Mode Configuration with Three DIMMs
Product Description
Figure 7 shows a dual channel configuration using four DIMMs. In this example, the combined
capacity of the two DIMMs in Channel A equal the combined capacity of the two DIMMs in
Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1 of both channels.
256 MB
512 MB
256 MB
512 MB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM17124
Figure 7. Dual Channel (Interleaved) Mode Configuration with Four DIMMs
23
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
1.6.1.2 Single Channel (Asymmetric) Mode Configurations
NOTE
✏
Dual channel (Interleaved) mode configurations provide the highest memory throughput.
Figure 8 shows a single channel configuration using one DIMM. In this example, only the DIMM0
(blue) socket of Channel A is populated. Channel B is not populated.
256 MB
Figure 8. Single Channel (Asymmetric) Mode Configuration with One DIMM
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM17125
Figure 9 shows a single channel configuration using three DIMMs. In this example, the combined
capacity of the two DIMMs in Channel A does not equal the capacity of the single DIMM in the
DIMM0 (blue) socket of Channel B.
256 MB
512 MB
512 MB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
24
OM17126
Figure 9. Single Channel (Asymmetric) Mode Configuration with Three DIMMs
Product Description
1.7 Intel® 925X Chipset
The Intel 925X chipset consists of the following devices:
• Intel 82925X Memory Controller Hub (MCH) with Direct Media Interface (DMI) interconnect
• Intel 82801FR I/O Controller Hub (ICH6-R) with DMI interconnect
• Firmware Hub (FWH)
The MCH is a centralized controller for the system bus, the memory bus, the PCI Express bus, and
the DMI interconnect. The ICH6-R is a centralized controller for the board’s I/O paths. The FWH
provides the nonvolatile storage of the BIOS.
For information about Refer to
The Intel 925X chipset http://developer.intel.com/
Resources used by the chipset Chapter 2
1.7.1 USB
The boards support up to eight USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and
EHCI-compatible drivers.
The ICH6-R provides the USB controller for all ports. The port arrangement is as follows:
• Four ports are implemented with dual stacked back panel connectors adjacent to the audio
connectors
• Four ports are routed to two separate front panel USB connectors
NOTES
✏
• Computer systems that have an unshielded cable attached to a USB port may not meet FCC
Class B requirements, even if no device is attached to the cable. Use shielded cable that meets
the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 20, page 66
The location of the front panel USB connectors on the Desktop Board D925XCV Figure 21, page 68
The location of the front panel USB connectors on the Desktop Board D925XBC Figure 22, page 70
1.7.2 IDE Support
The board provides five IDE interface connectors:
• One parallel ATA IDE connector, which supports two devices
• Four serial ATA IDE connectors, which support one device per connector
1.7.2.1 Parallel ATE IDE Interface
The ICH6-R’s Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface.
The Parallel ATA IDE interface supports the following modes:
• Programmed I/O (PIO): processor controls data transfer.
• 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec.
25
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
• Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates
of up to 33 MB/sec.
• ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of
up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible.
• ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH6-R’s
ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to
88 MB/sec.
✏ NOTE
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce reflections,
noise, and inductive coupling.
The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives) and ATA
devices using the transfer modes.
The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS)
translation modes. The drive reports the transfer rate and translation mode to the BIOS.
The boards support Laser Servo (LS-120) diskette technology through the Parallel ATA IDE
interfaces. An LS-120 drive can be configured as a boot device by setting the BIOS Setup
program’s Boot menu to one of the following:
• ARMD-FDD (ATAPI removable media device – floppy disk drive)
• ARMD-HDD (ATAPI removable media device – hard disk drive)
For information about Refer to
The location of the Parallel ATA IDE connector on the D925XCV board Figure 21, page 68
The location of the Parallel ATA IDE connector on the D925XBC board Figure 22, page 70
1.7.2.2 Serial ATA Interfaces
The ICH6-R’s Serial ATA controller offers four independent Serial ATA ports with a theoretical
maximum transfer rate of 150 MB/s per port. One device can be installed on each port for a
maximum of four Serial ATA devices. A point-to-point interface is used for host to device
connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices
per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the operating system.
The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard
IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for configurations
using the Windows XP and Windows 2000 operating systems.
NOTE
✏
Many Serial ATA drives use new low-voltage power connectors and require adaptors or power
supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
26
Product Description
For information about Refer to
The location of the Serial ATA IDE connectors on the D925XCV board Figure 21, page 68
The location of the Serial ATA IDE connectors on the D925XBC board Figure 22, page 70
1.7.2.3 Serial ATA RAID
The ICH6-R supports RAID (Redundant Array of Independent Drives) level 0 and RAID level 1 on
the Serial ATA ports as follows:
• RAID 0 supports data striping. Two physical drives, of identical size, can be teamed together
to create one logical drive. As data is written or retrieved from the logical drive, both drives
operate in parallel, thus increasing the throughput.
• RAID 1 supports data mirroring. Two physical drives, of identical size, maintain duplicate sets
of all data on separate disk drives. Level 1 provides the highest data reliability because two
complete copies of all information are maintained.
1.7.2.4 RAID Boot Configuration Overview
A RAID array can be created by using the existing Serial ATA ports, correctly configuring the
BIOS, and installing drivers. The following steps are required to successfully establish a RAID
configuration.
1. Enable RAID Support in BIOS.
2. Create a RAID array using the Intel Application Accelerator (IAA) utility.
3. Install the IAA RAID driver.
4. Format the RAID array.
5. Install the IAA Companion Utility (this step is optional).
For information about Refer to
Serial ATA RAID configuration http://developer.intel.com/design/motherbd/cv/index.htm
1.7.2.5 SCSI Hard Drive Activity LED Connector (Optional)
The SCSI hard drive activity LED connector is a 1 x 2-pin connector that allows an add-in
hard drive controller to use the same LED as the onboard IDE controller. For proper operation, this
connector should be wired to the LED output of the add-in hard drive controller. The LED
indicates when data is being read from, or written to, either the add-in hard drive controller or the
onboard IDE controller (Parallel ATA or Serial ATA).
NOTE
✏
The SCSI Hard Drive Activity LED connector is an option available only on the D925XCV board.
It is not available on the D925XBC board.
For information about Refer to
The location of the SCSI hard drive activity LED connector on the
D925XCV board
The signal names of the SCSI hard drive activity LED connector Table 26, page 73
Figure 21, page 68
27
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
1.7.3 Real-Time Clock, CMOS SRAM, and Battery
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer
is not plugged into a wall socket, the battery has an estimated life of three years. When the
computer is plugged in, the standby current from the power supply extends the life of the battery.
The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.
✏ NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS
RAM at power-on.
1.8 PCI Express Connectors
The boards provide the following PCI Express connectors:
• One PCI Express x16 connector. The x16 interface supports simultaneous (full duplex) transfer
speeds up to 8 GBytes/sec. Single-ended (half duplex) transfers are supported at up to
4 Gbytes/sec.
• Four PCI Express x1 connectors on the D925XCV board; two PCI Express x1 connectors on
the D925XBC board. The x1 interfaces support simultaneous transfer speeds up to
500 MBytes/sec
The PCI Express interface supports the PCI Conventional bus configuration mechanism so that the
underlying PCI Express architecture is compatible with PCI Conventional compliant operating
systems. Additional features of the PCI Express interface includes the following:
• Support for the PCI Express enhanced configuration mechanism
• Automatic discovery, link training, and initialization
• Support for Active State Power Management (ASPM)
• SMBus 2.0 support
• Wake# signal supporting wake events from ACPI S1, S3, S4, or S5
• Software compatible with the PCI Power Management Event (PME) mechanism defined in the
PCI Power Management Specification Rev. 1.1
1.9 Auxiliary Power (AUX PWR) Output Connector
The D925XCV board includes a 1x4 power connector that can be used to provide power for
internal chassis lighting or additional fans. The use of this connector requires an ATX12V power
supply with a 24-pin (2x12) main power cable. If a power supply with a 20-pin (2x10) main power
cable is used, the auxiliary power output connector may not function.
The on/off function of this connector is controlled from within the BIOS Setup Program. The
default setting in the BIOS is for this connector to be off.
28
Product Description
INTEGRATOR’S NOTES
#
When using this connector, observe the following precautions:
• Do not use a Y-adapter, power splitter, or SATA power adapter to attach storage devices (such
as hard disk drives or CD/DVD drives) to this connector. This connector will not provide
adequate power for storage devices.
• Do not connect any devices to this connector that draw more than 1.5 A. The connector
circuitry includes overcurrent protection components that limit the current draw to a maximum
✏
of 1.5 A.
For information about Refer to
The location of the auxiliary power output connector Figure 21, page 68
The signal names of the auxiliary power output connector Table 28, page 73
NOTE
The auxiliary power output connector is present only on the D925XCV board. It is not present on
the D925XBC board.
1.10 I/O Controller
The I/O controller provides the following features:
• One serial port
• One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port
(EPP) support
• Serial IRQ interface compatible with serialized IRQ support for PCI Conventional bus systems
• PS/2-style mouse and keyboard interfaces
• Interface for one 1.44 MB or 2.88 MB diskette drive
• Intelligent power management, including a programmable wake-up event interface
• PCI Conventional bus power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.10.1 Serial Port
The boards have one serial port connector located on the back panel. The serial port supports data
transfers at speeds up to 115.2 kbits/sec with BIOS support.
For information about Refer to
The location of the serial port A connector Figure 20, page 66
1.10.2 Parallel Port
The 25-pin D-Sub parallel port connector is located on the back panel. Use the BIOS Setup
program to set the parallel port mode.
29
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
For information about Refer to
The location of the parallel port connector Figure 20, page 66
1.10.3 Diskette Drive Controller
The I/O controller supports one diskette drive. Use the BIOS Setup program to configure the
diskette drive interface.
For information about Refer to
The location of the diskette drive connector on the D925XCV board Figure 21, page 68
The location of the diskette drive connector on the D925XBC board Figure 22, page 70
1.10.4 Keyboard and Mouse Interface
PS/2 keyboard and mouse connectors are located on the back panel.
NOTE
✏
The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2
connector. Power to the computer should be turned off before a keyboard or mouse is connected or
disconnected.
For information about Refer to
The location of the keyboard and mouse connectors Figure 20, page 66
30
Product Description
1.11 Audio Subsystem
The boards support the Intel High Definition audio subsystem based on the Realtek ALC880 or the
Realtek ALC860 audio codec. The audio subsystem supports the following features:
• Advanced jack sense (front and rear panel) that enables the audio codec to recognize the device
that is connected to an audio port. All jacks are capable of retasking according to user’s
definition, or can be automatically switched depending on the recognized device type.
• Stereo input and output for all jacks
• Multi-streaming capabilities that enable different audio streams to be sent to different audio
devices. Multi-streaming also allows one audio stream to be directed out the back panel while
another audio stream can be directed out the front panel.
• A signal-to-noise (S/N) ratio of 90 dB
INTEGRATOR’S NOTE
#
For the front panel jack sensing and automatic retasking feature to function, a front panel daughter
card that is designed for Intel High Definition Audio must be used. Otherwise, an AC ’97 style
audio front panel connector will be assumed and the Line Out and Mic In functions will be
permanent.
1.11.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.4, page 19
1.11.2 Audio Connectors
The boards contain audio connectors on both the back panel and the component side of the board.
The component-side audio connectors include the following:
• Front panel audio (a 2 x 5-pin connector that provides mic in and line out signals for front panel
audio connectors)
• ATAPI CD-ROM (a 1 x 4-pin ATAPI-style connector for connecting an internal ATAPI
CD-ROM drive to the audio mixer)
The functions of the back panel audio connectors are dependent on which subsystem is present.
The 8-channel (7.1) audio subsystem is described in Section 1.11.3; the 6-channel (5.1) audio
subsystem is described in Section 1.11.4.
