Intel CELERON 200 User Manual
Intel® Celeron® Processor 200Δ
Sequence
Thermal and Mechanical Design Guidelines
— Supporting the Intel® Celeron® processor 220 Δ
October 2007
318548-001
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Copyright © 2007, Intel Corporation. All rights reserved.
2 Thermal and Mechanical Design Guidelines
Contents
1 Introduction .....................................................................................................7
1.1 Document Goals and Scope .....................................................................7
1.1.1 Importance of Thermal Management............................................7
1.1.2 Document Goals........................................................................7
1.1.3 Document Scope .......................................................................8
1.2 Reference Documents .............................................................................9
1.3 Definition of Terms .................................................................................9
2 Processor Thermal/Mechanical Information .........................................................11
2.1 Mechanical Requirements ......................................................................11
2.1.1 Processor Package................................................................... 11
2.1.2 Heatsink Attach ......................................................................16
2.2 Thermal Requirements .......................................................................... 18
2.2.1 Processor Junction Temperature ................................................19
2.3 Heatsink Design Considerations.............................................................. 19
2.3.1 Heatsink Size..........................................................................20
2.3.2 Heatsink Mass ........................................................................21
2.3.3 Thermal Interface Material........................................................21
2.4 System Thermal Solution Considerations ................................................. 22
2.4.1 Chassis Thermal Design Capabilities...........................................22
2.4.2 Improving Chassis Thermal Performance .................................... 22
2.4.3 Summary...............................................................................25
3 Thermal Metrology ..........................................................................................27
3.1 Characterizing Cooling Performance Requirements ....................................27
3.1.1 Example ................................................................................29
3.2 Local Ambient Temperature Measurement Guidelines.................................30
3.3 Processor Power Measurement Metrology Recommendation ........................ 32
3.3.1 Sample Preparation .................................................................33
4 System Thermal/Mechanical Design Information..................................................37
4.1 Overview of the Reference Design...........................................................37
4.1.1 Altitude..................................................................................37
4.1.2 Heatsink Thermal Validation .....................................................37
4.2 Environmental Reliability Testing ............................................................ 38
4.2.1 Structural Reliability Testing ..................................................... 38
4.2.2 Power Cycling ......................................................................... 40
4.2.3 Recommended BIOS/CPU/Memory Test Procedures ...................... 40
4.3 Material and Recycling Requirements ...................................................... 40
4.4 Safety Requirements ............................................................................41
4.5 Reference Attach Mechanism..................................................................41
4.5.1 Structural Design Strategy .......................................................41
4.5.2 Mechanical Interface to the Reference Attach Mechanism ..............41
Thermal and Mechanical Design Guidelines 3
Appendix A Heatsink Clip Load Metrology............................................................................ 43
A.1 Overview ............................................................................................43
A.2 Test Preparation...................................................................................43
A.2.1 Heatsink Preparation ...............................................................43
A.2.2 Typical Test Equipment ............................................................43
A.3 Test Procedure Examples.......................................................................45
Appendix B Intel® Enabled Boxed Processor Thermal Solution Information............................... 47
Appendix C Mechanical Drawings .......................................................................................49
Figures
Figure 1. Micro-FCBGA Processor Package Drawing – Isometric View .....................13
Figure 2. Micro-FCBGA Processor Package Drawing (Sheet 1 of 2)......................... 14
Figure 3. Micro-FCBGA Processor Package Drawing (Sheet 2 of 2)......................... 15
Figure 4. Vertical Lock-Down Alignment Feature................................................. 18
Figure 5. Various Types of Solder Crack ...........................................................18
Figure 6. Case Study #1: Top view — Poor μATX Chassis Layout Design for
Intel® Celeron® Processor 200 Sequence on Intel® Desktop Board
D201GLY2 (chassis cover removed for illustration)................................
Figure 7. Case Study #2: Relocate System Fan to CAG Venting for Airflow
Improvement ..................................................................................
Figure 8. Case Study#3: An μATX Chassis Equipped with Two Exhaust Fans ...........24
Figure 9. Case Study #4: A “Top Mount Fan” PSU is located next to Processor
in μATX Chassis for System Thermal Performance Improvement .............
Figure 10. Processor Thermal Characterization Parameter Relationships................. 29
Figure 11. Locations for Measuring Local Ambient Temperature, Active Heatsink .....31
Figure 12. Locations for Measuring Local Ambient Temperature, Passive Heatsink ... 32
Figure 13. Precision Resistor Connected in-series with Processor Circuitry for
Power Measurement .........................................................................
