GE Industrial Solutions EHW007A0B User Manual

Data Sheet

f

October 2, 2009

EHW007A0B Series (Eighth-Brick) DC-DC Converter Power Modules

36–75Vdc Input; 12.0Vdc Output; 7A Output Current

RoHS Compliant

Applications

 Distributed Power Architectures

 Wireless Networks

 Access and Optical Network Equipment

 Enterprise Networks including Power over Ethernet

(PoE)

Options

 Negative Remote On/Off logic

 Over current/Over temperature/Over voltage

protections (Auto-restart)

 Heat plate version (-H)

 Surface Mount version (-S)

Features

 Compliant to RoHS EU Directive 2002/95/EC (-Z

versions)

 Compliant to ROHS EU Directive 2002/95/EC with

lead solder exemption (non-Z versions)

 High efficiency 92.5% at 12.0V full load

(Vin=48Vdc)

 Industry standard, DOSA compliant footprint

58.4mm x 22.8mm x 8.1mm

(2.30 in x 0.9 in x 0.32 in)

 Low profile height and reduced component skyline

 Wide input voltage range: 36-75 Vdc

 Tightly regulated output

 Constant switching frequency

 Positive remote On/Off logic

 Input under/over voltage protection

 Output overcurrent and overvoltage protection

 Over-temperature protection

 Remote sense

 No reverse current during output shutdown

 Output Voltage adjust: 90% to 110% of V

 Wide operating temperature range (-40°C to 85°C)

 Suitable for cold wall cooling using suitable Gap

Pad applied directly to top side of module

 UL*Recognized to UL60950-1, CAN/CSA

No.60950-1, and EN60950-1(
Licensed

 CE mark meets 2006/95/EC directive

 Meets the voltage and current requirements for

ETSI 300-132-2 and complies with and licensed
for Basic insulation rating per EN60950-1

 2250 Vdc Isolation tested in compliance with IEEE

 ISO

¤

802.3

PoE standards

**

9001 and ISO 14001 certified manufacturing

facilities

VDE

‡

0805-1)

§

o,nom

†

C22.2

Description

The EHW007A0B, Eighth-brick low-height power module is an isolated dc-dc converters that can deliver up to 7A of
output current and provide a precisely regulated output voltage of 12.0V over a wide range of input voltages (V

- 75Vdc). The modules achieve typical full load efficiency of 92.5%. The open frame modules construction, available
in both surface-mount and through-hole packaging, enable designers to develop cost and space efficient solutions.
Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and
overtemperature protection.

* UL is a registered trademark of Underwriters Laboratori es, Inc.

†

CSA is a registered trademark of Canadian Standards Association.

‡

VDE is a trademark of Verband Deutscher Elektrotechniker e. V.

§

This product is intended for integration into end-user e quipment . All of the required procedures of end-use equipment should be followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the International Orga nization of Standards

Document No: DS08-002 ver. 1.02

PDF name: ehw007_ds.pd

IN = 36

Data Sheet
October 2, 2009

EHW007A0B Series Eighth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 7A Output Current

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute
stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those
given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can
adversely affect the device reliability.

Parameter Device Symbol Min Max Unit

Input Voltage

Continuous All V

Transient, operational (≤100 ms) All V

Operating Ambient Temperature All T

IN

IN,trans

A

-0.3 80 Vdc

-0.3 100 Vdc

-40 85 °C

(see Thermal Considerations section)

Storage Temperature All T

I/O Isolation voltage (100% factory Hi-Pot tested) All

stg

⎯ ⎯

-55 125 °C

2250 Vdc

Electrical Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.

Parameter Device Symbol Min Typ Max Unit

Operating Input Voltage All VIN 36 48 75 Vdc

Maximum Input Current

(VIN= V

IN, min

to V

IN, max

, IO=I

O, max

)

Input No Load Current

(VIN = V

, IO = 0, module enabled)

IN, nom

Input Stand-by Current All

(VIN = V

, module disabled)

IN, nom

Inrush Transient All I2t 0.5 A2s

All I

All I

IN,max

IN,No load

I

IN,stand-by

2.75 3.0 Adc

70 mA

5 8 mA

Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; V
IO= I

; See Test configuration section)

Omax

IN, min

to V

IN, max,

All 30 mA

p-p

Input Ripple Rejection (120Hz) All 50 dB

CAUTION: This power module is not internally fused. An input line fuse must always be used.

