Harman Kardon DVD-37-230 Service Manual

Page 1
harman/kardon
Service manual DVD37EU
Page 1 of 117
Eu version
harman kardon
Model
DVD 37
DVD/CD/CD-R/CD-RW/VCD MP3 Player
Service Manual
CONTENTS
SERVICING PRECAUTIONS....... 3 PCB DRAWINGS....................... 32
BASIC SPECIFICATIONS............ 5 SEMICONDUCTOR PINOUT.... 36
TROUBLESHOOTING GUIDE..... 10 BLOCK DIAGRAM................. 112
PACKAGE AND PACKAGE PARTS 11 WIRING DIAGRAM................ 113
DISASSEMBLY 12 SCHEMATIC DIAGRAMS....... 114
UNIT EXPLODED VIEW AND PARTS 13
harman/kardon, Inc.
250 Crossways Park Dr.
Woodbury, New York, 11797 Released 2007 Discontinued XXXX Rev 0, 8/2007
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harman/kardon
Service manual DVD37EU
Page 2 of 117
ESD PRECAUTIONS
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components com­monly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated cir­cuits and some field-effect transistors and semiconductor chip components. The following techniques should be used to help reduce the incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive sur­face such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ESD devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD devices.
6. Do not remove a replacement ESD device from its protective package until immediately before you are ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive materials).
7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the protective material to the chassis or circuit assembly into which the device will by installed.
CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALL
OTHER SAFETY PRECAUTIONS.
8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can gen­erate static electricity sufficient to damage an ESD device).
Page 3
SERVICING PRECAUTIONS
NOTES REGARDING HANDLING OF THE PICK-UP
1. Notes for transport and storage
1) The pick-up should always be left in its conductive bag until immediately prior to use.
2) The pick-up should never be subjected to external pressure or impact.
2. Repair notes
1) The pick-up incorporates a strong magnet, and so should never be brought close to magnetic materials.
2) The pick-up should always be handled correctly and carefully, taking care to avoid external pressure and impact. If it is subjected to strong pressure or impact, the result may be an operational malfunction and/or damage to the printed-circuit board.
3) Each and every pick-up is already individually adjusted to a high degree of precision, and for that reason the adjustment point and installation screws should absolutely never be touched.
4) Laser beams may damage the eyes! Absolutely never permit laser beams to enter the eyes! Also NEVER switch ON the power to the laser output part (lens, etc.) of the pick-up if it is damaged.
5) Cleaning the lens surface If there is dust on the lens surface, the dust should be cleaned away by using an air bush (such as used for camera lens). The lens is held by a delicate spring. When cleaning the lens surface, therefore, a cot­ton swab should be used, taking care not to distort this.
6) Never attempt to disassemble the pick-up. Spring by excess pressure. If the lens is extremely dirty, apply isopropyl alcohol to the cotton swab. (Do not use any other liquid cleaners, because they will damage the lens.) Take care not to use too much of this alcohol on the swab, and do not allow the alcohol to get inside the pick-up.
Storage in conductive bag
NEVER look directly at the laser beam, and don’t let contact fingers or other exposed skin.
Magnet
How to hold the pick-up
Conductive Sheet
Cotton swab
Pressure
Pressure
Drop impact
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Service manual DVD37EU
Page 3 of 117
Page 4
NOTES REGARDING COMPACT DISC PLAYER REPAIRS
1. Preparations
1) Compact disc players incorporate a great many ICs as well as the pick-up (laser diode). These compo­nents are sensitive to, and easily affected by, static electricity. If such static electricity is high voltage, components can be damaged, and for that reason components should be handled with care.
2) The pick-up is composed of many optical components and other high-precision components. Care must be taken, therefore, to avoid repair or storage where the temperature of humidity is high, where strong
magnetism is present, or where there is excessive dust.
2. Notes for repair
1) Before replacing a component part, first disconnect the power supply lead wire from the unit
2) All equipment, measuring instruments and tools must be grounded.
3) The workbench should be covered with a conductive sheet and grounded. When removing the laser pick-up from its conductive bag, do not place the pick-up on the bag. (This is because there is the possibility of damage by static electricity.)
4) To prevent AC leakage, the metal part of the soldering iron should be grounded.
5) Workers should be grounded by an armband (1M)
6) Care should be taken not to permit the laser pick-up to come in contact with clothing, in order to prevent static electricity changes in the clothing to escape from the armband.
7) The laser beam from the pick-up should NEVER be directly facing the eyes or bare skin.
Resistor (1 Mohm)
Conductive Sheet
Resistor (1 Mohm)
Armband
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Service manual DVD37EU
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Page 5
DVD 37 TECHNICAL SPECIFICATIONS
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Service manual DVD37EU
Page 5 of 117
Applicable Disc: Disc formats: 5-inch (12cm) or 3-inch (8cm) DVD-Video, DVD-Audio, standard-conforming DVD-R, DVD+R, DVD-RW, DVD+RW,
VCD, CD, CD-R, CD-RW or MP3 discs Region code: DVD video disc with Code 1 or 0 only DVD layers: Single side/single layer, single side/dual layer, dual side/dual layer Audio formats: DVD Audio MLP lossless, linear PCM, MPEG, Windows Media Still-image format: JPEG
Video Signal System: NTSC HDMI™Output: Video: 480p, 720p, 1080i
HDMI Version 1.0-compliant HDCP Version 1.1-compliant
Composite Video Output: 1V p-p/75 ohms, sync negative polarity S-Video Output: Y/luminance: 1V p-p/75 ohms, sync negative polarity
C/chrominance: 0.286V p-p
Component Video Output: Y: 1V p-p/75 ohms, sync negative polarity
Pr: 0.7V p-p/75 ohms Pb: 0.7V p-p/75 ohms
Analog Audio Output: 2V RMS (1kHz, 0dB) Frequency Response: DVD (linear PCM): 2Hz – 22kHz +0/–0.5dB (48kHz sampling)
2Hz – 44kHz +0/–1.5dB (96kHz sampling) 2Hz – 88kHz +0/–0.5dB (192kHz sampling)
CD: 2Hz – 20kHz +0/–0.5dB
Signal/Noise Ratio (SNR): 105dB (A-weighted) Dynamic Range: DVD: 100dB (18-bit)/105dB (20-bit)
CD/DVD: 96dB (16-bit)
THD/1kHz: DVD/CD: 0.0025% Wow & Flutter: Below measurable limits AC Power: 110–240V AC/50–60Hz Power Consumption: 1 Watt (on/standby)/13 watts (max) Dimensions (H x W x D): 2" x 17-3/10" x 11-1/4" (50mm x 440mm x 285mm) Weight: 6 lb (2.7kg) Shipping Dimensions (H x W x D): 5" x 14-3/8" x 20" (127mm x 365mmx 508mm) Shipping Weight: 8.8 lb (4kg)
®
9, Dolby®Digital or DTS®audio discs
Depth measurement includes knobs and connectors. Height measurement includes feet and chassis. All specifications subject to change without notice.
Harman Kardon and Harman International are trademarks of Harman International Industries, Incorporated, registered in the United States and/or other countries. Dolby, Pro Logic and the double-D symbol are registered trademarks of Dolby Laboratories. Confidential Unpublished Works.
1992-1997 Dolby Laboratories, Inc.All rights reserved. Manufactured under license from Dolby Laboratories. DTS and DTS-ES are registered trademarks of DTS, Inc. Kodak and Photo CD are trademarks of Eastman Kodak Company. Microsoft, Windows Media, HDCD and High Definition Compatible Digital are registered trademarks of Microsoft Corporation in the United States and/or other countries. Blu-ray Disc is a trademark of the Blu-ray Disc Association. HDMI, the HDMI logo and High-Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC. HD-DVD is a trademark of the DVD Format/Logo Licensing Corporation (DVD FLLC). SACD is a trademark of Sony Corporation. This product incorporates copyright protection technology that is protected by method claims of certain U.S. patents and other intellectual property rights owned by
Macrovision Corporation and other rights owners. Use of this copyright protection technology must be authorized by Macrovision Corporation and is intended for home and other limited viewing uses only unless otherwise authorized by Macrovision Corporation. Reverse engineering or disassembly is prohibited.
38 TECHNICAL SPECIFICATIONS
Page 6
MODEL NAME : DVD 37 & DVD 37/230
D
ifi
f
Audi
o
TDV-540A (ABEX)
,
TDV-540A (ABEX)
harman/kardon
Service manual DVD37EU
Page 6 of 117
escription : Characteristics Spec
cation o
o
Test Disc : YEDS7 (SONY), TDV-540A (ABEX) Test Conditions : 10kΩ Load Terminated, AC100V 50/60Hz Test Measuerment : VP-7722A (Audio Analyzer) ,CASCADE SYS-2522(AP)
1.ANALOG AUDIO OUTPUT
Measurement Item
Output Level[Vrms] L
R
Limit Result
2.0 ± 0.2
YEDS7 (SONY)
Level difference [Vrms] < 0.2 F/ response [dB] L
Ref.1kHz 0dB L
z
2 0 H
100 Hz
10 KHz
20 KHz
R
R
L
R
L
R
L
44 KHz
R
Emphasis L Characteristic[dB] R Ref.1kHz 0dB L
5 KHz
16 KHz
R
S/N [dB] L
R
Channel Separation [dB] L→R
R→L
Linearity [dB] L
-90dB playback R T.H.D [%] L
R
Dynamic Range [dB] L
-60dB playback R 全高調波歪率 [%] L
DVD 96k R Dynamic Range [dB] L DVD 96k R
全高調波歪率 [%] L DVD 48k R Dynamic Range [dB] L DVD 48k R
0± 1.0
0± 1.0
0± 1.0
0± 1.5
0± 1.5
-4.53±1.0
-9.04 ± 1.0
>105
> 95
89.5±3
< 0.01
>93
< 0.01
>95
< 0.01
>95
YEDS7 (SONY)
YEDS7 (SONY)
YEDS7 (SONY)
YEDS7 (SONY)
TDV-540A (ABEX) TITLE 4,CHAPTER
AUDIO STREAM 3
YEDS7 (SONY)
YEDS7 (SONY)
YEDS7 (SONY)
YEDS7 (SONY)
YEDS7 (SONY)
YEDS7 (SONY)
YEDS7 (SONY)
TDV-540A (ABEX)
TITLE 3, CHAPTER 1
TDV-540A (ABEX)
TITLE 3, CHAPTER 2
TITLE 2, CHAPTER 1
TITLE 2, CHAPTER 2
TEST DISC
TRACK 1
TRACK 2
TRACK 4
TRACK 10
TRACK 13
16
TRACK 40
TRACK 41
TRACK 23
TRACK 30
TRACK 22
TRACK 1
TRACK 20
34
2. DIGITAL OUTPUT
1) OPTICAL OUT JITTER 44.1kHz Normal 44.1kHz
JITTER 96kHz Normal 96kHz
2) COAXIAL OUT OUTPUT Level [mV] Normal CD or DVD Peak to Peak Level at 75ohm L
(mUI) CD Playback
(mUI) DVD Playback
< 50mUI
< 50mUI
500±50 (mV)
Playback
Page 7
MODEL NAME : DVD 37& DVD 37/230
harman/kardon
Service manual DVD37EU
Page 7 of 117
Description : Characteristics Specification of Video Test Disc : TDV-540A (ABEX) , MDVD-111 (TEAC) Serial NO.: Test Conditions : 75Ω Load Terminated AC Input : For USA (120V/60Hz) , For Europe (230V/50Hz) Test Measuerment : VM-700T
4. Video Frequency Respoens (75Ω Terminated)
MP用
Measurement Item Result Test Disc
Composite [dB]
Measurement Item Result Test Disc
S-Video Y [dB]
Measurement Item Result Test Disc
Component Y
[dB]
Interace Mode
Limit
0.5MHz 0dB Ref. 0 1MHz 0dB ± 2dB 2MHz 0dB ± 2dB 3MHz 0dB ± 2dB 4MHz 0dB ± 2dB
5.8MHz -3dB ± 2dB
Limit
0.5MHz 0dB Ref. 0 1MHz 0dB ± 2dB 2MHz 0dB ± 2dB 3MHz 0dB ± 2dB 4MHz 0dB ± 2dB
5.8MHz -3dB ± 2dB
Limit
0.5MHz 0dB Ref. 0 1MHz 0dB ± 2dB 2MHz 0dB ± 2dB 3MHz 0dB ± 2dB 4MHz 0dB ± 2dB
5.8MHz -3dB ± 2dB
MDVD-111
TITLE2,CHAPTER9
100% Multi Brust
MDVD-111
TITLE2,CHAPTER9
100% Multi Brust
MDVD-111
TITLE2,CHAPTER9
100% Multi Brust
Page 8
MODEL NAME : DVD 37& DVD 37/230
harman/kardon
Service manual DVD37EU
Page 8 of 117
Description : Characteristics Specification of Video Test Disc : TDV-540A (ABEX) , MDVD-111 (TEAC) Serial NO.: Test Conditions : 75Ω Load Terminated AC Input : For USA (120V/60Hz) , For Europe (230V/50Hz) Test Measuerment : VM-700T
1. Video Level Test (75Ω Terminated)
MP用
Measurement Item Result Test Disc
Limit Composite 1.0V ± 0.1V S-Video Y 1.0V ± 0.1V S-Video C 286mV ± 30mV
Video output [V]
Component Y 1.0V ± 0.1V Component Pb 700mV ± 100mV Component Pr 700mV ± 100mV Scart CVBS 1.0V ± 0.15V
MDVD-111 TITLE2,CHAPTER1 100% COLOR BAR
Scart Red 700mV ± 100mV Scart Green 700mV ± 100mV Scart Blue 700mV ± 100mV
** Pb/Pr & RGB Video Level check before please setting the Black Level off in the set-up menu **
2. Video S/N Raito Test (75Ω Terminated)
Measurement Item Result Test Disc
Limit
Composite ≥ 65.0 dB
Video SNR [dB]
100KHz~4.2MHz
Use SC Trap
S-Video Y ≥ 65.0 dB Component Y ≥ 65.0 dB Component Pb ≥ 65.0 dB
MDVD-111
TITLE2,CHAPTER 4
50% Gray Color
Component Pr ≥ 65.0 dB
3. Chroma Signal AM.PM Test (75Ω Terminated)
Measurement Item Result Test Disc
Chroma AM [dB]
10KHz~500KHz
Chroma PM [dB]
10KHz~500KHz
Composite Chroma ≥ 65.0 dB S-Video Chroma ≥ 65.0 dB
Composite Chroma ≥ 60.0 dB S-Video Chroma ≥ 60.0 dB
Limit
TDV-540A
TITLE2,CHAPTER17
100% Magenta
Color
Page 9
2. DVD-Audio Part (Test Disc V-612 , JVC)
harman/kardon
Service manual DVD37EU
Page 9 of 117
LimitTrack Inform.
Output Level (V)
T.H.D (%) 20KHz LPF
48 / 24
Frequency
Respones (dB)
Ref. : Tr. 38
S/N (dB) "A" Filter
Dynamic Range (dB)
20KHz LPF
96 / 20
192 / 24
Tr.38 1KHz 0dB 2.1±0.2Vrms Tr.38 1KHz 0dB ↓0.01%
Tr.59 17Hz 0±1.0dB Tr.54 10KHz 0±1.0dB Tr.53 20KHz 0±2.0dB
Tr.49 17Hz 0±1.0dB Tr.45 10KHz 0±1.0dB Tr.44 20KHz 0±2.0dB
Tr.22 17Hz 0±1.0dB Tr.18 10KHz 0±1.0dB Tr.17 20KHz 0±2.0dB
Tr.40 Infinity Zero ↑90dB
Tr.39 -60dB ↑85dB
★ SW Level & THD --> Track 38 (30Hz) Play. ★ SW Frequency Respones -> Track 55(31Hz , 0dB) Reference
★ Track 54 (61Hz) , Track 53 (81Hz) , Track 51(127Hz) Play
Downmix 2CH Muiti 5 CH
LT RT FL FR SL SR C
MP
SW
Page 10
TROUBLESHOOTING GUIDE
harman/kardon
Service manual DVD37EU
Page 10 of 117
TROUBLESHOOTING GUIDE
SYMPTOM POSSIBLE CAUSE SOLUTION
Unit does not turn on • No AC power • Check AC power plug and make certain any switched
outlet is turned on.
Disc does not play • Disc loaded improperly • Load disc label-side up; align the disc with the guides and place
it in its proper position.
• Incorrect disc type • Check to see that disc is SACD, CD, CD-R, CD-RW, VCD, MP3, WMA, JPEG, DVD-R, DVD-RW, DVD+R, DVD+RW (standard-conforming), DVD-Audio or DVD-Video; other types will not play.
• Invalid Region Code • Use Region 1 or Open Region (0) disc only.
• Rating is above parental preset • Enter password to override or change rating settings (see page 20).
No picture • Intermittent connections • Check all video connections.
• Wrong input • Check input selection of TV or receiver.
• Progressive Scan output selected • Use Progressive Scan mode only with compatible TV. Press
Interlaced Button
• Video Off feature active • Press
HDMI Output 2 is connected to a • The HDMI Output 2 may not be used with video displays that are not video display that is not HDCP-compliant. HDCP-compliant. Unplug the cable and select another audio and video
Video Off ButtonFto reactivate video circuitry.
connection (see pages 14 through 16).
