Intel D33217CK, DC3217BY Specification

Intel® Next Unit of Computing
Board D33217CK

Technical Product Specification

October 2012

Order Number: G67688-002

The Intel Next Unit of Computing Board D33217CK may contain design defects or errors known as errata that may cause the product to deviate from
published specifications. Current characterized errata are documented in the Intel Next Unit of Computing Board D33217CK Specification Update.

Revision History

Revision Revision History Date

001 First release of the Intel® Next Unit of Computing Board D33217CK

Technical Product Specification

002 Specification Clarification October 2012

Disclaimer

This product specification applies to only the standard Intel® Next Unit of Computing Board with
BIOS identifier GKPPT10H.86A.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR
INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS
OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED
FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION
WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

®

All Intel
use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar
locations. The suitability of this product for other PC or embedded non-PC applications or other
environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported
without further evaluation by Intel.

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.

Intel Next Unit of Computing Boards may contain design defects or errors known as errata, which may
cause the product to deviate from published specifications. Current characterized errata are available on
request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.

Intel and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.

* Other names and brands may be claimed as the property of others.

Copyright  2012, Intel Corporation. All rights reserved.

Next Unit of Computing Boards are evaluated as Information Technology Equipment (I.T.E.) for

October 2012

Board Identification Information

AA Revision

BIOS Revision

Notes

Device

Stepping

S-Spec Numbers

Basic Intel® Next Unit of Computing Board D33217CK
Identification Information

G69977-201 GKPPT10H.86A.0020 1,2

G69977-301 GKPPT10H.86A.0025 1,2

Notes:

1. The AA number is found on a small label on the component side of the board.

2. The Intel
of the following components:

Intel Core I3-3217U L1 SR0N9

Intel BD82QS77 C1 SLI8B

®

QS77 PCH and Intel® Core™ i3-3217U processor used on this AA revision consists

Specification Changes or Clarifications

Table 1 indicates the Specification Changes or Specification Clarifications that apply to
the Intel

®

Desktop Board D33217CK.

Table 1. Specification Changes or Clarifications

Date Type of Change Description of Changes or Clarifications

October 2012 Spec Change Corrected a typo in the Table 1 Audio section.

Errata

Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.

iii

Intel Desktop Board D33217CK Technical Product Specification

iv

Preface

1

A description of the hardware used on Intel Next Unit of Computing Board
2

A map of the resources of the Intel Next Unit of Computing Board

3

The features supported by the BIOS Setup program

4

A description of the BIOS error messages, beep codes, and POST codes

5

Regulatory compliance and battery disposal information

This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for Intel
of Computing Board D33217CK.

Intended Audience

The TPS is intended to provide detailed, technical information about Intel Next Unit of
Computing Board D33217CK and its components to the vendors, system integrators,
and other engineers and technicians who need this level of information. It is
specifically not intended for general audiences.

What This Document Contains

Chapter Description

D33217CK

®

Next Unit

Typographical Conventions

This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

v

Intel Desktop Board D33217CK Technical Product Specification

Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#)

GB Gigabyte (1,073,741,824 bytes)

GB/s Gigabytes per second

Gb/s Gigabits per second

KB Kilobyte (1024 bytes)

Kb Kilobit (1024 bits)

kb/s 1000 bits per second

MB Megabyte (1,048,576 bytes)

MB/s Megabytes per second

Mb Megabit (1,048,576 bits)

Mb/s Megabits per second

TDP Thermal Design Power

xxh An address or data value ending with a lowercase h indicates a hexadecimal value.

x.x V Volts. Voltages are DC unless otherwise specified.

