INFICON IC-5 User Manual

OPERATING MANUAL
IC/5
Thin Film Deposition Controller
IPN 074-237AE
OPERATING MANUAL
IC/5
Thin Film Deposition Controller
IPN 074-237AE
www.inficon.com reachus@inficon.com
Due to our continuing program of product improvements, specifications are subject to change without notice.
©2001 INFICON

Trademarks

INFICON® is a trademark of INFICON Inc.
Windows®, Windows 95® and Microsoft® are registered trademarks of Microsoft Corporation.
CAJON® is a registered trademark of Swagelok, Co.
All other brand and product names are trademarks or registered trademarks of their respective companies.
The information contained in this Operating Manual is believed to be accurate and reliable. However, INFICON assumes no responsibility for its use and shall not be liable for any special, incidental, or consequential damages related to the use of this product.
Due to our continuing program of product improvements, specifications are subject to change without notice.
©2001 All rights reserved. Reproduction or adaptation of any part of this document without permission is unlawful.
DECLARATION
OF
CONFORMITY
This is to certify that this equipment, designed and manufactured by:
INFICON Inc.
2 Technology Place
East Syracuse, NY 13057
USA
meets the essential safety requirements of the European Union and is placed on the market accordingly. It has been constructed in accordance with good engineering practice in safety matters in force in the Community and does not endanger the safety of persons, domestic animals or property when properly installed and maintained and used in applications for which it was made.
Equipment Description: IC/5 Thin Film Deposition Controllers, including
Oscillators and Crystal Sensors as properly installed.
Applicable Directives: 73/23/EEC as amended by 93/68/EEC
89/336/EEC as amended by 93/68/EEC
Applicable Standards: EN 61010-1 : 1993
EN 55011, Group 1, Class A : 1991
EN 50082-1 : 1992
CE Implementation Date: January 2, 1996
Authorized Representative: Gary W. Lewis
Vice President - Quality Assurance INFICON Inc.
ANY QUESTIONS RELATIVE TO THIS DECLARATION OR TO THE SAFETY OF INFICON'S PRODUCTS SHOULD BE DIRECTED, IN WRITING, TO THE QUALITY ASSURANCE DEPARTMENT AT THE ABOVE ADDRESS.
01/16/96

Warranty

WARRANTY AND LIABILITY - LIMITATION: Seller warrants the products manufactured by it, or by an affiliated company and sold by it, and described on the reverse hereof, to be, for the period of warranty coverage specified below, free from defects of materials or workmanship under normal proper use and service. The period of warranty coverage is specified for the respective products in the respective Seller instruction manuals for those products but shall not be less than two (2) years from the date of shipment thereof by Seller. Seller's liability under this warranty is limited to such of the above products or parts thereof as are returned, transportation prepaid, to Seller's plant, not later than thirty (30) days after the expiration of the period of warranty coverage in respect thereof and are found by Seller's examination to have failed to function properly because of defective workmanship or materials and not because of improper installation or misuse and is limited to, at Seller's election, either (a) repairing and returning the product or part thereof, or (b) furnishing a replacement product or part thereof, transportation prepaid by Seller in either case. In the event Buyer discovers or learns that a product does not conform to warranty, Buyer shall immediately notify Seller in writing of such non-conformity, specifying in reasonable detail the nature of such non-conformity. If Seller is not provided with such written notification, Seller shall not be liable for any further damages which could have been avoided if Seller had been provided with immediate written notification.
THIS WARRANTY IS MADE AND ACCEPTED IN LIEU OF ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, WHETHER OF MERCHANTABILITY OR OF FITNESS FOR A PARTICULAR PURPOSE OR OTHERWISE, AS BUYER'S EXCLUSIVE REMEDY FOR ANY DEFECTS IN THE PRODUCTS TO BE SOLD HEREUNDER. All other obligations and liabilities of Seller, whether in contract or tort (including negligence) or otherwise, are expressly EXCLUDED. In no event shall Seller be liable for any costs, expenses or damages, whether direct or indirect, special, incidental, consequential, or other, on any claim of any defective product, in excess of the price paid by Buyer for the product plus return transportation charges prepaid.
No warranty is made by Seller of any Seller product which has been installed, used or operated contrary to Seller's written instruction manual or which has been subjected to misuse, negligence or accident or has been repaired or altered by anyone other than Seller or which has been used in a manner or for a purpose for which the Seller product was not designed nor against any defects due to plans or instructions supplied to Seller by or for Buyer.
This manual is intended for private use by INFICON® Inc. and its customers. Contact INFICON before reproducing its contents.
NOTE: These instructions do not provide for every contingency that may arise in connection with the installation, operation or maintenance of this equipment. Should you require further assistance, please contact INFICON.
www.inficon.com reachus@inficon.com
IC/5 Operating Manual

Table Of Contents

Chapter 1
Introduction and Specifications
1.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1
1.1.1 Related Manuals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1
1.2 Instrument Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.2.1 Definition of Notes, Cautions and Warnings. . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.2.2 General Safety Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-3
1.2.3 Earth Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-4
1.2.4 Main Power Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-5
1.3 How To Contact Customer Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-6
1.3.1 Returning Your Instrument . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-6
1.4 IC/5 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
1.4.1 Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-7
1.4.2 Screens and Hierarchy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-7
1.4.3 Set-Up Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
1.4.4 Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
1.4.5 Source / Recorder Outputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11
1.4.6 Logic Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12
1.4.7 Relays / Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12
1.4.8 Remote Communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13
1.4.9 Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13
1.4.10 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13
1.4.11 Operating Environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14
1.4.12 Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14
1.4.13 Warm Up Period . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-14
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1.4.14 Size. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-14
1.4.15 Connector Clearance Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14
1.4.16 Weight . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14
1.4.17 Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14
1.5 Unpacking and Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-15
1.6 Parts and Options Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-15
1.6.1 Base Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-15
1.6.2 Pre-installed Options or Spares . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-16
1.6.3 Optional Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16
1.6.4 Oscillator Packages and Sensors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-17
1.7 Initial Power-On Verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-18
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IC/5 Operating Manual
Chapter 2
Measurement and Control Theory
2.1 Basics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.1.1 Monitor Crystals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.1.2 Period Measurement Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
2.1.3 Z-match Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
2.1.4 Active Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
2.1.5 ModeLock Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
2.1.6 Auto Z-match Theory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
2.1.7 Control Loop Theory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11
Chapter 3
Operation
3.1 Front Panel Controls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.2 Rear Panel Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
3.3 Displays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
3.3.1 Display Navigation via the MENU TREE . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
3.3.2 Operate Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
3.3.2.1 Crystal Life and Starting Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12
3.3.3 Sensors Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13
3.3.3.1 SENSORS Display Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13
3.3.3.2 Function Key Selection Choices for
the Sensors Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16
3.3.4 Maintenance/Diagnostics Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-17
3.3.4.1 Function Key Selection Choices for the
Maintenance/Diagnostics Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-17
3.3.5 Source Maintenance Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18
3.3.5.1 Function Key Selection Choices for the
Source Maintenance Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18
3.3.6 Cross Talk and Calibration Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-19
3.3.7 Program Displays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-20
3.3.7.1 Function Key Selection Choices for the Program Display . . . . . . . . . . . . . 3-20
3.4 Process Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-22
3.4.1 Defining a Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-22
3.4.2 Executing a Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-23
3.4.3 Pre-conditioning a Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-25
3.4.4 Co-deposition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-26
3.4.5 Automating a Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-27
3.5 State Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-30
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IC/5 Operating Manual
3.6 Special Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-32
3.6.1 Crystal Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-32
3.6.1.1 CrystalSix Position Select. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-33
3.6.1.2 Rotary Sensor Crystal Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-33
3.6.2 Source/Crucible Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-34
3.6.2.1 Example: Programming Turret Source Crucible Selection . . . . . . . . . . . . . 3-34
3.6.3 Auto Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-36
3.6.4 Auto Tune - Optimizing the Control Loop . . . . . . . . . . . . . . . . . . . . . . . . . . 3-37
3.6.5 Rate Watcher . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-37
3.6.6 Hand-Held Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-38
3.6.7 Test Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-39
3.6.8 Floppy Disk (Optional) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-39
3.6.9 Lock and Access Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-40
3.6.10 Datalog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-40
Chapter 4
Material Set Up
4.1 Material Set Up Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1
4.2 Material Definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1
4.3 Material Definition Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-5
4.4 Error Messages in Material Set-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-15
Chapter 5
Process Set-Up
5.1 Process Set-Up Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
5.2 Process Definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-2
5.2.1 Layer Editing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-3
5.3 Layer Definition Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4
5.4 Error Messages in Process Set-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8
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5.5 Special Layer Parameter Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-9
5.5.1 Skip Deposit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-9
5.5.2 Rate Ramp Trigger of Final Thickness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9
Chapter 6
I/O Logic Statement Set-Up
6.1 I/O Logic Statement Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-1
6.2 Editing the Logic Statements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-2
6.2.1 Logic Statement Directory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
6.2.2 Logic Statement Editing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
6.3 ’IF’ Event Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6
6.4 ’THEN’ Action Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-12
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6.5 Logic Statement Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-15
6.6 I/O Map Directory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-16
6.7 Define User Messages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-17
6.8 Floppy Disk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-19
6.9 Error Messages in I/O
Logic Statement Set-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-21
Chapter 7
Remote Communications
7.1 Remote Communication
Configuration Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1
7.2 Remote Communication Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-2
7.3 Error Messages in
Remote Communications Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-4
7.4 Remote Communications Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-4
7.5 Physical Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-4
7.5.1 RS-232C Serial Port. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-5
7.5.2 IEEE488 Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-7
7.5.2.1 IEEE Settings for a National Instruments IEEE-GPIB Board . . . . . . . . . . . . 7-8
7.6 Message Protocols. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-8
7.6.1 INFICON Message Formats. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-9
7.7 INFICON Standard
Communication Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-10
7.7.1 ECHO Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-10
7.7.2 HELLO Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-10
7.7.3 Query Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-11
7.7.3.1 Query Material Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-11
7.7.3.2 Query Process Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-14
7.7.3.3 Query Utility Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-15
7.7.3.4 Query Sensor Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-16
7.7.3.5 Query Source Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-16
7.7.3.6 Query Output Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-17
7.7.3.7 Query Logic Statements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-17
7.7.3.8 Query Output Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-17
7.7.3.9 Query Input Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-17
7.7.3.10 Query User Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-17
7.7.4 UPDATE Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-18
7.7.4.1 Update Material Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-18
IPN 074-237AE
7.7.4.2 Update Process Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-21
7.7.4.3 Update Utility Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-22
TOC - 4
IC/5 Operating Manual
7.7.4.4 Update Sensor Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-23
7.7.4.5 Update Source Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-23
7.7.4.6 Update Output Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-24
7.7.4.7 Update Logic Statements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-24
7.7.4.8 Update Output Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-27
7.7.4.9 Update Input Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-27
7.7.4.10 Update User Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-27
7.7.5 STATUS Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-28
7.7.6 REMOTE Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-38
7.7.7 Negative Response Error Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-41
7.8 Sample INFICON Messages and
Host Programs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-41
7.8.1 Sample INFICON Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-41
7.8.2 Sample Host Programs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-43
7.8.2.1 Serial Communications - No Checksum. . . . . . . . . . . . . . . . . . . . . . . . . . . 7-43
7.8.2.2 Serial Communication with Checksum . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-44
7.8.2.3 IEEE Sample Host Program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-45
Chapter 8
Source/Sensor Set-Up
8.1 Source/Sensor Set-Up Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-1
8.2 Source/Sensor Navigation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-2
8.3 Source Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-3
8.4 Sensor Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-6
8.5 DAC Output Selection Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-8
8.6 Error Messages in Source/Sensor Set-Up . . . . . . . . . . . . . . . . . . . . . . . . . . 8-9
Chapter 9
Utility Set-Up
IPN 074-237AE
9.1 Utility Set-Up Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-1
9.2 Utility Navigation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-2
9.3 Utility Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-2
9.4 Error Messages in Utility Set-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7
Chapter 10
Applications
10.1 Multiple Sensor Deposition Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-1
10.1.1 Instrument Parameters and Corrections for
Multiple Sensor Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-2
10.2 Trend Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-4
10.2.1 Instrument Parameters Associated with the Trend Analysis Feature. . . . . 10-5
TOC - 5
IC/5 Operating Manual
10.3 Use as a System Controller Example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-5
10.3.1 System Equipment List. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-8
10.3.1.1 Valves. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-8
10.3.1.2 Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-8
10.3.1.3 Solenoid Valves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-9
10.3.1.4 Electron Beam Gun Power Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-9
10.3.1.5 Vacuum Gauges and Controllers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-9
10.3.1.6 Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-10
10.3.1.7 Lamps. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-10
10.3.2 I/O Set-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-10
10.3.2.1 Outputs Connected to I/O Board 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-13
10.3.2.2 Outputs Connected to I/O Board 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-14
10.3.2.3 Logic Statement Directory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-15
Chapter 11
Installation and Interfaces
11.1 Location Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-1
11.1.1 Sensor Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-1
11.1.2 Sensor Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-3
11.1.3 Control Unit Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-5
11.2 Avoiding Electrical Interference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-5
11.2.1 Verifying/Establishing Earth Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-5
11.2.2 Connections to Earth Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-6
11.2.3 Minimizing Noise Pickup From External Cabling . . . . . . . . . . . . . . . . . . . . 11-7
11.3 Connecting the Controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-8
11.3.1 Verifying the Correct Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-8
11.3.2 Voltage Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-9
11.3.3 Routing XIU Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-10
11.3.4 Interface Cable Fabrication and Pin-Out . . . . . . . . . . . . . . . . . . . . . . . . . 11-10
11.3.4.1 Source Control Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-10
IPN 074-237AE
11.3.4.2 Input/Relay Module Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-11
11.3.4.3 RS-232C Communications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-13
11.3.4.4 Isolated +24 V(dc) Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-14
Chapter 12
Calibration Procedures
12.1 Importance of Density, Tooling and Z-ratio . . . . . . . . . . . . . . . . . . . . . . . . 12-1
12.2 Determining Density . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-1
12.3 Determining Tooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-2
12.4 Laboratory Determination of Z-ratio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-3
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IC/5 Operating Manual
12.5 Determining Cross Talk Calibration
For Co-Deposition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-4
12.5.1 Procedure Set-Up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-6
12.5.1.1 Cross Talk Calibrate Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-7
12.5.1.1.1 Function Key Selection Choices for
Cross Talk Calibration Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-8
12.5.2 Cross Talk Calibration MANUAL display . . . . . . . . . . . . . . . . . . . . . . . . . .12-8
12.5.2.1 Function Key Selection Choices for
Cross Talk Calibration Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-8
12.5.3 Cross Talk Calibration CALIBRATE display . . . . . . . . . . . . . . . . . . . . . . . .12-9
12.5.3.1 Function Key Selection Choices for
Cross Talk Calibration Calibrate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-9
12.5.4 Cross Talk Calibration SELECT display . . . . . . . . . . . . . . . . . . . . . . . . . . .12-9
12.5.4.1 Function Key Selection Choices for
Cross Talk Calibration Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-10
12.5.5 Cross Talk Calibration Procedural Notes . . . . . . . . . . . . . . . . . . . . . . . . .12-10
12.6 AutoTuning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-11
12.6.1 AutoTune Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-12
12.6.2 AutoTune Manual Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-13
12.6.3 AutoTune Tuning Display and
AutoTune Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-14
12.6.4 Definition of AutoTune Messages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-15
12.6.5 AutoTune Preparation Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-17
Chapter 13
Troubleshooting, Status and Error Messages
13.1 Status and Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13-1
13.2 Troubleshooting Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-11
13.2.1 Major Instrument Components and Assemblies. . . . . . . . . . . . . . . . . . . .13-12
IPN 074-237AE
13.2.2 Troubleshooting the Instrument . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13-13
13.2.3 Troubleshooting Transducers/Sensors. . . . . . . . . . . . . . . . . . . . . . . . . . . 13-15
13.2.4 Troubleshooting Computer Communications . . . . . . . . . . . . . . . . . . . . . . 13-20
13.3 Replacing the Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-23
13.3.1 Standard and Compact. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13-23
13.3.2 Shuttered and Dual Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-24
13.3.3 Bakeable Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13-25
13.3.4 Sputtering Sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13-26
13.3.5 Crystal Snatcher . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13-27
13.3.6 CrystalSix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-27
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IC/5 Operating Manual
13.4 Crystal Sensor Emulator
IPN 760-601-G1 or 760-601-G2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-28
13.4.1 Diagnostic Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-29
13.4.1.1 Measurement System Diagnostic Procedure . . . . . . . . . . . . . . . . . . . . . . 13-29
13.4.1.2 Feed-Through Or In-Vacuum Cable
Diagnostic Procedure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-30
13.4.1.3 Sensor Head Or Monitor Crystal
Diagnostic Procedure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-31
13.4.1.4 System Diagnostics Pass But
Crystal Fail Message Remains. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-32
13.4.2 % XTAL Life . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-32
13.4.3 Sensor Cover Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-33
13.4.3.1 Compatible Sensor Heads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-33
13.4.3.2 Incompatible Sensor Heads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-33
13.4.4 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-34
Appendix A
Material Table
A.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .A-1
Index
IPN 074-237AE
TOC - 8