I to toggle to the correct mode (see page 23).
Progressive Scan/
No sound • Intermittent connections • Check all audio connections.
• Incorrect digital audio selection • Check digital audio settings on DVD 47 and on receiver.
• DVD disc is in fast or slow mode • There is no audio playback on DVD discs during fast or slow modes.
• Surround receiver not compatible • Use analog audio outputs.
with 96kHz PCM audio
• DVD Audio or SACD disc is loaded • Use
without using analog audio connection
Picture is distorted or jumps during • MPEG-2 decoding • It is a normal artifact of DVD playback for pictures to jump or show fast forward or reverse play some distortion during rapid play.
Some remote buttons do not operate • Function not permitted at this time • With most discs, some functions are not permitted at certain during DVD play; prohibited symbol times (e.g., Track Skip) or at all (e.g., direct audio track selection). appears (see below)
The OSD menu is in a foreign language • Incorrect OSD language • Change the display language selection (see page 23).
The symbol appears • Requested function not available at • Certain functions may be disabled by the DVD itself during
this time passages of a disc.
Picture is displayed in the • Incorrect match of aspect ratio settings • Change aspect ratio settings (see page 23). wrong aspect ratio to disc
Remote control inoperative • Weak batteries • Change both batteries.
• Sensor is blocked • Clear path to sensor or use optional outboard remote sensor.
Disc will not copy to VCR • Copy protection • Many DVDs are encoded with copy protection to prevent
6-Channel Audio Outputs 9 or Analog Audio Outputs 8.
copying to VCR.
Password not accepted. • Incorrect password being used or • Stop play of disc. Press and hold
Clear Button 3 until the display blinks.
password has been forgotten. This resets the password and all settings to their defaults.
TROUBLESHOOTING GUIDE 37
Page 11
1. Instruction manual ass'y - Accessories 2. Package Drawing
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Service manual DVD37EU
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DVD7/230
1
POLY BAG
4
MANUAL INSTRUCTION
2
HARMAN IMAGE BROCHURES
4
STAPLE
NO DESCRIPTION PARTS NO.
1
2
SAFETY MANUAL                             CQX1A1049Z
3 4
INSTRUCTION MANUAL CQX1A1053Z
5
STAPLE CPL0905 3
1. Cable ass'y - Accessories
1
POLY BAG
2
BATTERY ASS'Y
3
MANUAL SAFETY
CPB1061YPOLY BAG HQE1A273ZHARMAN IMAGE BROCHURES 1
3
CORD PIN(3P, W/R/Y)
Q,ty
MANUAL ASS'Y
1
REMOCON ASS'Y
6
3
SNOW PAD
SNOW PAD
3
4
SNOW PAD
1
1 1
1
SET
2
CABLE ASS'Y
7
BOX ,OUT CARTON
5
4
CABLE,S-VHS(1.5M)
7
CABLE, HDMI(2M)
8
STAPLE
5
CORF ,JACK(MONO)1200MM
NO DESCRIPTION PARTS NO. Q,ty
1
2
BATTERY
3
CORD,PIN(3P,W/R/Y)
4
CABLE,S-VHS(1.5M)
5
CORD,JACK(MONO)1200MM CJS9D002Z 1
6
AC CORD CJA2B020Z 1
7
CABLE,HDMI(2M) CJS8T001Z 1 STAPLE8 KPL0905
6
AC CORD
CABR03P CJS4S004Z
CJS0I006Z
1CPB1061YPOLY BAG
MANUAL ASS'Y
2 1
1
3
1
2
SET DVD7/230    1 31SNOW,PAD 4
BOX,OUT CARTON
5 6
REMOCON ASS'Y                        CARTDVD37A           1 7
CABLE ASS'Y CQXDVD47 1
DESCRIPTIONNO
CQXDVD37A/230
CPS1A714 CPS1A715SNOW,PAD
CPG1A798V
Q,tyPARTS NO.
1
2
1
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Service manual DVD37EU
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Page 13
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Service manual DVD37EU
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A
See part list
y
Page 14
H
FRONT AND MAIN PCB
harman/kardon
Service manual DVD37EU
Page 14 of 117
Ref# Component Description Drawing No
COP11842F DVD37/230 MAIN PCB ASS'Y DVD37A/230 (EUR) COP11842F-1 FRONT PCB DISPLAY ASS'Y DVD37A/230 (EUR)
COP11842F-2 FRONT PCB CONTROL ASS'Y DVD37A/230 (EUR) CN11 CJP24GA195ZM SMT FFC/FPC WAFER(0.5MM PITC C100 CCUS1H104KC CAP , CHIP C101 CCUS1H104KC CAP , CHIP C102 CCUS1H104KC CAP , CHIP C103 CCUS1H104KC CAP , CHIP C104 CCUS1H104KC CAP , CHIP C106 CCUS1H104KC CAP , CHIP C107 CCUS1H104KC CAP , CHIP C110 CCUS1H104KC CAP , CHIP C112 CCUS1H104KC CAP , CHIP C113 CCUS1H104KC CAP , CHIP C115 CCUS1H104KC CAP , CHIP C117 CCUS1H104KC CAP , CHIP C120 CCUS1H104KC CAP , CHIP C122 CCUS1H104KC CAP , CHIP C124 CCUS1H104KC CAP , CHIP C126 CCUS1H104KC CAP , CHIP C127 CCUS1H104KC CAP , CHIP C129 CCUS1H104KC CAP , CHIP C131 CCUS1H104KC CAP , CHIP C132 CCUS1H104KC CAP , CHIP C133 CCUS1H104KC CAP , CHIP C138 CCUS1H104KC CAP , CHIP C140 CCUS1H104KC CAP , CHIP C141 CCUS1H104KC CAP , CHIP C143 CCUS1H104KC CAP , CHIP
52559-2472 (PB FREE)
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608 C144 CCUS1H103KC CAP , CHIP 0.01UF ZF 1608 C146 CCUS1H104KC CAP , CHIP C148 CCUS1H104KC CAP , CHIP C149 CCUS1H104KC CAP , CHIP C151 CCUS1H104KC CAP , CHIP C152 CCUS1H104KC CAP , CHIP C153 CCUS1H104KC CAP , CHIP C154 CCUS1H104KC CAP , CHIP
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608 C156 CCUS1H180JA CHIP, CAP 18PF/50V/1608 18PF/50V/1608 C156 CCUS1H180JA CHIP, CAP 18PF/50V/1608 18PF/50V/1608 C157 CCUS1H330JA CAP , CHIP C158 CCUS1H330JA CAP , CHIP C159 CCUS1H562KC CHIP CERAMIC CAP. 1608 (5600p) C160 CCUS1H562KC CHIP CERAMIC CAP. 1608 (5600p) C161 CCUS1H562KC CHIP CERAMIC CAP. 1608 (5600p) C163 CCUS1H471JA CAP , CHIP C164 CCUS1H104KC CAP , CHIP C165 CCUS1H104KC CAP , CHIP C166 CCUS1H102KC CAP , CHIP C167 CCUS1H102KC CAP , CHIP C168 CCUS1H102KC CAP , CHIP C169 CCUS1H102KC CAP , CHIP C170 CCUS1H102KC CAP , CHIP
33PF JA 1608 33PF JA 1608 5600PF KC 1608 5600PF KC 1608 5600PF KC 1608 470PF JA 1608
0.1UF ZF 1608
0.1UF ZF 1608
1000PF KC 1608 1000PF KC 1608 1000PF KC 1608 1000PF KC 1608 1000PF KC 1608
Page 15
FRONT AND MAIN PCB
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Service manual DVD37EU
Page 15 of 117
Ref# Component Description Drawing No C172 CCUS1H102KC CAP , CHIP C173 CCUS1H102KC CAP , CHIP C174 CCUS1H333KC CAP , CHIP C175 CCUS1H104KC CAP , CHIP C176 CCUS1H102KC CAP , CHIP C178 CCUS1H104KC CAP , CHIP C179 CCUS1H104KC CAP , CHIP C180 CCUS1H104KC CAP , CHIP C181 CCUS1H104KC CAP , CHIP C183 CCUS1H104KC CAP , CHIP C185 CCUS1H104KC CAP , CHIP C186 CCUS1H104KC CAP , CHIP C187 CCUS1H104KC CAP , CHIP C188 CCUS1H104KC CAP , CHIP C189 CCUS1H104KC CAP , CHIP C190 CCUS1H104KC CAP , CHIP C191 CCUS1H104KC CAP , CHIP C192 CCUS1H104KC CAP , CHIP C193 CCUS1H104KC CAP , CHIP C194 CCUS1H104KC CAP , CHIP C195 CCUS1H104KC CAP , CHIP C196 CCUS1H104KC CAP , CHIP C197 CCUS1H104KC CAP , CHIP C199 CCUS1H104KC CAP , CHIP C200 CCUS1H104KC CAP , CHIP C201 CCUS1H104KC CAP , CHIP C204 CCUS1H104KC CAP , CHIP C205 CCUS1H104KC CAP , CHIP C207 CCUS1H272KC CAP , CHIP C208 CCUS1H102KC CAP , CHIP
1000PF KC 1608 1000PF KC 1608
0.033PF KC 1608 SIZE
0.1UF ZF 1608 1000PF KC 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608 2700PF KC 1608
1000PF KC 1608 C209 CCUS1H273KC CAP , CHIP 27000P KC 1608 C210 CCUS1H102KC CAP , CHIP C214 CCUS1H104KC CAP , CHIP C215 CCUS1H561JA CAP , CHIP C217 CCUS1H273KC CAP , CHIP C218 CCUS1H104KC CAP , CHIP C220 CCUS1H104KC CAP , CHIP C222 CCUS1H104KC CAP , CHIP C225 CCUS1H104KC CAP , CHIP C227 CCUS1H104KC CAP , CHIP C228 CCUS1H222KC CAP , CHIP C229 CCUS1H222KC CAP , CHIP C230 CCUS1H222KC CAP , CHIP C231 CCUS1H222KC CAP , CHIP C232 CCUS1H330JA CAP , CHIP C234 CCUS1H104KC CAP , CHIP C235 CCUS1H104KC CAP , CHIP C237 CCUS1H104KC CAP , CHIP C240 CCUS1H104KC CAP , CHIP C242 CCUS1H104KC CAP , CHIP C244 CCUS1H104KC CAP , CHIP C245 CCUS1H104KC CAP , CHIP
1000PF KC 1608
0.1UF ZF 1608
560PF JA 1608
0.027UF KC 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
2200PF KC 1608
2200PF KC 1608
2200PF KC 1608
2200PF KC 1608
33PF JA 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
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Ref# Component Description Drawing No C247 CCUS1H104KC CAP , CHIP C249 CCUS1H150JA CHIP, CAP 15PF/50V/1608 C250 CCUS1H150JA CHIP, CAP 15PF/50V/1608 C252 CCUS1H104KC CAP , CHIP C253 CCUS1H104KC CAP , CHIP C254 CCUS1H272KC CAP , CHIP C255 CCUS1H104KC CAP , CHIP C256 CCUS1H104KC CAP , CHIP C257 CCUS1H104KC CAP , CHIP C260 CCUS1H104KC CAP , CHIP C261 CCUS1H104KC CAP , CHIP C262 CCUS1H104KC CAP , CHIP C263 CCUS1H104KC CAP , CHIP C266 CCUS1H104KC CAP , CHIP C267 CCUS1H104KC CAP , CHIP C276 CCUS1H104KC CAP , CHIP C277 CCUS1H104KC CAP , CHIP C279 CCUS1H104KC CAP , CHIP C280 CCUS1H104KC CAP , CHIP C281 CCUS1H104KC CAP , CHIP C282 CCUS1H104KC CAP , CHIP C283 CCUS1H104KC CAP , CHIP C284 CCUS1H104KC CAP , CHIP C285 CCUS1H104KC CAP , CHIP C286 CCUS1H104KC CAP , CHIP C287 CCUS1H104KC CAP , CHIP C295 CCUS1H104KC CAP , CHIP C304 HCSHB21A220B CAP , TANTAL B2 SIZE C306 HCSHB21A220B CAP , TANTAL B2 SIZE C307 HCSHB21A220B CAP , TANTAL B2 SIZE C308 HCSHB21A220B CAP , TANTAL B2 SIZE C310 CCUS1H102KC CAP , CHIP C311 CCUS1H560JA CAP , CHIP C312 CCUS1H102KC CAP , CHIP C313 CCUS1H102KC CAP , CHIP C336 CCUS1H682KC CAP , CHIP C337 CCUS1H223KC CAP , CHIP C338 CCUS1H221JA CAP , CHIP C339 CCUS1H104KC CAP , CHIP C346 CCUS1H070DA CAP , CHIP C380 CCUS1H150JA CHIP, CAP 15PF/50V/1608 C401 CCUS1H104KC CAP , CHIP C402 CCUS1H104KC CAP , CHIP C403 CCUS1H102KC CAP , CHIP C405 CCUS1H104KC CAP , CHIP C406 CCUS1H104KC CAP , CHIP C408 CCUS1H104KC CAP , CHIP C429 CCUS1H104KC CAP , CHIP
0.1UF ZF 1608 15PF JA 1608 15PF JA 1608
0.1UF ZF 1608
0.1UF ZF 1608 2700PF KC 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608 22UF/50V 22UF/50V 22UF/50V 22UF/50V 1000PF KC 1608 56PF JA 1608 1000PF KC 1608 1000PF KC 1608 6800PF KB 1608
0.022UF KC 1608 220PF JA 1608
0.1UF ZF 1608 7PF D 1608 15PF JA 1608
0.1UF ZF 1608
0.1UF ZF 1608 1000PF KC 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608 C430 CRJ10DJ0R0T RES , CHIP 0 ohm 1608 C431 CCUS1H221JA CAP , CHIP C432 CCUS1H104KC CAP , CHIP C511 CCUS1H151JA CAP , CHIP
220PF JA 1608
0.1UF ZF 1608
150PF JA 1608
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Ref# Component Description Drawing No C531 CCUS1H104KC CAP , CHIP C533 CCUS1H104KC CAP , CHIP C552 CCUS1H104KC CAP , CHIP C553 CCUS1H104KC CAP , CHIP C555 CCUS1H150JA CHIP, CAP 15PF/50V/1608 C556 CCUS1H150JA CHIP, CAP 15PF/50V/1608 C578 CCUS1H104KC CAP , CHIP C580 CCUS1H104KC CAP , CHIP C581 CCUS1H104KC CAP , CHIP C584 CCUS1H104KC CAP , CHIP C585 CCUS1H104KC CAP , CHIP C593 CCUS1H104KC CAP , CHIP C594 CCUS1H104KC CAP , CHIP C615 CCUS1H391JA CAP , CHIP C617 CCUS1H104KC CAP , CHIP C620 CCUS1H104KC CAP , CHIP C630 CCUS1H104KC CAP , CHIP C631 CCUS1H104KC CAP , CHIP C636 CCUS1H391JA CAP , CHIP C638 CCUS1H391JA CAP , CHIP C639 CCUS1H391JA CAP , CHIP C641 CCUS1H391JA CAP , CHIP C644 CCUS1H391JA CAP , CHIP C646 CCUS1H391JA CAP , CHIP C650 CCUS1H391JA CAP , CHIP C657 CCUS1H391JA CAP , CHIP C659 CCUS1H391JA CAP , CHIP C660 CCUS1H391JA CAP , CHIP C662 CCUS1H391JA CAP , CHIP C664 CCUS1H104KC CAP , CHIP C665 CCUS1H104KC CAP , CHIP C668 CCUS1H104KC CAP , CHIP C671 CCUS1H104KC CAP , CHIP C672 CCUS1H104KC CAP , CHIP C674 CCUS1H104KC CAP , CHIP C677 CCUS1H104KC CAP , CHIP C678 CCUS1H104KC CAP , CHIP C679 CCUS1H104KC CAP , CHIP C809 CCUS1H104KC CAP , CHIP C810 CCUS1H560JA CAP , CHIP C812 CCUS1H101JA CAP , CHIP C817 CCUS1H104KC CAP , CHIP C819 CCUS1H101JA CAP , CHIP C820 CCUS1H101JA CAP , CHIP
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608 15PF JA 1608 15PF JA 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608 390PF JA 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608 390PF JA 1608 390PF JA 1608 390PF JA 1608 390PF JA 1608 390PF JA 1608 390PF JA 1608 390PF JA 1608 390PF JA 1608 390PF JA 1608 390PF JA 1608 390PF JA 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608
0.1UF ZF 1608 56PF JA 1608 100PF JA 1608
0.1UF ZF 1608 100PF JA 1608
100PF JA 1608 C822 CCUS1H560JA CAP , CHIP 56PF JA 1608 C823 CCUS1H104KC CAP , CHIP
