AMD is a trademark of Advanced Micro Devices,
Inc. Bluetooth is a trademark owned by its
proprietor and used by HP Inc. under license.
Intel, Core, Thunderbolt, vPro, and XMM are
trademarks of Intel Corporation or its
subsidiaries in the U.S. and/or other countries.
Microsoft and Windows are either registered
trademarks or trademarks of Microsoft
Corporation in the United States and/or other
countries. USB Type-C and USB-C are registered
trademarks of USB Implementers Forum.
Qualcomm is a trademark of Qualcomm
Incorporated, registered in the United States and
other countries, used with permission.
The information contained herein is subject to
change without notice. The only warranties for
HP products and services are set forth in the
express warranty statements accompanying
such products and services. Nothing herein
should be construed as constituting an
additional warranty. HP shall not be liable for
technical or editorial errors or omissions
contained herein.
First Edition: August 2020
Product notice
This guide describes features that are common
to most models. Some features may not be
available on your computer.
Not all features are available in all editions or
versions of Windows. Systems may require
upgraded and/or separately purchased
hardware, drivers, software or BIOS update to
take full advantage of Windows functionality.
Windows 10 is automatically updated, which is
always enabled. ISP fees may apply and
additional requirements may apply over time for
updates. Go to http://www.microsoft.com for
details.
To access the latest user guides, go to
http://www.hp.com/support, and follow the
instructions to nd your product. Then select
Manuals.
Software terms
By installing, copying, downloading, or otherwise
using any software product preinstalled on this
computer, you agree to be bound by the terms
of the HP End User License Agreement (EULA). If
you do not accept these license terms, your sole
remedy is to return the entire unused product
(hardware and software) within 14 days for a full
refund subject to the refund policy of your seller.
For any further information or to request a full
refund of the price of the computer, please
contact your seller.
Document Part Number: M20768-001
Page 3
Safety warning notice
Reduce the possibility of heat-related injuries or of overheating the computer by following the practices
described.
WARNING! To reduce the possibility of heat-related injuries or of overheating the computer, do not place the
computer directly on your lap or obstruct the computer air vents. Use the computer only on a hard, at surface.
Do not allow another hard surface, such as an adjoining optional printer, or a soft surface, such as pillows or rugs
or clothing, to block airow. Also, do not allow the AC adapter to come into contact with the skin or a soft surface,
such as pillows or rugs or clothing, during operation. The computer and the AC adapter comply with the useraccessible surface temperature limits dened by applicable safety standards.
Right ........................................................................................................................................................................................... 5
Left .............................................................................................................................................................................................. 6
Keyboard area ........................................................................................................................................................................... 9
Button, speakers, and ngerprint reader ...................................................................................................... 12
Special keys ........................................................................................................................................................ 13
Hot keys (select products only) ....................................................................................................................... 14
Top cover ................................................................................................................................................................................. 15
Inserting a nano SIM card (select products only) .............................................................................................................. 18
3 Illustrated parts catalog ........................................................................................................................................................................ 21
Computer major components .............................................................................................................................................. 21
Mass storage devices ............................................................................................................................................................ 30
Miscellaneous parts ............................................................................................................................................................... 31
4 Removal and replacement procedures preliminary requirements ................................................................................................ 35
Service considerations .......................................................................................................................................................... 36
Plastic parts ........................................................................................................................................................ 36
Cables and connectors ..................................................................................................................................... 36
Electrostatic discharge information .................................................................................................................................... 38
Preventing electrostatic damage to equipment ........................................................................................... 39
Personal grounding methods and equipment .............................................................................................. 39
Grounding the work area .................................................................................................................................. 39
Recommended materials and equipment ..................................................................................................... 40
Packaging and transporting guidelines .............................................................................................................................. 40
5 Removal and replacement procedures for authorized service provider parts ............................................................................ 43
Preparation for disassembly ........................................................................................................................... 44
System board ..................................................................................................................................................... 61
Determining the BIOS version ......................................................................................................................... 72
Preparing for a BIOS update ............................................................................................................................ 73
Downloading a BIOS update ........................................................................................................ 73
Installing a BIOS update ............................................................................................................... 73
7 Backing up, restoring, and recovering ................................................................................................................................................. 75
Backing up information and creating recovery media ..................................................................................................... 76
viENWW
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Using Windows tools for backing up .............................................................................................................. 76
Using the HP Cloud Recovery Download Tool to create recovery media (select products only) .......... 76
Restoring and recovering your system ............................................................................................................................... 77
Creating a system restore ................................................................................................................................ 77
Restoring and recovery methods ................................................................................................................... 77
Recovering using HP Recovery media ............................................................................................................ 77
Changing the computer boot order ................................................................................................................ 78
Using HP Sure Recover (select products only) .............................................................................................. 78
8 Using HP PC Hardware Diagnostics ..................................................................................................................................................... 79
Downloading the HP PC Hardware Diagnostics Windows from the Microsoft Store .................................................. 79
Customizing Remote HP PC Hardware Diagnostics UEFI settings ................................................................................. 79
10 Statement of memory volatility ........................................................................................................................................................ 85
Current BIOS steps ................................................................................................................................................................. 85
Questions and answers ......................................................................................................................................................... 89
Using HP Sure Start (select products only) ........................................................................................................................ 91
11 Power cord set requirements ............................................................................................................................................................ 93
Requirements for all countries ............................................................................................................................................ 93
Requirements for specic countries and regions ............................................................................................................. 93
Index ............................................................................................................................................................................................................. 99
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viiiENWW
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1Product description
This table provides detailed product information.
Table 1-1 Product components and their descriptions
(4)Security cable slotAttaches an optional security cable to the computer.
Connects optional powered stereo speakers, headphones,
earbuds, a headset, or a television audio cable. Also connects an
optional headset microphone. This jack does not support optional
standalone microphones.
WARNING! To reduce the risk of personal injury, adjust the
volume before putting on headphones, earbuds, or a headset. For
additional safety information, see the Regulatory, Safety, and Environmental Notices.
To access this guide:
▲ Type HP Documentation in the taskbar search box, and
then select HP Documentation.
NOTE: When a device is connected to the jack, the computer
speakers are disabled.
NOTE: The security cable is designed to act as a deterrent, but it
might not prevent the computer from being mishandled or stolen.
Use the illustration and table to identify the display components.
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Table 2-3 Display components and their descriptions
ComponentDescription
(1)WLAN antennas*Send and receive wireless signals to communicate with wireless local
(2)Ambient light sensorAdjusts the brightness of the display, depending on the ambient light.
(3)Internal microphones (2)Record sound.
(4)Camera light(s)On: One or more cameras are in use.
(5)CameraAllows you to video chat, record video, and record still images. Some
(6)User-proximity sensorUses facial recognition to monitor your presence in front of the
(7)WWAN antennas (select products only)*Send and receive wireless signals to communicate with wireless wide
*The antennas are not visible from the outside of the computer. For optimal transmission, keep the areas immediately around the
antennas free from obstructions.
For wireless regulatory notices, see the section of the Regulatory, Safety, and Environmental Notices that applies to your country or region.
To access this guide:
area networks.
cameras also allow a facial recognition logon to Windows, instead of a
password logon.
NOTE: Camera functions vary depending on the camera hardware
and software installed on your product.
computer to save power and add security. When you step away from
the computer, the sensor puts the computer into the Sleep state. When
you return to your computer, the sensor recognizes you and wakes the
computer without a key press or mouse movement.
area networks.
▲ Type HP Documentation in the taskbar search box, and then select HP Documentation.
8Chapter 2 ComponentsENWW
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Keyboard area
ENWWKeyboard area9
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Touchpad
Touchpad settings
Use the illustration and table to identify the touchpad components.
To adjust touchpad settings and gestures, or to turn o the touchpad:
1.Type touchpad settings in the taskbar search box, and then press enter.
2.Choose a setting.
To turn on the touchpad:
1.Type touchpad settings in the taskbar search box, and then press enter.
2.2. Using an external mouse, click the Touchpad button.
– or –
▲Press the Tab key repeatedly until the pointer rests on the Touchpad button. Then press the spacebar to
select the button.
Table 2-4 Touchpad components and their descriptions
ComponentDescription
(1)Touchpad zoneReads nger gestures to move the pointer or activate items on
the screen.
(2)Left touchpad buttonFunctions like the left button on an external mouse.
(3)Near Field Communications (NFC) tapping area
and antenna (select products only)*
(4)Right touchpad buttonFunctions like the right button on an external mouse.
Allows you to wirelessly share information when you tap it with an
NFC-enabled device.
10Chapter 2 ComponentsENWW
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Lights
Use the illustration and table to identify the lights on the computer.
Table 2-5 Lights and their descriptions
ComponentDescription
(1)Caps lock lightOn: Caps lock is on, which switches the key input to all capital
letters.
(2)Privacy key lightOn: Privacy screen is on, which helps prevent side-angle viewing.
(3)Mute light●On: Computer sound is o.
●O: Computer sound is on.
(4)Microphone mute light●On: Microphone is o.
●O: Microphone is on.
(5)Camera privacy light●On: The camera is o.
●O: The camera is on.
(6)Power light●On: The computer is on.
●Blinking (select products only): The computer is in the Sleep
state, a power-saving state. The computer shuts o power to
the display and other unnecessary components.
●O: Depending on your computer model, the computer is o,
in Hibernation, or in Sleep. Hibernation is the power-saving
state that uses the least amount of power.
(7)Fn lock lightOn: The fn key is locked.
ENWWKeyboard area11
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Button, speakers, and ngerprint reader
Use the illustration and table to identify the button, speakers, and ngerprint reader on the computer.
IMPORTANT: To verify that your computer supports ngerprint reader sign-in, type Sign-in options in
the taskbar search box and follow the on-screen instructions. If Fingerprint reader is not listed as an option, then
your notebook does not include a ngerprint reader.
Table 2-6 Button, speaker, and ngerprint reader components and their descriptions
ComponentDescription
(1)Speakers (2)Produce sound.
12Chapter 2 ComponentsENWW
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Table 2-6 Button, speaker, and ngerprint reader components and their descriptions (continued)
ComponentDescription
(2)Power button●When the computer is o, press the button briey to turn on
(3)Fingerprint readerAllows a ngerprint logon to Windows, instead of a password
the computer.
●When the computer is on, press the button briey to initiate
Sleep.
●When the computer is in the Sleep state, press the button
briey to exit Sleep (select products only).
●When the computer is in Hibernation, press the button briey
to exit Hibernation.
IMPORTANT: Pressing and holding down the power button results
in the loss of unsaved information.
If the computer has stopped responding and shutdown procedures
are ineective, press and hold the power button for at least 4
seconds to turn o the computer.
To learn more about your power settings, see your power options.
▲ Right-click the Power meter icon and then select
Power Options.
logon.
▲ Touch your nger to the ngerprint reader.
Special keys
Use the illustration and table to identify the special keys on the computer.
IMPORTANT: To prevent ngerprint logon issues, make sure
when you register your ngerprint that all sides of your nger
are registered by the ngerprint reader.
ENWWKeyboard area13
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Table 2-7 Special keys and their descriptions
ComponentDescription
(1)esc keyDisplays system information when pressed in combination with the
(2)fn keyExecutes frequently used system functions when pressed in
(3)Windows keyOpens the Start menu.
(4)Action keysExecute frequently used system functions as dened by the icon
(5)Fingerprint readerAllows a ngerprint logon to Windows, instead of a password
(6)Camera privacy keyTurns the camera o (shutter closed) and on.If you record video
(7)Power button●When the computer is o, press the button briey to turn on
fn key.
combination with another key. Such key combinations are called
hot keys.
