INFICON IC6 User Manual

Download

over Page

OPERATING MANUAL

IC6

Thin Film Deposition Controller

PN 074-505-P1F

Title P

age

www.inficon.com reachus@inficon.com

OPERATING MANUAL

IC6

Thin Film Deposition Controller

PN 074-505-P1F

Trademarks

The trademarks of the products mentioned in this Operating Manual are held by the companies that produce them.

CAJON® is a registered trademark of Swagelok, Co.

RateWatcher™ is trademark of INFICON GmbH

Kingston® is a registered trademark of Kingston Technology Corporation.

Inconel® is a registered trademark of Inco Alloys International, Huntington, WV.

Lexar® is a registered trademark of Lexar Media, Inc.

Memorex® is a U.S. registered trademark of Memtek Corporation.

SanDisk® is a registered trademark of SanDisk Corporation.

Windows®, Windows 95® and Microsoft® are registered trademarks of Microsoft Corporation.

All other brand and product names are trademarks or registered trademarks of their respective companies.

Disclaimer

The information contained in this Operating Manual is believed to be accurate and reliable. However, INFICON assumes no responsibility for its use and shall not be liable for any special, incidental, or consequential damages related to the use of this product.

Due to our continuing program of product improvements, specifications are subject to change without notice.

Copyright

Declaration Of Conformity

Page 1

Declaration Of Conformity

Page 2

Warranty

Standard INFICON Two Year

Page 1

Standard INFICON Two Year Warranty

Page 2

IC6 Operating Manual

Cover Page

Title Page

Trademarks

Disclaimer

Declaration Of Conformity

Warranty

Chapter 1

Introduction and Specifications

1.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

1.1.1 Related Manuals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1

1.2 IC6 Safety. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-2

1.2.1 Definition of Notes, Cautions and Warnings. . . . . . . . . . . . . . . . . . . . . . . . .1-2

1.2.2 General Safety Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3

1.2.3 Earth Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4

1.2.4 Main Power Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5

1.3 How To Contact INFICON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6

1.3.1 Returning Your IC6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-6

1.4 IC6 Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-7

1.4.1 Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-7

1.4.2 Screens and Hierarchy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7

1.4.3 IC6 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-8

1.4.3.1 Recipe Storage & Datalogging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-8

1.4.3.2 Sensor Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-8

PN 074-505-P1F

1.4.3.3 Source Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-8

1.4.3.4 Material Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-9

1.4.3.5 Process Layer Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11

1.4.3.6 General Global Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-11

1.4.4 Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-13

1.4.5 DAC Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14

1.4.6 Logic Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-15

1.4.7 Relays / Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-15

1.4.8 Remote Communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-16

1.4.9 Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-16

1.4.10 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16

TOC - 1

IC6 Operating Manual

1.4.11 Operating Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16

1.4.12 Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16

1.4.13 Warm Up Period. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16

1.4.14 Size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17

1.4.15 Installation Clearance Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17

1.4.15.1 Connector Clearance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17

1.4.15.2 Cooling Clearance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17

1.4.16 Weight . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17

1.4.17 Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17

1.5 Unpacking and Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-18

1.6 Parts and Options Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-18

1.6.1 Base Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-18

1.6.2 Pre-installed Options or Spares . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-18

1.6.3 Optional Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-19

1.6.4 Oscillator Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-19

1.6.5 Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-19

1.6.6 Replacement Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-19

1.7 Initial Power-On Verification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-20

Chapter 2

Installation and Interfaces

2.1 Location Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

2.1.1 Sensor Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

2.1.2 Sensor Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

2.1.3 IC6 Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4

2.2 Avoiding Electrical Interference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4

2.2.1 Verifying/Establishing Earth Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4

2.2.2 Connections to Earth Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5

2.2.3 Minimizing Noise Pickup From External Cabling . . . . . . . . . . . . . . . . . . . . . 2-6

2.3 Connecting the Controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7

2.3.1 Routing XIU Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7

2.3.2 Interface Cable Fabrication and Pin-Out . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7

2.3.2.1 Source Control Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7

2.3.2.2 Crucible Indexer Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8

2.3.2.3 DAC Option Kit 781-504-G1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8

2.3.2.4 I/O Expansion Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9

2.3.2.5 RS-232C Communications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11

2.3.2.6 Isolated +24 V (dc) Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12

PN 074-505-P1F

TOC - 2

IC6 Operating Manual

Chapter 3

Operation

3.1 Front Panel Controls. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-1

3.2 Rear Panel Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-3

3.3 Displays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5

3.3.1 Main Menu Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5

3.3.2 Operate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-6

3.3.3 Sensor Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-9

3.3.3.1 Sensor Information Rate/Xtal Display Description . . . . . . . . . . . . . . . . . . . .3-9

3.3.3.2 Crystal Life and Starting Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-11

3.3.3.3 Percent Life Auto-Zero . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11

3.3.3.3.1 Function Key Selection Choices for the

Sensor Information Rate/Xtal Display. . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-12

3.3.3.4 Sensor Information Type/Freq Display Description . . . . . . . . . . . . . . . . . . 3-13

3.3.3.4.1 TEST XIU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-14

3.3.4 Sensor Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-14

3.3.5 Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-16

3.3.6 Material. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-17

3.3.6.1 Overview Page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-17

3.3.6.2 Source Page. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-17

3.3.6.3 Sensor Page. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-17

3.3.6.4 Pre/Post Page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18

3.3.6.5 Deposit Page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-18

3.3.6.6 Lib A-Hf, Lib Hf-Sc, Lib Sc-Z Sub-Displays . . . . . . . . . . . . . . . . . . . . . . . .3-19

3.3.7 Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-19

3.3.7.1 Overview Page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-19

3.3.7.2 Current Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-20

3.3.7.3 1 - 10, 11 - 20 etc. Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-20

3.3.8 General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-20

PN 074-505-P1F

3.3.8.1 Process Page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-20

3.3.8.2 DACs Page. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-22

3.3.8.3 Comm Page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-22

3.3.8.4 Message Page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-22

3.3.8.5 Date/Time Page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-22

3.3.8.6 Test Page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-22

3.3.8.7 Lock Page. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-22

3.3.8.8 Audio/Visual Page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-23

3.3.9 Digital I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-23

3.3.10 Logic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-24

3.3.11 Maintenance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-24

TOC - 3

IC6 Operating Manual

3.3.12 Counter / Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-24

3.3.13 USB Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-24

3.4 Process Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-25

3.4.1 Defining a Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-25

3.4.2 Executing a Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-27

3.4.3 Pre-conditioning a Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-29

3.4.4 Co-deposition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-29

3.4.5 Multiple Layer Starts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-30

3.4.6 Automating a Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-30

3.5 State Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-32

3.6 Special Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-34

3.6.1 Crystal Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-34

3.6.1.1 XtalTwo (CrystalTwo). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-35

3.6.1.2 XtalSix (CrystalSix). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-36

3.6.1.3 Xtal12 (Crystal12). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-36

3.6.1.4 Generic Sensor Crystal Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-37

3.6.2 Source/Crucible Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-37

3.6.2.1 Example: Programming Turret Source Crucible Selection. . . . . . . . . . . . . 3-38

3.6.3 Auto-Z. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-39

3.6.4 Auto Tune — Optimizing the Control Loop. . . . . . . . . . . . . . . . . . . . . . . . . 3-40

3.6.5 Rate Watcher . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-40

3.6.6 Handheld Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-41

3.6.6.1 Determining Soak Power with the Handheld Controller . . . . . . . . . . . . . . . 3-41

3.6.7 Test Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-42

3.6.7.1 Standard or Time Compressed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-42

3.6.7.2 Advanced Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-42

3.6.8 USB Storage Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-42

3.6.9 Lock and Access Codes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-43

3.6.10 Datalog. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-43

3.6.11 DAC Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-46

PN 074-505-P1F

Chapter 4

TOC - 4

Sensor & Source Setup

4.1 Sensor Setup Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

4.1.1 Sensor Display Navigation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

4.1.2 Sensor Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2

4.2 Source Setup Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4

4.2.1 Source Navigation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4

4.2.2 Source Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5

4.3 DAC Output Selection Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8

IC6 Operating Manual

Chapter 5

Material Setup

5.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1

5.1.1 Material Screen Overview Page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1

5.1.2 Material Definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-2

5.1.3 Material Screen Source Page Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . 5-3

5.1.4 Material Screen Sensor Parameters Page . . . . . . . . . . . . . . . . . . . . . . . . . .5-6

5.1.5 Pre/Post Screen Deposit Page Parameters . . . . . . . . . . . . . . . . . . . . . . . . 5-12

5.1.6 Post Deposit Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15

5.1.7 Deposit Page Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-16

Chapter 6

Process Setup

6.1 Process Setup Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1

6.2 Overview Page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-1

6.3 Curr(ent) Proc(ess) Page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-2

6.4 Process Layers 1 - 10 etc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-3

6.4.1 Layer Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3

6.4.1.1 Layer Parameter Editing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3

6.4.1.2 Layer Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-4

6.5 Special Layer Parameter Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-5

6.5.1 Skip Deposit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5

Chapter 7

General Parameters

7.1 General Setup Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1

7.2 General Screen Process Page. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1

7.3 DACs Page Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-3

7.4 COMM Page Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-4

7.5 MESSAGE Page Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-6

PN 074-505-P1F

7.6 DATE / TIME Set Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-7

7.7 TEST Page Set Up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-8

7.8 LOCK Page Code Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-9

7.9 AUDIO / VISUAL Page Set Up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-10

Chapter 8

Digital I/O

8.1 Digital I/O Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1

8.2 All Input Page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-1

8.3 All Output Page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-2

8.4 I/O Board Page. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-3

8.4.1 Output Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-3

TOC - 5

IC6 Operating Manual

Chapter 9

Logic Statement Setup

9.1 Logic Statement Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-1

9.2 Editing the Logic Statements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-2

9.2.1 Logic Statement Groups. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-3

9.2.2 Logic Statement Editing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-4

9.2.3 AND/OR and ON Logic Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-6

9.2.3.1 ON Operator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-6

9.3 IF Event Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7

9.4 THEN Action Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-16

9.5 Logic Statement Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-20

Chapter 10 Remote Communications

10.1 Remote Communication Configuration Overview . . . . . . . . . . . . . . . . . . . 10-1

10.2 Physical Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-1

10.2.1 RS-232C Serial Port. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-2

10.2.2 TCP/IP Ethernet Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-2

10.2.2.1 Network Connection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-2

10.2.2.2 How to Set Up the Network Protocol on the PC. . . . . . . . . . . . . . . . . . . . . 10-3

10.3 Message Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-6

10.3.1 Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-6

10.3.1.1 Command Packet (Host to IC6 Message) . . . . . . . . . . . . . . . . . . . . . . . . . 10-6

10.3.1.2 Response Packet (IC6 to Host Message) . . . . . . . . . . . . . . . . . . . . . . . . . 10-8

10.3.1.3 Timeouts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-9

10.3.2 Data Type Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-9

10.3.2.1 REAL_xXx and REAL_xFx. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-10

10.3.2.2 TIME. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-10

10.3.2.3 ENCODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-10

10.3.2.4 INTEGER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-10

10.3.2.5 LOCKCODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-10

10.4 Communication Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-11

10.4.1 Query and Update Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-11

10.4.2 Status Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-12

10.4.3 HELLO Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-12

10.4.4 Query Source Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-12

10.4.5 Update Source Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-13

10.4.6 Query General Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-14

10.4.7 Update General Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-14

10.4.8 Query Input Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-18

10.4.9 Update Input Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-18

PN 074-505-P1F

TOC - 6

IC6 Operating Manual

10.4.10 Query Process Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-18

10.4.11 Update Process Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-18

10.4.12 Query Logic Statement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-19

10.4.13 Update Logic Statement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-21

10.4.14 IC6 Event List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-21

10.4.15 IC6 Action List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-24

10.4.16 Query Material Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-26

10.4.17 Update Material Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-26

10.4.18 Query Material Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-35

10.4.19 Update Material Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-35

10.4.20 Query Output Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-35

10.4.21 Update Output Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-35

10.4.22 Query Process Layer Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-36

10.4.23 Update Process Layer Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-36

10.4.24 Query Sensor Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-37

10.4.25 Update Sensor Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-37

10.4.26 Query Output Type. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-39

10.4.27 Update Output Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-39

10.4.28 Query User Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-39

10.4.29 Update User Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-39

10.4.30 Status General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-40

10.4.31 Status Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-43

10.4.32 Status Sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-45

10.4.33 Remote General Action . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-47

10.4.34 Remote Layer Action . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-50

10.4.35 IC6 Communications Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-52

10.4.35.1 General Command Packet Format. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-52

10.4.35.2 General Response Packet Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-52

10.4.35.3 HELLO Command, ASCII name and version . . . . . . . . . . . . . . . . . . . . . .10-52

PN 074-505-P1F

10.4.35.4 Query General Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-53

10.4.35.5 Update General Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-53

10.4.35.6 Query Material Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-53

10.4.35.7 Update Material Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-53

10.4.35.8 Query Sensor Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-53

10.4.35.9 Update Sensor Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-54

10.4.35.10 Query Source Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-54

10.4.35.11 Update Source Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-54

10.4.35.12 Query Process Layer Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-54

10.4.35.13 Update Process Layer Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-55

10.4.35.14 Query Material Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-56

TOC - 7

IC6 Operating Manual

10.4.35.15 Update Material Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-56

10.4.35.16 Query Process Name. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-56

10.4.35.17 Update Process Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-56

10.4.35.18 Query Input Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-56

10.4.35.19 Update Input Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-57

10.4.35.20 Query Output Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-57

10.4.35.21 Update Output Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-57

10.4.35.22 Query Output Type. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-57

10.4.35.23 Update Output Type. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-57

10.4.35.24 Query User Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-58

10.4.35.25 Update User Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-58

10.4.35.26 Query Logic Statement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-58

10.4.35.27 Update Logic Statement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-59

10.4.35.28 Status General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-59

10.4.35.29 Status Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-60

10.4.35.30 Status Sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-60

10.4.35.31 Remote General Action . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-60

10.4.35.32 Remote Layer Action . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-60

10.4.35.33 Example for Interpreting Float Responses. . . . . . . . . . . . . . . . . . . . . . . . 10-61

Chapter 11

Applications

11.1 Multiple Sensor Deposition Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-1

11.1.1 IC6 Parameters and Corrections for

Multiple Sensor Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-3

11.2 Trend Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-5

11.2.1 IC6 Parameters Associated with the Trend Analysis Feature . . . . . . . . . . 11-5

11.3 IC6 Cygnus Emulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-6

11.4 IC6 Four & Six Layer (Cygnus Emulation) Configuration. . . . . . . . . . . . . . 11-7

11.4.1 Configure Sensors 1 to 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-8

11.4.2 Configure Sources 1 to 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-8

11.4.3 Configure six Materials. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-8

11.4.4 Configure the Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-9

11.4.5 General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-9

11.4.6 Logic Functions Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-9

11.4.7 State Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-10

11.4.7.1 NonDepCntl State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-10

11.4.7.2 Suspend . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-10

11.4.7.3 Idle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-10

PN 074-505-P1F

TOC - 8

IC6 Operating Manual

Chapter 12

Maintenance and Calibration Procedures

12.1 Importance of Density, Tooling and Z-Ratio. . . . . . . . . . . . . . . . . . . . . . . . 12-1

12.2 Determining Density . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-1

12.3 Determining Tooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-2

12.4 Laboratory Determination of Z-Ratio . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-3

12.5 AutoTuning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-5

12.5.1 AutoTune Preparation Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-5

12.5.2 AutoTune Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-8

12.5.3 AutoTune Manual Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-9

12.5.4 AutoTune Tuning Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-10

12.5.5 AutoTune Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-10

12.6 Determining Cross Talk Calibration

For Co-Deposition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-13

12.6.1 Procedure Set-Up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-14

12.6.1.1 Cross Talk Calibration Procedural Notes . . . . . . . . . . . . . . . . . . . . . . . . . 12-14

12.6.1.2 Cross Talk Calibrate Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-16

12.6.2 Cross Talk Calibration MANUAL display . . . . . . . . . . . . . . . . . . . . . . . . . 12-17

12.6.2.1 Function Key Selection Choices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-17

12.6.3 Cross Talk Calibration CALIBRATE display. . . . . . . . . . . . . . . . . . . . . . . 12-18

12.6.4 Cross Talk Calibration SELECT display. . . . . . . . . . . . . . . . . . . . . . . . . . 12-19

12.6.4.1 Function Key Selection Choices for

Cross Talk Calibration Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-19

12.7 Source Maintenance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-20

12.7.1 Source Maintenance Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-21

12.7.1.1 Crucible Rotation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-21

12.7.1.2 Toggle Sensor and Source Shutter . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-21

12.7.1.3 Start/Stop Manual Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-21

12.8 System Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-22

PN 074-505-P1F

Chapter 13

Counters & Timers

13.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13-1

Chapter 14

14.1 File Handling (USB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14-1

14.1.1 USB Storage Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14-1

14.2 Directory Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14-1

14.3 Configuration Files . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14-2

14.4 Data Logs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14-3

14.5 Screen Captures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14-4

USB Storage

TOC - 9

IC6 Operating Manual

Chapter 15

Troubleshooting, Status and Error Messages

15.1 Status Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-1

15.2 User Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-5

15.3 AutoTune and Calibration Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-6

15.4 STOP messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-7

15.5 Transient Messages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-9

15.6 Input Error Messages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-14

15.7 Troubleshooting Guide. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-16

15.7.1 Troubleshooting the IC6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-17

15.7.2 Troubleshooting Transducers/Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . 15-19

15.7.3 Troubleshooting Computer Communications. . . . . . . . . . . . . . . . . . . . . . 15-23

15.8 Replacing the Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-25

15.8.1 Front Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-26

15.8.2 Cool Drawer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-27

15.8.3 Shuttered and Dual Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-28

15.8.4 Bakeable Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-28

15.8.5 Sputtering Sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-29

15.8.6 Crystal Snatcher. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-30

15.8.7 CrystalSix (XtalSix). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-30

15.9 Crystal Sensor Emulator

IPN 760-601-G1 or 760-601-G2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-31