For information about Refer to
The locations of the front panel audio connector and the ATAPI CD-ROM
connector on the Desktop Board D925XCV
The locations of the front panel audio connector and the ATAPI CD-ROM
connector on the Desktop Board D925XBC
The signal names of the front panel audio connector Table 22, page 72
The signal names of the ATAPI CD-ROM connector Table 21, page 72
The back panel audio connectors Section 2.8.1, page 63
Figure 21, page 68
Figure 22, page 70
31
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
1.11.3 8-Channel (7.1) Audio Subsystem
The 8-channel (7.1) audio subsystem includes the following:
• Intel 82801FR I/O Controller Hub (ICH6-R)
• Realtek ALC880 audio codec
• Microphone input that supports a single dynamic, condenser, or electret microphone
The front and back panel audio connectors are configurable through the audio device drivers. The
available configurable audio ports are shown in Figure 10.
Front Panel
Audio Connectors
Line Out/
Retasking Jack F
Surround Left and Right/
Retasking Jack H
[Black]
Center channel and LFE (Subwoofer)/
Retasking Jack G
[Orange]
S/PDIF Digital Audio Out
Coaxial
[Port 2]
Back Panel
Audio Connectors
S/PDIF Digital Audio Out
Optical
Mic In/
Retasking Jack A or E
[Port 1]
Line In/Retasking Jack C
[Blue]
Line Out/Retasking Jack D
[Lime Green]
Mic In/Retasking Jack B
[Pink]
OM16993
Figure 10. Front/Back Panel Audio Connector Options for 8-Channel (7.1) Audio Subsystem
32
Figure 11 is a block diagram of the 8-channel (7.1) audio subsystem.
Mic In/Retasking Jack B
Line In/Retasking Jack C
Line Out/Retasking Jack D
82801FR
I/O Controller
Hub
(ICH6-R)
Intel
High Definition
Audio Link
Realtek
ALC880
Audio Codec
Front Panel Retasking Jack A/E [Port 1]
Front Panel Retasking Jack F [Port 2]
Center and LFE/Retasking Jack G
Surround Left-Right/Retasking Jack H
Product Description
CD-ROM
S/PDIF
OM16994
Figure 11. 8-channel (7.1) Audio Subsystem Block Diagram
For information about Refer to
The back panel audio connectors Section 2.8.1, page 63
33
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
1.11.4 6-Channel (5.1) Audio Subsystem
The 6-channel (5.1) audio subsystem includes the following:
• Intel 82801FB I/O Controller Hub (ICH6)
• Realtek ALC860 audio codec
• Microphone input that supports a single dynamic, condenser, or electret microphone
The front and back panel audio connectors are configurable through the audio device drivers. The
available configurable audio ports are shown in Figure 12.
Back Panel
Audio Connectors
Line In/
Retasking Jack C
Line Out/
Retasking Jack D
Mic In/
Retasking Jack B
OM16989
Line Out/
Retasking Jack F
[Port 2]
Front Panel
Audio Connectors
Mic In/
Retasking Jack E
[Port 1]
Figure 12. Front/Back Panel Audio Connector Options for 6-Channel (5.1) Audio Subsystem
Figure 13 is a block diagram of the 6-channel (5.1) audio subsystem.
Mic In/Retasking Jack B
82801FR
I/O Controller
Hub
(ICH6-R)
Intel
High Definition
Audio Link
ALC860
Audio Codec
Front Panel Mic In/Retasking Jack E [Port 1]
Front Panel Line Out/Retasking Jack F [Port 2]
Line In/Retasking Jack C
Line Out/Retasking Jack D
CD-ROM (optional)
34
Figure 13. 6-Channel (5.1) Audio Subsystem Block Diagram
For information about Refer to
The back panel audio connectors Section 2.8.1, page 63
OM17128
Product Description
1.12 LAN Subsystem
The LAN subsystem includes the Marvell Yukon 88E50 Gigabit (10/100/1000 Mbits/sec) Ethernet
Controller and an RJ-45 LAN connector with integrated status LEDs.
1.12.1 Marvell Yukon 88E8050 PCI Express 1.0a Integrated MAC/PHY Gigabit Ethernet Controller
The Marvell Yukon 88E8050 provides the following functions:
• x1 PCI Express link
• Basic 10/100/1000 Ethernet LAN connectivity
• IEEE 802.1p and 802.1q support
• 10/100/1000 IEEE 802.3 compliant
• Compliant to 802.3x flow control support
• Jumbo frame support
• TCP, IP, UDP checksum offload
• Automatic MDI/MDIX crossover
• Full device driver compatibility
• Configuration EEPROMs that contain the MAC address and ASF 2.0 support
• Wake On LAN technology power management support
• PCI Express Active State Power Management Support (L0s)
• ASF 2.0 support
1.12.2 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (as shown in Figure 14). Table 7 describes the
LED states when the board is powered up and the Gigabit LAN subsystem is operating.
Green LED
Figure 14. LAN Connector LED Locations
Table 7. LAN Connector LED States
LED Color LED State Condition
Off LAN link is not established.
Left Green
N/A Off 10 Mbits/sec data rate is selected.
Right
Green On 100 Mbits/sec data rate is selected.
Yellow
On LAN link is established.
Blinking LAN activity is occurring.
On
Green/Yellow LED
OM16513
1000 Mbits/sec data rate is selected.
35
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
1.12.3 Alert Standard Format (ASF) Support
The boards provide the following ASF support for the onboard 10/100/1000 LAN subsystem, PCI
Express x1 bus add-in LAN cards, and PCI Conventional bus add-in LAN cards installed in PCI
Conventional bus slot 2:
• Monitoring of system firmware progress events, including:
BIOS present
Primary processor initialization
Memory initialization
Video initialization
PCI resource configuration
Hard-disk initialization
User authentication
Starting operating system boot process
• Monitoring of system firmware error events, including:
Memory missing
Memory failure
No video device
Keyboard failure
Hard-disk failure
No boot media
• Boot options to boot from different types of boot devices
• Reset, shutdown, power cycle, and power up options
1.12.4 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers Section 1.4, page 19
36
Product Description
1.13 Hardware Management Subsystem
The hardware management features enable the Desktop Boards to be compatible with the Wired for
Management (WfM) specification. The Desktop Board has several hardware management features,
including the following:
• Fan monitoring and control (through the hardware monitoring and fan control ASIC)
• Thermal and voltage monitoring
• Chassis intrusion detection
1.13.1 Hardware Monitoring and Fan Control ASIC
The features of the hardware monitoring and fan control ASIC include:
• Internal ambient temperature sensor
• Two remote thermal diode sensors for direct monitoring of processor temperature and ambient
temperature sensing
• Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.5 V, and +VCCP) to
detect levels above or below acceptable values
• Thermally monitored closed-loop fan control, for all three fans, that can adjust the fan speed or
switch the fans on or off as needed
• SMBus interface
For information about Refer to
The location of the fan connectors and sensors for thermal monitoring for
the D925XCV board
The location of the fan connectors and sensors for thermal monitoring for
the D925XBC board
Figure 15, page 38
Figure 16, page 39
37
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
1.13.2 Thermal Monitoring
Figure 15 shows the location of the sensors and fan connectors on the D925XCV board.
G
4
1
3
1
A
B
4
1
1
3
C
D
F
E
Item Description
A Remote ambient temperature sensor
B Thermal diode, located on processor die
C Ambient temperature sensor, internal to hardware monitoring and fan control ASIC
D Processor fan connector
E Rear chassis fan connector
F Front chassis fan connector
G Auxiliary rear fan connector
Figure 15. Thermal Monitoring for D925XCV Board
OM16679
38
Product Description
Figure 16 shows the location of the sensors and fan connectors on the D925XBC board.
3
1
B
A
4
1
1
3
C
D
F
E
OM16689
Item Description
A Remote ambient temperature sensor
B Thermal diode, located on processor die
C Ambient temperature sensor, internal to hardware monitoring and fan control ASIC
D Processor fan
E Rear chassis fan
F Front chassis fan
Figure 16. Thermal Monitoring for D925XBC Board
39
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
1.13.3 Fan Monitoring
Fan monitoring can be implemented using Intel Desktop Utilities, LANDesk* software, or thirdparty software. The level of monitoring and control is dependent on the hardware monitoring ASIC
used with the Desktop Board.
For information about Refer to
The functions of the fan connectors Section 1.14.2.2, page 44
1.13.4 Chassis Intrusion and Detection
The Desktop Boards D925XCV and D925XBC support a chassis security feature that detects if the
chassis cover is removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion connector. When the chassis cover is removed, the mechanical switch is in
the closed position.
1.14 Power Management
Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:
Power connector
Fan connectors
LAN wake capabilities
Instantly Available PC technology
Resume on Ring
Wake from USB
Wake from PS/2 devices
Power Management Event signal (PME#) wake-up support
PCI Express WAKE# signal support
1.14.1 ACPI
ACPI gives the operating system direct control over the power management and Plug and Play
functions of a computer. The use of ACPI with the Desktop Boards D925XCV and D925XBC
requires an operating system that provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in boards may
require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake-up events (see Table 10 on page 43)
• Support for a front panel power and sleep mode switch
Table 8 lists the system states based on how long the power switch is pressed, depending on how
ACPI is configured with an ACPI-aware operating system.
40
Table 8. Effects of Pressing the Power Switch
Product Description
If the system is in this state…
Off
(ACPI G2/G5 – Soft off)
On
(ACPI G0 – working state)
On
(ACPI G0 – working state)
Sleep
(ACPI G1 – sleeping state)
Sleep
(ACPI G1 – sleeping state)
…and the power switch is
pressed for
Less than four seconds Power-on
Less than four seconds Soft-off/Standby
More than four seconds Fail safe power-off
Less than four seconds Wake-up
More than four seconds Power-off
…the system enters this state
(ACPI G0 – working state)
(ACPI G1 – sleeping state)
(ACPI G2/G5 – Soft off)
(ACPI G0 – working state)
(ACPI G2/G5 – Soft off)
1.14.1.1 System States and Power States
Under ACPI, the operating system directs all system and device power state transitions. The
operating system puts devices in and out of low-power states based on user preferences and
knowledge of how devices are being used by applications. Devices that are not being used can be
turned off. The operating system uses information from applications and user settings to put the
system as a whole into a low-power state.
41
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
Table 9 lists the power states supported by the Desktop Boards D925XCV and D925XBC along
with the associated system power targets. See the ACPI specification for a complete description of
the various system and power states.
Table 9. Power States and Targeted System Power
Global States Sleeping States
G0 – working
S0 – working C0 – working D0 – working
state
G1 – sleeping
state
S1 – Processor
stopped
Processor
States
C1 – stop
grant
Device States
state.
D1, D2, D3 –
device
Targeted System
Power
(Note 1)
Full power > 30 W
5 W < power < 52.5 W
specification
specific.
G1 – sleeping
state
S3 – Suspend to
RAM. Context
saved to RAM.
G1 – sleeping
state
S4 – Suspend to
disk. Context
saved to disk.
G2/S5 S5 – Soft off.
Context not saved.
Cold boot is
No power D3 – no power
except for
wake-up logic.
No power D3 – no power
except for
wake-up logic.
No power D3 – no power
except for
wake-up logic.
Power < 5 W
Power < 5 W
Power < 5 W
(Note 2)
(Note 2)
(Note 2)
required.
G3 –
mechanical off
AC power is
disconnected
from the
computer.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals powered
by the system chassis’ power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.
No power to the
system.
No power D3 – no power for
wake-up logic,
except when
provided by
battery or external
source.
No power to the system.
Service can be performed
safely.
42
Product Description
1.14.1.2 Wake-up Devices and Events
Table 10 lists the devices or specific events that can wake the computer from specific states.
Table 10. Wake-up Devices and Events
These devices/events can wake up the computer… …from this state
LAN S1, S3, S4, S5
Modem (back panel Serial Port A) S1, S3
PME# signal S1, S3, S4, S5
Power switch S1, S3, S4, S5
PS/2 devices S1, S3
RTC alarm S1, S3, S4, S5
USB S1, S3
WAKE# S1, S3, S4, S5
Note: For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option to Power On
will enable a wake-up event from LAN in the S5 state.
(Note)
(Note)
NOTE
✏
The use of these wake-up events from an ACPI state requires an operating system that provides full
ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake
events.
1.14.2 Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and
Instantly Available PC technology features are used. Failure to do so can damage the power
supply. The total amount of standby current required depends on the wake devices supported and
manufacturing options.