This power module can be used in a wide variety of applications, ranging from simple standalone operation to an
integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included,
however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies
require a fast-acting fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information
provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating
can be used. Refer to the fuse manufacturer’s data sheet for further information.

LINEAGE POWER 2

Data Sheet
October 2, 2009

EHW007A0B Series Eighth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 7A Output Current

Electrical Specifications (continued)

Parameter Device Symbol Min Typ Max Unit

Nominal Output Voltage Set-point

VIN=V

IN, min

, IO=I

, TA=25°C) All V

O, max

O, set

Output Voltage

(Over all operating input voltage, resistive load, and

All V

O

temperature conditions until end of life)

Output Regulation

Line (VIN=V
Load (IO=I

Temperature (T

IN, min

O, min

to V

to I

O, max

ref=TA, min

) All

IN, max

)

to T

) All

A, max

All

⎯ ⎯ ±0.2 % V

Output Ripple and Noise on nominal output

(VIN=V

IN, nom

,IO= I

O, max

, TA=T

A, min

to T

)

A, max

RMS (5Hz to 20MHz bandwidth) All

Peak-to-Peak (5Hz to 20MHz bandwidth) All

External Capacitance All C

Output Current All I

Output Current Limit Inception (Hiccup Mode )
(VO= 90% of V

O, set

)

Output Short-Circuit Current

(VO≤250mV) ( Hiccup Mode )

All

All I

O, max

I

O, lim

O, s/c

o

Efficiency

VIN= V

VIN= V

Switching Frequency All f

, TA=25°C, IO=I

IN, nom

, TA=25°C, IO=0.5I

IN, nom

O, max , VO

O, max , VO

= V

All η 92.5 %

O,set

= V

All η 91.5 %

O,set

sw

Dynamic Load Response

(dIo/dt=0.1A/μs; VIN = V

IN, nom

; TA=25°C)

Load Change from Io= 50% to 75% or 25% to 50% of
I

o,max

Peak Deviation All V

Settling Time (Vo<10% peak deviation)

(dIo/dt=1.0A/μs; VIN = V

IN, nom

; TA=25°C)

Load Change from Io= 50% to 75% or 25% to 50% of
I

o,max

Peak Deviation All V

Settling Time (Vo<10% peak deviation)

pk

All t

s

pk

All t

s

11.8 12.0 12.24 V

11.64

⎯ ⎯

⎯ ⎯

⎯
⎯

0

0

⎯

20 30 mV

50 100 mV

⎯
⎯

12.36 % V

±0.2 % V

±1.0

2,000 μF

7 Adc

105 120 130

5 A

% V

% I

dc

O, set

O, set

O, set

O, set

pk-pk

rms

rms

o

400 kHz

⎯
⎯

3

200

⎯
⎯ μs

% V

O, set

⎯
⎯

5

200

⎯
⎯ μs

% V

O, set

Isolation Specifications

Parameter Device Symbol Min Typ Max Unit

Isolation Capacitance All C

Isolation Resistance All R

I/O Isolation Voltage (100% factory Hi-pot tested) All All

iso

iso

⎯

100

⎯ ⎯

1000

⎯ ⎯

⎯

2250 Vdc

pF

MΩ

General Specifications

Parameter Device Symbol Min Typ Max Unit

Calculated Reliability based upon Telcordia SR-332
Issue 2: Method

I Case 3 (I

=80%I

O

O, max

, TA=40°C,

airflow = 200 lfm, 90% confidence)

Weight (Open Frame) All

Weight (with Heatplate) All

LINEAGE POWER 3

All FIT 235.0 109/Hours

All MTBF 4,254,493 Hours

21

(0.77)

33

(1.16)

g

(oz.)

g

(oz.)

Data Sheet
October 2, 2009

EHW007A0B Series Eighth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 7A Output Current

Feature Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions for additional information.