15.9.1 Diagnostic Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-32

15.9.1.1 Measurement System Diagnostic Procedure. . . . . . . . . . . . . . . . . . . . . . 15-32

15.9.1.2 Feedthrough Or In-Vacuum Cable

Diagnostic Procedure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-33

15.9.1.3 Sensor Head Or Monitor Crystal

Diagnostic Procedure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-34

15.9.1.4 System Diagnostics Pass But

Crystal Fail Message Remains. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-35

15.9.2 % XTAL Life . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-35

15.9.3 Sensor Cover Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-36

15.9.3.1 Compatible Sensor Heads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-36

15.9.3.2 Incompatible Sensor Heads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-36

15.9.4 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-37

PN 074-505-P1F

TOC - 10

Chapter 16

16.1 Basics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16-1

16.1.1 Monitor Crystals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16-2

16.1.2 Period Measurement Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16-4

16.1.3 Z-match Technique. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16-5

16.1.4 Active Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16-6

16.1.5 ModeLock Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16-7

16.1.6 Auto-Z Theory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16-9

16.1.7 Control Loop Theory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16-11

Appendix A

A.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .A-1

IC6 Operating Manual

Measurement and Control Theory

Material Table

PN 074-505-P1F

TOC - 11

IC6 Operating Manual

This page is intentionally blank.

TOC - 12

PN 074-505-P1F

1.1 Introduction

The IC6 is a closed loop process controller designed for use primarily in physical vapor deposition. The IC6 monitors and/or controls the rate and thickness of the deposition of thin films. Deposition rate and thickness are inferred from the frequency change induced by mass added to a quartz crystal. This technique positions sensors in the path between or to the side of the source of the vaporized material and the target substrate. The sensor incorporates an exposed oscillating quartz crystal whose frequency decreases as material accumulates. The change in frequency provPN 074-505-P1Fides information to determine rate and thickness and to continually control the evaporation power source. With user programmed time, thickness and power limits and with desired rates and material characteristics, the IC6 is capable of automatically controlling the process in a precise and repeatable manner. User interaction is accomplished via the IC6 front panel or remote communication and consists of selection or entry of parameters to define the process.

IC6 Operating Manual

Chapter 1

Introduction and Specifications

A complete system consists of a main electronics unit also called the IC6, sensor heads and a crystal interface unit (XIU) for each attached sensor. These items are generally bundled at the factory and are also sold separately.

This IC6 Operating Manual provides user information for installing, programming and operating the main electronics unit.

When reading the IC6 Operating Manual, please pay particular attention to the Notes, Cautions, and Warnings found throughout the text. The Notes, Cautions, and Warnings are defined in section 1.2.1 on page 1-2.

You are invited to comment on the usefulness and accuracy of this manual by

PN 074-505-P1F

visiting our website at www.inficon.com.

1.1.1 Related Manuals

Sensors are covered in separate manuals.

 074-154 - Front Load Bakeable

 074-155 - CrystalSix (XtalSix)

 074-398 - Crystal12 (Xtal12)

 074-156 - Front Load Single/Dual

 074-157 - Sputtering

1 - 1

IC6 Operating Manual

CAUTION

WARNING

WARNING - Risk Of Electric Shock

1.2 IC6 Safety

1.2.1 Definition of Notes, Cautions and Warnings

When using this manual, please pay attention to the Notes, Cautions, and Warnings found throughout. For the purposes of this manual they are defined as follows:

NOTE: Pertinent information that is useful in achieving maximum IC6 efficiency

when followed.

Failure to heed these messages could result in damage to the IC6.

Failure to heed these messages could result in personal injury.

Dangerous voltages are present which could result in personal injury.

PN 074-505-P1F

1 - 2

1.2.2 General Safety Information

WARNING - Risk Of Electric Shock

CAUTION

Do not open the IC6 case! There are no user-serviceable components within the IC6 case.

Dangerous voltages may be present whenever the power cord or external input/relay connectors are present.

Refer all maintenance to qualified personnel.

This IC6 contains delicate circuitry which is susceptible to transient power line voltages. Disconnect the line cord whenever making any interface connections. Refer all maintenance to qualified personnel.

IC6 Operating Manual

PN 074-505-P1F

1 - 3

IC6 Operating Manual

WARNING - Risk Of Electric Shock

1.2.3 Earth Ground

The IC6 is connected to earth ground through a sealed three-core (three-conductor) power cable, which must be plugged into a socket outlet with a protective earth terminal. Extension cables must always have three conductors including a protective earth terminal.

Never interrupt the protective earth circuit.

Any interruption of the protective earth circuit inside or outside the IC6, or disconnection of the protective earth terminal is likely to make the IC6 dangerous.

This symbol indicates where the protective earth ground is connected inside the IC6. Never unscrew or loosen this connection.

PN 074-505-P1F

1 - 4

1.2.4 Main Power Connection

WARNING - Risk Of Electric Shock

This IC6 has line voltage present on the primary circuits whenever it is plugged into a main power source.

Never remove the covers from the IC6 during normal operation.

There are no operator-serviceable items within this IC6.

Removal of the top or bottom covers must be done only by a technically qualified person.

In order to comply with accepted safety standards, the IC6 must be installed into a rack system which contains a mains switch. This switch must break both sides of the line when it is open and it must not disconnect the safety ground.

IC6 Operating Manual

PN 074-505-P1F

1 - 5

IC6 Operating Manual

1.3 How To Contact INFICON

Worldwide customer support information is available under Support at

www.inficon.com where you can contact:

 a Technical Support Engineer with questions regarding applications for and

programming the IC6.

 a Service Engineer with questions regarding troubleshooting, diagnosing or

repairing a defective IC6.

 Sales and Customer Service, to find the INFICON Sales office nearest to you.

 Repair Service, to find the INFICON Service Center nearest to you.

If you are experiencing a problem with your IC6, please have the following information readily available:

 the serial number and firmware version for your IC6,  a description of your problem,  an explanation of any corrective action that you may have already attempted,  and the exact wording of any error messages that you may have received.

1.3.1 Returning Your IC6

Do not return any component of your IC6 to INFICON without first speaking with a Customer Support Representative. You must obtain a Return Material Authorization (RMA) number from the Customer Support Representative.

If you deliver a package to INFICON without an RMA number, your package will be held and you will be contacted. This will result in delays in servicing your IC6.

Prior to being given an RMA number, you may be required to complete a Declaration Of Contamination (DOC) form if your sensor has been exposed to process materials. DOC forms must be approved by INFICON before an RMA number is issued. INFICON may require that the sensor be sent to a designated decontamination facility, not to the factory.

PN 074-505-P1F

1 - 6

1.4 IC6 Specifications

1.4.1 Measurement

Measurement Frequency Range . . . 6.0 to 4.5 MHz (fixed)

Frequency Resolution . . . . . . . . . . . ± 0.0035 Hz @ 6 MHz

Thickness and Rate

Resolution/Measurement . . . . . . . . . ± 0.00433 Å @ tooling/density = 100/1

Measurement Interval. . . . . . . . . . . . 0.10 s

Thickness Accuracy . . . . . . . . . . . . . 0.5% typical, (dependent on process

Frequency Accuracy. . . . . . . . . . . . . ± 2 ppm 0 to 50°C

Measurement Frequency . . . . . . . . . 10 Hz

Measurement Technique . . . . . . . . . ModeLock with Auto-Z

IC6 Operating Manual

Fundamental frequency = 6 MHz

conditions, especially sensor location, material stress, temperature and density)

User Interface. . . . . . . . . . . . . . . . . . LCD and limited membrane keypad. All

parameters accessible through computer communications. Multiple message areas for indication of states and detailed indication of abnormal and stop conditions.

1.4.2 Screens and Hierarchy

a) Navigation . . . . . . . . . . . . . . . . . . Menu driven, four soft keys

b) Structure. . . . . . . . . . . . . . . . . . . . Separate screens dedicated to

1) Operate 2 ) Se ns or In f or ma t io n

3) Sensor Parameters

PN 074-505-P1F

4) Source Parameters

5) Material Parameters

6) Process Parameters

7) General Parameters

8) Digital I/O Display

9) Logic

10) Ma inte na nc e

11) Counter/Timer

12) USB Storage

1 - 7

IC6 Operating Manual

1.4.3 IC6 Features

1.4.3.1 Recipe Storage & Datalogging

USB Memory Device

1.4.3.2 Sensor Parameters

Up to 8 sensors can be averaged together

(Sensor) Shutter Output . . . . . . . . . . 0 to 38

Sensor Type. . . . . . . . . . . . . . . . . . . Single, XtalTwo, XtalSix, Xtal12, Generic

(Sensor) Switch Output . . . . . . . . . . 0 to 38

Auto-Z . . . . . . . . . . . . . . . . . . . . . . . Yes/No

# of Positions (for Generic Sensor type) . . . . . . . . . 1 to 12

# of Pulses (for Generic Sensor type) . . . . . . . . . . . 1 to 10

Pulse On (Time for Generic Sensor type) . . . . . . . . 0.1 to 9.9 s

Pulse Off (Time for Generic Sensor type) . . . . . . . . 0.1 to 9.9 s

Recorder Output. . . . . . . . . . . . . . . . 0 to 12

Recorder Function . . . . . . . . . . . . . . Rate, Thickness, RateDeviation

Recorder Range. . . . . . . . . . . . . . . . 0 to 99999

1.4.3.3 Source Parameters

Up to 6 sources may be controlled at the same time

DAC Output . . . . . . . . . . . . . . . . . . . 0 to 12

(Source) Shutter Output . . . . . . . . . . 0 to 38

Crucible Selection . . . . . . . . . . . . . . Turret is indexed to selected position on a

Number of Crucibles. . . . . . . . . . 1, 4, 8, 16, 32 or 64

Crucible Output . . . . . . . . . . . . . 0 to 38

Turret Feedback. . . . . . . . . . . . . Yes / No

Turret Input. . . . . . . . . . . . . . . . . 0 to 28

Start. Turret feedback is checked whenever a source is started. Range is from 1 to number of crucibles.

PN 074-505-P1F

1 - 8

Turret Delay . . . . . . . . . . . . . . . . 2 to 180 s (Time-out period with feedback,

delay time without feedback)

1.4.3.4 Material Parameters

32 materials can be specified and given unique names (15 character max.).

Density . . . . . . . . . . . . . . . . . . . . . . . 0.100 to 99.999 g/cm

Z-ratio . . . . . . . . . . . . . . . . . . . . . . . . 0.100 to 15.000

Master Tooling . . . . . . . . . . . . . . . . . 1.0 to 999.9%

Control Loop types . . . . . . . . . . . . . . Non-PID, PI, PID

Process Gain . . . . . . . . . . . . . . . . . . 0.01 to 999.99 Å/s/%Power

Time Constant . . . . . . . . . . . . . . . . . 0.010 to 9999.99 s

Dead Time . . . . . . . . . . . . . . . . . . . . 0.010 to 9999.99 s

Source . . . . . . . . . . . . . . . . . . . . . . . 1 to 6

Maximum Source Power . . . . . . . . . 0.01 to 99.99%

Minimum Source Power . . . . . . . . . . 0.00 to 99.98%

Maximum Power Option . . . . . . . . . . Continue, Post-Dep(osition), Stop Proc(ess),

IC6 Operating Manual

Suspend Mat(erial) — can be selected for each Material individually

Power Ramps. . . . . . . . . . . . . . . . . . 3 per Material

Power Level . . . . . . . . . . . . . . . . 0.00 to 99.99%

Rise Time . . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:s

Soak Time. . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:s

Auto Soak 2 . . . . . . . . . . . . . . . . . . . Yes / No

Deposit After Pre-Deposit. . . . . . . . . Yes / No

Yes = go to Deposit No = go to Non-Deposit Rate Control

(Control) Delay Option . . . . . . . . . . . None, Shutter, Control, Both

PN 074-505-P1F

Control Delay Time. . . . . . . . . . . . . . 00:00 to 99:59 min:s

Shutter Delay Accur(acy) . . . . . . . . . 1 to 99%

Transfer Sensor . . . . . . . . . . . . . . . . 0 to 8

Transfer Tooling . . . . . . . . . . . . . . . . 1 to 999.9%

Feed Power . . . . . . . . . . . . . . . . . . . 0.00 to 99.99%

Feed Ramp Time . . . . . . . . . . . . . . . 00:00 to 99:59 min:s

Feed Time . . . . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:s

1 - 9

IC6 Operating Manual

Idle Ramp. . . . . . . . . . . . . . . . . . . . . 1 per Source

Idle Power . . . . . . . . . . . . . . . . . 0.00 to 99.99%

Idle Ramp Time . . . . . . . . . . . . . 00:00 to 99:59 min:s

Rate . . . . . . . . . . . . . . . . . . . . . . . . . 0.000 to 999.9 Å/s

Time Limit (in Deposit) . . . . . . . . . . . 00:00 to 99:59 min:s

Rate Filter Time . . . . . . . . . . . . . . . . 0.1, 0.4, 1.0, 4.0, or 10.0, 20.0, 30.0 s

Time Power Averaging Time . . . . . . 0 to 30 minutes

Ion Assist Deposit . . . . . . . . . . . . . . Yes/No

On Final Thickness . . . . . . . . . . . . . Continue, Post-Dep(osit),

NonDep(osit)Cont(rol)

New Rate while in Deposit . . . . . . . . 2 Rate Ramps per Material

New Rate 1 or 2 . . . . . . . . . . . . . 0.000 to 999.9 Å/s

Start Ramp 1 or 2 . . . . . . . . . . . . 0.000 to 999.9 kÅ

Ramp Time 1 or 2. . . . . . . . . . . . 00:00 to 99:59 min:s

RateWatcher® . . . . . . . . . . . . . . . . Sample and Hold Feature

(RateWatcher) Option. . . . . . . . . Yes/No

(RateWatcher) Time . . . . . . . . . . 00:00 to 99:59 min:s

(RateWatcher) Accuracy . . . . . . 1 to 99%

Multipoint . . . . . . . . . . . . . . . . . . . . . Yes/No (average up to 8 sensors)

Aggregate Multiply . . . . . . . . . . . . . . Yes/No

(Sensor) Failure Action . . . . . . . . . . Unused, PostD(e)p(osit), Stop, Susp(e)nd,

TimeP(o)w(er)

(Sensor) Failure Trigger . . . . . . . . . . OnFail (when this sensor fails) or Last (when

the last sensor fails)

(Sensor) Weight . . . . . . . . . . . . . . . . 1 to 400.0%

(Sensor) Tooling (Factor) . . . . . . . . . 1.0 to 999.9%

CrystalTwo Tooling . . . . . . . . . . . . . . 1.0 to 999.9%

Cal(ibration) Thickness . . . . . . . . . . 0.000 to 999.9 kÅ (for Crosstalk correction)

CrystalSix (XtalSix) and Crystal12 (Xtal12) sensor selections to specify a subset of available crystal positions:

PN 074-505-P1F

1 - 10

Xtal Position First . . . . . . . . . . . . 0 to 6 (XtalSix) or 12 (Xtal12)

Xtal Position Last . . . . . . . . . . . . 0 to 6 (XtalSix) or 12 (Xtal12)

Backup Sensor . . . . . . . . . . . . . . . . . 0 to 8

Backup Tooling . . . . . . . . . . . . . . . . . 1.0 to 999.9%

(Crystal) Quality Percent . . . . . . . . . 0 to 99%

(Crystal) Quality Counts . . . . . . . . . . 0 to 99

(Crystal) Stability Single . . . . . . . . . . 0 to 9999 Hz

(Crystal) Stability Total . . . . . . . . . . . 0 to 9999 Hz

Recorder Output. . . . . . . . . . . . . . . . 0 to 12

Recorder Function . . . . . . . . . . . . . . Rate, Thick(ness), RateDev(iation), Power

Recorder Range . . . . . . . . . . . . . . . . 0 to 99999

1.4.3.5 Process Layer Parameters

50 processes can be created and given unique names (15 character max.).

