INFICON Cygnus Thin Film Deposition Controller User Manual

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OPERATING MANUAL

Cygnus

Thin Film Deposition Monitor

IPN 074-379-P1K

OPERATING MANUAL

Cygnus

Thin Film Deposition Monitor

IPN 074-379-P1K

www.inficon.com reachus@inficon.com

Due to our continuing program of product improvements, specifications are subject to change without notice.

Trademarks

The trademarks of the products mentioned in this Operating Manual are held by the companies that produce them.

INFICON® and Cygnus® are trademarks of INFICON Inc.

Windows®, Windows 95® and Microsoft® are registered trademarks of Microsoft Corporation.

CAJON® is a registered trademark of Swagelok, Co.

All other brand and product names are trademarks or registered trademarks of their respective companies.

The information contained in this Operating Manual is believed to be accurate and reliable. However, INFICON assumes no responsibility for its use and shall not be liable for any special, incidental, or consequential damages related to the use of this product.

Due to our continuing program of product improvements, specifications are subject to change without notice.

DECLARATION

OF CONFORMITY

This is to certify that this equipment, designed and manufactured by:

INFICON Inc.

Two Technology Place

East Syracuse, NY 13057

USA

meets the essential safety requirements of the European Union and is placed on the market accordingly. It has been constructed in accordance with good engineering practice in safety matters in force in the Community and does not endanger the safety of persons, domestic animals or property when properly installed and maintained and used in applications for which it was made.

Equipment Description: Cygnus Thin Film Deposition Controllers, including Oscillators and Crystal Sensors as properly installed.

Applicable Directives: 73/23/EEC as amended by 93/68/EEC 89/336/EEC as amended by 93/68/EEC

Applicable Standards: EN 61010-1:2001 EN 61326:1997 (Industrial Use) EN 61000-3-2:1995/A14:2000 EN 61000-3-3:1995

CE Implementation Date: August 22, 2003

Authorized Representative: Gary W. Lewis Vice President - Quality Assurance INFICON Inc.

ANY QUESTIONS RELATIVE TO THIS DECLARATION OR TO THE SAFETY OF LEYBOLD INFICON'S PRODUCTS SHOULD BE DIRECTED, IN WRITING, TO THE QUALITY ASSURANCE DEPARTMENT AT THE ABOVE ADDRESS.

01-22-04

Warranty

WARRANTY AND LIABILITY - LIMITATION: Seller warrants the products manufactured by it, or by an affiliated company and sold by it, and described on the reverse hereof, to be, for the period of warranty coverage specified below, free from defects of materials or workmanship under normal proper use and service. The period of warranty coverage is specified for the respective products in the respective Seller instruction manuals for those products but shall not be less than two (2) years from the date of shipment thereof by Seller. Seller's liability under this warranty is limited to such of the above products or parts thereof as are returned, transportation prepaid, to Seller's plant, not later than thirty (30) days after the expiration of the period of warranty coverage in respect thereof and are found by Seller's examination to have failed to function properly because of defective workmanship or materials and not because of improper installation or misuse and is limited to, at Seller's election, either (a) repairing and returning the product or part thereof, or (b) furnishing a replacement product or part thereof, transportation prepaid by Seller in either case. In the event Buyer discovers or learns that a product does not conform to warranty, Buyer shall immediately notify Seller in writing of such non-conformity, specifying in reasonable detail the nature of such non-conformity. If Seller is not provided with such written notification, Seller shall not be liable for any further damages which could have been avoided if Seller had been provided with immediate written notification.

THIS WARRANTY IS MADE AND ACCEPTED IN LIEU OF ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, WHETHER OF MERCHANTABILITY OR OF FITNESS FOR A PARTICULAR PURPOSE OR OTHERWISE, AS BUYER'S EXCLUSIVE REMEDY FOR ANY DEFECTS IN THE PRODUCTS TO BE SOLD HEREUNDER. All other obligations and liabilities of Seller, whether in contract or tort (including negligence) or otherwise, are expressly EXCLUDED. In no event shall Seller be liable for any costs, expenses or damages, whether direct or indirect, special, incidental, consequential, or other, on any claim of any defective product, in excess of the price paid by Buyer for the product plus return transportation charges prepaid.

No warranty is made by Seller of any Seller product which has been installed, used or operated contrary to Seller's written instruction manual or which has been subjected to misuse, negligence or accident or has been repaired or altered by anyone other than Seller or which has been used in a manner or for a purpose for which the Seller product was not designed nor against any defects due to plans or instructions supplied to Seller by or for Buyer.

This manual is intended for private use by INFICON® Inc. and its customers. Contact INFICON before reproducing its contents.

NOTE: These instructions do not provide for every contingency that may arise in connection with the installation, operation or maintenance of this equipment. Should you require further assistance, please contact INFICON.

www.inficon.com reachus@inficon.com

Cygnus Operating Manual

Chapter 1

Introduction and Specifications

1.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

1.1.1 Related Manuals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1

1.2 Instrument Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2

1.2.1 Definition of Notes, Cautions and Warnings. . . . . . . . . . . . . . . . . . . . . . . . . 1-2

1.2.2 General Safety Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-3

1.2.3 Earth Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-4

1.2.4 Main Power Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5

1.3 How To Contact Customer Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-6

1.3.1 Returning Your Cygnus to INFICON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6

1.4 Cygnus Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-7

1.4.1 Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-7

1.4.2 Screens and Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7

1.4.2.1 Instrument Set Up Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-8

1.4.2.2 Set Up Parameters for Each Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-8

1.4.3 User Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-11

1.4.4 Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12

1.4.5 Source / Recorder Outputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-13

1.4.6 Logic Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-14

1.4.7 Relays / Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14

1.4.8 Remote Communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-15

1.4.9 Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-15

1.4.10 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-15

1.4.11 Operating Environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16

IPN 074-379-P1K

1.4.12 Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16

1.4.13 Warm Up Period . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-16

1.4.14 Size. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-16

1.4.15 Connector Clearance Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16

1.4.16 Weight . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16

1.4.17 Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16

1.5 Unpacking and Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-17

1.6 Parts and Options Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-17

1.6.1 Base Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-17

1.6.2 Pre-Installed Options or Spares . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-18

1.6.3 Oscillator Packages, Optional Accessories, and Sensors . . . . . . . . . . . . . 1-18

1.7 Initial Power-On Verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-20

TOC - 1

Cygnus Operating Manual

Chapter 2

Operation

2.1 Front Panel Controls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

2.2 Rear Panel Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3

2.3 Displays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4

2.3.1 ALL CHANNELS Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5

2.3.1.1 GENERAL PARAMETERS Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8

2.3.1.2 General MAINTENANCE Display. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9

2.3.1.2.1 All Channels Sensor MAINTENANCE Display. . . . . . . . . . . . . . . . . . . . . . 2-11

2.3.1.3 CHANNEL Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12

2.3.1.3.1 Channel Parameters Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-16

2.3.1.3.1.1 HARDWARE PROCESS Display. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-17

2.3.1.3.2 Channel SENSOR MAINTENANCE Display . . . . . . . . . . . . . . . . . . . . . . . 2-17

2.3.1.3.2.1 Channel SOURCE MAINTENANCE Display . . . . . . . . . . . . . . . . . . . . . . . 2-20

2.4 Crystal Life, Starting Frequency and Activity . . . . . . . . . . . . . . . . . . . . . . . 2-21

2.5 Defining a Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-22

2.5.1 Executing a Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-22

2.6 State Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-23

2.7 Special Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-24

2.7.1 Crystal Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-24

2.7.2 Rotary Sensor Crystal Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-25

2.7.3 Source/Crucible Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-26

2.7.3.1 Example: Programming Turret Source Crucible Selection. . . . . . . . . . . . . 2-26

2.7.4 Hand-Held Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-28

2.7.5 Test Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-29

2.7.6 Floppy Disk (Optional) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-29

2.7.7 Lock Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-30

2.7.8 Datalog. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-30

2.7.9 Auto Soak 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-32

IPN 074-379-P1K

Chapter 3

TOC - 2

Channel Parameters

3.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

3.2 Channel Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2

3.2.1 Channel Parameter Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2

3.3 Channel Hardware Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12

3.3.1 Channel Hardware Parameters Definition . . . . . . . . . . . . . . . . . . . . . . . . . 3-12

Cygnus Operating Manual

Chapter 4

General Parameters

4.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

4.2 General Parameter Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2

4.3 General Parameters Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-3

4.4 Logic Directory Set Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-5

4.4.1 Logic Statement Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-5

4.4.2 Editing Logic Statements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6

4.4.2.1 Logic Statement Directory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-7

4.4.2.2 Logic Statements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-7

4.4.2.3 Logic Statement Event Editing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8

4.4.2.3.1 Event Definitions (IF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-10

4.4.2.4 Logic Statement Action Editing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-13

4.4.2.4.1 Action Definitions (THEN). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-14

4.5 Counters Timers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-16

4.6 I/O Map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-17

4.7 Floppy Disk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-19

Chapter 5

Remote Communications

5.1 Remote Communications Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1

5.2 Physical Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-1

5.2.1 RS232C Serial Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-1

5.2.2 IEEE488 Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3

5.3 Message Protocols. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4

5.3.1 INFICON Cygnus Message Formats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-4

5.3.2 Basic Protocol. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-4

5.3.2.1 Command Packet (Host to Instrument Message). . . . . . . . . . . . . . . . . . . . .5-4

IPN 074-379-P1K

5.3.2.2 Response Packet (Instrument to Host Message). . . . . . . . . . . . . . . . . . . . . 5-6

5.4 Cygnus Communication Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-7

5.4.1 ECHO Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-7

5.4.2 HELLO Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-8

5.4.3 Parameter Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9

5.4.3.1 All Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-9

5.4.3.1.1 Query All Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-9

5.4.3.1.2 Update All Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10

5.4.3.2 Channel Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-10

5.4.3.2.1 Query Channel Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10

5.4.3.2.2 Update Channel Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-11

TOC - 3

Cygnus Operating Manual

5.4.3.3 General Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-16

5.4.3.3.1 Query General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-16

5.4.3.3.2 Update General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-16

5.4.3.4 Input Name Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-18

5.4.3.4.1 Query Input Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-18

5.4.3.4.2 Update Input Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-18

5.4.3.5 Logic Statements Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-19

5.4.3.5.1 Query Logic Statements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-19

5.4.3.5.2 Update Logic Statements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-19

5.4.3.6 Output Name Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-23

5.4.3.6.1 Query Output Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-23

5.4.3.6.2 Update Output Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-23

5.4.3.7 Type of Output Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-24

5.4.3.7.1 Query Output Type. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-24

5.4.3.7.2 Update Output Type. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-24

5.4.4 STATUS Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-24

5.4.4.1 Status Channel Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-25

5.4.4.2 Status General Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-30

5.4.5 REMOTE Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-32

5.4.5.1 Remote Channel Action Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-33

5.4.5.2 Remote General Action Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-35

5.4.6 Negative Response Error Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-37

5.5 Sample Cygnus Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-37

5.5.1 Remote Communications Example — Updating a

Channel’s Rate Parameter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-37

Chapter 6

Installation and Interfaces

6.1 Location Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1

6.1.1 Sensor Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1

6.1.2 Sensor Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3

6.1.3 Control Unit Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5

6.2 Avoiding Electrical Interference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5

6.2.1 Verifying/Establishing Earth Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5

6.2.2 Connections to Earth Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6

6.2.3 Minimizing Noise Pickup From External Cabling . . . . . . . . . . . . . . . . . . . . . 6-7

6.3 Connecting the Controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-8

6.3.1 Verifying the Correct Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-8

6.3.2 Voltage Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-9

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Cygnus Operating Manual

6.3.3 Routing XIU Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-10

6.3.4 Interface Cable Fabrication and Pin-Out . . . . . . . . . . . . . . . . . . . . . . . . . .6-10

6.3.4.1 Source Control Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-10

6.3.4.2 Input/Relay Module Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-11

6.3.4.3 RS-232C Communications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-13

6.3.4.4 Isolated +24 V(dc) Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-14

6.3.4.5 Optional DAC Card. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-15

Chapter 7

Calibration Procedures

7.1 Importance of Density, Tooling and Z-Ratio. . . . . . . . . . . . . . . . . . . . . . . . . 7-1

7.2 Determining Density . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-1

7.3 Determining Tooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-2

7.4 Laboratory Determination of Z-Ratio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-3

7.5 Determining Cross Sensitivity Correction For Co-Deposition. . . . . . . . . . . .7-4

7.5.1 Procedure Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-5

7.5.2 Procedure Assumptions and Requirements. . . . . . . . . . . . . . . . . . . . . . . . . 7-5

7.5.3 Detailed Procedure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-6

Chapter 8

Troubleshooting, Status and Error Messages

8.1 Status and Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1

8.2 Troubleshooting Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-8

8.2.1 Major Instrument Components and Assemblies. . . . . . . . . . . . . . . . . . . . . . 8-9

8.2.2 Troubleshooting the Instrument . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-10

8.2.3 Troubleshooting Transducers/Sensors. . . . . . . . . . . . . . . . . . . . . . . . . . . .8-13

8.2.4 Troubleshooting Computer Communications . . . . . . . . . . . . . . . . . . . . . . .8-18

8.3 Replacing the Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-20

8.3.1 Standard and Compact. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-20

8.3.2 Shuttered and Dual Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-21

IPN 074-379-P1K

8.3.3 Bakeable Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-22

8.3.4 Sputtering Sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-23

8.3.5 Crystal Snatcher. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-24

8.3.6 CrystalSix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-24

8.3.7 Crystal12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-24

8.4 Crystal Sensor Emulator IPN 760-601-G1 or 760-601-G2. . . . . . . . . . . . . 8-25

8.4.1 Diagnostic Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-26

8.4.1.1 Measurement System Diagnostic Procedure . . . . . . . . . . . . . . . . . . . . . . .8-26

8.4.1.2 Feed-Through Or In-Vacuum Cable Diagnostic Procedure . . . . . . . . . . . .8-27

8.4.1.3 Sensor Head Or Monitor Crystal Diagnostic Procedure. . . . . . . . . . . . . . . 8-28

8.4.1.4 System Diagnostics Pass But Crystal Fail Message Remains. . . . . . . . . . 8-29

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Cygnus Operating Manual

8.4.2 % XTAL Life . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-29

8.4.3 Sensor Cover Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-30

8.4.3.1 Compatible Sensor Heads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-30

8.4.3.2 Incompatible Sensor Heads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-30

8.4.4 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-31

Chapter 9

Measurement and Control Theory

9.1 Basics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-1

9.1.1 Monitor Crystals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-2

9.1.2 Period Measurement Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-4

9.1.3 Z-Match Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-5

9.1.4 Active Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-6

9.1.5 ModeLock Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7

9.1.6 Auto Z-Match Theory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-9

9.1.7 Control Loop Theory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-11

Appendix A

Index

Material Table

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TOC - 6

1.1 Introduction

Cygnus is a closed loop process controller designed for use primarily in physical vapor deposition. The unit monitors and/or controls the rate and thickness of the deposition of thin films. Deposition rate and thickness are inferred from the frequency change induced by mass added to a quartz crystal. This technique positions sensors in the path between or to the side of the source of the vaporized material and the target substrate. The sensor incorporates an exposed oscillating quartz crystal whose frequency decreases as material accumulates. The change in frequency provides information to determine rate and thickness and to continually control the evaporation power source. With user supplied time, thickness and power limits and with desired rates and material characteristics, the unit is capable of automatically controlling the process in a precise and repeatable manner. User interaction is accomplished via the unit's front panel and consists of selection or entry of parameters to define the process.

Cygnus Operating Manual

Chapter 1

Introduction and Specifications

The complete system consists of a main electronics unit, the Cygnus, sensor heads and a crystal interface unit (XIU) for each attached sensor. These items are generally bundled at the factory and are also sold separately.

The Cygnus Manual provides user information for installing, programming, calibrating and operating the main electronics unit.

When reading the Cygnus Manual, please pay particular attention to the NOTES, CAUTIONS, and WARNINGS found throughout the text. The Notes, Cautions, and Warnings are defined in section 1.2.1 on page 1-2.

You are invited to comment on the usefulness and accuracy of this manual by filling out the registration card and returning it.

IPN 074-379-P1K

1.1.1 Related Manuals

Sensors are covered in separate manuals.

 074-154 - Bakeable

 074-155 - CrystalSix

 074-156 - Single/Dual

 074-157 - Sputtering

 074-398 - Crystal12

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Cygnus Operating Manual

CAUTION

WARNING

WARNING - Risk Of Electric Shock

1.2 Instrument Safety

1.2.1 Definition of Notes, Cautions and Warnings

When using this manual, please pay attention to the NOTES, CAUTIONS and WARNINGS found throughout. For the purposes of this manual they are defined as follows:

NOTE: Pertinent information that is useful in achieving maximum instrument

efficiency when followed.

Failure to heed these messages could result in damage to the instrument.

Failure to heed these messages could result in personal injury.

Dangerous voltages are present which could result in personal injury.

IPN 074-379-P1K

1 - 2

1.2.2 General Safety Information

WARNING - Risk Of Electric Shock

CAUTION

Do not open the instrument case! There are no user-serviceable components within the instrument case.

Dangerous voltages may be present whenever the power cord or external input/relay connectors are present.

Refer all maintenance to qualified personnel.

This instrument contains delicate circuitry which is susceptible to transient power line voltages. Disconnect the line cord whenever making any interface connections. Refer all maintenance to qualified personnel.

Cygnus Operating Manual

IPN 074-379-P1K

1 - 3

Cygnus Operating Manual

WARNING - Risk Of Electric Shock

1.2.3 Earth Ground

Cygnus is connected to earth ground through a sealed three-core (three-conductor) power cable, which must be plugged into a socket outlet with a protective earth terminal. Extension cables must always have three conductors including a protective earth terminal.