Figure 14. Installation of Isotek Resistor on Intel® Desktop Board D201GLY2 to
Setup Connection for Power Measurement ..........................................
Figure 15. Probing Resistance of the Soldered Walsin Resistor (R =19.6 KΩ)
on Intel
®
Desktop Board D201GLY2 to Ensure Proper Attachment ..........35
Figure 16. Precision Resistor Soldered on on Intel® Desktop Board D201GLY2,
and Connected to netDAQ for Voltage Measurement .............................
Figure 17. Random Vibration PSD..................................................................... 38
Figure 18. Shock Acceleration Curve................................................................. 39
Figure 19. Top Plate and Package Simulator Fasten onto Clip Force Measurement
Machine.........................................................................................
Figure 20. Anchors Installed and Glued Down the BTX Base Plate – for reference only46
Figure 21. Motherboard Keep-out Footprint Definition and Height Restrictions for
Enabling Components ......................................................................
Figure 22. Reference Clip E21952-001 ..............................................................51
Figure 23. Reference Heatsink D96271-001 ....................................................... 52
Figure 24. Intel
®
Boxed Processor Thermal Solution E21953-001 ..........................53
23
24
25
34
34
35
45
50
4 Thermal and Mechanical Design Guidelines
Tables
Table 1. Micro-FCBGA Package Mechanical Specifications..................................... 12
Table 2. Thermal Specifications for Intel® Celeron
®
Processor 200 Sequence .......... 19
Table 3. System Thermal Solution Design Requirement .......................................22
Table 4. Test Accessories ................................................................................33
Table 5. Typical Test Equipment....................................................................... 44
Table 6. Intel
®
Boxed Processor Thermal Solution Providers................................. 47
Thermal and Mechanical Design Guidelines 5
Revision History
Revision
Number
-001 • Initial Release October 2007
Description Revision Date
§
6 Thermal and Mechanical Design Guidelines
Introduction
1 Introduction
1.1 Document Goals and Scope
1.1.1 Importance of Thermal Management
The objective of thermal management is to ensure that the temperatures of all
components in a system are maintained within their functional temperature range.
Within this temperature range, a component is expected to meet its specified
performance. Operation outside the functional temperature range can degrade
system performance, cause logic errors or cause component and/or system damage.
Temperatures exceeding the maximum operating limit of a component may result in
irreversible changes in the operating characteristics of this component.
In a system environment, the processor temperature is a function of both system and
component thermal characteristics. The system level thermal constraints consist of
the local ambient air temperature and airflow over the processor as well as the
physical constraints at and above the processor. The processor temperature depends
in particular on the component power dissipation, the processor package thermal
characteristics, and the processor thermal solution.
All of these parameters are affected by the continued push of technology to increase
processor performance levels and packaging density (more transistors). As operating
frequencies increase and packaging size decreases, the power density increases while
the thermal solution space and airflow typically become more constrained or remains
the same within the system. The result is an increased importance on system design
to ensure that thermal design requirements are met for each component, including
the processor, in the system.
1.1.2 Document Goals
Depending on the type of system and the chassis characteristics, new system and
component designs may be required to provide adequate cooling for the processor.
The goal of this document is to provide an understanding of these thermal
characteristics and discuss guidelines for meeting the thermal requirements imposed
on single processor systems using the Intel
The concepts given in this document are applicable to any system form factor.
Specific examples used will be the Intel enabled reference solution for a system.
®
Celeron® processor 200 sequence.
Thermal and Mechanical Design Guidelines 7
1.1.3 Document Scope
This design guide supports the following processors:
®
• Intel
In this document the Intel Celeron Processor 200 sequence will be referred to as “the
processor”.
In this document when a reference is made to “the processor” it is intended that this
includes all the processors supported by this document. If needed for clarity, the
specific processor will be listed.
Celeron® Processor 200 sequence applies to the Intel® Celeron® processor
220.
Introduction
In this document, when a reference is made to “datasheet”, the reader should refer to
the Intel
®
Celeron® Processor 200 Sequence Datasheet. If needed for clarity, the
specific processor datasheet will be referenced.
In this document, when a reference is made to the “the reference design” it is
intended that this includes all reference designs (D16869-001 and D96271-001)
supported by this document. If needed for clarify, the specific reference design will be
listed.
Chapter
2 of this document discusses package thermal mechanical requirements to
design a thermal solution for the Intel Celeron processor 200 sequence in the context
of personal computer applications. Chapter
3 discusses the thermal solution
considerations and metrology recommendations to validate a processor thermal
solution. Chapter
4 gives information on the Intel reference thermal solution for the
processor in a system application.
