INFICON MDC-260 User Manual

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OPERATION and SERVICE MANUAL

MDC-260

Film Deposition Controller

IPN 622800 Rev. E

OPERATION and SERVICE MANUAL

MDC-260

Film Deposition Controller

IPN 622800 Rev. E

www.inficon.com reachus@inficon.com

Due to our continuing program of product improvements, specifications are subject to change without notice.

Trademarks

The trademarks of the products mentioned in this manual are held by the companies that produce them.

INFICON® is a trademark of INFICON Inc.

All other brand and product names are trademarks or registered trademarks of their respective companies.

Disclaimer

The information contained in this manual is believed to be accurate and reliable. However, INFICON assumes no responsibility for its use and shall not be liable for any special, incidental, or consequential damages related to the use of this product.

Disclosure

The disclosure of this information is to assist owners of INFICON equipment to properly operate and maintain their equipment, and does not constitute the release of rights thereof. Reproduction of this information and equipment described herein is prohibited without prior written consent from INFICON, Two Technology Place, East Syracuse, NY 13057-9714. Phone 315.434.1100. See www.inficon.com.

Copyright

First Edition Revision A January 2005 Revision B August 2005 Revision C October 2005 Revision D July 2007 Revision E October 2007

General Safety Warning

WARNING

All standard safety procedures associated with the safe handling of electrical equipment must be observed. Always disconnect power when working inside the controller. Only properly trained personnel should attempt to service the instrument.

DECLARATION

CONFORMITY

This is to certify that this equipment, designed and manufactured by:

INFICON Inc.

Two Technology Place

East Syracuse, NY 13057

USA

meets the essential safety requirements of the European Union and is placed on the market accordingly. It has been constructed in accordance with good engineering practice in safety matters in force in the Community and does not endanger the safety of persons, domestic animals or property when properly installed and maintained and used in applications for which it was made.

Equipment Description: MDC-260 Thin Film Deposition Controller, including the

SO-100 Oscillator Package.

Applicable Directives: 73/23/EEC as amended by 93/68/EEC (LVD)

89/336/EEC as amended by 93/68/EEC (EMC)

2002/95/EC (RoHS)

Applicable Standards: EN 61010-1:2001 (Safety)

EN 61326-1:1997/A1:1998/A2:2001, Class A: Emissions per Table 3 Immunity per Table A.1

Due to the classification of this product it is currently

exempt from the RoHS directive.

CE Implementation Date: October 1, 2007

Authorized Representative: Duane H. Wright

Quality Assurance Manager, ISS INFICON Inc.

ANY QUESTIONS RELATIVE TO THIS DECLARATION OR TO THE SAFETY OF INFICON'S PRODUCTS SHOULD BE DIRECTED, IN WRITING, TO THE QUALITY ASSURANCE DEPARTMENT AT THE ABOVE ADDRESS.

10/01/07

Warranty

INFICON warrants the product to be free of functional defects in material and workmanship and that it will perform in accordance with its published specification for a period of (twenty-four) 24 months.

The foregoing warranty is subject to the condition that the product be properly operated in accordance with instructions provided by INFICON or has not been subjected to improper installation or abuse, misuse, negligence, accident, corrosion, or damage during shipment.

Purchaser's sole and exclusive remedy under the above warranty is limited to, at INFICON's option, repair or replacement of defective equipment or return to purchaser of the original purchase price. Transportation charges must be prepaid and upon examination by INFICON the equipment must be found not to comply with the above warranty. In the event that INFICON elects to refund the purchase price, the equipment shall be the property of INFICON.

This warranty is in lieu of all other warranties, expressed or implied and constitutes fulfillment of all of INFICON's liabilities to the purchaser. INFICON does not warrant that the product can be used for any particular purpose other than that covered by the applicable specifications. INFICON assumes no liability in any event, for consequential damages, for anticipated or lost profits, incidental damage of loss of time or other losses incurred by the purchaser or third party in connection with products covered by this warranty or otherwise.

www.inficon.com reachus@inficon.com

SAFETY PRECAUTION AND PREPARATION FOR USE

Input Power Requirements

The MDC-260 Thin Film Controller can be set to operate one of the following line voltages: 100, 120, 200, or 240 VAC at line frequency of 50 or 60 Hz. Maximum power consumption is 25 watts. See Section 8.3.3 for instruction on selecting line voltage.

Power Entry Module

The AC (alternating current) power entry module, located in the rear panel of the MDC-260, provides connection to the power source and a protective ground. It also holds the fuses and the voltage selection wheel.

Power Cord

WARNING: To avoid electrical shock, always connect the power cord to an AC outlet which has a proper protective ground.

The MDC-260 comes with a detachable, three-wire power cord for connection to a power source with protective ground.

The MDC-260 chassis is connected to the power ground to protect against electrical shock. Always connect to an AC outlet which has a properly connected protective ground. If necessary, or when in doubt, consult a certified electrician.

Grounding

A grounding lug is located on the rear panel, near the power entry module. Use heavy ground wire, wire braid, or copper strap of #12 AWG or larger to connect this grounding lug directly to a facility protective earth ground to provide additional protection against electrical shock.

Line Fuses

There are two 5 x 20 mm fuses mounted inside the power entry module. They are accessible via the snap-in cover. Replace with the correct fuse rating: IEC T Type (Slow), 4/10 A, 250 VAC. Refer to Section 8.3.3 for instruction to replace the fuse.

Power Switch

WARNING: Do NOT use the power switch as a disconnecting device; disconnect the power cord from the power entry module to fully remove hazardous voltage from inside the MDC-260.

The power switch is located on the front lower left of the MDC-260. Pressing the switch will toggle the controller on or off. The MDC-260 is off when the LCD and all of the LEDs behind the operating keys are off. However, turning the power switch off does not fully remove the AC power from inside the unit. Always disconnect the power cord from the power entry module to fully remove AC power from inside the unit.

SAFETY TERMS AND SYMBOLS

Terms Used in This Manual

WARNING. Warning statements identify conditions or practices that could result in personnel injuries or loss of life.

CAUTION. Caution statements identify conditions or practices that could result in damage to the MDC-260 or other property.

NOTE. Note statements identify a sensitive or irreversible procedure. Proceed with caution.

Terms Used on the MDC-260

DANGER indicates and injury hazard immediately accessible as you read the marking.

WARNING indicates an injury hazard not immediately accessible as you read the marking.

CAUTION indicates a hazard to the MDC-260 or other property.

Symbols Used on the Product and in the Manual

DANGER

Hazardous Voltage

FUSE

Refer to Manual for

Instruction

ATTENTION

Refer to Manual

Alternating Current

Protective Ground

POWER

On/Off Switch

SAFETY PRECAUTION AND PREPARATION FOR USE...................................................IV

SAFETY TERMS AND SYMBOLS.............................................................................................V

1. GENERAL DESCRIPTION.............................................................................................1-1

1.1 PURPOSE....................................................................................................................... 1-1

1.2 FEATURES ....................................................................................................................1-1

1.2.1 AMPLE PROGRAM STORAGE................................................................................. 1-1

1.2.2 DYNAMIC MEASUREMENT UPDATE RATE .......................................................... 1-1

1.2.3 SUPERIOR COLOR GRAPHICS DISPLAY .............................................................. 1-1

1.2.4 PROGRAM SECURITY.............................................................................................. 1-1

1.2.5 DESIGNED FOR UNATTENDED OPERATION ...................................................... 1-1

1.2.6 FAIL SAFE ABORTS.................................................................................................. 1-2

1.2.7 ABORT STATUS RETENTION .................................................................................. 1-2

1.2.8 RUN COMPLETION ON CRYSTAL FAILURE ......................................................... 1-2

1.2.9 POWERFUL SYSTEM INTERFACE.......................................................................... 1-2

1.2.10 POWER SUPPLY NOISE TOLERANCE............................................................... 1-2

1.2.11 INTERNATIONAL STANDARD POWER CONNECTOR ..................................... 1-2

1.3 SPECIFICATIONS......................................................................................................... 1-3

1.3.1 MEASUREMENT .......................................................................................................1-3

1.3.2 DISPLAY ....................................................................................................................1-3

1.3.3 COMMUNICATION................................................................................................... 1-3

1.3.4 PROGRAM STORAGE CAPACITY ........................................................................... 1-3

1.3.5 PROCESS PARAMETERS ......................................................................................... 1-3

1.3.6 MATERIAL PARAMETERS ....................................................................................... 1-4

1.3.7 INPUT/OUTPUT CAPABILITY ................................................................................. 1-5

1.3.8 SENSOR PARAMETERS............................................................................................ 1-5

1.3.9 SOURCE PARAMETERS ........................................................................................... 1-6

1.3.10 UTILITY SETUP PARAMETER ............................................................................ 1-6

1.3.11 OTHERS ................................................................................................................ 1-6

1.4 ACCESSORIES..............................................................................................................1-7

2. FRONT PANEL DISPLAYS AND CONTROLS........................................................... 2-1

2.1 GRAPHIC LCD DISPLAY................................................................................................ 2-1

2.1.1 PROGRAMMING SCREENS (MENUS) .................................................................... 2-1

2.1.2 RUN-TIME GRAPHS ................................................................................................. 2-1

2.1.3 STATUS SCREENS .................................................................................................... 2-1

2.1.3.1 MAIN RUN SCREEN....................................................................................................2-1

2.1.3.2 SOURCE/SENSOR STATUS SCREEN........................................................................ 2-1

2.1.3.3 INPUT/OUTPUT STATUS SCREEN........................................................................... 2-1

2.1.3.4 ACTIVE LAYER PARAMETER UPDATE SCREEN ................................................. 2-2

2.1.3.5 POSITION CONTROL SCREEN.................................................................................. 2-2

2.2 OPERATING CONTROLS............................................................................................ 2-2

2.2.1 STATUS KEY.............................................................................................................. 2-2

2.2.2 GRAPH KEY .............................................................................................................. 2-2

2.2.3 PROGRAM KEY......................................................................................................... 2-2

2.2.4 MANUAL KEY ........................................................................................................... 2-2

2.2.5 START KEY ................................................................................................................ 2-3

2.2.6 ABORT KEY ............................................................................................................... 2-3

2.2.7 RESET KEY ................................................................................................................ 2-3

2.2.8 ZERO KEY ................................................................................................................. 2-3

2.2.9 SHUTTER KEY .......................................................................................................... 2-3

2.2.10 ARROW KEYS .......................................................................................................2-4

ALPHANUMERIC KEYPAD................................................................................. 2-4

2.2.11

3. BENCH CHECKOUT & INSPECTION......................................................................... 3-1

3.1 INSPECTION................................................................................................................. 3-1

3.2 COLD POWER UP ......................................................................................................... 3-1

3.3 WARM POWER UP....................................................................................................... 3-1

3.4 SAMPLE PROGRAM.................................................................................................... 3-1

3.4.1 MATERIAL #1 PARAMETERS .................................................................................. 3-2

3.4.2 MATERIAL #2 PARAMETERS .................................................................................. 3-3

3.4.3 PROCESS PARAMETERS ......................................................................................... 3-4

3.5 SIMULATE OPERATION............................................................................................. 3-4

3.6 MANUAL OPERATION ............................................................................................... 3-4

4. PROGRAMMING AND CONTROLLER SETUP........................................................ 4-1

4.1 GENERAL...................................................................................................................... 4-1

4.1.1 NAVIGATING THE MENU STRUCTURE ................................................................ 4-1

4.1.2 ENTERING ALPHA CHARACTERS.......................................................................... 4-1

4.1.3 ENTERING TIME PARAMETERS............................................................................. 4-2

4.1.4 COPYING AND DELETING ..................................................................................... 4-2

4.1.5 PASSWORD PROTECTION ...................................................................................... 4-2

4.1.5.1 VIEW/RUN PROCESS PASSWORD ...........................................................................4-2

4.1.5.2 EDIT PROCESS PASSWORD ......................................................................................4-3

4.1.5.3 EDIT MATERIAL PASSWORD................................................................................... 4-3

4.1.6 ADJUSTING LCD DISPLAY CONTRAST................................................................. 4-3

4.1.7 SPECIAL FUNCTION KEY ....................................................................................... 4-3

4.2 GETTING STARTED.................................................................................................... 4-3

4.2.1 UTILITY SETUP ........................................................................................................ 4-4

4.2.2 SOURCE SETUP ....................................................................................................... 4-4

4.2.3 SENSOR SETUP ........................................................................................................ 4-7

4.2.3.1 EXAMPLE USING THE RSH-600 SIX CRYSTAL SENSOR HEAD ........................4-9

4.2.4 INPUT, OUTPUT AND ACTION SETUP.................................................................. 4-9

4.2.5 DISPLAY SETUP ......................................................................................................4-10

4.2.6 MATERIAL SETUP...................................................................................................4-11

4.2.6.1 POWER RAMPS..........................................................................................................4-11

4.2.6.2 AUTOMATIC CRYSTAL SWITCHING.................................................................... 4-12

4.2.6.3 RATE ESTABLISH..................................................................................................... 4-12

4.2.6.4 RATE RAMPS.............................................................................................................4-12

4.2.6.5 RATE SAMPLE MODE.............................................................................................. 4-12

4.2.6.6 RATE DEVIATION ACTIONS...................................................................................4-13

4.2.7 PROCESS SETUP.....................................................................................................4-13

4.2.8 STARTING A NEW PROCESS..................................................................................4-13

4.2.9 RESUMING A PROCESS FROM ABORT OR HALT...............................................4-13

4.3 DETAILED PROGRAMMING ....................................................................................4-14

4.3.1 VIEW/EDIT PROCESS .............................................................................................4-14

4.3.1.1 DEFINE A PROCESS..................................................................................................4-14

4.3.2 VIEW/EDIT MATERIAL ...........................................................................................4-16

4.3.2.1 DEFINE A MATERIAL...............................................................................................4-16

4.3.3 SYSTEM SETUP .......................................................................................................4-24

4.3.3.1 EDIT DISPLAY SETUP .............................................................................................. 4-24

4.3.3.2 PROGRAM INPUTS...................................................................................................4-26

4.3.3.3 PROGRAM OUTPUTS................................................................................................4-27

4.3.3.4 PROGRAM ACTIONS................................................................................................4-32

4.3.3.5 EDIT SENSOR SETUP................................................................................................4-34

4.3.3.6 EDIT SOURCE SETUP...............................................................................................4-37

4.3.3.7 EDIT UTILITY SETUP...............................................................................................4-40

5. OPERATING THE MDC-260.......................................................................................... 5-1

5.1 SIGN-ON SCREEN........................................................................................................ 5-1

5.2 STARTING A NEW PROCESS..................................................................................... 5-1

5.3 STARTING A NEW LAYER......................................................................................... 5-2

vii

5.4

RESUMING AN ABORTED OR HALTED PROCESS................................................. 5-2

5.5 GRAPH DISPLAYS........................................................................................................ 5-2

5.6 STATUS DISPLAYS......................................................................................................5-3

5.6.1 MAIN RUN SCREEN ................................................................................................. 5-4

5.6.2 SOURCE-SENSOR STATUS SCREEN....................................................................... 5-4

5.6.3 I/O STATUS SCREEN ................................................................................................ 5-5

5.6.4 ACTIVE LAYER PARAMETER UPDATE SCREEN .................................................. 5-5

5.6.5 POSITION CONTROL SCREEN................................................................................ 5-5

5.7 MODES ..........................................................................................................................5-6

5.7.1 PROCESS READY...................................................................................................... 5-6

5.7.2 ABORT ....................................................................................................................... 5-6

5.7.3 HALT (SOFT ABORT) ............................................................................................... 5-6

5.7.4 IN PROCESS .............................................................................................................. 5-6

5.7.5 NOT SAMPLING........................................................................................................ 5-7

5.7.6 PROCESS COMPLETE ............................................................................................. 5-7

5.7.7 MANUAL.................................................................................................................... 5-7

5.7.8 SIMULATE................................................................................................................. 5-7

5.8 STATES..........................................................................................................................5-7

5.9 TROUBLE, ERROR AND WARNING MESSAGES.................................................... 5-7

5.9.1 DESCRIPTION .......................................................................................................... 5-8

5.9.1.1 MIN RATE&MAX POWER..........................................................................................5-8

5.9.1.2 MAX RATE&MIN POWER..........................................................................................5-9

5.9.1.3 SYSTEM SETUP MEMORY CORRUPTED................................................................ 5-9

5.9.1.4 PROCESS MEMORY CORRUPTED........................................................................... 5-9

5.9.1.5 MATERIAL MEMORY CORRUPTED........................................................................ 5-9

5.9.1.6 RATE EST. ERROR...................................................................................................... 5-9

5.9.1.7 CRYSTAL FAILURE.................................................................................................... 5-9

5.9.1.8 SOURCE FAULT.......................................................................................................... 5-9

5.9.1.9 SENSOR FAULT........................................................................................................... 5-9

5.9.1.10 NO SENSORS ENABLED.......................................................................................... 5-10

5.9.1.11 TIME POWER............................................................................................................. 5-10

5.9.1.12 RATE DEV. ALARM.................................................................................................. 5-10

5.9.1.13 ALARM ACTION ....................................................................................................... 5-10

5.9.1.14 CRYSTAL MARGINAL ............................................................................................. 5-10

5.9.1.15 RATE DEV. ALERT ................................................................................................... 5-10

5.9.1.16 MAX POWER ALERT................................................................................................ 5-10

5.9.1.17 MIN POWER ALERT ................................................................................................. 5-10

5.9.1.18 ALERT ACTION......................................................................................................... 5-10

5.9.1.19 XTAL FAIL SWITCH................................................................................................. 5-10

5.9.1.20 XTAL MRGN SWITCH.............................................................................................. 5-11

5.9.1.21 RATE DEV. ATTEN ................................................................................................... 5-11

5.9.1.22 MAXIMUM POWER .................................................................................................. 5-11

5.9.1.23 MINIMUM POWER.................................................................................................... 5-11

5.9.1.24 CHANGE POCKET..................................................................................................... 5-11

5.9.1.25 CHANGE CRYSTAL... ............................................................................................... 5-11

5.9.1.26 ATTENTION ACTION ............................................................................................... 5-11

5.9.1.27 PRESS START TO RESUME PROCESS................................................................... 5-11

viii

6. TUNING THE MDC-260 CONTROL LOOP................................................................. 6-1

6.1 CONTROL LOOP BASICS............................................................................................6-1

6.2 CONTROL LOOPS APPLIED TO VACUUM DEPOSITION....................................................... 6-2

6.3 ESTABLISHING MDC-260 CONTROL LOOP PARAMETERS ................................................ 6-3

7. INPUT/OUTPUT CHARACTERISTICS........................................................................7-1

7.1 SOURCE CONTROL VOLTAGE OUTPUT................................................................. 7-1

7.2 SENSOR INPUT............................................................................................................. 7-1

7.3 DISCRETE OUTPUTS................................................................................................... 7-1

7.4 DISCRETE INPUTS....................................................................................................... 7-1

8. CONTROLLER INSTALLATION .................................................................................8-1

MOUNTING .................................................................................................................. 8-1

8.1

8.2 PROPER GROUNDING................................................................................................ 8-1

8.3 EXTERNAL CONNECTIONS ...................................................................................... 8-1

8.3.1 POWER ENTRY MODULE ....................................................................................... 8-1

8.3.2 POWER CORD .......................................................................................................... 8-2

8.3.3 LINE VOLTAGE SELECTION AND FUSE REPLACEMENT .................................. 8-2

8.3.4 GROUND LUG.......................................................................................................... 8-3

8.3.5 REMOTE POWER HANDSET................................................................................... 8-3

8.3.6 SENSOR INTERFACE ............................................................................................... 8-3

8.3.7 SOURCE INTERFACE .............................................................................................. 8-3

8.3.8 USB COMMUNICATION .......................................................................................... 8-3

8.3.9 DISCRETE INPUT/OUTPUT .................................................................................... 8-3

8.3.9.1 CONFIGURING INPUT TYPE .....................................................................................8-4

8.4 POWER SWITCH ............................................................................................................... 8-4

8.5 CONTROLLER COVER REMOVAL........................................................................... 8-5

9. SYSTEM INSTALLATION............................................................................................. 9-1

9.1 SENSOR HEAD DESCRIPTION .................................................................................. 9-1

9.2 SENSOR HEAD INSTALLATION............................................................................... 9-1

9.3 SENSOR OSCILLATORS.............................................................................................. 9-2

9.3.1 SO-100 OSCILLATOR ............................................................................................... 9-2

9.3.2 VPLO-6 OSCILLATOR.............................................................................................. 9-2

9.3.3 INSTALLATION......................................................................................................... 9-2

