The Intel® Desktop Board D2500HN may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board D2500HN Specification Update.
June 2012
Revision History
Revision Revision Histor y Date
-001 First release o f the Intel® Desktop Board D2500HN Technical Product
Specification.
-002 Specification Clarification June 2012
This product spec ification applies to only the standard In tel® Desktop Board D2500HN with BIOS
identifier MUCDT10N.86A.
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®
Desktop Boards may contain des ig n defects or er r ors known as errata, which may cause the pr oduct
Intel
to deviate from p ublished specifications. Current characte rized errata are available on request.
Contact your local Intel sales office o r your distributor to obtain the latest sp e c ifications befor e p lac i ng y our
product order.
1. The AA number is found on a small label on the component side of the b oard.
®
2. The Intel
Device Stepping S-Spec Numbers
CG82NM10 B0 SLGXX
NM10 Express Chipset used on this AA rev is ion consists of the f o llowing component:
Specification Changes or Clarifications
Table 1 indicates the Specification Changes or Specification Clarifications that apply to
the Intel
Table 1. Specification Changes or Clarifications
Date Type of Change Description of Changes or Clarifications
June 2012 Spec Clarification Added a Note to s e c tio n 1.4 System Memory on page 18.
®
Desktop Board D2500H N.
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.
A description of the BIOS error messages, beep codes, and POST codes
5
Regulatory compliance and battery disposal information
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel
Desktop Board D2500HN. It describes the standard product and a vailable
manufacturing options .
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board D2500HN and its components to the v endors, syste m integrators, and other
engineers and technician s who n eed this level of information. It is specifically not
intended for general audiences.
What This Document Contai ns
®
Typographical Conventions
This section cont ains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attentio n to important information.
CAUTION
Cautions are included to help you avoid damaging hard w are or losing data.
# Used after a signal na me to identify an active-low s ignal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kb Kilob it (1024 bits)
kb/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048 ,576 bits)
Mb/s Megabits per second
TDP Therma l D e s ign Power
xxh An address or d ata v al ue ending with a lowercase h ind i c ate s a he x a d e c im al value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to ind i c ate third-party brands and names that are the property of their
40. ENERGY STAR Requirements .............................................................. 86
41. Regulatory Compliance Marks ............................................................ 87
x
• Seven USB 2.0 ports:
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of Intel Desktop Board D2500HN.
Table 2. Feature Summary
Form Factor Mini-ITX, (6.7 inches by 6.7 inches [17 0 m illim e te r s by 170 millimeters])
compatible with micr o A T X
Processor Passively-cooled, soldered-down Dual-Core Intel® Atom™ process or with
integrated graphi c s and inte grated memory c o ntroller
Memory
Chipset Passively coole d , Intel® NM10 Express Chipset
Audio Multi-streaming 5.1 (6-channel) audio subsystem s upport based on the Realtek*
Internal Graphics Onboard Intel® graphics subsy s te m w ith s up port for analog displays (VGA)
Legacy I/O Control Winbond W83627DHG-P based Legacy I/O control le r for hardware m anagement,
Peripheral
Interfaces
LAN Support 10/100/1000 Mb/s Ethernet LAN subsy s te m usi ng an Intel® 82574L Gigabit
• Two 204-pin DDR3 SDRAM Small Outline Dua l Inline Memory Module
(SO DIMM) sockets
• Support for DDR3 1066 MHz, DDR3 1333 MHz, and DDR3 1600 MHz
SO DIMMs
Note: DDR3 1333 MHz and DDR3 1600 MHz memory will run at 1066 MHz
• Support for up to 4 GB of system memory on a single SO-DIMM
ALC662 high definition audio codec
serial, parallel, and PS /2 * ports
― Four back pane l p orts
― Four ports a r e im p le m e nte d w ith two dual port inter nal he ader for fro nt
panel cabling
• Two Serial ATA (SA T A ) 3 .0 Gb/s connector s (supporting IDE and AHCI mode)
• One parallel por t connector on the back p a ne l
J
K
L
M
N
O Conventional PCI b us add-in card connector
P
Q
R Front panel USB 2.0 header
S
Description
Back panel connectors
Standby power LED
Processor core power connector (2 x 12)
Intel Atom processor
SO-DIMM channel A DIMM 1 socket
SO-DIMM channel A DIMM 0 socket
Intel NM10 Expr e s s C hipset
SATA connectors
System fan header
Front panel header
Battery
Front panel USB 2 .0 header
BIOS setup co nf i g uration jumper block
Piezo/monotonic spe a k e r header
S/PDIF header
Front panel audio he ader
Serial port heade r, COM 1
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas.