1.1 Introduction

The IC/5 is a closed loop process controller designed for use primarily in physical vapor deposition. The unit monitors and/or controls the rate and thickness of the deposition of thin films. Deposition rate and thickness are inferred from the frequency change induced by mass added to a quartz crystal. This technique positions sensors in the path between or to the side of the source of the vaporized material and the target substrate. The sensor incorporates an exposed oscillating quartz crystal whose frequency decreases as material accumulates. The change in frequency provides information to determine rate and thickness and to continually control the evaporation power source. With user supplied time, thickness and power limits and with desired rates and material characteristics, the unit is capable of automatically controlling the process in a precise and repeatable manner. User interaction is accomplished via the unit's front panel and consists of selection or entry of parameters to define the process.
IC/5 Operating Manual
Chapter 1
Introduction and Specifications
The complete system consists of a main electronics unit, the IC/5, sensor heads and a crystal interface unit (XIU) for each attached sensor. These items are generally bundled at the factory and are also sold separately.
The IC/5 Manual provides user information for installing, programming, calibrating and operating the main electronics unit.
When reading the IC/5 Manual, please pay particular attention to the NOTES, CAUTIONS, and WARNINGS found throughout the text. The Notes, Cautions, and Warnings are defined in section 1.2.1 on page 1-2.
You are invited to comment on the usefulness and accuracy of this manual by filling out the registration card and returning it.
IPN 074-237AE

1.1.1 Related Manuals

Sensors are covered in separate manuals.
074-154 - Bakeable
074-155 - CrystalSix
074-156 - Single/Dual
074-157 - Sputtering
1 - 1
IC/5 Operating Manual
CAUTION
WARNING
WARNING - Risk Of Electric Shock

1.2 Instrument Safety

1.2.1 Definition of Notes, Cautions and Warnings

When using this manual, please pay attention to the NOTES, CAUTIONS and WARNINGS found throughout. For the purposes of this manual they are defined as follows:
NOTE: Pertinent information that is useful in achieving maximum instrument
efficiency when followed.
Failure to heed these messages could result in damage to the instrument.
Failure to heed these messages could result in personal injury.
Dangerous voltages are present which could result in personal injury.
IPN 074-237AE
1 - 2

1.2.2 General Safety Information

WARNING - Risk Of Electric Shock
CAUTION
Do not open the instrument case! There are no user-serviceable components within the instrument case.
Dangerous voltages may be present whenever the power cord or external input/relay connectors are present.
Refer all maintenance to qualified personnel.
This instrument contains delicate circuitry which is susceptible to transient power line voltages. Disconnect the line cord whenever making any interface connections. Refer all maintenance to qualified personnel.
IC/5 Operating Manual
IPN 074-237AE
1 - 3
IC/5 Operating Manual
WARNING - Risk Of Electric Shock

1.2.3 Earth Ground

The IC/5 is connected to earth ground through a sealed three-core (three-conductor) power cable, which must be plugged into a socket outlet with a protective earth terminal. Extension cables must always have three conductors including a protective earth terminal.
Never interrupt the protective earth circuit.
Any interruption of the protective earth circuit inside or outside the instrument, or disconnection of the protective earth terminal is likely to make the instrument dangerous.
This symbol indicates where the protective earth ground is connected inside the instrument. Never unscrew or loosen this connection.
IPN 074-237AE
1 - 4

1.2.4 Main Power Connection

WARNING - Risk Of Electric Shock
This instrument has line voltage present on the primary circuits whenever it is plugged into a main power source.
Never remove the covers from the instrument during normal operation.
There are no operator-serviceable items within this instrument.
Removal of the top or bottom covers must be done only by a technically qualified person.
In order to comply with accepted safety standards, this instrument must be installed into a rack system which contains a mains switch. This switch must break both sides of the line when it is open and it must not disconnect the safety ground.
IC/5 Operating Manual
IPN 074-237AE
1 - 5
IC/5 Operating Manual

1.3 How To Contact Customer Support

Worldwide support information regarding: Technical Support, to contact an applications engineer with questions
regarding INFICON products and applications, or
Sales and Customer Service, to contact the INFICON Sales office nearest you,
or
Repair Service, to contact the INFICON Service Center nearest you, is available at www.inficon.com.
If you are experiencing a problem with your instrument, please have the following information readily available:
the serial number for your instrument, a description of your problem, an explanation of any corrective action that you may have already attempted, and the exact wording of any error messages that you may have received.
To contact Customer Support, see Support at www.inficon.com.

1.3.1 Returning Your Instrument

Do not return any component of your instrument to INFICON without first speaking with a Customer Support Representative. You must obtain a Return Material Authorization (RMA) number from the Customer Support Representative.
If you deliver a package to INFICON without an RMA number, your package will be held and you will be contacted. This will result in delays in servicing your instrument.
Prior to being given an RMA number, you may be required to complete a Declaration Of Contamination (DOC) form if your instrument has been exposed to process materials. DOC forms must be approved by INFICON before an RMA number is issued. INFICON may require that the instrument be sent to a designated decontamination facility, not to the factory. Failure to follow these procedures will delay the repair of your instrument.
IPN 074-237AE
1 - 6

1.4 IC/5 Specifications

1.4.1 Measurement

Crystal Frequency . . . . . . . . . . . . . . 6.0 MHz (new crystal) to 4.5 MHz
Internal Precision . . . . . . . . . . . . . . . ± 0.004657 Hz over 100 ms sample for
Thickness & Rate Resolution . . . . . . 0.00577 Å (new crystal);
Thickness Accuracy . . . . . . . . . . . . . 0.5% typical, (dependent on process
Frequency Accuracy. . . . . . . . . . . . . ± 2 ppm 0-50 °C
Measurement Frequency . . . . . . . . . 10 Hz
IC/5 Operating Manual
fundamental and anharmonic frequencies
0.01016 Å (crystal @ 4.5 MHz) over 100 ms sample for material density = 1.0, Z-ratio = 1.0
conditions, especially sensor location, material stress, temperature and density)
Measurement Technique . . . . . . . . . ModeLock with Auto-Z
User Interface. . . . . . . . . . . . . . . . . . CRT and limited membrane keypad. All
parameters accessible through computer communications. Multiple message areas for indication of states and detailed indication of abnormal and stop conditions.

1.4.2 Screens and Hierarchy

Navigation
1) Traditional. . . . . . . . . . . . . . . . Six soft keys
2) "Windows" influence. . . . . . . . X-tree like function with 4 levels of hide/show.
IPN 074-237AE
Structure. . . . . . . . . . . . . . . . . . . . . . Separate screens dedicated to
1) Materials, 2) Layers, 3) Logic,
4) Sensors, 5) Sources, 6) Utility,
7) Maintenance, 8) Communications,
9) Operation
1 - 7
IC/5 Operating Manual
1.4.3 Set-Up Parameters
# of Processes . . . . . . . . . . . . . . . . . 50
# of Layers . . . . . . . . . . . . . . . . . . . . 250 (total)
# of Materials . . . . . . . . . . . . . . . . . . 24
Density . . . . . . . . . . . . . . . . . . . . . . . 0.100 to 99.99 gm/cc
Z-ratio. . . . . . . . . . . . . . . . . . . . . . . . 0.100 to 15.000 or Automatic
# of Sources . . . . . . . . . . . . . . . . . . . Any of 6 channels
Co-deposition . . . . . . . . . . . . . . . 2 sources may operate concurrently
Control Loop types . . . . . . . . . . . . . . (0,1,2) Non-PID, PI, PID
PID Control Mode. . . . . . . . . . . . . . . Fast or Slow Source
Process Gain . . . . . . . . . . . . . . . 0.01 to 100 Å/sec/%Power
Primary Time Constant. . . . . . . . 0.010 to 200.0 seconds
System Dead Time. . . . . . . . . . . 0.010 to 50.000 seconds
Master Tooling Factor. . . . . . . . . . . . 10.0 to 400.0%
Sensor Tooling Factor . . . . . . . . . . . 10.0 to 400.0%
Sensor Weight . . . . . . . . . . . . . . . . . 1.0 to 400.0%
Sensors . . . . . . . . . . . . . . . . . . . . . . 2 standard, 6 additional w/optional hardware
CrystalSix Position Select . . . . . Material designation of position(s)
Sensor Option . . . . . . . . . . . . . . . . . Enter 0 for "not used"
Enter 1 for "stop if last to fail" Enter 2 for "time power if last to fail" Enter 3 for "stop if failed" Enter 4 for "time power if failed"
Maximum Source Power . . . . . . . . . 0.0 to 99.9%
Power Ramps. . . . . . . . . . . . . . . . . . 2 per material
Power Level . . . . . . . . . . . . . . . . 0.0 to 99.9%
Rise Time . . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:sec
Soak Time . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:sec
Auto Soak 2 Power . . . . . . . . . . . . . Yes/No
IPN 074-237AE
1 - 8
Delay Option . . . . . . . . . . . . . . . . . . (0,1,2,3) None, Shutter Delay,
Control Delay, Both
Control Delay Time. . . . . . . . . . . . . . 00:00 to 99:59
IC/5 Operating Manual
Feed Ramps. . . . . . . . . . . . . . . . . . . 1 per material
Feed Power . . . . . . . . . . . . . . . . 0.0 to 99.9%
Feed Ramp Time . . . . . . . . . . . . 00:00 to 99:59 min:sec
Feed Time. . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:sec
Idle Ramps . . . . . . . . . . . . . . . . . . . . 1 per material
Idle Power. . . . . . . . . . . . . . . . . . 0.0 to 99.9%
Idle Ramp Time . . . . . . . . . . . . . 00:00 to 99:59 min:sec
Aggregate Rate . . . . . . . . . . . . . . . . 0.0 to 999.9 Å/sec
Aggregate Multiplier . . . . . . . . . . . . . Yes/No
Final Thickness . . . . . . . . . . . . . . . . 0.0 to 999.9 kÅ
Thickness Limit. . . . . . . . . . . . . . . . . 0.0 to 999.9 kÅ
Time Limit. . . . . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:sec
Co-deposition
Cal Thick. . . . . . . . . . . . . . . . . . . uncal, 0.000 to 99.99kÅ
Ratio Control. . . . . . . . . . . . . . . . 0 to 99%
RateWatcher® . . . . . . . . . . . . . . . . . Sample and Hold Feature
RateWatch Time . . . . . . . . . . . . . 00:00 to 99:59 min:sec
RateWatch . . . . . . . . . . . . . . . . . Accuracy 1 to 99%
Rate Ramps . . . . . . . . . . . . . . . . . . . 2 per layer
New Rate . . . . . . . . . . . . . . . . . . 0 to 999 Å/sec
Start Ramp . . . . . . . . . . . . . . . . . 0 to 999.9 kÅ
Ramp Time. . . . . . . . . . . . . . . . . 00:00 to 99:59 min:sec
IPN 074-237AE
Crucible Selection . . . . . . . . . . . . . . 1 to 64, each source
1 - 9

1.4.4 Display

Type/Color/Size . . . . . . . . . . . . . . . . CRT/ Amber/ 5" H x 9" W
Format . . . . . . . . . . . . . . . . . . . . . . . 23 kHz Horizontal Scan Rate
Resolution . . . . . . . . . . . . . . . . . . . . 750 W x 350 H Monochrome
Vertical Scan Rate . . . . . . . . . . . . . . 50/60 Hz automatically detected
Thickness Display Range. . . . . . . . . 0.000 to 999.9 kÅ
Thickness Display Resolution . . . . . 1 Å
Rate Display Range . . . . . . . . . . . . . 0.0 to 99.9 Å/sec; 100 to 999 Å/sec
Rate Display Resolution. . . . . . . . . . 0.1 Å for 0 to 99.9 Å/sec
Power Display Range. . . . . . . . . . . . 0.0 to 99.9%
Graphic Display Functions . . . . . . . . Rate Deviation at ± 10 or ± 20 Å/sec or Power
Display Data Update Rate . . . . . . . . 1 Hz
IC/5 Operating Manual
1 Å for 100 to 999 Å/sec
at 0 to 100%
1 - 10
IPN 074-237AE

1.4.5 Source / Recorder Outputs

Quantity . . . . . . . . . . . . . . . . . . . . . . 6 BNC
Configuration . . . . . . . . . . . . . . . . . . User programmable for recorder
Function Ranges
Source Control . . . . . . . . . . . . . . 0 to 10 V, 0 to -10 V, 0 to 5 V,
Recorder Output. . . . . . . . . . . . . 0 to 10 V
Current rating . . . . . . . . . . . . . . . . . . 20 mA per channel
Resolution . . . . . . . . . . . . . . . . . . . . 15 bits over full range (10 V)
Update Rate . . . . . . . . . . . . . . . . . . . 10 Hz, maximum, (dependent on source
Recorder Output Functions . . . . . . . Aggregate Rate or Thickness or Rate
IC/5 Operating Manual
or source control.
0 to -5 V, 0 to 2.5 V, 0 to -2.5 V
characteristics).
Deviation; Individual Sensor Rate, Thickness or Rate Deviation; or Source Power.
Recorder Output Ranges
Rate . . . . . . . . . . . . . . . . . . . . . . 0 to 100 Å/sec, 0 to 1000 Å/sec
Thickness . . . . . . . . . . . . . . . . . . 0 to 100 Å, 0 to 1000 Å
Rate Deviation . . . . . . . . . . . . . . Desired rate ± 50 Å/sec
Accuracy. . . . . . . . . . . . . . . . . . . . . . ± 3% full scale
Zero Adjust . . . . . . . . . . . . . . . . . . . . Individual potentiometer
IPN 074-237AE
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IC/5 Operating Manual

1.4.6 Logic Processing

Type . . . . . . . . . . . . . . . . . . . . . . . . . If/Then statements
Logical Functions . . . . . . . . . . . . . . . And; Or; Not; Parentheses; ON
Depth . . . . . . . . . . . . . . . . . . . . . . . . 5 "If" conditions and 5 "Then" results/actions
# of Statements . . . . . . . . . . . . . . . . 100 If/Then
Selectable events. . . . . . . . . . . . . . . Deposition monitor events, states, external
Hierarchy . . . . . . . . . . . . . . . . . . . . . Statements evaluated in numerical order at
Partitioning . . . . . . . . . . . . . . . . . . . . None
Initialization . . . . . . . . . . . . . . . . . . . All outputs transition to their normal states as
per statement
inputs, relays, timers, and counters.
10 Hz any time the unit is on.
early as possible during power-on initialization sequence.

