Page 1
GE
Datasheet
EHHD036A0F HAMMERHEAD* Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 36A, 120W Output
Applications
Distributed Power Architectures
Wireless Networks
Enterprise Networks including Power over Ethernet (PoE)
Industrial Equipment
RoHS Compliant
Options
Negative Remote On/Off logic (preferred)
Over current/Over temperature/Over voltage protections
(Auto-restart) (preferred)
th
1/8
Brick Heat plate for 1/8th heatsinks
1/4th Brick heat plate with unthreaded inserts
Surface Mount version (-S)
Features
Compliant to RoHS II EU “Directive 2011/65/EU”
Compliant to REACH Directive (EC) No 1907/2006
Flat and high efficiency curve
Industry standard, DOSA compliant footprint
58.4mm x 22.8mm x 8.9mm
(2.30 in x 0.9 in x 0.35 in)
Ultra wide input voltage range: 18-75 V
Tightly regulated output
Remote sense
Output Voltage adjust: 90% to 110% of V
Constant switching frequency
Positive remote On/Off logic
Output overcurrent and overvoltage protection
Overtemperature protection
Wide operating temperature range (-40°C to 85°C)
Suitable for cold wall cooling using suitable Gap Pad applied
directly to top side of module
#
ANSI/UL
60950-1-2011 and CAN/CSA† C22.2 No. 60950-107, Second Edition + A1:2011 (MOD), dated March 19, 2011;
and DIN EN 60950-1 (VDE‡ 0805 Teil 1):2011-01; EN 609501:2006 + A11:2009 + A1:2010, DIN EN 60950-1/A12 (VDE
0805-1/A12):2011-08; EN 60950-1/A12:2011-02, IEC 609501(ed.2);am1:2009
CE mark meets 2006/95/EC directive
Meets the voltage and current requirements for ETSI 300-
132-2 and complies with and licensed for Basic insulation
rating per EN60950-1
2250 Vdc Isolation tested in compliance with IEEE 802.3
standards
**
ISO
9001 and ISO 14001 certified manufacturing facilities
dc
O,nom
§
¤
PoE
Description
The EHHD036A0F [HAMMERHEAD*] Series, eighth-brick, low-height power modules are isolated dc-dc converters which provide a
single, precisely regulated output voltage over an ultra-wide input voltage range of 18-75V
nominal output voltage rated for 36A
output current. The module incorporates GE’s vast heritage for reliability and quality, while
dc
also using the latest in technology, and component and process standardization to achieve highly competitive cost. The open
frame module construction, available in both surface-mount and through-hole packaging, enable designers to develop cost and
space efficient solutions. The module achieves typical full load efficiency greater than 90% at V
features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and overtemperature
protection. An optional heat plate allows for external standard, eighth-brick or quarter-brickheat sink attachment to achieve
higher output current in high temperature applications.
*
Trademark of General Electric Corporation.
#
UL is a registered trademark of Underwriters Laboratories, Inc.
†
CSA is a registered trademark of Canadian Standards Association.
‡
VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
§
This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the International Organization of Standards
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Page 1
. The EHHD036A0F provides 3.3Vdc
dc
=24Vdc and VIN=48Vdc. Standard
IN
Page 2
GE
Datasheet
EHHD036A0F Series: DC-DC Converter Power Module
18 to 75Vdc Input; 3.3Vdc, 36A, 120W Output
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings
only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations
sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage
Continuous All V
Transient, operational (≤100 ms) All V
Operating Ambient Temperature All T
Maximum Heat Plate Operating Temperature -18H, H T
(see Thermal Considerations section)
Storage Temperature All T
Altitude* All
I/O Isolation voltage (100% factory Hi-Pot tested) All
* For higher altitude applications, contact your GE Sales Representative for alternative conditions of use.
IN
IN,trans
A
C
stg
⎯ ⎯
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage All VIN 18 24/48 75 Vdc
Maximum Input Current
(VIN= V
Input No Load Current
VIN = 24Vdc, (IO = 0, module enabled)
VIN = 48V, (IO = 0, module enabled)
Input Stand-by Current All
(VIN = 24 to 48V, module disabled)
Inrush Transient All I2t 0.5 A2s
IN, min
to V
IN, max
, VO= V
O, set
, IO=I
O, max
)
All I
All I
IN,No load
I
IN,stand-by
IN
5 11 mA
-0.3 80 Vdc
-0.3 100 Vdc
-40 85 °C
-40 105 °C
-55 125 °C
4000 m
2250 Vdc
7.3 7.8 Adc
120
80
mA
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 12μH source impedance; V
See Test configuration section)
Input Ripple Rejection (120Hz) All 60 dB
IN, min
to V
IN, max, IO
= I
Omax
;
All 30 mA
p-p
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part
of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve
maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a
maximum rating of 15 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy
and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet
for further information.
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Page 2
Page 3
GE
Datasheet
EHHD036A0F Series: DC-DC Converter Power Module
18 to 75Vdc Input; 3.3Vdc, 36A, 120W Output
Electrical Specifications (continued)
Unless otherwise indicated, specifications apply at VIN = 48Vdc, resistive load, and TA = 25°C conditions.