0.1UF ZF 1608 C828 CCUS1H220JA CAP , CHIP 22PF JA 1608 C830 CCUS1H150JA CHIP, CAP 15PF/50V/1608 C831 CCUS1H150JA CHIP, CAP 15PF/50V/1608 C834 CCUS1H104KC CAP , CHIP
15PF JA 1608 15PF JA 1608
0.1UF ZF 1608 D101 HVDRLS4148SR DIODE, SWITCHING, SMD TYPE RLS4148 TE-11 D102 HVDRLS4148SR DIODE, SWITCHING, SMD TYPE RLS4148 TE-11
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Ref# Component Description Drawing No D501 HVDRLS4148SR DIODE, SWITCHING, SMD TYPE RLS4148 TE-11 D502 HVDRLS4148SR DIODE, SWITCHING, SMD TYPE RLS4148 TE-11 D511 HVDRLS4148SR DIODE, SWITCHING, SMD TYPE RLS4148 TE-11 D601 HVDRLS4148SR DIODE, SWITCHING, SMD TYPE RLS4148 TE-11 D602 HVDRLS4148SR DIODE, SWITCHING, SMD TYPE RLS4148 TE-11 D603 HVDRLS4148SR DIODE, SWITCHING, SMD TYPE RLS4148 TE-11 IC10 HVIZR36778 IC,MPEG (ZORAN)
ZR36778 IC11 HVILM1117S-3V3 I.C , REGULATOR (3.3V) 1117S-3.3V IC12 HVILM1117S-1V8 I.C , REGULATOR (1.8V) LM1117-1V8 IC13 HVILM1117S-3V3 I.C , REGULATOR (3.3V) 1117S-3.3V IC14 HVILM1117S-1V8 I.C , REGULATOR (1.8V) LM1117-1V8 IC15 HVIAT24C08N10SC I.C AT24C08N10SC2.7 IC16 HVISAA7893HLC2 IC,DSD DECODER (Philips) SAA7893HL/C2 (PB FR IC17 HVI74VHC04MX I.C , INVERTER 74VHC04M IC18 HVIM12L64164A7T IC, 64M SDRAM (4X16) IC19 HVIZR36721 IC,HDMI TRANSMITTER(ZORAN) IC20 HVITL3472IDR IC,OP AMP 8-SOIC (TI)
M12L64164A7T
ZR36721
TL3472 IC21 HVIM29W160ET70N IC,16M FLASH (ST) M29W160ET-70N6 IC22 HVIM12L64164A7T IC, 64M SDRAM (4X16)
M12L64164A7T IC23 HVIAM5888SLF I. C , Motor Driver(AMtek,Pb f AM5888S L/F IC24 HVIZR36707 IC,RF (ZORAN)
ZR36707 IC40 HVICS4382-KQ I.C , DAC CS4382-KQ IC41 BVIBH7862FS IC , 6CH VIDEO DRIVER ROHM (BH7862FS) IC42 HVIBA7660FS IC , R.G.B DRIVER BA7660FS IC43 HVI74LVC157ADBR I.C , MULTIPLEXER SN74LVC157A IC44 HVI74LVC157ADBR I.C , MULTIPLEXER SN74LVC157A IC45 HVIST72F324K2 IC,FLASH (ST)
ST72F324K2 IC47 HVITC74HCT7007F I.C TC74HC7007AFEL IC51 HVILM1117S-5.0 IC REGULATOR/SOT-223
LM1117-1V8 (1.8V) IC52 HVINJM2068MDTE1 I.C , OP AMP NJM2068MD-TE1 IC53 HVILM1117S-3V3 I.C , REGULATOR (3.3V) 1117S-3.3V IC54 HVINJM2068MDTE1 I.C , OP AMP NJM2068MD-TE1 IC55 HVINJM2068MDTE1 I.C , OP AMP NJM2068MD-TE1 IC56 HVILM1117S-5.0 IC REGULATOR/SOT-223
LM1117-5V0 (5V) IC57 HVTHN1K05FU MOS FET HN1K05FU JK07 HJJ9H003Z JACK,HDMI (JALCO) YKF45-7009 L101 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L102 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L103 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L104 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L105 HLQ06E100KRZ INDUCTOR , CHIP L106 HLQ06E100KRZ INDUCTOR , CHIP L107 HLQ06E100KRZ INDUCTOR , CHIP
10UH 3225 SIZE
10UH 3225 SIZE
10UH 3225 SIZE L109 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L110 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L111 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L112 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L113 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L114 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L115 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L116 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L117 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A
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Ref# Component Description Drawing No L118 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L119 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L120 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L121 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L122 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L123 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L124 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L125 HLZ9R006Z BEAD , CHIP L126 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L127 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L128 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L217 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L518 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L519 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L520 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L521 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L522 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L601 BLZ9R004Z BEAD CHIP 90 OHM (2012 SIZE) ACM2012H-900 L602 BLZ9R004Z BEAD CHIP 90 OHM (2012 SIZE) ACM2012H-900 L603 BLZ9R004Z BEAD CHIP 90 OHM (2012 SIZE) ACM2012H-900 L604 BLZ9R004Z BEAD CHIP 90 OHM (2012 SIZE) ACM2012H-900 L610 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L611 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L612 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L613 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L614 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L615 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L616 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L617 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L696 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L801 HLQ08ER68KRZ CHIP FERRITE INDUCTOR 2012-R68UH L802 HLQ08E1R8KRZ CHIP , COIL (1.8UH) 1.8UH 2012 SIZE L803 HLQ08E1R8KRZ CHIP , COIL (1.8UH) 1.8UH 2012 SIZE L804 HLQ09E8R2KRZ CHIP , COIL 8.2UH 2012 SIZE L805 HLQ08ER68KRZ CHIP FERRITE INDUCTOR 2012-R68UH L806 HLQ08ER39KRZ CHIP FERRITE INDUCTOR 2012-R39UH L807 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L808 HLZ9R001Z FB, 2012(0805)600E, 1.5A,POWER 600E, 1.5A L809 HLQ09E8R2KRZ CHIP , COIL
8.2UH L884 HLQ08E1R8KRZ CHIP , COIL (1.8UH) 1.8UH 2012 SIZE Q105 HVTKTA1664YP tr Q106 HVTKTA1664YP tr
KTA1664
KTA1664 Q108 HVT2N3904SP TR, CHIP (KEC) 2N3904S-RTK/PS Q109 HVT2N3904SP TR, CHIP (KEC) 2N3904S-RTK/PS Q110 HVT2N3904SP TR, CHIP (KEC) 2N3904S-RTK/PS Q307 HVT2SA1955B T.R, TE85L,F, SSM Type, hFE=B TE85L,F SSM TYPE HF Q308 HVT2N3904SP TR, CHIP (KEC) 2N3904S-RTK/PS Q315 HVTKRC107S TR , CHIP
KRC107S Q316 HVTKTA1504SYRTK T.R , CHIP KTA1504S Y RTK Q404 HVT2N3904SP TR, CHIP (KEC) 2N3904S-RTK/PS Q407 HVTKRC107S TR , CHIP
KRC107S Q408 HVTKRA107ST T.R , CHIP KRA107S
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Ref# Component Description Drawing No Q501 HVTKTA1504SYRTK T.R , CHIP KTA1504S Y RTK Q502 HVTKTC3875SYRTK T.R , CHIP KTC3875S Y RTK Q604 HVTKRA107ST T.R , CHIP KRA107S Q606 HVTKRA107ST T.R , CHIP KRA107S Q607 HVTKRA107ST T.R , CHIP KRA107S Q608 HVTKRC107S TR , CHIP
KRC107S Q609 HVTKTD1304T T.R , CHIP (MUTE) KTD1304 Q610 HVTKTD1304T T.R , CHIP (MUTE) KTD1304 Q611 HVTKTD1304T T.R , CHIP (MUTE) KTD1304 Q612 HVTKTD1304T T.R , CHIP (MUTE) KTD1304 Q613 HVTKTD1304T T.R , CHIP (MUTE) KTD1304 Q614 HVTKTD1304T T.R , CHIP (MUTE) KTD1304 Q615 HVTKRA107ST T.R , CHIP KRA107S Q616 HVTKRC107S TR , CHIP
KRC107S Q617 HVTKTD1304T T.R , CHIP (MUTE) KTD1304 Q618 HVTKTD1304T T.R , CHIP (MUTE) KTD1304 Q619 HVTKTD1304T T.R , CHIP (MUTE) KTD1304 Q620 HVTKTD1304T T.R , CHIP (MUTE) KTD1304 Q621 HVTKTD1304T T.R , CHIP (MUTE) KTD1304 Q622 HVTKTD1304T T.R , CHIP (MUTE) KTD1304 Q801 HVTKRC107S TR , CHIP KRC107S Q802 HVTKRC107S TR , CHIP KRC107S Q803 HVTKTA1504SYRTK T.R , CHIP KTA1504S Y RTK Q804 HVTKTA1504SYRTK T.R , CHIP KTA1504S Y RTK Q805 HVTKTD1304T T.R , CHIP (MUTE) KTD1304 Q806 HVTKRA107ST T.R , CHIP KRA107S Q821 HVTKTA1504SYRTK T.R , CHIP KTA1504S Y RTK R100 CRJ10DJ472T RES , CHIP 4.7K OHM 1608 SIZE R101 CRJ10DF4700T RES, CHIP 470 OHM/1608/1%
470 OHM(1%) 1608 SIZ R102 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE R103 CRJ10DF4300T RES
430 OHM(1%) 1608 SIZ R104 CRJ10DF3920T RES. CHIP (392R 1%) 3.9K OHM 1608 SIZE R105 CRJ10DJ0R0T RES , CHIP
0 OHM 1608 SIZE R106 CRJ104DJ101T RES, ARRAY, 100R (1608) 100 OHM 1608 SIZE R107 CRJ10DJ330T RES , CHIP 33 OHM 1608 SIZE R108 CRJ10DJ101T RES , CHIP 100 OHM 1608 SIZE R109 CRJ10DJ472T RES , CHIP
100 OHM 1608 SIZE R110 CRJ10DJ332T RES , CHIP 3.3K OHM 1608 SIZE R111 CRJ104DJ330T RES , 4ARRAY (1608*4) 33 OHM/1608*4 R112 CRJ10DJ202T RES , CHIP R113 CRJ10DJ202T RES , CHIP R114 CRJ10DJ121T RES , CHIP R115 CRJ10DJ0R0T RES , CHIP R116 CRJ10DJ121T RES , CHIP R117 CRJ10DJ121T RES , CHIP
2K OHM 1608 SIZE
2K OHM 1608 SIZE
120 OHM 1608 SIZE
0 OHM 1608 SIZE
120 OHM 1608 SIZE
120 OHM 1608 SIZE R118 CRJ10DJ103T RES , CHIP 10K OHM1608 SIZE R119 CRJ10DJ330T RES , CHIP 33 OHM 1608 SIZE R120 CRJ10DJ123T RES , CHIP 12K OHM 1608 SIZE R121 CRJ10DJ221T RES , CHIP 220 OHM 1608 SIZE R122 CRJ10DJ221T RES , CHIP 220 OHM 1608 SIZE R123 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE R124 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE
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Ref# Component Description Drawing No R125 CRJ10DJ113T RES , CHIP 11K OHM 1608 SIZE R126 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE R127 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE R128 CRJ10DJ121T RES , CHIP 120 OHM 1608 SIZE R129 CRJ104DJ330T RES , 4ARRAY (1608*4) 33 OHM/1608*4 R130 CRJ104DJ330T RES , 4ARRAY (1608*4) 33 OHM/1608*4 R131 CRJ10DJ330T RES , CHIP 33 OHM 1608 SIZE R132 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE R133 CRJ10DF3920T RES. CHIP (392R 1%) 3.9K OHM 1608 SIZE R134 CRJ10DJ103T RES , CHIP 10K OHM 1608 SIZE R135 CRJ10DJ100T RES , CHIP 10 OHM 1608 SIZE R136 CRJ10DJ221T RES , CHIP 220 OHM 1608 SIZE R137 CRJ10DJ221T RES , CHIP 220 OHM 1608 SIZE R138 CRJ10DJ100T RES , CHIP 10 OHM 1608 SIZE R139 CRJ10DJ472T RES , CHIP 4.7K OHM 1608 SIZE R140 CRJ10DJ133T RES , CHIP 13K OHM 1608 SIZE R141 CRJ10DJ474T RES , CHIP 470K OHM 1608 SIZE R142 CRJ10DJ474T RES , CHIP 470K OHM 1608 SIZE R143 CRJ10DJ330T RES , CHIP 33 OHM 1608 SIZE R144 CRJ10DJ330T RES , CHIP 33 OHM 1608 SIZE R145 CRJ10DJ750T RES , CHIP 75 OHM 1608 SIZE R146 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE R147 CRJ10DJ104T RES , CHIP 100K OHM 1608 SIZE R148 CRJ10DJ750T RES , CHIP 57 OHM 1608 SIZE R149 CRJ104DJ470T RES , 4ARRAY (1608*4) R150 CRJ104DJ470T RES , 4ARRAY (1608*4) R151 CRJ10DJ0R0T RES , CHIP R152 CRJ10DJ0R0T RES , CHIP R153 CRJ10DJ0R0T RES , CHIP R154 CRJ10DJ0R0T RES , CHIP
47 OHM/1608X4 47 OHM/1608X4 0 OHM 1608 SIZE 0 OHM 1608 SIZE 0 OHM 1608 SIZE
0 OHM 1608 SIZE R155 CRJ10DJ101T RES , CHIP 100 OHM 1608 SIZE R156 CRJ10DJ101T RES , CHIP 100 OHM 1608 SIZE R157 CRJ10DJ0R0T RES , CHIP 1608 SIZE R158 CRJ104DJ101T RES, ARRAY, 100R (1608) 100R (1608) R159 CRJ10DJ472T RES , CHIP 1608 SIZE R160 CRJ10DJ330T RES , CHIP 1608 SIZE R161 CRJ10DJ0R0T RES , CHIP 1608 SIZE R162 CRJ104DJ330T RES , 4ARRAY (1608*4) 33 OHM/1608*4 R163 CRJ104DJ330T RES , 4ARRAY (1608*4) 33 OHM/1608*4 R164 CRJ104DJ330T RES , 4ARRAY (1608*4) 33 OHM/1608*4 R165 CRJ10DJ330T RES , CHIP 1608 SIZE R166 CRJ10DJ330T RES , CHIP 1608 SIZE R167 CRJ10DJ330T RES , CHIP 1608 SIZE R168 CRJ104DJ330T RES , 4ARRAY (1608*4) 33 OHM/1608*4 R169 CRJ10DJ750T RES , CHIP 1608 SIZE R170 CRJ104DJ330T RES , 4ARRAY (1608*4) 33 OHM/1608*4 R171 CRJ104DJ330T RES , 4ARRAY (1608*4) 33 OHM/1608*4 R172 CRJ104DJ330T RES , 4ARRAY (1608*4) 33 OHM/1608*4 R173 CRJ104DJ330T RES , 4ARRAY (1608*4) 33 OHM/1608*4 R174 CRJ10DJ472T RES , CHIP
4.7K OHM 1608 SIZE R175 CRJ10DJ912T RES , CHIP 9.1K OHM/1608 R176 CRJ10DJ132T RES , CHIP
1.3K OHM 1608 SIZE
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Ref# Component Description Drawing No R177 CRJ10DJ132T RES , CHIP R178 CRJ10DJ272T RES , CHIP R180 CRJ10DJ0R0T RES , CHIP R181 CRJ10DJ0R0T RES , CHIP R182 CRJ10DJ0R0T RES , CHIP R183 CRJ10DF1202T RES , CHIP 1% R184 CRJ10DJ471T RES , CHIP R185 CRJ10DJ332T RES , CHIP R186 CRJ10DJ332T RES , CHIP R187 CRJ10DJ332T RES , CHIP R188 CRJ10DJ113T RES , CHIP R189 CRJ10DJ105T RES , CHIP R190 CRJ10DJ223T RES , CHIP R191 CRJ10DJ223T RES , CHIP R192 CRJ10DJ103T RES , CHIP R193 CRJ10DJ332T RES , CHIP R194 CRJ10DJ330T RES , CHIP R195 CRJ10DJ101T RES , CHIP R196 CRJ10DJ472T RES , CHIP R197 CRJ10DJ753T RES , CHIP