1.4.7 Relays / Inputs

Relays . . . . . . . . . . . . . . . . . . . . . . . SPST 2.5 A relays rated @ 30 V(dc) or
Relay Ratings. . . . . . . . . . . . . . . . . . 100 VA inductive; 2.5A maximum.
# of TTL Compatible Outputs . . . . . . 14 with optional I/O card. Internally pulled up
Inputs (TTL Compatible). . . . . . . . . . (14 standard, 14 additional optional)
Input Levels
maximum high . . . . . . . . . . . . . . 24 V
minimum high. . . . . . . . . . . . . . . 2.5 V
30 V(ac) RMS or 42 V(peak) maximum; (8 standard, up to 16 optional with 2 additional I/O cards); D sub connector; relays are normally open in the power off state, but may be programmed to normally open or normally closed during operation.
to 5 V(dc). May be pulled up externally to 24 V(dc) through 2.4k resistor. minimum high level 0.5mA load @3.75 V maximum low level 10mA load @1.1 V
IPN 074-237AE
1 - 12
maximum low . . . . . . . . . . . . . . . 1.1 V
Scan/Update Rate . . . . . . . . . . . . . . 10 Hz

1.4.8 Remote Communications

RS232C Serial Port . . . . . . . . . . . . . Standard; INFICON protocol
Baud Rates. . . . . . . . . . . . . . . . . . . . 19,200; 9,600; 4,800; 2,400
IEEE488 Parallel Port. . . . . . . . . . . . Optional
IEEE Service Requests . . . . . . . . . . Supported with RQS and MAV status bits

1.4.9 Accessories

Manual Power . . . . . . . . . . . . . . . . . Front panel
Control Connection
Function . . . . . . . . . . . . . . . . . . . . . . Handheld, increase/decrease/stop
Floppy (Optional) . . . . . . . . . . . . . . . 3.5', 1.44 MByte for process and
Connector Kit . . . . . . . . . . . . . . . . . . Connectors for inputs and relays
Operating Manual. . . . . . . . . . . . . . . 3-ring binder type
IC/5 Operating Manual
datalog storage

1.4.10 Power

Power . . . . . . . . . . . . . . . . . . . . . . . . 100 +10%, -15% V(ac) 50/60 Hz
120 +10%, -10% V(ac) 50/60 Hz 230 +10%, -10% V(ac) 50/60 Hz 240 +10%, -15% V(ac) 50/60 Hz
Maximum apparent power . . . . . . . . 300 VA
Fuse . . . . . . . . . . . . . . . . . . . . . . . . . 100 V(ac), 120 V(ac) use 4 Amp IEC 127
approved type T 230 V(ac), 240 V(ac) use 2 Amp IEC 127 approved type T
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IC/5 Operating Manual

1.4.11 Operating Environment

Usage. . . . . . . . . . . . . . . . . . . . . . . . Indoor only
Temperature. . . . . . . . . . . . . . . . . . . 0 to 50 °C (32-122 °F)
Humidity . . . . . . . . . . . . . . . . . . . . . . Up to 85%RH, non-condensing
Altitude . . . . . . . . . . . . . . . . . . . . . . . Up to 2000 meters
Installation (Overvoltage) . . . . . . . . . Category II per IEC 664
Pollution Degree. . . . . . . . . . . . . . . . 1 per IEC 664

1.4.12 Storage Temperature

Storage Temperature . . . . . . . . . . . . -10 to 60 °C (14 to 140 °F)

1.4.13 Warm Up Period

Warm Up Period. . . . . . . . . . . . . . . . None required;
For maximum stability allow 5 minutes.

1.4.14 Size

Not including mounts or user connectors
5.25" H x 17.625" W x 18.5" D (133.4 mm H x 447.7 mm W x 470 mm D)
Including mounts, but no user connectors
5.25" H x 18.85" W x 18.5" D (133.4 mm H x 478.8 mm W x 470 mm D)

1.4.15 Connector Clearance Requirements

Front. . . . . . . . . . . . . . . . . . . . . . . . . Less than 1.0" (25.4 mm)
Rear . . . . . . . . . . . . . . . . . . . . . . . . . Less than 4.0" (101.6 mm)

1.4.16 Weight

With all options. . . . . . . . . . . . . . . . . 13.2 kg / 29 lb

1.4.17 Cleaning

IPN 074-237AE
1 - 14
Use a mild, nonabrasive cleaner or detergent taking care to prevent cleaner from entering the unit.

1.5 Unpacking and Inspection

1 If the IC/5 control unit has not been removed from its shipping container, do so
now.
2 Carefully examine the unit for damage that may have occurred during shipping.
This is especially important if you notice obvious rough handling on the outside of the container. Immediately report any damage to the carrier and to INFICON.
3 Do not discard the packing materials until you have taken inventory and have
at least performed a power on verification.
4 Take an inventory of your order by referring to your order invoice and the
information contained in section 1.6 on page 1-15.
5 To perform a power-on verification, see section 1.7 on page 1-18.
6 For additional information or technical assistance, contact your nearest
INFICON Inc. sales office.

1.6 Parts and Options Overview

IC/5 Operating Manual

1.6.1 Base Configurations

IC/5 Control Unit. . . . . . . . . . . . . . . . 760-500-G1 (100 V(ac) 50/60 Hz)
760-500-G2 (120 V(ac) 50/60 Hz) 760-500-G3 (230 V(ac) 50/60 Hz) 760-500-G4 (240 V(ac) 50/60 Hz)
Technical Manual . . . . . . . . . . . . . . . 074-237
Hand Controller . . . . . . . . . . . . . . . . 755-262-G1
I/O Relay Ship Kit . . . . . . . . . . . . . . . 760-024-G1
Input/Relay Interface Connectors. . . (8 relay outputs, 14 TTL inputs)
Power Cord . . . . . . . . . . . . . . . . . . . 068-0433
(shielded power cord - North America)
IPN 074-237AE
Ship Kit . . . . . . . . . . . . . . . . . . . . . . . 760-020-G1 (100 V(ac), 120 V(ac))
068-0434 (shielded power cord - European)
760-020-G2 (230 V(ac), 240 V(ac))
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IC/5 Operating Manual
1.6.2 Pre-installed Options or Spares
Additional Sensor Module . . . . . . . . 760-1132-G1 (up to 3 extra)
Relay Card . . . . . . . . . . . . . . . . . . . . 760-162-G1
Relay Card . . . . . . . . . . . . . . . . . . . . 760-162-G2
I/O Relay Ship Kit. . . . . . . . . . . . . . . 760-024-G1
IEEE488 Parallel . . . . . . . . . . . . . . . 760-142-G1
Communications
Floppy disk . . . . . . . . . . . . . . . . . . . . 760-023-G1

1.6.3 Optional Accessories

(8 relay outputs, 14 TTL inputs)
(8 relay outputs, 14 TTL outputs)
(8 relay outputs, 14 TTL inputs) 760-024-G2 (8 relay outputs, 14 TTL outputs)
IC/5 15' Oscillator Kit . . . . . . . . . . . . 760-025-G15
IC/5 30' Oscillator Kit . . . . . . . . . . . . 760-025-G30
IC/5 50' Oscillator Kit . . . . . . . . . . . . 760-025-G50
IC/5 100' Oscillator Kit . . . . . . . . . . . 760-025-6100
Oscillator to vacuum. . . . . . . . . . . . . 755-257-G6
feedthrough cable, 6"
IC/5 Unit to Oscillator Cable 15' . . . . 600-1039-G15
IC/5 Unit to Oscillator Cable, 30' . . . 600-1039-G30
IC/5 Unit to Oscillator Cable, 50' . . . 600-1039-G50
IC/5 Unit to Oscillator Cable, 100' . . 600-1039-6100
Pneumatic Shutter Actuator . . . . . . . 750-420-G1
Control Valve
Sensor Emulator Kit . . . . . . . . . . . . . 760-601-G2
IC/5 Offline Editor Software . . . . . . . 760-030-G1
IPN 074-237AE
1 - 16
Adapter Cables
IC/5 to IC/4 Kit . . . . . . . . . . . . . . 600-1084-P1 (Relays and Inputs - for IC/4 or
DAC, IC/5 to IC/4 Kit. . . . . . . . . . 600-1049-P1 (IC/5 to IC/4 Analog
IC/5 to IC6000 Kit . . . . . . . . . . . . 600-1083-P1 (Relays and Inputs)

1.6.4 Oscillator Packages and Sensors

IC/5 Oscillator, 15' and 6" cable pkg. 760-025-G15
IC/5 Oscillator, 30' and 6" cable pkg. 760-025-G30
IC/5 Oscillator, 50' and 6" cable pkg. 760-025-G50
IC/5 Oscillator, 100' and 6" cable pkg.760-025-G100
4 Meter Oscillator Kit . . . . . . . . . . . . . . . . . . . . . . 4XI5-nnn
for operation with 3 to 4 m long in-vacuum cable, contact factory for part number
IC/5 Operating Manual
IC/4 PLUS)
Outputs - for IC/4 or IC/4 PLUS)
Standard Sensor. . . . . . . . . . . . . . . . 750-211-G1
Standard Sensor with Shutter. . . . . . 750-211-G2
Compact Sensor. . . . . . . . . . . . . . . . 750-213-G1
Compact Sensor with Shutter. . . . . . 750-213-G2
Sputtering Sensor. . . . . . . . . . . . . . . 750-618-G1
UHV Bakeable Sensor, 12" . . . . . . . 007-219
UHV Bakeable Sensor, 20" . . . . . . . 007-220
UHV Bakeable Sensor, 30" . . . . . . . 007-221
UHV Bakeable Sensor with Shutter, 12"750-012-G1
IPN 074-237AE
UHV Bakeable Sensor with Shutter, 20"750-012-G2
UHV Bakeable Sensor with Shutter, 30"750-012-G3
Dual Sensor . . . . . . . . . . . . . . . . . . . 750-212-G2
CrystaISix Multiple Sensor . . . . . . . . 750-446-G1
NOTE: Contact INFICON for a complete listing of oscillators and sensors.
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IC/5 Operating Manual
WARNING - Risk Of Electric Shock
WARNING - Risk Of Electric Shock
1.7 Initial Power-On Verification
A preliminary functional check of the instrument can be made before formal installation. It is not necessary to have sensors, source controls, inputs or relays connected to do this. For more complete installation information, refer to Chapter
11, Installation and Interfaces and to Chapter 12, Calibration Procedures.
There are no user-serviceable components within the instrument case.
Dangerous voltages may be present whenever the power cord or external input/relay connectors are present.
Refer all maintenance to qualified personnel.
Never interrupt the protective earth circuit.
Any interruption of the protective earth circuit inside or outside the instrument, or disconnection of the protective earth terminal is likely to make the instrument dangerous.
This symbol indicates where the protective earth ground is connected inside the instrument. Never unscrew or loosen this connection.
IPN 074-237AE
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IC/5 Operating Manual
1 Confirm that AC line voltage is supplied and proper for the instrument. Line
voltage should be indicated on the instrument back label.
2 Press the power button on the front panel. A green pilot light should be seen
next to the power switch.
3 The fan at the back of the instrument should be exhausting air.
4 Video monitor will display an image similar to the one shown in Figure 1-1.
5 Compare the configuration information on the screen against the unit
configuration ordered.
6 Status of parameter information will be displayed. If information was valid prior
to this power up, it should stay valid.
7 After a delay, the instrument will enter the OPERATE display.
8 In the OPERATE display, confirm that the display is centered vertically. Lines
between the function keys (F1...F6) should align with the lines between the panels on the right side of the display.
9 Using a non-conducting alignment tool, verify that the brightness pot is
operative. Adjust for the desired brightness. Access to the brightness pot is at the bottom-center of the face panel, see Figure 3-1 on page 3-1.
Figure 1-1 IC/5 System Status Screen (Display will vary depending on options present)
IPN 074-237AE
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IC/5 Operating Manual
This page is intentionally blank.
1 - 20
IPN 074-237AE

2.1 Basics

M
f
M
q
-------
F
F
q
-----------=
T
f
KF
d
f
----------------=
IC/5 Operating Manual
Chapter 2
Measurement and Control Theory
The Quartz Crystal deposition Monitor, or QCM, utilizes the piezoelectric sensitivity of a quartz monitor crystal to added mass. The QCM uses this mass sensitivity to control the deposition rate and final thickness of a vacuum deposition. When a voltage is applied across the faces of a properly shaped piezoelectric crystal, the crystal is distorted and changes shape in proportion to the applied voltage. At certain discrete frequencies of applied voltage, a condition of very sharp electro-mechanical resonance is encountered. When mass is added to the face of a resonating quartz crystal, the frequency of these resonances are reduced. This change in frequency is very repeatable and is precisely understood for specific oscillating modes of quartz. This heuristically easy to understand phenomenon is the basis of an indispensable measurement and process control tool that can easily detect the addition of less than an atomic layer of an adhered foreign material.
In the late 1950’s it was noted by Sauerbrey frequency, DF = F frequencies, F
and Fq respectively, is related to the change in mass from the
c
added material, M
, of a quartz crystal with coated (or composite) and uncoated
q-Fc
, as follows:
f
1,2
and Lostis3 that the change in
[1]
where M
is the mass of the uncoated quartz crystal. Simple substitutions lead
q
to the equation that was used with the first “frequency measurement” instruments:
[2]
IPN 074-237AE
where the film thickness, T DF, and inversely proportional to the density of the film, d N
atdq/Fq
2
; where dq (= 2.649 gm/cm3) is the density of single crystal quartz and Nat
, is proportional (through K) to the frequency change,
f
. The constant, K =
f
(=166100 Hz cm) is the frequency constant of AT cut quartz. A crystal with a starting frequency of 6.0 MHz will display a reduction of its frequency by 2.27 Hz when 1 angstrom of Aluminum (density of 2.77 gm/cm
3
) is added to its surface. In
this manner the thickness of a rigid adlayer is inferred from the precise
1.G. Z. Sauerbrey, Phys. Verhand .8, 193 (1957)
2.G. Z. Sauerbrey, Z. Phys. 155
3.P. Lostis, Rev. Opt. 38
,206 (1959)
,1 (1959)
2 - 1
IC/5 Operating Manual
measurement of the crystal’s frequency shift. The quantitative knowledge of this effect provides a means of determining how much material is being deposited on a substrate in a vacuum system, a measurement that was not convenient or practical prior to this understanding.

2.1.1 Monitor Crystals

No matter how sophisticated the electronics surrounding it, the essential device of the deposition monitor is the quartz crystal. The quartz resonator shown in Figure
2-1 has a frequency response spectrum that is schematically shown in Figure 2-2.
The ordinate represents the magnitude of response, or current flow of the crystal, at the specified frequency.
Figure 2-1 Quartz Resonator
The lowest frequency response is primarily a “thickness shear” mode that is called the fundamental. The characteristic movement of the thickness shear mode is for displacement to take place parallel to the major monitor crystal faces. In other words, the faces are displacement antinodes as shown in Figure 2-3. The responses located slightly higher in frequency are called anharmonics; they are a combination of the thickness shear and thickness twist modes. The response at about three times the frequency of the fundamental is called the third quasiharmonic. There are also a series of anharmonics slightly higher in frequency associated with the quasiharmonic.
The monitor crystal design depicted in Figure 2-1 is the result of several significant improvements from the square crystals with fully electroded plane parallel faces that were first used. The first improvement was to use circular crystals. This increased symmetry greatly reduced the number of allowed vibrational modes. The second set of improvements was to contour one face of the crystal and to reduce the size of the exciting electrode. These improvements have the effect of trapping the acoustic energy. Reducing the electrode diameter limits the excitation to the central area. Contouring dissipates the energy of the traveling acoustic wave before it reaches the edge of the crystal. Energy is not reflected back to the center where it can interfere with other newly launched waves, essentially making a small crystal appear to behave as though it is infinite in extent. With the crystal’s vibrations restricted to the center, it is practical to clamp the outer edges of the
IPN 074-237AE
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IC/5 Operating Manual
5.981 MHz 15 ohm
6.153 MHz 50 ohm
6.194 MHz 40 ohm
6.333 MHz 142 ohm
6.337 MHz 105 ohm
6.348 MHz 322 ohm
6.419 MHz 350 ohm
17.792 MHz 278 ohm
17.957 MHz 311 ohm
18.133 MHz 350 ohm
Log of relative intensity (Admittance)
Frequency (in MHz)
1
10
1
100
1
1000
6 7 17 18
crystal to a holder and not produce any undesirable effects. Contouring also reduces the intensity of response of the generally unwanted anharmonic modes; hence, the potential for an oscillator to sustain an unwanted oscillation is substantially reduced.
Figure 2-2 Frequency Response Spectrum
IPN 074-237AE
The use of an adhesion layer has improved the electrode-to-quartz bonding, reducing “rate spikes” caused by micro-tears between the electrode and the quartz as film stress rises. These micro-tears leave portions of the deposited film unattached and therefore unable to participate in the oscillation. These free portions are no longer detected and the wrong thickness consequently inferred.
The “AT” resonator is usually chosen for deposition monitoring because at room temperature it can be made to exhibit a very small frequency change due to temperature changes. Since there is presently no way to separate the frequency change caused by added mass (which is negative) or even the frequency changes caused by temperature gradients across the crystal or film induced stresses, it is essential to minimize these temperature-induced changes. It is only in this way that small changes in mass can be measured accurately.
2 - 3
IC/5 Operating Manual
displacement node
X
X
X
2
1
3
E
M
f
M
q
-------
TcTq–
T
q
----------------------
F
F
c
-----------==
Figure 2-3 Thickness Shear Displacement

