INFICON MDC-370 User Manual
OPERATION AND SERVICE MANUAL
MODEL MDC-370
MAXTEK AVERAGING DEPOSITION CONTROLLE R
P/N 600800
S/N _____________
MAXTEK, INC.
http://www.maxtekinc.com
11980 Telegraph Road, Santa Fe Springs, CA 90670
Tel: (562) 906-1515 • Fax: (562) 906-1622
Email: sales@maxteki nc. co m • support@maxtekinc.com
© 2000 MAXTEK, INC. All rights reserved.
First Edition, March 2000
Second Edition February 2001
ii
WARRANTY
Maxtek, Inc. warrants the product to be free of functional defects in material and
workmanship and that it will perform in accordance with its published
specification for a period of (twenty-four) 24 months.
The foregoing warranty is subject to the condition that the product be properly
operated in accordance with instructions provided by Maxtek, Inc. or has not been
subjected to improper installation or abuse, misuse, negligence, accident,
corrosion, or damage during shipment.
Purchaser's sole and exclusive remedy under the above warranty is limited to, at
Maxtek's option, repair or replacement of defective equipment or return to
purchaser of the original purchase price. Transportation charges must be prepaid
and upon examination by Maxtek the equipment must be found not to comply
with the above warranty. In the event that Maxtek elects to refund the purchase
price, the equipment shall be the property of Maxtek.
This warranty is in lieu of all other warranties, expressed or implied and
constitutes fulfillment of all of Maxtek's liabilities to the purchaser. Maxtek does
not warrant that the product can be used for any particular purpose other than that
covered by the applicable specifications. Maxtek assumes no liability in any
event, for consequential damages, for anticipated or lost profits, incidental
damage of loss of time or other losses incurred by the purchaser or third party in
connection with products covered by this warranty or otherwise.
DISCLOSURE
The disclosure of this information is to assist owners of Maxtek equipment to
properly operate and maintain their equipment, and does not constitute the release
of rights thereof. Reproduction of this information and equipment described
herein is prohibited without prior written consent from Maxtek, Inc., 11980
Telegraph Road, Suite 104, Santa Fe Springs, CA 90670.
SAFETY
All standard safety procedures associated with the safe handling of
electrical equipment must be observed. Always disconnect power when
working inside the controller. Only properly trained personnel should
attempt to service the instrument.
iii
Table of Contents
1. GENERAL DESCRIPTION ............................................................................................. 1-1
1.1 PURPOSE ....................................................................................................................... 1-1
1.2 FEATURES .................................................................................................................... 1-1
1.2.1 MULTI-CRYSTAL AVERAGING ............................................................................... 1-1
1.2.2 EXTENSIVE PROGRAM STORAGE ......................................................................... 1-1
1.2.3 DYNAMIC MEASUREMENT UPDATE RATE .......................................................... 1-1
1.2.4 SUPERIOR GRAPHICS DISPLAY ............................................................................ 1-1
1.2.5 PROGRAM SECURITY .............................................................................................. 1-1
1.2.6 DESIGNED FOR UNATTENDED OPERATION ...................................................... 1-1
1.2.7 FAIL SAFE ABORTS .................................................................................................. 1-2
1.2.8 ABORT STATUS RETENTION .................................................................................. 1-2
1.2.9 RUN COMPLETION ON CRYSTAL FAILURE ......................................................... 1-2
1.2.10 POWERFUL SYSTEM INTERFACE ..................................................................... 1-2
1.2.11 POWER SUPPLY NOISE TOLERANCE ............................................................... 1-2
1.2.12 INTERNATIONAL STANDARD POWER CONNECTOR ..................................... 1-2
1.2.13 FIELD UPGRADABLE ......................................................................................... 1-2
1.3 SPECIFICATIONS ......................................................................................................... 1-3
1.3.1 MEASUREMENT ....................................................................................................... 1-3
1.3.2 DISPLAY .................................................................................................................... 1-3
1.3.3 COMMUNICATION................................................................................................... 1-3
1.3.4 PROGRAM STORAGE CAPACITY ........................................................................... 1-3
1.3.5 PROCESS PARAMETERS ......................................................................................... 1-3
1.3.6 MATERIAL PARAMETERS ....................................................................................... 1-4
1.3.7 INPUT/OUTPUT CAPABILITY ................................................................................. 1-5
1.3.8 SENSOR PARAMETERS ............................................................................................ 1-5
1.3.9 SOURCE PARAMETERS ........................................................................................... 1-6
1.3.10 RECORDER PARAMETERS ................................................................................. 1-6
1.3.11 UTILITY SETUP PARAMETER ............................................................................ 1-6
1.3.12 OTHER .................................................................................................................. 1-6
1.4 ACCESSORIES .............................................................................................................. 1-7
iv
2. FRONT PANEL DISPLAYS AND CONTROLS ........................................................... 2-1
2.1 OPERATING DISPLAYS .............................................................................................. 2-1
2.1.1 RATE .......................................................................................................................... 2-1
2.1.2 POWER ...................................................................................................................... 2-1
2.1.3 THICKNESS ............................................................................................................... 2-1
2.1.4 LAYER NUMBER ....................................................................................................... 2-1
2.1.5 CRYSTAL HEALTH % ............................................................................................... 2-2
2.1.6 TIME DISPLAY .......................................................................................................... 2-2
2.2 PARAMETER/STATUS DISPLAYS ............................................................................ 2-2
2.3 OPERATING CONTROLS ............................................................................................ 2-2
2.3.1 MANUAL KEY ........................................................................................................... 2-2
2.3.2 START KEY ................................................................................................................ 2-3
2.3.3 ABORT KEY ............................................................................................................... 2-3
2.3.4 RESET KEY ................................................................................................................ 2-3
2.3.5 ZERO KEY ................................................................................................................. 2-3
2.3.6 SHUTTER KEY .......................................................................................................... 2-3
2.3.7 STATUS KEY .............................................................................................................. 2-3
2.3.8 GRAPH KEY .............................................................................................................. 2-4
2.3.9 ARROW KEYS ............................................................................................................ 2-4
2.3.10 PROGRAM KEY .................................................................................................... 2-4
2.3.11 ALPHANUMERIC KEYBOARD ............................................................................ 2-5
3. BENCH CHECKOUT & INSPECTION ......................................................................... 3-1
3.1 INSPECTION ..................................................................................................................3-1
3.2 INITIAL POWER UP ......................................................................................................3-1
3.3 SAMPLE PROGRAM .....................................................................................................3-1
3.3.1 MATERIAL #1 PARAMETERS ...................................................................................3-2
3.3.2 MATERIAL #2 PARAMETERS ...................................................................................3-3
3.3.3 PROCESS PARAMETERS ..........................................................................................3-4
3.4 SIMULATE OPERATION ..............................................................................................3-4
3.5 MANUAL OPERATION ................................................................................................3-4
