Intel® Desktop Board D425KT and
Intel® Desktop Board D425KTW
Technical Product Specification
July 2010
Order Number: E98415-001US
The Intel® Desktop Board D425KT and Intel® Desktop Board D425KTW may contain design defects or errors known as errata that may cause the product to
deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board D425KT and Intel Desktop Board D425KTW
Specification Update.
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board D425KT and Intel® Desktop
Board D425KTW Technical Product Specification.
This product specification applies to only the standard Intel® Desktop Board D425KT and Intel®
Desktop Board D425KTW with BIOS identifier MWPNT10N.86A
Changes to this specification will be published in the Intel Desktop Board D425KT and Intel
Desktop Board D425KTW Specification Update before being incorporated into a revision of this
document.
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July 2010
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®
Desktop Boards may contain design defects or errors known as errata, which may cause the product
Intel
to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
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* Other names and brands may be claimed as the property of others.
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel
Desktop Board D425KT and Intel
standard product and available manufacturing options.
®
Desktop Board D425KTW. It describes the
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board D425KT and Intel Desktop Board D425KTW and its components to the vendors,
system integrators, and other engineers and technicians who need this level of
information. It is specifically not intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
®
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gbit Gigabit (1,073,741,824 bits)
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
J
K
L
M
N
O
P
Q
R
S
T
U Front Panel Wireless Activity LED Header (D425KTW only)
V
W
X
Y
Descri
Back panel connectors
LVDS inverter panel voltage selection jumper (D425KTW only)
Serial port header
LVDS inverter power voltage selection jumper (D425KTW only)
LVDS inverter power connector (D425KTW only)
LVDS panel connector (D425KTW only)
Processor core power connector (2 x 2)
Intel Atom processor
Power connector (2 x 12)
SO-DIMM channel A socket, DIMM 0
SO-DIMM channel A socket, DIMM 1
Battery
SATA connector 1
SATA connector 0
Front panel USB header (black)
Front panel header
Standby power LED
BIOS setup configuration jumper block
PCI Express x1 Mini Card connector (D425KTW only)
Intel NM10 Express Chipset
Front panel USB header (black)
D425KTW only - Front panel USB header supports Intel Z-U130
USB Solid-State Drive or compatible device (brown)
PCI conventional bus connector
Chassis fan header
Front panel audio header
ption
12
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas.
The board has a passively-cooled, soldered-down Single-Core Intel Atom processor
with integrated graphics and integrated memory controller.
NOTE
The board is designed to be passively cooled in a properly ventilated chassis. Chassis
venting locations are recommended above the processor heatsink area for maximum
heat dissipation effectiveness.
For information about Refer to
Power supply connectors Section 2.2.2.3, page 45
14
1.3.1 Intel D425 Graphics Subsystem
Product Description
1.3.1.1 Intel
®
Graphics Media Accelerator 3150 Graphics
Controller
The Intel GMA 3150 graphics controller features the following:
• 400 MHz core frequency
• High quality texture engine
⎯ DX9.0c* and OpenGL* 1.4 compliant
⎯ Hardware Pixel Shader 2.0
⎯ Vertex Shader Model 2.0
• 3D Graphics Rendering enhancements
⎯ 1.6 dual texture GigaPixel/s max fill rate
⎯ 16-bit and 32-bit color
⎯ Vertex cache
• Video
⎯ Software DVD at 30 fps full screen
⎯ DVMT support up to 256 MB
• Display
⎯ Supports analog displays up to 2048 x 1536 at 75 Hz refresh (QXGA)
⎯ Supports LVDS displays up to 1366 x 768 (single channel, 18 bpp) (D425KTW
only)
⎯ Dual independent display support with LVDS option (D425KTW only)
For information about Refer to
Obtaining graphics software and utilities Section 1.2, page 14
(DDR3 1066 MHz and DDR3 1333 MHz memory will run at 800 MHz)
NOTE
Due to passively-cooled thermal constraints, system memory must have an operating
temperature rating of 85
The board is designed to be passively cooled in a properly ventilated chassis. Chassis
venting locations are recommended above the system memory area for maximum
heat dissipation effectiveness.
o
C.
NOTE
To be fully compliant with all applicable DDR3 SDRAM memory specifications, the
board should be populated with SO-DIMMs that support the Serial Presence Detect
(SPD) data structure. This allows the BIOS to read the SPD data and program the
chipset to accurately configure memory settings for optimum performance. If nonSPD memory is installed, performance and reliability may be impacted or the SODIMMs may not function under the determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
DIMM
Capacity Configuration
1024 MB DS 1 Gbit 64 M x16/64 M x16 8
1024 MB SS 1 Gbit 128 M x8/empty 8
2048 MB DS 2 Gbit 128 M x16/128 M x16 8
2048 MB SS 2 Gbit 256 M x8/empty 8
Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM)
and “SS” refers to single-sided memory modules (containing one row of SDRAM).
