Intel 3210, 3200 Thermal/mechanical Design Manual
Intel® 3210 and 3200 Chipset
Thermal/Mechanical Design Guide
November 2007
Reference Number: 318465 Revision: 001
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®
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2 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Contents
1Introduction..............................................................................................................7
1.1 Design Flow........................................................................................................8
1.2 Definition of Terms..............................................................................................8
1.3 Reference Documents......................... ......................... .. .......................... .. ..........9
2 Packaging Technology.............................................................................................11
2.1 Non-Critical to Function Solder Joints...................................................................13
2.2 Package Mechanical Requirements................................................ .......................13
3 Thermal Specifications ............................................................................................15
3.1 Thermal Design Power (TDP) ..............................................................................15
3.2 Thermal Specification.........................................................................................15
4 Thermal Simulation .................................................................................................17
5 Thermal Metrology ..................................................................................................19
5.1 MCH Case Measurement.....................................................................................19
5.1.1 Supporting Test Equipment......................................................................19
5.1.2 Thermal Calibration and Controls..............................................................20
5.1.3 IHS Groove ...........................................................................................20
5.1.4 Thermocouple Attach Procedure...............................................................22
6 Reference Thermal Solution.....................................................................................35
6.1 Operating Environment.......................................... .. .. .. ......................................35
6.2 Heatsink Performance........................................................................................35
6.3 Mechanical Design Envelope ...............................................................................36
6.4 Thermal Solution Assembly.................................................................................36
6.4.1 Extruded Heatsink Profiles.......................................................................37
6.4.2 Retention Mechanism Responding in Shock and Vibration.............................38
6.4.3 Thermal Interface Material.......................................................................38
6.4.4 Reference Thermal Solution Assembly Process........ ....................................39
6.5 Reliability Guidelines.......................................................................................... 40
A Thermal Solution Component Suppliers ...................................................................43
A.1 Heatsink Thermal Solution..................................................................................43
B Mechanical Drawings...............................................................................................45
Figures
1-1 Thermal Design Process .......................................................................................8
2-1 MCH Package Dimensions (Top View)................................................ ...................11
2-2 MCH Package Height..........................................................................................11
2-3 MCH Package Dimensions (Bottom View)..............................................................12
2-4 Non-Critical to Function Solder Joints...................................................................13
2-5 Package Height.......................... .. .................................................. .. ... .. ............14
5-1 Omega Thermocouple........................................................................................20
5-2 FCBGA7 Chipset Package Reference Groove Drawing..............................................21
5-3 IHS Groove on the FCBGA7 Chipset Package on the Live Board................................21
5-4 The Live Board on the Fixture Plate......................................................................22
5-5 Inspection of Insulation on Thermocouple.............................................................23
5-6 Bending the Tip of the Thermocouple...................................................................23
5-7 Extending Slightly the Exposed Wire over the End of Groove ................................... 24
5-8 Securing Thermocouple Wire with Kapton* Tape Prior to Attach............................. ..24
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 3
5-9 Detailed Thermocouple Bead Placement................................................................25
5-10 Tapes Installation ..............................................................................................25
5-11 Placing Thermocouple Bead into the Bottom of the Groove......................................26
5-12 Second Tape Installation.....................................................................................26
5-13 Measuring Resistance between Thermocouple and IHS............................................27
5-14 Adding a Small Amount of Past Flux to the Bead for Soldering .................................27
5-15 Cutting Solder...................................................................................................28
5-16 Positioning Solder on IHS....................................................................................28
