GE Industrial Solutions EHW015A0A User Manual

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Page 1

Data Sheet

October 2, 2009

EHW015A0A Series (Eighth-Brick) DC-DC Converter Power Modules

RoHS Compliant

36–75Vdc Input; 5.0Vdc Output; 15A Output Current

Applications

 Distributed Power Architectures

 Wireless Network Infrastructure

 Access and Optical Network Equipment

 Enterprise Networks, including Power over Ethernet

(PoE)

Options

 Negative Remote On/Off logic

 Over current/Over temperature/Over voltage

protections (Auto-restart)

 Surface Mount version (-S)

Features

 Compliant to RoHS EU Directive 2002/95/EC (-Z

versions)

 Compliant to ROHS EU Directive 2002/95/EC with

lead solder exemption (non-Z versions)

 High efficiency 92% at 5.0V full load (Vin=48Vdc)

 Industry standard, DOSA compliant footprint

58.4mm x 22.8mm x 7.77mm

(2.30 in x 0.9 in x 0.306 in)

 Low profile height and reduced component skyline

 Wide input voltage range: 36-75 Vdc

 Tightly regulated output

 Constant switching frequency

 Positive remote On/Off logic

 Input under/over voltage protection

 Output overcurrent and overvoltage protection

 Over-temperature protection

 Remote sense

 No reverse current during output shutdown

 Output Voltage adjust: 90% to 112% of V

 Wide operating temperature range (-40°C to 85°C)

 Suitable for cold wall cooling using suitable Gap

Pad applied directly to top side of module

 UL*Recognized to UL60950-1, CAN/CSA

No.60950-1, and EN60950-1(

VDE

Licensed

 CE mark meets 2006/95/EC directive

 Meets the voltage and current requirements for

ETSI 300-132-2 and complies with and licensed for Basic insulation rating per EN60950-1

 2250 Vdc Isolation tested in compliance with IEEE

 ISO

802.3

PoE standards

9001 and ISO 14001 certified manufacturing

facilities

‡

0805-1)

o,nom

†

C22.2

Description

The EHW015A0A, Eighth-brick low-height power module is an isolated dc-dc converters that can deliver up to 15A of output current and provide a precisely regulated output voltage of 5.0V over a wide range of input voltages (V 75Vdc). The modules achieve typical full load efficiency of 92%. The open frame modules construction, available in both surface-mount and through-hole packaging, enable designers to develop cost and space efficient solutions. Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and overtemperature protection.

* UL is a registered trademark of Underwriters Laboratori es, Inc.

†

CSA is a registered trademark of Canadian Standards Association.

‡

VDE is a trademark of Verband Deutscher Elektrotechniker e. V.

This product is intended for integration into end-user e quipment . All of the required procedures of end-use equipment should be followed. ¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated. ** ISO is a registered trademark of the International Orga nization of Standards

Document No: DS08-003 ver. 1.02

PDF name: ehw015_ds.pd

IN = 36 -

Page 2

Data Sheet October 2, 2009

EHW015A0A Series Eighth-Brick Power Modules

36–75Vdc Input; 5.0Vdc Output; 15A Output Current

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.

Parameter Device Symbol Min Max Unit

Input Voltage

Continuous All V

Transient, operational (≤100 ms) All V

Operating Ambient Temperature All T

IN,trans

-0.3 80 Vdc

-0.3 100 Vdc

-40 85 °C

(see Thermal Considerations section)

Storage Temperature All T

I/O Isolation voltage (100% factory Hi-Pot tested) All

stg

⎯ ⎯

-55 125 °C

2250 Vdc

Electrical Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.

Parameter Device Symbol Min Typ Max Unit

Operating Input Voltage All VIN 36 48 75 Vdc

Maximum Input Current

(VIN= V

IN, min

to V

IN, max

, IO=I

O, max

)

Input No Load Current

(VIN = V

, IO = 0, module enabled)

IN, nom

Input Stand-by Current All

(VIN = V

, module disabled)

IN, nom

Inrush Transient All I2t 0.5 A2s

All I

IN,max

IN,No load

IN,stand-by

2.75 3.0 Adc

70 mA

2.5 5.0 mA

Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; V IO= I

; See Test configuration section)

Omax

IN, min

to V

IN, max,

All 20 mA

p-p

Input Ripple Rejection (120Hz) All 65 dB

CAUTION: This power module is not internally fused. An input line fuse must always be used.

This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.