To find information about … Visit this World Wide Web site:
Intel Desktop B oard D2500HN http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available config ur a tio ns for the Intel
Chipset informatio n http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration info r m ation http://www.intel.com/support/go/buildit
http://ark.intel.com
025414.htm
1.3 Processor
The board has a passively-cooled, soldered-down Dual-Core Intel Atom processor with
integrated graphics and integrated memory controller.
NOTE
The board is designed to be passively cooled in a proper ly ventilated chassis. Chassis
venting locations are recommended above the processor heatsink area for maximum
heat dissipation effectiveness.
For information about Refer to
Power supply c o nne c tors Section 2.2.2.3, page 46
16
Product Description
1.3.1 Intel® D2500 Graphics Subsystem
1.3.1.1 Intel® Graphics Media Accelerator Graphics 3600
Controller (Intel® GMA)
The Intel® GMA 3600 graphics controller features the following:
• 400 MHz core frequency
• High quality texture engine
DX9.3* and OpenGL* 3.0 compliant
Hardware Pixel Shader 4.1
Vertex Shader Model 4.1
• Video
H.264 and VC1 hardware decoder
HDCP1.3
• Display
Supports VGA displays up to 1920 x 1200 at 60 Hz refresh (WUXGA)
For information about Refer to
Obtaining graphics s oftware and utilities Section 1.2, page 16
(DDR3 1333 MHz and DDR3 1600 MHz memory will run at 1066 MHz)
NOTES
•Due to passively-cooled thermal constraints, system memory must have an
operating temperature rating of 85
The board is des igned to be passively cooled in a properly ventilated chassis.
Chassis venting locations are recommended above the system memory area for
maximum heat dissipation effectiveness.
•If you are installing only one SO-DIMM, it must be i nstalled in the bottom socket
(SO-DIMM 1).
•To be fully compliant with all applicable DDR3 SDRAM memory specifications, the
board should be populated with SO-DIMMs that support the Serial Presence Detect
(SPD) data structure. T his allows the BIOS to read the SPD data and program the
chipset to accurately configure memory settings for optimum performance. If nonSPD memory is installed, performance and reliability ma y be impacted or the SODIMMs may not function under the d etermined frequency.
o
C.
Table 3 lists the supported SO-DIMM configurations.
Table 4. Supported Memory Configurations
Raw Card
Version
B
F
Notes:
1. System memory configurations are based on availab ility and are subject to c hange.
2. Support fo r one 4 GB SO-DIMM instal le d in s lot 1. Slot 0 must be lef t e m p ty.
SO-DIMM
Capacity
1 GB 1 Gb 128 M x 8 8
2 GB 2 Gb 256 M x 8 8
2 GB 1 Gb 128 M x 8 16
4 GB2 2 Gb 256 M x 8 16
DRAM Device
Technology
DRAM
Organization
1
# of DRAM
Devices
18
Product Description
Figure 3 illustrates the memory channel and SO-DIMM configuration.
Figure 3. Memory Channel and SO-DIMM Configuration
The Intel NM10 Express Chipset provides interfaces to the processor and the USB,
SATA, LPC, LAN, PCI, and PCI Express interfaces. The Intel NM10 Express Chipset is a
centralized controller for the board’s I/O paths.
NOTE
The board is des igned to be passively cooled in a prope rly ventilated chassis. Chassis
venting locations are recommended above the processor heatsink area for maximum
heat dissipation effectiveness.
For information about Refer to
The Intel NM10 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chips e t Chapter 2
1.5.1.1 Video Memory Allocation
Video memory is allocated from the total available system memory for the efficient
balancing of 2-D/3-D graphics performance and overall system performance. Dynamic
allocation of system memory to video memory is as follows:
• 256 MB total RAM results in 32 MB video RAM
• 512 MB total RAM results in 64 MB video RAM
• 1 GB total RAM results in 128 MB video RAM
• 2 GB total RAM results in 224 MB video RAM
1.5.1.2 Analog Display (VGA)
The VGA port supports analog displays. The maximum supported resolution is 1920 x
1200 (WUXGA) at a 60 Hz refresh rate. The VGA port is enabled for POST whenever a
monitor is attached.
1.5.1.3 Configuration Modes
For monitors attached to the VGA port, video modes supported by this board are based
on the Extended Display Identification Data (EDID) prot ocol.
20
Product Description
1.5.2 USB
The board provides up to eight USB 2.0 ports, supports UHCI and EHCI, and uses
UHCI- and EHCI-compatible drivers (four ports route d to the back panel and four ports
routed to two fr ont panel USB 2.0 headers).
NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet
FCC Class B requirements, even if no device is attached to the cable. Use shielded
cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB c onnectors on the back panel Figure 9, page 39
The location of the front panel USB headers Figure 11, page 41
1.5.3 SATA Support
The board provides two SATA interface connectors that support one device per
connector.