NOTE: Pressing the Windows key again will close the Start menu.
symbols on f1 through f12 function keys.
logon.
▲ Touch your nger to the ngerprint reader.
IMPORTANT: To prevent ngerprint logon issues, make sure
when you register your ngerprint that all sides of your nger
are registered by the ngerprint reader.
when the camera is o (shutter closed), audio will still record.
the computer.
●When the computer is on, press the button briey to initiate
Sleep.
Hot keys (select products only)
Use the illustration and table to identify the hot keys on the computer.
A hot key is the combination of the fn key and another key.
To use a hot key:
●When the computer is in the Sleep state, press the button
briey to exit Sleep (select products only).
●When the computer is in Hibernation, press the button briey
to exit Hibernation.
IMPORTANT: Pressing and holding down the power button results
in the loss of unsaved information.
If the computer has stopped responding and shutdown procedures
are ineective, press and hold the power button for at least 4
seconds to turn o the computer.
To learn more about your power settings, see your power options.
▲ Right-click the Power meter icon and then select
Power Options.
14Chapter 2 ComponentsENWW
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▲Press the fn key, and then press one of the keys listed in the following table.
Table 2-8 Hot keys and their descriptions
Bottom
Use the illustration and table to identify the bottom components.
KeyDescription
CTurns on scroll lock.
RBreaks the operation.
SSends a programming query.
WPauses the operation.
Table 2-9 Bottom components and their descriptions
ComponentDescription
(1)SpeakersProduce sound.
(2)VentEnables airow to cool internal components.
NOTE: The computer fan starts up automatically to cool
internal components and prevent overheating. It is normal
for the internal fan to cycle on and o during routine
operation.
Top cover
Use the illustration and table to identify the top cover components.
ENWWBottom15
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Rear
Table 2-10 Top cover component and its description
ComponentDescription
Internal microphones (2)Record sound.
Use the illustration and table to identify the rear components.
Table
2-11 Rear component and its description
ComponentDescription
VentEnables airow to cool internal components.
NOTE: The computer fan starts up automatically to
cool internal components and prevent overheating. It is
normal for the internal fan to cycle on and o during
routine operation.
Labels
Use the illustration and table to identify the label location and components.
The labels axed to the computer provide information you might need when you troubleshoot system problems
or travel internationally with the computer. Labels might be in paper form or imprinted on the product.
16Chapter 2 ComponentsENWW
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IMPORTANT: Check the following locations for the labels described in this section: the bottom of the computer,
inside the battery bay, under the service door, on the back of the display, or on the bottom of a tablet kickstand.
●Service label—Provides important information to identify your computer. When contacting support, you
might be asked for the serial number, the product number, or the model number. Locate this information
before you contact support.
Your service label will resemble one of the examples shown below. Refer to the illustration that most
closely matches the service label on your computer.
Table 2-12 Service label components and their descriptions
Component
(1)HP product name
(2)Warranty period
(3)Product ID
(4)Serial number
Table 2-13 Service label components and their descriptions
Component
(1)HP product name
(2)Model number
(3)Product ID
(4)Serial number
(5)Warranty period
ENWWLabels17
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Table 2-14 Service label components and their descriptions
Component
(1)HP product name
(2)Product ID
(3)Serial number
(4)Warranty period
Inserting a nano SIM card (select products only)
To insert a SIM card, follow these steps.
IMPORTANT: Inserting a SIM card of the wrong size or inserting the SIM tray in the wrong direction could
damage the SIM card, damage internal components, or cause the SIM card to become stuck in the slot. Do not
use SIM card adapters. To prevent damage to the SIM tray and internal connectors of the computer, use minimal
force when you insert or remove a SIM tray. Be sure to insert the SIM tray in the same orientation as it was when
you removed it.
Before purchasing a SIM card, follow these instructions to determine the correct SIM card size for your computer:
1.Go to http://www.hp.com/support, and then search for your computer by product name or number.
2.Select Product Information.
3.Refer to the listed options to determine which card to purchase.
To insert a SIM card, follow these steps:
1.Position the computer display-side up on a at surface.
2.Press in gently on the SIM tray (1) to release the tray.
3.Holding the end of the tray, pull the tray (2) straight out from the computer, and then insert the SIM card
(3).
NOTE: Be sure that the SIM card and SIM tray are properly aligned.
4.Replace the tray in the computer with the same orientation as it was when you removed it. Press in gently
on the tray (4) until it is rmly seated.
NOTE: The SIM tray in your computer might look slightly dierent from the illustration in this section.
18Chapter 2 ComponentsENWW
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To remove the card:
1.Release the SIM tray as described previously, and then remove the card.
2.Replace the tray in the computer. Press in gently on the tray until it is rmly seated.
ENWWInserting a nano SIM card (select products only)19
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20Chapter 2 ComponentsENWW
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3Illustrated parts catalog
Use this table to determine the spare parts that are available for the computer.
Computer major components
To identify the computer major components, use this illustration and table.
NOTE: HP continually improves and changes product parts. For complete and current information about
supported parts for your computer, go to http://partsurfer.hp.com, select your country or region, and then follow
the on-screen instructions.
NOTE: Details about your computer, including model, serial number, product key, and length of warranty, are
on the service tag on the bottom of your computer.
ENWWComputer major components21
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Table 3-1 Computer major component descriptions and part numbers
Table 3-1 Computer major component descriptions and part numbers (continued)
ItemComponentSpare part number
Top cover/keyboard equipped with backlight and privacy lter for use only on computer models with WWAN capability (includes
backlight cable and keyboard cable):
For use in BelgiumM16933-A41
For use in BrazilM16933-211
For use in BulgariaM16933-261
For use in CanadaM16933-DB1
For use in the Czech Republic and SlovakiaM16933-FL1
For use in DenmarkM16933-081
For use in Denmark, Finland, and NorwayM16933-DH1
For use in FranceM16933-051
For use in GermanyM16933-041
For use in GreeceM16933-151
For use in HungaryM16933-201
For use in IcelandM16933-DD1
For use in IndiaM16933-D61
For use in IsraelM16933-BB1
For use in ItalyM16933-061
For use in JapanM16933-291
For use in Latin AmericaM16933-161
For use in the NetherlandsM16933-B31
For use in Northwest AfricaM16933-FP1
For use in NorwayM16933-091
For use in PortugalM16933-131
For use in RomaniaM16933-271
For use in RussiaM16933-251
For use in Saudi ArabiaM16933-171
For use in SloveniaM16933-BA1
For use in South KoreaM16933-AD1
For use in SpainM16933-071
For use in Sweden and FinlandM16933-B71
For use in SwitzerlandM16933-BG1
For use in TaiwanM16933-AB1
For use in ThailandM16933-281
For use in TurkeyM16933-141
ENWWComputer major components23
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Table 3-1 Computer major component descriptions and part numbers (continued)
ItemComponentSpare part number
For use in Turkey-FM16933-541
For use in the UkraineM16933-BD1
For use in the United KingdomM16933-031
For use in the United StatesM16933-001
Top cover/keyboard equipped with backlight and privacy lter for use only on computer models not equipped with WWAN
capability (includes backlight cable and keyboard cable):
For use in BelgiumM16931-A41
For use in BrazilM16931-211
For use in BulgariaM16931-261
For use in CanadaM16931-DB1
For use in the Czech Republic and SlovakiaM16931-FL1
For use in DenmarkM16931-081
For use in Denmark, Finland, and NorwayM16931-DH1
For use in FranceM16931-051
For use in GermanyM16931-041
For use in GreeceM16931-151
For use in HungaryM16931-201
For use in IcelandM16931-DD1
For use in IndiaM16931-D61
For use in IsraelM16931-BB1
For use in ItalyM16931-061
For use in JapanM16931-291
For use in Latin AmericaM16931-161
For use in the NetherlandsM16931-B31
For use in Northwest AfricaM16931-FP1
For use in NorwayM16931-091
For use in PortugalM16931-131
For use in RomaniaM16931-271
For use in RussiaM16931-251
For use in Saudi ArabiaM16931-171
For use in SloveniaM16931-BA1
For use in South KoreaM16931-AD1
For use in SpainM16931-071
For use in Sweden and FinlandM16931-B71
24Chapter 3 Illustrated parts catalogENWW
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Table 3-1 Computer major component descriptions and part numbers (continued)
ItemComponentSpare part number
For use in SwitzerlandM16931-BG1
For use in TaiwanM16931-AB1
For use in ThailandM16931-281
For use in TurkeyM16931-141
For use in Turkey-FM16931-541
For use in the UkraineM16931-BD1
For use in the United KingdomM16931-031
For use in the United StatesM16931-001
Top cover/keyboard equipped with backlight for use only on computer models with WWAN capability (includes backlight cable
and keyboard cable):
For use in BelgiumM16932-A41
For use in BrazilM16932-211
For use in BulgariaM16932-261
For use in CanadaM16932-DB1
For use in the Czech Republic and SlovakiaM16932-FL1
For use in DenmarkM16932-081
For use in Denmark, Finland, and NorwayM16932-DH1
For use in FranceM16932-051
For use in GermanyM16932-041
For use in GreeceM16932-151
For use in HungaryM16932-201
For use in IsraelM16932-BB1
For use in ItalyM16932-061
For use in JapanM16932-291
For use in Latin AmericaM16932-161
For use in the NetherlandsM16932-B31
For use in Northwest AfricaM16932-FP1
For use in NorwayM16932-091
For use in PortugalM16932-131
For use in RomaniaM16932-271
For use in RussiaM16932-251
For use in Saudi ArabiaM16932-171
For use in SloveniaM16932-BA1
For use in South KoreaM16932-AD1
ENWWComputer major components25
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Table 3-1 Computer major component descriptions and part numbers (continued)
ItemComponentSpare part number
For use in SpainM16932-071
For use in Sweden and FinlandM16932-B71
For use in SwitzerlandM16932-BG1
For use in ThailandM16932-281
For use in TurkeyM16932-141
For use in Turkey-FM16932-541
For use in the UkraineM16932-BD1
For use in the United KingdomM16932-031
For use in the United StatesM16932-001
Top cover/keyboard equipped with backlight for use only on computer models not equipped with WWAN capability (includes
backlight cable and keyboard cable):
For use in BelgiumM16930-A41
For use in BrazilM16930-211
For use in BulgariaM16930-261
For use in CanadaM16930-DB1
For use in the Czech Republic and SlovakiaM16930-FL1
For use in DenmarkM16930-081
For use in Denmark, Finland, and NorwayM16930-DH1
For use in FranceM16930-051
For use in GermanyM16930-041
For use in GreeceM16930-151
For use in HungaryM16930-201
For use in IcelandM16930-DD1
For use in IndiaM16930-D61
For use in IsraelM16930-BB1
For use in ItalyM16930-061
For use in JapanM16930-291
For use in Latin AmericaM16930-161
For use in the NetherlandsM16930-B31
For use in Northwest AfricaM16930-FP1
For use in NorwayM16930-091
For use in PortugalM16930-131
For use in RomaniaM16930-271
For use in RussiaM16930-251
26Chapter 3 Illustrated parts catalogENWW
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Table 3-1 Computer major component descriptions and part numbers (continued)
ItemComponentSpare part number
For use in Saudi ArabiaM16930-171
For use in SloveniaM16930-BA1
For use in South KoreaM16930-AD1
For use in SpainM16930-071
For use in Sweden and FinlandM16930-B71
For use in SwitzerlandM16930-BG1
For use in ThailandM16930-281
For use in TurkeyM16930-141
For use in Turkey-FM16930-541
For use in the UkraineM16930-BD1
For use in the United KingdomM16930-031
For use in the United StatesM16930-001
(3)WWAN antenna (includes left and right antenna cables and transceivers)M20836-001
(4a)Touchpad:
NOTE: The touchpad spare part kit does not include the touchpad bracket or touchpad cable. The touchpad bracket is not
available as a spare part. The touchpad cable is available in the Cable Kit, spare part number M20835-001.