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Page 3

Data Sheet October 2, 2009

EHW015A0A Series Eighth-Brick Power Modules

36–75Vdc Input; 5.0Vdc Output; 15A Output Current

Electrical Specifications (continued)

Parameter Device Symbol Min Typ Max Unit

Nominal Output Voltage Set-point

VIN=V

IN, min

, IO=I

, TA=25°C) All V

O, max

O, set

Output Voltage

(Over all operating input voltage, resistive load, and

All V

temperature conditions until end of life)

Output Regulation

Line (VIN=V Load (IO=I

Temperature (T

IN, min

O, min

to V

to I

O, max

ref=TA, min

) All

IN, max

)

to T

) All

A, max

All

⎯ ⎯ ±0.2 % V

Output Ripple and Noise on nominal output

(VIN=V

IN, nom

,IO= I

O, max

, TA=T

A, min

to T

)

A, max

RMS (5Hz to 20MHz bandwidth) All

Peak-to-Peak (5Hz to 20MHz bandwidth) All

External Capacitance All C

Output Current All I

Output Current Limit Inception (Hiccup Mode ) (VO= 90% of V

O, set

)

Output Short-Circuit Current

(VO≤250mV) ( Hiccup Mode )

All

All I

O, lim

O, s/c

Efficiency

VIN= V

Switching Frequency All f

, TA=25°C, IO=I

IN, nom

, TA=25°C, IO=0.5I

IN, nom

O, max , VO

= V

All η 92.0 %

O,set

= V

All η 90.0 %

O,set

Dynamic Load Response

(dIo/dt=0.1A/μs; VIN = V

; TA=25°C, Co=C

IN, nom

o,min

)

Load Change from Io= 50% to 75% or 25% to 50% of I

o,max

Peak Deviation All V

Settling Time (Vo<10% peak deviation)

(dIo/dt=1.0A/μs; VIN = V

; TA=25°C, Co=C

IN, nom

o,min

)

Load Change from Io= 50% to 75% or 25% to 50% of I

o,max

Peak Deviation All V

Settling Time (Vo<10% peak deviation)

All t

4.90 5.0 5.10 V

4.85

⎯ ⎯

500

⎯

15 25 mV

40 75 mV

⎯ ⎯

5.15 % V

±0.2 % V

±0.2

4,700 μF

15 Adc

105 120 130

5 A

% V

% I

O, set

pk-pk

rms

400 kHz

⎯ ⎯

200

⎯ ⎯ μs

% V

O, set

⎯ ⎯

200

⎯ ⎯ μs

% V

O, set

Isolation Specifications

Parameter Device Symbol Min Typ Max Unit

Isolation Capacitance All C

Isolation Resistance All R

I/O Isolation Voltage (100% factory Hi-pot tested) All All

iso

⎯

100

⎯ ⎯

2000

⎯ ⎯

⎯

2250 Vdc

MΩ

General Specifications

Parameter Device Symbol Min Typ Max Unit

Calculated Reliability based upon Telcordia SR-332 Issue 2: Method

I Case 3 (I

=80%I

O, max

, TA=40°C,

airflow = 200 lfm, 90% confidence)

Weight (Open Frame) All

Weight (with Heatplate) All

LINEAGE POWER 3

All FIT 244.1 109/Hours

All MTBF 4,097,359 Hours

⎯

(0.67)

(1.09)

⎯

(oz.)

Page 4

Data Sheet October 2, 2009

EHW015A0A Series Eighth-Brick Power Modules

36–75Vdc Input; 5.0Vdc Output; 15A Output Current

Feature Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information.

Parameter Device Symbol Min Typ Max Unit

Remote On/Off Signal Interface

(VIN=V Signal referenced to V Negative Logic: device code suffix “1” Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On

Logic Low - Remote On/Off Current All I

Logic Low - On/Off Voltage All V

Logic High Voltage – (Typ = Open Collector) All V

Logic High maximum allowable leakage current All I

Turn-On Delay and Rise Times

(IO=I Case 1: Input power is applied for at least 1 second

and then the On/Off input is set from OFF to ON (T = from instant at which V

Case 2: On/Off input is set to Logic Low (Module ON) and then input power is applied (T instant at which V

