HP Pavilion 11 x2 Disassembly Instructions Manual
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicabl e.]
HP Pavilion 11 x2 PC
1.0 Items Requiring Selective Treatment
Quantity
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
PCBA
1
Batteries
All types including standard alkaline and lithium coin
or button style batteries Main battery & RTC battery
2
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illum inate d dis plays with gas
discharge lamps LCD Pan el
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Product End-of-Life Disassembly Instructions
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
weighing > 25 grams (not including PCBs or PCAs
of items
included
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
Tool Description
Tool Size (if
applicable)
Description Screwdriver
#1#2
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Proc ess
and materials requiring selective treatment can be removed.
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Release hinge BTN and Pull up Slate.fig#1
2. Disassemblly Slate Cover.fig#2
3. Release bootm trim's screw and disasemblly bottom trim.fig#3
4. Release Thermal bracket's screw and disasemblly Thermal bracket.fig#4
5. Disasembll y Speak er fig#5
6. Release MB's screw and disasemblly MB.fig#6
7. Release Battery's screw and disasemblly Battery.fig#7
8. Slate disasemblly finish.fig#8
9. Remove Base Rubber foot.fig#9
10. Release Base's screw and disasemblly Base case.fig#10
11. Release Hinge's cable and screw and disasemblly Hinge module.fig#11
12. Release Battery's screw and disasemblly Battery.fig#12
13. Release all board's screw and disasemblly all board.fig#13
14. Dock disaemblly finish.fig#14
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Release hinge BTN and Pull up Slate
2. Disassemblly Slate Cover
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
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