Each process can contain 200 layers.

Material. . . . . . . . . . . . . . . . . . . . . . . 0 to 32

IC6 Operating Manual

Final Thick(ness) . . . . . . . . . . . . . . . 0.000 to 999.99 kÅ

Thick(ness) Limit . . . . . . . . . . . . . . . 0.000 to 999.99 kÅ

Cruc(ible) . . . . . . . . . . . . . . . . . . . . . 1 to 64

Co-Dep(osition) . . . . . . . . . . . . . . . . Yes/No

Ratio C(o)ntr(o)l . . . . . . . . . . . . . . . . 0 to 999.9% (if CoDep)

1.4.3.6 General Global Parameters

Active Process . . . . . . . . . . . . . . . . . 1 to 50

Layer To Start . . . . . . . . . . . . . . . . . 1 to 200

Run # . . . . . . . . . . . . . . . . . . . . . . . . 1 to 9999

PN 074-505-P1F

Auto Start Next (Layer) . . . . . . . . . . . Yes / No

Max Concurrent Layer . . . . . . . . . . . 1 to 6

Layers Displayed . . . . . . . . . . . . . . . Auto, 4 Layers, 6 Layers

Active Layer Output . . . . . . . . . . . . . First of eight consecutive outputs encoded to

indicate the number of the loaded layer (first if multiple layers) that will be executed on a Start. 00000001 indicates layer 1, 00010011 indicates layer 200.

Date Format . . . . . . . . . . . . . . . . . . . DDMMYYYY or MMDDYYYY

1 - 11

IC6 Operating Manual

LCD Dimmer Time . . . . . . . . . . . . . . 0 for Always On or # of Minutes till Off

0 to 99 minutes

Graph Scale . . . . . . . . . . . . . . . . . . . Power, +/-10 Å/s, +/-20 Å/s

Graph Scan Rate . . . . . . . . . . . . . . . Auto, Slow, Medium, Fast

Test . . . . . . . . . . . . . . . . . . . . . . . . . On / Off

Advanced Test . . . . . . . . . . . . . . . . . On / Off

Time Compressed . . . . . . . . . . . . . . Yes / No

Audio Feedback . . . . . . . . . . . . . . . . Yes / No

RS232 Baud Rate . . . . . . . . . . . . . . 9600, 19200, 38400, 57600, 115200

RS232 Protocol . . . . . . . . . . . . . . . . Standard, D(ata)log Page, D(ata)log Comma

DataLog XTAL History . . . . . . . . . . . Yes / No

USB Datalog Format . . . . . . . . . . . . Log Off (No datalogging), Page, Comma

Thickness Eq(uation) 1 . . . . . . . . . . Up to 6 Source numbers can be specified,

each Source number can be used only once in the equation.

Thickness Eq(uation) 2 . . . . . . . . . . Up to 6 Source numbers can be specified,

each Source number can be used only once in the equation.

Thickness Eq(uation) 3 . . . . . . . . . . Up to 6 Source numbers can be specified,

each Source number can be used only once in the equation.

DAC 1 to 12 Scale . . . . . . . . . . . . . . 0.1 to 10.0

DAC 1 to 12 Polarity. . . . . . . . . . . . . Positive / Negative

Source DAC Required . . . . . . . . . . . Yes/No (to allow 6 Rate and 6 Thickness

DACs option)

PN 074-505-P1F

1 - 12

1.4.4 Display

Type/Color/Size . . . . . . . . . . . . . . . . LCD/Color/TFT/7 inch diagonal

Dimming Feature . . . . . . . . . . . . . . . Always Full on or Full on when in use.

Format . . . . . . . . . . . . . . . . . . . . . . . WVGA

Resolution . . . . . . . . . . . . . . . . . . . . 800 W x 480 H

Backlighting . . . . . . . . . . . . . . . . . . . LED

Thickness Display Range. . . . . . . . . 0.000 to +/-9999 kÅ

Thickness Display Resolution . . . . . 1 Å for 0.000 to +/-9.999 kÅ,

Rate Display Range . . . . . . . . . . . . . 0.000 to +/-999.9 Å/s

IC6 Operating Manual

Full off when no process running and no key interaction for dimming time

10 Å for +/-10.00 to +/-99.99 kÅ 100Å for +/-100.0 to +/-999.9 kÅ

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 kÅ for +/-1000 to +/-9999 kÅ

Rate Display Resolution . . . . . . . . . . 0.001 Å/s for 0.000 to +/-9.999 Å/s if Rate

Filter Time is 10 s or greater, otherwise 0.01 Å/s for 0.00 to +/-99.99 Å/s

0.1 Å/s for +/-100.0 to +/-999.9 Å/s

Power Display Range. . . . . . . . . . . . 0.00 to 99.99%

Graphic Display Functions . . . . . . . . Rate Deviation at ±10 or ±20 Å/s or

Power at 0 to 100%

Display Data Update Rate . . . . . . . . 1 Hz

PN 074-505-P1F

1 - 13

IC6 Operating Manual

1.4.5 DAC Outputs

Quantity and Type . . . . . . . . . . . . . . 6 with BNC, 6 optional with 15 pin miniature

Configuration . . . . . . . . . . . . . . . . . . User programmable for recorder

Function and Ranges . . . . . . . . . . . . Power, Rate, Rate Deviation, Thickness

Current rating . . . . . . . . . . . . . . . . . . 20 mA per channel

Resolution . . . . . . . . . . . . . . . . . . . . 15 bits over full range (10 V)

Update Rate . . . . . . . . . . . . . . . . . . . 10 Hz, maximum, (dependent on source

Recorder Output Functions . . . . . . . Aggregate Rate, Thickness or Rate

D-sub providing analog outputs for Rate and Thickness.

or source control.

Full scale voltage value fully selectable up to + or - 10V relative to 0 V at 0 output

characteristics).

Deviation; Individual Sensor Rate, Thickness or Rate Deviation; or Source Power.

Recorder Output Ranges

Rate . . . . . . . . . . . . . . . . . . . . . . 0 to up to 99999 Å/s programmable

Thickness . . . . . . . . . . . . . . . . . . 0 to up to 99999 Å programmable, [Function

modulo (Thickness Range, Thickness)output is "saw-tooth" like with increasing thickness.]

Rate Deviation . . . . . . . . . . . . . . Desired rate ±50 Å/s

Accuracy . . . . . . . . . . . . . . . . . . . . . ±1% relative to Full Scale 10 V

PN 074-505-P1F

1 - 14

1.4.6 Logic Processing

Type . . . . . . . . . . . . . . . . . . . . . . . . . If/Then statements

Logical Functions . . . . . . . . . . . . . . . And; Or; Not; Parentheses; ON

Depth . . . . . . . . . . . . . . . . . . . . . . . . 5 "If" conditions and 5 "Then" results/actions

# of Statements. . . . . . . . . . . . . . . . . 100 If/Then

Selectable events . . . . . . . . . . . . . . . Deposition monitor events, states, external

Hierarchy . . . . . . . . . . . . . . . . . . . . . Statements evaluated in numerical order at

Partitioning . . . . . . . . . . . . . . . . . . . . None

Initialization. . . . . . . . . . . . . . . . . . . . All outputs transition to their normal states as

IC6 Operating Manual

per statement

inputs, relays, timers, and counters.

10 Hz any time the IC6 is on.

early as possible during power-on initialization sequence.

1.4.7 Relays / Inputs

Relays . . . . . . . . . . . . . . . . . . . . . . . SPST 2.5 A relays rated @ 30 V (dc) or

30 V (ac) RMS or 42 V (peak) maximum; (8 standard, up to 16 optional with 2 additional I/O cards); D sub connector; relays are normally open in the power off state, but may be programmed to normally open or normally closed during operation.

Relay Ratings . . . . . . . . . . . . . . . . . . 100 VA inductive; 2.5 A maximum.

# of TTL Compatible Outputs . . . . . . 14 with optional I/O card. Internally pulled up

to 5 V (dc). May be pulled up externally to 24 V (dc) through 2.4 k resistor.

PN 074-505-P1F

Inputs (TTL Compatible). . . . . . . . . . (14 standard, 14 additional optional)

Input Levels

maximum high . . . . . . . . . . . . . . 24 V

minimum high . . . . . . . . . . . . . . . 2.5 V

minimum high level 0.5 mA load @3.75 V maximum low level 10 mA load @1.1 V

maximum low . . . . . . . . . . . . . . . 1.1 V

Scan/Update Rate . . . . . . . . . . . . . . 10 Hz

Input/Output Name . . . . . . . . . . . . . . Those that are Non-Hardware reserved may

be named. (15 character max.)

1 - 15

IC6 Operating Manual

1.4.8 Remote Communications

RS232C Serial Port . . . . . . . . . . . . . Standard; INFICON binary protocol

Baud Rates . . . . . . . . . . . . . . . . . . . 115,200, 57,600, 38,400, 19,200, 9,600

Ethernet . . . . . . . . . . . . . . . . . . . . . . Optional, Programmable IP Address and

USB port. . . . . . . . . . . . . . . . . . . . . . Print screen bitmap (.bmp) files, Datalogging

1.4.9 Accessories

Connector Kit . . . . . . . . . . . . . . . . . . Connectors for inputs and relays

Operating Manual. . . . . . . . . . . . . . . 074-5000-G1 CD-ROM

1.4.10 Power

Power . . . . . . . . . . . . . . . . . . . . . . . . 100-230 V (ac) +/-15% V (ac); 50/60 Hz

Net Mask

file, Configuration file store/retrieve

+/-3Hz Maximum apparent power 150 VA

Fuse . . . . . . . . . . . . . . . . . . . . . . . . . use 250 V 4 Amp, 5 x 20, Slow Blow

1.4.11 Operating Environment

Usage. . . . . . . . . . . . . . . . . . . . . . . . Indoor only

Temperature . . . . . . . . . . . . . . . . . . . 0 to 50°C (32-122°F)

Humidity . . . . . . . . . . . . . . . . . . . . . . Up to 85% RH, non-condensing

Altitude . . . . . . . . . . . . . . . . . . . . . . . Up to 2000 meters

Installation (Overvoltage) . . . . . . . . . Category II per IEC 60664

Pollution Degree. . . . . . . . . . . . . . . . 2 per EN 61010

1.4.12 Storage Temperature

Storage Temperature . . . . . . . . . . . . -10 to 60°C (14 to 140°F)

1.4.13 Warm Up Period

Warm Up Period. . . . . . . . . . . . . . . . None required;

PN 074-505-P1F

For maximum stability allow 5 minutes.

1 - 16

1.4.14 Size

Height-Width-Depth, not including mounts or user connectors

133.4 x 447.7 x 330 mm (5.25 x 17.625 x 13 in.)

Height-Width-Depth including mounts, but no user connectors

133.4 x 482.6 x 330 mm (5.25 x 19 x 13 in.)

1.4.15 Installation Clearance Requirements

1.4.15.1 Connector Clearance

Front . . . . . . . . . . . . . . . . . . . . . . . . . 25 mm (1.0 in.) minimum without USB,

64 mm (2.5 in.) minimum dependent on size of USB storage device

Rear . . . . . . . . . . . . . . . . . . . . . . . . . 100 mm (4.0 in.) minimum

1.4.15.2 Cooling Clearance

Rear . . . . . . . . . . . . . . . . . . . . . . . . . 100 mm (4.0 in.) minimum

IC6 Operating Manual

Sides . . . . . . . . . . . . . . . . . . . . . . . . 7 mm (1/4 in.) minimum

1.4.16 Weight

With all options . . . . . . . . . . . . . . . . . 5.9 kg (13 lb.)

1.4.17 Cleaning

Use a mild, nonabrasive cleaner or detergent taking care to prevent cleaner from entering the IC6.

PN 074-505-P1F

1 - 17

IC6 Operating Manual

1.5 Unpacking and Inspection

1 If the IC6 has not been removed from its shipping container, do so now.

2 Carefully examine the IC6 for damage that may have occurred during shipping.

This is especially important if you notice obvious rough handling on the outside of the container. Immediately report any damage to the carrier and to INFICON.

3 Do not discard the packing materials until you have taken inventory and have

at least performed a power on verification.

4 Take an inventory of your order by referring to your order invoice and the

information contained in section 1.6 on page 1-18.

5 To perform a power-on verification, see section 1.7 on page 1-20.

6 For additional information or technical assistance, contact INFICON, refer to

section 1.3, How To Contact INFICON, on page 1-6.

1.6 Parts and Options Overview

1.6.1 Base Configurations

IC6 Control Unit . . . . . . . . . . . . . . . . 781-500-G1 North America,

Ship Kit. . . . . . . . . . . . . . . . . . . . . . . 781-020-G1 North America,

Operating Manual on CD ROM . . . . 074-505 on 074-5000-G1 CD ROM included

I/O Relay . . . . . . . . . . . . . . . . . . . . . Contains Input/Relay Interface Connectors

1.6.2 Pre-installed Options or Spares

Additional Sensor Module . . . . . . . . 781-132-G1 (up to 3 extra)

The following contain board and interface connector

I/O Relay Card . . . . . . . . . . . . . . . . . 781-122-G1

781-500-G2 Europe

781-020-G2 Europe

in Ship Kit

(8 relay outputs, 14 TTL inputs). Included in Ship Kit.

PN 074-505-P1F

(8 relay outputs, 14 TTL inputs) 781-122-G2 (8 relay outputs, 14 TTL outputs)

1 - 18

DAC Option Board and Kit . . . . . . . . 781-162-G1

Ethernet . . . . . . . . . . . . . . . . . . . . . . 781-102-G2

1.6.3 Optional Accessories

Pneumatic Shutter

Actuator Control Valve . . . . . . . . . . . 750-420-G1

Sensor Emulator Kit . . . . . . . . . . . . . 760-601-G2

Handheld Controller . . . . . . . . . . . . 755-262-G1

Function . . . . . . . . . . . . . . . . . . . Power Increase/Decrease/Stop/

Adapter Cables

IC6 to IC/4 Kit . . . . . . . . . . . . . . . 600-1084-P1 (Relays and Inputs - for IC/4 or

1.6.4 Oscillator Packages

IC6 Oscillator, 15 ft. and 6 in. cable pkg. . . . . . . . . . 781-611-G15

IC6 Oscillator, 30 ft. and 6 in. cable pkg. . . . . . . . . . 781-611-G30

IC6 Oscillator, 50 ft. and 6 in. cable pkg. . . . . . . . . . 781-611-G50

IC6 Operating Manual

Switch Crystal

IC/4 PLUS)

IC6 Oscillator, 100 ft. and 6 in. cable pkg. . . . . . . . . 781-611-G100

4 Meter Oscillator, 15 ft. and 6 in. cable pkg. . . . . . .781-612-G15

4 Meter Oscillator, 30 ft. and 6 in. cable pkg. . . . . . .781-612-G30

4 Meter Oscillator, 50 ft. and 6 in. cable pkg. . . . . . .781-612-G50

4 Meter Oscillator, 100 ft. and 6 in. cable pkg. . . . . .781-612-G100

4 Meter Oscillator, 15 ft. and 20 in. cable pkg. . . . . .781-613-G15

4 Meter Oscillator, 20 ft. and 20 in. cable pkg. . . . . .781-613-G20

4 Meter Oscillator, 50 ft. and 20 in. cable pkg. . . . . .781-613-G50

4 Meter Oscillator, 100 ft. and 20 in. cable pkg. . . . .781-613-G100

PN 074-505-P1F

1.6.5 Sensors

Contact INFICON for a complete listing of sensors.

1.6.6 Replacement Cables

Oscillator to vacuum. . . . . . . . . . . . . 755-257-G6

feedthrough cable, 6 in.

IC6 Unit to Oscillator Cable 15 ft. . . 600-1261-P15

IC6 Unit to Oscillator Cable, 30 ft. . . 600-1261-P30

IC6 Unit to Oscillator Cable, 50 ft. . . 600-1261-P50

IC6 Unit to Oscillator Cable, 100 ft. . 600-1261-P100

1 - 19

IC6 Operating Manual

WARNING - Risk Of Electric Shock

1.7 Initial Power-On Verification

A preliminary functional check of the IC6 can be made before formal installation. It is not necessary to have sensors, source controls, inputs or relays connected to do this. For more complete installation information, refer to Chapter 2, Installation and

Interfaces and to Chapter 12, Maintenance and Calibration Procedures.

