Intel BOXD915GEV - LGA775 800FSB 4DDR2 Aud+Vdo SATA ATX 4PCI, BOXD915GEVL, BOXD915GEVLK, D915GEV, D915GRF User Manual

Intel® Desktop Boards D915GEV/D915GRF

Technical Product Specification

The Intel® Desktop Board D915GEV/D915GRF may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board D915GEV/D915GRF Specification Update.

June 2004

Order Number: C68602-001

Revision History

Revision Revision History Date

-001 First Release of the Intel® Desktop Board D915GEV/D915GRF Technical Product Specification.

This product specification applies to only standard Intel® Desktop Boards D915GEV and D915GRF with BIOS identifier EV91510A.86A.

Changes to this specification will be published in the Intel Desktop Board D915GEV/D915GRF Specification Update before being incorporated into a revision of this document.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from

Intel published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.

Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from:

Intel Corporation P.O. Box 5937 Denver, CO 80217-9808

or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333.

Intel, Pentium, and Celeron are registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

* Other names and brands may be claimed as the property of others.

June 2004

Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for these Intel and D915GRF. It describes the standard product and available manufacturing options.

Intended Audience

The TPS is intended to provide detailed, technical information about the Desktop Boards D915GEV and D915GRF and their components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter Description

1 A description of the hardware used on the Desktop Boards D915GEV and D915GRF

2 A map of the resources of the Desktop Boards

3 The features supported by the BIOS Setup program

4 A description of the BIOS error messages, beep codes, and POST codes

Desktop Boards: D915GEV

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

✏

Notes call attention to important information.

INTEGRATOR’S NOTES



Integrator’s notes are used to call attention to information that may be useful to system integrators.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

iii

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

WARNING

Warnings indicate conditions, which if not observed, can cause personal injury.

Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#)

(NxnX) When used in the description of a component, N indicates component type, xn are the

relative coordinates of its location on the Desktop Boards D915GEV and D915GRF, and X is the instance of the particular part at that general location. For example, J5J1 is a connector, located at 5J. It is the first connector in the 5J area.

GB Gigabyte (1,073,741,824 bytes)

GB/sec Gigabytes per second

KB Kilobyte (1024 bytes)

Kbit Kilobit (1024 bits)

kbits/sec 1000 bits per second

MB Megabyte (1,048,576 bytes)

MB/sec Megabytes per second

Mbit Megabit (1,048,576 bits)

Mbit/sec Megabits per second

xxh An address or data value ending with a lowercase h indicates a hexadecimal value.

x.x V Volts. Voltages are DC unless otherwise specified.

* This symbol is used to indicate third-party brands and names that are the property of their

respective owners.

Contents

1 Product Description

1.1 PCI Bus Terminology Change ....................................................................................11

1.2 Overview ....................................................................................................................12

1.2.1 Feature Summary ........................................................................................12

1.2.2 Manufacturing Options .................................................................................13

1.2.3 Board Layout................................................................................................14

1.2.4 Block Diagram..............................................................................................16

1.3 Online Support ...........................................................................................................17

1.4 Processor ...................................................................................................................17

1.5 System Memory .........................................................................................................18

1.5.1 Memory Configurations ................................................................................19

1.6 Intel

1.7 PCI Express Connectors ............................................................................................27

1.8 I/O Controller..............................................................................................................28

1.9 Audio Subsystem .......................................................................................................29

1.10 LAN Subsystem..........................................................................................................31

1.11 Hardware Management Subsystem ...........................................................................34

1.12 Power Management ...................................................................................................36

1.13 Trusted Platform Module ............................................................................................43

915G Chipset....................................................................................................23

1.6.1 Intel 915G Graphics Subsystem...................................................................23

1.6.2 USB .............................................................................................................25

1.6.3 IDE Support .................................................................................................25

1.6.4 Real-Time Clock, CMOS SRAM, and Battery...............................................27

1.8.1 Serial Ports ..................................................................................................28

1.8.2 Parallel Port .................................................................................................28

1.8.3 Diskette Drive Controller ..............................................................................28

1.8.4 Keyboard and Mouse Interface ....................................................................28

1.9.1 Audio Subsystem Software ..........................................................................29

1.9.2 Audio Connectors.........................................................................................29

1.9.3 Intel® High Definition Audio Subsystem.......................................................30

1.10.1 10/100 Mbits/sec LAN Subsystem ...............................................................31

1.10.2 Gigabit LAN Subsystem ...............................................................................32

1.10.3 Alert Standard Format (ASF) Support ..........................................................33

1.10.4 LAN Subsystem Software ............................................................................34

1.11.1 Hardware Monitoring and Fan Control ASIC ................................................34

1.11.2 Thermal Monitoring ......................................................................................35

1.11.3 Fan Monitoring .............................................................................................36

1.11.4 Chassis Intrusion and Detection...................................................................36

1.12.1 ACPI ............................................................................................................37

1.12.2 Hardware Support........................................................................................39

1.13.1 System Requirements..................................................................................43

1.13.2 Warning of Potential Data Loss....................................................................43

1.13.3 Security Precautions ....................................................................................44

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

1.13.4 Trusted Platform Module Ownership ............................................................45

1.13.5 Enabling the Trusted Platform Module .........................................................46

1.13.6 Assuming Trusted Platform Module Ownership ...........................................46

1.13.7 Recovery Procedures...................................................................................47

1.13.8 Clearing Trusted Platform Module Ownership..............................................48

1.13.9 Software Support .........................................................................................49

2 Technical Reference

2.1 Introduction ................................................................................................................51

2.2 Memory Resources ....................................................................................................51

2.2.1 Addressable Memory ...................................................................................51

2.2.2 Memory Map ................................................................................................53

2.3 DMA Channels ...........................................................................................................53

2.4 Fixed I/O Map.............................................................................................................54

2.5 PCI Configuration Space Map ....................................................................................55

2.6 Interrupts ....................................................................................................................56

2.7 PCI Conventional Interrupt Routing Map ....................................................................57

2.8 Connectors.................................................................................................................59

2.8.1 Back Panel Connectors................................................................................60

2.8.2 Component-side Connectors........................................................................62

2.9 Jumper Block .............................................................................................................71

2.10 Mechanical Considerations.........................................................................................72

2.10.1 Form Factor .................................................................................................72

2.10.2 I/O Shield .....................................................................................................73

2.11 Electrical Considerations ............................................................................................74

2.11.1 DC Loading..................................................................................................74

2.11.2 Add-in Board Considerations .......................................................................74

2.11.3 Fan Connector Current Capability................................................................74

2.11.4 Power Supply Considerations ......................................................................75

2.12 Thermal Considerations .............................................................................................76

2.13 Reliability....................................................................................................................78

2.14 Environmental ............................................................................................................79

2.15 Regulatory Compliance ..............................................................................................80

2.15.1 Safety Regulations.......................................................................................80

2.15.2 EMC Regulations .........................................................................................80

2.15.3 European Union Declaration of Conformity Statement .................................81

2.15.4 Product Ecology Statements ........................................................................82

2.15.5 Product Certification Markings (Board Level) ...............................................83

3 Overview of BIOS Features

3.1 Introduction ................................................................................................................85

3.2 BIOS Flash Memory Organization ..............................................................................86

3.3 Resource Configuration..............................................................................................86

3.3.1 PCI Autoconfiguration ..................................................................................86

3.3.2 PCI IDE Support ..........................................................................................86

3.4 System Management BIOS (SMBIOS).......................................................................87

3.5 Legacy USB Support..................................................................................................87

3.6 BIOS Updates ............................................................................................................88

3.6.1 Language Support........................................................................................88

3.6.2 Custom Splash Screen ................................................................................88

3.7 Boot Options ..............................................................................................................89

3.7.1 CD-ROM Boot..............................................................................................89

3.7.2 Network Boot ...............................................................................................89

3.7.3 Booting Without Attached Devices ...............................................................89

3.7.4 Changing the Default Boot Device During POST .........................................89

3.8 Fast Booting Systems with Intel

Rapid BIOS Boot....................................................90

3.8.1 Peripheral Selection and Configuration ........................................................90

3.8.2 Intel Rapid BIOS Boot ..................................................................................90

3.9 BIOS Security Features..............................................................................................91