9.4 INSTRUMENTATION FEEDTHROUGH.................................................................... 9-2

9.5 SENSOR CRYSTAL REPLACEMENT........................................................................ 9-3

9.5.1 CRYSTAL CARE AND HANDLING........................................................................... 9-3

9.5.2 CRYSTAL REPLACEMENT PROCEDURE .............................................................. 9-3

9.6 TYPICAL SYSTEM INSTALLATION......................................................................... 9-6

10. THEORY OF OPERATION......................................................................................10-1

10.1 BASIC MEASUREMENT ............................................................................................10-1

10.2 FILM THICKNESS CALCULATION..........................................................................10-1

10.3 SENSOR CRYSTAL.....................................................................................................10-3

10.3.1 CRYSTAL HEALTH .............................................................................................10-3

10.3.2 CRYSTAL STABILITY..........................................................................................10-4

10.3.3 TEMPERATURE COEFFICIENT OF THE CRYSTAL........................................10-4

10.3.4 CRYSTAL LIFE EXPECTANCY...........................................................................10-5

10.3.5 CRYSTAL ELECTRODE TYPE RECOMMENDATION ......................................10-6

10.4 RATE CALCULATION................................................................................................10-6

10.5 EMPIRICAL CALIBRATION......................................................................................10-6

10.5.1 FILM DENSITY....................................................................................................10-7

10.5.2 TOOLING FACTOR.............................................................................................10-7

10.5.3 ACOUSTIC IMPEDANCE...................................................................................10-8

11. COMPUTER INTERFACE........................................................................................11-1

11.1 GENERAL.....................................................................................................................11-1

11.2 HOST API FUNCTIONS....................................................................................................11-2

SI_GetNumDevices..................................................................................................................11-2

SI_GetProductString...............................................................................................................11-3

SI_Open...................................................................................................................................11-3

SI_Close ..................................................................................................................................11-4

SI_Read ...................................................................................................................................11-4

SI_Write...................................................................................................................................11-5

SI_SetTimeouts........................................................................................................................11-5

SI_GetTimeouts.......................................................................................................................11-6

SI_SetBaudRate.......................................................................................................................11-6

11.3 PROTOCOL..................................................................................................................11-7

11.4 DATA TYPES...............................................................................................................11-7

11.5

TRANSMISSION RECEIPT........................................................................................ 11-8

11.6 TRANSMITTING AND RECEIVEING MESSAGES................................................. 11-8

11.7 INSTRUCTION SUMMARY..................................................................................... 11-10

11.8 INSTRUCTION DESCRIPTIONS............................................................................. 11-11

Code #00: Remote Keypress Activation of Controller.......................................................... 11-11

Code #01: Send System Information..................................................................................... 11-12

Code #02: Send Utility Parameters ...................................................................................... 11-13

Code #03: Receive Utility Parameters ................................................................................. 11-14

Code #04: Not Supported ..................................................................................................... 11-14

Code #05: Not Supported ..................................................................................................... 11-14

Code #06: Send a Material................................................................................................... 11-15

Code #07: Receive a Material.............................................................................................. 11-17

Code #09: Send Number of Undefined Layers ..................................................................... 11-18

Code #10: Send Process....................................................................................................... 11-19

Code #11: Receive Process .................................................................................................. 11-20

Code #12: Delete Process .................................................................................................... 11-21

Code #13: Send Process Layer............................................................................................. 11-21

Code #14: Insert Process Layer ........................................................................................... 11-22

Code #15: Replace Process Layer........................................................................................ 11-23

Code #16: Delete Process Layer .......................................................................................... 11-24

Code #17: Send Process List................................................................................................ 11-24

Code #18: Send Source Setup............................................................................................... 11-25

Code #19: Receive Source Setup.......................................................................................... 11-26

Code #20: Send Sensor Setup............................................................................................... 11-27

Code #21: Receive Sensor Setup .......................................................................................... 11-28

Code #22: Send Input Setup ................................................................................................. 11-29

Code #23: Receive Input Setup............................................................................................. 11-30

Code #24: Send Output Setup............................................................................................... 11-30

Code #25: Receive Output Setup .......................................................................................... 11-33

Code #26: Send Action Setup ............................................................................................... 11-33

Code #27: Receive Action Setup........................................................................................... 11-35

Code #28: Send Controller Status ........................................................................................ 11-36

Code #29: Start Process....................................................................................................... 11-39

Code #30: Send Run-Time Values ........................................................................................ 11-39

Code #31: Initiate Automatic Data Logging ........................................................................ 11-43

Code #32: Internal Command ..............................................................................................11-45

Code #33: Set Active Source Power ..................................................................................... 11-45

Code #34: Internal Command ..............................................................................................11-45

Code #35: Internal Command ..............................................................................................11-46

Code #36: Not Supported ..................................................................................................... 11-46

Code #37: Not Supported ..................................................................................................... 11-46

Code #38: Remote Activation of Controller ......................................................................... 11-46

Code #39: Send a Run-Time Value....................................................................................... 11-47

Code #40: Enable/Disable the Front Panel Keyboard......................................................... 11-48

12. REPAIR AND MAINTENANCE.............................................................................. 12-1

12.1 HANDLING PRECAUTIONS ..................................................................................... 12-1

12.2 MAINTENANCE PHILOSOPHY................................................................................12-1

12.3 TROUBLE SHOOTING AIDS.....................................................................................12-1

12.4 RETURNING THE MDC-260 TO THE FACTORY.................................................... 12-3

13. APPENDIX A – MATING CABLE COLOR CODES ............................................ 13-1

14. APPENDIX B – PARAMETER TEMPLATES....................................................... 14-1

14.1 MATERIAL..................................................................................................................14-2

14.2 PROCESS..................................................................................................................... 14-4

14.3 DISPLAY SETUP......................................................................................................... 14-5

INPUTS.........................................................................................................................14-6

14.4

14.5 OUTPUTS.....................................................................................................................14-7

14.6 ACTIONS......................................................................................................................14-8

14.7 SENSOR SETUP...........................................................................................................14-9

14.8 SOURCE SETUP...........................................................................................................14-9

14.9 UTILITY SETUP.........................................................................................................14-10

15. INDEX.............................................................................................................................11

16. MENU MAPS...............................................................................................................16-1

Table of Figures

FIGURE 2-1 ARROW KEYS.......................................................................................................2-4

FIGURE 2-2 ALPHANUMERIC KEYPAD ................................................................................ 2-4

FIGURE 3-1 REMOTE POWER HANDSET ............................................................................. 3-5

FIGURE 4-1 THE MAIN MENU................................................................................................ 4-1

FIGURE 4-2 SELECT PROCESS SCREEN............................................................................. 4-14

FIGURE 4-3 DEFINE PROCESS SCREEN..............................................................................4-14

FIGURE 4-4 SELECT LAYER MATERIAL SCREEN.............................................................4-16

FIGURE 4-5 SELECT MATERIAL SCREEN........................................................................... 4-16

FIGURE 4-6 DEFINE MATERIAL SCREEN...........................................................................4-16

FIGURE 4-7 SYSTEM SETUP MENU SCREEN .................................................................... 4-24

FIGURE 4-8 DISPLAY SETUP SCREEN................................................................................4-24

FIGURE 4-9 PROGRAM INPUT SCREEN...............................................................................4-27

FIGURE 4-10 SELECT OUTPUT SCREEN............................................................................. 4-28

FIGURE 4-11 PROGRAM OUTPUT SCREEN........................................................................ 4-28

FIGURE 4-12 OUTPUT CONDITIONS SELECTION SCREEN............................................. 4-29

FIGURE 4-13 OUTPUT CONDITIONS SELECTION - SUB MENU...................................... 4-29

FIGURE 4-14 ACTION SELECTION SCREEN.......................................................................4-32

FIGURE 4-15 PROGRAM ACTION SCREEN......................................................................... 4-33

FIGURE 4-16 SELECT DEFINED ACTION SCREEN ............................................................ 4-33

FIGURE 4-17 SENSOR SETUP SCREEN................................................................................4-35

FIGURE 4-18 SOURCE SETUP SCREEN............................................................................... 4-37

FIGURE 4-19 UTILITY SETUP SCREEN............................................................................... 4-40

FIGURE 5-1 SIGN-ON SCREEN................................................................................................5-1

FIGURE 5-2 RUN PROCESS SELECTION SCREEN............................................................... 5-1

FIGURE 5-3 RATE VS. TIME GRAPH......................................................................................5-2

FIGURE 5-4 RATE DEVIATION VS. TIME GRAPH............................................................... 5-3

FIGURE 5-5 THICKNESS VS. TIME GRAPH..........................................................................5-3

FIGURE 5-6 POWER VS. TIME GRAPH..................................................................................5-3

FIGURE 5-7 MAIN RUN SCREEN.............................................................................................5-4

FIGURE 5-8 SOURCE-SENSOR STATUS SCREEN.................................................................5-4

FIGURE 5-9 I/O STATUS SCREEN............................................................................................5-5

FIGURE 5-10 ACTIVE LAYER PARAMETER UPDATE SCREEN ........................................ 5-5

FIGURE 5-11 POSITION CONTROL SCREEN.........................................................................5-5

FIGURE 5-12 TYPICAL PROCESS PROFILE........................................................................ 5-12

FIGURE 7-1 PASSIVE INPUT BUFFER CIRCUIT .................................................................. 7-3

FIGURE 7-2 ACTIVE INPUT BUFFER CIRCUIT.....................................................................7-4

FIGURE 7-3 SENSOR INPUT BUFFER CIRCUIT.................................................................. 7-5

FIGURE 7-4 SOURCE OUTPUT DRIVER CIRCUIT ............................................................... 7-6

FIGURE 8-1 POWER ENTRY MODULE...................................................................................8-2

FIGURE 8-2 INPUT TYPE SELECTION SWITCHES...............................................................8-4

FIGURE 8-3 MDC-260 FRONT PANEL....................................................................................8-6

FIGURE 8-4 MDC-260 REAR PANEL ...................................................................................... 8-7

FIGURE 8-5 SOURCE SOCKET CONNECTOR PIN OUT...................................................... 8-8

FIGURE 8-6 USB “B” TYPE SOCKET FRONT AND REAR PANEL CONNECTOR............. 8-8

FIGURE 8-7 D37P DISCRETE I/O PLUG CONNECTOR......................................................... 8-9

FIGURE 8-8 FRONT PANEL MANUAL POWER CONNECTOR.........................................8-10

FIGURE 8-9 MDC-260 TOP VIEW (COVER REMOVED)..................................................... 8-11

FIGURE 8-10 RECOMMENDED GROUNDING METHOD...................................................8-12

FIGURE 9-1 REMOVING THE CRYSTAL RETAINER........................................................... 9-5

FIGURE 9-2 INSTALLING THE SENSOR CRYSTAL ............................................................. 9-5

FIGURE 9-3 SO-100 SENSOR OSCILLATOR OUTLINE........................................................ 9-7

FIGURE 9-4 VPLO-6 SENSOR OSCILLATOR OUTLINE....................................................... 9-8

FIGURE 9-5 IF-111 INSTRUMENTATION FEEDTHROUGH OUTLINE..............................9-9

FIGURE 9-6 SH-102 SENSOR HEAD OUTLINE...................................................................9-10

FIGURE 9-7 TYPICAL SYSTEM INSTALLATION............................................................... 9-11

xii

FIGURE 13-1 PLUG PIN OUT - SOURCE CABLE CONNECTOR.........................................13-1

FIGURE 16-1 MAP OF STATUS AND GRAPH SCREENS.....................................................16-1

FIGURE 16-2 MAP OF PROGRAMMING MENU SCREENS.................................................16-2

List of Tables

TABLE 4-1 TABLE OF INPUT STATES FOR BCD FEEDBACK TYPE...............................4-37

TABLE 4-2 TABLE OF INPUT STATES FOR BCD FEEDBACK TYPE................................4-39

TABLE 5-1 TROUBLE CONDITIONS AND WARNINGS...................................................... 5-8

TABLE 6-1 DEFAULT AND RANGE FOR PID PARAMETERS............................................. 6-3

TABLE 6-2 SUGGESTED PID STARTING VALUES FOR DIFFERENT SOURCES............. 6-3

TABLE 8-1 SOURCE CONTROL SYSTEM INTERFACE CONNECTOR PIN

ASSIGNMENTS................................................................................................................. 8-8

TABLE 8-2 DISCRETE I/O SYSTEM INTERFACE CONNECTOR PIN ASSIGNMENTS... 8-9

TABLE 8-3 FRONT PANEL MANUAL POWER CONNECTOR PIN ASSIGNMENTS.......8-10

TABLE 10-1 MATERIAL DENSITY AND ACOUSTIC IMPEDANCE VALUE....................10-9

xiii

MDC-260 DEPOSITION CONTROLLER

1. GENERAL DESCRIPTION

1.1 PURPOSE

The MDC-260 is a full-featured deposition controller which can provide automatic control of single or multi-layer film deposition in either a production or development environment. The MDC-260 will improve predictability and repeatability of deposited film characteristics through dependable digital control.

The MDC-260 makes programming and operation easy with an easy to use menudriven user interface and a large graphic LCD for displaying important run-time information and graphs. The plain-English programming interface offers unmatched simplicity and control of all processes, materials, inputs, outputs and actions.

1.2 FEATURES

The MDC-260 incorporates numerous features which are economically justifiable as a result of rapid advances in semiconductor technology and the advent of low cost microprocessors.

1.2.1 AMPLE PROGRAM STORAGE

The MDC-260 is capable of storing up to 10 processes, 250 layer definitions and 8 complete material definitions. Once a program is entered it will be maintained in internal Flash Memory indefinitely (for a minimum of 100 years) without external power.

1.2.2 DYNAMIC MEASUREMENT UPDATE RATE

Measurement is dynamically adjusted from 0.5 to 10 Hz for optimum resolution and control.

1.2.3 SUPERIOR COLOR GRAPHICS DISPLAY

The MDC-260 features a 240x64 pixel color LCD graphics display allowing realtime graphing of important process information such as rate, rate deviation, thickness and power.

1.2.4 PROGRAM SECURITY

To assure the integrity of stored programs, the MDC-260 incorporates view/edit passwords to guard against unauthorized program changes.

1.2.5 DESIGNED FOR UNATTENDED OPERATION

The MDC-260 has been designed for truly automatic operation and toward this end incorporates extensive internal monitoring and overriding abort circuitry to minimize the possibility of damage in the event of a failure or other problem in the total deposition system. In addition there are attention, alert and alarm signals with adjustable volume for trouble and routine operator call.

GENERAL DESCRIPTION 1-1

MDC-260 DEPOSITION CONTROLLER

1.2.6 FAIL SAFE ABORTS

In the event of an MDC-260 failure, as evidenced by unsatisfactory internal checks, the MDC-260 will abort the process and shut off all outputs. In addition to the internal checks, the MDC-260 also provides user enabled aborts on excessive rate control error or crystal failure.

1.2.7 ABORT STATUS RETENTION

In the event that the MDC-260 does abort during the deposition process, pertinent information is stored at the time of abort. More importantly, the process can be easily resumed once the problem is corrected without re-programming.

1.2.8 RUN COMPLETION ON CRYSTAL FAILURE

The extensive monitoring and abort functions are designed to protect the system and/or process from serious and hopefully infrequent malfunctions of the deposition system. A condition which need not cause an abort is the condition of crystal failure. The MDC-260 can be set to abort upon crystal failure or run to completion using a backup crystal or time/power method.

1.2.9 POWERFUL SYSTEM INTERFACE

Fully programmable discrete inputs and outputs permit the MDC-260 to be easily interfaced into deposition systems controlling the most complex processes. Also, source control outputs are fully isolated avoiding ground loop problems. The MDC-260 also supports input from an optical monitor for optical termination of film thickness.

1.2.10 POWER SUPPLY NOISE TOLERANCE

Integral RFI filter and large energy storage capacitors will tolerate high levels of power supply noise and power interruptions of 700 ms or less without effect.

1.2.11 INTERNATIONAL STANDARD POWER CONNECTOR

The power connector is internationally approved and meets IEC (International Electrotechnical Commission) standards. It allows selection of input power voltages ranging from 100 to 240 volts at a frequency of 50 or 60 Hz and includes an integral RFI filter.

GENERAL DESCRIPTION 1-2

MDC-260 DEPOSITION CONTROLLER

1.3 SPECIFICATIONS

1.3.1 MEASUREMENT

Frequency Resolution 0.03 Hz @ 6.0 MHz Mass Resolution 0.375 ng/cm2 Thickness Accuracy 0.5% + 1 count Measurement Update Rate Dynamically adjusted, 0.5 to 10 Hz Display Update Rate 10 Hz Sensor Crystal Frequency 2.5, 3, 5, 6, 9, 10 MHz

1.3.2 DISPLAY

Thickness Display Autoranging: 0.000 to 999.9 KÅ Rate Display Autoranging: 0.0 to 999 Å/sec Power Display 0.0 to 99.9% Time Display 0 to 9:59:59 H:MM:SS Crystal Health 0-99 % Layer Number 1 to 250 Graphics Display 240X64 Color LCD with CCFL

backlighting

Color Schemes 4 built-in color presets

1.3.3 COMMUNICATION

Protocol USB 1.1 Driver Microsoft Windows driver included

1.3.4 PROGRAM STORAGE CAPACITY

Process 10 (user definable) Layer 250 (user definable) Material 8 (user definable)

1.3.5 PROCESS PARAMETERS

Process Name 12 character string View/Run Password 4 character string Edit Password 4 character string Layer# 1 to 250 Thickness, material name

GENERAL DESCRIPTION 1-3

MDC-260 DEPOSITION CONTROLLER

1.3.6 MATERIAL PARAMETERS

Material Name 10 character string Sensor # 1 to 2 Crystal # 1 to 16 Source # 1 to 2 Pocket # 1 to 16 Density 0.80 to 99.9 gm/cm3 Acoustic Impedance 0.50 to 59.9 gm/cm2 sec Tooling Factor 10.0 to 499.9% Proportional Gain 0.00 to 9999 Integral Time Constant 0 to 99.9 sec Derivative Time Constant 0 to 99.9 sec Rise to Soak Time 0 to 9:59:59 H:MM:SS Soak Power 0 to 99% Soak Time 0 to 9:59:59 Rise to Predeposit Time 0 to 9:59:59 Predeposit Power 0 to 99.9% Predeposit Time 0 to 9:59:59 Rate Establish Time 0 to 60 sec Rate Establish Error * 0 to 99.9% Deposition Rate (#1, #2*, #3*) 00.0 to 999.9 Å/sec Ramp (#1, #2*) Start Thickness 0 to 100% [100% = Ramp Disabled] Ramp (#1*, #2*) Stop Thickness 0 to 100% Time Setpoint 0 to 9:59:59 Ramp to Feed Time 0 to 9:59:59 Feed Power 0 to 99.9% Feed Time 0 to 9:59:59 Ramp to Idle Time 0 to 9:59:59 Idle Power 0 to 99.9% Maximum Power 0 to 99.9% Power Alarm Delay 0 to 99 sec Minimum Power 0 to 99.9% Rate Deviation Attention 0 to 99.9% Rate Deviation Alarm 0 to 99.9% Rate Deviation Abort 0 to 99.9% Sample Dwell % 0 to 100% Sample Period * 0:01:00 to 9:59:59 Crystal Fail Switch, Time Power, Halt, Abort Backup Sensor # 1 to 2 Backup Crystal # 1 to 16 Backup Tooling Factor 10.0 to 499.9%

Material Password 4 character string * These options are made available based on the settings of surrounding parameters, and will not appear if their value is not needed.

GENERAL DESCRIPTION 1-4

MDC-260 DEPOSITION CONTROLLER

The MDC-260 also has a built in material library that contains many common material names along with their density and acoustic impedance values.

1.3.7 INPUT/OUTPUT CAPABILITY

Sensor Inputs 2 BNC inputs Source Outputs 2 fully isolated, 2.5, 5, 10 volts @ 20

ma. 0.002% resolution

Discrete Inputs 8 fully programmable inputs, user

selectable ground true (Passive) or 12 to 120 volt AC/DC (Active).