Parameter Device Symbol Min Typ Max Unit

Remote On/Off Signal Interface

(VIN=V
Signal referenced to V
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On

Logic Low - Remote On/Off Current All I

Logic Low - On/Off Voltage All V

Logic High Voltage – (Typ = Open Collector) All V

Logic High maximum allowable leakage current All I

Turn-On Delay and Rise Times

(IO=I
Case 1: Input power is applied for at least 1 second

and then the On/Off input is set from OFF to ON (T
= from instant at which V

Case 2: On/Off input is set to Logic Low (Module
ON) and then input power is applied (T
instant at which V

Output voltage Rise time (time for Vo to rise from 10%
of V

Output voltage overshoot – Startup

IO= I

Remote Sense Range All V

Output Voltage Adjustment Range All 90 110 % V

Output Overvoltage Protection

Overtemperature Protection – Hiccup Auto Restart All T

Input Undervoltage Lockout All V

Turn-on Threshold

Turn-off Threshold

Hysterisis 1 2 3 Vdc

Input Overvoltage Lockout All V

Turn-on Threshold 76 79

Turn-off Threshold

Hysterisis 1 2

to V

IN, min

O, max , VIN=VIN, nom, TA

o,set

O, max

IN, max

to 90% of V

; VIN=V

IN, min

= V

IN

o, set

to V

; open collector or equivalent,

terminal)

IN-

on/off

on/off

on/off

on/off

⎯

-0.7

⎯
⎯ ⎯

0.3 1.0 mA

⎯

5 V

1.2 Vdc

dc

10 μA

= 25oC)

until VO = 10% of V

IN=VIN, min

until Vo=10% of V

IN, min

)

, TA = 25 oC

IN, max

delay

from

O,set

)

delay

All T

O,

All T

All T

All

All V

― 20 ― msec

delay

― ― 150 msec

delay

rise

SENSE

O, limit

ref

UVLO

OVLO

― 5 12 msec

― 3 % V

10 % V

13.8

⎯

⎯

135

16.5 Vdc

⎯

O, set

O, set

O, set

O

C

⎯

34 36 V

30 32

⎯

Vdc

dc

Vdc

Vdc

⎯

⎯

81 83 Vdc

⎯

LINEAGE POWER 4

Data Sheet

V

V

V

October 2, 2009

EHW007A0B Series Eighth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 7A Output Current

Characteristic Curves

The following figures provide typical characteristics for the EHW007A0B (12.0V, 7A) at 25oC. The figures are
identical for either positive or negative remote On/Off logic.

95

90

85

80

Vin = 36

Vin = 48

Vin = 75

(V) (200mV/div)

O

75

70

EFFICIENCY, η (%)

01234567

OUTPUT CURRENT, IO (A)

Io(A) (2A/div) V

OUTPUT CURRENT OUTPUT VOLTAGE

TIME, t (100µs/div)

Figure 1. Converter Efficiency versus Output Current. Figure 4. Transient Response to 1.0A/µS Dynamic

Load Change from 50% to 75% to 50% of full load.

(V) (5V/div)

On/Off

(V) (50mV/div)

O

V

OUTPUT VOLTAGE

(V) (5V/div) V

O

TIME, t (2μs/div)

Figure 2. Typical outpu t ripple and noise (V
I

o = Io,max).

IN = VIN,NOM,

OUTPUT VOLTAGE On/Off VOLTAGE

V

Figure 5. Typical Start-up Using Remote On/Off,
negative logic version shown (VIN = VIN,NOM, Io = Io,max).

TIME, t (5ms/div)

(V) (20V/div)

(V) (200mV/div)

O

Io(A) (2A/div) V

OUTPUT CURRENT OUTPUT VOLTAGE

TIME, t (200µs/div)

Figure 3. Transient Response to 0.1A /µS Dynamic
Load Change from 50% to 75% to 50% of full load.

IN

(V) (5V/div) V

O

OUTPUT VOLTAGE INPUT VOLTAGE

V

TIME, t (20ms/div)

Figure 6. Typical Start-up Using Input Voltage (VIN =
V

IN,NOM, Io = Io,max).

LINEAGE POWER 5

Data Sheet
October 2, 2009

36–75Vdc Input; 12.0Vdc Output; 7A Output Current

Test Configurations

33-10 0μF

SCOP E

Vout+

Vout-

V

CURRENT P ROBE

RESISTIVE
LOA D

R

contactRdistribution

O

R

contactRdistribution

x 100 %

Vin+

Vin-

R

LOAD

TO OSCILL OSCOPE

L

TEST

12μH

CS 220μF

BAT TERY

NOTE: M easure input r eflected ri pple current wi th a simulated

E.S .R.<0 .1Ω

@ 20° C 100kHz

source inductance (L
possi ble batt ery impedance . Meas ure curre nt as show n
above.

) of 12μH. Capacitor CS offs ets

TEST

Figure 7. Input Reflected Ripple Current Test
Setup.

