INFICON IC-5 User Manual

OPERATING MANUAL

IC/5

Thin Film Deposition Controller

IPN 074-237AE

OPERATING MANUAL

IC/5

Thin Film Deposition Controller

IPN 074-237AE

www.inficon.com [e-mail]

Due to our continuing program of product improvements, specifications are subject to change without notice.

©2001 INFICON

Trademarks

The trademarks of the products mentioned in this Operating Manual are held by the companies that
produce them.

INFICON® is a trademark of INFICON Inc.

Windows®, Windows 95® and Microsoft® are registered trademarks of Microsoft Corporation.

CAJON® is a registered trademark of Swagelok, Co.

All other brand and product names are trademarks or registered trademarks of their respective companies.

The information contained in this Operating Manual is believed to be accurate and reliable. However, INFICON
assumes no responsibility for its use and shall not be liable for any special, incidental, or consequential
damages related to the use of this product.

Due to our continuing program of product improvements, specifications are subject to change without notice.

©2001 All rights reserved.
Reproduction or adaptation of any part of this document without permission is unlawful.

DECLARATION

OF

CONFORMITY

This is to certify that this equipment, designed and manufactured by:

INFICON Inc.

2 Technology Place

East Syracuse, NY 13057

USA

meets the essential safety requirements of the European Union and is placed on the
market accordingly. It has been constructed in accordance with good engineering
practice in safety matters in force in the Community and does not endanger the safety
of persons, domestic animals or property when properly installed and maintained and
used in applications for which it was made.

Equipment Description: IC/5 Thin Film Deposition Controllers, including

Oscillators and Crystal Sensors as properly installed.

Applicable Directives: 73/23/EEC as amended by 93/68/EEC

89/336/EEC as amended by 93/68/EEC

Applicable Standards: EN 61010-1 : 1993

EN 55011, Group 1, Class A : 1991

EN 50082-1 : 1992

CE Implementation Date: January 2, 1996

Authorized Representative: Gary W. Lewis

Vice President - Quality Assurance
INFICON Inc.

ANY QUESTIONS RELATIVE TO THIS DECLARATION OR TO THE SAFETY OF INFICON'S PRODUCTS SHOULD BE
DIRECTED, IN WRITING, TO THE QUALITY ASSURANCE DEPARTMENT AT THE ABOVE ADDRESS.

01/16/96

Warranty

WARRANTY AND LIABILITY - LIMITATION: Seller warrants the products
manufactured by it, or by an affiliated company and sold by it, and described on
the reverse hereof, to be, for the period of warranty coverage specified below, free
from defects of materials or workmanship under normal proper use and service.
The period of warranty coverage is specified for the respective products in the
respective Seller instruction manuals for those products but shall not be less than
two (2) years from the date of shipment thereof by Seller. Seller's liability under
this warranty is limited to such of the above products or parts thereof as are
returned, transportation prepaid, to Seller's plant, not later than thirty (30) days
after the expiration of the period of warranty coverage in respect thereof and are
found by Seller's examination to have failed to function properly because of
defective workmanship or materials and not because of improper installation or
misuse and is limited to, at Seller's election, either (a) repairing and returning the
product or part thereof, or (b) furnishing a replacement product or part thereof,
transportation prepaid by Seller in either case. In the event Buyer discovers or
learns that a product does not conform to warranty, Buyer shall immediately notify
Seller in writing of such non-conformity, specifying in reasonable detail the nature
of such non-conformity. If Seller is not provided with such written notification,
Seller shall not be liable for any further damages which could have been avoided if
Seller had been provided with immediate written notification.

THIS WARRANTY IS MADE AND ACCEPTED IN LIEU OF ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, WHETHER OF MERCHANTABILITY OR
OF FITNESS FOR A PARTICULAR PURPOSE OR OTHERWISE, AS BUYER'S
EXCLUSIVE REMEDY FOR ANY DEFECTS IN THE PRODUCTS TO BE SOLD
HEREUNDER. All other obligations and liabilities of Seller, whether in contract or
tort (including negligence) or otherwise, are expressly EXCLUDED. In no event
shall Seller be liable for any costs, expenses or damages, whether direct or
indirect, special, incidental, consequential, or other, on any claim of any defective
product, in excess of the price paid by Buyer for the product plus return
transportation charges prepaid.

No warranty is made by Seller of any Seller product which has been installed,
used or operated contrary to Seller's written instruction manual or which has been
subjected to misuse, negligence or accident or has been repaired or altered by
anyone other than Seller or which has been used in a manner or for a purpose for
which the Seller product was not designed nor against any defects due to plans or
instructions supplied to Seller by or for Buyer.

This manual is intended for private use by INFICON® Inc. and its customers.
Contact INFICON before reproducing its contents.

NOTE: These instructions do not provide for every contingency that may arise in
connection with the installation, operation or maintenance of this equipment.
Should you require further assistance, please contact INFICON.

www.inficon.com [e-mail]

IC/5 Operating Manual

Table Of Contents

Chapter 1

Introduction and Specifications

1.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1

1.1.1 Related Manuals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1

1.2 Instrument Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2

1.2.1 Definition of Notes, Cautions and Warnings. . . . . . . . . . . . . . . . . . . . . . . . . 1-2

1.2.2 General Safety Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-3

1.2.3 Earth Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-4

1.2.4 Main Power Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-5

1.3 How To Contact Customer Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-6

1.3.1 Returning Your Instrument . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-6

1.4 IC/5 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7

1.4.1 Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-7

1.4.2 Screens and Hierarchy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-7

1.4.3 Set-Up Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8

1.4.4 Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10

1.4.5 Source / Recorder Outputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11

1.4.6 Logic Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12

1.4.7 Relays / Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12

1.4.8 Remote Communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13

1.4.9 Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13

1.4.10 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13

1.4.11 Operating Environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14

1.4.12 Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14

1.4.13 Warm Up Period . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-14

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1.4.14 Size. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-14

1.4.15 Connector Clearance Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14

1.4.16 Weight . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14

1.4.17 Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14

1.5 Unpacking and Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-15

1.6 Parts and Options Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-15

1.6.1 Base Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-15

1.6.2 Pre-installed Options or Spares . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-16

1.6.3 Optional Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16

1.6.4 Oscillator Packages and Sensors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-17

1.7 Initial Power-On Verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-18

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IC/5 Operating Manual

Chapter 2

Measurement and Control Theory

2.1 Basics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

2.1.1 Monitor Crystals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2

2.1.2 Period Measurement Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4

2.1.3 Z-match Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5

2.1.4 Active Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6

2.1.5 ModeLock Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7

2.1.6 Auto Z-match Theory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9

2.1.7 Control Loop Theory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11

Chapter 3

Operation

3.1 Front Panel Controls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

3.2 Rear Panel Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3

3.3 Displays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5

3.3.1 Display Navigation via the MENU TREE . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8

3.3.2 Operate Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9

3.3.2.1 Crystal Life and Starting Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12

3.3.3 Sensors Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13

3.3.3.1 SENSORS Display Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13

3.3.3.2 Function Key Selection Choices for

the Sensors Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16

3.3.4 Maintenance/Diagnostics Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-17

3.3.4.1 Function Key Selection Choices for the

Maintenance/Diagnostics Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-17

3.3.5 Source Maintenance Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18

3.3.5.1 Function Key Selection Choices for the

Source Maintenance Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18

3.3.6 Cross Talk and Calibration Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-19

3.3.7 Program Displays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-20

3.3.7.1 Function Key Selection Choices for the Program Display . . . . . . . . . . . . . 3-20

3.4 Process Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-22

3.4.1 Defining a Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-22

3.4.2 Executing a Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-23

3.4.3 Pre-conditioning a Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-25

3.4.4 Co-deposition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-26

3.4.5 Automating a Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-27

3.5 State Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-30

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IC/5 Operating Manual

3.6 Special Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-32

3.6.1 Crystal Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-32

3.6.1.1 CrystalSix Position Select. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-33

3.6.1.2 Rotary Sensor Crystal Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-33

3.6.2 Source/Crucible Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-34

3.6.2.1 Example: Programming Turret Source Crucible Selection . . . . . . . . . . . . . 3-34

3.6.3 Auto Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-36

3.6.4 Auto Tune - Optimizing the Control Loop . . . . . . . . . . . . . . . . . . . . . . . . . . 3-37

3.6.5 Rate Watcher . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-37

3.6.6 Hand-Held Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-38

3.6.7 Test Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-39

3.6.8 Floppy Disk (Optional) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-39

3.6.9 Lock and Access Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-40

3.6.10 Datalog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-40

Chapter 4

Material Set Up

4.1 Material Set Up Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1

4.2 Material Definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1

4.3 Material Definition Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-5

4.4 Error Messages in Material Set-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-15

Chapter 5

Process Set-Up

5.1 Process Set-Up Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1

5.2 Process Definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-2

5.2.1 Layer Editing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-3

5.3 Layer Definition Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4

5.4 Error Messages in Process Set-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8

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5.5 Special Layer Parameter Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-9

5.5.1 Skip Deposit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-9

5.5.2 Rate Ramp Trigger of Final Thickness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9

Chapter 6

I/O Logic Statement Set-Up

6.1 I/O Logic Statement Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-1

6.2 Editing the Logic Statements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-2

6.2.1 Logic Statement Directory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3

6.2.2 Logic Statement Editing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4

6.3 ’IF’ Event Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6

6.4 ’THEN’ Action Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-12

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IC/5 Operating Manual

6.5 Logic Statement Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-15

6.6 I/O Map Directory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-16

6.7 Define User Messages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-17

6.8 Floppy Disk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-19

6.9 Error Messages in I/O

Logic Statement Set-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-21

Chapter 7

Remote Communications

7.1 Remote Communication

Configuration Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1

7.2 Remote Communication Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-2

7.3 Error Messages in

Remote Communications Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-4

7.4 Remote Communications Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-4

7.5 Physical Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-4

7.5.1 RS-232C Serial Port. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-5

7.5.2 IEEE488 Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-7

7.5.2.1 IEEE Settings for a National Instruments IEEE-GPIB Board . . . . . . . . . . . . 7-8

7.6 Message Protocols. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-8

7.6.1 INFICON Message Formats. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-9

7.7 INFICON Standard

Communication Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-10

7.7.1 ECHO Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-10

7.7.2 HELLO Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-10

7.7.3 Query Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-11

7.7.3.1 Query Material Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-11

7.7.3.2 Query Process Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-14

7.7.3.3 Query Utility Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-15

7.7.3.4 Query Sensor Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-16

7.7.3.5 Query Source Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-16

7.7.3.6 Query Output Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-17

7.7.3.7 Query Logic Statements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-17

7.7.3.8 Query Output Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-17

7.7.3.9 Query Input Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-17

7.7.3.10 Query User Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-17

7.7.4 UPDATE Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-18

7.7.4.1 Update Material Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-18

IPN 074-237AE

7.7.4.2 Update Process Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-21

7.7.4.3 Update Utility Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-22

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IC/5 Operating Manual

7.7.4.4 Update Sensor Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-23

7.7.4.5 Update Source Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-23

7.7.4.6 Update Output Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-24

7.7.4.7 Update Logic Statements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-24

7.7.4.8 Update Output Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-27

7.7.4.9 Update Input Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-27

7.7.4.10 Update User Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-27

7.7.5 STATUS Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-28

7.7.6 REMOTE Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-38

7.7.7 Negative Response Error Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-41

7.8 Sample INFICON Messages and

Host Programs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-41

7.8.1 Sample INFICON Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-41

7.8.2 Sample Host Programs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-43

7.8.2.1 Serial Communications - No Checksum. . . . . . . . . . . . . . . . . . . . . . . . . . . 7-43

7.8.2.2 Serial Communication with Checksum . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-44

7.8.2.3 IEEE Sample Host Program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-45

Chapter 8

Source/Sensor Set-Up

8.1 Source/Sensor Set-Up Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-1

8.2 Source/Sensor Navigation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-2

8.3 Source Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-3

8.4 Sensor Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-6

8.5 DAC Output Selection Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-8

8.6 Error Messages in Source/Sensor Set-Up . . . . . . . . . . . . . . . . . . . . . . . . . . 8-9

Chapter 9

Utility Set-Up

IPN 074-237AE

9.1 Utility Set-Up Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-1

9.2 Utility Navigation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-2

9.3 Utility Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-2

9.4 Error Messages in Utility Set-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7

Chapter 10

Applications

10.1 Multiple Sensor Deposition Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-1

10.1.1 Instrument Parameters and Corrections for

Multiple Sensor Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-2

10.2 Trend Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-4

10.2.1 Instrument Parameters Associated with the Trend Analysis Feature. . . . . 10-5

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IC/5 Operating Manual

10.3 Use as a System Controller Example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-5

10.3.1 System Equipment List. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-8

10.3.1.1 Valves. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-8

10.3.1.2 Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-8

10.3.1.3 Solenoid Valves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-9

10.3.1.4 Electron Beam Gun Power Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-9

10.3.1.5 Vacuum Gauges and Controllers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-9

10.3.1.6 Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-10

10.3.1.7 Lamps. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-10

10.3.2 I/O Set-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-10

10.3.2.1 Outputs Connected to I/O Board 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-13

10.3.2.2 Outputs Connected to I/O Board 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-14

10.3.2.3 Logic Statement Directory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-15

Chapter 11

Installation and Interfaces

11.1 Location Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-1

11.1.1 Sensor Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-1

11.1.2 Sensor Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-3

11.1.3 Control Unit Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-5

11.2 Avoiding Electrical Interference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-5

11.2.1 Verifying/Establishing Earth Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-5

11.2.2 Connections to Earth Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-6

11.2.3 Minimizing Noise Pickup From External Cabling . . . . . . . . . . . . . . . . . . . . 11-7

11.3 Connecting the Controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-8

11.3.1 Verifying the Correct Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-8

11.3.2 Voltage Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-9

11.3.3 Routing XIU Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-10

11.3.4 Interface Cable Fabrication and Pin-Out . . . . . . . . . . . . . . . . . . . . . . . . . 11-10

11.3.4.1 Source Control Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-10

IPN 074-237AE

11.3.4.2 Input/Relay Module Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-11

11.3.4.3 RS-232C Communications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-13

11.3.4.4 Isolated +24 V(dc) Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-14

Chapter 12

Calibration Procedures

12.1 Importance of Density, Tooling and Z-ratio . . . . . . . . . . . . . . . . . . . . . . . . 12-1

12.2 Determining Density . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-1

12.3 Determining Tooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-2

12.4 Laboratory Determination of Z-ratio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-3

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IC/5 Operating Manual

12.5 Determining Cross Talk Calibration

For Co-Deposition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-4

12.5.1 Procedure Set-Up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-6

12.5.1.1 Cross Talk Calibrate Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-7

12.5.1.1.1 Function Key Selection Choices for

Cross Talk Calibration Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-8

12.5.2 Cross Talk Calibration MANUAL display . . . . . . . . . . . . . . . . . . . . . . . . . .12-8

12.5.2.1 Function Key Selection Choices for

Cross Talk Calibration Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-8

12.5.3 Cross Talk Calibration CALIBRATE display . . . . . . . . . . . . . . . . . . . . . . . .12-9

12.5.3.1 Function Key Selection Choices for

Cross Talk Calibration Calibrate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-9

12.5.4 Cross Talk Calibration SELECT display . . . . . . . . . . . . . . . . . . . . . . . . . . .12-9

12.5.4.1 Function Key Selection Choices for

Cross Talk Calibration Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-10

12.5.5 Cross Talk Calibration Procedural Notes . . . . . . . . . . . . . . . . . . . . . . . . .12-10

12.6 AutoTuning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-11

12.6.1 AutoTune Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-12

12.6.2 AutoTune Manual Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-13

12.6.3 AutoTune Tuning Display and

AutoTune Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-14

12.6.4 Definition of AutoTune Messages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-15

12.6.5 AutoTune Preparation Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-17

Chapter 13

Troubleshooting, Status and Error Messages

13.1 Status and Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13-1

13.2 Troubleshooting Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-11

13.2.1 Major Instrument Components and Assemblies. . . . . . . . . . . . . . . . . . . .13-12

IPN 074-237AE

13.2.2 Troubleshooting the Instrument . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13-13

13.2.3 Troubleshooting Transducers/Sensors. . . . . . . . . . . . . . . . . . . . . . . . . . . 13-15

13.2.4 Troubleshooting Computer Communications . . . . . . . . . . . . . . . . . . . . . . 13-20

13.3 Replacing the Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-23

13.3.1 Standard and Compact. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13-23

13.3.2 Shuttered and Dual Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-24

13.3.3 Bakeable Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13-25

13.3.4 Sputtering Sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13-26

13.3.5 Crystal Snatcher . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13-27

13.3.6 CrystalSix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-27

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IC/5 Operating Manual

13.4 Crystal Sensor Emulator

IPN 760-601-G1 or 760-601-G2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-28

13.4.1 Diagnostic Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-29

13.4.1.1 Measurement System Diagnostic Procedure . . . . . . . . . . . . . . . . . . . . . . 13-29

13.4.1.2 Feed-Through Or In-Vacuum Cable

Diagnostic Procedure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-30

13.4.1.3 Sensor Head Or Monitor Crystal

Diagnostic Procedure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-31

13.4.1.4 System Diagnostics Pass But

Crystal Fail Message Remains. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-32

13.4.2 % XTAL Life . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-32

13.4.3 Sensor Cover Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-33

13.4.3.1 Compatible Sensor Heads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-33

13.4.3.2 Incompatible Sensor Heads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-33

13.4.4 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-34

Appendix A

Material Table

A.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .A-1

Index

IPN 074-237AE

TOC - 8

1.1 Introduction

The IC/5 is a closed loop process controller designed for use primarily in physical
vapor deposition. The unit monitors and/or controls the rate and thickness of the
deposition of thin films. Deposition rate and thickness are inferred from the
frequency change induced by mass added to a quartz crystal. This technique
positions sensors in the path between or to the side of the source of the vaporized
material and the target substrate. The sensor incorporates an exposed oscillating
quartz crystal whose frequency decreases as material accumulates. The change
in frequency provides information to determine rate and thickness and to
continually control the evaporation power source. With user supplied time,
thickness and power limits and with desired rates and material characteristics, the
unit is capable of automatically controlling the process in a precise and repeatable
manner. User interaction is accomplished via the unit's front panel and consists of
selection or entry of parameters to define the process.