2.1.2 Period Measurement Technique

Although instruments using equation [2] were very useful, it was soon noted they had a very limited range of accuracy, typically holding accuracy for DF less than
0.02 F
where T and the bare crystal respectively. The period measurement technique was the outgrowth of two factors; first, the digital implementation of time measurement, and second, the recognition of the mathematically rigorous formulation of the proportionality between the crystal’s thickness, I = 1/F oscillator, or reference oscillator, not affected by the deposition and usually much higher in frequency than the monitor crystal. This reference oscillator is used to generate small precision time intervals which are used to determine the oscillation period of the monitor crystal. This is done by using two pulse accumulators. The first is used to accumulate a fixed number of cycles, m, of the monitor crystal. The second is turned on at the same time and accumulates cycles from the reference oscillator until m counts are accumulated in the first. Since the frequency of the reference is stable and known, the time to accumulate the m counts is known to an accuracy equal to ± 2/F
. In 1961 it was recognized by Behrndt4 that:
q
and Tq are the periods of oscillation of the crystal with film (composite)
c
. Electronically the period measurement technique uses a second crystal
q
where Fr is the reference oscillator’s frequency. The
r
, and the period of oscillation, Tq
q
[3]
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2 - 4
4.K. H. Behrndt, J. Vac. Sci. Technol. 8, 622 (1961)
IC/5 Operating Manual
T
f
Natd
q
dfFcZ
------------------


arctan Z tan
FqFc–
F
q
-------------------------


=
monitor crystal’s period is (n/Fr)/m where n is the number of counts in the second accumulator. The precision of the measurement is determined by the speed of the reference clock and the length of the gate time (which is set by the size of m). Increasing one or both of these leads to improved measurement precision.
Having a high frequency reference oscillator is important for rapid measurements (which require short gating times), low deposition rates and low density materials. All of these require high time precision to resolve the small, mass induced frequency shifts between measurements. When the change of a monitor crystal’s frequency between measurements is small, that is, on the same order of size as the measurement precision, it is not possible to establish quality rate control. The uncertainty of the measurement injects more noise into the control loop, which can be counteracted only by longer time constants. Long time constants cause the correction of rate errors to be very slow, resulting in relatively long term deviations from the desired rate. These deviations may not be important for some simple films, but can cause unacceptable errors in the production of critical films such as optical filters or very thin layered superlattices grown at low rates. In many cases the desired properties of these films can be lost if the layer to layer reproducibility exceeds one, or two, percent. Ultimately, the practical stability and frequency of the reference oscillator limits the precision of measurement for conventional instrumentation.

2.1.3 Z-match Technique

After learning of fundamental work by Miller and Bolef 5, which rigorously treated the resonating quartz and deposited film system as a one-dimensional continuous acoustic resonator, Lu and Lewis in 1972. Advances in electronics taking place at the same time, namely the micro-processor, made it practical to solve the Z-match equation in “real-time”. Most deposition process controllers sold today use this sophisticated equation that takes into account the acoustic properties of the resonating quartz and film system as shown in equation [4].
IPN 074-237AE
where Z=(d
quq/dfuf
1/2
)
is the acoustic impedance ratio and uq and uf are the shear moduli of the quartz and film, respectively. Finally, there was a fundamental understanding of the frequency-to-thickness conversion that could yield theoretically correct results in a time frame that was practical for process control. To achieve this new level of accuracy requires only that the user enter an additional material parameter, Z, for the film being deposited. This equation has been tested
6
developed the simplifying Z-match™ equation
[4]
5.J. G. Miller and D. I. Bolef, J. Appl. Phys. 39, 5815, 4589 (1968)
6.C. Lu and O. Lewis, J Appl. Phys. 43
, 4385 (1972)
2 - 5
IC/5 Operating Manual
for a number of materials, and has been found to be valid for frequency shifts equivalent to F and equation [3] was valid only to ~0.05F

2.1.4 Active Oscillator

All of the instrumentation developed to date has relied on the use of an active oscillator circuit, generally the type schematically shown in Figure 2-4. This circuit actively keeps the crystal in resonance, so that any type of period or frequency measurement may be made. In this type of circuit, oscillation is sustained as long as the gain provided by the amplifiers is sufficient to offset losses in the crystal and circuit and the crystal can provide the required phase shift. The basic crystal oscillator’s stability is derived from the rapid change of phase for a small change in the crystal’s frequency near the series resonance point, as shown in Figure 2-5 on
page 2-7.
Figure 2-4 Active Oscillator Circuit
= 0.4Fq. Keep in mind that equation [2] was valid to only 0.02Fq
f
.
q
2 - 6
The active oscillator circuit is designed so the crystal is required to produce a phase shift of 0 degrees, which allows it to operate at the series resonance point. Long­and short-term frequency stabilities are a property of crystal oscillators because very small frequency changes are needed to sustain the phase shift required for oscillation. Frequency stability is provided by the quartz crystal even though there are long term changes in electrical component values caused by temperature or aging or short-term noise-induced phase jitter.
As mass is added to a crystal, its electrical characteristics change. Figure 2-6 on
page 2-8 is the same plot as Figure 2-5 overlaid with the response of a heavily
loaded crystal. The crystal has lost the steep slope displayed in Figure 2-5. Because the phase slope is less steep, any noise in the oscillator circuit translates
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IC/5 Operating Manual
into a greater frequency shift than that which would be produced with a new crystal. In the extreme, the basic phase/frequency shape is not preserved and the crystal is not able to provide a full 90 degrees of phase shift.
The impedance, |Z|, is also noted to rise to an extremely high value. When this happens it is often more favorable for the oscillator to resonate at one of the anharmonic frequencies. This condition is sometimes short lived, with the oscillator switching between the fundamental and anharmonic modes, or it may continue to oscillate at the anharmonic. This condition is known as mode hopping and in addition to annoying rate noise can also lead to false termination of the film because of the apparent frequency change. It is important to note that the controller will frequently continue to operate under these conditions; in fact there is no way to tell this has happened except that the film’s thickness is suddenly apparently thinner by an amount equivalent to the frequency difference between the fundamental and the anharmonic that is sustaining the oscillation.
Figure 2-5 Crystal Frequency Near Series Resonance Point
IPN 074-237AE

2.1.5 ModeLock Oscillator

INFICON has created a new technology that eliminates the active oscillator and its limitations. This new system constantly tests the crystal’s response to an applied frequency in order to not only determine the resonant frequency, but also to verify that the crystal is oscillating in the desired mode. This new system is essentially immune to mode hopping and the resulting inaccuracies. It is fast and accurate, determining the crystal’s frequency to less than .005 Hz at a rate of 10 times per second. Because of the system’s ability to identify and then measure particular crystal modes, it is now possible to offer new features that take advantage of the additional informational content of these modes. This new “intelligent”
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IC/5 Operating Manual
measurement system uses the phase/frequency properties of the quartz crystal to determine the resonant frequency. It operates by applying a synthesized sine wave of specific frequency to the crystal and measuring the phase difference between the applied signal’s voltage and the current passing through the crystal. At series resonance, this phase difference is exactly 0 degrees; that is, the crystal behaves like a pure resistance. By separating the applied voltage and the current returned from the crystal and monitoring the output of a phase comparator it is possible to establish whether the applied frequency is higher or lower than the crystal’s resonance point. At frequencies well below the fundamental, the crystal’s impedance is capacitive and at frequencies slightly higher than resonance it is inductive in nature. This information is useful if the resonance frequency of a crystal is unknown. A quick sweep of frequencies can be undertaken until the output of the phase comparator changes, marking the resonance event. For AT crystals we know that the lowest frequency event encountered is the fundamental. The events slightly higher in frequency are anharmonics. This information is useful not only for initialization, but also for the rare case when the instrument loses track of the fundamental. Once the frequency spectrum of the crystal is determined the instrument’s task is to follow the changing resonance frequency and to periodically provide a measurement of the frequency for subsequent conversion to thickness.
Figure 2-6 Heavily Loaded Crystal
The use of the “intelligent” measurement system has a series of very apparent advantages when compared to the previous generation of active oscillators, namely immunity from mode hopping, speed of measurement and precision of measurement. The technique also allows the implementation of a sophisticated feature that cannot even be contemplated using the active oscillator approach. The same capability that allows the new technology to sweep and identify the fundamental can be used to identify other oscillation modes, such as the anharmonics and the quasiharmonic. Not only can the instrument track the
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2 - 8
fundamental mode continuously, but also it can be implemented to alternate between one or more other modes. This interrogation of multiple modes can be performed as fast as 10 Hz for two modes of the same crystal.

2.1.6 Auto Z-match Theory

The one drawback in using equation [4] on page 2-5 is that the acoustic impedance must be known. There are several cases where accuracy has to be compromised because of incomplete or limited knowledge of the material constants of the deposited materials.
Often the Z-ratio for the bulk material is different from that of the deposited thin
film. Thin films are especially sensitive to process parameters, particularly in a sputtering environment. Consequently, the values available for bulk materials may not be pertinent.
For many exotic materials, including alloys, the Z-ratio is not known nor easily
available.
There has always been a need to accurately measure layer thickness of
multiple material films using the same crystal sensor. This is particularly true for multi-layer optical coatings and high-temperature superconductor fabrication. The effective Z-ratio of the composite of multi-material layers is not known.
IC/5 Operating Manual
In such cases, the only recourse is to assume the Z-ratio to be unity (that is, ignoring the reality of wave propagation in composite media). This false premise introduces error in the thickness and rate predictions. The magnitude of this error depends upon the film thickness and the amount of departure of the true Z-ratio from unity.
7
In 1989, A. Wajid became aware of the ModeLock oscillator
. He speculated there might be a relationship between the fundamental and one of the anharmonics similar to the relationship noted by Benes
8
between the fundamental and the third quasiharmonic. The frequencies of the fundamental and the anharmonics are very similar, solving the problem of capacitance of long cables. He found the ideas
IPN 074-237AE
needed for establishing the required connections in papers published by Wilson
10
in 1974 and Tiersten and Smythe
in 1979.
9
Contouring a crystal, that is, giving one face a spherical shape, has the effect of separating the various modes further apart and preventing the transfer of energy from one mode to another. For the sake of identification it is common to assign mode [100] to the fundamental, [102] to the lowest frequency anharmonic and [120] to the next lowest frequency anharmonic. The three indices of the mode
7.U.S. Patent No. 5,117,192 (May 26, 1992) International Patents Pending.
8.E. Benes, J. Appl. Phys. 56(3), 608-626 (1984)
9.C. J. Wilson, J. Phys. d7,2449 (1974)
10.H. F. Tiersten and R.C. Smythe, J. Acoust. Soc. Am., 65(6), 1455 (1979).
2 - 9
IC/5 Operating Manual
C55C66
coated
C55C66
uncoated
--------------------------------------------
1
1MZ+
-----------------------
MZ
F
c
F
q
-----


Z+
F
c
F
q
-----


tantan 0=
Z
MZ
F
c
F
q
-----


tan
F
c
F
q
-----


tan
---------------------------------=
assignment refer to the number of phase reversals in the wave motion along the three axes of the crystal. The above-referenced papers by Wilson and Tiersten & Smythe are examinations of modal properties, relating the various properties of the radius of curvature to the placement of the anharmonics relative to the fundamental.
As material is deposited upon one face of a crystal, the entire spectrum of resonances shifts to lower frequencies. The three above mentioned modes are observed to have slightly different mass sensitivity and hence undergo slightly different frequency shifts. It is this difference that is used to estimate the Z-ratio of the material. Using the modal equations and the observed frequencies of the modes [100] and [102], one can calculate the ratio of two elastic constants C C
. Both of these elastic constants relate to shear motion. The essential element
55
of Wajid’s theory is the following equation:
where M is the aerial mass density (film mass to quartz mass ratio per unit area) and Z is the Z-ratio. It is a fortunate coincidence that the combination MZ also appears in the Lu-Lewis equation [4], which can be used to extract an estimate of the effective Z-ratio from the equations below:
66
and
[5]
[6]
or
[7]
Where, F fundamental mode (mode [100]). Due to the multi-valued nature of the mathematical functions involved, the value of Z-ratio extracted in this manner is not always a positive definite quantity. This is hardly of any consequence however, because M is uniquely determined with the estimated Z and the measured frequency shift. Thus, thickness and rate of deposition are subsequently calculated from the knowledge of M.
One must be aware of the limitations of this technique. Since the estimate for Z-ratio is dependent on the frequency shifts of the two modes, any spurious shift due to excessive mechanical or thermal stress on the crystal will lead to errors.
and Fc denote uncoated and coated crystal frequencies in the
q
11
IPN 074-237AE
2 - 10
11.U.S. Patent No. 5,112,642 (May 12, 1992) International Patents Pending.
Needless to say, similar errors occur with the Z-match™ technique under similar circumstances. However, the automatic Z-ratio estimate is somewhat more prone to error, because the amplitude distribution of the mode [102] is asymmetric, whereas that of the mode [100] is symmetric over the active area of the crystal.
In our experience, film-induced stress on the crystal has the most deleterious effect. This effect is most pronounced whenever there is a presence of gas in the environment, for example, in reactive evaporation or sputtering processes. In such cases, if the bulk Z-ratio is already well known, it is better to use the bulk value instead of the automatically determined Auto Z-ratio. In cases of co-deposition and sequential layers, automatic Z-ratio estimation is significantly superior.

2.1.7 Control Loop Theory

The instrumental advances in measurement speed, precision and reliability would not be complete without a means of translating this improved information into improved process control. For a deposition process, this means keeping the deposition rate as close as possible to the desired rate. The purpose of a control loop is to take the information flow from the measurement system and to make power corrections that are appropriate to the characteristics of the particular evaporation source. When properly operating, the control system translates small errors in the controlled parameter, or rate, into the appropriate corrections in the manipulated parameter, power. The controller’s ability to quickly and accurately measure and then react appropriately to the small changes keeps the process from deviating very far from the set point.
IC/5 Operating Manual
The controller model most commonly chosen, for converting error into action is called PID. In the PID, P stands for proportional, I stands for integral and D stands for derivative action. Certain aspects of this model will be examined in detail a little further on. The responsiveness of an evaporation source can be found by repetitively observing the system response to a disturbance under a particular set of controller settings. After observing the response, improved controller parameters are estimated and then tried again until satisfactory control is obtained. Control, when it is finally optimized, essentially matches the parameters of the controller
IPN 074-237AE
model to the characteristics of the evaporation source.
It is quite laborious and frustrating to tune a controller for an evaporation source that takes several minutes to stabilize. It may take several hours to obtain satisfactory results. Often the parameters chosen for a specific rate will not be satisfactory for another. Ideally, it would be nice if a machine could optimize itself. INFICON’s IC/5 can do this. In an operator initiated mode that is used during initial setup the instrument will measure the source characteristics. Slow sources are characterized by having significant dead time, whereas fast sources have no dead time.
For a slow source, the IC/5 will use a PID model to calculate optimum source control parameters. For a fast source, the IC/5 will use an integrating control loop model to calculate optimum source control parameters
2 - 11
IC/5 Operating Manual
Output
Input
------------------
K
p
L– sexp
T1s1+
-------------------------------=
Techniques for calculating optimum source control parameters can be classified by the type of data used for tuning. They fall into basically three categories:
Closed Loop Methods
Open Loop Methods
Frequency Response Methods
Of these categories, the open loop methods are considered superior. They are considered superior because of the ease with which the necessary experimental data can be obtained and because of the elimination (to a large extent) of trial and error when the technique is applied.
INFICON’s Auto-Control-Tune characterizes a process from its step response attributes. After Auto-Control-Tune executes a step change of power, the resulting rate changes are smoothed and stored. The important response characteristics are determined as shown in Figure 2-7.
In general, it is not possible to characterize all processes exactly; some approximation must be applied. The most common is to assume that the dynamic characteristics of the process can be represented by a first-order lag plus a dead time. The Laplace transform for this model (conversion to the s domain) is approximated as:
[8]
Three parameters are determined from the process reaction curve. They are the steady state gain, K
, the dead time, L, and the time constant, T1. Several methods
p
have been proposed to extract the required parameters from the system response as graphed in Figure 2-7. These are: a one point fit at 63.2% of the transition (one time constant); a two point exponential fit; and a weighted least-square-exponential fit. From the above information a process is sufficiently characterized so that a controller algorithm may be customized.
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IC/5 Operating Manual
Ms Kc1
1
Tis
------- Tds++