4 Error Messages and Beep Codes

4.1 BIOS Error Messages ................................................................................................93

4.2 Port 80h POST Codes................................................................................................95

4.3 Bus Initialization Checkpoints.....................................................................................99

4.4 Speaker....................................................................................................................100

4.5 BIOS Beep Codes ....................................................................................................100

Contents

Figures

1 Board Components ....................................................................................................14

2 Block Diagram............................................................................................................16

3. Memory Channel and DIMM Configuration.................................................................19

4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs..............................20

5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs ...........................20

6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs .............................21

7. Single Channel (Asymmetric) Mode Configuration with One DIMM............................22

8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs........................22

9. Front/Back Panel Audio Connector Options for High Definition Audio Subsystem......30

10. High Definition Audio Subsystem Block Diagram........................................................30

11. LAN Connector LED Locations...................................................................................31

12. LAN Connector LED Locations...................................................................................32

13. Thermal Monitoring ....................................................................................................35

14. Location of the Standby Power Indicator LED ............................................................42

15. Detailed System Memory Address Map......................................................................52

16. Back Panel Connectors..............................................................................................60

17. Component-side Connectors......................................................................................62

18. Connection Diagram for Front Panel Connector .........................................................68

19. Connection Diagram for Front Panel USB Connectors...............................................70

20. Connection Diagram for IEEE 1394a Connectors.......................................................70

21. Location of the Jumper Block .....................................................................................71

22. Board Dimensions ......................................................................................................72

23. I/O Shield Dimensions................................................................................................73

24. Processor Heatsink Airflow.........................................................................................76

25. Localized High Temperature Zones............................................................................77

vii

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

Tables

1. Feature Summary.......................................................................................................12

2. Manufacturing Options ...............................................................................................13

3. Board Components Shown in Figure 1.......................................................................15

4. Supported Memory Configurations .............................................................................18

5. LAN Connector LED States........................................................................................32

6. LAN Connector LED States........................................................................................33

7. Effects of Pressing the Power Switch .........................................................................37

8. Power States and Targeted System Power ................................................................38

9. Wake-up Devices and Events.....................................................................................39

10. System Memory Map .................................................................................................53

11. DMA Channels ...........................................................................................................53

12. I/O Map ......................................................................................................................54

13. PCI Configuration Space Map ....................................................................................55

14. Interrupts ....................................................................................................................56

15. PCI Interrupt Routing Map..........................................................................................58

16. Back Panel Connectors Shown in Figure 16...............................................................61

17. Component-side Connectors Shown in Figure 17 ......................................................63

18. S/PDIF Connector (Optional)......................................................................................64

19. ATAPI CD-ROM Connector (Optional) .......................................................................64

20. Front Panel Audio Connector .....................................................................................64

21. Serial Port B Connector (optional) ..............................................................................64

22. Chassis Intrusion Connector ......................................................................................64

23. SCSI Hard Drive Activity LED Connector (Optional)...................................................65

24. Serial ATA Connectors...............................................................................................65

25. Processor Fan Connector...........................................................................................65

26. Chassis Fan Connectors ............................................................................................65

27. Main Power Connector...............................................................................................66

28. ATX12V Power Connector .........................................................................................67

29. Alternate Power Connector ........................................................................................67

30. Auxiliary Front Panel Power/Sleep LED Connector ....................................................68

31. Front Panel Connector ...............................................................................................68

32. States for a One-Color Power LED.............................................................................69

33. States for a Two-Color Power LED.............................................................................69

34. BIOS Setup Configuration Jumper Settings................................................................71

35. DC Loading Characteristics........................................................................................74

36. Fan Connector Current Capability ..............................................................................74

37. Thermal Considerations for Components ...................................................................78

38. Environmental Specifications......................................................................................79

39. Safety Regulations .....................................................................................................80

40. EMC Regulations .......................................................................................................80

41. Product Certification Markings....................................................................................83

42. BIOS Setup Program Menu Bar .................................................................................86

43. BIOS Setup Program Function Keys ..........................................................................86

44. Boot Device Menu Options.........................................................................................89

45. Supervisor and User Password Functions..................................................................91

46. BIOS Error Messages ................................................................................................93

viii

Contents

47. Uncompressed INIT Code Checkpoints......................................................................95

48. Boot Block Recovery Code Checkpoints ....................................................................95

49. Runtime Code Uncompressed in F000 Shadow RAM ................................................96

50. Bus Initialization Checkpoints.....................................................................................99

51. Upper Nibble High Byte Functions..............................................................................99

52. Lower Nibble High Byte Functions............................................................................100

53. Beep Codes .............................................................................................................100

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

1 Product Description

What This Chapter Contains

1.1 PCI Bus Terminology Change ....................................................................................11

1.2 Overview ....................................................................................................................12

1.3 Online Support ...........................................................................................................17

1.4 Processor ...................................................................................................................17

1.5 System Memory .........................................................................................................18

1.6 Intel

1.7 PCI Express Connectors ............................................................................................27

1.8 I/O Controller..............................................................................................................28

1.9 Audio Subsystem .......................................................................................................29

1.10 LAN Subsystem..........................................................................................................31

1.11 Hardware Management Subsystem ...........................................................................34

1.12 Power Management ...................................................................................................36

1.13 Trusted Platform Module ............................................................................................43

1.1 PCI Bus Terminology Change

915G Chipset....................................................................................................23

Previous generations of Intel® Desktop Boards used an add-in card connector referred to as PCI. This generation of Intel Desktop Boards adds a new technology for add-in cards: PCI Express. The 32-bit parallel bus previously referred to as PCI is now called PCI Conventional.

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

1.2 Overview

1.2.1 Feature Summary

Table 1 summarizes the major features of the Desktop Boards D915GEV and D915GRF.

Table 1. Feature Summary

Form Factor

Processor Support for an Intel® Pentium®4 processor in an LGA775 socket with an 800 or

Memory

Chipset

Video Intel® GMA900 onboard graphics subsystem

Audio Intel® High Definition Audio subsystem using the Realtek ALC860 audio codec

I/O Control LPC Bus I/O controller

USB Support for USB 2.0 devices

Peripheral Interfaces

LAN Support The board provides one of the following:

BIOS • Intel/AMI BIOS (resident in the 4 Mbit FWH)

Instantly Available PC Technology

ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])

533 MHz system bus

•

Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets

•

Support for DDR2 533 MHz or DDR2 400 MHz DIMMs

•

Support for up to 4 GB of system memory

915G Chipset, consisting of:

Intel

•

Intel®82915G Graphics Memory Controller Hub (GMCH)

•

Intel®82801FB I/O Controller Hub (ICH6)

• 4 Mbit Firmware Hub (FWH)

• Eight USB ports

• One serial port

• One parallel port

• Four Serial ATA interfaces

• One Parallel ATA IDE interface with UDMA 33, ATA-66/100 support

• One diskette drive interface

• PS/2* keyboard and mouse ports

• Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Marvell* Yukon*

88E8050 PCI Express* Gigabit Ethernet Controller

• 10/100 Mbits/sec LAN subsystem using the Intel Connect (PLC) device

• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS

• Support for PCI Local Bus Specification Revision 2.2

• Support for PCI Express Revision 1.0a

• Suspend to RAM support

• Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports

82562EZ Platform LAN

continued

Product Description

Table 1. Feature Summary (continued)

Expansion Capabilities

Hardware Monitor Subsystem

•

Four PCI Conventional bus add-in card connectors (SMBus routed to PCI Conventional bus connector 2)

•

Two PCI Express x1 bus add-in card connectors

•

One PCI Express x16 bus add-in card connector

•

Hardware monitoring and fan control ASIC

•

Voltage sense to detect out of range power supply voltages

•

Thermal sense to detect out of range thermal values

•

Three fan connectors

•

Three fan sense inputs used to monitor fan activity

•

Fan speed control

1.2.2 Manufacturing Options

Table 2 describes the manufacturing options on the Desktop Boards D915GEV and D915GRF. Not every manufacturing option is available in all marketing channels. Please contact your Intel representative to determine which manufacturing options are available to you.

