Intel D2550DC2 Specification
Intel® Desktop Board
D2550DC2
Technical Product Specification
Part Number: G73746-001
The Intel® Desktop Board D2550DC2 may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board D2550DC2 Specification Update.
July 2012
Revision History
Revision Revision Histor y Date
-001 First release o f the Intel® Desktop Board D2550DC2 Technical Produc t
Specification.
This product spec ification applies to only the standard In te l® Desktop Board D2550DC2 with
BIOS identifier MUCDT10N.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED I N C ONNEC TION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHER WISE, TO ANY INTELLECTUAL PRO PER TY R IGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATI NG TO FI TNESS FOR A PARTIC U LA R PURPOSE, MERCHANTABILITY, OR
INFRINGEMENT OF ANY PATENT, CO PY R IGHT OR OTHER IN TELLECTU A L PR O PERTY RIGHT. UNLESS
OTHERWISE AGREED IN WRITING BY IN TEL, THE I NTEL PR O D UCTS ARE NOT DESIGNED NOR INTENDED
FOR ANY APPLICATION IN WHICH THE FAILURE O F THE INTEL PRODUCT COULD CREATE A SITUATION
WHERE PERSONAL INJUR Y OR DEATH MAY OCCUR.
Intel Corporation may have patents o r pending patent applic a tio ns , trademarks, cop y rights, or other
intellectual proper ty rights that relate to the p resented subject matte r. The furnishing of d ocuments and
other materials and inf ormation does not p rovide any license , e x press or implied , by estoppel or otherwise,
to any such patents, trad e ma r ks, copyrights, o r other intellectual pr o perty rights.
Intel may make change s to specifications and p roduct descrip tions at any time, without notice.
Designers must not rely on the absence o r characteristics o f any features or ins tr uc ti o ns marked “reserved”
or “undefined.” Intel reserves the s e for future def inition and shall have no resp onsibility whatsoev e r for
conflicts or inco mpatibilities arising from future changes to the m .
®
Desktop Boards may contain design defects or errors known as errata, which may c aus e the p roduct
Intel
to deviate from p ublished specifications. Current characte rized errata are available on request.
Contact your local Intel sales office o r your distributor to obtain the latest sp e c ifications befor e p lac i ng y our
product order.
Intel, the Intel logo , a nd Intel Atom are trade m arks of Intel Co rporation in the U.S. and/or other countries.
* Other names and brands may be claimed a s the property of others.
Copyright © 2012, I nte l C orporation. All r ig hts reserved.
July 2012
ii
Board Identification Information
Basic Desktop Board D2550DC2 Identification Information
AA Revision BIOS Revision Notes
G73894-600 MUCDT10N.86A.0069 1,2
Notes:
1. The AA number is fo und on a small label on the comp o ne nt s ide of the board.
®
2. The Intel
following comp onent:
Device Stepping S-Spec Numbers
CG82NM10 B0 SLGXX
D2550 processor B3 SR0VY
NM10 Express Chipset and D2550 processor used on this AA revision consists of the
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.
iii
Intel Desktop Board D2550DC2 Technical Product Specification
iv
Chapter
Description
1
A description of the hardware used on the board
2
A map of the resources of the board
3
The features s upported by the BIOS Setup program
4
A description of the BIOS error messages, beep codes, and POST codes
5
Regulatory compliance and battery disposal information
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel
Desktop Board D2550DC2. It describes the standard product and a vailable
manufacturing options .
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board D2550DC2 and its components to the vendors, system integrators, and other
engineers and technicia ns who need this level of information. It is specifically not
intended for general audiences.