Discrete Outputs 8 fully programmable outputs, SPST

relay, 120VA, 2A max. Abort Output 1 SPST Relay, 120VA, 2A max. Remote Power Handset Front panel, RJH jack USB 1.1 Communication USB “B” connectors on both front

and rear panel

1.3.8 SENSOR PARAMETERS

Number of Crystals 1 to 16 Shutter Relay Type Normally open, normally closed, dual,

or none Position Control Manual, direct, BCD, or individual Position Drive Up, down, Fast, inline, single step, or

double step Feedback Type Individual, BCD, single home, in

position, or no feedback Rotator Delay 0 to 99 sec

GENERAL DESCRIPTION 1-5

MDC-260 DEPOSITION CONTROLLER

1.3.9 SOURCE PARAMETERS

Number of Pockets 1 to 16 Shutter Relay Type Normally open, normally closed, or

none. Shutter Delay 0.0 to 9.9 sec Position Control Manual, direct, BCD, or individual Position Drive Up, down, Fast, inline, single step, or

double step Feedback Type Individual, BCD, single home, in

position, or no feedback Rotator Delay 0 to 99 sec Source Voltage Range 2.5, 5, 10 volts

1.3.10 UTILITY SETUP PARAMETER

Crystal Frequency 2.5, 3, 5, 6, 9, 10 MHz Simulate Mode On/Off USB Interface Address 1 to 32 Attention Volume 0 to 10 Alert Volume 0 to 10 Alarm Volume 0 to 10

1.3.11 OTHERS

Input Power Requirements 100, 120, 200, 240 VAC; 50/60 Hz;

25 watts Fuse Rating IEC T-Type (Slow), 4/10 A, 250 V Operating Temperature Range

0 to 50°C Physical Size Rack-mount configuration (with ears)

10.4” wide x 3.5” high x 9.7” deep

Desktop configuration (with feet)

8.5” wide x 4.2” high x 9.7” deep

GENERAL DESCRIPTION 1-6

MDC-260 DEPOSITION CONTROLLER

1.4 ACCESSORIES

The table below lists the most commonly used accessories. Refer to the Price List for more accessories and other products. Part Number Description 611200 DCM-250 V2.0 179220 Remote Power Handset 123200-5 SH-102 Sensor Head, cables, and

carousel of 10 each 6MHz Gold SC-101 sensor crystals

123213 BSH-150 Single Bakeable Sensor Head

with 2-3/4 innch Conflat® Flange.

150212 ASF-140 Adjustable Single Sensor with

1 inch Feedthrough Combo.

124201-4 SO-100 Oscillator with 6" and 10' BNC

Cables.

621201 VPLO-6 Vacuum Phase-Lock

Oscillator with 6" and 10' BNC Cables.

130200-2 IF-111 Instrument Feedthrough, 1" O-

Ring with 1 electrical connector and dual 3/16" water tubes.

130204-2 IF-276 Instrumentation Feedthrough, 2

3/4" Conflat® Flange seal with 1 electrical connector and dual 3/16" water tubes.

150902 SF-120 Combination Sensor Head,

Feedthrough, Cables, Crystals and

Oscillator. 123204-1 Internal Coax Cable 30". 123204-2 Internal Coax Cable 60". 124202-1 BNC Cable Assembly 10'. 124202-2 BNC Cable Assembly 20' 124204 BNC Cable Assembly 6". 103220 SC-101 Carousel of 10 each 6MHz gold

sensor crystals. 103221 SC-102 Carousel of 10 each 6MHz

silver sensor crystals.

GENERAL DESCRIPTION 1-7

MDC-260 DEPOSITION CONTROLLER

2. FRONT PANEL DISPLAYS AND CONTROLS

Using the front panel is the most direct method of accessing the MDC-260. Both the programmer and the operator will find it beneficial to become familiar with it.

2.1 GRAPHIC LCD DISPLAY

All programming and status information is shown through the central color LCD. This section lists the available screens. These screens are grouped in three distinctive areas: Programming screens, Graph screen, and Status screens. For detailed descriptions of the different programming and status screens, refer to Section 4 and 5.

2.1.1 PROGRAMMING SCREENS (MENUS)

Pressing the Program key at any time will cause the MDC-260 to return to the main programming mode. In this mode, the user has the ability to make changes to any parameter settings. Upon power up, the LCD display automatically reverts to the last viewed status screen.

2.1.2 RUN-TIME GRAPHS

There are four graphs that may be displayed to show the progress of a deposition process. Pressing the Graph key scrolls through the four available graphs: Rate, Power, Thickness and Rate Deviation. The graphs automatically adjust the time axis as the deposition proceeds.

2.1.3 STATUS SCREENS

Pressing the Status key scrolls through the four available screens of run-time data (Status Screens). Each shows a different aspect of the current process. All of the parameters are updated ten times per second unless the controller is in the Abort mode.

2.1.3.1 MAIN RUN SCREEN

The Main Run Screen is a useful data screen which displays the most pertinent run-time information in large, easy-to-read numbers. The data shown specifically applies to the active Source/Sensor combination and the active process.

2.1.3.2 SOURCE/SENSOR STATUS SCREEN

The Source/Sensor Status Screen presents run-time data concerning both sources and sensors. Also, from this view, the Pocket #, Sensor # or Crystal # may be changed.

2.1.3.3 INPUT/OUTPUT STATUS SCREEN

The Input/Output Status Screen shows the state of all of the external inputs and output.

FRONT PANEL DISPLAYS AND CONTROLS

2-1

MDC-260 DEPOSITION CONTROLLER

2.1.3.4 ACTIVE LAYER PARAMETER UPDATE SCREEN

The Active Layer Parameter Update screen displays a set of parameters of the current active. It allows the user to quickly change these values, if needed, to fine-tune the run, without having to go into the Edit Material Definition screen. This screen is only available during a process.

2.1.3.5 POSITION CONTROL SCREEN

This screen allows the user to easily switch to a desired pocket or crystal in order to replace the material or crystal. The Position Control Screen is only available when the controller is in idle (not in process or abort state).

2.2 OPERATING CONTROLS

Normal operation of the MDC-260 is controlled by three viewing-mode keys (Status, Graph, and Program) and six action keys (Manual, Start, Abort, Reset, Zero and Shutter). Except for Zero, each of the action keys is equipped with an LED to indicate the controller’s status.

2.2.1 STATUS KEY

Pressing the Status key will bring up one of the four run-time status screens. Repeatedly pressing the key will cycle through the different status screens. Refer to Section 5 for a detailed description of the viewing modes.

2.2.2 GRAPH KEY

Pressing the Graph key will bring up one of the four run-time graph screens. Repeatedly pressing the key will cycle through the different graph screens. Refer to Section 5 for a detailed description of the viewing modes.

2.2.3 PROGRAM KEY

Pressing the Program key return the controller into Programming Mode, which allows the operator to adjust settings and enter program parameters. The last viewed programming screen will appear immediately (If a programming screen

is already shown, this key has no effect.) This key is also used in conjunction with the Up and Down Arrow keys to adjust the contrast of the LCD . If the screen background is too bright, press and hold the Program and the down arrow keys until the text is easy to read. If the screen background is too dark and the text cannot be seen, press and hold the Program and the up arrow keys. Refer to Section 5 for a detailed description of the viewing modes.

2.2.4 MANUAL KEY

This key is used to toggle Manual Mode on and off. A red light behind this key indicates the controller is in manual power control mode. This mode may be selected at any time providing that the controller is not in Abort mode. The

Manual mode indicates that the source control voltage output for the active source is being controlled through the Remote Power Handset. (The active source is set by the active material's Source parameter).

FRONT PANEL DISPLAYS AND CONTROLS 2-2

MDC-260 DEPOSITION CONTROLLER

In the Manual mode the control voltage remains constant unless incremented up or down by means of the Remote Power Handset. At entry into the Manual mode, the power is left at the last value prior to entry and is thereafter modified only through the Remote Power Handset. Exit from the manual mode is accomplished by means of the Manual or Reset key.

The MDC-260 can also be aborted through the Remote Power Handset. This abort feature is active whether or not MDC-260 is in the manual mode.

2.2.5 START KEY

The Start key starts a process, starts a layer, or resumes an aborted process. A green light behind this key indicates the controller is in process. When this key is pressed the first time a list of stored processes is displayed in the LCD window. You simply scroll the cursor on to the desired process and press Start again to start the process.

2.2.6 ABORT KEY

The Abort key drives the MDC-260 into the Abort mode. All source powers are set to zero and discrete outputs are set to inactive state. A red light behind this key indicates the controller is in the abort mode.

2.2.7 RESET KEY

The Reset key is used to clear the controller from Abort mode and put it into the Ready mode. A yellow light behind this key indicates a Ready mode. The Reset key is inactive during the In Process mode so that a premature exit from the In Process mode requires an abort.

CAUTION: Once a process is reset, it cannot be resumed. Consequently, don't reset an aborted process if you want to resume it once the problem is cleared.

2.2.8 ZERO KEY

Pressing the Zero key causes the thickness display to go to zero. This key is active at all times and if pressed during the deposit state will result in a film thicker than that desired by an amount equal to the thickness displayed at the time the display was zeroed.

2.2.9 SHUTTER KEY

This key is used to manually open and close all source shutters. The red light is illuminated when the active source shutter relay is closed. This key is only active when the controller is in the Process Ready mode.

FRONT PANEL DISPLAYS AND CONTROLS

2-3

MDC-260 DEPOSITION CONTROLLER

2.2.10 ARROW KEYS

The arrow keys are used to navigate through the programming and setup menu structure. These keys will auto-repeat if they are held down for more than half a second.

Figure 2-1 Arrow Keys

2.2.11 ALPHANUMERIC KEYPAD

The alphanumeric keyboard is used to edit controller parameters. Refer to Section 4 for details on enter new parameter values

Figure 2-2 Alphanumeric Keypad

FRONT PANEL DISPLAYS AND CONTROLS 2-4

MDC-260 DEPOSITION CONTROLLER

3. BENCH CHECKOUT & INSPECTION

3.1 INSPECTION

Your MDC-260 was released to the carrier in good condition and properly packed. It is essential to all concerned that the contents of the shipment be carefully examined when unpacked to assure that no damage occurred in transit. Check the material received against the packing list to be certain that all elements are accounted for. Items included with your controller are:

1 MDC-260 Deposition Controller 1 Operation and Service Manual 1 Power cord 1 Source cable (4 pin mini DIN connector) 1 Discrete I/O connector kit (37P D shell)

In addition, you may have ordered one or more of the accessories listed in Section

1.4. If there is evidence of loss or damage:

a) Notify the carrier or the carrier agent to request inspection of the loss

or damage claimed.

b) Keep the shipping containers until it is determined whether or not they

are needed to return the equipment to INFICON.

3.2 COLD POWER UP

When external power is initially supplied (a “cold” power up), the unit will run a series of tests and initialize all program data. The LCD will show the controller Sign-on screen with its configuration information. See Figure 5-1. The unit will stay in this state until a key is pressed, at which time the LCD display will return to the last viewed screen prior to loss of power.

3.3 WARM POWER UP

Pressing the front-panel “Power” key does not completely remove power from the system, but rather puts the MDC-260 into a power-saving “Stand-by Mode”. Pressing the key again wakes up the MDC-260 (a “warm” power up) and resumes whatever operation was in process when the unit was disabled.

3.4 SAMPLE PROGRAM

The sample program listed below is included in the MDC-260 memory at the time of shipment. It can be used to evaluate the controller by running it in Simulate Mode. Follow instructions in Section 4 to navigate through the menu structure. Check the controller parameter values against the sample program for discrepancy and change if necessary. Note also, if the source or sensor configuration has been changed during familiarization with the controller programming, appropriate source and sensor parameter values also need to be retained for the sample program to run correctly.

BENCH CHECKOUT & INSPECTION

3-1

MDC-260 DEPOSITION CONTROLLER

3.4.1 MATERIAL #1 PARAMETERS

Material Name Cr Sensor # 1 Crystal # 1 Source # 1 Pocket # 1 Density 07.20 gm/cm3 Acoustic Impedance 28.95 gm/cm2 sec Tooling Factor 100% Proportional gain 2400 Integral Time constant 99.9 seconds Derivative Time constant 0.00 seconds Rise to Soak Time 0:00:10 Soak Power 5 % Soak Time 0:00:10 Rise to Predeposit Time 0:00:10 Predeposit Power 9.5 % Predeposit Time 0:00:05 Rate Establish Time 0 seconds Deposition Rate #1 10.0 Å/second Ramp #1 Start Thickness 100 % (No Rate Ramps) Time Setpoint 0:00:00 Ramp to Feed Time 0:00:05 Feed Power 7 % Feed Time 0:00:10 Ramp to Idle Time 0 Idle Power 0 Maximum Power 20 % Power Alarm Delay 5 seconds Minimum Power 0 % Rate Deviation Attention 0 % Rate Deviation Alarm 0 % Rate Deviation Abort 0 % Sample Dwell % 100 % (Continuous Sampling) Crystal Fail TimePwr Backup Sensor # 1 Backup Crystal # 1 Backup Tooling Factor 100 % Material Password 0000

BENCH CHECKOUT & INSPECTION 3-2

MDC-260 DEPOSITION CONTROLLER

3.4.2 MATERIAL #2 PARAMETERS

Material Name Au Sensor # 1 Crystal # 1 Source # 1 Pocket # 2 Density 19.30 gm/cm3 Acoustic Impedance 23.18 gm/cm2 sec Tooling Factor 100 % Proportional gain 5000 Integral Time constant 99.9 seconds Derivative Time constant 0.00 seconds Rise to Soak Time 0:00:05 Soak Power 25 % Soak Time 0:00:05 Rise to Predeposit Time 0:00:05 Predeposit Power 37.5 % Predeposit Time 0:00:10 Rate Establish Time 0 sec Deposition Rate #1 20.0 Å/sec Ramp #1 Start Thickness 100% (No Rate Ramps) Time Setpoint 0:00:00 Ramp to Feed Time 0:00:05 Feed Power 10 % Feed Time 0:00:10 Ramp to Idle Time 0 Idle Power 0 Maximum Power 50 % Power Alarm Delay 5 seconds Minimum Power 0 % Rate Deviation Attention 0 % Rate Deviation Alert 0 % Rate Deviation Alarm 0 % Sample Dwell % 100 % (Continuous Sampling) Crystal Fail TimePwr Backup Sensor # 1 Backup Crystal # 1 Backup Tooling Factor 100 % Material Password 0000

BENCH CHECKOUT & INSPECTION

3-3

MDC-260 DEPOSITION CONTROLLER

3.4.3 PROCESS PARAMETERS

Process Name Layer No. Thickness Material Sample 1 0.400 KÅ Cr 2 1.050 KÅ Au

3.5 SIMULATE OPERATION

Testing the MDC-260 is best accomplished by checking its operation in the Simulate Mode. This mode can be selected by entering the following programming sequence: (Main Menu, Edit System Setup, Edit Utility Setup, Simulate Mode ON). After enabling Simulate Mode, you may run a process in Simulate Mode by pressing the Start key and selecting the process that you want to run.

Simulate Mode is identical to the Normal Mode except that the sensor inputs are simulated. For this reason, entry to the Simulate Mode will switch off the Crystal Failure message if it is flashing. No other difference between the Simulate Mode and the Normal Mode occurs until entry to the Deposit State.

3.6 MANUAL OPERATION

Manual Mode is selected by depressing the Manual key. The LED behind the key will light up indicating the controller is in Manual Mode.

The Manual Mode is identical to the Normal Mode in all respects except that source power for the active source is controlled only through the Remote Power Handset.

The Remote Power Handset has three push buttons (see Figure 3-1). Without any of the buttons depressed, the output power is maintained at its last value. Depressing the “POWER (+)” button will increase the power, depressing the “POWER (-)” button will decrease the power and depressing the “ABORT” button will put the controller into the Abort Mode.

The “ABORT” button on the handset is active whether or not the MDC-260 is in Manual Mode and therefore can be used as a remote “panic button”.

The minimum increment by which the power is increased or decreased is 0.1%.

BENCH CHECKOUT & INSPECTION 3-4

MDC-260 DEPOSITION CONTROLLER

Figure 3-1 Remote Power Handset

TO MDC-260 FRONT PANEL

BENCH CHECKOUT & INSPECTION

3-5

MDC-260 DEPOSITION CONTROLLER

4. PROGRAMMING AND CONTROLLER SETUP

4.1 GENERAL

4.1.1 NAVIGATING THE MENU STRUCTURE

Before attempting to navigate the menu structure of the MDC-260 controller, please refer to Section 2 which provides a brief summary of the front-panel displays and key functions. A graphical menu structure is shown in Figure 16-2. Note that following a power-on (“cold” or “warm”), the LCD will begin at the last screen the unit was displaying when it was turned off.

This may be confusing until the full scope of the controller’s capabilities are understood. However, as their names suggest, the Status, Graph and Program keys select the display of status screens, graph screens and programming screens, respectively. Also note that the last viewed screen for each type is remembered and will be displayed the next time that display type is selected.

Main Menu

View/Edit Process..

View/Edit Material Edit System Setup

Figure 4-1 The Main Menu Press the Program key to enter the programming mode. The programming

screens can be visualized as a two-dimensional menu format. The Main Menu is visualized at the far left, with an increasing level of detail in the menus to the right. The Left and Right-arrow keys are used to move between menus and columns. The Up and Down-arrow keys are used to scroll through a list of parameters or options in each menu. To select a menu option, highlight it, then press either the Enter key or the Right-arrow key. This will present the next screen associated with the selected option. Please note that holding the Left

arrow key will always bring you back to the Main Menu screen no matter where you are in the menu structure.

Each of the programming screens is described in detail later in this section.

4.1.2 ENTERING ALPHA CHARACTERS

To enter a name, press the key that contains the letter or character you wish to enter. Next, press the Alpha key to change the number to the first letter of that key. Keep pressing the Alpha key to get the desired letter. Upper/lower case can be toggled by pressing the Shift key. Once the desired letter is achieved, repeat the above procedure and enter the remainder of the name. Note that the 9 key contains characters “Y”, “Z”, and “space”. Use this key to enter a space.

PROGRAMMING AND CONTROLLER SETUP

4-1

MDC-260 DEPOSITION CONTROLLER

4.1.3 ENTERING TIME PARAMETERS

The MDC-260 expresses time in 24-hour h:mm:ss format. In programming a time parameter, the Decimal ‘.’ key is used to separate hour, minute and second. Hence, 1:45:23 would be entered as “1.45.23” and 0:00:35 entered as “..35”, followed by the Enter key.

4.1.4 COPYING AND DELETING

A ‘process’ is defined by one or more ‘layers’, and a layer requires a ‘material’ and a thickness definition. The MDC-260 has the capability of copying and deleting processes, layers, and materials. Except when copying a layer, procedures for copying and deleting a process, a layer and a material are the same. The difference when copying a layer is that layers are pushed-down to make space for the new layer, and move up when a layer is deleted.

To copy a process, position the cursor at the process to be copied, then press the 1 key. Next, move the cursor to the location where the process is to be copied and press Enter. The process will be copied to the new location with the same name.

If there is already a process name at the new location, it will be overwritten.

The copied process should be given a new name to avoid confusion. The same procedure applies when copying a material.

When copying a layer, the copied data will be positioned at the selected layer number. The data of the selected layer, and all following layers, will be pushed down one layer. Example, if a layer is copied onto Layer #4 location, the existing data in Layer #4 will be pushed to Layer #5, Layer #5 to Layer #6, etc., while the copied data is placed in Layer #4.

CAUTION: Use below instruction carefully as deleted items are not recoverable.

To delete a process or a material, move the cursor to the item and press the 0 key. A message will pop up asking for verification of the deletion, press 1 to confirm or 0 to cancel the deletion.

4.1.5 PASSWORD PROTECTION

NOTE: The password protection is only meant to deter unsophisticated users. Be sure to record passwords, because if you forget a password it will not be possible to gain access to the protected item!

Each Process has a View/Run password and an Edit password. Each Material has an Edit password. The three passwords protect against unauthorized operations. The passwords default to 0000, or no password protection, at the time of shipment. Refer to the descriptions below to set each password.

4.1.5.1 VIEW/RUN PROCESS PASSWORD

The View/Run password is required to view or run a process. To set this password, select View/Edit Process from the Main Menu, select the process from the Select Process screen. Move the cursor onto the View/Run password, type in your password (4-digit string), and then press the Enter key. A message will pop

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MDC-260 DEPOSITION CONTROLLER

up asking for verification to change the password. Press 1 to confirm and 0 to cancel the change. Each time you want to view or run this process, you will now be asked to enter the correct password. Note that the Edit Process password takes precedence over the View/Run password. If you know the Edit password, you can also view the process. Once a password other than 0000 has been installed, it will not be displayed unless re-entered.

4.1.5.2 EDIT PROCESS PASSWORD

The Edit process password is required to edit a process. To set this password, select View/Edit Process from the Main Menu, select the process from the Select Process screen. Move the cursor onto the Edit password, type in your password (4-digit string), then press the Enter key. A message will pop up asking for verification to change the password. Press 1 to confirm and 0 to cancel the change. Each time you want to edit this process, you will be asked to enter the correct password. Once a password other than 0000 has been installed, it will not be displayed unless re-entered.