The Desktop Boards D925XCV and D925XBC provide several power management hardware
features, including:
• Power connector
• Fan connectors
• LAN wake capabilities
• Instantly Available PC technology
• Resume on Ring
• Wake from USB
• Wake from PS/2 keyboard
• PME# signal wake-up support
• WAKE# signal wake-up support
LAN wake capabilities and Instantly Available PC technology require power from the +5 V
standby line.
43
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
Resume on Ring enables telephony devices to access the computer when it is in a power-managed
state. The method used depends on the type of telephony device (external or internal).
NOTE
✏
The use of Resume on Ring and Wake from USB technologies from an ACPI state requires an
operating system that provides full ACPI support.
1.14.2.1 Power Connector
ATX12V-compliant power supplies can turn off the system power through system control. When
an ACPI-enabled system receives the correct command, the power supply removes all non-standby
voltages.
When resuming from an AC power failure, the computer returns to the power state it was in before
power was interrupted (on or off). The computer’s response can be set using the Last Power State
feature in the BIOS Setup program’s Boot menu.
For information about Refer to
The location of the power connector Figure 21, page 68
The signal names of the power connector Table 29, page 75
1.14.2.2 Fan Connectors
The function/operation of the fan connectors is as follows:
• The fans are on when the board is in the S0 or S1 state.
• The fans are off when the board is off or in the S3, S4, or S5 state.
• Each fan connector is wired to a fan tachometer input of the hardware monitoring and fan
control ASIC
• All fan connectors support closed-loop fan control that can adjust the fan speed or switch the
fan on or off as needed.
• All fan connectors have a +12 V DC connection
For information about Refer to
The location of the fan connectors Figure 21, page 68
The location of the fan connectors and sensors for thermal monitoring Figure 15, page 38
The signal names of the fan connectors Section 2.8.1.1, page 64
1.14.2.3 LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line for the power supply must be capable of
providing adequate +5 V standby current. Failure to provide adequate standby current when
implementing LAN wake capabilities can damage the power supply.
LAN wake capabilities enable remote wake-up of the computer through a network. The LAN
network adapter monitors network traffic at the Media Independent Interface. Upon detecting a
Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer.
44
Product Description
Depending on the LAN implementation, the Desktop Boards D925XCV and D925XBC support
LAN wake capabilities with ACPI in the following ways:
• The PCI Express WAKE# signal
• The PCI Conventional bus PME# signal for PCI 2.2 compliant LAN designs
• The onboard LAN subsystem
1.14.2.4 Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line for the power supply must be capable
of providing adequate +5 V standby current. Failure to provide adequate standby current when
implementing Instantly Available PC technology can damage the power supply.
Instantly Available PC technology enables the Desktop Boards D925XCV and D925XBC to enter
the ACPI S3 (Suspend-to-RAM) sleep-state. While in the S3 sleep-state, the computer will appear
to be off (the power supply is off, and the front panel LED is amber if dual colored, or off if single
colored.) When signaled by a wake-up device or event, the system quickly returns to its last known
wake state. Table 10 on page 43 lists the devices and events that can wake the computer from the
S3 state.
The Desktop Boards D925XCV and D925XBC support the PCI Bus Power Management Interface
Specification. Add-in boards that also support this specification can participate in power
management and can be used to wake the computer.
The use of Instantly Available PC technology requires operating system support and PCI 2.2
compliant add-in cards, PCI Express add-in cards, and drivers.
1.14.2.5 Resume on Ring
The operation of Resume on Ring can be summarized as follows:
• Resumes operation from ACPI S1 or S3 states
• Detects incoming call similarly for external and internal modems
• Requires modem interrupt be unmasked for correct operation
1.14.2.6 Wake from USB
USB bus activity wakes the computer from ACPI S1 or S3 states.
NOTE
✏
Wake from USB requires the use of a USB peripheral that supports Wake from USB.
1.14.2.7 Wake from PS/2 Devices
PS/2 device activity wakes the computer from an ACPI S1 or S3 state.
1.14.2.8 PME# Signal Wake-up Support
When the PME# signal on the PCI Conventional bus is asserted, the computer wakes from an ACPI
S1, S3, S4, or S5 state (with Wake on PME enabled in BIOS).
45
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
1.14.2.9 WAKE# Signal Wake-up Support
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI
S1, S3, S4, or S5 state.
1.14.2.10 +5 V Standby Power Indicator LED
The +5 V standby power indicator LED shows that power is still present even when the computer
appears to be off. Figure 17 shows the location of the standby power indicator LED on the
D925XCV board.
CAUTION
If AC power has been switched off and the standby power indicator is still lit, disconnect the power
cord before installing or removing any devices connected to the board. Failure to do so could
damage the board and any attached devices.
46
CR3J1
OM16678
Figure 17. Location of the Standby Power Indicator LED on the D925XCV Board
Product Description
1.15 Trusted Platform Module (Optional)
The optional Trusted Platform Module (TPM) is a component on the desktop board that is
specifically designed to enhance platform security above-and-beyond the capabilities of today’s
software by providing a protected space for key operations and other security critical tasks. Using
both hardware and software, the TPM protects encryption and signature keys at their most
vulnerable stages—operations when the keys are being used unencrypted in plain-text form. The
TPM is specifically designed to shield unencrypted keys and platform authentication information
from software-based attacks.
1.15.1 System Requirements
• Intel Desktop Board D925XCV or D925XBC
• Microsoft Windows* 2000 Professional (SP4) or Microsoft Windows XP Professional (SP1)
• NTFS file system required
• Microsoft Internet Explorer* 5.5 or later
• Adobe* Acrobat* 5.0 or later
1.15.2 Warning of Potential Data Loss
CAUTION
Failure to follow the instructions below may cause you to lose data. Read and follow these
instructions prior to Trusted Platform Module initialization.
System integrators, owners, and end users must take precautions to mitigate the chance of data loss.
Data encrypted by any program utilizing the Trusted Platform Module (TPM) may become
inaccessible or unrecoverable if any of the following occurs:
• Lost Password: Loss of any of the passwords associated with the TPM will render encrypted
data inaccessible. No password recovery is available. Read the Security Precautions for
Password Procedures.
• Hard Drive Failure: In the event of a failure of a hard disk (or other storage media) that
contains encrypted data, an image of the hard disk (or other storage media) must be restored
from backup before access to encrypted data may become available. The owner/user should
backup the system hard disk on a regular basis. Read the Security Precautions below for
Hard Drive Backup Procedures.
• Platform Failure: In the event of a platform failure and/or replacement of the motherboard,
recovery procedures may allow migratable keys to be recovered and may restore access to
encrypted data. All non-migratable keys and their associated data will be lost. Both the
Infineon* Security Platform software and Wave Systems* EMBASSY* Trust Suite utilize
migratable keys. Please check any other software that accesses the TPM for migratability.
Read the Security Precautions for Emergency Recovery File Back Up Procedures.
• Loss of Trusted Platform Module Ownership: Trusted Platform Module Ownership/contents
may be cleared (via a BIOS switch) to allow for the transfer of a system to a new owner. If
TPM ownership is cleared, either intentionally or in error, recovery procedures may allow the
migratable keys to be recovered and may restore access to encrypted data. Read the Security
Precautions for Emergency Recovery File Back Up Procedures.
47
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
1.15.3 Security Precautions
Security, like any other aspect of computer maintenance requires planning. What is unique about
security has to do with understanding who "friends" and adversaries are. The TPM provides
mechanisms to enable the owner/user to protect their information from adversaries. To provide this
protection the TPM effectively puts "locks" around the data. Just like physical locks, if keys or
combinations are lost, the assets (i.e., data) may be inaccessible not only to adversaries, but also to
asset owner/user.
The TPM provides two classes of keys: migratable and non-migratable. Migratable keys are
designed to protect data that can be used (i.e., unencrypted) on more than one platform. This has
the advantage of allowing the key data to be replicated (backed-up and restored) to another
platform. This may be because of user convenience (someone uses more than one platform, or the
data needs to be available to more than one person operating on different platforms). This type of
key also has the advantage in that it can be backed-up and restored from a defective platform onto a
new platform. However, migratable keys may not be the appropriate level of protection (e.g., the
user wants the data restricted to a single platform) needed for the application. This requires a nonmigratable key. Non-migratable keys carry with them a usage deficit in that while the key may be
backed-up and restored (i.e., protected from hard disk failure) they are not protected against system
or TPM failure. The very nature of a non-migratable key is that they can be used on one and only
one TPM. In the event of a system or TPM failure, all non-migratable keys and the data associated
with them will be inaccessible and unrecoverable.
CAUTION
The following precautions and procedures may assist in recovering from any of the previously
listed situations. Failure to implement these security precautions and procedures may result in
unrecoverable data loss.
1.15.3.1 Password Procedures
The Infineon Security Platform software allows users to configure passwords from 6 to 255
characters. A good password should consist of:
• At least one upper case letter (A to Z)
• At least one numerical character (0 to 9)
• At least one symbol character (!, @, &, etc.)
Example Passwords: “I wear a Brown hat 2 worK @ least once-a-month” or
“uJGFak&%)adf35a9m”
NOTE
✏
Avoid using names or dates that can be easily guessed such as: birthdays, anniversaries, family
member names, pet names, etc.
All passwords associated with the Infineon Security Platform software (Owner, Emergency
Recovery Token, and User passwords) and the Wave Systems EMBASSY Trust Suite are NOT
RECOVERABLE and cannot be reset without the original text. The system owner should document
all passwords, store them in a secured location (vault, safe deposit box, off-site storage, etc.), and
have them available for future use. These documents should be updated after any password changes.
48
Product Description
1.15.3.2 Emergency Recovery File Back Up Procedures
The Emergency Recovery Token (SPEmRecToken.xml) must be saved or moved to a removable
media (floppy, USB drive, CDR, flash media, etc). Once this is done, the removable media should
be stored in a secure location. DO NOT LEAVE ANY COPIES of the Emergency Recovery Token
on the hard drive or within any hard drive image backups. If a copy of the Emergency Recovery
Token remains on the system, it could be used to compromise the Trusted Platform Module and
platform.
After completing the Infineon Security Platform User Initialization Wizard, a copy of the
Emergency Recovery Archive (SPEmRecArchive.xml) should be copied to a removable media
and stored in a secure location. This procedure should be repeated after any password changes or
the addition of a new user.
1.15.3.3 Hard Drive Image Backup Procedures
To allow for emergency recovery from a hard drive failure, frequent images of the hard drive
should be created and stored in a secure location. In the event of a hard drive failure, the latest
image can be restored to a new hard drive and access to the encrypted data may be re-established.
NOTE
✏
All encrypted and unencrypted data that was added after the last image was created will be lost.
1.15.3.4 Clear Text Backup (Optional)
It is recommended that system owners follow the Hard Drive Image Backup Procedures. To
backup select files without creating a drive image, files can be moved from secured programs or
drive letters to an unencrypted directory. The unencrypted (clear text) files may then be backed up
to a removable media and stored in a secure location. The advantage of the clear text backup is that
no TPM key is required to restore the data. This option is not recommended because the data is
exposed during backup and restore.
1.15.4 Trusted Platform Module Ownership
The Trusted Platform Module is disabled by default when shipped and the owner/end customer of
the system assumes “ownership” of the TPM. This permits the owner of the system to control
initialization of the TPM and create all the passwords associated with the TPM that is used to
protect their keys and data.
System builders/integrators may install both the Infineon Security Platform software and the Wave
System EMBASSY Trust Suite, but SHOULD NOT attempt to use or activate the TPM or either
software package.
49
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
1.15.5 Enabling the Trusted Platform Module
The Trusted Platform Module is disabled by default when shipped to insure that the owner/end
customer of the system initializes the TPM and configures all security passwords. The owner/end
customer should use the following steps to enable the TPM.
1. While the PC is displaying the splash screen (or POST screen), press the <F2> key to enter
BIOS.
2. Use the arrow keys to go to the Advanced Menu, select Peripheral Configuration, and then
press the <Enter> key.
