Intel D2550MUD2 Specification

Intel® Desktop Board D2550MUD2

Technical Product Specification

Part Number: G73745-001

The Intel® Desktop Board D2550MUD2 may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board D2550MUD2 Specification Update.

July 2012

Revision History

Revision Revision Histor y Date

-001 First release o f the Intel® Desktop Board D2550MUD2 Technical Product Specification.

This product spec ification applies to only the standard Intel® Desktop Board D2550MUD2 with BIOS identifier MUCDT10N.86A.

INFORMATION IN THIS DOCUMENT IS PROVIDED I N C ONNEC TION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELA TING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY O R WARRANTIES RELATI NG TO FI TNESS FOR A PARTIC U LA R PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, CO PY R IGHT OR OTHER IN TELLECTU A L PR O PERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY I N TEL, THE I NTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE O F THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJUR Y OR DEATH MAY OCCUR.

Intel Corporation may have patents o r pending patent applic a tio ns , trademarks, copyrights, or othe r intellectual proper ty rights that relate to the p resented subject matte r. The furnishing of d ocuments and other materials and inf ormation does not p rovide any license , e x press or implied , by estoppel or otherwise, to any such patents, trad e ma r ks, copyrights, o r other intellectual pr o perty rights.

Intel may make change s to specifications and p roduct descrip tions at any time, without notice. Designers must not rely on the absence o r characteristics o f any features or ins tr uc tions marked “reser v ed”

or “undefined.” Intel reserves the s e for future def inition and shall have no resp onsibility whatsoev e r for conflicts or inco mpatibilities arising from future changes to the m .

Desktop Boards may contain design defects or errors known as errata , w hic h ma y c aus e the p roduct

Intel to deviate from p ublished specifications. Current characte rized errata are available on request.

Contact your local Intel sales office o r your distributor to obtain the latest sp e c ifications befor e p lac i ng y our product order.

Intel, the Intel logo , a nd Intel Atom are trade m arks of Intel Co rporation in the U.S. and/or other countries. * Other names and brands may be claimed a s the property of others. Copyright © 2012, I nte l C orporation. All r ig hts reserved.

July 2012

Board Identification Information

Basic Desktop Board D2550MUD2 Identification Information

AA Revision BIOS Revision Notes

G73892-600 MUCDT10N.86A.0069 1,2 Notes:

1. The AA number is fo und on a small label on the comp o ne nt s ide of the board.

2. The Intel following comp onent:

Device Stepping S-Spec Numbers

CG82NM10 B0 SLGXX D2550 processor B3 SR0VY

NM10 Express Chipset and D2550 processor used on this AA revision cons is ts o f the

Errata

Current characterized errata, if any, are documented in a separate Specification Update. See http://developer.intel.com/products/desktop/motherboard/index.htm for the latest documentation.

iii

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

Chapter

Description

A description of the hardware used on the board

A map of the resources of the board

The features s upported by the BIOS Setup program

A description of the BIOS error messages, beep codes, and POST codes

Regulatory compliance and battery disposal information

Preface

This Technical Product Specification (TPS) specifies the board layo ut, components, connectors, power and environmental requirements, and the BIOS for the Intel Desktop Board D2550MUD2. It describes the standard product a nd a vailable manufacturing options .

Intended Audience

The TPS is intended to provide detailed, technical information about the Intel De sktop Board D2550MUD2 and its components to the vendors, syste m integrators, and other engineers and te chnicia ns who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Typographical Conventions

This section cont ains information about the conventions u sed in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attentio n to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

Other Common Notation

# Used after a signal na me to identify an active-low s ig na l (s uc h as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kb Kilob it (1024 bits) kb/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mb Megabit (1,048 ,576 bits) Mb/s Megabits per second TDP Therma l D e s ign Power xxh An address or d ata v al ue ending with a lowercase h ind i c ate s a he x a d e c im al value. x.x V Volts. Voltages are DC unless otherwise specified. * This symbol is used to indicate third-party brands and names that ar e the p roperty of thei r

respective owners.

Contents

1 Product Description

1.1 Overview ......................................................................................... 11

1.1.1 Feature Summary ................................................................. 11

1.1.2 Board Layout ........................................................................ 13

1.1.3 Block Diagram ...................................................................... 15

1.2 Online Support ................................................................................. 16

1.3 Processor ........................................................................................ 16

1.3.1 Intel

1.4 System Memory ............................................................................... 18

1.5 Intel

NM10 Express Chipset .............................................................. 20

1.5.2 USB ..................................................................................... 22

1.5.3 SATA Support ....................................................................... 22

1.6 Real-Time Clock Subsyst em ............................................................... 23

1.7 Legacy I/O Controller ........................................................................ 23

1.8 LAN Subsystem ................................................................................ 24

1.8.1 LAN Subsystem Drivers .......................................................... 24

1.8.2 RJ-45 LAN Connector with Integrated LEDs .............................. 25

1.9 Audio Subsystem .............................................................................. 26

1.9.1 Audio Subsystem Software ..................................................... 27

1.9.2 Audio Connectors and Headers ................................................ 27

1.10 Hardware Management Subsystem ..................................................... 28

1.10.1 Hardware Monitoring ............................................................. 28

1.10.2 Thermal Monitoring ............................................................... 29

1.11 Power Management .......................................................................... 30

1.11.1 ACPI .................................................................................... 30

1.11.2 Hardware Support ................................................................. 33

D2550 Graphics Subsystem ........................................... 17

2 Technical Reference

2.1 Memory Map .................................................................................... 37

2.1.1 Addressable Memory ............................................................. 37

2.2 Connectors and Headers .................................................................... 40

2.2.1 Back Panel ........................................................................... 41

2.2.2 Component-side Connectors and Headers................................. 43

2.3 BIOS Configuration Jumper Block ....................................................... 55

2.4 Mechanical Considerations ................................................................. 57

2.4.1 Form Factor .......................................................................... 57

2.5 Electrical Considerations .................................................................... 58

2.5.1 Fan Header Current Capability ................................................ 58

2.5.2 Add-in Board Considerations ................................................... 58

2.6 Thermal Considerations ..................................................................... 58

2.6.1 Passive Heatsink Design in a Passive System Environment ......... 60

vii

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

2.7 Power Consumption .......................................................................... 63

2.7.1 Minimum Load Configuration ................................................... 63

2.7.2 Maximum Load Configuration .................................................. 63

2.8 Reliability......................................................................................... 64

2.9 Environmental .................................................................................. 64

3 Overview of BIOS Features

3.1 Introduction ..................................................................................... 65

3.2 BIOS Flash Memory Organization ........................................................ 66

3.3 Resource Configuration ..................................................................... 66

3.3.1 PCI* Autoconfiguration .......................................................... 66

3.4 System Management BIOS (SMBIOS) ................................................. 67

3.5 Legacy USB Support ......................................................................... 68

3.6 BIOS Updates .................................................................................. 69

3.6.1 BIOS Recovery ...................................................................... 69

3.6.2 Custom Splash Screen ........................................................... 70

3.7 Boot Options .................................................................................... 70

3.7.1 Optical Drive Boot ................................................................. 70

3.7.2 Network Boot ........................................................................ 70

3.7.3 Booting Without Attached Devices ........................................... 71

3.7.4 Changing the Default Boot Device During POST ......................... 71

3.8 Adjusting Boot Speed ........................................................................ 71

3.8.1 Peripheral Selection and Configuration ..................................... 71

3.8.2 BIOS Boot Optimizations ........................................................ 72

3.9 BIOS Security Features ..................................................................... 73

4 Board Status and Error Messages

4.1 BIOS Beep Codes ............................................................................. 75

4.2 Front-panel Power LED Blink Codes ..................................................... 76

4.3 BIOS Error Messages ........................................................................ 76

4.4 Port 80h POST Codes ........................................................................ 77

5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance ...................................................................... 83

5.1.1 Safety Standards................................................................... 83

5.1.2 European Union Declaration of Conformity Statement ................ 84

5.1.3 Product Ecology Statements ................................................... 85

5.1.4 EMC Regulations ................................................................... 87

5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 90

5.1.6 Regulatory Compliance Marks (Board Level) ............................. 91

5.2 Battery Disposal Information .............................................................. 92

viii

Contents

Figures

1. Major Board Components .................................................................. 13

2. Block Diagram .................................................................................. 15

3. Memory Channel and SO-DIMM Configuration ...................................... 19

4. LAN Connector LED Locations ............................................................. 25

5. Back Panel Audio Connectors ............................................................. 27

6. Thermal Sensors and Fan Header ....................................................... 29

7. Location of the Standby Power Indicator LED ....................................... 35

8. Detailed System Memory Address Map ................................................ 38

9. Back Panel Connectors ...................................................................... 41

10. I/O Shield Reference Diagram ............................................................ 42

11. Component-side Connectors and Headers ............................................ 43

12. Connection Diagram for Front Panel Header ......................................... 52

13. Connection Diagram for Front Panel USB Header .................................. 54

14. Connection Diagram for Front Panel USB Header with Intel Z-USB

Solid-State Drive or Compatible Device Support ................................... 54

15. Location of the BIOS Configuration Jumper Block .................................. 55

16. Board Dimensions ............................................................................. 57

17. Localized High Temperature Zones ..................................................... 59

18. Fan Location Guide for Chassis Selection (Chassis Orientation is Not

Restricted) ....................................................................................... 62

Tables

1. Feature Summary ............................................................................. 11

2. Board Components Shown in Figure 1 ................................................. 14

3. Supported Memory Configurations ...................................................... 18

4. LAN Connector LED States ................................................................. 25

5. Audio Jack Support ........................................................................... 26

6. Effects of Pressing the Power Switch ................................................... 30

7. Power States and Targeted System Power ........................................... 31

8. Wake-up Devices and Events ............................................................. 32

9. System Memory Map ........................................................................ 39

10. Component-side Connectors and Headers Shown in Figure 11 ................ 44

11. TPM Header ..................................................................................... 45

12. Serial Port Headers ........................................................................... 45

13. LVDS Data Connector ........................................................................ 46

14. LVDS Panel Volt a g e Selection Jumper.................................................. 47

15. FPD Brightness Connector .................................................................. 47

16. LVDS Inverter Power Voltage Selection Jumper .................................... 47

17. System Fan Header .......................................................................... 48

18. SATA Connectors .............................................................................. 48

19. Front Panel Wireless Activity LED Header ............................................. 48

20. Front Panel Audio Header for Intel HD Audio ........................................ 48

21. Front Panel Audio Header for AC ’97 Audio ........................................... 48

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

22. Front Panel USB Header .................................................................... 49

23. Front Panel USB Header with Intel Z-U130 USB Solid-State Drive or

Compatible Device Support ................................................................ 49

24. Power Connector .............................................................................. 51

25. Front Panel Header ........................................................................... 52

26. States for a One-Color Power LED ....................................................... 53

27. BIOS Configuration Jumper Settings ................................................... 56

28. Fan Header Current Capability ............................................................ 58

29. Thermal Considerations for Components .............................................. 60

30. Minimum Load Configuration Current and Power Results ........................ 63

31. Maximum Load Configuration Current and Power Results ....................... 64

32. Intel Desktop Board D2550MUD2 Environmental Specifications .............. 64

33. BIOS Setup Program Menu Bar ........................................................... 66

34. BIOS Setup Program Function Keys .................................................... 66

35. AcceptableDrives/Media Ty p es for BIOS Recovery ................................. 69

36. Boot Device Menu Options ................................................................. 71

37. Supervisor and User Password Functions ............................................. 73

38. BIOS Beep Codes ............................................................................. 75

39. Front-panel Power LED Blink Codes ..................................................... 76

40. BIOS Error Messages ........................................................................ 76

41. Port 80h POST Code Ranges .............................................................. 77

42. Port 80h POST Codes ........................................................................ 78

43. Typical Port 80h POST Sequence ........................................................ 81

44. Safety Standards .............................................................................. 83

45. EMC Regulations ............................................................................... 87

46. ENERGY STAR Requirements .............................................................. 90

47. Regulatory Compliance Marks ............................................................ 91

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of Intel Desktop Board D2550MUD2.