* This symbol is used to indicate third-party brands and names that are the property of their

respective owners.

vi

Contents

Revision History

Disclaimer ................................................................................................ ii

Board Identification Information .................................................................. iii

Errata ...................................................................................................... iii

Preface

Intended Audience ..................................................................................... v

What This Document Contains ..................................................................... v

Typographical Conventions ......................................................................... v

1 Product Description

1.1 Overview ......................................................................................... 11

1.1.1 Feature Summary ................................................................. 11

1.1.2 Board Layout (Top) ............................................................... 13

1.1.3 Board Layout (Bottom) .......................................................... 15

1.1.4 Block Diagram ...................................................................... 17

1.2 Online Support ................................................................................. 18

1.3 Processor ........................................................................................ 18

1.4 System Memory ............................................................................... 19

1.4.1 Memory Configurations .......................................................... 20

1.5 Intel

1.6 Graphics Subsystem ......................................................................... 22

1.7 SATA Interface ................................................................................. 24

1.8 Real-Time Clock Subsystem ............................................................... 25

1.9 Connectivity ..................................................................................... 25

1.10 Hardware Management Subsystem ..................................................... 25

1.11 Power Management .......................................................................... 27

®

QS77 Express Chipset .............................................................. 22

1.5.1 Direct Media Interface (DMI) .................................................. 22

1.5.2 Display Interfaces ................................................................. 22

1.6.1 Integrated Graphics ............................................................... 22

1.6.2 USB ..................................................................................... 24

1.7.1 AHCI Mode ........................................................................... 24

1.9.1 Thunderbolt™ Technology Interface ......................................... 25

1.10.1 Hardware Monitoring ............................................................. 26

1.10.2 Fan Monitoring ...................................................................... 26

1.10.3 Thermal Solution ................................................................... 26

1.11.1 ACPI .................................................................................... 27

1.11.2 Hardware Support ................................................................. 29

vii

Intel Desktop Board D33217CK Technical Product Specification

2 Technical Reference

2.1 Memory Resources ........................................................................... 33

2.1.1 Addressable Memory ............................................................. 33

2.1.2 Memory Map ......................................................................... 35

2.2 Connectors and Headers .................................................................... 35

2.2.1 Back Panel Connectors ........................................................... 36

2.2.2 Connectors and Headers (Bottom) ........................................... 37

2.3 BIOS Setup Configuration Jumper ....................................................... 44

2.4 Mechanical Considerations ................................................................. 46

2.4.1 Form Factor .......................................................................... 46

2.5 Electrical Considerations .................................................................... 47

2.5.1 Power Supply Considerations .................................................. 47

2.5.2 Fan Header Current Capability ................................................ 48

2.6 Thermal Considerations ..................................................................... 48

2.7 Reliability......................................................................................... 51

2.8 Environmental .................................................................................. 51

3 Overview of BIOS Features

3.1 Introduction ..................................................................................... 53

3.2 BIOS Flash Memory Organization ........................................................ 54

3.3 System Management BIOS (SMBIOS) ................................................. 54

3.4 Legacy USB Support ......................................................................... 54

3.5 BIOS Updates .................................................................................. 55

3.5.1 Language Support ................................................................. 55

3.5.2 Custom Splash Screen ........................................................... 56

3.6 BIOS Recovery ................................................................................. 56

3.7 Boot Options .................................................................................... 57

3.7.1 Booting Without Attached Devices ........................................... 57

3.7.2 Changing the Default Boot Device During POST ......................... 57

3.8 Hard Disk Drive Password Security Feature .......................................... 58

3.9 BIOS Security Features ..................................................................... 59

4 Error Messages and Blink Codes

4.1 Front-panel Power LED Blink Codes ..................................................... 61

4.2 BIOS Error Messages ........................................................................ 61

4.3 Port 80h POST Codes ........................................................................ 62

5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance ...................................................................... 69