Output voltage Rise time (time for Vo to rise from 10% of V

Output voltage overshoot – Startup

IO= I

Remote Sense Range All V

Output Voltage Adjustment Range All 90 112 % V

Output Overvoltage Protection

Overtemperature Protecdtion – Hiccup Auto Restart All T

Input Undervoltage Lockout All V

Turn-on Threshold

Turn-off Threshold

Hysterisis 3 5.5

to V

IN, min

O, max , VIN=VIN, nom, TA

o,set

O, max

IN, max

to 90% of V

; VIN=V

IN, min

= V

o, set

to V

; open collector or equivalent,

terminal)

IN-

on/off

⎯

-0.7

⎯ ⎯ ⎯

0.3 1.0 mA

⎯

5 V

1.2 Vdc

10 μA

= 25oC)

until VO = 10% of V

IN=VIN, min

until Vo=10% of V

IN, min

)

, TA = 25 oC

IN, max

delay

from

O,set

)

delay

All T

All

All V

― ― 50 msec

delay

― ― 50 msec

delay

rise

SENSE

O, limit

ref

UVLO

― 5 12 msec

― 3 % V

10 % V

5.75

⎯

130

7.0 Vdc

⎯

27 28

33 36 V

⎯ ⎯

Vdc

O, set

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Page 5

Data Sheet October 2, 2009

EHW015A0A Series Eighth-Brick Power Modules

36–75Vdc Input; 5.0Vdc Output; 15A Output Current

Characteristic Curves

The following figures provide typical characteristics for the EHW015A0A (5.0V, 15A) at 25oC. The figures are identical for either positive or negative remote On/Off logic.

EFFICIENCY, η (%)

03691215

Vin=48V

Vin=36V

OUTPUT CURRENT, IO (A)

Figure 1. Converter Efficiency versus Output Current. Figure 4. Transient Response to 1.0A/µS Dynamic

Vin=75V

(V) (100mV/div)

Io(A) (5A/div) V

OUTPUT CURRENT OUTPUT VOLTAGE

TIME, t (200µs/div)

Load Change from 50% to 75% to 50% of full load (V = V

IN,NOM

(V) (20mV/div)

OUTPUT VOLTAGE

TIME, t (2μs/div)

Figure 2. Typical outpu t ripple and noise (V I

o = Io,max).

(V) (100mV/div)

Io(A) (5A/div) V

OUTPUT CURRENT OUTPUT VOLTAGE

TIME, t (200µs/div)

IN = VIN,NOM,

Figure 3. Transient Response to 0.1A /µS Dynamic Load Change from 50% to 75% to 50% of full load (V = V

IN,NOM

(V) (5V/div)

On/Off

(V) (2V/div) V

OUTPUT VOLTAGE On/Off VOLTAGE

TIME, t (20ms/div)

Figure 5. Typical Start-up Using Remote On/Off, negative logic version shown (VIN = VIN,NOM, Io = Io,max).

(V) (20V/div)

(V) (2V/div) V

OUTPUT VOLTAGE INPUT VOLTAGE

TIME, t (20ms/div)

Figure 6. Typical Start-up Using Input Voltage (V V

IN,NOM, Io = Io,max).

IN =

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Page 6

Data Sheet October 2, 2009

EHW015A0A Series Eighth-Brick Power Modules

36–75Vdc Input; 5.0Vdc Output; 15A Output Current

Test Configurations

Vout+

Vout-

CURRENT P ROBE

33-1 00μF

RESISTIVE LOA D

x 100 %

Vin+

Vin-

contactRdistribution

LOAD

TO OSCILL OSCOPE

TEST

12μH

CS 220μF

BAT TERY

NOTE: M easure input r eflected ri pple current wi th a simulated

E.S .R.<0 .1Ω

@ 20° C 100kHz

source inductance (L possi ble batt ery impedance . Meas ure curre nt as show n above.

) of 12μH. Capacitor CS offs ets

TEST

Figure 7. Input Reflected Ripple Current Test Setup.

COPPER STR IP

V O (+)

SCOP E

V O ( – )

NOTE: A ll volt age mea surements to be tak en at the module

termin als, as shown ab ove. If sock ets are used th en Kelvi n conn ections are required at th e module te rm inals to av oid me asureme nt errors due to s ocket contact resistance.

10uF 1uF

GROUND PLANE

Figure 8. Output Ripple and Noise Test Setup.

contact

distribution

contact

distribution

NOTE: All voltage measurements to be taken at t he module

terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance.

Vin+

Vin-

Figure 9. Output Voltage and Efficiency Tes t Setup.