Table 2. Manufacturing Options

ATAPI CD-ROM Connector

ATX Fan Connector

IEEE-1394a Interface

SCSI Hard Drive Activity LED Connector

Serial Port B Second serial port accessible via a connector on the component side of the board

S/PDIF Connector A 1 x 3 connector (mounted on the component side of the board) that provides digital

For information about Refer to

Available configurations for the Desktop Boards D915GEV and D915GRF Section 1.3, page 17

A connector for attaching an internal CD-ROM drive to the onboard audio subsystem

Additional fan connector for use in larger chassis

IEEE-1394a controller and three IEEE-1394a connectors (one back panel connector, two front-panel connectors)

Allows add-in hard drive controllers (SCSI or other) to use the same LED as the onboard IDE controller

audio signals in S/PDIF format

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

1.2.3 Board Layout

Figure 1 shows the location of the major components on the Desktop Board D915GEV/D915GRF.

A B K L

G H I J

P Q

S T

DDFF

Figure 1. Board Components

Table 3 lists the components identified in Figure 1.

VWXYGG ZAAEEBBCC

OM16666

Table 3. Board Components Shown in Figure 1

Item/Callout from Figure 1 Description

Rear chassis fan connector 2

Speaker

PCI Express x1 bus add-in card connectors

ATAPI CD-ROM connector (optional)

S/PDIF connector (optional)

Realtek ALC860 audio codec

Front panel audio connector

PCI Conventional bus add-in card connectors

Ethernet PLC device (optional)

PCI Express x16 bus add-in card connector

Rear chassis fan connector 1

Back panel connectors

Alternate power connector

+12V power connector (ATX12V)

LGA775 processor socket

Processor fan connector

Intel 82915G GMCH

DIMM Channel A sockets

Serial port B connector (optional)

DIMM Channel B sockets

SCSI LED (optional)

I/O controller

Power connector

Diskette drive connector

Parallel ATE IDE connector

Battery

Chassis intrusion connector

BIOS Setup configuration jumper block

4 Mbit Firmware Hub (FWH)

Front chassis fan connector

Serial ATA connectors

Auxiliary front panel power LED connector

Front panel connector

ATX fan connector (optional)

Front panel USB connector

Intel 82801FB I/O Controller Hub (ICH6)

Front panel IEEE-1394a connectors (optional)

IEEE-1394a controller (optional)

PCI Conventional bus add-in card connectors

Product Description

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

1.2.4 Block Diagram

Figure 2 is a block diagram of the major functional areas of the boards.

PCI Express x1 Slot 1

PCI Express x1 Slot 2

Parallel ATA

IDE Connector

LGA775

Processor Socket

PCI Express

x16 Interface

PCI Express

x16

Connector

VGA Port

Channel A DIMMs (2)

Channel B DIMMs (2)

Display Interface

PCI Express x1 Interface

Parallel ATA

IDE Interface

System Bus

(800/533 MHz)

Intel 82915G

Graphics and

Memory Controller

Hub (GMCH)

Dual-Channel

Memory Bus

SMBus

Gigabit Ethernet

Controller (Optional)

USB

LPC Bus

I/O

Controller

LPC Bus

Intel 82801FB

I/O Controller Hub

(ICH6)

DMI Interconnect

Back Panel/Front Panel

USB Ports

Serial Ports

Parallel Port

PS/2 Mouse

PS/2 Keyboard

Diskette Drive

Firmware Hub

(FWH)

LAN

Connector

4 Mbit

Intel 915G Chipset

LPC Bus

TPM Component

(Optional)

Interface

LAN Connect

10/100

LAN PLC

(Optional)

LAN

Connector

IEEE-1394a Connectors

(Optional)

PCI Slot 1

PCI Slot 2

PCI Slot 3

PCI Slot 4

= connector or socket

PCI Bus

SMBus

Hardware Monitoring

and Fan Control ASIC

Figure 2. Block Diagram

Serial ATA

IDE Interface

High Definition Audio Link

Mic In/Retasking Jack B

Line In/Retasking Jack C

Audio

Codec

Line Out/Retasking Jack D

Retasking Jack E [Port 1]

Retasking Jack F [Port 2]

CD-ROM (optional)

S/PDIF (optional)

Serial ATA IDE Connectors (4)

OM16995

1.3 Online Support

To find information about… Visit this World Wide Web site:

Intel Desktop Boards D915GEV and D915GRF under “Desktop Board Products” or “Desktop Board Support”

Available configurations for the Desktop Board D915GEV

Available configurations for the Desktop Board D915GRF

Processor data sheets http://www.intel.com/design/litcentr

ICH6 addressing http://developer.intel.com/design/chipsets/datashts

Custom splash screens http://intel.com/design/motherbd/gen_indx.htm

Audio software and utilities http://www.intel.com/design/motherbd

LAN software and drivers http://www.intel.com/design/motherbd

1.4 Processor

Product Description

http://www.intel.com/design/motherbd

http://support.intel.com/support/motherboards/desktop

http://developer.intel.com/design/motherbd/ev/ev_available.htm

http://developer.intel.com/design/motherbd/rf/rf_available.htm

The board is designed to support Intel Pentium 4 processors in an LGA775 processor socket with an 800 or 533 MHz system bus. See the Intel web site listed below for the most up-to-date list of supported processors.

For information about… Refer to:

Supported processors for the D915GEV board http://www.intel.com/design/motherbd/ev/ev_proc.htm

Supported processors for the D915GRF board http://www.intel.com/design/motherbd/rf/rf_proc.htm

CAUTION

Use only the processors listed on web site above. Use of unsupported processors can damage the board, the processor, and the power supply.

INTEGRATOR’S NOTE



Use only ATX12V-compliant power supplies.

For information about Refer to

Power supply connectors Section 2.8.2.2, page 65

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

1.5 System Memory

The boards have four DIMM sockets and support the following memory features:

•

1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts

•

Unbuffered, single-sided or double-sided DIMMs with the following restriction:

Double-sided DIMMS with x16 organization are not supported.

•

4 GB maximum total system memory. Refer to Section 2.2.1 on page 51 for information on the total amount of addressable memory.

•

Minimum total system memory: 128 MB

•

Non-ECC DIMMs

•

Serial Presence Detect

•

DDR2 533 MHz or DDR2 400 MHz SDRAM DIMMs

NOTES

•

Remove the PCI Express x16 video card before installing or upgrading memory to avoid interference with the memory retention mechanism.

• To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency.

Table 4 lists the supported DIMM configurations.

Table 4. Supported Memory Configurations

DIMM Capacity Configuration

128 MB SS 256 Mbit 16 M x 16/empty 4

256 MB SS 256 Mbit 32 M x 8/empty 8

256 MB SS 512 Mbit 32 M x 16/empty 4

512 MB DS 256 Mbit 32 M x 8/32 M x 8 16

512 MB SS 512 Mbit 64 M x 8/empty 8

512 MB SS 1 Gbit 64 M x 16/empty 4

1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16

1024 MB SS 1 Gbit 128 M x 8/empty 8

2048 MB DS 1 Gbit 128 M x 8/128 M x 8 16

Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS”

refers to single-sided memory modules (containing one row of SDRAM).

INTEGRATOR’S NOTE



SDRAM Density

SDRAM Organization Front-side/Back-side

Number of SDRAM Devices

It is possible to install four 2048 MB (2 GB) modules for a total of 8 GB of system memory, however, only 4 GB of address space is available. Refer to Section 2.2.1, on page 51 for additional information on available memory.

Product Description

OM16667

Channel A, DIMM 0 Channel A, DIMM 1

Channel B, DIMM 0 Channel B, DIMM 1

1.5.1 Memory Configurations

The Intel 82915G GMCH supports two types of memory organization:

•

Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used.

•

Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used.

Figure 3 illustrates the memory channel and DIMM configuration.

NOTE

The DIMM0 sockets of both channels are blue. The DIMM1 sockets of both channels are black.

Figure 3. Memory Channel and DIMM Configuration

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

1.5.1.1 Dual Channel (Interleaved) Mode Configurations

Figure 4 shows a dual channel configuration using two DIMMs. In this example, the DIMM0 (blue) sockets of both channels are populated with identical DIMMs.