3.6 INSTALLING OPTION BOARDS .................................................................................3-4
3.6.1 SOURCE-SENSOR BOARD .......................................................................................3-5
3.6.2 DISCRETE I/O BOARD ..............................................................................................3-5
3.6.3 IEEE-488 OPTION BOARD .......................................................................................3-5
3.7 DIGITAL TO ANALOG CONVERTER (DAC) CHECKOUT.......................................3-5
4. PROGRAMMING AND CONTROLLER SETUP .........................................................4-1
4.1 GENERAL .......................................................................................................................4-1
4.1.1 NAVIGATING THE MENU STRUCTURE .................................................................4-1
4.1.2 ENTERING ALPHA CHARACTERS ...........................................................................4-2
4.1.3 ENTERING TIME PARAMETERS ..............................................................................4-2
4.1.4 COPYING AND DELETING ......................................................................................4-2
4.1.5 PASSWORD PROTECTION .......................................................................................4-2
4.1.5.1 VIEW/RUN PROCESS PASSWORD ........................................................................... 4-3
4.1.5.2 EDIT PROCESS PASSWORD ...................................................................................... 4-3
4.1.5.3 EDIT MATERIAL PASSWORD ................................................................................... 4-3
4.1.6 ADJUSTING PARAMETER/STATUS DISPLAY CONTRAST ....................................4-3
4.2 GETTING STARTED .....................................................................................................4-3
4.2.1 UTILITY SETUP .........................................................................................................4-4
4.2.2 DAC SETUP ...............................................................................................................4-4
4.2.3 SOURCE SETUP ........................................................................................................4-4
4.2.4 SENSOR SETUP .........................................................................................................4-7
4.2.4.1 EXAMPLE USING MAXTEK’S RSH-600 SIX CRYSTAL SENSOR HEAD ............ 4-9
4.2.5 INPUT, OUTPUT AND ACTION SETUP ..................................................................4-9
4.2.6 DISPLAY SETUP ......................................................................................................4-10
4.2.7 MATERIAL SETUP ...................................................................................................4-11
4.2.7.1 POWER RAMPS .......................................................................................................... 4-11
4.2.7.2 AUTOMATIC CRYSTAL SWITCHING .................................................................... 4-12
4.2.7.3 RATE ESTABLISH ..................................................................................................... 4-12
4.2.7.4 RATE RAMPS ............................................................................................................. 4-12
4.2.7.5 RATE SAMPLE MODE .............................................................................................. 4-13
4.2.7.6 RATE DEVIATION ALARM...................................................................................... 4-13
4.2.8 PROCESS SETUP .....................................................................................................4-13
4.2.9 STARTING A NEW PROCESS ..................................................................................4-13
4.2.10 RESUMING A PROCESS FROM ABORT OR HALT ..........................................4-13
4.3 DETAILED PROGRAMMING ....................................................................................4-14
4.3.1 VIEW/EDIT PROCESS .............................................................................................4-14
4.3.1.1 DEFINE A PROCESS .................................................................................................. 4-14
4.3.2 VIEW/EDIT MATERIAL ...........................................................................................4-16
4.3.2.1 DEFINE A MATERIAL............................................................................................... 4-16
4.3.3 SYSTEM SETUP .......................................................................................................4-24
4.3.3.1 EDIT DISPLAY SETUP .............................................................................................. 4-24
4.3.3.2 PROGRAM INPUTS ................................................................................................... 4-26
4.3.3.3 PROGRAM OUTPUTS................................................................................................ 4-27
4.3.3.4 PROGRAM ACTIO N S ................................................................................................ 4-33
4.3.3.5 EDIT SENSOR SETUP ................................................................................................ 4-35
4.3.3.6 EDIT SOURCE SETUP ............................................................................................... 4-38
4.3.3.7 EDIT DAC SETUP ...................................................................................................... 4-41
4.3.3.8 EDIT UTILITY SETUP ............................................................................................... 4-42
5. OPERATING THE MDC-370 ...........................................................................................5-1
5.1 SIGN-ON SCREEN .........................................................................................................5-1
v
5.2 STARTING A NEW PROCESS ..................................................................................... 5-1
5.3 STARTING A NEW LAYER ......................................................................................... 5-2
5.4 RESUMING AN ABORTED OR HALTED PROCESS ................................................. 5-2
5.5 GRAPH DISPLAYS ........................................................................................................ 5-3
5.6 STATUS DISPLAYS ...................................................................................................... 5-4
5.7 VIEWING RESULTS ..................................................................................................... 5-5
5.8 MODES .......................................................................................................................... 5-7
5.8.1 PROCESS READY...................................................................................................... 5-7
5.8.2 ABORT ....................................................................................................................... 5-7
5.8.3 HALT (SOFT ABORT) ............................................................................................... 5-8
5.8.4 IN PROCESS .............................................................................................................. 5-8
5.8.5 NOT SAMPLING ........................................................................................................ 5-8
5.8.6 PROCESS COMPLETE ............................................................................................. 5-8
5.8.7 MANUAL .................................................................................................................... 5-8
5.8.8 SIMULATE ................................................................................................................. 5-8
5.9 STATES .......................................................................................................................... 5-8
5.10 TROUBLE, ERROR AND WARNING MESSAGES .................................................... 5-8
5.10.1 DESCRIPTION ...................................................................................................... 5-9
5.10.1.1 MIN RATE&MAX POWER........................................................................................ 5-10
5.10.1.2 MAX RATE&MIN POWER........................................................................................ 5-10
5.10.1.3 SYSTEM SETUP MEMORY CORRUPTED .............................................................. 5-10
5.10.1.4 PROCESS MEMORY CORRUPTED ......................................................................... 5-10
5.10.1.5 MATERIAL MEMORY CORRUPTED ...................................................................... 5-10
5.10.1.6 RATE EST. ERROR .................................................................................................... 5-10
5.10.1.7 CRYSTAL FAILURE .................................................................................................. 5-10
5.10.1.8 SOURCE FAULT ........................................................................................................ 5-10
5.10.1.9 SENSOR FAULT ......................................................................................................... 5-11
5.10.1.10 NO SENSORS ENABLED .......................................................................................... 5-11
5.10.1.11 TIME POWER ............................................................................................................. 5-11
5.10.1.12 RATE DEV. ALARM .................................................................................................. 5-11
5.10.1.13 ALARM ACTION ....................................................................................................... 5-11