Never interrupt the protective earth circuit.

Any interruption of the protective earth circuit inside or outside the instrument, or disconnection of the protective earth terminal is likely to make the instrument dangerous.

This symbol indicates where the protective earth ground is connected inside the instrument. Never unscrew or loosen this connection.

IPN 074-379-P1K

1 - 4

1.2.4 Main Power Connection

WARNING - Risk Of Electric Shock

This instrument has line voltage present on the primary circuits whenever it is plugged into a main power source.

Never remove the covers from the instrument during normal operation.

There are no operator-serviceable items within this instrument.

Removal of the top or bottom covers must be done only by a technically qualified person.

In order to comply with accepted safety standards, this instrument must be installed into a rack system which contains a mains switch. This switch must break both sides of the line when it is open and it must not disconnect the safety ground.

Cygnus Operating Manual

IPN 074-379-P1K

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Cygnus Operating Manual

1.3 How To Contact Customer Support

Worldwide support information regarding:  Technical Support, to contact an applications engineer with questions

regarding INFICON products and applications, or

 Sales and Customer Service, to contact the INFICON Sales office nearest you,

 Repair Service, to contact the INFICON Service Center nearest you, is available at www.inficon.com.

If you are experiencing a problem with your instrument, please have the following information readily available:

 the serial number for your instrument,  a description of your problem,  an explanation of any corrective action that you may have already attempted,  and the exact wording of any error messages that you may have received.

To contact Customer Support, see Support at www.inficon.com.

1.3.1 Returning Your Cygnus to INFICON

Do not return any component of your Cygnus to INFICON without first speaking with a Customer Support Representative. You must obtain a Return Material Authorization (RMA) number from the Customer Support Representative.

If you deliver a package to INFICON without an RMA number, your package will be held and you will be contacted. This will result in delays in servicing your instrument.

Prior to being given an RMA number, you may be required to complete a Declaration Of Contamination (DOC) form if your instrument has been exposed to process materials. DOC forms must be approved by INFICON before an RMA number is issued. INFICON may require that the instrument be sent to a designated decontamination facility, not to the factory. Failure to follow these procedures will delay the repair of your instrument.

IPN 074-379-P1K

1 - 6

1.4 Cygnus Specifications

1.4.1 Measurement

Crystal Frequency . . . . . . . . . . . . . . 6.0 MHz (new crystal) to 4.5 MHz

Internal Precision . . . . . . . . . . . . . . . ± 0.004657 Hz over 100 ms sample for

Thickness & Rate Resolution . . . . . . 0.00577 Å (new crystal);

Thickness Accuracy . . . . . . . . . . . . . 0.5% typical, (dependent on process

Frequency Accuracy. . . . . . . . . . . . . ± 2 ppm 0-50 °C

Measurement Frequency . . . . . . . . . 10 Hz

Measurement Technique . . . . . . . . . ModeLock

Cygnus Operating Manual

fundamental and anharmonic frequencies

0.01016 Å (crystal @ 4.5 MHz) over 100 ms sample for material density = 1.0, Z-ratio = 1.0

conditions, especially sensor location, material stress, temperature and density)

User Interface. . . . . . . . . . . . . . . . . . CRT and limited membrane keypad. All

parameters accessible through computer communications. Multiple message areas for indication of states and detailed indication of abnormal and stop conditions.

1.4.2 Screens and Parameters

Navigation . . . . . . . . . . . . . . . . . . . . Six soft keys

Structure. . . . . . . . . . . . . . . . . . . . . . Separate screens dedicated to

1) All Channel Data Display, 2) Individual Channel Data, 3) Channel Parameters,

4) Channel Hardware Parameters,

IPN 074-379-P1K

# of Source / Sensor Channels . . . . 6, Sources can be started or stopped

5) General Parameters, 6) Logic,

7) Maintenance, 8) Communications.

individually or in any combination.

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Cygnus Operating Manual

1.4.2.1 Instrument Set Up Parameters

Test On. . . . . . . . . . . . . . . . . . . . . . . Yes / No

Time Compressed . . . . . . . . . . . . . . Yes / No

Audio Feedback . . . . . . . . . . . . . . . . Yes / No

RS232 Baud Rate . . . . . . . . . . . . . . 2400, 4800, 9600, 19200

IEEE Address. . . . . . . . . . . . . . . . . . 1-30

Data Logging Path . . . . . . . . . . . . . . 0 = No Data Logging

Data Log XTAL History. . . . . . . . . . . Yes / No

Print Screen Path . . . . . . . . . . . . . . . 2 = Floppy Disk

Print Screen Number . . . . . . . . . . . . 0 to 999

DAC Output Option . . . . . . . . . . . . . 0 = Power/Rate for 6 channels

2 = File, Page Format 3 = File, Comma Format

1 = Power/Thickness for 6 channels 2 = Power/Rate/Thickness for 4 channels 3 = Rate/Thickness for 6 channels

Thickness Equation 1. . . . . . . . . . . . Up to 6 channel numbers can be specified,

Thickness Equation 2. . . . . . . . . . . . Up to 6 channel numbers can be specified,

Thickness Equation 3. . . . . . . . . . . . Up to 6 channel numbers can be specified,

1.4.2.2 Set Up Parameters for Each Source

Source States . . . . . . . . . . . . . . . . . . Film template defines state sequence.

Power Ramps. . . . . . . . . . . . . . . . . . 2 per Source

Power Level . . . . . . . . . . . . . . . . 0.00 to 99.99%

Rise Time . . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:sec

Soak Time . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:sec

each channel number can be used only once.

IPN 074-379-P1K

Flexible sequencing is a done by skipping states or vectoring to a different state.

1 - 8

Rate Filter Time . . . . . . . . . . . . . . . . 0.1, 0.4, 1.0, 4.0, 10.0, 20.0, or 30.0 sec

Cygnus Operating Manual

Rate & Thickness Control with

Shutter open . . . . . . . . . . . . . . . . . 0.001 to 999.9 Å/sec

Rate Control with Shutter closed . . . 0.001 to 999.9 Å/sec

Idle Ramp . . . . . . . . . . . . . . . . . . . . . 1 per Source

Idle Power. . . . . . . . . . . . . . . . . . 0.00 to 99.99%

Idle Ramp Time . . . . . . . . . . . . . 00:00 to 99:59 min:sec

Deposit After Pre-Deposit. . . . . . . . . Yes / No

Yes = go to Deposit No = go to Non-Deposit Rate Control

Density . . . . . . . . . . . . . . . . . . . . . . . 0.100 to 99.999 gm/cc

Z-ratio . . . . . . . . . . . . . . . . . . . . . . . . 0.100 to 15.000

Control Loop types . . . . . . . . . . . . . . 0 / 1 / 2

Non-PID, PI, PID

PID Control Mode. . . . . . . . . . . . . . . Fast or Slow Source

Process Gain . . . . . . . . . . . . . . . 0.01 to 999.99 Å/sec/%Power

Primary Time Constant . . . . . . . . 0.010 to 9999.99 seconds

System Dead Time. . . . . . . . . . . 0.010 to 9999.99 seconds

Tooling Factor. . . . . . . . . . . . . . . . . . 1.0 to 999.9%

Secondary Tooling . . . . . . . . . . . . . . 1.0 to 999.9%

Sensors . . . . . . . . . . . . . . . . . . . . . . 2 standard, 4 additional w/optional hardware

Sensor Type . . . . . . . . . . . . . . . . . . . 1 / 2 / 6 / 7 / 12

(Single, CrystalTwo, CrystalSix, Rotary, Crystal12)

CrystalSix Position Select. . . . . . Indexes to next good crystal

IPN 074-379-P1K

Sensor Switch Output. . . . . . . . . . . . 0 to 38

Sensor Shutter Output . . . . . . . . . . . 0 to 38

Sensor Shutter Output Type. . . . . . . 0 / 1

Normally Open, Normally Closed

Maximum Source Power . . . . . . . . . 0.01 to 99.99%

Minimum Source Power . . . . . . . . . . 0.00 to 99.98%

Maximum Power Option . . . . . . . . . . Stop / Idle Ramp / Continue — can be

selected for each source individually.

Averaging Time . . . . . . . . . . . . . . . . 0 to 30 minutes

Final Thickness . . . . . . . . . . . . . . . . 0.000 to 999.9 kÅ

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Cygnus Operating Manual

ON Final Thickness . . . . . . . . . . . . . 0 / 1 / 2

0 = Go to Non-Deposit Control 1 = Go to Idle Ramp 2 = Continue

Cross Talk Percent . . . . . . . . . . . . . . 0.00 to 99.99%, Correction for 2 sensors,

multiple instances of 2 sensor correction is allowed (maximum of 3 instances of 2 sensor correction).

Crucible Selection . . . . . . . . . . . . . . Turret is indexed to selected position on a

start. Turret feedback is checked whenever a source is started. Range is from 1 to number of crucibles.

Number of Crucibles. . . . . . . . . . 1, 4, 8, 16, 32 or 64

Crucible Output . . . . . . . . . . . . . 0 to 37

Crucible Output Type . . . . . . . . . 0 / 1

0 = Normally Open, 1 = Normally Closed.

Turret Feedback. . . . . . . . . . . . . Yes / No

Turret Input. . . . . . . . . . . . . . . . . 0 to 28

Turret Delay . . . . . . . . . . . . . . . . 1 to 60 secs.

RateWatcher® . . . . . . . . . . . . . . . . . Sample and Hold Feature

RateWatcher Option. . . . . . . . . . 0 = None, 1 = Non-deposit,

2 = Non-deposit and Deposit

RateWatcher Time . . . . . . . . . . . 00:01 to 99:59 min:sec

RateWatcher . . . . . . . . . . . . . . . Accuracy 1 to 99%

Source Voltage Range . . . . . . . . . . . 0 to 10 V, 0 to 5 V, 0 to 2.5 V, 0 to -10 V,

0 to -5 V, 0 to -2.5 V

DAC Rate Range . . . . . . . . . . . . . . . 0 = 10 Å/sec, 1 = 50 Å/sec, 2 = 100 Å/sec,

3 = 1000 Å/sec, 4 = 1 Å/sec

DAC Thickness Range. . . . . . . . . . . 0 = 100 Å, 1 = 1000 Å, 2 = 2000 Å,

3 = 3000 Å, 4 = 5000 Å

Substrate Shutter Output . . . . . . . . . 0 to 38

Substrate Shutter Output Type. . . . . 0 / 1

0 = Normally Open, 1 = Normally Closed

IPN 074-379-P1K

1 - 10

Crystal Fail Option . . . . . . . . . . . . . . 0 / 1 / 2

Crystal Quality . . . . . . . . . . . . . . . . . 0 to 9

Crystal Stability . . . . . . . . . . . . . . . . . 0 to 9

Auto-Z. . . . . . . . . . . . . . . . . . . . . . . . Yes / No

1.4.3 User Interface

Front Panel / CRT. . . . . . . . . . . . . . . Parameters can be programmed through

Remote Communications . . . . . . . . . Parameters can be programmed through

Cygnus Operating Manual

0 = Time Power, 1 = Idle Ramp 2 = Stop Can be selected for each source individually.

Cygnus front panel. There is a display for each source with graphical and text / number information. There is also a display showing text and number information for all sources.

computer communications. Complete control of source state sequencing available by remote communications.

I/O. . . . . . . . . . . . . . . . . . . . . . . . . . . Control of state sequencing, starting /

stopping each source, is available using Inputs and Outputs.

PC Applications Software. . . . . . . . . Optional, Compatible with RS232

communications or National Instruments PCI-GPIB Controller and NI-488.2 protocol.

Operating System. . . . . . . . . . . . Windows 2000

Function . . . . . . . . . . . . . . . . . . . Complete Cygnus programming, Monitoring

of sources.

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1 - 11

1.4.4 Display

Type / Color / Size . . . . . . . . . . . . . . CRT / Amber /

Format . . . . . . . . . . . . . . . . . . . . . . . 23 kHz Horizontal Scan Rate

Resolution . . . . . . . . . . . . . . . . . . . . 750 W x 350 H Monochrome

Vertical Scan Rate . . . . . . . . . . . . . . 50/60 Hz automatically detected

Thickness Display Range. . . . . . . . . 0.000 to 999.9 kÅ

Thickness Display Resolution . . . . . 1 Å

Rate Display Range . . . . . . . . . . . . . 0.000 to 9999 Å/sec

Rate Display Resolution. . . . . . . . . . 0.001 Å/sec for 0 to 9.999 Å/sec

Power Display Range. . . . . . . . . . . . 0.00 to 99.99%

Cygnus Operating Manual

5" H x 9" W (127 mm x 228.6 mm)

0.01 Å/sec for 10.00 to 99.99 Å/sec

0.1 Å/sec for 100.0 to 999.9 Å/sec 1 Å/sec for 1000 to 9999 Å/sec

Graphic Display Functions . . . . . . . . Rate Deviation at ±10 or ±20 Å/sec or Power

at 0 to 100%

Graphic Scan Rate. . . . . . . . . . . . . . 0 = Auto, 1 = Slow, 2 = Med, 3 = Fast

Display Data Update Rate . . . . . . . . 1 Hz

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1.4.5 Source / Recorder Outputs

Quantity . . . . . . . . . . . . . . . . . . . . . . 6 standard, an additional 6 are optional with

Type . . . . . . . . . . . . . . . . . . . . . . . . . 6 standard with BNC Connectors for Source

Source control voltage range

(BNC connectors). . . . . . . . . . . . 0 to 10V, 0 to 5V, 0 to 2.5V,

Recorder Voltage Range . . . . . . . . . 0 to 10V

Current rating . . . . . . . . . . . . . . . . . . 20 mA per channel

Resolution . . . . . . . . . . . . . . . . . . . . 15 bits over full range (10 V)

Update Rate . . . . . . . . . . . . . . . . . . . 10 Hz, maximum, (dependent on source

Cygnus Operating Manual

2nd DAC board.

control. 6 optional with 15 pin miniature D-sub providing analog outputs for Rate and Thickness.

0 to -10V, 0 to -5V, 0 to -2.5V.

characteristics).

Accuracy. . . . . . . . . . . . . . . . . . . . . . ± 3% full scale

Zero Adjust . . . . . . . . . . . . . . . . . . . . Individual potentiometer

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Cygnus Operating Manual

1.4.6 Logic Processing

Type . . . . . . . . . . . . . . . . . . . . . . . . . If/Then statements

Logical Functions . . . . . . . . . . . . . . . And; Or; Not; Parentheses

Depth . . . . . . . . . . . . . . . . . . . . . . . . 5 "If" conditions and 5 "Then" results/actions

# of Statements . . . . . . . . . . . . . . . . 100 If/Then

Selectable events. . . . . . . . . . . . . . . Deposition monitor events, states, external

Hierarchy . . . . . . . . . . . . . . . . . . . . . Statements evaluated in numerical order at

Partitioning . . . . . . . . . . . . . . . . . . . . None

Initialization . . . . . . . . . . . . . . . . . . . All outputs transition to their normal states as

per statement

inputs, relays, timers, and counters.

10 Hz any time the unit is on.

early as possible during power-on initialization sequence.

1.4.7 Relays / Inputs

Relays . . . . . . . . . . . . . . . . . . . . . . . SPST 2.5 A relays rated @ 30 V(dc) or

Relay Ratings. . . . . . . . . . . . . . . . . . 100 VA inductive; 2.5A maximum.

# of TTL Compatible Outputs . . . . . . 14 with optional I/O card. Internally pulled up

Inputs (TTL Compatible). . . . . . . . . . (14 standard, 14 additional optional)

Input Levels

maximum high . . . . . . . . . . . . . . 24 V

minimum high. . . . . . . . . . . . . . . 2.5 V

30 V(ac) RMS or 42 V(peak) maximum; (8 standard, up to 16 optional with 2 additional I/O cards); D sub connector; relays are normally open in the power off state, but may be programmed to normally open or normally closed during operation.

to 5 V(dc). May be pulled up externally to 24 V(dc) through 2.4k resistor. minimum high level 0.5mA load @3.75 V maximum low level 10mA load @1.1 V

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1 - 14

maximum low . . . . . . . . . . . . . . . 1.1 V

Scan/Update Rate . . . . . . . . . . . . . . 10 Hz

1.4.8 Remote Communications

RS232C Serial Port . . . . . . . . . . . . . Standard

Baud Rates. . . . . . . . . . . . . . . . . . . . 19,200; 9,600; 4,800; 2,400

IEEE488 Parallel Port. . . . . . . . . . . . Optional

IEEE Service Requests . . . . . . . . . . Supported with RQS and MAV status bits

1.4.9 Accessories

Manual Power

Control Connection. . . . . . . . . . . . . . Front panel

Function . . . . . . . . . . . . . . . . . . . . . . Handheld, increase/decrease/stop

Floppy (Optional) . . . . . . . . . . . . . . . 3.5', 1.44 MByte for process and

Connector Kit . . . . . . . . . . . . . . . . . . Connectors for inputs and relays

Operating Manual. . . . . . . . . . . . . . . PDF format on CD

Cygnus Operating Manual

datalog storage

1.4.10 Power

Power . . . . . . . . . . . . . . . . . . . . . . . . 100 +10%, -15% V(ac) 50/60 Hz

120 +10%, -10% V(ac) 50/60 Hz 230 +10%, -10% V(ac) 50/60 Hz 240 +10%, -15% V(ac) 50/60 Hz

Maximum apparent power . . . . . . . . 300 VA

Fuse . . . . . . . . . . . . . . . . . . . . . . . . . 100 V(ac), 120 V(ac) use 4 Amp IEC 127

approved type T 230 V(ac), 240 V(ac) use 2 Amp IEC 127 approved type T

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Cygnus Operating Manual

1.4.11 Operating Environment

Usage. . . . . . . . . . . . . . . . . . . . . . . . Indoor only

Temperature. . . . . . . . . . . . . . . . . . . 0 to 50 °C (32-122 °F)

Humidity . . . . . . . . . . . . . . . . . . . . . . Up to 85%RH, non-condensing

Altitude . . . . . . . . . . . . . . . . . . . . . . . Up to 2000 meters

Installation (Overvoltage) . . . . . . . . . Category II per IEC 664

Pollution Degree. . . . . . . . . . . . . . . . 1 per IEC 664

1.4.12 Storage Temperature

Storage Temperature . . . . . . . . . . . . -10 to 60 °C (14 to 140 °F)

1.4.13 Warm Up Period

Warm Up Period. . . . . . . . . . . . . . . . None required;

For maximum stability allow 5 minutes.