Parameter Device Symbol Min Typ Max Unit
Nominal Output Voltage Set-point
VIN= 24V to 48V IO=I
O, max
, TA=25°C)
All V
O, set
Output Voltage
(Over all operating input voltage, resistive load, and temperature
All V
O
conditions until end of life)
Adjustment Range (*Vin > 20V) All V
Selected by external resistor
O, adj
Output Regulation
Line (VIN=V
Load (IO=I
Temperature (T
Output Ripple and Noise on nominal output
Measured with 10uF Tantalum||1uF ceramic
(VIN=24 to 48, IO=80% I
IN, min
O, min
to V
to I
ref=TA, min
) All
O, max
IN, max
)
to T
) All
A, max
All
, TA=25)
O, max
RMS (5Hz to 20MHz bandwidth) All
Peak-to-Peak (5Hz to 20MHz bandwidth) All
External Capacitance All C
Output Current All I
Output Current Limit Inception (Hiccup Mode )
(VO= 90% of V
Output Short-Circuit Current
(VO≤250mV) ( Hiccup Mode )
) 3.3
O, set
All I
O, max
O
I
O, lim
O, s/c
Efficiency
VIN=24V, TA=25°C, IO=36A, VO = 3.3V All η 92 %
VIN=48V, TA=25°C, IO=36A, VO = 3.3V All η 91.5 %
Switching Frequency All f
sw
Dynamic Load Response
(dIo/dt=0.1A/μs; VIN = 24V or 48V; TA=25°C; CO>100μF)
Load Change from Io= 50% to 75% or 25% to 50% of I
o,max
Peak Deviation All V
Settling Time (Vo<10% peak deviation)
All t
pk
s
3.25 3.3 3.36 V
-3.0
⎯
+3.0 % V
-10 +10* % V
⎯ ⎯
⎯ ⎯
⎯ ⎯
⎯
⎯
0
10 mV
50 mV
⎯
±0.2 % V
±0.2 % V
±1.5
10,000 μF
% V
dc
O, set
O, set
O, set
O, set
O, set
rms
pk-pk
0 36 Adc
39.6 43 Adc
1.2 A
rms
380 kHz
⎯
⎯
3
800
⎯
⎯
% V
μs
O, set
Isolation Specifications
Parameter Device Symbol Min Typ Max Unit
Isolation Capacitance All C
Isolation Resistance All R
I/O Isolation Voltage (100% factory Hi-pot tested) All All
iso
iso
⎯
10
⎯ ⎯
1000
⎯ ⎯
⎯
pF
MΩ
2250 Vdc
General Specifications
Parameter Device Symbol Min Typ Max Unit
Calculated Reliability based upon Telcordia SR-332 Issue 2: Method I
Case 3 (I
=80%I
O
, TA=40°C, airflow = 200 lfm, 90% confidence)
O, max
All FIT 105.7
All MTBF 9,462,810 Hours
Weight (Open Frame) All 23 (0.8) g (oz.)
Weight (with Heatplate) All 37 (1.3) g (oz.)
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Page 3
9
10
/Hour
s
Page 4
GE
Datasheet
EHHD036A0F Series: DC-DC Converter Power Module
18 to 75Vdc Input; 3.3Vdc, 36A, 120W Output
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See
Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VIN=V
Signal referenced to V
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Turn-On Delay and Rise Times
(IO=I
Case 1: Input power is applied for at least 1 second,
Case 2: On/Off input is set to Logic Low (Module
ON) and then input power is applied (T
instant at which V
Output voltage Rise time (time for Vo to rise from 10%
of V
Output voltage overshoot – Startup
IO= I
Remote Sense Range All V
Output Overvoltage Protection
Overtemperature Protection – Hiccup Auto Restart
Input Undervoltage Lockout All V
1
– Module complies with min. 100µF external output cap
to V
IN, min
Logic Low - Remote On/Off Current All I
Logic Low - On/Off Voltage All V
Logic High Voltage – (Typ = Open Collector) All V
Logic High maximum allowable leakage current All I
O, max , VIN=VIN, nom, TA
and then the On/Off input is set from OFF to ON
= on/off pin transition until VO = 10% of V
(T
delay
to 90% of V
o,set
; VIN=V
O, max
Turn-on Threshold
Turn-off Threshold
; open collector or equivalent,
IN, max
terminal)
IN-
on/off
on/off
on/off
on/off
⎯
-0.7
2.5 5 6.7 Vdc
⎯ ⎯
0.15 mA
⎯
0.6 Vdc
20 μA
= 25oC)
IN, min
IN
o, set
to V
)
O, set
from
= V
IN, min
until Vo=10% of V
delay
O,set
)
)
, TA = 25 oC
IN, max
1
All T
All T
All
All V
Open
frame
Heat
Plate
All T
— 35 — msec
delay
— 35 - msec
delay
rise
SENSE
O, limit
T
ref
T
ref
UVLO
— 10 msec
— 3 % V
10 % V
4.0
⎯
5.5 Vdc
135 OC
120 OC
17.5 Vdc
15.5 Vdc
O, set
O, set
Hysteresis 2 Vdc
Input Overvoltage Lockout All V
Turn-on Threshold 79
Turn-off Threshold
Hysteresis 2
OVLO
Vdc
Vdc
⎯
⎯
81 Vdc
⎯
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Page 4
Page 5
V
V
GE
Datasheet
EHHD036A0F Series: DC-DC Converter Power Module
18 to 75Vdc Input; 3.3Vdc, 36A, 120W Output
Characteristic Curves
The following figures provide typical characteristics for the EHHD036A0F (3.3V, 36A) at 25 OC. The figures are identical for either
positive or negative remote On/Off logic.
