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July 2003000First internal draft of this document.
Intel® 41210 Serial to Parallel PCI Bridge Design Guidev
Information
Added signals to Section 8.3.1
Updated Table 19, Table 20, and Table 21
Updated PCI Express operation information in Section 2.1 and
Table 19.
Added signal NC17 information in Table 21.
Updated content; second draft of this document; initial public
release of this document.
Contents
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viIntel® 41210 Serial to Parallel PCI Bridge Design Guide
About This Document1
This document provides layout i nformation and guide lines for designing p latform or add-in board
applications with the Intel
®
41210 Serial to Parall el PCI Br idge (also c alled the 41 210 Bridge). I t is
recommended that this document be used as a guideline. Intel r ecommen ds emp l oyi ng b est -k now n
design practices with board level simulation, signal integrity testing and validation for a robust
design.
Designers should note that this guide focuses upon specific design considerations for the 41210
Bridge and is not intended to be an all-inclusive list of all good design practices. Use this guide as
a starting point and use empirical data to optimize your particular design.
1.1Terminology and Definitions
Table 1 provides a list of terms and definitions that may be useful when working with the 41210
Bridge product.
Table 1. Terminology and Definitions (Sheet 1 of 2)
TermDefinition
Stripline
Stripline in a PCB is composed of the
conductor inserted in a dielectric with GND
planes to the top and bottom.
NOTE: An easy way to distinguish stripline
from microstrip is that you need to
strip away layers of the board to view
the trace on stripline.
Microstrip
Prepreg
Core
Intel® 41210 Serial to Parallel PCI Bridge Design Guide7
Material used for the lamination process of manufacturing PCBs. It consists of a layer of
epoxy material that is placed between two cores. This layer melts into epoxy when heated and
forms around adjacent traces.
Material used for the lamination process of manufacturing PCBs. This material is two sided
laminate with copper on each side. The core is an internal layer that is etched.
Microstrip in a PCB is composed of the
conductor on the top layer above the dielectric
with a ground plane below
About This Document
Table 1. Terminology and Definitions (Sheet 2 of 2)
TermDefinition
Layer 1: copper
Prepreg
Layer 2: GND
Core
PCB
Example of a Four-Layer Stack
SSTL_2Series Stub Terminated Logic for 2.5 V
JEDECProvides standards for the semiconductor industry.
A network that transmits a coupled signal to another network is aggressor network.
Aggressor
VictimA network that receives a coupled cross-talk signal from another network is a victim network.
NetworkThe trace of a PCB that completes an electrical connection between two or more components.
StubBranch from a trunk terminating at the pad of an agent.
CRBCustomer Reference Board
Downstream
Upstream
Local memory
DWORD32-bit data word.
Flip Chip
Mode
Conversion
PCI-EPCI-Express
Downstream refers either to the relative position of an interconnect/system element (Link/
device) as something that is farther from the Root Complex, or to a direction of information
flow, i.e., when information is flowing away from the Root Complex.
Memory subsystem on the Intel XScale
busses.
FC-BGA (flip chip-ball grid array) chip packages are designed with processor core flipped up
on the back of the chip, facing away from the PCB. This allows more efficient cooling of the
package.
Mode Conversions are due to imperfections on the interconnect which transform differential
mode voltage to common mode voltage and common mode voltage to differential voltage.
Zo
Layer 3: VCC15
Prepreg
Layer 4: copper
Zo
Victim Network
Aggressor Network
Printed circuit board.
Example manufacturing process consists of
the following steps:
• Consists of alternating layers of core and
prepreg stacked
• The finished PCB is heated and cured.
• The via holes are drilled
• Plating covers holes and outer surfaces
• Etching removes unwanted copper
• Board is tinned, coated with solder mask
and silk screened
Zo
Zo
®
core DDR SDRAM or Peripheral Bus Interface
8Intel® 41210 Serial to Parallel PCI Bridge Design Guide
Introduction2
The Intel®41210 Serial to Parallel PCI Bridge integrates two PCI Express-to-PCI bridges. Each
bridge follows the PCI-to-PCI Bridge programming model. The PCI Express port is compliant to
the PCI Express Specification, Revision 1.0. The two PCI bus interfaces are fully compliant to the
PCI Local Bus Specification, Revision 2.3.
Intel® 41210 Serial to Parallel PCI Bridge Design Guide11
Introduction
2.5JTAG
• Compliant with IEEE Standard Test Access Port and Boundary Scan Architecture 1149.1a
2.6Related Documents
• Intel® 41210 Serial to Parallel PCI Bridge Design Specification (EDS), Revision 1.0.
• PCI Express Specification, Revision 1.0, from www.pci-sig.com.
• PCI Express Design Guide, Revision 0.5
• PCI Local Bus Specification, Revision 2.3, from www.pci-sig.com.
• PCI-X Addendum to the PCI Local Bus Specification, Revision 1.0a, from www.pci-sig.com.
• IEEE Standard Test Access Port and Boundary Scan Architecture 1149.1a
• System Management Bus Specification, Revision 2.0
Figure 3. 41210 Bridge Block Diagram
PCI-Express x8
JTAGSMB Bus
fi
Intel
41210 Bridge
B_PCLKIA_PCLKI
A
Bus Arbiter
A
Clock Buffer
B
Bus Arbiter
B
Clock Buffer
A Bus PCI-X 133MHz
6 REQ/GNT Pairs
6 A_PCLKO
B Bus PCI-X 133MHz
6 REQ/GNT Pairs
6 B_PCLKO
B2709-01
12Intel® 41210 Serial to Parallel PCI Bridge Design Guide
2.7Intel®41210 Serial to Parallel PCI Bridge
Applications
This section provides a block diagram for a typical the 41210 Bridge application. This application
shows a PCI-E adapter card with two Dual 2Gb Fibre Channel controllers. Each of the PCI-X bus
segments is connected to the Dual 2Gb Fibre Channel chip running at 133MHz. The two Dual FC
chips provides the four 2Gb/s outputs.
Figure 4. Intel
®
41210 Bridge Adapter Card Block Diagram
Introduction
I2C Micro
Controller
®
41210
Intel
Bridge
PCI-X to
PCI Express
PCI Express
(to Server)
SFP Optical
Dual 2Gb
FC
133 MHz
PCI-X
Dual 2Gb
FC
This is locally configurable from SMBus or
PCI-X interfaces (no BIOS support or Drivers
required)
SFP Optical
SFP Optical
SFP Optical
Module
Module
Module
Module
2 Gb/s
2 Gb/s
2 Gb/s
2 Gb/s
B1491-02
Intel® 41210 Serial to Parallel PCI Bridge Design Guide13
Introduction
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14Intel® 41210 Serial to Parallel PCI Bridge Design Guide
Package Information3
3.1Package Specification
The 41210 Bridge is in a 567-ball FCBGA package, 31mm X 31mm in size, with a 1.27mm ball
pitch.