For use only on computer models equipped with NFC capabilityM16010-001
For use only on computer models not equipped with NFC capabilityM16005-001
(4b)Touchpad bracket: The touchpad bracket is not available as a spare part.
(4c)Touchpad cable: The touchpad cable is available in the Cable Kit, spare part number M20835-001.
(5a)NFC module:
NOTE: The NFC module spare part kit does not include the NFC module cable. The NFC module cable
is available in the Cable Kit, spare part number M20835-001.
(5b)NFC module cable: The NFC module cable is available in the Cable Kit, spare part number M20835-001.
(6a)Solid-state drive:
2 TB, M.2 2280, PCIe-NVMe 3×4, SS solid-state drive with TLCL85358-005
1 TB, M.2 2280, PCIe-NVMe 3×4, SS solid-state drive with TLCL85348-005
512 GB, M.2 2280, PCIe-3×4, SS solid-state drive with TLCL85360-005
512 GB, M.2 2280, PCIe, NVMe, SED solid-state drive with TLCL85368-005
512 GB, M.2 2280, PCIe, NVMe, value solid-state driveL85364-005
256 GB, M.2 2280, PCIe-3×4, SS solid-state drive with TLCL85350-005
M16045-001
256 GB, M.2 2280, PCIe, NVMe, SED solid-state drive with TLCM07245-005
256 GB, M.2 2280, PCIe, NVMe, value solid-state driveL85354-005
128 GB, M.2 2280, SATA-3 solid-state drive with TLCL85346-005
ENWWComputer major components27
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Table 3-1 Computer major component descriptions and part numbers (continued)
To identify the cables, use this illustration and table.
30Chapter 3 Illustrated parts catalogENWW
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Table 3-3 Cable descriptions and part numbers
ItemComponent
NOTE: The following cables are available in the Cable Kit, spare part number M20835-001.
(1)Touchpad cable
(2)NFC module cable
(3)Connector board cable
(4)Sensor board cable
Miscellaneous parts
To identify the miscellaneous parts, use this table.
Table
3-4 Miscellaneous part descriptions and part numbers
ComponentSpare part number
AC adapter:
90 W AC adapter, (PFC, S-3P, 4.5 mm)710413-001
65 W AC adapter, (non-PFC, slim, USB Type-C, straight, 1.8 m)L04650-850
65 W AC adapter (non-PFC, USB Type-C, RC, 1.8 m)L32392-001
65 W AC adapter (non-PFC, USB Type-C, 1.8 m)L67440-001
HP USB Type-C–to–RJ45 adapter855560-001
Bracket Kit (includes the WWAN bracket)M16009-001
HP USB Type-C male–to–USB Type-C male cable (1 m)L65253-001
Cable Kit (includes the connector board cable, NFC module cable, sensor board cable, and touchpad cable)M20835-001
Dock:
ENWWMiscellaneous parts31
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Table 3-4 Miscellaneous part descriptions and part numbers (continued)
ComponentSpare part number
Thunderbolt® dock (120 W with cable)L15809-001
HP USB Type-C dockL16133-001
HP USB Type-A/C universal dock (includes cable)L64087-001
HP USB Type-C mini dock935327-001
Thunderbolt dock (120 W with cable)L15809-001
Duckhead adapter:
C5NS, premium, sticker, black, for use in North AmericaL50818-002
C5NS, premium, sticker, black, for use in South KoreaL50818-001
HP USB stereo headset840340-001
HP nano lock918431-001
Miscellaneous Kit (includes battery gaskets [2], battery support sponges [2], and keyboard support
rubber)
Mouse:
HP comfort grip wireless mouse691922-001
HP USB laser mouse674318-001
HP USB travel mouse757770-001
HP AES 2.0 pen with app buttonL57041-001
Power cord (C5, conventional, with sticker, 1.8 m):
ArgentinaL19357-002
AustraliaL19358-002
BrazilL19359-002
DenmarkL19360-002
EuropeL19361-002
IndiaL19363-002
IsraelL19362-002
ItalyL19364-002
JapanL19365-002
M16036-001
North AmericaL19367-002
The People's Republic of ChinaL19368-002
South AfricaL19369-002
South KoreaL19366-002
SwitzerlandL19370-002
The United KingdomL19373-002
Power cord (C5, premium, 1.8 m):
32Chapter 3 Illustrated parts catalogENWW
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Table 3-4 Miscellaneous part descriptions and part numbers (continued)
ComponentSpare part number
ArgentinaL30811-001
AustraliaL22327-001
BrazilL30812-001
DenmarkL22322-001
EuropeL22321-001
IndiaL22624-001
IsraelL22323-001
ItalyL30813-001
JapanL22330-001
North AmericaL22319-001
The People's Republic of ChinaL21930-001
South AfricaL22325-001
South KoreaL22328-001
SwitzerlandL22324-001
TaiwanL22329-001
ThailandL22326-001
The United KingdomL22320-001
Power cord (C5, FDH, premium, 1.0 m):
ArgentinaL36815-001
AustraliaL36816-001
BrazilL44789-001
DenmarkL36817-001
EuropeL36818-001
IndiaL36820-001
IsraelL36819-001
ItalyL44788-001
North AmericaL36822-001
The People's Republic of ChinaL36823-001
South AfricaL36824-001
SwitzerlandL36825-001
TaiwanL36827-001
ThailandL36826-001
The United KingdomL36828-001
ENWWMiscellaneous parts33
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Table 3-4 Miscellaneous part descriptions and part numbers (continued)
ComponentSpare part number
Power cord (C5, conventional, with sticker, 1.0 m):
ArgentinaL19357-001
AustraliaL19358-001
BrazilL19359-001
DenmarkL19360-001
EuropeL19361-001
IndiaL19363-001
IsraelL19362-001
ItalyL19364-001
North AmericaL19365-001
The People's Republic of ChinaL19367-001
South AfricaL19368-001
SwitzerlandL19369-001
TaiwanL19366-001
ThailandL19370-001
The United KingdomL19373-001
Power cord for use in Brazil (C5, 1.0 m)438722-001
Screw KitM16008-001
34Chapter 3 Illustrated parts catalogENWW
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4Removal and replacement procedures
preliminary requirements
Use this information to properly prepare to disassemble and reassemble the computer.
Tools required
You need the following tools to complete the removal and replacement procedures:
●Magnetic Phillips P1 screwdriver
●Nonconductive, nonmarking pry tool
●Torx T6 screwdriver
●Tweezers
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Service considerations
The following sections include some of the considerations that you must keep in mind during disassembly and
assembly procedures.
NOTE: As you remove each subassembly from the computer, place the subassembly (and all accompanying
screws) away from the work area to prevent damage.
Plastic parts
Using excessive force during disassembly and reassembly can damage plastic parts.
Cables and connectors
Handle cables with extreme care to avoid damage.
IMPORTANT: When servicing the computer, be sure that cables are placed in their proper locations during the
reassembly process. Improper cable placement can damage the computer.
Apply only the tension required to unseat or seat the cables during removal and insertion. Handle cables by the
connector whenever possible. In all cases, avoid bending, twisting, or tearing cables. Be sure that cables are
routed so that they cannot be caught or snagged as you remove or replace parts. Handle ex cables with
extreme care; these cables tear easily.
Drive handling
Note the following guidelines when handling drives.
IMPORTANT: Drives are fragile components. Handle them with care. To prevent damage to the computer,
damage to a drive, or loss of information, observe these precautions:
Before removing or inserting a hard drive, shut down the computer. If you are unsure whether the computer is
o or in Hibernation, turn the computer on, and then shut it down through the operating system.
Before handling a drive, be sure that you are discharged of static electricity. While handling a drive, avoid
touching the connector.
Before removing an optical drive, be sure that a disc is not in the drive, and be sure that the optical drive tray is
closed.
Handle drives on surfaces covered with at least 2.54 cm (1 inch) of shock-proof foam.
Avoid dropping drives from any height onto any surface.
After removing a hard drive or an optical drive, place it in a static-proof bag.
Avoid exposing an internal hard drive to products that have magnetic elds, such as monitors or speakers.
Avoid exposing a drive to temperature extremes or liquids.
If a drive must be mailed, place the drive in a bubble pack mailer or other suitable form of protective packaging,
and label the package “FRAGILE.”
Workstation guidelines
Follow these grounding workstation guidelines:
36Chapter 4 Removal and replacement procedures preliminary requirementsENWW
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●Cover the workstation with approved static-shielding material.
●Use a wrist strap connected to a properly grounded work surface and use properly grounded tools and
equipment.
●Use conductive eld service tools, such as cutters, screw drivers, and vacuums.
●When xtures must directly contact dissipative surfaces, use xtures made only of static-safe materials.
●Keep the work area free of nonconductive materials, such as ordinary plastic assembly aids
and polystyrene foam.
●Handle ESD-sensitive components, parts, and assemblies by the case or PCM laminate. Handle these items
only at static-free workstations.
●Avoid contact with pins, leads, or circuitry.
●Turn o power and input signals before inserting or removing connectors or test equipment.
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Electrostatic discharge information
A sudden discharge of static electricity from your nger or other conductor can destroy static-sensitive devices
or microcircuitry. Often the spark is neither felt nor heard, but damage occurs. An electronic device exposed to
electrostatic discharge (ESD) might not appear to be aected at all and can work perfectly throughout a normal
cycle. The device might function normally for a while, but it has been degraded in the internal layers, reducing its
life expectancy.
Networks built into many integrated circuits provide some protection, but in many cases, the discharge contains
enough power to alter device parameters or melt silicon junctions.
IMPORTANT: To prevent damage to the device when you remove or install internal components, observe these
precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Before touching an electronic component, discharge static electricity by using the guidelines described Personal
grounding methods and equipment on page 39.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
Generating static electricity
Follow these static electricity guidelines.
●Dierent activities generate dierent amounts of static electricity.
●Static electricity increases as humidity decreases.
Table
4-1 Static electricity occurrence based on activity and humidity
Relative humidity
Event55%40%10%
Walking across carpet
Walking across vinyl oor
Motions of bench worker
Removing DIPs (dual in-line packages) from plastic tube
Removing DIPs from vinyl tray
Removing DIPs from polystyrene foam
Removing bubble pack from PCB (printed circuit board)
Packing PCBs in foam-lined box
Multiple electric components can be packaged together in plastic tubes, trays, or polystyrene foam.
7,500 V
3,000 V
400 V
400 V
2,000 V
3,500 V
7,000 V
5,000 V
15,000 V
5,000 V
800 V
700 V
4,000 V
5,000 V
20,000 V
11,000 V
35,000 V
12,000 V
6,000 V
2,000 V
11,500 V
14,500 V
26,500 V
21,000 V
NOTE: As little as 700 V can degrade a product.
