Intel D2700MUD Specification

Intel® Desktop Board
D2700MUD

Technical Product Specification

Part Number: G34953-002

The Intel® Desktop Board D2700MUD may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board D2700MUD Specification Update.

June 2012

Revision History

Revision Revision History Date

-001 First release o f the Intel® Desktop Board D2700MUD Technical Product
Specification.

-002 Specification Clarification June 2012

This product spec ification applies to only the standard Intel® Desktop Board D2700MUD with
BIOS identifier MUCDT10N.86A.

INFORMATION IN THIS DOCUMENT IS PROVIDED I N C ONNEC TION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
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IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
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OTHERWISE AGREED IN WRITING BY I N TEL, THE INTEL PRODUCTS ARE NOT D ESIGNED NOR INTENDED
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WHERE PERSONAL INJUR Y OR DEATH MAY OCCUR.

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other materials and inf ormation does not p rovide any license , e x press or implied , by estoppel or otherwise,
to any such patents, trad e marks, copyrig hts , o r other intellectual property rights.

Intel may make change s to specifications and p roduct descrip tions at any time, without notice.
Designers must not rely on the absence o r characteristics o f any features or ins tructions marked “reserved”

or “undefined.” Intel reserves the s e for future def inition and shall have no resp onsibility whatsoev e r for
conflicts or inco mpatibilities arising from future changes to the m .

®

Desktop Boards may contain design defects or errors known as errata, which may cause the product

Intel
to deviate from p ublished specifications. Current characte rized errata are available on request.

Contact your local Intel sales office o r your distributor to obtain the latest sp e c ifications befor e p lac i ng your
product order.

Intel, the Intel logo , a nd Intel Atom are trade m arks of Intel Co rporation in the U.S. and/or other countries.
* Other names and brands may be claimed a s the property of others.
Copyright © 2011, 2012, Inte l C orporation. All rights reserved .

December 2011

ii

Board Identification Information

Basic Desktop Board D2700MUD Identification Information

AA Revision BIOS Revision Notes

G32419-502 MUCDT10N.86A.0047 1,2
G32419-503 MUCDT10N.86A.0067 1,2
G32419-504 MUCDT10N.86A.0067 1,2
G32419-600 MUCDT10N.86A.0067 1,2
G32419-601 MUCDT10N.86A.0067 1,2
G32419-602 MUCDT10N.86A.0069 1,2
Notes:

1. The AA number is fo und on a small label on the comp o ne nt s ide of the board.

®

2. The Intel

Device Stepping S-Spec Numbers

CG82NM10 B0 SLGXX

NM10 Express Chipset used on this AA rev is ion consists of the f o llowing component:

Specification Changes or Clarifications

Table 1 indicates the Specification Changes or Specification Clarifications that apply to
the Intel

Table 1. Specification Changes or Clarifications

Date Type of Change Description of Changes or C larifications

June 2012 Spec Clarification Added a Note to se c tion 1.4 System Memory on page 18.

®

Desktop Board D2700MUD.

Errata

Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.

iii

Intel Desktop Board D2700MUD Technical Product Specification

iv

Chapter

Description

1

A description of the hardware used on the board

2

A map of the resources of the board

3

The features s upported by the BIOS Setup program

4

A description of the BIOS error messages, beep codes, and POST codes

5

Regulatory compliance and battery disposal information

Preface

This Technical Product Specification (TPS) specifies the board layo ut, components,
connectors, power and environmental requirements, and the BIOS for the Intel
Desktop Board D2700MUD. It describes the standard product and available
manufacturing options .

Intended Audience

The TPS is intended to provide detailed, technical information about the Intel Desktop
Board D2700MUD and its components to the vendors, syste m integrators, and other
engineers and te chnicia ns who need this level of information. It is specifically not
intended for general audiences.