5.1.1 Safety Standards................................................................... 69

5.1.2 European Union Declaration of Conformity Statement ................ 70

5.1.3 Product Ecology Statements ................................................... 71

5.1.4 EMC Regulations ................................................................... 73

5.1.5 ENERGY STAR* 5.2, e-Standby, and ErP Compliance ................. 76

5.1.6 Regulatory Compliance Marks (Board Level) ............................. 77

5.2 Battery Disposal Information .............................................................. 78

viii

Contents

Figures

1. Major Board Components (Top) .......................................................... 13

2. Major Board Components (Bottom) ..................................................... 15

3. Block Diagram .................................................................................. 17

4. Memory Channel and SO-DIMM Configuration ...................................... 21

5. Thermal Solution and Fan Header ....................................................... 26

6. Location of the Standby Power LED ..................................................... 31

7. Detailed System Memory Address Map ................................................ 34

8. Back Panel Connectors ...................................................................... 36

9. Connectors and Headers (Bottom) ...................................................... 37

10. Connection Diagram for Front Panel Header ......................................... 42

11. Connection Diagram for Front Panel USB 2.0 Dual-Port Header............... 43

12. Location of the BIOS Configuration Setup Jumper ................................. 44

13. Board Dimensions ............................................................................. 46

14. Localized High Temperature Zones ..................................................... 49

ix

Intel Desktop Board D33217CK Technical Product Specification

Tables

1. Feature Summary ............................................................................. 11

2. Components Shown in Figure 1 .......................................................... 14

3. Components Shown in Figure 2 .......................................................... 16

4. Supported Memory Configurations ...................................................... 19

5. Effects of Pressing the Power Switch ................................................... 27

6. Power States and Targeted System Power ........................................... 28

7. Wake-up Devices and Events ............................................................. 29

8. System Memory Map ........................................................................ 35

9. Connectors and Headers Shown in Figure 9 ......................................... 38

10. PCI Express Full-Mini Card Connector .................................................. 39

11. Dual-Port Front Panel USB 2.0 Header ................................................. 40

12. 19 V Internal Power Supply Connector ................................................ 41

13. Front Panel Header ........................................................................... 41

14. States for a One-Color Power LED ....................................................... 42

15. BIOS Setup Configuration Jumper Settings .......................................... 45

16. Fan Header Current Capability ............................................................ 48

17. Thermal Considerations for Components .............................................. 50

18. Tcontrol Values for Components ......................................................... 50

19. Environmental Specifications .............................................................. 51

20. AcceptableDrives/Media Types for BIOS Recovery ................................. 56

21. Boot Device Menu Options ................................................................. 57

22. Master Key and User Hard Drive Password Functions ............................ 58

23. Supervisor and User Password Functions ............................................. 59

24. Front-panel Power LED Blink Codes ..................................................... 61

25. BIOS Error Messages ........................................................................ 61

26. Port 80h POST Code Ranges .............................................................. 62

27. Port 80h POST Codes ........................................................................ 63

28. Typical Port 80h POST Sequence ........................................................ 67

29. Safety Standards .............................................................................. 69

30. EMC Regulations ............................................................................... 73

31. Regulatory Compliance Marks ............................................................ 77

x

4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)

• Soldered-down Intel® Core™ i3-3217U processor with up to 17 W TDP

• Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Module

Intel

®

QS77 Express Chipset consisting of the Intel® QS77 Express Platform

• Integrated graphics support for processors with Intel® Graphics Technology:

• USB 2.0 ports:

• One PCI Express Half-Mini Card connector

• Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 2 summarizes the major features of the board.

Table 2. Feature Summary

Form Factor

Processor

― Integrated graphics
― Integrated memory controller

Memory

Chipset

Connectivity Thunderbolt™ Technology Interface

Graphics

Audio Intel® High Definition Audio via the HDMI v1.4a interface

Peripheral
Interfaces

Expansion
Capabilities

BIOS

(SO-DIMM) sockets

• Support for DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz

SO-DIMMs

• Support for 1 Gb, 2 Gb, and 4 Gb memory technology

• Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb

memory technology

• Support for non-ECC memory

• Support for 1.35 V low voltage JEDEC memory

Controller Hub (PCH)

― One High Definition Multimedia Interface* (HDMI*) back panel connector

― Three front panel ports (via one dual-port internal header and one front

panel connector)

― Two ports are implemented with vertical back panel connectors
― One port is reserved for the PCI Express* Half-Mini Card
― One port is reserved for the PCI Express Full-Mini Card

• SATA port:

― One internal mSATA port (PCI Express Full-Mini Card) for SSD support

• One PCI Express Full-Mini Card connector

• Support for Advanced Configuration and Power Interface (ACPI), Plug and

Play, and System Management BIOS (SMBIOS)

continued

11

Intel Desktop Board D33217CK Technical Product Specification

Table 2. Feature Summary (continued)

Hardware Monitor
Subsystem

Hardware monitoring subsystem, based on a Nuvoton NPCE791C embedded
controller, including:

• Voltage sense to detect out of range power supply voltages

• Thermal sense to detect out of range thermal values

• One processor fan header

• Fan sense input used to monitor fan activity

• Simple fan speed control

12

Product Description

1.1.2 Board Layout (Top)

Figure 1 shows the location of the major components on the top-side of Intel Next Unit
of Computing Board D33217CK.

Figure 1. Major Board Components (Top)

13

Intel Desktop Board D33217CK Technical Product Specification

Table 3 lists the components identified in Figure 1.

Table 3. Components Shown in Figure 1

Item from Figure 1 Description

A Battery

B Standby power LED

C Processor fan header

D Onboard power button

E Power LED

F Hard Disk Drive LED

G Thermal solution

14

Product Description

1.1.3 Board Layout (Bottom)

Figure 2 shows the location of the major components on the bottom-side of Intel Next
Unit of Computing Board D33217CK.

Figure 2. Major Board Components (Bottom)

15

Intel Desktop Board D33217CK Technical Product Specification

Table 4. Components Shown in Figure 2

Item from
Figure 2

A Back panel connectors

B PCI Express Full-Mini Card connector

C PCI Express Half-Mini Card connector

D Front panel dual-port USB 2.0 header

E BIOS setup configuration jumper

F Front panel USB 2.0 connector

G Front panel header

H DDR3 SO-DIMM 2 socket

I DDR3 SO-DIMM 1 socket

J Internal DC power connector

Description

16

1.1.4 Block Diagram

Figure 3 is a block diagram of the major functional areas of the board.

Product Description

Figure 3. Block Diagram

17

Intel Desktop Board D33217CK Technical Product Specification

To find information about…

Visit this World Wide Web site:

1.2 Online Support

Intel Next Unit of Computing Board
D33217CK

Next Unit of Computing Board Support http://www.intel.com/p/en_US/support?iid=hdr+support

Available configurations for Intel Next
Unit of Computing Board D33217CK

Chipset information http://www.intel.com/products/desktop/chipsets/index.htm

BIOS and driver updates http://downloadcenter.intel.com

Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-

Integration information http://www.intel.com/support/go/buildit

http://www.intel.com/products/motherboard/index.htm

http://ark.intel.com

025414.htm

1.3 Processor

The board has a soldered-down Intel Core i3-3217U processor with Integrated
Graphics Technology and integrated memory controller.

NOTE

This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 47 for information on power supply requirements for this board.

18

Product Description

Version

Capacity

Technology

Organization

Devices

1.4 System Memory

The board has two 204-pin SO-DIMM sockets and supports the following memory
features:

• 1.5 V DDR3 SDRAM SO-DIMMs with gold plated contacts

• Support for 1.35 V Low Voltage DDR3 (new JEDEC specification)

• Two independent memory channels with interleaved mode support

• Unbuffered, single-sided or double-sided SO-DIMMs

• 16 GB maximum total system memory (with 4 Gb memory technology). Refer to

Section 2.1.1 on page 33 for information on the total amount of addressable
memory.

• Minimum recommended total system memory: 1024 MB

• Non-ECC SO-DIMMs

• Serial Presence Detect

• XMP profile support for voltage detection

• DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz SDRAM SO-DIMMs

NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with SO-DIMMs that support the Serial Presence Detect (SPD)
data structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the SO-DIMMs may not function under
the determined frequency.

Table 5 lists the supported SO-DIMM configurations.

Table 5. Supported Memory Configurations

Raw Card

A

B

C

F

Note: System memory configurations are based on availability and are subject to change.