4.1.5.3 EDIT MATERIAL PASSWORD

The Edit material password is required to edit a material. To set this password, select View/Edit Material from the Main Menu, select the material from the Select Material screen. Move the cursor down to the Material Password parameter, the last item in the list, type in your password (4 digit string), then press the Enter key. A message will pop up asking for verification to change the password. Press 1 to confirm and 0 to cancel the change. Each time you want to edit this material, you will be asked to enter the correct password. Once a password other than 0000 has been installed, it will not be displayed unless reentered.

4.1.6 ADJUSTING LCD DISPLAY CONTRAST

The LCD display contrast can be adjusted by using the Program key in conjunction with the Up-arrow and Down-arrow keys. Hold down the Program key and press the Up-arrow key to increase the contrast. Likewise, hold down the Program key and press the Down-arrow key to decrease the contrast. Continue to adjust the contrast until a clear and comfortable setting is found.

4.1.7 SPECIAL FUNCTION KEY

The number 7 key on the alphanumeric keypad is used as a special function in certain screens. It can be used to toggle the time displayed on the Main Run Screen, or to toggle between thickness and frequency on the Source-Sensor Status Screen.

4.2 GETTING STARTED

This section is intended to help new users quickly program the MDC-260 for basic applications. The section gives the best programming sequence and lists programming examples. See DETAILED PROGRAMMING in section 4.3 for a complete programming description.

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4.2.1 UTILITY SETUP

The only critical parameter in the Utility Setup is the Crystal Frequency parameter. This parameter must be set for the specific frequency crystals that you plan to use (2.5, 3.0, 5.0, 6.0, 9.0, 10.0 MHz).

The Simulate Mode parameter may also be useful in the initial setup and testing phase of the MDC-260. Simulate Mode provides a means of simulating deposition on the crystal. This mode is useful for testing the setup of the MDC260 without having to deposit any material.

If you only are using one MDC-260, leave the USB Interface Address at 01. Numbers greater than 01 are used when multiple MDC-260’s are connected to the same system.

4.2.2 SOURCE SETUP

When defining sources or sensors, the MDC-260 will automatically create the inputs and outputs necessary to complete the interface based on the parameter settings. Therefore, once the setup is complete, the user should review the inputs and outputs noting the pin assignments so that the proper connections can be made. Also note that the I/O pin assignments can be changed if necessary in the program input and output screens.

The following two items in the Source Setup are common to almost all types of sources and typically require definition:

Source Shutter - If the source has a shutter to be activated by the MDC-260

then the Shutter Relay Type parameter must be set to either N.O. (normally open) or N.C. (normally closed). The typical setting is N.O. which means that the relay will close to open the shutter.

Once defined, the MDC-260 will create a relay output called “SourceN Shutter” that should be connected to the shutter actuator. The shutter can be tested by pressing the Shutter key with the controller in the Process Ready state. When the red LED in the Shutter key is illuminated then all source shutters should be opened. When the shutter LED is off then all source shutters should be closed.

If the shutter actuator has a significant delay in opening and closing then set the Shutter Delay parameter equal to the delay.

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Source Voltage - This parameter must be set to correspond to the input

voltage range of the source power supply (0 to 2.5, 5.0 or 10.0 volts).

The settings of the rest of the source parameters are dependent on whether the source has one or more pockets (crucibles) and whether pocket selection is manual or automatic.

Single Pocket Source - If the source has only one pocket (single pocket E-

beam gun, filament boat or sputtering source) then the remaining parameters can be left at their default values.

Multiple Pocket Source with Manual Position Control - For manual

position control of a multiple pocket source, you need only set the Number of Pockets parameter to the correct number of pockets. Once set, a message will appear at the start of each layer instructing the operator to change Source #N to the required material.

Multiple Pocket Source with Automatic Position Control - There are two

parameters requiring definition which are common to all the various types of position control. The first is the Number of Pockets parameter and the second is the Rotator Delay parameter. The Number of Pockets parameter is simply the number of pockets in the source. The Rotator Delay parameter defines the maximum amount of time allowed for the correct pocket to rotate into position. This should be set to the time it takes for the rotator to go from Pocket #1 all the way around to Pocket #1 again.

The settings of the three remaining parameters required for automatic pocket position control depends on the required type of position control and position feedback.

Position Control - The MDC-260 can be setup to either control the pocket position directly by interfacing to the rotator’s actuator or indirectly by interfacing to a rotator controller.

Direct Control of Pocket Position - Direct control means that the MDC-

260 will control the actuator (rotator motor, pneumatic valve, etc.) directly to get the desired pocket into position. For direct control first set the Control Parameter to Direct then select one of the following drive types and follow the instructions:

a. Unidirectional Motor Drive - The rotator drive motor can only turn in

one direction. Select Up for the Drive parameter. A relay output will be created called “SourceN Drive Up” that should be connected between the rotator motor and power supply.

b. Bi-directional Motor Drive - The rotator motor can turn in either

direction. Select Fast for the Drive parameter. Two relay outputs will be created. One called “SourceN Drive Up” and one called “SourceN Drive Dn”. With this drive type, the MDC-260 will activate either the drive up or drive down outputs to rotate to the required pocket in the least amount of time.

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c. Motor Driven Inline Source - Select Inline for the Drive type

parameter. Two relay outputs will be created. One called “SourceN Drive Up” and one called “SourceN Drive Dn”. In this case the up output will be activated when going from the greatest pocket to pocket #1.

d. Unidirectional Pneumatic Drive - Select Sngl Step or Dbl Step for the

Drive parameter. A relay output will be created called “SourceN Drive Up” that should be connected between the rotator’s pneumatic valve and power supply. With Sngl Step, the output will pulse once for one second to increment the rotator one position. With Dbl Step, the output will pulse twice for one second each to increment the rotator one position.

Indirect Control of Pocket Position - Indirect control means that the MDC-

260 will indicate the desired pocket position to a pocket rotator controller through position select outputs. The Drive parameter selects between the two following indirect position output formats:

a. Individual - With individual format, one output will be created for each pocket. So, if pocket 2 is the desired pocket, then the output “SourceN Pocket 2” will be true while all the other position outputs will be false.

b. BCD - With BCD format , the MDC-260 will create from one to three outputs based on the number of pockets. For example, an eight pocket source would use three outputs. If pocket one is the desired pocket, all outputs will be false. If pocket four is the desired pocket, outputs one and two will be true and output three will be false.

Position Feedback - The last step in defining automatic control of a multi-pocket source is to select the pocket position feedback type. The MDC-260 has the following five types of position feedback available:

No Feedback - As the name implies, no position feedback is created for this

type.

Individual - For this feedback type, one input is created for each pocket

position in the source. The inputs are labeled “SourceN Pocket X”. All inputs are normally false (open circuit) unless the respective pocket is in position then that input should be true (closed to ground). For example, a six pocket source would use six inputs. If pocket two was in position then all the inputs should be false except the input connected to “SourceN Pocket 2”.

Individual position feedback is the most typical feedback type and is recommended if more than one type is available.

BCD - Binary Coded Decimal position feedback. This feedback type uses

binary coding to indicate the pocket position. Inputs are numbered most significant bit first. For example, an eight pocket source would use three

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inputs. With pocket one in position, all inputs will be false. With poctket four in position, inputs one and two will be true and input three will be false.

Single Home - Single home position feedback. This feedback type uses one

input. The input is normally false (open circuit) and should go true (closed to ground) when pocket one is in position.

In Position - In position feedback. This feedback type uses one input. The

input is normally false (open circuit) and should go true (closed to ground) when the desired pocket is in position.

4.2.3 SENSOR SETUP

The following examples demonstrate how the MDC-260 is setup to control the four basic types of crystal sensor heads available:

Single Crystal Sensor Head - No sensor parameters need to be changed for a

single crystal sensor head.

Single Crystal Sensor Head with Shutter - For a single shuttered sensor

head, set the Shutter Relay Type parameter to either N.O. (normally open) or N.C. (normally closed). The typical setting is normally open which means that the relay will close to open the shutter. A relay output called “SensorN Shutter” will be created that should be connected between the sensor shutter actuator and power supply.

Dual Crystal Sensor Head with Shutter - For a dual crystal shuttered sensor

head, set the Shutter Relay Type parameter to Dual. A relay output called “DualSnsr1&2 Shtr” will be created that should be connected between the sensor shutter actuator and power supply.

Automatic crystal switching upon failure is enabled in the material menu by setting the Crystal Fail parameter to Switch and the Backup Sensor number to 2. Note that with the dual sensor head you define the sensor number that you would like to use, (or switch too) not the crystal number. The crystal number need only be defined when you are using a multiple crystal sensor head (sensor head with one BNC output and more than one crystal).

Multiple Crystal Sensor Head - The MDC-260 can be setup for either

automatic or manual control of multiple crystal sensor heads. a. Manual Crystal Position Control - For manual crystal position

control of a multiple crystal sensor head, set the Number of Crystals parameter to the correct number of crystals. Once set, a message will appear at the start of each layer instructing the operator to change Sensor N to the required crystal number.

b. Automatic Crystal Position Control - There are two parameters requiring definition which are common to all the various types of multiple sensor heads. The first is the Number of Crystals parameter and the second is the Rotator Delay parameter. The Number of

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Crystals parameter defines the number of crystals in the sensor head. The Rotator Delay parameter defines the maximum amount of time allowed for the correct crystal to rotate into position. This should be set to the time it takes for the rotator to go from Crystal #1 all the way around to Crystal #1 again.

The settings of the three remaining parameters required for automatic crystal position control depend on the type of position control and position feedback.

Position Control - The MDC-260 can be setup to either control the crystal position directly by interfacing to the rotator’s actuator or indirectly by interfacing to a rotator controller.

Direct Control of Pocket Position - Direct control means that the

MDC-260 will control the actuator (rotator motor, pneumatic valve, etc.) directly to get the desired crystal into position. For direct control, set the Control Parameter to Direct then select one of the following drive types and follow the instructions:

a. Unidirectional Motor Drive - Select Up for the Drive

parameter. A relay output will be created called “SensorN Drive Up” that should be connected between the rotator motor and power supply.

b. Bi-directional Motor Drive - Select Fast for the Drive

parameter. Two relay outputs will be created. One called “SensorN Drive Up” and one called “SensorN Drive Dn”. With this drive type, the MDC-260 will activate either the drive up or drive down outputs to get to the required crystal in the least amount of time.

d. Unidirectional Pneumatic Drive - Select Sngl Step or Dbl

Step for the Drive parameter. A relay output will be created called “SensorN Drive Up” that should be connected between the rotator’s pneumatic valve and power supply. With Sngl Step, the output will pulse once for one second to increment the rotator one position. With Dbl Step, the output will pulse twice for one second each to increment the rotator one position.

Indirect Control of Crystal Position - Indirect control means that the MDC-

260 will indicate the desired crystal position to a crystal rotator controller through position select outputs. . The Drive parameter selects between the two following indirect position output formats:

a. Individual - With individual format, one output will be created for each crystal. So, if crystal 2 is the desired crystal, then the output “SensorN Crystal2” will be true while all the other position outputs will be false.

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b. BCD - With BCD format , the MDC-260 will create from one to three outputs based on the number of crystals. For example, an eight crystal sensor head will use three outputs. If crystal one is the desired crystal, all outputs will be false. If crystal four is the desired crystal, outputs one and two will be true and output three will be false.

4.2.3.1 EXAMPLE USING THE RSH-600 SIX CRYSTAL SENSOR HEAD

The following is a list of the sensor parameter settings required to control the RSH-600 six crystal sensor head.

Number of Crystals - 6 Shutter Relay Type - None Control - Direct Drive - Sngl Step Feedback Type - Indiv Rotator Delay - 30 With the above parameter settings, the MDC-260 will create six position

feedback inputs called “SensorN CrystalX” where X ranges from 1 to 6 and one control output called SensorN Drive Up.

The inputs should be connected to the six position feedback pins on the RSH-600 sensor head. Pin #1 of connector J1 on the sensor head should be connected to the “SensorN Crystal1” input on the MDC-260. Pin #2 on the sensor head should be connected to “SensorN Crystal2” on the MDC260 and so on. Pin #7 on the sensor head should be connected to pin #12 or any of the return pins when using the standard MDC-260 I/O board. When using the MDC-260 Active I/O board then pin #7 of the sensor head should be connected to one side of a 115VAC source. The other side of the 115VAC source should be connected to the other side of the six position feedback inputs on the MDC-260.

One pin from the SensorN Drive Up output should be connected to the 115 VAC voltage source and the other to J1. The remaining pin on J1 should connect to the other side of the 115 VAC power supply. In this configuration, combined with the “single step” drive type, whenever the MDC-260 needs to change crystals it will close the SensorN Drive Up output for one second. This completes the circuit applying the 115 VAC to the RSH-600.

4.2.4 INPUT, OUTPUT AND ACTION SETUP

The MDC-260’s inputs, outputs and actions can be used to provide control for, or an interface to all sorts of vacuum system peripherals such as PLC system controllers, substrate heaters, planetary rotators, etc. If your system doesn’t require any special interfacing or control then you can skip to the next section.

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The following are a few examples of some typical uses for the MDC-260’s programmable I/O’s and actions.

Optical Monitor Termination - To setup the MDC-260 to terminate the

deposit on a signal from an optical monitor, the first step is to program an input that will be connected to an output in the optical monitor. Go to the Program Inputs screen and select a blank input. Name the input “Optical Monitor” for future identification. Note the I/O card and the pin numbers of the input so you can later connect the input to the optical monitor.

Next, go to the Program Actions screen and select any action labeled “No Action”. Press the right arrow key with the cursor on the action Name parameter and select the TerminateDeposit action. Move the cursor to the Conditions field and press the 0 key to add a condition. Move the cursor down to the Input condition type, press the right arrow key, move the cursor onto the “Optical Monitor” input and press enter. Press enter again to complete the condition string.

Now, the MDC-260 will terminate the deposit whenever the “Optical Monitor” input is set true by the optical monitor.

Substrate Heat Control - To create an output in the MDC-260 to switch on

and off a substrate heat controller, first go to the Program Outputs screen and select a blank output. Name the output “Substrate Heat” for future identification. Note the I/O card number and the pin numbers of the output so you can later connect the output to the substrate heater controller.

Next, move the cursor onto the Conditions field and press the 0 key to add a condition. With the cursor on the State condition type, press the right arrow key and select the state in which you would like the heater to first turn on. If you would like the heater on during more than the one state, then press the 5 key to add an or “|” symbol then press 0 to add the next desired state. Repeat this process until all of the states requiring substrate heat have been added to the condition. For example, if you would like substrate heat to start in the Predeposit Hold state and continue through the Deposit 1 state then your condition string would look like this “Predeposit Hold|Deposit 1”.

With the condition string completed, the MDC-260 will set this output true whenever it is in one of the selected states.

4.2.5 DISPLAY SETUP

The only parameter in the Display Setup menu that affects the controller’s function is the Pause On Layer Complete parameter. This parameter determines whether or not the controller will pause at the completion of each layer. When set to Yes, the controller will stop at the end of each layer and wait for a Start key press before continuing. When set to No, the controller will immediately go to the next layer.

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4.2.6 MATERIAL SETUP

The next step in the initial setup of the controller is to define the materials that you wish to deposit. Because of its many features, the MDC-260 has a long list of material parameters which at first can be overwhelming. Fortunately, the default settings of most parameters are such that the feature they define is disabled when left at the default. This section will list the material parameters typically set for all materials and the parameters which must be set to utilize the different features of the MDC-260. For a detailed description of any material parameter, go to Section 4.3.2.1.

The following is a list of the material parameters that are typically set when defining a new material:

Process Name - If you select a material from the default material library (press the

right arrow key from the material name parameter and press enter on the desired material) then the density and acoustic impedance for that material will be entered automatically. If your material is not in the library then you must enter the name, density and acoustic impedance.

Source output and pocket number - Defines the source and pocket number of the

source that the material will be deposited from.

Control loop parameters (Proportional Gain, Integral Time, Derivative Time).

The default settings for these parameters are a good starting point. Deposit Rate #1 - Defines the target deposit rate for the material. Maximum Power - Defines the maximum deposit power for the material. The above parameters are typically all that are needed to deposit the most basic

materials. If no other features are required then the remaining parameters can be neglected. The following is a list of the more specialized features defined by the material parameters. All of the features are disabled by default.

4.2.6.1 POWER RAMPS

Power ramps are used for source material conditioning prior to and after the deposit states. A power ramp is defined by a ramp time, a “ramp-to” power level and a hold time before the next state. There are two power ramps available prior to and one after the deposit states. The first ramp prior to deposit is the Soak and the second is the Predeposit. If only one ramp is needed prior to deposit then you should use the predeposit ramp. The power ramp after the deposit states is called the Feed.

The parameters used to define the three power ramps are as follows: Soak Power Ramp - Rise to Soak Time, Soak Power and Soak Time Predeposit Power Ramp - Rise to Predeposit Time, Predeposit Power and

Predeposit Time Feed Power Ramp - Ramp to Feed Time, Feed Power and Feed Time

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4.2.6.2 AUTOMATIC CRYSTAL SWITCHING

To enable automatic crystal switching upon failure, set the Backup Sensor, Backup Crystal, and its Tooling Factor parameters to define which Sensor/Crystal to switch to.

4.2.6.3 RATE ESTABLISH

The rate establish feature is used in critical processes where it is important to establish the correct deposition rate prior to opening the source shutter and depositing on the substrates.

NOTE: To use this feature, the sensor head must be mounted in such a way that it is in the material vapor stream with the source shutter either opened or closed.

To enable this feature you must set the Rate Estab. Time to a positive value, then set the Rate Estab. Error parameter. The Rate Establish Time parameter sets the maximum time that the controller will attempt to keep the rate error within the Rate Estab. Error limit for a period of five seconds. If the rate error condition is meet within the allotted time then the controller will enter the deposit state. If not, then the process will be halted and a Rate Establish Error will be displayed.

4.2.6.4 RATE RAMPS

Rate ramping is typically used at the beginning of the deposition to ease the rate up slowly to prevent material spitting. Rate ramping is also used towards the end of the deposition to achieve a more accurate endpoint thickness. By slowing down the rate, the thickness overshoot caused by the delay of the shutter closing is diminished

The MDC-260 has two rate ramps available. A rate ramp is defined by a “Ramp Start” and “Ramp Stop” thickness (expressed as % of total deposit) and the target rate. For example, to setup the MDC-260 to deposit at 20Å/sec for 90% of the layer, then ramp down to 5 Å/sec over the last 10%, you would enter the following material parameters:

Deposit Rate #1 = 20Å/sec Ramp #1 Start Thk = 90% Ramp #1 Stop Thk = 100% Deposit Rate #2 = 5Å/sec

The rate ramps are disabled by default with the Ramp Start and Ramp Stop Thicknesses set to 100% since 100% represents the end of deposition for the layer. The applicable parameters will become available for editing when the start/stop thicknesses are changed from 100%.

4.2.6.5 RATE SAMPLE MODE

The Rate Sample feature is designed for large deposition thicknesses where crystal life is a problem. By sampling the rate periodically to maintain rate control, then closing the sensor shutter with the rate and power level constant, a large deposition thickness can be achieved with one crystal.

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To enable the rate sample feature, set the Sample Dwell % parameter to the percentage of time you wish the controller to sample the rate. Then set the Sample Period parameter to adjust how often the rate is sampled. For example, a Sample Period of 0:01:00 (one minute) and a Sample Dwell of 50% will sample the rate for 30 seconds then close the sensor shutter for 30 seconds (assuming it is depositing at the last measured rate). This cycle will repeat every one minute.

4.2.6.6 RATE DEVIATION ACTIONS

The MDC-260 provides three actions that can take place when rate deviation reaches various levels of severity. Each action may be assigned to a rate deviation amount (%). The assignable actions include an attention sound, an alarm sound and a process abort. The attention and alarm sounds are momentarily triggered meaning they will sound when the error is exceeded and clear when within the limit. The process will abort when the “Rate Deviation Abort” level is exceeded, or when the power is at the maximum or minimum power level.

4.2.7 PROCESS SETUP

The final step in the initial setup of the controller is to define the processes that you wish to run. To define a process you should complete the following steps:

1. Select a blank process from the Select Process Screen. Please note that you

can also copy and modify a similar process to save time.

2. Enter a process name in the Define Process Screen.

3. Move the cursor onto the layer thickness parameter and enter the desired

thickness for the layer.

4. Select a material for the layer by moving the cursor onto the material column,

pressing the right arrow key, moving the cursor onto the desired material for

the layer and pressing the Enter key. Repeat steps 3&4 until the process layers are complete.