What This Document Contains

®

Typographical Conventions

This section cont ains information about the conventions u sed in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attentio n to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

v

Intel Desktop Board D2700MUD Technical Product Specification

Other Common Notation

# Used after a signal na me to identify an active-low s ig na l (s uc h as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kb Kilob it (1024 bits)
kb/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048 ,576 bits)
Mb/s Megabits per second
TDP Therma l D e s ign Power
xxh An address or d ata v al ue ending with a lowercase h ind i c ate s a he x a d e c im al value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the p roperty of the ir

respective owners.

vi

Contents

1 Product Description

1.1 Overview ......................................................................................... 11

1.1.1 Feature Summary ................................................................. 11

1.1.2 Board Layout ........................................................................ 13

1.1.3 Block Diagram ...................................................................... 15

1.2 Onl ine Support ................................................................................. 16

1.3 Processor ........................................................................................ 16

1.3.1 Intel® D2700 Graphics Subsystem ........................................... 17

1.4 System Memory ............................................................................... 18

1.5 Intel® NM10 Express Chipset .............................................................. 20

1.5.2 USB ..................................................................................... 22

1.5.3 SATA Support ....................................................................... 22

1.6 Real-Ti me Clock Subsystem ............................................................... 23

1.7 Legacy I/O Controller ........................................................................ 23

1.8 LAN Sub system ................................................................................ 24

1.8.1 LAN Subsystem Drivers .......................................................... 24

1.8.2 RJ-45 LAN Connector with Integrated LEDs .............................. 25

1.9 Audio Subsystem .............................................................................. 26

1.9.1 Audio Subsystem Software ..................................................... 27

1.9.2 Audio Connectors and Headers ................................................ 27

1.10 Hardware Management Subsystem ..................................................... 28

1.10.1 Hardware Monitoring ............................................................. 28

1.10.2 Thermal Monitoring ............................................................... 29

1.11 Power Management .......................................................................... 30

1.11.1 ACPI .................................................................................... 30

1.11.2 Hardware Support ................................................................. 33

2 Technical Reference

2.1 Memory Map .................................................................................... 37

2.1.1 Addressable Memory ............................................................. 37

2.2 Connectors and Headers .................................................................... 40

2.2.1 Back Panel ........................................................................... 41

2.2.2 Component-side Connectors and Headers................................. 43

2.3 BIOS Configuration Jumper Block ....................................................... 55

2.4 Mechanical Considerations ................................................................. 57

2.4.1 Form Factor .......................................................................... 57

2.5 El ectrical Considerations .................................................................... 58

2.5.1 Fan Header Current Capability ................................................ 58

2.5.2 Add-in Board Considerations ................................................... 58

2.6 Thermal Considerations ..................................................................... 58

2.6.1 Passive Heatsink Design in a Passive System Environment ......... 60

vii

Intel Desktop Board D2700MUD Technical Product Specification

2.7 Power Consumption .......................................................................... 63

2.7.1 Minimum Load Configuration ................................................... 63

2.7.2 Maximum Load Configuration .................................................. 63

2.8 Reliability......................................................................................... 64

2.9 Environmental .................................................................................. 64

3 Overview of BIOS Features

3.1 Introduction ..................................................................................... 65

3.2 BIOS Flash Memory Organization ........................................................ 66

3.3 Resource Configuration ..................................................................... 66

3.3.1 PCI* Autoconfiguration .......................................................... 66

3.4 System Management BIOS (SMBIOS) ................................................. 67

3.5 Legacy USB Support ......................................................................... 68

3.6 BIOS Updates .................................................................................. 69

3.6.1 BIOS Recovery ...................................................................... 69

3.6.2 Custom Splash Screen ........................................................... 70

3.7 Boot Options .................................................................................... 70

3.7.1 Optical Drive Boot ................................................................. 70

3.7.2 Network Boot ........................................................................ 70

3.7.3 Booting Without Attached Devices ........................................... 71

3.7.4 Changing the Default Boot Device During POST ......................... 71

3.8 Adjusting Boot Speed ........................................................................ 71

3.8.1 Peripheral Selection and Configuration ..................................... 71

3.8.2 BIOS Boot Optimizations ........................................................ 72

3.9 BIOS Security Features ..................................................................... 73

4 Board Status and Error Messages

4.1 BIOS Beep Codes ............................................................................. 75

4.2 Front-panel Power LED Blink Codes ..................................................... 76

4.3 BIOS Error Messages ........................................................................ 76

4.4 Port 80h POST Codes ........................................................................ 77

5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance ...................................................................... 83