IC/5 Operating Manual

Chapter 1

Introduction and Specifications

The complete system consists of a main electronics unit, the IC/5, sensor heads
and a crystal interface unit (XIU) for each attached sensor. These items are
generally bundled at the factory and are also sold separately.

The IC/5 Manual provides user information for installing, programming, calibrating
and operating the main electronics unit.

When reading the IC/5 Manual, please pay particular attention to the NOTES,
CAUTIONS, and WARNINGS found throughout the text. The Notes, Cautions, and
Warnings are defined in section 1.2.1 on page 1-2.

You are invited to comment on the usefulness and accuracy of this manual by filling
out the registration card and returning it.

IPN 074-237AE

1.1.1 Related Manuals

Sensors are covered in separate manuals.

 074-154 - Bakeable

 074-155 - CrystalSix

 074-156 - Single/Dual

 074-157 - Sputtering

1 - 1

IC/5 Operating Manual

CAUTION

WARNING

WARNING - Risk Of Electric Shock

1.2 Instrument Safety

1.2.1 Definition of Notes, Cautions and Warnings

When using this manual, please pay attention to the NOTES, CAUTIONS and
WARNINGS found throughout. For the purposes of this manual they are defined as
follows:

NOTE: Pertinent information that is useful in achieving maximum instrument

efficiency when followed.

Failure to heed these messages could result in damage
to the instrument.

Failure to heed these messages could result in personal
injury.

Dangerous voltages are present which could result in
personal injury.

IPN 074-237AE

1 - 2

1.2.2 General Safety Information

WARNING - Risk Of Electric Shock

CAUTION

Do not open the instrument case! There are no
user-serviceable components within the instrument
case.

Dangerous voltages may be present whenever the power
cord or external input/relay connectors are present.

Refer all maintenance to qualified personnel.

This instrument contains delicate circuitry which is
susceptible to transient power line voltages. Disconnect
the line cord whenever making any interface
connections. Refer all maintenance to qualified
personnel.

IC/5 Operating Manual

IPN 074-237AE

1 - 3

IC/5 Operating Manual

WARNING - Risk Of Electric Shock

1.2.3 Earth Ground

The IC/5 is connected to earth ground through a sealed three-core
(three-conductor) power cable, which must be plugged into a socket outlet with a
protective earth terminal. Extension cables must always have three conductors
including a protective earth terminal.

Never interrupt the protective earth circuit.

Any interruption of the protective earth circuit inside or
outside the instrument, or disconnection of the
protective earth terminal is likely to make the instrument
dangerous.

This symbol indicates where the protective earth ground
is connected inside the instrument. Never unscrew or
loosen this connection.

IPN 074-237AE

1 - 4

1.2.4 Main Power Connection

WARNING - Risk Of Electric Shock

This instrument has line voltage present on the primary
circuits whenever it is plugged into a main power source.

Never remove the covers from the instrument during
normal operation.

There are no operator-serviceable items within this
instrument.

Removal of the top or bottom covers must be done only
by a technically qualified person.

In order to comply with accepted safety standards, this
instrument must be installed into a rack system which
contains a mains switch. This switch must break both
sides of the line when it is open and it must not
disconnect the safety ground.

IC/5 Operating Manual

IPN 074-237AE

1 - 5

IC/5 Operating Manual

1.3 How To Contact Customer Support

Worldwide support information regarding:
 Technical Support, to contact an applications engineer with questions

regarding INFICON products and applications, or

 Sales and Customer Service, to contact the INFICON Sales office nearest you,

or

 Repair Service, to contact the INFICON Service Center nearest you,
is available at www.inficon.com.

If you are experiencing a problem with your instrument, please have the following
information readily available:

 the serial number for your instrument,
 a description of your problem,
 an explanation of any corrective action that you may have already attempted,
 and the exact wording of any error messages that you may have received.

To contact Customer Support, see Support at www.inficon.com.

1.3.1 Returning Your Instrument

Do not return any component of your instrument to INFICON without first speaking
with a Customer Support Representative. You must obtain a Return Material
Authorization (RMA) number from the Customer Support Representative.

If you deliver a package to INFICON without an RMA number, your package will be
held and you will be contacted. This will result in delays in servicing your
instrument.

Prior to being given an RMA number, you may be required to complete a
Declaration Of Contamination (DOC) form if your instrument has been exposed to
process materials. DOC forms must be approved by INFICON before an RMA
number is issued. INFICON may require that the instrument be sent to a
designated decontamination facility, not to the factory. Failure to follow these
procedures will delay the repair of your instrument.

IPN 074-237AE

1 - 6

1.4 IC/5 Specifications

1.4.1 Measurement

Crystal Frequency . . . . . . . . . . . . . . 6.0 MHz (new crystal) to 4.5 MHz

Internal Precision . . . . . . . . . . . . . . . ± 0.004657 Hz over 100 ms sample for

Thickness & Rate Resolution . . . . . . 0.00577 Å (new crystal);

Thickness Accuracy . . . . . . . . . . . . . 0.5% typical, (dependent on process

Frequency Accuracy. . . . . . . . . . . . . ± 2 ppm 0-50 °C

Measurement Frequency . . . . . . . . . 10 Hz

IC/5 Operating Manual

fundamental and anharmonic frequencies

0.01016 Å (crystal @ 4.5 MHz) over
100 ms sample for material density = 1.0,
Z-ratio = 1.0

conditions, especially sensor location,
material stress, temperature and density)

Measurement Technique . . . . . . . . . ModeLock with Auto-Z

User Interface. . . . . . . . . . . . . . . . . . CRT and limited membrane keypad. All

parameters accessible through computer
communications. Multiple message areas for
indication of states and detailed indication of
abnormal and stop conditions.

1.4.2 Screens and Hierarchy

Navigation

1) Traditional. . . . . . . . . . . . . . . . Six soft keys

2) "Windows" influence. . . . . . . . X-tree like function with 4 levels of hide/show.

IPN 074-237AE

Structure. . . . . . . . . . . . . . . . . . . . . . Separate screens dedicated to

1) Materials, 2) Layers, 3) Logic,

4) Sensors, 5) Sources, 6) Utility,

7) Maintenance, 8) Communications,

9) Operation

1 - 7

IC/5 Operating Manual

1.4.3 Set-Up Parameters

# of Processes . . . . . . . . . . . . . . . . . 50

# of Layers . . . . . . . . . . . . . . . . . . . . 250 (total)

# of Materials . . . . . . . . . . . . . . . . . . 24

Density . . . . . . . . . . . . . . . . . . . . . . . 0.100 to 99.99 gm/cc

Z-ratio. . . . . . . . . . . . . . . . . . . . . . . . 0.100 to 15.000 or Automatic

# of Sources . . . . . . . . . . . . . . . . . . . Any of 6 channels

Co-deposition . . . . . . . . . . . . . . . 2 sources may operate concurrently

Control Loop types . . . . . . . . . . . . . . (0,1,2) Non-PID, PI, PID

PID Control Mode. . . . . . . . . . . . . . . Fast or Slow Source

Process Gain . . . . . . . . . . . . . . . 0.01 to 100 Å/sec/%Power

Primary Time Constant. . . . . . . . 0.010 to 200.0 seconds

System Dead Time. . . . . . . . . . . 0.010 to 50.000 seconds

Master Tooling Factor. . . . . . . . . . . . 10.0 to 400.0%

Sensor Tooling Factor . . . . . . . . . . . 10.0 to 400.0%

Sensor Weight . . . . . . . . . . . . . . . . . 1.0 to 400.0%

Sensors . . . . . . . . . . . . . . . . . . . . . . 2 standard, 6 additional w/optional hardware

CrystalSix Position Select . . . . . Material designation of position(s)

Sensor Option . . . . . . . . . . . . . . . . . Enter 0 for "not used"

Enter 1 for "stop if last to fail"
Enter 2 for "time power if last to fail"
Enter 3 for "stop if failed"
Enter 4 for "time power if failed"

Maximum Source Power . . . . . . . . . 0.0 to 99.9%

Power Ramps. . . . . . . . . . . . . . . . . . 2 per material

Power Level . . . . . . . . . . . . . . . . 0.0 to 99.9%

Rise Time . . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:sec

Soak Time . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:sec

Auto Soak 2 Power . . . . . . . . . . . . . Yes/No

IPN 074-237AE

1 - 8

Delay Option . . . . . . . . . . . . . . . . . . (0,1,2,3) None, Shutter Delay,

Control Delay, Both

Control Delay Time. . . . . . . . . . . . . . 00:00 to 99:59

IC/5 Operating Manual

Feed Ramps. . . . . . . . . . . . . . . . . . . 1 per material

Feed Power . . . . . . . . . . . . . . . . 0.0 to 99.9%

Feed Ramp Time . . . . . . . . . . . . 00:00 to 99:59 min:sec

Feed Time. . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:sec

Idle Ramps . . . . . . . . . . . . . . . . . . . . 1 per material

Idle Power. . . . . . . . . . . . . . . . . . 0.0 to 99.9%

Idle Ramp Time . . . . . . . . . . . . . 00:00 to 99:59 min:sec

Aggregate Rate . . . . . . . . . . . . . . . . 0.0 to 999.9 Å/sec

Aggregate Multiplier . . . . . . . . . . . . . Yes/No

Final Thickness . . . . . . . . . . . . . . . . 0.0 to 999.9 kÅ

Thickness Limit. . . . . . . . . . . . . . . . . 0.0 to 999.9 kÅ

Time Limit. . . . . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:sec

Co-deposition

Cal Thick. . . . . . . . . . . . . . . . . . . uncal, 0.000 to 99.99kÅ

Ratio Control. . . . . . . . . . . . . . . . 0 to 99%

RateWatcher® . . . . . . . . . . . . . . . . . Sample and Hold Feature

RateWatch Time . . . . . . . . . . . . . 00:00 to 99:59 min:sec

RateWatch . . . . . . . . . . . . . . . . . Accuracy 1 to 99%

Rate Ramps . . . . . . . . . . . . . . . . . . . 2 per layer

New Rate . . . . . . . . . . . . . . . . . . 0 to 999 Å/sec

Start Ramp . . . . . . . . . . . . . . . . . 0 to 999.9 kÅ

Ramp Time. . . . . . . . . . . . . . . . . 00:00 to 99:59 min:sec

IPN 074-237AE

Crucible Selection . . . . . . . . . . . . . . 1 to 64, each source

1 - 9

1.4.4 Display

Type/Color/Size . . . . . . . . . . . . . . . . CRT/ Amber/ 5" H x 9" W

Format . . . . . . . . . . . . . . . . . . . . . . . 23 kHz Horizontal Scan Rate

Resolution . . . . . . . . . . . . . . . . . . . . 750 W x 350 H Monochrome

Vertical Scan Rate . . . . . . . . . . . . . . 50/60 Hz automatically detected

Thickness Display Range. . . . . . . . . 0.000 to 999.9 kÅ

Thickness Display Resolution . . . . . 1 Å

Rate Display Range . . . . . . . . . . . . . 0.0 to 99.9 Å/sec; 100 to 999 Å/sec

Rate Display Resolution. . . . . . . . . . 0.1 Å for 0 to 99.9 Å/sec

Power Display Range. . . . . . . . . . . . 0.0 to 99.9%

Graphic Display Functions . . . . . . . . Rate Deviation at ± 10 or ± 20 Å/sec or Power

Display Data Update Rate . . . . . . . . 1 Hz

IC/5 Operating Manual

1 Å for 100 to 999 Å/sec

at 0 to 100%

1 - 10

IPN 074-237AE

1.4.5 Source / Recorder Outputs

Quantity . . . . . . . . . . . . . . . . . . . . . . 6 BNC

Configuration . . . . . . . . . . . . . . . . . . User programmable for recorder

Function Ranges

Source Control . . . . . . . . . . . . . . 0 to 10 V, 0 to -10 V, 0 to 5 V,

Recorder Output. . . . . . . . . . . . . 0 to 10 V

Current rating . . . . . . . . . . . . . . . . . . 20 mA per channel

Resolution . . . . . . . . . . . . . . . . . . . . 15 bits over full range (10 V)

Update Rate . . . . . . . . . . . . . . . . . . . 10 Hz, maximum, (dependent on source

Recorder Output Functions . . . . . . . Aggregate Rate or Thickness or Rate

IC/5 Operating Manual

or source control.

0 to -5 V, 0 to 2.5 V, 0 to -2.5 V

characteristics).

Deviation; Individual Sensor Rate, Thickness
or Rate Deviation; or Source Power.

Recorder Output Ranges

Rate . . . . . . . . . . . . . . . . . . . . . . 0 to 100 Å/sec, 0 to 1000 Å/sec

Thickness . . . . . . . . . . . . . . . . . . 0 to 100 Å, 0 to 1000 Å

Rate Deviation . . . . . . . . . . . . . . Desired rate ± 50 Å/sec

Accuracy. . . . . . . . . . . . . . . . . . . . . . ± 3% full scale

Zero Adjust . . . . . . . . . . . . . . . . . . . . Individual potentiometer

IPN 074-237AE

1 - 11

IC/5 Operating Manual

1.4.6 Logic Processing

Type . . . . . . . . . . . . . . . . . . . . . . . . . If/Then statements

Logical Functions . . . . . . . . . . . . . . . And; Or; Not; Parentheses; ON

Depth . . . . . . . . . . . . . . . . . . . . . . . . 5 "If" conditions and 5 "Then" results/actions

# of Statements . . . . . . . . . . . . . . . . 100 If/Then

Selectable events. . . . . . . . . . . . . . . Deposition monitor events, states, external

Hierarchy . . . . . . . . . . . . . . . . . . . . . Statements evaluated in numerical order at

Partitioning . . . . . . . . . . . . . . . . . . . . None

Initialization . . . . . . . . . . . . . . . . . . . All outputs transition to their normal states as

per statement

inputs, relays, timers, and counters.

10 Hz any time the unit is on.

early as possible during power-on
initialization sequence.

1.4.7 Relays / Inputs

Relays . . . . . . . . . . . . . . . . . . . . . . . SPST 2.5 A relays rated @ 30 V(dc) or

Relay Ratings. . . . . . . . . . . . . . . . . . 100 VA inductive; 2.5A maximum.