5.10.1.14 CRYSTAL MARGINAL ............................................................................................. 5-11
5.10.1.15 RATE DEV. ALERT ................................................................................................... 5-11
5.10.1.16 MAX POWER ALERT ................................................................................................ 5-11
5.10.1.17 MIN POWER ALERT ................................................................................................. 5-11
5.10.1.18 ALERT ACTI ON ......................................................................................................... 5-11
5.10.1.19 XTAL FAIL SWITCH ................................................................................................. 5-12
5.10.1.20 XTAL MRGN SWITCH .............................................................................................. 5-12
5.10.1.21 RATE DEV. ATTEN ................................................................................................... 5-12
5.10.1.22 MAXIMUM POWER .................................................................................................. 5-12
5.10.1.23 MINIMUM POWER .................................................................................................... 5-12
5.10.1.24 CHANGE POCKET... .................................................................................................. 5-12
5.10.1.25 CHANGE CRYSTAL... ............................................................................................... 5-12
5.10.1.26 ATTENTION ACTION ............................................................................................... 5-12
5.10.1.27 CALIBRATION DONE ............................................................................................... 5-12
vi
6. TUNING THE MDC-370 CONTROL LOOP ................................................................. 6-1
6.1 CONTROL LOOP BASICS ................................................................................................... 6-1
6.2 CONTROL LOOPS APPLIED TO VACUUM DEPOSITION....................................................... 6-2
6.3 ESTABLISHING MDC-370 CONTROL LOOP PARAMETERS ................................................ 6-3
7. INPUT/OUTPUT CHARACTERISTICS ........................................................................ 7-1
7.1 SOURCE CONTROL VOLTAGE OUTPUT ................................................................. 7-1
7.2 SENSOR INPUT ............................................................................................................. 7-1
7.3 DISCRETE OUTPUTS ................................................................................................... 7-1
7.4 DISCRETE INPUTS ....................................................................................................... 7-2
7.5 DIGITAL-TO-ANALOG CONVERTER OUTPUTS .................................................... 7-2
7.6 DIGITAL-TO-ANALOG CONVERTER CONTROL INPUTS ..................................... 7-2
8. CONTROLLER INSTALLATION.................................................................................. 8-1
8.1 MOUNTING ...................................................................................................................8-1
8.2 PROPER GROUNDING .................................................................................................8-1
8.3 EXTERNAL CONNECTIONS .......................................................................................8-1
8.3.1 POWER .......................................................................................................................8-1
8.3.2 VOLTAGE SELECTION .............................................................................................8-1
8.3.3 GROUND LUG ...........................................................................................................8-2
8.3.4 REMOTE POWER HANDSET ....................................................................................8-2
8.3.5 SOURCE-SENSOR .....................................................................................................8-2
8.3.6 RS-232 COMMUNICATION .......................................................................................8-2
8.3.7 DISCRETE INPUT/OUTPUT .....................................................................................8-3
8.3.8 DIGITAL-TO-ANALOG CONVERTER (DAC) ...........................................................8-3
9. SYSTEM INSTA LLATION ..............................................................................................9-1
9.1 SENSOR HEAD DESCRIPTION ...................................................................................9-1
9.2 SENSOR HEAD INSTALLATION ................................................................................9-1
9.3 SENSOR OSCILLATOR ................................................................................................9-2
9.3.1 INSTALLATION ..........................................................................................................9-3
9.4 INSTRUMENTATION FEEDTHROUGH .....................................................................9-3
9.5 SENSOR CRYSTAL REPLACEMENT .........................................................................9-3
9.6 TYPICAL SYSTEM INSTALLATION ..........................................................................9-4
10. THEORY OF OPERATION ......................................................................................10-1
10.1 BASIC MEASUREMENT ............................................................................................10-1
10.2 FILM THICKNESS CALCULATION ..........................................................................10-1
10.3 CRYSTAL HEALTH CALCULATION .......................................................................10-3
10.4 RATE CALCULATION ................................................................................................10-4
10.5 MULTI-SENSOR AVERAGIN G ...........................................................................................10-4
10.6 EMPIRICAL CALIBRATION ......................................................................................10-5
10.6.1 FILM DENSITY ....................................................................................................10-5
10.6.2 TOOLING FACTOR .............................................................................................10-6
10.6.3 ACOUSTIC IMPEDANCE ...................................................................................10-6
11. CO MPUTER INTERFACE ........................................................................................11-1
11.1 GENERAL .....................................................................................................................11-1
11.2 RS-232 SERIAL INTERFACE ......................................................................................11-1
11.3 RS-485 SERIAL INTERFACE ......................................................................................11-1
11.4 IEEE-488 PARALLEL INTERFACE............................................................................11-2
11.5 PROTOCOL ..................................................................................................................11-2
11.6 DATA TYPES ...............................................................................................................11-3
11.7 MESSAGE RECEIVED STATUS ................................................................................11-3
11.8 INSTRUCTION SUMMARY .......................................................................................11-4
11.9 INSTRUCTION DESCRIPTIONS ................................................................................11-5
12. REPAIR AND MAINTENANCE ...............................................................................12-1
12.1 HANDLING PRECAUTIONS ......................................................................................12-1
12.2 MAINTENANCE PHILOSOPHY ................................................................................12-1
12.3 TROUBLE SHOOTING AIDS ......................................................................................12-2
12.4 RETURNING THE MDC-370 TO THE FACTORY .....................................................12-3
13. APP ENDI X A ...............................................................................................................13-1
14. APP ENDI X B – PARAMETER TEMPLATES ........................................................14-1
14.1 MATERIAL ...................................................................................................................14-2
14.2 PROCESS ......................................................................................................................14-4
14.3 DISPLAY SETUP .........................................................................................................14-5
14.4 INPUTS .........................................................................................................................14-6
14.5 OUTPUTS .....................................................................................................................14-7
vii
14.6 ACTIONS ..................................................................................................................... 14-8
14.7 SENSOR SETUP .......................................................................................................... 14-9
14.8 SOURCE SETUP .......................................................................................................... 14-9
14.9 DAC SETUP ............................................................................................................... 14-10