EFFICIENCY, η (%)
OUTPUT CURRENT, IO (A) TIME, t (200µs/div)
Figure 1. Converter Efficiency versus Output Current.
18Vin
(V) (100mV/div)
O
Io(A) (10A/div) V
OUTPUT CURRENT OUTPUT VOLTAGE
Figure 4. Transient Response to 0.1A/µS Dynamic Load Change
from 50% to 75% to 50% of full load, Vin=48V
24
in
48Vin
(V) (50mV/div)
O
V
OUTPUT VOLTAGE
in
75
TIME, t (2μs/div)
o
= I
o,max
Figure 2. Typical output ripple and noise (I
(V) (100mV/div)
O
Io(A) (10A/div) V
OUTPUT CURRENT OUTPUT VOLTAGE
TIME, t (200µs/div) TIME, t (10ms/div)
). Figure 5. Typical Start-up Using Remote On/Off, negative logic
Figure 3. Transient Response to 0.1A/µS Dynamic Load
Change from 50% to 75% to 50% of full load, Vin=24V.
(V) (2V/div)
On/Off
(V) (1V/div) V
O
OUTPUT VOLTAGE On/Off VOLTAGE
V
version shown (V
IN
= 48V, Io = I
TIME, t (10ms/div)
o,max
).
(V) (20V/div)
IN
(V) (1V/div) V
O
OUTPUT VOLTAGE INPUT VOLTAGE
V
Figure 6. Typical Start-up Using Input Voltage (VIN = 48V, Io=
o,max
).
I
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Page 5
Page 6
GE
EHHD036A0F Series: DC-DC Converter Power Module
18 to 75Vdc Input; 3.3Vdc, 36A, 120W Output
Test Configurations
Vout+
Vout-
33-10 0μF
V
CURRENT PROBE
RESISTIVE
LOA D
R
contact Rdistribution
O
R
contact Rdistribution
x 100 %
Vin +
Vin-
R
LOAD
TO OSCILLOSCOPE
L
TEST
12μH
CS 220μF
BAT TERY
NOTE: M easure inpu t reflected ri pple current wi th a simula ted
E.S .R.< 0.1 Ω
@ 20 °C 10 0kHz
source inductance (L
possi ble batt ery impedance . Measure cur rent as s hown
abov e.
) of 12μH. Capacitor CS offs ets
TEST
Figure 7. Input Reflected Ripple Current Test Setup.
COPPER STRIP
V O (+)
SCOP E
V O ( – )
NOTE: A ll volta ge mea surements to be tak en at the module
1uF
10uF
GROUND PLANE
termin als, as shown ab ove. If so ckets are used then
Kelvi n conn ections are required at th e module te rminals
to av oid me asureme nt errors due to sock et conta ct
resistance.
Figure 8. Output Ripple and Noise Test Setup.
R
R
contact
distribution
R
R
contact
distribution
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Vin+
V
IN
Vin-
Figure 9. Output Voltage and Efficiency Test Setup.
V
. I
O
Efficiency
=
η
VIN. I
O
IN
Design Considerations
Input Filtering
The power module should be connected to a low
ac-impedance source. Highly inductive source impedance
can affect the stability of the power module. For the test
configuration in Figure 7 a 100μF electrolytic capacitor
(ESR<0.7Ω at 100kHz), mounted close to the power module
helps ensure the stability of the unit. Consult the factory for
further application guidelines.
Safety Considerations
For safety-agency approval of the system in which the
power module is used, the power module must be installed
in compliance with the spacing and separation
requirements of the end-use safety agency standard, i.e.
UL60950-1, CSA C22.2 No.60950-1, and VDE08051(IEC60950-1).
If the input source is non-SELV (ELV or a hazardous voltage
greater than 60 Vdc and less than or equal to 75Vdc), for the
module’s output to be considered as meeting the
requirements for safety extra-low voltage (SELV), all of the
following must be true:
The input source is to be provided with reinforced
insulation from any other hazardous voltages, including
the ac mains.
One V
The input pins of the module are not operator
Another SELV reliability test is conducted on the whole
Note: Do not ground either of the input pins of the module
The power module has extra-low voltage (ELV) outputs when
all inputs are ELV.
All flammable materials used in the manufacturing of these
modules are rated 94V-0, or tested to the UL60950 A.2 for
reduced thickness.
For input voltages exceeding –60 Vdc but less than or equal
to –75 Vdc, these converters have been evaluated to the
applicable requirements of BASIC INSULATION between
secondary DC MAINS DISTRIBUTION input (classified as
TNV-2 in Europe) and unearthed SELV outputs.