. I

Efficiency

VIN. I

Design Considerations

Input Filtering

The power module should be connected to a low ac-impedance source. Highly inductive source impedance can affect the stability of the power module. For the test configuration in Figure 7, a 33-100μF electrolytic capacitor (ESR<0.7Ω at 100kHz), mounted close to the power module helps ensure the stability of the unit. Consult the factory for further application guidelines.

Safety Considerations

For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e. UL60950-1, CSA C22.2 No.60950-1, and VDE0805-1(IEC60950-1).

If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75Vdc), for the module’s output to be considered as meeting the requirements for safety extra-low voltage (SELV), all of the following must be true:

 The input source is to be provided with reinforced

insulation from any other hazardous voltages, including the ac mains.

 One V

 The input pins of the module are not operator

 Another SELV reliability test is conducted on the

Note: Do not ground either of the input pins of the

The power module has extra-low voltage (ELV) outputs when all inputs are ELV.

All flammable materials used in the manufacturing of these modules are rated 94V-0, or tested to the UL60950 A.2 for reduced thickness.

For input voltages exceeding –60 Vdc but less than or equal to –75 Vdc, these converters have been evaluated to the applicable requirements of BASIC INSULATION between secondary DC MAINS DISTRIBUTION input (classified as TNV-2 in Europe) and unearthed SELV outputs.

The input to these units is to be provided with a maximum 6 A fast-acting fuse in the ungrounded lead.

pin and one V

pin are to be grounded,

OUT

or both the input and output pins are to be kept floating.

accessible.

whole system (combination of supply source and subject module), as required by the safety agencies, to verify that under a single fault, hazardous voltages do not appear at the module’s output.

module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pins and ground.

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Page 7

Data Sheet

October 2, 2009

EHW015A0A Series Eighth-Brick Power Modules

36–75Vdc Input; 5.0Vdc Output; 15A Output Current

Feature Description

Remote On/Off

Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the ON/OFF pin, and off during a logic low. Negative logic remote On/Off, device code suffix “1”, turns the module off during a logic high and on during a logic low.

Vin+

on/off

ON/OFF

Vin-

Figure 10. Remote On/Off Implementation.

To turn the power module on and off, the user must supply a switch (open collector or equivalent) to control the voltage (V the V

(-) terminal (see Figure 10). Logic low is

0V ≤ V

on/off

) between the ON/OFF terminal and

on/off

≤ 1.2V. The maximum I low is 1mA, the switch should be maintain a logic low level whilst sinking this current.

During a logic high, the typical maximum V generated by the module is 15V, and the maximum allowable leakage current at V

If not using the remote on/off feature:

For positive logic, leave the ON/OFF pin open.

For negative logic, short the ON/OFF pin to V

Remote Sense

Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections (See Figure 11). The voltage between the remote-sense pins and the output terminals must not exceed the output voltage sense range given in the Feature Specifications table:

(+) – VO(–)] – [SENSE(+) – SENSE(–)] ≤ 0.5 V

The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be

Vout+

TRIM

Vout-

on/off

= 5V is 1μA.

on/off

during a logic

on/off

(-).

increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = Vo,set x Io,max).

SENSE(+)

SENSE(–)

I(+)

VO(+)

SUPPLY

CONTACT

RESISTANCE

I(-)

O(–)

CONTACT AND

DISTRIBUTION LOSS

LOAD

Figure 11. Circuit Configuration for remote sense .

Input Undervoltage Lockout

At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will only begin to operate once the input voltage is raised above the undervoltage lockout turn-on threshold, V

UV/ON

Once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn-off threshold, V

UV/OFF

Overtemperature Protection

To provide protection under certain fault conditions, the unit is equipped with a thermal shutdown circuit. The unit will shutdown if the thermal reference point Tref (Figure 13), exceeds 130

C (typical), but the thermal shutdown is not intended as a guarantee that the unit will survive temperatures beyond its rating. The module can be restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second. If the auto-restart option (4) is ordered, the module will automatically restart upon cool-down to a safe temperature.

Output Overvoltage Protection

The output over voltage protection scheme of the modules has an independent over voltage loop to prevent single point of failure. This protection feature latches in the event of over voltage across the output. Cycling the on/off pin or input voltage resets the latching protection feature. If the auto-restart option (4) is ordered, the module will automatically restart upon an internally programmed time elapsing.