14.10 UTILITY SETUP ........................................................................................................ 14-10
15. INDEX .............................................................................................................................. 11
16. MENU MAP ................................................................................................................ 16-1
viii
Table of Figures
FIGURE 2-1 OPERATING DISPLAY..........................................................................................2-1
FIGURE 2-2 PARAMETER/STATUS DISPLAY .......................................................................2-2
FIGURE 2-3 PROGRAMMING SECTION ..................................................................................2-4
FIGURE 2-4 ARROW KEYS ........................................................................................................2-4
FIGURE 2-5 ALPHANUMERIC KEYBOARD ..........................................................................2-5
FIGURE 3-1 REMOTE PO WER HANDSET ..............................................................................3-7
FIGURE 4-1 THE MAIN MENU .................................................................................................4-1
FIGURE 4-2 SELECT PROCESS SCREEN ..............................................................................4-14
FIGURE 4-3 DEFINE PROCESS SCREEN ..............................................................................4-14
FIGURE 4-4 SELECT LAYER MATERIAL SCREEN .............................................................4-16
FIGURE 4-5 SELECT MATERIAL SCREEN............................................................................4-16
FIGURE 4-6 DEFINE MATERIAL SCREEN ............................................................................4-17
FIGURE 4-7 SYSTEM SETUP MENU SCREEN .....................................................................4-24
FIGURE 4-8 DISPLAY SETUP SCREEN .................................................................................4-24
FIGURE 4-9 SELECT OUTPUT SCREEN ...............................................................................4-28
FIGURE 4-10 PROGRAM OUTPUT SCREEN ........................................................................4-28
FIGURE 4-11 SENSOR SETUP SCREEN ................................................................................4-35
FIGURE 4-12 SOURCE SETUP SCREEN ................................................................................4-39
FIGURE 4-13 DAC SETUP SCREEN .......................................................................................4-42
FIGURE 4-14 UTILITY SETUP SCREEN ................................................................................4-42
FIGURE 5-1 SIGN-ON SCREEN ................................................................................................5-1
FIGURE 5-2 RUN PROCESS S ELECTION SCREEN ...............................................................5-2
FIGURE 5-3 RATE VS. TIME GRAPH ......................................................................................5-3
FIGURE 5-4 RATE DEVIATION VS. TIME GRAPH ...............................................................5-3
FIGURE 5-5 THICKNESS VS. TIME GRAPH ...........................................................................5-3
FIGURE 5-6 POWER VS. TIME GRAPH ...................................................................................5-4
FIGURE 5-7 SOURCE/SENSOR STATUS SCREEN .................................................................5-4
FIGURE 5-8 I/O STATUS SCREEN ...........................................................................................5-5
FIGURE 5-9 VIEW RESULTS SCREEN ....................................................................................5-6
FIGURE 5-10 RATE VS. TIME PROCESS LOG GRAPH .........................................................5-7
FIGURE 5-11 TYPICAL PROCESS PROFILE .........................................................................5-13
FIGURE 7-1 PASSIVE INPUT BUFFER CIRCUIT ...................................................................7-3
FIGURE 7-2 ACTIVE INPUT BUFFER CIRCUIT ......................................................................7-4
FIGURE 7-3 DAC OUTPUT CIRCUIT .......................................................................................7-5
FIGURE 7-4 SENSOR INPUT BUFFER CIRCUIT ...................................................................7-6
FIGURE 7-5 SOURCE OUTPUT DRIVER CIRCUIT ................................................................7-7
FIGURE 8-1 MDC-370 FRONT PANEL .....................................................................................8-4
FIGURE 8-2 MDC-370 REAR PANEL .......................................................................................8-5
FIGURE 8-3 DAC SOCKET CONNECTOR PIN OUT ..............................................................8-6
FIGURE 8-4 SOURCE SOCKET CONNECTOR PIN OUT .......................................................8-6
FIGURE 8-5 D9S DTE REAR-PANEL RS-232 SOCKET CONNECTOR .................................8-7
FIGURE 8-6 D37P DISCRETE I/O PLUG CONNECTOR ..........................................................8-8
FIGURE 8-7 RJ11 FRONT PANEL RS-232 CONNECTOR ......................................................8-9
FIGURE 8-8 FRONT PANEL MANUAL POWER CONNECTOR ...........................................8-9
FIGURE 8-9 MDC-370 TOP VIEW (COVER REMOVED) .....................................................8-10
FIGURE 9-1 SENSOR OSCILLATOR SCHEMATIC ................................................................9-5
FIGURE 9-2 SENSOR OSCILLATOR OUTLINE ......................................................................9-6
FIGURE 9-3 IF-111 INSTRUMENTATION FEEDTHROUGH OUTLINE ...............................9-7
FIGURE 9-4 SH-102 SENSOR HEAD OUTLINE ......................................................................9-8
FIGURE 9-5 TYPICAL SYSTEM INSTALLATION..................................................................9-9
FIGURE 13-1 PLUG PIN OUT - SOURCE CABLE CO NN E CT OR .........................................13-1
FIGURE 13-2 PLUG PIN OUT - DAC CABLE CONNECTOR ................................................13-2
FIGURE 16-1 ...............................................................................................................................16-1
ix
List of Tables
TABLE 5-1 TROUBLE CONDITIONS AND WARNINGS ...................................................... 5-9
TABLE 8-1 DAC SYSTEM INTERFACE CONNECTOR PIN ASSIGNMENTS .................... 8-6
TABLE 8-2 SOURCE CONTROL SYSTEM INTERFACE CONNECT OR PIN
ASSIGNMENTS ................................................................................................................. 8-6
TABLE 8-3 D9 REAR PANEL RS-232/RS-485 CONNECTOR PIN ASSIGNMENTS ............ 8-7
TABLE 8-4 DISCRETE I/O SYSTEM INTERFACE CONNECTOR PIN ASSIGNMENTS ... 8-8
TABLE 8-5 RJ11 FRONT PANEL RS-232 CONNECTOR PIN ASSIGNMENTS ................... 8-9
TABLE 8-6 FRONT PANEL MANUAL POWER CONNECTOR PIN ASSIGNMENTS ........ 8-9
TABLE 10-1 MATERIAL DENSITY AND ACOUSTIC IMPEDANCE VALUE ................... 10-7
TABLE 1 3-1 SOURCE CONTROL CABLE COLOR CODE - (4 PIN MINI DIN) ............... 13-1
TABLE 13-2 DAC CABLE COLOR CODE - (7 PIN MINI DIN) ......................................... 13-2
x
MDC-370 DEPOSITION CONTROLLER
1. GENERAL DESCRIPTION
1.1 PURPOSE
The MDC-370 is a full-featured deposition controller which can provide
automatic control of single or multi-layer film deposition in either a production or
development environment. The MDC-370 will improved predictability and
repeatability of deposited film characteristics through dependable digital control
and multi-sensor averaging.
The MDC-370 makes programming and operation easy with large LED displays
for important run-time values, a graphic LCD display for graphs of rate, rate
deviation, thickness and deposit power, an easy to use menu-driven user interface
providing unparalleled access to plain English programming of processes,
materials, inputs and outputs.
1.2 FEATURES
The MDC-370 incorporates numerous features which are economically justifiable
as a result of rapid advances in semiconductor technology and the advent of low
cost microprocessors.
1.2.1 MULTI-CRYSTAL AVERAGING
The MDC-370 provides greater accuracy in thin film deposition by averaging up
to six sensors distributed throughout the chamber to account for changes in vapor
distribution during deposition.
1.2.2 EXTENSIVE PROGRAM STORAGE
The MDC-370 is capable of storing up to 99 processes, 999 layer definitions and
32 complete material definitions. Once a program is entered it will be maintained
in memory for a minimum of 5 years without external power.
1.2.3 DYNAMIC MEASUREMENT UPDATE RATE
Measurement is dynamically adjusted from 0.5 to 10 Hz for optimum resolution
and control.
1.2.4 SUPERIOR GRAPHICS DISPLAY
The MDC-370 features a 256x64 pixel LCD graphics display allowing real time
graphing of important process information such as rate, rate deviation, thickness
and power.
1.2.5 PROGRAM SECURITY
To assure the integrity of stored programs, the MDC-370 incorporates edit
passwords to guard against unauthorized program changes.
1.2.6 DESIGNED FOR UNATTENDED OPERATION
The MDC-370 has been designed for truly automatic operation and toward this
end incorporates extensive internal monitoring and overriding abort circuitry to
GENERAL DESCRI PTION
1-1
MDC-370 DEPOSITION CONTROLLER
minimize the possibility of damage in the event of a failure or other problem in
the total deposition system. In addition there are attention, alert and alarm signals
with adjustable volume for trouble and routine operator call.