What This Document Contai ns
®
Typographical Conventions
This section cont ains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attentio n to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing da ta.
v
Intel Desktop Board D2550DC2 Technical Product Specification
Other Common Notation
# Used after a signal na me to identify an active-low s ig na l (s uc h as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kb Kilob it (1024 bits)
kb/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048,576 bits)
Mb/s Megabits per second
TDP Therma l D e s ign Power
xxh An address or d ata v al ue ending with a lowercase h ind i c ate s a he x a d e c im al value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the p roperty of thei r
respective owners.
vi
Contents
1 Product Description
1.1 Overview ......................................................................................... 11
1.1.1 Feature Summary ................................................................. 11
1.1.2 Board Layout ........................................................................ 13
1.1.3 Block Diagram ...................................................................... 15
1.2 Online Support ................................................................................. 16
1.3 Processor ........................................................................................ 16
1.3.1 Intel
1.4 System Memory ............................................................................... 18
1.5 Intel
®
NM10 Express Chipset .............................................................. 20
1.5.2 USB ..................................................................................... 21
1.5.3 SATA Support ....................................................................... 21
1.6 Real-Time Clock Subsyst em ............................................................... 22
1.7 Legacy I/O Controller ........................................................................ 22
1.8 LAN Subsystem ................................................................................ 23
1.8.1 LAN Subsystem Drivers .......................................................... 23
1.8.2 RJ-45 LAN Connector with Integrated LEDs .............................. 24
1.9 Audio Subsystem .............................................................................. 25
1.9.1 Audio Subsystem Software ..................................................... 26
1.9.2 Audio Connectors and Headers ................................................ 26
1.10 Hardware Management Subsystem ..................................................... 27
1.10.1 Hardware Monitoring ............................................................. 27
1.10.2 Thermal Monitoring ............................................................... 28
1.11 Power Management .......................................................................... 29
1.11.1 ACPI .................................................................................... 29
1.11.2 Hardware Support ................................................................. 32
®
D2550 Graphics Subsystem ........................................... 17
2 Technical Reference
2.1 Memory Map .................................................................................... 35
2.1.1 Addressable Memory ............................................................. 35
2.2 Connectors and Headers .................................................................... 38
2.2.1 Back Panel ........................................................................... 39
2.2.2 Component-side Connectors and Headers................................. 41
2.3 BIOS Configuration Jumper Block ....................................................... 50
2.4 Mechanical Considerations ................................................................. 52
2.4.1 Form Factor .......................................................................... 52
2.5 Electrical Considerations .................................................................... 53
2.5.1 Fan Header Current Capability ................................................ 53
2.5.2 Add-in Board Considerations ................................................... 53
2.6 Thermal Considerations ..................................................................... 53
2.6.1 Passive Heatsink Design in a Passive System Environment ......... 55
vii
Intel Desktop Board D2550DC2 Technical Product Specification
2.7 Power Consumption .......................................................................... 58
2.7.1 Minimum Load Configuration ................................................... 58
2.7.2 Maximum Load Configuration .................................................. 58
2.8 Reliability......................................................................................... 59
2.9 Environmental .................................................................................. 59
3 Overview of BIOS Features
3.1 Introduction ..................................................................................... 61
3.2 BIOS Flash Memory Organization ........................................................ 62
3.3 Resource Configuration ..................................................................... 62
3.3.1 PCI* Autoconfiguration .......................................................... 62
3.4 System Management BIOS (SMBIOS) ................................................. 63
3.5 Legacy USB Support ......................................................................... 64
3.6 BIOS Updates .................................................................................. 65
3.6.1 BIOS Recovery ...................................................................... 65
3.6.2 Custom Splash Screen ........................................................... 66
3.7 Boot Options .................................................................................... 66
3.7.1 Optical Drive Boot ................................................................. 66
3.7.2 Network Boot ........................................................................ 66
3.7.3 Booting Without Attached Devices ........................................... 67
3.7.4 Changing the Default Boot Device During POST ......................... 67
3.8 BIOS Security Features ..................................................................... 68
4 Board Status and Error Messages
4.1 BIOS Beep Codes ............................................................................. 69
4.2 Front-panel Power LED Blink Codes ..................................................... 70
4.3 BIOS Error Messages ........................................................................ 70