1.3K OHM 1608 SIZE
2.7K OHM 1608 SIZE 0 OHM 1608 SIZE 0 OHM 1608 SIZE 0 OHM 1608 SIZE
1.2K OHM(1%) 1608 SI 470 OHM 1608 SIZE
3.3K OHM 1608 SIZE
3.3K OHM 1608 SIZE
3.3K OHM 1608 SIZE 11K OHM 1608 SIZE 1M OHM 1608 SIZE 22K OHM 1608 SIZE 22K OHM 1608 SIZE 10K OHM 1608 SIZE
3.3K OHM 1608 SIZE 33 OHM 1608 SIZE 100 OHM 1608 SIZE
4.7K OHM 1608 SIZE
75K OHM 1608 SIZE R198 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE R199 CRJ10DJ330T RES , CHIP 33 OHM 1608 SIZE R200 CRJ10DJ330T RES , CHIP 33 OHM 1608 SIZE R201 CRJ10DJ472T RES , CHIP 4.7K OHM 1608 SIZE R202 CRJ10DJ622T RES , CHIP 6.2K OHM 1608 SIZE R203 CRJ10DJ562T RES , CHIP 5.6K OHM 1608 SIZE R204 CRJ10DJ562T RES , CHIP 5.6K OHM 1608 SIZE R205 CRJ10DJ562T RES , CHIP 5.6K OHM 1608 SIZE R206 CRJ10DJ103T RES , CHIP 10K OHM 1608 SIZE R207 CRJ10DF4700T RES, CHIP 470 OHM/1608/1% R209 CRJ10DF1002T RES , CHIP 1% R210 CRJ10DF1002T RES , CHIP 1% R211 CRJ10DF1002T RES , CHIP 1%
470 OHM(1%) 1608 SIZ
10K OHM(1%) 1608 SI
10K OHM(1%) 1608 SI
10K OHM(1%) 1608 SI R212 CRJ104DJ330T RES , 4ARRAY (1608*4) 33 OHM/1608*4 R213 CRJ104DJ330T RES , 4ARRAY (1608*4) 33 OHM/1608*4 R214 CRJ104DJ330T RES , 4ARRAY (1608*4) 33 OHM/1608*4 R215 CRJ104DJ330T RES , 4ARRAY (1608*4) 33 OHM/1608*4 R216 CRJ104DJ330T RES , 4ARRAY (1608*4) 33 OHM/1608*4 R217 CRJ10DJ330T RES , CHIP 1608 SIZE R218 CRJ104DJ330T RES , 4ARRAY (1608*4) 33 OHM/1608*4 R219 CRJ10DJ273T RES , CHIP 27K OHM 1608 SIZE R220 CRJ10DJ562T RES , CHIP R221 CRJ10DJ562T RES , CHIP R222 CRJ10DJ562T RES , CHIP
5.6K OHM 1608 SIZE
5.6K OHM 1608 SIZE
5.6K OHM 1608 SIZE R223 CRJ10DJ103T RES , CHIP 10K OHM 1608 SIZE R224 CRJ10DJ472T RES , CHIP 4.7K OHM 1608 SIZE R225 CRJ10DJ330T RES , CHIP 33 OHM 1608 SIZE R226 CRJ10DJ330T RES , CHIP 33 OHM 1608 SIZE R227 CRJ10DJ330T RES , CHIP 33 OHM 1608 SIZE R228 CRJ10DJ330T RES , CHIP 33 OHM 1608 SIZE R230 CRJ10DJ472T RES , CHIP 4.7K OHM 1608 SIZE R241 CRJ10DF75R0T RES, CHIP 1% 75 OHM 75 OHM, 1%
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Ref# Component Description Drawing No R243 CRJ10DF75R0T RES, CHIP 1% 75 OHM 75 OHM, 1% R244 CRJ10DF75R0T RES, CHIP 1% 75 OHM 75 OHM, 1% R265 CRJ10DJ472T RES , CHIP R284 CRJ10DJ472T RES , CHIP R285 CRJ10DJ472T RES , CHIP R287 CRJ10DJ113T RES , CHIP R297 CRJ10DJ0R0T RES , CHIP R298 CRJ10DJ103T RES , CHIP R299 CRJ10DJ0R0T RES , CHIP R301 CRJ10DJ0R0T RES , CHIP R302 CRJ10DJ0R0T RES , CHIP R303 CRJ10DJ0R0T RES , CHIP R305 CRJ10DJ472T RES , CHIP R306 CRJ10DJ0R0T RES , CHIP R307 CRJ10DJ272T RES , CHIP R308 CRJ10DJ102T RES , CHIP R309 CRJ10DJ102T RES , CHIP R377 CRJ10DJ221T RES , CHIP R404 CRJ10DJ333T RES , CHIP R409 CRJ10DJ100T RES , CHIP R410 CRJ10DJ103T RES , CHIP R412 CRJ10DJ681T RES , CHIP R413 CRJ10DJ821T RES , CHIP R414 CRJ10DJ122T RES , CHIP R415 CRJ10DJ152T RES , CHIP R416 CRJ10DJ222T RES , CHIP R417 CRJ10DJ332T RES , CHIP R418 CRJ10DJ472T RES , CHIP R419 CRJ10DJ221T RES , CHIP R420 CRJ10DJ750T RES , CHIP R421 CRJ10DJ680T RES , CHIP R422 CRJ10DJ121T RES , CHIP R423 CRJ10DJ820T RES , CHIP R424 CRJ10DJ4R7T RES , CHIP R425 CRJ10DJ332T RES , CHIP R501 CRJ10DJ182T RES , CHIP R502 CRJ10DJ182T RES , CHIP R503 CRJ10DJ103T RES , CHIP R504 CRJ10DJ473T RES , CHIP R505 CRJ10DJ470T RES , CHIP R506 CRJ10DJ271T RES , CHIP R511 CRJ10DJ0R0T RES , CHIP R512 CRJ10DJ0R0T RES , CHIP R513 CRJ10DJ103T RES , CHIP R514 CRJ10DJ100T RES , CHIP R515 CRJ10DJ103T RES , CHIP R516 CRJ10DJ103T RES , CHIP R517 CRJ10DJ103T RES , CHIP R518 CRJ10DJ103T RES , CHIP R519 CRJ10DJ473T RES , CHIP R522 CRJ10DJ0R0T RES , CHIP R533 CRJ10DJ0R0T RES , CHIP
4.7K OHM 1608 SIZE
4.7K OHM 1608 SIZE
4.7K OHM 1608 SIZE 11K OHM 1608 SIZE 0 OHM 1608 SIZE 10K OHM 1608 SIZE 0 OHM 1608 SIZE 0 OHM 1608 SIZE 0 OHM 1608 SIZE 0 OHM 1608 SIZE
4.7K OHM 1608 SIZE 0 OHM 1608 SIZE
2.7K OHM 1608 SIZE 1K OHM 1608 SIZE 1K OHM 1608 SIZE 220 OHM 1608 SIZE 33K OHM 1608 SIZE 10 OHM 1608 SIZE 10K OHM 1608 SIZE 680 OHM 1608 SIZE 820 OHM 1608 SIZE
1.2K OHM 1608 SIZE
1.5K OHM 1608 SIZE
2.2K OHM 1608 SIZE
3.3K OHM 1608 SIZE
4.7K OHM 1608 SIZE 220 OHM 1608 SIZE 75 OHM 1608 SIZE 68 OHM 1608 SIZE 120 OHM 1608 SIZE 82 OHM 1608 SIZE
4.7 OHM 1608 SIZE
3.3K OHM 1608 SIZE
1.8K OHM 1608 SIZE
1.8K OHM 1608 SIZE 10K OHM 1608 SIZE 47K OHM 1608 SIZE 47 OHM 1608 SIZE 270 OHM 1608 SIZE 0 OHM 1608 SIZE 0 OHM 1608 SIZE 10K OHM 1608 SIZE 10 OHM 1608 SIZE 10K OHM 1608 SIZE 10K OHM 1608 SIZE 10K OHM 1608 SIZE 10K OHM 1608 SIZE 47K OHM 1608 SIZE 0 OHM 1608 SIZE 0 OHM 1608 SIZE
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Ref# Component Description Drawing No R544 CRJ10DJ0R0T RES , CHIP R549 CRJ10DJ105T RES , CHIP R552 CRJ10DJ0R0T RES , CHIP R553 CRJ10DJ0R0T RES , CHIP R564 CRJ10DJ472T RES , CHIP R593 CRJ10DJ0R0T RES , CHIP R600 CRJ10DJ132T RES , CHIP R601 CRJ10DJ132T RES , CHIP R602 CRJ10DJ132T RES , CHIP R603 CRJ10DJ132T RES , CHIP R604 CRJ10DJ132T RES , CHIP R605 CRJ10DJ132T RES , CHIP R606 CRJ10DJ132T RES , CHIP R607 CRJ10DJ132T RES , CHIP R608 CRJ10DJ132T RES , CHIP R609 CRJ10DJ132T RES , CHIP R611 CRJ10DJ0R0T RES , CHIP R612 CRJ10DJ332T RES , CHIP R618 CRJ10DJ332T RES , CHIP R619 CRJ10DJ101T RES , CHIP R620 CRJ10DJ132T RES , CHIP R621 CRJ10DJ132T RES , CHIP R622 CRJ10DJ132T RES , CHIP R623 CRJ10DJ132T RES , CHIP R624 CRJ10DJ102T RES , CHIP R625 CRJ10DJ332T RES , CHIP R626 CRJ10DJ332T RES , CHIP R627 CRJ10DJ332T RES , CHIP R628 CRJ10DJ102T RES , CHIP R629 CRJ10DJ332T RES , CHIP R630 CRJ10DJ221T RES , CHIP R631 CRJ10DJ221T RES , CHIP R632 CRJ10DJ104T RES , CHIP R633 CRJ10DJ104T RES , CHIP R641 CRJ10DJ224T RES , CHIP R642 CRJ10DJ224T RES , CHIP R650 CRJ10DJ132T RES , CHIP R651 CRJ10DJ132T RES , CHIP R652 CRJ10DJ132T RES , CHIP R653 CRJ10DJ132T RES , CHIP R654 CRJ10DJ102T RES , CHIP R655 CRJ10DJ332T RES , CHIP R656 CRJ10DJ332T RES , CHIP R657 CRJ10DJ332T RES , CHIP R658 CRJ10DJ102T RES , CHIP R659 CRJ10DJ332T RES , CHIP R660 CRJ10DJ102T RES , CHIP R661 CRJ10DJ102T RES , CHIP R662 CRJ10DJ104T RES , CHIP R663 CRJ10DJ104T RES , CHIP R664 CRJ10DJ102T RES , CHIP R665 CRJ10DJ102T RES , CHIP
0 OHM 1608 SIZE 1M OHM 1608 SIZE 0 OHM 1608 SIZE 0 OHM 1608 SIZE
4.7K OHM 1608 SIZE 0 OHM 1608 SIZE
1.3K OHM 1608 SIZE
1.3K OHM 1608 SIZE
1.3K OHM 1608 SIZE
1.3K OHM 1608 SIZE
1.3K OHM 1608 SIZE
1.3K OHM 1608 SIZE
1.3K OHM 1608 SIZE
1.3K OHM 1608 SIZE
1.3K OHM 1608 SIZE
1.3K OHM 1608 SIZE 0 OHM 1608 SIZE
3.3K OHM 1608 SIZE
3.3K OHM 1608 SIZE 100 OHM 1608 SIZE
1.3K OHM 1608 SIZE
1.3K OHM 1608 SIZE
1.3K OHM 1608 SIZE
1.3K OHM 1608 SIZE 1K OHM 1608 SIZE
3.3K OHM 1608 SIZE
3.3K OHM 1608 SIZE
3.3K OHM 1608 SIZE 1K OHM 1608 SIZE
3.3K OHM 1608 SIZE 220 OHM 1608 SIZE 220 OHM 1608 SIZE 1M OHM 1608 SIZE 1M OHM 1608 SIZE 220K OHM 1608 SIZE 220K OHM 1608 SIZE
1.3K OHM 1608 SIZE
1.3K OHM 1608 SIZE
1.3K OHM 1608 SIZE
1.3K OHM 1608 SIZE 1K OHM 1608 SIZE
3.3K OHM 1608 SIZE
3.3K OHM 1608 SIZE
3.3K OHM 1608 SIZE 1K OHM 1608 SIZE
3.3K OHM 1608 SIZE 1K OHM 1608 SIZE 1K OHM 1608 SIZE 100K OHM 1608 SIZE 100K OHM 1608 SIZE 1K OHM 1608 SIZE 1K OHM 1608 SIZE
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FRONT AND MAIN PCB
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Service manual DVD37EU
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Ref# Component Description Drawing No R666 CRJ10DJ102T RES , CHIP R667 CRJ10DJ102T RES , CHIP R668 CRJ10DJ104T RES , CHIP R669 CRJ10DJ104T RES , CHIP R670 CRJ10DJ102T RES , CHIP R671 CRJ10DJ102T RES , CHIP R672 CRJ10DJ332T RES , CHIP R673 CRJ10DJ102T RES , CHIP R674 CRJ10DJ332T RES , CHIP R675 CRJ10DJ102T RES , CHIP R676 CRJ10DJ102T RES , CHIP R677 CRJ10DJ102T RES , CHIP R678 CRJ10DJ132T RES , CHIP R679 CRJ10DJ132T RES , CHIP R680 CRJ10DJ132T RES , CHIP R681 CRJ10DJ132T RES , CHIP
1K OHM 1608 SIZE 1K OHM 1608 SIZE 100K OHM 1608 SIZE 100K OHM 1608 SIZE 1K OHM 1608 SIZE 1K OHM 1608 SIZE
3.3K OHM 1608 SIZE 1K OHM 1608 SIZE
3.3K OHM 1608 SIZE 1K OHM 1608 SIZE 1K OHM 1608 SIZE 1K OHM 1608 SIZE
1.3K OHM 1608 SIZE
1.3K OHM 1608 SIZE
1.3K OHM 1608 SIZE
1.3K OHM 1608 SIZE R682 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE R683 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE R684 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE R685 CRJ10DJ101T RES , CHIP 100 OHM 1608 SIZE R686 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE R687 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE R688 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE R689 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE R690 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE R691 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE R692 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE R694 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE R695 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE R698 CRJ10DJ132T RES , CHIP 1.3K OHM 1608 SIZE R699 CRJ10DJ132T RES , CHIP 1.3K OHM 1608 SIZE R726 CRJ10DJ474T RES , CHIP 470K OHM 1608 SIZE R727 CRJ10DJ221T RES , CHIP 220 OHM 1608 SIZE R728 CRJ10DJ223T RES , CHIP 22K OHM 1608 SIZE R729 CRJ10DJ221T RES , CHIP 220 OHM 1608 SIZE R730 CRJ10DJ221T RES , CHIP 220 OHM 1608 SIZE R731 CRJ10DJ221T RES , CHIP 220 OHM 1608 SIZE R732 CRJ10DJ221T RES , CHIP 220 OHM 1608 SIZE R733 CRJ10DJ222T RES , CHIP 2.2K OHM 1608 SIZE R734 CRJ10DJ222T RES , CHIP 2.2K OHM 1608 SIZE R735 CRJ10DJ222T RES , CHIP 2.2K OHM 1608 SIZE R736 CRJ10DJ222T RES , CHIP 2.2K OHM 1608 SIZE R737 CRJ10DJ222T RES , CHIP 2.2K OHM 1608 SIZE R738 CRJ10DJ222T RES , CHIP 2.2K OHM 1608 SIZE R739 CRJ10DJ224T RES , CHIP 220K OHM 1608 SIZE R744 CRJ10DJ222T RES , CHIP 2.2K OHM 1608 SIZE R745 CRJ10DJ222T RES , CHIP 2.2K OHM 1608 SIZE R746 CRJ10DJ222T RES , CHIP 2.2K OHM 1608 SIZE R747 CRJ10DJ222T RES , CHIP 2.2K OHM 1608 SIZE R748 CRJ10DJ222T RES , CHIP 2.2K OHM 1608 SIZE R749 CRJ10DJ222T RES , CHIP 2.2K OHM 1608 SIZE R801 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE
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Ref# Component Description Drawing No R802 CRJ10DJ820T RES , CHIP 82 OHM 1608 SIZE R803 CRJ10DJ0R0T RES , CHIP 0 OHM 1608 SIZE R806 CRJ10DJ820T RES , CHIP 82 OHM 1608 SIZE R807 CRJ10DJ680T RES , CHIP 68 OHM 1608 SIZE R808 CRJ10DJ680T RES , CHIP 68 OHM 1608 SIZE R809 CRJ10DJ680T RES , CHIP 68 OHM 1608 SIZE R810 CRJ10DJ471T RES , CHIP 470 OHM 1608 SIZE R811 CRJ10DJ471T RES , CHIP 470 OHM 1608 SIZE R812 CRJ10DJ102T RES , CHIP 1K OHM 1608 SIZE R813 CRJ10DJ821T RES , CHIP 820 OHM 1608 SIZE R814 CRJ10DJ750T RES , CHIP 75 OHM 1608 SIZE R815 CRJ10DJ181T RES , CHIP 1608 SIZE R816 CRJ10DJ390T RES , CHIP R817 CRJ10DJ750T RES , CHIP R818 CRJ10DJ750T RES , CHIP R821 CRJ10DJ0R0T RES , CHIP R823 CRJ10DJ0R0T RES , CHIP R824 CRJ10DJ750T RES , CHIP R825 CRJ10DJ101T RES , CHIP R826 CRJ10DJ222T RES , CHIP R827 CRJ10DJ221T RES , CHIP R828 CRJ18AJ221T RES , CHIP R829 CRJ10DJ104T RES , CHIP R830 CRJ10DJ390T RES , CHIP
39 OHM 1608 SIZE 75 OHM 1608 SIZE 75 OHM 1608 SIZE 0 OHM 1608 SIZE 0 OHM 1608 SIZE 75 OHM 1608 SIZE 100 OHM 1608 SIZE
2.2K OHM 1608 SIZE 220 OHM 1608 SIZE 220 OHM 1608 SIZE 100K OHM 1608 SIZE
39 OHM 1608 SIZE R831 CRJ10DJ750T RES , CHIP 75 OHM 1608 SIZE R832 CRJ10DJ102T RES , CHIP 1K OHM 1608 SIZE R833 CRJ10DJ750T RES , CHIP 75 OHM 1608 SIZE R834 CRJ10DJ820T RES , CHIP 82 OHM 1608 SIZE R878 CRJ10DJ104T RES , CHIP R879 CRJ10DJ101T RES , CHIP
100K OHM 1608 SIZE