Table 1. Feature Summary

Form Factor Mini-ITX (6.7 inches b y 6.7 inches [170 m illim e te r s by 170 millimeters])

compatible with micr o A T X

Processor Passively-cooled, soldered-down Dual-Core Intel® Atom™ process or with

integrated graphi c s and inte grated memory c o ntroller

Memory

Chipset Passively coole d , Intel® NM10 Express Chipset Audio Multi-streaming 5.1 (6-channel) audio subsystem s upport based on the Realtek*

Internal Graphics Onboard Intel® graphics subsy s te m w ith s up port for:

Legacy I/O Control Winbond W83627DHG-P based Legacy I/O controller f or hardware manag e m e nt,

Peripheral Interfaces

LAN Support 10/100/1000 Mb/s Ethernet LAN subsy s te m us ing an Intel® 82574L Gigabit

• Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Mod ul e (SO- DIMM) sockets

• Support for DDR3 1066 MHz, DDR3 1333 MHz, and DDR3 1600 MHz SO DIMMs

Note: DDR3 1333 MHz and DDR3 1600 MHz memory will run at 1066 MHz

• Support for up to 4 GB of system memory on a single SO-DIMM

ALC662 high definition audio codec

• Analog displays (VGA)

• Digital displays (DVI-D)

• Flat Panel displays (LVDS interface)

serial, parallel, and PS /2 * ports

• Seven USB 2.0 ports:

― Four back pane l p orts ― Two ports are im p le m e nte d w ith a d ual port internal header f or front panel

cabling

― One port is impleme nte d with an internal header (brown-colored) that

supports an Intel

• Two Serial ATA (SATA) 3.0 Gb/s conne c tors (supporting IDE and AHCI mode)

• One parallel port connector on the bac k panel

• Two serial port headers

• PS/2-style keyboard/ mouse ports

Ethernet Controller

Z-U130 USB Solid-State Drive or comp a tib le device

continued

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

Suspend to RAM sup port

One Conventional PC I bus connector (with riser card support for up to two PCI

Table 1. Feature Summary (continued)

BIOS

Instantly Available PC Technology

Expansion Capabilities

Hardware Monitor Subsystem

• Intel

• Support for Advanced Conf i g uration and Power I nte r face (ACPI), Plug and

•

• Wake on PCI, PCI Express*, PS/2 , s e rial, front panel, USB p orts, and LAN

•

• One PCI Express Full-/Half-Mini Card slot

• Hardware monitoring through the Windbond I/O controll e r

• Voltage sense to detect out of range p ower supply voltages

• Thermal sense to detect out of range thermal values

• One fan header

• One fan sense input used to monitor fan ac tiv ity

• Fan sp eed control

BIOS (resid e nt in the S PI Flash device)

Play, and SMBIOS

cards)

1.1.2 Board Layout

Figure 1 shows the location of the major components.

Product Description

Table 2 lists the components identified in Figure 1.

Figure 1. Major Board Components

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

Solid-State Drive o r compatible devi c e (b rown-colored))

Table 2. Board Components Shown in Figure 1

Item/callout from Figure 1

A B C D E F G H

J K L M N O P Q R Front Panel Wireless A c ti v ity LED header S T U V Serial port heade r, COMM 2

X Y Z

Description

LVDS inverter p a ne l v oltage selection jumpe r Back panel connectors S/PDIF header Standby power LED Processor core power connector (2 x 12) LVDS panel connector Intel Atom processor Trusted Platform Module (TPM) header SO-DIMM channel A socke t, DIMM 1 SO-DIMM channel A socke t, DIMM 0 Intel NM10 Expr e s s C hipset SATA connectors System fan header Front panel header BIOS setup co nf i g uration jumper block Battery Front panel USB 2 .0 header

Piezo/monotonic speaker header Conventional PCI b us add-in card connector PCI Express Full-/Half-Mini Card slot

FPD brightness c o nne c tor LVDS inverter power voltage se le c tion jumper Front panel audio he ad e r Front panel USB hea d e r that supports an Intel Z-U130 USB

Serial port heade r, COMM 1

1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas.

Product Description

Figure 2. Block Diagram

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

1.2 Online Support

To find information a bout… Visit this World Wide Web site:

Intel Desktop B oard D2550MUD2 http://www.intel.com/products/motherboard/index.htm Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support Available config ur a tio ns for the Intel

Desktop Board D2550MUD2 Supported processors http://processormatch.intel.com

Chipset informatio n http://www.intel.com/products/desktop/chipsets/index.htm BIOS and driver updates http://downloadcenter.intel.com Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-

Integration info r m ation http://www.intel.com/support/go/buildit

http://ark.intel.com

025414.htm

1.3 Processor

The board has a passively-cooled, soldered-down Dual-Core Intel Atom processor with integrated graphics and integrated memory controller.

NOTE

The board is des igned to be passively cooled in a properly ventilated chassis. Chassis venting locations are recommended above the processor heatsink area for maximum heat dissipation effectiveness.

For information about Refer to

Power supply c o nne c tors Section 2.2.2.3, page 51

Product Description

1.3.1 Intel® D2550 Graphics Subsystem

1.3.1.1 Intel® Graphics Media Accelerator 3650 Graphics Controller (Intel® GMA)

The Intel® GMA 3650 graphics controller features the following:

• 640 MHz core frequency

• High quality texture engine  DX9.3* and OpenGL* 3.0 compliant  Hardware Pixel Shader 4.1  Vertex Shader Model 4.1

• Video  Blu-ray* 2.0  H.264 & VC1 hardware decoder  PAVP 1.1c  HDCP1.3

• Display  Supports VGA and DVI displays up to 1920 x 1200 at 60 Hz refresh (WUXGA)  Supports LVDS displays up to 1 440 x 900 (single channel, 24 bpp)  Dual independent display support

For information about Refer to

Obtaining graphics s oftware and utilities Section 1.2, page 16

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

1.4 System Memory

The board has two 204-pin DDR3 SO-DIMM sockets and supports the following memory features:

• DDR3 SDRAM SO-DIMMs with gold-plated contacts

• Unbuffered, single-sided or double-sided DIMMs

• 4 GB maximum total system memory

• Minimum total system memory: 256 MB

• Non-ECC DIMMs

• Serial Presence Detect

• DDR3 1066 MHz, DDR3 1333 MHz, DDR3 1600 MHz SO-DIMMs

(DDR3 1333 MHz and DDR3 1600 MHz memory will run at 1066 MHz)

NOTES

• Due to passively-cooled thermal constraints, system memory must have an operating temperature rating of 85

The board is des igned to be passively cooled in a properly ventilated chassis. Chassis venting locations are recommended above the system memory area for maximum heat dissipation effectiveness.

• If you are installing only one SO-DIM M, it must be installed in the bottom socket (SO-DIMM 1).

• To be fully compliant with all applicable DDR3 SDRAM memory specifications, the board should be populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. T his allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If nonSPD memory is installed, performance and reliability may be impacted or the SODIMMs may not function under the determined frequency.

Table 3 lists the supported SO-DIMM configurations.

Table 3. Supported Memory Configurations

Raw Card Version

Notes:

1. System memory configurations are based on availab ility and are subject to c hange.

2. Support fo r one 4 GB SO-DIMM instal le d in s lot 1. Slot 0 must be lef t e m p ty.

SO-DIMM Capacity

1 GB 1 Gb 128 M x 8 8 2 GB 2 Gb 256 M x 8 8 2 GB 1 Gb 128 M x 8 16 4 GB2 2 Gb 256 M x 8 16

DRAM Device Technology

DRAM Organization

# of DRAM Devices

Product Description

Figure 3 illustrates the memory channel and SO-DIMM configuration.

Figure 3. Memory Channel and SO-DIMM Configuration

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

1.5 Intel® NM10 Express Chipset

The Intel NM10 Express Chipset provides interfaces to the processor and the USB, SATA, LPC, LAN, PCI, and PCI Express interfaces. The Intel NM10 Express Chipset is a centralized controller for the board’s I/O paths.

NOTE

The board is des igned to be passively cooled in a properly ventilated chassis. Chassis venting locations are recommended above the processor heatsink area for maximum heat dissipation effectiveness.

For information about Refer to

The Intel NM10 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm Resources used by the chipset Chapter 2

1.5.1.1 Video Memory Allocation

Video memory is allocated from the total available system memory for the efficient balancing of 2-D/3-D graphics performance and overall system performance. Dynamic allocation of system memory to video memory is as follows:

• 256 MB total RAM results in 32 MB video RAM

• 512 MB total RAM results in 64 MB video RAM

• 1 GB total RAM results in 128 MB video RAM

• 2 GB total RAM results in 224 MB video RAM

1.5.1.2 Analog Display (VGA)

The VGA port supports analog displays. The maximum supported r esolution is 1920 x 1200 (WUXGA) at a 60 Hz refresh rate. The VGA port is enabled for POST whenever a monitor is attached, regardless of the DVI-D connector status.

1.5.1.3 Digital Visual Interface (DVI-D)

The DVI-D port supports only digital DVI displays. The max imum supported resolution is 1920 x 1200 at 60 Hz refresh. The DVI-D port is compliant with the DVI 1.0 specification.

Product Description

1.5.1.4 Flat Panel Interface (LVDS)

The flat panel interface (LVDS ) supports the following:

• Panel support up to WXGA+ (1440 x 900)

• 25 MHz to 112 MHz single–channel; @18 or 24 bpp  TFT panel type

• Panel fitting, panning, and center mode

• CPIS 1.5 compliant

• Spread spectrum clocking

• Panel power sequencing

• Integrated PWM interface for LCD backlight inverter control

• Flat panel brightness control via front panel button input as well as Windows* 7

“Screen brightness” adjustment slider

1.5.1.5 Configuration Modes

For monitors attached to the VGA port, video modes supported b y this board are based on the Extended Display Identification Data (EDID) protocol.

Video mode configuration fo r LVDS displays is supported as follows:

• Automatic panel identification via Extended Display Identification Data (EDID) for panels with onboard EDID support

• Panel selection from common predefined panel types (without onboard EDID)

• Custom EDID payload installation for ultimate par ameter fle xibility, allowing

custom definition of EDID d a ta on panels without onboard EDID

• In addition, BIOS setup pr ovides the following configuration parameters for internal

flat panel displays:

• Screen Brightness: allows the end user to set the screen brightness for the display effective through the Power-On Self Test stage (such as while showing the splash screen image and BIOS setup). Windows 7 will ignore this setting in favor of the native “screen brightness” control provided by the operating system.

• Brightness Steps: allows the system integrator to configure the brightness steps fo r the operating system’s “screen brightness” control (such as the “ Screen brightne ss” adjustment slider under the Windows 7 “Power Options” control panel).

• Flat Panel Configuration Changes Lock: allows the system integrator to “lock” critical settings of the LVDS configuration to avoid end users potentially rendering the display unusable.