4.4 Port 80h POST Codes ........................................................................ 71
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ...................................................................... 77
5.1.1 Safety Standards................................................................... 77
5.1.2 European Union Declaration of Conformity Statement ................ 78
5.1.3 Product Ecology Statements ................................................... 79
5.1.4 EMC Regulations ................................................................... 81
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 84
5.1.6 Regulatory Compliance Marks (Board Level) ............................. 85
5.2 Battery Disposal Information .............................................................. 86
viii
Contents
Figures
1. Major Board Components .................................................................. 13
2. Block Diagram .................................................................................. 15
3. Memory Channel and SO-DIMM Configuration ...................................... 19
4. LAN Connector LED Locations ............................................................. 24
5. Back Panel Audio Connectors ............................................................. 26
6. Thermal Sensors and Fan Header ....................................................... 28
7. Location of the Standby Power Indicator LED ....................................... 34
8. Detailed System Memory Address Map ................................................ 36
9. Back Panel Connectors ...................................................................... 39
10. I/O Shield Reference Diagram ............................................................ 40
11. Component-side Connectors and Headers ............................................ 41
12. Connection Diagram for Front Panel Header ......................................... 47
13. Connection Diagram for Front Panel USB Header .................................. 49
14. Connection Diagram for Front Panel USB Header with Intel Z-USB
Solid-State Drive or Compatible Device Support ................................... 49
15. Location of the BIOS Configuration Jumper Block .................................. 50
16. Board Dimensions ............................................................................. 52
17. Localized High Temperature Zones ..................................................... 54
18. Fan Location Guide for Chassis Selection (Chassis Orientation is Not
Restricted) ....................................................................................... 57
Tables
1. Feature Summary ............................................................................. 11
2. Board Components Shown in Figure 1 ................................................. 14
3. Supported Memory Configurations
4. LAN Connector LED States ................................................................. 24
5. Audio Jack Support ........................................................................... 25
6. Effects of Pressing the Power Switch ................................................... 29
7. Power States and Targeted System Power ........................................... 30
8. Wake-up Devices and Events ............................................................. 31
9. System Memory Map ........................................................................ 37
10. Component-side Connectors and Headers Shown in Figure 11 ................ 42
11. System Fan Header .......................................................................... 43
12. SATA Connectors .............................................................................. 43
13. Front Panel Wireless Activity LED Header ............................................. 43
14. Front Panel Audio Header for Intel HD Audio ........................................ 43
15. Front Panel Audio Header for AC ’97 Audio ........................................... 43
16. Front Panel USB Header .................................................................... 44
17. Front Panel USB Header with Intel Z-U130 USB Solid-State Drive or
Compatible Device Support ................................................................ 44
18. Power Connector
.............................................................................. 46
19. Front Panel Header ........................................................................... 47
20. States for a One-Color Power LED ....................................................... 48
1
..................................................... 18
ix
Intel Desktop Board D2550DC2 Technical Product Specification
21. BIOS Configuration Jumper Settings ................................................... 51
22. Fan Header Current Capability ............................................................ 53
23. Thermal Considerations for Components .............................................. 55
24. Minimum Load Configuration Current and Power Results ........................ 58
25. Maximum Load Configuration Current and Power Results ....................... 59
26. Intel Desktop Board D2550DC2 Environmental Specifications ................. 59
27. BIOS Setup Program Menu Bar ........................................................... 62
28. BIOS Setup Program Function Keys .................................................... 62
29. Acceptable Drives/Media Types for BIOS Recovery ................................ 65
30. Boot Device Menu Options ................................................................. 67
31. Supervisor and User Password Functions ............................................. 68
32. BIOS Beep Codes ............................................................................. 69
33. Front-panel Power LED Blink Codes ..................................................... 70
34. BIOS Error Messages ........................................................................ 70
35. Port 80h POST Code Ranges .............................................................. 71
36. Port 80h POST Codes ........................................................................ 72
37. Typical Port 80h POST Sequence ........................................................ 75
38. Safety Standards .............................................................................. 77
39. EMC Regulations ............................................................................... 81
40. ENERGY STAR Requirements .............................................................. 84
41. Regulatory Compliance Marks ............................................................ 85
x
Seven USB 2.0 ports:
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of Intel Desktop Board D2550DC2.