1.4.14 Size

Not including mounts or user connectors

5.25" H x 17.625" W x 17.3" D (133.4 mm H x 447.7 mm W x 435.1 mm D)

Including mounts, but no user connectors

5.25" H x 18.85" W x 17.3" D (133.4 mm H x 478.8 mm W x 435.1 mm D)

1.4.15 Connector Clearance Requirements

Front. . . . . . . . . . . . . . . . . . . . . . . . . Minimum 1.0" (25.4 mm)

Rear . . . . . . . . . . . . . . . . . . . . . . . . . Minimum 4.0" (101.6 mm)

1.4.16 Weight

With all options. . . . . . . . . . . . . . . . . 13.2 kg / 29 lb

1.4.17 Cleaning

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Use a mild, nonabrasive cleaner or detergent taking care to prevent cleaner from entering the unit.

1.5 Unpacking and Inspection

1 If the Cygnus control unit has not been removed from its shipping container, do

so now.

2 Carefully examine the unit for damage that may have occurred during shipping.

This is especially important if you notice obvious rough handling on the outside of the container. Immediately report any damage to the carrier and to INFICON.

3 Do not discard the packing materials until you have taken inventory and have

at least performed a power on verification.

4 Take an inventory of your order by referring to your order invoice and the

information contained in section 1.6 on page 1-17.

5 To perform a power-on verification, see section 1.7 on page 1-20.

6 For additional information or technical assistance, contact your nearest

INFICON Inc. sales office.

1.6 Parts and Options Overview

Cygnus Operating Manual

1.6.1 Base Configurations

Cygnus Control Unit . . . . . . . . . . . . . 779-700-G1 (100 V(ac) 50/60 Hz)

779-700-G2 (120 V(ac) 50/60 Hz) 779-700-G3 (230 V(ac) 50/60 Hz) 779 -700 -G4 (240 V(ac) 50/60 Hz)

Technical Manual . . . . . . . . . . . . . . . 074-379

Hand Controller . . . . . . . . . . . . . . . . 755-262-G1

I/O Relay Ship Kit . . . . . . . . . . . . . . . 760-024-G1

Power Cord . . . . . . . . . . . . . . . . . . . 068-0433

(shielded power cord - North America) 068-0434

IPN 074-379-P1K

Ship Kit . . . . . . . . . . . . . . . . . . . . . . . 779-610-G1 (100 V(ac), 120 V(ac))

(shielded power cord - European)

779-610-G2 (230 V(ac), 240 V(ac))

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Cygnus Operating Manual

1.6.2 Pre-Installed Options or Spares

Additional Sensor Module (std.) . . . . 760-1132-G1 (up to 2 extra)

Relay Card . . . . . . . . . . . . . . . . . . . . 760-162-G1

Relay Card . . . . . . . . . . . . . . . . . . . . 760-162-G2

I/O Relay Ship Kit. . . . . . . . . . . . . . . 760-024-G1

IEEE488 Parallel . . . . . . . . . . . . . . . 760-142-G1

Communications

Floppy disk . . . . . . . . . . . . . . . . . . . . 760-023-G1

Optional DAC Card . . . . . . . . . . . . . 760-1112-G2

(8 relay outputs, 14 TTL inputs)

(8 relay outputs, 14 TTL outputs)

(8 relay outputs, 14 TTL inputs) 760-024-G2 (8 relay outputs, 14 TTL outputs)

1.6.3 Oscillator Packages, Optional Accessories, and Sensors

IC/5 XIU (Oscillator) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 760-600-G1

Oscillator to vacuum. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 755-257-G6

feedthrough cable, 6" (152.4 mm)

IC/5 Unit to Oscillator Cable 15' (4.6 m). . . . . . . . . . . . . . . . . . . 600-1039-G15

IC/5 Unit to Oscillator Cable, 30' (9.2 m) . . . . . . . . . . . . . . . . . . 600-1039-G30

IC/5 Unit to Oscillator Cable, 50' (15.3 m) . . . . . . . . . . . . . . . . . 600-1039-G50

IC/5 Unit to Oscillator Cable, 100' (30.5 m) . . . . . . . . . . . . . . . . 600-1039-6100

Pneumatic Shutter Actuator . . . . . . . . . . . . . . . . . . . . . . . . . . . . 750-420-G1

Control Valve

Sensor Emulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 760-601-G2

Cygnus Editor Applications Software. . . . . . . . . . . . . . . . . . . . . 779-030-G1

IC/5 Oscillator, 15' and 6" cable pkg. . . . . . . . . . . . . . . . . . . . . . 760-025-G15

IC/5 Oscillator, 30' and 6" cable pkg. . . . . . . . . . . . . . . . . . . . . . 760-025-G30

IC/5 Oscillator, 50' and 6" cable pkg. . . . . . . . . . . . . . . . . . . . . . 760-025-G50

IPN 074-379-P1K

1 - 18

IC/5 Oscillator, 100' and 6" cable pkg. . . . . . . . . . . . . . . . . . . . . 760-025-G100

4 Meter Oscillator Kit . . . . . . . . . . . . . . ............................ . . . . . . . 4XI5-nnn

NOTE: For operation with 3 m to 4 m long in-vacuum cable, contact INFICON for

part the number.

Cygnus Operating Manual

Standard Sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 750-211-G1

Standard Sensor with Shutter. . . . . . . . . . . . . . . . . . . . . . . . . . . 750-211-G2

Compact Sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 750-213-G1

Compact Sensor with Shutter. . . . . . . . . . . . . . . . . . . . . . . . . . . 750-213-G2

Sputtering Sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 750-618-G1

UHV Bakeable Sensor, 12" (304.8 mm) . . . . . . . . . . . . . . . . . . . 007-219

UHV Bakeable Sensor, 20" (508 mm) . . . . . . . . . . . . . . . . . . . . 007-220

UHV Bakeable Sensor, 30" (762 mm) . . . . . . . . . . . . . . . . . . . . 007-221

UHV Bakeable Sensor with Shutter, 12" (304.8 mm) . . . . . . . . . 750-012-G1

UHV Bakeable Sensor with Shutter, 20" (508 mm) . . . . . . . . . . 750-012-G2

UHV Bakeable Sensor with Shutter, 30" (762 mm) . . . . . . . . . . 750-012-G3

Dual Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 750-212-G2

CrystaISix Sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 750-446-G1

Crystal12 Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 750-667-G1

CrystalTwo Switch with two 6" (152.4 mm) BNC cables . . . . . . 779-220-G1

CrystalTwo Switch with two 20" (508 mm) BNC cables . . . . . . . 779-220-G2

NOTE: Contact INFICON for a complete listing of oscillators and sensors.

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Cygnus Operating Manual

WARNING - Risk Of Electric Shock

1.7 Initial Power-On Verification

A preliminary functional check of the instrument can be made before formal installation. It is not necessary to have sensors, source controls, inputs or relays connected to do this. For more complete installation information, see Chapter 6,

Installation and Interfaces and Chapter 7, Calibration Procedures.

There are no user-serviceable components within the instrument case.

Dangerous voltages may be present whenever the power cord or external input/relay connectors are present.

Refer all maintenance to qualified personnel.

Never interrupt the protective earth circuit.

Any interruption of the protective earth circuit inside or outside the instrument, or disconnection of the protective earth terminal is likely to make the instrument dangerous.

This symbol indicates where the protective earth ground is connected inside the instrument. Never unscrew or loosen this connection.

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Cygnus Operating Manual

1 Confirm that AC line voltage is supplied and proper for the instrument. Line

voltage should be indicated on the instrument back label.

2 Press the power button on the front panel. A green pilot light should be seen

next to the power switch.

3 The fan at the back of the instrument should be exhausting air.

4 Video monitor will display an image similar to the one shown in Figure 1-1.

5 Compare the configuration information on the screen against the unit

configuration ordered.

6 Status of parameter information will be displayed. If information was valid prior

to this power up, it should stay valid.

7 After a delay, the instrument will enter the OPERATE display.

8 In the OPERATE display, confirm that the display is centered vertically. Lines

between the function keys (F1...F6) should align with the lines between the panels on the right side of the display.

9 Using a non-conducting alignment tool, verify that the brightness pot is

operative. Adjust for the desired brightness. Access to the brightness pot is at the bottom-center of the face panel, see Figure 2-1 on page 2-1.

Figure 1-1 Cygnus System Status Screen

(Display will vary depending on options present)

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Cygnus Operating Manual

This page is intentionally blank.

1 - 22

IPN 074-379-P1K

2.1 Front Panel Controls

12345

7891011

Operational controls for Cygnus are located on the front panel of the instrument, as depicted in Figure 2-1.

Figure 2-1 Cygnus Front Panel

Cygnus Operating Manual

Chapter 2

Operation

1 CRT Screen

Provides graphical displays, set-up menus, status and error messages.

2 Function Keys

An array of function keys are located adjacent to the screen. These keys are labeled F1 through F6. They are used to select displays or menu items. Their

IPN 074-379-P1K

function is indicated on the display and is described in subsequent sections.

3 Data Entry Keys

A keypad array with numerics 0 through 9 and keys for Yes (Y), No (N), Enter (E), Clear (C), Print, and Help used for selection and parameter entry. All numeric and Yes/No entries need to be followed by Enter. Clear is used to erase data entry errors. If an illegal value has been entered, Clear will erase the error message and re-display the last valid data. The Print Screen key is used to send the display information to the floppy drive. The Help key displays parameter information and the parameter’s value range on the upper portion of the display, replacing the screen name area.

2 - 1

Cygnus Operating Manual

4 System Switches

An array of four keys that provide START, STOP, RESET and STOP ALL functions, for process control.

5 3.5" Floppy Disk Access Port

Receptacle for the optional 3.5", 1.44 MB floppy disk.

6 Stop ALL Key

A key which when pressed will place all channels in a STOP state regardless of the screen display.

7 Power

This switch controls secondary power to the instrument between ON and STANDBY. Power is provided when the button is in its depressed position. The instrument is initialized for approximately 5 seconds before providing an operational screen.

8 Pilot Light

A green pilot light, adjacent to the power switch, is illuminated when power is on.

9 Remote Control Jack

Receptacle for the wired hand-held remote controller.

10 Cursor Keys

An array of four keys that are used to move the display cursor either up, down, left or right. The keys auto-repeat; the cursor will continue to move as long as the key is held down or until a display field boundary is met.

11 Brightness Adjustment

An access hole for the display’s brightness adjustment potentiometer. Use a nonconductive TV adjustment tool to increase the brightness by turning the potentiometer clockwise.

IPN 074-379-P1K

2 - 2

2.2 Rear Panel Interfaces

1 2345678 9 10

111213

Interfaces for Cygnus are located on the rear panel of the instrument as depicted in Figure 2-2.

Figure 2-2 Cygnus Rear Panel

Cygnus Operating Manual

1 IEEE488 Connector (Optional)

Provides connections for IEEE-GPIB interface.

2 Digital to Analog Converter (optional)

Provides recorder output for six channels (15 pin miniature D-sub connector). Outputs are programmable for recorder function.

3 Sensor Connectors - Channels 1 & 2 (standard)

Provides connection for the units two standard sensor channels.

4 Sensor Connectors - Channels 3 & 4 (optional)

Expansion panel to accommodate the optional addition of two more sensors,

IPN 074-379-P1K

sensors 3 & 4.

5 Sensor Connectors - Channels 5 & 6 (optional)

Expansion panel to accommodate the optional addition of two more sensors, sensors 5 & 6.

6 8 Relay x 14 Input I/O Card (standard)

Provides pin connection for 8 Relays rated for 30 V(dc) or 30 V(ac) RMS or 42 V(peak) maximum, and 14 TTL Inputs.

7 8 Relay x 14 Input I/O Card (optional)

Provides pin connection for 8 relays rated for 30 V(dc) or 30 V(ac) RMS or 42 V(peak) maximum, and 14 TTL inputs.

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Cygnus Operating Manual

8 8 Relay x 14 Output I/O Card (optional)

Provides pin connection for 8 relays rated for 30 V(dc) or 30 V(ac) RMS or 42 V(peak) maximum, and 14 open collector type outputs.

9 6-Channel DAC (standard)

Provides source control voltage or recorder output for 6 channels (BNC connectors). Outputs are programmable for Source Control or Recorder function.

10 24-Volt Supply (standard)

Provides one 24 V(dc) supply rated at 1.75 Amps.

11 Fan Outlet

Exhaust opening for the unit’s miniature fan. A grill is attached for safety.

12 AC Power Inlet

Provides a common connector for various international plug sets. The unit is factory set for 100 V(ac), 120 V(ac), 230 V(ac) or 240 V(ac) service.

13 RS-232C Remote Communication Connector (standard)

2.3 Displays

Cygnus has many display screens for monitoring and programming processes. At the top of the hierarchy is the ALL CHANNELS display. The ALL CHANNELS display allows the user to simultaneously monitor process information for up to six channels. Three main types of displays, GENERAL PARMS; GENERAL MAINTENANCE and CHANNEL are accessible from the ALL CHANNELS DISPLAY: To move from one display to another, use the function keys to the right of the screen. Figure 2-4 provides an overview of the Cygnus display hierarchy.

Provides a 9-pin RS-232C communications port.

IPN 074-379-P1K

2 - 4

2.3.1 ALL CHANNELS Display

Figure 2-3 All Channels Display

Cygnus Operating Manual

NOTE: The four channel ALL CHANNELS display is shown when one or two

measurement boards are installed. If three measurement boards are installed, a six channel ALL CHANNELS display is shown.

ALL CHANNELS Display Description 1 Identifies the channel number associated with the displayed information. 2 Deposition Rate of the channel 3 Accumulated Channel thickness 4 Percent power of individual channel 5 Run time

6 General message area for Test and Lock

7 Power — normal video = level is OK, inverse video = power is at max/min level

IPN 074-379-P1K

and channel is in control.

8 Cumulative thickness for the individual THICK SUM equations defined in the

GENERAL PARAMETER display

9 Rate — normal video = good crystal, inverse video = failed crystal 10 State timer 11 State of individual channel

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Cygnus Operating Manual

ALL CHANNELS Display Function Keys

F1 GENERAL PARMS

To view the GENERAL PARAMETERS display, press function key F1.

F2 ZERO THICKNESS

To zero the accumulated thickness for the channel indicated by the cursor, press function key F2.

F3 MANUAL / AUTO

To toggle between the MANUAL and RATE control states for the channel indicated by the cursor, press function key F3. When in MANUAL, the source power is controlled by the handheld controller.

F4 CRYSTAL SWITCH

To initiate a crystal switch for the channel indicated by the cursor, press function key F4.

F5 GENERAL MAINTENANCE

To view the GENERAL MAINTENANCE display, press function key F5.

F6 CHANNEL

To go to the CHANNEL display associated with the current cursor position, press function key F6.