100 OHM 1608 SIZE R880 CRJ10DJ221T RES , CHIP 220 OHM 1608 SIZE R895 CRJ10DJ221T RES , CHIP 220 OHM 1608 SIZE R896 CRJ10DJ680T RES , CHIP 68 OHM 1608 SIZE X101 HOX27000E180S CRYSTAL , CHIP(27MHZ,SMD) HC-49/US C105 CCEA1CH470T CAP , ELECT 47UF 16V C108 CCEA1CH101T CAP , ELECT 100UF 16V C109 CCEA1CH101T CAP , ELECT 100UF 16V C111 CCEA1CH101T CAP , ELECT 100UF 16V C114 CCEA1CH101T CAP , ELECT 100UF 16V C116 CCEA1CH101T CAP , ELECT 100UF 16V C118 CCEA1CH101T CAP , ELECT 100UF 16V C119 CCEA1CH101T CAP , ELECT 100UF 16V C121 CCEA1CH101T CAP , ELECT 100UF 16V C123 CCEA1CH101T CAP , ELECT 100UF 16V C125 CCEA1CH101T CAP , ELECT 100UF 16V C128 CCEA1CH101T CAP , ELECT 100UF 16V C130 CCEA1CH101T CAP , ELECT 100UF 16V C137 CCEA1CH470T CAP , ELECT 47UF 16V C139 CCEA1CH470T CAP , ELECT 47UF 16V C142 CCEA1CH470T CAP , ELECT 47UF 16V C150 CCEA1CH101T CAP , ELECT 100UF 16V C155 CCEA1CH470T CAP , ELECT 47UF 16V
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Service manual DVD37EU
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Ref# Component Description Drawing No C177 CCEA1CH101T CAP , ELECT 100UF 16V C182 CCEA1CH470T CAP , ELECT 47UF 16V C184 CCEA1CH470T CAP , ELECT 47UF 16V C198 CCEA1CH101T CAP , ELECT 100UF 16V C202 CCEA1CH470T CAP , ELECT 47UF 16V C203 CCEA1CH470T CAP , ELECT 47UF 16V C206 CCEA1CH470T CAP , ELECT 47UF 16V C213 CCEA1CH221T CAP , ELECT 220UF 16V C219 CCEA1CH470T CAP , ELECT 47UF 16V C221 CCEA1CH101T CAP , ELECT 100UF 16V C223 CCEA1CH101T CAP , ELECT 100UF 16V C224 CCEA1CH101T CAP , ELECT 100UF 16V C226 CCEA1CH101T CAP , ELECT 100UF 16V C233 CCEA1CH101T CAP , ELECT 100UF 16V C236 CCEA1CH470T CAP , ELECT 47UF 16V C241 CCEA1CH470T CAP , ELECT 47UF 16V C243 CCEA1CH470T CAP , ELECT 47UF 16V C251 CCEA1CH470T CAP , ELECT 47UF 16V C258 CCEA1HH4R7T CAP , ELECT 4.7UF 50V C301 CCEA1CH101T CAP , ELECT 100UF 16V C404 CCEA1CKS470T CAP , ELECT 47UF 16V C504 CCEA1CH221T CAP , ELECT 220UF 16V C508 CCEA1CH221T CAP , ELECT 220UF 16V C510 CCEA1HH4R7T CAP , ELECT 4.7UF 50V C530 CCEA1CH221T CAP , ELECT 220UF 16V C532 CCEA1CH221T CAP , ELECT 220UF 16V C548 CCEA1CH221T CAP , ELECT 220UF 16V C549 CCEA1CH221T CAP , ELECT 220UF 16V C561 CCEA1CH100T CAP , ELECT 10UF 16V C562 CCEA1HH1R0T CAP , ELECT 1UF 50V C574 CCEA1CH221T CAP , ELECT 220UF 16V C579 CCEA1CH221T CAP , ELECT 220UF 16V C582 CCEA1CH470T CAP , ELECT 47UF 16V C583 CCEA1CH221T CAP , ELECT 220UF 16V C586 CCEA1CH221T CAP , ELECT 220UF 16V C616 CCEA1CH220T CAP , ELECT 22UF 16V C618 CCEA1CH101T CAP , ELECT 100UF 16V C628 CCEA1CH101T CAP , ELECT 100UF 16V C629 CCEA1CH101T CAP , ELECT 100UF 16V C637 HCQI1H222JZT CAP , MYLAR C640 HCQI1H222JZT CAP , MYLAR
2200PF 50V J
2200PF 50V J C642 CCEA1CH220T CAP , ELECT 22UF 16V C643 CCEA1CH220T CAP , ELECT 22UF 16V C645 HCQI1H222JZT CAP , MYLAR C648 HCQI1H222JZT CAP , MYLAR
2200PF 50V J
2200PF 50V J C653 CCEA1CH220T CAP , ELECT 22UF 16V C658 HCQI1H222JZT CAP , MYLAR C661 HCQI1H222JZT CAP , MYLAR
2200PF 50V J
2200PF 50V J C666 CCEA1CH101T CAP , ELECT 100UF 16V C667 CCEA1CH101T CAP , ELECT 100UF 16V C669 CCEA1CH101T CAP , ELECT 100UF 16V C670 CCEA1CH101T CAP , ELECT 100UF 16V
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Service manual DVD37EU
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Ref# Component Description Drawing No C673 CCEA1CH101T CAP , ELECT 100UF 16V C675 CCEA1CH470T CAP , ELECT 47UF 16V C676 CCEA1HH1R0T CAP , ELECT 1UF 50V C680 CCEA1CH221T CAP , ELECT 220UF 16V C681 CCEA1CH101T CAP , ELECT 100UF 16V C685 HCQI1H222JZT CAP , MYLAR C687 HCQI1H222JZT CAP , MYLAR C688 HCQI1H222JZT CAP , MYLAR C689 HCQI1H222JZT CAP , MYLAR C690 HCQI1H222JZT CAP , MYLAR C692 HCQI1H222JZT CAP , MYLAR
2200PF 50V J 2200PF 50V J 2200PF 50V J 2200PF 50V J 2200PF 50V J
2200PF 50V J C733 CCEA1HH3R3T CAP , ELECT 3.3UF 50V C751 CCEA1CH220T CAP , ELECT 22UF 16V C752 CCEA1CH220T CAP , ELECT 22UF 16V C795 CCEA1CH221T CAP , ELECT 220UF 16V C801 CCEA1AH331T CAP , ELECT 330UF 10V C802 CCEA1AH331T CAP , ELECT 330UF 10V C803 CCEA1CH220T CAP , ELECT 22UF 16V C804 CCEA1CH101T CAP , ELECT 100UF 16V C811 CCEA1AH331T CAP , ELECT 330UF 10V C813 CCEA1AH331T CAP , ELECT 330UF 10V C815 CCEA1AH331T CAP , ELECT 330UF 10V C818 CCEA1AH331T CAP , ELECT 330UF 10V C824 CCEA1HH1R0T CAP , ELECT 1UF 50V C825 CCEA1HH1R0T CAP , ELECT 1UF 50V C826 CCEA1CH470T CAP , ELECT 47UF 16V C827 CCEA1CH470T CAP , ELECT 47UF 16V C829 CCEA1AH471T CAP , ELECT 470UF 10V C835 CCEA1CH221T CAP , ELECT 220UF 16V C882 CCEA1AH471T CAP , ELECT 470UF 10V C891 CCEA1AH471T CAP , ELECT 470UF 10V IC50 HVIKA79L08AZT REGULATOR, -8V KA79LXXAZTA Q605 HVTKSA916YT T.R S401 HST1A020ZT SW , TACT S402 HST1A020ZT SW , TACT S403 HST1A020ZT SW , TACT S404 HST1A020ZT SW , TACT S405 HST1A020ZT SW , TACT S406 HST1A020ZT SW , TACT S407 HST1A020ZT SW , TACT S408 HST1A020ZT SW , TACT
KSA916Y
switch, Front panel
switch, Front panel
switch, Front panel
switch, Front panel
switch, Front panel
switch, Front panel
switch, Front panel
switch, Front panel
CMD1A504 BRACKET , FIP BN01 CWB1C912060EN WIRE ASS'Y BN07 CWB1A906190EN WIRE ASS'Y CN01 CJP15GA117ZY WAFER , CARD CABLE CN03 CJP07GA01ZY WAFER, STRAIGHT, 7PIN CN05 CJP15GB113ZY WAFER CN07 CJP06GA19ZY WAFER, STRAIGHT, 6PIN CN12 CJP05GA19ZY WAFER, STRAIGHT, 5PIN CN13 CJP06GA19ZY WAFER, STRAIGHT, 6PIN
12Pin, 60mm 6Pin, 190mm 15Pin connector 7Pin connector 15Pin connector 6Pin connector 5Pin connector
6Pin connector D103 CVD1N4003ST RECT , DIODE 1N4003 D104 CVD1N4003ST RECT , DIODE 1N4003
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Ref# Component Description Drawing No D105 CVD1N4003ST RECT , DIODE 1N4003 D107 CVD1N4003ST RECT , DIODE 1N4003 D109 CVD1N4003ST RECT , DIODE 1N4003 D110 CVD1N4003ST RECT , DIODE 1N4003 D401 CVD50BOBBWGA L.E.D , 2 COLOR (ORG , BLUE) TOL-50BOBBWGA ET01 CMC1A111 PLATE , EARTH ET02 CMC1A111 PLATE , EARTH F401 HFL13BT229GINK F.I.P 13-BT-229GINK IC46 BVIKP1010B IC, PHOTO COUPLER IC49 HVIKIA7808API REGULATOR, +8V KIA7808 (KEC) IC61 HRVKSM603TH2 SENSOR IR KSM-603TH2 JK01 CJJ4R041Z 6P JACK, BOARD RCA-601DAG-11 JK02 CJJ4N067Z 2P, JACK RCA-201DAG-01 JK03 CJJ4S043Z JACK , BOARD JK04 CJJ9N003Z JACK , (S-VIDEO+VHS) JK05 CJJ6K003Z JACK, SCART CS-1071PB JK06 HJS9U008Z Optical+Coaxial Jack (Gold Pla YKC22-0732N JK08 HJJ1D002Z JACK, HOSIDEN SR7400 X501 HOX08000E160C CRYSTAL 8MHz
SMPS PCB
Ref# Component Description Drawing No
COP11840C SMPS ASS'Y (DVD37/47) DVD37 SMPS C905 CCFT1H104ZF CAP , SEMICONDUCTOR C906 CCKT1H391KB CAP , CERAMIC C907 CCEA1HH100T CAP , ELECT 10UF 50V C908 CCEA1HH470T CAP , ELECT 47UF 50V C910 CCEA1HH1R0T CAP , ELECT 1UF 50V C921 CCEA1EH331T CAP , ELECT 33OUF 25V C922 CCEA1HH0R1T CAP , ELECT 0.1UF 50V C923 CCEA1EH331T CAP , ELECT 33OUF 25V C924 CCEA1VH101T CAP , ELECT 100UF 35V C925 CCEA1EH331T CAP , ELECT 33OUF 25V C926 HCQI1H102JZT CAP , MYLAR
1000PF 50V J C927 CCEA1HH470T CAP , ELECT 47UF 50V C928 CCEA1HH470T CAP , ELECT 47UF 50V C929 CCFT1H104ZF CAP , SEMICONDUCTOR C931 CCFT1H104ZF CAP , SEMICONDUCTOR C935 CCFT1H104ZF CAP , SEMICONDUCTOR
0.1UF 50V ZF
0.1UF 50V ZF
0.1UF 50V ZF D906 HVDMTZJ12BT DIODE , ZENER MTZJ12B 1/2W D907 HVD1N4148T DIODE 1N4148 D909 HVDMTZJ24BT DIODE , ZENER MTZJ24BT 1/2W D910 HVD1N4148T DIODE 1N4148 D911 HVD1N4148T DIODE 1N4148 D912 HVDMTZJ5.1BT DIODE , ZENER MTZJ5.1B 1/2W D925 HVD1N4148T DIODE 1N4148 D926 HVDMTZJ12BT DIODE , ZENER MTZJ12B 1/2W D928 HVDMTZJ2.7BT DIODE , ZENER MTZJ2.7B 1/2W FH91 KJCFC5S HOLDER , FUSE FH92 KJCFC5S HOLDER , FUSE IC92 HVIKIA431BAT I.C , REGULATOR KIA431B J901 C3A206 WIRE , COPPER SN95/PB5 , 0.6 J910 C3A206 WIRE , COPPER SN95/PB5 , 0.6
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Ref# Component Description Drawing No J915 C3A206 WIRE , COPPER SN95/PB5 , 0.6 J916 C3A206 WIRE , COPPER SN95/PB5 , 0.6 J923 C3A206 WIRE , COPPER SN95/PB5 , 0.6 J924 C3A206 WIRE , COPPER SN95/PB5 , 0.6 J925 C3A206 WIRE , COPPER SN95/PB5 , 0.6 L903 CLZ9Z040Z COIL , CHOKE(6.8UH) DR 6.5*7.5 L905 CLZ9Z040Z COIL , CHOKE(6.8UH) DR 6.5*7.5 NT91 KRT10D9MSFT THERMISTER Q904 HVTKTC3198YT T.R KTC3198Y Q905 HVTKTA1273YT TR NORMAL KTA1273/PNP/TO-92L Q906 HVTKSC1008YT T.R KSC1008Y Q907 HVTKRC102MT T.R KRC102M Q908 HVTKRA102MT T.R KRA102M Q910 HVTKSC1008YT T.R KSC1008Y Q911 HVTKSA708YT T.R KSA708Y Q912 HVDMCR100-6ZL1G SCR (ON SEMI) R901 KROS1TJ105V RES , METAL FILM (1/2W , 1M OH R903 CRD25TJ754T RES R904 CRD25TJ754T RES R905 CRD20TJ222T RES , CARBON 2.2K OHM 1/5W J R906 CRD20TJ101T RES , CARBON 100 OHM 1/5W J R907 CRD20TJ103T RES , CARBON 10K OHM 1/5W J R909 CRD20TJ100T RES , CARBON 10 OHM 1/5W J R910 CRD20TJ103T RES , CARBON 10K OHM 1/5W J R911 CRD20TJ104T RES , CARBON 100K OHM 1/5W J R912 CRD20TJ102T RES , CARBON 1K OHM 1/5W J R913 CRD20TJ102T RES , CARBON 1K OHM 1/5W J R914 CRD20TJ333T RES , CARBON 33K OHM 1/5W J R920 CRD20TJ101T RES , CARBON 100 OHM 1/5W J R921 CRD20TJ222T RES , CARBON 2.2K OHM 1/5W J R922 CRD20TF3481T RES , CARBON
3.48K OHM 1/5W J R923 CRD20TF3001T RES , CARBON 3K 1/5W F R924 CRD20TJ101T RES , CARBON 100 OHM 1/5W J R925 CRD25TJ101T RES , CARBON
100 OHM 1/4W J R926 CRD20TJ101T RES , CARBON 100 OHM 1/5W J R928 CRD20TJ102T RES , CARBON 1K OHM 1/5W J R929 CRD20TJ102T RES , CARBON 1K OHM 1/5W J R930 CRD20TJ101T RES , CARBON 100 OHM 1/5W J R934 CRD20TJ102T RES , CARBON 1K OHM 1/5W J R935 CRD20TJ153T RES , CARBON 15K OHM 1/5W J R940 CRD20TJ472T RES , CARBON 4.7K OHM 1/5W J CN91 KJP02KA060ZY WAFER 7.92MM(YUNHO) CN92 CJP12GA19ZY WAFER C901 HCQF2E104KZE CAP , POLYPROPYLENE FILM
0.1UF
0.1UF C902 HCQF2E104KZE CAP , POLYPROPYLENE FILM 400V/47uF C903 CCET400VKRH470K CAP , ELECT(400V/47uF) KOSHIN KRH SERIES ( C904 CCKT3A222KBL CAP , CERAMIC EKR3A222K05FK5 C920 CCEA1EH102T CAP , ELECT 1000UF 25V C930 CCKDHS222ME CAP , CERAMIC (400V Y-CAP) SDE2G222M10FF7 C932 CCKDHS102ME CAP , CERAMIC (400V Y-CAP) SDE2G102M10FF7 C933 CCKDHS102ME CAP , CERAMIC (400V Y-CAP) SDE2G102M10FF7 D901 HVD1N4007T DIODE
1N4007 (1000V/1A)
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Ref# Component Description Drawing No D902 HVD1N4007T DIODE D903 HVD1N4007T DIODE D904 HVD1N4007T DIODE
1N4007 (1000V/1A) 1N4007 (1000V/1A)
1N4007 (1000V/1A) D905 HVDUF4007T DIODE , SCHOTTKY UF4007 D908 HVD1N4007T DIODE 1N4007 (1000V/1A) D913 HVD1N4148T DIODE 1N4148 D920 HVD31DQ06H DIODE 31DQ06-FC5 D921 HVDUF4007T DIODE , SCHOTTKY UF4007 D922 HVD1N4937T DIODE , RECTIFIERS 1N4937(600V/1A) D923 HVD1N4937T DIODE , RECTIFIERS 1N4937(600V/1A) D924 HVDSF26T DIODE , SUPER FAST
1N4007 (1000V/1A) IC91 BVISG6848DZ IC,PWM SG6848DZ LF91 CLZ9Z060Y LINE FILTER CLZ9Z060Y PC91 HVIPC17L1CB I.C , PHOTO COUPLER
PC17L1C Q901 CVICEF04N6YA FET. HEAT SINK ASS`Y
BVICEF04N6 FET , CEF04N6 CMY2A223 HEAT SINK
CTB3+8JR SCREW Q903 HVTKSB1151Y T.R KSB1151Y R902 KRG1SANJ104H RES,METAL OXIDE FILM
100K OHM R908 KRW1PJ1R5V RES, WIRE WOUND 1W 1.5(J) NON-INDUC R927 KRDS1TJ681V RES , CARBON 680OHM 1/2W J T901 CLT9Z018ZE TRANS (DVD 27) EER2828H
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H/K DVD 37 EU PCB DRAWING
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Page 72
ESMT M12L64164A
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SDRAM
1M x 16 Bit x 4 Banks
Synchronous DRAM
FEATURES
JEDEC standard 3.3V power supply LVTTL compatible with multiplexed address Four banks operation MRS cycle with address key programs
- CAS Latency (2 & 3)
- Burst Length (1, 2, 4, 8 & full page)
- Burst Type (Sequential & Interleave)
All inputs are sampled at the positive going edge of the
system clock
DQM for masking Auto & self refresh 64ms refresh period (4K cycle)
GENERAL DESCRIPTION
The M12L64164A is 67,108,864 bits synchronous high data rate Dynamic RAM organized as 4 x 1,048,576 words by 16 bits. Synchronous design allows precise cycle controls with the use of system clock I/O transactions are possible on every clock cycle. Range of operating frequencies, programmable burst length and programmable latencies allow the same device to be useful for a variety of high bandwidth, high performance memory system applications.