COPPER STRIP

V O (+)

V O ( – )

NOTE: A ll volt age mea surements to be tak en at the module

1uF

10uF

GROUND PLANE

termin als, as shown ab ove. If sock ets are used th en
Kelvi n conn ections are required at th e module te rminals
to av oid me asureme nt errors due to s ocket contact
resistance.

Figure 8. Output Ripple and Noise Test Setup.

R

R

contact

distribution

R

R

contact

distribution

NOTE: All voltage measurements to be taken at t he module

terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.

Vin+

V

IN

Vin-

Figure 9. Output Voltage and Effici ency Tes t
Setup.

. I

V

O

Efficiency

=

η

VIN. I

O

IN

EHW007A0B Series Eighth-Brick Power Modules

Design Considerations

Input Filt ering

The power module should be connected to a low
ac-impedance source. Highly inductive source
impedance can affect the stability of the power
module. For the test configuration in Figure 7 a 33­100μF electrolytic capacitor (ESR<0.7Ω at 100kHz),
mounted close to the power module helps ensure the
stability of the unit. Consult the factory for further
application guidelines.

Safety Considerations

For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and
separation requirements of the end-use safety agency
standard, i.e. UL60950-1, CSA C22.2 No.60950-1,
and VDE0805-1(IEC60950-1).

If the input source is non-SELV (ELV or a hazardous
voltage greater than 60 Vdc and less than or equal to
75Vdc), for the module’s output to be considered as
meeting the requirements for safety extra-low voltage
(SELV), all of the following must be true:

 The input source is to be provided with reinforced

insulation from any other hazardous voltages,
including the ac mains.

 One V

pin and one V

IN

pin are to be

OUT

grounded, or both the input and output pins are
to be kept floating.

 The input pins of the module are not operator

accessible.

 Another SELV reliability test is conducted on the

whole system (combination of supply source and
subject module), as required by the safety
agencies, to verify that under a single fault,
hazardous voltages do not appear at the
module’s output.

Note: Do not ground either of the input pins of the

module without grounding one of the output
pins. This may allow a non-SELV voltage to
appear between the output pins and ground.

The power module has extra-low voltage (ELV)
outputs when all inputs are ELV.

All flammable materials used in the manufacturing of
these modules are rated 94V-0, or tested to the
UL60950 A.2 for reduced thickness.

For input voltages exceeding –60 Vdc but less than or
equal to –75 Vdc, these converters have been
evaluated to the applicable requirements of BASIC
INSULATION between secondary DC MAINS
DISTRIBUTION input (classified as TNV-2 in Europe)
and unearthed SELV outputs.

The input to these units is to be provided with a
maximum 6 A fast-acting fuse in the ungrounded lead.

LINEAGE POWER 6

Data Sheet

E

October 2, 2009

EHW007A0B Series Eighth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 7A Output Current

Feature Description

Remote On/Off

Two remote on/off options are available. Positive logic
turns the module on during a logic high voltage on the
ON/OFF pin, and off during a logic low. Negative logic
remote On/Off, device code suffix “1”, turns the
module off during a logic high and on during a logic
low.

Vin+

I

on/off

V

on/off

ON/OFF

Vin-

Figure 10. Remote On/Off Implementation.

To turn the power module on and off, the user must
supply a switch (open collector or equivalent) to
control the voltage (V
terminal and the V
low is 0V ≤ V

≤ 1.2V. The maximum I

on/off

) between the ON/OFF

on/off

(-) terminal (see Figure 10). Logic

IN

logic low is 1mA, the switch should be maintain a
logic low level whilst sinking this current.

During a logic high, the typical maximum V
generated by the module is 5V, and the maximum
allowable leakage current at V

If not using the remote on/off feature:

For positive logic, leave the ON/OFF pin open.

For negative logic, short the ON/OFF pin to V

Remote Sense

Remote sense minimizes the effects of distribution
losses by regulating the voltage at the remote-sense
connections (See Figure 11). The voltage between
the remote-sense pins and the output terminals must
not exceed the output voltage sense range given in
the Feature Specifications table:

[V

(+) – VO(–)] – [SENSE(+) – SENSE(–)] ≤ 0.5 V

O

Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim.

The amount of power delivered by the module is
defined as the voltage at the output terminals
multiplied by the output current. When using remote
sense and trim, the output voltage of the module can
be increased, which at the same output current would
increase the power output of the module. Care should
be taken to ensure that the maximum output power of

Vout+

TRIM

Vout-

= 5V is 1μA.

on/off

on/off

on/off

during a

(-).