3. Select the Trusted Platform Module, press <Enter>, and select Enabled and press <Enter> again
(display should show:
4. Press the <F10> key, select Ok and press <Enter>.
5. System should reboot and start Microsoft Windows.
Trusted Platform Module [Enabled]).
1.15.6 Assuming Trusted Platform Module Ownership
Once the TPM has been enabled, ownership must be assumed by using the Infineon Security
Platform Software. The owner/end user should follow the steps listed below to take ownership of
the TPM:
1. Start the system.
2. Launch the Infineon Security Platform Initialization Wizard.
3. Create Owner password (before creating any password, review the Password Recommendations
made earlier in this document).
4. Create a new Recovery Archive (note the file name and location).
5. Specify a Security Platform Emergency Recovery Token password and location. (this password
should not match the Owner password or any other password).
6. Define where to save the Emergency Recovery Token (note the file location and name).
7. The software will then create recovery archive files and finalize ownership of the TPM.
8. After completing the Infineon Security Platform Initialization Wizard, the Emergency
Recovery Token (SPEmRecToken.xml) must be moved
flash media, etc) if the file was not saved to a removable media during installation. Once this is
done, the removable media should be stored in a secure location. No copies of this Emergency
Recovery Token file should remain on the system. If a copy remains on the system, it could be
used to compromise the security of the platform.
9. Launch the Infineon Security Platform User Initialization Wizard.
10. Create a Basic User password (this password is the most frequently used and should not match
any other password).
11. Select and configure Security Platform features for this user.
12. After completing the Infineon Security Platform User Initialization Wizard, a copy of the
Emergency Recovery Archive (SPEmRecArchive.xml) should be copied to a removable
media and stored in a secure location. This procedure should be repeated after any password
changes or the addition of new users.
13. Restart the system.
14. To backup the keys for the EMBASSY Trust Suite, the Key Transfer Manager software must
be configured. Launch the Key Transfer Manager from the program menu.
to a removable media (floppy, CDR,
50
Product Description
15. Follow the instructions and create and document the locations for both the archive and
restoration key files. The key archive should be located on a removable media and stored in a
secure location when not in use.
16. Create and document the password to protect the key archive.
17. Provide the TPM Owner password to allow the Key Transfer Manager to create the archive and
restoration key files.
18. Upon completing the configuration of the Key Transfer Manager, it will place an icon in the
task bar and automatically back up all new and updated keys associated with the EMBASSY
Trust Suite. If the removable media that contains the archive file is not present when a new key
is generated, then keys will have to be manually backed up using the Key Transfer Manager
when the removable media is available.
19. All passwords associated with the Infineon Security Platform Software (Owner, Emergency
Recovery Token, and User passwords) and Wave Systems EMBASSY Trust Suite and Key
Transfer Manager are not recoverable and cannot be reset without the original text. These
passwords should be documented and stored in a secured location (vault, safe deposit box, offsite storage, etc.) in case they are needed in the future. These documents and files should be
updated after any password changes.
1.15.7 Recovery Procedures
1.15.7.1 Recovering from Hard Disk Failure
Restore the latest hard drive image from backup to the new hard drive – no TPM specific recovery
is necessary.
1.15.7.2 Recovering from Desktop Board or TPM Failure
This procedure may restore the migratable keys from the Emergency Recovery Archive, and does
not restore any previous keys or content to the TPM. This recovery procedure may restore access
to the Infineon Security Platform software and Wave Systems EMBASSY Trust Suite that are
secured with migratable keys.
Requirements:
• Emergency Recovery Archive (created with the Infineon Security Platform Initiation Wizard)
• Emergency Recovery Token (created with the Infineon Security Platform Initiation Wizard)
• Emergency Recovery Token Security Password (created with the Infineon Security Platform
Initiation Wizard)
• Working original operating system (OS) installation, or a restored image of the hard drive
• Wave Systems Key Transfer Manager archive password
• TPM Ownership password
This recovery procedure only restores the migratable keys from the previously created Recovery
Archives.
1. Replace the desktop board with the same model as the failed board.
2. Start the original operating system or restore the original hard drive image.
3. Start the Infineon Security Platform Initialization Wizard and check the “I want to restore the
existing Security Platform” box.
51
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
4. Follow the instructions during the Security Platform Initialization, and append the Emergency
Recovery Archive to the existing archive.
5. Provide all the necessary passwords, files, and file locations as requested. It may take up to 20
minutes for Security Platform Initialization Wizard to restore the security platform settings.
6. Start User Initialization Wizard. Select “Recover Your Basic User Key” when prompted.
Specify the original Basic User Key password and proceed with the wizard.
7. When re-configuring the Personal Secure Drive, select “I want to change my Personal Secure
Drive setting”, confirm the drive letter and name are correct, and then proceed through the rest
of the wizard.
8. Restart the system when requested.
9. To restore access to the EMBASSY Trust Suite, right mouse click on the Key Transfer
Manager icon located in the taskbar in the lower right corner of the screen, and select Restore
TPM Keys.
10. Provide all the necessary passwords, files, and file locations as requested by the Key Transfer
Manager.
11. Upon successful completion of all steps, you should be able to access previously encrypted
files.
1.15.8 Clearing Trusted Platform Module Ownership
WARNING
Disconnect the desktop board's power supply from its AC power source before you connect or
disconnect cables, or install or remove any board components. Failure to do this can result in
personal injury or equipment damage. Some circuitry on the desktop board can continue to
operate even though the front panel power switch is off.
CAUTION
DATA ENCRYPTED BY ANY PROGRAM UTILIZING THE TPM WILL BECOME
INACCESSIBLE IF TPM OWNERSHIP IS CLEARED. Recovery procedures may allow the
migratable keys to be recovered and might restore access to encrypted data. (Review the Recovery
Procedures for detailed instructions).
The TPM may be cleared to transfer ownership of the platform to a new owner.
1. Observe precautions in the above WARNING then open the system case.
2. Move the configuration jumper on the board to pins 2-3.
3. Restore power to the PC and power on.
4. System should automatically enter BIOS setup.
5. Use the arrow keys to select Clear Trusted Platform Module, press <Enter>.
6. If you agree to the warning message select Ok and press <Enter>.
7. Press the <F10> key to save and exit, select Ok and press <Enter>.
8. Power off the system.
9. Review precautions in the WARNING above.
10. Restore the configuration jumper on the board to pins 1-2.
When cleared, the TPM module is disabled by default.
52
1.15.9 Software Support
• For assistance with the Infineon Security Platform Software, visit the web at:
http://www.infineon.com
• For assistance with the Wave System EMBASSY Trust Suite, visit the web at:
Product Description
http://www.wave.com/support/ets.html
• For additional information about TPM and enhancing PC security, visit:
https://www.trustedcomputinggroup.org/home
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Intel Desktop Board D925XCV/D925XBC Technical Product Specification
54
2 Technical Reference
What This Chapter Contains
2.1 Introduction ..................................................................................................................55
2.2 Memory Resources ......................................................................................................55
2.3 DMA Channels .............................................................................................................57
2.4 Fixed I/O Map............................................................................................................... 58
2.5 PCI Configuration Space Map...................................................................................... 59
2.6 Interrupts ......................................................................................................................60
2.7 PCI Conventional Interrupt Routing Map .....................................................................61
2.8 Connectors................................................................................................................... 63
2.9 Jumper Block ...............................................................................................................80
2.10 Mechanical Considerations ..........................................................................................81
2.11 Electrical Considerations.............................................................................................. 85
2.12 Thermal Considerations ...............................................................................................87
2.13 Reliability...................................................................................................................... 89
2.14 Environmental .............................................................................................................. 90
2.1 Introduction
Sections 2.2 - 2.6 contain several standalone tables. Table 11 describes the system memory map,
Table 12 lists the DMA channels, Table 13 shows the I/O map, Table 14 defines the PCI
Conventional bus configuration space map, and Table 15 describes the interrupts. The remaining
sections in this chapter are introduced by text found with their respective section headings.
2.2 Memory Resources
2.2.1 Addressable Memory
The board utilizes 4 GB of addressable system memory. Typically the address space that is
allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (firmware
hub), and chipset overhead resides above the top of DRAM (total system memory). On a system
that has 4 GB of system memory installed, it is not possible to use all of the installed memory due
to system address space being allocated for other system critical functions. These functions include
the following:
• BIOS/firmware hub (2 MB)
• Local APIC (19 MB)
• Digital Media Interface (40 MB)
• Front side bus interrupts (17 MB)
• PCI Express configuration space (256 MB)
• MCH base address registers, internal graphics ranges, PCI Express ports (up to 512 MB)
55
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
• Memory-mapped I/O that is dynamically allocated for PCI Conventional and PCI Express addin cards
The amount of installed memory that can be used will vary based on add-in cards and BIOS
settings. Figure 18 shows a schematic of the system memory map. All installed system memory
can be used when there is no overlap of system addresses.
4 GB
Top of System Address Space
FLASH
PCI Memory Range -
contains PCI, chipsets,
Direct Media Interface
(DMI), and ICH ranges
(approximately 750 MB)
DRAM
Range
Compatibility
Memory
DOS
APIC
Reserved
~20 MB
Top of usable
DRAM (memory
visible to the
operating
system)
1 MB
640 KB
0 MB
0FFFFFH
0F0000H
0EFFFFH
0E0000H
0DFFFFH
0C0000H
0BFFFFH
0A0000H
09FFFFH
00000H
Upper BIOS
area (64 KB)
Lower BIOS
area
(64 KB;
16 KB x 4)
Add-in Card
BIOS and
Buffer area
(128 KB;
16 KB x 8)
Standard PCI/
ISA Video
Memory (SMM
Memory)
128 KB
DOS area
(640 KB)
1 MB
960 KB
896 KB
768 KB
640 KB
0 KB
OM17140
56
Figure 18. Detailed System Memory Address Map
2.2.2 Memory Map
Table 11 lists the system memory map.
Table 11. System Memory Map
Address Range (decimal) Address Range (hex) Size Description
1024 K - 4194304 K 100000 - FFFFFFFF 4095 MB Extended memory
960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS
896 K - 960 K E0000 - EFFFF 64 KB Reserved
800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS
640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS
639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by
512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory
0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory
Technical Reference
memory (open to the PCI
Conventional bus). Dependent on
video adapter used.
memory manager software)
2.3 DMA Channels
Table 12. DMA Channels
DMA Channel Number Data Width System Resource
0 8 or 16 bits Open
1 8 or 16 bits Parallel port
2 8 or 16 bits Diskette drive
3 8 or 16 bits Parallel port (for ECP or EPP)
4 8 or 16 bits DMA controller
5 16 bits Open
6 16 bits Open
7 16 bits Open
57
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
2.4 Fixed I/O Map
Table 13. I/O Map
Address (hex) Size Description
0000 - 00FF 256 bytes Used by the Desktop Board D925XCV/D925XBC. Refer to
the ICH6-R data sheet for dynamic addressing information.
0170 - 0177 8 bytes Secondary Parallel ATA IDE channel command block
01F0 - 01F7 8 bytes Primary Parallel ATA IDE channel command block
0228 - 022F
0278 - 027F
02E8 - 02EF
02F8 - 02FF
0374 - 0377 4 bytes Secondary Parallel ATA IDE channel control block
0377, bits 6:0 7 bits Secondary IDE channel status port
0378 - 037F 8 bytes LPT1
03E8 - 03EF 8 bytes COM3
03F0 - 03F5 6 bytes Diskette channel
03F4 – 03F7 1 byte Primary Parallel ATA IDE channel control block
03F8 - 03FF 8 bytes COM1
04D0 - 04D1 2 bytes Edge/level triggered PIC
LPTn + 400 8 bytes ECP port, LPTn base address + 400h
0CF8 - 0CFB
0CF9
0CFC - 0CFF 4 bytes PCI Conventional bus configuration data register
FFA0 - FFA7 8 bytes Primary Parallel ATA IDE bus master registers
FFA8 - FFAF 8 bytes Secondary Parallel ATA IDE bus master registers
Notes:
1. Default, but can be changed to another address range.
2. Dword access only.
3. Byte access only.
(Note 1)
8 bytes LPT3
(Note 1)
8 bytes LPT2
(Note 1)
8 bytes COM4
(Note 1)
8 bytes COM2
(Note 2)
4 bytes PCI Conventional bus configuration address register
(Note 3)
1 byte Reset control register
✏ NOTE
Some additional I/O addresses are not available due to ICH6-R address aliasing. The ICH6-R
data sheet provides more information on address aliasing.