1.2.7 FAIL SAFE ABORTS
In the event of an MDC-370 failure, as evidenced by unsatisfactory internal
checks, the MDC-370 will abort the process and shut off all outputs. In addition
to the internal checks, the MDC-370 also provides user enabled aborts on
excessive rate control error or crystal failure.
1.2.8 ABORT STATUS RETENTION
In the event that the MDC-370 does abort during the deposition process, pertinent
information is stored at the time of abort. More importantly, the process can be
easily resumed once the problem is corrected without re-programming.
1.2.9 RUN COMPLETION ON CRYSTAL FAILURE
The extensive monitoring and abort functions are designed to protect the system
and/or process from serious and hopefully infrequent malfunctions of the
deposition system. A condition which need not cause an abort is the condition of
crystal failure. The MDC-370 can be set to abort upon crystal failure or run to
completion using a backup crystal or time/power method.
1.2.10 POWERFUL SYSTEM INTERFACE
Fully programmable discrete inputs and outputs permit the MDC-370 to be easily
interfaced into deposition systems controlling the most complex processes. Also,
source control outputs are fully isolated avoiding ground loop problems. The
MDC-370 also supports input from an optical monitor for optical termination of
film thickness.
1.2.11 POWER SUPPLY NOISE TOLERANCE
Integral RFI filter and large energy storage capacitors will tolerate high levels of
power supply noise and power interruptions of 700 ms or less without effect.
1.2.12 INTERNATIONAL STANDARD POWER CONNECTOR
The power connector is internationally approved and meets IEC (International
Electrotechnical Commission) standards. It allows selection of input power
voltages ranging from 100 to 240 volts at a frequency of 50 or 60 Hz and includes
an integral RFI filter.
1.2.13 FIELD UPGRADABLE
Plug-in interface boards and option boards allow the basic unit to be upgraded in
the field to the maximum system level.
1-2
GENERAL DESCRI PTION
MDC-370 DEPOSITION CONTROLLER
Frequency Resolution
0.03 Hz @ 6.0 MHz
Mass Resolution
0.375 ng/cm2
Thickness Accuracy
0.5% + 1 count
Measurement Update Rate
Dynamically adjusted, 0.5 to 10 Hz
Display Update Rate
10 Hz
Sensor Crystal Frequency
2.5, 3, 5, 6, 9, 10 MHz
Thickness Display
Autoranging: 0.000 to 999.9 KÅ
Rate Display
Autoranging: 0.0 to 999 Å/sec
Power Display
0.0 to 99.9%
Time Display
0 to 9:59:59 H:MM:SS
Crystal Health %
0 to 99%
Layer Number
1 to 999
Graphics Display
256X64 LCD with CCFL
backlighting
RS-232 serial port standard
RS-485 serial port optional
IEEE-488 bus interface optional
Process
99, user definable
Layer
999, user definable
Material
32, user definable
Process Name
12 character string
Edit password
4 character string
Run/View password
4 character string
Layer# 1 to 999
Material name, Thickness
1.3 SPECIFICATIONS
1.3.1 MEASUREMENT
1.3.2 DISPLAY
1.3.3 COMMUNICATION
1.3.4 PROGRAM STORAGE CAPACITY
1.3.5 PROCESS PARAMETERS
GENERAL DESCRI PTION
1-3
MDC-370 DEPOSITION CONTROLLER
Material Name
10 character string
Source #
1 to 6
Pocket #
1 to 8
Material Density
0.80 to 99.9 gm/cm3
Acoustic Impedance
0.50 to 59.9 gm/cm2 sec
Tooling Factor
10.0 to 499.9%
Proportional Gain
0.00 to 9999
Integral Time Constant
0 to 99.9 sec
Derivative Time Constant
0 to 99.9 sec
Rise to Soak Time
0 to 9:59:59 H:MM:SS
Soak Power
0 to 99%
Soak Time
0 to 9:59:59
Rise to Predeposit Time
0 to 9:59:59
Predeposit Power
0 to 99.9%
Predeposit Time
0 to 9:59:59
Rate Establish Time
0 to 60 sec
Rate Establish Error
0 to 99.9%
Deposition Rate (1 to 5)
00.0 to 999.9 Å/sec
Rate Start Thickness (1 to 4)
0 to 100%
Rate Stop Thickness (1 to 4)
0 to 100%
Time Setpoint
0 to 9:59:59
Ramp to Feed Time
0 to 9:59:59
Feed Power
0 to 99.9%
Feed Time
0 to 9:59:59
Ramp to Idle Time
0 to 9:59:59
Idle Power
0 to 99.9%
Maximum Power
0 to 99.9%
Power Alarm Delay
0 to 99 sec
Minimum Power
0 to 99.9%
Rate Deviation Attention
0 to 99.9%
Rate Deviation Alarm
0 to 99.9%
Rate Deviation Abort
0 to 99.9%
Sample Dwell %
0 to 100.0%
Sample Period
0:01:00 to 9:59:59
Sensor (1 to 6) Fail
NotUsed, Disable, HaltLast, Halt,
TimePower, Switch
Sensor (1 to 6) Tooling
10.0 to 499.9%
Sensor (1 to 6) Weight
10.0 to 499.9%
Sensor (1 to 6) Crystal #
1 to 8
Sensor (1 to 6) Backup Sensor #
1 to 6
Sensor (1 to 6) Backup Crystal #
1 to 8
Material Password
4 character string
1.3.6 MATERIAL PARAMETERS
1-4
GENERAL DESCRI PTION
MDC-370 DEPOSITION CONTROLLER
Sensor Inputs
2 Standard, up to 6 optional, BNC
inputs
Source Outputs
2 Standard, up to 6 optional, fully
0.002% resolution
Discrete Inputs
8 Standard, up to 16 optional fully
AC/DC across the input pins.
Discrete Outputs
8 standard, up to 16 optional fully
2A max.
Abort Output
1 standard and 1 optional SPST
Relay, 120VA, 2A max.
Remote Power Handset
Front panel, RJH jack
RS-232 Communication
Rear panel, 9 pin, Full duplex, DTE
Front panel, RJ11 jack, Full duplex
DAC Recorder Outputs
Two 0 to 5 volts, 0.02% resolution
Number of Crystals
1 to 8
Shutter Relay Type
Normally open, normally closed, dual,
or none.
Position Control
Manual, direct, BCD, or individual.
Position Drive
Up, down, Fast, inline, single step, or
double step.
Feedback Type
Individual, BCD, single home, in
position, or no feedback.
Rotator Delay
0 to 99 sec
The MDC-370 also has a built in material library that contains many common
material names along with their density and acoustic impedance values.
1.3.7 INPUT/OUTPUT CAPABILITY
isolated, 2.5, 5, 10 volts @ 20 ma.
programmable inputs.
The Passive I/O card (PN#179216)
has TTL level inputs activated by a
short across the input pins.
The Active I/O card (PN#179239) has
inputs activated by 12 to 120 volt
1.3.8 SENSOR PARAMETERS
programmable, SPST relay, 120VA,
GENERAL DESCRI PTION
1-5
MDC-370 DEPOSITION CONTROLLER
Number of Pockets
1 to 8
Shutter Relay Type
Normally open, normally closed, or
none.