38Chapter 4 Removal and replacement procedures preliminary requirementsENWW
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Preventing electrostatic damage to equipment
Many electronic components are sensitive to ESD. Circuitry design and structure determine the degree of
sensitivity. The following packaging and grounding precautions are necessary to prevent static electricity
damage to electronic components.
●To avoid hand contact, transport products in static-safe containers such as tubes, bags, or boxes.
●Protect all electrostatic parts and assemblies with conductive or approved containers or packaging.
●Keep electrostatic-sensitive parts in their containers until they arrive at static-free stations.
●Place items on a grounded surface before removing them from their container.
●Always be properly grounded when touching a sensitive component or assembly.
●Avoid contact with pins, leads, or circuitry.
●Place reusable electrostatic-sensitive parts from assemblies in protective packaging or conductive foam.
Personal grounding methods and equipment
Using certain equipment can prevent static electricity damage to electronic components.
●Wrist straps are exible straps with a maximum of 1 MΩ ±10% resistance in the ground cords. To provide
proper ground, a strap must be worn snug against bare skin. The ground cord must be connected and t
snugly into the banana plug connector on the grounding mat or workstation.
●Heel straps/Toe straps/Boot straps can be used at standing workstations and are compatible with most
types of shoes or boots. On conductive oors or dissipative oor mats, use them on both feet with a
maximum of 1 MΩ ±10% resistance between the operator and ground.
Table
4-2 Static shielding protection levels
Static shielding protection levels
MethodVoltage
Antistatic plastic
Carbon-loaded plastic
Metallized laminate
Grounding the work area
To prevent static damage at the work area, follow these precautions.
●Cover the work surface with approved static-dissipative material. Provide a wrist strap connected to the
work surface and properly grounded tools and equipment.
●Use static-dissipative mats, foot straps, or air ionizers to give added protection.
●Handle electrostatic sensitive components, parts, and assemblies by the case or PCB laminate. Handle
them only at static-free work areas.
1,500
7,500
15,000
●Turn o power and input signals before inserting and removing connectors or test equipment.
●Use xtures made of static-safe materials when xtures must directly contact dissipative surfaces.
ENWWElectrostatic discharge information39
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●Keep work area free of nonconductive materials such as ordinary plastic assembly aids and polystyrene
foam.
●Use eld service tools, such as cutters, screwdrivers, and vacuums, that are conductive.
Recommended materials and equipment
HP recommends certain materials and equipment to prevent static electricity.
●Antistatic tape
●Antistatic smocks, aprons, or sleeve protectors
●Conductive bins and other assembly or soldering aids
●Conductive foam
●Conductive tabletop workstations with ground cord of 1 MΩ ±10% resistance
●Static-dissipative table or oor mats with hard tie to ground
●Field service kits
●Static awareness labels
●Wrist straps and footwear straps providing 1 MΩ ±10% resistance
●Material handling packages
●Conductive plastic bags
●Conductive plastic tubes
●Conductive tote boxes
●Opaque shielding bags
●Transparent metallized shielding bags
●Transparent shielding tubes
Packaging and transporting guidelines
Follow these grounding guidelines when packaging and transporting equipment.
●To avoid hand contact, transport products in static-safe tubes, bags, or boxes.
●Protect ESD-sensitive parts and assemblies with conductive or approved containers or packaging.
●Keep ESD-sensitive parts in their containers until the parts arrive at static-free workstations.
●Place items on a grounded surface before removing items from their containers.
●Always be properly grounded when touching a component or assembly.
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●Store reusable ESD-sensitive parts from assemblies in protective packaging or nonconductive foam.
●Use transporters and conveyors made of antistatic belts and roller bushings. Be sure that mechanized
equipment used for moving materials is wired to ground and that proper materials are selected to avoid
static charging. When grounding is not possible, use an ionizer to dissipate electric charges.
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42Chapter 4 Removal and replacement procedures preliminary requirementsENWW
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5Removal and replacement procedures for
authorized service provider parts
This chapter provides removal and replacement procedures for authorized service provider parts.
IMPORTANT: Components described in this chapter should be accessed only by an authorized service provider.
Accessing these parts can damage the computer or void the warranty.
NOTE: Details about your computer, including model, serial number, product key, and length of warranty, are
on the service tag at the bottom of your computer.
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Component replacement procedures
To remove and replace computer components, use these procedures.
NOTE: HP continually improves and changes product parts. For complete and current information about
supported parts for your computer, go to http://partsurfer.hp.com, select your country or region, and then follow
the on-screen instructions.
You must remove, replace, or loosen as many as 42 screws when you service the parts described in this chapter.
Make special note of each screw size and location during removal and replacement.
Preparation for disassembly
To remove and replace computer components, use these procedures.
See Removal and replacement procedures preliminary requirements on page 35 for initial safety procedures.
1.Turn o the computer. If you are unsure whether the computer is o or in Hibernation, turn the computer
on, and then shut it down through the operating system.
2.Disconnect the power from the computer by unplugging the power cord from the computer.
3.Disconnect all external devices from the computer.
Bottom cover
To remove the bottom cover, use this procedure and illustration.
Table
5-1 Bottom cover description and part number
DescriptionSpare part number
For use only on computer models equipped with WWAN capabilityM16004-001
For use only on computer models not equipped with WWAN capabilityM16003-001
Before removing the bottom cover, prepare the computer for disassembly (Preparation for disassembly
on page 44).
Remove the bottom cover:
1.Remove the six Torx T6M2.0 × 5.0 screws that secure the bottom cover to the computer.
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2.Use a nonmarking, nonconductive tool (1) to release the rear edge (2) of the bottom cover from the
computer.
3.Remove the bottom cover (3) from the computer.
To replace the bottom cover, reverse the removal procedures.
Battery
To remove the battery, use this procedure and illustration.
5-2 Battery description and part number
Table
DescriptionSpare part number
Battery (4 cell, 78 Whr, 5.09 Ahr, LI)L84352-005
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WARNING! To avoid personal injury and damage to the product:
●Do not puncture, twist, or crack the battery.
●Do not cause an external puncture or rupture to the battery. They can cause a short inside the battery,
which can result in battery thermal runaway.
●Do not handle or touch the battery enclosure with sharp objects such as tweezers or pliers, which might
puncture the battery.
●Do not compress or squeeze the battery case with tools or heavy objects stacked on top of the case. These
actions can apply undue force on the battery.
●Do not touch the connectors with any metallic surface or object, such as metal tools, screws, or coins,
which can cause shorting across the connectors.
Before removing the battery, follow these steps:
1.Prepare the computer for disassembly (Preparation for disassembly on page 44).
2.Remove the bottom cover (Bottom cover on page 44).
WARNING! To reduce potential safety issues, use only the user-replaceable battery provided with the
computer, a replacement battery provided by HP, or a compatible battery purchased from HP.
IMPORTANT: Removing a battery that is the sole power source for the computer can cause loss of information.
To prevent loss of information, save your work or shut down the computer through Windows before you remove
the battery.
Remove the battery:
1.Disconnect the battery cable (1) from the system board.
2.Remove the ve Phillips M2.0 × 3.0 screws (2) that secure the battery to the computer.
3.Remove the battery (3) from the computer.
To install the battery, reverse the removal procedures.
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Solid-state drive
To remove the M.2 solid-state drive, use this procedure and illustration.
Table 5-3 Solid-state drive descriptions and part numbers
DescriptionSpare part number
2 TB, M.2 2280, PCIe-NVMe 3×4, SS solid-state drive with TLCL85358-005
1 TB, M.2 2280, PCIe-NVMe 3×4, SS solid-state drive with TLCL85348-005
512 GB, M.2 2280, PCIe-3×4, SS solid-state drive with TLCL85360-005
512 GB, M.2 2280, PCIe, NVMe, SED solid-state drive with TLCL85368-005
512 GB, M.2 2280, PCIe, NVMe, value solid-state driveL85364-005
256 GB, M.2 2280, PCIe-3×4, SS solid-state drive with TLCL85350-005
256 GB, M.2 2280, PCIe, NVMe, SED solid-state drive with TLCM07245-005
256 GB, M.2 2280, PCIe, NVMe, value solid-state driveL85354-005
128 GB, M.2 2280, SATA-3 solid-state drive with TLCL85346-005
Before removing the solid-state drive, follow these steps:
1.Prepare the computer for disassembly (Preparation for disassembly on page 44).
2.Remove the bottom cover (Bottom cover on page 44).
3.Disconnect the battery cable from the system board the battery (see Battery on page 45).
Remove the solid-state drive:
1.Remove the solid-state drive from the system board.
NOTE: The solid-state drive shield is not available as a spare part.
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2.Remove the Phillips PM2.0 × 3.0 screw (1) that secures the solid-state drive to the system board.
3.Pull the drive (2) away from the socket to remove it.
NOTE: Solid-state drives are designed with a notch to prevent incorrect insertion.
WWAN module
To remove the WWAN module, use this procedure and illustration.
5-4 WWAN module descriptions and part numbers
Table
DescriptionSpare part number
Intel XMM 7360 LTE-Advanced (Cat 9)L70670-005
Qualcomm X55 LTE+5GL83053-005
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IMPORTANT: To prevent an unresponsive system, replace the wireless module only with a wireless module
authorized for use in the computer by the governmental agency that regulates wireless devices in your country
or region. If you replace the module and then receive a warning message, remove the module to restore device
functionality, and then contact technical support.
Before removing the WWAN module, follow these steps:
1.Prepare the computer for disassembly (Preparation for disassembly on page 44).
2.Remove the bottom cover (Bottom cover on page 44).
3.Disconnect the battery cable from the system board the battery (see Battery on page 45).
Remove the WWAN module:
1.Disconnect the WWAN antenna cables (1) from the terminals on the WWAN module.
NOTE: The #5/blue WWAN antenna cable connects to the WWAN module #5/Main terminal. The #6/red
WWAN antenna cable connects to the WWAN module #6/Aux terminal.
2.Remove the Phillips M2.0 × 3.0 screw (2) that secures the WWAN module to the top cover/keyboard. (The
WWAN module tilts up.)
3.Remove the WWAN module (3) by pulling the module away from the slot at an angle.
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4.If the WWAN antenna is not connected to the terminal on the WWAN module, a protective sleeve must be
installed on the antenna connector, as shown in the following illustration.
Reverse this procedure to install the WWAN module.
Connector board cable
To remove the connector board cable, use this procedure and illustration.
NOTE: The connector board cable is available in the Cable Kit, spare part number M20833-001.
Before removing the connector board cable, follow these steps:
1.Prepare the computer for disassembly (Preparation for disassembly on page 44).
2.Remove the bottom cover (Bottom cover on page 44).
3.Disconnect the battery cable from the system board the battery (see Battery on page 45).
Remove the connector board cable:
1.Release the zero insertion force (ZIF) connector (1) to which the connector board cable is connected, and
then disconnect the cable from the system board.
2.Release the ZIF connector (2) to which the connector board cable is connected, and then disconnect the
cable from the connector board.
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3.Remove the connector board cable (3).
Reverse this procedure to install the connector board cable.
Connector board
To remove the connector board, use this procedure and illustration.
Table
5-5 Connector board description and part number
DescriptionSpare part number
Connector board (includes audio-out (headphone)/audio-in (microphone) combo jack, nano SIM card slot
(select products only), and USB SuperSpeed port)
NOTE: The connector board spare part kit does not include the connector board cable. The connector board
cable is available in the Cable Kit, spare part number M20835-001.
M16050-001
Before removing the connector board, follow these steps:
1.Prepare the computer for disassembly (Preparation for disassembly on page 44).