5.1.1 Safety Standards................................................................... 83

5.1.2 European Union Declaration of Conformity Statement ................ 84

5.1.3 Product Ecology Statements ................................................... 85

5.1.4 EMC Regulations ................................................................... 87

5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 90

5.1.6 Regulatory Compliance Marks (Board Level) ............................. 91

5.2 Battery Disposal Information .............................................................. 92

viii

Contents

Figures

1. Major Board Components .................................................................. 13

2. Block Diagram .................................................................................. 15

3. Memory Channel and SO-DIMM Configuration ...................................... 19

4. LAN Connector LED Locations ............................................................. 25

5. Back Panel Audio Connectors ............................................................. 27

6. Thermal Sensors and Fan Header ....................................................... 29

7. Location of the Standby Power Indicator LED ....................................... 35

8. Detailed System Memory Address Map ................................................ 38

9. Back Panel Connectors ...................................................................... 41

10. I/O Shield Reference Diagram ............................................................ 42

11. Component-side Connectors and Headers ............................................ 43

12. Connection Diagram for Front Panel Header ......................................... 52

13. Connection Diagram for Front Panel USB Header .................................. 54

14. Connection Diagram for Front Panel USB Header with Intel Z-USB

Solid-State Drive or Compatible Device Support ................................... 54

15. Location of the BIOS Configuration Jumper Block .................................. 55

16. Board Dimensions ............................................................................. 57

17. Localized High Temperature Zones ..................................................... 59

18. Fan Location Guide for Chassis Selection (Chassis Orientation is Not

Restricted) ....................................................................................... 62

Tables

1. Feature Summary ............................................................................. 11

2. Board Components Shown in Figure 1 ................................................. 14

3. Supported Memory Configurations ...................................................... 18

4. LAN Connector LED States ................................................................. 25

5. Audio Jack Support ........................................................................... 26

6. Effects of Pressing the Power Switch ................................................... 30

7. Power States and Targeted System Power ........................................... 31

8. Wake-up Devices and Events ............................................................. 32

9. System Memory Map ........................................................................ 39

10. Component-side Connectors and Headers Shown in Figure 11 ................ 44

11. TPM Header ..................................................................................... 45

12. Serial Port Headers ........................................................................... 45

13. LVDS Data Connector ........................................................................ 46

14. LVDS Panel Voltage Selection Jumper.................................................. 47

15. FPD Brightness Connector .................................................................. 47

16. LVDS Inverter P ower Voltage Select ion Jumper .................................... 47

17. System Fan Header .......................................................................... 48

18. SATA Connectors .............................................................................. 48

19. Front Panel Wireless Activity LED Header ............................................. 48

20. Front Panel Audio Header for Intel HD Audio ........................................ 48

21. Front Panel Audio Header for AC ’97 Audio ........................................... 48

ix

Intel Desktop Board D2700MUD Technical Product Specification

22. Front Panel USB Header .................................................................... 49

23. Front Panel USB Header with Intel Z-U130 USB Solid-State Drive or

Compatible Device Support ................................................................ 49