IN

the module remains at or below the maximum rated
power (Maximum rated power = Vo,set x Io,max).

SENSE(+)

SENSE(–)

V

I(+)

VO(+)

SUPPLY

CONTACT

RESISTANCE

I

I

I(-)

V

O(–)

V

DISTRIBUTION LOSS

IO

CONTACT AND

LOAD

Figure 11. Circuit Configuration for remote
sense .

Input Undervoltage Lockout

At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module
will only begin to operate once the input voltage is
raised above the undervoltage lockout turn-on
threshold, V

UV/ON

.

Once operating, the module will continue to operate
until the input voltage is taken below the undervoltage
turn-off threshold, V

UV/OFF

.

Overtemperature Protection

To provide protection under certain fault conditions,
the unit is equipped with a thermal shutdown circuit.
The unit will shutdown if the thermal reference point
Tref (Figure 13), exceeds 135

o

C (typical), but the
thermal shutdown is not intended as a guarantee that
the unit will survive temperatures beyond its rating.
The module can be restarted by cycling the dc input
power for at least one second or by toggling the
remote on/off signal for at least one second. If the
auto-restart option (4) is ordered, the module will
automatically restart upon cool-down to a safe
temperature.

Output Overvoltage Protection

The output over voltage protection scheme of the
modules has an independent over voltage loop to
prevent single point of failure. This protection feature
latches in the event of over voltage across the output.
Cycling the on/off pin or input voltage resets the
latching protection feature. If the auto-restart option
(4) is ordered, the module will automatically restart
upon an internally programmed time elapsing.

Overcurrent Protection

To provide protection in a fault (output overload)
condition, the unit is equipped with internal
current-limiting circuitry and can endure current
limiting continuously. At the point of current-limit
inception, the unit enters hiccup mode. If the unit is
not configured with auto–restart, then it will latch off
following the over current condition. The module can
be restarted by cycling the dc input power for at least

LINEAGE POWER 7

Data Sheet

Δ

October 2, 2009

EHW007A0B Series Eighth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 7A Output Current

Feature Descriptions (continued)

one second or by toggling the remote on/off signal for
at least one second. If the unit is configured with the
auto-restart option (4), it will remain in the hiccup
mode as long as the overcurrent condition exists; it
operates normally, once the output current is brought
back into its specified range. The average output
current during hiccup is 10% I

O, max

.

Output Voltage Programming

Trimming allows the output voltage set point to be
increased or decreased, this is accomplished by
connecting an external resistor between the TRIM pin
and either the V

VIN(+)

ON/OFF

VIN(-)

(+) pin or the VO(-) pin.

O

VO(+)

VOTRIM

VO(-)

R

trim-up

R

trim-down

LOAD

Figure 12. Circuit Configuration to Trim Output
Voltage.

Connecting an external resistor (R
the TRIM pin and the V
decreases the output voltage set point. To maintain
set point accuracy, the trim resistor tolerance should
be ±1.0%.

The following equation determines the required
external resistor value to obtain a percentage output
voltage change of Δ%

Where

For example, to trim-down the output voltage of the
module by 8% to 11.04V, Rtrim-down is calculated as
follows:

Connecting an external resistor (R
TRIM pin and the V
the output voltage set point. The following equation
determines the required external resistor value to
obtain a percentage output voltage change of Δ%:

) between

(-) (or Sense(-)) pin

O

511

⎡

R

=Δ

=

−

downtrim

⎢

Δ

⎣

⎛

−

VV

,

⎜
⎜
⎝

desiredseto

V

,

seto

trim-down

⎤

−

22.10

%

⎞
⎟

100%

×

⎟
⎠

ΚΩ

⎥
⎦

8% =Δ

511

R

⎡

−

downtrim

⎢

8

⎣

R

downtrim

(+) (or Sense (+)) pin increases

O

⎤

ΚΩ

22.10

−=

⎥
⎦

ΚΩ=−655.53

) between the

trim-up

R

−

Where

V

⎡

=

uptrim

⎢
⎣

,seto

⎛
⎜

=Δ

⎜

V

⎝

,

Δ+××

%)100(11.5

511

−

Δ×

%225.1

VV

−

,

setodesired

seto

Δ

%

⎞
⎟

100%

×

⎟
⎠

⎤

−

ΚΩ

22.10

⎥
⎦

For example, to trim-up the output voltage of the
module by 5% to 12.6V, R

is calculated is as

trim-up

follows:

5% =

+××

511

⎡

=

R

−

uptrim

⎢
⎣

×

R

uptrim

The voltage between the V

)5100(0.1211.5

5225.1

(+) and VO(–) terminals

O

5

ΚΩ=−8.938

⎤

−−

ΚΩ

22.10

⎥
⎦

must not exceed the minimum output overvoltage
protection value shown in the Feature Specifications
table. This limit includes any increase in voltage due
to remote-sense compensation and output voltage
set-point adjustment trim.

Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim. The amount of power
delivered by the module is defined as the voltage at
the output terminals multiplied by the output current.
When using remote sense and trim, the output
voltage of the module can be increased, which at the
same output current would increase the power output
of the module. Care should be taken to ensure that
the maximum output power of the module remains at
or below the maximum rated power (Maximum rated
power = V

O,set

x I

O,max

).

Thermal Considerations

The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.

Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.

The thermal reference point, T
specifications for open frame modules is shown in
Figure 13. For reliable operation this temperature
should not exceed 123

o

C.

The thermal reference point, T
specifications for modules with heatplate is shown in
Figure 14. For reliable operation this temperature
should not exceed 110

o

C.

used in the

ref

used in the

ref

LINEAGE POWER 8

Data Sheet
October 2, 2009

EHW007A0B Series Eighth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 7A Output Current

Thermal Considerations (continued)

AIRFLOW

Figure 13. T
Location for Open Frame Module.

Figure 14. T
Location for Module with Heatplate.

Heat Transfer via Convection

Increased airflow over the module enhances the heat
transfer via convection. Derating curves showing the
maximum output current that can be delivered by
each module versus local ambient temperature (T
for natural convection and up to 3m/s (600 ft./min)
forced airflow are shown in Figure 14.

Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board­Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.

8

7

(A)

O

6

5

4

3

OUTPUT CURRENT, I

2

Figure 14. Output Current Derating for the Open
Frame Module; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.

Temperature Measurement

ref

AIRFLOW

Temperature Measurement

ref

A)

3.0 m/s

(600 LFM)

2.0 m/s

(400 LFM)

1.0 m/s

(200 LFM)

0.5 m/s

(100 LFM)

NC

20 30 40 50 60 70 80 90

AMBIENT TEMEPERATURE, TA (oC)

8

7

(A)

O

6

5

4

OUTPUT CURRENT, I

3

20 30 40 50 60 70 80 90

AMBIENT TEMEPERATURE, TA (oC)

1.0 m/s

(200 LFM)

0.5 m/s

(100 LFM)

Figure 15. Output Curr ent Derating for the Modul e
with Heatplate; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.

8

7

(A)

O

6

5

4

OUTPUT CURRENT, I

3

20 30 40 50 60 70 80 90

AMBIENT TEMEPERATURE, TA (oC)

1.0 m/s

(200 LFM)

(100 LFM)

Figure 16. Output Curr ent Derating for the Modul e
with Heatplate and 0.25 in. heat sink; Airflow in
the Transverse Direction from Vout(+) to Vout(-);
Vin =48V.

8

7

(A)

O

6

5

4

OUTPUT CURRENT, I

3

20 30 40 50 60 70 80 90

AMBIENT TEMEPERATURE, TA (oC)

0.5 m/s

(100 LFM)

Figure 17. Output Curr ent Derating for the Modul e
with Heatplate and 0.5 in. heat sink; Airflow in the
Transverse Direction from Vout(+) to Vout(-); Vin
=48V.

0.5 m/s

NC

NC

1.0 m/s

(200 LFM)

NC

2.0 m/s

(400 LFM)

LINEAGE POWER 9

Data Sheet
October 2, 2009

EHW007A0B Series Eighth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 7A Output Current

Thermal Considerations (continued)

8

7

(A)

O

6

5

4

OUTPUT CURRENT, I

3

20 30 40 50 60 70 80 90

AMBIENT TEMEPERATURE, TA (oC)

0.5 m/s

(100 LFM)

NC

Figure 18. Output Current Derating for the Module
with Heatplate and 1.0 in. heat sink; Airflow in the
Transverse Direction from Vout(+) to Vout(-); Vin
=48V.