SO-DIMM

1 GB 1 Gb 64 M x 16 8

2 GB 2 Gb 128 M x 16 8

1 GB 1 Gb 128 M x 8 8

2 GB 2 Gb 256 M x 8 8

512 MB 1 Gb 64 M x 16 4

1 GB 2 Gb 128 M x 16 4

2 GB 1 Gb 128 M x 8 16

4 GB 2 Gb 256 M x 8 16

8 GB 4 Gb 512 M x 8 16

DRAM Device

DRAM

# of DRAM

19

Intel Desktop Board D33217CK Technical Product Specification

For information about…

Refer to:

Tested Memory http://support.intel.com/support/motherboards/desktop/sb

/CS-025414.htm

1.4.1 Memory Configurations

The processor supports the following types of memory organization:

• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both SO-DIMM channels are equal. Technology and device width can
vary from one channel to the other but the installed memory capacity for each
channel must be equal. If different speed SO-DIMMs are used between channels,
the slowest memory timing will be used.

• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single SO-DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed SO-DIMMs
are used between channels, the slowest memory timing will be used.

For information about… Refer to:

Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-

011965.htm

20

Product Description

Figure 4 illustrates the memory channel and SO-DIMM configuration.

Figure 4. Memory Channel and SO-DIMM Configuration

21

Intel Desktop Board D33217CK Technical Product Specification

1.5 Intel® QS77 Express Chipset

Intel QS77 Express Chipset with Direct Media Interface (DMI) interconnect provides
interfaces to the processor and the USB, SATA, LPC, LAN, and PCI Express interfaces.
The Intel QS77 Express Chipset is a centralized controller for the board’s I/O paths.

For information about Refer to

The Intel QS77 chipset http://www.intel.com/products/desktop/chipsets/index.htm

Resources used by the chipset Chapter 2

1.5.1 Direct Media Interface (DMI)

Direct Media Interface (DMI) is the chip-to-chip connection between the processor and
PCH. This high-speed interface integrates advanced priority-based servicing allowing
for concurrent traffic and true isochronous transfer capabilities.

1.5.2 Display Interfaces

Display is divided between the processor and the PCH. The processor houses the
memory interface, display planes, and pipes while the PCH has transcoder and display
interface or ports. The PCH receives the display data over Intel
Interface (Intel
and sends the data through the display interface.

1.5.2.1 Intel

Intel FDI connects the display engine in the processor with the display interfaces on
the PCH. The display data from the frame buffer is processed in the display engine of
the processor and sent to the PCH over the Intel FDI where it is transcoded as per the
display protocol and driven to the display monitor.

®

FDI) and transcodes the data as per the display technology protocol

®

Flexible Display Interconnect (Intel

®

Flexible Display

®

FDI)

1.5.2.2 High-bandwidth Digital Content Protection (HDCP)

HDCP is the technology for protecting high definition content against unauthorized
copy or unreceptive between a source (computer, digital set top boxes, etc.) and the
sink (panels, monitor, and TVs). The PCH supports HDCP 1.4 for content protection
over wired displays (HDMI).

1.6 Graphics Subsystem

The board supports graphics through Intel Graphics Technology.

1.6.1 Integrated Graphics

The board supports integrated graphics through Intel FDI.

22

1.6.1.1 Intel® High Definition (Intel® HD) Graphics

The Intel HD graphics controller features the following:

• 3D Features
 DirectX* 10.1 and OpenGL* 3.0 compliant
 DirectX 11.0 CS4.0 only
 Shader Model 4.0

• Video
 High-Definition content at up to 1080p resolution
 Hardware accelerated MPEG-2, VC-1/WMV and H.264/AVC Hi-Definition video

formats

 Intel HD Technology with Advanced Hardware Video Transcoding
 Blu-ray* S3D via HDMI 1.4a
 Dynamic Video Memory Technology (DVMT) 5.0 support
 Support of up to 1.7 GB Video Memory with 4 GB and above system memory

configuration

Product Description

1.6.1.2 Video Memory Allocation

Intel® Dynamic Video Memory Technology (DVMT) is a method for dynamically
allocating system memory for use as graphics memory to balance 2D/3D graphics and
system performance. If your computer is configured to use DVMT, graphics memory is
allocated based on system requirements and application demands (up to the
configured maximum amount). When memory is no longer needed by an application,
the dynamically allocated portion of memory is returned to the operating system for
other uses.