The input to these units is to be provided with a maximum
15 A fast-acting fuse in the ungrounded lead.
pin and one V
IN
both the input and output pins are to be kept floating.
accessible.
system (combination of supply source and subject
module), as required by the safety agencies, to verify
that under a single fault, hazardous voltages do not
appear at the module’s output.
without grounding one of the output pins. This may
allow a non-SELV voltage to appear between the
output pins and ground.
Datasheet
pin are to be grounded, or
OUT
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Page 6
Page 7
E
GE
EHHD036A0F Series: DC-DC Converter Power Module
18 to 75Vdc Input; 3.3Vdc, 36A, 120W Output
Feature Descriptions
Remote On/Off
Two remote on/off options are available. Positive logic turns
the module on during a logic high voltage on the ON/OFF
pin, and off during a logic low. Negative logic remote On/Off,
device code suffix “1”, turns the module off during a logic
high and on during a logic low.
Vin+
I
on/off
V
on/off
ON/OFF
Vin-
Figure 10. Remote On/Off Implementation.
To turn the power module on and off, the user must supply a
switch (open collector or equivalent) to control the voltage
) between the ON/OFF terminal and the VIN(-) terminal
(V
on/off
(see Figure 10). Logic low is 0V ≤ V
during a logic low is 0.15mA; the switch should
I
on/off
on/off
maintain a logic low level whilst sinking this current.
During a logic high, the typical maximum V
by the module is 5V, and the maximum allowable leakage
current at V
= 5V is 1μA.
on/off
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to V
Remote Sense
Remote sense minimizes the effects of distribution losses by
regulating the voltage at the remote-sense connections (See
Figure 11). The voltage between the remote-sense pins and
the output terminals must not exceed the output voltage
sense range given in the Feature Specifications table:
(+) – VO(–)] – [SENSE(+) – SENSE(–)] ≤ 0.5 V
[V
O
Although the output voltage can be increased by both the
remote sense and by the trim, the maximum increase for
the output voltage is not the sum of both. The maximum
increase is the larger of either the remote sense or the trim.
Vout+
TRIM
Vout-
≤ 0.6V. The maximum
generated
on/off
(-).
IN
The amount of power delivered by the module is defined as
the voltage at the output terminals multiplied by the output
current. When using remote sense and trim, the output
voltage of the module can be increased, which at the same
output current would increase the power output of the
module. Care should be taken to ensure that the maximum
output power of the module remains at or below the
maximum rated power (Maximum rated power = Vo,set x
Io,max).
SUPPLY
I
I
CONTACT
RESISTANCE
Figure 11. Circuit Configuration for remote sense .
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit,
the module operation is disabled. The module will only
begin to operate once the input voltage is raised above the
undervoltage lockout turn-on threshold, V
Once operating, the module will continue to operate until
the input voltage is taken below the undervoltage turn-off
threshold, V
UV/OFF
.
Overtemperature Protection
To provide protection under certain fault conditions, the unit
is equipped with a thermal shutdown circuit. The unit will
shutdown if the thermal reference point, Tref, exceeds 122°
O
and 123
C (Figure 13, typical or 105 OC (Figure 14, typical),,
but the thermal shutdown is not intended as a guarantee
that the unit will survive temperatures beyond its rating.
The module will automatically restart upon cool-down to a
safe temperature.
Output Overvoltage Protection
The output over voltage protection scheme of the modules
has an independent over voltage loop to prevent single
point of failure. This protection feature latches in the event
of over voltage across the output. Cycling the on/off pin or
input voltage resets the latching protection feature. If the
auto-restart option (4) is ordered, the module will
automatically restart upon an internally programmed time
elapsing.
Overcurrent Protection
To provide protection in a fault (output overload) condition,
the unit is equipped with internal
current-limiting circuitry and can endure current
limiting continuously. At the point of current-limit
inception, the unit enters hiccup mode. If the unit is
not configured with auto–restart, then it will latch off
following the over current condition. The module can be
restarted by cycling the dc input power for at least one
second or by toggling the remote on/off signal for at least
one second.
Datasheet
SENSE(+)
SENSE(–)
V
I(+)
VO(+)
V
I(-)
V
IO
O(–)
DISTRIBUTION LOSS
LOAD
CONTACT AND
.
UV/ON
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Page 7
Page 8
GE
EHHD036A0F Series: DC-DC Converter Power Module
18 to 75Vdc Input; 3.3Vdc, 36A, 120W Output
Feature Descriptions (continued)
If the unit is configured with the auto-restart option (4), it will
remain in the hiccup mode as long as the overcurrent
condition exists; it operates normally, once the output
current is brought back into its specified range. The average
output current during hiccup is 10% I
Output Voltage Programming
Trimming allows the output voltage set point to be
increased or decreased from the default value; this is
accomplished by connecting an external resistor between
the TRIM pin and either the V
VIN(+)
ON/OFF
VIN(-)
VO(+)
VOTRIM
VO(-)
Figure 12. Circuit Configuration to Trim Output Voltage.