Table 1. Feature Summary
Form Factor Mini-ITX, (6.7 inches b y 6.7 inches [170 m illim e te r s by 170 millimeters])
compatible with micr o A T X
Processor Passively-cooled, soldered-down Dual-Core Intel® Atom™ process or with
integrated graphi c s and inte grated memory c o ntroller
Memory
Chipset Passively coole d , Intel® NM10 Express Chipset
Audio Multi-streaming 5.1 (6-channel) audio subsystem s upport based on the R ealtek*
Graphics Onboard Intel® graphics subsy s te m w ith s up port for:
Legacy I/O Control Winbond W83627DHG-P based Legacy I/O controller for hardware management
Peripheral
Interfaces
LAN Support 10/100/1000 Mb/s Ethernet LAN subsy s te m usi ng an Intel® 82574L Gigabit
• Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Mod ul e (SO-
DIMM) sockets
• Support for DDR3 1066 MHz, DDR3 1333 MHz, and DDR3 1600 MHz
SO-DIMMs
Note: DDR3 1333 MHz and DDR3 1600 MHz m e mory will run at 1066 MHz
• Support for up to 4 GB of system memory on a single SO-DIMM
ALC662 high definition audio codec
― High Definition Multimedi a Interface* (HDMI*)
― DVI-D
• External graphics support provided through the Co nventional PCI bus
connector
•
― Four back pane l p orts
― Two ports are im p le m e nte d w ith a d ual port internal header f or front panel
cabling
― One port is impleme nte d with an internal header (b rown-colored) that
supports an Intel
• Two Serial ATA (SATA) 3.0 Gb/s conne c tors (supporting IDE and AHCI mode)
Ethernet Controller
®
Z-U130 USB Solid-State Drive or compatible d e v ic e
continued
11
Intel Desktop Board D2550DC2 Technical Product Specification
®
Suspend to RAM sup port
One Conventional PC I bus connector (with riser card support for up to two PCI
Table 1. Feature Summary (continued)
BIOS
Instantly Available
PC Technology
Expansion
Capabilities
Hardware Monitor
Subsystem
• Intel
• Support for Advanced Conf i g uration and Power I nte r face (ACPI), Plug and
•
• Wake on PCI, PCI Express*, front panel, USB por ts , and LAN
•
• One PCI Express Full-/Half-Mini Card slo t
• Hardware monitoring through the Windbond I/O controll e r
• Voltage sense to detect out of range p ower supply voltages
• Thermal sense to detect out of range thermal values
• One fan header
• One fan sense input used to monitor fan activ ity
• Fan speed control
BIOS (resid e nt in the S PI Flash device)
Play, and SMBIOS
cards)
12
1.1.2 Board Layout
Figure 1 shows the location of the major components.
Product Description
Table 2 lists the components identified in Figure 1.
Figure 1. Major Board Components
13
Intel Desktop Board D2550DC2 Technical Product Specification
Table 2. Board Components Shown in Figure 1
Item/callout
from Figure 1
A Back panel connectors
B Standby power LED
C Processor core power connector (2 x 12)
D Intel Atom processor
E SO-DIMM channel A so c k e t, DIMM 1
F SO-DI MM c hanne l A s ocket, DIMM 0
G Intel NM10 Express Chipset
H SATA connectors
I System fan header
J Front panel header
K BIOS setup conf iguration jumper blo c k
L Battery
M Front panel USB 2 .0 header
N Fro nt Pane l Wi r e le s s A c ti v ity LED header
O Piezo/mono tonic speaker head e r
P PCI Exp r e s s Full-/Half-Mini Card slot
Q Conventional PCI bus add-in car d c onnector
R Front panel audio he ader
S Front panel USB hea d e r (supports Inte l Z -U130 USB Solid-
Description
State Drive or c ompatible device (b rown-colored)
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas.