• Color Depth: allows the system integrator to select whether the panel is 24 bpp or 18 bpp.

• Inverter Frequency and Polarity: allows the system integrator to set the operating frequency and polarity of the panel inverter board.

• Maximum and Minimum Inverter Current Limit (%): allows the system integrator to set maximum PWM%, as appropriate, according to the power requirements of the internal flat panel display and the selected inverter board.

• Panel Power Sequencing: allows the system integrator to adjust panel sequencing parameters, if necessary.

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

NOTE

Support for flat panel display configuration complies with the following:

1. Internal fla t panel display connectiv i ty is disabled (and all parameters hidden) by default.

2. Internal fla t panel display settings ar e not exposed through Intel Toolkit or Intel

3. Internal fla t panel display settings will not be overwritten by loading BIOS setup defaults.

4. Internal fla t panel display settings will be preserved across BIOS updates.

Integrator Assis tant GUIs.

Integrator

1.5.2 USB

The board provides up to seven USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and EHCI-compatible drivers (four ports route d to the back panel and three ports routed to two front panel USB 2.0 headers). One of the front panel USB headers (brown-colored) supports an Intel Z-U130 USB Solid-State Drive or compatible device.

NOTE

Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices.

For information about Refer to

The location of the USB c onnectors on the back panel Figure 9, page 41 The location of the front panel USB headers Figure 11, page 43

1.5.3 SATA Support

The board provides two SATA interface connectors that support one device per connector.

The board’s SATA controller offers independent SATA ports with a theoretical maximum transfer rate of 3.0 Gb/s on each port. One device can be installed on each port for a maximum of two SATA devices. A point-to-point interface is used for host to device connections, unlike PATA which supports a master/slave configuration and two devices on each channel.

For compatibility, the underlying SATA functionality is transpare nt to the operating system. The SATA controller supports IDE and AHCI configuration and can operate in both legacy and native modes. In legacy mode, standard ATA I/O and IRQ resources are assigned (IRQ 14 a nd 1 5 ). In native mode, standard Conventional PC I bus resource steering is used. Native mode is the preferred mode for configurations using the Windows Vista* operating system.

Product Description

For information about Refer to

Obtaining AHCI driver Section 1.2, page 16 The location of the SA TA c onnectors Figure 11, page 43

1.6 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.

NOTE

If the battery and AC po w er fail, custom defaults, if previously saved, will be loaded into CMOS RAM at power-on.

When the voltage drops b elow a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.

1.7 Legacy I/O Controller

The Legacy I/O Controller provides the following features:

• Two serial port headers

• One parallel port connector with Enhanced Parallel Port (EPP) support

• Serial IRQ interface compatible with serialized IRQ support for Conventional PCI

bus systems

• PS/2-style keyboard and mouse ports

• Intelligent power management, including a programmable wake-up event interface

• Conventional PCI bus power manageme nt support

The BIOS Setup program provides configuration options for the Legacy I/O controller.

For information about Refer to

The location of the head e rs Figure 11, page 43 The serial port head e rs signal mapping Table 12, on page 45

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

1.8 LAN Subsystem

The LAN subsystem consists of the following:

• Intel NM10 Express Chipset

• Intel 82574L Gigabit Ethernet Controller for 10/100/1000 Mb/s Ethernet LAN

connectivity

• RJ-45 LAN connector w ith integrated status LEDs

Additional features of the LAN subsystem include:

• CSMA/CD protocol engine

• LAN connect interfac e that supports the Ethernet controller

• Conventional PCI bus power management  Supports ACPI technology  Supports LAN w ake capabilities

1.8.1 LAN Subsystem Drivers

LAN drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining LAN drive rs Section 1.2, page 16

Product Description

1.8.2 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 4).

Figure 4. LAN Connector LED Locations

Table 4 describes the LED states when the board is powered up and the Ethernet LAN subsystem is opera ting.

Table 4. LAN Connector LED States

LED LED C olor L ED State Condition

Off LAN link is not estab lis he d.

Link/Activity (A) Green

Link Speed (B) Green/Yellow

On LAN link is established . Blinking LAN ac tivity is occurring . Off 10 Mb/s data rate is s e le c te d or negotiated. Green 100 Mb/s data rate is s e le c te d or negotiated. Yellow 1000 Mb/s data r ate is s e le c te d or negotiated.

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

1.9 Audio Subsystem

The board support s the Intel® High Definition Audio (Intel® HD Audio) subsystem. The audio subsystem consists of the following:

• Intel NM10 Express Chipset

• Realtek ALC662 audio codec

The audio subsystem has the following features:

• Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port. The back panel audio jacks are capable of retasking according to the user’s definition, or can be automatically switched depending on the recognized device type.

• Front panel Intel HD Audio and AC ’97 audio support.

• 3-port analog audio out stack.

• Windows Vista Basic certification.

• A signal-to-noise (S/N) ratio of 95 dB.

Table 5 lists the supported functions of the front panel and back panel audio jacks.

Table 5. Audio Jack Support

Audio Jack

Front panel – Green Default Front panel – Pink Default Back panel – Blue Default Back panel – Green (ctrl pa ne l) Default Back panel – Pink Default

Microphone Headphones

Line Out

(Front Spks)

Line In

(Stereo 2) Mic-In

Product Description

1.9.1 Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining audio sof tw a r e and drivers Section 1.2, page 16

1.9.2 Audio Connectors and Headers

The board contains audio connectors and headers on both the back pa nel and the component side of the board. The component-side audio headers include front panel audio (a 2 x 5-pin header that provides mic in and line out signals for front panel audio connectors).

Item Description

A Line in B Line out C Mic in

Figure 5. Back Panel Audio Connectors

NOTE

The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.

For information about Refer to

The locations of the f ront panel audio header and S/PDIF audio header Figure 11, page 43 The signal names of the f ront panel audio header and S/PDIF head e r Section 2.2.2.1, page 45

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

1.10 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following:

• Thermal monitoring

• Voltage monitoring

1.10.1 Hardware Monitoring

The hardware monitoring and fan control subsystem is base d on the Winbond W83627DHG-P device, which supports the following:

• System ambient temperature monitoring

• System fan speed monitoring

• Power monitoring of +12 V, +5 V, +5 Vstdby, +3.3 V, and +VCCP

• SMBus interface

1.10.2 Thermal Monitoring

Figure 6 shows the locations of the thermal sensors and fan header.

Product Description

Item Description

A Remote thermal sensor B DTS, located on the pr ocessor die C System fan header

Figure 6. Thermal Sensors and Fan Header

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

1.11 Power Management

Power management is implemented at several levels, including:

• Software support through Advanced Configuration and P ower Interface (ACPI)

• Hardware support:  Power connector  Fan header  LAN wake capabilities  Instantly Available PC technology  Wake from USB  Wake from PS/2 devices  Power M a na gement Event signal (PME#) wake-up support  WAKE# signal wake-up support

1.11.1 ACPI

ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with the board requires an operating system that provides full ACPI support. ACPI features include:

• Plug and Play (including bus and device enumeration)

• Power management control of individual devices, add-in boards (some add-in

boards may require an ACPI-aware driver), video displays, and hard disk drives

• Methods for achieving less than 15-watt system operation in the pow er-on/standby sleeping state

• A Soft-off feature that enables the operating system to power-off the computer

• Support for multiple wake-up events (see Table 8 on page 32)

• Support for a front panel power and sleep mode switch

Table 6 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system.

Table 6. Effects of Pressing the Power Switch

If the system i s in this state…

Off (ACPI G2/G5 – Soft off)

On (ACPI G0 – wo rking state)

Sleep (ACPI G1 – slee ping state)

…and the power switch is pressed for

Less than four seconds Power-on

Less than four seconds Power-off

More than four sec o nds Fail safe power-off

Less than four seconds Wake-up

More than four sec o nds Power-off

…the system enters this state

(ACPI G0 – wo rking state)

(ACPI G2/G5 – Soft off)

(ACPI G0 – wo rking state)

(ACPI G2/G5 – Soft off)

Product Description

1.11.1.1 System States and Power State s

Under ACPI, the operating system directs all system and device p ower state transitions. The opera ting sy stem puts devices in and out of low-power states base d on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.

Table 7 lists the power states supported by the board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states.

Table 7. Power States and Targeted System Power

Global States

G0 – working state

G1 – sleeping state

G2/S5 S5 – Soft off.

G3 – mechanical off. AC power is disconnected from the computer.

Notes:

1. Total system powe r is dependent on the system configuratio n, inc l ud ing add-in boards and p e ripherals powered by the system’s power supply.

2. Dependent on the stand b y power consumption of wake-up devices used in the system.

Sleeping States

S0 – working C0 – working D0 – working

S3 – Suspend to RAM. Context saved to RAM.

S4 – Suspend to disk. Context saved to disk.

Context not saved . Cold boot is required.

No power to the system.

Processor States

No power D3 – no power

No power D3 – no power for

Device States

state.

except for wake-up logic.

wake-up logic, except when provided by battery or external source.

Targeted System Power

Full power > 30 W

Power < 5 W

No power to the s y s te m . Service can be performed safely.

(Note 1)

(Note 2)

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

Note 1)

(Note 1)

(Notes 1 and 3)

1.11.1.2 Wake-up Devices and Events

Table 8 lists the devices or specific events that can wake the computer from specific states.

Table 8. Wake-up Devices and Events

Devices/events that wake up the system… …from this sleep state

Power switch S3, S4, S5 RTC alarm S3, S4, S5 LAN S3, S4, S5 USB S3 WAKE# S3, S4, S5 PME# signal S3, S4, S5 Serial port S3 PS/2 devices S3, S4, S5

Notes:

1. S4 implies oper a ting s ystem support only.

2. USB ports must be tur ne d off during S4/S5 states.

3. PS/2 wake fro m S 5 should have a selection in the BIOS to enable wake from a combination key (Alt + Print Screen) or the keyboard power button.

(Note 2)

(

NOTE

The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripher a l s must fully support ACPI wake events.

Product Description

1.11.2 Hardware Support

The board provides several power management hardware features, including:

• Power connector

• Fan header

• LAN wake capabilities

• Instantly Available PC technology

• Wake from USB

• Wake from PS/2 devices

• Power Manageme nt Event signal (PME#) wake-up support

• WAKE# signal wake-up support

• +5V Standby Power Indicator LED

LAN wake capabilities and Instantly Available PC technology require pow er from the +5 V standby line.

NOTE

The use of Wake from USB technologies from an ACPI state requires an operating system that provides full ACPI support.

1.11.2.1 Fan Header

The function/operation of the fan header is as follows:

• The fan is on when the board is in the S0 state.

• The fan is off when the board is off or in the S3, S4, or S5 state.

• The system fan header supports closed-loop fan control that can adjust the fan

speed and is wired to a fa n tachometer input.

• The fan header supports +12 V, 3-wire fans at 1 A maximum.

For information about Refer to

The locations of the f an he a d e r and thermal sensors Figure 6, page 29 The signal names of the system fan header Table 17, page 46

1.11.2.2 LAN Wake Capabilities

LAN wake capabilities enable remote wake-up of the computer through a network. The LAN subsystem network adapter monitors network traffic at the Media Independent Interface. The board supports LAN wake capabilities with ACPI in the following ways:

• By Ping

• By Magic Packet

Upon detecting the configured wake packet type, the LAN subsystem asserts a wakeup signal that powers up the computer.