5-17 Solder Block Setup.............................. .. .. ................................................... .. .. ....29
5-18 Observing the Solder Melting...............................................................................30
5-19 Pushing Solder Back into the End of Groove ..........................................................30
5-20 Remove Excess Solder....................... .. .. ........................... ..................................31
5-21 Thermocouple Placed into Groove ........................................................................32
5-22 Remove Excess Solder....................... .. .. ........................... ..................................32
5-23 Fill Groove with Adhesive....................................................................................33
5-24 Finished Thermocouple Installation.......................................................................34
6-1 Reference Heatsink Measured Thermal Performance vs. Approach Velocity ................36
6-2 Design Concept for Reference Thermal Solution.....................................................37
6-3 Heatsink Extrusion Profiles..................................................................................37
6-4 Reference Thermal Solution Assembly Process - Heatsink Sub-Assembly (Step 1).......39
6-5 Reference Thermal Solution Assembly Process - Heatsink Assembly (Step 2) .............40
B-1 Intel® 3210 and 3200 Chipset Package Drawing........................................... .........46
B-2 Intel® 3210 and 3200 Chipset Motherboard Component
Top-Side Keep-Out Restrictions ...........................................................................47
B-3 Intel® 3210 and 3200 Chipset Motherboard Component
Back-Side Keep-Out Restrictions..........................................................................48
B-4 Intel® 3210 and 3200 Chipset Reference Thermal Solution Assembly.......................49
B-5 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Heatsink Drawing..........50
B-6 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Spring Preload Clip........51
B-7 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Fastener Nut................52
B-8 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Bracket (1 of 2)............53
B-9 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Bracket (2 of 2)............54
B-10 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Backplate Assembly ......55
B-11 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Backplate.....................56
B-12 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Insulator......................57
B-13 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Flush Mount Stud ..........58
Tables
3-1 Intel® 3210 Chipset Thermal Specifications ....................... ...................................15
3-2 Intel® 3200 Chipset Thermal Specifications ....................... ...................................15
5-1 Thermocouple Attach Support Equipment..............................................................19
6-1 Honeywell PCM45F* TIM Performance as a Function of Attach Pressure.....................38
6-2 Reference Thermal Solution Environmental Reliability Guidelines..............................41
4 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Revision History
Document
Number
318465 001 • Initial release of the document. November 2007
Revision
Number
Description Date
§
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 5
6 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Introduction
1 Introduction
As the complexity of computer systems increases, so do the power dissipation
requirements. Care must be taken to ensure that the additional power is properly
dissipated. Typical methods to improve heat dissipation include selective use of
ducting, and/or passive heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for
• Describe a reference thermal solution that meets the specification of
Properly designed thermal solutions provide adequate cooling to maintain Intel® 3210
and 3200 Chipsets die temperatures at or below thermal specifications. This is
accomplished by providing a low local-ambient temperature, ensuring adequate local
airflow, and minimizing the die to local-ambient thermal resistance. By maintaining
Intel
system designer can ensure the proper functionality, performance, and reliability of the
chipset. Operation outside the functional limits can degrade system performance and
may cause permanent changes in the operating characteristics of the component.
®
Intel
Intel® 3210 and 3200 Chipsets.
3210 and 3200 Chipsets.
®
3210 and 3200 Chipsets die temperature at or below the specified limits, a
The simplest and most cost-effective method to improve the inherent system cooling
characteristics is through careful chassis design and placement of fans, vents, and
ducts. When additional cooling is required, component thermal solutions may be
implemented in conjunction with system thermal solutions. The size of the fan or
heatsink can be varied to balance size and space constraints with acoustic noise.
This document addresses thermal design and specifications for Intel
Chipsets components only. For thermal design information on other chipset
components, refer to the respective component datasheet. F or the Intel® ICH9, refer to
the Intel
Note: Unless otherwise specified, the term “MCH” refers to the Intel
Chipsets.
®
I/O Controller Hub9 (ICH9) Thermal Design Guidelines.
®
3210 and 3200
®
3210 and 3200
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 7
1.1 Design Flow
Figure 1-1. Thermal Design Process
Step 1: Thermal
Simulation
y Thermal Model
y Thermal Model User's Guide
1.2 Definition of Terms
FC-BGA Flip Chip Ball Grid Array. A package type defined by a plastic
substrate where a die is mounted using an underfill C4
(Controlled Collapse Chip Connection) attach style. The primary
electrical interface is an array of solder balls attached to the
substrate opposite the die. Note that the device arrives at the
customer with solder balls attached.