For information about Refer to
Obtaining the ICH6-R data sheet Section 1.4 on page 19
58
2.5 PCI Configuration Space Map
Table 14. PCI Configuration Space Map
Technical Reference
Bus
Number (hex)
Device
Number (hex)
Function
Number (hex) Description
00 00 00 Memory controller of Intel 82925X component
00 01 00 PCI Express x16 graphics port
00 1B 00 Intel High Definition Audio Controller
00 1C 00 PCI Express port 1 (PCI Express x1 bus connector 1)
00 1C 01 PCI Express port 2 (Gigabit Ethernet controller bridge)
00 1C 02 PCI Express port 3 (PCI Express x1 bus connector 2)
(Note 1)
00 1C 03 PCI Express port 4 (not used)
00 1D 00 USB UHCI controller 1
00 1D 01 USB UHCI controller 2
00 1D 02 USB UHCI controller 3
00 1D 03 USB UHCI controller 4
00 1D 07 EHCI controller
00 1E 00 PCI bridge
00 1F 00 PCI controller
00 1F 01 Parallel ATA IDE controller
00 1F 02 Serial ATA controller
00 1F 03 SMBus controller
(Note 2)
(Note 2)
(Note 2)
(Note 2)
(Note 2)
(Note 2)
Notes:
1. Not present on the D925XBC.
2. Bus number is dynamic and can change based on add-in cards used.
00 00 Gigabit Ethernet Controller
00 00 PCI Conventional bus connector 1
01 00 PCI Conventional bus connector 2
02 00 PCI Conventional bus connector 3
03 00 PCI Conventional bus connector 4
(Note 1)
(Note 1)
05 00 IEEE-1394a controller
59
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
2.6 Interrupts
The interrupts can be routed through either the Programmable Interrupt Controller (PIC) or the
Advanced Programmable Interrupt Controller (APIC) portion of the ICH6-R component. The PIC
is supported in Windows 98 SE and Windows ME and uses the first 16 interrupts. The APIC is
supported in Windows 2000 and Windows XP and supports a total of 24 interrupts.
Table 15. Interrupts
IRQ System Resource
NMI I/O channel check
0 Reserved, interval timer
1 Reserved, keyboard buffer full
2 Reserved, cascade interrupt from slave PIC
3 User available
4 COM1
5 LPT2 (Plug and Play option)/User available
6 Diskette drive
7 LPT1
8 Real-time clock
9 User available
10 User available
11 User available
12 Onboard mouse port (if present, else user available)
13 Reserved, math coprocessor
14 Primary IDE/Serial ATA (if present, else user available)
15 Serial ATA (if present, else user available)
(Note 2)
16
17
18
19
20
21
22
23
Notes:
1. Default, but can be changed to another IRQ.
2. Available in APIC mode only.
User available (through PIRQA)
(Note 2)
User available (through PIRQB)
(Note 2)
User available (through PIRQC)
(Note 2)
User available (through PIRQD)
(Note 2)
User available (through PIRQE)
(Note 2)
User available (through PIRQF)
(Note 2)
User available (through PIRQG)
(Note 2)
User available (through PIRQH)
(Note 1)
(Note 1)
60
Technical Reference
2.7 PCI Conventional Interrupt Routing Map
This section describes interrupt sharing and how the interrupt signals are connected between the
PCI Conventional bus connectors and onboard PCI Conventional devices. The PCI Conventional
specification describes how interrupts can be shared between devices attached to the PCI
Conventional bus. In most cases, the small amount of latency added by interrupt sharing does not
affect the operation or throughput of the devices. In some special cases where maximum
performance is needed from a device, a PCI Conventional device should not share an interrupt with
other PCI Conventional devices. Use the following information to avoid sharing an interrupt with a
PCI Conventional add-in card.
PCI Conventional devices are categorized as follows to specify their interrupt grouping:
• INTA: By default, all add-in cards that require only one interrupt are in this category. For
almost all cards that require more than one interrupt, the first interrupt on the card is also
classified as INTA.
• INTB: Generally, the second interrupt on add-in cards that require two or more interrupts is
classified as INTB. (This is not an absolute requirement.)
• INTC and INTD: Generally, a third interrupt on add-in cards is classified as INTC and a fourth
interrupt is classified as INTD.
The ICH6-R has eight Programmable Interrupt Request (PIRQ) input signals. All PCI
Conventional interrupt sources either onboard or from a PCI Conventional add-in card connect to
one of these PIRQ signals. Some PCI Conventional interrupt sources are electrically tied together
on the board and therefore share the same interrupt. Table 16 shows an example of how the
PIRQ signals are routed.
For example, using Table 16 as a reference, assume an add-in card using INTA is plugged into PCI
Conventional bus connector 3. In PCI bus connector 3, INTA is connected to PIRQB, which is
already connected to the ICH6-R audio controller. The add-in card in PCI Conventional bus
connector 3 now shares an interrupt with the onboard interrupt source.
61
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
Table 16. PCI Interrupt Routing Map
PCI Interrupt Source
IEEE-1394a controller INTA
PCI bus connector 1 INTD INTA INTB INTC
PCI bus connector 2 INTC INTB INTA INTD
PCI bus connector 3
PCI bus connector 4
Note: Not present on the D925XBC.
NOTE
✏
PIRQA PIRQB PIRQC PIRQD PIRQE PIRQF PIRQG PIRQH
(Note)
INTD INTC INTA INTB
(Note)
INTB INTA INTC INTD
ICH6-R PIRQ Signal Name
In PIC mode, the ICH6-R can connect each PIRQ line internally to one of the IRQ signals (3, 4, 5,
6, 7, 9, 10, 11, 12, 14, and 15). Typically, a device that does not share a PIRQ line will have a
unique interrupt. However, in certain interrupt-constrained situations, it is possible for two or
more of the PIRQ lines to be connected to the same IRQ signal. Refer to Table 15 for the
allocation of PIRQ lines to IRQ signals in APIC mode.
PCI interrupt assignments to the USB ports, Serial ATA ports, and PCI Express ports are dynamic.
62
Technical Reference
2.8 Connectors
CAUTION
Only the following connectors have overcurrent protection: back panel USB, front panel USB, and
PS/2.
The other internal connectors are not overcurrent protected and should connect only to devices
inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors
to power devices external to the computer’s chassis. A fault in the load presented by the external
devices could cause damage to the computer, the power cable, and the external devices themselves.
This section describes the board’s connectors. The connectors can be divided into these groups:
• Back panel I/O connectors
• Component-side I/O connectors (see page 68)
NOTE
✏
When installing the D925XBC board in a microATX chassis, make sure that peripheral devices are
installed at least 1.5 inches above the main power connector, the diskette drive connector, the
Parallel ATA IDE connector, and the DIMM sockets.
2.8.1 Back Panel Connectors
The back panel configuration is dependent upon which audio subsystem is present. The
configurations are as follows:
• 8-channel (7.1) audio subsystem (five analog audio output connectors and two digital audio
output connectors), described on page 64
• 6-channel (5.1) audio subsystem (three analog audio output connectors), described on page 66
63
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
2.8.1.1 Back Panel Connectors For 8-Channel (7.1) Audio Subsystem
Figure 19 shows the location of the back panel connectors for boards equipped with the 8-channel
(7.1) audio subsystem. The back panel connectors are color-coded. The figure legend (Table 17)
lists the colors used (when applicable).
J
AC
B
Figure 19. Back Panel Connectors for 8-Channel (7.1) Audio Subsystem
D
E
F
H
M
L
K
I
G
N
Table 17 lists the back panel connectors identified in Figure 19.
NOTE
✏
The back panel audio line out connector is designed to power headphones or amplified speakers
only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.
O
OM16680
64
Table 17. Back Panel Connectors Shown in Figure 19.
Item/callout from
Figure 19
A
B
C
D
E
F
G
H
I
J
K Mic in/Retasking Jack B [Pink]
L USB ports (two)
M IEEE-1394a connector (optional)
N
O
Description
PS/2 mouse port [Green]
PS/2 keyboard port [Purple]
Serial port A [Teal]
Parallel port [Burgundy]
Digital audio out coaxial [Orange]
Digital audio out optical
Front left/right channel audio out/Two channel audio line out/Retasking Jack D
[Lime green]
Surround left/right channel audio out/Retasking Jack H [Black]
Center channel and LFE (subwoofer) audio out/ Retasking Jack G
[Orange]
Audio line in/Retasking Jack C [Blue]
LAN
USB ports (two)
Technical Reference
65
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
2.8.1.2 Back Panel Connectors For 6-Channel (5.1) Audio Subsystem
Figure 20 shows the location of the back panel connectors for boards equipped with the 6-channel
(5.1) audio subsystem. The back panel connectors are color-coded. The figure legend (Table 18)
lists the colors used (when applicable).
AC
B
Figure 20. Back Panel Connectors for 6-Channel (5.1) Audio Subsystem
D
E
I
H
G
F
J
Table 18 lists the back panel connectors identified in Figure 20.
NOTE
✏
The back panel audio line out connector is designed to power headphones or amplified speakers
only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.
K
OM17127
66
Table 18. Back Panel Connectors Shown in Figure 20.
Item/callout from
Figure 20
A
B
C
D
E
F
G Mic in/Retasking Jack B [Pink]
H USB ports (two)
I IEEE-1394a connector (optional)
J
K
Description
PS/2 mouse port [Green]
PS/2 keyboard port [Purple]
Serial port A [Teal]
Parallel port [Burgundy]
Audio line in/Retasking Jack C [Blue]
Front left/right channel audio out/Two channel audio line out/Retasking Jack D
[Lime green]
LAN
USB ports (two)
Technical Reference
67
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
2.8.2 Component-side Connectors
Figure 21 shows the locations of the component-side connectors of the D925XCV board.
F
AC
B
4
1
1
E
D
4
G
H
12
910
I
K
J
L
2
1
10
2
1
10
M
14
3
1
O
N
4
13
2
1
10
1
9
2
2
1
1
11
11
1
3
4
1
2
1
10
1
24 2
23
40
2
39
1
EE
DD
CC
BB
AA
2
1
T
V
X
Z
U
W
Y
S
Figure 21. D925XCV Component-side Connectors
Table 19 lists the D925XCV component-side connectors identified in Figure 21.
1
34
33
Q
R
P
OM16681
68
Table 19. D925XCV Component-side Connectors Shown in Figure 21.
Item/callout from Figure 21 Description
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
AA
BB
CC
DD
EE
PCI Conventional bus add-in card connector 4
Auxiliary rear fan connector
PCI Conventional bus add-in card connector 3
ATAPI CD-ROM connector
PCI Express x1 bus add-in card connector 2
PCI Express x1 bus add-in card connector 1
Front panel audio connector
PCI Conventional bus add-in card connector 2
Front panel IEEE-1394a connector (optional)
PCI Conventional bus add-in card connector 1
Front panel IEEE-1394a connector (optional)
PCI Express x16 bus add-in card connector
Rear chassis fan connector
Alternate power connector
+12V power connector (ATX12V)
Processor fan connector
Power connector
Diskette drive connector
Parallel ATA IDE connector
Chassis intrusion connector
Front chassis fan connector
Serial ATA connector 1
Serial ATA connector 3
Serial ATA connector 2
Serial ATA connector 0
Auxiliary front panel power LED connector
Front panel connector
SCSI hard drive indicator LED (optional)
Auxiliary power output connector
Front panel USB connector
Front panel USB connector
Technical Reference
69
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
Figure 22 shows the locations of the component-side connectors of the D925XBC board.
W
BA
C EDF
12
910
1
Y
4
2
1
10
2
1
10
X
2
1
10
V
1
U
G
I
H
14
3
1
2
1
4
13
2
1
11
10
9
11
2
1
1
24 2
23
40
2
39
1
1
3
4
1
1
34
33
P
R
T
O
Q
S
Figure 22. D925XBC Component-side Connectors
Table 20 lists the D925XBC component-side connectors identified in Figure 22.