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Cygnus Operating Manual

GENERAL

PARMS

GENERAL

MAINTENANCE

CHANNEL

(F1)

(F2) (F6)

LOGIC

DIRECTORY

I/O

MAP

FLOPPY

DISK

COUNTERS/

TIMERS

SELECT LOGIC

STATEMENT

GENERAL

PARAMETERS

EDIT

NAME

SAVE

NAME

CANCEL

NAME

CLEAR

NAME

TOGGLE

TYPE

CHANGE

SELECT NEGATE ADD/DELETE

PARENTHESIS

DELETE

CANCEL

CHANGES

RS232

TEST

SYSTEM

STATUS

CHANGE

TIME/

DATE

CHANNEL ZERO MANUAL/

AUTO

CRYSTAL

CHANNEL

MAINT

PARMS THICKNESS

SWITCH

SWITCH TOGGLE TOGGLE

SENSOR

MANUAL

SENSOR

MAINT

CRUCIBLE SUBSTR

CLEAR

SOURCE

MAINT

QUALITY

STABILITY

ENHANCE

HARDWARE

SHUTTER SHUTTER

ALL CHANNELS

(F1) (F3)(F2)

(F4) (F5) (F6)

(F1) (F2) (F3)

(F1) (F2) (F3) (F4) (F5)

(F5)(F4)(F3)

(F1) (F2) (F3) (F4) (F5)

REPLACE INSERT

(F1) (F2)

ZERO

COUNTER

START

TIMER

CANCEL

TIMER

(F1) (F2) (F3)

TIMER

LOGIC

DIRECTORY

(F6)

PAG E

FORWARD

PAG E

BACK

EDIT

LOGIC

(F1) (F2) (F5)

PROGRAM

LOCK

SENSOR

MAINTENANCE

(F4) (F5)

CRYSTAL ROTATE TEST

XIU

CLEAR

SWITCH XTAL

QUALITY

(F1) (F2) (F3) (F4)

HEAD

STABILITY

GENERAL

MAINTENANCE

(F5)

CRYSTAL

SWITCH

(F1)

ROTATE

XTAL HEAD

(F2)

PARAMETERS

GENERAL

PAR AME TER S

(F6)

CHANNEL

(F6)

CHANNEL

(F6)

ALL

(F6)

CHANNELS

ALL

(F6)

CHANNELS

ALL

(F6)

CHANNELS

LOGIC

(F6)

DIRECTORY

WITH SAVE

SAVE LOAD DELETE

ALL

(F1) (F2) (F3) (F5)

GENERAL

PARAMETERS

(F6)

ALL

(F6)

CHANNELS

FLOPPY

FROM

FILES

FLOPPY

LOGIC

DIRECTORY

(F6)

STATEMENT

(F6)

CHANNEL

(F1) (F6)

CLEAR

FAIL ED

CRYSTALS

Figure 2-4 Cygnus Display Hierarchy

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Cygnus Operating Manual

2.3.1.1 GENERAL PARAMETERS Display

Figure 2-5 GENERAL PARMATERS Display

See Chapter 4 for a detailed description for programming the General Parameters.

GENERAL PARAMETER Display Function Keys

F1 LOGIC DIRECTORY

For a display that facilitates selection of Logic Statements for editing, press function key F1.

F2 I/O MAP

To view the I/O MAP display, press function key F2. Provides access to a display where inputs or outputs may be assigned names and where the output type may be designated as normally open or normally closed.

F3 FLOPPY DISK

To view the files currently stored on the floppy disk, press function key F3. Saves or retrieves parameters to or from floppy disk.

F6 ALL CHANNELS

To return to the ALL CHANNELS display, press function key F6.

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2 - 8

2.3.1.2 General MAINTENANCE Display

These displays provide a simple method for system maintenance and diagnostics. To access the MAINTENANCE display, press the GENERAL MAINTENANCE function key (F2) on the ALL CHANNELS display.

Figure 2-6 General MAINTENANCE Display

Cygnus Operating Manual

General MAINTENANCE Display Description

CHAN #

These numbers correspond to the measurement channel numbers on the Cygnus rear panel. The cursor keys are used to position the box cursor over the desired channel number. When either the Crystal Switch, Rotate Crystal Head, Test XIU, or Clear Quality / Stability function key is pressed, the function will be performed on the channel indicated by the box cursor. It is not allowed to cursor to channel numbers that do not have the corresponding measurement card installed. If a crystal fail has occurred for a particular channel this condition is indicated by displaying the channel number in reverse video.

SENS TYPE

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This field indicates the Sensor Type chosen for each channel number. A “1” indicates a single crystal head, a “2” indicates a CrystalTwo head, a “6” indicates a CrystalSix sensor head, a “7” indicates a Rotary sensor and a “12” indicates a Crystal12.

POSITIONS

This field is subdivided into two categories; current position (CUR), and FAILED. Information is displayed in these fields if the sensor has more than one position. For a single sensor type, the CUR and FAILED fields have no meaning. For a multi-position sensor type, the CUR field indicates the current position of the sensor head. The FAILED field indicates the sensor head positions containing failed crystals.

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Cygnus Operating Manual

Q (Crystal Quality value field)

This field displays the value currently accumulated in the Crystal Quality counter when active. The Crystal Quality counter will become active five seconds after entering DEPOSIT and if the Crystal Quality parameter is non-zero. The function of the Crystal Quality counter is described in section

3.2.1 on page 3-2.

S (Crystal Stability value field)

This field displays the value currently accumulated in the Crystal Stability counter. The function of the Crystal Stability counter is described in section

3.2.1 on page 3-2.

XTAL

This field is subdivided into two categories. The first category, LIFE displays the crystal life. The second category is a measurement of the crystal activity, ACT. For a detailed explanation of LIFE and ACT, see section 2.4 on page 2-21.

RATE

This field is subdivided into three categories. These fields are useful in identifying if a sensor’s rate measurements are becoming erratic. 0.000 will be displayed in these fields for channels not in use. All values are refreshed at the display’s one second update rate.

The first category is DISPLAY. The value displayed here is the channel’s average rate. This average is calculated based on a 1 second average.

The second field labeled FILTER is based on the average of the RAW rate (100 msec) measurements over the Rate Filter Time selected in the Channel Parms screen for that particular channel.

The third field is RAW representing the instantaneous 100 msec frequency change measurement restated in Angstrom/second units.

General MAINTENANCE Display Function Keys

F1 RS232 TEST

To initiate the RS-232C COMM PORT self test, press function key F1. Upon completion of the test, the unit will display a message indicating the test was successful and the COMM PORT is okay; or the test failed and the COMM PORT is bad.

NOTE: The RS-232C Loop Back connector, IPN 760-406-P1 must be installed

on the Cygnus RS-232C port for the self-test to work properly.

F2 SYSTEM STATUS

To access the SYSTEM STATUS display (refer to Figure 1-1 on page 1-21), press function key F2.

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F3 CHANGE TIME/DATE

To access the display to edit the time and date for the instrument, press function key F3.

F4 PROGRAM LOCK

To access a display for setting a program lock code, press function key F4.

F5 SENSOR MAINTENANCE

To access the All Channels Sensor MAINTENANCE display, see Figure 2-7, press function key F5.

F6 ALL CHANNELS

To return to the ALL CHANNELS display, press function key F6.

2.3.1.2.1 All Channels Sensor MAINTENANCE Display

This display provides a simple way to view sensor information for all the sensors as well as providing general sensor maintenance functions.

Figure 2-7 All Channels Sensor MAINTENANCE Display

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All Channels Sensor Maintenance Display Function Keys

F1 CRYSTAL SWITCH

To initiate a crystal switch for the sensor indicated by the cursor position, press function key F1.

F2 ROTATE XTAL HEAD

If the sensor number indicated by the cursor position is a CrystalSix, Crystal12, or Rotary sensor, pressing F2 will sequentially rotate the sensor head through all positions. This is useful to initialize a CrystalSix, Crystal12, or Rotary sensor after replacing failed crystals.

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F3 TEST XIU

To initiate the XIU Self Test, press function key F3. The XIU Self Test determines whether the Crystal Interface Unit (XIU) and Measurement Card pair is operating properly.

NOTE: For the XIU Self Test to work properly, the XIU must have the

F4 CLEAR QUALITY / STABILITY

To clear the Quality and Stability counters, press function key F4.

F5 GENERAL MAINTENANCE

To access the General MAINTENANCE display, press function key F5.

F6 ALL CHANNELS

To access the ALL CHANNELS display, press function key F6.

2.3.1.3 CHANNEL Display

6" (152.4 mm) BNC cable (IPN 755-257-G6) attached and must be disconnected from the sensor feedthrough.

The CHANNEL display (shown in Figure 2-8) provides information about the specified channel. The rate, thickness, power level, state, state time, and run time are all updated once a second. Near the bottom of the display is a graph that provides an analog display of the rate deviation from the desired rate, while the channel is in a Rate Control state. Alternatively, the graph can display the percent power being output during a process. The SCALE and SCAN RATE parameters control the meaning, scaling and speed of the graph.

On the top right of the display is a general message area. This area displays information that is not channel specific, such as indicating that the instrument is in TEST mode The region adjacent to the graph displays channel specific status information,. For a complete list of error and status messages, see Chapter 8.

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Figure 2-8 CHANNEL Display

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CHANNEL Display Description

1 Identifies the channel number associated with the displayed information.

2 Accumulated Channel thickness

3 General instrument information message area

4 Function key definitions

5 Date and Time

6 Status area

Displays channel specific status information

7 Run time

This timer represents the elapsed time since the last READY state.

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8 Crystal life and activity values (see section 2.4 on page 2-21)

9 Scan rate 0 / 1 / 2 / 3

This parameter determines the horizontal axis for the channel graphic display. Permissible values are 0, 1, 2 and 3. A 0 places the scan rate into the Auto mode. A 3 sets the scale to three measurements per horizontal pixel, a 2 sets the scale to 10 measurements per horizontal pixel, while a 1 sets the scale to 40 measurements per horizontal pixel. The default value is zero. When the plot reaches the right edge it will wrap and erase the plot from the left edge. Auto mode starts plotting at 3, then compresses and plots at 2, then compresses and plots at 1’s rate.

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10 Channel sensor information

This region of the Channel identifies the sensor type currently defined in the Channel hardware configuration (see section 2.3.1.3.1.1 on page 2-17). If a value of 2, 6, 7 or 12 is selected for the sensor type, the current crystal position as well as the quantity of good crystals remaining is displayed.

11 Scale 0 / 1 / 2

Establishes the vertical scale for the channel graphics display. Permissible values are 0, 1 and 2. A 0 sets the vertical scale to % Power, 1 sets the vertical scale to ±10 Å/sec, while a 2 sets the vertical scale to ±20 Å/sec. The default value is 1.

12 Graphical display of rate deviation or power

13 State of channel

14 Rate of the channel

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CHANNEL Display Function Keys

F1 CHANNEL PARMS

To access the PROCESS (see Figure 2-9) and HARDWARE (see Figure 2-10) related channel parameters, press function key F1.

F2 ZERO THICKNESS

To resets the channel thickness and zero the channel’s contribution to the thickness sum equations, press function key F2.

F3 MANUAL

To put the channel in manual control, (so that the power level is controlled by the hand-held controller), press function key F3. When in manual, the F3 panel reads AUTO, and pressing it will remove the channel from the manual state and place it into a rate control state. See State Descriptions (see section 2.6 on

page 2-23) for a more complete description of manual operation.

F4 CRYSTAL SWITCH

To initiate a crystal switch, press function key F4.

F5 CHANNEL MAINTENANCE

To move to the Channel Sensor and Source Maintenance displays, press function key F5.

F6 ALL CHANNELS

To return to the ALL CHANNELS display, press function key F6.

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2.3.1.3.1 Channel Parameters Display

The Channel Parameters Display contains CHANNEL specific material and process related parameters. This display is accessed by selecting the CHANNEL PARMS function key (F1) from the CHANNEL display. See Chapter 3 for a detailed description for programming of these parameters.

Figure 2-9 Channel Parameters Display

PROCESS Display Function Keys

F1 HARDWARE PARMS

To access the Channel HARDWARE parameters (see Figure 2-10), press function key F1.

F6 CHANNEL

To return to the CHANNEL display, press function key F6.

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2.3.1.3.1.1 HARDWARE PROCESS Display

The Channel HARDWARE display contains channel specific hardware related parameters. This display is accessed by selecting the HARDWARE PARMS function key (F1) from the PROCESS display. See section 3.3 on page 3-12 for a detailed description for programming of these parameters.

Figure 2-10 HARDWARE Display

Cygnus Operating Manual

HARDWARE Display Function Keys

F1 PROCESS PARMS

To access the PROCESS (see Figure 2-9) related channel information, press function key F1.

F6 CHANNEL

To return to the CHANNEL display, press function key F6.

2.3.1.3.2 Channel SENSOR MAINTENANCE Display

Figure 2-11 SENSOR MAINTENANCE Display

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SENSOR MAINTENANCE Display Description (refer to Figure 2-11)

Sensor Type

Indicates the Sensor Type as defined on the Channel Hardware display (refer to Figure 2-10).

XTAL Readings

The values of percent life and activity for the channel sensor crystal

Crystal Status

Depending upon the type of sensor used, this field may be empty (Single), may identify the current crystal position in addition to the quantity of good crystals (CrystalTwo); may identify the current crystal position and the position number(s) of the failed crystal (CrystalSix, Crystal12) or the quantity of good crystals (Rotary).

Q Count (Crystal Quality value field)

This field displays the value currently accumulated in the Crystal Quality counter when active. DLY indicates the Crystal Quality counter is not active. The Crystal Quality counter will become active five seconds after entering DEPOSIT and if the Crystal Quality parameter value is non-zero.

S Count (Crystal Stability value field)

This field displays the value currently accumulated in the Crystal Stability counter.

Z-Ratio

Type Material or Auto-Z, value in use.

Frequency

Crystal Fund — normal video = good crystal, inverse video = bad crystal

Anharmonic

Crystal Anharmonic — normal video = good crystal, inverse video = unable to Auto-Z.

Rate, Power, and Thickness display area

The lower portion of this display shows the Rate, %Power, and Thickness for the channel.

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SENSOR MAINTENANCE Display Function Keys

F1 CRYSTAL SWITCH

To initiate a crystal switch, press function key F1.

F2 ROTATE XTAL HEAD

If the channel sensor type is a CrystalSix, Crystal12, or Rotary, press function key F2 to sequentially rotate the sensor head through all positions. This is useful to initialize a CrystalSix, Crystal12 or Rotary sensor after replacing failed crystals, or changing Sensor Type parameter.

F3 CLEAR FAILED CRYSTALS

If the channel sensor type is a CrystalTwo, CrystalSix or Crystal12, press function key F3 to clear all non current failed crystal position numbers (CrystalSix, Crystal12) or to increment the number of good crystals (CrystalTwo), if applicable.

F4 CLEAR QUALITY / STABILITY

To clear the Quality and Stability counters, press function key F4.

F5 SOURCE MAINTENANCE

To access the channel source maintenance display press function key F5.

F6 CHANNEL

To return to the Operate display, press function key F6.

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2.3.1.3.2.1 Channel SOURCE MAINTENANCE Display

Figure 2-12 Channel SOURCE MAINTENANCE Display

Channel SOURCE MAINTENANCE Display Function Keys

F1 SWITCH CRUCIBLE

To switch the source turret to the crucible position designated by the crucible parameter, press function key F1. When power is at 0.00% only.

F2 TOGGLE SUBSTRATE SHUTTER

To activate the relay for the substrate shutter, press function key F2. A second pressing of this key deactivates the substrate shutter relay.

F3 TOGGLE SENSOR SHUTTERS

To activate the sensor shutter relay, press function key F3. Pressing this key a second time deactivates the sensor shutter relays.

F4 START MANUAL POWER

To enable the hand-held controller to effect power changes to the source output associated with the channel, press function key F4.

F5 SENSOR MAINTENANCE

To access the channel sensor maintenance display press function key F5.

F6 CHANNEL

To return to the Channel display, press function key F6.

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2.4 Crystal Life, Starting Frequency and Activity

On the CHANNEL display, crystal life is shown as a percentage of the monitor crystal’s frequency shift, relative to the 1.50 MHz frequency shift allowed by the instrument. This quantity is useful as an indicator of when to change the monitor crystal to safeguard against crystal failures during deposition. It is normal to change a crystal after a specific amount of crystal life (% change) is consumed. It is not always possible to use a monitor crystal to 100% of crystal life. Useful crystal life is highly dependent on the type of material being deposited and the resulting influence of this material on the quartz monitor crystal. For well-behaved materials, such as copper, at about 100% crystal life the inherent quality, Q, of the monitor crystal degrades to a point where it is difficult to maintain a sharp resonance and therefore the ability to measure the monitor crystal’s frequency deteriorates.

When depositing dielectric or optical materials, the life of a gold, aluminum or silver quartz monitor crystal is much shorter — as much as 10 to 20%. This is due to thermal and intrinsic stresses at the quartz-dielectric film interface, which are usually exacerbated by the poor mechanical strength of the film. For these materials, the inherent quality of the quartz has very little to do with the monitor crystal’s failure.

It is normal for a brand new quartz monitor crystal to display a crystal life anywhere from 0 to 5% due to process variations in producing the crystal. Naturally, this invites the question, “Is a brand new crystal indicating 5% life spent inferior to a crystal indicating 1% life spent?”

If a new crystal indicates 5% life spent, it means that either the quartz blank is slightly thicker than normal (more mechanical robustness), or the gold electrode is slightly thicker than normal (better thermal and electrical properties), or both. In either case, its useful life with regard to material deposition should not be adversely affected. To verify this assertion, laboratory testing was performed on crystals that covered the crystal life range in question. Results indicate that a brand new crystal that indicates 3 to 5% life spent is just as good as, if not better than, a crystal indicating 0 to 2% life spent. As a consequence, it is important to consider the

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change in crystal life (%), not just the absolute crystal life (%) indicated.

The activity value is useful for predicting when a crystal needs to be replaced. If a crystal is about to fail, its series resistance will increase, allowing less current to flow through the crystal and hence the activity value will decrease. The closer the activity value is to zero the more imminent a crystal failure.

It also can be used to gauge the health of the sensor head electrical contacts. Activity values range from a maximum of 650 (healthiest) to a minimum of 0 (least healthy). For example, if a new monitor crystal is placed into the sensor head and has a crystal life of near 0%, but the activity value for this crystal is lower than 400, the sensor head or in-vacuum cable is in need of repair.

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2.5 Defining a Process

The following procedure is used to define a process. (All steps do not necessarily have to be followed in the given order.)

1 Make sure the instrument is in READY.

Some configuration and process parameters can be changed only while the channel is in READY. Therefore, before setting parameters, make sure READY appears as the state on the CHANNEL display. If it does not, press STOP then RESET.