1 GB

Channel A, DIMM 0 Channel A, DIMM 1

1 GB

Channel B, DIMM 0 Channel B, DIMM 1

OM17123

Figure 4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs

Figure 5 shows a dual channel configuration using three DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the capacity of the single DIMM in the DIMM0 (blue) socket of Channel B.

256 MB 256 MB

Channel A, DIMM 0 Channel A, DIMM 1

512 MB

Channel B, DIMM 0 Channel B, DIMM 1

OM17122

Figure 5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs

Product Description

Figure 6 shows a dual channel configuration using four DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the combined capacity of the two DIMMs in Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1 of both channels.

256 MB 5

12 MB

256 MB 512 MB

Channel A, DIMM 0 Channel A, DIMM 1

Channel B, DIMM 0 Channel B, DIMM 1

OM17124

Figure 6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

1.5.1.2 Single Channel (Asymmetric) Mode Configurations

NOTE

Dual channel (Interleaved) mode configurations provide the highest memory throughput.

Figure 7 shows a single channel configuration using one DIMM. In this example, only the DIMM0 (blue) socket of Channel A is populated. Channel B is not populated.

256 MB

Channel A, DIMM 0 Channel A, DIMM 1

Channel B, DIMM 0 Channel B, DIMM 1

OM17125

Figure 7. Single Channel (Asymmetric) Mode Configuration with One DIMM

Figure 8 shows a single channel configuration using three DIMMs. In this example, the combined capacity of the two DIMMs in Channel A does not equal the capacity of the single DIMM in the DIMM0 (blue) socket of Channel B.

256 MB 512 MB

Channel A, DIMM 0 Channel A, DIMM 1

Figure 8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs

512 MB

Channel B, DIMM 0 Channel B, DIMM 1

OM17126

Product Description

1.6 Intel® 915G Chipset

The Intel 915G chipset consists of the following devices:

•

Intel 82915G Graphics Memory Controller Hub (MCH) with Direct Media Interface (DMI) interconnect

•

Intel 82801FB I/O Controller Hub (ICH6) with DMI interconnect

•

Firmware Hub (FWH)

The MCH is a centralized controller for the system bus, the memory bus, the PCI Express bus, and the DMI interconnect. The ICH6 is a centralized controller for the board’s I/O paths. The FWH provides the nonvolatile storage of the BIOS.

For information about Refer to

The Intel 915G chipset http://developer.intel.com/

Resources used by the chipset Chapter 2

1.6.1 Intel 915G Graphics Subsystem

The Intel 915G chipset contains two separate, mutually exclusive graphics options. Either the GMA900 graphics controller (contained within the 82915G GMCH) is used, or a PCI Express x16 add-in card can be used. When a PCI Express x16 add-in card is installed, the GMA900 graphics controller is disabled.

1.6.1.1 Intel® GMA900 Graphics Controller

The Intel® GMA900 graphics controller features the following:

• Integrated graphics controller

 32 bpp (Bits Per Pixel) graphics engine  333 MHz core frequency  256-bit 2-D engine  32-bit 3-D engine  Motion video acceleration  Pixel Shader 2.0  4-pixel pipes  DirectX* 9.0 Hardware Acceleration  Software Vertex Shader

• Up to 2048 x 1536 at 75 Hz refresh

• With Advanced Digital Display 2 (ADD2) card support flat panel displays up to 2048 x 1536

at 75 Hz or digital CRTs/HDTV displays at 1920 x 1080 at 85 Hz

• High performance 3-D setup and render engine

• High quality/performance texture engine

• Display

 Integrated 24-bit 400 MHz RAMDAC  DDC2B compliant interface

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

•

Video



Asynchronous dual monitor display with ADD2 card



Hardware motion compensation for software MPEG2 decode



Two multiplexed DVO port interfaces with 200 MHz pixel clocks using an ADD2 card

•

Dynamic Video Memory Technology (DVMT) support up to 224 MB

•

For information about Refer to

DVMT Section 1.6.1.2, page 24

Obtaining graphics software and utilities Section 1.3, page 17

Zoom Utility

Intel

1.6.1.2 Dynamic Video Memory Technology (DVMT)

DVMT enables enhanced graphics and memory performance through Direct AGP, and highly efficient memory utilization. DVMT ensures the most efficient use of available system memory for maximum 2-D/3-D graphics performance. Up to 224 MB of system memory can be allocated to DVMT on systems that have 512 MB or more of total system memory installed. Up to 128 MB can be allocated to DVMT on systems that have 256 MB but less than 512 MB of total installed system memory. Up to 64 MB can be allocated to DVMT when less than 256 MB of system memory is installed. DVMT returns system memory back to the operating system when the additional system memory is no longer required by the graphics subsystem.

DVMT will always use a minimal fixed portion of system physical memory (as set in the BIOS Setup program) for compatibility with legacy applications. An example of this would be when using VGA graphics under DOS. Once loaded, the operating system and graphics drivers allocate additional system memory to the graphics buffer as needed for performing graphics functions.

NOTE

The use of DVMT requires operating system driver support.

1.6.1.3 Advanced Digital Display 2 (ADD2) Card Support

The GMCH routes two multiplexed DVO ports that are each capable of driving up to a 200 MHz pixel clock to the PCI Express x16 connector. The DVO ports can be paired for a dual channel configuration to support up to a 400 MHz pixel clock. When an ADD2 card is detected, the Intel GMA900 graphics controller is enabled and the PCI Express x16 connector is configured for DVO mode. DVO mode enables the DVO ports to be accessed by the ADD2 card. An ADD2 card can either be configured to support simultaneous display with the primary VGA display or can be configured to support dual independent display as an extended desktop configuration with different color depths and resolutions. ADD2 cards can be designed to support the following configurations:

• TV-Out (composite video)

• Transition Minimized Differential Signaling (TMDS) for DVI 1.0

• Low Voltage Differential Signaling (LVDS)

• Single device operating in dual channel mode

• VGA output

• HDTV output

Product Description

1.6.1.4 Configuration Modes

A list of supported modes for the Intel GMA900 graphics controller is available as a downloadable document.

For information about Refer to

Supported modes for the D915GEV board http://www.intel.com/design/motherbd/ev/ev_prdoc.htm

Supported modes for the D915GRF board http://www.intel.com/design/motherbd/rf/rf_prdoc.htm

1.6.2 USB

The boards support up to eight USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and EHCI-compatible drivers.

The ICH6 provides the USB controller for all ports. The port arrangement is as follows:

•

Four ports are implemented with dual stacked back panel connectors adjacent to the audio connectors

•

Four ports are routed to two separate front panel USB connectors

NOTE

✏

Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices.

For information about Refer to

The location of the USB connectors on the back panel Figure 16, page 60

The location of the front panel USB connectors Figure 17, page 62

1.6.3 IDE Support

The board provides five IDE interface connectors:

• One parallel ATA IDE connector that supports two devices

• Four serial ATA IDE connectors that support one device per connector

1.6.3.1 Parallel ATE IDE Interface

The ICH6’s Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The Parallel ATA IDE interface supports the following modes:

• Programmed I/O (PIO): processor controls data transfer.

• 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec.

• Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates

of up to 33 MB/sec.

• ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible.

• ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH6’s ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec.

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

✏ NOTE

ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce reflections, noise, and inductive coupling.

The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives) and ATA devices using the transfer modes.

The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS.

The boards support Laser Servo (LS-120) diskette technology through the Parallel ATA IDE interfaces. An LS-120 drive can be configured as a boot device by setting the BIOS Setup program’s Boot menu to one of the following:

•

ARMD-FDD (ATAPI removable media device – floppy disk drive)

•

ARMD-HDD (ATAPI removable media device – hard disk drive)

For information about Refer to

The location of the Parallel ATA IDE connector Figure 17, page 62

1.6.3.2 Serial ATA Interfaces

The ICH6’s Serial ATA controller offers four independent Serial ATA ports with a theoretical maximum transfer rate of 150 MB/s per port. One device can be installed on each port for a maximum of four Serial ATA devices. A point-to-point interface is used for host to device connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices per channel.

For compatibility, the underlying Serial ATA functionality is transparent to the operating system. The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP and Windows 2000 operating systems.

NOTE

Many Serial ATA drives use new low-voltage power connectors and require adaptors or power supplies equipped with low-voltage power connectors.