PIN ASSIGNMENT
ORDERING INFORMATION
54 Pin TSOP (Type II) (400mil x 875mil )
PRODUCT NO. MAX FREQ. PACKAGE
M12L64164A-6T 166MHz
M12L64164A-7T 143MHz
TSOP II
V
DQ0
V
DDQ
DQ1 DQ2
V
SSQ
DQ3 DQ4
V
DDQ
DQ5 DQ6
V
SSQ
DQ7
V
LDQM
WE CAS RAS
CS A A12
A10/AP
VDD
DD
DD
A A1 A2 A3
Top View
54
V
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
13
21 22 23
0
24 25 26 27
53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28
SS
DQ15 V
SSQ
DQ14 DQ13 V
DDQ
DQ12 DQ11 V
SSQ
DQ10 DQ9 V
DDQ
DQ8 V
SS
NC UDQM CLK CKE NC A
11
A9 A8 A7 A6 A5 A4 VSS
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2003
Revision: 1.7 1/44
Page 73
ESMT M12L64164A
A
A
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FUNCTIONAL BLOCK DIAGRAM
CLK
CKE
ddress
CS
RAS
CAS
WE
Clock Generator
Row
ddress Buffer & Refresh Counter
Column Address Buffer & Refresh Counter
Row Decoder
Sense Amplifier
Column Decoder
Data Control Circuit
Command Decoder
Mode Register
Control Logic
Bank B
Bank A
Bank D
Bank C
L(U)DQM
DQ
Buffer
Latch Circuit
Input & Output
PIN FUNCTION DESCRIPTION
PIN NAME INPUT FUNCTION
CLK System Clock Active on the positive going edge to sample all inputs
CS
CKE Clock Enable
A0 ~ A11 Address
A12 , A13 Bank Select Address
RAS
CAS
WE
L(U)DQM Data Input / Output Mask
DQ0 ~ DQ15 Data Input / Output Data inputs / outputs are multiplexed on the same pins.
VDD / VSS Power Supply / Ground Power and ground for the input buffers and the core logic.
VDDQ / VSSQ Data Output Power / Ground
NC No Connection This pin is recommended to be left No Connection on the device.
Chip Select
Row Address Strobe
Column Address Strobe
Write Enable
Disables or enables device operation by masking or enabling all inputs except CLK , CKE and L(U)DQM
Masks system clock to freeze operation from the next clock cycle. CKE should be enabled at least one cycle prior new command. Disable input buffers for power down in standby.
Row / column address are multiplexed on the same pins. Row address : RA0~RA11, column address : CA0~CA7
Selects bank to be activated during row address latch time. Selects bank for read / write during column address latch time.
Latches row addresses on the positive going edge of the CLK with
RAS low.
Enables row access & precharge.
Latches column address on the positive going edge of the CLK with
CAS low.
Enables column access.
Enables write operation and row precharge.
Latches data in starting from
Makes data output Hi-Z, tSHZ after the clock and masks the output. Blocks data input when L(U)DQM active.
Isolated power supply and ground for the output buffers to provide improved noise immunity.
CAS , WE active.
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2003
Revision: 1.7 2/44
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DEVICE OPERATIONS
CLOCK (CLK)
The clock input is used as the reference for all SDRAM operations. All operations are synchronized to the positive going edge of the clock. The clock transitions must be monotonic between V high all inputs are assumed to be in valid state (low or high) for the duration of setup and hold time around positive edge of the clock for proper functionality and Icc specifications.
CLOCK ENABLE(CKE)
The clock enable (CKE) gates the clock onto SDRAM. If CKE goes low synchronously with clock (set-up and hold time same as other inputs), the internal clock suspended from the next clock cycle and the state of output and burst address is frozen as long as the CKE remains low. All other inputs are ignored from the next clock cycle after CKE goes low. When all banks are in the idle state and CKE goes low synchronously with clock, the SDRAM enters the power down mode from the next clock cycle. The SDRAM remains in the power down mode ignoring the other inputs as long as CKE remains low. The power down exit is synchronous as the internal clock is suspended. When CKE goes high at least “1CLK + tSS” before the high going edge of the clock, then the SDRAM becomes active from the same clock edge accepting all the input commands.
BANK ADDRESSES (A13~A12)
This SDRAM is organized as four independent banks of 1,048,576 words x 16 bits memory arrays. The A13~A12
inputs are latched at the time of assertion of
CAS to select the bank to be used for the operation. The
banks addressed A13~A12 are latched at bank active, read, write, mode register set and precharge operations.
ADDRESS INPUTS (A0~A11)
The 20 address bits are required to decode the 1,048,576 word locations are multiplexed into 12 address input pins (A0~A11). The 12 row addresses are latched along with
RAS and A13~A12 during bank active command. The 8 bit
column addresses are latched along with A13~A12 during read or with command.
NOP and DEVICE DESELECT
IL and VIH. During operation with CKE
RAS and
CAS , WE and
POWER-UP
1.Apply power and start clock, Attempt to maintain CKE = “H”, DQM = “H” and the other pins are NOP condition at the inputs.
2.Maintain stable power, stable clock and NOP input condition for minimum of 200us.
3.Issue precharge commands for both banks of the devices.
4.Issue 2 or more auto-refresh commands.
5.Issue a mode register set command to initialize the mode register. cf.) Sequence of 4 & 5 is regardless of the order.
The device is now ready for normal operation.
MODE REGISTER SET (MRS)
The mode register stores the data for controlling the various operating modes of SDRAM. It programs the CAS latency, burst type, burst length, test mode and various vendor specific options to make SDRAM useful for variety of different applications. The default value of the mode register is not defined, therefore the mode register must be written after power up to operate the SDRAM. The mode register is written by asserting low
CS , RAS , CAS and WE (The SDRAM should
on be in active mode with CKE already high prior to writing
the mode register). The state of address pins A0~A11
and A13~A12 in the same cycle as
WE going low is the data written in the mode
and register. Two clock cycles is required to complete the write in the mode register. The mode register contents can be changed using the same command and clock cycle requirements during operation as long as all banks are in the idle state. The mode register is divided into various fields into depending on functionality. The burst length field uses A0~A2, burst type uses A3, CAS latency (read latency from column address) use A4~A6, vendor specific options or test mode use A7~A8, A10/AP~A11 and A13~A12. The write burst length is programmed using A9. A7~A8, A10/AP~A11 and A13~A12 must be set to low for normal SDRAM operation. Refer to the table for specific codes for various burst length, burst type and CAS latencies.
CS , RAS , CAS
When performs no operation (NOP). NOP does not initiate any new
operation, but is needed to complete operations which require more than single clock cycle like bank activate, burst read, auto refresh, etc. The device deselect is also a NOP
and is entered by asserting
the command decoder so that the address inputs are ignored.
RAS , CAS and WE are high, The SDRAM
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2003
Revision: 1.7 11/44
CS high. CS high disables
RAS , CAS , WE and all
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DEVICE OPERATIONS (Continued)
BANK ACTIVATE
The bank activate command is used to select a random row
in an idle bank. By asserting low on RAS and CS with desired row and bank address, a row access is initiated. The read or write operation can occur after a time delay of t
(min) from the time of bank activation. tRCD is the internal
RCD
timing parameter of SDRAM, therefore it is dependent on operating clock frequency. The minimum number of clock cycles required between bank activate and read or write command should be calculated by dividing tRCD (min) with cycle time of the clock and then rounding of the result to the next higher integer. The SDRAM has four internal banks in the same chip and shares part of the internal circuitry to reduce chip area, therefore it restricts the activation of four banks simultaneously. Also the noise generated during sensing of each bank of SDRAM is high requiring some time for power supplies to recover before another bank can be sensed reliably. tRRD (min) specifies the minimum time required between activating different bank. The number of clock cycles required between different bank activation must be calculated similar to t
RCD specification. The minimum time
required for the bank to be active to initiate sensing and restoring the complete row of dynamic cells is determined by
RAS (min). Every SDRAM bank activate command must satisfy
t t
RAS (min) specification before a precharge command to that
active bank can be asserted. The maximum time any bank can be in the active state is determined by tRAS (max) and tRAS
(max) can be calculated similar to tRCD specification.
BURST READ
The burst read command is used to access burst of data on consecutive clock cycles from an active row in an active bank. The burst read command is issued by asserting low on
CS and RAS with WE being high on the positive edge
of the clock. The bank must be active for at least tRCD (min) before the burst read command is issued. The first output appears in CAS latency number of clock cycles after the issue of burst read command. The burst length, burst sequence and latency from the burst read command is determined by the mode register which is already programmed. The burst read can be initiated on any column address of the active row. The address wraps around if the initial address does not start from a boundary such that number of outputs from each I/O are equal to the burst length programmed in the mode register. The output goes into high-impedance at the end of burst, unless a new burst read was initiated to keep the data output gapless. The burst read can be terminated by issuing another burst read or burst write in the same bank or the other active bank or a precharge command to the same bank. The burst stop command is valid at every page burst length.
BURST WRITE
The burst write command is similar to burst read command and is used to write data into the SDRAM on consecutive clock cycles in adjacent addresses depending on burst length
and burst sequence. By asserting low on
WE with valid column address, a write burst is
and initiated. The data inputs are provided for the initial address in the same clock cycle as the burst write command. The input buffer is deselected at the end of the burst length, even though the internal writing can be completed yet. The writing can be complete by issuing a burst read and DQM for blocking data inputs or burst write in the same or another active bank. The burst stop command is valid at every burst length. The write burst can also be terminated by using DQM for blocking data and procreating the bank t
RDL after the last data input to
be written into the active row. See DQM OPERATION also.
DQM OPERATION
The DQM is used mask input and output operations. It
works similar to
OE during operation and inhibits
writing during write operation. The read latency is two cycles from DQM and zero cycle for write, which means DQM masking occurs two cycles later in read cycle and occurs in the same cycle during write cycle. DQM operation is synchronous with the clock. The DQM signal is important during burst interrupts of write with read or precharge in the SDRAM. Due to asynchronous nature of the internal write, the DQM operation is critical to avoid unwanted or incomplete writes when the complete burst write is required. Please refer to DQM timing diagram also.
PRECHARGE
The precharge is performed on an active bank by asserting low on clock cycles required between bank activate and clock cycles required between bank
activate and
CS , RAS , WE and A10/AP with valid A13~A12 of the bank to be procharged. The precharge command can be asserted anytime after t
satisfy from the bank active command in the desired bank. t
RP is defined as the minimum number of clock
cycles required to complete row precharge is calculated by dividing tRP with clock cycle time and rounding up to the next higher integer. Care should be taken to make sure that burst write is completed or DQM is used to inhibit writing before precharge command is asserted. The maximum time any bank can be active is specified
RAS (max). Therefore, each bank activate command. At
by t the end of precharge, the bank enters the idle state and is ready to be activated again. Entry to power-down, Auto refresh, Self refresh and Mode register set etc. is possible only when all banks are in idle state.
CS , CAS
RAS (min) is
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2003
Revision: 1.7 12/44
Page 76
ESMT M12L64164A
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DEVICE OPERATIONS (Continued)
AUTO PRECHARGE
The precharge operation can also be performed by using auto precharge. The SDRAM internally generates the timing to satisfy t and CAS latency. The auto precharge command is issued at the same time as burst write by asserting high on A10/AP, the bank is precharge command is asserted. Once auto precharge command is given, no new commands are possible to that particular bank until the bank achieves idle state.
BOTH BANKS PRECHARGE
Both banks can be precharged at the same time by using
Precharge all command. Asserting low on CS , RAS , and
WE with high on A10/AP after all banks have satisfied tRAS
(min) requirement, performs precharge on all banks. At the
end of t state.
AUTO REFRESH
The storage cells of SDRAM need to be refreshed every 64ms to maintain data. An auto refresh cycle accomplishes refresh of a single row of storage cells. The internal counter increments automatically on every auto refresh cycle to refresh all the rows. An auto refresh command is issued by
asserting low on
and with both banks being in idle state and the device is not in power down mode (CKE is high in the previous cycle). The time required to complete the auto refresh operation is specified by t required can be calculated by driving t time and them rounding up to the next higher integer. The auto refresh command must be followed by NOP’s until the auto refresh operation is completed. The auto refresh is the preferred refresh mode when the SDRAM is being used for normal data transactions. The auto refresh cycle can be performed once in 15.6us or the burst of 4096 auto refresh cycles in 64ms.
RAS (min) and “tRP” for the programmed burst length
RP after performing precharge all, all banks are in idle
CS , RAS and CAS with high on CKE
WE . The auto refresh command can only be asserted
RFC (min). The minimum number of clock cycles
RFC with clock cycle
SELF REFRESH
The self refresh is another refresh mode available in the SDRAM. The self refresh is the preferred refresh mode for data retention and low power operation of SDRAM. In self refresh mode, the SDRAM disables the internal clock and all the input buffers except CKE. The refresh addressing and timing is internally generated to reduce power consumption. The self refresh mode is entered
from all banks idle state by asserting low on
RAS , CAS and CKE with high on WE . Once the self
refresh mode is entered, only CKE state being low matters, all the other inputs including clock are ignored to remain in the refresh. The self refresh is exited by restarting the external clock and then asserting high on CKE. This must be followed by NOP’s for a minimum time of t reaches idle state to begin normal operation. If the system uses burst auto refresh during normal operation, it is recommended to use burst 4096 auto refresh cycles immediately after exiting self refresh.
RFC before the SDRAM
CS ,
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2003
Revision: 1.7 13/44
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Page 78
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SN74LVC157A
QUADRUPLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER
SCAS292G – JANUARY 1993 – REVISED OCTOBER 1998
D
EPIC
(Enhanced-Performance Implanted
CMOS) Submicron Process
D
Typical V < 0.8 V at V
D
Typical V > 2 V at V
D
Inputs Accept Voltages to 5.5 V
D
ESD Protection Exceeds 2000 V Per
(Output Ground Bounce)
OLP
= 3.3 V, TA = 25°C
CC
(Output VOH Undershoot)
OHV
= 3.3 V, TA = 25°C
CC
MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
D
Latch-Up Performance Exceeds 250 mA Per
D, DB, OR PW PACKAGE
(TOP VIEW)
A/B
1A 1B 1Y 2A 2B 2Y
GND
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10
V
CC
G 4A 4B 4Y 3A 3B
9
3Y
JESD 17
D
Package Options Include Plastic Small-Outline (D), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages
description
This quadruple 2-line to 1-line data selector/multiplexer is designed for 1.65-V to 3.6-V VCC operation. The SN74LVC157A features a common strobe (G
the strobe is low, a 4-bit word is selected from one of two sources and is routed to the four outputs. The device provides true data.
) input. When the strobe is high, all outputs are low. When
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators in a mixed 3.3-V/5-V system environment.