2 Configure the sensor.

Configuring the sensor involves designating whether the sensor is a single, CrystalTwo, CrystalSix, Crystal12 or Rotary sensor, and what output relays are connected to the sensor shutter and crystal switcher, if any. These parameters are on the Channel HARDWARE display.

3 Configure the sources.

Configuring the sources involves selecting, the output voltage range and polarity, and selecting the output relay for the substrate shutter. Also, if a source has more than one crucible, this is set up in the source configuration. The source parameters are programmed on the HARDWARE display.

2.5.1 Executing a Process

Once a process has been defined, it is ready to execute.

NOTE: Certain parameters cannot be changed while executing a process. The

Cygnus will not allow these parameters to be changed.

 A Process is not being executed when the instrument is in the READY or STOP

state.

 STOP freezes a process, the status information on the display is maintained

and the control voltage output is set to zero.

 START, pressed once, will continue the process from the point at which it was

stopped.

 RESET takes a stopped process back to the beginning of the process.

HINT: It may be desirable to execute a new process in TEST before doing an

actual deposition to check correct shutter operation, sequencing and limits.

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2.6 State Descriptions

Table 2-1 State Descriptions

STATE CONDITION RELAY CONTACT

Cygnus Operating Manual

STATUS

Substrate Shutter

Sensor Shutter

NOTE: The following are Pre-Deposit states.

READY Cygnus will accept a START command

Inactive Inactive

Thickness is not incremented

CRUCIBLE SWITCH Instrument advances to next state when

Inactive Inactive “turret” input is low, or “turret” delay has elapsed. If IDLE PWR of the channel using this source is not equal to zero, power is set to zero before the crucible position changes.

RISE TIME 1

SOAK TIME 1

Source is rising to Soak Power 1 level. Inactive Inactive

Source is being maintained at Soak Power

Inactive Inactive 1 level.

Rise Time 1 and Soak Time 1 will be skipped and the channel will start with the Rise Time 2 state if Idle Power is set to a non-zero value and the channel is currently at Idle at this non-zero Idle Power.

RISE TIME 2 Source is rising to Soak Power 2 level. Inactive Inactive

SOAK TIME 2 Source is being maintained at Soak Power

Inactive Inactive

2 level.

If a channel is linked to another due to crosstalk correction, that channel’s Sensor Shutter will become active during Soak Time 2 if the linked channel is in Deposit.

NOTE: The following are Deposit states.

DEPOSIT Thickness is zeroed on entry. Rate

Active Active

control, substrate shutter relay active.

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NONDEP CONTROL Rate control, substrate relay contact

Inactive Active

inactive. Thickness is not incremented

RateWatcher in Delay and Sample will have the sensor shutter active. RateWatcher in Hold will have the sensor shutter inactive.

NONDEP HOLD Power held constant due to a crystal

Inactive Inactive

failure.

MANUAL Source power controlled by hand-held

Active Active

controller.

TIME-POWER Crystal failed; source maintained at

average control power prior to crystal

Active or Inactive

Active

failure.

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Table 2-1 State Descriptions (continued)

STATE CONDITION RELAY CONTACT

STATUS

NOTE: The following are Post-Deposit states.

IDLE RAMP Source changing to Idle Power. Inactive Inactive

STOP Source output set to zero power. The

NOTE: The following is a Non-Deposit state.

MANUAL Source power controlled by hand-held

2.7 Special Features

Cygnus has several special features to enhance the performance of the instrument.

2.7.1 Crystal Switching

Substrate Shutter

Inactive Inactive display is frozen at the last rate and thickness values.

NOTE: In the STOP state the instrument will accept a START provided a Crystal Failure for the sensors used in the channel being started is not present.

Inactive Active controller.

Sensor Shutter

Cygnus offers a choice of Single, CrystalTwo, CrystalSix, Crystal12 or Rotary sensors. The CrystalTwo, CrystalSix, Crystal12, and Rotary sensors provide a backup monitor crystal in case a crystal fails during deposition. Sensor types are specified on the Channel Hardware Display.

A crystal switch will automatically occur when:

 The instrument is configured for a CrystalTwo sensor type, a channel is

STARTed or running and there is another good crystal available when the active crystal fails.

 The instrument is configured for a CrystalSix or Crystal12, a channel is

STARTed or running, and there is at least one good crystal left in the carousel when the active crystal fails.

 The instrument is configured for a Rotary sensor, the channel is running, and

there is at least one good crystal in the Rotary sensor. 

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A crystal switch will NOT automatically occur:

 During a state of STOP or READY.

 During deposition, if the secondary crystal of a CrystalTwo sensor fails, or the

last good crystal of a Rotary, CrystalSix, or Crystal12 fails. (In either case a TIME-POWER, IDLE-RAMP or STOP will occur, depending on the crystal fail option chosen.)

A crystal switch can be manually executed via the front panel, hand-held controller, remote communications, or logic statements when the system is configured for CrystalTwo, CrystalSix, Crystal12 or Rotary sensors.

NOTE: When crystal switching with the hand-held controller, Cygnus must be on

a screen with a channel selected.

2.7.2 Rotary Sensor Crystal Switching

Selecting type 7, Rotary, as the sensor type enables sequential crystal switching only. Upon a crystal switch the Crystal Switch Output will first close for one second and then open (i.e., one pulse to move one position). Cygnus will not keep track of which position the Rotary Sensor is on nor will it keep track of which crystals are good and which are failed. After the one second pulse, Cygnus measurement system software will attempt to find the resonant frequency for the crystal in this position. If the Cygnus does not find a good resonant frequency for this crystal it will again pulse the Crystal Switch Output for one second and attempt to find a resonant frequency at this position. There will be a maximum of five attempts to find a good resonant frequency (i.e., a maximum of five pulses of the Crystal Switch Output). If a good resonant frequency is not found after five attempts, the Cygnus will then enter the Time Power, Idle-Ramp or STOP state depending on the Crystal Fail Option value chosen in the Channel Process Display.

Cygnus Operating Manual

There is to be a maximum of five attempts to find a good resonant frequency. However, if the Cygnus detects a crystal fail and automatically initiates a crystal switch it will recognize there has been an automatic crystal switch. The Cygnus will

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keep track of the number of times an automatic crystal switch has been done. Therefore if there have been five automatic crystal switches and then the sixth crystal fails, Cygnus will go directly to either Time Power, Idle-Ramp, or STOP as appropriate without any additional pulses.

After a ’Start’ command, all crystals are assumed to be good.

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2.7.3 Source/Crucible Selection

Cygnus can control a source with up to 64 crucibles, through up to six binary encoded relays. This is configured by setting the Number Of Crucibles, Crucible Outputs, Turret Feedback, Turret Input, and Turret Delay parameters on the Channel Hardware display.

To define which crucible to use for the channel, set the “crucible” parameter on the CHANNEL PROCESS display. If the current crucible position is different from the one requested upon STARTing, the system’s turret controller would move into position. This will be signified on the Channel display by the state indicator CRUCIBLE SWITCH. Sequencing will continue on to RISE 1 after either the turret delay time expires or an input indicates the turret is in position, depending on which option is chosen. The specific method used is determined by the parameter Turret Feedback on the Channel Hardware display.

NOTE: If the source has been idling at a nonzero power when the START is

initiated, the power will be dropped to zero before the crucible is changed.

2.7.3.1 Example: Programming Turret Source Crucible Selection

Interfacing a turret source controller to the Cygnus requires both hardware connections to the turret controller and properly defining certain instrument parameters.

Proceed to the Channel Hardware display for the source that is going to be defined as the turret source.

1 Designate the Number of Crucibles; for example, 4.

2 Select the Crucible Output. This defines the number of the first relay that

encodes the crucible number selected by the active channel. Relays are defined sequentially with the first relay containing the least significant bit (LSB). The greater the number of crucibles selected, the greater the number of relays required. The number required is based on binary encoding (actual coding is binary -1, with 00 representing position 1 and 11 representing position 4). Any unused sequence of relays may be used if it is long enough to provide sufficient selections.

3 Select the Crucible Output Type as normally open (NO), or normally closed

(NC).

Example:

Number of crucibles = 4 Crucible output = 6 Crucible output type = NO

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For this example, wiring to the controller is based on Table 2-2. Only relays 6 and 7 are needed to encode the four possible positions

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Table 2-2 Wiring To The Controller

Crucible Position Contact Status

Relay #6 Relay #7

1 Open Open

2 Closed Open

3OpenClosed

4 Closed Closed

NOTE: If the crucible output type were normally closed (NC), Table 2-2 would

need to be modified by exchanging open and closed.

4 Determine whether Turret Feedback is desired. This allows the turret position

controller to stop further instrument processing until the requested turret position is satisfied. If chosen, a turret input must be connected to the turret position controller’s feedback signal within one minute, else a STOP Crucible ERR occurs.

If Turret Feedback is not chosen, program a Turret Delay Time, which allows an adequate time for positioning to take place. Once the delay time has expired, instrument state processing continues.

5 The selection of a particular crucible for a channel is defined in the CHANNEL

PROCESS display.

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2.7.4 Hand-Held Controller

A Hand-Held Controller, see Figure 2-13, is provided as an accessory with the Cygnus. The Controller serves as a wired remote to manually control power, switch crystals and produce a STOP.

The Controller is attached to the instrument with a modular plug to the front panel. Power is affected (only when in Manual mode) by moving the POWER/STOP switch laterally. A STOP is produced by moving the POWER/STOP switch down (only when in Manual mode). An All STOP is performed when the STOP function is pressed twice within one second, or is continuously pressed. When in a READY or STOP state and the instrument is on the SENSOR Maintenance display, a crystal switch is activated by pressing the red button on the body of the controller. The ship kit includes a convenience hook for the Controller that can be attached to the instrument’s mounting ears or some other accessible location.

Figure 2-13 Hand-Held Controller

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2.7.5 Test Mode

CAUTION

Rate Display

Density (gm/cc)

--------------------------------------

Tooling %

100

-------------------------

Å/sec=

This instrument contains a software-controlled test mode which simulates actual operation. Optionally, time can be compressed so that a long process can be simulated in one tenth of the time. The purpose of the test mode is to verify basic operation and to demonstrate typical operation. The rate display during test mode operation is:

Crystal fails are ignored in test mode. Crystal switching is disabled. All other relays and inputs operate normally.

2.7.6 Floppy Disk (Optional)

The floppy disk drive is an optional accessory for the Cygnus. This option allows storage of all parameter information to the 3.5 inch 1.44 MByte floppy diskette. The maximum number of files that may be stored onto the floppy disk is 224 for a 1.44 MByte diskette and 112 files when using a 720 KByte diskette

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The parameter set may be stored under a new or existing filename and retrieved from an existing file. A file containing the Cygnus parameter set is referred to as a configuration file.

Multiple files may be contained on one diskette. Filenames may be eight characters long. All files must be contained on the root directory. Storage/retrieval from sub-directories is not allowed.

The instrument supports the writing of filenames using alphanumeric characters selected using the cursor keys. Characters A through Z and numbers 0 through 9 inclusive are available. The instrument has the ability to display the files contained on the diskette. A scrolling feature is enabled to view those filenames that cannot fit on the screen. Error messages include: Disk Full; File Not Found; Disk Write Protected; Media Error; Disk not Found; File is Read Only.

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Do not bend the diskette.

Keep the diskette dry and do not expose the diskette to temperature extremes.

Do not remove the diskette from the instrument while a save or retrieve operation is taking place.

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2.7.7 Lock Codes

A Program Lock Code can be entered to prevent unauthorized changing of parameters. This Lock Code can be entered through the front panel using the PROGRAM LOCK display. An additional Lock Code can be entered through remote communications to prevent parameter entry from the front panel while communicating to Cygnus using remote communications. The word “LOCK” in inverse video will be displayed in the upper right corner of the display.

HINT: To clear the lock, hold down the clear key on power up. HOWEVER, if no

2.7.8 Datalog

Datalog automatically saves to diskette every time a source shutter closure occurs. When the Datalog data is saved to a diskette, the information will be saved under a filename.

Datalog files saved to diskette will be automatically named using the date and Channel number. The format of the filename is YYMMDDC#.IDL where YY is 00 to 89 for the last two digits of the year 20YY, MM is 01 to 12 for the month, DD is 1 to 31 for the day and # is the Channel number 1 to 6. If the diskette already contains a file with the same filename as the new datalog information, the new datalog information will be appended to the old file.

lock code is present, all parameters will be cleared by doing this.

At each source shutter close, the datalog information will be appended to the file (when saved to diskette) until the end of the Process.

The Datalog data set is defined as follows:

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DATE: MM-DD-YYYY TIME: XX:XX

CHANNEL #: #

RUN TIME: XX:XX

DEPOSITION TIME: XX:XX

THICKNESS: ###.### kÅ

AVE. AGG. RATE: ###.### Å/s

AVE. RATE DEV: ##.### Å/s

ENDING POWER: ##.## %

AVE. POWER: ##.## % COMPLETION: POST-DEPOSIT NORMAL

(time-power, ave. value, crystal fail, remote, keyboard,

max. power, hand-held controller) Crystal Use History (example) SENSOR 1

BEG. END BEG. END BEG. END

XTAL FREQ. FREQ. LIFE LIFE ACT. ACT. STAB. QUAL.

1 5975323 5876991 0% 2% 245 240 30 22 2 5978368 5879012 0% 2% 225 189 1200 99 3 5768733 5677987 3% 5% 176 168 0 0 4 5346278 5129870 48% 51% 150 105 0 0 5 4876789 4567899 78% 81% 101 101 25 1 6 4678843 4500000 98% 100% 100 92 0 0

SENSOR 2

BEG. END BEG. END BEG. END

XTAL FREQ. FREQ. LIFE LIFE ACT. ACT. STAB. QUAL.

2 5978368 5879012 0% 2% 225 189 1200 99 3 5768733 5677987 3% 5% 176 168 0 0 5 4876789 4567899 78% 81% 101 101 25 1

SENSOR 8

BEG. END BEG. END BEG. END

XTAL FREQ. FREQ. LIFE LIFE ACT. ACT. STAB. QUAL.

1 5975323 5876991 0% 2% 245 240 30 22

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If two Channels are co-deposited, the first Channel to have a source shutter close will be data-logged first.

The ability to turn ON/OFF datalogging and where to output the datalog data set is determined by a programmable parameter located in the General Parameters display. The CRYSTAL USE HISTORY data is an optional subset of the datalog string. A second parameter located in the General Parameters display is used to determine if the CRYSTAL USE HISTORY is to be output. Additionally, the datalog string format is selectable between a page format and a comma delimited format. The comma delimited format is actually comma-and-quote delimited intended for file importation into a spreadsheet program. When a spreadsheet program imports a file having the comma delimited format data groups that are strictly numbers become value entries, data groups surrounded by quotes are stored as labels. For the page format, only those sensors which are used in a particular Material for a particular Layer will be datalogged. For the comma delimited format, all the data fields are returned for all the sensors and crystals. If a sensor is not used during the deposition, the data field will contain a zero.

Outputting the Datalog Data Set to multiple outputs at the same time (for example, Save to diskette and Output to Remote Comm at the same time) is not allowed.

2.7.9 Auto Soak 2

When Auto Soak 2 is enabled, the Soak 2 power parameter will automatically be updated at the end of deposit or nondeposit control. The value will be the power at the end of control. This allows the next Soak 2 on the channel to be done at the last power used to maintain control.

To enable Auto Soak 2, the parameter Dep After PreDep is set to 2.

NOTE: The Soak 2 power parameter retains the new value even if Auto Soak 2 is

subsequently disabled.

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3.1 Introduction

ALL CHANNELS DATA DISPLAY

CHANNEL (Channel Graphical Display)

CHANNEL PARAMETERS

HARDWARE PARAMETERS

Cygnus can store the definition parameters for 6 Channels (or sources). There are three primary displays associated with each Channel. These are the Channel Parameters display, the Channel Hardware parameters display, and a graphical data display. Each Channel is completely defined by programming Channel Parameters and Channel Hardware parameters. Channel Parameters define the material to be deposited and the deposition profile, for example: Density, Z-Ratio, Rise Times and Soak Times. Channel Hardware parameters define the digital-to-analog (DAC) functions, sensor type, as well as the shutter and crucible outputs.

Figure 3-1 Display Tree for Channel Set Up

Cygnus Operating Manual

Chapter 3

Channel Parameters

Channel set up is initiated by selecting the Channel (F6) key in the All Channels data display. Selecting F6 brings up the Channel Graphical Display for the Channel number indicated by the cursor.

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3.2 Channel Parameters

Channel definition is done by pressing the F1 function key on the CHANNEL display. Selecting F1 brings up the Channel Parameters display as shown in Figure 3-2.

Figure 3-2 Channel Parameters Display

Channel Parameters Display Function Keys

F1 HARDWARE PARMS

To access the Channel Hardware Parameters Display, select function key F1

F6 CHANNEL

To return to the Channel Graphical display, select function key F6.

3.2.1 Channel Parameter Definitions

DENSITY . . . . . . . . . . . . . . . . . . . . . 0.100 to 99.99 gm/cc (default = 1.000)

This parameter is specific to the material being deposited onto the Crystal. It is one of two parameters that relate the mass loading on the crystal to a thickness.

Z-Ratio. . . . . . . . . . . . . . . . . . . . . . . 0.100 to 15.000 (default = 1.000)

This parameter is specific to the material being deposited. It is one of two parameters that relate the mass loading on the crystal to a thickness. This parameter is superseded if Auto Z-Ratio is selected.