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

1.11.2.3 Instantly Available PC Technology

Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the hard drive(s) and fan will power off, the front panel LED w ill blink). When signaled by a wake-up device or event, the system quickly returns to its last known state. Table 8 on page 32 lists the devices and events that can wake the computer from the S3 state.

The board support s the PCI Bus Power Management Interface Specification. Add-in boards that also suppor t this s pecification can participate in power manage ment and can be used to wake the computer.

1.11.2.4 Wake from USB

USB bus activity wakes the computer from an ACPI S3 state.

NOTE

Wake from USB requires the use of a USB peripheral that supports Wake from U SB and support in the operating system.

1.11.2.5 PME# Signal Wake-up Support

When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state (with Wake on PME enabled in the BIOS).

1.11.2.6 Wake from PS/2 Devices

PS/2 keyboard activity wakes the computer from an ACPI S3, S4, or S5 state. However, when the computer is in an ACPI S4 or S5 state, the only PS/2 activity that will wake the computer is the Alt + Print Screen or the Power Key available only on some keyboards.

1.11.2.7 WAKE# Signal Wake-up Support

When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state.

1.11.2.8 Wake from Serial Port

Serial Port activity wakes the computer from an ACPI S3 state.

Product Description

1.11.2.9 +5 V Standby Power Indicator LED

The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 7 shows the location of the standby power indicator LED.

CAUTION

If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices.

Figure 7. Location of the Standby Power Indicator LED

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

2 Technical Reference

2.1 Memory Map

2.1.1 Addressable Memory

The board utilizes 4 GB of addressable system memory. Typically the address space that is allocated for Conventional PCI bus add-in cards, PCI Express configuration space, BIOS (SPI Flash), and chipset overhead resides abo ve the top of DRAM (total system memory). On a system that has 4 GB of system memory installed, it is not possible to use all of the installed memor y due to system address space being allocated for other system critical functions. T h ese functions include the following:

• BIOS/ SPI Flash (2 MB)

• Local APIC (19 MB)

• Direct Media Interface (40 MB)

• Internal graphics address registers

• Memory-mapped I/O that is dynamically allocated for Conv entional PCI add-in

cards

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 8 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.

Figure 8. Detailed System Memory Address Map

Technical Reference

Table 9 lists the system memory map.

Table 9. System Memory Map

Address Range (decimal)

1024 K - 4194304 K 100000 - FFFFFFFF 4095 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K E0000 - EFFFF 64 KB Reserved 800 K - 896 K C8000 - DFFFF 96 KB Potential available hig h DOS

640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS 639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by

512 K - 639 K 80000 - 9FBFF 127 KB Extend e d conventional memor y 0 K - 512 K 00000 - 7FFFF 512 KB Conventional memo ry

Address Range (hex)

Size

Description

memory (open to the PC I bus). Dependent on vid e o adapter used.

memory manager software)

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

2.2 Connectors and Headers

CAUTION

Only the following connectors/headers have overcurrent protection: Back panel and front panel USB, VGA, serial, and PS/2.

The other internal connectors/headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors/headers to power devices external to the computer’s chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves.

NOTE

This section describes the board’s connectors and headers. The connectors and headers can be divided into these groups:

• Back panel I/O connectors (see page 41)

• Component-side connectors and headers (see page 43)

2.2.1 Back Panel

2.2.1.1 Back Panel Connectors

Figure 9 shows the location of the back panel connectors.

Item Description

A DVI-D port B Parallel port C VGA port D PS/2 keyboard/mouse port E USB ports F LAN port G USB ports H Line in I Line out J Mic in

Technical Reference

Figure 9. Back Panel Connectors

NOTE

The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

2.2.1.2 I/O Shield

The I/O shield provided with the board allows access to all back panel connectors and is compatible with standard mini-ITX and microATX chassis. As an added benefit for system configurations with wireless PCI Express Mini Card solutions, the I/O shield also provides pre-cut holes for user installation of up to two external wireless antennas. Figure 10 shows an I/O shield reference diagram.

Figure 10. I/O Shield Reference Diagram

Technical Reference

2.2.2 Component-side Connectors and Headers

Figure 11 shows the locations of the component-side connectors and headers.

Figure 11. Component-side Connectors and Headers

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

Table 10 lists the component-side connectors and headers identified in Figure 11.

Table 10. Component-side Connectors and Headers Shown in Figure 11

Item/callout from Figure 11 Description

B C D

F G H

L M N Conventional PCI bus add-in card connector O Serial port header, CO MM 2

P Q R

LVDS inverter p a ne l v oltage selection jumpe r S/PDIF header Processor core power connector (2 x 12) LVDS panel connector TPM header SATA connector SATA connector System fan header Front panel header Front panel USB 2 .0 header Front panel wire le s s ac tivity LED header Piezo/monotonic spe a k e r header PCI Express Full-/Half-Mini Card slot

FPD brightness c o nne c tor LVDS inverter p ower voltage se le c tion jumper Front panel audio he ad e r Front panel USB hea d e r that supports an Intel Z-U130 USB Solid-State Drive or

compatible devic e (b rown-colored) Serial port heade r, COMM 1

Technical Reference

2.2.2.1 Signal Tables for the Connectors and Headers

Table 11. TPM Header

Pin Signal Name Pin Signal Name

1 CK_33M_TPM_DIP 2 Ground 3 LFRAME# 4 Key (no pin) 5 PLTRST# 6 No connec ti o n 7 LAD3 8 LAD2 9 +3.3 V 10 LAD1 11 LAD0 12 Ground 13 No connection 14 No connection 15 +3.3 VSB 16 TPM_SERRQ 17 Ground 18 TPM_CLKRUN# 19 LPCPD# 20 No connection

Table 12. Serial Port Headers

Pin Signal N a me Pin Signal Name

1 DCD (Data Carrier Detect) 2 RXD# (Receive Data) 3 TXD# (Transmit Data) 4 DTR (Data Terminal Ready) 5 Ground 6 DSR (Data Set Ready) 7 RTS (R e q ue s t T o S e nd) 8 CTS (Clear To Send) 9 RI (Ring Indicator) 10 Key (no pin)

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

Name

Description

Name

Description

negative

positive

ROM

signaling

positive

negative

positive

GND

Ground

GND

Ground

positive

negative

positive

power output

output

power output

output

Table 13. LVDS Data Connector

Signal

1 LA_CLKN LV DS Channel A diff

clock output -

3 LA_CLKP LVDS C hanne l A diff

clock output -

5 EDID_3.3V Power for EDID

7 LA_DATAN0 LVDS Channel A diff

data output – negative

9 LA_DATAP0 LVDS Channel A d iff

data output –

11 LA_DATAN1 LVDS Channel A diff

data output –

13 LA_DATAP1 LVDS Channel A diff

data output –

17 LA_DATAN2 LVDS Channel A diff

data output – negative

19 LA_DATAP2 LVDS Channel A diff

data output –

2 NC

4 NC

6 EDID_GND Ground for EDID

8 NC

10 NC

12 NC

14 NC

18 NC

20 NC

21 LA_DATAN3 LVDS Channel A diff

data output –

23 LA_DATAP3 LVDS Channel A diff

data output –

25 3.3 V/5 V/12 V Selectable LCD

27 3.3 V/5 V/12 V Selectable LCD

29 EDID_CLK EDID/DDC clock

signal

22 GND Ground

24 GND Ground

26 3.3 V/5 V/12 V Selectable LCD power

28 3.3 V/5 V/12 V Selectable LCD power

30 EDID_DATA EDID/DDC data signal

Table 14. LVDS Panel Voltage Selection Jumper

Voltage Jumper Setting Configuration

3.3 V 2 and 4

5 V 6 and 4

12 V 3 and 4

Jumper position for 3.3 V (default)

Jumper position for 5 V

Jumper position for 12 V

Technical Reference

Table 15. FPD Brightness Connector

Pin Signal Name Description

1 BKLT_EN Backli g ht e nable 2 BKLT_PWM Backlight control 3 BKLT_PWR (5V/12V) Backlight inverte r power 4 BKLT_PWR (5V/12V) Backlight inverte r power 5 BKLT_GND/Brightness_GND Gr o und (shared) 6 BKLT_GND/Brightness_GND Gr o und (shared) 7 Brightness_Up Panel brightness increas e 8 Brightness_Down Panel brightness decrease

Table 16. LVDS Inverter Power Voltage Selection Jumper

Voltage Jumper Setting Configuration

5 V 1 and 2

12 V 3 and 2

Jumper position for 5 V (default)

Jumper position for 12 V

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

Table 17. System Fan Header

Pin Signal Name

1 Ground 2 +12 V (PWM controlled p uls e s) 3 Tach

Table 18. SATA Connectors

Pin Signal Name

1 Ground 2 TXP 3 TXN 4 Ground 5 RXN 6 RXP 7 Ground

Table 19. Front Panel Wireless Activity LED Header

Pin Signal Name

1 Ground 2 MINICARD_WLAN#

Table 20. Front Panel Audio Header for Intel HD Audio

Pin Signal N a me Pin Signal Name

1 [Port 1 ] Le ft channel 2 Ground 3 [Port 1 ] R i g ht c hanne l 4 PR ES EN C E# (Dongle prese nt) 5 [Port 2 ] R i g ht c hanne l 6 [Po r t 1] SENSE_RETURN 7 SENSE_ S E ND (Jack detection) 8 Key (no pin) 9 [Port 2 ] Le ft channel 10 [Port 2] SENSE_RETURN

Table 21. Front Panel Audio Header for AC ’97 Audio

Pin Signal Name Pin Signal Name

1 MIC 2 AUD_GND 3 MIC_BIAS 4 AUD_GND 5 FP_OUT_R 6 FP_RETURN_R 7 AUD_5V 8 KEY (no pin) 9 FP_OUT_L 10 FP_RETURN_L

Technical Reference

Table 22. Front Panel USB Header

Pin Signal Name Pin Signal Name

1 +5 VDC 2 +5 VDC 3 D- 4 D5 D+ 6 D+ 7 Ground 8 Ground 9 KEY (no pin) 10 No Co nne ct

Table 23. Front Panel USB Header with Intel Z-U130 USB Solid-State Drive or

Compatible Device Support

Pin Signal Name Pin Signal Name

1 +5 VDC 2 NC 3 D- 4 NC 5 D+ 6 NC 7 Ground 8 NC 9 KEY (no pin) 10 LED#

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

2.2.2.2 Add-in Card Connectors

The board has the following add-in card connectors:

• PCI Express Full-/Half-Mini Card slot

• Conventional PCI bus connector (with riser card support for up to two PCI cards)

Note the following considerations for the Conventional PCI bus connector:

• The Conventional PCI bus connector is bus master capable.

• SMBus signals are routed to the Conventional PCI bus connector. This enables

Conventional PCI bus add-in boards with SMBus support to access sensor data on the board. The specific SMBus signals are as follows:

 The SMBus clock line is connected to pin A40.  The SMBus data line is connected to pin A41.

The Conventional PCI bus connector also supports single-slot and dual-slot riser cards for use of up to two bus master PCI expansion cards. In order to support two PCI bus master expansion cards, the riser card must support the following PCI signal routing:

• Pin A11: additional 33 MHz PCI clock

• Pin B10: additional PCI Request signal (i.e., PREQ#2)

• Pin B14: additional PCI Grant signal (i.e., GNT#2)

NOTE

BIOS IRQ programming for the second PCI slot on PCI riser card:

• ID_SEL: AD20 (Device 4)

• Second PCI slot INT Mapping:  INT A# (A6)  INT B# (B7)  INT C# (A7)  INT D# (B8)

NOTE

The Conventional PCI slot on this board does not support the PCI PHOLD1 function. Due to this limitation (errata), certain PCI cards may experience performance or detection issues when DMA transfer is used as part of the PCI card operation.