# of TTL Compatible Outputs . . . . . . 14 with optional I/O card. Internally pulled up

Inputs (TTL Compatible). . . . . . . . . . (14 standard, 14 additional optional)

Input Levels

maximum high . . . . . . . . . . . . . . 24 V

minimum high. . . . . . . . . . . . . . . 2.5 V

30 V(ac) RMS or 42 V(peak) maximum;
(8 standard, up to 16 optional with 2
additional I/O cards); D sub connector; relays
are normally open in the power off state, but
may be programmed to normally open or
normally closed during operation.

to 5 V(dc). May be pulled up externally to
24 V(dc) through 2.4k resistor.
minimum high level 0.5mA load @3.75 V
maximum low level 10mA load @1.1 V

IPN 074-237AE

1 - 12

maximum low . . . . . . . . . . . . . . . 1.1 V

Scan/Update Rate . . . . . . . . . . . . . . 10 Hz

1.4.8 Remote Communications

RS232C Serial Port . . . . . . . . . . . . . Standard; INFICON protocol

Baud Rates. . . . . . . . . . . . . . . . . . . . 19,200; 9,600; 4,800; 2,400

IEEE488 Parallel Port. . . . . . . . . . . . Optional

IEEE Service Requests . . . . . . . . . . Supported with RQS and MAV status bits

1.4.9 Accessories

Manual Power . . . . . . . . . . . . . . . . . Front panel

Control Connection

Function . . . . . . . . . . . . . . . . . . . . . . Handheld, increase/decrease/stop

Floppy (Optional) . . . . . . . . . . . . . . . 3.5', 1.44 MByte for process and

Connector Kit . . . . . . . . . . . . . . . . . . Connectors for inputs and relays

Operating Manual. . . . . . . . . . . . . . . 3-ring binder type

IC/5 Operating Manual

datalog storage

1.4.10 Power

Power . . . . . . . . . . . . . . . . . . . . . . . . 100 +10%, -15% V(ac) 50/60 Hz

120 +10%, -10% V(ac) 50/60 Hz
230 +10%, -10% V(ac) 50/60 Hz
240 +10%, -15% V(ac) 50/60 Hz

Maximum apparent power . . . . . . . . 300 VA

Fuse . . . . . . . . . . . . . . . . . . . . . . . . . 100 V(ac), 120 V(ac) use 4 Amp IEC 127

approved type T
230 V(ac), 240 V(ac) use 2 Amp IEC 127
approved type T

IPN 074-237AE

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IC/5 Operating Manual

1.4.11 Operating Environment

Usage. . . . . . . . . . . . . . . . . . . . . . . . Indoor only

Temperature. . . . . . . . . . . . . . . . . . . 0 to 50 °C (32-122 °F)

Humidity . . . . . . . . . . . . . . . . . . . . . . Up to 85%RH, non-condensing

Altitude . . . . . . . . . . . . . . . . . . . . . . . Up to 2000 meters

Installation (Overvoltage) . . . . . . . . . Category II per IEC 664

Pollution Degree. . . . . . . . . . . . . . . . 1 per IEC 664

1.4.12 Storage Temperature

Storage Temperature . . . . . . . . . . . . -10 to 60 °C (14 to 140 °F)

1.4.13 Warm Up Period

Warm Up Period. . . . . . . . . . . . . . . . None required;

For maximum stability allow 5 minutes.

1.4.14 Size

Not including mounts or user connectors

5.25" H x 17.625" W x 18.5" D
(133.4 mm H x 447.7 mm W x 470 mm D)

Including mounts, but no user connectors

5.25" H x 18.85" W x 18.5" D
(133.4 mm H x 478.8 mm W x 470 mm D)

1.4.15 Connector Clearance Requirements

Front. . . . . . . . . . . . . . . . . . . . . . . . . Less than 1.0" (25.4 mm)

Rear . . . . . . . . . . . . . . . . . . . . . . . . . Less than 4.0" (101.6 mm)

1.4.16 Weight

With all options. . . . . . . . . . . . . . . . . 13.2 kg / 29 lb

1.4.17 Cleaning

IPN 074-237AE

1 - 14

Use a mild, nonabrasive cleaner or detergent taking care to prevent cleaner from
entering the unit.

1.5 Unpacking and Inspection

1 If the IC/5 control unit has not been removed from its shipping container, do so

now.

2 Carefully examine the unit for damage that may have occurred during shipping.

This is especially important if you notice obvious rough handling on the outside
of the container. Immediately report any damage to the carrier and to INFICON.

3 Do not discard the packing materials until you have taken inventory and have

at least performed a power on verification.

4 Take an inventory of your order by referring to your order invoice and the

information contained in section 1.6 on page 1-15.

5 To perform a power-on verification, see section 1.7 on page 1-18.

6 For additional information or technical assistance, contact your nearest

INFICON Inc. sales office.

1.6 Parts and Options Overview

IC/5 Operating Manual

1.6.1 Base Configurations

IC/5 Control Unit. . . . . . . . . . . . . . . . 760-500-G1 (100 V(ac) 50/60 Hz)

760-500-G2 (120 V(ac) 50/60 Hz)
760-500-G3 (230 V(ac) 50/60 Hz)
760-500-G4 (240 V(ac) 50/60 Hz)

Technical Manual . . . . . . . . . . . . . . . 074-237

Hand Controller . . . . . . . . . . . . . . . . 755-262-G1

I/O Relay Ship Kit . . . . . . . . . . . . . . . 760-024-G1

Input/Relay Interface Connectors. . . (8 relay outputs, 14 TTL inputs)

Power Cord . . . . . . . . . . . . . . . . . . . 068-0433

(shielded power cord - North America)

IPN 074-237AE

Ship Kit . . . . . . . . . . . . . . . . . . . . . . . 760-020-G1 (100 V(ac), 120 V(ac))

068-0434
(shielded power cord - European)

760-020-G2 (230 V(ac), 240 V(ac))

1 - 15

IC/5 Operating Manual

1.6.2 Pre-installed Options or Spares

Additional Sensor Module . . . . . . . . 760-1132-G1 (up to 3 extra)

Relay Card . . . . . . . . . . . . . . . . . . . . 760-162-G1

Relay Card . . . . . . . . . . . . . . . . . . . . 760-162-G2

I/O Relay Ship Kit. . . . . . . . . . . . . . . 760-024-G1

IEEE488 Parallel . . . . . . . . . . . . . . . 760-142-G1

Communications

Floppy disk . . . . . . . . . . . . . . . . . . . . 760-023-G1

1.6.3 Optional Accessories

(8 relay outputs, 14 TTL inputs)

(8 relay outputs, 14 TTL outputs)

(8 relay outputs, 14 TTL inputs)
760-024-G2
(8 relay outputs, 14 TTL outputs)

IC/5 15' Oscillator Kit . . . . . . . . . . . . 760-025-G15

IC/5 30' Oscillator Kit . . . . . . . . . . . . 760-025-G30

IC/5 50' Oscillator Kit . . . . . . . . . . . . 760-025-G50

IC/5 100' Oscillator Kit . . . . . . . . . . . 760-025-6100

Oscillator to vacuum. . . . . . . . . . . . . 755-257-G6

feedthrough cable, 6"

IC/5 Unit to Oscillator Cable 15' . . . . 600-1039-G15

IC/5 Unit to Oscillator Cable, 30' . . . 600-1039-G30

IC/5 Unit to Oscillator Cable, 50' . . . 600-1039-G50

IC/5 Unit to Oscillator Cable, 100' . . 600-1039-6100

Pneumatic Shutter Actuator . . . . . . . 750-420-G1

Control Valve

Sensor Emulator Kit . . . . . . . . . . . . . 760-601-G2

IC/5 Offline Editor Software . . . . . . . 760-030-G1

IPN 074-237AE

1 - 16

Adapter Cables

IC/5 to IC/4 Kit . . . . . . . . . . . . . . 600-1084-P1 (Relays and Inputs - for IC/4 or

DAC, IC/5 to IC/4 Kit. . . . . . . . . . 600-1049-P1 (IC/5 to IC/4 Analog

IC/5 to IC6000 Kit . . . . . . . . . . . . 600-1083-P1 (Relays and Inputs)

1.6.4 Oscillator Packages and Sensors

IC/5 Oscillator, 15' and 6" cable pkg. 760-025-G15

IC/5 Oscillator, 30' and 6" cable pkg. 760-025-G30

IC/5 Oscillator, 50' and 6" cable pkg. 760-025-G50

IC/5 Oscillator, 100' and 6" cable pkg.760-025-G100

4 Meter Oscillator Kit . . . . . . . . . . . . . . . . . . . . . . 4XI5-nnn

for operation with 3 to 4 m long in-vacuum cable, contact factory for part number

IC/5 Operating Manual

IC/4 PLUS)

Outputs - for IC/4 or IC/4 PLUS)

Standard Sensor. . . . . . . . . . . . . . . . 750-211-G1

Standard Sensor with Shutter. . . . . . 750-211-G2

Compact Sensor. . . . . . . . . . . . . . . . 750-213-G1

Compact Sensor with Shutter. . . . . . 750-213-G2

Sputtering Sensor. . . . . . . . . . . . . . . 750-618-G1

UHV Bakeable Sensor, 12" . . . . . . . 007-219

UHV Bakeable Sensor, 20" . . . . . . . 007-220

UHV Bakeable Sensor, 30" . . . . . . . 007-221

UHV Bakeable Sensor with Shutter, 12"750-012-G1

IPN 074-237AE

UHV Bakeable Sensor with Shutter, 20"750-012-G2

UHV Bakeable Sensor with Shutter, 30"750-012-G3

Dual Sensor . . . . . . . . . . . . . . . . . . . 750-212-G2

CrystaISix Multiple Sensor . . . . . . . . 750-446-G1

NOTE: Contact INFICON for a complete listing of oscillators and sensors.

1 - 17

IC/5 Operating Manual

WARNING - Risk Of Electric Shock

WARNING - Risk Of Electric Shock

1.7 Initial Power-On Verification

A preliminary functional check of the instrument can be made before formal
installation. It is not necessary to have sensors, source controls, inputs or relays
connected to do this. For more complete installation information, refer to Chapter

11, Installation and Interfaces and to Chapter 12, Calibration Procedures.

There are no user-serviceable components within the
instrument case.

Dangerous voltages may be present whenever the power
cord or external input/relay connectors are present.

Refer all maintenance to qualified personnel.

Never interrupt the protective earth circuit.

Any interruption of the protective earth circuit inside or
outside the instrument, or disconnection of the
protective earth terminal is likely to make the instrument
dangerous.

This symbol indicates where the protective earth ground
is connected inside the instrument. Never unscrew or
loosen this connection.

IPN 074-237AE

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IC/5 Operating Manual

1 Confirm that AC line voltage is supplied and proper for the instrument. Line

voltage should be indicated on the instrument back label.

2 Press the power button on the front panel. A green pilot light should be seen

next to the power switch.

3 The fan at the back of the instrument should be exhausting air.

4 Video monitor will display an image similar to the one shown in Figure 1-1.

5 Compare the configuration information on the screen against the unit

configuration ordered.

6 Status of parameter information will be displayed. If information was valid prior

to this power up, it should stay valid.

7 After a delay, the instrument will enter the OPERATE display.

8 In the OPERATE display, confirm that the display is centered vertically. Lines

between the function keys (F1...F6) should align with the lines between the
panels on the right side of the display.

9 Using a non-conducting alignment tool, verify that the brightness pot is

operative. Adjust for the desired brightness. Access to the brightness pot is at
the bottom-center of the face panel, see Figure 3-1 on page 3-1.

Figure 1-1 IC/5 System Status Screen (Display will vary depending on options present)

IPN 074-237AE

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IC/5 Operating Manual

This page is intentionally blank.

1 - 20

IPN 074-237AE

2.1 Basics

M

f

M

q

-------

F

F

q

-----------=

T

f

KF

d

f

----------------=

IC/5 Operating Manual

Chapter 2

Measurement and Control Theory

The Quartz Crystal deposition Monitor, or QCM, utilizes the piezoelectric sensitivity
of a quartz monitor crystal to added mass. The QCM uses this mass sensitivity to
control the deposition rate and final thickness of a vacuum deposition. When a
voltage is applied across the faces of a properly shaped piezoelectric crystal, the
crystal is distorted and changes shape in proportion to the applied voltage. At
certain discrete frequencies of applied voltage, a condition of very sharp
electro-mechanical resonance is encountered. When mass is added to the face of
a resonating quartz crystal, the frequency of these resonances are reduced. This
change in frequency is very repeatable and is precisely understood for specific
oscillating modes of quartz. This heuristically easy to understand phenomenon is
the basis of an indispensable measurement and process control tool that can easily
detect the addition of less than an atomic layer of an adhered foreign material.

In the late 1950’s it was noted by Sauerbrey
frequency, DF = F
frequencies, F

and Fq respectively, is related to the change in mass from the

c

added material, M

, of a quartz crystal with coated (or composite) and uncoated

q-Fc

, as follows:

f

1,2

and Lostis3 that the change in

[1]

where M

is the mass of the uncoated quartz crystal. Simple substitutions lead

q

to the equation that was used with the first “frequency measurement”
instruments:

[2]

IPN 074-237AE

where the film thickness, T
DF, and inversely proportional to the density of the film, d
N

atdq/Fq

2

; where dq (= 2.649 gm/cm3) is the density of single crystal quartz and Nat

, is proportional (through K) to the frequency change,

f

. The constant, K =

f

(=166100 Hz cm) is the frequency constant of AT cut quartz. A crystal with a
starting frequency of 6.0 MHz will display a reduction of its frequency by 2.27 Hz
when 1 angstrom of Aluminum (density of 2.77 gm/cm

3

) is added to its surface. In

this manner the thickness of a rigid adlayer is inferred from the precise

1.G. Z. Sauerbrey, Phys. Verhand .8, 193 (1957)

2.G. Z. Sauerbrey, Z. Phys. 155

3.P. Lostis, Rev. Opt. 38

,206 (1959)

,1 (1959)

2 - 1

IC/5 Operating Manual

measurement of the crystal’s frequency shift. The quantitative knowledge of this
effect provides a means of determining how much material is being deposited on a
substrate in a vacuum system, a measurement that was not convenient or practical
prior to this understanding.

2.1.1 Monitor Crystals

No matter how sophisticated the electronics surrounding it, the essential device of
the deposition monitor is the quartz crystal. The quartz resonator shown in Figure

2-1 has a frequency response spectrum that is schematically shown in Figure 2-2.

The ordinate represents the magnitude of response, or current flow of the crystal,
at the specified frequency.

Figure 2-1 Quartz Resonator

The lowest frequency response is primarily a “thickness shear” mode that is called
the fundamental. The characteristic movement of the thickness shear mode is for
displacement to take place parallel to the major monitor crystal faces. In other
words, the faces are displacement antinodes as shown in Figure 2-3. The
responses located slightly higher in frequency are called anharmonics; they are a
combination of the thickness shear and thickness twist modes. The response at
about three times the frequency of the fundamental is called the third
quasiharmonic. There are also a series of anharmonics slightly higher in frequency
associated with the quasiharmonic.

The monitor crystal design depicted in Figure 2-1 is the result of several significant
improvements from the square crystals with fully electroded plane parallel faces
that were first used. The first improvement was to use circular crystals. This
increased symmetry greatly reduced the number of allowed vibrational modes. The
second set of improvements was to contour one face of the crystal and to reduce
the size of the exciting electrode. These improvements have the effect of trapping
the acoustic energy. Reducing the electrode diameter limits the excitation to the
central area. Contouring dissipates the energy of the traveling acoustic wave
before it reaches the edge of the crystal. Energy is not reflected back to the center
where it can interfere with other newly launched waves, essentially making a small
crystal appear to behave as though it is infinite in extent. With the crystal’s
vibrations restricted to the center, it is practical to clamp the outer edges of the

IPN 074-237AE

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IC/5 Operating Manual

5.981 MHz 15 ohm

6.153 MHz 50 ohm

6.194 MHz 40 ohm

6.333 MHz 142 ohm

6.337 MHz 105 ohm

6.348 MHz 322 ohm

6.419 MHz 350 ohm

17.792 MHz 278 ohm

17.957 MHz 311 ohm

18.133 MHz 350 ohm

Log of relative intensity (Admittance)

Frequency (in MHz)

1

10

1

100

1

1000

6 7 17 18

crystal to a holder and not produce any undesirable effects. Contouring also
reduces the intensity of response of the generally unwanted anharmonic modes;
hence, the potential for an oscillator to sustain an unwanted oscillation is
substantially reduced.

Figure 2-2 Frequency Response Spectrum

IPN 074-237AE

The use of an adhesion layer has improved the electrode-to-quartz bonding,
reducing “rate spikes” caused by micro-tears between the electrode and the quartz
as film stress rises. These micro-tears leave portions of the deposited film
unattached and therefore unable to participate in the oscillation. These free
portions are no longer detected and the wrong thickness consequently inferred.

The “AT” resonator is usually chosen for deposition monitoring because at room
temperature it can be made to exhibit a very small frequency change due to
temperature changes. Since there is presently no way to separate the frequency
change caused by added mass (which is negative) or even the frequency changes
caused by temperature gradients across the crystal or film induced stresses, it is
essential to minimize these temperature-induced changes. It is only in this way that
small changes in mass can be measured accurately.