TOOLING . . . . . . . . . . . . . . . . . . . . . 1.0 to 999.9% (default = 100.0)

This is a correction factor used for correlating the thickness accumulation on the crystal with the thickness accumulation on the substrate. This thickness difference is due to the geometric distribution of material flux from the source.

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TOOLING TFiTmTx=

The tooling factor is calculated using the equation:

[1]

where TF T

= Thickness on the Crystal.

= Initial Tooling Factor, Tm = Actual Thickness at the Substrate, and

If the TOOLING parameter is changed, the new TOOLING value is used for subsequent calculation of the rate and thickness. Also, the thickness accumulated thus far will be re-scaled based on the change to the TOOLING.

SECONDARY TOOLING . . . . . . . . . 1.0 to 999.9% (default = 100.0)

This is a second tooling factor for use with the CrystalTwo Switch. It allows a second tooling factor for the second crystal of the CrystalTwo Switch to accommodate the thickness difference between the two different crystal positions. The function is the same as the Tooling factor and is calculated in the same manner.

CONTROL LOOP . . . . . . . . . . . . . . 0, 1, 2 (default = 2)

This parameter establishes the control loop algorithms pertaining to either a slow responding source or a fast responding source. Permissible values are 0, 1, or 2. Select a 0 to choose the non-PID control loop, good for fast- and medium-speed responding systems with high noise levels (e.g., an electron beam gun with or without a liner, having a large sweep amplitude of low frequency, 10 Hz or less). Select a 1 for the PI control loop, good for fast, medium, or slow systems with medium noise levels (e.g., an electron beam gun with medium sweep amplitude frequency, 20 to 100 Hz; also, sputtering and resistive sources). Select a 2 for the PID Control Loop, good for medium or slow systems with low noise levels (e.g., an electron beam gun with sweep off or at a high frequency, 100+ Hz; also, sputtering and resistive sources).

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PROCESS GAIN . . . . . . . . . . . . . . . 0.01 to 999.99 Å/sec/% pwr (default = 10.00)

This parameter determines the change in % Power for a given rate deviation (dRate/dPower). The larger the process gain value, the smaller the change in power for a given rate error.

PRIMARY TIME CONSTANT. . . . . . 0.010 to 9999.99 sec (default = 1.00)

This is the evaporation source’s time constant. This value is defined as the time difference between the actual start of a change in rate and the time at which 63% of the rate step is achieved. This value may be measured according to the above criterion or it may be determined empirically. This parameter is disabled if the CONTROL LOOP option parameter is set to 0.

SYSTEM DEAD TIME . . . . . . . . . . . 0.010 to 9999.99 sec (default = 1.00)

This value is defined as the time difference between a change in % power and the start of an actual change in rate. This parameter is disabled if the CONTROL LOOP option parameter is set to 0.

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MAXIMUM POWER . . . . . . . . . . . . . 0.0 to 99.99% (default = 90.00)

This parameter is used to set the maximum permissible % power level. The control voltage output will not exceed this limit.

MINIMUM POWER . . . . . . . . . . . . . 0.0 to 99.98% (default = 0.00)

This parameter is used to set the minimum permissible % power level. The control voltage output will not go below this limit during either the Deposit or Non-Deposit Rate control states.

Power Ramps (Pre deposit states)

The next six parameters — Soak Power 1, Rise Time 1, Soak Time 1, and Soak Power 2, Rise Time 2 and Soak Time 2 — are used to define two power ramps provided to precondition materials.

SOAK POWER 1 . . . . . . . . . . . . . . . 0.0 to 99.99% (default = 0.00)

This parameter is usually set to the power level at which the source material just begins to melt. The instrument ramps the power level from zero to Soak Power 1 linearly over the time period Rise Time 1.

RISE TIME 1 . . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:sec (default = 00:00)

This parameter provides the time period over which the source power is ramped from 0 to Soak Power 1. See note.

SOAK TIME 1 . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:sec (default = 00:00)

This parameter provides the time period for which the instrument holds at Soak Power 1. See note.

NOTE: Rise Time 1 and Soak Time 1 will be skipped and the channel will start with

the Rise Time 2 state if Idle Power is set to a non-zero value and the channel is currently at Idle at this non-zero Idle Power.

SOAK POWER 2 . . . . . . . . . . . . . . . 0.00 to 99.99% (default = 0.00)

This parameter sets the power level at which the rate from the source very nearly matches the desired deposition Rate. If Auto Soak 2 is enabled, this parameter will automatically be updated when leaving deposit or nondeposit control.

RISE TIME 2 . . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:sec (default = 00:00)

This parameter sets the time period in which the instrument linearly ramps the power level from Soak Power 1 to Soak Power 2.

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SOAK TIME 2 . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:sec (default = 00:00)

This parameter sets the time period for which the instrument holds the power level at Soak Power 2.

Cygnus Operating Manual

DEP AFTER PREDEP . . . . . . . . . . . 0, 1, 2 (default = 1)

This parameter is used to determine which rate control state to enter after Soak Time 2. It will also determine whether Auto Soak 2 is enabled.

0 = NonDeposit Control after Soak 2. No Auto Soak 2.

1 = Enter Deposit Control after Soak 2. No Auto Soak 2.

2 = Enter Deposit Control after Soak 2. Enable Auto Soak 2.

RATE . . . . . . . . . . . . . . . . . . . . . . . . 0.000 to 999.9 Å/sec (default = 0.000)

NOTE: Rate = 0.000 will take a channel in control to post deposit.

This specifies the rate at which the deposition is to be controlled during the DEPOSIT and NON-DEPOSIT CONTROL states. The Rate is calculated based on:

 The rate information acquired by the sensor in use, based on the density

and tooling values entered for this Channel.

 The tooling factor that corrects for any relative difference in flux distribution

reaching the sensor.

FINAL THICKNESS . . . . . . . . . . . . . 0.000 to 999.9 kÅ (default = 0.000)

This is the thickness setting that triggers the end of the DEPOSIT state. The Substrate Shutter output returns to its normal state. The deposition profile then proceeds to the State indicated by the ON FINAL THICK parameter value, or by a user supplied input via the I/O or one of the Remote Communications ports.

ON FINAL THICKNESS. . . . . . . . . . 0, 1, 2 (default = 1)

The On Final Thickness parameter value determines the next step of the deposition profile.

0 = NonDeposit Control. Entering a value of 0 directs the deposition profile to enter the NonDeposit Control state, returning the substrate shutter output to its

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normal state, when the final thickness value is reached during the Deposit state.

1 = Idle Ramp. Entering a value of 1 directs the deposition profile to enter the Idle Ramp state when the final thickness value is reached during the Deposit state.

2 = Continue. Entering a value of 2 directs the deposition profile to continue in the Deposit state. Thickness continues to be accumulated.

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AVERAGING TIME . . . . . . . . . . . . . 0 to 30 min (default = 0)

This parameter value determines the amount of time used in calculating the average rate and average power for use in Time Power.

The Averaging Time parameter is the time interval used to calculate both the average rate and average power applied, if a crystal fails, for Time-Power and Non-Deposit Hold states. When the Averaging TIme parameter value is 0, then a 2.5 second average, ignoring the most recent 0.5 second, is the averaging interval.

A channel warning ABBREVIATED AVERAGE is generated if the averaging interval has not been reached, but there was at least a "complete whole minute" of data to average.

A channel error NO TIME POWER AVG is generated if a crystal fail occurred within the first minute of control with Averaging TIme set >0. This error also occurs if there is a crystal fail during the first 2.5 seconds of control with the Averaging TIme =0. (There are also SC and RC commands to get and set the average rate and average power values.)

Idle Ramp State

The next two parameters define an idle ramp provided to maintain the control voltage power level after the Deposit or NonDeposit Control state. Control voltage is ramped from the power level at the end of the Deposit (or NonDeposit Control) state to the Idle Power level. The control voltage is maintained at the Idle Power level until the instrument enters the STOP state or until the Channel is started again. If the Idle Power is non-zero, the started channel will skip Rise 1 and Soak 1, and will begin at Rise 2.

IDLE POWER . . . . . . . . . . . . . . . . . 0.0 to 99.99% (default = 0.00%)

This is one of two parameters used to affect an Idle Power Ramp. This value is the power level at which the source is maintained after the DEPOSIT (or NonDeposit Control) state. Idle Power is usually the same as Soak Power 1.

IDLE RAMP TIME . . . . . . . . . . . . . . 00:00 to 99:59 min:sec (default = 00:00)

This is the time interval over which the source power is ramped linearly from the power level at the end of Deposit (or NonDeposit Control) to Idle Power.

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CRUCIBLE. . . . . . . . . . . . . . . . . . . . 1 to the maximum number of crucibles

programmed. (default = 1)

This parameter identifies which crucible of a multiple pocket source to use when the channel is started.

CRYSTAL QUALITY . . . . . . . . . . . . 0 to 9 (default = 0)

This parameter is used to ensure tight rate control by monitoring the information obtained from the crystal. It can be used to effect a crystal fail when operating in the single frequency mode. The “single frequency” mode is when the Z-Ratio type is set for Material Z, “dual frequency” mode is when the Z-Ratio type is set for Auto Z. See Table 3-1.

Table 3-1 Crystal Quality Number and Threshold of Rate Deviation

Crystal Quality

Number

92.5%

85.0%

77.5%

6 10.0%

5 12.5%

4 15.0%

3 20.0%

2 25.0%

1 30.0%

0 Disabled

Threshold of

Rate Deviation

For each rate reading, the percent relative deviation from the sensor’s rolling average rate is calculated. Each time this deviation is greater than the allowed

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percent relative deviation, as determined by the Crystal Quality value, a counter is incremented by one count. If the deviation is within tolerance, the counter will count down. (The counter will not count below zero.) When the count reaches 100, a crystal fail will be initiated. In this manner only sustained erratic rate readings will trigger a crystal fail and instantaneous noise will be ignored.

If Auto Z is in use, the crystal quality will trigger an Auto Z failure instead of a crystal fail. This will change the instrument from dual frequency measurement mode to single frequency measurement mode. For some materials, it is possible to regain rate stability by this change. Once the switch to single frequency has occurred and a waiting period has elapsed (four times the Primary Time Constant plus the System Dead Time plus ten seconds), the counter will again track the rate deviation. If the counter reaches 100 a second time, a crystal fail will be triggered.

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CRYSTAL STABILITY . . . . . . . . . . . 0 to 9 (default = 0)

The Crystal Stability parameter can also be used to effect a crystal fail. In normal operation, when mass is added to a crystal its frequency of oscillation will decrease. There are, however, a number of reasons, such as thermal shock, high stresses in the film, electrical arcing from an electron beam gun, or frequency instabilities, that may cause a positive frequency shift between successive measurements. The Crystal Stability function is used to monitor these positive frequency excursions while the Channel is active. Values range from 0 to 9. The default value of 0 disables the function. Values 1 through 9 correspond to the maximum positive frequency accumulation permitted. See

Table 3-2.

Table 3-2 Crystal Stability Number and Positive Frequency Accumulation

Crystal Stability

Number

925

8 100 (max single shift of 50)

7 100

6 200 (max single shift of 100)

5 200

4 400

3 500

21000

1 5000 (max single shift of 1250)

0 Disabled

Positive Frequency

Accumulation (Hz)

Each time there is a positive shift in frequency, the magnitude of the positive frequency excursion is accumulated. If the cumulative total, or the maximum single shift, exceeds the limit set by the Crystal Stability value a crystal fail function is triggered.

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CRYSTAL FAIL OPTION . . . . . . . . . 0, 1, 2 (default = 1)

This parameter value determines what action will be taken if there is a crystal failure for this Channel during control.

0 = Time Power. Entering a value of 0 will cause the Channel to enter the Time Power state upon a crystal failure.

1 = Idle Ramp. A value of 1 will cause the Channel to enter the Idle Ramp state upon a crystal failure.

2 = Stop. A value of 2 will cause the Channel to Stop upon a crystal failure.

Cygnus Operating Manual

MAX POWER OPTION . . . . . . . . . . 0, 1, 2 (default = 1)

This parameter value determines what action will be taken if the Channel reaches maximum power and is held at maximum power for 5 seconds.

0 = Continue. Selecting a value of 0 will allow the Channel to continue in its

current state. 1 = Idle Ramp. A value of 1 will cause the Channel to enter the Idle Ramp state. 2 = Stop. A value of 2 will cause the Channel to Stop.

RateWatcher™ Sample and Hold Feature

Four parameters — RateWatcher Option, RateWatcher Averaging Time, RateWatch Time and RateWatch Accuracy — enable the Sample and Hold feature. When enabled, this feature periodically samples the deposition rate by automatically opening the sensor shutter and exposing the sensor to the deposition source. The power is adjusted so the actual rate is set to the desired rate. The sensor shutter is then automatically closed and power is held constant at the adjusted level. A five second time delay for thermal stabilization occurs between opening the shutter and taking measurements.

The RateWatcher Sample phase uses the measured deposition rate to control the source power. When the deposition rate meets the requirements of the RateWatcher Accuracy parameter, the RateWatcher Acceptance Window Time is started. If the rate falls out of the RateWatcher Accuracy requirement, the RateWatcher Acceptance Time Interval is reset to zero.

If the deposition rate meets the RateWatcher Accuracy requirement for the duration of the Acceptance Window Time, the sensor shutter is closed and RateWatcher enters Hold phase for the Hold Time duration.

Finally, after the Hold Time has elapsed, RateWatcher will enter a 5 second Delay phase. During the Delay phase, the crystal is exposed to the deposition, but the accumulated rate and sustained power are that from the previous Hold phase. This Delay phase allows the crystal to thermally stabilize to the deposition before re-entering the RateWatcher Sample phase.

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The RateWatcher Sample Acceptance Window Time (that is, the length of time that the rate must be within the accuracy range before going into hold) will be calculated as follows:

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Parameters

RateWatcher

Averaging

Time

0 min < 10 sec 5 seconds 2 second interval before

Rate Filter Time

"Sample"

Acceptance

Window

Time

Rate and Power are simultaneously averaged

using the following stored data

most recent 0.5 seconds

0 min

1 min any 60 seconds 2 second interval before

> 1 min any Averaging

10 sec 10 seconds 2 second interval before

most recent 0.5 seconds

Averaging Time excluding the most recently

Time * 60

seconds

calculated 1 minute average

RATEWATCHER OPTION . . . . . . . . 0, 1, 2 (default = 0)

This parameter controls the use of the RateWatcher. 0 = None, disabled 1 = Non-deposit state only 2 = Non-deposit and deposit states

RATEWATCH HOLD TIME . . . . . . . 00:01 to 99:59 min:sec (default = 00:05)

RateWatch Time determines the time interval over which the sensor shutter will be closed between samples.

RATEWATCH ACCURACY . . . . . . . 1 to 99 % (default = 5)

During the rate sampling period, the deposition rate is measured by the crystal; source power control is active. When the rate is within the desired accuracy for a period of time, the shutter is closed and the deposition state returns to HOLD.

RATE FILTER TIME. . . . . . . . . . . . . 0.1, 0.4, 1.0, 4.0, 10.0, 20.0, 30.0 sec.

(default = 0.1)

This parameter is used to apply a boxcar filter to the measured “raw” rate which is used to produce the Rate DAC output voltage.

The Rate Filter Time may be used for enhanced resolution. If a source has a long time constant, rate may be taken as constant over longer intervals Averaging provides an opportunity to reduce rate noise. Depending on the source of the noise, averaging can improve rate resolution:

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Thickness at sensor Channel N

Thickness at sensor Channel (N+1)

------------------------------------------------------------------------------------





100% VALUE=

 If the noise is crystal frequency resolution limited — the thickness change

over one second provides ten times the thickness change vs. the thickness change measured over a tenth of a second. A one second averaging interval will improve rate resolution by 10 times.

 If the sensor noise is random, then RMS reduction of rate noise is provided

by the square root of the number of point’s averaged (example a 10 point average provides a factor of 3.1 noise reduction).

The selection of the appropriate Rate Filter Time value will be dependent on the characteristics of the source.

CROSS TALK PERCENT . . . . . . . . 0.00 to 99.99% (default = 0.00)

This parameter is used for co-deposition of two sources. The selection of two co-deposition sources is always a Channel N= (odd value) and Channel (N+1).

This parameter provides a value used in an algorithm that compensates for cross interference during co-deposition. Mass accumulation onto the sensor for source Channel N due to evaporant from source Channel (N+1) can be subtracted from the mass accumulation onto sensor Channel N due to source Channels N and (N+1). The correction is expressed as a percentage of the rate at sensor Channel N over the rate at sensor Channel (N+1) due to only source Channel (N+1). When calculating cross sensitivity, the density and Z-Ratio parameter values should be the same for each source. See section 7.5 on page

7-4 for a procedure on how to determine Cross Talk Percent values.

The Cross Talk Percent value is calculated according to the equation (while depositing from source Channel (N+1) only).

[1]

This is the value entered into the Cross Talk Percent parameter for Channel N.

AUTO-Z . . . . . . . . . . . . . . . . . . . . . . YES / NO (default = NO)

This parameter designates the method in which the Z-Ratio value will be

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obtained for use in computing thickness with this sensor.

YES indicates that the Auto Z calculation feature of the system is used. If Auto-Z cannot be enabled on a crystal, the “Unable To Auto Z” message will be displayed.

NO indicates that the Z-Ratio established in Z-Ratio parameter is used.

The default value is NO and the Z-Ratio value will be used.