Overcurrent Protection

To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. If the unit is not configured with auto–restart, then it will latch off following the over current condition. The module can be

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Page 8

Data Sheet

October 2, 2009

EHW015A0A Series Eighth-Brick Power Modules

36–75Vdc Input; 5.0Vdc Output; 15A Output Current

Feature Descriptions (continued)

restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second. If the unit is configured with the auto-restart option (4), it will remain in the hiccup mode as long as the overcurrent condition exists; it operates normally, once the output current is brought back into its specified range. The average output current during hiccup is 10% I

O, max

Output Voltage Programming

Trimming allows the output voltage set point to be increased or decreased, this is accomplished by connecting an external resistor between the TRIM pin and either the V

VIN(+)

ON/OFF

VIN(-)

(+) pin or the VO(-) pin.

VO(+)

VOTRIM

VO(-)

trim-up

trim-down

LOAD

Figure 12. Circuit Configuration to Trim Output Voltage.

Connecting an external resistor (R TRIM pin and the V output voltage set point. To maintain set point accuracy, the trim resistor tolerance should be ±1.0%.

The following equation determines the required external resistor value to obtain a percentage output voltage change of Δ%

Where

For example, to trim-down the output voltage of the module by 8% to 4.6V, Rtrim-down is calculated as follows:

Connecting an external resistor (R TRIM pin and the V the output voltage set point. The following equation

) between the

511

trim-down

⎤

−

⎞ ⎟

100%

⎟ ⎠

ΚΩ

22.10

⎥ ⎦

(-) (or Sense(-)) pin decreases the

⎡

⎛ ⎜

=Δ

⎜ ⎝

−

downtrim

⎢ ⎣

−

desiredseto

seto

8% =Δ

511

⎡

−

downtrim

⎢

⎣

downtrim

(+) (or Sense (+)) pin increases

⎤

ΚΩ

22.10

−=

⎥ ⎦

ΚΩ=−6.53

) between the

trim-up

determines the required external resistor value to obtain a percentage output voltage change of Δ%:

−

Where

⎡

uptrim

⎢ ⎣

,seto

⎛ ⎜

=Δ

⎜ ⎝

−

seto

%)100(11.5

Δ+××

511

%225.1

Δ×

setodesired

− Δ

⎞ ⎟

100%

⎟ ⎠

For example, to trim-up the output voltage of the module by 5% to 5.25V, R

is calculated is as

trim-up

follows:

5% =

+××

511

⎡

−

uptrim

⎢ ⎣

uptrim

The voltage between the V

)5100(0.511.5

5225.1

(+) and VO(–) terminals

ΚΩ=−6.325

must not exceed the minimum output overvoltage protection value shown in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation and output voltage setpoint adjustment trim.

Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = V I

O,max

Thermal Considerations

The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation.

Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel.

The thermal reference point, T specifications for open frame modules is shown in Figure 13. For reliable operation this temperature should not exceed 117

The thermal reference point, T specifications for modules with heatplate is shown in Figure 14. For reliable operation this temperature should not exceed 105

used in the

ref

used in the

ref

⎤

ΚΩ

22.10

−

−−

⎥ ⎦

⎤

ΚΩ

22.10

⎥ ⎦

O,set

LINEAGE POWER 8

Page 9

Data Sheet October 2, 2009

EHW015A0A Series Eighth-Brick Power Modules

36–75Vdc Input; 5.0Vdc Output; 15A Output Current

Thermal Considerations (continued)

AIRFLOW

Figure 13. T for Open Frame Module.

Figure 14. T for Module with Heatplate.

Heat Transfer via Convection

Increased airflow over the module enhances the heat transfer via convection. Derating curves showing the maximum output current that can be delivered by the open frame module versus local ambient temperature (T

A) for natural convection and up to 3m/s (600 ft./min)

forced airflow are shown in Figure 15.

(A)

OUTPUT CURRENT, I

Figure 15. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V.

For additional power, the module is available with an optional heatplate (-H), that allows for the use of heat sinks to improve the thermal derating. Derating curves showing the maximum output current that can be delivered by the heatplate module with different heat sink heights versus local ambient temperature (T

Temperature Measurement Location

ref

AIRFLOW

Temperature Measurement Location

ref

3.0 m/s

20 30 40 50 60 70 80 90

AMBIENT TEMEPERATURE, TA (oC)

(600 LFM)

(400 LFM)

2.0 m/s

(200 LFM)

1.0 m/s

0.5 m/s

(100 LFM)

A) for

natural convection and up to 3m/s (600 ft./min) forced airflow are shown in Figures 16 -19.