The board’s SATA controller offers independent SATA ports with a theoretical
maximum transfer rate of 3.0 Gb/s on each port. One device can be installed on each
port for a maximum of two SATA devices. A point-to-point interface is used f or host to
device connections, unlike PATA which supports a master/slave co nfiguration and two
devices on each channel.
For compatibility, the underlying SATA functionality is transparent to the operating
system. The SATA controller supports IDE and AHCI configuration and can operate in
both legacy and native modes. In legacy mode, standard ATA I/O and IRQ resources
are assigned (IRQ 14 and 15). In native mode, standard Conventional PCI bus
resource steering is used. Native mode is the preferred mode for configurations using
the Windows Vista* operating system.
For information about Refer to
Obtaining AHCI driver Section 1.2, page 16
The location of the SA TA c onnectors Figure 11, page 41
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the
computer is not plugged into a wall socket, the battery has an e stimated life of three
years. When the computer is plugged in, the standby current from the pow er supply
extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC
with 3.3 VSB applied.
NOTE
If the battery and AC po w er fail, custom defaults, if previously saved, will be loaded
into CMOS RAM at power-on.
When the voltage drops b elow a certain level, the BIOS Setup program se ttings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.
1.7 Legacy I/O Controller
The Legacy I/O Controller provides the following features:
• One serial port header
• One serial port connector on the back panel
• One parallel port connector with Enhanced Parallel Port (EPP) support
• Serial IRQ interface compatible with serialized IRQ support for Conventional PCI
bus systems
• PS/2-style keyboard/mouse port
• Intelligent power management, including a programmable wake-up event interface
• Conventional PCI bus power management support
The BIOS Setup program provides co nfiguration options for the Leg a cy I/O controller.
For information about Refer to
The location of the head e rs Figure 11, page 41
The serial port head e rs signal mapping Table 11, on page 43
22
Product Description
1.8 LAN Subsystem
The LAN subsystem consists of the following:
• Intel NM10 Express Chipset
• Intel 82574L Gigabit Ethernet Controller for 10/100/1000 Mb/s Ethernet LAN
connectivity
•RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface that supports the Ethernet controller
• Conventional PCI bus power management
Supports ACPI technology
Supports LAN wake capabilities
1.8.1 LAN Subsystem Drivers
LAN drivers are available from Intel’s World Wide Web site.
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 4).
Figure 4. LAN Connector LED Locations
Table 4 describes the LED states w hen the board is powered up and the Ethernet LAN
subsystem is opera ting.
Table 5. LAN Connector LED States
LED LED C olor L ED State Condition
Off LAN link is not estab lis he d.
Link/Activity (A) Green
Link Speed (B) Green/Yellow
On LAN link is established .
Blinking LAN ac tivity is occurring .
Off 10 Mb/s data rate is selected or negotiated.
Green 100 Mb/s data rate is s e le c te d or negotiated.
Yellow 1000 Mb/s data r ate is s e le c te d or negotiated.
24
Product Description
1.9 Audio Subsystem
The board support s the Intel® High Definitio n Audio (Intel® HD Audio) subsystem. The
audio subsystem consists of the following:
• Intel NM10 Express Chipset
• Realtek ALC662 audio codec
The audio subsystem has the following features:
•Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.
• Front panel Intel HD Audio and AC ’97 audio support.
• 3-port analog audio out stack.
• Windows Vista Basic certification.
• A signal-to-noise (S/N) ratio of 95 dB.
Table 5 lists the supported functions of the front panel and back panel audio jacks.
Table 6. Audio Jack Support
Audio Jack
Front panel – Green Default
Front panel – Pink Default
Back panel – Blue Default
Back panel – Green (ctrl pa ne l) Default
Back panel – Pink Default
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio sof tw a r e and drivers Section 1.2, page 16
1.9.2 Audio Connectors and Headers
The board contains audio connectors and headers on both the back pane l and the
component side of the board. The compo nent-side audio headers include front panel
audio (a 2 x 5-pin header that provides mic in and line out signals for front panel audio
connectors).
Item Description
A Line in
B Line out
C Mic in
Figure 5. Back Panel Audio Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if pa ssive (non-amplified) speakers are
connected to this output.
For information about Refer to
The locations of the f ront panel audio header and S/PDIF audio header Figure 11, page 41
The signal names of the f ront panel audio header and S/PDIF head e r Section 2.2.2.1, page 43
26
Product Description
1.10 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Thermal monitoring
• Voltage monitoring
1.10.1 Hardware Monitoring
The hardware monitoring and fan control subsystem is bas ed on the Winbond
W83627DHG-P device, which supports the following:
• System ambient temperature monitoring
• System fan speed monitoring
• Power monitoring of +12 V, +5 V, +5 Vstdby, +3.3 V, and + VCCP