For more information, see: http://www.serialata.org/

For information about Refer to

The location of the Serial ATA IDE connectors Figure 17, page 62

Product Description

1.6.3.3 SCSI Hard Drive Activity LED Connector (Optional)

The SCSI hard drive activity LED connector is a 1x2-pin connector that allows an add-in hard drive controller to use the same LED as the onboard IDE controller. For proper operation, this connector should be wired to the LED output of the add-in hard drive controller. The LED indicates when data is being read from, or written to, either the add-in hard drive controller or the onboard IDE controller (Parallel ATA or Serial ATA).

For information about Refer to

The location of the SCSI hard drive activity LED connector Figure 17, page 62

The signal names of the SCSI hard drive activity LED connector Table 23, page 65

1.6.4 Real-Time Clock, CMOS SRAM, and Battery

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.

✏ NOTE

If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS RAM at power-on.

1.7 PCI Express Connectors

The boards provide the following PCI Express connectors:

• One PCI Express x16 connector supporting simultaneous transfer speeds up to 8 GBytes/sec

• Two PCI Express x1 connectors. The x1 interfaces support simultaneous transfer speeds up to

500 MBytes/sec

The PCI Express interface supports the PCI Conventional bus configuration mechanism so that the underlying PCI Express architecture is compatible with PCI Conventional compliant operating systems. Additional features of the PCI Express interface includes the following:

• Support for the PCI Express enhanced configuration mechanism

• Automatic discovery, link training, and initialization

• Support for Active State Power Management (ASPM)

• SMBus 2.0 support

• Wake# signal supporting wake events from ACPI S1, S3, S4, or S5

• Software compatible with the PCI Power Management Event (PME) mechanism defined in the

PCI Power Management Specification Rev. 1.1

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

1.8 I/O Controller

The I/O controller provides the following features:

•

Two serial ports (Serial Port B is optional)

•

One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port (EPP) support

•

Serial IRQ interface compatible with serialized IRQ support for PCI Conventional bus systems

•

PS/2-style mouse and keyboard interfaces

•

Interface for one 1.44 MB or 2.88 MB diskette drive

•

Intelligent power management, including a programmable wake-up event interface

•

PCI Conventional bus power management support

The BIOS Setup program provides configuration options for the I/O controller.

1.8.1 Serial Ports

The Desktop Board can support up to two serial port connectors. Serial port A is located on the back panel. Serial port B (optional) is accessible using a connector on the component side of board. The serial ports support data transfers at speeds up to 115.2 kbits/sec with BIOS support.

For information about Refer to

The location of the serial port A connector Figure 16, page 60

The location of the serial port B connector Figure 17, page 62

The signal names of the serial port B connector Table 21, page 64

1.8.2 Parallel Port

The 25-pin D-Sub parallel port connector is located on the back panel. Use the BIOS Setup program to set the parallel port mode.

For information about Refer to

The location of the parallel port connector Figure 16, page 60

1.8.3 Diskette Drive Controller

The I/O controller supports one diskette drive. Use the BIOS Setup program to configure the diskette drive interface.

For information about Refer to

The location of the diskette drive connector Figure 17, page 62

1.8.4 Keyboard and Mouse Interface

PS/2 keyboard and mouse connectors are located on the back panel.

NOTE

✏

The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is connected or disconnected.

Product Description

1.9 Audio Subsystem

The boards support the Intel High Definition audio subsystem based on the Realtek ALC860 codec. The audio subsystem supports the following features:

• Advanced jack sense (front and rear panel) that enables the audio codec to recognize the device that is connected to an audio port. All jacks are capable of retasking according to user’s definition, or can be automatically switched depending on the recognized device type.

• Stereo input and output for all jacks.

• A signal-to-noise (S/N) ratio of 90 dB.

INTEGRATOR’S NOTE

For the front panel jack sensing and automatic retasking feature to function, a front panel daughter card that is designed for Intel High Definition Audio must be used. Otherwise, an AC ’97 style audio front panel connector will be assumed and the Line Out and Mic In functions will be permanent.

1.9.1 Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining audio software and drivers Section 1.3, page 17

1.9.2 Audio Connectors

The boards contain audio connector on both the back panel and the component side of the board. The component-side audio connectors include the following:

• Front panel audio (a 2 x 5-pin connector that provides mic in and line out signals for front panel audio connectors)

• ATAPI CD-ROM (an optional 1 x 4-pin ATAPI-style connector for connecting an internal ATAPI CD-ROM drive to the audio mixer)

• S/PDIF (an optional 1 x 3 connector that provides S/PDIF output signals)

The functions of the back panel audio connectors are dependent on which subsystem is present.

For information about Refer to

The location of the front panel audio connector, the optional ATAPI CD-ROM connector, and the optional S/PDIF connector.

The signal names of the front panel audio connector Table 20, page 64

The signal names of the optional ATAPI CD-ROM connector Table 19, page 64

The signal names of the optional S/PDIF connector Table 18, page 64

Figure 17, page 62

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

1.9.3 Intel® High Definition Audio Subsystem

The Intel High Definition Audio subsystem includes the following:

•

Intel 82801FB I/O Controller Hub (ICH6)

•

Realtek ALC860 audio codec

•

Microphone input that supports a single dynamic, condenser, or electret microphone

The front and back audio connectors are configurable through the audio device drivers. The available configurable audio ports are shown in Figure 9.

Back Panel

Audio Connectors

Line In/

Retasking Jack C

Line Out/

Retasking Jack D

Mic In/

Retasking Jack B

OM16989

Line Out/

Retasking Jack F

[Port 2]

Front Panel

Audio Connectors

Mic In/

Retasking Jack E

[Port 1]

Figure 9. Front/Back Panel Audio Connector Options for High Definition Audio Subsystem

Figure 10 is a block diagram of the High Definition audio subsystem.

Mic In/Retasking Jack B

Line In/Retasking Jack C

82801FB

I/O Controller

Hub

(ICH6)

Intel

High Definition

Audio Link

ALC860

Audio Codec

Front Panel Mic In/Retasking Jack E [Port 1]

Front Panel Line Out/Retasking Jack F [Port 2]

Line Out/Retasking Jack D

CD-ROM (optional)

S/PDIF (optional)

Figure 10. High Definition Audio Subsystem Block Diagram

For information about Refer to

The back panel audio connectors Figure 16, page 60

OM16990

1.10 LAN Subsystem

The LAN subsystem consists of the following:

•

Physical layer interface device. As a manufacturing option, the board includes one of the following Platform LAN Connect (PLC) devices:

 

•

RJ-45 LAN connector with integrated status LEDs

Additional features of the LAN subsystem include:

•

CSMA/CD protocol engine

•

LAN connect interface that supports the 82562EZ

•

PCI Conventional bus power management

 

1.10.1 10/100 Mbits/sec LAN Subsystem

82562EZ PLC for 10/100 Mbits/sec Ethernet LAN connectivity

Intel

Marvell Yukon 88E50 for Gigabit (10/100/1000 Mbits/sec) Ethernet LAN connectivity

Supports ACPI technology

Supports LAN wake capabilities

Product Description

The 10/100 Mbits/sec LAN subsystem includes the ICH6, the Intel 82562EZ PLC, and an RJ-45 LAN connector with integrated status LEDs.

1.10.1.1 Intel® 82562EZ Physical Layer Interface Device

The Intel 82562EZ provides the following functions:

• Basic 10/100 Ethernet LAN connectivity

• Full device driver compatibility

• Programmable transit threshold

• Configuration EEPROM that contains the MAC address

1.10.1.2 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 11 below).

Green LED

Figure 11. LAN Connector LED Locations

Yellow LED

OM15076

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

Table 5 describes the LED states when the board is powered up and the 10/100 Mbits/sec LAN subsystem is operating.

Table 5. LAN Connector LED States

LED Color LED State Condition

Green

Off LAN link is not established.

On LAN link is established.

Blinking LAN activity is occurring.

Off 10 Mbits/sec data rate is selected.Yellow

On 100 Mbits/sec data rate is selected.

1.10.2 Gigabit LAN Subsystem

The Gigabit (10/100/1000 Mbits/sec) LAN subsystem includes the Marvell Yukon 88E50 and an RJ-45 LAN connector with integrated status LEDs.