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
16
Product Description
1.5 Intel
The Intel NM10 Express Chipset provides interfaces to the processor and the USB,
SATA, LPC, LAN, PCI, and PCI Express interfaces. The Intel NM10 Express Chipset is a
centralized controller for the board’s I/O paths.
NOTE
The board is designed to be passively cooled in a properly ventilated chassis. Chassis
venting locations are recommended above the processor heatsink area for maximum
heat dissipation effectiveness.
For information about Refer to
The Intel NM10 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
®
NM10 Express Chipset
1.5.1.1 Video Memory Allocation
Video memory is allocated from the total available system memory for the efficient
balancing of 2-D/3-D graphics performance and overall system performance. Dynamic
allocation of system memory to video memory is as follows:
• 256 MB total RAM results in 32 MB video RAM
• 512 MB total RAM results in 64 MB video RAM
• 1 GB total RAM results in 128 MB video RAM
• 2 GB total RAM results in 224 MB video RAM
1.5.1.2 Analog Display (VGA)
The VGA port supports analog displays. The maximum supported resolution is 2048 x
1536 (QXGA) at a 75 Hz refresh rate.
1.5.1.3 Flat Panel Interface (LVDS) - D425KTW Only
The flat panel interface (LVDS) supports the following:
• Panel support up to UXGA (1366 x 768)
• 25 MHz to 112 MHz single–channel; @18 bpp
⎯ TFT panel type
• Panel fitting, panning, and center mode
• CPIS 1.5 compliant
• Spread spectrum clocking
• Panel power sequencing
• Integrated PWM interface for LCD backlight inverter control
For monitors attached to the VGA port, video modes supported by this board are
based on the Extended Display Identification Data (EDID) protocol.
Video mode configuration for LVDS displays (D425KTW only) is supported as follows:
•Automatic panel identification via Extended Display Identification Data (EDID) for
LVDS panels supporting EDID protocol.
•Manual LVDS panel configuration through the BIOS setup page. This feature
allows the manual entry of critical panel settings (equivalent to the 18-byte
Detailed Timings Descriptor structure defined by the VESA EDID specification) for
non-EDID panel support.
In addition, BIOS setup provides the following configuration parameters for LVDS
displays (D425KTW only):
• Screen Brightness: allows the end-user to set screen brightness for the display.
• Maintain Aspect Ratio: allows the end-user to select whether the native aspect
ratio is to be preserved during POST and before the video driver is loaded.
•LVDS Configuration Changes: allows the system integrator to “lock” critical settings
of the LVDS configuration to avoid end-users potentially rendering the display
unusable (refer to Note 1).
•Inverter Frequency and Polarity: allows the system integrator to set the operating
frequency and polarity of the panel inverter board.
•Minimum Inverter Current Limit (%): allows the system integrator to set minimum
PWM%, as appropriate, according to the power requirements of the LVDS display
and the selected inverter board.
NOTE
Support for LVDS (D425KTW only) configuration complies with the following:
1. “Unlocking” of critical settings of the LVDS configuration is supported via Intel
Integrator Toolkit’s command-line tool.
2. Critical settings of the LVDS configuration are not exposed through Intel Integrator
Toolkit or Intel
3. Critical settings of the LVDS configuration will not be overwritten by loading BIOS
setup defaults.
4. Critical settings of the LVDS configuration will be preserved across BIOS updates.
®
Integrator Assistant GUIs.
®
18
Product Description
1.5.2 USB
The board provides up to eight USB 2.0 ports, supports UHCI and EHCI, and uses
UHCI- and EHCI-compatible drivers. The port arrangement is as follows:
• Eight USB 2.0 ports (D425KT only):
⎯ Four back panel ports
⎯ Four ports are implemented with two dual port internal headers for front panel
cabling
• Seven USB 2.0 ports (D425KTW only):
⎯ Four back panel ports
⎯ Two ports are implemented with a dual port internal header for front panel
cabling
⎯ One port is implemented with an internal header (brown-colored) that supports
an Intel
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 8, page 37
The location of the front panel USB headers Figure 10, page 39
®
Z-U130 USB Solid-State Drive or compatible device
1.5.3 SATA Support
The board provides two SATA interface connectors that support one device per
connector.
The board’s SATA controller offers independent SATA ports with a theoretical
maximum transfer rate of 3.0 Gbits/s on each port. One device can be installed on
each port for a maximum of two SATA devices. A point-to-point interface is used for
host to device connections, unlike PATA which supports a master/slave configuration
and two devices on each channel.
For compatibility, the underlying SATA functionality is transparent to the operating
system. The SATA controller supports IDE and AHCI configuration and can operate in
both legacy and native modes. In legacy mode, standard ATA I/O and IRQ resources
are assigned (IRQ 14 and 15). In native mode, standard PCI Conventional bus
resource steering is used. Native mode is the preferred mode for configurations using
the Windows* XP and Windows Vista* operating systems.
For information about Refer to
Obtaining AHCI driver Section 1.2, page 14
The location of the SATA connectors Figure 10, page 39
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded
into CMOS RAM at power-on.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 11 shows the location of the battery.