Product Description
Figure 2. Block Diagram
15
Intel Desktop Board D2550DC2 Technical Product Specification
1.2 Online Support
To find information a bout… Visit this World Wide Web site:
Intel Desktop B oard D2550DC2 http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available config ur a tio ns for the Intel
Desktop Board D2550DC2
Supported processors http://processormatch.intel.com
Chipset informatio n http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration info r m ation http://www.intel.com/support/go/buildit
http://ark.intel.com
025414.htm
1.3 Processor
The board has a passively-cooled, soldered-down Dual-Core Intel Atom processor with
integrated graphics and integrated memory controller.
NOTE
The board is des igned to be passively cooled in a properly ventilated chassis. Chassis
venting locations are recommended above the processor heatsink area for maximum
heat dissipation effectiveness.
For information about Refer to
Power supply c o nne c tors Section 2.2.2.3, page 46
16
Product Description
1.3.1 Intel® D2550 Graphics Subsystem
1.3.1.1 Intel® Graphics Media Accelerator 3650 Graphics
Controller (Intel® GMA)
The Intel® GMA 3650 graphics controller features the following:
• 640 MHz core frequency
• High quality texture engine
DX9.3* and OpenGL* 3.0 compliant
Hardware Pixel Shader 4.1
Vertex Shader Model 4.1
• Video
Blu-Ray 2.0
H.264 & VC1 hardware decoder
PAVP 1.1c
HDCP 1.3
• Display
Supports HDMI and DVI displays up to 1920 x 1200 at 60 Hz refresh (WUXGA)
Dual independent display support
For information about Refer to
Obtaining graphics s oftware and utilities Section 1.2, page 16
1.3.1.2 High Definition Multimedia Interface* (HDMI*)
The HDMI por t supports standard, enhanced, or high definition video, plus multichannel digital audio on a single cable. . The maximum supported resolution is 1920 x
1200 (WUXGA). The HDMI port is compliant with the HDMI 1.3a specification
The HDMI port is enabled for POST whenever a monitor is attached
17
Intel Desktop Board D2550DC2 Technical Product Specification
1.4 System Memory
The board has two 204-pin DDR3 SO-DIMM sockets and supports the following
memory features:
• DDR3 SDRAM SO-DIMMs with gold-plated contacts
• Unbuffered, single-sided or double-sided DIMMs
• 4 GB maximum total system memory
• Minimum total system memory: 256 MB
• Non-ECC DIMMs
• Seri a l Presence Detect
• DDR3 1066 MHz, DDR3 1333 MHz, DDR3 1600 MHz SO-DIMMs
(DDR3 1333 MHz and DDR3 1600 MHz memory will run at 1066 MHz)
NOTES
• Due to passively-cooled thermal constraints, system memory must have an
operating temperature rating of 85
The board is designed to be passively cooled in a properly ventilated
chassis. Chassis venting locations are recommended above the system
memory area for maximum heat dissipation effectiveness.
o
C.
• If you are installing only one SO-DIMM, it must be installed in the bottom
socket (SO-DIMM 1).
• To be fully compliant with all applicable DDR3 SDRAM memory
specifications, the board should be populated with SO-DIMMs that support
the Serial Presence Detect (SPD) data structure. This allows the BIOS to
read the SPD data and program the chipset to accurately configure memory
settings for optimum performance. If non-SPD memory is installed,
performance and reliability may be impacted or the SO-DIMMs may not
function under the determined frequency.