4.2.8 STARTING A NEW PROCESS

To start a new process, the controller must be in the Process Ready State (You can see the current state of the controller at the top-right corner of any Graph or Status screen). To switch to the Process Ready State, press Abort then Reset. From the Process Ready State, press the Start key, move the cursor onto the desired process and press Start again to start the process. To start a process from a layer other layer #1, press the left arrow key to move the cursor onto the Starting Layer parameter, enter the desired layer number, move back to the desired process and press Start again. Please note that you can also change the process Run Number (provided for your documentation purposes) from the Start Process screen.

4.2.9 RESUMING A PROCESS FROM ABORT OR HALT

To resume an aborted process, first press the start key. A message will appear asking you to press the start key again to resume the process. The process will resume from the layer where the process was aborted starting in either the Rise to

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Soak or Rise to Predeposit power states. Once in deposit, the thickness will continue from the last value prior to the abort.

4.3 DETAILED PROGRAMMING

This section covers all of the MDC-260 programming in detail.

4.3.1 VIEW/EDIT PROCESS

Selecting View/Edit Process from the Main Menu will present the Select Process screen to delete, copy, view or edit any one of up to 10 processes.

To select a process for viewing and editing, move the cursor onto the desired process using the Up-arrow and Down-arrow keys, then press the Enter key.

Select Process: 01 Cr---------- 02 Au 03 04 05 1 - Copy 06 0 - Delete 07

- View/Edit 08 ↓

Figure 4-2 Select Process Screen

4.3.1.1 DEFINE A PROCESS

View or Run Password

Process Name Layer# Thickness Material

Sample------ 001 0.500 Cr

View/Run 0000 002 1.350 Au Edit 0000 003 0.000 End Layer 004 0.000 End Layer 005 0.000 End Layer 006 0.000 End Layer 007 0.000 End La

Edit Password

Figure 4-3 Define Process Screen

Selecting a process will bring up the Define Process screen as shown in Figure 4-3. In this screen you enter all of the parameters that define a process. A process consists of a twelve-character name, two levels of passwords and finally a sequence of layers that makeup the process. Each layer consists of a material and the desired thickness for the layer. A process can have from 1 to 250 layers as long as the total number of layers in all the processes is not greater than 250. The following list describes all of the process parameters:

Process Name (twelve character alphanumeric field)

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Each process is referenced by a twelve-character alphanumeric process name. You enter a process name using the alphanumeric keypad as described in Section

4.1.2. Please note that the active process name is displayed in the upper left-hand corner of all the status screens.

Edit Password (four character alphanumeric field) The Edit process password allows you to lock out other users from editing a

process unless the correct password is known. To set this password, highlight the Edit password field, type in your password then press the Enter key. A message will pop up asking for verification to change the password. Press “1” to confirm and “0” to cancel the change. Each time you want to edit this process, you will be asked to enter the correct password. Once a password has been entered, this parameter will not be displayed until the password has been entered again.

The default for this parameter is '0000'.

NOTE: Please note that once the password has been changed, the process cannot be modified unless the correct password is entered so you must remember your passwords!

View/Run Password (four character alphanumeric field) The View/Run process password allows you to lock out other users from viewing

and/or running a process unless the correct password is known. To set this password, highlight the Edit password field, type in your password then press the Enter key. A message will pop up asking for verification to change the password. Press “1” to confirm and “0” to cancel the change. Each time you want to view or run this process, you will be asked to enter this password. Please note that the view function of this password is ignored if the Edit Password is not set. Once a password has been entered, this parameter will not be displayed until the password has been entered again.

The default for this parameter is '0000'.

NOTE: Please note that once the password has been changed, the process cannot be modified unless the correct password is entered so you must remember your passwords!

Layer (001 to 250) This column shows the layer number in the process. Please note that with the

cursors on a layer number you can copy or delete this layer. Thickness (000.0 to 999.9) This parameter defines the desired thickness for the layer. The default for this

parameter is 0.000 KÅ. Material This parameter defines the material for this layer. The layer material is s elected

from the list of materials defined in View/Edit Material. Therefore, you should define all of the necessary materials for the process before defining the process. See EDIT MATERIAL PASSWORD section 4.3.2.

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To select a material, move the cursors to the material parameter for that layer and press the Right-arrow key. The Select Layer Material screen will be displayed as shown below. Scroll to the desired material and press Enter.

The layer material defaults to 'End Layer' meaning this layer marks the end of the process.

Select Layer Material 01 Cr--------- 02 Au 03 04 05 06 07 to select material 08

Figure 4-4 Select Layer Material Screen

4.3.2 VIEW/EDIT MATERIAL

From the Main Menu, selecting View/Edit Material will present the Select Material screen shown below.

Select Material 01 Cr--------- 02 Au 03 04 05 1 - Copy 06 0 - Delete 07

- View/Edit 08

Figure 4-5 Select Material Screen

4.3.2.1 DEFINE A MATERIAL

Selecting a material for viewing and/or editing will present the screen which permits the material to be defined, shows the first page of this screen. In this screen, you define all of the material parameters for the selected material. The material parameters are described in detail below.

Material Name: Cr---------- Press > Sensor 1 Crystal 01 Source 1 Pocket 01 Density 07.20 gm/cm^3 Acoustic Impedance 28.95 gm/cm^2/sec

Tooling Factor 100 % ↓

Figure 4-6 Define Material Screen

PROGRAMMING AND CONTROLLER SETUP 4-16

MDC-260 DEPOSITION CONTROLLER

1. Material Name (A ten character material name) The material name parameter allows you to either use the keypad to type in a

name, or pick a name from the materials already stored in the material library. To pick a material from the material library, highlight the material parameter and

press the Right-arrow key. This will display a complete list of materials that are stored in the MDC-260. To pick a material, highlight that material and press Enter key. Once a material is chosen, the stored values for the density and acoustic impedance for that material are automatically entered into their respective parameters.

2. Sensor# (1 to 2) This parameter defines the sensor input that will be used for this material. Choose

between 1 and 2. The default setting is 1.

3. Crystal# (1 to 16) This parameter defines the primary crystal used to monitor this material. This

parameter cannot be greater than the Number of Crystals parameter in the Sensor Setup screen. The default setting is 1.

4. Source# (1 to 2) This parameter defines the source output number that will be used for this

material. Choose between 1 and 2. The default setting is 1.

5. Pocket# (1 to 16) This parameter defines the pocket number that contains this material. This

parameter cannot be greater than the Number of Pockets parameter in the Source Setup screen. The default setting is 1.

6. Density (0.80 to 99.99 gm/cm3) This parameter provides the material density so that the controller can calculate

and display the physical film thickness. If the film density is known it should be used. A list of the more commonly used film densities is presented in Table 10-1. As a first approximation, bulk material density can be used in programming. Empirical calibration of this parameter is described in Section 10.5.1.

7. Acoustic Impedance (0.50 to 59.99 gm/cm

/sec)

This parameter is the acoustic impedance of the material. The acoustic impedance of the deposited film is required by the MDC-260 in order to accurately establish the sensor scale factor when the sensor crystal is heavily loaded. If the acoustic impedance of the film material is known, it can be entered directly in units of 105 gm/cm2 sec. In most cases the acoustic impedance of the bulk material can be used and can be obtained from The Handbook of Physics or other source of acoustic data. The shear wave impedance should be used. The shear wave acoustic impedance can be calculated from the shear modulus or the shear wave velocity and the density by using the following equation:

PROGRAMMING AND CONTROLLER SETUP

4-17

MDC-260 DEPOSITION CONTROLLER

GCAI ⋅=⋅=

ρρ

Where: AI= Acoustic Impedance

ρ= Density (gm/cm

)

C= Transverse (shear) wave velocity (cm/sec) G= Shear Modulus (dynes/cm2).

A list of the acoustic impedance and density of the more commonly deposited materials is presented in Table 10-1 and a technique for empirically determining this parameter is presented in Section 10.5.3.

In many cases and particularly if the sensor crystal is not heavily loaded, sufficient accuracy can be achieved by using the acoustic impedance of quartz which is 8.83 X 105 gm/cm2 sec.

8. Tooling Factor (10.0 to 499.9%) This parameter is the tooling factor for the average rate and thickness

measurements. Typically this parameter is left at the default setting of 100% because each sensor has a tooling factor that is used to compensate for geometric factors in the deposition system which result in a difference between the deposition rate on the substrates and the rate on the sensing crystal. However, this parameter might be used to compensate for any changes in the system that affects all sensor heads equally. To a first approximation the tooling factor can be calculated using the following equation:

⎛

Tooling

⎞

⎜ ⎝

100%

⋅

⎟ ⎠

where:

dc = Distance from source to crystal. ds = Distance from source to substrate.

The equation above assumes that the angle from normal between the source and sensor and the source and substrate is zero. To account for the angle of the crystal and the substrate, use the following equation:

Tooling

⎛

⎞

⎜

⎟

⎝

⎠

⎛

⋅⋅

100%

⎜

⎜ ⎝

cos cos

⎞

⎟

⎠

where:

dc= Distance from source to crystal. ds = Distance from source to substrate.

PROGRAMMING AND CONTROLLER SETUP 4-18

MDC-260 DEPOSITION CONTROLLER

c = The angle of the crystal off of normal from the source.

s = The angle of the substrate off of normal from the source. This equation assumes the crystal face is perpendicular to the source. Empirical calibration of the tooling factor is described in Section 10.5.2.

9. Proportional Gain (0 to 9999) This parameter is the proportional gain factor for the source power control loop.

Control loop tuning is covered in Section 6.

10. Integral Time constant (0 to 99.9 sec) This parameter is the system time constant. Control loop tuning is covered in

Section 6.

11. Derivative Time constant (0 to 99.9 sec) This parameter is the system dead time. Control loop tuning is covered in Section

12. Rise To Soak Time (0 to 9:59:59) This parameter sets the time interval for the source power to ramp up from zero to

the power level set in Soak Power parameter. It should be long enough for the material to have time to reach equilibrium temperature without spitting, or in the case of evaporation sources, protected from unnecessary thermal shock.

13. Soak Power (0.0-99.9%) This parameter defines the source power level during the Soak state. The Soak

Power should be established at a level which will assure that the source material is properly outgassed and prepared for subsequent deposition.

14. Soak Time (0 to 9:59:59) The Soak Time parameter defines the time duration of the Soak state. It is used in

conjunction with the Soak Power to allow the material to fully outgas.

15. Rise To Predeposit (0 to 9:59:59) This parameter sets the time interval for the source power to ramp from Soak

Power level to the Predeposit Power.

16. Predeposit Power (0.0 to 99.9%) This parameter defines the source power level during the Predeposit state. This

should be set as close as possible to the power level required to reach the desired deposition rate. The Manual mode can be used to conveniently determine the Soak and Predeposit power levels of a particular material.

17. Predeposit Time (0 to 9:59:59) This parameter defines the time duration of the Predeposit state. The Predeposit

Time should be established at a value which allows the source material to be brought to the deposit temperature level and stabilized in an orderly manner. Since evaporation will normally occur at the Predeposit power level, too long a

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MDC-260 DEPOSITION CONTROLLER

Predeposit Time will result in unnecessary buildup of material on the shutter and unnecessary material loss.

18. Rate Establish Time (0 to 99 seconds) This parameter defines the time limit of the rate establish state. The Rate

Establish state occurs before the deposit state and is used to establish the correct source power before the source shutter is opened. In the rate establish state the crystal shutter is opened, the source shutter is closed, and the controller is controlling source power to achieve the programmed rate within the Rate Establish Error % for a period of 5 seconds. Once the rate has been held within limit for 5 seconds, the controller will go into the deposit state. If the rate error cannot be held within the allowed percentage error for 5 seconds, then the controller will display a Rate Establish Error and the process will be halted.

For the Rate Establish function to work, the sensor must be located somewhere in the vapor stream of the source while the source shutter is closed. The default setting for this parameter is 0, which disables this function.

19. Rate Establish Error % (0 to 99%) This parameter sets a maximum limit for the rate establish error, which must not

be exceeded for a five-second period during the rate establish state, in order for the controller to enter the deposit state.

20. Deposit Rate (#1, #2, #3) (0.0 to 999.9 Å/sec) Deposition Rate #1 defines the first deposition rate. Deposition Rates #2 and #3 define the target rate that will follow the prior rate

ramp. This rate will continue until either the end of the layer or the beginning of the next rate ramp. These parameters will not be displayed the rate ramps leading up to them are not used (set to 100%).

21. Ramp (#1, #2) Start Thk (0 to 100%) These parameters set the layer thickness percentage that will trigger the start of

the respective rate ramp. The MDC-260 supports two rate ramps. The corresponding “Ramp Stop Thk” parameter sets the layer thickness percentage for the end of the rate ramp. Finally, the next Deposit Rate parameter sets the target deposition rate that the rate ramp will work towards.

Setting any “Ramp Start Thk” parameter to 100% disables that rate ramp.

Note: The ramp parameters can also be used as thickness setpoints for triggering I/O events without actually using the ramping feature. For

example, if you wanted to trigger an event after 10% of the layer, your could:

• Set Ramp #1 Start Thk to 10%

• Set Ramp #1 Stop Thk to 10%

• Set the Deposit Rate #2 equal to Deposit Rate #1.

Then you would use the Deposit #2 State condition in the output's or action's condition string that you wanted to trigger.

22. Ramp (#1, #2) Stop Thk (0 to 100%)

PROGRAMMING AND CONTROLLER SETUP 4-20

MDC-260 DEPOSITION CONTROLLER

These parameters define the layer thickness percentage that will trigger the end of the respective rate ramp. These parameters will not be displayed if their corresponding “Rate Start Thk” parameters are not used (set to 100%).

23. Time Setpoint (0 to 9:59:59) This parameter defines the time from the start of the layer until the time setpoint

event is triggered.

24. Ramp To Feed Time (0 to 9:59:59) This parameter defines the time allowed for the source power to go from the last

deposition power to the Feed Power. The default for this parameter is zero.

25. Feed Power (00.0 to 99.9%) The Feed Power parameter defines the source power level during the feed state.

26. Feed Time (0 to 9:59:59) The Feed Time parameter sets the feed time. This parameter can also be used as a

delay between the Deposit State and the idle state. The default for this parameter is zero which disables the feed function.

27. Ramp To Idle Time (0 to 9:59:59) This parameter defines the time allowed for the source power to go from the last

deposition power or feed power to the Idle Power. The default for this parameter is zero.

28. Idle Power (00.0 to 99.9%) This parameter defines the source power after the feed or deposit states until the

next Soak or abort state. If the idle power is greater than zero then the next layer using this source and pocket will start from the Predeposit state. If any subsequent layer uses the same source but a different pocket, the idle power will be automatically set to zero.

29. Maximum Power (00.0 to 99.9%) The maximum power parameter sets the maximum allowable source power for

this material. The deposition power will not be allowed to exceed this value.

30. Power Alarm Delay (0 to 99) This parameter sets the time required for the deposit power to be at Maximum or

Minimum power before the alarm will be triggered.

31. Minimum Power (00.0 to 99.9%) This parameter sets the minimum power level for the minimum power warnings.

If the power is at or below this level during a deposit a Minimum Power attention warning will be given. If this condition remains true for longer than the time set by the Power Alarm Delay parameter then a Minimum Power Alert warning will be given.

32. Rate Dev. Attention (00.0 to 99.9%)

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MDC-260 DEPOSITION CONTROLLER

The rate deviation attention parameter sets the allowable percent deviation from the deposition rate. If the deposition rate deviates by more than this percentage during the deposition, than a rate deviation attention message will be displayed in the LCD display. The default setting of 00.0% disables this function.

33. Rate Dev. Alarm (00.0 to 99.9%) This parameter sets the percent deviation from the deposition rate required to

trigger a rate deviation alarm. The default setting of 00.0% disables this function.

34. Rate Dev. Abort (00.0 to 99.9%) The rate deviation abort parameter sets the allowable percent deviation from the

deposition rate. If the deposition rate deviates by more than this percentage and the deposit power is at the maximum or minimum power alert level then the process will be aborted. The default setting of 00.0% disables this function.

35. Sample Dwell % (000.0 to 100.0) The Sample Dwell% parameter establishes the percentage of the Sample Time for

which the crystal is being sampled. Rate sampling is used for high deposition thickness where crystal life is a problem. By sampling the rate periodically and setting the power level to establish rate control, then closing the crystal shutter and maintaining the power level, a large deposition thickness can be achieved with one crystal. The primary sensor must have an individual shutter for the rate sample feature. The default for this parameter is 100% which enables sampling at all times.

36. Sample Period (0 to 9:59:59) The Sample Period parameter defines the sample period. For example, a sample

time of 5 minutes and a dwell of 40% will result in the crystal being sampled for 2 minutes, then the crystal shutter is automatically closed for the remaining 3 minutes while the deposition power is kept constant. Please note, once the crystal shutter has opened, there is a 5-second delay for crystal stabilization before measuring. This parameter will not be displayed if the Sample Dwell % parameter is set to 100%.

37. Crystal Fail (Halt, TimePwr, Switch) This parameter defines the controller’s action in the event of a crystal failure. The

options are to halt the process, finish the current layer on time-power, or switch to a backup crystal. Use the Enter key to cycle between the options.

38. Backup Sensor # (1 to 2) This parameter is available when the Crystal Fail parameter (37, above) is set to

Switch. This parameter defines the backup sensor input for the backup crystal. For a dual-crystal sensor head, this parameter should be set to “2” assuming Sensor #1 is the primary crystal. However, for multiple-crystal sensor heads, this parameter would be the same value as the Sensor # parameter (2, above) and the Backup Crystal # parameter (39, below) would be set to “2”. This is because a multiple-crystal sensor head uses one sensor input to measure any of its crystals while a dual-crystal sensor head uses two sensor inputs to measure either crystal.

PROGRAMMING AND CONTROLLER SETUP 4-22

MDC-260 DEPOSITION CONTROLLER

39. Backup Crystal # (1 to 16) This parameter is available when the Crystal Fail parameter (37 above) is set to

Switch. This parameter defines the backup crystal number. Note that for a dualcrystal sensor head, this parameter should be set to 1. For a multiple-crystal sensor head, set it to 2.

40. Backup Tooling Factor (10.0% to 499.9%) This parameter defines the tooling factor for the backup sensor head. Note that

for a multiple-crystal sensor head, this parameter should be set to the same value as the [primary] Tooling Factor parameter (8, above).

41. Material Password (4 digit string) This parameter defines the edit password for the material. If the password is set

to anything other than 0000 it will not be displayed, and when you attempt to edit the material you will first be asked to enter the correct password.

PROGRAMMING AND CONTROLLER SETUP

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MDC-260 DEPOSITION CONTROLLER

4.3.3 SYSTEM SETUP

Choosing the Edit System Setup option from the Main Menu screen will present the System Setup Menu options as shown in Figure 4-7. These options allow for setting up the controller to interface with the vacuum system and are described below.

System Setup Edit Display Setup Program Inputs Program Outputs Program Actions Edit Sensor Setup Edit Source Setup Edit DAC Setup Edit Utility Setup

Figure 4-7 System Setup Menu Screen

4.3.3.1 EDIT DISPLAY SETUP

Selecting Edit Display Setup will present the Display Setup screen.

Display Setup Pause On Layer Complete Yes Display Negatives Enabled Thickness Graph Scale 3-digit Sensor Status Thickness Time Display Estimated Layer Rate Graph Disabled

Power Gra

h Enabled ↓

Figure 4-8 Display Setup Screen

1. Pause On Layer Complete (Yes or No) This parameter determines whether the controller will pause between layers. If

this parameter is set to Yes then the controller will stop after completing a layer and wait for a Start key press from the operator. If this parameter is set to No then the controller will automatically increment to the next layer.

2. Display Negatives (Enabled or Disabled) This parameter defines whether the MDC-260 will display negative rates and

thickness or not. If set to disable, the MDC-260 will hold negative values at zero. The default for this parameter is Disabled.

3. Thickness Graph Scale (2-digit, 3-digit) This parameter defines whether the rightmost 2 or 3 digits of thickness will be

graphed effectively setting the graph range at either 100 or 1000Å.

4. Sensor Status (Thickness, Frequency)

PROGRAMMING AND CONTROLLER SETUP 4-24

MDC-260 DEPOSITION CONTROLLER

This parameter determines the value displayed in the Sensor Status screen. The available options are sensor Thickness or Frequency. Note that, while in the Source-Sensor Status Screen, Figure 5-8, pressing the “7” key will toggle the sensor display between Thickness and Frequency.

5. Time Display (Estimated State, Layer or Elapsed Process, Layer or State time) This parameter sets the displayed value in the Time display on the front panel.

The choices are estimated state or layer time, or the elapsed process, layer or state time.

6. Rate Graph (Enabled, Disabled) This parameter defines whether the rate verses time graph is enabled as one of the

status screens.