Shutter Delay
0.0 to 9.9 sec
Position Control
Manual, direct, BCD, or individual.
Position Drive
Up, down, Fast, inline, single step, or
double step.
Feedback Type
Individual, BCD, single home, in
position, or no feedback.
Rotator Delay
0 to 99 sec
Source Voltage Range
2.5, 5, 10 volts
Recorder #1/#2 Output
Rate, rate dev., power or thickness
Recorder #1/#2 Scale
Full scale %, 2/3 digit
Crystal Frequenc y
2.5, 3, 5, 6, 9, 10 MHz
Simulate Mode
On/Off
Interface Address
1 to 32
Attention Volume
0 to 10
Alert Volume
0 to 10
Alarm Volume
0 to 10
Data Points/Minute
30,60,120,300,600 PPM
Time
0 to 23:59
Date
MM/DD/YY
Input Power Requirements
100, 120, 200, 240 VAC; 50/60 Hz;
25 watts
Operating Temperature Range
0 to 50°C
Physical Weight
10 LB
Physical Size
19” rackmount case
3 1/2” high x 9 3/8” deep
1.3.9 SOURCE PARAMETERS
1.3.10 RECORDER PARAMETERS
1.3.11 UTILITY SETUP PARAMETER
1.3.12 OTHER
1-6
GENERAL DESCRI PTION
MDC-370 DEPOSITION CONTROLLER
Part Number
Description
179215
Dual Source/Sensor Board
179216
Passive I/O Board
179217
IEEE-488 Communication Board
179218
Internal Storage Data/Time Clock
179219
RS-232 to RS-485 conversion
179220
Remote Power Handset
179239
Active I/O Board
123200-5
SH-102 Sensor Head, cables, and
101 sensor crystals
124201-4
SO-100 Oscillator with 6" and 10'
BNC Cables.
130200-2
IF-111 Instrument Feedthrough, 1" O-
dual 3/16" water tubes.
130204-2
IF-276 Instrumentation Feedthrough,
water tubes.
150902
SF-120 Combination Sensor Head,
Oscillator.
123204-1
Internal Coax Cable 30".
123204-2
Internal Coax Cable 60".
124202-1
BNC Cable Assembly 10'.
124202-2
BNC Cable Assembly 20'
124204
BNC Cable Assembly 6".
103220
SC-101 Carousel of 10 each 6MHz
gold sensor crystals.
103221
SC-102 Carousel of 10 each 6MHz
silver sensor crystals.
1.4 ACCESSORIES
carousel of 10 each 6MHz Gold SC-
Ring with 1 electrical connector and
2 3/4" Conflat® Flange seal with 1
electrical connector and dual 3/16"
Feedthrough, Cables, Crystals and
Refer to Maxtek Price List for more accessories and other products.
GENERAL DESCRI PTION
1-7
MDC-370 DEPOSITION CONTROLLER
2. FRONT PANEL DISPLAYS AND CONTROLS
The front panel is divided into two sections, the operating section and the
programming section. The left half of the panel is devoted to the operating
displays and controls. The right half is used for programming, viewing stored
processes, and displaying the status of the selected process.
2.1 OPER ATING DISPLAYS
All of the operating displays are updated ten times per second unless the
controller is in the Abort mode. When in the Abort mode, the values of the
operating displays are held constant so the operator will know the values at the
time of the Abort. The controller will also flash the operating displays while in
Abort to alert the operator.
Figure 2-1 Operating Display
2.1.1 RATE
A three digit display with a floating decimal point is used to display deposition
rate in angstroms per second at a resolution of 0.1 Å/sec from 0 to 99.9 Å/sec, and
a resolution of 1.0 Å/sec for rates from 100 to 999 Å/sec.
2.1.2 POWER
A three digit display with a fixed decimal point displays percent of maximum
power with a resolution of 0.1% from 0 to 99.9%. This corresponds to the control
voltage range of 0 to 9.99 volts.
2.1.3 THICKNESS
Four digits with an autoranging decimal point display measured thickness in KÅ
with a resolution of 1 Å from 0 to 9.999 KÅ, a resolution of 10 Å from 10.00 KÅ
to 99.99 KÅ and a resolution of 100 Å from 100.0 KÅ to 999.9 KÅ.
2.1.4 LAYER NUMBER
Three digits display the layer number of the current process.
FRONT PANEL DISPLAYS AND CONTROLS
2-1
MDC-370 DEPOSITION CONTROLLER
Sample Cr Process Ready
0 1
Displays the current
Displays the current
material name.
Displays the
Displays the time
axis scale factor
2.1.5 CRYSTAL HEALTH %
A two-digit display is used to show the health percentage of the active
sensor/crystal. If multiple sensors/crystals are active then the crystal with the
lowest health will be displayed. A fresh crystal starts out with a health of 99%.
2.1.6 TIME DISPLAY
Time is displayed in hours, minutes and seconds. This display can be configured
to show the estimated time to go for the state or layer or the elapsed process, layer
or state times.
2.2 PARAMETER/STATUS DISPLAYS
A graphics display labeled Parameter/Status is used for process programming and
controller setup as well as displaying run-time status and data graphing. The
operator can switch between programming screens and status screens by pressing
the Program and Status keys on the front panel. Upon power up, the
Parameter/Status display automatically reverts to the last viewed status screen.
Detail descriptions of the different programming and status screens can be found
in Section 4 and 5.
process name.
10
R
a
t
e
Figure 2-2 Parameter/Status Display
2.3 OPER ATING CONTROLS
Normal operation of the MDC-370 is controlled by seven operating keys, Manual,
Start, Abort, Reset, Zero, Shutter and Status. Except for the Zero and Status keys,
each of the other keys is equipped with an LED to indicate the controller’s status.
2.3.1 MANUAL KEY
This key is used to toggle the MDC-370 Manual mode on and off. A red light
behind this key indicates the controller is in manual power control mode. This
mode may be selected at any time providing that the controller is not in Abort
mode. The Manual mode indicates that the source control voltage output for the
active source is being controlled through the Remote Power Handset. (The active
source is set by the active material's Source parameter).
controller modes,
states or troubles.
2-2
FRONT PANEL DISPLAYS AND CONTROLS
MDC-370 DEPOSITION CONTROLLER
In the Manual mode the control voltage remains constant unless incremented up
or down by means of the Remote Power Handset. At entry into the Manual mode,
the power is left at the last value prior to entry and is thereafter modified only
through the Remote Power Handset. Exit from the manual mode is accomplished
by means of the Manual or Reset key.
The MDC-370 can also be aborted through the Remote Power Handset. This
abort feature is active whether or not MDC-370 is in the manual mode.
2.3.2 START KEY
The Start key starts a process, starts a layer, or resumes an aborted process. A
green light behind this key indicates the controller is in process. When this key is
pressed the first time a list of stored processes is displayed in the Parameter/Status
window. You simply scroll the cursor on to the desired process and press Start
again to start the process.
