HIT 2SC458, 2SC2308 Datasheet

2SC458, 2SC2308
Silicon NPN Epitaxial
Application
Low frequency amplifier
Complementary pair with 2SA1029 and 2SA1030
Outline
TO-92 (1)
1. Emitter
2. Collector
3
2
1
2SC458, 2SC2308
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol 2SC458 2SC2308 Unit
Collector to base voltage V Collector to emitter voltage V Emitter to base voltage V Collector current I Emitter current I Collector power dissipation P
CBO
CEO
EBO
C
E
C
Junction temperature Tj 150 150 °C Storage temperature Tstg –55 to +150 –55 to +150 °C
30 55 V 30 50 V 55V 100 100 mA –100 –100 mA 200 200 mW
2
2SC458, 2SC2308
Electrical Characteristics (Ta = 25°C)
2SC458 2SC2308
Item Symbol Min Typ Max Min Typ Max Unit Test conditions
Collector to base breakdown voltage
Collector to emitter breakdown voltage
Emitter to base breakdown voltage
Collector cutoff current I Emitter cutoff current I DC current transfer ratio hFE* Collector to emitter
saturation voltage Base to emitter voltage V Gain bandwidth product f Collector output
capacitance Noise figure NF 4 10 4 10 dB VCE = 6 V, IC = 0.1 mA,
Small signal input impedance
Small signal voltage feedback ratio
Small signal current trancefer ratio
Small signal output admittance
Note: 1. The 2SC458 and 2SC2308 are grouped by hFE as follows.
BCD
2SC458 100 to 200 160 to 320 250 to 500 2SC2308 100 to 200 160 to 320
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
CBO
EBO
V
CE(sat)
BE
T
30 55 V IC = 10 µA, IE = 0
30 50 V IC = 1 mA, RBE =
5 ——5 ——V IE = 10 µA, IC = 0
0.5 0.5 µAVCB =18 V, IE = 0 — 0.5 0.5 µAVEB = 2 V, IC = 0
1
100 500 100 320 VCE = 12 V, IC = 2 mA — 0.2 0.2 V IC = 10 mA, IB = 1 mA
0.67 0.75 0.67 0.75 V VCE = 12 V, IC = 2 mA — 230 230 MHz VCE = 12 V, IC = 2 mA
Cob 1.8 3.5 1.8 3.5 pF VCB = 10 V, IE = 0,
f = 1 MHz
f = 1 kHz, R
h
ie
16.5 16.5 k VCE = 5V, IC = 0.1mA,
= 500
g
f = 270 Hz
h
re
h
fe
h
oe
—70——70—× 10
130 130
11.0 11.0 µS
–6
See characteristic curves of 2SC458 (LG) and 2SC2310 except for the followings.
3
2SC458, 2SC2308
Maximum Collector Dissipation Curve
300
(mW)
C
200
100
Collector Power Dissipation P
0 50 100 150
Ambient Temperature Ta (°C)
20
IC = 0.1 mA
16
R
12
8
Noise Figure NF (dB)
4
0
100 1k 3k300 10k 30k30
Noise Figure vs. Collector to Emitter Voltage
8
IC = 0.1 mA
= 500
R
g
6
f = 1kHz
Noise Figure vs. Frequency
= 500
g
= 6 V
V
CE
Frequency f (Hz)
4
Noise Figure NF (dB)
2
0
1
Collector to Emitter Voltage VCE (V)
30201052
4
Unit: mm
0.60 Max
0.5 ± 0.1
4.8 ± 0.3
1.27
2.54
0.7
5.0 ± 0.2
2.3 Max
12.7 Min
3.8 ± 0.3
0.5
Hitachi Code JEDEC EIAJ Weight
(reference value)
TO-92 (1) Conforms Conforms
0.25 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
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Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
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