2 - 3

IC/5 Operating Manual

displacement node

X

X

X

2

1

3

E

M

f

M

q

-------

TcTq–

T

q

----------------------

F

F

c

-----------==

Figure 2-3 Thickness Shear Displacement

2.1.2 Period Measurement Technique

Although instruments using equation [2] were very useful, it was soon noted they
had a very limited range of accuracy, typically holding accuracy for DF less than

0.02 F

where T
and the bare crystal respectively. The period measurement technique was the
outgrowth of two factors; first, the digital implementation of time measurement, and
second, the recognition of the mathematically rigorous formulation of the
proportionality between the crystal’s thickness, I
= 1/F
oscillator, or reference oscillator, not affected by the deposition and usually much
higher in frequency than the monitor crystal. This reference oscillator is used to
generate small precision time intervals which are used to determine the oscillation
period of the monitor crystal. This is done by using two pulse accumulators. The
first is used to accumulate a fixed number of cycles, m, of the monitor crystal. The
second is turned on at the same time and accumulates cycles from the reference
oscillator until m counts are accumulated in the first. Since the frequency of the
reference is stable and known, the time to accumulate the m counts is known to an
accuracy equal to ± 2/F

. In 1961 it was recognized by Behrndt4 that:

q

and Tq are the periods of oscillation of the crystal with film (composite)

c

. Electronically the period measurement technique uses a second crystal

q

where Fr is the reference oscillator’s frequency. The

r

, and the period of oscillation, Tq

q

[3]

IPN 074-237AE

2 - 4

4.K. H. Behrndt, J. Vac. Sci. Technol. 8, 622 (1961)

IC/5 Operating Manual

T

f

Natd

q

dfFcZ

------------------





arctan Z tan

 FqFc–

F

q

-------------------------





=

monitor crystal’s period is (n/Fr)/m where n is the number of counts in the second
accumulator. The precision of the measurement is determined by the speed of the
reference clock and the length of the gate time (which is set by the size of m).
Increasing one or both of these leads to improved measurement precision.

Having a high frequency reference oscillator is important for rapid measurements
(which require short gating times), low deposition rates and low density materials.
All of these require high time precision to resolve the small, mass induced
frequency shifts between measurements. When the change of a monitor crystal’s
frequency between measurements is small, that is, on the same order of size as
the measurement precision, it is not possible to establish quality rate control. The
uncertainty of the measurement injects more noise into the control loop, which can
be counteracted only by longer time constants. Long time constants cause the
correction of rate errors to be very slow, resulting in relatively long term deviations
from the desired rate. These deviations may not be important for some simple films,
but can cause unacceptable errors in the production of critical films such as optical
filters or very thin layered superlattices grown at low rates. In many cases the
desired properties of these films can be lost if the layer to layer reproducibility
exceeds one, or two, percent. Ultimately, the practical stability and frequency of the
reference oscillator limits the precision of measurement for conventional
instrumentation.

2.1.3 Z-match Technique

After learning of fundamental work by Miller and Bolef 5, which rigorously treated
the resonating quartz and deposited film system as a one-dimensional continuous
acoustic resonator, Lu and Lewis
in 1972. Advances in electronics taking place at the same time, namely the
micro-processor, made it practical to solve the Z-match equation in “real-time”.
Most deposition process controllers sold today use this sophisticated equation that
takes into account the acoustic properties of the resonating quartz and film system
as shown in equation [4].

IPN 074-237AE

where Z=(d

quq/dfuf

1/2

)

is the acoustic impedance ratio and uq and uf are the shear
moduli of the quartz and film, respectively. Finally, there was a fundamental
understanding of the frequency-to-thickness conversion that could yield
theoretically correct results in a time frame that was practical for process control.
To achieve this new level of accuracy requires only that the user enter an additional
material parameter, Z, for the film being deposited. This equation has been tested

6

developed the simplifying Z-match™ equation

[4]

5.J. G. Miller and D. I. Bolef, J. Appl. Phys. 39, 5815, 4589 (1968)

6.C. Lu and O. Lewis, J Appl. Phys. 43

, 4385 (1972)

2 - 5

IC/5 Operating Manual

for a number of materials, and has been found to be valid for frequency shifts
equivalent to F
and equation [3] was valid only to ~0.05F

2.1.4 Active Oscillator

All of the instrumentation developed to date has relied on the use of an active
oscillator circuit, generally the type schematically shown in Figure 2-4. This circuit
actively keeps the crystal in resonance, so that any type of period or frequency
measurement may be made. In this type of circuit, oscillation is sustained as long
as the gain provided by the amplifiers is sufficient to offset losses in the crystal and
circuit and the crystal can provide the required phase shift. The basic crystal
oscillator’s stability is derived from the rapid change of phase for a small change in
the crystal’s frequency near the series resonance point, as shown in Figure 2-5 on

page 2-7.

Figure 2-4 Active Oscillator Circuit

= 0.4Fq. Keep in mind that equation [2] was valid to only 0.02Fq

f

.

q

2 - 6

The active oscillator circuit is designed so the crystal is required to produce a phase
shift of 0 degrees, which allows it to operate at the series resonance point. Long­and short-term frequency stabilities are a property of crystal oscillators because
very small frequency changes are needed to sustain the phase shift required for
oscillation. Frequency stability is provided by the quartz crystal even though there
are long term changes in electrical component values caused by temperature or
aging or short-term noise-induced phase jitter.

As mass is added to a crystal, its electrical characteristics change. Figure 2-6 on

page 2-8 is the same plot as Figure 2-5 overlaid with the response of a heavily

loaded crystal. The crystal has lost the steep slope displayed in Figure 2-5.
Because the phase slope is less steep, any noise in the oscillator circuit translates

IPN 074-237AE

IC/5 Operating Manual

into a greater frequency shift than that which would be produced with a new crystal.
In the extreme, the basic phase/frequency shape is not preserved and the crystal
is not able to provide a full 90 degrees of phase shift.

The impedance, |Z|, is also noted to rise to an extremely high value. When this
happens it is often more favorable for the oscillator to resonate at one of the
anharmonic frequencies. This condition is sometimes short lived, with the oscillator
switching between the fundamental and anharmonic modes, or it may continue to
oscillate at the anharmonic. This condition is known as mode hopping and in
addition to annoying rate noise can also lead to false termination of the film
because of the apparent frequency change. It is important to note that the controller
will frequently continue to operate under these conditions; in fact there is no way to
tell this has happened except that the film’s thickness is suddenly apparently
thinner by an amount equivalent to the frequency difference between the
fundamental and the anharmonic that is sustaining the oscillation.

Figure 2-5 Crystal Frequency Near Series Resonance Point

IPN 074-237AE

2.1.5 ModeLock Oscillator

INFICON has created a new technology that eliminates the active oscillator and its
limitations. This new system constantly tests the crystal’s response to an applied
frequency in order to not only determine the resonant frequency, but also to verify
that the crystal is oscillating in the desired mode. This new system is essentially
immune to mode hopping and the resulting inaccuracies. It is fast and accurate,
determining the crystal’s frequency to less than .005 Hz at a rate of 10 times per
second. Because of the system’s ability to identify and then measure particular
crystal modes, it is now possible to offer new features that take advantage of the
additional informational content of these modes. This new “intelligent”

2 - 7

IC/5 Operating Manual

measurement system uses the phase/frequency properties of the quartz crystal to
determine the resonant frequency. It operates by applying a synthesized sine wave
of specific frequency to the crystal and measuring the phase difference between
the applied signal’s voltage and the current passing through the crystal. At series
resonance, this phase difference is exactly 0 degrees; that is, the crystal behaves
like a pure resistance. By separating the applied voltage and the current returned
from the crystal and monitoring the output of a phase comparator it is possible to
establish whether the applied frequency is higher or lower than the crystal’s
resonance point. At frequencies well below the fundamental, the crystal’s
impedance is capacitive and at frequencies slightly higher than resonance it is
inductive in nature. This information is useful if the resonance frequency of a crystal
is unknown. A quick sweep of frequencies can be undertaken until the output of the
phase comparator changes, marking the resonance event. For AT crystals we
know that the lowest frequency event encountered is the fundamental. The events
slightly higher in frequency are anharmonics. This information is useful not only for
initialization, but also for the rare case when the instrument loses track of the
fundamental. Once the frequency spectrum of the crystal is determined the
instrument’s task is to follow the changing resonance frequency and to periodically
provide a measurement of the frequency for subsequent conversion to thickness.

Figure 2-6 Heavily Loaded Crystal

The use of the “intelligent” measurement system has a series of very apparent
advantages when compared to the previous generation of active oscillators,
namely immunity from mode hopping, speed of measurement and precision of
measurement. The technique also allows the implementation of a sophisticated
feature that cannot even be contemplated using the active oscillator approach. The
same capability that allows the new technology to sweep and identify the
fundamental can be used to identify other oscillation modes, such as the
anharmonics and the quasiharmonic. Not only can the instrument track the

IPN 074-237AE

2 - 8

fundamental mode continuously, but also it can be implemented to alternate
between one or more other modes. This interrogation of multiple modes can be
performed as fast as 10 Hz for two modes of the same crystal.

2.1.6 Auto Z-match Theory

The one drawback in using equation [4] on page 2-5 is that the acoustic impedance
must be known. There are several cases where accuracy has to be compromised
because of incomplete or limited knowledge of the material constants of the
deposited materials.

 Often the Z-ratio for the bulk material is different from that of the deposited thin

film. Thin films are especially sensitive to process parameters, particularly in a
sputtering environment. Consequently, the values available for bulk materials
may not be pertinent.

 For many exotic materials, including alloys, the Z-ratio is not known nor easily

available.

 There has always been a need to accurately measure layer thickness of

multiple material films using the same crystal sensor. This is particularly true for
multi-layer optical coatings and high-temperature superconductor fabrication.
The effective Z-ratio of the composite of multi-material layers is not known.

IC/5 Operating Manual

In such cases, the only recourse is to assume the Z-ratio to be unity (that is,
ignoring the reality of wave propagation in composite media). This false premise
introduces error in the thickness and rate predictions. The magnitude of this error
depends upon the film thickness and the amount of departure of the true Z-ratio
from unity.

7

In 1989, A. Wajid became aware of the ModeLock oscillator

. He speculated there
might be a relationship between the fundamental and one of the anharmonics
similar to the relationship noted by Benes

8

between the fundamental and the third
quasiharmonic. The frequencies of the fundamental and the anharmonics are very
similar, solving the problem of capacitance of long cables. He found the ideas

IPN 074-237AE

needed for establishing the required connections in papers published by Wilson

10

in 1974 and Tiersten and Smythe

in 1979.

9

Contouring a crystal, that is, giving one face a spherical shape, has the effect of
separating the various modes further apart and preventing the transfer of energy
from one mode to another. For the sake of identification it is common to assign
mode [100] to the fundamental, [102] to the lowest frequency anharmonic and [120]
to the next lowest frequency anharmonic. The three indices of the mode

7.U.S. Patent No. 5,117,192 (May 26, 1992) International Patents Pending.

8.E. Benes, J. Appl. Phys. 56(3), 608-626 (1984)

9.C. J. Wilson, J. Phys. d7,2449 (1974)

10.H. F. Tiersten and R.C. Smythe, J. Acoust. Soc. Am., 65(6), 1455 (1979).

2 - 9

IC/5 Operating Manual

C55C66

coated

C55C66

uncoated

--------------------------------------------

1

1MZ+

-----------------------



MZ

F

c

F

q

-----





Z+ 

F

c

F

q

-----





tantan 0=

Z

MZ

F

c

F

q

-----





tan



F

c

F

q

-----





tan

---------------------------------–=

assignment refer to the number of phase reversals in the wave motion along the
three axes of the crystal. The above-referenced papers by Wilson and Tiersten &
Smythe are examinations of modal properties, relating the various properties of the
radius of curvature to the placement of the anharmonics relative to the
fundamental.

As material is deposited upon one face of a crystal, the entire spectrum of
resonances shifts to lower frequencies. The three above mentioned modes are
observed to have slightly different mass sensitivity and hence undergo slightly
different frequency shifts. It is this difference that is used to estimate the Z-ratio of
the material. Using the modal equations and the observed frequencies of the
modes [100] and [102], one can calculate the ratio of two elastic constants C
C

. Both of these elastic constants relate to shear motion. The essential element

55

of Wajid’s theory is the following equation:

where M is the aerial mass density (film mass to quartz mass ratio per unit area)
and Z is the Z-ratio. It is a fortunate coincidence that the combination MZ also
appears in the Lu-Lewis equation [4], which can be used to extract an estimate of
the effective Z-ratio from the equations below:

66

and

[5]

[6]

or

[7]

Where, F
fundamental mode (mode [100]). Due to the multi-valued nature of the
mathematical functions involved, the value of Z-ratio extracted in this manner is not
always a positive definite quantity. This is hardly of any consequence however,
because M is uniquely determined with the estimated Z and the measured
frequency shift. Thus, thickness and rate of deposition are subsequently calculated
from the knowledge of M.

One must be aware of the limitations of this technique. Since the estimate for
Z-ratio is dependent on the frequency shifts of the two modes, any spurious shift
due to excessive mechanical or thermal stress on the crystal will lead to errors.

and Fc denote uncoated and coated crystal frequencies in the

q

11

IPN 074-237AE

2 - 10

11.U.S. Patent No. 5,112,642 (May 12, 1992) International Patents Pending.

Needless to say, similar errors occur with the Z-match™ technique under similar
circumstances. However, the automatic Z-ratio estimate is somewhat more prone
to error, because the amplitude distribution of the mode [102] is asymmetric,
whereas that of the mode [100] is symmetric over the active area of the crystal.

In our experience, film-induced stress on the crystal has the most deleterious
effect. This effect is most pronounced whenever there is a presence of gas in the
environment, for example, in reactive evaporation or sputtering processes. In such
cases, if the bulk Z-ratio is already well known, it is better to use the bulk value
instead of the automatically determined Auto Z-ratio. In cases of co-deposition and
sequential layers, automatic Z-ratio estimation is significantly superior.

2.1.7 Control Loop Theory

The instrumental advances in measurement speed, precision and reliability would
not be complete without a means of translating this improved information into
improved process control. For a deposition process, this means keeping the
deposition rate as close as possible to the desired rate. The purpose of a control
loop is to take the information flow from the measurement system and to make
power corrections that are appropriate to the characteristics of the particular
evaporation source. When properly operating, the control system translates small
errors in the controlled parameter, or rate, into the appropriate corrections in the
manipulated parameter, power. The controller’s ability to quickly and accurately
measure and then react appropriately to the small changes keeps the process from
deviating very far from the set point.

IC/5 Operating Manual

The controller model most commonly chosen, for converting error into action is
called PID. In the PID, P stands for proportional, I stands for integral and D stands
for derivative action. Certain aspects of this model will be examined in detail a little
further on. The responsiveness of an evaporation source can be found by
repetitively observing the system response to a disturbance under a particular set
of controller settings. After observing the response, improved controller parameters
are estimated and then tried again until satisfactory control is obtained. Control,
when it is finally optimized, essentially matches the parameters of the controller

IPN 074-237AE

model to the characteristics of the evaporation source.

It is quite laborious and frustrating to tune a controller for an evaporation source
that takes several minutes to stabilize. It may take several hours to obtain
satisfactory results. Often the parameters chosen for a specific rate will not be
satisfactory for another. Ideally, it would be nice if a machine could optimize itself.
INFICON’s IC/5 can do this. In an operator initiated mode that is used during initial
setup the instrument will measure the source characteristics. Slow sources are
characterized by having significant dead time, whereas fast sources have no dead
time.

For a slow source, the IC/5 will use a PID model to calculate optimum source
control parameters. For a fast source, the IC/5 will use an integrating control loop
model to calculate optimum source control parameters

2 - 11

IC/5 Operating Manual

Output

Input

------------------

K

p

L– sexp

T1s1+

-------------------------------=

Techniques for calculating optimum source control parameters can be classified by
the type of data used for tuning. They fall into basically three categories:

 Closed Loop Methods

 Open Loop Methods

 Frequency Response Methods

Of these categories, the open loop methods are considered superior. They are
considered superior because of the ease with which the necessary experimental
data can be obtained and because of the elimination (to a large extent) of trial and
error when the technique is applied.

INFICON’s Auto-Control-Tune characterizes a process from its step response
attributes. After Auto-Control-Tune executes a step change of power, the resulting
rate changes are smoothed and stored. The important response characteristics are
determined as shown in Figure 2-7.

In general, it is not possible to characterize all processes exactly; some
approximation must be applied. The most common is to assume that the dynamic
characteristics of the process can be represented by a first-order lag plus a dead
time. The Laplace transform for this model (conversion to the s domain) is
approximated as:

[8]

Three parameters are determined from the process reaction curve. They are the
steady state gain, K

, the dead time, L, and the time constant, T1. Several methods

p

have been proposed to extract the required parameters from the system response
as graphed in Figure 2-7. These are: a one point fit at 63.2% of the transition (one
time constant); a two point exponential fit; and a weighted least-square-exponential
fit. From the above information a process is sufficiently characterized so that a
controller algorithm may be customized.

IPN 074-237AE

2 - 12

IC/5 Operating Manual

Ms Kc1

1

Tis

------- Tds++





Es=

Figure 2-7 Response of Process To An Open Loop Step Change

(At t=0 Control Signal is Increased)

A controller model used extensively is the PID type, shown in Laplace form in

equation [9].