Connecting an external resistor (R
pin and the V
(-) (or Sense(-)) pin decreases the output
O
voltage set point. To maintain set point accuracy, the trim
resistor tolerance should be ±1.0%.
The following equation determines the required external
resistor value to obtain a percentage output voltage change
of ∆%
R
−
downtrim
3.3
Where
% ×
=Δ
For example, to trim-down the output voltage of the module
by 6% to 3.102V, Rtrim-down is calculated as follows:
R
−
downtrim
R
Connecting an external resistor (R
pin and the V
voltage set point. The following equation determines the
required external resistor value to obtain a percentage
output voltage change of ∆%:
R
Where
(+) (or Sense (+)) pin increases the output
O
=
−
uptrim
V
desired
% ×
=Δ
(+) pin or the VO(-) pin.
O
511
=
Δ
%
−
VV
desired
3.3
V
511
−=
6
downtrim
Δ+××
Δ×
%225.1
3.3
−
100
3.3
.
O, max
R
trim-up
R
trim-down
) between the TRIM
trim-down
−
22.10
ΚΩ
22.10
100
6% =Δ
ΚΩ
ΚΩ=−9.74
) between the TRIM
trim-up
511
%)100(3.311.5
−
−
Δ
%
LOAD
ΚΩ
22.10
For example, to trim-up the output voltage of the module by
4% to 3.432V, R
=
R
−
uptrim
is calculated is as follows:
trim-up
R
The voltage between the V
exceed the minimum output overvoltage protection value
shown in the Feature Specifications table. This limit includes
any increase in voltage due to remote-sense compensation
and output voltage set-point adjustment trim.
Although the output voltage can be increased by both the
remote sense and by the trim, the maximum increase for
the output voltage is not the sum of both. The maximum
increase is the larger of either the remote sense or the trim.
The amount of power delivered by the module is defined as
the voltage at the output terminals multiplied by the output
current. When using remote sense and trim, the output
voltage of the module can be increased, which at the same
output current would increase the power output of the
module. Care should be taken to ensure that the maximum
output power of the module remains at or below the
maximum rated power (Maximum rated power = V
).
I
O,max
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of the
module will result in an increase in reliability.
The thermal data presented here is based on physical
measurements taken in a wind tunnel, using automated
thermo-couple instrumentation to monitor key component
temperatures: FETs, diodes, control ICs, magnetic cores,
ceramic capacitors, opto-isolators, and module pwb
conductors, while controlling the ambient airflow rate and
temperature. For a given airflow and ambient temperature,
the module output power is increased, until one (or more) of
the components reaches its maximum derated operating
temperature, as defined in IPC-9592. This procedure is then
repeated for a different airflow or ambient temperature until
a family of module output derating curves is obtained.
Datasheet
4% =Δ
+××
511
)4100(3.311.5
×
4225.1
uptrim
(+) and VO(–) terminals must not
O
4
ΚΩ=−9.219
−−
ΚΩ
22.10
O,set
x
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Page 8
Page 9
GE
EHHD036A0F Series: DC-DC Converter Power Module
18 to 75Vdc Input; 3.3Vdc, 36A, 120W Output
Thermal Considerations (continued)
The thermal reference points, T
specifications for open frame modules are shown in Figure
13. For reliable operationthese temperatures should not
exceed 122° and 123
Figure 13. For reliable operation and
should not exceed
T
ref
Figure 13. T
ref
Open Frame Module.
O
C respectively.
122°C and 123°C .
1
Temperature Measurement Locations for
The thermal reference point, T
for modules with heatplate is shown in Figure 14. For
reliable operation this temperature should not exceed 105
O
C.
and T
ref1
T
ref
1
T
ref
2
used in the specifications
ref,
T
ref
re21,
2
used in the
AIRFLOW
transfer via convection. Derating curves showing the
maximum output current that can be delivered by
each module versus local ambient temperature (T
for natural convection and up to 3m/s (600 ft./min) forced
airflow are shown in Figures 15 - 20.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-Mounted
Power Modules” for a detailed discussion of thermal
aspects including maximum device temperatures.
36
32
28
(A)
O
OUTPUT CURRENT, I
NC
100LFM
24
20
16
12
8
4
0
30 40 50 60 70 80 90
(0.5m/s)
AMBIENT TEMEPERATURE, TA (oC)
Figure 15. Output Current Derating for the Open Frame
Module; Airflow in the Transverse Direction from V
(+); VIN =48V, VO=3.3V.
V
out
36
32
NC
28
(A)
O
24
20
16
12
8
OUTPUT CURRENT, I
4
0
30 40 50 60 70 80 90
Figure 16. Output Current Derating for the Module with
100LFM
(0.5m/s)
AMBIENT TEMEPERATURE, TA (oC)
Heatplate; Airflow in the Transverse Direction from V
to V
(+);VIN =48V, VO=3.3V.
out
Datasheet
200LFM
(1.0m/s)
400LFM
(2.0m/s)
200LFM
(1.0m/s)
400LFM
(2.0m/s)
A
)
(-) to
out
(-)
out
Figure 14. T
Temperature Measurement Location for
ref
Module with Heatplate.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Page 9
Page 10
GE
EHHD036A0F Series: DC-DC Converter Power Module
18 to 75Vdc Input; 3.3Vdc, 36A, 120W Output
Thermal Considerations (continued)
36
32
28
(A)
O
OUTPUT CURRENT, I
Figure 17. Output Current Derating for the Module with
-18H Heatplate; Airflow in the Transverse Direction from
(-) to V
V
out
36
32
(A)
28
O
24
20
16
12
OUTPUT CURRENT, I
Figure 18. Output Current Derating for the Open Frame
Module; Airflow in the Transverse Direction from V
(+); VIN =24V, VO=3.3V.