Es=
Figure 2-7 Response of Process To An Open Loop Step Change
(At t=0 Control Signal is Increased)
A controller model used extensively is the PID type, shown in Laplace form in
equation [9].
[9]
Where
M(s) = manipulated variable or power
= controller gain (the proportional term)
K
c
T
= integral time
i
= derivative time
T
d
E(s) = process error
IPN 074-237AE
Figure 2-8 represents the controller algorithm and a process with first order lag plus
a dead time. The process block implicitly includes the dynamics of the measuring devices and the final control elements, in our case the evaporator power supply. R(s) represents the rate setpoint. The feedback mechanism is the error generated by the difference between the measured deposition rate, C(s), and the rate set point, R(s).
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IC/5 Operating Manual
Kc1
1
T
i
s
------- T
d
s++


K
p
L– sexp
T1s1+
-------------------------------
Rs
Es
S
Cs
setpoint error
[controller] [process]
+
deposition
rate
ISE e
2
tdt=
IAE e tdt=
ITAE t e tdt=
Figure 2-8 PID Controller Block Diagram
The key to using any control system is to choose the proper values of Kc, Td and
. Optimum control is a somewhat subjective quantity as noted by the presence of
T
i
several mathematical definitions as shown below.
The integral of the squared error (ISE) is a commonly proposed criterion of performance for control systems.
It can be described as:
[10]
where error = e = setpoint minus the measured rate. The ISE measure is relatively insensitive to small errors, but large errors contribute heavily to the value of the integral. Consequently, using ISE as a criterion of performance will result in responses with small overshoots but long settling times, since small errors occurring late in time contribute little to the integral.
The integral of the absolute value of the error (IAE) has been frequently proposed as a criterion of performance:
[11]
This criterion is more sensitive to small errors, but less sensitive to large errors, than ISE.
12
Graham and Lathrop
introduced the integral of time multiplied by the absolute
error (ITAE) as an alternate criterion of performance:
[12]
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2 - 14
12.Graham, D., and Lanthrop, R.C., “The Synthesis of Optimum Transient Response: Criteria and Standard Forms, Transactions IEEE, vol. 72 pt. II, November 1953.
IC/5 Operating Manual
K
c
1.36 KpLT1
0.947
=
T
i
1.19T
1
LT1
0.738
=
T
d
0.381T
1
LT
1

0.995
=
ITAE is insensitive to the initial and somewhat unavoidable errors, but it will weight heavily any errors occurring late in time. Optimum responses defined by ITAE will consequently show short total response times and larger overshoots than with either of the other criteria. It has been found that this criteria is generally most useful for deposition process control.
INFICON’s Auto-Control-Tune is based on an open loop measurement of the system’s response. From a step change in the control signal, the response characteristics of the system are calculated. The experimental determination of response characteristics is accomplished through two types of 2-point curve fits. They are determined either quickly, but less accurately (i.e., “Quick Tune”) at an arbitrary deposition rate, or less quickly, but more accurately (i.e., “Complete Tune”) near the desired rate setpoint. Since the process response characteristics depend on the position of the system (i.e. deposition rate for this discussion), the process response is best measured at the desired operating point of the system. This measured process information (i.e. process gain, K
, time constant, T1, and
p
dead time, L) is used to generate the best fitting PID control loop parameters for the specific system.
The most satisfactory performance criterion for deposition controllers is the ITAE. There will be overshoot, but the response time is quick, and the settling time is short. For all of the above integral performance criteria, controller tuning relations have been developed to minimize the associated errors. Using manually entered or experimentally determined process response coefficients, ideal PID controller coefficients can be readily calculated for the ITAE criteria as shown below.
[13]
[14]
[15]
For slow systems, in order to help avoid controller windup (windup is the rapid
IPN 074-237AE
increase in control signal before the system has the chance to respond to the changed signal), the time period between manipulated variable (control voltage) changes is lengthened. This allows the system to respond to the previous controller setting change, and aggressive controller settings can be used. A secondary advantage is that immunity to process noise is increased since the data used for control is now comprised of multiple readings instead of a single rate measurement, taking advantage of the mass integrating nature of the quartz crystal.
With process systems that respond quickly (short time constant) and with little to no measurable dead time, the PID controller often has difficulty with the deposition process noise (beam sweep, fast thermal shorts of melt to crucible, etc.). In these situations a control algorithm used successfully is an integral/reset type of controller. This type of controller will always integrate the error, driving the system
2 - 15
IC/5 Operating Manual
towards zero error. This technique works well when there is little or no dead time. If this technique is used on a process with measurable lag or dead time, then the control loop will tend to be oscillatory due to the control loop over-compensating the control signal before the system has a chance to respond. Auto-Control-Tune detects the characteristics of these fast response systems during measurement of the step response. This information is used to calculate the controller gain coefficient for the non-PID control algorithm.
2 - 16
IPN 074-237AE

3.1 Front Panel Controls

12345
678910
Operational controls for the IC/5 are located on the front panel of the instrument, as depicted in Figure 3-1.
Figure 3-1 IC/5 Front Panel
IC/5 Operating Manual
Chapter 3
Operation
1 CRT Screen
Provides graphical displays, set-up menus, status and error messages.
2 Function Keys
An array of function keys are located adjacent to the screen. These keys are labeled F1 through F6. They are used to select displays or menu items. Their
IPN 074-237AE
function is indicated on the display and is described in subsequent sections.
3 Data Entry Keys
A keypad array with numerics 0 through 9 and keys for Yes (Y), No (N), Enter (E), Clear (C), Print, and Menu used for selection and parameter entry. All numeric and Yes/No entries need to be followed by Enter. Clear is used to erase data entry errors. If an illegal value has been entered, Clear will erase the error message and re-display the last valid data. The Print Screen key is used to send the display information to the floppy drive. The Menu key is used to navigate through the instrument’s displays.
3 - 1
IC/5 Operating Manual
4 System Switches
An array of three keys that provide START, STOP and RESET functions, for process control. See section 3.4.2 on page 3-23.
5 3.5" Floppy Disk Access Port
Receptacle for the optional 3.5", 1.44 MB floppy disk.
6 Power
This switch controls secondary power to the instrument between ON and STANDBY. Power is provided when the button is in its depressed position. The instrument is initialized for approximately 5 seconds before providing an operational screen.
7 Pilot Light
A green pilot light, adjacent to the power switch, is illuminated when power is on.
8 Remote Control Jack
Receptacle for the wired hand-held remote controller.
9 Cursor Keys
An array of four keys that are used to move the display cursor either up, down, left or right. The keys auto-repeat; the cursor will continue to move as long as the key is held down or until a display field boundary is met.
10 Brightness Adjustment
An access hole for the display’s brightness adjustment potentiometer. Use a nonconductive TV adjustment tool to increase the brightness by turning the potentiometer clockwise.
IPN 074-237AE
3 - 2

3.2 Rear Panel Interfaces

1 2345678 9 10
111213
Interfaces for the IC/5 are located on the rear panel of the instrument as depicted in Figure 3-2.
Figure 3-2 IC/5 Rear Panel
IC/5 Operating Manual
1 IEEE488 Connector (Optional)
Provides connections for IEEE-GPIB interface.
2 Sensor Connectors - Channels 1 & 2 (standard)
Provides connection for the unit’s two standard sensor channels.
3 Sensor Connectors - Channels 3 & 4 (optional)
Expansion panel to accommodate the optional addition of two more sensors, sensors 3 & 4.
4 Sensor Connectors - Channels 5 & 6 (optional)
Expansion panel to accommodate the optional addition of two more sensors,
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sensors 5 & 6.
5 Sensor Connectors - Channels 7 & 8 (optional)
Expansion panel to accommodate the optional addition of two more sensors, sensors 7 & 8.
6 8 Relay x 14 Input I/O Card (standard)
Provides pin connection for 8 Relays rated for 30 V(dc) or 30 V(ac) RMS or 42 V(peak) maximum, and 14 TTL Inputs.
7 8 Relay x 14 Input I/O Card (optional)
Provides pin connection for 8 relays rated for 30 V(dc) or 30 V(ac) RMS or 42 V(peak) maximum, and 14 TTL inputs.
3 - 3
IC/5 Operating Manual
8 8 Relay x 14 Output I/O Card (optional)
Provides pin connection for 8 relays rated for 30 V(dc) or 30 V(ac) RMS or 42 V(peak) maximum, and 14 open collector type outputs.
9 6-Channel DAC (standard)
Provides source control voltage or recorder output for 6 channels (BNC connectors). Outputs are programmable for Source Control or Recorder Voltage.
10 24-Volt Supply (standard)
Provides one 24 V(dc) supply rated at 1.75 Amps.
11 Fan Outlet
Exhaust opening for the unit’s miniature fan. A grill is attached for safety.
12 AC Power Inlet
Provides a common connector for various international plug sets. The unit is factory set for 100 V(ac), 120 V(ac), 230 V(ac) or 240 V(ac) service.
13 RS-232C Remote Communication Connector (standard)
Provides a 9-pin RS-232C communications port.
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3 - 4

3.3 Displays

The IC/5 has many display screens for monitoring and programming processes. The four main types of displays are: OPERATE; SENSORS; MAINTENANCE/DIAGNOSTICS; and PROGRAM.
To move from one display to another, use either the function keys to the right of the screen or the MENU TREE function described in section 3.3.1 on page 3-8. Figure
3-3 provides an overview of the Program display hierarchy. Figure 3-4 provides an
overview of the Operate display hierarchy.
IC/5 Operating Manual
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3 - 5
IC/5 Operating Manual
PROGRAM
MATERIAL
DIRECTORY
PROCESS
DIRECTORY
I/O
SOURCE/SENSOR
DIRECTORY
Utility
(Pages 1 & 2)
MATERIAL
(Pages 1, 2, 3)
DELETE
MATERIAL
PROCESS
(Pages 1 & 2)
EDIT
SOURCE/SENSOR
(F1) (F2) (F3) (F4) (F5)
(F5)(F5)
(F5)* (F1)
(F5)
(F5)
COPY
DELETE
TAG /
LAYER
EDITING
UNTAG
MATERIAL
LIBRARY
*If material is undefined, pressing F5 will go directly to MATERIAL LIBRARY
(F1)
(F2)
(F5)
LOGIC STATEMENT DIRECTORY
I/O MAP
DIRECTORY
DEFINE
USER
MESSAGES
FLOPPY
DISK
REMOTE
COMMUNICATIONS
(F1) (F2) (F3) (F4) (F5)
EDIT
LOGIC
STATEMENT
I/O MAP
EDIT
MESSAGE
SAVE
MESSAGE
CANCEL
MESSAGE
CHANGE
CLEAR
MESSAGE
(F5) (F5)
(F1) (F2) (F3) (F4)
SELECT
NEGATE
ADD/DELETE
PARENTHESES
DELETE
CANCEL
CHANGES
SAVE
PARAMETERS
RETRIEVE
PARAMETERS
DELETE
ALL
FILES
(F1) (F2) (F3) (F5)
(F1) (F2) (F3) (F4) (F5)
EDIT CANCEL
NAME
TOGGLE
TYPE
(F1) (F2) (F3) (F4) (F5)
CONTINUECONTINUECONTINUE
DELETE
CONFIG.
FILES
(F3)
(F5)
(F5)(F5)
(F5)
REPLACE
INSERT
(F1) (F2)
NAME
SAVE NAME
CHANGE
CLEAR
NAME
Figure 3-3 Display Hierarchy - Program
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3 - 6
Figure 3-4 Display Hierarchy - Operate
OPERATE
CRYSTAL ROTATE TEST
SENSORS
XIU
(F1) (F2) (F3)
RS232
TEST
SYSTEM
STATUS
SOURCE
MAIN
CROSS
TAL K
(F1) (F3) (F4) (F5)
SWITCH TOGGLE
SOURCE
AUTOTUNE
PAR AMET ERS
(F1) (F2) (F3) (F4) (F5)
START LEAVE
MANUAL
(F5)
(F6)
CRUCIBLE
TOGGLE SENSOR
SHUTTER
START
MANUAL
SWITCH XTAL
HEAD
CALIBRATE
SHUTTERS POWER
STOP
MANUAL
POWER
START
AUTOTUNE
START
MANUAL
MAIN/DIAG
(F5)
(F6)
PROGRAM
(F2)
(F4)
(F5)
(F5)
CALIBRATION
STOP
CALIBRATION
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3.3.1 Display Navigation via the MENU TREE

Press the MENU key on the front panel to access the MENU TREE. (See Figure 3-5.)
Figure 3-5 Menu Display
During the MENU TREE display, the “F” keys (softkeys) will function as explained in Table 3-1.
Table 3-1 F Key Functionality
Key Function Description
F1 Show 1 level To view only the top level branches,
press function key F1.
F2 Show 2 levels To view the top two level branches,
press function key F2.
F3 Show 3 levels To view the top three level branches,
press function key F3.
F4 Show 4 levels To view all the branches, press function key F4.
F6 Operate To move to the OPERATE display, (see Figure 3-6 on page
3-10) press function key F6.
The Cursor keys are used to move the cursor along the MENU TREE.
Up arrow Moves the cursor up one line
Down arrow Moves the cursor down one line Left arrow Moves the cursor up one page Right arrow Moves the cursor down one page
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You can move to any of the instrument’s displays by positioning the cursor at the desired display and pressing the MENU key on the front panel. A second pressing of the MENU key returns the user to the MENU TREE.
The following displays cannot be accessed through the MENU TREE: AutoTune, Cross Talk Calibrate, Logic Statement Editing, Layer Editing, and I/O Map Editing Display. To access these displays, use the functions keys. The “Menu Unavailable” message is displayed when trying to access the MENU TREE from one of these displays.