[9]

Where

 M(s) = manipulated variable or power

= controller gain (the proportional term)

 K

c

 T

= integral time

i

= derivative time

 T

d

 E(s) = process error

IPN 074-237AE

Figure 2-8 represents the controller algorithm and a process with first order lag plus

a dead time. The process block implicitly includes the dynamics of the measuring
devices and the final control elements, in our case the evaporator power supply.
R(s) represents the rate setpoint. The feedback mechanism is the error generated
by the difference between the measured deposition rate, C(s), and the rate set
point, R(s).

2 - 13

IC/5 Operating Manual

Kc1

1

T

i

s

------- T

d

s++





K

p

L– sexp

T1s1+

-------------------------------

Rs

Es

S

Cs

setpoint error

[controller] [process]

+

deposition

rate

ISE e

2



tdt=

IAE e tdt=

ITAE t e tdt=

Figure 2-8 PID Controller Block Diagram

The key to using any control system is to choose the proper values of Kc, Td and

. Optimum control is a somewhat subjective quantity as noted by the presence of

T

i

several mathematical definitions as shown below.

The integral of the squared error (ISE) is a commonly proposed criterion of
performance for control systems.

It can be described as:

[10]

where error = e = setpoint minus the measured rate. The ISE measure is relatively
insensitive to small errors, but large errors contribute heavily to the value of the
integral. Consequently, using ISE as a criterion of performance will result in
responses with small overshoots but long settling times, since small errors
occurring late in time contribute little to the integral.

The integral of the absolute value of the error (IAE) has been frequently proposed
as a criterion of performance:

[11]

This criterion is more sensitive to small errors, but less sensitive to large errors,
than ISE.

12

Graham and Lathrop

introduced the integral of time multiplied by the absolute

error (ITAE) as an alternate criterion of performance:

[12]

IPN 074-237AE

2 - 14

12.Graham, D., and Lanthrop, R.C., “The Synthesis of Optimum Transient Response: Criteria and
Standard Forms, Transactions IEEE, vol. 72 pt. II, November 1953.

IC/5 Operating Manual

K

c

1.36 KpLT1

0.947–

=

T

i

1.19T

1

LT1

0.738

=

T

d

0.381T

1

LT

1



0.995

=

ITAE is insensitive to the initial and somewhat unavoidable errors, but it will weight
heavily any errors occurring late in time. Optimum responses defined by ITAE will
consequently show short total response times and larger overshoots than with
either of the other criteria. It has been found that this criteria is generally most
useful for deposition process control.

INFICON’s Auto-Control-Tune is based on an open loop measurement of the
system’s response. From a step change in the control signal, the response
characteristics of the system are calculated. The experimental determination of
response characteristics is accomplished through two types of 2-point curve fits.
They are determined either quickly, but less accurately (i.e., “Quick Tune”) at an
arbitrary deposition rate, or less quickly, but more accurately (i.e., “Complete
Tune”) near the desired rate setpoint. Since the process response characteristics
depend on the position of the system (i.e. deposition rate for this discussion), the
process response is best measured at the desired operating point of the system.
This measured process information (i.e. process gain, K

, time constant, T1, and

p

dead time, L) is used to generate the best fitting PID control loop parameters for
the specific system.

The most satisfactory performance criterion for deposition controllers is the ITAE.
There will be overshoot, but the response time is quick, and the settling time is
short. For all of the above integral performance criteria, controller tuning relations
have been developed to minimize the associated errors. Using manually entered
or experimentally determined process response coefficients, ideal PID controller
coefficients can be readily calculated for the ITAE criteria as shown below.

[13]

[14]

[15]

For slow systems, in order to help avoid controller windup (windup is the rapid

IPN 074-237AE

increase in control signal before the system has the chance to respond to the
changed signal), the time period between manipulated variable (control voltage)
changes is lengthened. This allows the system to respond to the previous controller
setting change, and aggressive controller settings can be used. A secondary
advantage is that immunity to process noise is increased since the data used for
control is now comprised of multiple readings instead of a single rate
measurement, taking advantage of the mass integrating nature of the quartz
crystal.

With process systems that respond quickly (short time constant) and with little to
no measurable dead time, the PID controller often has difficulty with the deposition
process noise (beam sweep, fast thermal shorts of melt to crucible, etc.). In these
situations a control algorithm used successfully is an integral/reset type of
controller. This type of controller will always integrate the error, driving the system

2 - 15

IC/5 Operating Manual

towards zero error. This technique works well when there is little or no dead time.
If this technique is used on a process with measurable lag or dead time, then the
control loop will tend to be oscillatory due to the control loop over-compensating
the control signal before the system has a chance to respond. Auto-Control-Tune
detects the characteristics of these fast response systems during measurement of
the step response. This information is used to calculate the controller gain
coefficient for the non-PID control algorithm.

2 - 16

IPN 074-237AE

3.1 Front Panel Controls

12345

678910

Operational controls for the IC/5 are located on the front panel of the instrument,
as depicted in Figure 3-1.

Figure 3-1 IC/5 Front Panel

IC/5 Operating Manual

Chapter 3

Operation

1 CRT Screen

Provides graphical displays, set-up menus, status and error messages.

2 Function Keys

An array of function keys are located adjacent to the screen. These keys are
labeled F1 through F6. They are used to select displays or menu items. Their

IPN 074-237AE

function is indicated on the display and is described in subsequent sections.

3 Data Entry Keys

A keypad array with numerics 0 through 9 and keys for Yes (Y), No (N), Enter
(E), Clear (C), Print, and Menu used for selection and parameter entry. All
numeric and Yes/No entries need to be followed by Enter. Clear is used to
erase data entry errors. If an illegal value has been entered, Clear will erase the
error message and re-display the last valid data. The Print Screen key is used
to send the display information to the floppy drive. The Menu key is used to
navigate through the instrument’s displays.

3 - 1

IC/5 Operating Manual

4 System Switches

An array of three keys that provide START, STOP and RESET functions, for
process control. See section 3.4.2 on page 3-23.

5 3.5" Floppy Disk Access Port

Receptacle for the optional 3.5", 1.44 MB floppy disk.

6 Power

This switch controls secondary power to the instrument between ON and
STANDBY. Power is provided when the button is in its depressed position. The
instrument is initialized for approximately 5 seconds before providing an
operational screen.

7 Pilot Light

A green pilot light, adjacent to the power switch, is illuminated when power is
on.

8 Remote Control Jack

Receptacle for the wired hand-held remote controller.

9 Cursor Keys

An array of four keys that are used to move the display cursor either up, down,
left or right. The keys auto-repeat; the cursor will continue to move as long as
the key is held down or until a display field boundary is met.

10 Brightness Adjustment

An access hole for the display’s brightness adjustment potentiometer. Use a
nonconductive TV adjustment tool to increase the brightness by turning the
potentiometer clockwise.

IPN 074-237AE

3 - 2

3.2 Rear Panel Interfaces

1 2345678 9 10

111213

Interfaces for the IC/5 are located on the rear panel of the instrument as depicted
in Figure 3-2.

Figure 3-2 IC/5 Rear Panel

IC/5 Operating Manual

1 IEEE488 Connector (Optional)

Provides connections for IEEE-GPIB interface.

2 Sensor Connectors - Channels 1 & 2 (standard)

Provides connection for the unit’s two standard sensor channels.

3 Sensor Connectors - Channels 3 & 4 (optional)

Expansion panel to accommodate the optional addition of two more sensors,
sensors 3 & 4.

4 Sensor Connectors - Channels 5 & 6 (optional)

Expansion panel to accommodate the optional addition of two more sensors,

IPN 074-237AE

sensors 5 & 6.

5 Sensor Connectors - Channels 7 & 8 (optional)

Expansion panel to accommodate the optional addition of two more sensors,
sensors 7 & 8.

6 8 Relay x 14 Input I/O Card (standard)

Provides pin connection for 8 Relays rated for 30 V(dc) or
30 V(ac) RMS or 42 V(peak) maximum, and 14 TTL Inputs.

7 8 Relay x 14 Input I/O Card (optional)

Provides pin connection for 8 relays rated for 30 V(dc) or
30 V(ac) RMS or 42 V(peak) maximum, and 14 TTL inputs.

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IC/5 Operating Manual

8 8 Relay x 14 Output I/O Card (optional)

Provides pin connection for 8 relays rated for 30 V(dc) or 30 V(ac) RMS or
42 V(peak) maximum, and 14 open collector type outputs.

9 6-Channel DAC (standard)

Provides source control voltage or recorder output for 6 channels (BNC
connectors). Outputs are programmable for Source Control or Recorder
Voltage.

10 24-Volt Supply (standard)

Provides one 24 V(dc) supply rated at 1.75 Amps.

11 Fan Outlet

Exhaust opening for the unit’s miniature fan. A grill is attached for safety.

12 AC Power Inlet

Provides a common connector for various international plug sets. The unit is
factory set for 100 V(ac), 120 V(ac), 230 V(ac) or 240 V(ac) service.

13 RS-232C Remote Communication Connector (standard)

Provides a 9-pin RS-232C communications port.

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3.3 Displays

The IC/5 has many display screens for monitoring and programming processes.
The four main types of displays are: OPERATE; SENSORS;
MAINTENANCE/DIAGNOSTICS; and PROGRAM.

To move from one display to another, use either the function keys to the right of the
screen or the MENU TREE function described in section 3.3.1 on page 3-8. Figure

3-3 provides an overview of the Program display hierarchy. Figure 3-4 provides an

overview of the Operate display hierarchy.

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IC/5 Operating Manual

PROGRAM

MATERIAL

DIRECTORY

PROCESS

DIRECTORY

I/O

SOURCE/SENSOR

DIRECTORY

Utility

(Pages 1 & 2)

MATERIAL

(Pages 1, 2, 3)

DELETE

MATERIAL

PROCESS

(Pages 1 & 2)

EDIT

SOURCE/SENSOR

(F1) (F2) (F3) (F4) (F5)

(F5)(F5)

(F5)* (F1)

(F5)

(F5)

COPY

DELETE

TAG /

LAYER

EDITING

UNTAG

MATERIAL

LIBRARY

*If material is undefined,
pressing F5 will go directly
to MATERIAL LIBRARY

(F1)

(F2)

(F5)

LOGIC
STATEMENT
DIRECTORY

I/O MAP

DIRECTORY

DEFINE

USER

MESSAGES

FLOPPY

DISK

REMOTE

COMMUNICATIONS

(F1) (F2) (F3) (F4) (F5)

EDIT

LOGIC

STATEMENT

I/O MAP

EDIT

MESSAGE

SAVE

MESSAGE

CANCEL

MESSAGE

CHANGE

CLEAR

MESSAGE

(F5) (F5)

(F1) (F2) (F3) (F4)

SELECT

NEGATE

ADD/DELETE

PARENTHESES

DELETE

CANCEL

CHANGES

SAVE

PARAMETERS

RETRIEVE

PARAMETERS

DELETE

ALL

FILES

(F1) (F2) (F3) (F5)

(F1) (F2) (F3) (F4) (F5)

EDIT CANCEL

NAME

TOGGLE

TYPE

(F1) (F2) (F3) (F4) (F5)

CONTINUECONTINUECONTINUE

DELETE

CONFIG.

FILES

(F3)

(F5)

(F5)(F5)

(F5)

REPLACE

INSERT

(F1) (F2)

NAME

SAVE
NAME

CHANGE

CLEAR

NAME

Figure 3-3 Display Hierarchy - Program

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Figure 3-4 Display Hierarchy - Operate

OPERATE

CRYSTAL ROTATE TEST

SENSORS

XIU

(F1) (F2) (F3)

RS232

TEST

SYSTEM

STATUS

SOURCE

MAIN

CROSS

TAL K

(F1) (F3) (F4) (F5)

SWITCH TOGGLE

SOURCE

AUTOTUNE

PAR AMET ERS

(F1) (F2) (F3) (F4) (F5)

START LEAVE

MANUAL

(F5)

(F6)

CRUCIBLE

TOGGLE
SENSOR

SHUTTER

START

MANUAL

SWITCH XTAL

HEAD

CALIBRATE

SHUTTERS POWER

STOP

MANUAL

POWER

START

AUTOTUNE

START

MANUAL

MAIN/DIAG

(F5)

(F6)

PROGRAM

(F2)

(F4)

(F5)

(F5)

CALIBRATION

STOP

CALIBRATION

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IC/5 Operating Manual

3.3.1 Display Navigation via the MENU TREE

Press the MENU key on the front panel to access the MENU TREE.
(See Figure 3-5.)

Figure 3-5 Menu Display

During the MENU TREE display, the “F” keys (softkeys) will function as explained
in Table 3-1.

Table 3-1 F Key Functionality

Key Function Description

F1 Show 1 level To view only the top level branches,

press function key F1.

F2 Show 2 levels To view the top two level branches,

press function key F2.

F3 Show 3 levels To view the top three level branches,

press function key F3.

F4 Show 4 levels To view all the branches, press function key F4.

F6 Operate To move to the OPERATE display, (see Figure 3-6 on page

3-10) press function key F6.

The Cursor keys are used to move the cursor along the MENU TREE.

 Up arrow Moves the cursor up one line

 Down arrow Moves the cursor down one line
 Left arrow Moves the cursor up one page
 Right arrow Moves the cursor down one page

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You can move to any of the instrument’s displays by positioning the cursor at the
desired display and pressing the MENU key on the front panel. A second pressing
of the MENU key returns the user to the MENU TREE.

The following displays cannot be accessed through the MENU TREE: AutoTune,
Cross Talk Calibrate, Logic Statement Editing, Layer Editing, and I/O Map Editing
Display. To access these displays, use the functions keys. The “Menu Unavailable”
message is displayed when trying to access the MENU TREE from one of these
displays.

3.3.2 Operate Display

The OPERATE display (shown in Figure 3-6) provides information about the
current layer(s) in process. This includes the layer #, material, source #, and sensor
# currently in process. The rate, thickness, power level, state, state time, layer time,
and process time are all updated once a second.

Near the bottom of the display is a graph which gives an analog display of the rate
deviation from the desired rate, while depositing. Alternatively, the graph can
display the percent power being output during a process. Use the UTILITY display
to set parameters that control the meaning, scaling and speed of the graph. (See

section 9.3 on page 9-2.)

IC/5 Operating Manual

On the bottom right of the display is a status area. This area displays error
messages, custom user messages and system status information, such as
indicating the instrument is in TEST mode. For a complete list of error and status
messages, see Chapter 13.

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IC/5 Operating Manual

Figure 3-6 Operate Display

Operate Display Description

1 Layer Currently In Process
2 Layer Timer
3 Material Being Deposited
4 Source Number In Use
5 Sensor Number(s) In Use
6 State of Layer
7 Function Key Definitions
8 Message Area
9 Date and Time
10 Run Number
11 Process Timer
12 Process Being Executed
13 Graphical Display of Rate Deviation or Power
14 Layer Thickness
15 Aggregate Rate

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IC/5 Operating Manual

During the OPERATE display, the function keys along the right side of the screen
will function as explained in Table 3-2.

Table 3-2 Operate Display Function Keys

Key Function Description

F1 ZERO

THICKNESS

F2 SENSORS To access the SENSORS display, (see Figure 3-8 on page

F3 MANUAL To put the layer in manual control, (so that the power level

F4 KEY SWITCH 2

(or KEY
SWITCH 1)

F5 MAIN/DIAG Press this key while in the READY state to move to the

To reset to zero both the displayed thickness of the current
layer and the sensor thickness values shown on page 3 of
the Material display, press function key F1.

3-13) which allows crystal switching and displays sensor

diagnostic information, press function key F2.

is controlled by the hand-held controller), press function key
F3. When in manual, the F3 panel reads AUTO, and
pressing it will remove the layer from the manual state and
place it into the DEPOSIT state. See State Descriptions
(section 3.5 on page 3-30) for a more complete description
of manual operation.

When co-depositing two layers (see Figure 3-7), press this
key to change the numeric designators for F1 and F3. The
function key works in toggle fashion between the secondary
(Key Switch 2) and primary (Key Switch 1) layers.

Maintenance/Diagnostics display. This allows selection of
Source Maintenance or Diagnostics functions for the
Remote communications port, or Cross Talk Calibration.
(See section 3.3.4 on page 3-17.)

F6 PROGRAM To move to the PROGRAM menu, press F6. (See section

3.3.7 on page 3-20.)

In addition to the standard operational screen, if the system is configured for
co-deposition, the operational screen will be divided to show information for both

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layers. Two options of the co-deposition OPERATE screen are available. One
includes the graph information as shown in Figure 3-7. The other removes the
graph and shows enlarged digital information for Rate, Thickness, and Power. The
format is determined by a parameter in the UTILITY screen. (See Chapter 9.)