BLT Bond line thickness. Final settled thickness of the thermal
interface material after installation of heatsink.
MCH Memory controller hub. The chipset component contains the
processor interface, the memory interface, the PCI Express*
interface and the DMI interface.
ICH I/O controller hub. The chipset component contains the MCH
interface, the SATA interface, the USB interface, the IDE
interface, the LPC interface, and so forth.
IHS Integrated Heat Spreader. A thermally conductive lid integrated
into the package to improve heat transfer to a thermal solution
through heat spreading.
T
case_max
T
case_min
TDP Thermal design power. Thermal solutions should be designed to
TIM Thermal Interface Material. Thermally conductive material
T
LA
Maximum die or IHS temperature allowed. This temperature is
measured at the geometric center of the top of the package die
or IHS.
Minimum die or IHS temperature allowed. This temperature is
measured at the geometric center of the top of the package die
or IHS.
dissipate this target power level. TDP is not the maximum power
that the chipset can dissipate.
installed between two surfaces to improve heat transfer and
reduce interface contact resistance.
The local ambient air temperature at the component of interest.
The local ambient temperature should be measured just
Introduction
Step 2: Heatsink Selection
y Thermal Reference
y Mechanical Reference
Step 3: Thermal Validation
y Thermal Testing Software
y Software User's Guide
001239
8 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Introduction
upstream of airflow for a passive heatsink or at the fan inlet for
an active heatsink.
Ψ
Case-to-ambient thermal solution characterization parameter
CA
(Psi). A measure of thermal solution performance using total
package power. Defined as (T
source size should always be specified for Ψ measurements.
1.3 Reference Documents
The reader of this specification should also be familiar with material and concepts
presented in the following documents:
Document Title Document Number / Location
®
Intel
I/O Controller Hub9 (ICH9) Thermal Design Guidelines Contact your Intel Field Sales
®
Intel
3210 and 3200 Chipset Datasheet www.developer.intel.com
®
Intel
3210 and 3200 Chipset Specification Update www.developer.intel.com
Dual-Core Intel
Quad-Core Intel
BGA/OLGA Assembly Development Guide Contact your Intel Field Sales
Various system thermal design suggestions http://www.formfactors.org
®
Xeon® Processor 3000 Series Datasheet www.developer.intel.com
®
Xeon® Processor 3200 Series Datasheet www.developer.intel.com
- TLA)/T otal Package Power. Heat
C
Representative
Representative
Note: Contact your Intel field sales representative for the latest revision and order number of this document.
§
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 9
Introduction
10 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Packaging Technology
2 Packaging Technology
The Intel® 3210 and 3200 Chipset consists of two individual components: the Memory
Controller Hub (MCH) and the Intel® I/O Controller (Intel® ICH9). The Intel® 3210 and
3200 Chipset MCH component uses a 40 mm [1.57 in] x 40 mm [1.57 in] Flip Chip Ball
Grid Array (FC-BGA) package with an integrated heat spreader (IHS) and 1300 solder
balls. A mechanical drawing of the package is shown in Figure 2-1. For information on
the Intel
Design Guidelines.
Figure 2-1. MCH Package Dimensions (Top View)
®
ICH9 package, refer to the Intel® I/O Controller Hub9 (ICH9) Thermal
Figure 2-2. MCH Package Height
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 11
Figure 2-3. MCH Package Dimensions (Bottom View)
Packaging Technology
Notes:
1. All dimensions are in millimeters.
2. All dimensions and tolerances conform to ANSI Y14.5 - 1994.
12 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Packaging Technology
2.1 Non-Critical to Function Solder Joints
Figure 2-4. Non-Critical to Function Solder Joints
Intel has defined selected solder joints of the MCH as non-critical to function (NCTF)
when evaluating package solder joints post environmental testing. The MCH signals at
NCTF locations are typically redundant ground or no-critical reserved, so the loss of the
solder joint continuity at end of life conditions will not affect the overall product
functionality. Figure 2-4 identifies the NCTF solder joints of the MCH package.