2.Remove the bottom cover (Bottom cover on page 44).
3.Disconnect the battery cable from the system board the battery (see Battery on page 45).
4.Remove the WWAN module (see WWAN module on page 48).
Remove the connector board:
1.Remove the nano SIM tray (1) from the mini media card reader slot.
The nano SIM tray is available using spare part number M16053-001.
2.Release the ZIF connector (2) to which the connector board cable is connected, and then disconnect the
cable from the system board.
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3.Remove the two Phillips M2.0 × 5.0 screws (3) that secure the connector board to the computer.
4.Remove the connector board (4) and cable.
Reverse this procedure to install the connector board.
Display assembly
To remove the display assembly, use these procedures and illustrations.
Before removing the display panel, follow these steps:
1.Prepare the computer for disassembly (Preparation for disassembly on page 44).
2.Remove the bottom cover (Bottom cover on page 44).
3.Disconnect the battery cable from the system board the battery (see Battery on page 45).
Remove the display assembly:
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1.Remove the WWAN module shield (1).
2.Disconnect the WLAN antenna cables (2) from the WLAN module terminals.
The #1/white WLAN antenna cable connects to the WLAN module #1/Main terminal. The #2/black WLAN
antenna cable connects to the WLAN module #2/Aux terminal.
3.Release the ZIF connector (3) to which the webcam/microphone module cable is connected, and disconnect
the cable from the system board.
4.Release the WLAN antenna cables and the webcam/microphone module cable from the retention clip (4)
built into the top cover/keyboard.
5.Release the ZIF connector (5) to which the display panel cable is connected, and disconnect the cable from
the system board.
6.Release the display panel cable from the retention clip (6) built into the top cover/keyboard.
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7.Remove the six Phillips M2.0 × 6.0 screws that secure the display assembly to the computer.
8.Swing the top edge of the display assembly (1) away from the top cover/keyboard. (The top cover/
keyboard disengages from the display assembly hinges.)
Speakers
9.Separate the display assembly (2) from the top cover/keyboard.
Reverse this procedure to install the display assembly.
To remove the speakers, use this procedure and illustration.
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Table 5-7 Speaker description and part number
DescriptionSpare part number
Speakers (includes left and right speakers, cables, and rubber isolators)M16007-001
Before removing the speakers, follow these steps:
1.Prepare the computer for disassembly (Preparation for disassembly on page 44).
2.Remove the bottom cover (Bottom cover on page 44).
3.Remove the battery (see Battery on page 45).
Remove the speakers:
1.Detach the keyboard cable from the right speaker. (The keyboard cable is attached to the right speaker
with double-side adhesive.)
2.Disconnect the right speaker cable (1) from the system board.
3.Release the WWAN antenna cable from the retention channel (2) built into the right speaker.
4.Remove the three Phillips M2.0 × 3.5 screws (3) that secure the right speaker to the computer.
5.Remove the right speaker (4) .
NOTE: When removing the right speaker, make note of the location of the rubber isolator (5). The
absence of or damage to this isolator can result in degraded right speaker performance.
6.Disconnect the left speaker cable (1) from the system board.
7.Release the WWAN antenna cable from the retention channel (2) built into the left speaker.
8.Remove the three Phillips M2.0 × 3.5 screws (3) that secure the left speaker to the computer.
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9.Remove the left speaker (4) .
NOTE: When removing the left speaker, make note of the location of the rubber isolator (5). The absence
of or damage to this isolator can result in degraded left speaker performance.
Reverse this procedure to install the speakers.
Touchpad cable
To remove the touchpad cable, use this procedure and illustration.
NOTE: The touchpad cable is available in the Cable Kit, spare part number M20833-001.
Before removing the touchpad cable, follow these steps:
1.Prepare the computer for disassembly (Preparation for disassembly on page 44).
2.Remove the bottom cover (Bottom cover on page 44).
3.Remove the battery (see Battery on page 45).
Remove the touchpad cable:
1.Release the ZIF connector (1) to which the touchpad cable is connected, and then disconnect the cable
from the system board.
2.Release the ZIF connector (2) to which the touchpad cable is connected, and then disconnect the cable
from the touchpad.
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3.Remove the touchpad cable (3).
Reverse this procedure to install the touchpad cable.
Touchpad
To remove the touchpad, use this procedure and illustration.
Table
5-8 Touchpad description and part number
DescriptionSpare part number
For use only on computer models equipped with NFC capabilityM16010-001
For use only on computer models not equipped with NFC capabilityM16005-001
NOTE: The touchpad spare part kit does not include the touchpad bracket or touchpad cable. The touchpad bracket is not available as a
spare part. The touchpad cable is available in the Cable Kit, spare part number M20835-001.
Touchpad bracket: The touchpad bracket is not available as a spare part.
Before removing the touchpad, follow these steps:
1.Prepare the computer for disassembly (Preparation for disassembly on page 44).
2.Remove the bottom cover (Bottom cover on page 44).
3.Remove the battery (see Battery on page 45).
Remove the touchpad:
1.Detach the touchpad cable (1) from the top cover/keyboard. (The touchpad cable is attached to the top
cover/keyboard with double-sided adhesive.)
2.Release the ZIF connector (2) to which the touchpad cable is connected, and then disconnect the cable
from the system board.
Steps 3 and 4 apply only to computer models equipped with an NFC module and cable.
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3.Detach the NFC module cable (3) from the top cover/keyboard. (The NFC module cable is attached to the
top cover/keyboard with double-sided adhesive.).
4.Release the ZIF connector (4) to which the NFC module cable is connected, and then disconnect the cable
from the system board.
5.Fold back the keyboard cable (5) until the touchpad screws are accessible.
6.Remove the three Phillips M2.0 × 2.0 broad head screws (1) that secure the touchpad to the computer.
7.Remove the touchpad bracket (2).
NOTE: The touchpad bracket is not available as a spare part component.
8.Lift the front edge (3) of the touchpad until it clears the top cover/keyboard.
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9.Remove the touchpad from the computer (4).
Reverse this procedure to install the touchpad.
NFC module cable
To remove the NFC module cable, use this procedure and illustration.
NOTE: The NFC module cable is available in the Cable Kit, spare part number M20835-001.
Table 5-9 NFC module cable description and part number
DescriptionSpare part number
NFC module cable:
NOTE: The NFC module cable spare part kit does not include the NFC module cable cable. The NFC module
cable cable is available in the Cable Kit, spare part number M20835-001.
M16045-001
Before removing the NFC module cable, follow these steps:
1.Prepare the computer for disassembly (Preparation for disassembly on page 44).
2.Remove the bottom cover (Bottom cover on page 44).
3.Remove the battery (see Battery on page 45).
Remove the NFC module cable:
1.Detach the NFC module cable (1) from the top cover/keyboard. (The NFC module cable cable is attached to
the top cover/keyboard with double-sided adhesive.)
2.Release the ZIF connector (2) to which the NFC module cable cable is connected, and then disconnect the
cable from the system board.
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3.Release the ZIF connector (3) to which the NFC module cable cable is connected, and then disconnect the
cable from the NFC module.
4.Remove the NFC module cable.
Reverse this procedure to install the NFC module cable.
NFC module
To remove the NFC module, use this procedure and illustration.
Table
DescriptionSpare part number
NFC module cable:
NOTE: The NFC module cable spare part kit does not include the NFC module cable cable. The NFC module
cable cable is available in the Cable Kit, spare part number M20835-001.
Before removing the NFC module, follow these steps:
1.Prepare the computer for disassembly (Preparation for disassembly on page 44).
2.Remove the bottom cover (Bottom cover on page 44).
3.Remove the battery (see Battery on page 45).
Remove the NFC module:
1.Detach the NFC module cable cable (1) from the top cover/keyboard. (The NFC module cable cable is
5-10 NFC module cable description and part number
M16045-001
attached to the top cover/keyboard with double-sided adhesive.)
2.Release the ZIF connector (2) to which the NFC module cable cable is connected, and then disconnect the
cable from the system board.
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3.Detach the NFC module (3) from the top cover/keyboard. (The NFC module is attached to the top cover/
keyboard with double-sided adhesive.)
Reverse this procedure to install the NFC module.
System board
To remove the system board, use these procedures and illustrations.
Table
5-11 System board descriptions and part numbers
DescriptionSpare part
NOTE: All system board spare part kits include an integrated processor and replacement thermal material.
Equipped with an Intel Core i7-10810U processor, 32 GB of system memory, and the Windows 10 OSR operating
system
Equipped with an Intel Core i7-10810U processor, 32 GB of system memory, and a non-Windows OSR operating
system
Equipped with an Intel Core i7-10810U processor, 16 GB of system memory, and the Windows 10 OSR operating
system
Equipped with an Intel Core i7-10810U processor, 16 GB of system memory, and a non-Windows OSR operating
system
Equipped with an Intel Core i7-10810U processor, 8 GB of system memory, and the Windows 10 OSR operating system M16025-601
Equipped with an Intel Core i7-10810U processor, 8 GB of system memory, and a non-Windows OSR operating systemM16025-001
Equipped with an Intel Core i7-10710U processor, 32 GB of system memory, and the Windows 10 operating systemM16021-601
Equipped with an Intel Core i7-10710U processor, 32 GB of system memory, and a non-Windows operating systemM16021-001
number
M16024-601
M16024-001
M16023-601
M16023-001
Equipped with an Intel Core i7-10710U processor, 16 GB of system memory, and the Windows 10 operating systemM16020-601
Equipped with an Intel Core i7-10710U processor, 16 GB of system memory, and a non-Windows operating systemM16020-001
Equipped with an Intel Core i7-10710U processor, 8 GB of system memory, and the Windows 10 operating systemM16022-601
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Table 5-11 System board descriptions and part numbers (continued)
DescriptionSpare part
number
Equipped with an Intel Core i7-10710U processor, 8 GB of system memory, and a non-Windows operating systemM16022-001
Equipped with an Intel Core i7-10610U processor, 32 GB of system memory, and the Windows 10 OSR operating
system
Equipped with an Intel Core i7-10610U processor, 32 GB of system memory, and a non-Windows OSR operating
system
Equipped with an Intel Core i7-10610U processor, 16 GB of system memory, and the Windows 10 OSR operating
system
Equipped with an Intel Core i7-10610U processor, 16 GB of system memory, and a non-Windows OSR operating
system
Equipped with an Intel Core i7-10610U processor, 8 GB of system memory, and the Windows 10 OSR operating system M16019-601
Equipped with an Intel Core i7-10610U processor, 8 GB of system memory, and a non-Windows OSR operating systemM16019-001
Equipped with an Intel Core i5-10310U processor, 16 GB of system memory, and the Windows 10 OSR operating
system
Equipped with an Intel Core i5-10310U processor, 16 GB of system memory, and a non-Windows OSR operating
system
Equipped with an Intel Core i5-10310U processor, 16 GB of system memory, and the Windows 10 operating systemM16013-601
Equipped with an Intel Core i5-10310U processor, 16 GB of system memory, and a non-Windows operating systemM16013-001
Equipped with an Intel Core i5-10310U processor, 8 GB of system memory, and the Windows 10 OSR operating system M16016-601
Equipped with an Intel Core i5-10310U processor, 8 GB of system memory, and a non-Windows OSR operating systemM16016-001
Equipped with an Intel Core i5-10310U processor, 8 GB of system memory, and the Windows 10 operating systemM16015-601
M16018-601
M16018-001
M16017-601
M16017-001
M16014-601
M16014-001
Equipped with an Intel Core i5-10310U processor, 8 GB of system memory, and a non-Windows operating systemM16015-001
Equipped with an Intel Core i5-10210U processor, 16 GB of system memory, and the Windows 10 OSR operating
system
Equipped with an Intel Core i5-10210U processor, 16 GB of system memory, and a non-Windows OSR operating
system
Equipped with an Intel Core i5-10210U processor, 8 GB of system memory, and the Windows 10 operating systemM16012-601
Equipped with an Intel Core i5-10210U processor, 8 GB of system memory, and a non-Windows operating systemM16012-001
Nano SIM tray (not illustrated, for use only on computer models equipped with WWAN capability)M16053-001
M16011-601
M16011-001
Before removing the system board, follow these steps:
1.Prepare the computer for disassembly (Preparation for disassembly on page 44).