The SN74LVC157A is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
G A/B A B
H X X X L L LLX L LLHX H LHXL L LHXH H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
INPUTS
OUTPUT
Y
Copyright 1998, Texas Instruments Incorporated
Page 79
SN74LVC157A
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QUADRUPLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER
SCAS292G – JANUARY 1993 – REVISED OCTOBER 1998
logic symbol
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
15
A/B
1A 1B 2A 2B
3A 3B 4A 4B
G
1
2 3 5 6 11 10 14 13
EN G1
1 1
MUX
logic diagram (positive logic)
2
1A
3
1B
12
4
1Y
7
2Y
9
3Y
4Y
4
1Y
2A
2B
3A
3B
4A
4B
A/B
5
7
12
2Y
9
3Y
4Y
6
11
10
14
13
15
G
1
Page 80
74VHC04
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Hex Inverte r
74VHC04 Hex Inverter
November 1992 Revised February 2005
General Description
The VHC04 is an advanced high speed CMOS Inverter fabricated with silicon gate CMOS technology. It achieves the high speed operation similar to equivalent Bipolar Schottky TTL while maintaining the CMOS low power dissi­pation.
The internal circuit is composed of 3 stages including buffer output, which provide high noise immunity and stabl e out­put. An input protection circuit ensures that 0V to 7V can be applied to the input pins witho ut regard to the supply vol t­age. This device can be used to interface 5V to 3V systems and two supply systems such as bat tery back up. This cir­cuit prevents device destruction du e to mismatch ed suppl y and input voltages.
Features
High Speed: t
High noise immunity: V
Power down protection is provided on all inputs
Low Noise: V
Low power dissipation: I
Pin and function compatible with 74HC04
3.8 ns (typ) at VCC 5V
PD
V
28% VCC (Min)
NIL
2 PA (Max) @ TA 25qC
CC
0.4V (typ)
OLP
NIH
Ordering Code:
Order Number
74VHC04M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow 74VHC04MX_NL
(Note 1) 74VHC04SJ M14D Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74VHC04MTC MTC14 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74VHC04MTCX_NL
(Note 1) 74VHC04N N14A 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Surface mount packag es are also available on Tape and Reel. Specify by appen ding the suffix letter “X” to the ordering code. Pb-Free package per JEDEC J-STD-020B.
Note 1: “_NL” indicates Pb-Free pac k age (per JEDEC J-STD-020B). Device available in Tape and Reel only.
Package
Number
M14A Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
MTC14 Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Package Description
Logic Symbol
74VHC04
Pin Descriptions
Pin Names Description
A
n
O
n
IEEE/IEC
Inputs Outputs
Connection Diagram
Truth Table
AO
LH HL
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AM5888S
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5-channel BTL Driver for DVD player
Motor Driver ICs
AM5888S
The AM5888S is a five-channel BTL driver IC for driving the motors and actuators such as used in DVD player and consists of two independent precision voltage regulators with adjustable range from 1.5V to 4 V. It supports a variety of applications. Also, Pb free package is selectable (Please refer to Marking Identification).
Applications
BTL driver for CD, CD-ROM and DVD.
Features
1) Two channels are voltage-type BTL drivers for actuators of tracking and focus. Two channels are voltage-type BTL driver for sled and spindle motors. It is also built-in one channel bi-direction DC motor driver for tray.
2) Wide dynamic range [9.0V (typ.) when Vcc1= Vcc2= 12V, at R
3) Separating power of Vcc1 and Vcc2 is to improve power efficiency by a low supply voltage for tracking, focus, and spindle.
4) Level shift circuit built-in.
5) Thermal shut down circuit built-in.
6) Mute mode built-in.
7) Dual actuator drivers: A general purpose input OP provides differential input for signal addition. The output structure is two power OPAMPS in bridge configuration.
= 20Ω load].
L
8) Sled motor driver:
A general purpose input OP provides differential input for signal addition. The output structure is one power OPAMP in bridge configuration.
9) Spindle driver:
Single input linear BTL driver. The output structure are two power OPAMPS in bridge configuration.
10) Tray in-out driver:
The DC motor driver supports forward/reverse control for tray motor.
11) 2 Built-in regulator controllers
Adjustable range 1.5V ~ 4V
AAMMtteekk SSEEMMIICCOONNDDUUCCTTOORRSS
- 1 -
FFeebb 22000055 VV11..22
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AM5888S
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Absolute maximum ratings (Ta=25°C)
Motor Driver ICs
Parameter Symbol Limits Unit
Supply voltage
Vcc1 Vcc2
Power dissipation Pd *1.7 W
T
Operate T emp range Storage Temp range
-35 ~ +85
opr
T
**-55 ~ +150
stg
*When mounted on a 70mm×70mm×1.6mm glass epoxy board. *Reduced by 13.6mW for each increase in T **Should not exceed Pd or ASO and T
of 1 over 25℃.
a
=150°C values
j
13.5 V
℃ ℃
Guaranteed operating conditions (Ta=25°C)
Parameter Symbol Limits Unit
Power supply voltage
Block diagram
MUTE BIAS VINTK VINLD GND VCC2
28 27 26 25 24 23 22 21 20 19 18 17 16 15
MUTE
+
Thermal
Shut down
25K
-
+
-
10K
Vcc1 4.3 ~ 13.2 V Vcc2 4.3 ~ Vcc1 V
TRB_2 NC NC
10K
-
PGND
+
25K
PGND
GND
10K
-
25K
+
10K
-
+
VCTL
Pre-DRV
Vcc1
15K
-
+
TRAY
DRIVER
VOLD- VOLD+ VOTK- VOTK+
Vcc2
Spindle
Driver(4X)
Sled
Driver(4X)
Actuator
Driver(6x)
Vcc2
Vcc2
Vcc1
Actuator
Driver(6x)
AAMMtteekk SSEEMMIICCOONNDDUUCCTTOORRSS
8 9 10 11 12 13 141 2 3 4 5 6 7
VINSL+VINFC
REGO2TRB_1
REGO1
FWD REV
VCC1
VOTR- VOTR+ VOSL+ VOSL- VOFC- VOFC+
- 2 -
FFeebb 22000055 VV11..22
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AM5888S
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Pin description
PIN No Pin Name Function
1 VINFC Input for focus driver 2 TRB_1 Connect to external transistor base 3 REGO2 Regulator voltage output, connect to external transistor collector 4 VINSL+ Input for the sled driver 5 REGO1 Regulator voltage output, connect to external transistor collector 6 FWD Tray driver forward input 7 REV Tray driver reverse input 8 Vcc1 Vcc for pre-drive block and power block of sled and tray 9 VOTR- Tray driver output (-)
Motor Driver ICs
10 VOTR+ Tray driver output (+) 11 VOSL+ Sled driver output (+) 12 VOSL- Sled driver output (-) 13 VOFC- Focus driver output (-) 14 VOFC+ Focus driver output (+) 15 VOTK+ Tracking driver output (+) 16 VOTK- Tracking driver output (-) 17 VOLD+ Spindle driver output (+) 18 VOLD- Spindle driver output (-) 19 Vcc2 Vcc for power block of spindle, tracking and focus 20 NC No Connection 21 VCTL Speed control input of tray driver 22 GND Ground 23 VINLD Input for spindle driver 24 NC No Connection 25 TRB_2 Connect to external transistor base 26 VINTK Input for tracking driver 27 BIAS Input for reference voltage 28 MUTE Input for mute control
Notes) Symbol of + and – (output of drivers) means polarity to input pin.
(For example, if voltage of pin1 is high, pin14 is high.)
AAMMtteekk SSEEMMIICCOONNDDUUCCTTOORRSS
- 5 -
FFeebb 22000055 VV11..22
Page 84
Features
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Medium-voltage and Standard-voltage Operation
– 5.0 (VCC = 4.5V to 5.5V) – 2.7 (V
Automotive Temperature Range –40°C to 125°C
Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K),
1024 x 8 (8K) or 2048 x 8 (16K)
Two-wire Serial Interface
Schmitt Trigger, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
400 kHz (2.7V) Compatibility
Write Protect Pin for Hardware Data Protection
8-byte Page (1K, 2K), 16-byte Page (4K, 8K, 16K) Write Modes
Partial Page Writes are Allowed
Self-timed Write Cycle (5 ms max)
High-reliability
– Endurance: 1 Million Write Cycles – Data Retention: 100 Years
8-lead PDIP, 8-lead JEDEC SOIC, and 8-lead TSSOP Packages
= 2.7V to 5.5V)
CC
Two-wire Automotive Temperature Serial EEPROM
1K (128 x 8)
Description
The AT24C01A/02/04/08A/16A provides 1024/2048/4096/8192/16384 bits of serial electrically erasable and programmable read-only memory (EEPROM) organized as 128/256/512/1024/2048 words of 8 bits each. The device is optimized for use in many automotive applications where low-power and low-voltage operation are essential. The AT24C01A/02/04/08A/16A is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, and 8-lead TSSOP packages and is accessed via a two-wire serial interface. In addition, the entire family is available in 2.7V (2.7V to 5.5V) versions.
8-lead PDIP
Table 1. Pin Configurations
Pin Name Function
A0 A2 Address Inputs
SDA Serial Data
SCL Serial Clock Input
WP Write Protect
NC No Connect
GND
A0 A1 A2
GND
1
A0
2
A1
3
A2
4
8-lead SOIC
1 2
3
4
8
VCC
7
WP
6
SCL
5
SDA
VCC
8
WP
7
SCL
6
SDA
5
2K (256 x 8)
4K (512 x 8)
8K (1024 x 8)
16K (2048 x 8)
AT24C01A AT24C02 AT24C04 AT24C08A AT24C16A
A0 A1 A2
GND
8-lead TSSOP
1 2
3
4
8
7 6 5
VCC WP
SCL SDA
5092B–SEEPR–9/05
1
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Absolute Maximum Ratings
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Operating Temperature ......................................−55°C to +125°C
Storage Temperature .........................................−65°C to +150°C
Voltage on Any Pin
with Respect to Ground........................................ −1.0V to +7.0V
Maximum Operating Voltage .......................................... 6.25V
DC Output Current........................................................ 5.0 mA
Figure 1. Block Diagram
*NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam­age to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Pin Description SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each
2
AT24C01A/02/04/08A/16A
EEPROM device and negative edge clock data out of each device. SERIAL DATA (SDA): The SDA pin is bi-directional for serial data transfer. This pin is
open-drain driven and may be wire-ORed with any number of other open-drain or open­collector devices.
DEVICE/PAGE ADDRESSES (A2, A1, A0): The A2, A1 and A0 pins are device address inputs that are hard wired for the AT24C01A and the AT24C02. As many as eight 1K/2K devices may be addressed on a single bus system (device addressing is discussed in detail under the Device Addressing section).
The AT24C04 uses the A2 and A1 inputs for hard wire addressing and a total of four 4K devices may be addressed on a single bus system. The A0 pin is a no connect.
5092B–SEEPR–9/05
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AT24C01A/02/04/08A/16A
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The AT24C08A only uses the A2 input for hardwire addressing and a total of two 8K devices may be addressed on a single bus system. The A0 and A1 pins are no connects.
The AT24C16A does not use the device address pins, which limits the number of devices on a single bus to one. The A0, A1 and A2 pins are no connects.
WRITE PROTECT (WP): The AT24C01A/02/04/08A/16A has a Write Protect pin that provides hardware data protection. The Write Protect pin allows normal read/write oper­ations when connected to ground (GND). When the Write Protect pin is connected to
, the write protection feature is enabled and operates as shown in the following
V
CC
table.
Table 2. Write Protect
WP Pin Status
At V
CC
At GND Normal Read/Write Operations
24C01A 24C02 24C04 24C08A 24C16A
Full (1K) Array Full (2K) Array Full (4K) Array Full (8K) Array Full (16K) Array
Part of the Array Protected
Memory Organization AT24C01A, 1K SERIAL EEPROM: Internally organized with 16 pages of 8 bytes each,
the 1K requires a 7-bit data word address for random word addressing. AT24C02, 2K SERIAL EEPROM: Internally organized with 32 pages of 8 bytes each,
the 2K requires an 8-bit data word address for random word addressing. AT24C04, 4K SERIAL EEPROM: Internally organized with 32 pages of 16 bytes each,
the 4K requires a 9-bit data word address for random word addressing. AT24C08A, 8K SERIAL EEPROM: Internally organized with 64 pages of 16 bytes each,
the 8K requires a 10-bit data word address for random word addressing. AT24C16A, 16K SERIAL EEPROM: Internally organized with 128 pages of 16 bytes
each, the 16K requires an 11-bit data word address for random word addressing.
Page 87
Table 5. AC Characteristics
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Applicable over recommended operating range from T 100 pF (unless otherwise noted)
AT24C01A/02/04/08A/16A
= 40°C to +125°C, VCC = +2.7V to +5.5V, CL = 1 TTL Gate and
A
AT24C01A/02/04/08A/16A
Symbol Parameter
f
SCL
t
LOW
t
HIGH
t
I
t
AA
t
BUF
t
HD.STA
t
SU.STA
t
HD.DAT
t
SU.DAT
t
R
t
F
t
SU.STO
t
DH
t
WR
Endurance
(2)
Clock Frequency, SCL 400 kHz
Clock Pulse Width Low 1.2 µs
Clock Pulse Width High 0.6 µs
Noise Suppression Time
Clock Low to Data Out Valid 0.1 0.9 µs
Time the bus must be free before a new transmission can start
Start Hold Time 0.6 µs
Start Set-up Time 0.6 µs
Data In Hold Time 0 µs
Data In Set-up Time 100 ns
Inputs Rise Time
Inputs Fall Time
Stop Set-up Time 0.6 µs
Data Out Hold Time 50 ns
Write Cycle Time 5 ms
5.0V, 25°C, Page Mode 1M Write Cycles
UnitsMin Max
(1)
(2)
(2)
(2)
1.2 µs
50 ns
300 ns
300 ns
Note: 1. This parameter is characterized and is not 100% tested (TA = 25°C).
2. This parameter is characterized.
Device Operation CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an exter-
nal device. Data on the SDA pin may change only during SCL low time periods (see to Figure 4 on page 7). Data changes during SCL high periods will indicate a start or stop condition as defined below.
START CONDITION: A high-to-low transition of SDA with SCL high is a start condition which must precede any other command (see to Figure 5 on page 7).
STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition. After a read sequence, the stop command will place the EEPROM in a standby power mode (see Figure 5 on page 7).
ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words. The EEPROM sends a “0” to acknowledge that it has received each word. This happens during the ninth clock cycle.
STANDBY MODE: The AT24C01A/02/04/08A/16A features a low-power standby mode which is enabled: (a) upon power-up and (b) after the receipt of the STOP bit and the completion of any internal operations.
Page 88
BH7862FS
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Multimedia ICs
High-performance 6-channel video driver IC for progressive DVD
BH7862FS
BH7862FS is a 6-channel video driver IC developed for progressive DVD player/recorder. Special filters adjusted to each band of various video signals are incorporated into a single chip. Extended definition, size reduction, and high cost performance can be achieved in DVD players.
!!!!Application
DVD players, DVD recorders
!!!!Features
1) Each high-performance filter, 6dB amplifier, and 75 driver for DVD are incorporated into a single chip.
2) Driver 6ch (Y, C, MIX, and PY, Pb, Pr for progressive)
3) Group delay difference between chroma signal and luminance signal is a small number of nsec.
4) Drive 2 lines of each signal
5) Operating by 5V single power supply
6) Built-in mute circuit
!!!!Absolute maximum ratings (Ta = 25°C)
Parameter Symbol Limits Unit
Impressed voltage
Power dissipation
Operating temperature range Storage temperature range
Reduced by 7.6mW for each increase in Ta of 1°C over 25°C.
PCB (70mm×70mm, t=1.6mm) glass epoxy mounting.
!!!!Recommended operating conditions (Ta = 25°C)
Parameter
Power supply voltage
Radiation resistance is not included in the design.
VCC max
Pd
Topr
Tstg
Symbol UnitMax.Typ.Min.
CC
V
4.5 5.5
6.0 V
0.95
10~+70
55~+150
W
°C °C
V
1/9
Page 89
Multimedia ICs
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!!!!Block diagram
BH7862FS
MUTE1
CIN
GND
YIN
V
GND
PYIN
GND
PYTRAP
V
PbIN
GND
1
756dB
2
3
MUTE1 TEST
20k
1.5-6M BPF
756dB
4
5
6
CC
7
8
6M
LPF
CLAMP
CLAMP
12M LPF
756dB
9
10
CC
11
12
20k
6M
LPF
756dB
13
32
31
30
29
28
27
26
25
24
23
22
21
20
COUTCTRAP
TEST
MIXOUT
MIXFB
GND
YTRAP
GND
YOUT
YFB
GND
PYOUT
PYFB
GND
PrIN
MUTE2
PrTRAP
14
15
16
20k
MUTE2
6M
LPF
756dB
756dB
19
18
17
PbOUT
N.C.
PrOUT
Page 90
SEMICONDUCTOR
TECHNICAL DATA
THREE TERMINAL POSITIVE VOLTAGE REGULATORS 5V, 6V, 8V, 9V, 10V, 12V, 15V, 18V, 20V, 24V.