V
out
(A)
O
OUTPUT CURRENT, I
Figure 19. Output Current Derating for the Module with
Heatplate; Airflow in the Transverse Direction from V
to V
out
NC
24
20
16
12
8
4
0
30 40 50 60 70 80 90
100LFM
(0.5m/s)
200LFM
(1.0m/s)
400LFM
(2.0m/s)
AMBIENT TEMEPERATURE, TA (oC)
(+);VIN =48V, VO=3.3V
out
NC
(0.5m/s)
8
4
0
30 40 50 60 70 80 90
AMBIENT TEMEPERATURE, T
36
32
28
24
20
16
12
NC
8
4
0
30 40 50 60 70 80 90
100LFM
100LFM
(0.5m/s)
200LFM
(1.0m/s)
400LFM
(2.0m/s)
200LFM
(1.0m/s)
400LFM
(2.0m/s)
(oC)
A
AMBIENT TEMEPERATURE, TA (oC)
(+);VIN =24V, VO=3.3V.
out
(-) to
(-)
out
36
32
28
(A)
O
24
20
16
12
8
OUTPUT CURRENT, I
4
0
NC
30 40 50 60 70 80 90
AMBIENT TEMEPERATURE, TA (oC)
Figure 20. Output Current Derating for the Module with
-18 Heatplate; Airflow in the Transverse Direction from
V
out
(-) to V
(+);VIN =24V, VO=3.3V.
out
Heat Transfer via Conduction
The module can also be used in a sealed environment with
cooling via conduction from the
module’s top surface through a gap pad material to a
cold wall, as shown in Figure 21. This capability is achieved
by insuring the top side component skyline profile achieves
no more than 1mm height difference between the tallest
and the shortest power train part that benefits from contact
with the gap pad material. The output current derating
versus cold wall temperature, when using a gap pad such as
Bergquist GP2500S20, is shown in Figure 22.
Figure 21. Cold Wall Mounting
36
32
28
(A)
O
24
20
16
12
8
OUTPUT CURRENT, I
4
0
20 30 40 50 60 70 80 90
COLDPLATE TEMEPERATURE, TC (oC)
Figure 22. Derated Output Current versus Cold Wall
Temperature with local ambient temperature around
module at 85C; V
=24V or 48V.
IN
Datasheet
100LFM
(0.5m/s)
200LFM
(1.0m/s)
400LFM
(2.0m/s)
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Page 10
Page 11
GE
EHHD036A0F Series: DC-DC Converter Power Module
18 to 75Vdc Input; 3.3Vdc, 36A, 120W Output
Through-Hole Soldering Information
Lead-Free Soldering
The EHHD036A0F xx RoHS-compliant through-hole
products use SAC (Sn/Ag/Cu) Pb-free solder and RoHScompliant components. They are designed to be processed
through single or dual wave soldering machines. The pins
have a RoHS-compliant finish that is compatible with both
Pb and Pb-free wave soldering processes. A maximum
preheat rate of 3°C/s is suggested. The wave preheat
process should be such that the temperature of the power
module board is kept below 210°C. For Pb solder, the
recommended pot temperature is 260°C, while the Pb-free
solder pot is 270°C max.
Paste-in-Hole Soldering
The EHHD036A0F xx module is compatible with reflow
paste-in-hole soldering processes shown in Figures 24-26.
Since the EHHD036A0F xxZ module is not packaged per JSTD-033 Rev.A, the module must be baked prior to the
paste-in-hole reflow process. EHHD036A0F xx-HZ modules
are not compatible with paste-in-hole reflow soldering.
Please contact your GE Sales Representative for further
information.
Surface Mount Information
MSL Rating
The EHHD036A0F -SZ module has a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages
is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping
and Use of Moisture/Reflow Sensitive Surface Mount
Devices). Moisture barrier bags (MBB) with desiccant are
provided for the EHHD036A0Axx-SZ modules. These sealed
packages should not be broken until time of use. Once the
original package is broken, the floor life of the product at
conditions of ≤ 30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The shelf life
for dry packed SMT packages is a minimum of 12 months
from the bag seal date, when stored at the following
conditions: < 40° C, < 90% relative humidity
Pick and Place
The EHHD036A0F modules use an open frame construction
and are designed for a fully automated assembly process.
The modules are fitted with a label designed to provide a
large surface area for pick and place operations. The label
meets all the requirements for surface mount processing, as
well as safety standards, and is able to withstand reflow
temperatures of up to 300
information such as product code, serial number and the
location of manufacture.
o
C. The label also carries product
.