70
K JLMN
OM16691
Table 20. D925XBC Component-side Connectors Shown in Figure 22.
Item/callout from Figure 22 Description
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
PCI Express x1 bus add-in card connector
Front panel audio connector
PCI Conventional bus add-in card connector 2
Front panel IEEE-1394a connector (optional)
PCI Conventional bus add-in card connector 1
PCI Express x16 bus add-in card connector
Rear chassis fan connector
Alternate power connector
+12V power connector (ATX12V)
Processor fan connector
Power connector
Diskette drive connector
Parallel ATA IDE connector
Chassis intrusion connector
Front chassis fan connector
Serial ATA connector 1
Serial ATA connector 3
Serial ATA connector 2
Serial ATA connector 0
Auxiliary front panel power LED connector
Front panel connector
Front panel USB connector
Front panel USB connector
Front panel IEEE-1394a connector (optional)
ATAPI CD-ROM connector
Technical Reference
71
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
Table 21. ATAPI CD-ROM Connector
Pin Signal Name
1 Left audio input from CD-ROM
2 CD audio differential ground
3 CD audio differential ground
4 Right audio input from CD-ROM
Table 22. Front Panel Audio Connector
Pin Signal Name Pin Signal Name
1 Port E [Port 1] Left Channel 2 Ground
3 Port E [Port 1] Right Channel 4 Presence# (dongle present)
5 Port F [Port 2] Right Channel 6 Port E [Port 1] Sense return
(jack detection)
7 Port E [Port 1] and Port F [Port 2]
Sense send (jack detection)
9 Port F [Port 2] Left Channel 10 Port F [Port 2] Sense return
8 Key
(jack detection)
INTEGRATOR’S NOTE
#
The front panel audio connector is colored yellow.
Table 23. Front Chassis Fan and Rear Chassis
Fan Connectors
Pin Signal Name
1 Control
2 +12 V
3 Tach
Table 24. Processor Fan Connector and Auxiliary
Rear Fan Connector
Pin Signal Name
1 Ground
2 +12 V
3 FAN_TACH
4 FAN_CONTROL
NOTE
✏
The auxiliary rear fan connector is present only on the D925XCV board. It is not present on the
D925XBC board.
72
Table 25. Chassis Intrusion Connector
Pin Signal Name
1 Intruder
2 Ground
Table 26. SCSI Hard Drive Activity LED
Connector (Optional)
Pin Signal Name
1 SCSI_ACT#
2 No connect
Table 27. Serial ATA Connectors
Pin Signal Name
1 Ground
2 TXP
3 TXN
4 Ground
5 RXN
6 RXP
7 Ground
Technical Reference
Table 28. Auxiliary Power Output Connector
Pin Signal Name
1 +12 V
2 Ground
3 Ground
4 +5 V
NOTE
✏
The auxiliary power output connector is present only on the D925XCV board. It is not present on
the D925XBC board.
73
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
2.8.2.1 Power Supply Connectors
The board has three power supply connectors:
• Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors
previously used on Intel Desktop boards. The board supports the use of ATX12V power
supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a
2 x 10 main power cable, attach that cable on the rightmost pins of the main power connector,
leaving pins 11, 12, 23, and 24 unconnected.
• ATX12V power – a 2 x 2 connector. This connector provides power directly to the processor
voltage regulator and must always be used. Failure to do so will prevent the board from
booting.
• Alternate power – a 1 x 4 connector. This connector provides additional power when using
high wattage PCI Express x16 graphics cards.
INTEGRATOR’S NOTE
#
When using high wattage PCI Express x16 graphics cards, use one of the following power supply
configurations to avoid system instability:
• The preferred method of power delivery is to use a power supply with a 2 x 12 main power
cable. In this configuration, use two connectors to provide power to the board:
The main power connector
The ATX12V connector
In this configuration, the alternate power connector is not required. The 2 x 12 main power
cable can provide up to 144 W of power from the +12 V rail.
• An alternate method of power delivery is to use a power supply has a 2 x 10 main power cable.
In this configuration, use three connectors to provide power to the board:
The main power connector
The ATX12V connector
The alternate power connector
The combination of the 2 x 10 main power cable and the alternate power cable can provide up
to 144 W of power from the +12 V rail (72 W each).
74
Table 29. Main Power Connector
Pin Signal Name Pin Signal Name
1 +3.3 V 13 +3.3 V
2 +3.3 V 14 -12 V
3 Ground 15 Ground
4 +5 V 16 PS-ON# (power supply remote on/off)
5 Ground 17 Ground
6 +5 V 18 Ground
7 Ground 19 Ground
8 PWRGD (Power Good) 20 No connect
9 +5 V (Standby) 21 +5 V
10 +12 V 22 +5 V
11 +12 V 23 +5 V
12 2x12 connector detect 24 Ground
Table 30. ATX12V Power Connector
Technical Reference
Pin Signal Name Pin Signal Name
1 Ground 2 Ground
3 +12 V 4 +12 V
Table 31. Alternate Power Connector
Pin Signal Name
1 +12 V
2 Ground
3 Ground
4 +5 V
2.8.2.2 Add-in Card Connectors
The board has the following add-in card connectors:
• PCI Express x16: one connector supporting simultaneous transfer speeds up to 8 GBytes/sec
• PCI Express x1: the D925XCV board has two PCI Express x1 connectors; the D925XBC
board has one PCI Express x1 connector. The x1 interfaces support simultaneous transfer
speeds up to 500 MBytes/sec.
• PCI Conventional (rev 2.2 compliant) bus: the D925XCV board has four PCI Conventional
bus add-in card connectors; the D925XBC board has two PCI Conventional add-in card
connectors. The SMBus is routed to PCI Conventional bus connector 2 only (ATX expansion
slot 6). PCI Conventional bus add-in cards with SMBus support can access sensor data and
other information residing on the Desktop Board.
75
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
Note the following considerations for the PCI Conventional bus connectors (for both Desktop
Boards):
• All of the PCI Conventional bus connectors are bus master capable.
• SMBus signals are routed to PCI Conventional bus connector 2. This enables PCI
Conventional bus add-in boards with SMBus support to access sensor data on the Desktop
Board. The specific SMBus signals are as follows:
The SMBus clock line is connected to pin A40.
The SMBus data line is connected to pin A41.
2.8.2.3 Auxiliary Front Panel Power/Sleep LED Connector
Pins 1 and 3 of this connector duplicate the signals on pins 2 and 4 of the front panel connector.
Table 32. Auxiliary Front Panel Power/Sleep LED Connector
Pin Signal Name In/Out Description
1 HDR_BLNK_GRN Out Front panel green LED
2 Not connected
3 HDR_BLNK_YEL Out Front panel yellow LED
2.8.2.4 Front Panel Connector
This section describes the functions of the front panel connector. Table 33 lists the signal names of
the front panel connector. Figure 23 is a connection diagram for the front panel connector.
Table 33. Front Panel Connector
Pin Signal In/Out Description Pin Signal In/Out Description
Hard Drive Activity LED
[Yellow]
1 HD_PWR Out Hard disk LED pull-up
(750 Ω) to +5 V
3 HAD# Out Hard disk active LED 4 HDR_BLNK_
Reset Switch
[Purple]
5 Ground Ground 6 FPBUT_IN In Power switch
7 FP_RESET# In Reset switch 8 Ground Ground
Power Not Connected
9 +5 V Power 10 N/C Not connected
2 HDR_BLNK_
GRN
YEL
Power LED
[Green]
Out Front panel green
LED
Out Front panel yellow
LED
On/Off Switch
[Red]
76
Technical Reference
+5 V DCN/C
Purple
Yellow
Reset
Switch
−
+
Hard Drive
Activity LED
OM17000
Dual-colored
Power LED
+
−
Power
Switch
Single-colored
Power LED
−
+
Green Red
9
8
7
6
5
4
3
2
1
Figure 23. Connection Diagram for Front Panel Connector
2.8.2.4.1 Hard Drive Activity LED Connector [Yellow]
Pins 1 and 3 [Yellow] can be connected to an LED to provide a visual indicator that data is being
read from or written to a hard drive. Proper LED function requires one of the following:
• A Serial ATA hard drive connected to an onboard Serial ATA connector
• An IDE hard drive connected to an onboard IDE connector
2.8.2.4.2 Reset Switch Connector [Purple]
Pins 5 and 7 [Purple] can be connected to a momentary single pole, single throw (SPST) type
switch that is normally open. When the switch is closed, the board resets and runs the POST.
2.8.2.4.3 Power/Sleep LED Connector [Green]
Pins 2 and 4 [Green] can be connected to a one- or two-color LED. Table 34 shows the possible
states for a one-color LED. Table 35 shows the possible states for a two-color LED.
Table 34. States for a One-Color Power LED
LED State Description
Off Power off/sleeping
Steady Green Running
Table 35. States for a Two-Color Power LED
LED State Description
Off Power off
Steady Green Running
Steady Yellow Sleeping
77
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
✏ NOTE
The colors listed in Table 34 and Table 35 are suggested colors only. Actual LED colors are
product- or customer-specific.
2.8.2.4.4 Power Switch Connector [Red]
Pins 6 and 8 [Red] can be connected to a front panel momentary-contact power switch. The switch
must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or
off. (The time requirement is due to internal debounce circuitry on the board.) At least two
seconds must pass before the power supply will recognize another on/off signal.
2.8.2.5 Front Panel USB Connectors
Figure 24 is a connection diagram for the front panel USB connectors.
INTEGRATOR’S NOTES
#
• The +5 V DC power on the USB connector is fused.
• Pins 1, 3, 5, and 7 comprise one USB port.
• Pins 2, 4, 6, and 8 comprise one USB port.
• Use only a front panel USB connector that conforms to the USB 2.0 specification for high-
speed USB devices.
One
USB
Port
Power
(+5 V DC)
D−
D+
Ground
Key (no pin)
2
1
4
3
6
5
8
7
10
Power
(+5 V DC)
D−
D+
Ground
No Connect
One
USB
Port
OM15963
Figure 24. Connection Diagram for Front Panel USB Connectors
78
2.8.2.6 Front Panel IEEE 1394a Connectors (Optional)
Figure 25 is a connection diagram for the IEEE 1394a connectors.
2
TPA+
1
TPA−
Technical Reference
Ground
TPB+ TPB−
+12 V DC
Key (no pin)
3
5
7
Figure 25. Connection Diagram for IEEE 1394a Connectors
INTEGRATOR’S NOTES
#
• The IEEE 1394a connectors are colored blue.
• The +12 V DC power on the IEEE 1394a connectors is fused.
• Each IEEE 1394a connector provides one IEEE 1394a port.
4
6
8
10
Ground
+12 V DC
Ground
OM16107
79
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
2.9 Jumper Block
CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the power cord
from the computer before changing a jumper setting. Otherwise, the board could be damaged.
Figure 26 shows the location of the jumper block. The 3-pin jumper block determines the BIOS
Setup program’s mode. Table 36 describes the jumper settings for the three modes: normal,
configure, and recovery. When the jumper is set to configure mode and the computer is poweredup, the BIOS compares the processor version and the microcode version in the BIOS and reports if
the two match.
31
J6J3
Figure 26. Location of the Jumper Block
Table 36. BIOS Setup Configuration Jumper Settings
Function/Mode Jumper Setting Configuration
Normal
1-2
Configure
2-3
Recovery
None
80
1
13
13
The BIOS uses current configuration information and
3
passwords for booting.
After the POST runs, Setup runs automatically. The
maintenance menu is displayed.
The BIOS attempts to recover the BIOS configuration. A
recovery diskette is required.
OM16682
Technical Reference
2.10 Mechanical Considerations
2.10.1 D925XCV Form Factor
The Desktop Board D925XCV is designed to fit into an ATX-form-factor chassis. Figure 27
illustrates the mechanical form factor for the Desktop Board D925XCV. Dimensions are given in
inches [millimeters]. The outer dimensions are 10.20 inches by 9.60 inches [259.08 millimeters by
243.84 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the
ATX specification.