Table 3 lists the supported SO-DIMM configurations.
1
Table 3. Supported Memory Configurations
Raw Card
Version
B
F
Notes:
1. System memory configurations are based on availab ility and are subject to c hange.
2. Support fo r one 4 GB SO-DIMM instal le d in s lot 1. Slot 0 must be lef t e m p ty.
SO-DIMM
Capacity
1 GB 1 Gb 128 M x 8 8
2 GB 2 Gb 256 M x 8 8
2 GB 1 Gb 128 M x 8 16
4 GB2 2 Gb 256 M x 8 16
DRAM Device
Technology
DRAM
Organization
# of DRAM
Devices
18
Product Description
Figure 3 illustrates the memory channel and SO-DIMM configuration.
Figure 3. Memory Channel and SO-DIMM Configuration
19
Intel Desktop Board D2550DC2 Technical Product Specification
1.5 Intel® NM10 Express Chipset
The Intel NM10 Express Chipset provides interfaces to the processor and the USB,
SATA, LPC, LAN, PCI, and PCI Express interfaces. The Intel NM10 Express Chipset is a
centralized controller for the board’s I/O paths.
NOTE
The board is des igned to be passively cooled in a properly ventilated chassis. Chassis
venting locations are recommended above the processor heatsink area for maximum
heat dissipation effectiveness.
For information about Refer to
The Intel NM10 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.5.1.1 Video Memory Allocation
Video memory is allocated from the total available system memory for the efficient
balancing of 2-D/3-D graphics performance and overall system performance. Dynamic
allocation of system memory to video memory is as follows:
• 256 MB total RAM results in 32 MB video RAM
• 512 MB total RAM results in 64 MB video RAM
• 1 GB total RAM results in 128 MB video RAM
• 2 GB total RAM results in 224 MB video RAM
1.5.1.2 Digital Visual Interface (DVI-D)
The DVI-D port supports only digital DVI displays. The max imum supported resolution
is 1920 x 1200 at 60 Hz refresh (WUXGA). The DVI-D port is compliant with the
DVI 1.0 specification.
20
Product Description
1.5.2 USB
The board provides up to seven USB 2.0 ports, supports UHCI and EHCI, and uses
UHCI- and EHCI-compatible drivers (four ports routed to the back panel and three
ports routed to two front panel USB 2.0 headers). One of the front panel USB headers
(brown-colored) supports an Intel Z-U130 USB Solid-State Drive or compatible device.
NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet
FCC Class B requirements, even if no device is attached to the cable. Use shielded
cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 9, page 39
The location of the front panel USB headers Figure 11, page 41
1.5.3 SATA Support
The board provides two SATA interface connectors that support one device per
connector.
The board’s SATA controller offers independent SATA ports with a theoretical
maximum transfer rate of 3.0 Gb/s on each port. One device can be installed on each
port for a maximum of two SATA devices. A point-to-point interface is used for host to
device connections, unlike PATA which supports a master/slave configuration and two
devices on each channel.
For compatibility, the underlying SATA functionality is transparent to the operating
system. The SATA controller supports IDE and AHCI configuration and can operate in
both legacy and native modes. In legacy mode, standard ATA I/O and IRQ resources
are assigned (IRQ 14 a nd 1 5 ). In native mode, standard Conventional PCI bus
resource steering is used. Native mode is the preferred mode for configurations using
the Windows Vista* operating system.
For information about Refer to
Obtaining AHCI driver Section 1.2, page 16
The location of the SA TA c onnectors Figure 11, page 41
21
Intel Desktop Board D2550DC2 Technical Product Specification
1.6 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the
computer is not plugged into a wall socket, the battery has an estimated life of three
years. When the computer is plugged in, the standby current from the power supply
extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC
with 3.3 VSB applied.
NOTE
If the battery and AC po w er fail, custom defaults, if previously saved, will be l oaded
into CMOS RAM at power-on.