Figure 23. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by using
open frame construction. Even so, these modules have a
relatively large mass when compared to conventional SMT
components. Variables such as nozzle size, tip style,
vacuum pressure and placement speed should be
considered to optimize this process. The minimum
recommended nozzle diameter for reliable operation is
6mm. The maximum nozzle outer diameter, which will safely
fit within the allowable component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be used
within the space available.
Tin Lead Soldering
The EHHD036A0F power modules are lead free modules
and can be soldered either in a lead-free solder process or
in a conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets in
order to customize the solder reflow profile for each
application board assembly. The following instructions must
be observed when soldering these units. Failure to observe
these instructions may result in the failure of or cause
damage to the modules, and can adversely affect long-term
reliability.
In a conventional Tin/Lead (Sn/Pb) solder process peak
reflow temperatures are limited to less than 235oC.
Typically, the eutectic solder melts at 183oC, wets the land,
and subsequently wicks the device connection. Sufficient
time must be allowed to fuse the plating on the connection
to ensure a reliablesolder joint. There are several types of
SMT reflow technologies currently used in the industry.
These surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For reliable
soldering the solder reflow profile should be established by
accurately measuring the modules CP connector
temperatures.
Lead Free Soldering
The –Z version of the EHHD036A0F modules are lead-free
(Pb-free) and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb soldering
process. Failure to observe the instructions below may
result in the failure of or cause damage to the modules and
can adversely affect long-term reliability.
Datasheet
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Page 11
Page 12
GE
EHHD036A0F Series: DC-DC Converter Power Module
18 to 75Vdc Input; 3.3Vdc, 36A, 120W Output
300
250
200
15 0
10 0
REFLOW TEMP (°C)
50
0
Peak Temp 235oC
Heat zone
oCs-1
max 4
Soak zone
30-240s
Preheat zone
oCs-1
max 4
REFLOW TIME (S)
T
lim
205
Cooling
zo ne
1- 4
above
o
C
oCs-1
Figure 24. Reflow Profile for Tin/Lead (Sn/Pb) process.
240
235
230
225
220
215
210
MAX TEMP SOLDER (°C)
205
200
0 10 2030405060
Figure 25. Time Limit Curve Above 205oC for Tin/Lead
(Sn/Pb) process
Pb-free Reflow Profile
Power Systems will comply with J-STD-015 Rev. D
(Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder
profiles and MSL classification procedures. This standard
provides a recommended forced-air-convection reflow
profile based on the volume and thickness of the package
(table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu
(SAC). The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure 26.
300
Per J-STD-0 20 Rev. D
250
Reflow Temp (°C)
200
150
Heating Zone
1°C/Second
100
50
0
Peak Temp 260°C
Figure 26. Recommended linear reflow profile using
Sn/Ag/Cu solder.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures, refer
to GE Board
Mounted Power Modules: Soldering and Cleaning Application
Note (AN04-001).
Datasheet
* Min. Time Above 235°C
15 Seconds
*Time Above 2 17°C
60 Seconds
Reflow Time (Seconds)
Cooling
Zone
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Page 12
Page 13
GE
Datasheet
EHHD036A0F Series: DC-DC Converter Power Module
18 to 75Vdc Input; 3.3Vdc, 36A, 120W Output
EMC Considerations
The circuit and plots in Figure 27 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B.
FLT012A0
FILTER
Figure 27. EMC Considerations
For further information on designing for EMC compliance, please refer to the FLT0012A0 data sheet.
EHHD036
VIN = 48V, Io = Io,max, L Line VIN = 48V, Io = Io,max, N Line
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Page 13
Page 14
GE
EHHD036A0F Series: DC-DC Converter Power Module
18 to 75Vdc Input; 3.3Vdc, 36A, 120W Output
Mechanical Outline for Through-Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
*Top side label includes GE name, product designation and date code.
Top
View
Datasheet
Side
View
Bottom
View*
*For optional pin lengths, see Table 2, Device Coding Scheme and Options
VI-
SENSE-
ON/OFF
VI+
TRIM
SENSE+
VO-
VO+
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Page 14
Page 15
GE
EHHD036A0F Series: DC-DC Converter Power Module
18 to 75Vdc Input; 3.3Vdc, 36A, 120W Output
Mechanical Outline for Surface Mount Module (-S Option)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
* Top side label includes GE name, product designation and date code.
Top
View
Side
View
Datasheet
Bottom
View*
VI-
ON/OFF
VI+
VO-
SENSE-
TRIM
SENSE+
VO+
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Page 15
Page 16
GE
EHHD036A0F Series: DC-DC Converter Power Module
18 to 75Vdc Input; 3.3Vdc, 36A, 120W Output
Mechanical Outline for Through-Hole Module with Heat Plate (-H Option)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
Top
View
Side
View
Datasheet
Bottom
View*
**Side
View
*For optional pin lengths, see Table 2, Device Coding Scheme and Options
VI-
ON/OFF
VI+
*Bottom side label includes product designation and date code.