There are no user-serviceable components within the IC6 case.

Dangerous voltages may be present whenever the power cord or external input/relay connectors are present.

Refer all maintenance to qualified personnel.

Never interrupt the protective earth circuit.

Any interruption of the protective earth circuit inside or outside the IC6, or disconnection of the protective earth terminal is likely to make the IC6 dangerous.

This symbol indicates where the protective earth ground is connected inside the IC6. Never unscrew or loosen this connection.

PN 074-505-P1F

1 - 20

IC6 Operating Manual

1 Confirm that AC line voltage is supplied and proper for the IC6.

2 Confirm that the back panel (main) AC switch is in the ON position.

3 Press the ON/STBY button on the front panel. A green pilot light should be seen

next to the power switch.

4 The fan at the back of the IC6 should be exhausting air.

5 After the initial temporary boot-up screen which can be viewed in Maintenance

Sys Status, see section 12.8 on page 12-22, the LCD monitor will display an image similar to the one shown in Figure 1-1.

Figure 1-1 Operate Screen

PN 074-505-P1F

1 - 21

IC6 Operating Manual

This page is intentionally blank.

1 - 22

PN 074-505-P1F

2.1 Location Guidelines

CAUTION

Before permanently installing the IC6, read this entire chapter on installation and interfaces and follow its recommendations as closely as possible. INFICON has taken numerous steps to ensure its equipment will operate in a variety of harsh situations. Failure to adhere to these simple practices may adversely affect the performance and longevity of the IC6.

2.1.1 Sensor Types

The choice of sensor type must be dictated by the Process, the deposition material and the physical characteristics of the process chamber. General guidelines for each sensor type produced by INFICON are outlined in the Sensor Data Sheets on the www.inficon.com website. For specific recommendations, consult your INFICON representative.

IC6 Operating Manual

Chapter 2

Installation and Interfaces

The performance of this IC6 depends on the careful installation of the chosen transducer. Improper installation will cause problems with deposition repeatability, crystal life and rate stability.

2.1.2 Sensor Installation

Figure 2-1 shows a typical installation of an INFICON water cooled crystal sensor

PN 074-505-P1F

in the vacuum process chamber. Use the illustration and the following guidelines to install your sensors for optimum performance and convenience.

2 - 1

IC6 Operating Manual

Mounting Bracket

Coax Cable (Routed with Water Tubes)

Or, Customer Supplied Cajon Coupling

Brazing Adapters

Water In

Water Out

XIU (Oscillator)

Instrument Chassis

Source

Source Shutter

Pneumatic Actuator

Source Controller

Source to Sensor 10" Minimum

Sensor Shutter

Air, 80 PSI, 110 PSI Max.

To Sensor Shutter

IPN 750-420-G1

Shutter

Solenoid

Assembly

Figure 2-1 Typical installation

PN 074-505-P1F

2 - 2

IC6 Operating Manual

Correct

Incorrect

Correct

Incorrect

Obstruction

Source

Generally, install the sensor as far as possible from the evaporation source (a minimum of 10 in. (25.4 cm) is recommended) while still being in a position to accumulate thickness at a rate proportional to accumulation on the substrate.

Figure 2-2 shows proper and improper methods of installing sensors.

Figure 2-2 Sensor installation guidelines

PN 074-505-P1F

To guard against spattering, use a source shutter or crystal shutter to shield the crystal during the initial soak periods. If the crystal is hit with even a minute particle of molten material, it may be damaged and stop oscillating. Even in cases when it does not completely stop oscillating, it may become unstable. Follow these precautions:

 Mount the sensor to something rigid and fixed in the chamber. Do not rely on

the water tubes to provide support.

 Plan the installation to insure there are no obstructions blocking the path

between the sensor and the source. Be certain to consider rotating or moving fixtures.

 Install sensors so their central axis (an imaginary line drawn normal to the

center of the crystal face) is aimed directly at the virtual source being monitored.

 Be sure there is easy access for the exchange of crystals.

 For systems employing simultaneous source evaporation (co-deposition), try to

locate the sensors so the evaporant from each source is flowing to only one sensor. It is not generally possible to do this without special shielding or optional “material directors”.

2 - 3

IC6 Operating Manual

2.1.3 IC6 Installation

The IC6 is designed to be rack mounted. It may be also used on a table. The IC6 is forced-air cooled, with the air flow exiting the rear of the IC6 for clean room convenience.

It is generally advisable to centrally locate the IC6, minimizing the length of external cabling. The cable from the Sensor card to the XIU is typically fifteen feet. Thirty, fifty and one hundred foot cables are available.

2.2 Avoiding Electrical Interference

Careful consideration of simple electrical guidelines during installation will avoid many problems caused by electrical noise.

To maintain the required shielding and internal grounding and ensure safe and proper operation, the IC6 must be operated with all enclosure covers, sub-panels and braces in place and fully secured with the screws and fasteners provided.

NOTE: When using the IC6 with an RF sputtering system, the cable between the

IC6 and oscillator should be kept as far away from the RF transmission cable as possible. Interference from the RF transmission cable may cause an erroneous crystal fail.

2.2.1 Verifying/Establishing Earth Ground

If a ground must be established, the following procedure is recommended:

 Where soil conditions allow, drive two ten foot copper clad steel rods into the

ground six feet apart. Pour a copper sulfate or a salt solution around each rod to improve the ground’s conduction. A near zero resistance measurement indicates earth ground is achieved.

 Keep connections to this grounding network as short as possible.

PN 074-505-P1F

2 - 4

2.2.2 Connections to Earth Ground

WARNING - Risk Of Electric Shock

CAUTION

There are two required earth ground connections:

 The earth ground connection on the IC6 is a threaded stud with a hex nut.

Connect a ring terminal to the ground strap, thus allowing a good connection and easy removal and installation. This connection must be made at installation. For best protection against high frequency noise, the length-to-width ratio of the earth conductor should not exceed 5:1 See Figure 2-3 for the suggested method of grounding.

 This IC6 is also connected to earth ground via a sealed three-core power cable,

which must be plugged into a socket outlet with a protective earth ground terminal. Extension cables must always have three conductors including a protective earth ground conductor.

Never interrupt the protective earth ground intentionally. Any interruption of the protective earth ground connection inside or outside the IC6 or disconnection of the protective earth ground terminal is likely to make the IC6 dangerous.

IC6 Operating Manual

This symbol indicates where the protective earth ground is connected inside the IC6. Never unscrew or loosen this connection.

PN 074-505-P1F

An external earth ground connection is required to ensure proper operation, especially in electrically noisy environments.

When used with RF powered sputtering systems, the grounding method may have to be modified to the specific situation. An informative article on the subject of Grounding and RFI Prevention was published by H.D. Alcaide, in “Solid State Technology”, p.117, April, 1982.

2 - 5

IC6 Operating Manual

Back Panel

Ground

Stud

Earth

Ground

Transducer Feedthrough

Vacuum System

In many cases, a braided ground strap is sufficient. However, there are cases when a solid copper strap (0.030 in. thick and 1 in. wide) is required because of its lower RF impedance.

Figure 2-3 System grounding diagram

2.2.3 Minimizing Noise Pickup From External Cabling

When a IC6 is fully integrated into a deposition system, there can be many wire connections, each a potential path for electrical noise to reach the inside of the IC6. The likelihood of these wires causing a problem can be greatly diminished by adhering to the following guidelines.

 Use shielded coax cable or twisted pairs for all connections.

 Minimize cable lengths.

 Avoid routing cables near areas that have the potential to generate high levels

of interference. For example, large power supplies such as those used for electron beam guns or sputtering sources can be a source of large, rapidly changing electromagnetic fields. Placing cables as little as one foot away from these problem areas can significantly reduce noise pickup.

 Be sure that a good ground system and straps are in place per the

recommendations in section 2.2.2 on page 2-5.

 Ensure that all IC6 covers and option panels are in place and tightly secured

with the provided fasteners.

NOTE: Always use shielded cables when making connections to the IC6 rear

panel to minimize electrical noise pickup.

PN 074-505-P1F

2 - 6

2.3 Connecting the Controller

WARNING - Risk Of Electric Shock

The operation of the IC6 depends on the proper connection of power and signal interfaces to owner equipment and sources.

This IC6 has line voltage present on the primary circuits whenever it is plugged into a mains power source.

Never remove the cover from the IC6 during normal operation.

There are no operator serviceable items within this IC6.

Removal of the cover must be done only by a technically qualified person.

In order to comply with accepted safety standards, the IC6 must be installed into a rack or system which contains a mains switch. This switch must break both sides of the line when it is open and it must not interfere with the safety earth ground.

IC6 Operating Manual

The IC6 is initially powered by AC line current. The line voltage provided in your facility must be within the voltage range of 100-230 V (ac) +/-15% V (ac).

2.3.1 Routing XIU Cables

The signals traveling on this cable are both analog and digital. It is suggested that it not be routed near areas with high levels of electromagnetic interference, even if its length must be somewhat increased.

PN 074-505-P1F

2.3.2 Interface Cable Fabrication and Pin-Out

It is necessary to fabricate several cables in order to interface the IC6 to the deposition system. Refer to section 2.2.3, Minimizing Noise Pickup From External

Cabling, on page 2-6.

2.3.2.1 Source Control Connection

Six digital to analog (DAC) outputs are provided as standard equipment with the IC6. These standard 6 DAC channels with BNC connectors and six optional DAC outputs on a 15 pin sub-D connector may be programmed for source control or chart recorder functions as desired.

2 - 7

IC6 Operating Manual

2.3.2.2 Crucible Indexer Connections

Example: 4 pocket crucible using outputs 6 and 7

Number of crucibles = 4

Crucible output = 6

For this example, wiring to the controller is based on Table 2-1. Only relays 6 and 7 are needed to encode the four possible positions.

Table 2-1 Wiring to the controller

Crucible Position Contact Status

Relay #6 Relay #7

1 Open Open

2 Closed Open

3 Open Closed

4 Closed Closed

2.3.2.3 DAC Option Kit 781-504-G1

An optional Digital to Analog Converter (DAC) card can be installed into the IC6. This card provides six additional DAC outputs, numbered 7 through 12, for Thickness and/or Rate as determined by the DAC Output Option parameters. The pin assignments for DAC outputs 7 through 12 are shown in Table 2-2.

Table 2-2 Optional DAC pin assignments

Output

Number

7 1, 6 (GND)

8 2, 7 (GND)

9 3, 8 (GND)

10 4, 9 (GND)

11 5, 10 (GND)

12 11, 12 (GND)

A mating connector is included with the DACoption

PN 074-505-P1F

2 - 8

2.3.2.4 I/O Expansion Options

WARNING - Risk Of Electric Shock

One I/O Relay module is included as standard equipment with the IC6 and is used to interface with other machinery of the vacuum system. It can control components such as heaters, rotators or shutters through its 8 relays. It can respond to external instructions through its 14 isolated input lines. Standard equipment provides 8 relays and 14 input lines. Optionally, this can be expanded to 24 relays, 28 TTL inputs, and 14 open collector type outputs with the addition of another Relay I/O module 781-502-G1 and a TTL Relay module 781-503-G1 having 8 relays and 14 TTL open collector outputs.

The module provides separate connectors for relay outputs and input lines. A 25-pin D-sub, male connector is used for the eight relays. A 15-pin D-sub, male connector is used for the input lines. Mating connectors are provided in ship kits IPN 781-502-G1 and 781-503-G1. Refer to Figure 3-2 on page 3-3 for connector locations and Table 2-3 on page 2-10 for connector pin assignments. Relay connections are rated at 30 V (dc) or 30 V (ac) RMS or 42 V (peak) maximum; 2.5 A maximum.

Inputs are activated by pulling the specific input terminal to ground (<0.8 V) through a contact closure to common (GND) or with TTL/CMOS Logic having current sink capability of 2 mA (1 low power TTL load).

IC6 Operating Manual

The relay, relay circuit, and associated pins in the I/O connector(s) have a maximum voltage rating of 30 V (dc) or 30 V (ac) RMS or 42 V (peak). The maximum current rating per connector pin or relay contact is 2.5 Amps.

PN 074-505-P1F

2 - 9

IC6 Operating Manual

Table 2-3 Input/Relay pin connections

I/O Board #1 I/O Board #2

Relay # Pins TTL

Input #

17, 6 1 15 97, 6 1515 2 9, 8 2 14 10 9, 8 16 14 3 11, 10 3 13 11 11, 10 17 13 4 13, 12 4 12 12 13, 12 18 12 5 5, 4 5 11 13 5, 4 19 11 6 3, 2 6 10 14 3, 2 20 10 7 1, 14 7 9 15 1, 14 21 9 8 15, 16 8 8 16 15, 16 22 8

97 237 10 6 24 6 11 5 25 5 12 4 26 4 13 3 27 3 14 2 28 2

GND 1 GND 1

Pin Relay # Pins TTL

Input #

I/O Board #3

Relay # Pins TTL

Output #

17 7, 6 25 9 18 9, 8 26 10 19 11, 10 27 11 20 13, 12 28 12 21 5, 4 29 13 22 3, 2 30 14 23 1, 14 31 15 24 15, 16 32 1

33 2 34 3 35 4 36 5 37 6 38 7

GND 8

PN 074-505-P1F

2 - 10

2.3.2.5 RS-232C Communications

RS-232C serial communication is included in the IC6 as standard equipment. It can be used to remotely control or monitor the IC6. An industry standard 9-pin D-Sub connector is required for the host computer side connection. Depending on the computer source, all connections may not be necessary. The length of the cable is limited to fifty feet according to published standards. The IC6 interface operates as DCE (Data Communication Equipment). Pin assignments are for the IC6 connector.

Table 2-4 RS-232C pin connections

Signal Name Pin EIA Name

TX Transmit Data 2 BA

RX Receive Data 3 BB

SG Signal Ground 5 AB

GND Shield Ground 1

IC6 Operating Manual

PN 074-505-P1F

2 - 11

IC6 Operating Manual

CAUTION

2.3.2.6 Isolated +24 V (dc) Supply

An isolated +24 V (dc) power supply is available on a 9-pin D-Sub connector on the IC6 back panel. This supply is rated for 1.75 A maximum.

The pin assignments for this connector are shown in Table 2-5.

Table 2-5 +24 V (dc) pin connections

Pin Function

1 Return

2 Return

3 Return

4 Not Connected

5 Not Connected

6+24 Volts

7+24 Volts

8+24 Volts

9 Not Connected

Both the isolated 24 V (dc) supply and the RS-232C remote communications port use a 9-pin D-sub connector. Care must be taken not to inadvertently connect the RS-232C remote communications cable to the 24-volt supply connector. Also, care must be taken not to inadvertently connect the 24 V (dc) supply cable to the RS-232C remote communications connector.

PN 074-505-P1F

2 - 12

3.1 Front Panel Controls

234

1110987

Operational controls for the IC6 are located on the front panel, see Figure 3-1.

Figure 3-1 IC6 front panel

IC6 Operating Manual

Chapter 3

Operation

1 LCD Screen

Provides graphical displays, setup menus, status and error messages.

2 HELP and PRINT Function Keys

The HELP key brings up context-related text. The PRINT key sends the LCD screen content to the USB storage device.

3 Data Entry Keys

PN 074-505-P1F

A keypad array with numerics 0 through 9 with telephone-style assigned letters for parameter entry. All numeric entries need to be followed by ENTER. CLEAR is used to erase data entry errors. If an illegal value has been entered, CLEAR will erase the error message and re-display the last valid data. Pressing TOGL moves through selection options such as Yes or No or others such as sensor types. Pressing ENTER continues with the selected choice.

4 System Switches

An array of three keys that provide START, STOP and RESET for process control.

5 Handheld Controller Mount

Tapped hole for attaching support bracket.

3 - 1

IC6 Operating Manual

6 F1, F2, F3, F4 Function Keys

The function keys. They are used to select displays or menu items. Their function is indicated on the display and is described in subsequent sections.

7USB

Receptacle for a storage device.

8 Remote Control Jack

Receptacle for the optional wired Handheld Controller (IPN 755-262-G1). For more information on the Handheld Controller, see section 3.6.6 on page 3-41.

9 Cursor Keys

An array of five keys used to move the display cursor either up, down, left or right. The MENU key is used to navigate through the IC6 displays. The keys auto-repeat; the cursor will continue to move as long as the key is held down.