24. Power Connector .............................................................................. 51

25. Front Panel Header ........................................................................... 52

26. States for a One-Color Power LED ....................................................... 53

27. BIOS Configuration Jumper Settings ................................................... 56

28. Fan Header Current Capability ............................................................ 58

29. Thermal Considerations for Components .............................................. 60

30. Minimum Load Configuration Current and Power Results ........................ 63

31. Maximum Load Configuration Current and Power Results ....................... 64

32. Intel Desktop Board D2700MUD Environmental Specifications ................ 64

33. BIOS Setup Program Menu Bar ........................................................... 66

34. BIOS Setup Program Function Keys .................................................... 66

35. AcceptableDriv es/Media Types for BIOS Recovery ................................. 69

36. Boot Device Menu O ptions ................................................................. 71

37. Supervisor and User Password Functions ............................................. 73

38. BIOS Beep Codes ............................................................................. 75

39. Front-panel Power LED Blink Codes ..................................................... 76

40. BIOS Error Messages ........................................................................ 76

41. Port 80h POST Code Ranges .............................................................. 77

42. Port 80h POST Codes ........................................................................ 78

43. Typical Port 80h POST Sequence ........................................................ 81

44. Safety Standards .............................................................................. 83

45. EMC Regulations ............................................................................... 87

46. ENERGY STAR Requirements .............................................................. 90

47. Regulatory Compliance Marks ............................................................ 91

x

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of Intel Desktop Board D2700MUD.

Table 2. Feature Summary

Form Factor Mini-ITX (6.7 inches b y 6.7 inches [170 millimeters by 170 millimeters])

compatible with micr o A T X

Processor Passively-cooled, soldered-down Dual-Core Intel® Atom™ process or with

integrated graphi c s and inte grated memory c o ntroller

Memory

Chipset Passively coole d , Intel® NM10 Express Chipset
Audio Multi-streaming 5.1 (6-channel) audio subsystem s upport based on the Realtek*

Internal Graphics Onboard Intel® graphics subsy s te m w ith s up port for:

Legacy I/O Control Winbond W83627DHG-P based Legacy I/O controller f or hardware manag e m e nt,

Peripheral
Interfaces

LAN Support 10/100/1000 Mb/s Ethernet LAN subsy s te m usi ng an Intel® 82574L Gigabit

• Two 204-pin DDR3 SDRAM Small Outline Dua l Inline Memory Module (SO-
DIMM) sockets

• Support for DDR3 1066 MHz, DDR3 1333 MHz, and DDR3 1600 MHz
SO DIMMs

Note: DDR3 1333 MHz and DDR3 1600 MHz memory will run at 1066 MHz

• Support for up to 4 GB of system memory on a single SO-DIMM

ALC662 high definition audio codec

• Analog displays (V G A )

• Digital displays (D V I-D)

• Flat Panel displays (LVDS interface)

serial, parallel, and PS /2 * ports

• Seven USB 2.0 ports:

― Four back pane l p orts
― Two ports are im p le m e nte d w ith a d ual port internal header f or front panel

cabling

― One port is impleme nte d with an internal header (brown-colored) that

supports an Intel

• Two Serial ATA (SA TA) 3.0 Gb/s connectors (supporting IDE and AHCI mode)

• One parallel por t connector on the back p a ne l

• Two serial por t he ad e rs

• PS/2-style keyboard/ mouse ports

Ethernet Controller

®

Z-U130 USB Solid-State Drive or compatible d e v ic e

continued

11

Intel Desktop Board D2700MUD Technical Product Specification

®

Suspend to RAM sup port

One Conventional PC I bus connector (with riser card support for up to two PCI

Table 2. Feature Summary (continued)

BIOS

Instantly Available
PC Technology

Expansion
Capabilities

Hardware Monitor
Subsystem

• Intel

• Support for A d vanced Configur ation and Power Interface (ACPI), Plug and

•

• Wake on PCI, PCI Ex press*, PS/2, serial, front panel, USB ports, and LAN

•

• One PCI Expre s s F ull -/Half-Mini Card slot

• Hardware monitoring through the Windbo nd I/O controller

• Voltage sense to d e te c t o ut of range power supply voltage s

• Thermal sense to dete c t out of range thermal v a lue s

• One fan header

• One fan sense input used to monitor fan activi ty

• Fan speed control

BIOS (resid e nt in the S PI Flash device)

Play, and SMBIOS

cards)

12

1.1.2 Board Layout

Figure 1 shows the location of the major components.

Product Description

Table 2 lists the components identified in Figure 1.

