Low Current, High Performance
NPN Silicon Bipolar Transistor
Technical Data
AT-31011
AT-31033
Features
• High Performance Bipolar
Transistor Optimized for
Low Current, Low Voltage
Operation
• 900 MHz Performance:
AT-31011: 0.9 dB NF, 13 dB G
AT-31033: 0.9 dB NF, 11 dB G
• Characterized for End-OfLife Battery Use (2.7 V)
• SOT-143 SMT Plastic
Package
• Tape-And-Reel Packaging
Option Available
[1]
Outline Drawing
EMITTER COLLECTOR
310
BASE EMITTER
SOT-143 (AT-31011)
COLLECTOR
310
BASE EMITTER
SOT-23 (AT-31033)
Description
Hewlett-Packard’s AT-31011 and
AT-31033 are high performance
NPN bipolar transistors that have
been optimized for operation at
low voltages, making them ideal
A
A
for use in battery powered
applications in wireless markets.
The AT-31033 uses the 3 lead
SOT-23, while the AT-31011 places
the same die in the higher
performance 4 lead SOT-143. Both
packages are industry standards
compatible with high volume
surface mount assembly
techniques.
battery operated systems as an
LNA, gain stage, buffer, oscillator,
or active mixer. Applications
include cellular and PCS handsets
as well as Industrial-ScientificMedical systems. Typical amplifier
designs at 900 MHz yield 1.3 dB
noise figures with 11 dB or more
associated gain at a 2.7 V, 1 mA
bias. Moderate output power
capability (+9 dBm P
) coupled
1dB
with an excellent noise figure
yields high dynamic range for a
microcurrent device. High gain
capability at 1 V, 1 mA makes these
devices a good fit for 900 MHz
pager applications.
The 3.2 micron emitter-to-emitter
pitch and reduced parasitic design
of these transistors yields
extremely high performance
products that can perform a multiplicity of tasks. The 10 emitter
finger interdigitated geometry
yields an extremely fast transistor
with low operating currents and
reasonable impedances.
The AT-3 series bipolar transistors
are fabricated using an optimized
version of Hewlett-Packard’s
10 GHz fT, 30 GHz f
max
SelfAligned-Transistor (SAT) process.
The die are nitride passivated for
surface protection. Excellent
device uniformity, performance
and reliability are produced by the
use of ion-implantation, self-
Optimized performance at 2.7 V
makes these devices ideal for use
in 900 MHz, 1.9 GHz, and 2.4 GHz
alignment techniques, and gold
metalization in the fabrication of
these devices.
Note:
1. Refer to “Tape-and-Reel Packaging for
Semiconductor Devices”
4-33
5965-8919E
AT-31011, AT-31033 Absolute Maximum Ratings
Symbol Parameter Units Absolute Maximum
V
EBO
V
CBO
V
CEO
I
P
T
T
STG
Notes:
1. Operation of this device above any one of these parameters may cause permanent damage.
2. T
Mounting Surface
3. Derate at 1.82 mW/°C for TC > 67.5°C.
Emitter-Base Voltage V 1.5
Collector-Base Voltage V 11
Collector-Emitter Voltage V 5.5
Collector Current mA 16
C
Power Dissipation
T
Junction Temperature °C 150
j
[2,3]
mW 150
Storage Temperature °C -65 to 150
= 25°C.
[1]
Thermal Resistance
θjc = 550°C/W
[2]
:
Electrical Specifications, T
= 25°C
A
AT-31011 AT-31033
Symbol Parameters and Test Conditions Units Min Typ Max Min Typ Max
NF Noise Figure
VCE = 2.7 V, IC = 1 mA f = 0.9 GHz dB 0.9
G
Associated Gain
A
VCE = 2.7 V, IC = 1 mA f = 0.9 GHz dB 11
h
Forward Current VCE = 2.7 V - 70 300 70 300
FE
[1]
13
[1]
[1]
1.2
[1]
[2]
0.9
1.2
[2]
9
11
[2]
Transfer Ratio IC = 1 mA
I
CBO
I
EBO
Notes:
1. Test circuit B, Figure 1. Numbers reflect device performance de-embedded from circuit losses.
Input loss = 0.4 dB; output loss = 0.4 dB.