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3.3 Channel Hardware Parameters

Channel Hardware parameters define the digital-to-analog (DAC) functions, sensor type, as well as the shutter and crucible outputs for the specified Channel.

Channel Hardware definition is done by pressing the F1 function key on the Channel Parameters display. Selecting F1 brings up the Channel Hardware parameters display as shown in Figure 3-3.

Figure 3-3 Channel Hardware Parameters Display

Channel Hardware Display Function Keys

F1 PROCESS PARMS

To return to the Channel Parameters display, select F1.

F6 CHANNEL

To return to the Channel display, select F6.

3.3.1 Channel Hardware Parameters Definition

NOTE: All Hardware parameters can be changed only when a channel is in the

STOP or READY state and is not crystal switching on the channel.

SOURCE VOLTAGE RANGE . . . . . 0, 1, 2, 3, 4, 5 (default = 3)

This parameter selects the control voltage range for the Channel being edited. Permissible values are 0, 1, 2, 3, 4 and 5 for maximum output voltages of 10, 5, 2.5, -10, -5, and -2.5 Volts respectively. The default value is 3, for a control voltage output of 0 to -10 Volts.

NOTE: This parameter is not available if DAC Option 3 (Rate & Thickness) has

been selected under General Parameters, DAC Output Option.

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DAC RATE RANGE. . . . . . . . . . . . . 0 - 999 (default = 0)

This parameter determines the function of the Digital-To-Analog (DAC) recorder output. Values range from 0 to 4. Refer to the General Parameters display DAC Output Option for information pertaining to the DAC Rate and DAC Thickness outputs.

0 . . . . . . indicates the function is Channel Rate in the range of 0 to 10 Å/s.

1 . . . . . . is for Channel Rate in the range of 0 to 50 Å/s.

2 . . . . . . is for Channel Rate in the range of 0 to 100 Å/s.

3 . . . . . . is for Channel Rate in the range of 0 to 1000 Å/s.

4 . . . . . . is for Channel Rate in the range of 0 to 1 Å/s.

5 - 999 . . . . . is for Channel Rate in the range of 0 to the value entered.

DAC THICKNESS RANGE . . . . . . . 0 - 99999 (default = 0)

0 . . . . . . indicates the function is Channel thickness in the range of 0 to 100 Å.

1 . . . . . . is for Channel thickness in the range of 0 to 1000 Å.

2 . . . . . . is for Channel thickness in the range of 0 to 2000 Å.

3 . . . . . . is for Channel thickness in the range of 0 to 3000 Å.

4 . . . . . . is for Channel thickness in the range of 0 to 5000 Å.

5 - 99999 . . . is for channel thickness in the range of 0 to the value entered.

NOTE: The recorder output for the specified DAC Thickness Range is modulo

of the channel’s thickness value and the DAC Thickness Range’s upper limit value. The recorder output will roll over to zero volts when the channel’s thickness reaches the DAC Thickness Range upper limit value, and for every N times the DAC Thickness Range upper limit value.

SUBSTRATE SHUTTER OUTPUT . . . . . . . . . . 0 to 38 (default = 0)

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This parameter designates which of the 38 outputs is to be used as the Substrate Shutter output. Values range from 0 through 38. 0 indicates that a Shutter is not used and the values 1 through 38 correspond to the appropriate relay or open collector type output. If a value other than 0 is entered the output chosen as the Substrate Shutter output is designated as such in the I/O Map Display. The Substrate Shutter output is activated upon the Channel entering the Deposit or Manual states and stays active until the Channel exits the Deposit and Manual states.

SUBSTRATE SHUTTER OUTPUT TYPE . . . . . 0, 1 (default = 0)

This parameter designates the normal state of the relay contacts for the Substrate Shutter Output output. Permissible values are 0 and 1. 0 indicates a Normally Open output, 1 indicates a Normally Closed output.

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SENSOR SHUTTER OUTPUT . . . . 0 to 38 (default = 0)

This parameter designates which of the 38 outputs is to be used to activate the Crystal Shutter for this Channel. Values range from 0 to 38. Values 1 through 38 correspond to the appropriate output. Value 0 indicates that a shutter is not used. If a value other than 0 is entered, the output chosen as the Crystal Shutter output is designated as such on the I/O Map Display. The sensor shutter output is activated when this Channel enters either the Deposit, Manual, Non-Deposit Control states and during the Sample portion of the RateWatcher function.

SENSOR SHUTTER OUTPUT TYPE . . . . . . . . 0, 1 (default = 0)

This parameter designates the normal state of the contact closure for the Sensor Shutter output. Permissible values are 0 and 1. 0 indicates a Normally Open output, 1 indicates a Normally Closed output.

SENSOR TYPE . . . . . . . . . . . . . . . . 1, 2, 6, 7, 12 (default = 1)

This parameter provides selection among the Single sensor (1), CrystalTwo sensor (2), CrystalSix sensor (6), and Rotary sensor (7), Crystal12 (12). It enables the Crystal Switch feature for the CrystalTwo, CrystalSix, Crystal12 and Rotary sensor heads and enables the crystal indexing feature on the hand held power controller. If a value of 1 is entered, the Sensor Switch Output parameter is removed from the display.

SENSOR SWITCH OUTPUT . . . . . . 0 to 38, (default = 0)

This parameter designates which of the 38 outputs is to be used as the Sensor Switch output for the Channel. Values range from 0 to 38. Values 1 through 38 correspond to the appropriate output. Value 0 indicates that the Sensor Switch Output is not used. A nonzero value must be entered if a Sensor Type value of 2, 6, 7, or 12 is chosen. This non-zero value’s output is displayed on the I/O Map screen. The contact closure on this relay is always Normally Open.

If CrystalTwo is chosen, the output will close upon initiating a Crystal Switch and then open upon initiating a second Crystal Switch. If CrystalSix is chosen, then upon initiating a Crystal Switch, the output will first close for one second, then open for one second, then close for one second and then open (i.e., two pulses to move one position). If a Rotary or Crystal12 sensor is chosen, upon initiating a Crystal Switch the output will first close for one second and then open (that is, one pulse to move one position).

NUMBER OF CRUCIBLES . . . . . . . 1, 4, 8, 16, 32, 64 (default = 1)

This parameter can be used to automatically index the turret position when using a multiple pocket turret source. The value selected denotes the number of pockets in the turret source. The value 1 indicates a single pocket source, and the parameters — Crucible Output, Crucible Output Type, Turret Feedback and Turret Delay or Turret Input — are removed from the Display. The number of crucibles determines the number of outputs needed for crucible indexing. As

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the outputs are binary encoded (actual coding is binary - 1, with 000 representing position 1 and 111 representing position 8), 2 outputs are needed for 4 crucibles, 3 for 8, 4 for 16, 5 for 32 and 6 for 64.

CRUCIBLE OUTPUT . . . . . . . . . . . . 0 to 37 (default = 0)

This parameter designates which of the outputs are to be used as crucible outputs. The value 0 indicates the crucible output is inactive. The value entered into this parameter indicates which of the outputs begins the sequence used as crucible control outputs. For example, a 4 entered into the Number of Crucibles parameter and a 1 entered into the Crucible Output parameter will designate outputs 1 and 2 as crucible control outputs with the least significant bit of the binary coding in output 1. An 8 entered into the Number of Crucibles parameter and a 1 entered into the Crucible Output parameter will designate outputs 1, 2, and 3 as crucible control outputs with the least significant bit of the binary coding in output 1.

CRUCIBLE OUTPUT TYPE. . . . . . . 0, 1 (default = 0)

This parameter designates the normal state of the output contacts for the Crucible outputs. 0 indicates an Normally Open output, 1 indicates a Normally Closed output.

TURRET FEEDBACK . . . . . . . . . . . YES / NO (default = NO)

Some turret source indexers provide feedback to signify when the turret is in the proper position. This parameter allows Cygnus to accept this input and respond accordingly. A YES indicates that Turret Feedback is expected and the Turret Input parameter is displayed on the screen. A NO indicates there is no Turret Feedback forthcoming and the Turret Delay parameter is displayed. The default value is NO. See the Turret Input and Turret Delay descriptions below.

NOTE: If the Turret Feedback is set to YES and the Channel is STARTed, the

Channel will proceed to the Crucible Switch state. If the turret input is not received within 60 seconds the Channel will enter the STOP state.

TURRET INPUT . . . . . . . . . . . . . . . . 0 to 28 (default = 0)

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This parameter designates which of the 28 inputs is to be the Turret Feedback input. Values 1 through 28 correspond to the appropriate input. Value 0 indicates that an input for turret feedback is not used. However, an input must be assigned, or the channel will never proceed past the crucible switching state. If a value other than 0 is entered, then the input chosen as the Turret Input is designated as such on the I/O Map display. Input lines are activated with a contact closure to ground.

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Cygnus Operating Manual

CAUTION

TURRET DELAY . . . . . . . . . . . . . . . 1 to 60 sec (default = 5)

If Turret Feedback is not used a timer will be set to allow the source crucible time to rotate into position. This parameter sets the amount of time the Process will remain in the Crucible Switch state waiting for the crucible to rotate before proceeding to the Rise 1 state.

The Channel will proceed to the Rise 1 state after the Turret Delay time expires. This could result in damage to your equipment if the crucible is not in position after expiration of the Turret Delay time.

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4.1 Introduction

ALL CHANNELS DATA DISPLAY

GENERAL PARAMETERS

LOGIC DIRECTORY

I/O MAP

FLOPPY DISK

Cygnus system level configuration is accomplished through the General Parameters display. Further configuration of the Logic Statements and I/O is accomplished through displays accessed from the General Parameters display.

General parameters set up is initiated by selecting the GENERAL PARMS (F1) key in the All Channels data display.

Figure 4-1 Display Tree for General Parameters, Logic Statement, and I/O Set Up

Cygnus Operating Manual

Chapter 4

General Parameters

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Cygnus Operating Manual

4.2 General Parameter Display

The GENERAL PARAMETERS display is shown in Figure 4-2.

Figure 4-2 GENERAL PARAMETERS Display

GENERAL PARAMETERS Display Function Keys

F1 LOGIC DIRECTORY

To access the Logic Directory display, press function key F1.

F2 I/O MAP

To access the I/O Map display, press function key F2

F3 FLOPPY DISK

To save or load files from the floppy disk, press the F3 function key to access the Floppy Disk display.

F6 ALL CHANNELS

To move to the All Channels Data display, press function key F6.

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4.3 General Parameters Definition

NOTE: All general parameters can be changed only when all channels are in

STOP or READY states and are not crystal switching on any channel.

TEST ON . . . . . . . . . . . . . . . . . . . . . YES / NO (default = NO)

This feature provides a constant rate signal which can be varied by altering the density and tooling parameters. It is designed to allow testing of a Channel without actually running a deposition. YES turns the test signal on.

TIME COMPRESSED . . . . . . . . . . . YES / NO (default = NO)

When in TEST mode, this feature allows a faster than real time (10x) execution of the Channel. This is useful when testing a long Process. A value of YES increases the speed of execution 10 to 1.

AUDIO FEEDBACK. . . . . . . . . . . . . YES / NO (default = YES)

Activates Audio Feedback; signifying data entry. The value Yes activates the audio signal.

RS-232C BAUD RATE. . . . . . . . . . . 2400, 4800, 9600, 19200 (default = 19200)

Cygnus Operating Manual

For RS-232C serial interfaces, this parameter sets the rate for data transfer.

IEEE488 ADDRESS. . . . . . . . . . . . . 1 to 30 (default = 3)

Applies only if the IEEE-GPIB interface option board is installed. The GPIB address is a number which identifies Cygnus to the Host Computer. This address must be unique from other devices on the GPIB interface.

DATALOGGING PATH . . . . . . . . . . 0, 2, 3 (default = 0)

This parameter determines the path for the Datalog output. A value of 0 turns datalogging off. A value of 2 outputs the Datalog string to the floppy disk in a page format. A value of 3 outputs the Datalog string to the floppy disk in a comma delimited format.

NOTE: If a configuration file from a unit with version 1.70 or earlier firmware is

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to be loaded into a unit with version 1.80 or later, verify that the path is not set to 1 as this will prevent the file from loading due to a "File Range Error".

DATA LOG XTAL HISTORY . . . . . . YES / NO (default = NO)

This parameter selects whether to output the crystal use history. The crystal history includes the beginning and ending crystal frequency, the activity, and the S&Q counts.

PRINT SCREEN PATH . . . . . . . . . . 2 (default = 2)

This parameter determines which path to output the print screen function. 2 = File (floppy disk)

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Cygnus Operating Manual

NOTE: If a configuration file from a unit with version 1.70 or earlier firmware is

to be loaded into a unit with version 1.80 or later, verify that the path is not set to 1 as this will prevent the file from loading due to a "File Range Error".

PRINT SCREEN NUMBER . . . . . . . 0 to 999 (default = 0)

This parameter is used to distinguish between files printed to the floppy disk. After each print execution the number is incremented.

DAC OUTPUT OPTION. . . . . . . . . . 0, 1, 2, 3 (default = 0)

The standard Cygnus has a single DAC board with six outputs, DAC 1 to DAC 6. These DAC outputs are dedicated to source control voltage outputs (Power output). Optionally a second DAC board can be added to provide DAC outputs 7 through 12 which can be used to output Rate and/or Thickness.

When option 0 is selected, the DAC outputs have the following function:

DAC 1. . . . . . . . . Channel 1 Power

DAC 2. . . . . . . . . Channel 2 Power

DAC 3. . . . . . . . . Channel 3 Power

DAC 4. . . . . . . . . Channel 4 Power

DAC 5. . . . . . . . . Channel 5 Power

DAC 6. . . . . . . . . Channel 6 Power

DAC 7. . . . . . . . . Channel 1 Rate

DAC 8. . . . . . . . . Channel 2 Rate

DAC 9. . . . . . . . . Channel 3 Rate

DAC 10. . . . . . . . Channel 4 Rate

DAC 11 . . . . . . . . Channel 5 Rate

DAC 12. . . . . . . . Channel 6 Rate

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When option 1 is selected, the DAC outputs are:

DAC 1. . . . . . . . . Channel 1 Power

DAC 2. . . . . . . . . Channel 2 Power

DAC 3. . . . . . . . . Channel 3 Power

DAC 4. . . . . . . . . Channel 4 Power

DAC 5. . . . . . . . . Channel 5 Power

DAC 6. . . . . . . . . Channel 6 Power

DAC 7. . . . . . . . . Channel 1 Thickness

DAC 8. . . . . . . . . Channel 2 Thickness

DAC 9. . . . . . . . . Channel 3 Thickness

DAC 10. . . . . . . . Channel 4 Thickness

DAC 11 . . . . . . . . Channel 5 Thickness

DAC 12. . . . . . . . Channel 6 Thickness

When Option 2 is selected, the DAC outputs are:

DAC 1. . . . . . . . . Channel 1 Power

DAC 2. . . . . . . . . Channel 2 Power

DAC 3. . . . . . . . . Channel 3 Power

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Cygnus Operating Manual

DAC 4. . . . . . . . . Channel 4 Power

DAC 5. . . . . . . . . Channel 1 Thickness

DAC 6. . . . . . . . . Channel 2 Thickness

DAC 7. . . . . . . . . Channel 3 Rate

DAC 8. . . . . . . . . Channel 4 Rate

DAC 9. . . . . . . . . Channel 1 Rate

DAC 10. . . . . . . . Channel 2 Rate

DAC 11 . . . . . . . . Channel 3 Thickness

DAC 12. . . . . . . . Channel 4 Thickness

When Option 3 is selected, the DAC outputs are:

DAC 1. . . . . . . . . Channel 1 Rate

DAC 2. . . . . . . . . Channel 2 Rate

DAC 3. . . . . . . . . Channel 3 Rate

DAC 4. . . . . . . . . Channel 4 Rate

DAC 5. . . . . . . . . Channel 5 Rate

DAC 6. . . . . . . . . Channel 6 Rate

DAC 7. . . . . . . . . Channel 1 Thickness

DAC 8. . . . . . . . . Channel 2 Thickness

DAC 9. . . . . . . . . Channel 3 Thickness

DAC 10. . . . . . . . Channel 4 Thickness

DAC 11 . . . . . . . . Channel 5 Thickness

DAC 12. . . . . . . . Channel 6 Thickness

THICKNESS EQUATION 1,2,3 . . . . 0 to 654321 (default = 0)

Each of the three thickness equations can be set up to sum the thickness of the specified Channels. Each Channel can only be used once in an equation but can be used in all three. For example, 12 means sum the thickness of Channels 1 and 2, 1234 sums the first four Channels. Thickness equations are designed to be used in logic statements.

4.4 Logic Directory Set Up

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4.4.1 Logic Statement Overview

Cygnus has programmable logic capabilities that allow it to specifically respond to certain process states as well as External Inputs and to send control signals (Outputs) to external devices based on Inputs or specific instrument conditions. The logic capabilities can also be used to control the execution of a Channel without operator intervention. These capabilities can be specifically tailored by programming the Logic Statements.

The Logic Directory is accessed by pressing the LOGIC DIRECTORY key (F1) on the General Parameters display, refer to Figure 4-1 on page 4-1. From the Logic Directory display, press the SELECT LOGIC STATEMENT (F5) function key to edit a logic statement.

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Cygnus Operating Manual

 Single or multiple actions may be triggered by Inputs or the fulfillment of a user

specified logical condition.

 Single or multiple complex defined conditions are used to define an event.