7. Power Graph (Enabled, Disabled) This parameter defines whether the power verses time graph is enabled as one of

the status screens.

8. Thickness Graph (Enabled, Disabled) This parameter defines whether the thickness verses time graph is enabled as one

of the status screens.

9. Rate Dev. Graph (Enabled, Disabled) This parameter defines whether the rate deviation verses time graph is enabled as

one of the status screens.

10. Run Screen (Enabled, Disabled) This parameter defines whether the Run-Screen is enabled as one of the status

screens.

11. Source/Sensor Status (Enabled, Disabled) This parameter defines whether the source/sensor status screen is enabled as one

of the status screens.

12. I/O Status (Enabled, Disabled) This parameter defines whether the I/O status screen is enabled as one of the

status screens.

13. Parameter Screen (Enabled, Disabled) This parameter defines whether the Parameter screen is enabled as one of the

status screens.

14. Color Scheme (Scheme#1 – #4) This parameter allows the user to toggle between four pre-defined color schemes. Note: If all status screens are disabled, the Run-Screen will be displayed when

the Status key is pressed. If all graph screens are disabled, Rate Vs. Time Graph will be displayed when the Graph key is pressed.

PROGRAMMING AND CONTROLLER SETUP

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MDC-260 DEPOSITION CONTROLLER

4.3.3.2 PROGRAM INPUTS

The controller has ‘logical’ discrete inputs which are used when running a process, and ‘physical’ discrete inputs at the rear-panel connector pins which can be associated arbitrarily by the user with the logical inputs using the Edit Program Inputs function. By itself a user-defined input has no effect, it can only be useful when its logical state is used as a condition for an internal action, or an external action represented by the state of a discrete output.

The controller provides 8 logical inputs. The 8 logical inputs can be associated with up to 8 physical inputs.

A logical input (1 to 8) can be given a 16-digit name, and can be associated with a physical input by identifying the connector pin number (30 to 37, each of which also has a separate pin for the signal return which is displayed to the right of the Pin#). The input’s true level can also be defined for each input. An input defined as High true will be true when the input’s voltage is at or above the high level for the particular I/O card installed.

The inputs on the MDC-260 can be configured as either Active or Passive inputs. See Section 8.3.9.1 for instruction. The Passive inputs are pulled up to 5 volts internally through a 4.7 K OHM resister and are set true, assuming the input’s True level is set to Low, by shorting the input pins together. The Active inputs are 12 to 120 volt AC/DC inputs. The Active inputs are set true, assuming the input’s true level is set to High, by supplying 12 to 120 volt AC or DC across the input pins.

In the Program Inputs Menu (Main Menu, Edit System Setup, Program Inputs), you will see all of the logical inputs defined. Use the Up-arrow and Down-arrow keys to select a logical input. The Left-arrow and Right-arrow keys select the Input Name, True level and Pin# edit fields. A 16-digit name can be assigned to the logical input. Pressing the Enter key on the True level column will toggle between High or Low true. Any entry less than 30 or greater than 37 will be ignored for the Pin#.

The logical discrete inputs have two categories. One category contains logical inputs that are named and assigned by the user, the other category contains logical inputs that are automatically defined by the controller, such as those required for source and sensor position feedback, and these cannot be changed by the user.

When the controller defines inputs, it selects the blank names remaining in the logical input list and assigns them in sequence to the internally generated functions. For this reason, it is important that unused inputs are left blank, and that there are sufficient inputs for all required functions.

Inputs that are internally defined are discussed further in the source/sensor setup sections. Table 8-2 lists the input pin numbers.

PROGRAMMING AND CONTROLLER SETUP 4-26

MDC-260 DEPOSITION CONTROLLER

Input Name True Card Pin-Ret 01 External Start--- Low 1 30 12 02 Deposit pressure High 1 31 13 03 Over Pressure Low 1 32 14 04 Optical Monitor Low 1 33 15 05 Low 1 34 16 06 Low 1 35 17 07 Low 1 36 18

↓

Figure 4-9 Program Input Screen

4.3.3.3 PROGRAM OUTPUTS

The controller has ‘logical’ discrete outputs which are used when running a process, and ‘physical’ discrete outputs which can be associated arbitrarily by the user with the logical outputs using the Program Outputs function. Each physical discrete output is in the form of a pair of relay contacts assigned to dedicated pins on a controller back-panel connector, and these contacts will close when a the logical discrete output associated with the physical output satisfies a set of conditions defined by the user which are evaluated every 100 ms.

The controller provides 8 logical outputs. The 8 logical outputs can be associated with up to 8 physical outputs. Additionally, the controller has a relay output which is dedicated to the Abort function.

In the Program Outputs Menu (Main Menu, Edit System Setup, Program Outputs), you will see all of the logical outputs defined. Use the Up-arrow and Down-arrow keys to select a logical output. Press Enter or the Right-arrow to edit the name and conditions of that output.

A logical output (1 to 8) can be given a 16-digit name, and can be associated with a physical output by identifying connector pin number (2 to 9, paired with 21 to 28, respectively, for the relay contacts).

The logical discrete outputs have two categories. One category contains logical outputs that are named and assigned by the user, the other category contains logical outputs that are automatically defined by the controller, such as those required for source and sensor rotator controls, and these cannot be changed by the user. These internally defined outputs are indicated by a condition string labeled “Internally Defined”

When the controller defines outputs, it selects the blank names remaining in the logical output list and assigns them in sequence to the internally generated functions. For this reason, it is important that unused outputs are left blank, and that there are sufficient outputs for all required functions. Outputs that are internally defined are discussed further in the source/sensor setup sections.

Table 8-2 lists the output pin numbers. Two screens are required to program the Discrete outputs. The first screen

provides for selecting the output to be programmed, while the second screen provides for the actual programming, including the output name.

PROGRAMMING AND CONTROLLER SETUP

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MDC-260 DEPOSITION CONTROLLER

0=Add condition,

Selecting Program Outputs from the System Setup menu will present the Select Output screen.

Select Output 01 End of Process 02 Wire feed Al 03 Layer Complete 04 Procs Complete 05 06 07

- View

Edit 08 ↓

Figure 4-10 Select Output Screen

Selecting an output with the Right-arrow or Enter key will present the screen which permits definition of the output, as shown below.

The Left-arrow, Right-arrow, Up-arrow and Down-arrow keys provide access to the Output Name, card#, pin# and Condition string edit fields. A 16-digit name can be assigned to the logical input. Any entry other than 1 or 2 will be ignored for the card#, as will a pin# less than 2 or greater than 9.

Pin#-Return Output Name Wire Feed Al------- 2 21 Conditions Al & FeedHold

Valid operators: 1=!, 2=(

to save

Figure 4-11 Program Output Screen

The output condition string is a logical statement that determines the state of the output. The output relay is closed when the condition string is evaluated as true. Otherwise, the relay is open. Each output condition string is evaluated ten times per second (every 100 milliseconds).

4.3.3.3.1 ENTERING A CONDITION STRING

A condition string comprises one or more individual conditions linked together by the logical operators ! NOT, & AND, | OR and parentheses ( ). Conditions are chosen from a list. To enter a condition string correctly you must follow these rules:

There must be an equal number of closed and open parentheses.

PROGRAMMING AND CONTROLLER SETUP 4-28

All conditions must be separated by either the & or the | operator. Condition strings cannot end in an operator. To enter a condition string, first highlight the condition string field. The second

line from the bottom of the screen displays the valid operators and parentheses.

MDC-260 DEPOSITION CONTROLLER

The screen symbols will change depending on the contents of the condition string to the left of the blinking cursor. To select a symbol, press the corresponding key number. In the example displayed, the bottom line tells you that you press the “0” key to select a condition or, the Enter key to finish and validate the string. A blank condition string is evaluated as false.

While entering the condition string, pressing the “0” key will present a screen which has a list of condition types at the left side. For the chosen type, the righthand side of the screen displays a list of sub-conditions or a number entry field.

Example: If you move the marker of the left column onto the State condition type, a list of

all the possible states will appear in the right column. See Figure 4-12. To select one of the states, press the right arrow key to move the marker to the right column. You then move onto the desired state and press enter. This will return you to the previous screen and add the selected state to the condition string. You can return to the left column without selecting a state by pressing the Left-arrow key.

Condition State---- Process Ready Type Event Start Layer Input Change Pocket Output Change Crystal Process Layer Ready Material Soak Rise Source Soak Hold Pocket Prede

osit Rise ↓

Figure 4-12 Output Conditions Selection Screen

Example: If you move the marker of the left column onto the Layer condition type, a

number field will appear in the right column. To select layer #5, press the Rightarrow key to highlight the number on the right column. You then type the number 5 and press Enter.

Condition Process Type: Material Source Pocket Softnode Sensor Crystal Layer Number: 005

Figure 4-13 Output Conditions Selection - Sub menu

4.3.3.3.2 CONDITION TYPES

PROGRAMMING AND CONTROLLER SETUP

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MDC-260 DEPOSITION CONTROLLER

States - State conditions are evaluated true whenever the controller is in the respective state. Controller States are:

• Process Ready

• Start Layer

• Change Pocket

• Change Crystal

• Layer Ready

• Soak Rise

• Soak Hold

• Predeposit Rise

• Predeposit Hold

• Establish Rate

• Deposit 1

• Rate Ramp 1

• Deposit 2

• Rate Ramp 2

• Deposit 3

• Ramp To Feed

• Feed

• Ramp To Idle

• Layer Complete

• Process Complete

• Process Resume

Events - Event conditions are evaluated true whenever the respective event is true. Controller Events are:

• Abort

• Halt

• Hold

• Time Power

• Ready

• In Process

• Simulate

PROGRAMMING AND CONTROLLER SETUP 4-30

MDC-260 DEPOSITION CONTROLLER

• Time Setpoint

• Last Layer

• Crystal Failure

• Crystal Marginal

• Min Rate&Max Pwr

• Max Rate&Min Pwr

• Rate Dev. Alarm

• Rate Est. Error

• Source Fault

• Sensor Fault

• Rate Dev. Alert

• Max. Power Alert

• Min Power Alert

• Rate Dev. Atten.

• Max Power Atten.

• Min Power Atten.

Inputs - Input conditions are represented by the user defined programmable inputs. A condition is either true or false depending on the state of the input. Input conditions are used to indicate the state of something external to the MDC-

260. For example, you may want to program the MDC-260 to wait for a certain pressure before starting a deposit. In this case you would create an input called something like "At Pressure" and you would connect this input to a pressure setpoint output of a vacuum gage. Next, you would create a Hold In State action that would cause the MDC-260 to hold in a state prior to deposit until the "At Pressure" input goes true.

Outputs - Output conditions are represented by the user defined programmable outputs. A condition is either true or false depending on the state of the output's total condition string.

Process - The process condition is evaluated true whenever the selected process is the current process.

Material - The material condition is evaluated true whenever the selected material is the current material.

Source (1-2) - The source condition is evaluated true whenever the current source equals the specified source.

Pocket (1-16) - The pocket condition is evaluated true whenever the current pocket equals the specified pocket.

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MDC-260 DEPOSITION CONTROLLER

Soft Node (1-8) - Each Soft node defaults to false but can be set to true by a "Set Soft Node" Action. Soft nodes allow the user to link many action condition strings together to trigger another action or output.

Sensor (1-2) - The sensor condition is evaluated true whenever the current sensor equals the specified sensor.

Crystal (1-16) - The crystal condition is evaluated true whenever the current crystal equals the specified crystal.

Layer (1-250) - The layer condition is evaluated true whenever the current layer# equals the specified layer#.

Timer < (1-65,534 seconds) - The MDC-260 has eight internal counters that can be used as conditions to trigger outputs or actions. The timer condition is evaluated true whenever the timer's value is less than the value entered in the timer condition. A timer can be reset to zero using a Start Timer Action. Once reset, a timer will count up to its maximum value and stay there until it is reset again. Timers are typically used to trigger an output for a set amount of time after a certain event or state has occurred. For example, if you wanted to turn on an ion gun for the first 3 minutes of deposition, you would first create an output called "Ion Gun Power" with the condition "!Timer1<1&Timer1<181". This condition says that this output will be true whenever Timer1 is greater than 1 and less than 181 seconds. The next step is to create an action to reset the timer in the state before deposit. Select the "Start Timer #1" action and enter the conditions "Predeposit Hold". The MDC-260 will continually reset timer #1 (set to zero) while it is in the Predeposit Hold state then one second after it enters the deposit state, the "Ion Gun Power" output will go true for 180 seconds or three minutes.

4.3.3.4 PROGRAM ACTIONS

The MDC-260 provides for 8 internal user programmable actions. Internal actions are used to provide special functions at the true evaluation of a condition string. These functions may be such things as terminating a deposit on an input from an optical monitor. Or, sounding an alarm when certain events are true.

To program an action, first select the desired action from the list of eight programmable actions displayed in the Actions screen.

Select Action 01 Hold In State----- 02 Step From State 03 Sound Attention 04 Sound Alert 05 Sound Alarm 06 No Action 07 No Action

- View

Edit 08 No Action ↓

Figure 4-14 Action Selection Screen

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MDC-260 DEPOSITION CONTROLLER

Once you have selected the required action, pressing the Right-arrow key will present the screen which permits programming of the action details, and this procedure is similar to the one used for programming discrete outputs.

Action Name Hold In State----- Conditions

Press > to select action

Figure 4-15 Program Action Screen

In this screen you select the predefined action you would like to take and the associated conditions. To specify an action, move the markers onto the action name field and press the Right-arrow key. This will present the Select Defined Action screen.

Select Defined Action: 01 No Action------ 02 Manual Power 03 Zero Thickness 04 Reset Controller 05 Abort Process 06 Halt Process 07 TerminateDeposit to select action 08 Hold In State

↓

Figure 4-16 Select Defined Action Screen

In this screen you can select a predefined action from the list by moving the cursors onto the desired action and pressing Enter. The following is a list of the predefined actions:

No Action - No action is taken. This is the default setting. Manual - Functionally identical to pressing Manual key. Zero - Functionally identical to pressing Zero key. Reset - Functionally identical to pressing Reset key. Abort - Functionally identical to pressing Abort key. Halt - Halts the process, sets active source power to idle, and leaves all other

source powers unchanged. Terminate Deposit - Triggers the final thickness for the deposit state. Action is

ignored if state is not a deposit state. Hold In State - Holds controller in current state.

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MDC-260 DEPOSITION CONTROLLER

Step From State - Steps controller to next state. Sound Attention - Triggers the attention sound and displays the "Attention

Action" message in the State/Trouble field in the LCD display. Sound Alert - Triggers the Alert sound and displays the "Alert Action" message

in the State/Trouble field in the LCD display. Sound Alarm - Triggers the Alarm sound and displays the message "Alarm

Action" in the State/Trouble field of the LCD display. Start Process - Trigger the start of the currently selected process. This action is

ignored unless the controller is in the Process Ready state. Select Process 1-8 - Select process #1-8 as the next process to be started by the

Start Process action described above. Switch Crystals - Toggles between the primary and the backup sensor/crystal

combination defined by the active material. The first sensor/crystal will be switched if more than one sensor/crystal combinations are enabled for measurement.

Once the action is selected then you need to establish when the action should take place by defining its condition string. This is covered in the earlier section called Entering a Condition String.

Start Timer 1-8 – Resets the corresponding timer to zero and initiates counting. The timers are used to trigger other actions and/or outputs some time after the triggering event or for a set amount of time. This is a momentary action meaning it only triggers once when evaluated as true. The Start Timer’s condition string must be evaluated as false then true to trigger again.

Set Soft Nodes 1-8 – Sets a corresponding soft node. Soft nodes are used in conditions strings to trigger actions or outputs.

Once an action is selected then you need to establish when the action should take place by defining its condition string. This is covered in the earlier section called Entering a Condition String.

4.3.3.5 EDIT SENSOR SETUP

Selecting Edit Sensor Setup will present the Sensor Setup screen shown in Figure 4-17. In this screen you define the sensor parameters that the controller needs to interface to the various types of sensors. Once the sensor setup is complete, the controller will create the necessary inputs and outputs needed to interface to the defined sensors. To define a sensor, first select the sensor number by using the Up-arrow and Down-arrow keys to highlight the desired sensor number. Once selected, the sensor is configured by selecting the appropriate parameters from the right half of the display. Depending on the sensor configuration, some of the unnecessary parameters will be hidden:

PROGRAMMING AND CONTROLLER SETUP 4-34

MDC-260 DEPOSITION CONTROLLER

Sensor Setup Number of Crystals 06 Sensor #1 Shutter Relay Type N.O. Sensor #2 Control Direct Drive Up Feedback Type No Feedback Rotator Delay(sec) 00

Figure 4-17 Sensor Setup Screen

1. Number of crystals (1 to 16) This parameter defines the number of crystals available for that sensor input. For

a single sensor head this would be set to one. For a dual sensor head with separate oscillators and sensor connections, this would still be set to one because there is only one crystal for each sensor input. For a multiple rotary type sensor head, this parameter would be set to the number of crystals that the sensor will hold.

2. Shutter Relay type (N.O., N.C., None, Dual) This parameter defines the shutter relay type used to control the sensor shutter.

The following four relay types are available:

N.O. - Relay is normally open and closes to close shutter. For this type, a “SensorN Shutter” output will be created to interface to the shutter actuator.

N.C. - Relay is normally closed and opens to close shutter. For this type, a “SensorN Shutter” output will be created to interface to the shutter actuator.

None - No sensor shutter output is created. Dual - Select this type for a dual sensor head. For this type, a “Dual Snsr1&2

Shtr” output will be created to interface to the shutter actuator.

3. Control (Manual, Direct, BCD, Indiv) This parameter defines the type of crystal position control utilized. Manual, as it implies, means not under control of the MDC-260. Under manual

control, the MDC-260 will stop the process upon the completion of the current layer when the next layer requires a different crystal position. A message prompting the operator with the number of the crystal required is displayed in the LCD window. Once the crystal has been changed, the process is resumed by pressing the Start key.

BCD and Indiv are used when control is through an external crystal rotation controller which accepts Binary Coded Decimal inputs or Individual switch closures to select the crystal. The controller creates the number of outputs required to interface with the external controller and set the outputs as required to signal a crystal selection. Note that the BCD value is offset by one to the crystal number. For example, BCD value of 0 selects crystal 1. BCD value of 1 selects crystal 2, and so on.

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MDC-260 DEPOSITION CONTROLLER

Direct is used when the actuating device is driven directly. In this case the controller creates one or two outputs, one for each available direction, to drive a motor or solenoid.

4. Drive (Up, Down, Fast, Inline, Sngl Step, Dbl Step) This parameter defines the drive method or direction for Direct control and only

has an effect when Control type is set to Direct. For that reason this parameter will be hidden when the Control type is set to anything other than Direct. The different drive settings are described below.

Up, Down, Fast and Inline - These four settings are typically used with multi-

crystal heads that use a motor to rotate the crystals into position. With Up selected, the controller will create one output called "SensorN Drive Up". The MDC-260 will activate this output to increment the sensor head up to the next position. The down selection works the same except the output is called "SensorN Drive Dn". With Fast selected, the controller will create both an up and a down output. The 260 will then determine the fastest direction to the target crystal position by activating the appropriate output. The Inline drive type informs the controller that continuous travel in one direction is not possible. Therefore to get from position 6 to 1, the direction must be down through 5, 4, etc. until 1 is reached.

SnglStep and Dbl Step - Both the SnglStep and Dbl Step settings are typically

used with multi-crystal sensor heads that are actuated by pulsing a pneumatic valve. The MDC-260 will create a "SensorX Drive Up" which is either singly or doubly pulsed to sequentially step the sensor head to the next position.

5. Feedback Type (Individual, BCD, Single Home, In Position, No Feedback) This parameter defines the type of feedback for a multiple sensor head. The three

feedback types available are as follows:

Individual - Individual position feedback. This feedback type uses one input for each crystal position in the sensor head. All inputs are normally false (open circuit) unless that crystal is in position then that input is true (closed to ground). For example, a six crystal sensor head would use six inputs. If crystal two was in position then all the inputs would be false except the input connected to feedback position number two.

BCD - Binary Coded Decimal position feedback. This feedback type uses binary coding to indicate which crystal is in position. Inputs are numbered most significant bit first. For example, an eight crystal sensor head would use three inputs. With crystal one in position, all inputs would be false. With crystal four in position, inputs one and two would be true and input three would be false.