(A)

OUTPUT CURRENT, I

20 30 40 50 60 70 80 90

AMBIENT TEMEPERATURE, TA (oC)

3.0 m/s

(600 LFM)

(400 LFM)

2.0 m/s

(200 LFM)

1.0 m/s

(100 LFM)

0.5 m/s

Figure 16. Output Current Derating for the Module with Heatplate; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V.

(A)

OUTPUT CURRENT, I

20 30 40 50 60 70 80 90

AMBIENT TEMEPERATURE, TA (oC)

3.0 m/s

(600 LFM)

(400 LFM)

2.0 m/s

(200 LFM)

1.0 m/s

Figure 17. Output Current Derating for the Module with Heatplate and 0.25 in. heat sink; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V.

(A)

OUTPUT CURRENT, I

20 30 40 50 60 70 80 90

AMBIENT TEMEPERATURE, TA (oC)

3.0 m/s

(600 LFM)

(400 LFM)

2.0 m/s

(200 LFM)

1.0 m/s

Figure 18. Output Current Derating for the Module with Heatplate and 0.5 in. heat sink; Airfl ow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V.

0.5 m/s

(100 LFM)

0.5 m/s

(100 LFM)

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Data Sheet

October 2, 2009

EHW015A0A Series Eighth-Brick Power Modules

36–75Vdc Input; 5.0Vdc Output; 15A Output Current

Thermal Considerations (continued)

(A)

OUTPUT CURRENT, I

20 30 40 50 60 70 80 9

AMBIENT TEMEPERATURE, TA (oC)

Figure 19. Output Current De rating for the Module with Heatplate and 1.0 in. heat sink; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V.

Please refer to the Application Note “Thermal Characterization Process For Open-Frame BoardMounted Power Modules” for a detailed discussion of thermal aspects including maximum device temperatures.

Heat Transfer via Conduction

The module can also be used in a sealed environment with cooling via conduction from the module’s top surface through a gap pad material to a cold wall, as shown in Figure 20. The output current derating versus cold wall temperature, when using a gap pad such as Bergquist GP2500S20, is shown in Figure 21.

Figure 20. Cold Wall Mounting

(A)

OUTPUT CURRENT, I

20 30 40 50 60 70 80 90

Figure 21. Derated Output Current versus Cold Wall Temperature with local ambient temperature around module at 85C; Vin=48V.

COLDPLATE TEMEPERATURE, T

2.0 m/s

(400 LFM)

1.0 m/s

(200 LFM)

0.5 m/s

(100 LFM)

(oC)

Surface Mount Information

Pick and Place

The EHW015A0A-S modules use an open frame construction and are designed for a fully automated assembly process. The modules are fitted with a label designed to provide a large surface area for pick and place operations. The label meets all the requirements for surface mount processing, as well as safety standards, and is able to withstand reflow temperatures of up to 300 information such as product code, serial number and the location of manufacture.

Figure 23. Pick and Place Location.

Nozzle Recommendations

The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm.

Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available.

The surface mountable modules in the EHW family use our newest SMT technology called “Column Pin” (CP) connectors. Figure 24 shows the new CP connector before and after reflow soldering onto the end-board assembly.

Figure 24. Column Pin Connector Before and After

C. The label also carries product

EHW B oa rd

Insulator

Solder Ba ll

End assem bly PCB

Reflow Soldering .

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Data Sheet October 2, 2009

EHW015A0A Series Eighth-Brick Power Modules

36–75Vdc Input; 5.0Vdc Output; 15A Output Current

Surface Mount Information (continued)

The CP is constructed from a solid copper pin with an integral solder ball attached, which is composed of tin/lead (Sn/Pb) solder for non-Z codes, or Sn/Ag/Cu (SAC) solder for –Z codes. The CP connector design is able to compensate for large amounts of co-planarity and still ensure a reliable SMT solder joint. Typically, the eutectic solder melts at 183 217-218

C (SAC solder), wets the land, and

C (Sn/Pb solder) or

subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR.

Tin Lead Soldering

The EHW015A0A power modules are lead free modules and can be soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability.

In a conventional Tin/Lead (Sn/Pb) solder process peak reflow temperatures are limited to less than 235 Typically, the eutectic solder melts at 183 land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. For reliable soldering the solder reflow profile should be established by accurately measuring the modules CP connector temperatures.

300

250

200

15 0

10 0

REFLOW TEMP (°C)

Peak T emp 235oC

Heat zo ne

oCs-1

max 4

Soak zone 30-240s

Preheat zo ne

oCs-1

max 4

T 205

lim

above

C, wets the

Co o ling zo ne

oCs-1

1- 4

REFLOW TIME (S)

Figure 25. Reflow Profile for Tin/Lead (Sn/Pb) process.