Figure 1. Major Board Components

13

Intel Desktop Board D2700MUD Technical Product Specification

Solid-State Drive o r compatible devi c e (b rown-colored))

Table 3. Board Components Shown in Figure 1

Item/callout
from Figure 1

A
B
C
D
E
F
G
H

I

J
K
L
M
N
O
P
Q
R Front Panel Wireless A c ti v ity LED header
S
T
U
V Serial port heade r, COMM 2

W

X
Y
Z

Description

LVDS inverter p a ne l v oltage selection jumpe r
Back panel connectors
S/PDIF header
Standby power LED
Processor core power connector (2 x 12)
LVDS panel connector
Intel Atom processor
Trusted Platform Mo dule (TPM) header
SO-DIMM channel A socke t, DIMM 1
SO-DIMM channel A socke t, DIMM 0
Intel NM10 Expr e s s C hipset
SATA connectors
System fan header
Front panel header
BIOS setup configur ation jumper block
Battery
Front panel USB 2 .0 header

Piezo/monotonic speaker header
Conventional PCI b us add-in card connector
PCI Express Full-/Half-Mini Card slot

FPD brightness c o nne c tor
LVDS inverter p ower voltage se le c tion jumper
Front panel audio he ad e r
Front panel USB hea d e r that supports an Intel Z-U130 USB

AA

14

Serial port heade r, COMM 1

1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas.

Product Description

Figure 2. Block Diagram

15

Intel Desktop Board D2700MUD Technical Product Specification

1.2 Online Support

To find information about… Visit this World Wide Web site:

Intel Desktop B oard D2700MUD http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available config ur a tio ns for the Intel

Desktop Board D2700MUD
Supported processors http://processormatch.intel.com

Chipset informatio n http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-

Integration info r m ation http://www.intel.com/support/go/buildit

http://ark.intel.com

025414.htm

1.3 Processor

The board has a passively-cooled, soldered-down Dual-Core Intel Atom processor with
integrated graphics and integrated memory controller.

NOTE

The board is designed to be passively cooled in a properly ventilated chassis. Chassis
venting locations are recommended above the processor heatsink area for maximum
heat dissipation effectiveness.

For information about Refer to

Power supply c o nne c tors Section 2.2.2.3, page 51

16

Product Description

1.3.1 Intel® D2700 Graphics Subsystem

1.3.1.1 Intel® Graphics Media Accelerator 3650 Graphics

Controller (Intel® GMA)

The Intel® GMA 3650 graphics controller features the following:

• 640 MHz core frequency

• High quality texture engine
 DX9.3* and OpenGL* 3.0 compliant
 Hardware Pixel Shader 4.1
 Vertex Shader Model 4.1

• Video
 Blu-ray* 2.0
 H.264 & VC1 hardware decoder
 PAVP 1.1c
 HDCP1.3

• Display
 Supports VGA and DVI displays up to 1920 x 1200 at 60 Hz refresh (WUXGA)
 Supports LVDS displays up to 1 440 x 900 (single channel, 24 bpp)
 Dual independent display support

For information about Refer to

Obtaining graphics s oftware and utilities Section 1.2, page 16

17

Intel Desktop Board D2700MUD Technical Product Specification

1.4 System Memory

The board has two 204-pin DDR3 SO-DIMM sockets and supports the following
memory features:

• DDR3 SDRAM SO-DIMMs with gold-plated contacts

• Unbuffered, single-sided or double-sided DIMMs

• 4 GB maximum total system memory

• Minimum total system memory: 256 MB

• Non-ECC DIMMs

• Serial Presence Detect

• DDR3 1066 MHz, DDR3 1333 MHz, DDR3 1600 MHz SO-DIMMs

(DDR3 1333 MHz and DDR3 1600 MHz memory will run at 1066 MHz)

NOTES

• Due to passively-cooled thermal constraints, system memory must have an
operating temperature rating of 85

The board is des igned to be passively cooled in a properly ventilated chassis.
Chassis venting locations are recommended above the system memory area for
maximum heat dissipation effectiveness.