Crystal number 1 OPEN OPEN OPEN 2 OPEN OPEN GND

Input BCD2

Input BCD1

Input BCD0

PROGRAMMING AND CONTROLLER SETUP 4-36

MDC-260 DEPOSITION CONTROLLER

3 OPEN GND OPEN 4 OPEN GND GND 5 GND OPEN OPEN 6 GND OPEN GND 7 GND GND OPEN

8 GND GND GND

Table 4-1 Table of Input States for BCD Feedback Type

SNGL HOME - Single home position feedback. This feedback type uses one input. The input is normally false (open circuit) and should go true (closed to ground) when crystal one is in position.

IN POSITION - In position feedback. This feedback type uses one input. The input is normally false (open circuit) and should go true (closed to ground) when the desired crystal is in position.

NO FEEDBACK - No crystal position feedback is used.

6. Rotator Delay (0 to 99 seconds) This parameter serves two different functions. If the feedback type is “None”

(Not recommended. See cautions in the Installation section.), this parameter tells the controller how long to wait assuming the crystal is in position. If position feedback is provided, this parameter tells the controller how long it should wait for the crystal to reach its target position before it issues a Sensor Fault message.

4.3.3.6 EDIT SOURCE SETUP

Selecting Edit Source Setup will present the Source Setup screen as shown in Figure 4-18. In this screen you first select the source setup you wish to edit. To select a source, use the Up-arrow and Down-arrow keys, then press the Rightarrow or Enter key to select.

Source Setup Number of Pockets 04 Shutter Relay Type N.O. Source #1 Shutter Delay (sec) 0.0 Source #2 Control Direct Drive Up Feedback Type Individual Pocket Delay (sec) 10 Source Volta

e 10V

Figure 4-18 Source Setup Screen

Once selected, the source is configured with the following parameters located on the right side of the display. Depending on the configuration, some of the unnecessary parameters will be hidden:

1. Number of Pockets (1 to 16)

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MDC-260 DEPOSITION CONTROLLER

This parameter defines the number of pockets, or crucibles, available for the source. The default value is 1 for a single pocket source.

2. Shutter Relay type (N.O., N.C., None) This parameter defines the shutter relay type used to control the source shutter.

The following three relay types are available:

N.O. - Relay is normally open and closes to close shutter. For this type, a “SourceN Shutter” output will be created to interface to the shutter actuator.

N.C. - Relay is normally closed and opens to close shutter. For this type, a “SourceN Shutter” output will be created to interface to the shutter actuator.

None - No sensor shutter output is created.

3. Shutter Delay (sec) (0.0 to 9.9 seconds) This parameter should be set to the time it takes for the source shutter to

open/close. At the start of the deposition, the controller will delay adjusting the power for this amount of time to allow the shutter to completely open. At the end of deposition, the controller will begin closing the source shutter this much time before the target endpoint thickness is reached so the final thickness should be very close to the target.

4. Control (Manual, Direct, BCD, Indv) This parameter defines the type of pocket control utilized. Manual, as it implies, means not under control of the MDC-260. Under manual

control, the MDC-260 will stop the process upon the completion of the current layer when the next layer requires a different pocket. A message prompting the operator with the material required is displayed in the LCD window. Once the pocket has been changed, the process is resumed by pressing the Start key.

BCD and Indv are used when control is through an external pocket rotation controller which accepts Binary Coded Decimal inputs or Individual switch closures to select the pocket. The controller creates the number of outputs required to interface with the external controller and sets the outputs as required to signal a pocket change.

Direct is used when the actuating device is driven directly. In this case the controller sets up one or two outputs, one for each available direction, to drive a motor or solenoid.

5. Drive (Up, Down, Fast, Inline, Sngl Step, Dbl Step) When the Control type is Direct, this parameter defines the drive method or

direction. For Sngl Step and Dbl Step drive types, the controller sets up one output which is either singly or doubly pulsed to actuate a solenoid to sequentially step the rotator to the desired position. For Up and Down drive types, the controller sets up one output to control a drive motor which is turned on until the rotator reaches the desired position. For Fast and Inline drive types, the controller sets up a drive up and a drive down output. For the Fast drive type, the controller determines the fastest direction to the target pocket position and turns on the

PROGRAMMING AND CONTROLLER SETUP 4-38

MDC-260 DEPOSITION CONTROLLER

appropriate output. The Inline drive type informs the controller that continuous travel in one direction is not possible. Therefore to get from position 6 to 1, the direction must be down through 5, 4, etc. until 1 is reached.

The controller creates one or more of the following outputs depending on the type:

Drive Up Drive Down Step

6. Feedback Type (Individual, BCD, Single Home, In Position, No Feedback) This parameter defines the type of feedback for a multiple pocket source. The

three feedback types available are as follows:

Individual - Individual position feedback. This feedback type uses one input for each pocket position in the source. All inputs are normally false (open circuit) unless the respective pocket is in position then that input is true (closed to ground). For example, a six-pocket source would use six inputs. If pocket two was in position then all the inputs would be false except the input connected to feedback position number two.

BCD - Binary Coded Decimal position feedback. This feedback type uses binary coding to indicate the pocket position. Inputs are numbered most significant bit first. For example, an eight-pocket source would use three inputs. With pocket one in position, all inputs would be false. With pocket four in position, inputs one and two would be true and input three would be false.

Pocket Number 1 OPEN OPEN OPEN 2 OPEN OPEN GND 3 OPEN GND OPEN 4 OPEN GND GND 5 GND OPEN OPEN 6 GND OPEN GND 7 GND GND OPEN

8 GND GND GND

Input BCD2

Input BCD1

Input BCD0

Table 4-2 Table of Input States for BCD Feedback Type

SNGL HOME - Single home position feedback. This feedback type uses one input. The input is normally false (open circuit) and should go true (closed to ground) when pocket one is in position.

IN POSITION - In position feedback. This feedback type uses one input. The input is normally false (open circuit) and should go true (closed to ground) when the desired pocket is in position.

NO FEEDBACK - No pocket position feedback is used.

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MDC-260 DEPOSITION CONTROLLER

7. Rotator Delay (0 to 99 seconds) This parameter serves two different functions. If the feedback type is “None”

(Not recommended. See cautions in the Installation section) this parameter tells the controller how long to wait, on the assumption the pocket will get into position. If position feedback is provided, this parameter tells the controller how long it should wait for the pocket to reach its target position before it issues a Source Fault message.

8. Source Voltage (2.5V, 5.0V, 10V) This parameter sets the upper limit of the voltage range for the source control

output. The lower limit of the voltage range is always 0. For example, selecting 10V for this parameter sets the source control voltage range from 0 to 10 volts.

4.3.3.7 EDIT UTILITY SETUP

Selecting the Edit Utility Setup from the Edit System Setup menu will present the Utility Setup screen. Figure 4-19 shows the first page of this screen. All parameters are described below.

Utility Setup Crystal Frequency 6.0 MHz Simulate mode On Interface address 01 (1-32) Attention Volume 01 (0-10) Alert Volume 01 (0-10) Alarm Volume 01 (0-10)

Figure 4-19 Utility Setup screen

1. Crystal Freq. (2.5, 3.0, 5.0, 6.0, 9.0, 10.0 MHz)

This parameter determines the uncoated crystal frequency type for all sensor inputs. The default setting is 6.0 MHz.

2. Simulate Mode (On, Off) This parameter enables or disables the Simulate mode of the controller. The

Simulate mode is used for process testing and differs from the Normal mode only to the extent that the Thickness and Rate displays are derived from a simulated sensor input rather that the actual sensor. While in this mode, the simulated thickness build- up is directly proportional to the displayed power level and independent of actual thickness on the sensor. The Simulate mode allows the total deposit process to be simulated. It also allows the tooling factor, density and acoustic impedance calculations to be conveniently checked and altered at the end of the run, if necessary.

3. USB Interface Address. (1-32)

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MDC-260 DEPOSITION CONTROLLER

This parameter sets the controller’s computer interface address for the USB interface. This number will be transmitted as a part of all messages sent to and from the MDC-260 from a host computer.

4. Attention Volume (0-10) This parameter sets the volume of audio attention sound. Attention sounds

indicate that the controller is waiting for an operator response or action before continuing the process. A setting of zero disables audio attention sound.

5. Alert Volume (0-10) This parameter sets the volume of audio alert sound. Alert sounds indicate that a

material alert level has been exceeded. A setting of zero disables audio alert sounds.

6. Alarm Volume (0-10) This parameter sets the volume of audio alarm sound. Alarm sounds indicate that

a material alarm level has been exceeded. A setting of zero disables audio alarm sounds.

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MDC-260 DEPOSITION CONTROLLER

5. OPERATING THE MDC-260

5.1 SIGN-ON SCREEN

Upon a power-up, a series of tests are performed on the hardware, all of the LED’s are illuminated, and a Sign-on screen is displayed on the LCD. The user will be asked to press a key to continue.

INFICON MDC-260 Software Ver x.x Deposition Controller Serial Number xxxx

System Check... OK

INFICON

Press an

Figure 5-1 Sign-on Screen

y key to continue.

After pressing a key, the controller will be put into Abort mode. At this point, only the red LED behind the Abort key will now be illuminated. The LCD screen will return the screen that was being displayed when power was last removed.

Pressing the Reset key will put the controller into the Reset (Ready) state in preparation for a process run.

5.2 STARTING A NEW PROCESS

Pressing the Start key while the controller is in the Reset (Ready) state will present the screen shown below. A run number is provided to help correlate process information with a specific process run. The run number can range from 1 to 9999, and is automatically incremented before each new process. At 10,000 the run number will roll over to 1.

Start Process 01 Sample----- 02 Starting Layer: 001 03 Run Number : 0001 04 05 06 Press Start to start 07 or Reset to cancel. 08

Figure 5-2 Run Process Selection Screen

From this screen you can change the starting layer number or manually assign a run number, if required. When ready, place the cursor on the desired process name, which then becomes the ‘current’ process. To start the process, just press the Start key again. The controller will then scan the total process definition and

OPERATING THE MDC-260

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MDC-260 DEPOSITION CONTROLLER

the condition of the system, and if everything appears to be in order, will start the process.

If at this point an error message is presented by the LCD screen, it is likely that there is a problem somewhere with either the system configuration and/or the value of a system parameter which will prevent the process from running correctly. Use the details of the error message as an indication of the corrective action that should be taken. Refer to Section 5.9 for detail explanations of the errors messages. Press the Abort key to abort the process start, then the Reset key, and then make the necessary changes.

5.3 STARTING A NEW LAYER

The Start key is also used to start individual layers when the controller is set up for manual layer sequencing. The controller will prompt the operator to press the Start key to start the next layer.

5.4 RESUMING AN ABORTED OR HALTED PROCESS

The Start key is also used to resume an aborted or halted process. Pressing the Start key while the controller is in abort or halt mode will bring up the following prompt. Note that the green LED behind the Start key is illuminated, indicating that the process can be resumed. Otherwise, the controller has to be reset, and the process has to be started over.

Follow the prompt to resume the process.

5.5 GRAPH DISPLAYS

There are four different run time graph screens that can be displayed at any time by pressing the Graph key (providing they have each been enabled in the Edit Display Setup menu). The first key press will bring up the last viewed graph screen, repeatedly pressing the Graph key will cycle through the four graph screens, shown below.

Displays the current process name.

Press Start to resume process

or Reset to cancel.

Displays the current material name.

Sample Cr Process Ready 10 Rate

0 1

Displays Graph’s Name

Displays the controller status.

Figure 5-3 Rate vs. Time Graph

OPERATING THE MDC-260 5-2

MDC-260 DEPOSITION CONTROLLER

Sample Cr Process Ready 5 Rate Dev%

Figure 5-4 Rate Deviation vs. Time Graph

Sample Cr Process Ready 999 Thickness

0 1

Figure 5-5 Thickness vs. Time Graph

Sample Cr Process Ready 10 Power%

0 1

Figure 5-6 Power vs. Time Graph

5.6 STATUS DISPLAYS

There are five run-time status screens that can be displayed by pressing the Status key (providing they have each been enabled in the Edit Display Setup menu). However, only four screens are available at a time, depending on the controller’s status. The first key press will bring up the last viewed status screen, repeatedly pressing the Status key will cycle through four of the five status screens, shown below.

OPERATING THE MDC-260

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MDC-260 DEPOSITION CONTROLLER

5.6.1 MAIN RUN SCREEN

Figure 5-7 Main Run Screen

The Main Run Screen provides an easy-to-see display of the most critical information.

• The Rate field refers to the rate measured by the active sensor.

• The Power field refers to the power of the active source.

• The Thickness field refers to the cumulative Thickness, as measured by

the current sensor

• The Layer field refers to the layer number within the active process.

• The Crystal Health field refers to the health of the active sensor.

• The Time-to-Go field refers to the estimated time remaining or the elapsed

time of the current state, layer, or process. Note that the number 7 key can be used to toggle between the time modes.

5.6.2 SOURCE-SENSOR STATUS SCREEN

Sample Ag Process Ready Source Pocket Power 1* 01 00.0% 2 -- 00.0%

Sensor Crystal Health Rate Thickness 1* 01 99% 00.0 0.000 2 -- 00% 00.0 0.000

Figure 5-8 Source-Sensor Status Screen

The Source/Sensor Status screen displays the status of the two sensors and sources including the crystal or pocket position, source power, crystal health, each sensor's deposition rate and thickness or frequency. You select either sensor thickness or frequency in the Edit Display Setup Menu by setting the Sensor Status parameter. Active sources and the active sensors are indicated with a “*” next to the number. A failed sensor/crystal is indicated by “--” in the Health field.

OPERATING THE MDC-260 5-4

MDC-260 DEPOSITION CONTROLLER

5.6.3 I/O STATUS SCREEN

Sample Cr Process Ready Input State Output State

01 Source1 BCD 0 F Source1 BCD 0 F

02 Source1 BCD 1 T Source1 BCD 1 T 03 F Source1 Shutter F 04 F F 05 F F 06 F F

Figure 5-9 I/O Status Screen

The I/O Status screen indicates the state of all the MDC-260's inputs and outputs. Please note that you can use the arrow keys to scroll up and down the I/O listing.

5.6.4 ACTIVE LAYER PARAMETER UPDATE SCREEN

Sample Cr Predeposit Hold Active Layer Parameter Update Sensor 1 Soak Pwr 25.0 Crystal 01 Predep. Pwr 32.0 Thickness 1.500 Max Pwr 55.0 Rate #1 010.0 Prop. Gain 1000 Rate #2 000.0 Int. Time 99.9 Rate

3 000.0 Deriv. Time 00.0

Figure 5-10 Active Layer Parameter Update Screen

The Active Layer Parameter Update screen displays a set of parameters of the current active layer as shown in Figure 5-10. It allows the user to quickly change these values, if needed, to fine-tune the run, without having to go into the Edit Material Definition screen. To change a value, use the arrow keys to move the cursor to highlight it, punch in the new value and press Enter. Note that values changed in this screen will be written back to the material definition. Note that this screen is only available during a process.

5.6.5 POSITION CONTROL SCREEN

Sample Cr Process Ready Position Control

Command Actual Health Source 1 Pocket: CM 01 N/A Source 2 Pocket: -- N/A Sensor 1 Crystal: -- 99% Sensor 2 Cr

stal: -- 00%

Figure 5-11 Position Control Screen

OPERATING THE MDC-260

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MDC-260 DEPOSITION CONTROLLER

The Position Control Screen is only available when the controller is in idle (not in process or abort state). It allows the user to easily switch to a desired pocket or crystal in order to replace the material or crystal. To command a new pocket position, highlight the command field of the corresponding source. Punch in the desired pocket number. Once the desired pocket position is reached, it will be displayed in the Actual [position] field, if feedback is provided. Likewise, to command a new crystal position, highlight the command field of the corresponding sensor. Punch in the desired crystal number. Once the desired crystal position is reached, it will be displayed in the Actual [position] field, if feedback is provided. The Crystal Health of that crystal will also be displayed in the Health field.

5.7 MODES

Modes are conditions that the controller can occupy. Some modes are indicated by the LED’s behind the operating keys. Other modes are displayed in the top right hand corner of the status display (Refer to Figure 5-3). These controller modes are described below.

5.7.1 PROCESS READY

The Process Ready Mode indicates the MDC-260 has been reset and is awaiting a Start key press. The yellow LED behind the Reset key, when illuminated, indicates that the controller is in Process Ready Mode.

5.7.2 ABORT

The Abort mode is indicated by a red LED behind the Abort key as well as the flashing of all of the numeric LED displays. In Abort Mode all displays and operating keys, with the exception of the Start and Reset keys, are inoperative. All source control outputs are forced to zero, the Abort relay is closed and all discrete outputs are forced to open circuit. In addition, if the controller initiated the abort then the condition which caused the abort will be displayed in the top right hand corner of the LCD display. Exit from Abort Mode requires either a Reset or Start key press. See also Section 5.4 for resuming an aborted process. Refer to Table 5-1 for conditions that can cause an abort.

5.7.3 HALT (SOFT ABORT)

In Halt all I/O is frozen. If power is above Soak level, it is ramped down to Soak at the Predeposit ramp rate. If Power is at or below the Soak level it is held constant. The user has the option to resume from Halt or press Reset and start over. See also Section 5.4 for resuming a halted process. Refer to Table 5-1 for conditions that can cause the process to halt.

5.7.4 IN PROCESS

The green LED behind the Start key indicates the controller is in the In-Process Mode.

OPERATING THE MDC-260 5-6

MDC-260 DEPOSITION CONTROLLER

5.7.5 NOT SAMPLING

This mode indicates that the sensor crystal is shuttered from the source and that the deposition rate is established using the last power level. Sampling mode is set by two material parameters, Sample Dwell % and Sample Period. Refer to Section 4.3.2.1 # 35 and # 36 for a description of Sample Mode.

5.7.6 PROCESS COMPLETE

This mode indicates that the selected process has run to completion. A Process Complete message is displayed in the top right hand corner of the status display. In addition, an attention warning will sound. The controller remains in this mode until a reset signal puts it into the Process Ready mode.

5.7.7 MANUAL

This mode is indicated by the red LED behind the Manual key. In this mode the control voltage output is controlled through the Remote Power Handset. For a detailed description of this mode, refer to Section 3.6.

5.7.8 SIMULATE

This mode simulates rate and thickness build-up by simulating the sensor input rather than the actual sensor. Refer to Section 3.5 for more information on the Simulate Mode.

5.8 STATES

Figure 5-12 shows the different states that make up a complete deposition cycle, such as Rise to Soak, Rise to Predeposit, etc. The controller moves from state to state as the deposition progresses.

5.9 TROUBLE, ERROR AND WARNING MESSAGES

“Troubles” are controller conditions which in most case are indicative of problems or errors, but may be just warnings. These messages are displayed in the top right hand corner of the status screen (See Figure 5-3). When trouble messages are displayed, the status banner at the top of the screen turns red.

In addition, there are three levels of audible warnings associated with the trouble conditions, Attention, Alert and Alarm. * Sound will clear when the condition clears.

Table 5-1 lists the messages and warning levels. The list is arranged in descending order of priority. In the event that more than one warning level is triggered, the higher level has priority. An asterisk (*) in the Clear column indicates the warning sound will clear when the condition clears. Any key press will also clear the sound. The action column indicates if any action is taken by the controller as a result of the trouble.

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MDC-260 DEPOSITION CONTROLLER

Warning

Messages Type Clear Action

Min Rate&Max Power Alarm Abort Max Rate&Min Power Alarm Abort System Setup memory corrupted Alarm Halt Process memory corrupted Alarm Halt Material memory corrupted Alarm Halt Rate Est. Error Alarm Halt Crystal Failure Alarm/Attn NO/* Halt Source Fault Alarm Halt Sensor Fault Alarm Halt No Snsrs Enabled Alarm Halt Time Power Alarm Time/Power Rate Dev. Alarm Alarm * Alarm Action Alarm

Crystal Marginal Alert/Attn NO/* Rate Dev. Alert Alert * Max power Alert Alert * Min power Alert Alert * Alert Action Alert *

Xtal Fail Switch Attention Crystal Switch Xtal Mrgn Switch Attention Crystal Switch Rate Dev. Atten Attention * Max power Attention * Min power Attention * Change source # X to (material name)

Attention Hold and press Start to continue. Change sensor # X to crystal # X

Attention Hold and press Start to continue. Attention Action Attention * Press Start to resume process. N/A Start to continue. Attention * Hold

* Sound will clear when the condition clears. Table 5-1 Trouble Conditions and Warnings

5.9.1 DESCRIPTION

The messages in the above table are described below.

5.9.1.1 MIN RATE&MAX POWER

This message indicates that the output power is at the maximum power level set by the Maximum Power parameter and the rate deviation is below the limit value set in the Rate Dev. Alarm parameter. When this happens, the controller will go into the Abort mode and the Alarm will sound.