 The logical operators; AND, OR, and NOT (negate) as well as grouping

operators (parentheses) are available to define very precise conditionality.

 It is possible to execute an action immediately or delay it for a defined period of

time through the use of a timer or counter.

 Each Logic Statement is evaluated every measurement cycle of 100 ms.

 The components of the Logic statements may be the transition between or

entry of a specific state, specific programmable time limits, programmable thickness limits or various error conditions

 Inputs and outputs may be named on the I/O MAP display. Additionally on this

display, the outputs may be defined as normally open (NO) or normally closed (NC).

 Logic statements may be chained together using the Statement ### Event.

These features allow moderately complex vacuum processing plants to be controlled without the addition of any other intelligent machines. Fourteen TTL inputs and eight relay outputs are standard. An additional fourteen inputs and eight relay outputs are available with an optional I/O card. With a second optional I/O card, eight more relays and fourteen open collector outputs are available.

Cygnus has the capacity for 100 logic statements.

4.4.2 Editing Logic Statements

A series of conditional events and a related series of actions may be defined through the Logic Statements. When a logic statement has an event or action defined, the Logic Directory screen will display ">" character after the statement number. When the event string is determined to be true the associated actions are executed in left to right order. The state of the Logic statement is indicated on the Logic Directory display. Three small asterisks under the Logic Statement number indicate the statement is true (active). The expressions are evaluated in numerical sequence starting with logic statement 1.

To initiate Logic Statement Set-Up, select function key F1 (GENERAL PARAMETERS) on the All Channels display. Then, select function key F1 (LOGIC DIRECTORY). On the Logic Directory display, select F5, SELECT LOGIC STATEMENT, to define and edit the logic statement. This will invoke the Logic Statements display (see Figure 4-5). Upon entry, the cursor will be placed at the last referenced Logic statement. Entries for four statements are shown on each display page.

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Figure 4-3 Display Tree for Logic Statement Editing

ALL CHANNELS

GENERAL PARAMETERS

LOGIC DIRECTORY

SELECT LOGIC STATEMENT

LOGIC STATEMENTS

SELECT

NEGATE

ADD/DELETE PARENTHESIS

DELETE

CANCEL CHANGES

LOGIC DIRECTORY W/SAVE

EDIT LOGIC

LOGIC STATEMENTS

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4.4.2.1 Logic Statement Directory

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4.4.2.2 Logic Statements

Figure 4-4 Cygnus Logic Directory

A Logic Statement is selected for editing by positioning the box cursor at the desired statement number and pressing the key F5. Then by selecting the SELECT function (F1), the edit mode is entered where Events and Actions can be inserted.

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Cygnus Operating Manual

Figure 4-5 Logic Directory Display

LOGIC STATEMENTS Display Function Keys

F1 PAGE FORWARD

To access the next page of Logic Statements, select function key F1.

F2 PAGE BACK

To access the previous page of Logic Statements, select function key F2.

F5 EDIT LOGIC

To select or change Event or Action definitions, select function key F3.

F6 LOGIC DIRECTORY

To move to the LOGIC DIRECTORY display, select function key F6.

4.4.2.3 Logic Statement Event Editing

Figure 4-6 Logic Event Selection

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Logic Statement Display Function Keys

F1 SELECT

If the cursor is on IF (Event), or THEN (Action), pressing this key will bring up the respective Event or Action List.

F2 NEGATE

If the cursor is on an Event pressing this key will negate the Event.

F3 ADD/DELETE PARENTHESIS

If on an Event pressing this key will insert a parenthesis: a left parenthesis will be added if no previous parenthesis is defined; a right parenthesis is added if the cursor is on an Event which does not have a right parenthesis and a left parenthesis is already defined. If the cursor is on an Event which has a parenthesis defined, pressing this panel will delete the parenthesis.

F4 DELETE

If on an Event or Action, pressing this key will delete the Event or Action as well as associated connector and parenthesis.

F5 CANCEL CHANGES

Pressing this key will cancel any changes and return the Logic Statement to be the same as when the display was entered.

F6 LOGIC DIRECTORY w/SAVE

Pressing this key returns to the Logic Directory and saves the Logic Statement.

Figure 4-7 Event Selection

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Event Selection Display Function Keys

F1 REPLACE

Changes the Event or Action in reverse video to what is contained in the box cursor.

F2 INSERT

Inserts the Event or Action in the box cursor into the Logic Statement at the position indicated by reverse video. Previously entered Events or Actions are moved to the right.

F6 STATEMENT

Exits the Event or Action List display and returns to the Logic Statement Editing display.

Logic Connectors

If the cursor is on a connector designated by ccc, pressing F1 (SELECT) will toggle the ccc between a logical AND and a logical OR.

4.4.2.3.1 Event Definitions (IF)

NOTE: The presence (or absence) of an input is leading edge detected on the

transition from high to low (or low to high). Inputs are not “re-evaluated” if held level at either the high or low state.

COMP CNTL

Sets the logic condition to be true when a Set Logic Statement vvv command is received from the remote communications port. The logic condition remains true until a Clear Logic Statement vvv command is received from the remote communications port. See Remote Commands RG5 and RG6

COUNT LIMIT ### ###

Sets the logic condition to be true when the designated Counter ### (1 to 20) reaches the desired count value ### (1 to 999)

CRUCIBLE SW ###

Sets the logic condition to be true at the beginning of the Crucible Switch state for the designated Channel. If 0 is selected it will apply to any Channel. The condition remains true until the end of the Crucible Switch state.

DEPOSIT ###

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Sets the logic condition to be true at the beginning of the Deposit state of the designated Channel, or any Channel if 0 is entered for the Channel ###. The condition remains true until the end of the DEPOSIT state.

Cygnus Operating Manual

EXTERNAL IN ###

Designates a hardware input which, when it changes state, can be used to trigger an Action. Inputs can be given names up to 10 characters long. Inputs are activated by pulling the specific input’s terminal to ground (<0.8 V) through a contact closure to common (GND) or with TTL/CMOS logic having current sink capability of 2 mA (1 low power TTL load).

IDLE RAMP ###

Sets the logic condition to be true at the start of Idle Ramp for the designated Channel, or for any Channel if 0 is entered for the Channel ###. The condition remains true until the end of Idle Ramp.

MANUAL ###

Sets the logic condition to be true when the Manual state is entered for the designated Channel, or for any Channel if 0 is entered for the Channel ###. The condition remains true until leaving the Manual state.

MAXIMUM PWR ###

Sets the logic condition to be true as long as the designated source is at Maximum Power. If 0 is entered it will apply to any channel. The condition remains true until the designated source is less than Maximum Power.

MINIMUM PWR ###

Sets the logic condition to be true as long as the designated source is at Minimum Power while the source is in either the Deposit state or the Non-Deposit Control state. If 0 is entered it will apply to any channel. The condition remains true until the designated source is greater than Minimum Power.

NONDEP CNTL ###

This Event is evaluated true if the designated Channel is in the Non-Deposit Control state, i.e. there is rate control with the substrate shutter closed. If 0 is selected it will apply to any Channel. The condition remains true until the end

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of the Non-Deposit Control state.

NONDEP HOLD ###

This function is similar to Time Power except the substrate shutter for the designated source is closed and there is no determinant end point. If 0 is selected it will apply to any Channel. The condition remains true until the state is exited, for example when a Stop command is given.

READY ###

Sets the logic condition to be true as long as the designated Channel is in the READY state. If 0 is selected it will apply to any Channel.

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RISE 1 ###

Sets the logic condition to be true at the start of Rise Time 1 for the designated Channel. If 0 is selected it will apply to any Channel. The condition remains true until the end of the Rise Time 1.

RISE 2 ###

Sets the logic condition to be true at the start of Rise Time 2 for the designated Channel. If 0 is selected it will apply to any Channel. The condition remains true until the end of Rise Time 2.

SOAK 1 ###

Sets the logic condition to be true at the start of Soak Time 1 for the designated Channel. If 0 is selected it will apply to any Channel. The condition remains true until the end of Soak Time 1.

SOAK 2 ###

Sets the logic condition to be true at the start of Soak Time 2 for the designated Channel. If 0 is selected it will apply to any Channel. The condition remains true until the end of Soak Time 2.

STATEMENT ###

This Event can be used to test when a logic statement becomes “true.” This allows for linking statements together. A “true” statement is indicated by three small asterisks below the statement number.

STOP ###

Sets the logic condition to be true as long as the designated Channel is in STOP. If 0 is selected it will apply to any Channel.The condition remains true until a RESET or a START command is received.

SUBSTR SHTR ###

Sets the logic condition to be true whenever the substrate shutter output for the designated source is active. If 0 is selected it will apply to any Channel.

THICK LIMIT # ###

Sets the logic condition to be true once the designated Channel # reaches Thickness ### value. The condition remains true while the thickness for the designated Channel is above the Thickness Limit Value.

THICK SUM # ###

Sets the logic condition to be true when the sum of thickness indicated by the designated Thickness Equation # reaches the thickness value ###.

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TIME POWER ###

Sets the logic condition to be true upon entering a Time Power state for the designated Channel. If 0 is selected it will apply to any Channel.

TIMER HH:MM ### HH:MM

Sets the logic condition to be true when the designated timer ### reaches the specified time HH:MM.

TIMER SECS ### sss.s

Sets the logic condition to be true when the designated Timer ### reaches the specified time expressed in seconds, sss.s

XTAL FAIL ###

Sets the logic condition to be true as long as there is a Crystal Fail without having a Crystal Switch for the designated channel ###. If 0 is selected it will apply to any channel. The logic condition remains false if the XTAL FAIL INHIBIT Action is active. The condition remains true until a working crystal is input to the appropriate sensor.

4.4.2.4 Logic Statement Action Editing

Figure 4-8 Action Selection

Cygnus Operating Manual

Action Selection Display Function Keys

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F1 REPLACE

Changes the Event or Action in reverse video to what is contained in the box cursor.

F2 INSERT

Inserts the Event or Action in the box cursor into the Logic Statement at the position indicated by reverse video. Previously entered Events or Actions are moved to the right.

F6 STATEMENT

Exits the Event or Action List display and returns to the Logic Statement Editing display.

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4.4.2.4.1 Action Definitions (THEN)

NOTE: The following are level outputs and once turned on will remain active until

turned off. This is true even if the Logic string is cleared. XTL FL INHBT(ON/OFF) ### CLOCK HOLD (ON/OFF) ## EXTERN OUT (ON/OFF) ## RW SAMPLE ON ##

CANCEL TIMER ###

Sets the value of timer ### to zero.

CLEAR COUNTER ###

Clears the designated counter ###

CLOCK HOLD (ON/OFF) ###

This feature "holds" the state timer for the designated Channel ### during any non-rate control state. These states include the pre-deposit states: Ready, Crucible Switch, Rise 1, Soak 1, Rise 2, Soak 2; and the post-deposit state: Idle Ramp. For the feature to be activated the state’s timer must be non-zero. If the instrument is in the Ready state and a Start command is executed while CLOCK HOLD is active, the instrument will progress to the first pre-deposit state with a non-zero state time. If the instrument is in the Crucible Switch state, waiting for Turret Feedback Input, and CLOCK HOLD is activated, when the turret positioned input is activated the instrument will progress to the next pre-deposit state having a non-zero state time. The instrument is prevented from continuing state processing until the CLOCK HOLD action is turned OFF.

CONTINUE DEP ###

Puts the designated Channel ### into the Deposit state but does not zero the thickness. This action can not be done from a Ready, Stop, or Crucible Switch state. If the crystal is failed, this action will put the source into the Time Power state if the previous state was Non-Deposit Hold, otherwise it is not allowed.

EXTERN OUT (ON/OFF) ###

Designates a hardware output ### and places it into its ON or OFF state. Outputs can be given names up to 10 characters long. Outputs are named in the I/O Map display.

GOTO NONDEP CNT ###

Places the designated Channel ### into the Non-Deposit Control state. This cannot be done from the Ready, Stop, or Crucible Switch states. If the crystal is failed this action will place the Channel into the Non-Deposit Hold state if the previous state was Time Power, otherwise it is not allowed.

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GOTO POST DEP ###

This action places the designated Channel ### into the Idle Ramp state. This action cannot be done if in Crucible Switch.

INCREMENT COUNT ###

Increases the count by one in the designated counter ###.

RESET ###

This action is identical to pressing the RESET button on the front panel for the designated Channel ###. When 0 is entered all the Channels will be RESET.

RW SAMPLE ON ###

Leave RateWatch HOLD on Channel ### and do not return to RateWatch HOLD until turned off.

RW SAMPLE OFF ###

Allows return to RateWatch HOLD on Channel ### when sampling accuracy has been met.

START ###

This action is identical to pressing the START button on the front panel for the designated Channel ###.

START DEPOSIT ###

This function is used to place the designated Channel ### into Deposit from the NONDEP CNTL state. If the crystal is failed this command will make the source go into Time Power if the previous state was Non-Deposit Hold, otherwise the action is not allowed. Can not be done from Ready, Stop, or Crucible Switch. When in Ready or Stop use the Start action.

START TIMER ###

Starts the designated timer ###.

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STOP ###

This action is identical to pressing the Stop button on the front panel for the designated Channel ###. A value of 0 stops all channels.

SWITCH XTAL ###

This Action activates the Crystal Switch output for the sensor number indicated. It sets the alternate crystal active when using CrystalTwo Switch. It indexes to the next crystal position when using the CrystalSix, Crystal12, or Rotary sensor. This function is available only if a CrystalTwo, a CrystalSix, Crystal12, or a Rotary sensor type is chosen.

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ALL CHANNELS

GENERAL PARAMETERS

LOGIC DIRECTORY

COUNTERS TIMERS

XTL FL INHBT (ON/OFF) ###

The ON action prohibits the Crystal Fail output relay from activating. This is useful when changing crystals for the designated Channel ### (0 indicates all Channels). The OFF action cancels the corresponding ON action.

ZERO THICK ###

This Action is identical to selecting the ZERO THICKNESS key in the Channel display. The Action will zero the thickness accumulated on the display for the designated Channel ###. A value of 0 will zero the thickness on all channels.

4.5 Counters Timers

Figure 4-9 Display Tree for Counters Timers

Figure 4-10 Timers Counters

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COUNTERS / TIMERS Display Function Keys

F1 ZERO COUNTER TIMER

To set the value of the selected timer to 00:00, select function key F1.

F2 START TIMER

To start the selected timer, select function key F2.

F3 CANCEL TIMER

To stop the selected timer, select function key F3

F6 LOGIC DIRECTORY

To move to the LOGIC DIRECTORY display, select function key F6.

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INFICON Cygnus Thin Film Deposition Controller User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Trademarks

Warranty

Table Of Contents

1.1 Introduction

1.1.1 Related Manuals

1.2 Instrument Safety

1.2.1 Definition of Notes, Cautions and Warnings

1.2.2 General Safety Information

1.2.3 Earth Ground

1.2.4 Main Power Connection

1.3 How To Contact Customer Support

1.3.1 Returning Your Cygnus to INFICON

1.4 Cygnus Specifications

1.4.1 Measurement

1.4.2 Screens and Parameters

1.4.2.1 Instrument Set Up Parameters

1.4.2.2 Set Up Parameters for Each Source

1.4.3 User Interface

1.4.4 Display

1.4.5 Source / Recorder Outputs

1.4.6 Logic Processing

1.4.7 Relays / Inputs

1.4.8 Remote Communications

1.4.9 Accessories

1.4.10 Power

1.4.11 Operating Environment

1.4.12 Storage Temperature

1.4.13 Warm Up Period

1.4.14 Size

1.4.15 Connector Clearance Requirements

1.4.16 Weight

1.4.17 Cleaning

1.5 Unpacking and Inspection

1.6 Parts and Options Overview

1.6.1 Base Configurations

1.6.3 Oscillator Packages, Optional Accessories, and Sensors

2.1 Front Panel Controls

2.2 Rear Panel Interfaces

2.3 Displays

2.3.1 ALL CHANNELS Display

2.3.1.1 GENERAL PARAMETERS Display

2.3.1.2 General MAINTENANCE Display

2.3.1.2.1 All Channels Sensor MAINTENANCE Display

2.3.1.3 CHANNEL Display

2.3.1.3.1 Channel Parameters Display

2.3.1.3.1.1 HARDWARE PROCESS Display

2.3.1.3.2 Channel SENSOR MAINTENANCE Display

2.3.1.3.2.1 Channel SOURCE MAINTENANCE Display

2.4 Crystal Life, Starting Frequency and Activity

2.5 Defining a Process

2.5.1 Executing a Process

2.6 State Descriptions

2.7 Special Features

2.7.1 Crystal Switching

2.7.2 Rotary Sensor Crystal Switching

2.7.3 Source/Crucible Selection

2.7.3.1 Example: Programming Turret Source Crucible Selection

2.7.4 Hand-Held Controller

2.7.5 Test Mode

2.7.6 Floppy Disk (Optional)

2.7.7 Lock Codes

2.7.8 Datalog

2.7.9 Auto Soak 2

3.1 Introduction

3.2 Channel Parameters

3.2.1 Channel Parameter Definitions

3.3 Channel Hardware Parameters

3.3.1 Channel Hardware Parameters Definition

4.1 Introduction

4.2 General Parameter Display

4.3 General Parameters Definition

4.4 Logic Directory Set Up

4.4.1 Logic Statement Overview

4.4.2 Editing Logic Statements

4.4.2.1 Logic Statement Directory

4.4.2.2 Logic Statements