10 Power

This switch controls secondary power to the IC6 between ON and STANDBY.

11 Pilot Light

A green light, adjacent to the power switch, illuminated when power is on.

PN 074-505-P1F

3 - 2

3.2 Rear Panel Interfaces

123 945678 10 11 12

151413

Interfaces for the IC6 are located on the rear panel, see Figure 3-2.

Figure 3-2 IC6 rear panel

IC6 Operating Manual

1 Ground Stud

Refer to section 2.2.2, Connections to Earth Ground, on page 2-5.

2 AC Power Inlet, Fuse & Mains Switch

Provides a common connector for international plug sets.

3 8 Relay x 14 Input I/O Card (standard)

Provides pin connection for 8 Relays rated for 30 V (dc) or 30 V (ac) RMS or 42 V (peak) maximum, and 14 TTL inputs.

4 8 Relay x 14 Input I/O Card (optional)

Provides pin connection for 8 relays rated for 30 V (dc) or

PN 074-505-P1F

30 V (ac) RMS or 42 V (peak) maximum, and 14 TTL inputs.

5 8 Relay x 14 Output I/O Card (optional)

Provides pin connection for 8 relays rated for 30 V (dc) or 30 V (ac) RMS or 42 V (peak) maximum, and 14 open collector type outputs.

6 Sensor Connectors - Channels 1 & 2 (standard)

Provides connection for two sensor channels

7 Sensor Connectors - Channels 3 & 4 (optional)

Expansion panel to accommodate the optional addition of two more sensors, sensors 3 & 4.

3 - 3

IC6 Operating Manual

8 Sensor Connectors - Channels 5 & 6 (optional)

Expansion panel to accommodate the optional addition of two more sensors, sensors 5 & 6.

9 Sensor Connectors - Channels 7 & 8 (optional)

Expansion panel to accommodate the optional addition of two more sensors, sensors 7 & 8.

10 TCP/IP Connector (Optional)

Provides connections for TCP/IP interface.

RS-232C Remote Communication Connector (standard)

Provides a 9-pin RS-232C communications port.

11 For future expansion options

12 6-Channel DAC (optional)

Provides recorder output for six channels (15 pin miniature D-sub connector). Outputs are programmable for recorder function.

13 Fan Outlet

Exhaust opening for the IC6’s miniature fan; Do not block!

14 24-Volt Supply (standard)

Provides three 24 V (dc) supplies rated at 1.75 Amps. See Table 2-5 on page

2-12.

15 6-Channel DAC (standard)

Provides source control voltage or recorder output for 6 channels (BNC connectors). Outputs are programmable for Source Control or Recorder Voltage.

PN 074-505-P1F

3 - 4

3.3 Displays

The IC6 has many display screens for monitoring and programming processes. The six main types of displays are: Operate, Sensor, Source, Material, Process, and General.

To move from one display to another, use the cursor and MENU keys. Figure 3-3 provides an overview of the Main Menu display hierarchy. Figure 3-4 provides an overview of the Operate display hierarchy.

To maximize the life of the display, it can be set to turn off after a period of 1 to 99 minutes without a key press. See section 7.9, AUDIO / VISUAL Page Set Up, on

page 7-10. Pressing a key before the dimmer time elapses resets the dimmer

interval to start over. The default setting of 0 disables the dimmer function. When the display is dimmed, the START, RESET and STOP keys remain active. To restore the display to full brightness without stopping or starting the instrument, do not press the STOP or START key.

3.3.1 Main Menu Display

From the Main Menu screen, see Figure 3-3, move to any IC6 display by positioning the cursor to highlight the desired display and press the MENU key. A second pressing of the MENU key returns to the Main Menu display.

IC6 Operating Manual

Figure 3-3 Main menu

PN 074-505-P1F

3 - 5

3.3.2 Operate

Crystal x

The Operate display, see Figure 3-4, provides information about the current layer(s) in process. This includes the layer #, material, source #, and sensor # currently in process. The rate, thickness, power level, state, state time, layer time, and process time are updated once a second.

The graph gives an analog display of the Power% level or the rate deviation from the desired rate while depositing. With the cursor on the upper Y-axis value, use the TOGL key to choose Rate Deviation or Power% graphing. Similarly, with the cursor on the X-axis label, use the TOGL key to choose the desired Graph Scan Rate.

Below the graph is a message area consisting of five lines. The Status Messages area, see section 15.1, occupies the first four lines. Transient Messages, see

section 15.5 and Input Error Messages, see section 15.6, share the fifth line. This

area displays error messages, custom user messages and system status information, such as indicating the IC6 is in Test mode. Status messages are displayed as long as a status is true. They are put up and taken down as the condition that set them changes. Since there is limited space for the status messages, if too many status messages are displayed at the same time (greater than 4), newer messages will be displayed if they are cleared, the old messages will appear again assuming the condition is still applicable.

IC6 Operating Manual

Figure 3-4 Operate screen

PN 074-505-P1F

3 - 6

IC6 Operating Manual

Operate Display Description

1 Aggregate Rate

2 Layer Thickness

3 Power Level

4 State of Layer

5State Timer

6 Layer Currently In Process

7 Layer Timer

8 Material Being Deposited

9 Source Number In Use

10 Sensor Number(s) In Use

11 Crystal Position In Use

12 Graphical Display of Rate Deviation or Power

13 Process Being Executed & Process Time

14 Run Number

15 Date and Time

16 Message Area

17 Function Key Definitions

18 Crucible Position

During the OPERATE display, the function keys below the screen function as explained in Table 3-1.

Table 3-1 Operate display function keys

Key Function Description

PN 074-505-P1F

F1 ZERO

THICKNESS

F2 TOGGLE

MANUAL

F3 SHOW ALL

LAYERS/

SHOW GRAPH

Pressing F1 resets the displayed thickness of the current layer and the sensor thickness values to zero.

Press F2 to put the layer in manual control so that the power level is controlled by the Handheld Controller (section 3.6.6). When in Manual, press F2 again to remove the layer from the Manual state and place it into the DEPOSIT state.

Press F3 to toggle between showing all layers (if more are running) or showing only one layer

In addition to the standard operational screen, if the system is configured for co-deposition, or multi-layer deposition, the operational screen will be divided to show information for all layers as shown in Figure 3-5, Figure 3-6 or Figure 3-7.

3 - 7

IC6 Operating Manual

Figure 3-5 Co-deposition operate display

Figure 3-6 4 layer display

PN 074-505-P1F

3 - 8

Figure 3-7 6 layer display

IC6 Operating Manual

3.3.3 Sensor Information

3.3.3.1 Sensor Information Rate/Xtal Display Description

NOTE: N/A (not available) will be displayed in these fields for diabled features or

for sensors not in use.

Figure 3-8 Rate/Xtal display

PN 074-505-P1F

3 - 9

IC6 Operating Manual

Sensor (Number field)

These numbers correspond to the sensor connector channel numbers on the rear panel of the IC6. Use the cursor keys to position the box cursor over the desired sensor number. When either Switch Crystal, Rotate Sensor, Clear S & Q Counts, or Clear Failed Crystals is pressed, that function will be performed on the sensor indicated by the box cursor if the IC6 is in Ready, Stop or all active layers are in Idle or Suspend. Text will only be shown for installed cards, unless you are in TEST.

Average Rate

This average is calculated based on a 1 second average of the Filtered Rate.

Raw Rate

Shows the instantaneous rate measurement. The rate fields are useful in identifying if a sensor’s rate measurements are becoming erratic.

% Life

The IC6 allows a 1.5 MHz frequency shift on the monitor crystal corresponding to 100% crystal life. The value shown represents the amount of crystal life consumed. The amount of useful crystal life is highly dependent on the nature of the material being deposited as well as deposition conditions.

Crystal

This field is subdivided into three categories; current position (Curr), next position (Next), and Failed. Information is displayed in these fields only if the sensor has more than one position.

Curr: For a XtalTwo sensor, the Curr field will show either 1 or 2. 1 indicates the active crystal of the dual sensor head. 2 indicates the inactive (shuttered) crystal of the dual sensor head. For a multi-position sensor, the Curr field indicates the current position of the sensor head.

Next: The Next field indicates the position to which the sensor head will rotate upon pressing the CrystalSwitch function key.

Failed: The Failed field indicates the sensor head positions containing failed crystals.

Q Count (Crystal Quality value field)

This field displays the value currently accumulated in the Crystal Quality counter when active. Delay indicates the Crystal Quality counter is not active. The Crystal Quality counter will become active five seconds after entering DEPOSIT and if the Crystal Quality parameter is non-zero, see page 5-11.

S SIngle (Crystal Stability value field)

PN 074-505-P1F

3 - 10

This field displays the positive single frequency shift currently in the Crystal Stability counter, see page 5-12.

S Total (Crystal Stability value field)

This field displays the positive total frequency shift currently accumulated in the Crystal Stability counter, see page 5-12.

3.3.3.2 Crystal Life and Starting Frequency

On the Sensor Information RATE/XTAL display, crystal life is shown as a percentage of the monitor crystal’s frequency shift, relative to the 1.50 MHz frequency shift allowed by the IC6. This quantity is useful as an indicator of when to change the monitor crystal to safeguard against crystal failures during deposition. It is normal to change a crystal after a specific amount of crystal life (% change) is consumed.

It is usually not possible to use a monitor crystal to 100% of crystal life. Useful crystal life is dependent on the type of material being deposited and the resulting influence of this material on the quartz monitor crystal. For well-behaved materials, such as copper, at about 100% crystal life the inherent quality, Q, of the monitor crystal degrades to a point where it is difficult to maintain a sharp resonance and therefore the ability to measure the monitor crystal’s frequency deteriorates.

IC6 Operating Manual

When depositing dielectric or optical materials, the life of a gold, aluminum or silver quartz monitor crystal is much shorter— as much as 10 to 20%. This is due to thermal and intrinsic stresses at the quartz-dielectric film interface, which are usually exacerbated by the poor mechanical strength of the film. Many organic materials deposit as non-rigid films which causes the crystal’s Q to fall rapidly. For these materials, the %Life of the quartz has very little to do with the monitor crystal’s failure.

3.3.3.3 Percent Life Auto-Zero

If a new crystal has a starting frequency above 5.945 MHz and is more than

0.04 MHz different from the last valid crystal reading, its % Life will be set to 0. This facilitates using crystals to a uniform known % Life point without wasting usable crystal life. In all cases, reaching 4.50 MHz results in a crystal life fail even though

PN 074-505-P1F

% Life may not have reached 100%. For example, a crystal with a starting frequency of 5.95 MHz will have a % Life reading of 97% when it reaches 4.5 MHz.

3 - 11

IC6 Operating Manual

3.3.3.3.1 Function Key Selection Choices for the Sensor Information Rate/Xtal Display

To enable the function keys, move the cursor key to a Sensor number.

F1 Switch Crystal

To initiate a crystal switch for the sensor number selected, press F1. The crystal switch will be done on the sensor indicated by the box cursor. Use the cursor arrow keys to position the box cursor.

F2 Rotate Sensor

If the sensor number chosen is a XtalSix, Xtal12 or Generic sensor type, press F2 to sequentially rotate the sensor head through all positions. This is useful to initialize a multi-position sensor after replacing failed crystals. The action is taken on the sensor indicated by the box cursor if the IC6 is in Ready, Stop or all active layers are in Idle or Suspend. Failed crystal numbers are shown in the Failed column under Crystal.

Generic Sensor Status showing which crystals are good and which are failed relative to the current position is displayed in the bottom region of the table. This information is not retained upon leaving the Sensor Information display. To re-gain this information, press F2 again.

F3 Clear S & Q Counts

Press F3 to clear the Quality and Stability counters for the sensor chosen by the box cursor.

F4 Clear Failed Crystals

Pressing F4 resets the status of the sensor that the box cursor is on for failed sensors and crystal positions.

PN 074-505-P1F

3 - 12

3.3.3.4 Sensor Information Type/Freq Display Description

Figure 3-9 Type/Freq display

IC6 Operating Manual

Sensor

Sensor identifies the sensor channel. Failed sensor numbers appear in red.

Sensor Type

Shows the sensor type configured for the sensor channel.

Z-RATIO

This two-column field displays the type and value of the Z-Ratio being used for the given sensor. Three Z-Ratio types are possible: Matl, Auto and Sens.

Matl indicates the Z-Ratio being used for thickness calculation is the value found in the Material parameter Z-Ratio. If the Auto-Z parameter is set to No in the Sensor menu, the Z-Ratio Type displayed on the Sensor Information screen

PN 074-505-P1F

will always be Matl.

Auto indicates the Auto-Z parameter in the Sensor menu is set to Yes. Auto-Z continually calculates the Z-Ratio for the "as deposited" film. If the IC6 suddenly lost the ability to calculate Auto-Z, Auto would change to either Matl or Sens. Matl has the same meaning as described above,

Sens indicates the last calculated Auto-Z value (prior to failure) is used for thickness calculations for this sensor.

The IC6 determines to use Matl or Sens depending on the frequency of the fundamental resonance. If the fundamental frequency closely matches the last valid fundamental frequency prior to Auto-Z failure, the IC6 will use the Sens value. Otherwise the IC6 will use the Matl value.

3 - 13

IC6 Operating Manual

Act(ivity)

Activity is a measure of the sensor circuit health or ability to conduct current. The values range from a maximum of 800 (healthiest) to a minimum of 0 (least healthy).

The Activity value is useful for predicting when a crystal needs to be replaced. If a crystal is about to fail, its series resistance will increase, allowing less current to flow through the crystal and hence the Activity value will decrease. The closer the Activity value is to zero the more imminent a crystal failure.

Activity also can be used to gauge the health of the sensor head electrical contacts. For example, if a new monitor crystal is placed into the sensor head and has a crystal life of near 0%, but the Activity value for this crystal is lower than 550, this indicates the sensor head or in-vacuum cable is in need of repair.

Frequency

This field is subdivided into two categories: Fundamental and Anharmonic.The Fundamental frequency will be shown for all working

sensors. If Auto-Z is in effect for the sensor, the Anharmonic frequency will also be shown. Frequency value will be displayed.

3.3.3.4.1 TEST XIU

To test any XIU (Crystal Interface Unit), move the cursor onto the respective Sensor number. Pressing F1 then initiates the XIU self test. The XIU self test determines whether the XIU and measurement card pair is operating properly. "XIU Test Passed" message will appear to indicate this. "XIU Test Failed" message will appear when there is a defect in the XIU itself, the XIU interface cable or the measurement card.

For the XIU self test to work properly, the XIU must have the six inch BNC cable (IPN 755-257-G6) attached and must be disconnected from the sensor feedthrough.

3.3.4 Sensor Screen

From the main MENU display, placing the cursor on Sensor and pressing MENU brings up the Sensor display.

The Sensor Overview display, see Figure 3-10, shows the current configuration for all eight sensors.

PN 074-505-P1F

3 - 14

Figure 3-10 Sensor overview display

IC6 Operating Manual

Moving the cursor onto one of the sensor numbers and pressing F1 Select Sensor brings up the Sensor display

See section 4.1.2, Sensor Parameters, on page 4-2 for programming details.

PN 074-505-P1F

3 - 15

3.3.5 Source

The Source Overview display, see Figure 3-11, shows the current configuration for all six sources.

Figure 3-11 Source overview display

IC6 Operating Manual

Once the right cursor key has been used to move to one of the six sources, the Select Source function key will appear. Pressing F1 will then display the source’s parameter screen.

The Source display allows configuring the selected source.

See section 4.2.2, Source Parameters, on page 4-5 for programming details.

PN 074-505-P1F

3 - 16

3.3.6 Material

This display is organized into eight sub pages accessible thru the Select Menu described below.

See Chapter 5, Material Setup for programming details and screen displays.

3.3.6.1 Overview Page

The Material Overview display, see Figure 3-12, shows all 32 available materials. Materials are initially shown as Material 1 to Material 32. Once a chemical formula or other name has been assigned, that name will be shown. See section 5.1.2,

Material Definition, on page 5-2

Figure 3-12 Material overview page

IC6 Operating Manual

3.3.6.2 Source Page

PN 074-505-P1F

The Material Source page allows entering or editing Density, Z-Ratio, Control Loop type and associated control loop parameters. One of the six Source BNC analog control outputs is selected and the operating limits for that output such as Min. and Max Power are defined here. If desired, a Recorder Output (one of the unused standard six or optional additional six analog outputs) can be selected for Rate, Thickness, Rate Deviation or Power and the full scale Range value selected. See

section 5.1.3, Material Screen Source Page Parameters, on page 5-3.