Surface Mount Information

Pick and Place

The EHW007A0B modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300
product information such as product code, serial
number and the location of manufacture.

Figure 17. Pick and Place Location.

Nozzle Recommendations

The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.

Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.

Tin Lead Soldering

The EHW007A0B power modules are lead free
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)

o

C. The label also carries

process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.

In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than

o

235

C. Typically, the eutectic solder melts at 183oC,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.

300

250

200

15 0

10 0

REFLOW TEMP (°C)

50

0

Peak Temp 235oC

Heat zone

oCs-1

max 4

So ak zone
30-240s

Preheat zo ne

oCs-1

max 4

REFLOW TIME (S)

T
205

lim

Co o ling
zo ne
1- 4

above

o

C

oCs-1

Figure 18. Reflow Profile for Tin/Lead (Sn/Pb)
process

240

235

230

225

220

215

210

MAX TEMP SOLDER (°C)

205

200

0 102030405060

Figure 19. Time Limit Curve Above 205oC for
Tin/Lead (Sn/Pb) process

LINEAGE POWER 10

Data Sheet
October 2, 2009

EHW007A0B Series Eighth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 7A Output Current

Surface Mount Information (continued)

Lead Free Soldering

The –Z version of the EHW007A0B modules are lead­free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.

Pb-free Reflow Profile

Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure 20.

300

Per J-STD-020 Rev. C

250

200

150

Heat ing Zone
1°C/Second

100

Reflow Temp (°C)

50

0

Figure 20. Recommended linear reflow profile
using Sn/Ag/Cu solder.

MSL Rating

The EHW007A0B modules have a MSL rating of 2.

Storage and Handling

The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when

Peak Temp 260°C

Cooling

* Min. Time Above 235°C
15 Seconds

*Time Above 217°C

60 Seconds

Reflow Time (Seconds)

Zone

≤ 30°C and 60% relative humidity

stored at the following conditions: < 40° C, < 90%
relative humidity.

Post Solder Cleaning and Drying
Considerations

Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and

drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleanin g

Application Note (AN04-001).

Through-Hole Lead-Free Soldering
Information

The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3
wave preheat process should be such that the
temperature of the power module board is kept below

°C. For Pb solder, the recommended pot

210
temperature is 260

°C max. Not all RoHS-compliant through-hole

270

°C, while the Pb-free solder pot is

products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.

°C/s is suggested. The

LINEAGE POWER 11

Data Sheet
October 2, 2009

EHW007A0B Series Eighth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 7A Output Current

EMC Considerations

The circuit and plots in Figure 21 shows a suggested configuration to meet the conducted emission limits of EN55022
Class B.

Level [dBµV]

80

70

60

50

40

30

20

10

0

150k 300k 500k 1M 2M 3M 4M5M 7M 10M 30M

x xMES CE0508091459_fin QP

MES CE0508091459_pre PK

x

Frequency [Hz]

x

x

x

x

x

Level [dBµV]

80

70

60

50

40

30

20

10

0

150k 300k 500k 1M 2M 3M 4M5M 7M 10M 30M

+ +MES CE0508091459_fin AV

MES CE0508091459_pre AV

+

Frequency [Hz]

+

+

+

+

+

Figure 21. EMC Considerations

For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).

LINEAGE POWER 12

Data Sheet
October 2, 2009

EHW007A0B Series Eighth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 7A Output Current

Mechanical Outline for Through-Hole Module

Dimensions are in millimeters and [inches].

Tolerances: x.x mm

x.xx mm

Top side label includes Lineage Power name, product designation and date code.

± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)

± 0.25 mm [x.xxx in ± 0.010 in.]

Top

View*

Side
View

Bottom

View

*For optional pin lengths, see Table 2, Device Coding Scheme and Options

Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)

LINEAGE POWER 13

Data Sheet
October 2, 2009

EHW007A0B Series Eighth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 7A Output Current

Mechanical Outline for Surface Mount Module (-S Option)

Dimensions are in millimeters and [inches].

Tolerances: x.x mm

x.xx mm

* Top side label includes Lineage Power name, product designation and date code.

± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)

± 0.25 mm [x.xxx in ± 0.010 in.]

Top

View*

Side

View

Bottom

View

Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)

LINEAGE POWER 14

8 Vo(+)

Data Sheet
October 2, 2009

EHW007A0B Series Eighth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 7A Output Current

Mechanical Outline for Through-Hole Module with Heat Plate (-H Option)

Dimensions are in millimeters and [inches].