2. Test circuit A, Figure 1. Numbers reflect device performance de-embedded from circuit losses.
Input loss = 0.4 dB; output loss = 0.4 dB.
1000 pF
W = 10 L = 1000
TEST CIRCUIT
BOARD MATL = 0.062" FR-4 (ε = 4.8)
DIMENSIONS IN MILS
Collector Cutoff Current V
Emitter Cutoff Current V
V
BB
W = 10 L = 1860
W = 30 L = 100
W = 30 L = 100
TEST CIRCUIT A: W = 20 L = 100
TEST CIRCUIT B: W = 20 L = 200 x 2
NOT TO SCALE
= 3 V µA 0.05 0.2 0.05 0.2
CB
= 1 V µA 0.1 1.5 0.1 1.5
EB
25 Ω
V
CC
W = 10 L = 1860
1000 pF
W = 10 L = 1025
[2]
Figure 1. Test Circuit for Noise Figure and Associated Gain. This Circuit is a
Compromise Match Between Best Noise Figure, Best Gain, Stability, a Practical,
Synthesizable Match, and a Circuit Capable of Matching Both the AT-305 and AT-310
Geometries.
4-34
Characterization Information, T
= 25°
A
C
AT-31011 AT-31033
Symbol Parameters and Test Conditions Units Typ Typ
P
1dB
Power at 1 dB Gain Compression (opt tuning)
VCE = 2.7 V, IC = 10 mA f = 0.9 GHz dBm 9 9
G
Gain at 1 dB Gain Compression (opt tuning)
1dB
VCE = 2.7 V, IC = 10 mA f = 0.9 GHz d B 15 13
IP
Output Third Order Intercept Point,
3
VCE = 2.7 V, IC = 10 mA (opt tuning) f = 0.9 GHz dBm 20 20
2
|S21|
C
2.5
2
1.5
1
NOISE FIGURE (dB)
0.5
0
0
Figure 2. AT-31011 and AT-31033
Minimum Noise Figure and Amplifier
[1]
NF
vs. Frequency and Current at
VCE␣ = 2.7 V.
Gain in 50 Ω System; V
E
Collector-Base Capacitance VCB = 3V, f = 1 M Hz pF 0.04 0.04
CB
AMPLIFIER NF
NF MIN.
1 mA
10 mA
0.5 2.5
1 1.5
FREQUENCY (GHz)
2
= 2.7 V, IC = 1 mA f = 0.9 GHz dB 10 9
CE
25
20
15
Ga (dB)
10
5
0
0
0.5 2.5
10 mA
1 mA
1.0 1.5
FREQUENCY (GHz)
2.0
Figure 3. AT-31011 Associated Gain at
Optimum Noise Match vs. Frequency
and Current at VCE␣ = 2.7 V.
25
20
15
Ga (dB)
10
5
0
0.5 2.5
0
10 mA
1 mA
1.0 1.5
FREQUENCY (GHz)
Figure 4. AT-31033 Associated Gain at
Optimum Noise Match vs. Frequency
and Current at VCE␣ = 2.7 V.
2.0
10
8
6
4
P 1dB (dBm)
2
0
10 mA
5 mA
2 mA
0.5 2.5
0
FREQUENCY (GHz)
1.0 1.5
2 mA
5 mA
10 mA
2.0
Figure 5. AT-31011 and AT-31033
Power at 1 dB Gain Compression vs.
Frequency and Current at VCE␣ = 2.7 V.
20
16
12
8
G 1dB (dB)
4
0
0.5 2.5
0
1.0 1.5
FREQUENCY (GHz)
2 mA
5 mA
10 mA
2.0
Figure 6. AT-31011 1 dB Compressed
Gain vs. Frequency and Current at
VCE␣ = 2.7 V.
16
12
8
G 1dB (dB)
4
0
0
1.0 1.5
0.5 2.5
FREQUENCY (GHz)
2 mA
5 mA
10 mA
2.0
Figure 7. AT-31033 1 dB Compressed
Gain vs. Frequency and Current at
VCE␣ = 2.7 V.
Note:
1. Amplifier NF represents the noise figure which can be expected in a real circuit representing reasonable reflection coefficients and
including circuit losses.
4-35