3.3.2 Operate Display

The OPERATE display (shown in Figure 3-6) provides information about the current layer(s) in process. This includes the layer #, material, source #, and sensor # currently in process. The rate, thickness, power level, state, state time, layer time, and process time are all updated once a second.
Near the bottom of the display is a graph which gives an analog display of the rate deviation from the desired rate, while depositing. Alternatively, the graph can display the percent power being output during a process. Use the UTILITY display to set parameters that control the meaning, scaling and speed of the graph. (See
section 9.3 on page 9-2.)
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On the bottom right of the display is a status area. This area displays error messages, custom user messages and system status information, such as indicating the instrument is in TEST mode. For a complete list of error and status messages, see Chapter 13.
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Figure 3-6 Operate Display
Operate Display Description
1 Layer Currently In Process 2 Layer Timer 3 Material Being Deposited 4 Source Number In Use 5 Sensor Number(s) In Use 6 State of Layer 7 Function Key Definitions 8 Message Area 9 Date and Time 10 Run Number 11 Process Timer 12 Process Being Executed 13 Graphical Display of Rate Deviation or Power 14 Layer Thickness 15 Aggregate Rate
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During the OPERATE display, the function keys along the right side of the screen will function as explained in Table 3-2.
Table 3-2 Operate Display Function Keys
Key Function Description
F1 ZERO
THICKNESS
F2 SENSORS To access the SENSORS display, (see Figure 3-8 on page
F3 MANUAL To put the layer in manual control, (so that the power level
F4 KEY SWITCH 2
(or KEY SWITCH 1)
F5 MAIN/DIAG Press this key while in the READY state to move to the
To reset to zero both the displayed thickness of the current layer and the sensor thickness values shown on page 3 of the Material display, press function key F1.
3-13) which allows crystal switching and displays sensor
diagnostic information, press function key F2.
is controlled by the hand-held controller), press function key F3. When in manual, the F3 panel reads AUTO, and pressing it will remove the layer from the manual state and place it into the DEPOSIT state. See State Descriptions (section 3.5 on page 3-30) for a more complete description of manual operation.
When co-depositing two layers (see Figure 3-7), press this key to change the numeric designators for F1 and F3. The function key works in toggle fashion between the secondary (Key Switch 2) and primary (Key Switch 1) layers.
Maintenance/Diagnostics display. This allows selection of Source Maintenance or Diagnostics functions for the Remote communications port, or Cross Talk Calibration. (See section 3.3.4 on page 3-17.)
F6 PROGRAM To move to the PROGRAM menu, press F6. (See section
3.3.7 on page 3-20.)
In addition to the standard operational screen, if the system is configured for co-deposition, the operational screen will be divided to show information for both
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layers. Two options of the co-deposition OPERATE screen are available. One includes the graph information as shown in Figure 3-7. The other removes the graph and shows enlarged digital information for Rate, Thickness, and Power. The format is determined by a parameter in the UTILITY screen. (See Chapter 9.)
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Figure 3-7 Co-deposition Operate Display
3.3.2.1 Crystal Life and Starting Frequency
On the SENSORS display, crystal life is shown as a percentage of the monitor crystal’s frequency shift, relative to the 1.50 MHz frequency shift allowed by the instrument. This quantity is useful as an indicator of when to change the monitor crystal to safeguard against crystal failures during deposition. It is normal to change a crystal after a specific amount of crystal life (% change) is consumed.
It is not always possible to use a monitor crystal to 100% of crystal life. Useful crystal life is highly dependent on the type of material being deposited and the resulting influence of this material on the quartz monitor crystal. For well-behaved materials, such as copper, at about 100% crystal life the inherent quality, Q, of the monitor crystal degrades to a point where it is difficult to maintain a sharp resonance and therefore the ability to measure the monitor crystal’s frequency deteriorates.
When depositing dielectric or optical materials, the life of a gold, aluminum or silver quartz monitor crystal is much shorter—as much as 10 to 20%. This is due to thermal and intrinsic stresses at the quartz-dielectric film interface, which are usually exacerbated by the poor mechanical strength of the film. For these materials, the inherent quality of the quartz has very little to do with the monitor crystal’s failure.
It is normal for a brand new quartz monitor crystal to display a crystal life anywhere from 0 to 5% due to process variations in producing the crystal. Naturally, this invites the question, “Is a brand new crystal indicating 5% life spent inferior to a crystal indicating 1% life spent?”
If a new crystal indicates 5% life spent, it means that either the quartz blank is slightly thicker than normal (more mechanical robustness), or the gold electrode is slightly thicker than normal (better thermal and electrical properties), or both. In either case, its useful life with regard to material deposition should not be adversely affected. To verify this assertion, laboratory testing was performed on crystals
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which covered the crystal life range in question. Results indicate that a brand new crystal that indicates 3 to 5% life spent is just as good as, if not better than, a crystal indicating 0 to 2% life spent.
As a consequence, it is important to consider the change in crystal life (%), not just the absolute crystal life (%) indicated.

3.3.3 Sensors Display

Figure 3-8 Sensors Display
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3.3.3.1 SENSORS Display Description
1 # (Sensor Number field)
These numbers correspond to the measurement channel numbers on the rear panel of the IC/5. The cursor keys are used to position the box cursor over the desired sensor number. When either the Crystal Switch, Rotate Crystal Head, Test XIU, or Clear Quality / Stability function key is pressed, the function will be performed on the sensor indicated by the box cursor. It is not allowed to cursor
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to sensor numbers that do not have the corresponding measurement card installed. If a crystal fail has occurred for a particular sensor this condition is indicated by displaying the sensor number in reverse video.
2 SENS TYPE
This field indicates the Sensor Type chosen for each sensor number. A “1” indicates a single crystal head, a “2” indicates a dual crystal head, and a “6” indicates a CrystalSix sensor head.
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3 XTAL POSITIONS
This field is subdivided into three categories; current position (CURR), next position (NEXT), and FAILED. Information is displayed in these fields only if the sensor has a dual or CrystalSix sensor type.
For a dual sensor type the CURR field will show either the word ON or the word OFF. ON indicates the active sensor of the dual sensor head. OFF indicates the inactive (shuttered) sensor of the dual sensor head. For a dual sensor type the NEXT and FAILED fields have no meaning.
For a CrystalSix sensor type the CURR field indicates the current position of the CrystalSix sensor head. The NEXT field indicates the position to which the CrystalSix sensor head will rotate upon pressing the CrystalSwitch function key. The FAILED field indicates the CrystalSix sensor head positions containing failed crystals.
4 Z TYPE
This field displays the Z-ratio being used for the given sensor. MATL indicates the Z-ratio being used for thickness calculation is the value found in the Material parameter Z-ratio. AUTO indicates the IC/5’s Auto Z feature is being used for thickness calculations. Auto Z continually calculates the Z-ratio for the “as deposited” film. If the IC/5 suddenly lost the ability to calculate Auto Z, AUTO would change to either MATL or SENS. MATL has the same meaning as described above, SENS indicates the last calculated Auto Z value (prior to failure) is being used for thickness calculations for this sensor.
The IC/5 determines to use MATL or SENS depending on the frequency of the fundamental. If the fundamental frequency closely matches the “last valid” fundamental frequency prior to Auto Z failure, the IC/5 will use the SENS value. Otherwise the IC/5 will use the MATL value.
5 Q (Crystal Quality value field)
This field displays the value currently accumulated in the Crystal Quality counter when active. DLY indicates the Crystal Quality counter is not active. The Crystal Quality counter will become active five seconds after entering DEPOSIT and if the Crystal Quality parameter is non-zero. The function of the Crystal Quality counter is described on see page 4-8.
6 S (Crystal Stability value field)
This field displays the value currently accumulated in the Crystal Stability counter. The function of the Crystal Stability counter is described on see page 4-9.
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7XTAL
This field is subdivided into two categories. The first category, LIFE displays the crystal life. The IC/5 allows a 1.5 MHz frequency shift on the monitor crystal corresponding to 100% crystal life. The value shown represents the amount of crystal life consumed. The amount of useful crystal life is highly dependent on the nature of the material being deposited as well as deposition conditions. The second category is a measurement of the crystal activity, ACT. Activity is a measure of the sensor’s “health” or ability to conduct current. The values range from a maximum of 650 (healthiest) to a minimum of 0 (least healthy).
The activity value is useful for predicting when a crystal needs to be replaced. If a crystal is about to fail, its series resistance will increase, allowing less current to flow through the crystal and hence the activity value will decrease. The closer the activity value is to zero the more imminent a crystal failure.
It also can be used to gauge the health of the sensor head electrical contacts. For example, if a new monitor crystal is placed into the sensor head and has a crystal life of near 0%, but the activity value for this crystal is lower than 400, this indicates the sensor head or in-vacuum cable is in need of repair.
8RATE
This field is also subdivided into two categories. The first category is AVE. The value displayed here is the sensor’s average rate. This average is calculated based on a 2.5 second average minus the most recent 0.5 seconds of information. The second field is RAW representing the instantaneous rate measurement. These fields are useful in identifying if a sensor’s rate measurements are becoming erratic. N/A (not available) will be displayed in these fields for sensors not in use.
9 Function Key Definition area
10 Message area
11 Aggregate Rate, Thickness, and Power display area
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3.3.3.2 Function Key Selection Choices for the Sensors Display
F1 CRYSTAL SWITCH
To initiate a crystal switch for the sensor number selected, press function key F1. The crystal switch will be done on the sensor indicated by the box cursor. Use the cursor arrow keys to position the box cursor.
F2 ROTATE XTAL HEAD
If the sensor number chosen is a CrystalSix or rotary sensor type, press function key F2 to sequentially rotate the sensor head through all six positions. This is useful to initialize a CrystalSix or rotary sensor after replacing failed crystals. The action is taken on the sensor indicated by the box cursor. For the rotary sensor, a readout of failed (F) and good (G) crystals is shown in the lower left hand portion of the display. This readout assists the user in knowing which crystals are good and which are failed relative to the current position of the rotary sensor. This information is not retained upon leaving the SENSORS display. To re-gain this information, press the Rotate Xtal Head function key again.
F3 TEST XIU
Initiates the XIU self test. The XIU self test determines whether the crystal interface unit (XIU) and measurement card pair is operating properly.
NOTE: For the XIU self test to work properly, the XIU must have the six inch
BNC cable (IPN 755-257-G6) attached and must be disconnected from the sensor feedthrough.
F4 CLEAR QUALITY STABILITY
To clear the Quality and Stability counters for the sensor chosen by the box cursor, press function key F4.
F6 OPERATE
To return to the Operate display, press function key F6.
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3.3.4 Maintenance/Diagnostics Display

These displays provide a simple method for system maintenance and diagnostics. Pressing the MAIN/DIAG function key during the Operate display accesses the Maintenance/Diagnostics display.
Figure 3-9 Maintenance/Diagnostics Display
3.3.4.1 Function Key Selection Choices for the Maintenance/Diagnostics Display
F1 RS232 TEST
Press function key F1 to initiate the RS-232C COMM PORT self test. Upon completion of the test, the unit will display a message indicating the test was successful and the COMM PORT is okay; or the test failed and the COMM PORT is bad. If the COMM PORT is bad, a reminder message to make certain the RS-232C loop back connector is installed is displayed.
NOTE: The RS-232C Loop Back connector, IPN 760-406-P1 must be installed
on the IC/5 RS-232C port for the self test to work properly.
F3 SYSTEM STATUS
Press function key F3 to access the SYSTEM STATUS display. The SYSTEM STATUS display can also be accessed using the MENU TREE.
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F4 SOURCE MAINTENANCE
To move to the Source Maintenance display, press function key F4.
F5 CROSS TALK CALIBRATION
To enter the cross talk calibration series of displays, press function key F5. Cross talk calibration is used in co-deposition applications to correct for material flux from one source being deposited onto the sensors used to control the other material’s source. See section 12.5 on page 12-4 for the Cross Talk Calibration Procedure.
F6 OPERATE
To return to the Operate display, press function key F6.
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3.3.5 Source Maintenance Display

Figure 3-10 Source Maintenance Display
3.3.5.1 Function Key Selection Choices for the Source Maintenance Display
F1 SWITCH CRUCIBLE
To switch the source turret to the crucible position designated by the crucible parameter, press function key F1.
F2 TOGGLE SENSOR SHUTTERS
To activate the shutter relay for the sensors associated with the designated material, press function key F2. Pressing this key a second time deactivates the sensor shutter relays.
F3 TOGGLE SOURCE
To activate the shutter relay for the source associated with the designated material, press function key F3. A second pressing of this key deactivates the source shutter relay.
F4 START MANUAL POWER
To enable the hand-held controller to effect power changes to the source output associated with the chosen material, press function key F4. Pressing this key a second time exits manual power.
NOTE: The MANUAL power level is automatically set to zero % power when
exiting Manual Power while in source maintenance. This is different from executing a process. When executing a process, pressing the Manual Power key a second time will place the instrument into the Deposit State.
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F5 AUTOTUNE
To activate the Autotune displays, press function key F5. See section 12.6 on
page 12-11 for a description of Autotune and Autotune displays.
F6 MAIN/DIAG
To return to the Maintenance/Diagnostics display, press function key F6.

3.3.6 Cross Talk and Calibration Display

Cross talk calibration is used during co-deposition to correct for material from one source being deposited onto sensors used to control the second co-deposited material’s source.
When using multiple sensors and multiple sources it can be very difficult to empirically determine the required cross talk corrections. The following series of functions enables an automatic determination of cross talk values.
Figure 3-11 Cross Talk Calibration Display
IC/5 Operating Manual
The Cross Talk Calibration Display provides for initiation of the automatic cross talk calibration algorithm to determine the calibration thicknesses (CAL THICK). The CAL THICK values are entered into page 3 of the Material Definition Display. These values are used during co-deposition to correct for material from one source being deposited onto the sensors used to control the second co-deposited material’s source.
A calibration is done on each material to be co-deposited. See section 12.5 on
page 12-4 for a detailed description of cross talk calibration.
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3.3.7 Program Displays

Program displays allow you to program processes and system configuration. Each program display has a section at the bottom that gives the rate, thickness, power level, and status of the process running. PROGRAM is divided into five major categories, with some of these being further subdivided. Each category has a complete section in this manual detailing the parameters in that category and any special information needed to navigate those displays. Following is a brief description of each category, with reference to the appropriate sections of the manual.
Figure 3-12 Program Display
3.3.7.1 Function Key Selection Choices for the Program Display
F1 MATERIAL DIRECTORY
Material parameters include information specific to a given material to be deposited. The information includes Z ratio, density, soak times; up to 24 materials can be defined. (See Chapter 4.)
F2 PROCESS
The process screens allow the user to program a series of materials into a multilayer process. Desired rate, final thickness, and other information specific to each layer is also programmed here. Fifty different processes can be defined, containing up to a total of 250 layers. (See Chapter 5.)
F3 I/O
The I/O category deals with several different external links from the IC/5 to the vacuum system. This category is divided into the following subcategories, each accessed by a function key. Refer to the indicated sections for more detailed information on each subcategory.
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Figure 3-13 I/O Display
LOGIC STATEMENT DIRECTORY: Provides a display that facilitates selection of Logic statements for editing. (See Chapter 6.)
I/O MAP DIRECTORY: Provides a display where relays, inputs, or outputs may be assigned names and where the relay type may be designated as normally open or normally closed. (See section 6.6 on page 6-16.)
DEFINE USER MESSAGES: Provides a display where user messages may be assigned. (See section 6.7 on page 6-17.)
FLOPPY DISK: Saves or retrieves parameters to or from floppy disk or saves Datalogging parameters to the floppy disk (See section 3.6.8 on page 3-39).
REMOTE COMMUNICATIONS: Defines configuration for external computer communications (See Chapter 7.)
F4 SOURCE/SENSOR DIRECTORY
Source/Sensor displays allow the user to set up the configuration for sources and sensors connected to the IC/5. The information includes which source and sensor shutter outputs are connected, how many crucibles a source has, and whether a sensor is a single, dual or CrystalSix. (See Chapter 8.)
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F5 UTILITY
Parameters on the UTILITY displays deal with overall system setup, including how displays are formatted and general process choices (such as whether to STOP on max power). (See Chapter 9.)
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3.4 Process Description

The IC/5 allows the user to control deposition of a sequential series of single layers or two co-deposited layers of materials. This is done by defining and executing a process.

3.4.1 Defining a Process

The following procedure is used to define a process. (All steps do not necessarily have to be followed in the given order.)
1 Make sure the instrument is in READY.
Some configuration and process parameters can be changed only while the instrument is in READY. Therefore, before setting parameters, make sure READY appears as the state on the OPERATE display. If it does not, press STOP then RESET.
2 Configure the sensors.
Configuring the sensors involves designating whether the sensor is a single, dual or CrystalSix sensor, and what output relays are connected to the sensor shutter and crystal switcher, if any. Also, the Auto Z feature is activated or deactivated during sensor configuration. These parameters are on the SENSOR display of the SOURCE/SENSOR display. See Chapter 8 for a detailed description for programming these parameters. Also see section 3.6.1
on page 3-32 for details on crystal switching.
3 Configure the sources.
Configuring the sources involves selecting the digital-to-analog voltage converter (DAC) output, the output voltage range and polarity, and selecting the output relay for the source shutter. Also, if a source has more than one crucible, this is set up in the source configuration. The source parameters are programmed on the SOURCE screen of the SOURCE/SENSOR display. See
Chapter 8 for a detailed description for programming these parameters. Also
see section 3.6.2 on page 3-34 for details on crucible selection.
4 Define materials.
To define materials, the MATERIAL displays are used. Each distinct material used in the process must be defined. If the same material is going to be used more than once in the process, it needs to be defined only once. Final thickness and rate parameters are determined by the layer definition. The material definition includes density, Z-ratio, tooling, and soak power characteristics. Control loop characteristics also relate to the material. Also, a specific sensor and source are associated with each material. See Chapter 4 for a detailed description for programming these parameters.
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5 Define layer/process.
To define layers and processes, the PROCESS displays are used. A process is an ordered set of layers. Layers are entered in order on the PROCESS display. Each layer consists of a material, chosen by number from the material directory, final thickness, and rate. Additional information can be provided here for special process features; these include thickness setpoint and time limit triggers, RateWatcher, rate ramps, crucible selection and co-deposition. For a detailed description of layer parameters see Chapter 5.
6 Configure utility information.
The final step in defining a process is to program any process related parameters on the UTILITY display. This includes which defined process to execute, what layer to begin the process on (typically 1), and whether to STOP on max power. It may also be desirable to modify the definition of the graphical display and analog output. See Chapter 9 for a detailed description of utility parameters.