OPERATING THE MDC-260 5-8

MDC-260 DEPOSITION CONTROLLER

5.9.1.2 MAX RATE&MIN POWER

This message indicates that the output power is at the minimum power level set by the Minimum Power parameter, and the rate deviation is above the limit value set by the Rate Dev. Abort parameter. When this happens, the controller will go in Abort mode and the Alarm warning will sound.

5.9.1.3 SYSTEM SETUP MEMORY CORRUPTED

The integrity of the System Setup Memory has changed since the last time a system parameter was modified. Each one of the sub menus and its parameters has to be checked and corrected as necessary to fix this problem.

5.9.1.4 PROCESS MEMORY CORRUPTED

The integrity of the selected process has been changed since last time the process was modified. Each one of the process parameters has to be checked and corrected as necessary to fix this problem.

5.9.1.5 MATERIAL MEMORY CORRUPTED

The integrity of the selected material has been changed since last time the material was modified. Each one of the material parameters has to be checked and corrected as necessary to fix this problem.

5.9.1.6 RATE EST. ERROR

The controller is unable to establish the programmed rate within the time specified in the Rate Establish Time parameter. The rate is considered established when it stays within the Rate Establish Error % for 5 seconds.

5.9.1.7 CRYSTAL FAILURE

This condition indicates lack of a valid signal from the sensor, and generally results from a failed crystal but may also indicate problems in the crystal mounting or the interconnection between the sensor and the controller. If the primary crystal fails and the process is not in deposit state, the Attention warning will sound. If the backup crystal fails and the process is not in the deposit state, the alarm will sound and the process will be halted.

5.9.1.8 SOURCE FAULT

This condition indicates that the correct source pocket position feedback has not been achieved within the time set by the Rotator Delay parameter (Source Setup Menu).

5.9.1.9 SENSOR FAULT

This condition indicates that the correct crystal position feedback has not been achieved within the time set by the Rotator Delay parameter (Sensor Setup Menu).

OPERATING THE MDC-260

5-9

MDC-260 DEPOSITION CONTROLLER

5.9.1.10 NO SENSORS ENABLED

This condition indicates that no sensors were enabled for measurement of this material.

5.9.1.11 TIME POWER

This message is displayed when the controller is completing the current layer based on the last power and rate. This occurs in the event of a crystal failure without a backup.

5.9.1.12 RATE DEV. ALARM

The deposition rate error is greater than the rate deviation value set in the Rate Deviation Alarm parameter.

5.9.1.13 ALARM ACTION

This message indicates the Alarm sound was initiated by an internal action.

5.9.1.14 CRYSTAL MARGINAL

The sensor crystal in use is poor in quality. If the crystal is the backup one, the Alert warning will sound when the process is in deposit state. If the primary crystal is in poor quality then the Attention will sound.

5.9.1.15 RATE DEV. ALERT

The deposition rate deviation is greater than the value set in the Rate Deviation Alert parameter.

5.9.1.16 MAX POWER ALERT

Indicates that the power output level has been at the Maximum Power level longer than the time period set in the Power Alert Delay parameter.

5.9.1.17 MIN POWER ALERT

Indicates that the power output level has been at or below the Minimum Power level longer than the time period set in the Power Alert Delay parameter.

5.9.1.18 ALERT ACTION

This message indicates the Alert sound was initiated by an internal action.

5.9.1.19 XTAL FAIL SWITCH

This message indicates the primary crystal has failed and the sensor input has been switched to the backup crystal. In addition, the Attention warning sounds. Press any key to clear the sound.

OPERATING THE MDC-260 5-10

MDC-260 DEPOSITION CONTROLLER

5.9.1.20 XTAL MRGN SWITCH

This message indicates the primary crystal is marginal and the sensor input has been switched to the backup crystal. In addition, the Attention warning sounds. Press any key to clear the sound.

5.9.1.21 RATE DEV. ATTEN

The deposition rate deviation error is greater than the value set in the Rate Deviation Attention parameter.

5.9.1.22 MAXIMUM POWER

The output power is being limited by the value set in the Maximum Power parameter.

5.9.1.23 MINIMUM POWER

The output power is at or below the minimum power set by the Minimum Power parameter.

5.9.1.24 CHANGE POCKET...

Prompts the operator to switch the source pocket to the correct position. The process will be on hold until the Start key is pressed. There is no message if the Control parameter is set to Auto (Source Setup Menu).

5.9.1.25 CHANGE CRYSTAL...

Prompts the operator to switch the sensor to the correct crystal position. The process will be on hold until the Start key is pressed. There is no message if the Control parameter is set to Auto (Sensor Setup Menu).

5.9.1.26 ATTENTION ACTION

This message indicates the Alert sound was initiated by an internal action.

5.9.1.27 PRESS START TO RESUME PROCESS

This message comes up when the controller is aborted during a process. After the abort condition is removed, the operator may press the Start key to resume the process. To cancel from resuming the process, press Reset key.

OPERATING THE MDC-260

5-11

MDC-260 DEPOSITION CONTROLLER

Figure 5-12 Typical Process Profile

OPERATING THE MDC-260 5-12

MDC-260 DEPOSITION CONTROLLER

6. TUNING THE MDC-260 CONTROL LOOP

6.1 CONTROL LOOP BASICS

If evaporation rate were a function of source power alone, a rate controller would not be necessary. One would establish the power required achieving the desired rate, set the power at that point and that would be that. In control system parlance, this is called “Open Loop” control.

Unfortunately, evaporation rate is a function of many variables. With E-gun sources, rate is affected by material level, water-cooling temperature, beam position, sweep pattern, etc. With filaments and boats, rate is affected by material level, boat or filament condition, power line voltage, power losses in cables, connections, transformers, switches, etc. Even when sputtering under the conditions of constant power and constant pressure, rate is affected by target condition.

So, if we want to achieve a known and constant rate, we need a rate controller. The rate controller compares the measured rate with the desired rate and attempts to keep them equal by adjusting the command signal to the power supply. This is called “Closed Loop” or feedback control.

The most common example of feedback control is a car and driver. The car is the “Plant”. It is controlled by pedal pressure and steering wheel angle. Its output is direction and speed. The driver is the “Controller”. The driver monitors the direction and speed and adjusts pedal pressure and steering wheel angle to achieve the direction and speed he/she desires. If we hold the controls steady and close our eyes, no feedback, then our control is open loop. If the road is very straight and there is no wind, “no disturbances to the plant”, we can sometimes stay on the road for a pretty good distance. If the road is rolling or we have a good crosswind, the time we can stay on the road in open loop control can be pretty short indeed.

If the controller is slow and sluggish, i.e. a drunk driver, the difference between the desired speed and direction can be very different from the speed and direction desired. The driver can be all over the road, speeding up, slowing down, etc.

If the controller’s gain is too high, typical of a young person’s first driving experience, the response to an error is both slow and too great and the car careens from one side of the road to the other. This control “System” would normally go completely unstable and crash if control were not assumed by a different controller.

In the case of a young driver with a little more experience under his/her belt, the response speed has improved but the gain is still a little high. The vehicle stays pretty well in control but there is a lot of steering wheel action. We say this controller is “oversteering”.

When we go from one vehicle to another, especially if the vehicles are very different in size or weight, we find that we must really concentrate on our driving at first. That is because we are learning the characteristics of the “Plant”. As

TUNING THE MDC-260 CONTROL LOOP

6-1

MDC-260 DEPOSITION CONTROLLER

soon as we’ve learned them, we know what we have to do to correct for errors and we are back in good control. In other words the controller must compensate for the characteristics or the “Plant”.

6.2 CONTROL LOOPS APPLIED TO VACUUM DEPOSITION

In the deposition control loop the vacuum system and evaporation supply make up the plant. The output, deposition rate, is controlled by the source control voltage which establishes the source power. If all plants were the same we could predefine the characteristics of the controller for optimum control. Unfortunately, plants vary widely, in their gain, linearity, response, noise and drift.

The question we are going to address here is how the controller adjusts the source control voltage, the “command signal”. The MDC utilizes a type 1-control loop. A type 1 control loop does not require a continuous error to achieve a non-zero control voltage.

Many controllers utilize a type 0 control loop. In this type of loop the source control voltage output is determined by multiplying the rate error by the Proportional gain. For any given non-zero output the error required to achieve, the necessary output is inversely proportional the to gain. High gain, low error, low gain, high error. This would seem to call for high gain. Unfortunately, the higher the gain results in higher chance of instability. We may go unstable before we get the error down to where we want it.

In the MDC, the proportional gain parameter sets the rate at which the control voltage changes in response to an error signal. Any error in the rate causes the source control voltage to ramp to a new value. When the source control voltage increases or decreases to the correct value, the value required to achieve the desired rate, the error goes to zero and the output remains constant.

The Derivative Time constant is utilized to compensate for slow sources such as boats and induction heated sources. Like a large truck, these sources take time to get up to speed and to stop. The Derivative Time constant looks at the rate of change of the error. If the error is decreasing rapidly we better take our foot off the gas or we are going to overshoot our target. If the error is decreasing, but decreasing very slowly, we need to goose it to get up to speed. The Derivative Time constant instructs the controller on how much attention to pay to the rate of change of the error. A value of zero tells the controller to ignore the rate of change of the error. A large value tells the controller that this source is slow and is going to be hard to get going and hard to stop. So if the rate starts to fall off, give it power, or if we’re quickly approaching the target, begin to decrease the power.

The Integral Time constant is used to keep the thickness profile on schedule. We may have no rate error right now, so if we were not concerned about the thickness profile, we would be happy and leave everything as it is. However if we are trying to stay on a thickness profile, stay on schedule as it were, we may want to speed up or slow down a little bit to make up for previously lost, or gained time. For example, suppose our desired speed is 50 mph and that’s the speed we are traveling. However we’ve been traveling for exactly an hour and we’ve only

TUNING THE MDC-260 CONTROL LOOP 6-2

MDC-260 DEPOSITION CONTROLLER

gone 48 miles because of some traffic earlier on. Our Integral error is 2 miles. If we want to get back on schedule we need to speed up a bit. If schedule is very important to us, we will speed up a lot to get back on schedule fast. If schedule is not important at all we will maintain our speed. The Integral Time constant instructs the controller on how much attention to pay to the schedule. If we don’t care what happened in the past and we want zero rate error right now, we don’t want any Integral feedback. To accomplish that we set the Integral Time constant to its maximum value, which tells the controller to ignore any past error unless it lasts for a very long time.

6.3 ESTABLISHING MDC-260 CONTROL LOOP PARAMETERS

As explained above, the MDC utilizes three control loop parameters referred to as PID parameters; Proportional gain, Integral Time constant and Derivative Time constant to provide for optimization of the control loop. The MDC provides default values for each of these parameters.

Parameter Minimum

value

Maximum

value

Default

value

Proportional gain 1 9999 1000

Integral time constant, sec. 0 99.9 99.9

Derivative time constant sec. 0 99.9 0.0

Table 6-1 Default and Range for PID Parameters

The following table lists some recommended PID values for different types of deposition sources. These values represent a good starting point and in some cases may not need to be further modified.

Parameter Electron

Filament Boat

Beam Gun

Proportional gain 2000 600

Integral time constant, sec. 99.9 99.9

Derivative time constant sec. 25.0 75.0

Table 6-2 Suggested PID Starting Values for Different Sources

In the MDC-260, the PID parameters are defined at the material level because different materials often require different PID settings even though they may be deposited from the same source. Therefore it is usually necessary to establish the PID parameters for every each material and deposition source.

The first step in setting the PID parameters for a new material or source is to enter the recommended starting values listed above. Be sure and choose the PID values for the type of source you're using. Next, create a dummy process with the first layer set for the new material. Start and abort the dummy process to load the new material as the active material. You should now see the material's name in the top line of any Status Screen. Next, open the shutter and put the MDC-260 in the

TUNING THE MDC-260 CONTROL LOOP

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MDC-260 DEPOSITION CONTROLLER

manual power mode and adjust the source power using the remote handset to establish the power ramp parameters. Set the Predeposit Power level at or slightly below the power needed to get the desired deposition rate.

With the power ramp parameters defined, the next step is to start the dummy process to see how well the MDC-260 controls the rate. If the rate is too high or low when the shutter opens then make a note to go back and adjust the Predeposit Power level. Watch the rate graph and the power display. If the rate is different from the target rate then you should see the MDC-260 adjust the power attempting to achieve the target rate. If the rate is close to the target, then you should temporarily change the rate to see how the MDC-260 reacts. Ideally the MDC-260 will adjust the power so that the rate goes right to the target rate without overshooting it. If it does then no further adjustments are necessary.

If it seems like the MDC-260 is reacting too slowly, press the Program key to get back to the material screen and increase the Proportional Gain parameter. Begin with changes of about 10 to 20%. Changes of this magnitude are a good starting point because they are large enough to show the effect of the parameter and small enough that you won't greatly overshoot the ideal setting. Remember that too much Proportional Gain will make the system unstable and too little will make the MDC-260 slow to react. An unstable system is evident by the rate oscillating around the target value. A general rule of thumb is the faster the source, the larger the Proportional Gain. And conversely, the slower the source the smaller the Proportional Gain.

With the Proportional Gain at an acceptable value, the next step is to adjust the Derivative Time if necessary. Disturb the system again by changing the target rate. Watch the rate graph as the rate approaches the target. If the rate overshoots the target then increase the Derivative Time and change the target rate again to see the effect. Repeat these steps slowly increasing the Derivative Time until the rate goes right to the target without overshoot.

In very slow systems such as large filament boats, the Proportional Gain parameter may have to be set so low to maintain stability where the rate smoothly levels off but remains below the target value. In this case you will need to adjust the Integral Time parameter. This parameter works in reverse meaning the smaller the value the larger the effect. So, slightly decrease this parameter then watch the rate graph. The rate should ramp up to the target without overshoot. If the ramp takes too long then slowly decrease the Integral Time again and repeat these steps until you are satisfied with the control.

TUNING THE MDC-260 CONTROL LOOP 6-4

MDC-260 DEPOSITION CONTROLLER

7. INPUT/OUTPUT CHARACTERISTICS

The following section describes the electrical characteristics of the MDC-260 inputs and outputs. All outputs are updated and inputs are sampled every 100 msec. In order to insure immunity to transients, inputs are not considered to have changed until the same input state is obtained on two successive input samples.

For this reason all input signals must have a minimum duration of at least 0.2 sec. Input signals lasting less than 100 msec. will be ignored while signals lasting between 100 and 200 msec. may or may not be recognized.

7.1 SOURCE CONTROL VOLTAGE OUTPUT

For maximum noise immunity, each two-terminal control voltage output pair is isolated from controller ground. Either terminal can be grounded within the user system, so the output can provide either a negative or positive output voltage range. In the event that the receiving equipment has an isolated input, one of the two lines should be grounded to avoid excessive voltage buildup on the otherwise isolated circuitry.

The voltage output range can be programmed (see Source Setup) for 2.5, 5.0 or 10 volts full scale. The output impedance is nominally 100 ohms. The outputs are short circuit protected with short circuit current limited to between 20 and 40 milliamps, though the outputs should not be short-circuited for long periods. The schematic appears in Figure 7-4.

CAUTION: To avoid damage to the instrument, do NOT allow long term shorting of any of the source output which may cause excessive temperature rise in the isolated power supply.

7.2 SENSOR INPUT

The sensor oscillator is connected through a single coaxial cable. Sensor ground is common with the MDC-260 ground. Power to the sensor oscillator is carried on the center conductor of the coaxial cable. Power is supplied from the MDC260 internal 5-volt supply through a 50-ohm resistor which accomplishes the dual function of properly terminating the 50-ohm coaxial cable and providing short circuit protection. The sensor buffer circuit is shown schematically in Figure 7-4.

7.3 DISCRETE OUTPUTS

Each Discrete Output is an isolated, independent, normally open relay output connected to one pin pair on the output connector. Each output contact is rated for 120 VA, 2A maximum. See Table 8-2 for pin signal assignments.

7.4 DISCRETE INPUTS

The inputs can be set to accept one of the two input types, “Passive” or “Active”. They are selectable through the internal DIP switches (See Section 8.3.9.1).

INPUT/OUTPUT CHARACTERISTICS

7-1

MDC-260 DEPOSITION CONTROLLER

The Passive inputs are activated by shorting the input’s pins together. The inputs are internally pulled up to 5 volt through a 4.7 Kohm resistor and incorporate a 10-millisecond filter to enhance noise immunity and provide protection from a momentary short. The Passive input circuit is shown in Figure 7-1.

The Active inputs are activated by supplying 12 to 120 volt AC or DC across the input pins. The inputs incorporate a 10 millisecond filter to enhance noise immunity and provide protection from a momentary short. The Active input circuit is shown in Figure 7-2.

Pin assignments are shown in Table 8-2.

INPUT/OUTPUT CHARACTERISTICS 7-2

MDC-260 DEPOSITION CONTROLLER

Figure 7-1 Passive Input Buffer circuit

INPUT/OUTPUT CHARACTERISTICS

7-3

MDC-260 DEPOSITION CONTROLLER

Figure 7-2 Active Input Buffer Circuit

INPUT/OUTPUT CHARACTERISTICS 7-4

MDC-260 DEPOSITION CONTROLLER

Figure 7-3 Sensor Input Buffer circuit

INPUT/OUTPUT CHARACTERISTICS

7-5

MDC-260 DEPOSITION CONTROLLER

Figure 7-4 Source Output Driver circuit

INPUT/OUTPUT CHARACTERISTICS 7-6

INFICON MDC-260 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Trademarks

Disclaimer

Disclosure

Copyright

General Safety Warning

Warranty

SAFETY PRECAUTION AND PREPARATION FOR USE

SAFETY TERMS AND SYMBOLS

Table of Contents

1.2.1 AMPLE PROGRAM STORAGE

1.2.2 DYNAMIC MEASUREMENT UPDATE RATE

1.2.3 SUPERIOR COLOR GRAPHICS DISPLAY

1.2.4 PROGRAM SECURITY

1.2.5 DESIGNED FOR UNATTENDED OPERATION

GENERAL DESCRIPTION 1-1

1.2.6 FAIL SAFE ABORTS

1.2.7 ABORT STATUS RETENTION

1.2.8 RUN COMPLETION ON CRYSTAL FAILURE

1.2.9 POWERFUL SYSTEM INTERFACE

1.3.4 PROGRAM STORAGE CAPACITY

2.1.1 PROGRAMMING SCREENS (MENUS)

FRONT PANEL DISPLAYS AND CONTROLS

3.2 COLD POWER UP

3.3 WARM POWER UP

BENCH CHECKOUT & INSPECTION

3.4.1 MATERIAL #1 PARAMETERS

3.4.2 MATERIAL #2 PARAMETERS

4.1.1 NAVIGATING THE MENU STRUCTURE

PROGRAMMING AND CONTROLLER SETUP

4.1.3 ENTERING TIME PARAMETERS

4.1.4 COPYING AND DELETING

4.1.6 ADJUSTING LCD DISPLAY CONTRAST

4.2.4 INPUT, OUTPUT AND ACTION SETUP

4.2.8 STARTING A NEW PROCESS

System Setup Edit Display Setup Program Inputs Program Outputs Program Actions Edit Sensor Setup Edit Source Setup Edit DAC Setup Edit Utility Setup

4.3.3.3.1 ENTERING A CONDITION STRING

5.2 STARTING A NEW PROCESS

OPERATING THE MDC-260

5.3 STARTING A NEW LAYER

5.4 RESUMING AN ABORTED OR HALTED PROCESS

5.6.1 MAIN RUN SCREEN

5.6.2 SOURCE-SENSOR STATUS SCREEN

5.6.4 ACTIVE LAYER PARAMETER UPDATE SCREEN

5.6.5 POSITION CONTROL SCREEN

5.7.3 HALT (SOFT ABORT)

5.9.1.1 MIN RATE&MAX POWER

5.9.1.2 MAX RATE&MIN POWER

5.9.1.3 SYSTEM SETUP MEMORY CORRUPTED

5.9.1.4 PROCESS MEMORY CORRUPTED

5.9.1.6 RATE EST. ERROR

5.9.1.10 NO SENSORS ENABLED

5.9.1.16 MAX POWER ALERT

5.9.1.17 MIN POWER ALERT

5.9.1.19 XTAL FAIL SWITCH

5.9.1.20 XTAL MRGN SWITCH

5.9.1.27 PRESS START TO RESUME PROCESS

6.1 CONTROL LOOP BASICS

TUNING THE MDC-260 CONTROL LOOP

6.2 CONTROL LOOPS APPLIED TO VACUUM DEPOSITION

6.3 ESTABLISHING MDC-260 CONTROL LOOP PARAMETERS

7.1 SOURCE CONTROL VOLTAGE OUTPUT

INPUT/OUTPUT CHARACTERISTICS