INT D# of mother board PCI slot.



INT A# of mother b oard PCI slot.



INT B# of mother board PCI slot.



INT C# of mother board PCI slot.

PHOLD is the signal required to hold the bus during DM A transfers.

Technical Reference

2.2.2.3 Power Supply Connector

The board has a 2 x 12 power connector (see Table 24). This board requires a TFX12V or SFX12V power supply.

Table 24. Power Connector

Pin Signal N a me Pin Signal Name

1 +3.3 V 13 +3.3 V 2 +3.3 V 14 -12 V 3 Ground 15 Ground 4 +5 V 16 PS-ON# (power supply remote on/o ff) 5 Ground 17 Ground 6 +5 V 18 Ground 7 Ground 19 Ground 8 PWRGD (Power Goo d ) 20 No connect 9 +5 V (Standby) 21 +5 V 10 +12 V 22 +5 V 11 +12 V 23 +5 V 12 No connect 24 Ground

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

2.2.2.4 Front Panel Header

This section describes the functions of the front panel header. Table 25 lists the signal names of the front panel header. Figure 12 is a connection diagram for the front panel header.

Table 25. Front Panel Header

Pin Signal

Hard Drive Activity LED Power LED

1 HD_PWR Out Hard d is k LED

3 HDA# Out Hard disk active

5 Ground Ground 6 FPBUT_IN In Power switc h 7 FP_RESET# In Reset switch 8 Ground Ground

9 +5 V Power 10 N/C Not connected

In/ Out Description

pull-up to +5 V

LED

Pin Signal

2 HDR_BLNK_GRN Out Front panel gree n

4 HDR_BLNK_YEL Out Front panel yellow

In/ Out Description

Reset Switch On/Off Switch

Power Not Connected

LED

Figure 12. Connection Diagram for Front Panel Header

Technical Reference

2.2.2.4.1 Hard Drive Activity LED Header

Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive.

2.2.2.4.2 Reset Switch Header

Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the s w itch is closed, the board resets and runs the POST.

2.2.2.4.3 Power/Sleep LED Header

Pins 2 and 4 can be connected to a single- or dual-color LED. Table 26 shows the default states for a single-color LED.

Table 26. States for a One-Color Power LED

LED State Description

Off Po w e r off/hibernate (S 5/S4) Blinking Sleeping (S3 ) Steady Green Running/Away (S0)

NOTE

The LED states listed in Table 26 are default settings that can be modified through BIOS setup. Systems built with a dual-color front panel power LED can also use alternate color state options.

2.2.2.4.4 Power Switch Header

Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for a t least 50 ms to signal the power supply circuitry to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At lea st two seconds must pass before the power supply circuitry will recognize another on/off signal.

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

2.2.2.5 Front Panel USB Headers

Figure 13 and Figure 14 are connection diagrams for the front panel USB headers.

NOTE

• The +5 VDC power on the USB headers is fused.

• Use only a front panel USB connector that conforms to the USB 2.0 specification for

high-speed USB devices.

Figure 13. Connection Diagram for Front Panel USB Header

Figure 14. Connection Diagram for Front Panel USB Header

with Intel Z-USB Solid-State Drive or Compatible Device Support

Technical Reference

2.3 BIOS Configuration Jumper Block

CAUTION

Do not move the jumper with the power on. Al ways turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged.

Figure 15 shows the location of the jumper block. The jumper determines the BIOS Setup program’s mode. Table 27 lists the jumper settings for the three modes: normal, configure, and recovery.

Figure 15. Location of the BIOS Configuration Jumper Block

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

Table 27. BIOS Configuration Jumper Settings

Function/Mode

Normal 1-2 The BIOS uses current co nfiguration informa tio n and passwords

Configure 2-3 After the POST runs, Setup runs automatically. The maintenance

Recovery None The BIOS attempts to recov e r the BIOS conf ig uration. See

Jumper Setting

Configuration

for booting.

menu is displayed.

Section 3.7 for more information on BIOS recovery.

Technical Reference

2.4 Mechanical Considerations

2.4.1 Form Factor

The board is designed to fit into a mini-ITX or microATX form-factor chassis. Figure 16 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 6.7 inches by 6.7 inches [170 millimeters by 170 millimeters]. Location of the I/ O connectors and mounting holes a re in compliance with the microATX specification.

Figure 16. Board Dimensions

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

2.5 Electrical Considerations

2.5.1 Fan Header Current Capability

Table 28 lists the current capability of the fan header.

Table 28. Fan Header Current Capability

Fan Header Maximum Avai lable Current

System fan 1.5 A

2.5.2 Add-in Board Considerations

The board is designed to provide 2 A (average) of +5 V current for the Conventional PCI slot. The total +5 V current draw for the Conventional PCI expansion s lot (total load) must not exceed 2 A.

2.6 Thermal Considerations

CAUTION

A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is a requirement. Whenever possible, use of a processor heat sink that provides omni-directional airflow to maintain required airflow across the processor voltage regulator area is recommended.

CAUTION

Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel Desktop Boards please refer to the following website:

http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm

All responsibility for determining the adequacy of any thermal or system design remains solely with the system integrator. Intel makes no warranties or representations that merely following the instructions presented in this doc ument will result in a system with adequate thermal performance.

CAUTION

Ensure that the ambient temperature does not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.9.

Technical Reference

Item

Description

CAUTION

Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area (shown in Figure 17) can reach a temperature of up to 85 an open chassis.

Figure 17 shows the locations of the localized high temperature zones.

C in

Figure 17. Localized High Temperature Zones

Table 29 provides maximum case temperatures for the board components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board.

A Processor voltage regulator area B Intel Atom processor C

Intel NM10 Express Chipset

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

For information about

Refer to

Table 29. Thermal Considerations for Components

Component Maximum Case Temperature

Intel Atom processor 100 oC Processor voltage regulator area 85 oC Intel NM10 Express Chipset 113 oC Memory SO-DIMM 85 oC

Processor datasheets and specification updates Section 1.2, page 16

2.6.1 Passive Heatsink Design in a Passive System Environment

This section highlights important guidelines and related thermal boundary conditions for passive heatsink design in a passive system environment. Passive heatsink describes a thermal solution without a fan attached. Passive system environment describes a chassis with either a power supply fan or a built-in system fan.

This information sho uld be used in conjunction with the Thermal and Mechanical Design Guide (TMDG) published for the Intel Atom processor D2000 series. The TMDG contains detailed package information and thermal mechanical specifications for the processors. The TMDG also contains information on how to enable a completely fanless design provided the right usage scenario and boundary conditions are observed for optimal thermal design. While the TMSDG has a section on thermal design for passive system environments (p a g e 32), the information in this section can also be used to complement the TMDG.

2.6.1.1 Definition of Terms

Term Description

TA The measured ambie nt te mperature locally surrounding the pro c e s s or. The ambient

TJ Processor junction temperature.

Junction-to-ambient thermal characterization parameter (psi). A measure of thermal solution

TIM Thermal Interface Material : the thermally conducti ve c ompound between the heatsink and the

TDP Thermal Design Power: a power dissipation target based on worst-case applic ations. Thermal

TA external The measured external ambient temperature surrounding the chassis. The external am bi ent

temperature should be measured just ups tr e a m o f a passive heatsink.

performance using total package power. Defined as (T Note: Heat source must be specified for Ψ measurements.

processor die surface. T hi s material fills t he ai r gaps and voi ds, and enhances the transfer of the heat from the processor die s urface to the heatsink.

solutions should be designed t o di ssipate the thermal design power.

temperature should be measured just upstream of t he chassis inlet vent.

- TA)/TDP.

2.6.1.2 Thermal Specifications Guideline

Terms Requirements

TA ≤ 50 °C TJ ≤ 100 °C

ΨJA ≤ 3.85 °C/W

TIM Honeywell PCM45F TDP 10 W TA external ≤ 35 °C

2.6.1.3 Heatsink Design Guideline

Maximum heatsink size Heatsink mass ≤ 63.6 grams Retention type Spring load e d fasteners Heatsink preload 13.2 lb

Note: Refers to the he ats ink installed on the board.

(Note)

87 x 52 x 29 mm

Technical Reference

2.6.1.4 Chassis Design Guideline

The pin fin heatsink design used on this board w ill be able to dissipate up to 10 W of processor power in most of the passively enabled system chassis. This board is targeted for 3-7 liters volumetric or larger, desktop/tower orientation, mini-ITX and microATX chassis with a system fan. The recommended fan type is an exhaust fan.

For best thermal performance, it is recommended that the system fan provide reasonable airflow directly over all the major components on the board. The pin fin heatsink is designed to have the best thermal performance when airflow direction is parallel to the heatsink fins.

The processor on the board will generate the highest amount of heat, lea d ing to high ambient temperature within the chassis. The system fan should be located near the board region in order to effectively regulate airflow (see Figure 18). A system fan located further away from the board region, i.e., at the optical disk drive or hard disk drive region, will be less effective in controlling the local ambient temperature. Regardless of where the system fan is located, the maximum local ambient temperature as defined by T also provide adequate openings for airflow to pass through. The recommended freearea-ratio of chassis vents should be equal to or greater than 0.53. By using the reference pin fin heatsink, most chassis with a system fan enabled should have local ambient temperature safely below the 50 °C limit.

A should be capped at 50 °C. Chassis inlet vents should

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

Figure 18. Fan Location Guide for Chassis Selection

(Chassis Orientation is Not Restricted)

For all chassis configurations, the heatsink performance parameter, Ψ

should be less

than 3.85 °C/W. The detail thermal measurement metrology is described in the TMSDG. For chas sis that fail to meet the thermal specifications guideline highlighted above, an actively cooled heatsink solution should be used.

Technical Reference

2.7 Power Consumption

Power measurements were performed to determine bare minimum and likely maximum power requirements from the board, as well as attached devices, in order to facilitate power supply rating estimates for specific system configurations.