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IC/5 Operating Manual

Figure 3-7 Co-deposition Operate Display

3.3.2.1 Crystal Life and Starting Frequency

On the SENSORS display, crystal life is shown as a percentage of the monitor
crystal’s frequency shift, relative to the 1.50 MHz frequency shift allowed by the
instrument. This quantity is useful as an indicator of when to change the monitor
crystal to safeguard against crystal failures during deposition. It is normal to change
a crystal after a specific amount of crystal life (% change) is consumed.

It is not always possible to use a monitor crystal to 100% of crystal life. Useful
crystal life is highly dependent on the type of material being deposited and the
resulting influence of this material on the quartz monitor crystal. For well-behaved
materials, such as copper, at about 100% crystal life the inherent quality, Q, of the
monitor crystal degrades to a point where it is difficult to maintain a sharp
resonance and therefore the ability to measure the monitor crystal’s frequency
deteriorates.

When depositing dielectric or optical materials, the life of a gold, aluminum or silver
quartz monitor crystal is much shorter—as much as 10 to 20%. This is due to
thermal and intrinsic stresses at the quartz-dielectric film interface, which are
usually exacerbated by the poor mechanical strength of the film. For these
materials, the inherent quality of the quartz has very little to do with the monitor
crystal’s failure.

It is normal for a brand new quartz monitor crystal to display a crystal life anywhere
from 0 to 5% due to process variations in producing the crystal. Naturally, this
invites the question, “Is a brand new crystal indicating 5% life spent inferior to a
crystal indicating 1% life spent?”

If a new crystal indicates 5% life spent, it means that either the quartz blank is
slightly thicker than normal (more mechanical robustness), or the gold electrode is
slightly thicker than normal (better thermal and electrical properties), or both. In
either case, its useful life with regard to material deposition should not be adversely
affected. To verify this assertion, laboratory testing was performed on crystals

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which covered the crystal life range in question. Results indicate that a brand new
crystal that indicates 3 to 5% life spent is just as good as, if not better than, a crystal
indicating 0 to 2% life spent.

As a consequence, it is important to consider the change in crystal life (%), not just
the absolute crystal life (%) indicated.

3.3.3 Sensors Display

Figure 3-8 Sensors Display

IC/5 Operating Manual

3.3.3.1 SENSORS Display Description

1 # (Sensor Number field)

These numbers correspond to the measurement channel numbers on the rear
panel of the IC/5. The cursor keys are used to position the box cursor over the
desired sensor number. When either the Crystal Switch, Rotate Crystal Head,
Test XIU, or Clear Quality / Stability function key is pressed, the function will be
performed on the sensor indicated by the box cursor. It is not allowed to cursor

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to sensor numbers that do not have the corresponding measurement card
installed. If a crystal fail has occurred for a particular sensor this condition is
indicated by displaying the sensor number in reverse video.

2 SENS TYPE

This field indicates the Sensor Type chosen for each sensor number. A “1”
indicates a single crystal head, a “2” indicates a dual crystal head, and a “6”
indicates a CrystalSix sensor head.

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IC/5 Operating Manual

3 XTAL POSITIONS

This field is subdivided into three categories; current position (CURR), next
position (NEXT), and FAILED. Information is displayed in these fields only if the
sensor has a dual or CrystalSix sensor type.

For a dual sensor type the CURR field will show either the word ON or the word
OFF. ON indicates the active sensor of the dual sensor head. OFF indicates the
inactive (shuttered) sensor of the dual sensor head. For a dual sensor type the
NEXT and FAILED fields have no meaning.

For a CrystalSix sensor type the CURR field indicates the current position of
the CrystalSix sensor head. The NEXT field indicates the position to which the
CrystalSix sensor head will rotate upon pressing the CrystalSwitch function
key. The FAILED field indicates the CrystalSix sensor head positions containing
failed crystals.

4 Z TYPE

This field displays the Z-ratio being used for the given sensor. MATL indicates
the Z-ratio being used for thickness calculation is the value found in the Material
parameter Z-ratio. AUTO indicates the IC/5’s Auto Z feature is being used for
thickness calculations. Auto Z continually calculates the Z-ratio for the “as
deposited” film. If the IC/5 suddenly lost the ability to calculate Auto Z, AUTO
would change to either MATL or SENS. MATL has the same meaning as
described above, SENS indicates the last calculated Auto Z value (prior to
failure) is being used for thickness calculations for this sensor.

The IC/5 determines to use MATL or SENS depending on the frequency of the
fundamental. If the fundamental frequency closely matches the “last valid”
fundamental frequency prior to Auto Z failure, the IC/5 will use the SENS value.
Otherwise the IC/5 will use the MATL value.

5 Q (Crystal Quality value field)

This field displays the value currently accumulated in the Crystal Quality
counter when active. DLY indicates the Crystal Quality counter is not active.
The Crystal Quality counter will become active five seconds after entering
DEPOSIT and if the Crystal Quality parameter is non-zero. The function of the
Crystal Quality counter is described on see page 4-8.

6 S (Crystal Stability value field)

This field displays the value currently accumulated in the Crystal Stability
counter. The function of the Crystal Stability counter is described
on see page 4-9.

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IC/5 Operating Manual

7XTAL

This field is subdivided into two categories. The first category, LIFE displays the
crystal life. The IC/5 allows a 1.5 MHz frequency shift on the monitor crystal
corresponding to 100% crystal life. The value shown represents the amount of
crystal life consumed. The amount of useful crystal life is highly dependent on
the nature of the material being deposited as well as deposition conditions. The
second category is a measurement of the crystal activity, ACT. Activity is a
measure of the sensor’s “health” or ability to conduct current. The values range
from a maximum of 650 (healthiest) to a minimum of 0 (least healthy).

The activity value is useful for predicting when a crystal needs to be replaced.
If a crystal is about to fail, its series resistance will increase, allowing less
current to flow through the crystal and hence the activity value will decrease.
The closer the activity value is to zero the more imminent a crystal failure.

It also can be used to gauge the health of the sensor head electrical contacts.
For example, if a new monitor crystal is placed into the sensor head and has a
crystal life of near 0%, but the activity value for this crystal is lower than 400,
this indicates the sensor head or in-vacuum cable is in need of repair.

8RATE

This field is also subdivided into two categories. The first category is AVE. The
value displayed here is the sensor’s average rate. This average is calculated
based on a 2.5 second average minus the most recent 0.5 seconds of
information. The second field is RAW representing the instantaneous rate
measurement. These fields are useful in identifying if a sensor’s rate
measurements are becoming erratic. N/A (not available) will be displayed in
these fields for sensors not in use.

9 Function Key Definition area

10 Message area

11 Aggregate Rate, Thickness, and Power display area

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IC/5 Operating Manual

3.3.3.2 Function Key Selection Choices for the Sensors Display

F1 CRYSTAL SWITCH

To initiate a crystal switch for the sensor number selected, press function key
F1. The crystal switch will be done on the sensor indicated by the box cursor.
Use the cursor arrow keys to position the box cursor.

F2 ROTATE XTAL HEAD

If the sensor number chosen is a CrystalSix or rotary sensor type, press
function key F2 to sequentially rotate the sensor head through all six positions.
This is useful to initialize a CrystalSix or rotary sensor after replacing failed
crystals. The action is taken on the sensor indicated by the box cursor. For the
rotary sensor, a readout of failed (F) and good (G) crystals is shown in the lower
left hand portion of the display. This readout assists the user in knowing which
crystals are good and which are failed relative to the current position of the
rotary sensor. This information is not retained upon leaving the SENSORS
display. To re-gain this information, press the Rotate Xtal Head function key
again.

F3 TEST XIU

Initiates the XIU self test. The XIU self test determines whether the crystal
interface unit (XIU) and measurement card pair is operating properly.

NOTE: For the XIU self test to work properly, the XIU must have the six inch

BNC cable (IPN 755-257-G6) attached and must be disconnected from
the sensor feedthrough.

F4 CLEAR QUALITY STABILITY

To clear the Quality and Stability counters for the sensor chosen by the box
cursor, press function key F4.

F6 OPERATE

To return to the Operate display, press function key F6.

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IC/5 Operating Manual

3.3.4 Maintenance/Diagnostics Display

These displays provide a simple method for system maintenance and diagnostics.
Pressing the MAIN/DIAG function key during the Operate display accesses the
Maintenance/Diagnostics display.

Figure 3-9 Maintenance/Diagnostics Display

3.3.4.1 Function Key Selection Choices for the Maintenance/Diagnostics Display

F1 RS232 TEST

Press function key F1 to initiate the RS-232C COMM PORT self test. Upon
completion of the test, the unit will display a message indicating the test was
successful and the COMM PORT is okay; or the test failed and the COMM
PORT is bad. If the COMM PORT is bad, a reminder message to make certain
the RS-232C loop back connector is installed is displayed.

NOTE: The RS-232C Loop Back connector, IPN 760-406-P1 must be installed

on the IC/5 RS-232C port for the self test to work properly.

F3 SYSTEM STATUS

Press function key F3 to access the SYSTEM STATUS display. The SYSTEM
STATUS display can also be accessed using the MENU TREE.

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F4 SOURCE MAINTENANCE

To move to the Source Maintenance display, press function key F4.

F5 CROSS TALK CALIBRATION

To enter the cross talk calibration series of displays, press function key F5.
Cross talk calibration is used in co-deposition applications to correct for
material flux from one source being deposited onto the sensors used to control
the other material’s source. See section 12.5 on page 12-4 for the Cross Talk
Calibration Procedure.

F6 OPERATE

To return to the Operate display, press function key F6.

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IC/5 Operating Manual

3.3.5 Source Maintenance Display

Figure 3-10 Source Maintenance Display

3.3.5.1 Function Key Selection Choices for the Source Maintenance Display

F1 SWITCH CRUCIBLE

To switch the source turret to the crucible position designated by the crucible
parameter, press function key F1.

F2 TOGGLE SENSOR SHUTTERS

To activate the shutter relay for the sensors associated with the designated
material, press function key F2. Pressing this key a second time deactivates the
sensor shutter relays.

F3 TOGGLE SOURCE

To activate the shutter relay for the source associated with the designated
material, press function key F3. A second pressing of this key deactivates the
source shutter relay.

F4 START MANUAL POWER

To enable the hand-held controller to effect power changes to the source output
associated with the chosen material, press function key F4. Pressing this key
a second time exits manual power.

NOTE: The MANUAL power level is automatically set to zero % power when

exiting Manual Power while in source maintenance. This is different
from executing a process. When executing a process, pressing the
Manual Power key a second time will place the instrument into the
Deposit State.

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F5 AUTOTUNE

To activate the Autotune displays, press function key F5. See section 12.6 on

page 12-11 for a description of Autotune and Autotune displays.

F6 MAIN/DIAG

To return to the Maintenance/Diagnostics display, press function key F6.

3.3.6 Cross Talk and Calibration Display

Cross talk calibration is used during co-deposition to correct for material from one
source being deposited onto sensors used to control the second co-deposited
material’s source.

When using multiple sensors and multiple sources it can be very difficult to
empirically determine the required cross talk corrections. The following series of
functions enables an automatic determination of cross talk values.

Figure 3-11 Cross Talk Calibration Display

IC/5 Operating Manual

The Cross Talk Calibration Display provides for initiation of the automatic cross talk
calibration algorithm to determine the calibration thicknesses (CAL THICK). The
CAL THICK values are entered into page 3 of the Material Definition Display. These
values are used during co-deposition to correct for material from one source being
deposited onto the sensors used to control the second co-deposited material’s
source.

A calibration is done on each material to be co-deposited. See section 12.5 on

page 12-4 for a detailed description of cross talk calibration.

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IC/5 Operating Manual

3.3.7 Program Displays

Program displays allow you to program processes and system configuration. Each
program display has a section at the bottom that gives the rate, thickness, power
level, and status of the process running. PROGRAM is divided into five major
categories, with some of these being further subdivided. Each category has a
complete section in this manual detailing the parameters in that category and any
special information needed to navigate those displays. Following is a brief
description of each category, with reference to the appropriate sections of the
manual.

Figure 3-12 Program Display

3.3.7.1 Function Key Selection Choices for the Program Display

F1 MATERIAL DIRECTORY

Material parameters include information specific to a given material to be
deposited. The information includes Z ratio, density, soak times; up to 24
materials can be defined. (See Chapter 4.)

F2 PROCESS

The process screens allow the user to program a series of materials into a
multilayer process. Desired rate, final thickness, and other information specific
to each layer is also programmed here. Fifty different processes can be
defined, containing up to a total of 250 layers. (See Chapter 5.)

F3 I/O

The I/O category deals with several different external links from the IC/5 to the
vacuum system. This category is divided into the following subcategories, each
accessed by a function key. Refer to the indicated sections for more detailed
information on each subcategory.

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IC/5 Operating Manual

Figure 3-13 I/O Display

LOGIC STATEMENT DIRECTORY: Provides a display that facilitates selection
of Logic statements for editing. (See Chapter 6.)

I/O MAP DIRECTORY: Provides a display where relays, inputs, or outputs may
be assigned names and where the relay type may be designated as normally
open or normally closed. (See section 6.6 on page 6-16.)

DEFINE USER MESSAGES: Provides a display where user messages may be
assigned. (See section 6.7 on page 6-17.)

FLOPPY DISK: Saves or retrieves parameters to or from floppy disk or saves
Datalogging parameters to the floppy disk (See section 3.6.8 on page 3-39).

REMOTE COMMUNICATIONS: Defines configuration for external computer
communications (See Chapter 7.)

F4 SOURCE/SENSOR DIRECTORY

Source/Sensor displays allow the user to set up the configuration for sources
and sensors connected to the IC/5. The information includes which source and
sensor shutter outputs are connected, how many crucibles a source has, and
whether a sensor is a single, dual or CrystalSix. (See Chapter 8.)

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F5 UTILITY

Parameters on the UTILITY displays deal with overall system setup, including
how displays are formatted and general process choices (such as whether to
STOP on max power). (See Chapter 9.)

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IC/5 Operating Manual

3.4 Process Description

The IC/5 allows the user to control deposition of a sequential series of single layers
or two co-deposited layers of materials. This is done by defining and executing a
process.

3.4.1 Defining a Process

The following procedure is used to define a process. (All steps do not necessarily
have to be followed in the given order.)

1 Make sure the instrument is in READY.

Some configuration and process parameters can be changed only while the
instrument is in READY. Therefore, before setting parameters, make sure
READY appears as the state on the OPERATE display. If it does not, press
STOP then RESET.

2 Configure the sensors.

Configuring the sensors involves designating whether the sensor is a single,
dual or CrystalSix sensor, and what output relays are connected to the sensor
shutter and crystal switcher, if any. Also, the Auto Z feature is activated or
deactivated during sensor configuration. These parameters are on the
SENSOR display of the SOURCE/SENSOR display. See Chapter 8 for a
detailed description for programming these parameters. Also see section 3.6.1

on page 3-32 for details on crystal switching.

3 Configure the sources.

Configuring the sources involves selecting the digital-to-analog voltage
converter (DAC) output, the output voltage range and polarity, and selecting the
output relay for the source shutter. Also, if a source has more than one crucible,
this is set up in the source configuration. The source parameters are
programmed on the SOURCE screen of the SOURCE/SENSOR display. See

Chapter 8 for a detailed description for programming these parameters. Also

see section 3.6.2 on page 3-34 for details on crucible selection.

4 Define materials.

To define materials, the MATERIAL displays are used. Each distinct material
used in the process must be defined. If the same material is going to be used
more than once in the process, it needs to be defined only once. Final thickness
and rate parameters are determined by the layer definition. The material
definition includes density, Z-ratio, tooling, and soak power characteristics.
Control loop characteristics also relate to the material. Also, a specific sensor
and source are associated with each material. See Chapter 4 for a detailed
description for programming these parameters.

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5 Define layer/process.

To define layers and processes, the PROCESS displays are used. A process
is an ordered set of layers. Layers are entered in order on the PROCESS
display. Each layer consists of a material, chosen by number from the material
directory, final thickness, and rate. Additional information can be provided here
for special process features; these include thickness setpoint and time limit
triggers, RateWatcher, rate ramps, crucible selection and co-deposition. For a
detailed description of layer parameters see Chapter 5.

6 Configure utility information.

The final step in defining a process is to program any process related
parameters on the UTILITY display. This includes which defined process to
execute, what layer to begin the process on (typically 1), and whether to STOP
on max power. It may also be desirable to modify the definition of the graphical
display and analog output. See Chapter 9 for a detailed description of utility
parameters.

3.4.2 Executing a Process

IC/5 Operating Manual

Once a process has been defined, it is ready to execute.

NOTE: Certain parameters cannot be changed while executing a process. The

IC/5 will not allow these parameters to be changed.