2.3.3 ABORT KEY
The Abort key drives the MDC-370 into the Abort mode. All source powers are
set to zero and discrete outputs are set to inactive state. A red light behind this
key indicates the controller is in the abort mode.
2.3.4 RESET KEY
The Reset key is used to clear the controller from Abort mode and put it into the
Ready mode. A yellow light behind this key indicates a Ready mode. The Reset
key is inactive during the In Process mode so that a premature exit from the In
Process mode requires an abort. Caution! Once a process is reset, it cannot be
resumed. So don't reset an aborted process if you want to resume it once the
problem is cleared.
2.3.5 ZERO KEY
Pressing the Zero key causes the thickness display to go to zero. This key is
active at all times and if pressed during the deposit state will result in a film
thicker than that desired by an amount equal to the thickness displayed at the time
the display was zeroed.
2.3.6 SHUTTER KEY
This key is used to manually open and close all source shutters. The red light is
illuminated when the active source shutter relay is closed. This key is only active
when the controller is in the Process Ready mode.
2.3.7 STATUS KEY
Pressing the Status key will bring up one of the two run-time status screens.
Repeatedly pressing the key will cycle through the different status screens. Refer
to Section 5 for a detailed description of these status screens.
FRONT PANEL DISPLAYS AND CONTROLS
2-3
MDC-370 DEPOSITION CONTROLLER
2.3.8 GRAPH KEY
Pressing the Graph key will bring up one of the four run-time graph screens.
Repeatedly pressing the key will cycle through the different graph screens. Refer
to Section 5 for a detailed description of these status screens.
Figure 2-3 Programming Section
2.3.9 ARROW KEYS
The arrow keys are used to navigate through the programming and setup menu
structure. These keys will auto-repeat if they are held down for more than half a
second.
Figure 2-4 Arrow Keys
2.3.10 PROGRAM KEY
Pressing the programming key will bring up the last viewed programming screen.
If a programming screen is already shown, nothing will happen. This key is also
used in conjunction with the Up and Down Arrow keys to adjust the contrast of
the Parameter/Status display. If the screen background is white then press and
hold the Program and the down arrow keys until the text is easy to read. If the
screen background is blue and the text cannot be seen then press and hold the
Program and the up arrow keys.
2-4
FRONT PANEL DISPLAYS AND CONTROLS
MDC-370 DEPOSITION CONTROLLER
Figure 2-5 Alphanumeric Keyboard
‘Enter’
‘Backspace’
2.3.11 ALPHANUMERIC KEYBOARD
The alphanumeric keyboard is used to
edit controller parameters. Refer to
Section 4 for details on enter new
parameter values.
FRONT PANEL DISPLAYS AND CONTROLS
2-5
MDC-370 DEPOSITION CONTROLLER
3. BENCH CHECKOUT & INSPECTION
3.1 INSPECTION
Your MDC-370 was released to the carrier in good condition and properly
packed. It is essential to all concerned that the contents of the shipment be
carefully examined when unpacked to assure that no damage occurred in transit.
Check the material received against the packing list to be certain that all elements
are accounted for. Items included with your controller are:
1 MDC-370 Deposition Controller
1 Operation and Service Manual
1 Power cord
1 Source cable (4 pin mini DIN connector)
1 Discrete I/O connector kit (37P D shell)
In addition, you may have ordered one or more of the accessories listed in Section
1.4. If there is evidence of loss or damage:
a) Notify the carrier or the carrier agent to request inspection of the loss
or damage claimed.
b) Keep the shipping containers until it is determined whether or not they
are needed to return the equipment to Maxtek.
3.2 INI TIAL POWER UP
Upon initial power up the unit will start with all LED’s lighted. The
Parameter/Status display will show the controller Sign-on screen with its
configuration information. The unit will stay in this state until a key is pressed.
When any key on the front panel is pressed, the operating display and the
Parameter/Status display will return to the last viewed screen prior to loss of
power.
3.3 SAMPLE PROGRAM
The sample program listed below is included in the MDC-370 memory at the time
of shipment. It can be used to check out the controller by running it in Simulate
mode. Follow instructions in Section 4 to navigate through the menu structure.
Check the controller parameter values against the sample program for discrepancy
and change if necessary. Note also, if the source or sensor configuration has been
changed during familiarization with the controller programming, appropriate
source and sensor parameter values also need to be retained for the sample
program to run correctly.
Once the sample program has been checked, use the programming Main Menu,
Edit System Setup, Edit Utility Setup, to select Simulate mode ON, then use Start
to select and run the sample program in Simulate mode.
BENCH CHECKOUT & INSPECTION
3-1
MDC-370 DEPOSITION CONTROLLER
Material Name
Cr
Source #
1
Pocket #
1
Material Density
07.20 gm/cm3
Acoustic Impedance
28.95 gm/cm2 sec
Tooling Factor
100 %
Proportional gain
2400
Integral Time constant
99.9
Derivative Time constant
0.00
Rise to Soak Time
0:00:10 H:MM:SS
Soak Power
5 %
Soak Time
0:00:10
Rise to Predeposit Time
0:00:10
Predeposit Power
9.5 %
Predeposit Time
0:00:05
Rate Establish Time
0 sec
Rate Establish Error
0 %
Deposition Rate #1
10.0 Å/sec
Rate Start Thickness (1 to 4)
100%
Rate Stop Thickness (1 to 4)
100%
Time Setpoint
0
Ramp to Feed Time
0:00:05
Feed Power
7 %
Feed Time
0:00:10
Ramp to Idle Time
0
Idle Power
0
Maximum Power
20 %
Power Alarm Delay
5 sec
Minimum Power
0 %
Rate Deviation Attention
0 %
Rate Deviation Alarm
0 %
Rate Deviation Abort
0 %
Sample Dwell %
100.0 %
Sample Period
0:01:00
Sensor #1
TimePower
Sensor #1 Tooling
70 %
Sensor #1 Weight
100 %
Sensor #1 Crystal #
1
Sensor #1 Backup Sensor #
1
Sensor #1 Backup Crystal #
1
Material Password
0000
3.3.1 MATERIAL #1 PARAMETERS
3-2
BENCH CHECKOUT & INSPECTION
MDC-370 DEPOSITION CONTROLLER
Material Name
Au
Source #
1
Pocket #
2
Material Density
19.30 gm/cm3
Acoustic Impedance
23.18 gm/cm2 sec
Tooling Factor
100 %
Proportional gain
5000
Integral Time constant
99.9
Derivative Time constant
0.00
Rise to Soak Time
0:00:05 H:MM:SS
Soak Power
25 %
Soak Time
0:00:05
Rise to Predeposit Time
0:00:05
Predeposit Power
37.5 %
Predeposit Time
0:00:10
Rate Establish Time
0 sec
Rate Establish Error
0 %
Deposition Rate #1
20.0 Å/sec
Rate Start Thickness (1 to 4)
100%
Rate Stop Thickness (1 to 4)
100%
Time Setpoint
0
Ramp to Feed Time
0:00:05
Feed Power
10 %
Feed Time
0:00:10
Ramp to Idle Time
0
Idle Power
0
Maximum Power
50 %
Power Alarm Delay
5 sec
Minimum Power
0 %
Rate Deviation Attention
0 %
Rate Deviation Alert
0 %
Rate Deviation Alarm
0 %
Sample Dwell %
100 %
Sample Period
0:01:00
Sensor #1
TimePower
Sensor #1 Tooling
70 %
Sensor #1 Weight
100 %
Sensor #1 Crystal #
1
Sensor #1 Backup Sensor #
1
Sensor #1 Backup Crystal #
1
Material Password
0000
3.3.2 MATERIAL #2 PARAMETERS
BENCH CHECKOUT & INSPECTION
3-3
MDC-370 DEPOSITION CONTROLLER
Process Name
Layer No.