2.7.1 Minimum Load Configuration

Minimum load refers to the power demand placed on the power supply when using a bare system configuration with minimal power requirement conditions. Minimum load configuration tes t results are shown in Table 30. The test configuration was def ined a s follows:

• 2 GB DDR3/1066 MHz SO-DIMM

• USB keyboard and mouse

• LAN linked at 1000 Mb/s

• DOS booted via network (PXE); system at idle

• All on board peripherals enabled (serial, parallel, audio, …)

Table 30. Minimum Load Configuration Current and Power Results

Output Voltage Minimum Load

3.3 V 5 V 12 V -12 V 5 VSB

0.67 A 1.91 A 0.77 A 0.1 A 0.17 A

2.7.2 Maximum Load Configuration

Maximum load refers to the incremental power demands placed on the power supply, augmenting the minimum load configuration into a fully-featured system that stresses power consumption from all subsystems. Maximum load configuration test results are shown in Table 31. The test configuration was defined as follows:

• 4 GB DDR3/1066MHz SO-DIMM

• 14.1-inch LCD via LVDS

• SATA DVD-R/W  Load: DVD playback

• 3.5-inch SATA hard disk drive, running Microsoft Windows Vista Home Basic  Load: continuous read/write benchmark

• 2.5-inch SATA hard disk drive  Load: continuous read/write benchmark

• Intel Z-U130 USB Solid-State Drive or compatible device on the USB flash drive

header

 Load: continuous read/write benchmark

• Wireless card on PCI Express Full-/Half-Mini Card slot, connected via 802.11n

protocol

 Load: continuous read/write benchmark on remote share

• Riser card on conventional PCI slot, populated with PCI L AN card, running file

transfer through local network to SATA hard drive

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

Parameter

Specification

Temperature

Non-Operating

Operating

0 °C to +50 °C

Shock

Unpackaged

50 g trapezoidal waveform

Velocity change of 170 inches/sec o nd²

Product weight (po und s )

Free fall (inches)

Velocity change (inche s /s ²)

<20

167 21-40

152

81-100

118

Vibration

Unpackaged

5 Hz to 20 Hz: 0.01 g ² Hz s lo ping up to 0.02 g² Hz

Packaged

10 Hz to 40 Hz: 0.015 g² Hz (flat)

40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz

• USB keyboard and mouse

• Back and fro n t panel host-powered USB devices (other than keyboard and mouse)  Load: continuous read/write activity on external drive/peripheral

• LAN linked at 1000 Mb/s  Load: continuous read/write benchmark on remote share

• All on board peripherals enabled (serial, parallel, audio, …)

Table 31. Maximum Load Configuration Current and Power Results

Output Voltage Maximum Load

3.3 V 5 V 12 V -12 V 5 VSB 5 A 7.83 A 2.34 A 0.1 A 0.68 A

2.8 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Method I Case 1 50% electrical stress, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements.

The MTBF data was calculated from predicted data at 55 ºC. The Intel Desktop Board D2550MUD2 has an MTBF of at least 293,676 hours.

2.9 Environmental

Table 32 lists the environmental specifications for the board.

Table 32. Intel Desktop Board D2550MUD2 Environmental Specifications

-20 °C to +70 °C

Packaged Half sine 2 millisecond

41-80 24 136

20 Hz to 500 Hz: 0.02 g² Hz (flat)

Maintenance

Main

Advanced

Security

Power

Boot

Exit

3 Overview of BIOS Features

3.1 Introduction

The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configura t io n ut ility, LAN EEPROM information, and P lug and Play support.

The BIOS displays a message during POST identifying the type o f BIOS and a revision code. The initial production BIOSs a re identified as MUCDT10N.86A.

The BIOS Setup program can be used to view and change the BIOS s ettings for the computer. The BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST) memory test begins and before the oper a ting system boot begins. The men u bar is shown below .

NOTE

The maintenance menu is displayed only when the board is in configure mode. Section 2.3 on page 55 shows how to put the board in configure mode.

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

Table 33 lists the BIOS Setup program menu features.

Table 33. BIOS Setup Program Menu Bar

Maintenance Main Advanced Security Power Boot Exit

Clears passwords and displays processor information

Displays processor and memory configuration

Configures advanced features available through the chipset

Sets passwords and security features

Configures power management features and power states options

Table 34 lists the function keys available for menu screens.

Table 34. BIOS Setup Program Function Keys

BIOS Setup Program Function Key

<←> or <→> <↑> or <↓> <Enter> Executes command or selects the submenu <F9> Load the default conf iguration values for the current menu <F10> Save the current va lue s and e xits the BIOS Setup p rogram <Esc> Exits the menu

Description

Selects a differ e nt me nu s c reen (Moves the curs o r left or right) Selects an item (Move s the c ursor up or do w n)

Selects boot options

Saves or discards changes to Setup program options

3.2 BIOS Flash Memory Organization

The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 16 Mb (2048 KB) flash memory device.

3.3 Resource Configuration

3.3.1 PCI* Autoconfiguration

The BIOS can automatically configure PCI devices. PCI devices may be onboard or add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having to configure the system. When a user turns on the system after adding a PCI card, the BIOS automatically configures interrupts, the I/O space, and other system resources. Any interrupts set to Available in Setup are considered to be available for use by the add-in card.

Overview of BIOS Features

3.4 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network.

The main component of SMB IOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types , capabilities, operational status, and installation dates for system components. The MIF database defines the data and provides the method for accessing this information. The BIOS enables applications such as third-party management software to use SMBIOS. The BIOS stores and reports the following SMBIOS information:

• BIOS data, such as the BIOS revision level

• Fixed-system data, such as peripherals, serial numbers, and asset tags

• Resource data, such as memory size, cache size, and processor speed

• Dynamic data, such as event detection and error logging

Non-Plug and Play operating systems re quire an additional interface for obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such operating systems. Using this support, an SMBIOS service-level application running on a non-Plug and Play operating system can obtain the SMBIOS information. Additional board informat io n can be found in the BIOS under the Additional Informatio n header under the Main BIOS page.

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

3.5 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled.

Legacy USB support operates as follows:

1. When you apply power to the computer, legacy support is disabled.

2. POST begins.

3. Legacy US B support is enabled by the BIOS allowing you to use a USB keyb oard to enter and configure the BIOS Setup program and the maintenance menu.

4. POST completes.

5. The ope rating system loads. While the operating system is loading, USB keyboards and mice are recognized and may be used to configure the operating system. (Keyboards and mice ar e not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup program.)

6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are recognized by the operating system, and Legacy USB support from the BIOS is no longer used.

7. Additional USB legacy feature options can be accessed by using Intel Inte grator Toolkit.

To install an operating system that suppo rts USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system’s installa tion instruct ions.

Overview of BIOS Features

3.6 BIOS Updates

The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site:

• Intel

• Intel® Flash Memory Update Utility, which requires booting from DOS. Using this

• Intel® F7 switch allows a user to select where the BIOS .bio file is located and

Both utilities verify that the updated BIOS m a tches the target system to prevent accidentally installing an incompatible BIOS.

NOTE

Review the instructions distributed with the upgrade utility before attempting a BIOS update.

For information about Refer to

BIOS update utilities http://downloadcenter.intel.com

Express BIOS Update utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS c an be updated from a file on a hard disk, a USB drive (a flash drive or a USB drive), or an optical drive.

utility, the BIOS can be updated from a file on a hard disk, a USB dr ive (a flash drive or a USB drive), or an optical drive.

perform the update from that location/device. Similar to performing a BIOS Recovery without removing the BIOS configuration jumper.

3.6.1 BIOS Recovery

It is u nlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS could be damaged. Table 35 lists the drives and media types that can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootable.

Table 35. Acceptable Drives/Media Types for BIOS Recovery

Media Type

Optical drive c o nne c te d to the SATA interfac e Yes USB removable drive (a USB Flash Drive, for example) Yes USB diskette drive (with a 1.44 MB diskette) No USB hard disk drive Yes

NOTE: Suppor ted file systems for BIO S r ecov er y:

For information about Refer to

BIOS update instructions http://www.intel.com/support/motherboards/desktop/sb

(Note)

Can be used for BIOS recovery?

• NTFS (sparse, compressed, or encrypted files are not supported)

• FAT32

• FAT16

• FAT12

• ISO 9660

/CS-022312.htm

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

3.6.2 Custom Splash Screen

During POST, an Intel® splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel available from Intel can be used to create a custom splash screen.

NOTE

If you add a custom spl a sh screen, it will share space with the Intel branded logo.

For information about

Intel Integrato r Toolkit http://developer.intel.com/design/motherbd/software/itk/

Refer to

Integrator’s Toolkit that is

3.7 Boot Options

In the BIOS Setup program, the user can choose to boot from a hard drive , optical drive, removable drive, or the network. The default setting is for the optical drive to be the first boot device, the hard drive second, removable drive third, and the network fourth.

3.7.1 Optical Drive Boot

Booting from the optical drive is supp orted in compliance to the El Torito bootable CD-ROM format specification. U nder the Boot menu in the BIOS Setup program, the optical drive is listed as a boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD in the optical drive, the system will attempt to boot from the next defined drive.

3.7.2 Network Boot

The network can be selected as a boot device. This selection allows booting from the onboard LAN or a network add-in card with a remote boot ROM installed.

Pressing the <F12> key during POST automatically forces booting from the LAN. To use this key during POST, the User Access Level in the BIOS Setup program's Security menu must be set to Full.

Overview of BIOS Features

3.7.3 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present:

• Video adapter

• Keyboard

• Mouse

3.7.4 Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a boot device menu to be displayed. This menu displays the list of available boot devices (as set in the BIOS setup program’s Boot Device Priority submenu). Table 36 lists the boot device menu options.

Table 36. Boot Device Menu Options

Boot Device Menu F unc t ion Keys Description

<↑> or <↓> <Enter> Exits the menu, saves change s , and boots from the selected

<Esc> Exits the menu without saving c hang e s

Selects a default boot device

device

3.8 Adjusting Boot Speed

These factors affect system boot speed:

• Selecting and configuring peripherals properly

• Optimized BIOS boot parameters

• Enabling the new Fast Boot fea ture

3.8.1 Peripheral Selection and Configuration

The following techniques help improve sy stem boot speed:

• Choose a hard drive with parameters such as “power-up to data ready” in less than eight seconds that minimizes hard drive startup delays.

• Select a CD-ROM drive with a fast initialization rate . This rate can influence POST execution time.

• Eliminate unnecessary add-in adapter features, such as logo displays, screen repaints, or mode changes in POST. These features may add time to the boot process.

• Try different monitors. Some monit ors initialize a nd communicate with the BIOS more quickly, which enables the system to boot more quickly.

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

3.8.2 BIOS Boot Optimizations

Use of the following BIOS Setup program settings reduces the POST execution time.

• In the Boot Menu, set the hard disk drive as the first boot device. As a result, the POST does not first seek a diskette drive, which saves about one second from the POST execution time.

• In the Peripheral Configuration submenu, disable the LAN device if it will not be used. This can reduce up to four seconds of option ROM boot time.

NOTE

It is possible to optimize the boot process to the point whe re the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen.

This boot time may be so fast that some drives might be not be initialized at all. If this condition should occur, it is possible to introduce a programmable delay ranging from zero to 30 seconds by 5 second increments (using the Hard Disk Pre-Delay feature of the Advanced Menu in the Drive Configuration Submenu of the BIOS Setup program).

Overview of BIOS Features

3.9 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions:

• The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode.

• The user password gives restricted access to view and change Setup options in the BIOS Setup program. This is the user mode.

• If only the supervisor password is set, pressing the <Enter> key at the password prompt of the BIOS Setup program allows the user restricted a ccess to Setup.

• If both the supervisor and user passwords are set, users can enter either the supervisor password or the user password to access Setup. Users have access to Setup respective to which password is entered.

• Setting the user password restricts who can boot the computer. The password prompt will be displayed before the computer is booted. If only the supervisor password is set, the computer boots without asking for a password. If both passwords are set, the user can enter either password to boot the computer.

• For enhanced security, use different passwords for the supervisor and user passwords.

• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 16 characters in length.

Table 37 shows the effects of setting the supervisor password and user password. This table is for reference only and is not displayed on the screen.

Table 37. Supervisor and User Password Functions

Password Set

Neither Can change all

Supervisor only

User only N/A Can change all

Supervisor and user set

Note: If no passwor d is s e t, any user can change all Setup options.

Supervisor Mode

options Can change all

options

Can change all options

(Note)

User Mode

Can change all options

Can change a limited number of options

options Can change a

limited number of options

(Note)

Setup Options

None None None

Supervisor Password Supervisor None

Enter Password Clear User Password

Supervisor Password Enter Password

Password to Enter Setup

User User

Supervisor or user

Password During Boot

Supervisor or user

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

(Note)

4 Board Status and Error Messages

4.1 BIOS Beep Codes

The BIOS uses audible beep codes to signal status messages and error messages indicating recoverable errors that occur during the POST. The beep codes are listed in Table 38. These beep codes can be heard through a speaker attached to the board’s line out audio jack (see Figure 5, B on page 27).