2.Remove the bottom cover (Bottom cover on page 44).
3.Disconnect the battery cable from the system board (see Battery on page 45).
When you replace the system board, be sure to remove the following components (as applicable) from the
defective system board and install them on the replacement system board:
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●Solid-state drive and shield (see Solid-state drive on page 47).
●WWAN module (see WWAN module on page 48).
●Fan/heat sink assembly (see Fan/heat sink assembly on page 64).
Sensor board and cable (see Sensor board on page 67).
●
Remove the system board:
1.Release the ZIF connector (1) to which the webcam/microphone module cable is connected, and disconnect
the cable from the system board.
2.Remove the WWAN module shield.
3.Disconnect the WLAN antenna cables (2) from the WLAN module terminals.
The #1/white WLAN antenna cable connects to the WLAN module #1/Main terminal. The #2/black WLAN
antenna cable connects to the WLAN module #2/Aux terminal.
4.Disconnect the following cables from the system board:
●Display panel cable ZIF connector cable (3)
●Right speaker cable (4)
●Keyboard ZIF connector cable (5)
●Touchpad ZIF connector cable (6)
●Backlight ZIF connector cable (7)
●Fingerprint reader ZIF connector cable (8)
●NFC module ZIF connector cable (9)
●Left speaker cable (10)
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5.Remove the four Phillips M2.0 × 5.0 screws that secure the system board to the computer.
6.Lift the front edge of the system board (1) until it rests at an angle.
7.Remove the system board (2) by sliding it up and forward at an angle.
Reverse this procedure to install the system board.
Fan/heat sink assembly
To remove the fan/heat sink assembly, use these procedures and illustrations.
5-12 Fan/heat sink assembly descriptions and part numbers
Before removing the fan/heat sink assembly, follow these steps:
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1.Prepare the computer for disassembly (Preparation for disassembly on page 44).
2.Remove the bottom cover (Bottom cover on page 44).
3.Disconnect the battery cable from the system board the battery (see Battery on page 45).
4.Remove the system board (see System board on page 61).
Remove the fan/heat sink assembly:
1.Disconnect the fan cables (1) from the system board.
2.In the order indicated on the heat sink, loosen the four captive Phillips screws (2) that secure the fan/heat
sink assembly to the computer.
3.Loosen the four captive Phillips screws (3) that secure the fan/heat sink assembly to the computer.
4.Remove the fan/heat sink assembly from the system board (4).
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5.Thoroughly clean the thermal material from the surfaces of the fan/heat sink assembly and the system
board components each time the fan/heat sink assembly is removed. Replacement thermal material is
included with the fan/heat sink assembly and system board spare part kits. The following illustration
shows the replacement thermal material locations.
Thermal paste is used on the processor (1) and on the fan/heat sink assembly area (2) that services it.
Reverse this procedure to install the fan/heat sink assembly.
Sensor board cable
To remove the sensor board cable, use this procedure and illustration.
NOTE: The sensor board cable is available in the Cable Kit, spare part number M20835-001.
Before removing the sensor board cable, follow these steps:
1.Prepare the computer for disassembly (Preparation for disassembly on page 44).
2.Remove the bottom cover (Bottom cover on page 44).
3.Remove the battery (see Battery on page 45).
4.Remove the system board (see System board on page 61).
Remove the sensor board cable:
1.Turn the system board upside down with the rear toward you.
2.Release the ZIF connector (1) to which the sensor board cable is connected, and then disconnect the cable
from the system board.
3.Release the ZIF connector (2) to which the sensor board cable is connected, and then disconnect the cable
from the sensor board.
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4.Remove the sensor board cable (3).
Reverse this procedure to install the sensor board cable.
Sensor board
To remove the sensor board, use this procedure and illustration.
Table
5-13 Sensor board description and part number
DescriptionSpare part number
Sensor board:
NOTE: The sensor board spare part kit does not include the sensor board cable. The sensor board cable is available in the Cable Kit,
spare part number M20835-001.
For use only on computer models equipped with a microphoneM16047-001
For use only on computer models not equipped with a microphoneM16046-001
Before removing the sensor board, follow these steps:
1.Prepare the computer for disassembly (Preparation for disassembly on page 44).
2.Remove the bottom cover (Bottom cover on page 44).
3.Remove the battery (see Battery on page 45).
4.Remove the system board (see System board on page 61).
Remove the sensor board:
1.Turn the system board upside down with the rear toward you.
2.Release the ZIF connector (1) to which the sensor board cable is connected, and then disconnect the cable
from the system board.
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3.Detach the sensor board (2) from the system board. (The sensor board is attached to the system board
with double-sided adhesive.)
4.Remove the sensor board (3) and cable.
Reverse this procedure to install the sensor board.
WWAN antenna
To remove the WWAN antenna, use this procedure and illustration.
Table
5-14 WWAN antenna description and part number
DescriptionSpare part number
WWAN antenna (includes left and right cables and transceivers and adhesive)M20836-001
Before removing the WWAN antenna, follow these steps:
1.Prepare the computer for disassembly (Preparation for disassembly on page 44).
2.Remove the bottom cover (Bottom cover on page 44).
3.Remove the battery (see Battery on page 45).
4.Remove the speakers (see Speakers on page 54).
Remove the WWAN antenna:
1.Detach the transceivers (1) from the top cover/keyboard surface. (The transceivers are attached to the top
cover/keyboard with double-sided adhesive.)
2.Release the cables (2) from the routing path to which they are formed in the top cover/keyboard.
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3.Release the cables from the rubber retention molds (3).
4.Remove the WWAN antenna.
Reverse this procedure to install the WWAN antenna.
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6Using Setup Utility (BIOS)
Setup Utility, or Basic Input/Output System (BIOS), controls communication between all the input and output
devices on the system (such as disk drives, display, keyboard, mouse, and printer). Setup Utility (BIOS) includes
settings for the types of devices installed, the startup sequence of the computer, and the amount of system and
extended memory.
NOTE: To start Setup Utility on convertible computers, your computer must be in notebook mode and you
must use the keyboard attached to your notebook.
Starting Setup Utility (BIOS)
You have several ways to access the Setup Utility (BIOS).
IMPORTANT: Use extreme care when making changes in Setup Utility (BIOS). Errors can prevent the computer
from operating properly.
▲Turn on or restart the computer and quickly press f10.
– or –
Turn on or restart the computer, quickly press esc, and then press f10 when the Start menu is displayed.
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Updating Setup Utility (BIOS)
Updated versions of Setup Utility (BIOS) might be available on the HP website. Most BIOS updates on the HP
website are packaged in compressed les called SoftPaqs. Some download packages contain a le named
Readme.txt, which contains information regarding installing and troubleshooting the le.
Determining the BIOS version
To decide whether you need to update Setup Utility (BIOS), rst determine the BIOS version on your computer.
To reveal the BIOS version information (also known as ROM date and System BIOS), use one of these options.
●HP Support Assistant
1.Type support in the taskbar search box, and then select the HP Support Assistant app.
– or –
Select the question mark icon in the taskbar.
2.Select My notebook, and then select Specications.
●Setup Utility (BIOS)
1.Start Setup Utility (BIOS) (see Starting Setup Utility (BIOS) on page 71).
2.Select Main, and then make note of the BIOS version.
3.Select Exit, select one of the options, and then follow the on-screen instructions.
●In Windows, press ctrl+alt+s.
To check for later BIOS versions, see Preparing for a BIOS update on page 73.
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Preparing for a BIOS update
Be sure to follow all prerequisites before downloading and installing a BIOS update.
IMPORTANT: To reduce the risk of damage to the computer or an unsuccessful installation, download and
install a BIOS update only when the computer is connected to reliable external power using the AC adapter. Do
not download or install a BIOS update while the computer is running on battery power, docked in an optional
docking device, or connected to an optional power source. During the download and installation, follow these
instructions:
●Do not disconnect power from the computer by unplugging the power cord from the AC outlet.
●Do not shut down the computer or initiate Sleep.
●Do not insert, remove, connect, or disconnect any device, cable, or cord.
NOTE: If your computer is connected to a network, consult the network administrator before installing any
software updates, especially system BIOS updates.
Downloading a BIOS update
After you review the prerequisites, you can check for and download BIOS updates.
1.Type support in the taskbar search box, and then select the HP Support Assistant app.
– or –
Select the question mark icon in the taskbar.
2.Select Updates, and then select Check for updates and messages.
3.Follow the on-screen instructions.
4.At the download area, follow these steps:
a.Identify the most recent BIOS update and compare it to the BIOS version currently installed on your
computer. If the update is more recent than your BIOS version, make a note of the date, name, or
other identier. You might need this information to locate the update later, after it has been
downloaded to your hard drive.
b.Follow the on-screen instructions to download your selection to the hard drive.
Make a note of the path to the location on your hard drive where the BIOS update is downloaded. You
will need to access this path when you are ready to install the update.
Installing a BIOS update
BIOS installation procedures vary. Follow any instructions that appear on the screen after the download is
complete. If no instructions appear, follow these steps.
1.Type file in the taskbar search box, and then select File Explorer.
2.Select your hard drive designation. The hard drive designation is typically Local Disk (C:).
3.Using the hard drive path you recorded earlier, open the folder that contains the update.
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4.Double-click the le that has an .exe extension (for example, lename.exe).
The BIOS installation begins.
5.Complete the installation by following the on-screen instructions.
NOTE: After a message on the screen reports a successful installation, you can delete the downloaded le
from your hard drive.
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7Backing up, restoring, and recovering
You can use Windows tools or HP software to back up your information, create a restore point, reset your
computer, create recovery media, or restore your computer to its factory state. Performing these standard
procedures can return your computer to a working state faster.
IMPORTANT: If you will be performing recovery procedures on a tablet, the tablet battery must be at least 70%
charged before you start the recovery process.
IMPORTANT: For a tablet with a detachable keyboard, connect the tablet to the keyboard base before
beginning any recovery process.
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Backing up information and creating recovery media
These methods of creating recovery media and backups are available on select products only.
Using Windows tools for backing up
HP recommends that you back up your information immediately after initial setup. You can do this task either
using Windows Backup locally with an external USB drive or using online tools.
IMPORTANT: Windows is the only option that allows you to back up your personal information. Schedule
regular backups to avoid information loss.
NOTE: If computer storage is 32 GB or less, Microsoft System Restore is disabled by default.
Using the HP Cloud Recovery Download Tool to create recovery media (select products
only)
You can use the HP Cloud Recovery Download Tool to create HP Recovery media on a bootable USB ash drive.
For details:
▲Go to http://www.hp.com/support, search for HP Cloud Recovery, and then select the result that matches
the type of computer that you have.