3.3.6.3 Sensor Page

The Material Sensor page, see Figure 3-13, allows selecting the Tooling factor and which sensor (Multipoint Yes/No) or group of sensors (up to eight) is used or are to be averaged together to control the deposition rate and final thickness for the

3 - 17

IC6 Operating Manual

material. If Multipoint is set to No, a Backup Sensor and its Tooling factor can be specified. Other choices will be shown according to the Sensor Type. If the sensor is a XtalTwo, the Tooling factor for the secondary crystal can be specified. In the case of a multi-position rotary sensor head, the range of crystal positions to use can be specified.

In addition, Quality and Stability settings are available to force a crystal switch to a backup crystal or sensor when the primary crystal starts to become unstable.

Cal Thickness can be used to manually enter correction factors to subtract crosstalk when multiple materials are being co-deposited. After performing the Cross Talk calibration procedure entered from the Main Menu/Maintenance screen, the correct values will be imported here and shown. See section 5.1.4 on

page 5-6.

Figure 3-13 Material sensor page

3.3.6.4 Pre/Post Page

Up to three pre-deposition phases with rise times, power levels and soak times can be specified. Also, Auto Soak 2 can be enabled as well as Shutter or Control Delay. See section 5.1.5, Pre/Post Screen Deposit Page Parameters, on page 5-12.

3.3.6.5 Deposit Page

Set the desired deposition rate, Time Limit, Rate Filter Time, Time Power Avg Time, Ion Assist Deposit, and the state to enter after reaching Final Thickness.

Two new rates can be specified while in Deposit and RateWatcher can be enabled.

See section 5.1.7, Deposit Page Parameters, on page 5-16.

3 - 18

PN 074-505-P1F

3.3.6.6 Lib A-Hf, Lib Hf-Sc, Lib Sc-Z Sub-Displays

These three libraries allow convenient selection of a material by its chemical formula along with the correct density and Z-Ratio values. Cursor to a Material formula, then press F1 Define Material to select that material. The Material/Source display will be shown where the remaining parameters can be entered. See section

5.1.2, Material Definition, on page 5-2.

3.3.7 Process

This display is organized into three pages described below. See Chapter 6,

Process Setup, for programming detail and page displays.

3.3.7.1 Overview Page

The Process Overview display, see Figure 3-14, shows all 50 processes. Processes with layers are identified by an > preceding the process name. Cursoring to a Process and selecting it with F1 displays the layer sequence in the process. Cursoring to a Process and pressing F2 makes that Process the active Process. This process’ layer sequence will be executed when a Start is activated.

IC6 Operating Manual

Figure 3-14 Process overview display

PN 074-505-P1F

Press F4 to clear a Process of all programmed values. Move the cursor to a Process to be cleared.

Press F4 Default Process. This will set the Process parameter values, including its name, to their default values as well as remove all layers from the process.

3 - 19

IC6 Operating Manual

3.3.7.2 Current Process

The Curr(ent) Proc(ess) display, see Figure 3-15, shows the layer sequence for the last process edited, not necessarily the Active Process. A 15 character name can be entered here by cursoring to the Name and using the keys in cell phone style to enter characters and numbers. See section 6.3, Curr(ent) Proc(ess) Page, on page

6-2.

Figure 3-15 Current process display

3.3.7.3 1 - 10, 11 - 20 etc. Screen

This screen shows the programmed layers in groups of 10. Layer parameters Final Thick(ness), Thick Limit, Cruc(ible) number, CoDep (Yes/No) and related parameters are entered here. With the cursor in the Material # column, enter the material number to use for the first layer. To add to the layer sequence, with the cursor in the Material # column use the down arrow key to move to the empty line and enter the material number to use for that layer. See section 6.4, Process

Layers 1 - 10 etc., on page 6-3.

3.3.8 General

The General Process screen is organized into eight sub screens described below.

See Chapter 7, General Parameters for programming details and screen displays.

3.3.8.1 Process Page

The Process page shows global parameters and allows editing them.

PN 074-505-P1F

3 - 20

Figure 3-16 Process page

IC6 Operating Manual

Active Process . . . . . . . . . . . . . . . . specify which of the 50 processes to execute.

Layer To Start . . . . . . . . . . . . . . . . . when Start is initiated, this layer # will be

executed.

Source DAC Required . . . . . . . . . . specifies whether a Source DAC is required

for a layer to be active.

Auto Start Next . . . . . . . . . . . . . . . . start the next layer when a layer reaches Idle.

Max Concurrent Layer . . . . . . . . . . set to 1 to prevent accidental double Starts.

Layers Displayed . . . . . . . . . . . . . . maximum number of layers displayed on the

Operate screen.

Active Layer Output . . . . . . . . . . . . specify the first of 8 consecutive outputs to

indicate the number of the layer that will be

PN 074-505-P1F

executed when Start is executed. If multiple layers are active, the outputs will only indicate the lowest numbered one.

Run Number . . . . . . . . . . . . . . . . . . increments at the start of a process.

Thickness Eq 1, 2 and 3. . . . . . . . . allows summing of thicknesses from up to 6

sources for use in conjunction with a logic statement Thick Sum event.

See section 7.2, General Screen Process Page, on page 7-1

3 - 21

IC6 Operating Manual

3.3.8.2 DACs Page

Polarity and full scale voltage for all DAC outputs are configured here. 0 output corresponds to 0 Volts. See section 7.3, DACs Page Parameters, on page 7-3.

3.3.8.3 Comm Page

Datalogging of crystal data is enabled here and RS232 and optional Ethernet parameters are entered.

 Datalog Xtal Info

 RS232 / Baud Rate/ Protocol

 Ethernet / IP Address/ Net Mask

See section 7.4, COMM Page Parameters, on page 7-4.

3.3.8.4 Message Page

Ten messages of up to 19 characters each can be entered. Display of messages can be turned on and off using Logic statements.

See section 7.5, MESSAGE Page Setup, on page 7-6.

3.3.8.5 Date/Time Page

Toggle between date formats and enter the current date and time.

Date Format . . . . . . . . . . . . . . . . . . . Calendar / Day / Month / Year

System Time . . . . . . . . . . . . . . . . . . See section 7.6, DATE / TIME Set Up, on

3.3.8.6 Test Page

Allows executing the programmed layer sequence with a dummy rate signal.

Test. . . . . . . . . . . . . . . . . . . . . . . . . . On/Off

Time Compressed . . . . . . . . . . . . . . No/Yes to speed up all times by factor of 10

Advanced Test . . . . . . . . . . . . . . . . . On/Off. Responds to crystal failures in "On"

See section 7.7, TEST Page Set Up, on page 7-8.

3.3.8.7 Lock Page

Allows setting lock codes to prevent parameter changes or file access.

Program Lock Code / File Access Code

page 7-7.

PN 074-505-P1F

mode.

3 - 22

See section 7.8, LOCK Page Code Setup, on page 7-9.

3.3.8.8 Audio/Visual Page

Audio Feedback: turns key beep on or off.

LCD Dimmer Time: 0 disables, sets time in minutes for screen to be turned off after no keys pressed.

See section 7.9, AUDIO / VISUAL Page Set Up, on page 7-10.

3.3.9 Digital I/O

The Digital I/O displays show configuration of all inputs, see Figure 3-17, and outputs, see Figure 3-18, and allows configuring inputs and outputs on the three possible I/O boards.

See Chapter 8, Digital I/O for programming details.

Figure 3-17 All inputs display

IC6 Operating Manual

PN 074-505-P1F

NOTE: On All Input and All Output pages, active inputs and outputs are displayed

in a standard font. Inactive inputs and outputs are displayed in a shadow font.

3 - 23

IC6 Operating Manual

Figure 3-18 All outputs display

3.3.10 Logic

100 logic statements can be set up. Logic statements are evaluated sequentially, 10 times per second, while the IC6 is powered up.

See Chapter 9, Logic Statement Setup for programming details.

3.3.11 Maintenance

The Maintenance display is organized into four subscreens: Auto Tune, Cross Talk, Source Maint(enance)and Sys(tem) Status.

See Chapter 12, Maintenance and Calibration Procedures for programming details.

3.3.12 Counter / Timer

See Chapter 13, Counters & Timers.

3.3.13 USB Storage

Config. . . . . . . . . . . . . . . . . . . . . . . . allows saving and retrieving configuration

PN 074-505-P1F

files to and from the USB storage device.

3 - 24

Datalog. . . . . . . . . . . . . . . . . . . . . . . shows datalog files on USB storage device.

Screen Shot . . . . . . . . . . . . . . . . . . . shows Print files on USB storage device.

See Chapter 14, USB Storage.

3.4 Process Description

The IC6 allows sequential deposition control for a maximum of 200 layers in all of its 50 processes. Up to six layers can be started and rate controlled at the same time. Two sequential layers can be linked as being co-deposited, enabling crosstalk correction and ratio control. A layer that is linked to another by co-deposition can not be linked to a third layer for co-deposition control or crosstalk correction. Therefore, it is possible to simultaneously control six rates independent of each other or control up to three sets of two layers linked by co-deposition with crosstalk correction and ratio control.

3.4.1 Defining a Process

The following procedure is used to define a process. (All steps do not necessarily have to be followed in the given order.)

1 Make sure the IC6 is in READY.

Some configuration and process parameters can be changed only while the IC6 is in READY. Therefore, before setting parameters, make sure READY appears as the state on the OPERATE display. See Figure 3-19. If READY is not displayed, press STOP then RESET.

IC6 Operating Manual

Figure 3-19 Operate display - READY

PN 074-505-P1F

3 - 25

IC6 Operating Manual

2 Configure the sensors.

Configuring the sensors involves designating whether the sensor is a single or multi-position sensor, and what output relays are connected to the sensor shutter and crystal switcher, if any. Also, the Auto-Z feature is activated or deactivated during sensor configuration. These parameters are on the SENSOR display. See section 4.1 on page 4-1 for a description of programming these parameters. Also see section 3.6.1 on page 3-34 for details on crystal switching.

3 Configure the sources.

Configuring the sources involves selecting the digital-to-analog voltage converter (DAC) output, its polarity and full scale voltage, and selecting the output relay for the source shutter. Also, if a source has more than one crucible, this is set up in the source configuration. The source parameters are programmed on the SOURCE page of the SOURCE screen. See section 4.2

on page 4-4 for a detailed description for programming these parameters. Also

see section 3.6.2 on page 3-37 for details on crucible selection. The output voltage full scale range and polarity for the selected source control DAC output is set up in the General screen DACs page.

4 Define materials.

To define materials, the MATERIAL pages of the MATERIAL screen are used. Each distinct material used in the process must be defined. If the same material is going to be used more than once in the process, it needs to be defined only once. The material definition includes rate, density, Z-Ratio, tooling, soak power settings, RateWatcher, rate ramps, time limits and whether to STOP on max power. Control loop characteristics also relate to the material. Also, one source and one or more specific sensors are associated with each material. See Chapter 5 for a detailed description for programming these parameters.

5 Define layer/process.

To define layers and processes, the PROCESS pages are used. A process is an ordered set of layers. Layers are entered in order on the PROCESS display. Each layer consists of a material, chosen by number from the material display, final thickness, and thickness limit. Additional information can be provided here for special process features; these include crucible selection and co-deposition. For a detailed description of layer parameters see Chapter 6.

6 Configure General parameter information.

The final step in defining a process is to program any process related parameters on the GENERAL display. This includes which defined process to execute, what layer to begin the process on (typically 1), and whether to start the next layer automatically. It may also be desirable to modify the definition of the graphical display and analog output. See Chapter 7 for a detailed description of General parameters.

PN 074-505-P1F

3 - 26

3.4.2 Executing a Process

Once a process has been defined, it is ready to execute.

The IC6 will not allow certain parameters to be changed while executing a process.

 A Process is not being executed when the IC6 is in the READY state, or when

the Last Layer is in the IDLE state (end of process). A Layer is not being executed when the IC6 is the READY, STOP, SUSPEND or IDLE state.

 STOP freezes a process, the status information on the display is maintained

and all control voltage outputs are set to zero if multiple layers are active.

 SUSPEND is similar to a STOP but only acts on one layer.

 START, pressed once, will continue the process from the point at which it was

stopped. If STOP occurred during a Rate Ramp and the layer is continued without a RESET, the setpoint rate on entering Deposit will be replaced with the rate in effect when the STOP occurred. It may be desireable to adjust the SOAK POWER 2 level based on data log history prior to continuing the stopped layer. Subsequent STARTs will start the next sequential layer dependent upon the value set for the General parameter Max Concurrent Layer.

IC6 Operating Manual

 RESET takes a stopped process back to the beginning of the process at the

designated “Layer to START.”

HINT: It may be desirable to execute a new process in TEST before doing an

actual deposition to check correct shutter operation, sequencing and limits.

The execution of a process is depicted in the following state diagram.

PN 074-505-P1F

3 - 27

IC6 Operating Manual

See Figure 3-21

Normal Sequence

Alternate Sequence

Hand denotes key press

Key

Figure 3-20 Process state diagram

3 - 28

1 Make sure the IC6 is in READY. If not, press STOP then RESET.

2 Press START. Assuming there are no configuration problems, the layer to start

will enter pre-deposition, and continue on through deposition and post-deposition. (See section 3.5 on page 3-32 for detailed information about the states of a layer.) If there are configuration problems, a message describing the problem will be displayed, see Chapter 15 for Status and Error Message definitions.

3 When the first layer is complete, it will go to IDLE. Press START again to begin

the next layer unless Auto Start Next layer has been enabled. Repeat until the process is complete.

4 If at some point there is a need to interrupt or discontinue the process, press

STOP. This will close the sensor and source shutters, set the power to zero, and freeze the display. The process can be restarted where it left off by pressing START. (The pre-deposition phases will be repeated.) To completely abandon the run, press RESET.

5 A critical error may occur while a process is running.

For example, a sensor fail on a single crystal sensor head may occur during pre-deposition. The IC6 will automatically follow Materials Failure Action if a critical error occurs. See section 15.1, Status Messages, on page 15-1 for a list

PN 074-505-P1F

of critical errors. Assuming the error has been remedied, the process can be continued where it left off by pressing START. Pressing RESET will abandon the run.

3.4.3 Pre-conditioning a Layer

It may be desirable to prepare a layer for deposition while the previous layer is in progress. Pressing START while a layer is running will begin the pre-deposition states of the next layer. However, there are certain restrictions and some precautions should be taken.

1 The next layer cannot use the same source as the current layer. Pressing

START will cause a source conflict and the process will STOP. If pre-conditioning is desired, be sure the sources defined in the two consecutive layers are different and that Max Concurrent Layer in General/Process is set to 2 or more.

2 The next layer will enter DEPOSIT while the current layer is in DEPOSIT unless

a Soak Hold is activated. A Soak Hold will hold the pre-deposition at the chosen Soak Power level until ready to proceed. To set up a Soak Hold, see section

9.4, THEN Action Definitions, on page 9-16. or enable using remote

communication, see section 10.4.33, Remote General Action, on page 10-47.

IC6 Operating Manual

NOTE: If a Soak Hold is not active and two layers attempt to enter DEPOSIT

using some of the same sensors, a STOP sensor conflict will occur.

3.4.4 Co-deposition

Co-deposition pertains strictly to depositing two layers at the same time and correcting for any crosstalk due to material from one source arriving at the sensor dedicated to the other source.

A co-deposition is defined on the Layer Definition page of the Process screen. Yes is entered for the co-deposition parameter of the first layer to be co-deposited. This layer is referred to as the primary layer. The primary and secondary layers must both be defined before Yes is entered for the co-deposition parameter of the primary layer. In co-deposition, when the primary layer reaches final thickness, the

PN 074-505-P1F

secondary layer will also leave deposition. However, if the secondary layer reaches final thickness first, the primary layer will continue until reaching its programmed final thickness. There are two other parameters associated with co-deposition. The first is ratio control. This controls the secondary layer’s rate at a percentage of the primary layer’s desired rate. The second is cross talk, which compensates for interference between the two depositions. See section 6.4.1, Layer Parameters, on

page 6-3 and section 12.6, Determining Cross Talk Calibration For Co-Deposition, on page 12-13 for details on programming these parameters.

If two layers are programmed for co-deposition, pressing START once will begin both layers.

3 - 29

IC6 Operating Manual

3.4.5 Multiple Layer Starts

It is possible to run up to six layers independent of each other at the same time by pressing START six times, but ratio control and cross-sensitivity will not be active. Alternatively, two or three instances of co-deposition are also possible by pressing START two or three times, respectively. The Max Concurrent Layer parameter in the GENERAL/PROCESS page must be set appropriately, see section 7.2,

General Screen Process Page, on page 7-1.