1.10.2.1 Marvell Yukon 88E8050 PCI Express 1.0a Integrated MAC/PHY Gigabit Ethernet Controller

The Marvell Yukon 88E8050 provides the following functions:

• x1 PCI Express link

• Basic 10/100/1000 Ethernet LAN connectivity

• IEEE 802.1p and 802.1q support

• 10/100/1000 IEEE 802.3 compliant

• Compliant to 802.3x flow control support

• Jumbo frame support

• TCP, IP, UDP checksum offload

• Automatic MDI/MDIX crossover

• Full device driver compatibility

• Configuration EEPROMs that contain the MAC address and ASF 2.0 support

• Wake On LAN technology power management support

• PCI Express Active State Power Management Support (L0s)

• ASF 2.0 support

1.10.2.2 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (as shown in Figure 12). Table 6 describes the LED states when the board is powered up and the Gigabit LAN subsystem is operating.

Green LED

Green/Yellow LED

OM16513

Figure 12. LAN Connector LED Locations

Product Description

Table 6. LAN Connector LED States

LED Color LED State Condition

Off LAN link is not established.

Left Green

N/A Off 10 Mbits/sec data rate is selected.

Right

Green On 100 Mbits/sec data rate is selected.

Yellow

On LAN link is established.

Blinking LAN activity is occurring.

1000 Mbits/sec data rate is selected.

1.10.3 Alert Standard Format (ASF) Support

The boards provide the following ASF support for the onboard 10/100/1000 LAN subsystem, PCI Express x1 bus add-in LAN cards, and PCI Conventional bus add-in LAN cards installed in PCI Conventional bus slot 2:

•

Monitoring of system firmware progress events, including:

 BIOS present  Primary processor initialization  Memory initialization  Video initialization  PCI resource configuration  Hard-disk initialization  User authentication  Starting operating system boot process

• Monitoring of system firmware error events, including:

 Memory missing  Memory failure  No video device  Keyboard failure  Hard-disk failure  No boot media

• Boot options to boot from different types of boot devices

• Reset, shutdown, power cycle, and power up options

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

1.10.4 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining LAN software and drivers Section 1.3, page 17

1.11 Hardware Management Subsystem

The hardware management features enable the Desktop Boards to be compatible with the Wired for Management (WfM) specification. The Desktop Board has several hardware management features, including the following:

•

Fan monitoring and control (through the hardware monitoring and fan control ASIC)

•

Thermal and voltage monitoring

•

Chassis intrusion detection

1.11.1 Hardware Monitoring and Fan Control ASIC

The features of the hardware monitoring and fan control ASIC include:

• Internal ambient temperature sensor

• Two remote thermal diode sensors for direct monitoring of processor temperature and ambient

temperature sensing

• Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.5 V, and +VCCP) to detect levels above or below acceptable values

• Thermally monitored closed-loop fan control, for all three fans, that can adjust the fan speed or switch the fans on or off as needed

• SMBus interface

For information about Refer to

The location of the fan connectors and sensors for thermal monitoring Figure 13, page 35

1.11.2 Thermal Monitoring

Figure 13 shows the location of the sensors and fan connectors.

Product Description

Item Description

Thermal diode, located on processor die

Remote ambient temperature sensor

Ambient temperature sensor, internal to hardware monitoring and fan control ASIC

Processor fan

Rear chassis fan 1

Front chassis fan

ATX fan (optional)

Rear chassis fan 2

EFGH

OM16669

Figure 13. Thermal Monitoring

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

1.11.3 Fan Monitoring

Fan monitoring can be implemented using Intel® Desktop Utilities, LANDesk* software, or thirdparty software. The level of monitoring and control is dependent on the hardware monitoring ASIC used with the Desktop Board.

For information about Refer to

The functions of the fan connectors Section 1.12.2.2, page 40

1.11.4 Chassis Intrusion and Detection

The boards support a chassis security feature that detects if the chassis cover is removed. The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion connector. When the chassis cover is removed, the mechanical switch is in the closed position.

1.12 Power Management

Power management is implemented at several levels, including:

• Software support through Advanced Configuration and Power Interface (ACPI)

• Hardware support:

 Power connector  Fan connectors  LAN wake capabilities  Instantly Available PC technology  Resume on Ring  Wake from USB  Wake from PS/2 devices  Power Management Event signal (PME#) wake-up support

Product Description

1.12.1 ACPI

ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with these boards requires an operating system that provides full ACPI support. ACPI features include:

•

Plug and Play (including bus and device enumeration)

•

Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives

•

Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state

•

A Soft-off feature that enables the operating system to power-off the computer

•

Support for multiple wake-up events (see Table 9 on page 39)

•

Support for a front panel power and sleep mode switch

Table 7 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system.

Table 7. Effects of Pressing the Power Switch

…and the power switch is

If the system is in this state…

Off (ACPI G2/G5 – Soft off)

On (ACPI G0 – working state)

Sleep (ACPI G1 – sleeping state)

pressed for …the system enters this state

Less than four seconds Power-on

(ACPI G0 – working state)

Less than four seconds Soft-off/Standby

(ACPI G1 – sleeping state)

More than four seconds Fail safe power-off

(ACPI G2/G5 – Soft off)

Less than four seconds Wake-up

(ACPI G0 – working state)

More than four seconds Power-off

(ACPI G2/G5 – Soft off)

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

1.12.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.

Table 8 lists the power states supported by the boards along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states.

Table 8. Power States and Targeted System Power

Processor

Global States Sleeping States

G0 – working state

G1 – sleeping state

G2/S5 S5 – Soft off.

G3 – mechanical off

AC power is disconnected from the computer.

Notes:

1. Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the system chassis’ power supply.

2. Dependent on the standby power consumption of wake-up devices used in the system.

S0 – working C0 – working D0 – working

S1 – Processor stopped

S3 – Suspend to RAM. Context saved to RAM.

S4 – Suspend to disk. Context saved to disk.

Context not saved. Cold boot is required.

No power to the system.

States Device States

state.

C1 – stop grant

No power D3 – no power

No power D3 – no power for

D1, D2, D3 – device specification specific.

except for wake-up logic.

wake-up logic, except when provided by battery or external source.

Targeted System Power

Full power > 30 W

5 W < power < 52.5 W

Power < 5 W

No power to the system. Service can be performed safely.

(Note 1)

(Note 2)

Product Description

1.12.1.2 Wake-up Devices and Events

Table 9 lists the devices or specific events that can wake the computer from specific states.

Table 9. Wake-up Devices and Events

These devices/events can wake up the computer… …from this state

LAN S1, S3, S4, S5

Modem (back panel Serial Port A) S1, S3

PME# signal S1, S3, S4, S5

Power switch S1, S3, S4, S5

PS/2 devices S1, S3

RTC alarm S1, S3, S4, S5

USB S1, S3

WAKE# S1, S3, S4, S5

Note: For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option to Power On

will enable a wake-up event from LAN in the S5 state.

(Note)

NOTE

The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events.

1.12.2 Hardware Support

CAUTION

Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.

The boards provide several power management hardware features, including:

• Power connector

• Fan connectors

• LAN wake capabilities

• Instantly Available PC technology

• Resume on Ring

• Wake from USB

• Wake from PS/2 keyboard

• PME# signal wake-up support

• WAKE# signal wake-up support

LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line.

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

Resume on Ring enables telephony devices to access the computer when it is in a power-managed state. The method used depends on the type of telephony device (external or internal).

NOTE

✏

The use of Resume on Ring and Wake from USB technologies from an ACPI state requires an operating system that provides full ACPI support.

1.12.2.1 Power Connector

ATX12V-compliant power supplies can turn off the system power through system control. When an ACPI-enabled system receives the correct command, the power supply removes all non-standby voltages.

When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu.

For information about Refer to

The location of the main power connector Figure 17, page 62

The signal names of the main power connector Table 27, page 66

1.12.2.2 Fan Connectors

The function/operation of the fan connectors is as follows:

• The fans are on when the board is in the S0 or S1 state.

• The fans are off when the board is off or in the S3, S4, or S5 state.

• Each fan connector is wired to a fan tachometer input of the hardware monitoring and fan

control ASIC.