The physical dimensions and thermal specifications of the processor that are used in
this document are for illustration only. Refer to the Datasheet for the product
dimensions, thermal power dissipation, and maximum junction temperature. In case
of conflict, the data in the datasheet supersedes any data in this document.
8 Thermal and Mechanical Design Guidelines
Introduction
1.2 Reference Documents
Material and concepts available in the following documents may be beneficial when
reading this document.
Document Document
Intel® Celeron® Processor 200 Sequence Datasheet http://developer.intel
Power Supply Design Guide for Desktop Platform Form Factors (Rev
1.1)
ATX Thermal Design Suggestions http://www.formfactors.
microATX Thermal Design Suggestions http://www.formfactors.
Balanced Technology Extended (BTX) System Design Guide http://www.formfactors.
Thermally Advantaged Chassis version 1.1 http://www.intel.com/g
1.3 Definition of Terms
Term Description
No./Location
.com/design/processo
r/datashts/318546.ht
m
http://www.formfacto
rs.org/
org/
org/
org/
o/chassis/
The measured ambient temperature locally surrounding the processor. The
TA
TJ Processor junction temperature.
T
S-TOP
ΨJA
ΨJS
ΨSA
Thermal and Mechanical Design Guidelines 9
ambient temperature should be measured just upstream of a passive heatsink or
at the fan inlet for an active heatsink.
Heatsink temperature measured at vicinity to center on the top surface of
heatsink base.
Junction-to-ambient thermal characterization parameter (psi). A measure of
thermal solution performance using total package power. Defined as
– TA) / Total Package Power.
(T
J
Note: Heat source must be specified for Ψ measurements.
Junction-to-sink thermal characterization parameter. A measure of thermal
interface material performance using total package power. Defined as
– TS) / Total Package Power.
(T
J
Note: Heat source must be specified for Ψ measurements.
Sink-to-ambient thermal characterization parameter. A measure of heatsink
thermal performance using total package power. Defined as
Introduction
Term Description
(TS – TA) / Total Package Power.
Note: Heat source must be specified for Ψ measurements.
Thermal Interface Material: The thermally conductive compound between the
TIM
heatsink and the processor die surface. This material fills the air gaps and voids,
and enhances the transfer of the heat from the processor die surface to the
heatsink.
PD
Processor total power dissipation (assuming all power dissipates through the
processor die).
Thermal Design Power: a power dissipation target based on worst-case
TDP
applications. Thermal solutions should be designed to dissipate the thermal
design power.
P
USAGE
Maximum usage power of processor when running SysMark utility.
§
10 Thermal and Mechanical Design Guidelines
Processor Thermal/Mechanical Information
2 Processor Thermal/Mechanical
Information
2.1 Mechanical Requirements
2.1.1 Processor Package
The Intel Celeron processor 200 sequence is available in a 479-pin Micro-FCBGA
package, as shown in
Array (FC-BGA6) package technology that directly solder down to a 479-pin footprint
on PCB surface.
Figure 1 to Figure 3. The processor uses a Flip-Chip Ball Grid
Mechanical specifications of the package are listed in
for detailed mechanical specifications. In case of conflict, the package dimensions in
the datasheet supersedes dimensions provided in this document.
The processor package has mechanical load limits that are specified in the processor
datasheet. The specified maximum static and dynamic load limits should not be
exceeded during their respective stress conditions. These include heatsink
installation, removal, mechanical stress testing, and standard shipping conditions.
• When a compressive static load is necessary to ensure thermal performance of the
thermal interface material between the heatsink base and the processor die, it
should not exceed the corresponding specification given in the processor
datasheet.
• When a compressive static load is necessary to ensure mechanical performance, it
should remain in the minimum/maximum range specified in the processor
datasheet.
No portion of the substrate should be used as a mechanical reference or load-bearing
surface for the thermal or mechanical solution.
The processor datasheet provides package handling guidelines in terms of maximum
recommended shear, tensile and torque loads for the processor substrate. These
recommendations should be followed in particular for heatsink removal operations.