3.4.6 Automating a Process

A process can be automated so that a complete process can be executed without having to press START between all the layers. A process can be automated by any of the following three methods.

 Setting Auto Start Next in the GENERAL/PROCESS page to Yes will cause a

complete process to run by pressing START once.

 Remote communication control. An external computer could be set up to

monitor the status of a process and issue START commands at desired times. (See Chapter 10, PN 074-505-P1F Remote Communications.)

 Remote input line. A remote input line can be configured by use of a logic

statement to START a layer based on some external event. (See Chapter 9,

Logic Statement Setup.)

PN 074-505-P1F

3 - 30

IC6 Operating Manual

STOP

YES

ON/STBY

STBY/Power

FAIL

STANDBY

RESET

YES

SAVE

CURRENT

PROCESS

DATA

TURRET DELAY TIME OUT

CRUCIBLE

POSITION

MEMORY CHECKS

READ

CONFIGURATION

SWITCHES

RESTORE CURRENT

PROCESS VALUES

PRECONDITION RISE

PRECONDITION SOAK

RISE TIME

SOURCE

SWITCH

SAME

SOURCE

AND

CRUCIBLE

IDLE

POWER

ZERO

LOAD FILM

PARAMETERS

SOAK

TIME

SOAK

HOLD

INPUT

RISE

TIME

SOAK

TIME

SOAK

HOLD 2

INPUT

SHUTTER

DELAY

SHUTTER

DELAY

SHUTTER

DELAY

CONTROL

DELAY

YES

MPWR

SET LAYER

TO START

)

YES

START

AutoStart

Next=Yes

READY

IDLE

INCREMENT

LAYER NUMBER

IF NOT READY

STOP STATE

WAS

TIME

POWER

USED

IDLE

RAMP

TIME

FEED

TIME

FEED

RAMP

ON FINAL THK

DECISION

DATA

LOG

UPDATE

THICKNESSFINAL

TIME ELAPSED

XTAL FAIL

TIME

ELAPSED

FINAL THK

XTAL FAIL

RATE

RAMP

FINAL THICKNESS

RATE RAMP THICKNESS

XTAL FAIL

FINAL THK

THK LIMIT

XTAL FAIL

XTAL

SWITCH

SELECTED

DEPOSIT

RATEWATCHER

DEPOSIT

RETAIN

THICKNESS

“STOP” VALUE

ZERO

THICKNESS

PROCESS

CONTINUE

GOOD

XTAL

SWITCH

XTAL

DESIRED

RATE

0.0

YES

XTSW

TIME

POWER

SELECTED

“TO

FAILURE

ACTION

STATE”

TIME

POWER

FINAL

THICK

)

Figure 3-21 Simplified IC6 state sequence diagram

PN 074-505-P1F

3 - 31

IC6 Operating Manual

3.5 State Descriptions

Table 3-2 State descriptions

STATE CONDITION RELAY CONTACT

STATUS

Source Shutter

1. READY The IC6 will accept a START command. Inactive Inactive 0

2. CRUCIBLE SWITCH (Crucible Sw)

3. PRECON RISE Source power rises to Precondition power

4. PRECON SOAK Source is maintained at precondition

During this state, the crucible turret is being moved from its current position to the one called out for the given material. If the idle power of the source in use is not zero the power is set to zero before the crucible position changes. IC6 advances to next state when turret input goes low for the programmed position or turret delay has elapsed (depending on parameter settings).

level over the precondition rise time. [PreCon Rise Time]

power level for the precondition soak time. [PreCon Soak Time, PreCon Soak Power]

Inactive Inactive 1

Inactive Inactive 2

Inactive Inactive 3

Sensor Shutter

REMOTE

COMM

ENCODES

5. RISE 1 Source is rising to Soak Power 1 level.

[Rise Time 1]

6. SOAK 1 Source is being maintained at Soak Power

1 level. [Soak Time 1, Soak Power 1]

7. RISE 2 Source is rising to Soak Power 2 level.

[Rise Time 2]

8. SOAK 2 Source is being maintained at Soak Power

2 level. [Soak Time 2, Soak Power 2]

9. SHUTTER DLY Rate is being controlled. Advances to

Deposit State once the Source is in Rate Control within Shutter Delay Accuracy for 5 seconds. If the transfer sensor has been set to Yes it will be used during shutter delay [Delay Option].

10. DEPOSIT Rate control. [Rate, Final Thickness, PID

Control, Process Gain, Primary Time Constant, System Dead Time]

11. RATE RAMP 1 Rate control, desired rate changing. [New

Rate 1, Start Ramp 1, Ramp Time 1]

Inactive Inactive 4

Inactive Inactive 5

Inactive Inactive 6

Inactive Inactive 7

PN 074-505-P1F

Inactive Active 8

Active Active 9

Active Active 10

3 - 32

Table 3-2 State descriptions (continued)

IC6 Operating Manual

STATE CONDITION RELAY CONTACT

STATUS

12. RATE RAMP 2 Rate control, desired rate changing. [New

Source Shutter

Active Active 11

Sensor Shutter

Rate 2, Start Ramp 2, Ramp Time 2]

13. TIME POWER Crystal failed; source maintained at

Active Inactive 12 average control power and average rate prior to crystal failure. [Failure Actions]

14. Manual Manual is entered via front panel key or remote communications command.

Thickness is incrementing if source shutter is open. The source power is controlled by the hand-held controller or remote communications

15. (Non Deposit

Control) NonDep CNTL

The state is entered after the pre-deposit (if "Dep after Pre-dep" parameter set to no) or via external stimulus (remote command,

Active or Inactive

depending on the state when manual is entered. Shutter can be opened or closed by the operator via remote communications during manual.

Inactive Active 14

Active

Shutter can be opened or closed by operator via remote communications during manual.

digital input) or after deposit if "On Final Thickness" set to Non-Deposit Control. Thickness is not incrementing. The source power is controlled to the desired rate by the control loop.The state is ended via external stimulus.

REMOTE

COMM

ENCODES

16. NonDep Hold Non-deposit hold is entered when in

Inactive Inactive 15 non-deposit control and there are no available crystals to continue the control if the time power option had been chosen. Non-deposit hold can also be entered from

PN 074-505-P1F

time power using the RL3 Remote command. Thickness is not incrementing. The source power is maintained at the average control power prior to the crystal failure. Both aggregate rate and power can be adjusted via. remote communications. The state is ended via external stimulus.

17. FEED RAMP Source changing to Feed Power level.

Inactive Inactive 16 [Feed Power, Feed Ramp Time]

18. FEED Source maintained at Feed Power level.

Inactive Inactive 17 [Feed Time]

3 - 33

IC6 Operating Manual

Table 3-2 State descriptions (continued)

STATE CONDITION RELAY CONTACT

STATUS

Source Shutter

19. IDLE RAMP Source changing to Idle Power level. [Idle

Ramp Time, Idle Power]

20. IDLE Source resting at Idle Power; will accept a START command.

21. SUSPEND (layer) The respective layer’s source output is set to zero power. The layer’s display is frozen at the last rate and thickness values.

NOTE: In STOP or SUSPEND, the IC6 will accept a START provided a valid crystal is available for the layer(s) being started.

Inactive Inactive 18

Inactive Inactive 19

Inactive Inactive 20

Sensor Shutter

3.6 Special Features

The IC6 has several special features to enhance the performance of the instrument.

3.6.1 Crystal Switching

REMOTE

COMM

ENCODES

The IC6 offers a choice of Single, XtalTwo (CrystalTwo®), XtalSix (CrystalSix®), Xtal12 (Crystal12

), or Generic sensors. The CrystalTwo, CrystalSix, Crystal12, and Generic sensors provide one or more backup crystals in case a crystal fails during deposition. Sensor types are specified on the Sensors screen.

The XtalTwo option requires the 779-220-G1 or 779-220-G2 XTAL2 Switch. The XTAL2 Switch is connected to any sensor input through an XIU package. A Dual Sensor head can also be used by configuring it as two single sensors with the second Dual Head Sensor configured as Backup Sensor by using an XIU in place of the 779-220-Gx XTAL 2 Switch. The normally uncovered crystal is connected to Sensor x, the backup crystal normally covered by the shutter is connected to Sensor y (where y is any available sensor channel). Sensor y is configured as Backup Sensor for Sensor x in the Sensor page of the Material screen and must have a shutter output assigned in the Sensor page of the Sensor screen. The manual Switch Crystal function is not available in this configuration.To calibrate the Backup Sensor, temporarily set it to be the Sensor.

All multi-position and shuttered sensors require the Pneumatic Actuator Control Valve, part number 750-420-G1, and a feedthrough with an air tube.

PN 074-505-P1F

3 - 34

IC6 Operating Manual

A crystal switch will automatically occur when:

 The IC6 is configured for a XtalTwo (CrystalTwo) sensor type, a layer is

STARTed or running and there is another good crystal available when the active crystal fails.

 The IC6 is configured for a XtalSix, Xtal12 or Generic, a layer is STARTed or

running, and there is at least one good crystal left in the carousel when the active crystal fails.

 A layer is configured with a Backup sensor, a layer is running on the primary

sensor, and the last crystal of the primary sensor fails.

 The IC6 is configured for a XtalTwo or single head with Backup, a START is

executed and the designated primary sensor is different from the last sensor run.

 Using a XtalSix or Xtal12 and pressing START if the current position is not

within the First/Last Xtal position range listed on the Sensor page of the Material screen.

 S & Q levels are exceeded while in deposit.

A crystal switch will NOT automatically occur:

 During a state of STOP, READY or IDLE.

 When the designated primary sensor and backup sensor fail during

pre-deposit. (A SUSPEND will occur if the failure action is configured for Time Power.)

 During deposition if the secondary crystal of a XtalTwo switch fails, or the

Backup sensor, or the last good crystal of a XtalSix, Xtal12 or Generic fails. (In either case a TIME-POWER, SUSPEND, POST DEPOSIT, or STOP will occur, depending on the failure option chosen.)

A crystal switch can be manually executed via the front panel, handheld controller, remote communications, or logic statements when the system is configured for a multi-position sensor.

PN 074-505-P1F

NOTE: When crystal switching with the handheld controller, the IC6 must be on

the Sensor Information screen and the cursor on the appropriate sensor number.

3.6.1.1 XtalTwo (CrystalTwo)

In the case of the XtalTwo (a Dual Sensor head with a 779-220-G1 or 779-220-G2 XTAL 2 Switch), the CrystalSwitch output must be wired so that it simultaneously energizes the Pneumatic Shutter Actuator Control Valve which applies the air pressure to actuate the dual sensor shutter mechanism and the RF relay in the XTAL 2 Switch, exposing crystal #2 while covering crystal #1 and rerouting the RF signal. This allows the dual sensor to be operated with only one oscillator kit and requires only one sensor connection at the IC6.

3 - 35

IC6 Operating Manual

Power-up initialization is performed on a dual sensor to verify that the back-up crystal is good.

If a crystal fail occurs while in Deposit, the IC6 will switch to the second crystal and continue. The Failed Crystal list can be cleared while in Deposit by pressing the F4 function key on the Sensor Information screen with the cursor positioned on the appropriate sensor number. The IC6 will run the next layer using the last crystal position it switched to. While in Ready, the Failed Crystal list can also be cleared by executing a crystal switch with the Hand held controller or by pressing the Switch Crystal function key in the Sensor Information screen or via communications command RG23 (Switch Sensor) see section 10.4.33, Remote

General Action, on page 10-47. A good crystal must be available to switch to in the

case of using the crystal switch method.

3.6.1.2 XtalSix (CrystalSix)

On power-up, all crystals are read to determine how many good and bad crystals are present. The IC6 uniquely identifies and tracks all six positions in the CrystalSix.

During deposition, when there is a crystal failure the IC6 will automatically switch to the next position with a good crystal. When the last good crystal fails and a backup sensor is not available, the Xtal Fail message is displayed, the Xtal Fail state becomes true and the IC6 will go directly to Time Power, POST DEP, SUSPEND or STOP, as appropriate.

When the sensor selected is a XtalSix, the relay contacts are pulsed closed for one second, opened for one second, closed for one second, then opened for each position. The first one second closure will advance the CrystalSix carousel into an intermediate position between two crystals. Opening the closure for one second allows the ratchet mechanism to relax whereupon the second contact closure advances the next crystal into the proper position.

3.6.1.3 Xtal12 (Crystal12)

On power-up, IC6 will rotate the sensor until position 1 is detected. It will continue to rotate through the other 11 positions to determine the state of all crystals. At the conclusion of the sequence, the Sensor Information screen shows the sensor in position 1 and the position number of any failed crystals. The Crystal12 has resistors electrically in parallel for each of the 12 positions. The IC6 verifies that the resistance value is correct at each position. If the value is not as expected, the IC6 pulses again and rechecks the position. If position 1 is not detected, or after 13 pulses of the wrong value, the IC6 reports a Crystal Sw Fail message. In that case, all crystals are also marked as failed, except for current position status.

When the carousel is removed from the sensor for crystal replacements, the IC6 will display Carousel Open. This message also appears if the connection between the XIU (oscillator) and the sensor is absent. After the carousel is replaced, the IC6 assumes the current position is 12 and all crystals are failed. A Crystal Switch or

PN 074-505-P1F

3 - 36

Rotate Sensor function must be initiated in the Sensor Information screen or via Remote Communication to enable the IC6 to catalog the state of all crystals and to return to position 1. This must also be done after the sensor type has been changed to Xtal12. The Rotate Head function is permitted only if the IC6 is in Ready, Stop or all active layers are in Idle or Suspend.

During deposition, the IC6 will automatically switch to the next position with a good crystal when there is a crystal failure. When the last good crystal fails, and no backup sensor is available, the Crystal Fail message is displayed, the Xtal Fail state becomes true and the IC6 will go directly to Time Power or STOP, POST DEP, SUSPEND, as appropriate.

When configured for a Xtal12, the relay contacts are only pulsed closed for one second then opened again once for each position. There is no intermediate position.

3.6.1.4 Generic Sensor Crystal Switching

Selecting Generic as the sensor type enables sequential crystal switching for the # Positions selected (maximum of 12). Upon a crystal switch, the Switch Output will first close for the Pulse On time and then open for the Pulse Off time. The setting # Pulses determines how many On/Off pulse sequences will occur for each movement to the next crystal position. The IC6 will not keep track of which position the Generic Sensor is on nor will it keep track of which crystals are good and which are failed. The Position Selection feature is not available for the Generic sensor.

IC6 Operating Manual

After a crystal switch sequence, the IC6 will attempt to find the resonant frequency for the crystal in this position. If the IC6 does not find a good resonant frequency for this crystal, it will again pulse the Crystal Switch Output and attempt to find a resonant frequency at the next position. The maximum number of attempts to find a good resonant frequency is one less than the # Positions value. If a good resonant frequency is not found after all attempts, the IC6 will enter the Time Power, POST DEP, SUSPEND or STOP state depending on the Sensor / Option Action chosen in the Material/Sensor display.

PN 074-505-P1F

Start resets all crystal fail flags to good.

3.6.2 Source/Crucible Selection

The IC6 can control a source with up to 64 crucibles through up to six binary encoded relays. This is configured by setting the Number Of Crucibles, Crucible Outputs, Turret Feedback, Turret Input, and Turret Delay parameters on the SOURCE page of the SOURCE screen. (See section 4.2.2, Source Parameters,

on page 4-5 for details on programming the parameters associated with

source/crucible selection.)

To define which crucible to use for a layer, set the Cruc(ible) parameter on the PROCESS/Layer screen. When the layer is started, if the current crucible position is different from the one requested, the system’s turret controller will move the

3 - 37

IC6 Operating Manual

crucible into position. This will be signified on the OPERATE screen by the state indicator CRUCIBLE SW(ITCH). The layer sequencing will continue on to Pre-condition Rise Time after either the turret delay time expires or an input indicates the turret is in position, depending on which option is chosen. The specific method used is determined by the parameter Turret Feedback on the SOURCE screen.

NOTE: If the source has been idling at a nonzero power when the START is

initiated, the power will be dropped to zero before the crucible is changed.

3.6.2.1 Example: Programming Turret Source Crucible Selection

Interfacing a turret source controller to the IC6 requires both hardware connections to the turret controller and properly defining certain IC6 parameters.