Table 38. BIOS Beep Codes

Type Pattern Frequency

BIOS update in progress None Video error

Memory error On-off (1.0 second each) three time s , the n

Thermal trip warning Alternate high and low beeps (1 .0 s e c ond each)

Note: Disabled pe r default BIOS s e tup o ption.

On-off (1.0 second ea c h) tw o tim e s , the n

2.5-second pause (o ff), entire pattern r e p e ats (beeps and pause) o nc e and the BIOS will continue to boot.

2.5-second pause (o ff), entire pattern r e p e ats (beeps and pause) until the s y s te m is p o wered off.

for eight beeps, followed by system shut down.

932 Hz When no VGA option R O M is found.

932 Hz

High beep 2000 Hz Low beep 1500 Hz

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

(Note)

4.2 Front-panel Power LED Blink Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 39).

Table 39. Front-panel Power LED Blink Codes

Type Pattern Note

BIOS update in progress Off when the update b e g ins , the n on for

0.5 seconds, then off for 0.5 seconds. The pattern repeats until the B IOS update is complete.

Video error

Memory error On-off (1.0 s e c ond each) three times, then

Thermal trip warning Each beep will be accompanied b y the following

Note: Disabled pe r default BIOS s e tup o ption.

On-off (1.0 second ea c h) tw o tim e s , the n

2.5-second pause (o ff), entire pattern r e p e ats (blink and pause) until the sy s te m is p owered off.

2.5-second pause (o ff), entire pattern r e p e ats (blinks and pause) until the system is powered off.

blink pattern: .25 se c onds on, .25 seconds off, .25 seconds on, .25 seconds off. This will result in a total of 16 blinks.

When no VGA option R O M is found.

4.3 BIOS Error Messages

Whenever a recoverable error occurs during POST, the BIOS displays an error message describing the problem. Table 40 lists the error messages and provides a brief description of each.

Table 40. BIOS Error Messages

Error Message Explanation

CMOS Battery Low The battery may be losing power. Re place the battery so o n. CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have

been corrupted. Run Setup to reset values.

Memory Size Decreased Memory size has decreased since the last boot. If no memory

was removed, then memory may be bad.

No Boot Device A vailable System did no t find a device to bo ot.

Board Status and Error Messages

4.4 Port 80h POST Codes

During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the P OST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred.

Displaying the POST codes requires a PCI bus add-in card, often called a POST card. The POST card ca n d ecode the port and display the contents on a medium such as a seven-segment display.

NOTE

The POST card must be installed in the PCI bus connector.

The following tables provide information ab out the POST codes generated by the BIOS:

• Table 41 lists the Port 80h POST code ranges

• Table 42 lists the Port 80h POST codes themselves

• Table 43 lists the Port 80h POST sequence

NOTE

In the tables listed above, all POST codes and range values are listed in hexadecimal.

Table 41. Port 80h POST Code Ranges

Range Subsystem

0x00 – 0x05 Entering SX state s S 0 to S5. 0x10, 0x20, 0x30 Resuming from SX s tate s (0x10 – 0x20 – S2, 0x30 – S3 , etc .) 0x11 – 0x1F PEI phase pre MRC execution 0x21 – 0x29 MRC memory detection 0x2A – 0x2F PEI pha s e p o s t MRC execution 0x31 – 0x35 Recovery 0x36 – 0x3F Platform DXE driver 0x41 – 0x4F CPU Initialization (PEI, D X E, S MM) 0x50 – 0x5F I/O Buses: PCI, USB, ATA etc . 0 x5F is an unrecov e r a b le e rror. Start with PCI. 0x60 – 0x6F BDS 0x70 – 0x7F Output devices: All output consoles . 0x80 – 0x8F For future use 0x90 – 0x9F Input devices: Keyboard/Mouse. 0xA0 – 0xAF For future use 0xB0 – 0xBF Boot Devices: Includes fix e d m e d ia and removable media. Not that critical since

consoles should be up at this point. 0xC0 – 0xCF For future use 0xD0 – 0xDF For future use

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

Table 42. Port 80h POST Codes

Port 80 Code Progress Code Enumeration

ACPI S States 0x00,0x01,0x02,0x03,0x04,0x05 Entering S0, S 2, S3, S4, or S5 s tate 0x10,0x20,0x30 Resuming from S2, S 3, S4, or S5 state

PEI before MRC PEI Platform driver 0x11 Set boot mode, GPIO init 0x12 Early chipset register programming 0x13 Basic chipset initialization 0x14 LAN init 0x15 Exit early platform init driv e r PEI SMBUS 0x16 SMBUS driver init 0x17 Entry to S MB U S e xecute read/write 0x18 Exit SMBUS e x e c ute read/write Memory 0x21 MRC entr y point 0x24 Detecting presence of memory DIMMs 0x25 Override Detected DIMM settings 0x27 Config uring memory. 0x28 Testing mem o ry PEIMs/Recovery 0x31 Crisis R e c overy has initiated 0x33 Loading recovery capsule 0x34 Start r e c overy capsule / v a lid c apsule is found CPU Initialization CPU PEI Phase 0x41 Begin CPU PEI Init 0x42 XMM instruction enabling 0x43 End CPU PEI Init CPU PEI SMM Phase 0x44 Begin CPU S MM Init smm relocate base s 0x45 Smm relocate bases for APs 0x46 End CPU SMM Init

continued

Board Status and Error Messages

Table 42. Port 80h POST Codes (continued)

Port 80 Code P rogress Code Enumeration

CPU DXE Phase 0x47 CPU DXE Phase be gin 0x48 Refresh memory space attributes according to MTRRs 0x49 Load the microcode if needed 0x4A Initialize strings to HII database 0x4B Initialize MP support 0x4C CPU DXE Phase End CPU DXE SMM Phase 0x4D CPU DXE S MM Phase begin 0x4E Relocate SM bases for all APs 0x4F CPU DXE SMM Phase end I/O BUSES 0x50 Enumerating PCI b us e s 0x51 Allocating re s o urces to PCI bus 0x52 Hot Plug PCI controller initialization USB 0x58 Resetting USB bus 0x59 Reserved for USB ATA/ATAPI/SATA 0x5A Resetting PATA/SATA bus and a ll d e vices 0x5B Reserved for ATA BDS 0x60 BDS driver e ntry point initialize 0x61 BDS service routine entry point (can be called multiple times) 0x62 BDS Step2 0x63 BDS Step3 0x64 BDS Step4 0x65 BDS Step5 0x66 BDS Step6 0x67 BDS Step7 0x68 BDS Step8 0x69 BDS Step9 0x6A BDS Step10 0x6B BDS Step11 0x6C BDS Step12 0x6D BDS Step13 0x6E BDS Step14 0x6F BDS return to DXE co re (should not get her e )

continued

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

Table 42. Port 80h POST Codes (continued)

Port 80 Code P rogress Code Enumeration

Keyboard (PS/2 or USB) 0x90 Resetting ke yboard 0x91 Disabling the k e y board 0x92 Detecting the presence of the keyboard 0x93 Enabling the key b oard 0x94 Clearing ke y board input buffe r 0x95 Instructing keyboard controller to run Self Test (PS/2 o nl y ) Mouse (PS/2 or USB) 0x98 Resetting mous e 0x99 Detecting mous e 0x9A Detecting presence of mouse 0x9B Enabling mouse Fixed Media 0xB0 Resetting fixed me dia 0xB1 Disabling fixed me dia

0xB2 Detecting presenc e of a fixed media (IDE hard drive detection etc.) 0xB3 Enabling/configuring a f i x e d media Removable Media 0xB8 Resetting remova b le m e d ia 0xB9 Disabling remova b le me dia 0xBA Detecting presence of a removable media (IDE, CDROM detection

etc.) 0xBC Enabling/configuring a re m o vable media DXE Core 0xE4 Entered DXE phase BDS 0xE7 Waiting for user input 0xE8 Checking password 0xE9 Entering BIOS setup 0xEB Calling Legacy O p ti o n ROMs Runtime Phase/EFI OS Boot 0xF8 EFI boot service ExitBootServices ( ) has been called 0xF9 EFI runtime ser v ic e S e tVirtualAddressMap ( ) has been called

Table 43. Typical Port 80h POST Sequence

POST Code Description

24 Detecting presence of memory DIMMs 27 Configuring memory 28 T e s ting me m o ry 33 Loading recovery capsule E4 Entered DXE p has e 50 Enum e rating PCI buses 51 Allocating resour c e d to PCI bus 92 D etecting the presence of the keyboard 90 Resetting keybo ard 94 Clearing keybo ard input buffer 95 Ke yboard Self Test EB Calling V i d e o BIOS 58 Resetting USB bus 5A Resetting PA TA /SATA bus and all devic e s 92 D etecting the presence of the keyboard 90 Resetting keybo ard 94 Clearing keybo ard input buffer 5A Resetting PA TA /SATA bus and all devic e s 28 T e s ting me m o ry 90 Resetting keybo ard 94 Clearing keybo ard input buffer E7 Waiting for use r input 00 Ready to boot A3 Legacy USB driver disconnect

Board Status and Error Messages

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

5 Regulatory Compliance and Battery

Disposal Information

5.1 Regulatory Compliance

This section cont ains the following regulatory compliance information for Intel Desktop Board D2550MUD2:

• Safety standards

• European Union Declaration of Conformity statement

• Product Ecology statements

• Electromagnetic Compatibility (EMC) standards

• Product certification mark ings

5.1.1 Safety Standards

Intel Desktop Board D2550MUD2 complies with the safety standards stated in Table 44 when correctly installed in a compatible host system.

Table 44. Safety Standards

Standard Title

CSA/UL 60950-1 Information Tec hno l o gy Equipment – Safety - Part 1: General

Requirements (USA and Canada)

EN 60950-1 Information Technology Eq ui p me nt – Safety - Part 1: Ge ne ral

Requirements (Euro pean Union)

IEC 60950-1 Information Techno logy Equipment – Safety - Part 1: Gener al

Requirements (I nte r na tio na l)

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

5.1.2 European Union Declaration of Conformity Statement

We, Intel Corporation, declare under our sole responsibility that the product Intel® Desktop Board D2550MUD2 is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC (ROHS Directive).

The product is properly CE marked demonstrating this conformity and is for distribution within all member states of the EU with no restrictions.

This product follows the provisions of the European Directives 2004/108/EC, 2006/95/EC, and 2002/95/EC.

Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC, 2006/95/EC a 2002/95/EC.

Dansk Dette produkt er i overensstemmelse med det europæiske direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC.

Dutch Dit product is in navolging van de bepalingen van Europees Directief 2004/108/EC, 2006/95/EC & 2002/95/EC.

Eesti Antud toode vastab Euroopa direk tiivides 2004/108/EC, ja 2006/95/EC ja 2002/95/EC kehtestatud nõuetele.

Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC määräyksiä.

Français Ce produit est conforme aux exigences de la Directive Européenne 2004/108/EC, 2006/95/EC & 2002/95/EC.

Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie 2004/108/EC, 2006/95/EC & 2002/95/EC.

Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών

2004/108/EC, 2006/95/EC και 2002/95/EC. Magyar E termék megfelel a 2004/108/EC, 2006/95/EC és 2002/95/EC Európai

Irányelv előírásainak. Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer

2004/108/EC, 2006/95/EC, & 2002/95/EC. Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC,

2006/95/EC & 2002/95/EC. Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC, 2006/95/EC un

2002/95/EC noteikumiem. Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC, 2006/95/EC, ir

2002/95/EC nuostatas. Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej

2004/108/EC, 2006/95/EC u 2002/95/EC. Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet

2004/108/EC, 2006/95/EC & 2002/95/EC. Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej

2004/108/EC, 206/95/EC i 2002/95/EC.

Regulatory Complia nc e and Battery Disposal Information

中文

Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC, 2006/95/EC & 2002/95/EC.

Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC, 2006/95/EC & 2002/95/EC.

Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 2004/108/EC, 2006/95/EC a 2002/95/EC.

Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC, 2006/95/EC in 2002/95/EC.

Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC.

Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC, 2006/95/EC ve 2002/95/EC yönergelerine uyar.

5.1.3 Product Ecology Statements

The following information is provided to address worldwide product ecology conce rns and regulations.

5.1.3.1 Disposal Considerations

This product contains the fo llowing mater ials that may be regulated upon disposal: lead solder on the printed wiring board assembly.

5.1.3.2 Recycling Considerations

As part of its commitment to environmental responsibility, Intel has implemented the Intel Product Recycling Program to allow retail consumers of Intel’s branded products to return used products to selected locations for proper recycling.

Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the details of this program, including the scope of covered products, available locations, shipping instructions, terms and conditions, e tc.

作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program （英特尔产品

回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作恰当的重复使用处理。

请参考http://www.intel.com/intel/other/ehs/product_ecology 了解此计划的详情，包括涉及

产品之范围、回收地点、运送指导、条款和条件等。

Deutsch

Als Teil von Intels Engagement für den Umweltschutz hat das Unternehme n das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben.

Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisung en, Bedingungen usw., finden Sie auf der

http://www.intel.com/intel/other/ehs/product_ecology

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

Español Como parte de su compromiso de responsabilidad medioambiental, Intel ha

implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado.

Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles del programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de envío, términos y condiciones, etc.

Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis

en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à des adresses spécifiées.

Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en savoir plus sur ce programme, à savoir les produits concernés, les adresses disponibles, les instructions d'expé d ition, les conditions générales, etc.

日本語インテルでは、環境保護活動の一環として、使い終えたインテルブランド製品を指定の場所へ返送していただき、リ

サイクルを適切に行えるよう、インテル製品リサイクルプログラムを発足させました。

対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、

http://www.intel.com/intel/other/ehs/product_ecology （英語）をご覧ください。

Malay

Sebagai sebahagian daripada komitmennya te rhadap tanggungjawab persekitaran, Intel telah melaksa nakan Program Kitar Semula Produk unt uk membenarkan pengguna-pengguna runcit produk jenama Intel memulangkan produk t erguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.

Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk m endapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syar a t, dsb.

Portuguese Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o

Programa de Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel usados para locais selecionados, onde esses produtos são reciclados de maneira adequada.

Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Inglês) para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os locais disponíveis, as instruções de envio, os termos e condições, etc.

Regulatory Complia nc e and Battery Disposal Information

Russian

В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Progr am) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной утилизации.

Пожалуйста, обратитесь на веб-сайт

http://www.intel.com/intel/other/ehs/product_ecology за информацией об этой

программе, принимаемых продуктах, местах приема, инструкциях об отправке, положениях и условиях и т.д.

Türkçe

Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya koymuştur.

Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen

http://www.intel.com/intel/other/ehs/product_ecology

Web sayfasına gidin.

5.1.4 EMC Regulations

Intel Desktop Board D2550MUD2 complies with the EMC regulations stated in Table 45 when correctly installed in a compatible host sy stem.

Table 45. EMC Regulations

Regulation Title

FCC 47 CFR Part 15, Subpart B

ICES-003 Interference-Causing Equipment S ta nd ard, Digital Appara tus . (C anada) EN55022 Limits and me thods of measureme nt of Radio Inter ference Characteristics

EN55024 Inf o rmation Technology Equipment – Immunity Characteristics Limits and

EN55022 Austra lian C ommunications Authority, S ta nd ard for Electro m agnetic

CISPR 22 Limits and methods of me as urement of Radio D i s tur bance Characteristic s

CISPR 24 Information Tec hno l o gy Equipment – Immunity Characteristics – Limits

VCCI V-3, V-4 Voluntary Control f o r Interferenc e b y Information Tec hnology Equipment.

KN-22, KN-24 Korean Communications C ommission – Framework Act on

CNS 13438 Bureau of Standards, Metr ology, and Insp e c tio n (Ta iw an)

Title 47 of the Code of Federal R e gulations, Part 15, Subp a r t B , Radio Frequency Devices. (USA)

of Information Technology Equip me nt. (European Union)

methods of measurement. (European Union)

Compatibility. (Austr ali a and N e w Z e al and )

of Information Technology Equip me nt. (International)

and Methods of Measurement. (International)

(Japan)

Telecommunications and Radio Waves Act (So uth Korea)

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

FCC Declaration of Conformity

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

For questions related to the EMC performance of this produc t, contact: Intel Corpo ration, 5200 N.E. Elam Young Parkw a y, Hillsboro, OR 97124

1-800-628-8686 This equipment has been teste d a nd found to comply with the limits for a Class B

digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and the receiver.

• Connect the equipment to an outlet on a circuit other tha n t he one to which the

receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications to the equipment not expressly appro ved by Intel

Corporation could void the us er’s authority to operate the equipment. Tested to comply with FCC sta nda rds for home or office use.

Canadian Department o f C o mmun ications Compliance Statement

This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the Radio Interf erence Regulations of the Canadian Department of Comm unications.

Le présent appareil numerique német pas de bruits radioélectriques dépassant les limites applicables aux appareils numériques de la classe B prescrites dans le Réglement sur le broullage radioélectrique édicté par le ministére des Communications du Canada.

Regulatory Complia nc e and Battery Disposal Information

Japan VCCI Statement

Japan VCCI Statement translation: This is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.

Korea Class B Statement

Korea Class B Statement trans lation: This equipment is for home use, and has acquired electromagnetic conformity registration, so it can be used not only in residential areas, but also other areas.

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance

Intel Desktop Board D2550MUD2 meets the ENERGY STAR requirements listed in Table 46 when used in corresponding system configurations.

Table 46. ENERGY STAR Requirements

ENERGY STAR Specification

v4.0 Desktop Comp ute r Idle State (Cat A) v4.0 Integrated Co mp ute r

v5.0 Desktop Comp ute r Off Mode v5.0 Integrated Des ktop

v5.0 Thin Client Off Mode

Computer Type

Computer

Required States

Sleep Mode Standby Level

Sleep Mode Idle State Active State

Sleep Mode Idle State (Cat B)

Capability Adjustments

With and without Wake On LAN (Sleep, Standby)

With and without additional internal storage

With and without Wake On LAN (Sleep, Standby)

The Desktop Boards also meet the following international requirements:

• Republic of Korea e-Standby program

• European Union Energy-related Produc ts (ErP) directive

Typical Electricity Consumption (TEC) Criteria

N/A

Cat A under “desktop conventional” and “desktop proxying” operational mode weightings

N/A

For information about Refer to

ENERGY STAR req uirements and recomme nded configuratio ns http://www.intel.com/go/energystar Electronic Produc t Environmental Assessm e nt To ol (EPEAT) http://www.epeat.net/ Korea e-Standby Pr o gram http://www.kemco.or.kr/new_eng/pg02

European Union Energ y-related Products Directive 200 9 (ErP) http://ec.europa.eu/enterprise/policies/s

/pg02100300.asp

ustainable-business/sustainableproduct-policy/ecodesign/index_en.htm

Regulatory Complia nc e and Battery Disposal Information

5.1.6 Regulatory Compliance Marks (Board Level)

Intel Desktop Board D2550MUD2 has the regulatory compliance marks shown in Table 47.

Table 47. Regulatory Compliance Marks

Description Mark

UL joint US/Canada Rec o gnized Component mark. Includes adjac e nt U L file number for Intel Desktop Boards: E210882.

FCC Declaratio n o f Conformity lo g o mark for Clas s B e quipment.

CE mark. Declaring c o m p li anc e to the European Union (EU) EMC dir e c tive, Low Voltage dire c tive, and RoHS dire c tiv e .

Australian Communications A uthority (ACA) and New Z e a land Radio Spectrum Management (NZ RSM) C-tick mark. Inc lud e s adjacent Intel supplier code num b e r, N-232.

Japan VCCI (Voluntary Control Counci l f or Interfer e nc e ) mark.

Korea Certificati o n ma r k. Includes an adjace nt KC C (Korean Communications Commis s ion) certification numbe r : KCC-REM-CPU-D2550MUD2.

Taiwan BSMI (Bureau o f Standards, Metrolo g y and Inspections ) mark. Includes adjace nt Intel company number, D33025.

Printed wiring boa r d manufacturer’s r e c o gnition mark. Consists o f a unique UL recognized manuf a c tur e r’s logo, along wi th a f la mm ab il ity rating (solder side).

China RoHS/Environme nta lly Friendly Use Period Logo: This is an example of the symbol used on Intel Desktop Boards and associa te d c o l late ral. The color of the mar k may vary depe nd ing upon the application. The Environmental Friendly Usage Period (EFUP) for Intel De s k top Boards has been determined to be 10 years.

V-0

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

5.2 Battery Disposal Information

CAUTION

Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations.

PRÉCAUTION

Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des piles usagées doit respecter les réglementations locales en vigueur en matière de protection de l'environnement.

FORHOLDSREGEL

Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse med gældende miljølovgivning.

OBS!

Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier bør kastes i henhold til gjeldende miljølovgivning.

VIKTIGT!

Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljövårdsbestämmelserna.

VARO

Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on maghdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten mukaisesti.

VORSICHT

Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend.

AVVERTIMENTO

Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto. Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore.

Regulatory Complia nc e and Battery Disposal Information

PRECAUCIÓN

Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.

WAARSCHUWING

Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.

ATENÇÃO

Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto. As baterias devem ser recicladas nos loc a is apropriados. A eliminação de baterias usadas deve ser feita de acordo com as regulamentações ambientais da região.

AŚCIAROŽZNAŚĆ

Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу. Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.

UPOZORNÌNÍ

V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné, baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními předpisy o životním prostředí.

Προσοχή

Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με τους κατά τόπο περιβαλλοντικούς κανονισμούς.

VIGYÁZAT

Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi előírásoknak megfelelően kell kiselejtezni.

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

AWAS

Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan.

OSTRZEŻENIE

Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska.

PRECAUŢIE

Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător. Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să respecte reglementările locale privind protecţia mediului.

ВНИМАНИЕ

При использовании батареи несоответствующего типа существует риск ее взрыва. Батареи должны быть утилизированы по возможности. Утилизация батарей должна проводится по правилам, соответствующим местным требованиям.

UPOZORNENIE

Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu. Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí vykonávať v súlade s miestnymi predpismi na ochranu životného pros tredia.

POZOR

Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo. Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi

okoljevarstvenimi predpisi.

UYARI

Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.

OСТОРОГА

Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху. Якщо можливо, використані батареї слід утилізувати. Утилізація використаних батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.

Regulatory Complia nc e and Battery Disposal Information

Intel Desktop Board D2550MUD2 Technic al P roduct Specifi ca ti on

Intel D2550MUD2 Specification

Specifications and Main Features

Frequently Asked Questions

User Manual