• If you are installing only one SO-DIMM, i t m ust be installed in the botto m socket
(SO-DIMM 1).

• To be fully compliant with all applicable DDR3 SDRAM memory specifications, the
board should be populated with SO-DIMMs that support the Serial Presence Detect
(SPD) data structure. T his allows the BIOS to read the SPD data and pro gram the
chipset to accurately configure memory settings for optimum performance. If non­SPD memory is installed, performance and relia bility ma y be impacted or the SO­DIMMs may not function under the determined frequency.

o

C.

Table 3 lists the supported SO-DIMM configurations.

Table 4. Supported Memory Configurations

Raw Card
Version

B

F

Notes:

1. System memory configurations are based on availab ility and are subject to c hange.

2. Support fo r one 4 GB SO-DIMM instal le d in s lot 1. Slot 0 must be lef t e m p ty.

SO-DIMM
Capacity

1 GB 1 Gb 128 M x 8 8
2 GB 2 Gb 256 M x 8 8
2 GB 1 Gb 128 M x 8 16
4 GB2 2 Gb 256 M x 8 16

DRAM Device
Technology

DRAM
Organization

1

# of DRAM
Devices

18

Product Description

Figure 3 illustrates the memory channel and SO-DIMM configuration.

Figure 3. Memory Channel and SO-DIMM Configuration

19

Intel Desktop Board D2700MUD Technical Product Specification

1.5 Intel® NM10 Express Chipset

The Intel NM10 Express Chipset provides interfaces to the processor and the USB,
SATA, LPC, LAN, PCI, and PCI Express interfaces. The Intel NM10 Express Chipset is a
centralized controller for the board’s I/O paths.

NOTE

The board is des igned to be passively cooled in a properly ventilated chassis. Chassis
venting locations are recommended above the processor heatsink area for maximum
heat dissipation effectiveness.

For information about Refer to

The Intel NM10 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2

1.5.1.1 Video Memory Allocation

Video memory is allocated from the total available system memory for the efficient
balancing of 2-D/3-D graphics performance and overall system performance. Dynamic
allocation of system memory to video memory is as follows:

• 256 MB total RAM results in 32 MB video RAM

• 512 MB total RAM results in 64 MB video RAM

• 1 GB total RAM results in 128 MB video RAM

• 2 GB total RAM results in 224 MB video RAM

1.5.1.2 Analog Display (VGA)

The VGA port supports analog displays. The maximum supported resolution is 1920 x
1200 (WUXGA) at a 60 Hz refresh rate. The VGA port is enabled for POST whenever a
monitor is attached, regardless of the DVI-D connector status.

1.5.1.3 Digital Visual Interface (DVI-D)

The DVI-D port supports only digital DVI displays. The maximum supported resolution
is 1920 x 1200 at 60 Hz refresh. The DVI-D port is compliant with the DVI 1.0
specification.

20

Product Description

1.5.1.4 Flat Panel Interface (LVDS)

The flat panel interface (LVDS ) supports the following:

• Panel support up to WXGA+ (1440 x 900)

• 25 MHz to 112 MHz single–channel; @18 or 24 bpp
 TFT panel type

• Panel fitting, panning, and center mode

• CPIS 1.5 compliant

• Spread spectrum clocking

• Panel power sequencing

• Integrated PWM interface for LCD backlight inverter control

• Flat panel brightness control via front panel button input as well as Windows* 7

“Screen brightness” adjustment slider

1.5.1.5 Configuration Modes

For monitors attached to the VGA port, video modes supporte d b y this board are based
on the Extended Display Identification Data (EDID) protocol.

Video mode configuration for LVDS displays is supported as follows:

• Automatic panel identification via Extended Display Identification Data (EDID) for
panels with onboard EDID support

• Panel selection from common predefined panel type s (without onboard EDID)

• Custom EDID pay load installation for ultimat e par ameter flexibility, allowing

custom definition of EDID d a ta on panels without onboard EDID

• In addition, BIOS setup pr ovides the following configuration parameters for internal

flat panel displays:

• Screen Brightness: allows the end user to set the screen brightness for the display
effective through the Power-On Self Test stage (such as while showing the splash
screen image and BIOS setup). Windows 7 will ignore this setting in favor of the
native “screen brightness” control provided by the operating sys tem.