Table 1. Refer to the datasheet
Thermal and Mechanical Design Guidelines 11
Processor Thermal/Mechanical Information
Table 1. Micro-FCBGA Package Mechanical Specifications
Symbol Parameter Min Max Unit Figure
B1 Package substrate width 34.95 35.05 mm Figure 2
B2 Package substrate length 34.95 35.05 mm Figure 2
C1 Die width 11.1 mm Figure 2
C2 Die length 8.2 mm Figure 2
F2 Die height (with underfill)
F3 Package overall height
(package substrate to
die)
G1 Width (first ball center to
last ball center)
G2 Length (first ball center
to last ball center)
J1 Ball pitch (horizontal) 1.27 Basic mm Figure 2
J2 Ball pitch (vertical) 1.27 Basic mm Figure 2
M Solder Resist Opening 0.61 0.69 mm Figure 2
N Ball height 0.6 0.8 mm Figure 2
-- Corner Keep-out zone at
corner (4X)
-- Keep-out from edge of
package (4X)
-- Package edge to first ball
center
P
Allowable pressure on
die
the die for thermal
solution
W Package weight 6 g
0.89 mm Figure 2
2.022 Max mm
31.75 Basic mm Figure 2
31.75 Basic mm Figure 2
7 × 7 mm Figure 3
5 mm Figure 3
1.625 mm Figure 3
689 kPa
Figure 2
NOTE:
1. All dimensions are subject to change.
2. Overall height as delivered. Values were based on design specifications and tolerances.
Final height after surface mount depends on OEM motherboard design and SMT
process.
12 Thermal and Mechanical Design Guidelines
Processor Thermal/Mechanical Information
Figure 1. Micro-FCBGA Processor Package Drawing – Isometric View
Thermal and Mechanical Design Guidelines 13
Processor Thermal/Mechanical Information
Figure 2. Micro-FCBGA Processor Package Drawing (Sheet 1 of 2)
NOTE: All dimensions in millimeters. Values shown are for reference only. See Table 1 for
14 Thermal and Mechanical Design Guidelines
specific details.
Processor Thermal/Mechanical Information
Figure 3. Micro-FCBGA Processor Package Drawing (Sheet 2 of 2)
NOTE: All dimensions in millimeters. Values shown are for reference only. See Table 1 for
Thermal and Mechanical Design Guidelines 15
specific details.
2.1.2 Heatsink Attach
2.1.2.1 General Guidelines
The micro-FCBGA package may have capacitors placed in the area surrounding the
processor die. The die-side capacitors, which are only slightly shorter than the die
height, are electrically conductive and contact with electrically conductive materials
should be avoided. The use of an insulating material between the capacitors and any
thermal and mechanical solution should be considered to prevent capacitors shorting.
A thermal and mechanical solution design must not intrude into the required keep-out
zones as specified in the datasheet.
There are no features on the 479-pins micro-FCBGA package for direct heatsink
attachment: a mechanism must be designed to attach the heatsink directly to the
motherboard. In addition to holding the heatsink in place on top of the processor die,
this mechanism plays a significant role in the robustness of the system in which it is
implemented, in particular:
• Ensuring thermal performance of the thermal interface material (TIM) applied
between the processor die and the heatsink. TIMs based on phase change
materials are very sensitive to applied pressure: the higher the pressure, the
better the initial performance. Designs should incorporate a possible decrease in
applied pressure over time due to potential structural relaxation in retention
components (creep effect causing clip to lose its preload and causing anchor pullout). It is not recommended to use TIMs such as thermal greases onto small bare
die package, due to the TIM “pump-out” concern after heatsink is assembled.
• Ensuring system electrical, thermal, and structural integrity under shock and
vibration events. The mechanical requirements of the heatsink attach mechanism
depend on the mass of the heatsink and the level of shock and vibration that the
system must support. The overall structural design of the motherboard and the
system should be considered in designing the heatsink attach mechanism. The
design should provide a means for protecting the solder joints.
Processor Thermal/Mechanical Information
2.1.2.2 Heatsink Clip Load Requirement
The attach mechanism for the heatsink developed to support the processor creates a
nominal static compressive preload on the package of 9.9 lbf ± 1.2 lbf throughout the
life of the product for designs compliant with the Intel reference design assumptions:
• Using TIM Honeywell PCM45F (pad version).
• 55.88 mm (2.2”) x 54.88 mm (2.16”) attach pattern. Refer to
heatsink keep-out zone.
• And no board stiffening device (backing plate, chassis attach, etc.).
The minimum load is required to thermal performance while protecting solder joint
against fatigue failure in temperature cycling.
Notes the load range above is required to ensure a minimum load of 8.7lbf at end-oflife. The tolerance and nominal load is based on reference design and will slightly
differ on alternate thermal solution provided by third party.
It is important to take into account potential load degradation from creep over time
when designing the clip or fastener to the required minimum load. This means that,
16 Thermal and Mechanical Design Guidelines
Figure 21 for
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