2.2 Package Mechanical Requirements
The Intel® 3210 and 3200 Chipset package has an Integrated Heat Spreader (IHS)
which is capable of sustaining a maximum static normal load of 15-lbf. This mechanical
maximum load limit should not be exceeded during heatsink assembly, shipping
conditions, or standard use conditions. Also, any mechanical system or component
testing should not exceed the maximum limit. The package substrate should not be
used as a mechanical reference or load-bearing surface for the thermal and mechanical
solution.
Notes:
1. These specifications apply to uniform compressive loading in a direction normal to
the package.
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 13
2. This is the maximum force that can be applied by a heatsink retention clip. The clip
must also provide the minimum specified load of 7.6 lbf on the package to ensure
TIM performance assuming even distribution of the load.
3. These specifications are based on limited testing for design characterization.
Loading limits are for the package only.
To ensure that the package static load limit is not exceeded, the designer should
understand the post reflow package height shown in Figure 2-5. The following figure
shows the nominal post-reflow package height assumed for calculation of a heatsink
clip preload of the reference design. Please refer to the package drawing in Figure 2-1
to perform a detailed analysis.
Figure 2-5. Package Height
Packaging Technology
§
14 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Thermal Specifications
3 Thermal Specifications
3.1 Thermal Design Power (TDP)
Analysis indicates that real applications are unlikely to cause the MCH component to
consume maximum power dissipation for sustained time periods. Therefore, in order to
arrive at a more realistic power level for thermal design purposes, Intel characterizes
power consumption based on known platform benchmark applications. The resulting
power consumption is referred to as the Thermal Design Power (TDP). TDP is the target
power level that the thermal solutions should be designed to. TDP is not the maximum
power that the chipset can dissipate.
®
For TDP specifications, see Table 3-1 for Intel
3200. FC-BGA packages have poor heat transfer capability into the board and have
minimal thermal capability without a thermal solution. Intel recommends that system
designers plan for a heatsink when using the Intel
3.2 Thermal Specification
3210 Chipset and Table 3-2 for Intel®
®
3210 and 3200 Chipset.
To ensure proper operation and reliability of the Intel® 3210 and 3200 Chipset, the
case temperatures must be at or between the maximum/minimum operating
temperature ranges as specified in Table 3-1 and Table 3-2. System and/or component
level thermal solutions are required to maintain these temperature specifications. Refer
to Chapter 5 for guidelines on accurately measuring package die temperatures.
Table 3-1. Intel® 3210 Chipset Thermal Specifications
Parameter Value Notes
T
case_max
T
case_min
TDP
dual channel
TDP
dual channel
P
Idle_max
Notes:
1. The above specifications are based on post-si analysis.
2. The maximum idle power is the worst-case idle power with L1 ASPM state.
96 °C
5 °C
20.2 W DDR2-667
21.3 W DDR2-800
11.3 W
Table 3-2. Intel® 3200 Chipset Thermal Specifications
Parameter Value Notes
T
case_max
T
case_min
TDP
dual channel
TDP
dual channel
P
Idle_max
97 °C
5 °C
18.9 W DDR2-667
20.0 W DDR2-800
11.3 W
Notes:
1. The above specifications are based on post-silicon analysis.
2. The maximum idle power is the worst case idle power with L1 ASPM state.
§
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 15
Thermal Specifications
16 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Thermal Simulation
4 Thermal Simulation
Intel provides thermal simulation models of the Intel® 3210 and 3200 Chipset and
associated user's guides to aid system designers in simulating, analyzing, and
optimizing their thermal solutions in an integrated, system-level environment. The
models are for use with the commercially available Computational Fluid Dynamics
(CFD)-based thermal analysis tool FLOTHERM* (version 5.1 or higher) by Flomerics,
Inc. Contact your Intel field sales representative for the information of the thermal
models and user's guides.
§
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 17
Thermal Simulation
18 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
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