When the voltage drops b elow a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.
1.7 Legacy I/O Controller
The Legacy I/O Controller provides the following features:
• Serial IRQ interface compatible wi th serialized IRQ support for Conventional
PCI bus systems
• Intelligent power management, including a programmable wake-up event
interface
• Conventional PCI bus power management support
The BIOS Setup program provides configuration options for the Legacy I/O controller.
For information about Refer to
The location of the head e rs Figure 11, page 41
22
Product Description
1.8 LAN Subsystem
The LAN subsystem consists of the following:
• Intel NM10 Express Chipset
• Intel 82574L Gigabit Ethernet Controller for 10/100/1000 Mb/s Ethernet
LAN connectivity
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface that supports the Ethernet controller
• Conventional PCI bus power management
Supports ACPI technology
Supports LAN w ake capabilities
1.8.1 LAN Subsystem Drivers
LAN drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN drive rs Section 1.2, page 16
23
Intel Desktop Board D2550DC2 Technical Product Specification
1.8.2 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 4).
Figure 4. LAN Connector LED Locations
Table 4 describes the LED states w hen the board is powered up and the Ethernet LAN
subsystem is opera ting.
Table 4. LAN Connector LED States
LED LED Color LED State Condition
Off LAN link is not estab lis he d.
Link/Activity (A) Green
Link Speed (B) Green/Yellow
On LAN link is established .
Blinking LAN ac tivity is occurring .
Off 10 Mb/s data ra te is se l e c te d o r negotiated.
Green 100 Mb/s data rate is s e le c te d or negotiated.
Yellow 1000 Mb/s data r ate is s e le c te d or negotiated.
24
Product Description
1.9 Audio Subsystem
The board support s the Intel® High Definition Audio (Intel® HD Audio) subsystem. The
audio subsystem consists of the following:
• Intel NM10 Express Chipset
• Realtek ALC662 audio codec
The audio subsystem has the following features:
• Advanced jack sense for the back panel audio jacks that enables the audio
codec to recognize the device that is connected to an audio port. The back
panel audio jacks are capable of retasking according to the user’s definition,
or can be automatically switched depending on the recognized device type.
• Front panel Intel HD Audio and AC ’97 audio support.
• 3-port analog audio out stack.
• Windows Vista Basic certification.
• A signal-to-noi se (S/N) r atio of 95 dB.
Table 5 lists the supported functions of the front panel and back panel audio jacks.
Table 5. Audio Jack Support
Audio Jack
Front panel – Green Default
Front panel – Pink Default
Back panel – Blue Default
Back panel – Green (ctrl pa ne l) Default
Back panel – Pink Default
Microphone Headphones
Line Out
(Front Spks)
Line In
(Stereo 2) Mic-In
25
Intel Desktop Board D2550DC2 Technical Product Specification
1.9.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio sof tw a r e and drivers Section 1.2, page 16
1.9.2 Audio Connectors and Headers
The board contains audio connectors and headers on both the back panel and the
component side of the board. The component-side audio headers include front panel
audio (a 2 x 5-pin header that provides mic in and line out signals for front panel audio
connectors).
Item Description
A Line in
B Line out
C Mic in
Figure 5. Back Panel Audio Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
For information about Refer to
The locations of the f ront panel audio header and S/PDIF audio header Figure 11, page 41
The signal names of the f ront panel audio header and S/PDIF head e r Section 2.2.2.1, page 43
26
Product Description
1.10 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (Wf M) specification. The boar d has several hardware management
features, including the following:
• Thermal monitoring
• Voltage monitoring
1.10.1 Hardware Monitoring
The hardware monitoring and fan control subsystem is based on the Winbond
W83627DHG-P device, which supports the following:
• System ambient temperature monitoring
• System fan speed monitoring
• Power monitoring of +12 V, +5 V, +5 Vstdby, +3.3 V, and +VCCP
• SMBus interface
27
Loading...