3.4.2 Executing a Process

IC/5 Operating Manual
Once a process has been defined, it is ready to execute.
NOTE: Certain parameters cannot be changed while executing a process. The
IC/5 will not allow these parameters to be changed.
A Process is not being executed when the instrument is in the READY state, or
when the Last Layer is in the IDLE state (end of process). A Layer is not being executed when the instrument is the READY, STOP, or IDLE state.
STOP freezes a process, the status information on the display is maintained
and the control voltage output is set to zero.
START, pressed once, will continue the process from the point at which it was
stopped.
RESET takes a stopped process back to the beginning of the process at the
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designated “Layer to START.”
HINT: It may be desirable to execute a new process in TEST before doing an
actual deposition to check correct shutter operation, sequencing and limits.
The execution of a process is depicted in the following state diagram.
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See Figure 3-15 and
Figure 3-16
Figure 3-14 Process State Diagram
1 Make sure the instrument is in READY. If not, press STOP then RESET.
2 Press START. Assuming there are no configuration problems, the first layer will
3 When the first layer is complete, it will go to IDLE. Press START again to begin
4 If at some point there is a need to interrupt or discontinue the process, press
5 A critical error may occur while a process is running.
enter pre-deposition, and continue on through deposition and post-deposition. (See section 3.5 on page 3-30 for detailed information about the states of a layer.) If there are configuration problems, a message describing the problem will be displayed, see Chapter 13 for Status and Error Message definitions.
the next layer. Repeat until the process is complete.
STOP. This will close the sensor and source shutters, set the power to zero, and freeze the display. The process can be restarted where it left off by pressing START. (The pre-deposition phases will be repeated.) To completely abandon the run, press RESET.
For example, a sensor fail on a single sensor with a single head crystal may occur in pre-deposition. The IC/5 will automatically STOP if a critical error occurs. See section 13.1, Status and Error Messages, on page 13-1 for a list of critical errors. Assuming the error has been remedied, the process can be continued where it left off by pressing START. Pressing RESET will abandon the run.
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3.4.3 Pre-conditioning a Layer

It may be desirable to prepare a layer for deposition while the previous layer is in progress. Pressing START while a layer is running will begin the pre-deposition states of the next layer. However, there are certain restrictions and some precautions should be taken.
1 The next layer cannot use the same source as the current layer. Pressing
START will cause a source conflict and the process will STOP. If pre-conditioning is desired, be sure the sources defined in the two consecutive layers are different.
2 The next layer will enter DEPOSIT while the current layer is in DEPOSIT
(co-deposition) unless a Soak Hold is activated. A Soak Hold will hold the pre-deposition at the chosen Soak Power level until ready to proceed. To set these up, see Chapter 6.
NOTE: If a Soak Hold is not active and two layers attempt to enter DEPOSIT using
some of the same sensors, a STOP sensor conflict will occur.
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3.4.4 Co-deposition

On the IC/5 it is possible to execute two layers simultaneously. A co-deposition is defined on the Layer Definition display. A YES is entered for the co-deposition parameter of the first layer to be co-deposited. This layer is referred to as the primary layer. The primary and secondary layers must both be defined before the YES is entered for the co-deposition parameter of the primary layer. In co-deposition, when the primary layer reaches final thickness, the secondary layer will also leave deposition. However, if the secondary layer reaches final thickness first, the primary layer will continue until reaching its programmed final thickness. There are two other parameters associated with co-deposition. The first is ratio control. This controls the secondary layer’s rate at a percentage of the primary layer’s desired rate. The second is cross-sensitivity, which compensates for interference between the two depositions. See Sections section 5.3 on page 5-4 and section 12.5 on page 12-4 for details on programming these parameters.
If two layers are programmed for co-deposition, pressing START once will begin both layers.
NOTE: It is also possible to run two layers at the same time by pressing START
twice, but ratio control, cross-sensitivity and automatic completion of the secondary channel will not be active.
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3.4.5 Automating a Process

A process can be automated so that a complete process can be executed without having to press START between all the layers. A process can be automated by any of the following three methods.
1 Setting the logic statement:
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IF PROCESS END ALL
AND LAYER END ALL
THEN START
will cause a complete process to run by pressing START once. For a step by step procedure to set up this statement, see section 6.5 on page 6-15.
2 Remote communication control. An external computer could be set up to
monitor the status of a process and issue START commands at desired times. (See Chapter 7.)
3 Remote input line. A remote input line can be configured to issue a START
command based on some external event. (See Chapter 6.)
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Figure 3-15 State Sequence Diagram - Part A
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Figure 3-16 State Sequence Diagram - Part B
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3.5 State Descriptions

Table 3-3 State Descriptions
STATE CONDITION RELAY CONTACT
STATUS
NOTE: 1 through 7 are Pre-Deposit states.
1. READY The IC/5 will accept a START command
2. SOURCE SWITCH Instrument advances to next state when “turret” input is low, or “turret” delay has elapsed. If IDLE PWR of the previous layer using this source is not equal to zero, power is set to zero before the crucible position changes. [Crucible #, Source #]
3. RISE TIME 1 Source is rising to Soak Power 1 level. [Rise Time 1]
4. SOAK TIME 1 Source is being maintained at Soak Power 1 level. [Soak Time 1, Soak Power 1]
5. RISE TIME 2 Source is rising to Soak Power 2 level. [Rise Time 2]
6. SOAK TIME 2 Source is being maintained at Soak Power 2 level. [Soak Time 2, Soak Power 2]
7. SOAK HOLD 1
SOAK HOLD 2
Source is being maintained at Soak Power level. [Soak Hold input]
Source Shutter
Inactive Inactive
Inactive Inactive
Inactive Inactive
Inactive Inactive
Inactive Inactive
Inactive Active
Inactive Inactive
Sensor Shutter
Inactive Active
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8. SHUTTER DELAY Rate is being controlled. Advances to Deposit State once the Source is in Rate Control within > of 5% or 1A/s. [Shutter Delay ON]
NOTE: 9 through 16 are Deposit states.
9. CONTROL DELAY Constant Power at Soak Power 2. Startsrate control when the control delay time elapses. [Control Delay, Control Delay Time]
10. DEPOSIT Rate control. [Rate, Final Thickness, PID COntrol, Process Gain, Primary Time Constant, System Dead Time]
11. RATE RAMP TIME 1 Rate control, desired rate changing. [New Rate 2, Start Ramp 2, Ramp Time 2]
Inactive Active
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Active Active
Active Active
Active Active
Table 3-3 State Descriptions (continued)
STATE CONDITION RELAY CONTACT
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STATUS
NOTE: 1 through 7 are Pre-Deposit states.
12. RATE RAMP TIME 2 Rate control, desired rate changing. [New Rate 2, Start Ramp 2, Ramp Time 2]
13. RATEWATCHER
(SAMPLE)
14. RATEWATCHER
(HOLD)
Rate control. [RateWatch Accuracy]
Constant power, based on last sample’s average power. [RateWatch Time]
15. MANUAL Source power controlled by hand-held controller.
16. TIME-POWER Crystal failed; source maintained at average control power prior to crystal failure. [Time Pwr Y]
NOTE: 17 through 20 are Post-Deposit states.
17. FEED RAMP Source changing to Feed Power. [Feed Power, Feed Ramp Time]
18. FEED Source maintained at Feed Power level. [Feed Time]
Source Shutter
Sensor Shutter
Active Active
Active Active
Active Inactive
Active Active
Active Active
Inactive Inactive
Inactive Inactive
19. IDLE RAMP Source changing to Idle Power.
Inactive Inactive
[Idle Ramp Time, Idle Power]
20a.IDLE POWER (=0%) Source maintained at zero power;
Inactive Inactive
will accept a START command.
20b.IDLE POWER (>0%) Source resting at Idle Power; will
Inactive Inactive
accept a START command.
21. STOP Source output set to zero power.
Inactive Inactive
The display is frozen at the last rate
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and thickness values; will not accept a START or RESET command.
NOTE: In the STOP state the instrument will accept a START provided a Crystal Failure has not occurred for the sensors used in the layer being started.
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IC/5 Operating Manual

3.6 Special Features

The IC/5 has several special features to enhance the performance of the instrument.

3.6.1 Crystal Switching

The IC/5 offers a choice of single, dual, CrystalSix or rotary sensors. The dual or CrystalSix sensor provides a backup monitor crystal in case a crystal fails during deposition. To configure sensors, see Chapter 8.
A crystal switch will automatically occur when:
The instrument is configured for a dual head, a layer is running on the primary
sensor, and the primary crystal fails. The primary sensor is the sensor (of the dual sensor) which has its option set to non-zero.
The instrument is configured for a CrystalSix, a layer is running, and there is at
least one good crystal from the crystal position list (see Chapter 4) left in the carousel when the active crystal fails.
The instrument is configured for a rotary sensor, a layer is running, and there is
at least one good crystal in the rotary sensor.
The instrument is configured for a dual head or single heads, a START is
executed and the designated primary sensor is different from the last sensor run.
Using a CrystalSix and pressing START, if the current CrystalSix position is not
the position listed first on the material display.
A crystal switch will NOT automatically occur:
During a state of STOP, READY or IDLE.
When the designated primary sensor has already failed at the START of a
layer. (A STOP will occur.)
During deposition if the secondary crystal of a dual head fails, or the last good
crystal of a CrystalSix fails. (In either case a TIME-POWER or STOP will occur, depending on the sensor option chosen.)
A crystal switch can be manually executed via the front panel, hand-held controller, remote communications, or logic statements when the system is configured for dual, CrystalSix, or rotary sensors.
NOTE: When crystal switching with the hand-held controller, the IC/5 must be on
the SENSORS display.
NOTE: The active sensor of a dual sensor head is shown as ON in the SENSORS
display.
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3.6.1.1 CrystalSix Position Select
Used in conjunction with the position-select CrystalSix sensor (IPN 750-446-G1), the IC/5 allows crystal switching to a predetermined subset of the six crystal positions, if desired. This subset is selected using the Crystal Position parameter located on page 3 of the Material Set Up display. (See section 4.3 on page 4-5.) The position select feature allows you to select which of the six crystals are to be used for a given material. In applications involving sequential layering of different materials this allows specific crystals to be used for specific materials, eliminating the need for more than one sensor head in the deposition system.
3.6.1.2 Rotary Sensor Crystal Switching
Selecting type 7, Rotary, as the sensor type enables sequential crystal switching only. Upon a crystal switch the Crystal Switch Output will first close for one second and then open (i.e., one pulse to move one position). The IC/5 will not keep track of which position the Rotary Sensor is on nor will it keep track of which crystals are good and which are failed. The Position Selection feature available with Type 6=Multi is not available for the rotary sensor.
After the one second pulse, the IC/5 measurement system software will attempt to find the resonant frequency for the crystal in this position. If the IC/5 does not find a good resonant frequency for this crystal it will again pulse the Crystal Switch Output for one second and attempt to find a resonant frequency at this position. There will be a maximum of five attempts to find a good resonant frequency (i.e., a maximum of five pulses of the Crystal Switch Output). If a good resonant frequency is not found after five attempts, the IC/5 will then enter the Time Power or STOP state depending on the Sensor Option value chosen in the Material parameters display.
IC/5 Operating Manual
There is to be a maximum of five attempts to find a good resonant frequency however, while executing a Layer, if the IC/5 detects a crystal fail and automatically initiates a crystal switch it will recognize there has been an automatic crystal switch. The IC/5 will keep track of the number of times an automatic crystal switch has been done. Therefore if there have been five automatic crystal switches and then
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the sixth crystal fails, the IC/5 will go directly to either Time Power or STOP as appropriate without any additional pulses.
Start resets all crystal fail flags to ’good’.
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IC/5 Operating Manual

3.6.2 Source/Crucible Selection

The IC/5 can control a source with up to 64 crucibles, through up to six binary encoded relays. This is configured by setting the Number Of Crucibles, Crucible Outputs, Turret Feedback, Turret Input, and Turret Delay parameters on the SOURCE display of the SOURCE/SENSOR Directory. (See section 8.3 on page
8-3 for details on programming the parameters associated with source/crucible
selection.)
To define which crucible to use for a layer, set the “crucible” parameter on the PROCESS display. When the layer is started, if the current crucible position is different from the one requested, the system’s turret controller will move into position. This will be signified on the OPERATE screen by the state indicator SOURCE SWITCH. The layer sequencing will continue on to RISE 1 after either the turret delay time expires or an input indicates the turret is in position, depending on which option is chosen. The specific method used is determined by the parameter Turret Feedback on the SOURCE screen.
NOTE: If the source has been idling at a nonzero power when the START is
initiated, the power will be dropped to zero before the crucible is changed.
3.6.2.1 Example: Programming Turret Source Crucible Selection
Interfacing a turret source controller to the IC/5 requires both hardware connections to the turret controller and properly defining certain instrument parameters.
Proceed to the SOURCE/SENSOR Directory (see Figure 8-1 on page 8-1) and choose the source that is going to be defined as the turret source. This is accomplished by Editing the chosen source as follows (see Figure 8-2 on page
8-1):
1 Designate the Number of Crucibles; for example, 4.
2 Select the Crucible Output. This defines the number of the first relay that
encodes the crucible number selected by the active layer. Relays are defined sequentially with the first relay containing the least significant bit (LSB). The greater the number of crucibles selected, the greater the number of relays required. The number required is based on binary encoding (actual coding is binary -1, with 00 representing position 1 and 11 representing position 4). Any unused sequence of relays may be used if it is long enough to provide sufficient selections.
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IC/5 Operating Manual
3 Select the Crucible Output Type as normally open (NO), or normally closed
(NC).
Example:
Number of crucibles = 4 Crucible output = 6 Crucible output type = NO
For this example, wiring to the controller is based on Table 3-4. Only relays 6 and 7 are needed to encode the four possible positions.
Table 3-4 Wiring To The Controller
Crucible Position Contact Status
Relay #6 Relay #7
1OpenOpen
2 Closed Open
3 Open Closed
4 Closed Closed
NOTE: If the crucible output type were normally closed (NC), Table 3-4 would
need to be modified by exchanging open and closed.
4 Determine whether Turret Feedback is desired. This allows the turret position
controller to stop further instrument processing until the requested turret position is satisfied. If chosen, a turret input must be connected to the turret position controller’s feedback signal.
If Turret Feedback is not chosen, program a Turret Delay Time which allows an adequate time for positioning to take place. Once the delay time has expired, instrument state processing continues.
5 The selection of a particular crucible for a layer is defined in the process
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directory.
6 Select the process to modify.
7 Program the particular “Crucible Number” for each layer.
Example:
Layer 1: Crucible Number = 1 Layer 2: Crucible Number = 2 Layer 4: Crucible Number = 4
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3.6.3 Auto Z

IC/5 Operating Manual
The Auto Z feature of the IC/5 automatically determines the Z-ratio of a crystal. This feature is enabled on the SENSOR screen of the SOURCE/SENSOR display (see
section 8.4 on page 8-6). For the theory behind Auto Z, see section 2.1.6 on page 2-9.
The following information briefly describes Auto-Z and details the conditions under which a crystal is "unable to Auto-Z".
Auto Z is calculated based on the slightly different mass sensitivities of the fundamental and the first anharmonic resonances of the quartz crystal oscillator. Therefore, the need to measure the frequencies of both the fundamental and the first anharmonic resonances is critical.
When inserting a monitor crystal and attempting to Auto Z, the fundamental and anharmonic frequencies are measured to determine the status of the crystal. The crystal status may be classified into four categories:
1 New Crystal
The first category is for a “new” crystal, one that does not have any material deposited onto it. If both frequencies fall within the allowed range for new crystals, the instrument will allow an Auto Z calculation with this crystal.
2 Known, Used Crystal
The second category is for a “known, used” crystal, to account for the possibility that a person would remove a good monitor crystal and then reinsert the same crystal. Whenever a crystal fail occurs the last valid crystal frequencies are stored in the instrument. Upon inserting a coated monitor crystal the measured frequencies for this crystal will fall outside of the allowed range for “new” crystals. These frequencies are then compared with the stored values to determine if this crystal is the same one as was in use prior to the crystal fail. If the crystal is the same as used previously, and Auto Z was being calculated previously, the instrument will allow an Auto Z calculation with this crystal.
3 Unknown, Used Crystal
The third category is for an “unknown, used” crystal. This category is for a used crystal that, upon insertion, shows measured frequencies that are outside of the allowed “new” crystal range and also do not match the frequencies stored within the instrument. This results in an “unable to Auto Z” condition because the initial frequencies of the uncoated monitor crystal are not known.
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4 Unable to detect anharmonic frequency.
As mass is deposited onto the crystal, the oscillation is damped. This damping may be severe enough that the resonance can no longer be determined. If the instrument loses the ability to measure the first anharmonic frequency, but is still able to determine the fundamental frequency, the “unable to Auto Z” message is displayed. The instrument will then continue to use the fundamental frequency to monitor the deposition.
If the instrument loses the ability to measure the fundamental frequency, the “XTAL fail” message is displayed.
Unable to Auto Z
An “unable to Auto Z” condition occurs whenever:
The anharmonic frequency cannot be measured.
The fundamental and anharmonic frequencies of the monitor crystal have
not been continuously measured from the uncoated to the coated state.