Thickness
Material
Sample
1
0.400 KÅ
Cr 2
1.050 KÅ
Au
3.3.3 PROCESS PARAMETERS
3.4 SIMULATE OPERATION
Testing the MDC-370 is best accomplished by checking its operation in the
Simulate mode. This mode can be selected by using the programming Main
Menu, Edit System Setup, Edit Utility Setup, to select Simulate mode ON, then
use Start to select and run a process in Simulate mode.
The Simulate mode is identical to the Normal mode except that the sensor inputs
are simulated. For this reason, entry to the Simulate mode will extinguish the
Crystal Failure message if it is flashing. No other difference between the
Simulate mode and the Normal mode occurs until entry to the Deposit State.
3.5 MANUAL OPERATION
Manual Mode is selected by depressing the Manual key. The LED behind the key
will light up indicating the controller is in Manual mode.
The Manual Mode is identical to the normal mode in all respects except that
source power for the active source is controlled only through the Remote Power
Handset.
The Remote Power Handset has three push buttons, see Figure 3-1. Without any
of the buttons depressed, the output power is maintained at its last value.
Depressing the “PWR UP” button will increase the power, depressing the “PWR
DN” button will decrease the power and depressing the “ABORT” button will put
the controller into the Abort mode.
The Abort Mode is active whether or not the MDC-370 is in Manual Mode and
therefore can be used as a remote “panic button”.
The minimum increment by which the power is increased or decreased is 0.1%.
3.6 INSTALLING OPTION BOARDS
Option boards are most easily installed while the MDC-370 is on the bench.
Figure 8-9 shows the location of the various option boards. Also, they are clearly
marked on the rear panel.
All Dual Source-Sensor boards are identical, as are all Discrete I/O boards. The
input-output configuration of these boards is defined by the position into which
they are installed. One exception for the Discrete I/O boards is that the jumper J2
on the board installed in the Discrete I/O-2 position has to be connected. This is
required so the controller will acknowledge the second Discrete I/O board.
3-4
A Source-Sensor board plugged into the second position will provide sensor
inputs numbers 3 & 4 and source outputs numbers 3 & 4. A Source-Sensor board
BENCH CHECKOUT & INSPECTION
MDC-370 DEPOSITION CONTROLLER
plugged into the third position will provide sensor inputs numbers 5 & 6, and
source outputs numbers 5 & 6.
3.6.1 SOURCE-SENSOR BOARD
1. Remove the chassis top cover.
2. Remove the three plastic hole-plugs from the rear panel.
3. Carefully slide the two BNC connectors on the Source-Sensor board into
the two top holes on the rear panel. Then with even pressure, push the
card edge connector down into the Main board at J12, J13 or J14.
4. Fasten the two BNC connectors using the nuts and washers supplied with
the kit. Make sure the board is properly aligned.
5. Tighten the board down with the tie wrap.
6. Replace the chassis top cover and apply power to the controller.
7. The Sign On screen should acknowledge a new Source-Sensor card
installed.
3.6.2 DISCRETE I/O BOARD
1. Remove the chassis top cover.
2. Locate Discrete I/O-2 slot and remove the slot cover.
3. Carefully slide the D37 connector of the DIO board into the slot and fasten
it using the hex fasteners and washers supplied with the kit.
4. Fasten the other end of the board to the standoffs using the two # 4-40
screws provided.
5. Plug the 26-pin ribbon connector into the DIO edge connector J1.
6. Replace the chassis top cover and apply power to the controller.
7. The Sign On screen should acknowledge Discrete I/O-2 installed.
3.6.3 IEEE-488 OPTION BOARD
1. Remove the chassis top cover.
2. Locate IEEE-488 option slot and remove the slot cover.
3. Carefully slide the connector of the IEEE-488 board into the slot and fasten
it using the fasteners and washers supplied with the kit.
4. Plug the 20-pin ribbon connector into J7 connector on the Main board.
5. Replace the chassis top cover and apply power to the controller.
6. The Sign On screen should acknowledge IEEE-488 option installed.
3.7 DIGITAL TO ANALOG CONVERTER (DAC) CHECKOUT
The built-in DAC function on the Main board contains two converters, allowing
simultaneous recording of any two of the following four parameters: Rate, Rate
deviation, Power and Thickness. The full-scale output of each converter is 5
volts, is single ended and is referenced to ground. Parameter selection for each of
the channels is accomplished independently by making the appropriate choices in
the DAC setup menu.
In addition to the individual channel output pins there are two control pins which
are common to both channels and are intended to simplify the process of setting
up analog recorders. Connecting the Zero control line to ground will drive both
channel outputs to zero, allowing the recorder zero reference to be easily set.
BENCH CHECKOUT & INSPECTION
3-5
MDC-370 DEPOSITION CONTROLLER
Releasing the Zero line and connecting the Full Scale line to ground will drive
both channel outputs to full scale for establishing the recorder full scale
calibration.
Each channel can be set independently to convert either the two or the three least
significant digits of the chosen parameter to a proportional analog signal,
corresponding to the DAC setup option chosen. With the three-digit setting, a
thickness of 0.500 KÅ would result in an analog output of 2.50 volts, or a scale
factor of 5 mV/Å. If more resolution is desired, either channel can be configured
to convert only the last two digits of the parameter, thus the analog output would
achieve full scale at 99Å. The output scale factor in this configuration is 50
mV/Å.
The above scale factors are based on the assumption that the thickness display is
in the 0 - 9.999 KÅ range. Because the thickness and rate displays are autoranging, the analog output of these variables will also autorange so that in the
above example, if the thickness is in the range of 10 KÅ to 99.9 KÅ, the analog
scale factor would be 50 millivolts per 10 Å, also ten times larger.
The Rate deviation parameter must be handled differently than the other
parameters because it can be negative. Maximum positive error is converted to 5
volts, maximum negative error is converted to 0 volts and zero error is converted
to a mid scale, 2.5 volt, output. Maximum corresponds to 99 or 999, plus 1.
The DAC can be checked by putting the MDC-370 into the Simulate mode and
checking for correspondence between the analog output and the selected front
panel displays.
3-6
BENCH CHECKOUT & INSPECTION
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