1.800
[45.72]
6.500
[165.10]
6.100
[154.94]
5.200
[132.08]
0.00
2.850
[72.39]
3.100
[78.74]
3.750
[95.25]
4.900
[124.46]
2.600
[66.04]
0.00
Figure 27. Desktop Board D925XCV Dimensions
6.200
[157.48]
6.450
[163.83]
OM16684
81
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
2.10.2 D925XBC Form Factor
The Desktop Board D925XBC is designed to fit into either a microATX or an ATX-form-factor
chassis. Figure 28 illustrates the mechanical form factor for the Desktop Board D925XBC.
Dimensions are given in inches [millimeters]. The outer dimensions are 9.60 inches by 9.60 inches
[243.84 millimeters by 243.84 millimeters]. Location of the I/O connectors and mounting holes are
in compliance with the ATX specification.
NOTE
✏
When installing the Desktop Board in a microATX chassis, make sure that peripheral devices are
installed at least 1.5 inches above the main power connector, the diskette drive connector, and the
IDE connector, and the DIMM sockets.
1.800
[45.72]
6.500
[165.10]
6.100
[154.94]
5.200
[132.08]
0.00
2.850
[72.39]
3.100
[78.74]
3.150
[80.01]
2.600
[66.04]
0.00
6.200
[157.48]
Figure 28. Desktop Board D925XBC Dimensions
6.450
[163.83]
OM16694
82
Technical Reference
2.10.3 I/O Shield
The back panel I/O shield for the Desktop Boards D925XCV and D925XBC must meet specific
dimension and material requirements. Systems based on these Desktop Boards need the back panel
I/O shield to pass certification testing. Figure 29 shows the I/O shield for boards with the
8-channel (7.1) audio subsystem. Figure 30 shows the I/O shield for boards with the 6-channel
(5.1) audio subsystem. Dimensions are given in inches to a tolerance of ±0.02 inches. The figures
also indicate the position of each cutout. Additional design considerations for I/O shields relative
to chassis requirements are described in the ATX specification.
NOTE
✏
The I/O shield drawings in this document are for reference only. I/O shields compliant with the
ATX chassis specification 2.03 are available from Intel.
162.3 REF
[6.390]
1.6 ± 0.12
[0.063 ± 0.005]
7.012
[0.276]
0.00
[0.00]
12.00
[0.472]
1.55 REF
[0.061]
22.45
[0.884]
Ø 1.00
[0.039]
11.811
[0.465]
12.81
[0.504]
20. ± 0.254 TYP
[0.787 ± 0.10]
A
9.44
0.00
[0.00]
[0.372]
20.914
[0.832]
27.876
[1.097]
62.45
[2.459]
159.2 ± 0.12
[6.268 ± 0.005]
69.21
79.47
[2.725]
[3.129]
102.84
[4.049]
120.81
[4.756]
142.12
[5.595]
8x R 0.5 MIN
6.02
[0.237]
A
11.81
[0.465]
14.4
[0.567]
16.84
[0.663]
Pictorial
View
OM17164
Figure 29. I/O Shield Dimensions for Boards with the 8-Channel (7.1) Audio Subsystem
83
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
162.3 REF
[6.390]
20. ± 0.254 TYP
1.55 REF
7.012
[0.276]
0.00
[0.00]
[0.061]
22.45
[0.884]
Ø 1.00
[0.039]
11.811
[0.465]
12.00
[0.472]
[0.787 ± 0.10]
A
9.44
0.00
[0.00]
[0.372]
20.914
[0.832]
27.876
[1.097]
159.2 ± 0.12
[6.268 ± 0.005]
102.84
[4.049]
120.81
[4.756]
142.12
[5.595]
1.6 ± 0.12
[0.063 ± 0.005]
8x R 0.5 MIN
A
11.81
[0.465]
14.4
[0.567]
Pictorial
View
OM17165
Figure 30. I/O Shield Dimensions for Boards with the 6-Channel (5.1) Audio Subsystem
84
Technical Reference
2.11 Electrical Considerations
2.11.1 DC Loading
Table 37 lists the DC loading characteristics of the board. This data is based on a DC analysis of
all active components within the board that impact its power delivery subsystems. The analysis
does not include PCI add-in cards. Minimum values assume a light load placed on the board that is
similar to an environment with no applications running and no USB current draw. Maximum
values assume a load placed on the board that is similar to a heavy gaming environment with a
500 mA current draw per USB port. These calculations are not based on specific processor values
or memory configurations but are based on the minimum and maximum current draw possible from
the board’s power delivery subsystems to the processor, memory, and USB ports.
Use the datasheets for add-in cards, such as PCI, to determine the overall system power
requirements. The selection of a power supply at the system level is dependent on the system’s
usage model and not necessarily tied to a particular processor speed.
Table 37. DC Loading Characteristics
DC Current at:
Mode DC Power +3.3 V +5 V +12 V -12 V +5 VSB
Minimum loading 200.00 W 3.30 A 10.00 A 9.00 A 0.03 A 0.80 A
Maximum loading 300.00 W 6.00 A 14.00 A 16.00 A 0.10 A 1.40 A
2.11.2 Add-in Board Considerations
The boards are designed to provide 2 A (average) of +5 V current for each add-in board. The total
+5 V current draw for add-in boards for the boards is as follows:
• A fully loaded Desktop Board D925XCV (all six expansion slots and the PCI Express x16 slot
filled) must not exceed 14 A.
• A fully loaded Desktop Board D925XBC (all three expansion slots and the PCI Express x16
slot filled) must not exceed 8 A.
85
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
2.11.3 Fan Connector Current Capability
CAUTION
The processor fan must be connected to the processor fan connector, not to a chassis fan
connector. Connecting the processor fan to a chassis fan connector may result in onboard
component damage that will halt fan operation.
Table 38 lists the current capability of the fan connectors.
Table 38. Fan Connector Current Capability
Fan Connector Maximum Available Current
Processor fan 1000 mA
Front chassis fan
Rear chassis fan
Auxiliary rear fan
NOTE
✏
The auxiliary rear fan is available only on the D925XCV board. It is not available on the
D925XBC board.
800 mA
800 mA
800 mA
2.11.4 Power Supply Considerations
CAUTION
The +5 V standby line for the power supply must be capable of providing adequate +5 V standby
current. Failure to do so can damage the power supply. The total amount of standby current
required depends on the wake devices supported and manufacturing options.
System integrators should refer to the power usage values listed in Table 37 when selecting a power
supply for use with the board.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the following recommendations found in the indicated
sections of the ATX form factor specification.
• The potential relation between 3.3 VDC and +5 VDC power rails (Section 4.2)
• The current capability of the +5 VSB line (Section 4.2.1.2)
• All timing parameters (Section 4.2.1.3)
• All voltage tolerances (Section 4.2.2)
86
Technical Reference
2.12 Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is a
requirement. Use a processor heatsink that provides omni-directional airflow (as shown in
Figure 31) to maintain required airflow across the processor voltage regulator area.
OM16996
Figure 31. Processor Heatsink for Omni-directional Airflow
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the processor
and/or voltage regulator or, in some instances, damage to the desktop board. For a list of chassis
that have been tested with Intel desktop boards please refer to the following website:
http://developer.intel.com/design/motherbd/cooling.htm
All responsibility for determining the adequacy of any thermal or system design remains solely with
the reader. Intel makes no warranties or representations that merely following the instructions
presented in this document will result in a system with adequate thermal performance.
87
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
CAUTION
Ensure that the ambient temperature does not exceed the Desktop Board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case temperature
and malfunction. For information about the maximum operating temperature, see the
environmental specifications in Section 2.14.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do
so may result in damage to the voltage regulator circuit. The processor voltage regulator area
(item A in Figure 32) can reach a temperature of up to 85
Figure 32 shows the locations of the localized high temperature zones.
o
C in an open chassis.
CD
Item Description
A Processor voltage regulator area
B Processor
C Intel 82925X MCH
D Intel 82801FR ICH6-R
OM16683
A
B
Figure 32. Localized High Temperature Zones
88
Technical Reference
Table 39 provides maximum case temperatures for the Desktop Board D925XCV/D925XBC
components that are sensitive to thermal changes. The operating temperature, current load, or
operating frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the Desktop Board D925XCV/D925XBC.
Table 39. Thermal Considerations for Components
Component Maximum Case Temperature
Intel Pentium 4 processor For processor case temperature, see processor datasheets and
processor specification updates
o
99
Intel 82925X MCH
Intel 82801FR ICH6-R
C (under bias)
o
110
C (under bias)
For information about Refer to
Intel Pentium 4 processor datasheets and specification updates Section 1.4, page 19
2.13 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the D925XCV and
D925XBC boards is 105,577 hours.
89
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
2.14 Environmental
Table 40 lists the environmental specifications for the Desktop Boards D925XCV and D925XBC.
Table 40. Desktop Board D925XCV/D925XBC Environmental Specifications
Parameter Specification
Temperature
Non-Operating
Operating
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/second
Packaged Half sine 2 millisecond
Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
-40 °C to +70 °C
0 °C to +55 °C
90
Technical Reference
2.15 Regulatory Compliance
This section describes the Desktop Boards’ compliance with U.S. and international safety and
electromagnetic compatibility (EMC) regulations.
2.15.1 Safety Regulations
Table 41 lists the safety regulations the Desktop Boards D925XCV and D925XBC comply with
when correctly installed in a compatible host system.
Table 41. Safety Regulations
Regulation Title
UL 60950-1:2003/
CSA C22.2 No. 60950-1-03
EN 60950-1:2002 Information Technology Equipment - Safety - Part 1: General
IEC 60950-1:2001, First Edition Information Technology Equipment - Safety - Part 1: General
Information Technology Equipment - Safety - Part 1: General
Requirements (USA and Canada)
Requirements (European Union)
Requirements (International)
2.15.2 EMC Regulations
Table 42 lists the EMC regulations the Desktop Boards D925XCV and D925XBC comply with
when correctly installed in a compatible host system.
Table 42. EMC Regulations
Regulation Title
FCC (Class B) Title 47 of the Code of Federal Regulations, Parts 2 and 15, Subpart B,
Radio Frequency Devices. (USA)
ICES-003 (Class B) Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
EN55022: 1998 (Class B) Limits and methods of measurement of Radio Interference
Characteristics of Information Technology Equipment.
(European Union)
EN55024: 1998 Information Technology Equipment – Immunity Characteristics Limits
and methods of measurement. (European Union)
AS/NZS 3548 (Class B) Australian Communications Authority, Standard for Electromagnetic
Compatibility. (Australia and New Zealand)
CISPR 22, 3rd Edition (Class B) Limits and methods of measurement of Radio Disturbance
Characteristics of Information Technology Equipment. (International)
CISPR 24: 1997 Information Technology Equipment – Immunity Characteristics – Limits
and Methods of Measurements. (International)
VCCI (Class B) Voluntary Control for Interference by Information Technology Equipment.
(Japan)
91
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
2.15.2.1 FCC Compliance Statement (USA)
Product Type: D925XCV Desktop Board and D925XBC Desktop Board
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the following
measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment to a different electrical branch circuit from that to which the receiver is
connected.
• Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications to the equipment not expressly approved by Intel Corporation could
void the user’s authority to operate the equipment.
2.15.2.2 Canadian Compliance Statement
This Class B digital apparatus complies with Canadian ICES-003.
Cet appereil numérique de la classe B est conforme à la norme NMB-003 du Canada.
2.15.3 European Union Declaration of Conformity Statement
We, Intel Corporation, declare under our sole responsibility that the product: Intel
Boards D925XCV and D925XBC are in conformity with all applicable essential requirements
necessary for CE marking, following the provisions of the European Council Directive 89/336/EEC
(EMC Directive) and Council Directive 73/23/EEC (Safety/Low Voltage Directive).
The product is properly CE marked demonstrating this conformity and is for distribution within all
member states of the EU with no restrictions.
This product follows the provisions of the European Directives 89/336/EEC and 73/23/EEC.
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv 89/336/EEC &
73/23/EEC.
®
Desktop
Dutch Dit product is in navolging van de bepalingen van Europees Directief 89/336/EEC &
73/23/EEC.