240

235

230

225

220

215

210

MAX TEMP SOLDER (°C)

205

200

0 102030405060

Figure 26. Time Limit Curve Above 205oC for Tin/Lead (Sn/Pb) process

Lead Free Soldering

The –Z version of the EHW015A0A modules are leadfree (Pb-free) and RoHS compliant and are both forward and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect longterm reliability.

Pb-free Reflow Profile

Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure 27.

MSL Rating

The EHW015A0A modules have a MSL rating of 2.

Storage and Handling

The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is

LINEAGE POWER 11

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Data Sheet October 2, 2009

EHW015A0A Series Eighth-Brick Power Modules

36–75Vdc Input; 5.0Vdc Output; 15A Output Current

Surface Mount Information (continued)

broken, the floor life of the product at conditions of ≤ 30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40° C, < 90% relative humidity.

Post Solder Cleaning and Drying Considerations

Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures,

refer to Lineage Power Board Mounted Power Modules: Soldering and Cleaning

Application Note (AN04-001).

300

Per J-STD-020 Rev. C

250

200

150

100

Reflow Temp (°C)

Heat ing Zone 1°C/Second

Peak Temp 260°C

* Min. Time Above 235°C 15 Seconds

*Time Above 217°C

60 Seconds

Cooling Zone

Through-Hole Lead-Free Soldering Information

The RoHS-compliant through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have an RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3 wave preheat process should be such that the temperature of the power module board is kept below

°C. For Pb solder, the recommended pot

210 temperature is 260

°C max. Not all RoHS-compliant through-hole

270

°C, while the Pb-free solder pot is

products can be processed with paste-through-hole Pb or Pb-free reflow process. If additional information is needed, please consult with your Lineage Power representative for more details.

°C/s is suggested. The

Reflow Time (Seconds)

Figure 27. Recommended linear reflow profile using Sn/Ag/Cu solder.

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Data Sheet October 2, 2009

EHW015A0A Series Eighth-Brick Power Modules

36–75Vdc Input; 5.0Vdc Output; 15A Output Current

EMC Considerations

The circuit and plots in Figure 28 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B.

Level [dBµV]

150k 300k 500k 1M 2M 3M 4M 5M 7M 10M 30M

x xMES CE0526091159_fin QP

MES CE0526091159_pre PK

Level [dBµV]

150k 300k 500k 1M 2M 3M 4M 5M 7M 10M 30M

+ +MES CE0526091159_fin AV

MES CE0526091159_pre AV

Frequency [Hz]

Figure 28. EMC Considerations

For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).

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Page 14

Data Sheet October 2, 2009

EHW015A0A Series Eighth-Brick Power Modules

36–75Vdc Input; 5.0Vdc Output; 15A Output Current

Mechanical Outline for Through-Hole Module

Dimensions are in millimeters and [inches].

Tolerances: x.x mm

x.xx mm

± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)

± 0.25 mm [x.xxx in. ± 0.010 in.]

Top

View

Side View

Bottom

†

View

Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+)

*For optional pin lengths, see Table 2, Device Coding Scheme and Options

†

Bottom side label includes Lineage Power name, product designation and date code.

LINEAGE POWER 14

Page 15

Data Sheet October 2, 2009

EHW015A0A Series Eighth-Brick Power Modules

36–75Vdc Input; 5.0Vdc Output; 15A Output Current

Mechanical Outline for Surface Mount Module (-S Option)

Dimensions are in millimeters and [inches].

Tolerances: x.x mm

x.xx mm

Top

View

± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)

± 0.25 mm [x.xxx in ± 0.010 in.]

Top side label includes Lineage Power name, product designation and date code.

Side

View

Bottom

View

Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+)

LINEAGE POWER 15

Page 16

Data Sheet October 2, 2009

EHW015A0A Series Eighth-Brick Power Modules

36–75Vdc Input; 5.0Vdc Output; 15A Output Current

Mechanical Outline for Through-Hole Module with Heat Plate (-H Option)

Dimensions are in millimeters and [inches].

Tolerances: x.x mm

x.xx mm

± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)

± 0.25 mm [x.xxx in ± 0.010 in.]

Top

View

Side View

Bottom

†

View

*For optional pin lengths, see Table 2, Device Coding Scheme and Options

†

Bottom side label includes Lineage Power name, product designation and date code.

Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+)

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Data Sheet October 2, 2009

Recommended Pad Layout

Dimensions are in millimeters and [inches].

Tolerances: x.x mm

x.xx mm

Pin Function

1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+)

± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)

± 0.25 mm [x.xxx in ± 0.010 in.]

EHW015A0A Series Eighth-Brick Power Modules

36–75Vdc Input; 5.0Vdc Output; 15A Output Current

SMT Recommended Pad Layout (Component Side View)

Pin Function

1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+)

NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH HOLE DIAMETER

FOR 0.62 DIA” PIN, USE 0.076” PLATED THROUGH HOLE DIAMETER

TH Recommended Pad Layout (Component Side View)

LINEAGE POWER 17

Page 18

Data Sheet October 2, 2009

EHW015A0A Series Eighth-Brick Power Modules

36–75Vdc Input; 5.0Vdc Output; 15A Output Current

Packaging Details

The open frame through hole versions of the EHW015A0A and surface mount versions of the EHW015A0A (suffix –S) are supplied as standard in the plastic trays shown in Figures 28 and 29.

Tray Specification

Material Antistatic coated PVC Max surface resistivity 10 Color Clear Capacity 12 power modules

Ω/sq

Each tray contains a total of 12 power modules. The trays are self-stacking and each shipping box for the EHW015A0A through hole module will contain 2 full trays plus one empty hold down tray giving a total number of 24 power modules; and each shipping box for the EHW015A0A (suffix –S) surface mount module will contain 4 full trays plus one empty hold down tray giving a total number of 48 power modules.

Figure 28. Through Hole Packaging Tray

Figure 29. Surface Mount Packaging Tray

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Page 19

Data Sheet

October 2, 2009

EHW015A0A Series Eighth-Brick Power Modules

36–75Vdc Input; 5.0Vdc Output; 15A Output Current

Ordering Information

Please contact your Lineage Power Sales Representative for pricing, availability and optional features.

Table 1. Device Codes

Product Codes Input Voltage

EHW015A0A1

EHW015A0A41Z

EHW015A0A41-HZ

EHW015A0A41-SZ

48V (36-75Vdc) 5.0V 15A Negative Through hole

48V (36-75Vdc) 5.0V 15A Negative Surface mount

Output

Voltage

Table 2. Device Coding Scheme and Options Characteristic Character and Position Definition

Form Factor E E = Eighth Brick Family Designator H Input Voltage W W = Wide Input Voltage Range, 36V -75V Output Current 015A0 015A0 = 015.0 Amps Rated Output Current

Ratings

Output Voltage A A = 5.0 Vout Nominal

Omit = No Pin Trim

Pin Length

6 6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.)

8 8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.) Action following Omit = Latching Mode Protective Shutdown 4 4 = Auto-restart following shutdown (Overcurrent/Overvoltage)

On/Off logic

Options

Customer Specific XY XY = Customer Specific Modified Code, Omit for Standard Code

Omit = Positive Logic

1 1 = Negative Logic

Omit = Standard open Frame Module Mechanical Features

H H = Heat plate (not available with –S option)

S S = Surface mount connections

RoHS

Omit = RoHS 5/6, Lead Based Solder Used

Z Z = RoHS 6/6 Compliant, Lead free

Output

Current

On/Off

Logic

Connector

Type

Comcodes

CC109150587

CC109141818

CC109146387

CC109146395

Asia-Pacific Headquarters

Tel: + 65 6593 7211

World Wide Headquarters Lineage Power Corporation

601 Shil oh Roa d, Plano, TX 75074, USA +1-800-526-7819 (Outsi de U.S.A.: +1-972-244-9428)

www.lineagepower.com e-mail: techsupport1@lineagepower.com

Linea ge Power res erves th e right to make change s to the prod uct(s) or i nformation c ontained herein without not ice. No l iability is assumed as a result o f their use or

pplication . No righ ts under any patent accompany the sal e of any s uch produc t(s) or informati on.

Linea ge Power D C-DC product s are prote cted unde r various pa tents. Infor mation on these pa tents is av ailable at ww w.line agepower .com/paten ts.

2009 Line age Power Corporation, (Plan o, Texas) All Inte rnation al Rights Reserved.

Europe, Middle-East and Africa Headquarters

Tel: + 49 898 780 672 80

India Headquarters

Tel: + 91 80 2841163 3

Document No: DS08-003 ver. 1.02

PDF name: ehw015_ds.pdf