1.7 Legacy I/O Controller
The Legacy I/O Controller provides the following features:
• One serial port header
• One serial port connector on the back panel
• One parallel port connector with Extended Capabilities Port (ECP) and Enhanced
Parallel Port (EPP) support
•Serial IRQ interface compatible with serialized IRQ support for PCI Conventional
bus systems
• PS/2-style keyboard and mouse ports
• Intelligent power management, including a programmable wake-up event interface
• PCI Conventional bus power management support
The BIOS Setup program provides configuration options for the Legacy I/O controller.
For information about Refer to
The location of the serial port header Figure 10, page 39
The serial port header signal mapping Table 11, on page 41
20
Product Description
1.8 LAN Subsystem
The LAN subsystem consists of the following:
• Intel NM10 Express Chipset
• Realtek 8105E Ethernet Controller for 10/100 Mbits/s Ethernet LAN connectivity
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface that supports the Ethernet controller
• PCI Conventional bus power management
⎯ Supports ACPI technology
⎯ Supports LAN wake capabilities
1.8.1 LAN Subsystem Drivers
LAN drivers are available from Intel’s World Wide Web site.
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 3).
Figure 3. LAN Connector LED Locations
Table 4 describes the LED states when the board is powered up and the
10/100 Mbits/s LAN subsystem is operating.
Table 4. LAN Connector LED States
LED Color State Condition
Activity (A) Green Blinking LAN activity occurring
Speed (B)
N/A Off 10 Mb/s data rate
Yellow On 100 Mb/s data rate
22
Product Description
1.9 Audio Subsystem
The board supports the Intel® High Definition Audio (Intel® HD Audio) subsystem. The
audio subsystem consists of the following:
• Intel NM10 Express Chipset
• Realtek ALC662 audio codec
The audio subsystem has the following features:
•Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.
• Front panel Intel HD Audio and AC ’97 audio support
• 3-port analog audio out stack
• Windows Vista Basic certification
• A signal-to-noise (S/N) ratio of 95 dB
Table 5 lists the supported functions of the front panel and back panel audio jacks.
Table 5. Audio Jack Support
Audio Jack
Front panel – Green No Yes No No Yes
Front panel – Pink No No No Yes No
Back panel – Blue Yes No Yes No No
Back panel – Green No Yes No No Yes
Back panel – Pink No No No Yes No
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.2, page 14
1.9.2 Audio Connectors and Headers
The board contains audio connectors and headers on both the back panel and the
component side of the board. The component-side audio headers include front panel
audio (a 2 x 5-pin header that provides mic in and line out signals for front panel
audio connectors).
Item Description
A Line in
B Line out
C Mic in
Figure 4. Back Panel Audio Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
For information about Refer to
The locations of the front panel audio header and S/PDIF audio header Figure 10, page 39
The signal names of the front panel audio header and S/PDIF header Section 2.2.2.1. page 41
The back panel audio connectors Figure 4. page 24
24
Product Description
1.10 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Thermal and voltage monitoring
• Chassis intrusion detection
1.10.1 Hardware Monitoring
The hardware monitoring and fan control subsystem is based on the Winbond
W83627DHG-A device, which supports the following:
• Processor and system ambient temperature monitoring
• Chassis fan speed monitoring
• Power monitoring of +12 V, +5 V, +5 Vstdby, +3.3 V, and +VCCP
Figure 5 shows the locations of the thermal sensors and fan header.
26
Item Description
A Chassis fan header
B Remote thermal sensor
C Thermal diode, located on the processor die
Figure 5. Thermal Sensors and Fan Header
Product Description
1.11 Power Management
Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:
⎯ Power connector
⎯ Fan header
⎯ LAN wake capabilities
⎯ Instantly Available PC technology
⎯ Wake from USB
⎯ Wake from PS/2 devices
⎯ Power Management Event signal (PME#) wake-up support
⎯ WAKE# signal wake-up support
1.11.1 ACPI
ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with the board requires an
operating system that provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
•Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake-up events (see Table 8 on page 29)
• Support for a front panel power and sleep mode switch
Table 6 lists the system states based on how long the power switch is pressed,
dependi
ng on how ACPI is configured with an ACPI-aware operating system.
Table 6. Effects of Pressing the Power Switch
If the system is in this
state…
Off
(ACPI G2/G5 – Soft off)
On
(ACPI G0 – working state)
On
(ACPI G0 – working state)
Sleep
(ACPI G1 – sleeping state)
Sleep
(ACPI G1 – sleeping state)
…and the power switch
is pressed for
Less than four seconds Power-on
Less than four seconds Power-off
More than four seconds Fail safe power-off
Less than four seconds Wake-up
More than four seconds Power-off
…the system enters this state
(ACPI G0 – working state)
(ACPI G2/G5 – Soft off)
(ACPI G2/G5 – Soft off)
(ACPI G0 – working state)
(ACPI G2/G5 – Soft off)
27
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