NOTE: If you cannot create recovery media yourself, contact support to obtain recovery discs. Go to
http://www.hp.com/support, select your country or region, and then follow the on-screen instructions.
IMPORTANT: HP recommends that you follow the Restoring and recovery methods on page 77 to restore your
computer before you obtain and use the HP recovery discs. Using a recent backup can return your machine to a
working state sooner than using the HP recovery discs. After the system is restored, reinstalling all the operating
system software released since your initial purchase can be a lengthy process.
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Restoring and recovering your system
You have several tools available to recover your system both within and outside of Windows if the desktop
cannot load.
HP recommends that you attempt to restore your system using the Restoring and recovery methods
on page 77.
Creating a system restore
System Restore is available in Windows. The System Restore software can automatically or manually create
restore points, or snapshots, of the system les and settings on the computer at a particular point.
When you use System Restore, it returns your computer to its state at the time you made the restore point. Your
personal les and documents should not be aected.
Restoring and recovery methods
After you run the rst method, test to see whether the issue still exists before you proceed to the next method,
which might now be unnecessary.
1.Run a Microsoft System Restore.
2.Run Reset this PC.
3.Recover using HP Recovery media. For more information, see Recovering using HP Recovery media
on page 77.
For more information about the rst two methods, see the Get Help app:
Select the Start button, select the Get Help app, and then enter the task you want to perform.
NOTE: You must be connected to the internet to access the Get Help app.
Recovering using HP Recovery media
You can use HP Recovery media to recover the original operating system and software programs that were
installed at the factory. On select products, it can be created on a bootable USB ash drive using the HP Cloud
Recovery Download Tool.
For details, see Using the HP Cloud Recovery Download Tool to create recovery media (select products only)
on page 76.
NOTE: If you cannot create recovery media yourself, contact support to obtain recovery discs. Go to
http://www.hp.com/support, select your country or region, and then follow the on-screen instructions.
To recover your system:
▲Insert the HP Recovery media, and then restart the computer.
NOTE: HP recommends that you follow the Restoring and recovery methods on page 77 to restore your
computer before you obtain and use the HP recovery discs. Using a recent backup can return your machine to a
working state sooner than using the HP recovery discs. After the system is restored, reinstalling all the operating
system software released since your initial purchase can be a lengthy process.
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Changing the computer boot order
If your computer does not restart using the HP Recovery media, you can change the computer boot order, the
order of devices listed in BIOS for startup information. You can select an optical drive or a USB ash drive,
depending on the location of your HP Recovery media.
IMPORTANT: For a tablet with a detachable keyboard, connect the tablet to the keyboard base before
beginning these steps.
To change the boot order:
1.Insert the HP Recovery media.
2.Access the system Startup menu.
●For computers or tablets with keyboards attached, turn on or restart the computer or tablet, quickly
press esc, and then press f9 for boot options.
●For tablets without keyboards, turn on or restart the tablet, quickly press and hold the volume up
button, and then select f9.
‒ or –
Turn on or restart the tablet, quickly press and hold the volume down button, and then select f9.
3.Select the optical drive or USB ash drive from which you want to boot, and then follow the on-screen
instructions.
Using HP Sure Recover (select products only)
Select computer models are congured with HP Sure Recover, a PC OS recovery solution built into the hardware
and software. HP Sure Recover can fully restore the HP OS image without installed recovery software.
Using HP Sure Recover, an administrator or user can restore the system and install:
●Latest version of the operating system
●Platform-specic device drivers
●Software applications, in the case of a custom image
To access the latest documentation for HP Sure Recover, go to http://www.hp.com/support. Follow the on-
screen instructions to nd your product and locate your documentation.
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8Using HP PC Hardware Diagnostics
You can use the HP PC Hardware Diagnostics utility to determine whether your computer hardware is running
properly. The three versions are HP PC Hardware Diagnostics Windows, HP PC Hardware Diagnostics UEFI
(Unied Extensible Firmware Interface), and (for select products only) Remote HP PC Hardware Diagnostics UEFI,
a rmware feature.
Downloading the HP PC Hardware Diagnostics Windows from the
Microsoft Store
You can download the HP PC Hardware Diagnostics Windows from the Microsoft Store.
1.Select the Microsoft Store app on your desktop or enter Microsoft Store in the taskbar search box.
2.Enter HP PC Hardware Diagnostics Windows in the Microsoft Store search box.
3.Follow the on-screen directions.
The tool downloads to the selected location.
Customizing Remote HP PC Hardware Diagnostics UEFI settings
Using the Remote HP PC Hardware Diagnostics setting in Computer Setup (BIOS), you can perform several
customizations.
●Set a schedule for running diagnostics unattended. You can also start diagnostics immediately in
interactive mode by selecting Execute Remote HP PC Hardware Diagnostics.
●Set the location for downloading the diagnostic tools. This feature provides access to the tools from the HP
website or from a server that has been precongured for use. Your computer does not require the
traditional local storage (such as a hard drive or USB ash drive) to run remote diagnostics.
●Set a location for storing the test results. You can also set the user name and password that you use for
uploads.
●Display status information about the diagnostics run previously.
To customize Remote HP PC Hardware Diagnostics UEFI settings, follow these steps:
1.Turn on or restart the computer, and when the HP logo appears, press f10 to enter Computer Setup.
2.Select Advanced, and then select Settings.
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3.Make your customization selections.
4.Select Main, and then Save Changes and Exit to save your settings.
Your changes take eect when the computer restarts.
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9Specications
This chapter provides specications for your computer.
Computer specications
This section provides specications for your computer. When traveling with your computer, the computer
dimensions and weights, as well as input power ratings and operating specications, provide helpful information.
Table 9-1 Computer specications
Dimensions
Width385 mm15.18 in
Depth258 mm10.15 in
MetricU.S.
Height (front to back)23 mm0.89 in
Weight2.09 kg4.61 lb
Input power
Operating voltage and current19.5 V dc @ 2.31 A – 45 W
19.5 V dc @ 3.33 A – 65 W
19.5 V dc @ 4.62 A – 90 W
19.5 V dc @ 7.70 A – 150 W
19.5 V dc @ 10.3 A – 200 W
Temperature
Operating5°C to 35°C41°F to 95°F
Nonoperating–20°C to 60°C–4°F to 140°F
Relative humidity (noncondensing)
Operating10% to 90%
Nonoperating5% to 95%
Maximum altitude (unpressurized)
Operating–15 m to 3,048 m–50 ft to 10,000 ft
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Table 9-1 Computer specications (continued)
MetricU.S.
Nonoperating–15 m to 12,192 m–50 ft to 40,000 ft
NOTE: Applicable product safety standards specify thermal limits for plastic surfaces. The device operates well within this range of
temperatures.
35.6 cm (14.0 in) display specications
This section provides specications for your display.
Table 9-2 Display specications
MetricU.S.
Active diagonal size35.6 cm14.0 in
Resolution1920 × 1080 (FHD)
3840 × 2160 (UHD)
Surface treatmentAntiglare (FHD, UHD panels)
BrightView (OLED panel)
Brightness400 nits (UHD, sRGB 95% panel)
Viewing angleUWVA
BacklightWLED
Display panel interfaceeDP 1.4 + PSR2
Solid-state drive specications
This section provides specications for your solid-state drives.
Table
9-3 Solid-state drive specications
Dimensions
Height1.0 mm1.0 mm1.0 mm
Length50.8 mm50.8 mm50.8 mm
Width28.9 mm28.9 mm28.9 mm
1000 nits (FHD, 72% NTSC panels)
400 nits (FHD, 72% NTSC panels)
eDP + PSR2
256 GB*512 GB*1 TB*
Weight< 10 g< 10 g< 10 g
Interface typePCIePCIePCIe
Ready time, maximum (to not busy)1.0 ms< 1.0 ms1.0 ms
Sequential readup to 2150 MB/sup to 2150 MB/sup to 2150 MB/s
Random readUp to 300,000 IOPsUp to 300,000 IOPsUp to 300,000 IOPs
Sequential writeup to 1550 MB/sup to 1550 MB/sup to 1550 MB/s
Random writeUp to 100,000 IOPsUp to 100,000 IOPsUp to 100,000 IOPs
Total logical sectors468,883,2961,000,215,2161,500,336,388
Operating temperature0°C to 70°C (32°F to 158°F)
*1 GB = 1 billion bytes when referring to hard drive storage capacity. Actual accessible capacity is less.
Actual drive specications may dier slightly.
NOTE: Certain restrictions and exclusions apply. Contact support for details.
Solid-state drive specications (SATA-3)
This section provides specications for your solid-state drive.
Table
9-4 Solid-state drive specications
128 GB*
Dimensions
Height1.35 mm
Weight< 10 g
Interface typeSATA-3
Ready time, maximum (to not busy)1.0 ms
Access times, logical0.1 ms
Transfer rateup to 540 MB/s
Total logical sectors234,441,648
Operating temperature0°C to 70°C (32°F to 158°F)
*1 GB = 1 billion bytes when referring to hard drive storage capacity. Actual accessible capacity is less. Actual drive specications may
dier slightly.
NOTE: Certain restrictions and exclusions apply. Contact support for details.
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10Statement of memory volatility
For general information regarding nonvolatile memory in HP Business computers, and to restore nonvolatile
memory that can contain personal data after the system has been turned o and the hard drive has been
removed, use these instructions.
HP Business computer products that use Intel®-based or AMD®-based system boards contain volatile DDR
memory. The amount of nonvolatile memory present in the system depends upon the system conguration.
Intel-based and AMD-based system boards contain nonvolatile memory subcomponents as originally shipped
from HP, with the following assumptions:
●No subsequent modications were made to the system.
●No applications, features, or functionality were added to or installed on the system.
Following system shutdown and removal of all power sources from an HP Business computer system, personal
data can remain on volatile system memory (DIMMs) for a nite period of time and also remains in nonvolatile
memory. Use the following steps to remove personal data from the computer, including the nonvolatile memory
found in Intel-based and AMD-based system boards.
NOTE: If your tablet has a keyboard base, connect to the keyboard base before beginning steps in this chapter.
Current BIOS steps
Use these instructions to restore nonvolatile memory.
1.Follow these steps to restore the nonvolatile memory that can contain personal data. Restoring or
reprogramming nonvolatile memory that does not store personal data is neither necessary nor
recommended.
a.Turn on or restart the computer, and then quickly press esc.
NOTE: If the system has a BIOS administrator password, enter the password at the prompt.
b.Select Main, select Apply Factory Defaults and Exit, and then select Yes to load defaults. The
computer restarts.
c.During the restart, press esc while the "Press the ESC key for Startup Menu" message is displayed at
the bottom of the screen.
NOTE: If the system has a BIOS administrator password, enter the password at the prompt.
d.Select the Security menu, select Restore Security Settings to Factory Defaults, and then select Yes to
restore security level defaults. The computer reboots.
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e.During the reboot, press esc while the "Press the ESC key for Startup Menu" message is displayed at
the bottom of the screen.
NOTE: If the system has a BIOS administrator password, enter the password at the prompt.
f.If an asset or ownership tag is set, select the Security menu and scroll down to the Utilities menu.
Select System IDs, and then select Asset Tracking Number. Clear the tag, and then make the selection
to return to the prior menu.
g.If a DriveLock password is set, select the Security menu, and scroll down to Hard Drive Utilities under
the Utilities menu. Select Hard Drive Utilities, select DriveLock, and then clear the check box for
DriveLock password on restart. Select OK to proceed.
h.Select the Main menu, and then select Reset BIOS Security to factory default. Click Yes at the warning
message. The computer reboots.
i.During the reboot, press esc while the "Press the ESC key for Startup Menu" message is displayed at
the bottom of the screen.