 A Process is not being executed when the instrument is in the READY state, or

when the Last Layer is in the IDLE state (end of process). A Layer is not being
executed when the instrument is the READY, STOP, or IDLE state.

 STOP freezes a process, the status information on the display is maintained

and the control voltage output is set to zero.

 START, pressed once, will continue the process from the point at which it was

stopped.

 RESET takes a stopped process back to the beginning of the process at the

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designated “Layer to START.”

HINT: It may be desirable to execute a new process in TEST before doing an

actual deposition to check correct shutter operation, sequencing and limits.

The execution of a process is depicted in the following state diagram.

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IC/5 Operating Manual

See Figure 3-15 and

Figure 3-16

Figure 3-14 Process State Diagram

1 Make sure the instrument is in READY. If not, press STOP then RESET.

2 Press START. Assuming there are no configuration problems, the first layer will

3 When the first layer is complete, it will go to IDLE. Press START again to begin

4 If at some point there is a need to interrupt or discontinue the process, press

5 A critical error may occur while a process is running.

enter pre-deposition, and continue on through deposition and post-deposition.
(See section 3.5 on page 3-30 for detailed information about the states of a
layer.) If there are configuration problems, a message describing the problem
will be displayed, see Chapter 13 for Status and Error Message definitions.

the next layer. Repeat until the process is complete.

STOP. This will close the sensor and source shutters, set the power to zero,
and freeze the display. The process can be restarted where it left off by
pressing START. (The pre-deposition phases will be repeated.) To completely
abandon the run, press RESET.

For example, a sensor fail on a single sensor with a single head crystal may
occur in pre-deposition. The IC/5 will automatically STOP if a critical error
occurs. See section 13.1, Status and Error Messages, on page 13-1 for a list of
critical errors. Assuming the error has been remedied, the process can be
continued where it left off by pressing START. Pressing RESET will abandon
the run.

IPN 074-237AE

3 - 24

3.4.3 Pre-conditioning a Layer

It may be desirable to prepare a layer for deposition while the previous layer is in
progress. Pressing START while a layer is running will begin the pre-deposition
states of the next layer. However, there are certain restrictions and some
precautions should be taken.

1 The next layer cannot use the same source as the current layer. Pressing

START will cause a source conflict and the process will STOP. If
pre-conditioning is desired, be sure the sources defined in the two consecutive
layers are different.

2 The next layer will enter DEPOSIT while the current layer is in DEPOSIT

(co-deposition) unless a Soak Hold is activated. A Soak Hold will hold the
pre-deposition at the chosen Soak Power level until ready to proceed. To set
these up, see Chapter 6.

NOTE: If a Soak Hold is not active and two layers attempt to enter DEPOSIT using

some of the same sensors, a STOP sensor conflict will occur.

IC/5 Operating Manual

IPN 074-237AE

3 - 25

IC/5 Operating Manual

3.4.4 Co-deposition

On the IC/5 it is possible to execute two layers simultaneously. A co-deposition is
defined on the Layer Definition display. A YES is entered for the co-deposition
parameter of the first layer to be co-deposited. This layer is referred to as the
primary layer. The primary and secondary layers must both be defined before the
YES is entered for the co-deposition parameter of the primary layer. In
co-deposition, when the primary layer reaches final thickness, the secondary layer
will also leave deposition. However, if the secondary layer reaches final thickness
first, the primary layer will continue until reaching its programmed final thickness.
There are two other parameters associated with co-deposition. The first is ratio
control. This controls the secondary layer’s rate at a percentage of the primary
layer’s desired rate. The second is cross-sensitivity, which compensates for
interference between the two depositions. See Sections section 5.3 on page 5-4
and section 12.5 on page 12-4 for details on programming these parameters.

If two layers are programmed for co-deposition, pressing START once will begin
both layers.

NOTE: It is also possible to run two layers at the same time by pressing START

twice, but ratio control, cross-sensitivity and automatic completion of the
secondary channel will not be active.

3 - 26

IPN 074-237AE

3.4.5 Automating a Process

A process can be automated so that a complete process can be executed without
having to press START between all the layers. A process can be automated by any
of the following three methods.

1 Setting the logic statement:

IC/5 Operating Manual

IF PROCESS END ALL

AND LAYER END ALL

THEN START

will cause a complete process to run by pressing START once. For a step by
step procedure to set up this statement, see section 6.5 on page 6-15.

2 Remote communication control. An external computer could be set up to

monitor the status of a process and issue START commands at desired times.
(See Chapter 7.)

3 Remote input line. A remote input line can be configured to issue a START

command based on some external event. (See Chapter 6.)

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IC/5 Operating Manual

Figure 3-15 State Sequence Diagram - Part A

3 - 28

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Figure 3-16 State Sequence Diagram - Part B

IC/5 Operating Manual

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3 - 29

IC/5 Operating Manual

3.5 State Descriptions

Table 3-3 State Descriptions

STATE CONDITION RELAY CONTACT

STATUS

NOTE: 1 through 7 are Pre-Deposit states.

1. READY The IC/5 will accept a START
command

2. SOURCE SWITCH Instrument advances to next state
when “turret” input is low, or “turret”
delay has elapsed. If IDLE PWR of
the previous layer using this source
is not equal to zero, power is set to
zero before the crucible position
changes. [Crucible #, Source #]

3. RISE TIME 1 Source is rising to Soak Power 1
level. [Rise Time 1]

4. SOAK TIME 1 Source is being maintained at Soak
Power 1 level. [Soak Time 1, Soak
Power 1]

5. RISE TIME 2 Source is rising to Soak Power 2
level. [Rise Time 2]

6. SOAK TIME 2 Source is being maintained at Soak
Power 2 level. [Soak Time 2, Soak
Power 2]

7. SOAK HOLD 1

SOAK HOLD 2

Source is being maintained at Soak
Power level. [Soak Hold input]

Source
Shutter

Inactive Inactive

Inactive Inactive

Inactive Inactive

Inactive Inactive

Inactive Inactive

Inactive Active

Inactive
Inactive

Sensor
Shutter

Inactive
Active

3 - 30

8. SHUTTER DELAY Rate is being controlled. Advances
to Deposit State once the Source is
in Rate Control within > of 5% or
1A/s. [Shutter Delay ON]

NOTE: 9 through 16 are Deposit states.

9. CONTROL DELAY Constant Power at Soak Power 2.
Startsrate control when the control
delay time elapses. [Control Delay,
Control Delay Time]

10. DEPOSIT Rate control. [Rate, Final
Thickness, PID COntrol, Process
Gain, Primary Time Constant,
System Dead Time]

11. RATE RAMP TIME 1 Rate control, desired rate
changing. [New Rate 2, Start Ramp
2, Ramp Time 2]

Inactive Active

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Active Active

Active Active

Active Active

Table 3-3 State Descriptions (continued)

STATE CONDITION RELAY CONTACT

IC/5 Operating Manual

STATUS

NOTE: 1 through 7 are Pre-Deposit states.

12. RATE RAMP TIME 2 Rate control, desired rate
changing. [New Rate 2, Start Ramp
2, Ramp Time 2]

13. RATEWATCHER

(SAMPLE)

14. RATEWATCHER

(HOLD)

Rate control. [RateWatch
Accuracy]

Constant power, based on last
sample’s average power.
[RateWatch Time]

15. MANUAL Source power controlled by
hand-held controller.

16. TIME-POWER Crystal failed; source maintained at
average control power prior to
crystal failure. [Time Pwr Y]

NOTE: 17 through 20 are Post-Deposit states.

17. FEED RAMP Source changing to Feed Power.
[Feed Power, Feed Ramp Time]

18. FEED Source maintained at Feed Power
level. [Feed Time]

Source
Shutter

Sensor
Shutter

Active Active

Active Active

Active Inactive

Active Active

Active Active

Inactive Inactive

Inactive Inactive

19. IDLE RAMP Source changing to Idle Power.

Inactive Inactive

[Idle Ramp Time, Idle Power]

20a.IDLE POWER (=0%) Source maintained at zero power;

Inactive Inactive

will accept a START command.

20b.IDLE POWER (>0%) Source resting at Idle Power; will

Inactive Inactive

accept a START command.

21. STOP Source output set to zero power.

Inactive Inactive

The display is frozen at the last rate

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and thickness values; will not
accept a START or RESET
command.

NOTE: In the STOP state the instrument will accept a START
provided a Crystal Failure has not occurred for the sensors
used in the layer being started.

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IC/5 Operating Manual

3.6 Special Features

The IC/5 has several special features to enhance the performance of the
instrument.

3.6.1 Crystal Switching

The IC/5 offers a choice of single, dual, CrystalSix or rotary sensors. The dual or
CrystalSix sensor provides a backup monitor crystal in case a crystal fails during
deposition. To configure sensors, see Chapter 8.

A crystal switch will automatically occur when:

 The instrument is configured for a dual head, a layer is running on the primary

sensor, and the primary crystal fails. The primary sensor is the sensor (of the
dual sensor) which has its option set to non-zero.

 The instrument is configured for a CrystalSix, a layer is running, and there is at

least one good crystal from the crystal position list (see Chapter 4) left in the
carousel when the active crystal fails.

 The instrument is configured for a rotary sensor, a layer is running, and there is

at least one good crystal in the rotary sensor.

 The instrument is configured for a dual head or single heads, a START is

executed and the designated primary sensor is different from the last sensor
run.

 Using a CrystalSix and pressing START, if the current CrystalSix position is not

the position listed first on the material display.

A crystal switch will NOT automatically occur:

 During a state of STOP, READY or IDLE.

 When the designated primary sensor has already failed at the START of a

layer. (A STOP will occur.)

 During deposition if the secondary crystal of a dual head fails, or the last good

crystal of a CrystalSix fails. (In either case a TIME-POWER or STOP will occur,
depending on the sensor option chosen.)

A crystal switch can be manually executed via the front panel, hand-held controller,
remote communications, or logic statements when the system is configured for
dual, CrystalSix, or rotary sensors.

NOTE: When crystal switching with the hand-held controller, the IC/5 must be on

the SENSORS display.

NOTE: The active sensor of a dual sensor head is shown as ON in the SENSORS

display.

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3 - 32

3.6.1.1 CrystalSix Position Select

Used in conjunction with the position-select CrystalSix sensor (IPN 750-446-G1),
the IC/5 allows crystal switching to a predetermined subset of the six crystal
positions, if desired. This subset is selected using the Crystal Position parameter
located on page 3 of the Material Set Up display. (See section 4.3 on page 4-5.)
The position select feature allows you to select which of the six crystals are to be
used for a given material. In applications involving sequential layering of different
materials this allows specific crystals to be used for specific materials, eliminating
the need for more than one sensor head in the deposition system.

3.6.1.2 Rotary Sensor Crystal Switching

Selecting type 7, Rotary, as the sensor type enables sequential crystal switching
only. Upon a crystal switch the Crystal Switch Output will first close for one second
and then open (i.e., one pulse to move one position). The IC/5 will not keep track
of which position the Rotary Sensor is on nor will it keep track of which crystals are
good and which are failed. The Position Selection feature available with Type
6=Multi is not available for the rotary sensor.

After the one second pulse, the IC/5 measurement system software will attempt to
find the resonant frequency for the crystal in this position. If the IC/5 does not find
a good resonant frequency for this crystal it will again pulse the Crystal Switch
Output for one second and attempt to find a resonant frequency at this position.
There will be a maximum of five attempts to find a good resonant frequency (i.e., a
maximum of five pulses of the Crystal Switch Output). If a good resonant frequency
is not found after five attempts, the IC/5 will then enter the Time Power or STOP
state depending on the Sensor Option value chosen in the Material parameters
display.

IC/5 Operating Manual

There is to be a maximum of five attempts to find a good resonant frequency
however, while executing a Layer, if the IC/5 detects a crystal fail and automatically
initiates a crystal switch it will recognize there has been an automatic crystal switch.
The IC/5 will keep track of the number of times an automatic crystal switch has
been done. Therefore if there have been five automatic crystal switches and then

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the sixth crystal fails, the IC/5 will go directly to either Time Power or STOP as
appropriate without any additional pulses.

Start resets all crystal fail flags to ’good’.

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IC/5 Operating Manual

3.6.2 Source/Crucible Selection

The IC/5 can control a source with up to 64 crucibles, through up to six binary
encoded relays. This is configured by setting the Number Of Crucibles, Crucible
Outputs, Turret Feedback, Turret Input, and Turret Delay parameters on the
SOURCE display of the SOURCE/SENSOR Directory. (See section 8.3 on page

8-3 for details on programming the parameters associated with source/crucible

selection.)

To define which crucible to use for a layer, set the “crucible” parameter on the
PROCESS display. When the layer is started, if the current crucible position is
different from the one requested, the system’s turret controller will move into
position. This will be signified on the OPERATE screen by the state indicator
SOURCE SWITCH. The layer sequencing will continue on to RISE 1 after either
the turret delay time expires or an input indicates the turret is in position, depending
on which option is chosen. The specific method used is determined by the
parameter Turret Feedback on the SOURCE screen.

NOTE: If the source has been idling at a nonzero power when the START is

initiated, the power will be dropped to zero before the crucible is changed.

3.6.2.1 Example: Programming Turret Source Crucible Selection

Interfacing a turret source controller to the IC/5 requires both hardware
connections to the turret controller and properly defining certain instrument
parameters.

Proceed to the SOURCE/SENSOR Directory (see Figure 8-1 on page 8-1) and
choose the source that is going to be defined as the turret source. This is
accomplished by Editing the chosen source as follows (see Figure 8-2 on page

8-1):

1 Designate the Number of Crucibles; for example, 4.

2 Select the Crucible Output. This defines the number of the first relay that

encodes the crucible number selected by the active layer. Relays are defined
sequentially with the first relay containing the least significant bit (LSB). The
greater the number of crucibles selected, the greater the number of relays
required. The number required is based on binary encoding (actual coding is
binary -1, with 00 representing position 1 and 11 representing position 4). Any
unused sequence of relays may be used if it is long enough to provide sufficient
selections.

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IC/5 Operating Manual

3 Select the Crucible Output Type as normally open (NO), or normally closed

(NC).

Example:

Number of crucibles = 4
Crucible output = 6
Crucible output type = NO

For this example, wiring to the controller is based on Table 3-4. Only relays 6
and 7 are needed to encode the four possible positions.

Table 3-4 Wiring To The Controller

Crucible
Position Contact Status

Relay #6 Relay #7

1OpenOpen

2 Closed Open

3 Open Closed

4 Closed Closed

NOTE: If the crucible output type were normally closed (NC), Table 3-4 would

need to be modified by exchanging open and closed.

4 Determine whether Turret Feedback is desired. This allows the turret position

controller to stop further instrument processing until the requested turret
position is satisfied. If chosen, a turret input must be connected to the turret
position controller’s feedback signal.

If Turret Feedback is not chosen, program a Turret Delay Time which allows an
adequate time for positioning to take place. Once the delay time has expired,
instrument state processing continues.

5 The selection of a particular crucible for a layer is defined in the process

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directory.

6 Select the process to modify.

7 Program the particular “Crucible Number” for each layer.

Example:

Layer 1: Crucible Number = 1
Layer 2: Crucible Number = 2
Layer 4: Crucible Number = 4

3 - 35

3.6.3 Auto Z

IC/5 Operating Manual

The Auto Z feature of the IC/5 automatically determines the Z-ratio of a crystal. This
feature is enabled on the SENSOR screen of the SOURCE/SENSOR display (see

section 8.4 on page 8-6). For the theory behind Auto Z, see section 2.1.6 on page
2-9.

The following information briefly describes Auto-Z and details the conditions under
which a crystal is "unable to Auto-Z".

Auto Z is calculated based on the slightly different mass sensitivities of the
fundamental and the first anharmonic resonances of the quartz crystal oscillator.
Therefore, the need to measure the frequencies of both the fundamental and the
first anharmonic resonances is critical.

When inserting a monitor crystal and attempting to Auto Z, the fundamental and
anharmonic frequencies are measured to determine the status of the crystal. The
crystal status may be classified into four categories:

1 New Crystal

The first category is for a “new” crystal, one that does not have any material
deposited onto it. If both frequencies fall within the allowed range for new
crystals, the instrument will allow an Auto Z calculation with this crystal.

2 Known, Used Crystal

The second category is for a “known, used” crystal, to account for the possibility
that a person would remove a good monitor crystal and then reinsert the same
crystal. Whenever a crystal fail occurs the last valid crystal frequencies are
stored in the instrument. Upon inserting a coated monitor crystal the measured
frequencies for this crystal will fall outside of the allowed range for “new”
crystals. These frequencies are then compared with the stored values to
determine if this crystal is the same one as was in use prior to the crystal fail. If
the crystal is the same as used previously, and Auto Z was being calculated
previously, the instrument will allow an Auto Z calculation with this crystal.