Proceed to the SOURCE screen and choose the source that is going to be defined as the turret source. This is accomplished by Editing the chosen source as follows:

1 Designate the Number of Crucibles; for example, four.

2 Select the Crucible Output. This defines the number of the first relay that

encodes the crucible number selected by the active layer. Relays are defined sequentially with the first relay containing the least significant bit (LSB). The greater the number of crucibles selected, the greater the number of relays required. The number required is based on binary encoding (actual coding is binary -1, with 00 representing position 1 and 11 representing position 4). Any unused sequence of relays may be used if it is long enough to provide sufficient selections. Outputs are NO (Normally Open).

3 Determine whether Turret Feedback is desired. This allows the turret position

controller to stop further IC6 processing until the requested turret position is satisfied. If chosen, a turret input must be connected to the turret position controller’s feedback signal.

Enter a Turret Delay Time which allows an adequate time for positioning to take place. Once the delay time has expired, IC6 state processing continues.

4 The selection of a particular crucible for a layer is defined in the process page.

5 Select the process to modify.

6 Program the particular Crucible Number for each layer.

Example:

Layer 1: Cruc(ible) Number = 1 Layer 2: Cruc(ible) Number = 2 Layer 4: Cruc(ible) Number = 4

PN 074-505-P1F

3 - 38

3.6.3 Auto-Z

IC6 Operating Manual

The Auto-Z feature of the IC6 automatically determines the Z-Ratio of a crystal. This feature is enabled on the SENSOR page of the SENSOR screen. For the theory behind Auto-Z, see section 16.1.6, Auto-Z Theory, on page 16-9.

The following information briefly describes Auto-Z and details the conditions under which a crystal is "unable to Auto-Z".

Auto-Z is calculated based on the slightly different mass sensitivities of the fundamental and the first anharmonic resonances of the quartz crystal oscillator. Therefore, the need to measure the frequencies of both the fundamental and the first anharmonic resonances is critical.

When inserting a monitor crystal and attempting to Auto-Z, the fundamental and anharmonic frequencies are measured to determine the status of the crystal. The crystal status may be classified into four categories:

1 New Crystal

The first category is for a "new" crystal, one that does not have any material deposited onto it. If both frequencies fall within the allowed range for new crystals, the IC6 will allow an Auto-Z calculation with this crystal.

2 Known, Used Crystal

The second category is for a “known, used” crystal, to account for the possibility that a person would remove a good monitor crystal and then reinsert the same crystal. Whenever a crystal fail occurs, the last valid crystal frequencies are stored in the IC6. Upon inserting a coated monitor crystal, the measured frequencies for this crystal will fall outside of the allowed range for “new” crystals. These frequencies are then compared with the stored values to determine if this crystal is the same one as was in use prior to the crystal fail. If the crystal is the same as used previously, and Auto-Z was calculated previously, the IC6 will allow an Auto-Z calculation with this crystal.

3 Unknown, Used Crystal

PN 074-505-P1F

The third category is for an “unknown, used” crystal. This category is for a used crystal that, upon insertion, shows measured frequencies that are outside of the allowed “new” crystal range and also do not match the frequencies stored within the IC6. This results in an “unable to Auto-Z” condition because the initial frequencies of the uncoated monitor crystal are not known.

4 Unable to detect anharmonic frequency.

As mass is deposited onto the crystal, the oscillation is damped. This damping may be severe enough that the resonance can no longer be determined. If the IC6 loses the ability to measure the first anharmonic frequency, but is still able to determine the fundamental frequency, the “unable to Auto-Z” message is displayed. The IC6 will then continue to use the fundamental frequency to monitor the deposition.

3 - 39

IC6 Operating Manual

If the IC6 loses the ability to measure the fundamental frequency and all available crystals in a multi-position sensor head are flagged as failed, and a backup sensor is not available, the Crystal Fail message is displayed and the Xtal Fail logic state becomes true.

Unable to Auto-Z An “unable to Auto-Z” condition occurs whenever:

 The anharmonic frequency cannot be measured.  The fundamental and anharmonic frequencies of the monitor crystal have

not been continuously measured from the uncoated to the coated state.

3.6.4 Auto Tune — Optimizing the Control Loop

Control loop parameters can often be calculated automatically by the IC6. This is done by using the AutoTune feature. See section 12.5, AutoTuning, on page 12-5.

3.6.5 Rate Watcher

The IC6 includes a sample and hold function which enables periodic sampling of the deposition rate by opening and closing the sensor shutter. If you are controlling inherently stable deposition sources, this function is useful in maximizing crystal life. When RateWatcher is enabled, during deposit, rate control will be established. The sensor shutter will close for a designated amount of time. The shutter will once again be opened to validate and adjust the power level. This procedure is repeated throughout the deposition. Two Material/Deposit parameters—RateWatch Time and RateWatch Accuracy—control this function. See section 5.1.7, Deposit Page

Parameters, on page 5-16.

3 - 40

PN 074-505-P1F

3.6.6 Handheld Controller

An optional Handheld Controller (IPN 755-262-G1), see Figure 3-22, is available as an accessory with the IC6. The Handheld Controller serves as a wired remote to manually control power, switch crystals and produce a STOP.

The Handheld Controller is attached to the IC6 with a modular plug to the front panel.

Power is affected only when in Manual mode by moving the POWER/STOP switch laterally. Pressing to the left as idicated by the INCR arrow, increases the power. Pressing to the right as indicated by the DECR arrow, decreases the power.

A STOP is produced by moving the POWER/STOP switch down. When on the Sensor Information screen, and an XtalTwo (CrystalTwo), XtalSix

(CrystalSix), Xtal12 (Crystal12), or Generic sensor is selected, a crystal switch is activated by pressing the red button on the body of the controller.

The Handheld Controller kit includes a convenience hook for the Handheld Controller that can be attached to the IC6’s mounting ears or some other accessible location.

Figure 3-22 Handheld controller

IC6 Operating Manual

PN 074-505-P1F

3.6.6.1 Determining Soak Power with the Handheld Controller

The Handheld Controller is a useful tool that can be used to determine the appropriate Soak Power levels. Below is an example of how a typical process Soak 1 and Soak 2 can be determined using the Handheld Controller.

Determining Soak 1

Use the Handheld Controller to slowly increase power, a few percent-per-minute. Watch the rate until some rate increase is detected. Depending on the type of source used, this may take several minutes. Once a non-zero rate is achieved, note the current percent power. Use a percent or more lower than this for the Soak Power 1 parameter.

3 - 41

IC6 Operating Manual

Rate Display

Density (gm/cc)

--------------------------------------

Tooling %

100

-------------------------



sec=

Determining Soak 2

After ~30 - 60 seconds of Soak 1, using the Handheld Controller, again slowly increase the power a percent at a time until the desired Deposition Rate is reached. Use a percent or two less than this number for the Soak Power 2 parameter.

3.6.7 Test Mode

Test can be turned on or off in the General/Test display page. "Test" will be shown in red while Test mode is active.

3.6.7.1 Standard or Time Compressed

This IC6 contains a software-controlled test mode which simulates actual operation. In Time Compressed mode, all layer times are sped up so that a long process can be simulated in one tenth of the time. The purpose of the test mode is to verify basic operation and to demonstrate typical operation. The rate display during test mode operation is:

[1]

Crystal fails are ignored in these test modes. Auto crystal switching is disabled. All other relays and inputs operate normally.

3.6.7.2 Advanced Test

In Advanced Test mode, crystal fails are recognized and auto crystal switching is enabled.

3.6.8 USB Storage Device

The USB port allows storage of all parameter information, screen shots as well as automatic datalogging information to a storage device. The maximum number of files which may be stored depends on the storage device memory size. The IC6 is limited to displaying 120 files as 8 pages of 15. The directories are Config, Datalog and Screen Shot.

The parameter set may be stored under a new or existing filename and retrieved from an existing file. A file containing the IC6 parameter set is referred to as a configuration file. Datalog information will be saved only if the USB Datalog Format setting in the Datalog page of the USB Storage screen is set to Comma or Page.

Multiple files may be contained on one storage device. Filenames may be eight characters long; extensions are used to differentiate between configuration files, screen shots and datalogging files. All files must be contained in the appropriate directory. Storage/retrieval from sub-directories is not allowed for screen shots and datalog files

PN 074-505-P1F

3 - 42

IC6 Operating Manual

CAUTION

The IC6 supports the writing of filenames using alphanumeric characters selected using the cursor keys. Characters A through Z and numbers 0 through 9 inclusive are available. The IC6 has the ability to display the files contained on the memory stick. A scrolling feature is enabled to view those filenames which cannot fit as indicated by +++ on the screen. Error messages include: Disk Full; File Not Found; Disk Write Protected; Media Error; Disk not Found; File is Read Only.

Datalog files are automatically named using the process number and run number. See section 3.6.10, Datalog, on page 3-43 for the Datalog string details. Screen shots are named as DDMMYYXX or MMDDYYXX depending on the date format setting. XX is a number that increments 0-99, resetting to 0 every day.

NOTE: A File Access Code parameter is enabled when the IC6 has a Program

lock code set. By entering a File Access Code, the IC6 parameters can be saved to, or retrieved from, the USB storage device only without entering the Program Lock Code. (See Chapter 7, General Parameters.)

Do not remove the USB storage device from the IC6 while a save or retrieve operation is taking place.

3.6.9 Lock and Access Codes

The IC6 has several forms of protection to prevent unauthorized changing of parameters. Refer to the General setup section for a description of parameter and Program lock codes and the File Access Code. In addition, a method of locking the entire display is available through the remote communications. Lock codes are entered on the General display. See Chapter 7, General Parameters.

HINT: To clear any of the locks, except the File Access Code, hold down the

CLEAR key on power up. This will clear all lock codes. HOWEVER, if no lock codes are present, all parameters will be cleared.

PN 074-505-P1F

3.6.10 Datalog

If enabled, Datalog automatically sends process information to the RS-232 port or saves it to the USB storage device every time a source shutter closure occurs. an end of deposit occurs, or following a Stop or Suspend. The information will be saved under a filename on the USB storage device.

Datalog files saved to the USB storage device will be automatically named using the process number and run number. The format of the filename is: PXXRXXXX.IDL. If the USB storage device already contains a file with the same filename as the new datalog information, the new datalog information will be appended to the old file.

3 - 43

IC6 Operating Manual

At each source shutter close, the datalog information will be appended to the file (when saved to USB) until the end of the Process.

If two layers are co-deposited, the first layer to have a source shutter close will be data-logged first.

Datalogging to RS-232 is active if the USB Datalog format is set to page or comma in the Datalog page of the USB Storage screen. Datalogging the crystal frequency data is an optional subset of the datalog string and is enabled by selecting Yes for Datalog Xtal Info on the Comm page of the General screen. The Dlog Comma protocol format is actually comma-and-quote delimited intended for file importation into a spreadsheet program. When a spreadsheet program imports a file having the comma delimited format, data groups that are strictly numbers become value entries, data groups surrounded by quotes are stored as labels.

For the Dlog Page protocol format, only those sensors which are used in a particular Material for a particular Layer will be datalogged.

For the comma delimited format, all the data fields are returned for all the sensors and crystals. If a sensor is not used during the deposition, the data field will contain a zero.

The following values make up the data in the datalog. The data is sent in ASCII strings when the RS-232 port is set for data logging. The data is saved as ASCII strings in the datalog files. The ASCII strings are made up of the labels and values in the following list. ASCII strings are CRLF (Carriage Return Line Feed) terminated. When the data log is requested via the remote status layer command the values are sent in the binary format only.

 Year (Integer)

 Month (Integer)

 Day (Integer)

 Hour (Integer)

 Minute (Integer)

 Process x (x = process number or, in data log files, the name if the name is

programmed)

 Run Number X (Integer)

 Layer x (Integer)

 Material x (x is the material number or, in data log files, the name if the name is

programmed)

PN 074-505-P1F

3 - 44

 Process Time seconds (Integer)

 Layer Time seconds (Integer)

 Deposit Time seconds (Integer)

IC6 Operating Manual

 Ending Thickness kÅ (Float)

 Average Rate Å/s (Float)

 Average Rate Deviation Å/s (Float)

 Ending Power % (Float)

 Average Power % (Float)

 Where it goes next (Byte):

 0 = NonDeposit Control or NonDeposit Hold

 1 = Post Deposit

 2 = Stop

 Termination Reason (Byte) (Matches the "Cause of Stop" Remote encoding

comm, see section 15.4, STOP messages, on page 15-7:

 128 = Normal termination,

 127 = Manual source shutter closing,

 126 = Suspend)

 Time Power Flag (Byte) (0 = No, 1 = Yes)

 Power Fail Flag (Byte) (0 = No, 1 = Yes)

 Power Fail Thickness kÅ (Float) (0 if not a power fail, otherwise the thickness

when the power was lost.)

NOTE: If Data Log Xtal Info Parameter is set to Yes, the following Crystal History

will be sent for each sensor, see Table 3-3. The Crystal history contains the history of every crystal in every sensor used in the layer. In the Remote status command SL17, the crystal history for all twelve crystals in all eight sensors is returned. If the Data Log Xtal History Parameter is set to no, all zeros are sent in the remote status command SL17.

Table 3-3 Sensor 1 to 8

PN 074-505-P1F

Crystal Begin

Freq

1 <Float> <Float> <Integer> <Integer> <Integer> <Integer> <Integer> <Integer>

End Freq BegLife EndLife Beg Activity End Activity Stability

Value

Quality

Value

Table 3-3 is extended as necessary to show all crystals in a sensor.

3 - 45

IC6 Operating Manual

3.6.11 DAC Monitoring

IC6 continually compares the actual output voltages at the DAC BNC connectors with the internally generated values to detect external or internal equipment malfunction. If the values do not agree, IC6 takes the following action:

If the DAC output is assigned for Source control:

 Stop the process.

 Display Source Fault message.

 Set this Source Output to zero.

If the DAC output is assigned for Recorder use:

 Set this output to zero.

 Display Recorder Fault message.

Both types of faults remain active until a RESET is performed.

3 - 46

PN 074-505-P1F

INFICON IC6 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Trademarks

Disclaimer

Copyright

Declaration Of Conformity

Warranty

Table Of Contents

1.1 Introduction

1.1.1 Related Manuals

1.2 IC6 Safety

1.2.1 Definition of Notes, Cautions and Warnings

1.2.2 General Safety Information

1.2.3 Earth Ground

1.2.4 Main Power Connection

1.3 How To Contact INFICON

1.3.1 Returning Your IC6

1.4 IC6 Specifications

1.4.1 Measurement

1.4.2 Screens and Hierarchy

1.4.3 IC6 Features

1.4.3.1 Recipe Storage & Datalogging

1.4.3.2 Sensor Parameters

1.4.3.3 Source Parameters

1.4.3.4 Material Parameters

1.4.3.5 Process Layer Parameters

1.4.3.6 General Global Parameters

1.4.4 Display

1.4.5 DAC Outputs

1.4.6 Logic Processing

1.4.7 Relays / Inputs

1.4.8 Remote Communications

1.4.9 Accessories

1.4.10 Power

1.4.11 Operating Environment

1.4.12 Storage Temperature

1.4.13 Warm Up Period

1.4.14 Size

1.4.15 Installation Clearance Requirements

1.4.15.1 Connector Clearance

1.4.15.2 Cooling Clearance

1.4.16 Weight

1.4.17 Cleaning

1.5 Unpacking and Inspection

1.6 Parts and Options Overview

1.6.1 Base Configurations

1.6.2 Pre-installed Options or Spares

1.6.3 Optional Accessories

1.6.4 Oscillator Packages

1.6.5 Sensors

1.6.6 Replacement Cables

1.7 Initial Power-On Verification

2.1 Location Guidelines

2.1.1 Sensor Types

2.1.2 Sensor Installation

2.1.3 IC6 Installation

2.2 Avoiding Electrical Interference

2.2.1 Verifying/Establishing Earth Ground

2.2.2 Connections to Earth Ground

2.2.3 Minimizing Noise Pickup From External Cabling

2.3 Connecting the Controller

2.3.1 Routing XIU Cables

2.3.2 Interface Cable Fabrication and Pin-Out

2.3.2.1 Source Control Connection

2.3.2.2 Crucible Indexer Connections

2.3.2.3 DAC Option Kit 781-504-G1

2.3.2.4 I/O Expansion Options

2.3.2.5 RS-232C Communications

2.3.2.6 Isolated +24 V (dc) Supply

3.1 Front Panel Controls

3.2 Rear Panel Interfaces

3.3 Displays

3.3.1 Main Menu Display

3.3.2 Operate

3.3.3 Sensor Information

3.3.3.1 Sensor Information Rate/Xtal Display Description

3.3.3.2 Crystal Life and Starting Frequency

3.3.3.3 Percent Life Auto-Zero