3.6.4 Auto Tune - Optimizing the Control Loop

IC/5 Operating Manual
The control loop parameters can often be calculated automatically by the IC/5. This is done by using the AutoTune feature. For a detailed description of AutoTune, see
section 12.6 on page 12-11.

3.6.5 Rate Watcher

The IC/5 includes a sample and hold function which enables periodic sampling of the deposition rate by opening and closing the sensor shutter. If you are controlling inherently stable deposition sources, this function is useful in maximizing crystal life. When RateWatcher is enabled, during deposit, rate control will be established. Then the sensor shutter will close for a designated amount of time. The shutter will once again be opened to validate and adjust the power level. This procedure is repeated throughout the deposition. Two process parameters - RateWatch time
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and RateWatch accuracy - control this function. See section 5.3 on page 5-4 for details on programming these parameters.
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IC/5 Operating Manual

3.6.6 Hand-Held Controller

A Hand-Held Controller, see Figure 3-17, is provided as an accessory with the IC/5. The Controller serves as a wired remote to manually control power, switch crystals and produce a STOP.
The Controller is attached to the instrument with a modular plug to the front panel. Power is affected (only when in Manual mode) by moving the POWER/STOP switch laterally. A STOP is produced by moving the POWER/STOP switch down (only when in Manual mode). When in a READY, IDLE, or STOP state and the instrument is on the SENSORS display, a crystal switch is activated by pressing the red button on the body of the controller.
The ship kit includes a convenience hook for the Controller that can be attached to the instrument’s mounting ears or some other accessible location.
Figure 3-17 Hand-Held Controller
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IPN 074-237AE

3.6.7 Test Mode

Rate Display
40
Density (gm/cc)
--------------------------------------
Tooling %
100
-------------------------
A
sec=
This instrument contains a software-controlled test mode which simulates actual operation. Optionally, time can be compressed so that a long process can be simulated in one tenth of the time. The purpose of the test mode is to verify basic operation and to demonstrate typical operation. The rate display during test mode operation is:
Crystal fails are ignored in test mode. Crystal switching is disabled. All other relays and inputs operate normally.

3.6.8 Floppy Disk (Optional)

The floppy disk drive is an optional accessory for the IC/5. This option allows storage of all parameter information, as well as automatic datalogging information, to the 3.5 inch 1.44 MByte floppy diskette. The maximum number of files which may be stored onto the floppy disk is 224 for a 1.44 MByte diskette and 112 files when using a 720 KByte diskette. The maximum number of files includes parameter files as well as datalogging files. Diskettes must be pre-formatted.
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The parameter set may be stored under a new or existing filename and retrieved from an existing file. A file containing the IC/5 parameter set is referred to as a configuration file. Datalog information will be saved to the diskette only if the datalog output is turned on and the output path is chosen as the floppy drive (as opposed to choosing output to the RS-232C port). Selection of the output path is done in the remote communications parameters display. (See section 7.2 on page
7-2.)
Multiple files may be contained on one diskette. Filenames may be eight characters long; extensions are used to differentiate between configuration files and datalogging files. All files must be contained on the root directory. Storage/retrieval from sub-directories is not allowed.
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The instrument supports the writing of filenames using alphanumeric characters selected using the cursor keys. Characters A through Z and numbers 0 through 9 inclusive are available. The instrument has the ability to display the files contained on the diskette. A scrolling feature is enabled to view those filenames which cannot fit on the screen. Error messages include: Disk Full; File Not Found; Disk Write Protected; Media Error; Disk not Found; File is Read Only. See section 6.8 on page
6-19 for details on floppy disk operation.
Datalog files are automatically named using the process number and run number. See section 3.6.10 on page 3-40 for the Datalog string details.
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IC/5 Operating Manual
CAUTION
NOTE: A floppy disk access code is enabled when the instrument has a program
lock code set. By entering a floppy disk access code the IC/5 parameters can be saved to, or retrieved from, the diskette only without entering the Program Lock Code. (See Chapter 9.)
Do not bend the diskette.
Keep the diskette dry and do not expose the diskette to temperature extremes.
Do not remove the diskette from the instrument while a save or retrieve operation is taking place.

3.6.9 Lock and Access Codes

The IC/5 has several forms of protection to prevent unauthorized changing of parameters. Refer to the utility setup section for a description of parameter and I/O lock codes and the floppy disk access code. In addition, a method of locking the entire display is available through the remote communications. Lock codes are entered on the Utility Display. (See Chapter 9.)
HINT: To clear any of the locks, except the floppy disk access code, hold down the

3.6.10 Datalog

Datalog automatically saves to diskette or outputs to Remote Comm every time a source shutter closure occurs. When the Datalog data is saved to a diskette the information will be saved under a filename. Filenames will not be output when the Datalog information is sent out the Remote Comm port.
Datalog files saved to diskette will be automatically named using the process number and run number. The format of the filename is PXXRXXX.IDL. If the diskette already contains a file with the same filename as the new datalog information, the new datalog information will be appended to the old file.
At each source shutter close, the datalog information will be appended to the file (when saved to diskette) until the end of the Process.
The Datalog data set is defined as follows:
clear key on power up. This will clear all lock codes. HOWEVER, if no lock codes are present, all parameters will be cleared by doing this.
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IC/5 Operating Manual
DATE: MMDDYYYY TIME: XX:XX
PROCESS #1: ##
RUN #: ###
LAYER #: ###
MATERIAL NAME: NNN#MM#
PROCESS TIME XX:XX
LAYER TIME: XX:XX
DEPOSITION TIME: XX:XX
THICKNESS: ###.### kÅ
AVE. AGG. RATE: ###.### Å/s
AVE. RATE DEVIATION: ##.# Å/s
ENDING POWER: ##.# %
AVE. POWER: ##.# %
COMPLETION MODE:normal, time-power...ave. value,
crystal fail, remote, keyboard, max.
power, hand-held controller. Crystal Use History (example) SENSOR 1
BEG. END BEG. END BEG. END
XTAL FREQ. FREQ. LIFE LIFE ACT. ACT. STAB. QUAL.
1 5975323 5876991 0% 2% 245 240 30 22 2 5978368 5879012 0% 2% 225 189 1200 99 3 5768733 5677987 3% 5% 176 168 0 0 4 5346278 5129870 48% 51% 150 105 0 0 5 4876789 4567899 78% 81% 101 101 25 1 6 4678843 4500000 98% 100% 100 92 0 0
SENSOR 2
BEG. END BEG. END BEG. END
XTAL FREQ. FREQ. LIFE LIFE ACT. ACT. STAB. QUAL.
2 5978368 5879012 0% 2% 225 189 1200 99 3 5768733 5677987 3% 5% 176 168 0 0 5 4876789 4567899 78% 81% 101 101 25 1
SENSOR 8
BEG. END BEG. END BEG. END
XTAL FREQ. FREQ. LIFE LIFE ACT. ACT. STAB. QUAL.
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1 5975323 5876991 0% 2% 245 240 30 22
NOTE: A minus sign in front of the END FREQ. value indicates that crystal has
failed.
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IC/5 Operating Manual
If two layers are co-deposited, the first layer to have a source shutter close will be data-logged first.
The ability to turn ON/OFF datalogging and where to output the datalog data set is determined by a programmable parameter located in the Remote Communications display. The CRYSTAL USE HISTORY data is an optional subset of the datalog string. A second parameter located in the Remote Communications display is used to determine if the CRYSTAL USE HISTORY is to be output. Additionally, the datalog string format is selectable between a page format and a comma delimited format. The comma delimited format is actually comma-and-quote delimited intended for file importation into a spreadsheet program. When a spreadsheet program imports a file having the comma delimited format data groups that are strictly numbers become value entries, data groups surrounded by quotes are stored as labels. For the page format, only those sensors which are used in a particular Material for a particular Layer will be datalogged. For the comma delimited format, all the data fields are returned for all the sensors and crystals. If a sensor is not used during the deposition, the data field will contain a zero.
Outputting the Datalog Data Set to multiple outputs at the same time (for example, Save to diskette and Output to Remote Comm at the same time) is not allowed.
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4.1 Material Set Up Overview

PROGRAM
MATERIAL DIRECTORY
MATERIAL
MATERIAL LIBRARY
The IC/5 can store the definition parameters for up to 24 materials. Each layer in a Process references one of these materials by its directory number, ranging from 1 to 24. Any material that is to be used must be defined.
Materials are defined by referencing the internal Material Library (see Figure 4-1) and by completing a series of parameter entries at the front panel.
Figure 4-1 Display Tree for Material Set Up
IC/5 Operating Manual
Chapter 4
Material Set Up
Material Set Up is initiated by selecting the MATERIAL Directory (F1) key in the Program display. This will invoke the Material Directory (see Figure 4-2). Upon entry to the Material Directory, the cursor will be found at the last referenced material.

4.2 Material Definition

Material definition is initiated by selecting the MATERIAL (F5) panel in the Material Directory. If the cursor is placed at a previously defined material, the definition displays for that material will be entered. If the cursor is placed at an unassigned
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material, the Material Library will be entered to select from one of more than two hundred cataloged materials.
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IC/5 Operating Manual
CAUTION
Figure 4-2 Material Directory
A previously defined material can be deleted provided it is not referenced in any process. Place the cursor at the material to be deleted and select the DELETE MATERIAL (F1) panel in the Material Directory. The Material Directory will be compressed to eliminate any gaps and Process definitions will be updated to reflect any directory number changes.
Logic statements will not be updated to reflect Material Directory number changes after deleting a material.
The Material Library (see Figure 4-3) provides an alphabetic list of materials by chemical name along with their density and Z-ratio. A custom USER material may also be selected. Once a material is selected from the library listing, press the Define Material (F5) function key to enter the material parameter series of displays.
You can move among and through the materials by using the cursor and panel keys, as shown in the following tables and illustrations.
Figure 4-3 Material Library
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IC/5 Operating Manual
m
Table 4-1 Function Key Selection Choices For Material Library
Key Function Description
F1 PAGE FORWARD Select this panel to access additional pages of
material listings.
F2 PAGE BACK Select this panel to return to previous pages of
material listings.
F5 DEFINE MATERIAL Select this panel to complete the definition of the
selected material.
F6 MATERIAL Select this panel to return to the Material Directory.
Figure 4-4 Material Definition (Page 1)
Table 4-2 Function Key Selection Choices For Material Description
Key Function Description
F1 PAGE FORWARD Select this panel to access the second page of
material definition parameters.
F2 PAGE BACK Select this panel to return to the first page of
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material definition parameters.
F5 MATERIAL LIBRARY Select this panel to access the Material Library.
F6 MATERIAL DIRECTORY Select this panel to return to the Material
Directory.
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IC/5 Operating Manual
Figure 4-5 Material Definition (Page 2)
Figure 4-6 Material Definition (Page 3)
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4.3 Material Definition Parameters

Rate Avg. and Thickness values are shown on Material definition page 3, for each sensor in use. The Rate Avg. shown is the rate averaged over the last 2.5 seconds minus the most recent 0.5 seconds. This is the same average as shown in the SENSORS display. Thickness is the value at each sensor. The thickness values are zeroed when the zero thickness function key is pressed when in the OPERATE display. N/A is shown for sensors which are not in use.
DENSITY . . . . . . . . . . . . . . . . . . . . . 0.100 to 99.999 gm/cc
This parameter is specific to the material being deposited onto the Crystal. It is one of two parameters that relate the mass loading on the crystal to a thickness. Values range from 0.100 to 99.999. If a material is chosen from the Material Library the density is automatically entered. The default value is 10.00.
Z-RATIO . . . . . . . . . . . . . . . . . . . . . . 0.100 to 15.000
This parameter is specific to the material being deposited. It is one of two parameters that relate the mass loading on the crystal to a thickness. Values range from 0.100 to 15.000. If a material is chosen from the Material Library the Z-ratio is automatically entered. The default value is 1.00. This parameter is superseded if Auto Z-ratio is selected in Source/Sensor Set-Up.
IC/5 Operating Manual
SOURCE . . . . . . . . . . . . . . . . . . . . . 1,2,3,4,5,6
This parameter determines which source, defined in the Source Set Up display, is to be used for source control voltage for the material being defined. Values can range from 1 to 6. The default is 1. This parameter cannot be changed while a process is running.
CONTROL LOOP . . . . . . . . . . . . . . 0,1,2
This parameter establishes the control loop algorithms pertaining to either a slow responding source or a fast responding source. Permissible values are 0, 1, or 2. Select a 0 to choose the non-PID control loop, good for fast- and medium-speed responding systems with high noise levels (e.g., an electron
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beam gun with or without a liner, having a large sweep amplitude of low frequency, 10 Hz or less). Select a 1 for the PI control loop, good for fast, medium, or slow systems with medium noise levels (e.g., an electron beam gun with medium sweep amplitude frequency, 20 to 100 Hz; also, sputtering and resistive sources). Select a 2 for the PID Control Loop, good for fast, medium or slow systems with low noise levels (e.g., an electron beam gun with sweep off or at a high frequency, 100+ Hz; also, sputtering and resistive sources).
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IC/5 Operating Manual
TOOLING TF
i
TmTx=
PROCESS GAIN . . . . . . . . . . . . . . . 0.01 to 99.999 Å/sec/% pwr
This parameter determines the change in % Power for a given rate deviation (dRate/dPower). The larger the process gain value, the smaller the change in power for a given rate error. Values range from 0.01 to 99.999. The default value is 10.00.
PRIMARY TIME CONSTANT . . . . . 0.010 to 999.999 sec
This is the evaporation source’s time constant. This value is defined as the time difference between the actual start of a change in rate and the time at which 63% of the rate step is achieved. This value may be measured according to the above criterion or it may be determined empirically. Values range from 0.010 to
999.999 seconds. The default value is 1. This parameter is disabled if the CONTROL LOOP option parameter is set to 0.
SYSTEM DEAD TIME . . . . . . . . . . . 0.010 to 999.999 sec
This value is defined as the time difference between a change in % power and the start of an actual change in rate. Values range from 0.010 to 999.999 seconds. The default value is 1.0. This parameter is disabled if the CONTROL LOOP option parameter is set to 0.
MASTER TOOLING. . . . . . . . . . . . . 10.0 to 400.0%
This is a correction factor used for correlating the aggregate rate and thickness accumulation on the crystal with the thickness accumulation on the substrate. This thickness difference is due to the geometric distribution of material flux from the source.
The tooling factor is calculated using the equation
where TF T
= Thickness on the Crystal.
x
= Initial Tooling Factor, Tm = Actual Thickness at the Substrate, and
i
Values range from 10.0 to 400.0%. The default value is 100%.
If the MASTER TOOLING parameter is changed, the new MASTER TOOLING value is used for subsequent calculation of the individual as well as aggregate rate and thickness. Also, the aggregate thickness and each sensor’s thickness accumulated thus far will be re-scaled based on the change to the MASTER TOOLING.
For single sensor applications, this is the recommended parameter to use to get agreement between sensor and substrate thicknesses. The sensor tooling should be left at 100%. For multiple sensor applications, the sensor tooling factors should first be adjusted so all sensors read the same rate. Next, adjust the MASTER TOOLING to get agreement between the thickness measured by the IC/5 and the thickness measured at the substrates.
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