**Side label contains product designation and date code.
VO-
SENSE-
TRIM
SENSE+
VO+
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Page 16
Page 17
GE
Datasheet
EHHD036A0F Series: DC-DC Converter Power Module
18 to 75Vdc Input; 3.3Vdc, 36A, 120W Output
Mechanical Outline for Through-Hole Module with ¼ Brick Heat Plate (-18H Option)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
Top
View
Side
View
Bottom
View*
**Side
View
*For optional pin lengths, see Table 2, Device Coding Scheme and Options
VI-
ON/OFF
VI+
**Side label contains product designation and date code.
VO-
SENSE-
TRIM
SENSE+
VO+
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Page 17
Page 18
GE
EHHD036A0F Series: DC-DC Converter Power Module
18 to 75Vdc Input; 3.3Vdc, 36A, 120W Output
Recommended Pad Layout
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)
22.8
[.90]
7.62
[.300]
5.4[.22]
3.8
[.15]
58.4[2.30]
47.2[1.86]
39.0[1.54]
26.1[1.03]
17.9[.70]
1
2
11.7
3
[.46]
3.8[.15]
SMT Recommend Pa d Layout (Component Side View)
KEEP
OUT
AREAS
50.80[2.000]
Datasheet
8
7
6
5
4
3.81
[.150]
SMT Recommended Pad Layout (Component Side View)
Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)
NOTES:
FOR 0.030” X 0.025”
RECTANGULAR PIN, USE
0.050” PLATED THROUGH
HOLE DIAMETER
FOR 0.62 DIA” PIN, USE
0.076” PLATED THROUGH
HOLE DIAMETER
TH Recommended Pad Layout (Component Side View)
22.8
[.90]
7.62
[.300]
5.4[.22]
3.8
[.15]
58.4[2.30]
47.2[1.86]
39.0[1.54]
26.1[1.03]
17.9[.70]
1
2
11.7
[.46]
3.8[.15]
TH Recommend Pad Layout (Component Side View)
KEEP
OUT
AREAS
50.80[2.000]
8
7
6
5
4
3.81
[.150]
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Page 18
Page 19
GE
EHHD036A0F Series: DC-DC Converter Power Module
18 to 75Vdc Input; 3.3Vdc, 36A, 120W Output
Packaging Details
The surface mount versions of the EHHD036A0F (suffix –S)
are supplied as standard in the plastic trays shown in Figure
28.
Tray Specification
Material Antistatic coated PVC
Max surface resistivity 10
Color Clear
Capacity 12 power modules
Min order quantity 48 pcs (1 box of 4 full trays + 1
12
Ω/sq
empty top tray)
Each tray contains a total of 12 power modules. The trays are
self-stacking and each shipping box for the EHHD036A0F
(suffix –S) surface mount module will contain 4 full trays plus
one empty hold down tray giving a total number of 48 power
modules.
Datasheet
Figure 28. Surface Mount Packaging Tray
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Page 19
Page 20
GE
Datasheet
EHHD036A0F Series: DC-DC Converter Power Module
18 to 75Vdc Input; 3.3Vdc, 36A, 120W Output
Ordering Information
Please contact your GE Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Product Codes Input Voltage
Output
Voltage
EHHD036A0F 41Z 24/48V (18-75Vdc) 3.3V 36A Negative Through hole 150029666
EHHD036A0F 41-HZ 24/48V (18-75Vdc) 3.3V 36A Negative Through hole 150029824
EHHD036A0F 41-18HZ 24/48V (18-75Vdc) 3.3V 36A Negative Through hole 150029826
EHHD036A0F 41-SZ 24/48V (18-75Vdc) 3.3V 36A Negative Surface mount 150029825
Table 2. Device Coding Scheme and Options
Characteristic Def inition
Form Factor E
Family Designator HH
Input Voltage D
RatingsOptions
Output Current 036A0
Output Voltage F
Pin Length
Action following
Protective Shutdown
On/Off Logic
Customer Specific XY
Mechanical Features
RoHS
Character and Position
6
8
4
1
Output
Current
= 1 /8th Brick
E
HH
= UltraWide Range, 18V-75V
D
036A0
=3.3V Nominal
F
Omit
= Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.)
6
= Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.)
8
= Auto-re start following shutdown (Overcurrent/ Overvoltage)
4
Must be ordered
Omit
= Negative Logic
1
XY
Omit
= 1/8th Brick size heat plate, for use with heat sinks (not available
H
H
with -S option)
18H
18H
coldwall applications (not available with -S option)
S
= Surface Mount connections
S
Omit
ZZ = RoHS 6/6 Compliant, Lead free
On/Off Logic
= Hammerhead™ Series
= 036.0 Amps Maximum Output Current
= Default Pin Length shown in Mechanical Outline Figures
= Positive Logic
= Customer Specific Modified Code, Omit for Standard Code
= Standard open Frame Module
= 1/4th Brick size heat plate with unthreaded inserts for use in
= RoHS 5/6, Lead Based Solder Used
Connector
Type
Comcodes
Contact Us
For more information, call us at
USA/Canada:
+1 888 546 3243, or +1 972 244 9288
Asia-Pacific:
+86.021.54279977*808
Europe, Middle-East and Africa:
+49.89.878067-280
India:
+91.80.28411633
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Version 1.2
www.gecriticalpower.com
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