3 Unknown, Used Crystal

The third category is for an “unknown, used” crystal. This category is for a used
crystal that, upon insertion, shows measured frequencies that are outside of the
allowed “new” crystal range and also do not match the frequencies stored
within the instrument. This results in an “unable to Auto Z” condition because
the initial frequencies of the uncoated monitor crystal are not known.

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3 - 36

4 Unable to detect anharmonic frequency.

As mass is deposited onto the crystal, the oscillation is damped. This damping
may be severe enough that the resonance can no longer be determined. If the
instrument loses the ability to measure the first anharmonic frequency, but is
still able to determine the fundamental frequency, the “unable to Auto Z”
message is displayed. The instrument will then continue to use the fundamental
frequency to monitor the deposition.

If the instrument loses the ability to measure the fundamental frequency, the
“XTAL fail” message is displayed.

Unable to Auto Z

An “unable to Auto Z” condition occurs whenever:

 The anharmonic frequency cannot be measured.

 The fundamental and anharmonic frequencies of the monitor crystal have

not been continuously measured from the uncoated to the coated state.

3.6.4 Auto Tune - Optimizing the Control Loop

IC/5 Operating Manual

The control loop parameters can often be calculated automatically by the IC/5. This
is done by using the AutoTune feature. For a detailed description of AutoTune, see

section 12.6 on page 12-11.

3.6.5 Rate Watcher

The IC/5 includes a sample and hold function which enables periodic sampling of
the deposition rate by opening and closing the sensor shutter. If you are controlling
inherently stable deposition sources, this function is useful in maximizing crystal
life. When RateWatcher is enabled, during deposit, rate control will be established.
Then the sensor shutter will close for a designated amount of time. The shutter will
once again be opened to validate and adjust the power level. This procedure is
repeated throughout the deposition. Two process parameters - RateWatch time

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and RateWatch accuracy - control this function. See section 5.3 on page 5-4 for
details on programming these parameters.

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IC/5 Operating Manual

3.6.6 Hand-Held Controller

A Hand-Held Controller, see Figure 3-17, is provided as an accessory with the IC/5.
The Controller serves as a wired remote to manually control power, switch crystals
and produce a STOP.

The Controller is attached to the instrument with a modular plug to the front panel.
Power is affected (only when in Manual mode) by moving the POWER/STOP
switch laterally. A STOP is produced by moving the POWER/STOP switch down
(only when in Manual mode). When in a READY, IDLE, or STOP state and the
instrument is on the SENSORS display, a crystal switch is activated by pressing the
red button on the body of the controller.

The ship kit includes a convenience hook for the Controller that can be attached to
the instrument’s mounting ears or some other accessible location.

Figure 3-17 Hand-Held Controller

3 - 38

IPN 074-237AE

3.6.7 Test Mode

Rate Display

40

Density (gm/cc)

--------------------------------------

Tooling %

100

-------------------------



A

sec=

This instrument contains a software-controlled test mode which simulates actual
operation. Optionally, time can be compressed so that a long process can be
simulated in one tenth of the time. The purpose of the test mode is to verify basic
operation and to demonstrate typical operation. The rate display during test mode
operation is:

Crystal fails are ignored in test mode. Crystal switching is disabled. All other relays
and inputs operate normally.

3.6.8 Floppy Disk (Optional)

The floppy disk drive is an optional accessory for the IC/5. This option allows
storage of all parameter information, as well as automatic datalogging information,
to the 3.5 inch 1.44 MByte floppy diskette. The maximum number of files which may
be stored onto the floppy disk is 224 for a 1.44 MByte diskette and 112 files when
using a 720 KByte diskette. The maximum number of files includes parameter files
as well as datalogging files. Diskettes must be pre-formatted.

IC/5 Operating Manual

[1]

The parameter set may be stored under a new or existing filename and retrieved
from an existing file. A file containing the IC/5 parameter set is referred to as a
configuration file. Datalog information will be saved to the diskette only if the
datalog output is turned on and the output path is chosen as the floppy drive (as
opposed to choosing output to the RS-232C port). Selection of the output path is
done in the remote communications parameters display. (See section 7.2 on page

7-2.)

Multiple files may be contained on one diskette. Filenames may be eight characters
long; extensions are used to differentiate between configuration files and
datalogging files. All files must be contained on the root directory. Storage/retrieval
from sub-directories is not allowed.

IPN 074-237AE

The instrument supports the writing of filenames using alphanumeric characters
selected using the cursor keys. Characters A through Z and numbers 0 through 9
inclusive are available. The instrument has the ability to display the files contained
on the diskette. A scrolling feature is enabled to view those filenames which cannot
fit on the screen. Error messages include: Disk Full; File Not Found; Disk Write
Protected; Media Error; Disk not Found; File is Read Only. See section 6.8 on page

6-19 for details on floppy disk operation.

Datalog files are automatically named using the process number and run number.
See section 3.6.10 on page 3-40 for the Datalog string details.

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IC/5 Operating Manual

CAUTION

NOTE: A floppy disk access code is enabled when the instrument has a program

lock code set. By entering a floppy disk access code the IC/5 parameters
can be saved to, or retrieved from, the diskette only without entering the
Program Lock Code. (See Chapter 9.)

Do not bend the diskette.

Keep the diskette dry and do not expose the diskette to
temperature extremes.

Do not remove the diskette from the instrument while a
save or retrieve operation is taking place.

3.6.9 Lock and Access Codes

The IC/5 has several forms of protection to prevent unauthorized changing of
parameters. Refer to the utility setup section for a description of parameter and I/O
lock codes and the floppy disk access code. In addition, a method of locking the
entire display is available through the remote communications. Lock codes are
entered on the Utility Display. (See Chapter 9.)

HINT: To clear any of the locks, except the floppy disk access code, hold down the

3.6.10 Datalog

Datalog automatically saves to diskette or outputs to Remote Comm every time a
source shutter closure occurs. When the Datalog data is saved to a diskette the
information will be saved under a filename. Filenames will not be output when the
Datalog information is sent out the Remote Comm port.

Datalog files saved to diskette will be automatically named using the process
number and run number. The format of the filename is PXXRXXX.IDL. If the
diskette already contains a file with the same filename as the new datalog
information, the new datalog information will be appended to the old file.

At each source shutter close, the datalog information will be appended to the file
(when saved to diskette) until the end of the Process.

The Datalog data set is defined as follows:

clear key on power up. This will clear all lock codes. HOWEVER, if no lock
codes are present, all parameters will be cleared by doing this.

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IC/5 Operating Manual

DATE: MMDDYYYY
TIME: XX:XX

PROCESS #1: ##

RUN #: ###

LAYER #: ###

MATERIAL NAME: NNN#MM#

PROCESS TIME XX:XX

LAYER TIME: XX:XX

DEPOSITION TIME: XX:XX

THICKNESS: ###.### kÅ

AVE. AGG. RATE: ###.### Å/s

AVE. RATE DEVIATION: ##.# Å/s

ENDING POWER: ##.# %

AVE. POWER: ##.# %

COMPLETION MODE:normal, time-power...ave. value,

crystal fail, remote, keyboard, max.

power, hand-held controller.
Crystal Use History (example)
SENSOR 1

BEG. END BEG. END BEG. END

XTAL FREQ. FREQ. LIFE LIFE ACT. ACT. STAB. QUAL.

1 5975323 5876991 0% 2% 245 240 30 22
2 5978368 5879012 0% 2% 225 189 1200 99
3 5768733 5677987 3% 5% 176 168 0 0
4 5346278 5129870 48% 51% 150 105 0 0
5 4876789 4567899 78% 81% 101 101 25 1
6 4678843 4500000 98% 100% 100 92 0 0

SENSOR 2

BEG. END BEG. END BEG. END

XTAL FREQ. FREQ. LIFE LIFE ACT. ACT. STAB. QUAL.

2 5978368 5879012 0% 2% 225 189 1200 99
3 5768733 5677987 3% 5% 176 168 0 0
5 4876789 4567899 78% 81% 101 101 25 1

SENSOR 8

BEG. END BEG. END BEG. END

XTAL FREQ. FREQ. LIFE LIFE ACT. ACT. STAB. QUAL.

IPN 074-237AE

1 5975323 5876991 0% 2% 245 240 30 22

NOTE: A minus sign in front of the END FREQ. value indicates that crystal has

failed.

3 - 41

IC/5 Operating Manual

If two layers are co-deposited, the first layer to have a source shutter close will be
data-logged first.

The ability to turn ON/OFF datalogging and where to output the datalog data set is
determined by a programmable parameter located in the Remote Communications
display. The CRYSTAL USE HISTORY data is an optional subset of the datalog
string. A second parameter located in the Remote Communications display is used
to determine if the CRYSTAL USE HISTORY is to be output. Additionally, the
datalog string format is selectable between a page format and a comma delimited
format. The comma delimited format is actually comma-and-quote delimited
intended for file importation into a spreadsheet program. When a spreadsheet
program imports a file having the comma delimited format data groups that are
strictly numbers become value entries, data groups surrounded by quotes are
stored as labels. For the page format, only those sensors which are used in a
particular Material for a particular Layer will be datalogged. For the comma
delimited format, all the data fields are returned for all the sensors and crystals. If
a sensor is not used during the deposition, the data field will contain a zero.

Outputting the Datalog Data Set to multiple outputs at the same time (for example,
Save to diskette and Output to Remote Comm at the same time) is not allowed.

3 - 42

IPN 074-237AE

4.1 Material Set Up Overview

PROGRAM

MATERIAL DIRECTORY

MATERIAL

MATERIAL LIBRARY

The IC/5 can store the definition parameters for up to 24 materials. Each layer in a
Process references one of these materials by its directory number, ranging from 1
to 24. Any material that is to be used must be defined.

Materials are defined by referencing the internal Material Library (see Figure 4-1)
and by completing a series of parameter entries at the front panel.

Figure 4-1 Display Tree for Material Set Up

IC/5 Operating Manual

Chapter 4

Material Set Up

Material Set Up is initiated by selecting the MATERIAL Directory (F1) key in the
Program display. This will invoke the Material Directory (see Figure 4-2). Upon
entry to the Material Directory, the cursor will be found at the last referenced
material.

4.2 Material Definition

Material definition is initiated by selecting the MATERIAL (F5) panel in the Material
Directory. If the cursor is placed at a previously defined material, the definition
displays for that material will be entered. If the cursor is placed at an unassigned

IPN 074-237AE

material, the Material Library will be entered to select from one of more than two
hundred cataloged materials.

4 - 1

IC/5 Operating Manual

CAUTION

Figure 4-2 Material Directory

A previously defined material can be deleted provided it is not referenced in any
process. Place the cursor at the material to be deleted and select the DELETE
MATERIAL (F1) panel in the Material Directory. The Material Directory will be
compressed to eliminate any gaps and Process definitions will be updated to reflect
any directory number changes.

Logic statements will not be updated to reflect Material
Directory number changes after deleting a material.

The Material Library (see Figure 4-3) provides an alphabetic list of materials by
chemical name along with their density and Z-ratio. A custom USER material may
also be selected. Once a material is selected from the library listing, press the
Define Material (F5) function key to enter the material parameter series of displays.

You can move among and through the materials by using the cursor and panel
keys, as shown in the following tables and illustrations.

Figure 4-3 Material Library

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IC/5 Operating Manual

m

Table 4-1 Function Key Selection Choices For Material Library

Key Function Description

F1 PAGE FORWARD Select this panel to access additional pages of

material listings.

F2 PAGE BACK Select this panel to return to previous pages of

material listings.

F5 DEFINE MATERIAL Select this panel to complete the definition of the

selected material.

F6 MATERIAL Select this panel to return to the Material Directory.

Figure 4-4 Material Definition (Page 1)

Table 4-2 Function Key Selection Choices For Material Description

Key Function Description

F1 PAGE FORWARD Select this panel to access the second page of

material definition parameters.

F2 PAGE BACK Select this panel to return to the first page of

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material definition parameters.

F5 MATERIAL LIBRARY Select this panel to access the Material Library.

F6 MATERIAL DIRECTORY Select this panel to return to the Material

Directory.

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IC/5 Operating Manual

Figure 4-5 Material Definition (Page 2)

Figure 4-6 Material Definition (Page 3)

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4.3 Material Definition Parameters

Rate Avg. and Thickness values are shown on Material definition page 3, for each
sensor in use. The Rate Avg. shown is the rate averaged over the last 2.5 seconds
minus the most recent 0.5 seconds. This is the same average as shown in the
SENSORS display. Thickness is the value at each sensor. The thickness values
are zeroed when the zero thickness function key is pressed when in the OPERATE
display. N/A is shown for sensors which are not in use.

DENSITY . . . . . . . . . . . . . . . . . . . . . 0.100 to 99.999 gm/cc

This parameter is specific to the material being deposited onto the Crystal. It is
one of two parameters that relate the mass loading on the crystal to a thickness.
Values range from 0.100 to 99.999. If a material is chosen from the Material
Library the density is automatically entered. The default value is 10.00.

Z-RATIO . . . . . . . . . . . . . . . . . . . . . . 0.100 to 15.000

This parameter is specific to the material being deposited. It is one of two
parameters that relate the mass loading on the crystal to a thickness. Values
range from 0.100 to 15.000. If a material is chosen from the Material Library the
Z-ratio is automatically entered. The default value is 1.00. This parameter is
superseded if Auto Z-ratio is selected in Source/Sensor Set-Up.

IC/5 Operating Manual

SOURCE . . . . . . . . . . . . . . . . . . . . . 1,2,3,4,5,6

This parameter determines which source, defined in the Source Set Up display,
is to be used for source control voltage for the material being defined. Values
can range from 1 to 6. The default is 1. This parameter cannot be changed
while a process is running.

CONTROL LOOP . . . . . . . . . . . . . . 0,1,2

This parameter establishes the control loop algorithms pertaining to either a
slow responding source or a fast responding source. Permissible values are 0,
1, or 2. Select a 0 to choose the non-PID control loop, good for fast- and
medium-speed responding systems with high noise levels (e.g., an electron

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beam gun with or without a liner, having a large sweep amplitude of low
frequency, 10 Hz or less). Select a 1 for the PI control loop, good for fast,
medium, or slow systems with medium noise levels (e.g., an electron beam
gun with medium sweep amplitude frequency, 20 to 100 Hz; also, sputtering
and resistive sources). Select a 2 for the PID Control Loop, good for fast,
medium or slow systems with low noise levels (e.g., an electron beam gun with
sweep off or at a high frequency, 100+ Hz; also, sputtering and resistive
sources).

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IC/5 Operating Manual

TOOLING TF

i

TmTx=

PROCESS GAIN . . . . . . . . . . . . . . . 0.01 to 99.999 Å/sec/% pwr

This parameter determines the change in % Power for a given rate deviation
(dRate/dPower). The larger the process gain value, the smaller the change in
power for a given rate error. Values range from 0.01 to 99.999. The default
value is 10.00.

PRIMARY TIME CONSTANT . . . . . 0.010 to 999.999 sec

This is the evaporation source’s time constant. This value is defined as the time
difference between the actual start of a change in rate and the time at which
63% of the rate step is achieved. This value may be measured according to the
above criterion or it may be determined empirically. Values range from 0.010 to

999.999 seconds. The default value is 1. This parameter is disabled if the
CONTROL LOOP option parameter is set to 0.

SYSTEM DEAD TIME . . . . . . . . . . . 0.010 to 999.999 sec

This value is defined as the time difference between a change in % power and
the start of an actual change in rate. Values range from 0.010 to 999.999
seconds. The default value is 1.0. This parameter is disabled if the CONTROL
LOOP option parameter is set to 0.

MASTER TOOLING. . . . . . . . . . . . . 10.0 to 400.0%

This is a correction factor used for correlating the aggregate rate and thickness
accumulation on the crystal with the thickness accumulation on the substrate.
This thickness difference is due to the geometric distribution of material flux
from the source.

The tooling factor is calculated using the equation

where TF
T

= Thickness on the Crystal.

x

= Initial Tooling Factor, Tm = Actual Thickness at the Substrate, and

i

Values range from 10.0 to 400.0%. The default value is 100%.

If the MASTER TOOLING parameter is changed, the new MASTER TOOLING
value is used for subsequent calculation of the individual as well as aggregate
rate and thickness. Also, the aggregate thickness and each sensor’s thickness
accumulated thus far will be re-scaled based on the change to the MASTER
TOOLING.

For single sensor applications, this is the recommended parameter to use to
get agreement between sensor and substrate thicknesses. The sensor tooling
should be left at 100%. For multiple sensor applications, the sensor tooling
factors should first be adjusted so all sensors read the same rate. Next, adjust
the MASTER TOOLING to get agreement between the thickness measured by
the IC/5 and the thickness measured at the substrates.

[1]

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