• Brightness Steps: allows the system integrator to configure the brightness steps for
the operating system’s “screen brightness” control (such as the “Screen brightness”
adjustment slider under the Windows 7 “Power Options” control panel).

• Flat Panel Configuration Changes Lock: allows the system integrator to “lock”
critical settings of the LVDS configuration to avoid end users potentially rendering
the display unusable.

• Color Depth: allows the system integrator to select whether the panel is 24 bpp or
18 bpp.

• Inverter Frequency and Polarity: allows the system integrator to set the operating
frequency and polarity of the panel inverter board.

• Maximum and Minimum Inverter Current Limit (%): allows the system integrator to
set maximum PWM%, as appropriate, according to the power requirements of the
internal flat panel display and the selected inverter board.

• Panel Power Sequencing: allows the system integrator to adjust panel sequencing
parameters, if necessary.

21

Intel Desktop Board D2700MUD Technical Product Specification

NOTE

Support for flat panel display configuration complies with the following:

1. Internal flat panel display connec tivity is disabled (and all parameters hidden) by
default.

2. Internal flat panel display settings are not expose d through Intel
Toolkit or Intel

3. Internal flat panel display settings will not be overwri tten by loading BIOS setup
defaults.

4. Internal flat panel display settings will b e preserved across BIOS upda tes.

®

Integrator Assis tant GUIs.

®

Integrator

1.5.2 USB

The board provides up to seven USB 2.0 ports, supports UHCI and EHCI, and uses
UHCI- and EHCI-compatible drivers (four ports route d to the back panel and three
ports routed to two front panel USB 2.0 headers). One of the front panel USB headers
(brown-colored) supports an Intel Z-U130 USB Solid-State Drive or compatible device.

NOTE

Computer systems that have an unshielded cable attached to a USB por t may not meet
FCC Class B requirements, even if no device is attached to the cable. Use shielded
cable that meets the requirements for full-speed devices.

For information about Refer to

The location of the USB c onnectors on the back panel Figure 9, page 41
The location of the front panel USB headers Figure 11, page 43

1.5.3 SATA Support

The board provides two SATA interface connectors that support one device per
connector.

The board’s SATA controller offers independent SATA ports with a theoretical
maximum transfer rate of 3.0 Gb/s on each port. One device can be installed on each
port for a maximum of two SATA devices. A point-to-point interface is used for host to
device connections, unlike PATA which supports a master/slave configuration and two
devices on each channel.

For compatibility, the underlying SATA functionality is transpare nt to the operating
system. The SATA controller supports IDE and AHCI configuration and can operate in
both legacy and native modes. In legacy mode, standard ATA I/O and IRQ resources
are assigned (IRQ 14 and 15). In native mode, standard Conventional PCI bus
resource steering is used. Native mode is the preferred mode for configurations using
the Windows Vista* operating system.

22

Product Description

For information about Refer to

Obtaining AHCI driver Section 1.2, page 16
The location of the SA TA c onnectors Figure 11, page 43

1.6 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the
computer is not plugged into a wall socket, the battery has an estimated life of three
years. When the computer is plugged in, the standby current from the power supply
extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC
with 3.3 VSB applied.

NOTE

If the battery and AC po w er fail, custom defaults, if previously saved, will be loaded
into CMOS RAM at power-on.

When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.

1.7 Legacy I/O Controller

The Legacy I/O Controller provides the following features:

• Two serial port headers

• One parallel port connector with Enhanced Parallel Port (EPP) support

• Serial IRQ interface compatible with serialized IRQ support for Conventional PCI

bus systems

• PS/2-style keyboard and mouse ports

• Intelligent power management, including a programmable wake-up event interface

• Conventional PCI bus power manageme nt support

The BIOS Setup program provides configuration options for the Legacy I/O controller.