92
Technical Reference
Suomi Tämä tuote noudattaa EU-direktiivin 89/336/EEC & 73/23/EEC määräyksiä.
Français Ce produit est conforme aux exigences de la Directive Européenne 89/336/EEC &
73/23/EEC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie 89/336/EEC &
73/23/EEC.
Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer 89/336/ EEC &
73/23/EEC.
Italiano Questo prodotto è conforme alla Direttiva Europea 89/336/EEC & 73/23/EEC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 89/336/ EEC &
73/23/EEC.
Portuguese Este produto cumpre com as normas da Diretiva Européia 89/336/EEC &
73/23/EEC.
Español Este producto cumple con las normas del Directivo Europeo 89/336/EEC & 73/23/EEC.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 89/336/EEC & 73/23/EEC.
2.15.4 Product Ecology Statements
The following information is provided to address worldwide product ecology concerns and
regulations.
2.15.4.1 Disposal Considerations
This product contains the following materials that may be regulated upon disposal: lead solder on
the printed wiring board assembly.
2.15.4.2 Recycling Considerations
Intel encourages its customers to recycle its products and their components (e.g., batteries, circuit
boards, plastic enclosures, etc.) whenever possible. In the U.S., a list of recyclers in your area can
be found at:
http://www.eiae.org/
In the absence of a viable recycling option, products and their components must be disposed of in
accordance with all applicable local environmental regulations.
93
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
2.15.5 Product Certification Markings (Board Level)
Table 43 lists the board’s product certification markings.
Table 43. Product Certification Markings
Description Marking
UL joint US/Canada Recognized Component mark. Includes adjacent
UL file number for Intel Desktop Boards: E210882 (component side).
FCC Declaration of Conformity logo mark for Class B equipment;
includes Intel name and D925XCV or D925XBC model designation
(component side).
CE mark. Declares compliance to European Union (EU) EMC directive
(89/336/EEC) and Low Voltage directive (73/23/EEC) (component side).
The CE mark should also be on the shipping container.
Australian Communications Authority (ACA) C-Tick mark. Includes
adjacent Intel supplier code number, N-232. The C-tick mark should
also be on the shipping container.
Printed wiring board manufacturer’s recognition mark: consists of a
unique UL recognized manufacturer’s logo, along with a flammability
rating (solder side).
V-0 or 94V-0
94
3 Overview of BIOS Features
What This Chapter Contains
3.1 Introduction ..................................................................................................................95
3.2 BIOS Flash Memory Organization ...............................................................................96
3.3 Resource Configuration ...............................................................................................96
3.4 System Management BIOS (SMBIOS) ........................................................................97
3.5 Legacy USB Support.................................................................................................... 97
3.6 BIOS Updates .............................................................................................................. 98
3.7 Boot Options ................................................................................................................99
3.8 Fast Booting Systems with Intel® Rapid BIOS Boot................................................... 100
3.9 BIOS Security Features .............................................................................................101
3.1 Introduction
The Desktop Boards D925XCV and D925XBC use an Intel/AMI BIOS that is stored in the
Firmware Hub (FWH) and can be updated using a disk-based program. The FWH contains the
BIOS Setup program, POST, the PCI auto-configuration utility, and Plug and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision code. The
initial production BIOSs are identified as CV92510A.86A.
When the BIOS Setup configuration jumper is set to configure mode and the computer is poweredup, the BIOS compares the CPU version and the microcode version in the BIOS and reports if the
two match.
The BIOS Setup program can be used to view and change the BIOS settings for the computer. The
BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST)
memory test begins and before the operating system boot begins. The menu bar is shown below.
Maintenance Main Advanced Security Power Boot Exit
NOTE
✏
The maintenance menu is displayed only when the Desktop Board is in configure mode. Section 2.9
on page 80 shows how to put the Desktop Board in configure mode.
95
Intel Desktop Board D925XCV/D925XBC Technical Product Specification
Table 44 lists the BIOS Setup program menu features.
Table 44. BIOS Setup Program Menu Bar
Maintenance Main Advanced Security Power Boot Exit
Clears
passwords and
displays
processor
information
Displays
processor
and memory
configuration
Configures
advanced
features
available
through the
chipset
Sets
passwords
and security
features
Configures
power
management
features and
power supply
controls
Table 45 lists the function keys available for menu screens.
Table 45. BIOS Setup Program Function Keys
BIOS Setup Program Function Key Description
<←> or <→>
<↑> or <↓>
<Tab> Selects a field (Not implemented)
<Enter> Executes command or selects the submenu
<F9> Load the default configuration values for the current menu
<F10> Save the current values and exits the BIOS Setup program
<Esc> Exits the menu
Selects a different menu screen (Moves the cursor left or right)
Selects an item (Moves the cursor up or down)
Selects boot
options
Saves or
discards
changes to
Setup
program
options
3.2 BIOS Flash Memory Organization
The Firmware Hub (FWH) includes a 8 Mbit (1024 KB) symmetrical flash memory device.
3.3 Resource Configuration
3.3.1 PCI Autoconfiguration
The BIOS can automatically configure PCI devices. PCI devices may be onboard or add-in cards.
Autoconfiguration lets a user insert or remove PCI cards without having to configure the system.
When a user turns on the system after adding a PCI card, the BIOS automatically configures
interrupts, the I/O space, and other system resources. Any interrupts set to Available in Setup are
considered to be available for use by the add-in card.
3.3.2 PCI IDE Support
If you select Auto in the BIOS Setup program, the BIOS automatically sets up the
PCI IDE connector with independent I/O channel support. The IDE interface supports hard drives
up to ATA-66/100 and recognizes any ATAPI compliant devices, including CD-ROM drives, tape
drives, and Ultra DMA drives. The BIOS determines the capabilities of each drive and configures
them to optimize capacity and performance. To take advantage of the high capacities typically
available today, hard drives are automatically configured for Logical Block Addressing (LBA) and
96
Overview of BIOS Features
to PIO Mode 3 or 4, depending on the capability of the drive. You can override the autoconfiguration options by specifying manual configuration in the BIOS Setup program.
To use ATA-66/100 features the following items are required:
• An ATA-66/100 peripheral device
• An ATA-66/100 compatible cable
• ATA-66/100 operating system device drivers
NOTE
✏
Do not connect an ATA device as a slave on the same IDE cable as an ATAPI master device. For
example, do not connect an ATA hard drive as a slave to an ATAPI CD-ROM drive.
3.4 System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in
a managed network.
The main component of SMBIOS is the Management Information Format (MIF) database, which
contains information about the computing system and its components. Using SMBIOS, a system
administrator can obtain the system types, capabilities, operational status, and installation dates for
system components. The MIF database defines the data and provides the method for accessing this
information. The BIOS enables applications such as third-party management software to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems, such as Windows NT*, require an additional interface for
obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such
operating systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information.
3.5 Legacy USB Support
Legacy USB support enables USB devices to be used even when the operating system’s USB
drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and
to install an operating system that supports USB. By default, Legacy USB support is set to
Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and
configure the BIOS Setup program and the maintenance menu.
4. POST completes.
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Intel Desktop Board D925XCV/D925XBC Technical Product Specification
5. The operating system loads. While the operating system is loading, USB keyboards and mice
are recognized and may be used to configure the operating system. (Keyboards and mice are
not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup
program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are
recognized by the operating system, and Legacy USB support from the BIOS is no longer used.
To install an operating system that supports USB, verify that Legacy USB support in the BIOS
Setup program is set to Enabled and follow the operating system’s installation instructions.
3.6 BIOS Updates
The BIOS can be updated using either of the following utilities, which are available on the Intel
World Wide Web site:
®
• Intel
• Intel
Express BIOS Update utility, which enables automated updating while in the Windows
environment. Using this utility, the BIOS can be updated from a file on a hard disk, a 1.44 MB
diskette, or a CD-ROM, or from the file location on the Web.
®
Flash Memory Update Utility, which requires creation of a boot diskette and manual
rebooting of the system. Using this utility, the BIOS can be updated from a file on a 1.44 MB
diskette (from a legacy diskette drive or an LS-120 diskette drive) or a CD-ROM.
Both utilities verify that the updated BIOS matches the target system to prevent accidentally
installing an incompatible BIOS.
NOTE
✏
Review the instructions distributed with the upgrade utility before attempting a BIOS update.
For information about Refer to
The Intel World Wide Web site Section 1.4, page 19
3.6.1 Language Support
The BIOS Setup program and help messages are supported in US English. Additional languages
are available in the Integrator’s Toolkit utility. Check the Intel website for details.
3.6.2 Custom Splash Screen
During POST, an Intel® splash screen is displayed by default. This splash screen can be augmented
with a custom splash screen. The Integrator’s Toolkit that is available from Intel can be used to
create a custom splash screen.
NOTE
✏
If you add a custom splash screen, it will share space with the Intel branded logo.
For information about Refer to
The Intel World Wide Web site Section 1.4, page 19
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Overview of BIOS Features
3.7 Boot Options
In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drives,
CD-ROM, or the network. The default setting is for the diskette drive to be the first boot device,
the hard drive second, and the ATAPI CD-ROM third. The fourth device is disabled.
3.7.1 CD-ROM Boot
Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM format
specification. Under the Boot menu in the BIOS Setup program, ATAPI CD-ROM is listed as a
boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD
in the CD-ROM drive, the system will attempt to boot from the next defined drive.
3.7.2 Network Boot
The network can be selected as a boot device. This selection allows booting from the onboard LAN
or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To use this key
during POST, the User Access Level in the BIOS Setup program's Security menu must be
set to Full.
3.7.3 Booting Without Attached Devices
For use in embedded applications, the BIOS has been designed so that after passing the POST, the
operating system loader is invoked even if the following devices are not present:
• Video adapter
• Keyboard
• Mouse
3.7.4 Changing the Default Boot Device During POST
Pressing the <F10> key during POST causes a boot device menu to be displayed. This menu
displays the list of available boot devices (as set in the BIOS setup program’s Boot Device Priority
Submenu). Table 46 lists the boot device menu options.
Table 46. Boot Device Menu Options
Boot Device Menu Function Keys Description
<↑> or <↓>
<Enter> Exits the menu, saves changes, and boots from the selected device
<Esc> Exits the menu without saving changes
Selects a default boot device
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Intel Desktop Board D925XCV/D925XBC Technical Product Specification
3.8 Fast Booting Systems with Intel® Rapid BIOS Boot
These factors affect system boot speed:
• Selecting and configuring peripherals properly
• Using an optimized BIOS, such as the Intel
3.8.1 Peripheral Selection and Configuration
The following techniques help improve system boot speed:
• Choose a hard drive with parameters such as “power-up to data ready” less than eight seconds,
that minimize hard drive startup delays.
• Select a CD-ROM drive with a fast initialization rate. This rate can influence POST
execution time.
• Eliminate unnecessary add-in adapter features, such as logo displays, screen repaints, or mode
changes in POST. These features may add time to the boot process.
• Try different monitors. Some monitors initialize and communicate with the BIOS more
quickly, which enables the system to boot more quickly.
®
Rapid BIOS
3.8.2 Intel Rapid BIOS Boot
Use of the following BIOS Setup program settings reduces the POST execution time.
In the Boot Menu:
• Set the hard disk drive as the first boot device. As a result, the POST does not first seek a
diskette drive, which saves about one second from the POST execution time.
• Disable Quiet Boot, which eliminates display of the logo splash screen. This could save several
seconds of painting complex graphic images and changing video modes.
• Enable Intel Rapid BIOS Boot. This feature bypasses memory count and the search for a
diskette drive.
In the Peripheral Configuration submenu, disable the LAN device if it will not be used. This can
reduce up to four seconds of option ROM boot time.
NOTE
✏
It is possible to optimize the boot process to the point where the system boots so quickly that the
Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives
with minimum initialization times can also contribute to a boot time that might be so fast that
necessary logo screens and POST messages cannot be seen.
This boot time may be so fast that some drives might be not be initialized at all. If this condition
should occur, it is possible to introduce a programmable delay ranging from three to 30 seconds
(using the Hard Disk Pre-Delay feature of the Advanced Menu in the Drive Configuration Submenu
of the BIOS Setup program).
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