NOTE: If the system has a BIOS administrator password, enter the password at the prompt.
j.Select the Main menu, select Apply Factory Defaults and Exit, select Yes to save changes and exit, and
then select Shutdown.
k.Reboot the system. If the system has a Trusted Platform Module (TPM), ngerprint reader, or both,
one or two prompts will appear—one to clear the TPM and the other to Reset Fingerprint Sensor.
Press or tap f1 to accept or f2 to reject.
l.Remove all power and system batteries for at least 24 hours.
2.Complete one of the following:
●Remove and retain the storage drive.
– or –
●Clear the drive contents by using a third-party utility designed to erase data from an SSD.
– or –
●Clear the contents of the drive by using the following BIOS Setup Secure Erase command option
steps:
If you clear data using Secure Erase, you cannot recover it.
a.Turn on or restart the computer, and then quickly press esc.
b.Select the Security menu and scroll down to the esc menu.
c.Select Hard Drive Utilities.
d.Under Utilities, select Secure Erase, select the hard drive storing the data you want to clear, and then
follow the on-screen instructions to continue.
– or –
Clear the contents of the drive using the following Disk Sanitizer commands steps:
86Chapter 10 Statement of memory volatilityENWW
Page 95
i.Turn on or restart the computer, and then quickly press esc.
ii.Select the Security menu and scroll down to the Utilities menu.
iii.Select Hard Drive Utilities.
iv.Under Utilities, select Disk Sanitizer, select the hard drive with the data that you want to clear,
and then follow the on-screen instructions to continue.
NOTE: The amount of time it takes for Disk Sanitizer to run can take several hours. Plug the computer
into an AC outlet before starting.
Nonvolatile memory usage
Use this table to troubleshooting nonvolatile memory usage.
Table 10-1 Troubleshooting steps for nonvolatile memory usage
Nonvolatile
memory typeAmount (Size)
HP Sure Start ash
(select models
only)
Real Time Clock
(RTC) battery
backed-up CMOS
conguration
memory
8 MBNoYesProvides
256 bytesNoYesStores system
Does this
memory
store
customer
data?
Does this
memory
retain data
when power
is removed?
What is the
purpose of this
memory?
protected
backup of
critical System
BIOS code, EC
rmware, and
critical
computer
conguration
data for select
platforms that
support HP Sure
Start.
For more
information, see
Using HP Sure
Start (select
products only)
on page 91.
date and time
and noncritical
data.
How is data entered into this
memory?
Data cannot be written to this
device via the host processor.
The content is managed solely
by the HP Sure Start
Embedded Controller.
RTC battery backed-up CMOS
is programmed using
Computer Setup (BIOS), or by
changing the Windows date &
time.
How is this memory writeprotected?
This memory is protected
by the HP Sure Start
Embedded Controller.
This memory is not writeprotected.
Controller (NIC)
EEPROM
64 KB (not
customer
accessible)
NoYesStores NIC
conguration
and NIC
rmware.
NIC EEPROM is programmed
using a utility from the NIC
vendor that can be run from
DOS.
A utility must be used to
write data to this memory
and is available from the
NIC vendor. Writing data to
this ROM in an
inappropriate manner will
render the NIC nonfunctional.
ENWWNonvolatile memory usage87
Page 96
Table 10-1 Troubleshooting steps for nonvolatile memory usage (continued)
Does this
memory
Nonvolatile
memory typeAmount (Size)
DIMM Serial
Presence Detect
(SPD) conguration
data
Does this
memory
retain data
when power
is removed?
What is the
purpose of this
memory?
module
information.
BIOS code and
computer
conguration
data.
How is data entered into this
memory?
DIMM SPD is programmed by
the memory vendor.
System BIOS code is
programmed at the factory.
Code is updated when the
system BIOS is updated.
Conguration data and
settings are entered using the
Computer Setup (BIOS) or a
custom utility.
How is this memory writeprotected?
Data cannot be written to
this memory when the
module is installed in a
computer. The specic
write-protection method
varies by memory vendor.
NOTE: Writing data to
this ROM in an
inappropriate manner can
render the computer nonfunctional.
A utility must be used for
writing data to this
memory and is available
on the HP website; go to
http://www.hp.com/
support. Select Find your
product, and then follow
the on-screen
instructions.
Intel Management
Engine Firmware
(present only in
select Elite or Z
models. For more
information, go to
http://www.hp.com/
support. Select
Identify your
product for
manuals and
specic product
information, and
then follow the onscreen
instructions.)
Bluetooth ash
(select products
only)
802.11 WLAN
EEPROM
1.5 MB or 7 MBYesYesStores
Management
Engine Code,
Settings,
Provisioning
Data and iAMT
third-party data
store.
2 megabitsNoYesStores
Bluetooth
conguration
and rmware.
4 kilobits to 8
kilobits
NoYesStores
conguration
and calibration
data.
Management Engine Code is
programmed at the factory.
Code is updated via Intel
secure rmware update utility.
Unique Provisioning Data can
be entered at the factory or by
an administrator using the
Management Engine (MEBx)
setup utility. The third-party
data store contents can be
populated by a remote
management console or local
applications that have been
registered by an administrator
to have access to the space.
Bluetooth ash is
programmed at the factory.
Tools for writing data to this
memory are not publicly
available but can be obtained
from the silicon vendor.
802.11 WLAN EEPROM is
programmed at the factory.
Tools for writing data to this
memory are not made public.
The Intel chipset is
congured to enforce
hardware protection to
block all direct read-write
access to this area. An
Intel utility must be used
for updating the rmware.
Only rmware updates
digitally signed by Intel
can be applied using this
utility.
A utility must be used for
writing data to this
memory and is made
available through newer
versions of the driver
whenever the ash
requires an upgrade.
A utility must be used for
writing data to this
memory and is typically
not made available to the
public unless a rmware
upgrade is necessary to
address a unique issue.
88Chapter 10 Statement of memory volatilityENWW
Page 97
Table 10-1 Troubleshooting steps for nonvolatile memory usage (continued)
Does this
memory
Nonvolatile
memory typeAmount (Size)
Camera (select
products only)
Fingerprint reader
(select products
only)
64 kilobitsNoYesStores camera
512 KB ashYesYesStores
store
customer
data?
Questions and answers
Use this section to answer your questions about nonvolatile memory.
1.How can the BIOS settings be restored (returned to factory settings)?
IMPORTANT: The restore defaults feature does not securely erase any data on your hard drive. See
question and answer 6 for steps to securely erase data.
Does this
memory
retain data
when power
is removed?
What is the
purpose of this
memory?
conguration
and rmware.
ngerprint
templates.
How is data entered into this
memory?
Camera memory is
programmed using a utility
from the device manufacturer
that can be run from
Windows.
Fingerprint reader memory is
programmed by user
enrollment in HP ProtectTools
Security Manager.
How is this memory writeprotected?
A utility must be used for
writing data to this
memory and is typically
not made available to the
public unless a rmware
upgrade is necessary to
address a unique issue.
Only a digitally signed
application can make the
call to write to the ash.
The restore defaults feature does not reset the Custom Secure Boot keys. See question and answer 7 for
information about resetting the keys.
a.Turn on or restart the computer, and then quickly press esc.
b.Select Main, and then select Apply Factory Defaults and Exit.
ENWWQuestions and answers89
Page 98
c.Follow the on-screen instructions.
d.Select Main, select Save Changes and Exit, and then follow the on-screen instructions.
2.What is a UEFI BIOS, and how is it dierent from a legacy BIOS?
The Unied Extensible Firmware Interface (UEFI) BIOS is an industry-standard software interface between
the platform rmware and an operating system (OS). It replaces the older BIOS architecture but supports
much of the legacy BIOS functionality.
Like the legacy BIOS, the UEFI BIOS provides an interface to display the system information and
conguration settings and to change the conguration of your computer before an OS is loaded. BIOS
provides a secure runtime environment that supports a Graphic User Interface (GUI). In this environment,
you can use either a pointing device (touch screen, touchpad, pointing stick, or USB mouse) or the keyboard
to navigate and make menu and conguration selections. The UEFI BIOS also contains basic system
diagnostics.
The UEFI BIOS provides functionality beyond that of the legacy BIOS. In addition, the UEFI BIOS works to
initialize the computer’s hardware before loading and executing the OS; the runtime environment allows
the loading and execution of software programs from storage devices to provide more functionality, such
as advanced hardware diagnostics (with the ability to display more detailed system information) and
advanced rmware management and recovery software.
HP has provided options in Computer Setup (BIOS) to allow you to run in legacy BIOS, if required by the
operating system. Examples of this requirement would be if you upgrade or downgrade the OS.
3.Where is the UEFI BIOS located?
The UEFI BIOS is located on a ash memory chip. You must use a utility to write to the chip.
4.What kind of conguration data is stored on the DIMM Serial Presence Detect (SPD) memory module? How
would this data be written?
The DIMM SPD memory contains information about the memory module, such as size, serial number, data
width, speed and timing, voltage, and thermal information. This information is written by the module
manufacturer and stored on an EEPROM. You cannot write to this EEPROM when the memory module is
installed in a computer. Third-party tools do exist that can write to the EEPROM when the memory module
is not installed in a computer. Various third-party tools are available to read SPD memory.
5.What is meant by “Restore the nonvolatile memory found in Intel-based system boards”?
This message relates to clearing the Real Time Clock (RTC) CMOS memory that contains computer
conguration data.
6.How can the BIOS security be reset to factory defaults and erase the data?
IMPORTANT: Resetting results in the loss of information.
These steps do not reset Custom Secure Boot Keys. See question and answer 7 for information about
resetting the keys.
a.Turn on or restart the computer, and then quickly press esc.
b.Select Main, and then select Reset Security to Factory Defaults.
90Chapter 10 Statement of memory volatilityENWW
Page 99
c.Follow the on-screen instructions.
d.Select Main, select Save Changes and Exit, and then follow the on-screen instructions.
7.How can the Custom Secure Boot Keys be reset?
Secure Boot is a feature to ensure that only authenticated code can start on a platform. If you enabled
Secure Boot and created Custom Secure Boot Keys, disabling Secure Boot does not clear the keys. You
must also select to clear the Custom Secure Boot Keys. Use the same Secure Boot access procedure that
you used to create the Custom Secure Boot Keys, but select to clear or delete all Secure Boot Keys.
a.Turn on or restart the computer, and then quickly press esc.
b.Select the Security menu, select Secure Boot Conguration, and then follow the on-screen
instructions.
c.At the Secure Boot Conguration window, select Secure Boot, select Clear Secure Boot Keys, and then
follow the on-screen instructions to continue.
Using HP Sure Start (select products only)
Select computer models are congured with HP Sure Start, a technology that continuously monitors your
computer's BIOS for attacks or corruption.
If the BIOS becomes corrupted or is attacked, HP Sure Start restores the BIOS to its previously safe state, without
user intervention. Those select computer models ship with HP Sure Start congured and enabled. HP Sure Start
is congured and already enabled so that most users can use the HP Sure Start default conguration. Advanced
users can customize the default conguration.
To access the latest documentation on HP Sure Start, go to http://www.hp.com/support.
ENWWUsing HP Sure Start (select products only)91
Page 100
92Chapter 10 Statement of memory volatilityENWW
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