For information about Refer to

The location of the head e rs Figure 11, page 43
The serial port head e rs signal mapping Table 12, on page 45

23

Intel Desktop Board D2700MUD Technical Product Specification

1.8 LAN Subsystem

The LAN subsystem consists of the following:

• Intel NM10 Express Chipset

• Intel 82574L Gigabit Ethernet Controller for 10/100/1000 Mb/s Ethernet LAN

connectivity

• RJ-45 LAN connector w ith integrated status LEDs

Additional features of the LAN subsystem include:

• CSMA/CD protocol engine

• LAN connect interfac e that supports the Ethernet controller

• Conventional PCI bus power management
 Supports ACPI technology
 Supports LAN wake capabilities

1.8.1 LAN Subsystem Drivers

LAN drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining LAN drive rs Section 1.2, page 16

24

Product Description

1.8.2 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 4).

Figure 4. LAN Connector LED Locations

Table 4 describes the LED states w hen the board is power ed up and the Ethernet LAN
subsystem is opera ting.

Table 5. LAN Connector LED States

LED LED Color LED State Condition

Off LAN link is not estab lis he d.

Link/Activity (A) Green

Link Speed (B) Green/Yellow

On LAN link is established .
Blinking LAN ac tivity is occurring .
Off 10 Mb/s data ra te is se l e c te d o r negotiated.
Green 100 Mb/s data rate is s e le c te d or negotiated.
Yellow 1000 Mb/s data r ate is s e le c te d or negotiated.

25

Intel Desktop Board D2700MUD Technical Product Specification

1.9 Audio Subsystem

The board support s the Intel® High Definition Audio (Intel® HD Audio) subsystem. The
audio subsystem consists of the following:

• Intel NM10 Express Chipset

• Realtek ALC662 audio codec

The audio subsystem has the following features:

• Advanced jack sense for the back pa nel audio jacks that enables the audio codec to
recognize the device tha t is connected to an audio por t . The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.

• Front panel Intel HD Audio and AC ’97 audio support.

• 3-port analog audio out stack.

• Windows Vista Basic certification.

• A signal-to-noise (S/N) ratio of 95 dB.

Table 5 lists the supported functions of the front panel and back panel audio jacks.

Table 6. Audio Jack Support

Audio Jack

Front panel – Green Default
Front panel – Pink Default
Back panel – Blue Default
Back panel – Green (ctrl pa ne l) Default
Back panel – Pink Default

Micro­phone Headphones

Line Out

(Front Spks)

Line In

(Stereo 2) Mic-In

26

Product Description

1.9.1 Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining audio sof tw a r e and drivers Section 1.2, page 16

1.9.2 Audio Connectors and Headers

The board contains audio connectors and hea d ers on both the back panel and the
component side of the board. The component-side audio headers include front panel
audio (a 2 x 5-pin header that provides mic in and line out signals for front panel audio
connectors).

Item Description

A Line in
B Line out
C Mic in

Figure 5. Back Panel Audio Connectors

NOTE

The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.

For information about Refer to

The locations of the f ront panel audio header and S/PDIF audio header Figure 11, page 43
The signal names of the front panel audio head e r and S/PDIF head e r Section 2.2.2.1, page 45

27

Intel Desktop Board D2700MUD Technical Product Specification

1.10 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:

• Thermal monitoring

• Voltage monitoring

1.10.1 Hardware Monitoring

The hardware monitoring and fan control subsystem is based on the Winbond
W83627DHG-P device, which supports the following:

• System ambient temperature monitoring

• System fan speed monitoring

• Power monitoring of +12 V, +5 V, +5 Vstdby, +3.3 V, and +VCCP

• SMBus interface

28

1.10.2 Thermal Monitoring

Figure 6 shows the locations of the thermal sensors and fan header.

Product Description

Item Description

A Remote thermal sensor
B DTS, located on the pr ocessor die
C System fan header

Figure 6. Thermal Sensors and Fan Header

29