• All fan connectors support closed-loop fan control that can adjust the fan speed or switch the fan on or off as needed.

• All fan connectors have a +12 V DC connection.

For information about Refer to

The location of the fan connectors Figure 17, page 62

The location of the fan connectors and sensors for thermal monitoring Figure 13, page 35

The signal names of the processor fan connector Table 25, page 65

The signal names of the chassis fan connectors Table 26, page 65

1.12.2.3 LAN Wake Capabilities

CAUTION

For LAN wake capabilities, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply.

LAN wake capabilities enable remote wake-up of the computer through a network. The LAN network adapter monitors network traffic at the Media Independent Interface. Upon detecting a

Product Description

Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer. Depending on the LAN implementation, the boards support LAN wake capabilities with ACPI in the following ways:

•

The PCI Express WAKE# signal

•

The PCI Conventional bus PME# signal for PCI 2.2 compliant LAN designs

•

The onboard LAN subsystem

1.12.2.4 Instantly Available PC Technology

CAUTION

For Instantly Available PC technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply.

Instantly Available PC technology enables the boards to enter the ACPI S3 (Suspend-to-RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, and the front panel LED is amber if dual colored, or off if single colored.) When signaled by a wake-up device or event, the system quickly returns to its last known wake state. Table 9 on page 39 lists the devices and events that can wake the computer from the S3 state.

The boards support the PCI Bus Power Management Interface Specification. Add-in boards that also support this specification can participate in power management and can be used to wake the computer.

The use of Instantly Available PC technology requires operating system support and PCI 2.2 compliant add-in cards, PCI Express add-in cards, and drivers.

1.12.2.5 Resume on Ring

The operation of Resume on Ring can be summarized as follows:

• Resumes operation from ACPI S1 or S3 states

• Detects incoming call similarly for external and internal modems

• Requires modem interrupt be unmasked for correct operation

1.12.2.6 Wake from USB

USB bus activity wakes the computer from ACPI S1 or S3 states.

NOTE

✏

Wake from USB requires the use of a USB peripheral that supports Wake from USB.

1.12.2.7 Wake from PS/2 Devices

PS/2 device activity wakes the computer from an ACPI S1 or S3 state.

1.12.2.8 PME# Signal Wake-up Support

When the PME# signal on the PCI Conventional bus is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state (with Wake on PME enabled in BIOS).

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

1.12.2.9 WAKE# Signal Wake-up Support

When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state.

1.12.2.10 +5 V Standby Power Indicator LED

The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 14 shows the location of the standby power indicator LED.

CAUTION

If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices.

CR3J1

OM16668

Figure 14. Location of the Standby Power Indicator LED

Product Description

1.13 Trusted Platform Module

The optional Trusted Platform Module (TPM) is a component on the desktop board that is specifically designed to enhance platform security above-and-beyond the capabilities of today’s software by providing a protected space for key operations and other security critical tasks. Using both hardware and software, the TPM protects encryption and signature keys at their most vulnerable stages—operations when the keys are being used unencrypted in plain-text form. The TPM is specifically designed to shield unencrypted keys and platform authentication information from software-based attacks.

1.13.1 System Requirements

•

Intel Desktop Board D915GEV or D915GRF

•

Microsoft Windows 2000 Professional (SP4) or Microsoft Windows XP Professional (SP1)

•

NTFS file system required

•

Microsoft Internet Explorer* 5.5 or later

•

Adobe* Acrobat* 5.0 or later

1.13.2 Warning of Potential Data Loss

CAUTION

Failure to follow the instructions below may cause you to lose data. Read and follow these instructions prior to Trusted Platform Module initialization.

System integrators, owners, and end users must take precautions to mitigate the chance of data loss. Data encrypted by any program utilizing the Trusted Platform Module (TPM) may become inaccessible or unrecoverable if any of the following occurs:

• Lost Password: Loss of any of the passwords associated with the TPM will render encrypted data inaccessible. No password recovery is available. Read the Security Precautions for Password Procedures.

• Hard Drive Failure: In the event of a failure of a hard disk (or other storage media) that contains encrypted data, an image of the hard disk (or other storage media) must be restored from backup before access to encrypted data may become available. The owner/user should backup the system hard disk on a regular basis. Read the Security Precautions below for Hard Drive Backup Procedures.

• Platform Failure: In the event of a platform failure and/or replacement of the motherboard, recovery procedures may allow migratable keys to be recovered and may restore access to encrypted data. All non-migratable keys and their associated data will be lost. Both the Infineon* Security Platform software and Wave Systems EMBASSY Trust Suite utilize migratable keys. Please check any other software that accesses the TPM for migratability. Read the Security Precautions for Emergency Recovery File Back Up Procedures.

• Loss of Trusted Platform Module Ownership: Trusted Platform Module Ownership/contents may be cleared (via a BIOS switch) to allow for the transfer of a system to a new owner. If TPM ownership is cleared, either intentionally or in error, recovery procedures may allow the migratable keys to be recovered and may restore access to encrypted data. Read the Security Precautions for Emergency Recovery File Back Up Procedures.

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

1.13.3 Security Precautions

Security, like any other aspect of computer maintenance requires planning. What is unique about security has to do with understanding who "friends" and adversaries are. The TPM provides mechanisms to enable the owner/user to protect their information from adversaries. To provide this protection the TPM effectively puts "locks" around the data. Just like physical locks, if keys or combinations are lost, the assets (i.e., data) may be inaccessible not only to adversaries, but also to asset owner/user.

The TPM provides two classes of keys: migratable and non-migratable. Migratable keys are designed to protect data that can be used (i.e., unencrypted) on more than one platform. This has the advantage of allowing the key data to be replicated (backed-up and restored) to another platform. This may be because of user convenience (someone uses more than one platform, or the data needs to be available to more than one person operating on different platforms). This type of key also has the advantage in that it can be backed-up and restored from a defective platform onto a new platform. However, migratable keys may not be the appropriate level of protection (e.g., the user wants the data restricted to a single platform) needed for the application. This requires a nonmigratable key. Non-migratable keys carry with them a usage deficit in that while the key may be backed-up and restored (i.e., protected from hard disk failure) they are not protected against system or TPM failure. The very nature of a non-migratable key is that they can be used on one and only one TPM. In the event of a system or TPM failure, all non-migratable keys and the data associated with them will be inaccessible and unrecoverable.

CAUTION

The following precautions and procedures may assist in recovering from any of the previously listed situations. Failure to implement these security precautions and procedures may result in unrecoverable data loss.

1.13.3.1 Password Procedures

The Infineon Security Platform software allows users to configure passwords from 6 to 255 characters. A good password should consist of:

• At least one upper case letter (A to Z)

• At least one numerical character (0 to 9)

• At least one symbol character (!, @, &, etc.)

Example Passwords: “I wear a Brown hat 2 worK @ least once-a-month” or “uJGFak&%)adf35a9m”

NOTE

Avoid using names or dates that can be easily guessed such as: birthdays, anniversaries, family member names, pet names, etc.

All passwords associated with the Infineon Security Platform software (Owner, Emergency Recovery Token, and User passwords) and the Wave Systems* EMBASSY* Trust Suite are NOT RECOVERABLE and cannot be reset without the original text. The system owner should document all passwords, store them in a secured location (vault, safe deposit box, off-site storage, etc.), and have them available for future use. These documents should be updated after any password changes.

Product Description

1.13.3.2 Emergency Recovery File Back Up Procedures

The Emergency Recovery Token (SPEmRecToken.xml) must be saved or moved to a removable media (floppy, USB drive, CDR, flash media, etc). Once this is done, the removable media should be stored in a secure location. DO NOT LEAVE ANY COPIES of the Emergency Recovery Token on the hard drive or within any hard drive image backups. If a copy of the Emergency Recovery Token remains on the system, it could be used to compromise the Trusted Platform Module and platform.

After completing the Infineon Security Platform User Initialization Wizard, a copy of the Emergency Recovery Archive (SPEmRecArchive.xml) should be copied to a removable media and stored in a secure location. This procedure should be repeated after any password changes or the addition of a new user.

1.13.3.3 Hard Drive Image Backup Procedures

To allow for emergency recovery from a hard drive failure, frequent images of the hard drive should be created and stored in a secure location. In the event of a hard drive failure, the latest image can be restored to a new hard drive and access to the encrypted data may be re-established.