Tolerances: x.x mm

x.xx mm

± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)

± 0.25 mm [x.xxx in ± 0.010 in.]

Top

View

Side
View

Bottom

View*

*For optional pin lengths, see Table 2, Device Coding Scheme and Options

* Bottom side label includes Lineage Power name, product designation and date code.

Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)

LINEAGE POWER 15

Data Sheet
October 2, 2009

Recommended Pad Layout

Dimensions are in millimeters and [inches].

Tolerances: x.x mm

x.xx mm

Pin Function

1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)

± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)

± 0.25 mm [x.xxx in ± 0.010 in.]

EHW007A0B Series Eighth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 7A Output Current

SMT Recommended Pad Layout (Component Side View)

Pin Function

1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)

NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH HOLE DIAMETER

FOR 0.62 DIA” PIN, USE 0.076” PLATED THROUGH HOLE DIAMETER

TH Recommended Pad Layout (Component Side View)

LINEAGE POWER 16

Data Sheet
October 2, 2009

EHW007A0B Series Eighth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 7A Output Current

Packaging Details

The surface mount versions of the EHW007A0B (suffix
–S) are supplied as standard in the plastic trays shown
in Figure 22.

Tray Specification

Material Antistatic coated PVC
Max surface resistivity 10
Color Clear
Capacity 12 power modules

12

Ω/sq

Each tray contains a total of 12 power modules. The
trays are self-stacking and each shipping box for the
EHW007A0B (suffix –S) surface mount module will
contain 4 full trays plus one empty hold down tray
giving a total number of 48 power modules.

Figure 22. Surface Mount Packaging Tray

LINEAGE POWER 17

Data Sheet

a

©

October 2, 2009

EHW007A0B Series Eighth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 7A Output Current

Ordering Information

Please contact your Lineage Power Sales Representative for pricing, availability and optional features.

Table 1. Device Codes

Product Codes Input Voltage

EHW007A0B41Z

EHW007A0B41-HZ

EHW007A0B41-SZ

48V (36-75Vdc) 12.0V 7A Negative Through hole

48V (36-75Vdc) 12.0V 7A Negative Through hole

48V (36-75Vdc) 12.0V 7A Negative Surface mount

Output

Voltage

Table 2. Device Coding Scheme and Options
Characteristic Character and Position Definition

Form Factor E E = Eighth Brick
Family Designator H
Input Voltage W W = Wide Input Voltage Range, 36V -75V
Output Current 007A0 007A0 = 007.0 Amps Rated Output Current

Ratings

Output Voltage B B = 12.0 Vout Nominal

Omit = No Pin Trim

Pin Length

6 6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.)

8 8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.)
Action following Omit = Latching Mode
Protective Shutdown 4 4 = Auto-restart following shutdown (Overcurrent/Overvoltage)

On/Off logic

Options

Customer Specific XY XY = Customer Specific Modified Code, Omit for Standard Code

Omit = Positive Logic

1 1 = Negative Logic

-

Omit = Standard open Frame Module
Mechanical Features

H H = Heat plate (not available with –S option)

S S = Surface mount connections

RoHS

Omit = RoHS 5/6, Lead Based Solder Used

Z Z = RoHS 6/6 Compliant, Lead free

Output

Current

On/Off

Logic

Connector

Type

Comcodes

CC109145100

CC109143194

CC109147402

Asia-Pacific Headquarters

Tel: + 65 6593 7211

World Wide Headquarters
Lineage Power Corporation

601 Shil oh Roa d, Plano, TX 75074, USA
[phone]
(Outsi de U.S.A.: [phone])

www.lineagepower.com
e-mail: [e-mail]

Linea ge Power res erves th e right to make change s to the prod uct(s) or i nformation c ontained herein without not ice. No l iability is assumed as a result o f their use or

pplication . No righ ts under any patent accompany the sal e of any s uch produc t(s) or informati on.

Linea ge Power D C-DC product s are prote cted unde r various pa tents. Infor mation on these pa tents is av ailable at ww w.line agepower .com/paten ts.

2009 Line age Power Corporation, (Plan o, Texas) All Inte rnation al Rights Reserved.

Europe, Middle-East and Africa Headquarters

Tel: + 49 898 780 672 80

India Headquarters

Tel: + 91 80 2841163 3

Document No: DS08-002 ver. 1.02

PDF name: ehw007_ds.pdf