1.6.1.3 High Definition Multimedia Interface* (HDMI*)

The HDMI port supports standard, enhanced, or high definition video, plus multi­channel digital audio on a single cable. The port is compatible with all ATSC and DVB
HDTV standards and supports eight full range channels at 24-bit/96 kHz audio of
lossless audio formats such as Dolby* TrueHD or DTS* HD Master Audio. The
maximum supported resolution is 1920 x 1200 (WUXGA). The HDMI port is compliant
with the HDMI 1.4a specification.

1.6.1.3.1 Integrated Audio Provided by the HDMI Interface

The following audio technologies are supported by the HDMI 1.4a interface directly
from the PCH:

• AC-3 - Dolby* Digital

• Dolby Digital Plus

• DTS-HD*

• LPCM, 192 kHz/24-bit, 8 Channel

23

Intel Desktop Board D33217CK Technical Product Specification

1.6.2 USB

The board supports seven USB 2.0 ports. The port arrangement is as follows:

• Three front panel ports (via one dual-port internal header and one front panel
connector)

• Two ports are implemented with vertical back panel connectors

• One port is reserved for the PCI Express Half-Mini Card

• One port is reserved for the PCI Express Full-Mini Card

All seven USB 2.0 ports are high-speed, full-speed, and low-speed capable.

NOTE

Computer systems that have an unshielded cable attached to a USB port may not meet
FCC Class B requirements, even if no device is attached to the cable. Use a shielded
cable that meets the requirements for full-speed devices.

For information about Refer to

The location of the USB connectors on the back panel Figure 8, page 36

The location of the front panel USB headers Figure 2, page 15

1.7 SATA Interface

The board provides one internal mSATA port (PCI Express Full-Mini Card connector) for
SSD support.

The PCH provides independent SATA ports with a theoretical maximum transfer rate of
6 Gb/s. A point-to-point interface is used for host to device connections.

The underlying SATA functionality is transparent to the operating system. The SATA
controller can operate in both legacy and native modes. In legacy mode, standard IDE
I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for
configurations using Windows operating systems.

1.7.1 AHCI Mode

The board supports AHCI storage mode via the Intel QS77 Express Chipset.

NOTE

In order to use AHCI mode, AHCI must be enabled in the BIOS. Also, during Microsoft
Windows XP installation, F6 must be pressed to install the AHCI drivers. See your
Microsoft Windows XP documentation for more information about installing drivers
during installation. Microsoft Windows 7 includes the necessary AHCI drivers without
the need to install separate AHCI drivers during the operating system installation
process, however, it is always good practice to update the AHCI drivers to the latest
available by Intel.

24

Product Description

For information about

Refer to

1.8 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the
computer is not plugged into a wall socket, the battery has an estimated life of three
years. When the computer is plugged in, the standby current from the power supply
extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC
with 3.3 VSB applied via the power supply 5 V STBY rail.

NOTE

If the battery and AC power fail, date and time values will be reset and the user will be
notified during the POST.

When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.

1.9 Connectivity

1.9.1 Thunderbolt™ Technology Interface

The board’s Thunderbolt Technology Interface is supported by an Intel® L3310 CIO
10 Gb Controller.

The Thunderbolt controller connects a PC and other devices, transmitting and receiving
information for both PCI Express and DisplayPort* protocols. The Thunderbolt
controller switches between the two protocols to support communications over a single
cable.

Thunderbolt technology is implemented on Intel Desktop Board D33217CK as a plug
and play interface. No software drivers are required.

1.10 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including thermal and voltage monitoring.

Wired for Management (WfM) Specification www.intel.com/design/archives/wfm/

25