NOTE

All encrypted and unencrypted data that was added after the last image was created will be lost.

1.13.3.4 Clear Text Backup (Optional)

It is recommended that system owners follow the Hard Drive Image Backup Procedures. To backup select files without creating a drive image, files can be moved from secured programs or drive letters to an unencrypted directory. The unencrypted (clear text) files may then be backed up to a removable media and stored in a secure location. The advantage of the clear text backup is that no TPM key is required to restore the data. This option is not recommended because the data is exposed during backup and restore.

1.13.4 Trusted Platform Module Ownership

The Trusted Platform Module is disabled by default when shipped and the owner/end customer of the system assumes “ownership” of the TPM. This permits the owner of the system to control initialization of the TPM and create all the passwords associated with the TPM that is used to protect their keys and data.

System builders/integrators may install both the Infineon Security Platform software and the Wave System EMBASSY Trust Suite, but SHOULD NOT attempt to use or activate the TPM or either software package.

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

1.13.5 Enabling the Trusted Platform Module

The Trusted Platform Module is disabled by default when shipped to insure that the owner/end customer of the system initializes the TPM and configures all security passwords. The owner/end customer should use the following steps to enable the TPM.

1. While the PC is displaying the splash screen (or POST screen), press the <F2> key to enter BIOS.

2. Use the arrow keys to go to the Advanced Menu, select Peripheral Configuration, and then press the <Enter> key.

3. Select the Trusted Platform Module, press <Enter>, and select Enabled and press <Enter> again (display should show

: Trusted Platform Module [Enabled]).

4. Press the <F10> key, select Ok and press <Enter>.

5. System should reboot and start Microsoft Windows.

1.13.6 Assuming Trusted Platform Module Ownership

Once the TPM has been enabled, ownership must be assumed by using the Infineon Security Platform Software. The owner/end user should follow the steps listed below to take ownership of the TPM:

1. Start the system.

2. Launch the Infineon Security Platform Initialization Wizard.

3. Create Owner password (before creating any password, review the Password Recommendations made earlier in this document).

4. Create a new Recovery Archive (note the file name and location).

5. Specify a Security Platform Emergency Recovery Token password and location. (this password should not match the Owner password or any other password).

6. Define where to save the Emergency Recovery Token (note the file location and name).

7. The software will then create recovery archive files and finalize ownership of the TPM.

8. After completing the Infineon Security Platform Initialization Wizard, the Emergency Recovery Token (SPEmRecToken.xml) must be moved flash media, etc) if the file was not saved to a removable media during installation. Once this is done, the removable media should be stored in a secure location. No copies of this Emergency Recovery Token file should remain on the system. If a copy remains on the system, it could be used to compromise the security of the platform.

9. Launch the Infineon Security Platform User Initialization Wizard.

10. Create a Basic User password (this password is the most frequently used and should not match any other password).

11. Select and configure Security Platform features for this user.

12. After completing the Infineon Security Platform User Initialization Wizard, a copy of the Emergency Recovery Archive (SPEmRecArchive.xml) should be copied to a removable media and stored in a secure location. This procedure should be repeated after any password changes or the addition of new users.

13. Restart the system.

14. To backup the keys for the EMBASSY Trust Suite, the Key Transfer Manager software must be configured. Launch the Key Transfer Manager from the program menu.

to a removable media (floppy, CDR,

Product Description

15. Follow the instructions and create and document the locations for both the archive and restoration key files. The key archive should be located on a removable media and stored in a secure location when not in use.

16. Create and document the password to protect the key archive.

17. Provide the TPM Owner password to allow the Key Transfer Manager to create the archive and restoration key files.

18. Upon completing the configuration of the Key Transfer Manager, it will place an icon in the task bar and automatically back up all new and updated keys associated with the EMBASSY Trust Suite. If the removable media that contains the archive file is not present when a new key is generated, then keys will have to be manually backed up using the Key Transfer Manager when the removable media is available.

19. All passwords associated with the Infineon Security Platform Software (Owner, Emergency Recovery Token, and User passwords) and Wave Systems EMBASSY Trust Suite and Key Transfer Manager are not recoverable and cannot be reset without the original text. These passwords should be documented and stored in a secured location (vault, safe deposit box, off-site storage, etc.) in case they are needed in the future. These documents and files should be updated after any password changes.

1.13.7 Recovery Procedures

1.13.7.1 Recovering from Hard Disk Failure

Restore the latest hard drive image from backup to the new hard drive – no TPM specific recovery is necessary.

1.13.7.2 Recovering from Desktop Board or TPM Failure

This procedure may restore the migratable keys from the Emergency Recovery Archive, and does not restore any previous keys or content to the TPM. This recovery procedure may restore access to the Infineon Security Platform software and Wave Systems EMBASSY Trust Suite that are secured with migratable keys.

Requirements:

• Emergency Recovery Archive (created with the Infineon Security Platform Initiation Wizard)

• Emergency Recovery Token (created with the Infineon Security Platform Initiation Wizard)

• Emergency Recovery Token Security Password (created with the Infineon Security Platform

Initiation Wizard)

• Working original operating system (OS) installation, or a restored image of the hard drive

• Wave Systems Key Transfer Manager archive password

• TPM Ownership password

This recovery procedure only restores the migratable keys from the previously created Recovery Archives.

1. Replace the desktop board with the same model as the failed board.

2. Start the original operating system or restore the original hard drive image.

3. Start the Infineon Security Platform Initialization Wizard and check the “I want to restore the existing Security Platform” box.

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

4. Follow the instructions during the Security Platform Initialization, and append the Emergency Recovery Archive to the existing archive.

5. Provide all the necessary passwords, files, and file locations as requested. It may take up to 20 minutes for Security Platform Initialization Wizard to restore the security platform settings.

6. Start User Initialization Wizard. Select “Recover Your Basic User Key” when prompted. Specify the original Basic User Key password and proceed with the wizard.

7. When re-configuring the Personal Secure Drive, select “I want to change my Personal Secure Drive setting”, confirm the drive letter and name are correct, and then proceed through the rest of the wizard.

8. Restart the system when requested.

9. To restore access to the EMBASSY Trust Suite, right mouse click on the Key Transfer Manager icon located in the taskbar in the lower right corner of the screen, and select Restore TPM Keys.

10. Provide all the necessary passwords, files, and file locations as requested by the Key Transfer Manager.

11. Upon successful completion of all steps, you should be able to access previously encrypted files.

1.13.8 Clearing Trusted Platform Module Ownership

WARNING

Disconnect the desktop board's power supply from its AC power source before you connect or disconnect cables, or install or remove any board components. Failure to do this can result in personal injury or equipment damage. Some circuitry on the desktop board can continue to operate even though the front panel power switch is off.

CAUTION

DATA ENCRYPTED BY ANY PROGRAM UTILIZING THE TPM WILL BECOME INACCESSIBLE IF TPM OWNERSHIP IS CLEARED. Recovery procedures may allow the

migratable keys to be recovered and might restore access to encrypted data. (Review the Recovery Procedures for detailed instructions).

The TPM may be cleared to transfer ownership of the platform to a new owner.

1. Observe precautions in the above WARNING then open the system case.

2. Move the configuration jumper on the board to pins 2-3.

3. Restore power to the PC and power on.

4. System should automatically enter BIOS setup.

5. Use the arrow keys to select Clear Trusted Platform Module, press <Enter>.

6. If you agree to the warning message select Ok and press <Enter>.

7. Press the <F10> key to save and exit, select Ok and press <Enter>.

8. Power off the system.

9. Review precautions in the WARNING above.

10. Restore the configuration jumper on the board to pins 1-2.

When cleared, the TPM module is disabled by default.

1.13.9 Software Support

•

For assistance with the Infineon Security Platform Software, visit the web at:

http://www.infineon.com

•

For assistance with the Wave System EMBASSY Trust Suite, visit the web at:

http://www.wave.com/support/ets.html

•

For additional information about TPM and enhancing PC security, visit:

https://www.trustedcomputinggroup.org/home

Product Description

Intel Desktop Board D915GEV/D915GRF Technical Product Specification