FEATURES
Suitable for C-MOS, TTL, the Other Digital IC's Power Supply. Internal Thermal Overload Protection. Internal Short Circuit Current Limiting. Output Current in Excess of 1A. Satisfies IEC-65 Specification. (International Electronical Commission)
MAXIMUM RATINGS (Ta=25 )
KIA7805API~ KIA7824API
BIPOLAR LINEAR INTEGRATED CIRCUIT
CHARACTERISTIC SYMBOL RATING UNIT
Input Voltage
KIA7805API KIA7815API
V
IN
35
V
KIA7818API KIA7824API
40
Power Dissipation (Tc=25 )
P
D
20.8 W
Power Dissipation (Without Heatsink)
KIA7805API KIA7824API
P
D
2.0 W
Operating Junction Temperature
T
j
-30 150
Storage Temperature
T
stg
-55 150
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A
U
E
L
K
D
N
T
O
1
F
B
G
L
M
J
D
N
T
3
2
Q
TO-220IS
P
S
T
1. INPUT
2. COMMON
3. OUTPUT
C
DIM MILLIMETERS
A B C D E F G 12.30 MAX
R
J K L
M
V
N O
P Q R
H
S
T U
10.30 MAX
15.30 MAX
2.70Ź0.30
0.85 MAX
Φ3.20Ź0.20
3.00Ź0.30
0.75 MAXH
13.60Ź0.50
3.90 MAX
1.20
1.30
2.54
4.50Ź0.20
6.80
2.60Ź0.20 10Ɓ 25Ş
5Ş
0.5
2.60Ź0.15V
Page 91
THREE TERMINAL POSITIVE VOLTAGE REGULATORS 5V, 6V, 8V, 9V, 10V, 12V, 15V, 18V, 20V, 24V.
FEATURES
Best Suited to a Power Supply for TTL and CMOS. Built-in Overcurrent Protective Circuit. Built-in Thermal Protective Circuit. Max. Output Current 150mA (Tj=25 ). Packaged in TO-92L.
MAXIMUM RATINGS (Ta=25 )
KIA79L05BP~
KIA79L24BP
BIPOLAR LINEAR INTEGRATED CIRCUIT
EQUIVALENT CIRCUIT
CHARACTERISTIC SYMBOL RATING UNIT
Input Voltage
KIA79L05BP KIA79L15BP
V
IN
-35 V
KIA79L18BP KIA79L24BP
-40
Power Dissipation (Tc=25 )
P
D
800 mW
Operating Junction Temperature
T
j
-30 150
Operating Temperature
T
opr
-30 75
Storage temperature
T
stg
-55 150
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Service manual DVD37EU
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B
D
P
DEPTH:0.2
C
Q
FF
HH
E
M
123
O
A
G
K
J
M
H
NN
1. COMMON
2. INPUT
3. OUTPUT
R
D
L
DIM MILLIMETERS
A B C
S
D E F G H
J
K
H
L
M
N O P Q
7.20 MAX
5.20 MAX
0.60 MAX
2.50 MAX
1.15 MAX
1.27
1.70 MAX
0.55 MAX _
+
14.00 0.50
0.35 MIN _
+
0.75 0.10 4
25
1.25
Φ1.50
0.10 MAX _
12.50 0.50R
+
1.00S
TO-92L
R
1
R
10
Q
19
Q
1
R
Z
1
2
R
3
GND
(1)
R
9
R
5
Q
2
R
6
Q
4
Q
3
R
4
R
Q
5
7
R
8
R
11
Q
6
R
10
Q
Q
9
R
12
Q
8
R
17
7
Q
10
Q
11
Q
12
R
18
OUTPUT
(3)
R
20
C
Q
1
13
Q
14
R
R
13
14
Q
16
Q
15
Q
17
Q
18
R
15
R
16
INPUT
(2)
Page 92
Optic receiver modules
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KSM-60 󱅢 T H 2·KSM-70 󱅢 T H 2
K O D E N S H I
The KSM-60󱅢TH2 consist of a PIN Photodiode of high speed and a preamplifier IC in the package as an receiver for Infrared remote control systems
F E A T U R E S
•One mold small package
•5 Volt supply voltage, low power consumption
•Shielded against electrical field disturbance
•High immunity against ambient light
•Easy interface with the main board
•TTL and CMOS compatibility
A P P L I C A T I O N S
•TV, VTR, Acoustic Devices, Air Conditioners, Car Stereo Units, Computers, Interior controlling appliances, and all appliances that require remote c o n t r o l l i n g
R a t i n gS y m b o lP a r a m e t e r
5 . 5
- 1 0 ~ + 6 0
- 2 0 ~ + 7 5
( T a = 2 5℃U n l e s s otherwise noted)
U n i t
MAXIMUM RATINGS
Supply Voltage Operating Temperature Storage Temperature Soldering Temperature
C C
V T o p r . T s t g . T s o l .
260(Max 5 sec)
D I M E N S I O N S
B.P.F CENTER FREQUENCY
V ℃ ℃ ℃
K S M -◯◯1 TH2 K S M -◯◯2 TH2 K S M -◯◯3 TH2 K S M -◯◯4 TH2 K S M -◯◯5 TH2
(Unit : mm)
N O T E
PIN configuration
6 0󱅢T H 2 7 0󱅢T H 2 ① V o u t V o u t ② G N D V c c ③ V c c G N D
B.P.F Center Frequency(kHz)Model NO.
4 0 . 0 3 6 . 7 3 7 . 9 3 2 . 7 5 6 . 9
ELECTRO-OPTICAL CHARACTERISTICS
P a r a m e t e r T y p .
Supply Voltage Current Consumption Peak Wavelength *1 B.P.F Center Frequency
Transmission Distance *1 H Level Output Voltage *1
L Level Output Voltage *1 H Level Output Pulse Width *1 L Level Output Pulse Width *1 Output Form
Note : *1. It specifies the maximum distance between emitter and detector that the output waveform satisfies the standard under the conditions below against the standard
t r a n s m i t t e r
1) Measuring place : Indoor without extreme reflection of light
2) Ambient light source : Detecting surface illumination shall be irradiate 200±50lx under ordinary white fluorescence lamp without high frequency lightning
3) Standard transmitter : Burst wave of standard transmitter shall be arranged to 50mVp-p under the measuring circuit
( T a = 2 5℃), Vcc=5.0V
S y m b o l C o n d i t i o n s M i n . M a x . U n i t .
V
I
λp
f o
V V T T
C C
C C
L
O H O L
W H
W L
Input Signal=0
2 0 0±50l x
30cm over the ray
Burst Wave=600μs
P e r i o d = 1 . 2㎳
±3 0°
a x i s
4 . 5
-
-
-
1 0
7
4 . 5
­5 0 0 5 0 0
Active Low Output
5 . 0 1 . 2
9 4 0
3 7 . 9
-
­5 . 0 0 . 1
6 0 0 6 0 0
5 . 5 2 . 5
-
-
-
-
-
0 . 5 7 0 0 7 0 0
V m A n m
k H z
m m
V
V
μs μs
Page 93
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Service manual DVD37EU
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Page 94
LM1117/LM1117I
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Service manual DVD37EU
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800mA Low-Dropout Linear Regulator
LM1117/LM1117I 800mA Low-Dropout Linear Regulator
October 2002
General Description
The LM1117 is a series of low dropout voltage regulators with a dropout of 1.2V at 800mA of load current. It has the same pin-out as National Semiconductor’s industry standard LM317.
The LM1117 is available in an adjustable version, which can set the output voltage from 1.25V to 13.8V with only two external resistors. In addition, it is also available in five fixed voltages, 1.8V, 2.5V, 2.85V, 3.3V, and 5V.
The LM1117 offers current limiting and thermal shutdown. Its circuit includes a zener trimmed bandgap reference to as­sure output voltage accuracy to within
The LM1117 series is available in LLP, TO-263, SOT-223, TO-220, and TO-252 D-PAK packages. A minimum of 10µF tantalum capacitor is required at the output to improve the transient response and stability.
±
1%.
Typical Application
Active Terminator for SCSI-2 Bus
Features
n Available in 1.8V, 2.5V, 2.85V, 3.3V, 5V, and Adjustable
Versions
n Space Saving SOT-223 and LLP Packages n Current Limiting and Thermal Protection n Output Current 800mA n Line Regulation 0.2% (Max) n Load Regulation 0.4% (Max) n Temperature Range
— LM1117 0˚C to 125˚C — LM1117I −40˚C to 125˚C
Applications
n 2.85V Model for SCSI-2 Active Termination n Post Regulator for Switching DC/DC Converter n High Efficiency Linear Regulators n Battery Charger n Battery Powered Instrumentation
10091905
Fixed Output Regulator
10091928
Page 95
Block Diagram
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Service manual DVD37EU
Page 95 of 117
LM1117/LM1117I
Connection Diagrams
SOT-223
Top View
TO-220
Top View
TO-252
Top View
10091904
10091938
10091901
TO-263
10091944
Top View
10091945
Side View
LLP
10091902
10091946
When using the LLP package
Pins 2,3&4must be connected together and
Pins 5,6&7must be connected together
Top View
Page 96
FEATURES SUMMARY
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SUPPLY VOLTAGE
–V
2.7V to 3.6V for Program, Erase
CC =
and Read
ACCESS TIMES: 70, 90ns
PROGRAMMING TIME
10µs per Byte/Word typical
35 MEMORY BLOCKS
1 Boot Block (Top or Bottom Location) – 2 Parameter and 32 Main Blocks
PROGRAM/ERASE CONTROLLER
Embedded Byte/Word Program
algorithms
ERASE SUSPEND and RESUME MODES
Read and Program another Block during
Erase Suspend
U NLOCK BYPASS PROGRAM COMMAND
Faster Production/Batch Programming
T EMPO RARY BLOCK UNPROTECTION
MODE
COMMON FLASH INTERFACE
64 bit Security Code
L OW POWER CONSUM PTION
Standby and Automatic Standby
100,000 PROGRAM/ERASE CYCLES per
BLOCK
ELECTRONIC SIGNATURE
Manufacturer Code: 0020h – Top Device Code M29W160ET: 22C4h – Bottom Device Code M29W160EB: 2249h
Figure 1. Packages
TSOP48 (N)
12 x 20mm
FBGA
TFBGA48 (ZA)
6 x 8mm
Page 97
M29W160ET, M29W160EB
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SUMMARY DESCRIPTION
The M29W160E is a 16 Mbit (2Mb x8 or 1Mb x16) non-volatile memory that can be read, erased and reprogrammed. These operations can be per­formed using a single low voltage (2.7 to 3.6V) supply. On power-up th e memory defaults to its Read mode where it can be read in the same way as a ROM or EPROM.
The memory is divided into blocks that can be erased independently so it is possible to pres erve valid data while old data is erased. Each block can be protected independently to prevent accidental Program or Erase commands from modifying the memory. Program and Erase com m ands are wri t­ten to the Command Interface of t he memory. An on-chip Program/Erase Controller simplifies the process of programming or erasing the memory by taking care of all of the special operations that are required to update the memory contents.
The end of a program or erase operation can be detected and any error conditions identified. The
Figure 2. Logic Diagram Table 1. Signal Names
command set required to control the memory is consistent with JEDEC standards.
The blocks in the memory are asymmetrically ar­ranged, see Figures 5 and 6, Block Addresses. The first or last 64 KBytes have been divided into four additional blocks. The 16 KByte Boot Block can be used for small initialization code to start the microprocessor, the two 8 KByte Parameter Blocks can be used for parameter storage and the remaining 32K is a small Main Block where the ap­plication may be stored.
Chip Enable, Output Enable and Write Enable sig­nals control the bus operation of the memory. They allow simple conne ction to most m icropro­cessors, often without additional logic.
The memory is offered TSOP48 (12 x 20mm) and TFBGA48 (0.8mm pitch) packages. The memory is supplied with all the bits erased (set to ’1’).
A0-A19
W
RP
BYTE
A0-A19 Address Inputs
V
CC
20
E
G
M29W160ET M29W160EB
V
SS
15
DQ0-DQ14
DQ15A–1
RB
AI06849B
DQ0-DQ7 Data Inputs/Outputs DQ8-DQ14 Data Inputs/Outputs DQ15A–1 Data Input/Output or Address Input E G W RP RB BYTE V
CC
V
SS
NC Not Connected Internally
Chip Enable Output Enable Write Enable Reset/Block Temporary Unprotect Ready/Busy Output Byte/Word Organization Select Supply Voltage Ground
5/40
Page 98
M29W160ET, M29W160EB
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Page 98 of 117
Figure 3. TSOP Connections
A15 A14 A13 A12 A11
1
48
A16 BYTE V
SS
DQ15A–1 DQ7
A10 DQ14
37 36
DQ6 DQ13 DQ5 DQ12 DQ4 V
CC
DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 G V
SS
E A0
A9 A8
A19
NC
W RP NC NC RB
A18 A17
A7 A6 A5 A4 A3 A2 A1
12
M29W160ET
M29W160EB
13
24 25
AI06850
Page 99
ST72F324L, ST72324BL
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3V RANGE 8-BIT MCU WITH 8 TO 32K FLASH/ROM,
10-BIT ADC, 4 TIMERS, SPI, SCI INTERFACE
Memories
– 8 to 32K dual voltage High Density Flash (HD-
Flash) or ROM with read-out protection capa­bility. In-Application Programming and In-
Circuit Programming for HDFlash devices – 384 to 1K bytes RAM – HDFlash endurance: 100 cycles, data reten-
tion: 20 years at 55°C
Clock, Reset And Supply Management
TQFP44
10 x 10
– Clock sources: crystal/ceramic resonator os-
cillators, internal RC oscillator, and bypass for
external clock – PLL for 2x frequency multiplication – Four Power Saving Modes: Halt, Active-Halt,
Wait and Slow
Interrupt Management
– Nested interrupt controller – 10 interrupt vectors plus TRAP and RESET – 9/6 external interrupt lines (on 4 vectors)
Up to 32 I/O Ports
– 32/24 multifunctional bidirectional I/O lines – 22/17 alternate function lines – 12/10 high sink outputs
4 Timers
– Main Clock Controller with: Real time base,
Beep and Clock-out capabilities – Configurable watchdog timer – 16-bit Timer A with: 1 input capture, 1 output
compare, external clock input, PWM and
pulse generator modes
2 Communication Interfaces
– SPI synchronous serial interface – SCI asynchronous serial interface
1 Analog Peripheral
– 10-bit ADC with up to 12 input ports
Instruction Set
– 8-bit Data Manipulation – 63 Basic Instructions – 17 main Addressing Modes – 8 x 8 Unsigned Multiply Instruction
– 16-bit Timer B with: 2 input captures, 2 output
compares, PWM and pulse generator modes
Development Tools
– Full hardware/software development package – In-Circuit Testing capability
Device Summary
Features ST72F324L(J/K)6 ST72F324L(J/K)4 ST72F324L(J/K)2 ST72324BL(J/K)4 ST72324BL(J/K)2
Program memory ­bytes
RAM (stack) - bytes 1024 (256) 512 (256) 384 (256) 512 (256) 384 (256) Voltage Range 2.85 to 3.6V Temp. Range up to -40°C to +85°C Packages TQFP44 10x10, SDIP32, TQFP32 7x7
Flash 32K Flash 16K Flash 8K ROM 16K ROM 8K
TQFP32
7 x 7
SDIP32
400 mil
Rev. 3
1
Page 100
ST72F324L, ST72324BL
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Service manual DVD37EU
Page 100 of 117
1 INTRODUCTION
The ST72F324L and ST72324BL devices are members of the ST7 microcontroller family de­signed for the 3V operating range. They can be grouped as follows:
– The 32-pin devices are designed for mid-range
applications
– The 44-pin devices target the same range of ap-
plications requiring more than 24 I/O ports.
All devices are based on a common industry­standard 8-bit core, featuring an enhanced instruc-
Figure 1. Device Block Diagram
8-BIT CORE
ALU
RESET
V
PP
V
SS
V
DD
OSC1 OSC2
PF7:6,4,2:0 (6 bits on J devices) (5 bits on K devices)
CONTROL
OSC
MCC/RTC/BEEP
PORT F
TIMER A
BEEP
tion set and are available with FLASH or ROM pro­gram memory.
Under software control, all devices can be placed in WAIT, SLOW, ACTIVE-HALT or HALT mode, reducing power consumption when the application is in idle or stand-by state.
The enhanced instruction set and addressing modes of the ST7 offer both power and flexibility to software developers, enabling the design of highly efficient and compact application code. In addition to standard 8-bit data management, all ST7 micro­controllers feature true bit manipulation, 8x8 un­signed multiplication and indirect addressing modes.
PROGRAM
MEMORY
(8K - 60K Bytes)
RAM
(384 - 2048 Bytes)
WATCHDOG
ADDRESS AND DATA BUS
PORT A
PORT B
PA7:3 (5 bits on J devices) (4 bits on K devices)
PB4:0 (5 bits on J devices) (3 bits on K devices)
(6 bits on J devices) (2 bits on K devices)
PE1:0 (2 bits)
PD5:0
V
AREF
V
SSA
PORT E
SCI
PORT D
10-BIT ADC
PORT C
TIMER B
SPI
PC7:0
(8 bits)
3
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